Heterogeneous complex and method for manufacturing the heterogeneous complex

Abstract

The present invention provides a heterogeneous composite and a method for manufacturing the heterogeneous composite. The heterogeneous composite includes: a first compression structure formed by compressing a first material; and a second compression structure formed by compressing a second material different from the first material and arranged in close contact with the first compression structure, wherein at least a part of the first compression structure and at least a part of the second compression structure are arranged on both sides of an interface in a state of being in contact with each other at a circular interface having a constant radius with respect to a central axis.

Description

Technical Field

[0001] The present invention relates to a heterogeneous composite generated to reduce material loss of components for manufacturing semiconductor manufacturing equipment and a method for manufacturing the heterogeneous composite. Background Art

[0002] In the field of the semiconductor industry, fluororesins having properties such as chemical resistance, heat resistance, and abrasion resistance are used as materials for manufacturing components. A fluororesin is a resin containing fluorine in its molecule. Fluororesins include polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene (PCTFE), polyvinylidene fluoride (PVDF), etc., and among them, polytetrafluoroethylene is mainly used in the semiconductor industry.

[0003] In particular, in order to further improve chemical resistance and abrasion resistance, components can be manufactured by compression molding. At this time, CNT-PTFE synthesized from carbon nanotubes and polytetrafluoroethylene can be used as a material. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a heterogeneous composite generated to reduce material loss of components for manufacturing semiconductor manufacturing equipment and a method for manufacturing the heterogeneous composite.

[0005] The technical problems of the present invention are not limited to the above-mentioned technical problems, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0006] One aspect of the heterogeneous composite of the present invention for achieving the above technical problem includes: a first compression structure formed by compressing a first material; a second compression structure formed by compressing a second material different from the first material and disposed in close contact with the first compression structure, wherein at least a part of the first compression structure and at least a part of the second compression structure are disposed on both sides of the interface in a state of being in contact with each other at a circular interface having a constant radius with respect to a central axis.

[0007] The interface includes at least one of a parallel plane parallel to the central axis and an inclined plane formed inclined to the central axis.

[0008] The interface includes a plurality of sub-interfaces having different radii with respect to the central axis, and a first part of the first compression structure and a first part of the second compression structure are arranged on both sides of the first sub-interface in a state where they are in contact with each other at the first sub-interface among the plurality of sub-interfaces, and a second part of the first compression structure and a second part of the second compression structure are arranged on both sides of the second sub-interface in a state where they are in contact with each other at the second sub-interface among the plurality of sub-interfaces.

[0009] The heterogeneous composite includes at least one of a mixed layer and a separate layer, the mixed layer including a mixed layer of a part of the first compression structure and a part of the second compression structure; and the separate layer including only a part of the first compression structure or a part of the second compression structure.

[0010] The first compression structure and the second compression structure have different electrical conductivities.

[0011] The first compression structure includes carbon nanotube-polytetrafluoroethylene (CNT-PTFE; Carbon Nanotube-polytetrafluoroethylene), and the second compression structure includes polytetrafluoroethylene (PTFE; polytetrafluoroethylene).

[0012] One aspect of a method for manufacturing a heterogeneous composite of the present invention for solving the above technical problems includes the following steps: setting a frame in a first cavity formed in a mold; injecting a first material into a space outside the frame in the first cavity; removing the frame to form a second cavity including an interface in contact with the first material; injecting a second material different from the first material into the second cavity; and simultaneously compressing the first material and the second material to generate a heterogeneous composite, wherein the interface is a circle having a constant radius with respect to the central axis of the frame, and at least a part of the first material and at least a part of the second material are arranged on both sides of the interface in a state where they are in contact with each other at the interface.

[0013] The mold includes an opening corresponding to one side plane of the first cavity, and the first material and the second material are injected through the opening, and the frame is inserted into or discharged from the first cavity through the opening.

[0014] The first material and the second material are injected into the mold in the form of powder.

[0015] At least one of the mixed layer and the separate layer is disposed in the mold, the mixed layer including the first material and the second material; and the separate layer including only the first material or the second material.

[0016] The first material and the second material are injected in the form of powder.

[0017] The first material and the second material have different electrical conductivities.

[0018] The first material includes carbon nanotube-polytetrafluoroethylene (CNT-PTFE), and the second material includes polytetrafluoroethylene (PTFE).

[0019] The frame includes boundary sides forming the interface, and the boundary sides include at least one of a parallel plane parallel to the central axis of the frame and an inclined plane formed inclined to the central axis of the frame.

[0020] The frame includes a plurality of auxiliary frames, wherein the plurality of auxiliary frames have boundary sides with different radii based on the central axis of the frame, and a first portion of the first material and a first portion of the second material are disposed on both sides based on a first interface formed by the boundary side of a first auxiliary frame among the plurality of auxiliary frames, and a second portion of the first material and a second portion of the second material are disposed on both sides based on a second interface formed by the boundary side of a second auxiliary frame among the plurality of auxiliary frames.

[0021] Another aspect of the manufacturing method of the heterogeneous composite of the present invention for solving the above technical problems includes the following steps: setting a frame having a cylindrical or hollow cylindrical shape in a first cavity formed in a mold and having a cylindrical or hollow cylindrical shape; injecting a first material in powder form into the outer space of the frame in the first cavity; removing the frame to form a second cavity including an interface in contact with the first material; injecting a second material in powder form different from the first material into the second cavity; and simultaneously compressing the first material and the second material to generate a heterogeneous composite, wherein the mold includes an opening corresponding to one side plane of the first cavity, and the first material and the second material are injected through the opening, and the frame is inserted into or discharged from the first cavity through the opening, and the frame is set in the first cavity with the central axis of the circular or annular cross section of the frame coinciding with the central axis of the circular or annular cross section of the first cavity, and the interface is a circle having a constant radius with respect to the central axis of the circular or annular cross section of the frame, and at least a part of the first material and at least a part of the second material are arranged on both sides of the interface in a state of being in contact with each other at the interface.

[0022] The first material and the second material have different electrical conductivities.

[0023] The first material includes carbon nanotube-polytetrafluoroethylene (CNT-PTFE), and the second material includes polytetrafluoroethylene (PTFE).

[0024] The frame includes a boundary side surface forming the interface, and the boundary side surface includes at least one of a parallel surface parallel to the central axis of the frame and an inclined surface formed inclined to the central axis of the frame.

[0025] The frame includes a plurality of auxiliary frames, wherein the plurality of auxiliary frames have boundary side surfaces with different diameters with respect to the central axis of the frame, and a first part of the first material and a first part of the second material are arranged on both sides with respect to a first interface formed by the boundary side surface of the first auxiliary frame among the plurality of auxiliary frames, and a second part of the first material and a second part of the second material are arranged on both sides with respect to a second interface formed by the boundary side surface of the second auxiliary frame among the plurality of auxiliary frames.

[0026] Specific matters of other embodiments are included in the detailed description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a flowchart showing a method for manufacturing a heterogeneous composite according to an embodiment of the present invention.

[0028] Figures 2 to 4 It is a view of a mold of a first cavity having step S110 of Figure 1 .

[0029] Figure 5 It is for explaining the injection of a first material before step S110 of Figure 1 .

[0030] Figure 6 It is for explaining Figure 1 step S110 of

[0031] Figure 7 It is for explaining Figure 1 step S120 of

[0032] Figure 8 It is for explaining Figure 1 step S130 of

[0033] Figure 9 and Figure 10 It is for explaining Figure 1 step S140 of

[0034] Figures 11 to 13 It is for explaining the heterogeneous composite generated by step S150 through Figure 1 .

[0035] Figure 14 and Figure 15 It is a view showing heterogeneous composites according to several embodiments of the present invention.

[0036] Figure 16 It is a view for explaining the processing of a heterogeneous composite to generate a component of semiconductor manufacturing equipment.

[0037] Figure 17 It is a cross-sectional view taken along line C-C' shown in Figure 16 .

[0038] Figure 18 It is a view for explaining the formation of a component of semiconductor manufacturing equipment from multiple materials.

[0039] Figure 19 and Figure 20 It is a view for explaining the formation of a second cavity from multiple auxiliary frames.

[0040] Figure 21 It is for explaining the view of the injection of a second material into the mold shown in Figure 19 .

[0041] Figure 22 is a view showing a heterogeneous composite generated by the mold shown by Figure 21 .

[0042] Figure 23 is a view for explaining the formation of a second cavity by a frame including an inclined surface.

[0043] Figure 24 is a view showing a heterogeneous composite generated by the mold shown by Figure 23 .

[0044] Description of Reference Numerals

[0045] 200, 201: Mold 210: Outer plate

[0046] 220: Bottom plate 230: Inner plate

[0047] 300: Heterogeneous composite 310: First material

[0048] 320: Second material 400, 700, 800: Frame

[0049] 410: Outer plate 420: Bottom plate

[0050] 430: Inner plate 500, 501, 502, 503: Heterogeneous composite

[0051] 710, 720, 730: Auxiliary frame 600, 601: Components of semiconductor manufacturing equipment Detailed Description of the Invention

[0052] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention and the methods for achieving these advantages and features will become clear by referring to the embodiments described in detail below together with the accompanying Figure 1 drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are only provided to make the disclosure of the present invention complete and to fully inform those of ordinary skill in the art to which the present invention pertains of the scope of the invention. The present invention is only defined by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0053] An element or layer is said to be "on" or "above" another element or layer not only includes the case where it is directly above the other element or layer, but also includes the case where other layers or elements are interposed therebetween. On the contrary, an element is said to be "directly" "on" or directly above means that there are no other elements or layers interposed therebetween.

[0054] To easily describe the relative relationship between one element or component and another element or component as shown in the figures, spatial relative terms such as "below", "beneath", "lower", "above", "upper", etc. can be used. It should be understood that, in addition to the directions shown in the figures, spatial relative terms are terms that also include different directions of the elements relative to each other during use or operation. For example, when the element shown in the figure is flipped, the element described as "below" or "beneath" another element can be located "above" the other element. Thus, the exemplary term "below" can include both the below and above directions. The elements can also be oriented in another direction, whereby the spatial relative terms can be interpreted according to the orientation.

[0055] Although terms such as "first", "second", etc. are used to describe various elements, components, and / or parts, these elements, components, and / or parts are clearly not limited by these terms. These terms are only used to distinguish one element, component, and / or part from another element, component, and / or part. Thus, the first element, first component, or first part mentioned below can clearly also be the second element, second component, or second part within the technical concept of the present invention.

[0056] The terms used in this specification are for the purpose of describing embodiments and are not intended to limit the present invention. In this specification, unless specifically mentioned in the sentence, the singular form also includes the plural form. The "comprises" and / or "comprising" used in the specification do not exclude the existence or addition of one or more other components, steps, operations, and / or elements in addition to the mentioned components, steps, operations, and / or elements.

[0057] If there is no other definition, all terms (including technical and scientific terms) used in this specification can be used with the meanings commonly understood by those of ordinary skill in the art to which the present invention pertains. In addition, unless specifically and clearly defined otherwise, the terms defined in commonly used dictionaries are not idealized or overly interpreted.

[0058] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals regardless of the reference numerals, and repeated descriptions thereof are omitted.

[0059] Figure 1 is a flowchart showing a method for manufacturing a heterogeneous complex according to an embodiment of the present invention.

[0060] Refer to Figure 1, A method for manufacturing a heterogeneous composite according to an embodiment of the present invention includes the following steps: setting a frame in a first cavity formed in a mold (S110); injecting a first material into the outer space of the frame (S120); removing the frame to form a second cavity (S130); injecting a second material into the second cavity (S140); and compressing the first material and the second material to generate a heterogeneous composite (S150).

[0061] The method for manufacturing a heterogeneous composite according to an embodiment of the present invention can be executed by an additional heterogeneous composite manufacturing device (not shown) made for manufacturing a heterogeneous composite. The heterogeneous composite manufacturing device can include at least one accessory equipment (not shown) to generate a heterogeneous composite. The heterogeneous composite can be used for producing components applicable to semiconductor manufacturing equipment, but the applicable objects of the heterogeneous composite of the present invention are not limited to the components of semiconductor manufacturing equipment.

[0062] Each accessory equipment included in the heterogeneous composite manufacturing device can perform an inherent operation. For example, one accessory equipment can perform Figure 1 one or more steps among the steps shown, and multiple accessory equipments can perform Figure 1 one step among the steps shown.

[0063] Hereinafter, each step shown will be described in detail with reference to Figures 2 to 13 Figure 1 each step shown.

[0064] Figures 2 to 4 is a view of a mold showing the first cavity of step S110 having Figure 1 , Figure 5 is a view for explaining injecting the first material before step S110 in Figure 1 , Figure 6 is a view for explaining step S110 in Figure 1 , Figure 7 is a view for explaining step S120 in Figure 1 , Figure 8 is a view for explaining step S130 in Figure 1 , Figure 9 and Figure 10 are views for explaining step S140 in Figure 1 , and Figures 11 to 13 is a view for explaining the heterogeneous composite generated through step S150 in Figure 1 .

[0065] Referring to Figures 2 to 4 , a mold 200 having a first cavity CV1 can be prepared.

[0066] ​In the present invention, the molds 200 and 201 can be provided in the form of a cylinder or a hollow cylinder. Accordingly, the first cavity CV1 included in the molds 200 and 201 can also have the shape of a cylinder or a hollow cylinder. Here, the hollow cylinder means a cylinder having a hollow formed therein.

[0067] Regarding the generation of the heterogeneous composite by the manufacturing apparatus of the heterogeneous composite, the following compression operation of the material can be performed. Since the first cavity CV1 for accommodating the material has the shape of a cylinder or a hollow cylinder, a uniform force can be transmitted to all the materials accommodated in the first cavity CV1 during the compression operation.

[0068] Figure 2 The mold 200 provided in the form of a hollow cylinder is shown, and Figure 4 is shown Figure 2 a cross-sectional view taken along the line A - A' of the shown mold. Figure 3 The mold 201 provided in the form of a cylinder is shown.

[0069] Hereinafter, the mold 200 provided in the form of a hollow cylinder will be mainly described.

[0070] The mold 200 is configured to include an outer plate 210, a bottom plate 220, and an inner plate 230. The outer plate 210 and the inner plate 230 can be formed to have different diameters with respect to the same central axis Ax. The wide surfaces of the outer plate 210 and the inner plate 230 can be formed parallel to the central axis Ax. The outer plate 210 and the inner plate 230 can be connected by the bottom plate 220, and the first cavity CV1 can be formed by the outer plate 210, the bottom plate 220, and the inner plate 230. Further, as Figure 3 shown, in the case where the mold 201 is provided in the form of a cylinder, the mold 201 can be configured to include an outer plate 210 and a bottom plate 220, and the first cavity CV1 can be formed by the outer plate 210 and the bottom plate 220.

[0071] To explain again Figure 2 and Figure 4 , the mold 200 can include an opening OP corresponding to one plane of the first cavity CV1. For example, the opening OP can be formed on the opposite side of the bottom plate 220. The opening OP can be used as a movement passage for the material and the frame. For example, the following first material and second material can be injected through the opening OP, and the frame can be inserted into or discharged from the first cavity CV1 through the opening OP.

[0072] Referring to Figure 5 , the first material 310 can be injected into the first cavity CV1 formed in the mold 200.

[0073] The first material 310, as a material for generating a heterogeneous composite, may be a fluororesin. For example, the first material 310 may be carbon nanotube-polytetrafluoroethylene (CNT-PTFE), but the first material 310 of the present invention is not limited to carbon nanotube-polytetrafluoroethylene.

[0074] The first material 310 may be injected through the opening OP of the mold 200, and the injected first material 310 may be loaded upward from the bottom of the first cavity CV1. The first material 310 may not be injected into the entire space of the first cavity CV1. That is, a part of the entire space of the first cavity CV1 may not be filled with the first material 310.

[0075] As described below, the frame 400 may be provided in the first cavity CV1. Figure 5 It shows that the first material 310 is injected into the first cavity CV1 before the frame 400 is provided. According to an embodiment of the present invention, before the frame 400 is provided, the first material 310 may or may not be injected into the first cavity CV1. Hereinafter, the case where the first material 310 is injected into the first cavity CV1 before the frame 400 is provided will be mainly described.

[0076] Refer to Figure 6 , the frame 400 may be provided in the first cavity CV1.

[0077] The frame 400 may be inserted into the first cavity CV1 through the opening OP. Since the first cavity CV1 has a hollow cylindrical shape, the frame 400 may also be set to a hollow cylindrical shape. That is, the central axis Bx of the frame 400 may coincide with the central axis Ax of the mold 200, and the frame 400 may have a hollow cylindrical shape with a constant diameter based on the central axis Bx.

[0078] The frame 400 may include an outer side surface for forming the following second cavity CV2 (refer to Figure 8 ). For example, the cross-section of the outer side surface of the frame 400 may be quadrilateral, and in this case, the cross-section of the second cavity CV2 may be quadrilateral.

[0079] The frame 400 is configured to include an outer side plate 410, a bottom plate 420, and an inner side plate 430. The outer side plate 410 and the inner side plate 430 may be formed to have different diameters based on the same central axis Bx. The wide surfaces of the outer side plate 410 and the inner side plate 430 may be formed parallel to the central axis Bx. The outer side plate 410 and the inner side plate 430 may be connected by the bottom plate 420, and the second cavity CV2 may be formed by the outer side plate 410, the bottom plate 420, and the inner side plate 430.

[0080] The outer side surfaces of the above-mentioned frame 400 can be understood as the outer side surfaces of the outer side plate 410, the bottom plate 420, and the inner side plate 430. The outer side surfaces of the frame 400 can include surfaces parallel to the direction in which the frame 400 is inserted into or discharged from the mold 200. That is, the outer side surfaces of the outer side plate 410 and the inner side plate 430 can be parallel to the insertion or discharge direction of the frame 400.

[0081] As described below, the first material 310 and the second material 320 can be arranged on both sides of the interface. The frame 400 can include a boundary side surface 440 that forms the interface. The interface can be formed in a shape corresponding to the boundary side surface 440. The boundary side surface 440 can include at least one of a parallel surface parallel to the central axis Bx of the frame 400 and an inclined surface formed inclined to the central axis Bx of the frame 400. Figure 6 It is shown that the boundary side surface 440 is only composed of a parallel surface parallel to the central axis Bx.

[0082] Refer to Figure 7 , the first material 310 can be injected into the outer space of the frame 400. The first material 310 can be the same as the first material 310 injected before step S110. The first material 310 can be injected through the opening OP of the mold 200. One side surface of the injected first material 310 can be in close contact with the boundary side surface 440 of the frame 400.

[0083] Refer to Figure 8 , the mold 400 can be removed from the mold 200 to form the second cavity CV2. The frame 400 can be discharged from the first cavity CV1 through the opening OP of the mold 200.

[0084] In the present invention, the first material 310 can be injected into the first cavity CV1 in the form of powder. In addition, a binding force above a constant magnitude can act between the respective powder particles constituting the first material 310, and its shape can be maintained even when the mold 400 is removed.

[0085] Therefore, when the frame 400 is removed from the first material 310, a second cavity CV2 having a shape corresponding to the outer side surface of the frame 400 can be formed. That is, the second cavity CV2 can have the shape of a hollow cylinder like the frame 400. At this time, the second cavity CV2 can include an interface 330 in contact with the first material 310.

[0086] As described above, the outer side surfaces of the inner side plate 430 and the outer side plate 410 of the frame 400 can be parallel to the insertion or discharge direction of the frame 400. Therefore, even when the frame 400 is removed from the first material 310, the shape of the first material 310 can be maintained.

[0087] Refer to Figure 9 andFigure 10 The second material 320 different from the first material 310 can be injected into the second cavity CV2. The second material 320 can be injected through the opening OP of the mold 200. The second material 320 can be injected into the second cavity CV2 in the form of powder.

[0088] The second material 320 can be a fluororesin. The second material 320 can have a powder form similar to that of the first material 310. When the first material 310 and the second material 320 are accommodated in the same space and compressed, the first material 310 and the second material 320 can be fused harmoniously. For example, the second material 320 can be polytetrafluoroethylene (PTFE; polytetrafluoroethylene), but the second material 320 of the present invention is not limited to polytetrafluoroethylene.

[0089] There can be an interface 330 between the first material 310 and the second material 320. The interface 330 can be a circle having a constant radius R with respect to the central axis Bx of the frame 400.

[0090] At least a part of the first material 310 and at least a part of the second material 320 can be arranged on both sides of the interface 330 in a state of being in contact with each other at the interface 330. In other words, a part of the first material 310 and a part of the second material 320 can have different radii with respect to the central axis Bx of the frame 400.

[0091] In the mold 200, the materials 310, 320 can be arranged as a mixed layer or a separate layer. The mixed layer is a layer including the first material 310 and the second material 320, and the separate layer is a layer including only the first material or the second material. At least one of the mixed layer and the separate layer can be arranged in the mold, and in particular, at least one mixed layer can be arranged in the mold. Figure 9 A separate layer composed only of the first material 310 and a mixed layer including the first material 310 and the second material 320 are shown arranged in the mold 200. However, this is merely exemplary, and the mixed layer and the separate layer can be combined and arranged in the mold 200 in various forms.

[0092] As described above, the first material 310, as a material for generating a heterogeneous composite, can be a fluororesin. The first material 310 can be carbon nanotube-polytetrafluoroethylene (hereinafter referred to as CNT-PTFE). The unit price of CNT-PTFE may be relatively high.

[0093] When generating a heterogeneous composite in a state where the first cavity CV1 is filled with CNT-PTFE and manufacturing a component of semiconductor manufacturing equipment therefrom, waste of CNT-PTFE occurs. The component of the semiconductor manufacturing equipment can be generated by cutting or grinding the heterogeneous composite, and in the entire area of the heterogeneous composite, the cut or ground part is the part that cannot be reused, resulting in waste of cost. In addition, when a mold 400 or the like is inserted into the first cavity CV1 and compressed, cracks may occur in the heterogeneous composite.

[0094] Therefore, in the entire area of the heterogeneous composite, the part that is not used to generate the component of the semiconductor manufacturing equipment can be filled with polytetrafluoroethylene (hereinafter referred to as PTFE) with a relatively low unit price. When compressed in a state where the first cavity CV1 is filled with CNT-PTFE and PTFE, cracks do not occur in the compressed product, and waste of CNT-PTFE can be prevented.

[0095] In a state where the first material 310 and the second material 320 are filled in the first cavity CV1 of the mold 200, pressure can be applied to the first material 310 and the second material 320 through the opening OP of the mold 200, thereby compressing the first material 310 and the second material 320 simultaneously. At this time, heat can also be applied to the first material 310 and the second material 320.

[0096] Through pressure and heat, the first material 310 and the second material 320 can be melted and solidified, thereby being converted into a heterogeneous composite 500 (refer to Figure 11 ). The heterogeneous composite 500 can have the shape of a hollow cylinder like the first cavity CV1.

[0097] Refer to Figures 11 to 13 , the heterogeneous composite 500 can include a first compression structure 510 and a second compression structure 520.

[0098] The first compression structure 510 can be formed by compressing the first material 310, and the second compression structure 520 can be formed by compressing a second material 320 different from the first material 310. The second compression structure 520 can be arranged in close contact with the first compression structure 510.

[0099] At least a part of the first compression structure 510 and at least a part of the second compression structure 520 can be arranged on both sides of the interface 530 in a state of being in contact with each other at a circular interface 530 having a constant radius R with respect to the central axis Cx. Here, the interface 530 can correspond to the interface 330 of the above materials 310 and 320.

[0100] The interface 530 may include at least one of a parallel plane parallel to the central axis Cx and an inclined plane formed inclined to the central axis Cx. Figure 12 It shows that the interface 530 is composed only of parallel planes.

[0101] The heterogeneous composite 500 may include a mixed layer and a single layer. The mixed layer is a layer including a part of the first compression structure 510 and a part of the second compression structure 520, and the single layer represents a layer including only a part of the first compression structure 510 or a part of the second compression structure 520. The heterogeneous composite 500 may include at least one of the mixed layer and the single layer, and in particular may include at least one mixed layer. Figure 12 It shows that the heterogeneous composite 500 is composed of a single layer composed only of the first compression structure 510 and a mixed layer including the first compression structure 510 and the second compression structure 520. However, this is merely exemplary, and the mixed layer and the single layer can be combined differently to form the heterogeneous composite 500.

[0102] Figure 13 It shows heterogeneous composites formed by combining the mixed layer and the single layer in various forms. (a) and (b) show that the heterogeneous composite is configured to include one single layer and one mixed layer, and (c) shows that the heterogeneous composite is configured to include only one mixed layer. The arrangement forms of the first compression structure 510 and the second compression structure 520 can be determined differently according to the form of the components of the finally produced semiconductor manufacturing equipment.

[0103] The above has described the heterogeneous composite 500 manufactured in the form of a hollow cylinder, but as Figure 15 shown, the heterogeneous composite 501 can also be manufactured in the form of a cylinder. The heterogeneous composite 501 may include the first compression structure 510 and the second compression structure 520, and the heterogeneous composite 501 can be manufactured in the form of a cylinder without a hollow. For this purpose, as Figure 4 shown, the mold 201 may not include a hollow, and the first cavity CV1 may provide a cylindrical space.

[0104] To illustrate again Figures 11 to 13 , it can be processed Figures 11 to 13 the heterogeneous composite 500 shown to generate components of semiconductor manufacturing equipment. In particular, the components of semiconductor manufacturing equipment can be configured to include at least one of the first compression structure 510 and the second compression structure 520.

[0105] Figure 16 is a view for explaining the processing of the heterogeneous composite to generate components of semiconductor manufacturing equipment, and Figure 17 is a cross-sectional view taken along the C-C' line of the component of the semiconductor manufacturing equipment shown in Figure 16 , and Figure 18It is a view for explaining a component of a semiconductor manufacturing apparatus formed of multiple materials.

[0106] Referring to Figure 16 and Figure 17 , the heterogeneous composite 500 can be processed to form a component 600 of a semiconductor manufacturing apparatus.

[0107] The component 600 of the semiconductor manufacturing apparatus can be generated by cutting and grinding the heterogeneous composite 500. Figure 16 and Figure 17 show that the component 600 of the semiconductor manufacturing apparatus is generated to include only the first compression structure 510. That is, the entire second compression structure 520 is cut and removed. The unit price of the first material 310 for generating the first compression structure 510 may be high, and since the relatively inexpensive second material 320 is utilized, the cost required to produce the component 600 of the semiconductor manufacturing apparatus can be reduced overall.

[0108] In addition, although Figure 16 and Figure 17 show that the component 600 of the semiconductor manufacturing apparatus is generated to include only the first compression structure 510, as Figure 18 shown, the component 601 of the semiconductor manufacturing apparatus can be generated to include both the first compression structure 510 and the second compression structure 520.

[0109] In this case, the component of the semiconductor manufacturing apparatus can include a first part and a second part. The first part can have a first physical property, and the second part can have a second physical property different from the first physical property. For example, the first part and the second part can have different electrical conductivities. More specifically, the first part can include carbon nanotube - polytetrafluoroethylene (CNT - PTFE; Carbon Nanotube - polytetrafluoroethylene), and the second part can include polytetrafluoroethylene (PTFE; polytetrafluoroethylene).

[0110] The second part can be in direct contact with the first part. Here, the first part can represent the part composed of the first compression structure 510, and the second part can represent the part composed of the second compression structure 520. Specifically, at least a part of the first part and at least a part of the second part can be arranged on both sides of the interface 540 in a state of being in contact with each other at a circular interface 540 having a constant radius R with respect to the central axis Dx. Here, the interface 540 can be formed parallel to or inclined to the central axis Dx.

[0111] In the present invention, components 600 and 601 of semiconductor manufacturing equipment can be arranged adjacent to a substrate (not shown). When static electricity is generated in components 600 and 601 of the semiconductor manufacturing equipment, it may have an adverse effect on the substrate. As Figure 16 and Figure 17 shown, when component 600 of the semiconductor manufacturing equipment is configured to include only a first compression structure 510 having a relatively high conductivity, the generation of static electricity can be prevented. In addition, as Figure 18 shown, in the case where the first compression structure 510 is included on the inner side of component 601 of the semiconductor manufacturing equipment adjacent to the substrate and the second compression structure 520 is included on the outer side away from the substrate, the generation of static electricity can be prevented, and at the same time, the manufacturing cost of component 601 of the semiconductor manufacturing equipment can be saved.

[0112] Figure 19 and Figure 20 are views for explaining the formation of a second cavity by a plurality of auxiliary frames, and Figure 21 is for explaining the injection of a second material into the mold shown in Figure 19 and Figure 22 is a view showing a heterogeneous composite generated by the mold shown in Figure 21 .

[0113] Referring to Figure 19 , the frame 700 may include a plurality of auxiliary frames 710, 720, and 730, and the plurality of auxiliary frames 710, 720, and 730 have boundary sides 741, 742, and 743 with different radii R1, R2, and R3 based on the central axis Bx of the frame 700.

[0114] The second cavity CV2 can be formed by using the auxiliary frames 710, 720, and 730 having different radii.

[0115] Referring to Figure 19 and Figure 20 , the interfaces 331, 332, and 333 can be formed in shapes corresponding to the boundary sides 741, 742, and 743.

[0116] The first material 310 can be injected in a state where the first auxiliary frame 710 is inserted into the mold 200 to form the first interface 331. Then, the first auxiliary frame 710 is removed, and the first material 310 is injected in a state where the second auxiliary frame 720 is inserted into the mold 200 to form the second interface 332. Then, the second auxiliary frame 720 is removed, and the first material 310 is injected in a state where the third auxiliary frame 730 is inserted into the mold 200 to form the third interface 333.

[0117] Figure 19 and Figure 20Illustrated is a case where interfaces 331, 332, and 333 are formed by three auxiliary frames 710, 720, and 730. However, this is merely exemplary, and interfaces can be formed by two auxiliary frames, or can be formed by more than four auxiliary frames.

[0118] Referring Figure 21 , a first portion of the first material 310 and a first portion of the second material 320 can be arranged on both sides with reference to a first interface 331 formed by a boundary side surface 741 of the first auxiliary frame 710 among the plurality of auxiliary frames 710, 720, and 730, and a second portion of the first material 310 and a second portion of the second material 320 can be arranged on both sides with reference to a second interface 332 formed by a boundary side surface 742 of the second auxiliary frame 720 among the plurality of auxiliary frames 710, 720, and 730. In addition, a third portion of the first material 310 and a third portion of the second material 320 can be arranged on both sides with reference to a third interface 333 formed by a boundary side surface 743 of the third auxiliary frame 730 among the plurality of auxiliary frames 710, 720, and 730.

[0119] Since auxiliary frames 710, 720, and 730 having different radii are used to form the second cavity CV2, the first material 310 and the second material 320 corresponding to the fine shape of the components of the semiconductor manufacturing equipment can be arranged, and waste of materials with high unit prices can be prevented.

[0120] Referring Figure 22 , a heterogeneous composite 502 including a first compression structure 510 and a second compression structure 520 can be generated.

[0121] The heterogeneous composite 502 can be formed by compressing and heating the first material 310 and the second material 320 injected into Figure 21 the mold 200.

[0122] The heterogeneous composite 502 can include a plurality of sub-interfaces 531, 532, and 533 having different radii. A first portion of the first compression structure 510 and a first portion of the second compression structure 520 can be arranged on both sides of the first sub-interface 531 in a state of being in contact with each other at the first sub-interface 531 among the plurality of sub-interfaces 531, 532, and 533, and a second portion of the first compression structure 510 and a second portion of the second compression structure 520 can be arranged on both sides of the second sub-interface 532 in a state of being in contact with each other at the second sub-interface 532 among the plurality of sub-interfaces 531, 532, and 533. In addition, a third portion of the first compression structure 510 and a third portion of the second compression structure 520 can be arranged on both sides of the third sub-interface 533 in a state of being in contact with each other at the third sub-interface 533 among the plurality of sub-interfaces 531, 532, and 533.

[0123] The heterogeneous composite 502 can be processed to form components of semiconductor manufacturing equipment. Since the first compression structure 510 and the second compression structure 520 are arranged in a fine structure, the cost required to produce components of semiconductor manufacturing equipment can be reduced as a whole.

[0124] Figure 23 is a view for explaining the formation of the second cavity by a frame including an inclined surface, and Figure 24 is a view showing Figure 23 the heterogeneous composite generated by the mold shown.

[0125] Referring to Figure 23 , the frame 800 may include a boundary side surface 840 that forms an interface.

[0126] The boundary side surface 840 may include at least one of a parallel plane PL parallel to the central axis Bx of the frame 200 and an inclined surface SL formed inclined to the central axis Bx of the frame 200. Figure 23 It is shown that the boundary side surface 840 is formed to include the parallel plane PL and the inclined surface SL.

[0127] Since the frame 800 having the inclined surface SL is used to form the second cavity CV2, the arrangement of the first material 310 and the second material 320 corresponding to the fine shape of the heterogeneous composite can be performed, and waste of materials with a high unit price can be prevented.

[0128] Referring to Figure 24 , a heterogeneous composite 503 including a first compression structure 510 and a second compression structure 520 can be generated.

[0129] The heterogeneous composite 503 can be formed by compressing and heating the first material 310 and the second material 320 injected into Figure 23 the mold 200.

[0130] The heterogeneous composite 503 may include circular interfaces 530, 550 having a constant radius with respect to the central axis Cx. The interfaces 530, 550 may include at least one of a parallel plane 530 parallel to the central axis Cx and an inclined surface 550 formed inclined to the central axis Cx.

[0131] At least a part of the first compression structure 510 and at least a part of the second compression structure 520 may be arranged on both sides of the interfaces 530, 550 in a state where the interfaces 530, 550 are in contact with each other.

[0132] The heterogeneous composite 503 can be processed to generate components of semiconductor manufacturing equipment. Since the first compression structure 510 and the second compression structure 520 are arranged in a fine structure, the cost required to produce components of semiconductor manufacturing equipment can be reduced as a whole.

[0133] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those of ordinary skill in the art to which the present invention pertains should understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. Therefore, it should be understood that the above-described embodiments are exemplary in all aspects and not restrictive.

Claims

1. Heterogeneous composite, comprising: A first compressed structure formed by compressing a first material; A second compressed structure formed by compressing a second material different from the first material and arranged in close contact with the first compressed structure, wherein at least a part of the first compressed structure and at least a part of the second compressed structure are arranged on both sides of an interface in a state of being in contact with each other at the interface, and the interface is a circle with a constant radius with respect to a central axis; wherein the interface includes a plurality of sub-interfaces with different radii with respect to the central axis, a first part of the first compressed structure and a first part of the second compressed structure are arranged on both sides of a first sub-interface among the plurality of sub-interfaces in a state of being in contact with each other at the first sub-interface, and a second part of the first compressed structure and a second part of the second compressed structure are arranged on both sides of a second sub-interface among the plurality of sub-interfaces in a state of being in contact with each other at the second sub-interface.

2. The heterogeneous composite according to claim 1, wherein the interface includes at least one of a parallel plane parallel to the central axis and an inclined plane formed inclined to the central axis.

3. The heterogeneous composite according to claim 1, comprising at least one of a mixed layer and a separate layer, the mixed layer including a mixed layer of a part of the first compressed structure and a part of the second compressed structure; and the separate layer includes only a part of the first compressed structure or a part of the second compressed structure.

4. The heterogeneous composite according to claim 1, wherein the first compressed structure and the second compressed structure have different electrical conductivities.

5. The heterogeneous composite according to claim 1, wherein the first compressed structure includes carbon nanotube-polytetrafluoroethylene, and the second compressed structure includes polytetrafluoroethylene.

6. Method for manufacturing a heterogeneous composite, comprising the following steps: Setting a frame in a first cavity formed in a mold; Injecting a first material into a space outside the frame in the first cavity; Removing the frame to form a second cavity including an interface in contact with the first material; Injecting a second material different from the first material into the second cavity; and Compressing the first material and the second material simultaneously to generate a heterogeneous composite, wherein the interface is a circle with a constant radius with respect to the central axis of the frame, and at least a part of the first material and at least a part of the second material are arranged on both sides of the interface in a state of being in contact with each other at the interface.

7. The method for manufacturing a heterogeneous composite according to claim 6, wherein the mold includes an opening corresponding to a side plane of the first cavity, the first material and the second material are injected through the opening, and the frame is inserted into or removed from the first cavity through the opening.

8. The method for manufacturing a heterogeneous composite according to claim 6, wherein The first material and the second material are injected into the mold in the form of powder.

9. The method for manufacturing a heterogeneous composite according to claim 6, wherein, At least one of a mixed layer and a separate layer is disposed in the mold, the mixed layer includes the first material and the second material; and the separate layer includes only the first material or the second material.

10. The method for manufacturing a heterogeneous composite according to claim 6, wherein, The first material and the second material have different electrical conductivities.

11. The method for manufacturing a heterogeneous composite according to claim 6, wherein, The first material includes carbon nanotube-polytetrafluoroethylene, and The second material includes polytetrafluoroethylene.

12. The method for manufacturing a heterogeneous composite according to claim 6, wherein, The frame includes boundary sides forming the interface, and The boundary sides include at least one of a parallel plane parallel to the central axis of the frame and an inclined plane formed inclined to the central axis of the frame.

13. The method for manufacturing a heterogeneous composite according to claim 6, wherein, The frame includes a plurality of auxiliary frames, wherein the plurality of auxiliary frames have boundary sides with different radii based on the central axis of the frame, A first portion of the first material and a first portion of the second material are disposed on both sides of a first interface formed by the boundary side of a first auxiliary frame among the plurality of auxiliary frames, and A second portion of the first material and a second portion of the second material are disposed on both sides of a second interface formed by the boundary side of a second auxiliary frame among the plurality of auxiliary frames.

14. A method for manufacturing a heterogeneous composite, comprising the following steps: Disposing a frame having a cylindrical or hollow cylindrical shape in a first cavity formed in a mold and having a cylindrical or hollow cylindrical shape; Injecting a first material in powder form into an outer space of the frame in the first cavity; Removing the frame to form a second cavity including an interface in contact with the first material; Injecting a second material in powder form different from the first material into the second cavity; And Simultaneously compressing the first material and the second material to generate a heterogeneous composite, Wherein the mold includes an opening corresponding to a side plane of the first cavity, and the first material and the second material are injected through the opening, and the frame is inserted into or removed from the first cavity through the opening, The frame is disposed in the first cavity in a state where the central axis of the circular or annular cross-section of the frame coincides with the central axis of the circular or annular cross-section of the first cavity, The interface is a circle having a constant radius based on the central axis of the circular or annular cross-section of the frame, and At least a portion of the first material and at least a portion of the second material are disposed on both sides of the interface in a state of being in contact with each other at the interface.

15. The method for manufacturing a heterogeneous composite according to claim 14, wherein, The first material and the second material have different electrical conductivities.

16. The method for manufacturing a heterogeneous composite according to claim 14, wherein, the first material includes carbon nanotube-polytetrafluoroethylene, and the second material includes polytetrafluoroethylene.

17. The method for manufacturing a heterogeneous composite according to claim 14, wherein, the framework includes boundary sides forming the interface, and the boundary sides include at least one of a parallel plane parallel to the central axis of the framework and an inclined plane formed inclined to the central axis of the framework.

18. The method for manufacturing a heterogeneous composite according to claim 14, wherein, the framework includes a plurality of auxiliary frameworks, wherein the plurality of auxiliary frameworks have boundary sides with different diameters based on the central axis of the framework, a first portion of the first material and a first portion of the second material are arranged on both sides based on a first interface formed by the boundary side of a first auxiliary framework among the plurality of auxiliary frameworks, and a second portion of the first material and a second portion of the second material are arranged on both sides based on a second interface formed by the boundary side of a second auxiliary framework among the plurality of auxiliary frameworks.

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