Electronic component inspection method, device, computer equipment and readable storage medium

Abstract

The present application relates to an electronic component inspection method, device, computer equipment and readable storage medium. The method obtains the component configuration information of the circuit board to be inspected; obtains the design rules corresponding to the components according to the identification of the components, determines the matching results of the inspection indicators of the components and the design rules according to the inspection indicators and the design rules; and generates a component inspection report according to the matching results. The electronic component inspection method designed in the present application can realize the inspection of whether the components on the circuit board to be inspected comply with the design rules, thereby improving the reliability and practicality of the circuit board to be inspected.

Description

Technical Field

[0001] The present application relates to the field of electronic design automation technology, and in particular to an electronic component inspection method, device, computer equipment and readable storage medium. Background Art

[0002] At present, the circuit schematic is usually designed using an Electronic Design Automation (EDA) tool, and then the circuit schematic is printed on a Printed Circuit Board (PCB), and then the relevant components are soldered to form an integrated circuit. In order to ensure the reliability and practicality of the integrated circuit, it is necessary to check whether the components in the integrated circuit comply with the rules of electronic design.

[0003] In traditional technology, EDA PCB design tools are usually used to perform design rule checking (DRC) and electrical rule checking (ERC) on circuit schematics or printed circuit boards. In actual application scenarios, component manufacturers have special requirements in the manual, or the product has special requirements for components due to the particularity of the production / transportation / use environment. However, in traditional technology, there is a lack of inspection on whether electronic components meet the special requirements of electronic design. Summary of the invention

[0004] Based on this, it is necessary to provide an electronic component inspection method, device, computer equipment and readable storage medium to address the above technical problems.

[0005] In a first aspect, an embodiment of the present application provides an electronic component inspection method, comprising:

[0006] Obtaining component configuration information of the circuit board to be inspected; the component configuration information includes inspection indicators of each component in the circuit board to be inspected and an identification of each component;

[0007] Obtain the design rules corresponding to the components according to the identification of the components, and determine the matching results between the inspection indicators of the components and the design rules according to the inspection indicators and the design rules;

[0008] Generate component inspection reports based on the matching results.

[0009] In one embodiment, determining a matching result between an inspection indicator of a component and a design rule according to the inspection indicator and the design rule includes:

[0010] Determine whether the inspection index has a corresponding design rule; the design rule is used to represent the rules for assembling components on the circuit board to be inspected;

[0011] If so, the design rule corresponding to the inspection indicator is obtained, and the inspection indicator is compared with the design rule corresponding to the inspection indicator to determine the matching result of the inspection indicator of the component and the design rule.

[0012] In one embodiment, determining a matching result between an inspection indicator of a component and a design rule according to the inspection indicator and the design rule includes:

[0013] If the component configuration information includes the inspection requirements corresponding to the inspection indicators, then judging whether the inspection requirements of the inspection indicators in the component configuration information match the design rules to determine the matching result;

[0014] If the component configuration information does not include the inspection requirements corresponding to the inspection indicators, a matching result is generated based on the inspection requirements corresponding to the inspection indicators in the design rules.

[0015] In one embodiment, the electronic component inspection method further includes:

[0016] Determine whether there are any conflicts or anomalies between the inspection indicators of each component;

[0017] If there is a conflict anomaly, an inspection report is generated based on the component identification and anomaly information.

[0018] In one embodiment, determining whether there is a conflict anomaly between the inspection indicators of each component includes:

[0019] The design rules corresponding to the inspection indicators of each component are obtained, and the design rules corresponding to the inspection indicators of each component are compared to determine whether there are conflicts and anomalies between the inspection indicators of each component.

[0020] In one embodiment, determining whether there is a conflict anomaly between the inspection indicators of each component includes:

[0021] Obtaining the board configuration information of the circuit board to be checked;

[0022] The design rules corresponding to the inspection indicators of each component are compared with the board configuration information to determine whether there are any conflicts or anomalies between the inspection indicators of each component.

[0023] In one embodiment, the design rules corresponding to the inspection indicators of each component are compared with the board configuration information to determine whether there is a conflict anomaly between the inspection indicators of each component, including:

[0024] For any two components in the circuit board to be inspected, if there is a component that meets the preset condition among the two components, it is determined that there is a conflict anomaly between the inspection indicators of the two components; wherein the preset condition includes that the design rule corresponding to the inspection indicator of the component does not match the board configuration information;

[0025] If there is no component satisfying the preset condition between any two components, it is determined that there is no conflict anomaly between the inspection indicators of the two components.

[0026] In a second aspect, an embodiment of the present application provides an electronic component inspection device, comprising:

[0027] An acquisition module is used to acquire component configuration information of the circuit board to be inspected; the component configuration information includes inspection indicators of each component in the circuit board to be inspected and an identification of each component;

[0028] A determination module is used to obtain the design rules corresponding to the components according to the identification of the components, and determine the matching results of the inspection indicators of the components and the design rules according to the inspection indicators and the design rules;

[0029] The generation module is used to generate an inspection report of components based on the matching results.

[0030] In a third aspect, an embodiment of the present application provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the method provided in the above embodiment are implemented.

[0031] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the method provided in the above embodiment when the computer program is executed by a processor.

[0032] The embodiments of the present application provide an electronic component inspection method, device, computer equipment and readable storage medium. The electronic component inspection method obtains the component configuration information of the circuit board card to be inspected; obtains the design rules corresponding to the components according to the identification of the components, determines the matching results of the inspection indicators of the components and the design rules according to the inspection indicators and the design rules; and generates an inspection report of the components according to the matching results. The electronic component inspection method provided in the embodiments of the present application obtains the matching results by matching the design rules of the component correspondence table with the inspection indicators of the components, and can realize the inspection of whether the components meet the design rules, thereby improving the reliability and practicality of the circuit board card to be inspected made using this component. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For different technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A schematic diagram of the steps of a method for inspecting electronic components provided in one embodiment of the present application;

[0035] Figure 2 A schematic flow chart of the steps of an electronic component inspection method provided in another embodiment of the present application;

[0036] Figure 3 A schematic flow chart of the steps of an electronic component inspection method provided in another embodiment of the present application;

[0037] Figure 4 A schematic flow chart of the steps of an electronic component inspection method provided in another embodiment of the present application;

[0038] Figure 5 A schematic flow chart of the steps of an electronic component inspection method provided in another embodiment of the present application;

[0039] Figure 6 A schematic flow chart of the steps of an electronic component inspection method provided in another embodiment of the present application;

[0040] Figure 7 A schematic diagram of the structure of an electronic component inspection device provided in one embodiment of the present application;

[0041] Figure 8 A schematic diagram of the structure of a computer device provided for one embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0043] At present, the circuit schematic is usually designed using an Electronic Design Automation (EDA) tool, and then the circuit schematic is printed on a Printed Circuit Board (PCB), and then the relevant components are soldered to form an integrated circuit. In order to ensure the reliability and practicality of the integrated circuit, it is necessary to check whether the components in the integrated circuit comply with the rules of electronic design.

[0044] In traditional technology, EDA PCB design tools, such as Cadence Allegro, MentorXpedition, Altium Protel, etc., are usually used to perform design rule checking (DRC) and electrical rule checking (ERC) on circuit schematics or printed circuit boards. In actual application scenarios, special requirements of component manufacturers in manuals, or special requirements of components due to the particularity of production / transportation / use environment of products, however, in traditional technology, there is a lack of inspection on whether electronic components meet the special requirements of electronic design. In this regard, the present application provides an electronic component inspection method to inspect whether electronic components meet the special requirements of electronic design.

[0045] The electronic component inspection method provided in the present application can be implemented by computer equipment. Computer equipment includes but is not limited to control chips, personal computers, laptops, smart phones, tablet computers and portable wearable devices. The method provided in the present application can be implemented by JAVA software and can also be applied to other software.

[0046] The technical solution of the present application and how the technical solution of the present application solves the technical problem are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0047] See also Figure 1 An embodiment of the present application provides an electronic component inspection method. This embodiment describes the electronic component inspection method using a computer device as an execution subject. The steps of the method include:

[0048] Step 100: Obtain component configuration information of the circuit board to be inspected; the component configuration information includes inspection indicators of each component in the circuit board to be inspected and an identification of each component.

[0049] The circuit board card to be checked is a complete circuit board card that has been manufactured, and the circuit board card includes multiple components, such as resistors, capacitors, power modules and crystals. The computer device obtains the configuration information of the components on the circuit board card to be checked. If the number of components in the circuit board card to be checked is more than one, the component configuration information includes the inspection index of each component and the identification of each component. Among them, the inspection index of the component refers to the requirements when the components need to be inspected in actual applications, such as the testability, assembly temperature, operating temperature, manufacturability and electromagnetic interference of the components. The identification of the component is used to indicate the type and number of the component. For example, the component identification is C1 and C2, which respectively represent the capacitor numbered 1 and the capacitor numbered 2. There is more than one inspection index for each component. For example, the inspection index of the power module may include assembly temperature, operating temperature and testability. This embodiment does not limit the type and structure of the circuit board card to be checked, as well as the number, type and specific configuration information of the components included in the circuit board card to be checked, as long as its function can be achieved.

[0050] In an optional embodiment, the computer device may also obtain the component configuration information according to actual needs. In other words, the computer device may only obtain the configuration information required for inspecting the components in the actual application scenario. This can avoid the need to obtain all the component configuration information every time the electronic components are inspected, thereby increasing the rate of obtaining the component configuration information.

[0051] Step 110: Obtain the design rule corresponding to the inspection index of the component according to the identification of the component, and determine the matching result between the inspection index of the component and the design rule according to the inspection index and the design rule.

[0052] After obtaining the component configuration information, the computer device can obtain the design rules corresponding to the component according to the component identification in the component configuration information, that is, the special requirements of the staff for the component in the actual application scenario. The design rules can be pre-stored in the memory of the computer device. After obtaining the identification of the component, the computer device traverses the design rules stored in the memory according to the identification of the component to find the design rules corresponding to the component. Specifically, each inspection indicator of the component corresponds to a design rule. For example, the inspection indicators of the power module are assembly temperature and operating temperature. The corresponding design rules include the range of assembly temperature and the range of operating temperature. The assembly temperature corresponds to the range of assembly temperature, and the operating temperature corresponds to the range of operating temperature. After obtaining the design rules corresponding to the component, the computer device matches it with the inspection indicators in the component configuration information to determine the matching result. Specifically, the computer device matches the assembly temperature of the power module with the assembly temperature range to determine whether the assembly temperature is within the assembly temperature range; similarly, the computer device matches the operating temperature of the power module with the operating temperature range to determine whether the operating temperature is within the operating temperature range.

[0053] Step 120: Generate a component inspection report based on the matching results.

[0054] After determining the matching result, the computer device generates a component inspection report based on the matching result. The inspection report may include components whose inspection indicators match the design rules and the matching results, and components whose inspection indicators do not match the design rules and the matching results. This example does not limit the specific content and format of the inspection report, as long as it can indicate the inspection results of the components.

[0055] The electronic component inspection method provided in the embodiment of the present application obtains the component configuration information of the circuit board card to be inspected; obtains the design rules corresponding to the components according to the identification of the components, and determines the matching results of the inspection indicators and design rules of the components according to the inspection indicators and design rules; and generates an inspection report of the components according to the matching results. The electronic component inspection method provided in the embodiment of the present application obtains a matching result by matching the design rules of the component correspondence table with the inspection indicators of the components, so as to realize the inspection of whether the components meet the design rules, thereby improving the reliability and practicality of the circuit board card to be inspected made using this component. In addition, the inspection report is generated according to the matching results, which is convenient for the staff to determine whether the components meet the design rules in a more realistic manner, and can improve the convenience and practicality of the electronic component inspection method provided in the embodiment of the present application.

[0056] See also Figure 2In one embodiment, a possible implementation method for determining the matching result between the inspection index and the design rule of a component is proposed according to the inspection index and the design rule. The steps of the method include:

[0057] Step 200: determine whether the inspection indicator has a corresponding design rule; the design rule is used to represent the rules for assembling components on the circuit board to be inspected.

[0058] Step 210: If yes, then obtain the design rule corresponding to the inspection indicator, and compare the inspection indicator with the design rule corresponding to the inspection indicator to determine the matching result between the inspection indicator of the component and the design rule.

[0059] After the computer device obtains the design rules corresponding to the components according to the identification of the components, it will determine whether the design rules corresponding to the components include the design rules corresponding to the inspection indicators of the components. If the computer device determines that the design rules corresponding to the components include the design rules corresponding to the inspection indicators of the components, the design rules are obtained, the inspection indicators of the components are compared with the design rules, and the matching results of the inspection indicators of the components and the design rules are determined. Among them, the design rules of the components can be used to characterize the rules for assembling the components on the circuit board card to be inspected. If the computer device determines that the design rules corresponding to the components do not include the design rules corresponding to the inspection indicators of the components, the computer device can directly output the inspection indicators of the components and generate an inspection report.

[0060] In this embodiment, before comparing the inspection indicator with the design rule corresponding to the inspection indicator, it is first determined whether the inspection indicator has a corresponding design rule. When there is no corresponding design rule, there is no need to perform the comparison operation, thereby reducing the calculation amount of the computer equipment and improving calculation efficiency.

[0061] See also Figure 3 In one embodiment, another possible implementation method for determining the matching result between the inspection index and the design rule of the component is proposed according to the inspection index and the design rule. The steps of the method include:

[0062] Step 300: If the component configuration information includes inspection requirements corresponding to the inspection indicators, it is determined whether the inspection requirements of the inspection indicators in the component configuration information match the design rules to determine a matching result.

[0063] After obtaining the component configuration information, the computer device determines whether the inspection indicator in the component configuration information has a corresponding inspection requirement. If the computer device determines that the component configuration information includes the inspection requirement corresponding to the inspection indicator, the inspection requirement of the inspection indicator in the component configuration information is compared with the design rule to determine whether the inspection requirement of the inspection indicator matches the design rule, that is, to obtain a matching result.

[0064] Step 310: If the component configuration information does not include the inspection requirement corresponding to the inspection indicator, a matching result is generated based on the inspection requirement corresponding to the inspection indicator in the design rule.

[0065] If the computer device determines that the component configuration information does not include the inspection requirements corresponding to the inspection indicators, the computer device generates a matching result based on the inspection requirements corresponding to the inspection indicators in the design rules corresponding to the acquired components, that is, the matching result at this time is the inspection requirement corresponding to the inspection indicators in the design rules.

[0066] In an optional embodiment, the component is a power module, and the inspection index of the power module includes an assembly temperature. If the inspection index includes a corresponding inspection requirement, that is, the inspection requirement corresponding to the inspection index is that the assembly temperature is 170 degrees, and the design rule corresponding to the component includes that the assembly temperature is greater than 160 degrees, then the computer device compares the inspection requirement with the design rule to determine whether the inspection requirement matches the design rule and whether the assembly temperature of 170 degrees is greater than 160 degrees. If the inspection index does not include the inspection requirement, the computer device uses the assembly temperature greater than 160 degrees in the design rule as a matching result.

[0067] In another optional embodiment, the component is a capacitor, and the inspection index of the capacitor includes testability. If the inspection index includes a corresponding inspection requirement, the inspection requirement corresponding to the testability is how to check the testability (specifically, it can be the setting position of the capacitor, that is, whether the setting position of the capacitor is convenient for detecting the voltage or current of the capacitor), and the design rules corresponding to the component include restrictions on the setting position of the capacitor, then the computer device compares the inspection requirement with the design rules, that is, determines whether the setting position of the capacitor meets the restrictions on the setting position of the capacitor in the design rules. If the inspection index does not include the inspection requirement, and the design rules include the inspection requirement corresponding to the inspection index of the component, then the computer device outputs the inspection requirement in the design rules as a matching result.

[0068] In this embodiment, if the component configuration information does not include the inspection requirements corresponding to the inspection indicators, but the design rules corresponding to the components include the inspection requirements, the inspection requirements in the design rules are output as matching results, thereby generating an inspection report. This allows users to more comprehensively obtain inspection results for components, thereby improving the practicality and reliability of the electronic component inspection method.

[0069] See also Figure 4 In one embodiment, the steps of the electronic component inspection method further include:

[0070] Step 400: Determine whether there is any conflict or abnormality between the inspection indicators of each component.

[0071] After obtaining the component configuration information of the circuit board to be inspected, the computer equipment compares the inspection indicators of each component in the component configuration information to determine whether there are conflicts and anomalies between the inspection indicators of each component. Conflict anomalies refer to the contradictions between the inspection indicators of components. Suppose that the inspection indicator of the crystal is stress, and the inspection requirement is to set it away from components that can generate stress. The inspection indicator of the assembly hole is the setting position, and the inspection requirement is that greater stress will be generated when the assembly hole is used. The stress generated when the assembly hole is set close to the crystal will affect the crystal, and there will be a conflict and anomaly between the inspection indicator of the crystal and the inspection indicator of the assembly hole.

[0072] Step 410: If there is a conflict anomaly, an inspection report is generated based on the identification and anomaly information of the component.

[0073] If the computer device determines that there are conflicting anomalies between the inspection indicators of the components in the component configuration information, the computer device uses the identification of the conflicting components and the conflicting anomaly information as the content of the inspection report to obtain a final inspection report.

[0074] In this embodiment, by determining whether there are conflicting anomalies between the inspection indicators of components, it is possible to avoid the situation where the inspection indicators of each component match the design rules, but there are conflicts between the inspection indicators of the components, resulting in the circuit board card to be inspected being unusable, thereby improving the reliability of the electronic component inspection method. The method for determining whether there are conflicting anomalies between the inspection indicators of components provided in this embodiment can be performed when it is determined that the inspection indicators of each component match the corresponding design rules.

[0075] See also Figure 5 In one embodiment, a possible implementation method for determining whether there is a conflict anomaly between the inspection indicators of each component is proposed, and the steps of the method include:

[0076] Step 500: Compare the design rules corresponding to the inspection indicators of each component to determine whether there are any conflicts or anomalies between the inspection indicators of each component.

[0077] When the computer device determines whether there are conflict anomalies between the inspection indicators of the components, it can determine whether there are conflict anomalies between the design rules corresponding to the inspection indicators of the components. Specifically, the computer device can obtain the design rules corresponding to the inspection indicators of each component based on the acquired design rules of the components. The computer device compares the design rules corresponding to the inspection indicators of each component, determines whether there are conflict anomalies between the design rules of the inspection indicators of each component, and thus can determine whether there are conflict anomalies between the inspection indicators of each component.

[0078] The method for determining whether there are conflict anomalies between inspection indicators of components provided in this embodiment is simple and easy to understand.

[0079] In an optional embodiment, assuming that the design rule corresponding to the assembly temperature of one component is less than 100 degrees, and the design rule corresponding to the assembly temperature of another component is greater than 120 degrees, the assembly temperatures of these two components contradict each other and there is a conflict anomaly, then it can be determined that there is a conflict anomaly between the inspection indicators of the two components.

[0080] Please continue to see Figure 5 In one embodiment, another possible implementation method for determining whether there is a conflict anomaly between the inspection indicators of each component is proposed, and the steps of the method include:

[0081] Step 510: Obtain the board configuration information of the circuit board to be checked.

[0082] When the computer device judges whether there is a conflict anomaly between the inspection indicators of each component, it can judge through the intermediate quantity, that is, the board configuration information of the circuit board to be inspected, and the computer device obtains the board configuration information of the circuit board to be inspected. The board configuration information may include the identification of the circuit board to be inspected, and the inspection indicators of the circuit board to be inspected. The description of the board configuration information can refer to the above-mentioned specific description of the component configuration information, which will not be repeated here. The computer device can obtain the board configuration information when it is necessary to check whether there is a conflict anomaly between the inspection indicators of the components; it can also directly obtain the board configuration information while obtaining the component configuration information, and store it in the memory of the computer device, and the computer device can directly obtain it when needed. This embodiment does not limit the specific method and timing of obtaining the board configuration information, as long as its function can be achieved.

[0083] Step 520: Compare the design rules corresponding to the inspection indicators of each component with the board configuration information to determine whether there are any conflicts or anomalies between the inspection indicators of each component.

[0084] After obtaining the board configuration information, the computer device compares the design rules corresponding to the inspection indicators of each component with the board configuration information to determine whether there are any conflicts between the design rules corresponding to the inspection indicators of each component and the board configuration information, so as to determine whether there are any conflicts between the inspection indicators of each component.

[0085] In one embodiment, a possible implementation method is proposed to compare the design rules corresponding to the inspection indicators of each component with the board configuration information to determine whether there is a conflict anomaly between the inspection indicators of each component, such as Figure 6 As shown, the steps of the method include:

[0086] Step 600: for any two components in the circuit board to be inspected, if there is a component that meets the preset conditions between the two components, it is determined that there is a conflict anomaly between the inspection indicators of the two components; wherein the preset conditions include that the design rules corresponding to the inspection indicators of the components do not match the board configuration information.

[0087] Step 610: If there is no component satisfying the preset condition between any two components, it is determined that there is no conflict anomaly between the inspection indicators of the two components.

[0088] The computer device arbitrarily selects two components in the circuit board to be checked for conflict anomaly judgment. If the computer device determines that the design rule corresponding to the inspection index of one of the two components does not match the board configuration information, it can be determined that there is a conflict anomaly between the inspection indexes of the two components. If the computer device determines that the design rule corresponding to the inspection indexes of the two components matches the board configuration information, it can be determined that there is no conflict anomaly between the inspection indexes of the two components.

[0089] In an optional embodiment, assuming that the assembly temperature of the board in the board configuration information is greater than 100 degrees, the design rule corresponding to the inspection index of the first component is that the assembly temperature is greater than 130 degrees, and the design rule corresponding to the inspection index of the second component is that the assembly temperature is less than 90 degrees. If the design rule corresponding to the inspection index of the second component does not match the board information, it can be determined that there is a conflict anomaly between the inspection indexes of the first component and the second component.

[0090] In this embodiment, an intermediate quantity is introduced to determine whether there is a conflict anomaly between the inspection indicators of each component, so that the accuracy of the final determination can be improved.

[0091] It should be understood that, although the various steps in the flowchart in the figure are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a part of the steps in the figure may include a plurality of sub-steps or a plurality of stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these sub-steps or stages is not necessarily carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0092] See also Figure 7An embodiment of the present application provides an electronic component inspection device 10, which includes: an acquisition module 11, a determination module 12 and a generation module 13. Among them,

[0093] The acquisition module 11 is used to acquire the component configuration information of the circuit board to be inspected; the component configuration information includes the inspection index of each component in the circuit board to be inspected and the identification of each component;

[0094] The determination module 12 is used to obtain the design rules corresponding to the components according to the identification of the components, and determine the matching results of the inspection indicators of the components and the design rules according to the inspection indicators and the design rules;

[0095] The generating module 13 is used to generate an inspection report of the components according to the matching results.

[0096] In one embodiment, the determination module 12 includes a first judgment unit and a first determination unit. The first judgment unit is used to determine whether the inspection indicator has a corresponding design rule; the design rule is used to characterize the rule for assembling components on the circuit board to be inspected; the first determination unit is used to, if yes, obtain the design rule corresponding to the inspection indicator, and compare the inspection indicator with the design rule corresponding to the inspection indicator to determine the matching result between the inspection indicator of the component and the design rule.

[0097] In one embodiment, the determination module 12 further includes a second judgment unit and a generation unit. The second judgment unit is used to determine whether the inspection requirements of the inspection indicators in the component configuration information match the design rules if the component configuration information includes the inspection requirements corresponding to the inspection indicators, so as to determine the matching result; the generation unit is used to generate the matching result based on the inspection requirements corresponding to the inspection indicators in the design rules if the component configuration information does not include the inspection requirements corresponding to the inspection indicators.

[0098] In one example, the electronic component inspection device further includes a judgment module, which is used to judge whether there is a conflict anomaly between the inspection indicators of each component; if there is a conflict anomaly, an inspection report is generated according to the identification and abnormal information of the component.

[0099] In one example, the judgment module includes a comparison unit, which is used to obtain the design rules corresponding to the inspection indicators of each component, and compare the design rules corresponding to the inspection indicators of each component to determine whether there are conflict anomalies between the inspection indicators of each component.

[0100] In one embodiment, the judgment module further includes an acquisition unit and a second determination unit. The acquisition unit is used to acquire the board configuration information of the circuit board to be inspected; the second determination unit is used to compare the design rules corresponding to the inspection index of each component with the board configuration information to determine whether there is a conflict anomaly between the inspection index of each component.

[0101] In one embodiment, the second determination unit is specifically used to determine, for any two components in the circuit board card to be inspected, that there is a conflict anomaly between the inspection indicators of the two components if there is a component that meets the preset conditions between the two components; wherein the preset conditions include that the design rules corresponding to the inspection indicators of the components do not match the board configuration information; if there is no component that meets the preset conditions between the two components, then it is determined that there is no conflict anomaly between the inspection indicators of the two components.

[0102] For the specific definition of the electronic component inspection device 10, please refer to the definition of the electronic component inspection method above, which will not be repeated here. Each module in the electronic component inspection device 10 can be implemented in whole or in part by software, hardware, and a combination thereof. The above-mentioned devices, modules, or units can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above-mentioned devices or modules.

[0103] See also Figure 8 In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Figure 8 As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store component configuration information and design rules, etc. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer device is executed by the processor, an electronic component inspection method is implemented.

[0104] Those skilled in the art will understand that Figure 8 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0105] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

[0106] Obtaining component configuration information of the circuit board to be inspected; the component configuration information includes inspection indicators of each component in the circuit board to be inspected and an identification of each component;

[0107] Obtain the design rules corresponding to the components according to the identification of the components, and determine the matching results between the inspection indicators of the components and the design rules according to the inspection indicators and the design rules;

[0108] Generate component inspection reports based on the matching results.

[0109] In one embodiment, when the processor executes the computer program, the following steps are also implemented: determining whether the inspection indicator has a corresponding design rule; the design rule is used to characterize the rules for assembling components on the circuit board to be inspected; if so, obtaining the design rule corresponding to the inspection indicator, and comparing the inspection indicator with the design rule corresponding to the inspection indicator to determine the matching result between the inspection indicator and the design rule of the component.

[0110] In one embodiment, when the processor executes the computer program, the following steps are also implemented: if the component configuration information includes inspection requirements corresponding to the inspection indicators, then it is determined whether the inspection requirements of the inspection indicators in the component configuration information match the design rules to determine the matching results; if the component configuration information does not include the inspection requirements corresponding to the inspection indicators, then a matching result is generated based on the inspection requirements corresponding to the inspection indicators in the design rules.

[0111] In one embodiment, when the processor executes the computer program, the following steps are also implemented: determining whether there are conflict anomalies between the inspection indicators of each component; if there are conflict anomalies, generating an inspection report according to the identification and abnormality information of the component.

[0112] In one embodiment, when the processor executes the computer program, the following steps are also implemented: obtaining the design rules corresponding to the inspection indicators of each component, and comparing the design rules corresponding to the inspection indicators of each component to determine whether there are conflict anomalies between the inspection indicators of each component.

[0113] In one embodiment, when the processor executes the computer program, the following steps are also implemented: obtaining the board configuration information of the circuit board to be inspected; comparing the design rules corresponding to the inspection indicators of each component with the board configuration information to determine whether there are conflicting anomalies between the inspection indicators of each component.

[0114] In one embodiment, when the processor executes the computer program, the following steps are also implemented: for any two components in the circuit board to be inspected, if there is a component that meets the preset conditions between any two components, it is determined that there is a conflict anomaly between the inspection indicators of the two components; wherein the preset conditions include that the design rules corresponding to the inspection indicators of the components do not match the board configuration information; if there is no component that meets the preset conditions between any two components, it is determined that there is no conflict anomaly between the inspection indicators of the two components.

[0115] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0116] Obtaining component configuration information of the circuit board to be inspected; the component configuration information includes inspection indicators of each component in the circuit board to be inspected and an identification of each component;

[0117] Obtain the design rules corresponding to the components according to the identification of the components, and determine the matching results between the inspection indicators of the components and the design rules according to the inspection indicators and the design rules;

[0118] Generate component inspection reports based on the matching results.

[0119] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: determining whether the inspection indicator has a corresponding design rule; the design rule is used to characterize the rules for assembling components on the circuit board to be inspected; if so, obtaining the design rule corresponding to the inspection indicator, and comparing the inspection indicator with the design rule corresponding to the inspection indicator to determine the matching result between the inspection indicator and the design rule of the component.

[0120] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: if the component configuration information includes inspection requirements corresponding to the inspection indicators, then it is determined whether the inspection requirements of the inspection indicators in the component configuration information match the design rules to determine the matching results; if the component configuration information does not include the inspection requirements corresponding to the inspection indicators, then a matching result is generated based on the inspection requirements corresponding to the inspection indicators in the design rules.

[0121] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: determining whether there are conflict anomalies between the inspection indicators of each component; if there are conflict anomalies, generating an inspection report based on the identification and abnormality information of the component.

[0122] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: obtaining the design rules corresponding to the inspection indicators of each component, and comparing the design rules corresponding to the inspection indicators of each component to determine whether there are conflicting anomalies between the inspection indicators of each component.

[0123] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: obtaining the board configuration information of the circuit board to be inspected; comparing the design rules corresponding to the inspection indicators of each component with the board configuration information to determine whether there are conflicting anomalies between the inspection indicators of each component.

[0124] In one embodiment, when the computer program is executed by the processor, the following steps are also implemented: for any two components in the circuit board to be inspected, if there is a component that meets the preset conditions between any two components, it is determined that there is a conflict anomaly between the inspection indicators of the two components; wherein the preset conditions include that the design rules corresponding to the inspection indicators of the components do not match the board configuration information; if there is no component that meets the preset conditions between any two components, it is determined that there is no conflict anomaly between the inspection indicators of the two components.

[0125] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in the present application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0126] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0127] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for inspecting electronic components, characterized in that: include: Acquire component configuration information of the circuit board to be inspected; the component configuration information includes inspection indicators of each component in the circuit board to be inspected and an identification of each component; Acquire the design rule corresponding to the component according to the identification of the component, and determine the matching result between the inspection indicator of the component and the design rule according to the inspection indicator and the design rule; Generating an inspection report of the component according to the matching result; Determine whether there is a conflict or abnormality between the inspection indicators of each of the components; If the conflict anomaly exists, generating an inspection report based on the identification and anomaly information of the component; Wherein, the determining whether there is a conflict anomaly between the inspection indicators of each of the components includes: Obtaining the board configuration information of the circuit board to be checked; The design rules corresponding to the inspection indicators of each of the components are compared with the board configuration information to determine whether there is a conflict anomaly between the inspection indicators of each of the components.

2. The electronic component inspection method according to claim 1, characterized in that: Determining the matching result between the inspection index of the component and the design rule according to the inspection index and the design rule includes: Determine whether the inspection index has the corresponding design rule; the design rule is used to characterize the rule for assembling the components on the circuit board to be inspected; If so, the design rule corresponding to the inspection indicator is obtained, and the inspection indicator is compared with the design rule corresponding to the inspection indicator to determine a matching result between the inspection indicator of the component and the design rule.

3. The electronic component inspection method according to claim 1, characterized in that: Determining the matching result between the inspection index of the component and the design rule according to the inspection index and the design rule includes: If the component configuration information includes the inspection requirement corresponding to the inspection indicator, determining whether the inspection requirement of the inspection indicator in the component configuration information matches the design rule to determine the matching result; If the component configuration information does not include the inspection requirement corresponding to the inspection indicator, a matching result is generated based on the inspection requirement corresponding to the inspection indicator in the design rule.

4. The electronic component inspection method according to claim 1, characterized in that: The determining whether there is a conflict anomaly between the inspection indicators of each of the components further includes: The design rules corresponding to the inspection indicators of each of the components are obtained, and the design rules corresponding to the inspection indicators of each of the components are compared to determine whether there is a conflict anomaly between the inspection indicators of each of the components.

5. The electronic component inspection method according to claim 1, characterized in that: The step of comparing the design rule corresponding to the inspection index of each component with the board configuration information to determine whether there is a conflict anomaly between the inspection indexes of each component includes: For any two components in the circuit board to be inspected, if there is a component that meets the preset condition among the any two components, it is determined that there is the conflict anomaly between the inspection indicators of the two components; wherein the preset condition includes that the design rule corresponding to the inspection indicator of the component does not match the board configuration information; If there is no component satisfying the preset condition between any two components, it is determined that there is no conflict anomaly between the inspection indicators of the two components.

6. An electronic component inspection device, characterized in that: include: An acquisition module, used for acquiring component configuration information of the circuit board to be inspected; the component configuration information includes inspection indicators of each component in the circuit board to be inspected and an identification of each component; A determination module, configured to obtain a design rule corresponding to the component according to the identification of the component, and determine a matching result between the inspection indicator of the component and the design rule according to the inspection indicator and the design rule; A generating module, used for generating an inspection report of the component according to the matching result; A judgment module, used to judge whether there is a conflict anomaly between the inspection indicators of each of the components; If the conflict anomaly exists, generating an inspection report based on the identification and anomaly information of the component; The judgment module includes an acquisition unit and a second determination unit; The acquisition unit is used to acquire the board configuration information of the circuit board to be checked; The second determination unit is used to compare the design rule corresponding to the inspection index of each of the components with the board configuration information to determine whether the conflict anomaly exists between the inspection index of each of the components.

7. The device according to claim 6, characterized in that The determination module includes a first judgment unit and a first determination unit; The first judgment unit is used to judge whether the inspection index has the corresponding design rule; the design rule is used to represent the rule for assembling the components on the circuit board to be inspected; The first determining unit is configured to obtain the design rule corresponding to the inspection indicator, and compare the inspection indicator with the design rule corresponding to the inspection indicator to determine a matching result between the inspection indicator of the component and the design rule.

8. The device according to claim 6, characterized in that The determination module also includes a second judgment unit and a generation unit; The second judgment unit is configured to judge whether the inspection requirement of the inspection indicator in the component configuration information matches the design rule if the component configuration information includes the inspection requirement corresponding to the inspection indicator, so as to determine the matching result; The generating unit is configured to generate a matching result based on the inspection requirement corresponding to the inspection indicator in the design rule if the component configuration information does not include the inspection requirement corresponding to the inspection indicator.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 5 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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