Method of manufacturing a display device

Abstract

Disclosed is a method of manufacturing a display device, including: a step of providing a substrate including a display panel defined with panel marks; a step of disposing a processing module defined with a processing mark corresponding to the panel marks and a first processing line adjacent to the processing mark on the display panel; a step of calculating an offset amount between the panel marks and the processing mark when viewed on a plane; a step of correcting the first processing line to define a second processing line overlapping a bezel of the display panel, reflecting the calculated offset amount; and a step of processing the bezel of the display panel along the second processing line. The step of calculating the offset amount includes: a step of defining a first point defined in the processing mark and a second point of the panel mark corresponding to the first point; a step of calculating a first offset amount defined as a displacement between the first point and the second point; and a step of calculating a second offset amount defined as an angle formed by the panel mark with respect to the processing mark.

Description

TECHNICAL FIELD

[0001] The present application relates to a manufacturing method of a display device, and more particularly, to a manufacturing method of cutting a display panel. BACKGROUND

[0002] Electronic devices such as a smart phone, a digital camera, a notebook computer, a navigation device, and a smart TV, which provide an image to a user, include a display device for displaying an image. The display device generates an image and provides the image to the user through a display screen.

[0003] Recently, as the technology of a display device has been developed, various forms of display devices have been developed. For example, various flexible display devices capable of being deformed in a curved shape, folded, or rolled have been developed. The flexible display device capable of being variously deformed is easy to carry and can improve the convenience of a user. SUMMARY

[0004] An object of the present application is to provide a manufacturing method of a display device capable of more precisely cutting a display panel in consideration of deformation of the display panel.

[0005] A manufacturing method of a display device according to an embodiment of the present application includes a step of providing a substrate including a display panel defined with a panel mark; a step of disposing a processing module defined with a processing mark corresponding to the panel mark and a first processing line adjacent to the processing mark on the display panel; a step of calculating an offset amount between the panel mark and the processing mark when viewed on a plane; a step of correcting the first processing line to define a second processing line overlapping a bezel of the display panel by reflecting the calculated offset amount; and a step of processing a bezel of the display panel along the second processing line. The step of calculating the offset amount includes a step of defining positions of a first point defined in the processing mark and a second point of the panel mark corresponding to the first point, calculating a first offset amount defined as a displacement between the first point and the second point; and a step of calculating a second offset amount defined as an angle formed by the panel mark with respect to the processing mark.

[0006] The manufacturing method of a display device according to an embodiment of the present application includes a step of arranging a display panel defined with a panel mark on a first processing area defined by a first axis and a second axis crossing the first axis; a step of calculating a displacement of the panel mark on the first axis and a displacement on the second axis with respect to a processing mark defined in the first processing area when viewed in a plane; a step of calculating an angle formed by the panel mark and the processing mark when viewed in a plane; a step of defining a second processing area of the first processing area reflecting the displacement on the first axis, the displacement on the second axis, and the angle; and a step of processing a bezel of the display panel along a boundary of the second processing area.

[0007] (EFFECT OF INVENTION)

[0008] The manufacturing method of a display device according to an embodiment of the present application processes a bezel of a display panel with reference to a second processing line reflecting deformation of the display panel due to a heat treatment process, and thus can implement a more precise cutting process. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 FIG. 1 is a perspective view of a display device according to an embodiment of the present application.

[0010] Figure 2 FIG. 2 is a perspective view of a display device according to an embodiment of the present application. Figure 1 FIG. 3 is a view showing a state in which the display device shown in FIG. 2 is folded.

[0011] Figure 3A FIG. 4 is a view showing a state in which the display device shown in FIG. 2 is rolled and unfolded. Figure 3B Figure 1 FIG. 5 is a cross-sectional view exemplarily showing the display device shown in FIG. 2.

[0012] Figure 4 FIG. 6 is a flowchart showing a manufacturing method of a display device according to an embodiment of the present application. Figure 1

[0013] Figure 5 FIG. 7 is a plan view exemplarily showing a substrate on which a plurality of display panels are defined.

[0014] Figure 6 FIG. 8 is a view exemplarily showing a cutting device used in the manufacturing method of a display device according to the present embodiment.

[0015] Figure 7 FIG. 9 is a view exemplarily showing a processing module of the cutting device shown in FIG. 8.

[0016] Figure 8 FIG. 10 is a view exemplarily showing a worktable model indicated in the processing module of the cutting device shown in FIG. 8. Figure 7

[0017] ​​​Figure 9 is an explanatory view Figure 6 The substrate configuration shown in Figure 7 is a patterned view of the worktable of the cutting device shown in

[0018] Figure 10 and Figure 11 is a view for explaining deformation of the display panel due to thermal expansion.

[0019] Figures 12A-12D is a view for explaining a method of calculating Figure 11 the offset amount between the processing marks and the panel marks shown in

[0020] Figure 13 is a view showing a second processing line in which the calculated offset amount is reflected in the first processing line shown in Figure 11

[0021] Figure 14 is a cross-sectional view of the I-I' line shown in Figure 13

[0022] (Explanation of Reference Numerals)

[0023] DD: display device DP: display panel

[0024] MS: substrate CD: cutting device

[0025] MM: processing module ST: worktable

[0026] M1 to M4: first to fourth processing marks

[0027] PM1 to PM4: first to fourth panel marks DETAILED DESCRIPTION

[0028] In the present specification, when referring to a certain constituent element (or region, layer, portion, etc.) being "on", "connected to", or "joined to" another constituent element, it means that the certain constituent element can be directly provided / connected / joined to the other constituent element, or a third constituent element can be provided between them.

[0029] The same reference numerals denote the same constituent elements. In addition, in the drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for effective explanation of the technical content.

[0030] "and / or" includes all combinations of the relevant constituent elements defined thereby.

[0031] ​​The terms first, second, and so on can be used to describe various constituent elements, but the constituent elements are not limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from another constituent element. For example, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element, without departing from the scope of the present application. The singular expression includes the plural expression unless it is explicitly stated in the context.

[0032] In addition, the terms such as "lower", "bottom", "upper", "top" are used to describe the relative relationship of the constituent elements shown in the drawings. The terms are relative concepts described based on the direction indicated in the drawings.

[0033] Unless otherwise defined, all terms used in the present specification, including technical terms and scientific terms, have the same meanings as those generally understood by those skilled in the art to which the present application pertains. In addition, the terms defined in a generally used dictionary are to be interpreted as having the same meanings as those in the context of the relevant technology, unless explicitly defined otherwise, and are to be interpreted not as ideal or over-formal meanings unless explicitly defined in the present specification.

[0034] The terms such as "include" and "have" are to be construed as specifying the presence of stated features, numbers, steps, actions, constituent elements, components, or combinations thereof, and not precluding the presence or addition of one or more other features, numbers, steps, actions, constituent elements, components, or combinations thereof.

[0035] Hereinafter, an embodiment of the present application will be described in detail with reference to the accompanying drawings.

[0036] Figure 1 is a perspective view of a display device according to an embodiment of the present application. Figure 2 is a view showing Figure 1 is a view showing a state in which the display device shown in Figure 3A is a view showing Figure 3B is a view showing a state in which the display device shown in Figure 1 is a view showing a state in which the display device shown in

[0037] Referring to Figure 1 The display device DD according to the embodiment of the present application can have a shape of a right-angled quadrangle having a long side extending in a first direction DR1 and a short side extending in a second direction DR2 intersecting the first direction DR1. However, it is not limited thereto, and the display device DD can have various shapes such as a circular shape and a polygonal shape.

[0038] The display device DD can have a thin thickness in a third direction DR3. The third direction DR3 refers to a direction that substantially perpendicularly intersects a plane defined by the first direction DR1 and the second direction DR2. In the present specification, the meaning of "when viewed in a plan view" can mean a state of being viewed from the third direction DR3.

[0039] The upper surface of the display device DD can be defined as a display surface DS, and can have a plane defined by the first direction DR1 and the second direction DR2. An image IM generated in the display device DD can be provided to a user through the display surface DS.

[0040] The display surface DS can include a display area DA and a non-display area NDA surrounding the display area DA. It can be that the display area DA displays an image, and the non-display area NDA does not display an image. The non-display area NDA can surround the display area DA, and define a bezel of the display device DD printed in a predetermined color.

[0041] According to an embodiment of the present application, the display device DD can be a flexible display device. That is, the display device DD can be folded or rolled.

[0042] Referring to Figure 2 , the display device DD can be in-folding such that the display surface DS is not exposed to the outside. Specifically, the display device DD can include a first non-folded area NFA1, a second non-folded area NFA2, and a folded area FA disposed between the first non-folded area NFA1 and the second non-folded area NFA2. The first non-folded area NFA1, the second non-folded area NFA2, and the folded area FA can be arranged in the first direction DR1.

[0043] The display device DD can be bent with reference to a folding axis FX parallel to the second direction DR2. When the display device DD is folded, the upper surface of the first non-folded area NFA1 and the upper surface of the second non-folded area NFA2 can face each other. Accordingly, the display surface DS of the display device DD can not be exposed to the outside.

[0044] However, the manner in which the display device DD is folded is not limited thereto. For example, the display device DD can also be out-folding such that the display surface DS is exposed to the outside.

[0045] Referring to Figure 3A and Figure 3B , the display device DD can perform a rolling or unfolding action. Specifically, the display device DD can be mounted in a case CS. A portion of the display device DD can be configured in a state of being rolled inside the case CS.

[0046] For example, the housing CS can include a first housing CS1 and a second housing CS2 which are combined to accommodate the display device DD. The second housing CS2 can be combined to the first housing CS1 in a manner of moving in a first direction DR1. That is, the second housing CS2 can move away from or approach the first housing CS1. As the second housing CS2 moves in the first direction DR1, an area of the display surface DS exposed to the outside can change.

[0047] As previously explained, the display device DD can be folded or rolled to provide the display surface DS of various sizes to the user.

[0048] Figure 4 is an exemplary view Figure 1 is a cross-sectional view of the display device shown in

[0049] Referring to Figure 4 , the display device DD can include a display panel DP, an input sensing part ISP, an anti-reflection layer POL, and a window WIN.

[0050] The display panel DP according to an embodiment of the present application can be a light emitting type display panel. For example, the display panel DP can be an organic light emitting display panel or a quantum dot light emitting display panel. The light emitting layer of the organic light emitting display panel can include an organic light emitting substance. The light emitting layer of the quantum dot light emitting display panel can include quantum dots, quantum rods, or the like. Hereinafter, the display panel DP will be described as an organic light emitting display panel.

[0051] The display panel DP can generate an image by an organic light emitting substance. The image generated by the display panel DP can be visually recognized by a user through the display surface DS shown in Figure 1 . The display panel DP can include a unit substrate SUB, a circuit element layer CL, a display element layer OL, and a thin film encapsulation layer TFE.

[0052] The unit substrate SUB can be a base layer of the display panel DP. The unit substrate SUB can include a flexible substrate. For example, the unit substrate SUB can include polyimide (PI), polyethylene terephthalate (PET), or the like. However, the material of the unit substrate SUB is not limited thereto. The unit substrate SUB can also include other substances having flexibility.

[0053] The circuit element layer CL can be disposed on the unit substrate SUB. The circuit element layer CL can overlap the display area DA and the non-display area NDA.

[0054] The circuit element layer CL can include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line, etc. The insulating layer, the semiconductor layer, and the conductive layer can be formed on the unit substrate SUB in a manner of coating and evaporation, etc., and then the insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned by a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line of the circuit element layer CL can be formed.

[0055] The display element layer OL can be disposed on the circuit element layer CL. The display element layer OL can overlap the display area DA. The display element layer OL can include a light emitting element. For example, the display element layer OL can include an organic light emitting substance, a quantum dot, a quantum rod, or a micro light emitting diode.

[0056] The thin film encapsulation layer TFE can be disposed on the display element layer OL. More specifically, a central region of the thin film encapsulation layer TFE can be disposed on the display element layer OL, and an edge region of the thin film encapsulation layer TFE can be disposed on the circuit element layer CL.

[0057] The thin film encapsulation layer TFE can include at least two inorganic layers and an organic layer disposed between the inorganic layers. The inorganic layer includes an inorganic substance and can protect the display element layer OL from moisture / oxygen. The organic layer includes an organic substance and can protect the display element layer OL from foreign substances such as dust particles.

[0058] The input sensing part ISP can be disposed on the display panel DP. The input sensing part ISP can sense an external input (e.g., a user's touch) and change into a predetermined input signal, and provide the input signal to the display panel DP. The display panel DP can receive the provision of the input signal from the input sensing part ISP and generate an image corresponding to the input signal.

[0059] The anti-reflection layer POL can be disposed on the display panel DP. The anti-reflection layer POL can be an external light anti-reflection film. The anti-reflection layer POL can reduce the reflectance of external light incident from above the display device DD toward the display panel DP. Illustratively, the anti-reflection layer POL can include a phase retarder and / or a polarizer.

[0060] The window WIN can be disposed on the anti-reflection layer POL. The window WIN can protect the display panel DP and the input sensing part ISP from external scratches and impacts. The window WIN can be attached to the anti-reflection layer POL by an adhesive OCA. The adhesive OCA can include an optical clear adhesive (OCA). An image generated in the display panel DP can be provided to a user through the window WIN.

[0061] However, the cross-sectional structure of the display device DD is not limited thereto. The display device DD can also include other functional layers.

[0062] Hereinafter, a method of manufacturing the display device DD shown in Figure 1 will be described. Specifically, the method of manufacturing the display device according to an embodiment of the present application involves a process of cutting the display panels DP delineated on the substrate MS from the substrate MS in various processes of manufacturing the display device DD.

[0063] Figure 5 is a flowchart showing a method of manufacturing the display device according to an embodiment of the present application. Figure 6 is a plan view exemplarily showing a substrate on which a plurality of display panels are delineated.

[0064] Referring to Figure 5 and Figure 6 , in step (S10), the substrate MS can be provided. The substrate MS can have a quadrilateral shape when viewed in a plan. A plurality of display panels DP can be delineated on the substrate MS. Specifically, each of the display panels DP can have a long side extending in a first direction DR1 and a short side extending in a second direction DR2. The display panels DP can be arranged in the first direction DR1 and the second direction DR2. The display panels DP can be spaced apart in the first direction DR1 or the second direction DR2.

[0065] In Figure 6 , 20 display panels DP are shown as being delineated on the substrate MS, but this is exemplarily shown. In principle, a larger number of display panels DP can be delineated on the substrate MS.

[0066] The substrate MS can have the same cross-sectional structure as the display panel DP. For example, the substrate MS can include a unit substrate SUB, a circuit element layer CL, a display element layer OL, and a thin film encapsulation layer TFE (refer to Figure 4 ).

[0067] A panel mark PM can be defined in each of the display panels DP. In the present embodiment, the panel mark PM can be provided as a plurality in each of the display panels DP. For example, the plurality of panel marks PM can each be defined in an edge region of the display panel DP. The panel mark PM can be utilized in the process of aligning the display panel DP and the cutting device CD, which will be described later.

[0068] Figure 7 is a view exemplarily showing a cutting device utilized in the method of manufacturing the display device according to the present embodiment.

[0069] Referring to Figure 7The cutting apparatus CD can include a stage ST and a processing module MM. The stage ST can support the substrate MS during a cutting process performed by the cutting apparatus CD.

[0070] The processing module MM can be disposed adjacent to the stage ST. For example, the stage ST can be spaced apart from the processing module MM in a third direction DR3. The processing module MM can cut an object disposed on the stage ST. For example, the processing module MM can irradiate laser light to the object to cut the object. To this end, the processing module MM can include a laser generator that generates laser light, a scanner that determines an irradiation point of the laser light, a lens that diffuses / focuses the laser light, etc. However, a method by which the processing module MM processes the object is not limited to the laser irradiation method.

[0071] Figure 8 is a view that exemplarily shows a stage model indicated in the processing module of the cutting apparatus shown in Figure 7

[0072] Referring to Figure 8 A first processing area MAE1 can be defined in the processing module MM. The first processing area MAE1 can be a virtual area. The processing module MM can process an object disposed in the first processing area MAE1.

[0073] The first processing area MAE1 can have a quadrilateral shape when viewed in a plan view. The shape of the first processing area MAE1 can be substantially similar to the shape of the display panel DP shown in Figure 6

[0074] The first processing area MAE1 can include processing marks M1, M2, M3, M4 and a first processing line ML1. The processing marks M1 to M4, as virtual marks, can be used to align the processing module MM and an object (e.g., a display panel) disposed on the stage ST. The first processing line ML1 can be a virtual line in which the processing module MM irradiates laser light.

[0075] In the present embodiment, the processing marks M1, M2, M3, M4 can be provided in plural. For example, a first processing mark M1, a second processing mark M2, a third processing mark M3, and a fourth processing mark M4 can be defined in the first processing area MAE1.

[0076] The first to fourth processing marks M1 to M4 can each be defined in an edge region of the first processing area MAE1. Specifically, the first processing mark M1 can be defined in the vicinity of a first edge point EG1 of the first processing area MAE1. For example, the first processing mark M1 can be defined in the vicinity of a first edge point EG1 of the first processing area MAE1. For example, the second processing mark M2 can be defined in the vicinity of a second edge point EG2 of the first processing area MAE1. For example, the third processing mark M3 can be defined in the vicinity of a third edge point EG3 of the first processing area MAE1. For example, the fourth processing mark M4 can be defined in the vicinity of a fourth edge point EG4 of the first processing area MAE1. Figure 8 ​​For reference, the first edge point EG1 means a vertex located on the upper end of the right side of the first processing region MAE1. The first processing mark M1 can have a character shape.

[0077] The second processing mark M2 can be defined near the second edge point EG2 of the first processing region MAE1. For reference, the second edge point EG2 means a vertex located on the lower end of the right side of the first processing region MAE1. The second processing mark M2 can have a Figure 8 character shape rotated 90° in a clockwise direction.

[0078] The third processing mark M3 can be defined near the third edge point EG3 of the first processing region MAE1. For reference, the third edge point EG3 means a vertex located on the lower end of the left side of the first processing region MAE1. The third processing mark M3 can have a Figure 8 character shape rotated 180° in a clockwise direction.

[0079] The fourth processing mark M4 can be defined near the fourth edge point EG4 of the first processing region MAE1. For reference, the fourth edge point EG4 means a vertex located on the upper end of the left side of the first processing region MAE1. The fourth processing mark M4 can have a Figure 8 character shape rotated 90° in a counterclockwise direction.

[0080] However, the shapes of the first to fourth processing marks M1 to M4 are not limited to the foregoing. The shapes of the first to fourth processing marks M1 to M4 can be variously changed. In addition, the positions at which the first to fourth processing marks M1 to M4 are defined can be changed. For example, a processing mark can also be defined in a central region of the first processing region MAE1.

[0081] The first processing line ML1 can be defined outside the first to fourth processing marks M1 to M4. The first processing line ML1 can be defined by a line connecting the first to fourth edge points EG1, EG2, EG3, and EG4 to each other. For example, the first processing line ML1 can include a first portion PPl, a second portion PP2, a third portion PP3, and a fourth portion PP4. For example, the first portion PPl can be a line segment connecting the first edge point EG1 and the second edge point EG2. The second portion PP2 can be a line segment connecting the second edge point EG2 and the third edge point EG3. The third portion PP3 can be a line segment connecting the third edge point EG3 and the fourth edge point EG4. The fourth portion PP4 can be a line segment connecting the fourth edge point EG4 and the first edge point EG1.

[0082] The first processing line ML1 can define the direction of irradiation of laser light. For example, as shown in FIG. 2, the first processing line ML1 can define the direction of irradiation of laser light in a direction in which the first edge point EG1 is located on the left side of the second edge point EG2.​​​Figure 8 As shown, the laser irradiation direction can be defined as a clockwise direction by the first machining line ML1. However, the laser irradiation direction is not limited to this, and can also be defined as a counterclockwise direction.

[0083] The distance between the machining mark M1 to M4 and the first machining line ML1 adjacent to the machining mark M1 to M4 can be smaller than the distance between the adjacent machining marks M1 to M4.

[0084] For example, the first distance d1 means the distance between the first machining mark M1 and the fourth portion PP4 of the first machining line ML1 with the first direction DR1 as a reference. The second distance d2 means the distance between the first machining mark M1 and the first portion PP1 of the first machining line ML1 with the second direction DR2 as a reference.

[0085] The third distance d3 means the distance between the first machining mark M1 and the fourth machining mark M4 with the second direction DR2 as a reference. The first distance d1 and the second distance d2 are smaller than the third distance d3 to a negligible extent. For example, when the third distance d3 is several tens of mm, the first distance d1 and the second distance d2 are several μm.

[0086] Figure 9 is an exemplary diagram illustrating a substrate configuration shown in Figure 6 is a diagram of a pattern of a substrate configuration shown in Figure 7 is a diagram of a pattern of a substrate configuration shown in

[0087] Referring to Figure 5 and Figure 9 In step (S20), the machining module MM can be configured on the display panel DP. Specifically, the substrate MS can be configured on the worktable ST. The machining module MM can be configured on any one of the display panels DP demarcated on the substrate MS. The machining module MM can machine the display panel DP configured on the substrate MS.

[0088] Figure 10 and Figure 11 is a diagram for explaining the deformation of the display panel due to thermal expansion. Specifically, Figure 10 is an exemplary diagram illustrating a display panel DP_S according to a comparative example, which can be defined as a display panel before a heat treatment process is performed. That is, Figure 10 The display panel DP_S shown in

[0089] Figure 11 is an exemplary diagram illustrating a display panel according to an embodiment of the present application, which can be defined as a display panel after a heat treatment process is performed. That is, Figure 11The display panel DP shown in FIG. 1A can have a shape of a display panel deformed due to thermal expansion. For ease of explanation, the display panel DP shown in FIG. 1A is shown as having a rectangular shape. Figure 11 The display panel DP shown in FIG. 1A can have a shape of a display panel deformed due to thermal expansion. For ease of explanation, the display panel DP shown in FIG. 1A is shown as having a rectangular shape. Figure 9 The first machining area MA E1 of the machining module MM shown in FIG. 1A overlaps the display panel DP.

[0090] Referring to FIG. 1A, Figure 9 and Figure 10 The display panel DP_S according to the comparative example can include a display area DA_S and a non-display area NDA_S. The first to fourth edge points ED1_S to ED4_S mean four vertices of the display panel DP_S.

[0091] It can be that a first panel mark PM1_S is defined in the vicinity of the first edge point ED1_S, a second panel mark PM2_S is defined in the vicinity of the second edge point ED2_S, a third panel mark PM3_S is defined in the vicinity of the third edge point ED3_S, and a fourth panel mark PM4_S is defined in the vicinity of the fourth edge point ED4_S. The first to fourth panel marks PM1_S to PM4_S can be defined in the non-display area NDA_S.

[0092] The first to fourth panel marks PM1_S to PM4_S can correspond to Figure 9 the first to fourth machining marks M1 to M4 shown in FIG. 1A.

[0093] When each of the first to fourth panel marks PM1_S to PM4_S and the corresponding machining marks M1 to M4 are accurately aligned with each other when viewed in a planar view, the first machining line ML1 and an outline OUL_S of the display panel DP_S can overlap each other. The outline OUL_S can define a bezel of the display panel DP_S. When the machining module MM irradiates laser light along the first machining line ML1, the machining module MM can cut the display panel DP_S along the first machining line ML1.

[0094] However, the shape of an actual display panel can be different from the display panel DP_S. For example, a process of heat-treating the substrate MS can be performed before the step (S10) is performed. During the heat treatment, local thermal expansion can occur in the substrate MS. For example, the display panel DP delineated in the substrate MS can have shapes different from each other.

[0095] Therefore, in order for the display panel DP to be accurately separated from the substrate MS without damage, it is necessary to perform a cutting process that takes into account the respective shapes of the display panel DP deformed due to thermal expansion.

[0096] Referring to FIG. 1A, Figure 11The deformation at each point of the display panel DP may differ from one another. For example, the deformation of the display panel DP near the first edge point EG1 to the fourth edge point EG4 may be different.

[0097] Therefore, misalignment occurs between the first to fourth panel markings PM1 to PM4 and the first to fourth processing markings M1 to M4 of the display panel DP. Consequently, misalignment may also occur between the first processing line ML1 and the outline line OUL of the display panel DP.

[0098] Suppose that the machining module MM cuts along the first machining line ML1. Figure 11 The display panel DP shown may have defects (e.g., cracks).

[0099] To address this issue, a method for manufacturing a display device according to an embodiment of the present invention proposes a scheme for defining a new processing area that takes into account the deformation of the display panel DP.

[0100] Figures 12A-12D It is used to illustrate calculations Figure 11 A diagram illustrating the method for determining the offset between machining marks and panel marks is shown. Figures 12A-12D In this context, the horizontal axis can be defined as the X-axis, and the vertical axis as the Y-axis. The X-axis and Y-axis can be parallel to the second direction DR2 and the first direction DR1, respectively. Figures 12A-12D In this diagram, the position of each point can be represented by (X, Y, Z). Z can refer to the degree of tilt relative to the X-axis.

[0101] Reference Figure 5 as well as Figures 12A-12D In step (S30), the offset between panel markings PM1 to PM4 and processing markings M1 to M4 can be calculated.

[0102] In this embodiment, the step of calculating the offset (S30) may include: calculating the first offset between the processing marks M1 to M4 and the panel marks PM1 to PM4; and calculating the second offset between the processing marks M1 to M4 and the panel marks PM1 to PM4.

[0103] The first offset can be defined as the displacement between the first point M1_C to M4_C in the processing marks M1 to M4 and the second point PM1_C to PM4_C in the panel marks PM1 to PM4.

[0104] In the step of calculating the first offset, the positions of the first point M1_C to M4_C in the processing marks M1 to M4 and the second point PM1_C to PM4_C of the panel marks PM1 to PM4 corresponding to the first point M1_C to M4_C can be defined, and the displacement between the first point M1_C to M4_C and the second point PM1_C to PM4_C can be calculated.

[0105] The second offset refers to the degree to which panel markings PM1 to PM4 are tilted relative to machining markings M1 to M4. In calculating the second offset, the angle formed by machining markings M1 to M4 and panel markings PM1 to PM4 can be calculated.

[0106] Reference Figure 12A The first machining mark M1 may include a first horizontal portion M1_H and a first vertical portion M1_V. The first horizontal portion M1_H may extend parallel to the X-axis direction. The first vertical portion M1_V may extend from the first horizontal portion M1_H and be parallel to the Y-axis direction. Figures 12B-12D The second to fourth processing marks M2 to M4 shown may each include a first horizontal portion and a first vertical portion.

[0107] The first site M1_C can be defined as the center of the first processing mark M1. At the first site M1_C, the first horizontal portion M1_H and the first vertical portion M1_V can intersect.

[0108] The first panel mark PM1 of the display panel DP may correspond to the first processing mark M1. The first panel mark PM1 may include a second horizontal part PM1_H and a second vertical part PM1_V. Figures 12B-12D The second to fourth panel markings PM2 to PM4 shown may each include a second horizontal portion and a second vertical portion. The second site PM1_C may be the point corresponding to the first site M1_C of the first processing marking M1.

[0109] like Figure 12A As shown, when the coordinates of the first point M1_C of the first processing mark M1 are set to (0, 0, 0), the coordinates of the second point PM1_C of the first panel mark PM1 can be defined as (A1, B1, C1). Specifically, the second point PM1_C can be separated from the first point M1_C by A1 along the X-axis and by B1 along the Y-axis.

[0110] The first panel mark PM1 may be tilted C1 relative to the first machining mark M1. More specifically, the second horizontal portion PM1_H of the first panel mark PM1 may be tilted C1 relative to the first horizontal portion M1_H of the first machining mark M1.

[0111] like Figure 12BAs shown, when the coordinates of the first site M2_C of the second machining mark M2 are set as (0, 0, 0), the coordinates of the second site PM2_C of the second panel mark PM2 can be defined as (A2, B2, C2). Specifically, the second site PM2_C can be spaced apart from the first site M2_C by A2 toward the X axis and by B2 toward the Y axis. The second panel mark PM2 can be tilted by C2 with respect to the second machining mark M2.

[0112] As shown, when the coordinates of the first site M2_C of the second machining mark M2 are set as (0, 0, 0), the coordinates of the second site PM2_C of the second panel mark PM2 can be defined as (A2, B2, C2). Specifically, the second site PM2_C can be spaced apart from the first site M2_C by A2 toward the X axis and by B2 toward the Y axis. The second panel mark PM2 can be tilted by C2 with respect to the second machining mark M2. Figure 12C As shown, when the coordinates of the first site M3_C of the third machining mark M3 are set as (0, 0, 0), the coordinates of the second site PM3_C of the third panel mark PM3 can be defined as (A3, B3, C3). Specifically, the second site PM3_C can be spaced apart from the first site M3_C by A3 toward the X axis and by B3 toward the Y axis. The third panel mark PM3 can be tilted by C3 with respect to the third machining mark M3.

[0113] Figure 12D As shown, when the coordinates of the first site M4_C of the fourth machining mark M4 are set as (0, 0, 0), the coordinates of the second site PM4_C of the fourth panel mark PM4 can be defined as (A4, B4, C4). Specifically, the second site PM4_C can be spaced apart from the first site M4_C by A4 toward the X axis and by B4 toward the Y axis. The fourth panel mark PM4 can be tilted by C4 with respect to the fourth machining mark M4.

[0114] Figure 13 is a diagram showing a second machining line in which the calculated offset is reflected in the first machining line shown in Figure 11

[0115] Referring to Figure 5 , Figures 12A-12D and Figure 13 , in step (S40), the machining line of the machining module MM can be corrected. For example, the second machining area MAE2 can be redefined in the machining module MM. The second machining area MAE2 can include the second machining line ML2.

[0116] The first to fourth edge points EG1' to EG4' of the second machining line ML2 can be moved by reflecting the first offset calculated in step (S30). Thereby, the first to fourth portions PP1' to PP4' of the second machining line ML2 can also be corrected.

[0117] Specifically, the first portion PP1' of the second machining line ML2 can be a value obtained by multiplying K1 by the first portion PP1 of the first machining line ML1. K1 can satisfy the following mathematical formula 1.

[0118] ​​The second portion PP2' of the second machining line ML2 can be a value multiplied by K2 to the second portion PP2 of the first machining line ML1. K2 can satisfy the following mathematical formula 2. The third portion PP3' of the second machining line ML2 can be a value multiplied by K3 to the third portion PP3 of the first machining line ML1. K3 can satisfy the following mathematical formula 3. The fourth portion PP4' of the second machining line ML2 can be a value multiplied by K4 to the fourth portion PP4 of the first machining line ML1. K4 can satisfy the following mathematical formula 4.

[0119] [mathematical formula 1]

[0120] K1 = 2 - (absolute value of displacement between first machining mark and second machining mark) / (absolute value of displacement between first panel mark and second panel mark)

[0121] [mathematical formula 2]

[0122] K2 = 2 - (absolute value of displacement between second machining mark and third machining mark) / (absolute value of displacement between second panel mark and third panel mark)

[0123] [mathematical formula 3]

[0124] K3 = 2 - (absolute value of displacement between third machining mark and fourth machining mark) / (absolute value of displacement between third panel mark and fourth panel mark)

[0125] [mathematical formula 4]

[0126] K4 = 2 - (absolute value of displacement between fourth machining mark and first machining mark) / (absolute value of displacement between fourth panel mark and first panel mark)

[0127] In addition, the second machining line ML2 near the first to fourth edge points EG1' to EG4' can be rotated by a predetermined angle by reflecting the second offset amount calculated in step (S30).

[0128] Finally, when viewed on a plane, the second machining line ML2 reflecting the first offset amount and the second offset amount in the first machining line ML1 can be overlapped with the outline OUL of the display panel DP.

[0129] In step (S50), the machining module MM can machine the bezel of the display panel DP along the corrected machining line. Specifically, the machining module MM can cut the display panel DP by irradiating laser light along the second machining line ML2.

[0130] Figure 14 is Figure 13 a cross-sectional view of the I-I' line shown in FIG.

[0131] Referring toFigure 14 The display panel DP can include one or more dams DM1, DM2. The dams DM1, DM2 can block the outflow of the organic material of the thin film encapsulation layer TFE to the outside of the display device DD when the display device DD is manufactured. The organic material before hardening can have fluidity.

[0132] The thin film encapsulation layer TFE can include a first encapsulation layer EN1, a second encapsulation layer EN2, and a third encapsulation layer EN3. The first encapsulation layer EN1 and the third encapsulation layer EN3 can include inorganic materials. The second encapsulation layer EN2 can include an organic material. The second encapsulation layer EN2 can be disposed between the first encapsulation layer EN1 and the third encapsulation layer EN3.

[0133] Specifically, in the present embodiment, the dams DM1, DM2 can include a first dam DM1 and a second dam DM2. The first dam DM1 and the second dam DM2 can be disposed on the circuit element layer CL. The first dam DM1 and the second dam DM2 can overlap the non-display area NDA. The second dam DM2 can be disposed to be more spaced apart from the display area DA than the first dam DM1. However, the number of the dams DM1, DM2 is not limited thereto.

[0134] When viewed in cross-section, the second encapsulation layer EN2 can extend from the display area DA only to the side surface of the first dam DM1. The first encapsulation layer EN1 and the third encapsulation layer EN3 can extend from the display area DA to the non-display area NDA. The first encapsulation layer EN1 and the third encapsulation layer EN3 can be disposed on the first dam DM1 and the second dam DM2.

[0135] When the display device DD is manufactured, it can be that the first dam DM1 blocks the outflow of the organic material of the second encapsulation layer EN2, and the second dam DM2 further blocks the organic material overflowing the first dam DM1.

[0136] It is preferable that the second processing line ML2, at which the display panel DP is cut, is defined at an outer side than the second dam DM2. If the second processing line ML2 is defined at an inner side of the first dam DM1 or between the first dam DM1 and the second dam DM2, a defect (e.g., a crack) can occur in the display panel DP that is cut.

[0137] However, the method of manufacturing a display device according to an embodiment of the present application considers the amount of deformation of the display panel DP at the vicinity of the plurality of edges, corrects the second processing line ML2 to be defined at an outer side than the second dam DM2 disposed at the outermost periphery of the display panel DP, and cuts the display panel DP along the corrected second processing line ML2, and thus can prevent the display panel DP from being damaged during the cutting process.

[0138] In particular, the second correction machining line ML2 reflects not only the displacement at a plurality of points but also the degree of inclination, and thus can be more suitable for the shape of the actual display panel DP.

[0139] The above has been described with reference to a plurality of embodiments, but it will be understood by those skilled in the art that various modifications and changes can be made to the present application within the scope of the concept and field of the present application as recited in the claims. In addition, the embodiments disclosed in the present application are not intended to limit the technical concept of the present application, and it should be understood that all technical concepts within the scope of the claims and the equivalent scope thereof are included in the scope of the present application.

Claims

1. A method for manufacturing a display device, wherein, including: a step of providing a substrate including a display panel defined with a plurality of panel marks in a peripheral area; a step of arranging a processing module defining a plurality of processing marks corresponding to each of the panel marks and a first processing line adjacent to each of the processing marks on the display panel; a step of calculating an offset amount between the panel marks and the processing marks corresponding to each other when viewed in a plan; a step of correcting the first processing line to define a second processing line overlapping a bezel of the display panel by reflecting the calculated offset amount; and a step of processing the bezel of the display panel along the second processing line, the step of calculating the offset amount includes: a step of calculating a first offset amount defined as a displacement between a plurality of first sites defined in each of the processing marks and second sites of each of the panel marks corresponding to the first sites; and a step of calculating a second offset amount defined as an angle formed by the panel marks with respect to the corresponding processing marks.

2. The manufacturing method of a display device according to claim 1, wherein the panel marks include: a first panel mark defined in a vicinity of a first edge point of the display panel; a second panel mark defined in a vicinity of a second edge point of the display panel spaced apart from the first edge point in a first direction; a third panel mark defined in a vicinity of a third edge point of the display panel spaced apart from the second edge point in a second direction intersecting the first direction; and a fourth panel mark defined in a vicinity of a fourth edge point of the display panel spaced apart from the first edge point in the second direction and facing the third edge point in the first direction.

3. The manufacturing method of a display device according to claim 1, wherein the step of calculating the first offset amount includes: a step of calculating a displacement in an X axis from the first site to the second site; and a step of calculating a displacement in a Y axis intersecting the X axis from the first site to the second site.

4. The manufacturing method of a display device according to claim 1, wherein the processing marks include a first horizontal portion extending in a first direction, the panel marks include a second horizontal portion extending in the first direction, the step of calculating the second offset amount measures an angle formed by the second horizontal portion with respect to the first horizontal portion.

5. The manufacturing method of a display device according to claim 1, wherein the display panel includes: a unit substrate defined with a display area and a non-display area surrounding the display area; a circuit element layer arranged on the unit substrate and overlapping the display area and the non-display area; a display element layer arranged on the circuit element layer and overlapping the display area; and one or more dams arranged on the circuit element layer and overlapping the non-display area, the second processing line is spaced apart from the display area more than the dam when viewed in a plan.

6. The manufacturing method of a display device according to claim 1, wherein The area inside the first processing line is different from the area inside the second processing line when viewed in plan.

7. The method for manufacturing a display device according to claim 1, wherein The method for manufacturing a display device further includes a step of heat treating the substrate before the step of providing the substrate.

8. A method for manufacturing a display device, wherein comprises: a step of arranging a display panel having a plurality of panel marks defined at an edge region on a first processing region defined by a first axis and a second axis intersecting the first axis; a step of calculating a displacement on the first axis and a displacement on the second axis of the panel mark with respect to a corresponding processing mark among a plurality of processing marks defined in the first processing region when viewed in plan; a step of calculating an angle formed by the panel mark and the corresponding processing mark when viewed in plan; a step of defining a second processing region reflecting the displacement on the first axis, the displacement on the second axis, and the angle to correct the first processing region; and a step of processing a bezel of the display panel along a boundary of the second processing region.

9. The method for manufacturing a display device according to claim 8, wherein the panel marks include: a first panel mark defined near a first edge point of the display panel; a second panel mark defined near a second edge point of the display panel spaced apart from the first edge point in a first direction; a third panel mark defined near a third edge point of the display panel spaced apart from the second edge point in a second direction intersecting the first direction; and a fourth panel mark defined near a fourth edge point of the display panel spaced apart from the first edge point in the second direction and facing the third edge point in the first direction, the processing marks are respectively defined near a plurality of edge points of the first processing region.

10. The method for manufacturing a display device according to claim 8, wherein the display panel includes: a unit substrate having a display region and a non-display region surrounding the display region; and one or more dams arranged on the non-display region, the boundary of the second processing region is more spaced apart from the display region than the dam when viewed in plan.

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