Display device

Abstract

A display device includes a display panel, a printed circuit substrate, a first film connected with the display panel and the printed circuit substrate, and a second film connected with the display panel and the printed circuit substrate. The display panel includes a first column of panel pads connected with the first film, a second column of panel pads connected with the second film, and a plurality of panel connection wirings connecting the first column of panel pads with the second column of panel pads.

Description

Technical Field

[0001] This invention relates to display devices, and more particularly to display devices comprising multiple chip-on-film structures. Background Technology

[0002] Typically, a display device includes a display panel and a display panel driving unit. The display panel displays an image based on an input image and includes multiple gate lines, multiple data lines, and multiple pixels. The display panel driving unit includes a gate driving unit that provides gate signals to the multiple gate lines, a data driving unit that provides data voltages to the multiple data lines, and a drive control unit that controls the gate driving unit and the data driving unit.

[0003] Some components of the display panel driving unit can be directly integrated onto the display panel, can be connected to the display panel in the form of a flip-chip film, can be mounted on the display panel in the form of a chip on glass (COG), and can be disposed on a printed circuit board formed separately from the display panel and connected to the display panel through a flexible circuit board.

[0004] When some components of the display panel driving section are made of flip-chip film, defects may occur in the bonding of the film to the printed circuit board and the bonding of the film to the display panel, resulting in a decrease in the production yield of the display device. Summary of the Invention

[0005] In view of the above circumstances, the object of the present invention is to provide a display device that can effectively perform bonding inspection of flip-chip films in a display device comprising multiple flip-chip film structures.

[0006] An embodiment of the display device for achieving the above-described objectives of the present invention includes: a display panel; a printed circuit board; a first film connected to the display panel and the printed circuit board; and a second film connected to the display panel and the printed circuit board. The display panel includes: a first column of panel pads connected to the first film; a second column of panel pads connected to the second film; and a plurality of panel connection wirings connecting the first column of panel pads to the second column of panel pads.

[0007] In one embodiment of the present invention, the first film may include: a first film pad, a second film pad, a third film pad, and a fourth film pad connected to the printed circuit board; a fifth film pad, a sixth film pad, a seventh film pad, and an eighth film pad connected to the panel pads of the first column; a first film wiring connecting the first film pad and the fifth film pad; a third film wiring connecting the third film pad and the seventh film pad; a fourth film wiring connecting the fourth film pad and the eighth film pad; and a second film wiring connecting the second film pad and the third film wiring.

[0008] In one embodiment of the present invention, the second film may include a first pad, a second pad, a third pad, and a fourth pad connected to the panel pads of the second column.

[0009] In one embodiment of the present invention, the second film may further include connecting wiring that connects the first pad, the third pad, and the fourth pad.

[0010] In one embodiment of the present invention, a current may be applied to the fourth film pad, and the voltage in the first film pad and the second film pad may be measured to determine the bonding state of the first film and the second film.

[0011] In one embodiment of the present invention, the display panel may further include an alignment pattern connected to any one of the panel pads in the second column.

[0012] In one embodiment of the present invention, the second film may include: a fifth pad, a sixth pad, a seventh pad, and an eighth pad connected to the printed circuit board; a ninth pad, a tenth pad, an eleventh pad, and a twelfth pad connected to the panel pads of the second column; a first wiring connecting the fifth pad and the ninth pad; a third wiring connecting the seventh pad and the eleventh pad; a fourth wiring connecting the eighth pad and the twelfth pad; and a second wiring connecting the sixth pad and the third wiring.

[0013] In one embodiment of the present invention, the first film may include a ninth film pad, a tenth film pad, an eleventh film pad, and a twelfth film pad connected to the panel pads of the first column.

[0014] In one embodiment of the present invention, the first membrane may further include membrane connection wiring connected to the ninth membrane pad, the eleventh membrane pad, and the twelfth membrane pad.

[0015] In one embodiment of the present invention, a current may be applied to the eighth pad and the voltage is measured in the fifth and sixth pads to determine the bonding state between the first film and the second film.

[0016] In one embodiment of the present invention, the first spacing between the panel pads in the first column and the second spacing between the panel pads in the second column may be the same. The panel connection wiring connecting the panel pads in the first column and the panel pads in the second column may extend in the vertical direction.

[0017] In one embodiment of the present invention, the first interval between the panel pads of the first column may be greater than the second interval between the panel pads of the second column. At least one of the panel connection wirings connecting the panel pads of the first column and the panel pads of the second column may have an inclined portion based on the vertical direction.

[0018] In one embodiment of the present invention, the display device may further include: a first data driving unit that outputs a first data voltage to the display panel. Alternatively, the first data driving unit may be disposed on the first film.

[0019] In one embodiment of the present invention, the display device may further include: a second data driving unit that outputs a second data voltage to the display panel. Alternatively, the second data driving unit may be disposed on the second film.

[0020] In one embodiment of the present invention, the first data driving unit may output the first data voltage to the odd number of data lines of the display panel, and the second data driving unit may output the second data voltage to the even number of data lines of the display panel.

[0021] In one embodiment of the present invention, the display device may further include a driving control unit that controls the first data driving unit and the second data driving unit. The driving control unit may be disposed on the printed circuit board.

[0022] In one embodiment of the present invention, the width of the first film in the first direction in which it contacts the display panel may be greater than the width of the first film in the first direction in which it contacts the printed circuit board.

[0023] In one embodiment of the present invention, the width of the second film in the first direction in which it contacts the display panel may be greater than the width of the second film in the first direction in which it contacts the printed circuit board.

[0024] An embodiment of the display device for achieving the above-described objectives of the present invention includes: a display panel; a printed circuit board; a first film connected to the display panel and the printed circuit board; and a second film connected to the display panel and the printed circuit board. The display panel may include: a first column of panel pads connected to the first film; a second column of panel pads connected to the second film; and a total panel pad connected to both the first film and the second film.

[0025] (Invention Effects)

[0026] According to the display device described above, bonding inspection of the flip-chip film can be effectively performed in a display device comprising multiple flip-chip film structures.

[0027] Furthermore, the display device includes an inspection unit that simultaneously inspects the bonding state of the first film and the second film, thereby preventing a reduction in the bonding spacing of the printed circuit board and preventing a decrease in production volume caused by a reduction in the bonding spacing of the printed circuit board. Attached Figure Description

[0028] Figure 1 This is a block diagram illustrating a display device according to an embodiment of the present invention.

[0029] Figure 2 It means Figure 1 A schematic diagram of the display device.

[0030] Figure 3a It means Figure 2 A schematic diagram of the configuration of the display panel, printed circuit board, and first film.

[0031] Figure 3b It means Figure 2 A schematic diagram of the configuration of the display panel, printed circuit board, and second film.

[0032] Figure 4 It means Figure 1 A schematic diagram of the first inspection section of the display device.

[0033] Figure 5 It means Figure 4 The circuit diagram of the first inspection section.

[0034] Figure 6 It means Figure 4 A schematic diagram of the configuration of the display panel included in the first inspection section.

[0035] Figure 7 It means Figure 1 A schematic diagram of the second inspection section of the display device.

[0036] Figure 8It means Figure 7 The circuit diagram of the second inspection section.

[0037] Figure 9 It means Figure 7 A schematic diagram of the configuration of the display panel included in the second inspection section.

[0038] Figure 10 This is a schematic diagram illustrating the configuration of the display panel included in the first inspection section of a display device according to an embodiment of the present invention.

[0039] Figure 11 This is a schematic diagram illustrating the configuration of the display panel included in the first inspection section of a display device according to an embodiment of the present invention.

[0040] Figure 12 This is a schematic diagram illustrating the first inspection section of a display device according to an embodiment of the present invention.

[0041] Figure 13 It means Figure 12 A schematic diagram of the configuration of the display panel included in the first inspection section.

[0042] (Symbol Explanation)

[0043] 100, 100A: Display panel; 200: Drive control unit; 300: Gate drive unit; 400: Gamma reference voltage generation unit; 500: Data drive unit. Detailed Implementation

[0044] The present invention will now be described in more detail with reference to the accompanying drawings.

[0045] Figure 1 This is a block diagram illustrating a display device according to an embodiment of the present invention.

[0046] Reference Figure 1 The display device includes a display panel 100 and a display panel driving unit. The display panel driving unit includes a driving control unit 200, a gate driving unit 300, a gamma reference voltage generating unit 400, and a data driving unit 500.

[0047] For example, the drive control unit 200 and the data drive unit 500 can be integrated into one unit. For example, the drive control unit 200, the gamma reference voltage generation unit 400, and the data drive unit 500 can be integrated into one unit. At least the drive module in which the drive control unit 200 and the data drive unit 500 are integrated can be named a Timing Controller Embedded Data Driver (TED).

[0048] The display panel 100 includes a display section AA for displaying images and a peripheral section PA disposed adjacent to the display section AA.

[0049] The display panel 100 includes a plurality of gate lines GL, a plurality of data lines DL, and a plurality of pixels P electrically connected to the gate lines GL and the data lines DL, respectively. The gate lines GL extend in a first direction D1, and the data lines DL extend in a second direction D2 that intersects the first direction D1.

[0050] The drive control unit 200 receives input image data IMG and input control signal CONT from an external device (not shown). For example, the input image data IMG may include red image data, green image data, and blue image data. The input image data IMG may also include white image data. The input image data IMG may also include magenta image data, yellow image data, and cyan image data. The input control signal CONT may include a master clock signal, a data strobe signal, etc. The input control signal CONT may also include a vertical synchronization signal and a horizontal synchronization signal.

[0051] The drive control unit 200 generates a first control signal CONT1, a second control signal CONT2, a third control signal CONT3, and a data signal DATA based on the input image data IMG and the input control signal CONT.

[0052] The drive control unit 200 generates a first control signal CONT1 based on the input control signal CONT for controlling the operation of the gate drive unit 300, and outputs it to the gate drive unit 300. The first control signal CONT1 may include a vertical start signal and a gate clock signal.

[0053] The drive control unit 200 generates a second control signal CONT2 based on the input control signal CONT for controlling the operation of the data drive unit 500, and outputs it to the data drive unit 500. The second control signal CONT2 may include a horizontal start signal and a load signal.

[0054] The drive control unit 200 generates a data signal DATA based on the input image data IMG. The drive control unit 200 outputs the data signal DATA to the data drive unit 500.

[0055] The drive control unit 200 generates a third control signal CONT3 based on the input control signal CONT for controlling the operation of the gamma reference voltage generation unit 400 and outputs it to the gamma reference voltage generation unit 400.

[0056] The gate driving unit 300 generates a gate signal for driving the gate line GL in response to the first control signal CONT1 input from the driving control unit 200. The gate driving unit 300 outputs the gate signal to the gate line GL. For example, the gate driving unit 300 may output the gate signal to the gate line GL sequentially.

[0057] In one embodiment of the present invention, the gate driving portion 300 may be integrated on the peripheral portion PA of the display panel 100.

[0058] The gamma reference voltage generation unit 400 generates a gamma reference voltage VGREF in response to the third control signal CONT3 input from the drive control unit 200. The gamma reference voltage generation unit 400 provides the gamma reference voltage VGREF to the data drive unit 500. The gamma reference voltage VGREF has a value corresponding to each data signal DATA.

[0059] In one embodiment of the present invention, the gamma reference voltage generation unit 400 may be configured within the drive control unit 200 or the data drive unit 500.

[0060] The data driving unit 500 receives the second control signal CONT2 and the data signal DATA from the driving control unit 200, and receives the gamma reference voltage VGREF from the gamma reference voltage generation unit 400. The data driving unit 500 uses the gamma reference voltage VGREF to convert the data signal DATA into an analog data voltage. The data driving unit 500 outputs the data voltage to the data line DL.

[0061] Figure 2 It means Figure 1 A schematic diagram of the display device. Figure 3a It means Figure 2 A schematic diagram of the configuration of the display panel 100, the printed circuit board (PCB), and the first film COF1. Figure 3b It means Figure 2 A schematic diagram of the configuration of the display panel 100, the printed circuit board (PCB), and the second film COF2.

[0062] Reference Figure 1 to Figure 3b The display device may include the display panel 100, the printed circuit board (PCB), the first film COF1, and the second film COF2.

[0063] The first film COF1 can be connected to the display panel 100 and the printed circuit board PCB. The second film COF2 can be connected to the display panel 100 and the printed circuit board PCB. The first film COF1 and the second film COF2 can partially overlap.

[0064] For example, the first film COF1 can be connected to the first side of the display panel 100. The second film COF2 can also be connected to the first side of the display panel 100.

[0065] The first film COF1 can be connected to the panel pads of the first column of the display panel 100. The second film COF2 can be connected to the panel pads of the second column of the display panel 100. For example, the panel pads of the first column of the display panel 100 can be formed on the outer side of the display panel 100, compared to the panel pads of the second column of the display panel 100.

[0066] exist Figure 2 The diagram shows the shape of the first film COF1 and the second film COF2 overlapping and connected to the display panel 100. Figure 3a For ease of understanding, only the printed circuit board (PCB), the first film (COF1), and the display panel 100 are shown in the diagram. Figure 3b For ease of understanding, only the printed circuit board (PCB), the second film (COF2), and the display panel 100 are shown in the diagram.

[0067] The data driving unit 500 may include a first data driving unit that outputs a first data voltage to the display panel 100 and a second data driving unit that outputs a second data voltage to the display panel 100.

[0068] For example, the first data driving unit may be disposed on the first membrane COF1. Furthermore, the second data driving unit may be disposed on the second membrane COF2.

[0069] For example, the first data driving unit disposed on the first film COF1 can output the first data voltage to an odd number of data lines of the display panel 100. For example, the second data driving unit disposed on the second film COF2 can output the second data voltage to an even number of data lines of the display panel 100.

[0070] In one embodiment of the present invention, the drive control unit 200 that controls the first data drive unit and the second data drive unit may be disposed on the printed circuit board PCB.

[0071] like Figure 3aAs shown, the width of the first film COF1 in the first direction D1 that contacts the display panel 100 can be greater than the width of the first film COF1 in the first direction D1 that contacts the printed circuit board PCB.

[0072] like Figure 3b As shown, the width of the second film COF2 in the first direction D1 that contacts the display panel 100 can be greater than the width of the second film COF2 in the first direction D1 that contacts the printed circuit board PCB.

[0073] Figure 4 It means Figure 1 A schematic diagram of the first inspection section of the display device. Figure 5 It means Figure 4 The circuit diagram of the first inspection section. Figure 6 It means Figure 4 A schematic diagram of the configuration of the display panel 100 included in the first inspection section.

[0074] Reference Figure 1 to Figure 6 The first inspection section can be formed in Figure 2 Regions A to C.

[0075] The first film COF1 may include a first film pad P11, a second film pad P12, a third film pad P13, and a fourth film pad P14 connected to the printed circuit board PCB.

[0076] The first COF1 film may include a fifth film pad P15, a sixth film pad P16, a seventh film pad P17, and an eighth film pad P18 connected to the panel pads of the first column of the display panel 100. For example, the fifth film pad P15, the sixth film pad P16, the seventh film pad P17, and the eighth film pad P18 may be connected to the first panel pad PD11, the second panel pad PD12, the third panel pad PD13, and the fourth panel pad PD14 of the display panel 100, respectively.

[0077] The first film COF1 may include a first film wiring PL1 connecting the first film pad P11 and the fifth film pad P15, a third film wiring PL3 connecting the third film pad P13 and the seventh film pad P17, a fourth film wiring PL4 connecting the fourth film pad P14 and the eighth film pad P18, and a second film wiring PL2 connecting the second film pad P12 and the third film wiring PL3.

[0078] The second film COF2 may include a first pad P21, a second pad P22, a third pad P23, and a fourth pad P24 connected to the panel pads of the second column. For example, the first pad P21, the second pad P22, the third pad P23, and the fourth pad P24 may be connected to the fifth panel pad PD21, the sixth panel pad PD22, the seventh panel pad PD23, and the eighth panel pad PD24 of the display panel 100, respectively.

[0079] The second film COF2 may also include connection wiring CL connecting the first pad P21, the third pad P23 and the fourth pad P24.

[0080] The panel pads PD11, PD12, PD13, PD14 in the first column and the panel pads PD21, PD22, PD23, PD24 in the second column can be interconnected via multiple panel connection wirings PP1, PP2, PP3, PP4. For example, the first panel connection wiring PP1 can connect the first panel pad PD11 and the fifth panel pad PD21. For example, the second panel connection wiring PP2 can connect the second panel pad PD12 and the sixth panel pad PD22. For example, the third panel connection wiring PP3 can connect the third panel pad PD13 and the seventh panel pad PD23. For example, the fourth panel connection wiring PP4 can connect the fourth panel pad PD14 and the eighth panel pad PD24.

[0081] In this embodiment, the first interval between the panel pads PD11, PD12, PD13, and PD14 in the first column can be the same as the second interval between the panel pads PD21, PD22, PD23, and PD24 in the second column.

[0082] Furthermore, the panel connection wiring PP1, PP2, PP3, PP4 connecting the panel pads PD11, PD12, PD13, PD14 of the first column with the panel pads PD21, PD22, PD23, PD24 of the second column can extend in the vertical direction.

[0083] Figure 4 The first film pad P11 to the eighth film pad P18 of the first film COF1, the first film wiring PL1 to the fourth film wiring PL4 of the first film COF1, the first pad P21 to the fourth pad P24 of the second film COF2, and the connection wiring CL of the second film COF2. Figure 6The first panel pad PD11 to the eighth panel pad PD24 of the display panel 100 and the panel connection wiring PP1, PP2, PP3, and PP4 of the display panel 100 can constitute Figure 5 The inspection circuit.

[0084] A current can be applied to the fourth film pad P14, and the voltage can be measured in the first film pad P11 and the second film pad P12 to determine the bonding state of the first film COF1 and the second film COF2. The bonding state of the first film COF1 and the second film COF2 can be expressed as the following mathematical formula 1.

[0085] [Mathematical Expression 1]

[0086]

[0087] Here, RB2 is the contact resistance, VP11 is the voltage of the first film pad P11, VP12 is the voltage of the second film pad P12, and I is the test current applied to the fourth film pad P14. RB1 can be the wiring resistance between the first film pad P11 and the fourth film pad P14.

[0088] If the contact resistance RB2 exceeds the reference value, it can be determined that the bonding state of the first film COF1 and the second film COF2 is poor. If the contact resistance RB2 is below the reference value, it can be determined that the bonding state of the first film COF1 and the second film COF2 is normal.

[0089] Figure 7 It means Figure 1 A schematic diagram of the second inspection section of the display device. Figure 8 It means Figure 7 The circuit diagram of the second inspection section. Figure 9 yes Figure 7 A schematic diagram of the configuration of the display panel included in the second inspection section.

[0090] Reference Figure 1 to Figure 9 The second inspection section can be formed in Figure 2 Regions B to D.

[0091] The second film COF2 may include a fifth pad PX11, a sixth pad PX12, a seventh pad PX13, and an eighth pad PX14 that are connected to the printed circuit board PCB.

[0092] The second film COF2 may include a ninth pad PX15, a tenth pad PX16, an eleventh pad PX17, and a twelfth pad PX18 connected to the panel pads of the second column of the display panel 100. For example, the ninth pad PX15, the tenth pad PX16, the eleventh pad PX17, and the twelfth pad PX18 may be connected to the thirteenth panel pad PDX21, the fourteenth panel pad PDX22, the fifteenth panel pad PDX23, and the sixteenth panel pad PDX24 of the display panel 100, respectively.

[0093] The second film COF2 may include a first wiring PXL1 connecting the fifth pad PX11 and the ninth pad PX15, a third wiring PXL3 connecting the seventh pad PX13 and the eleventh pad PX17, a fourth wiring PXL4 connecting the eighth pad PX14 and the twelfth pad PX18, and a second wiring PXL2 connecting the sixth pad PX12 and the third wiring PXL3.

[0094] The first film COF1 may include a ninth film pad PX21, a tenth film pad PX22, an eleventh film pad PX23, and a twelfth film pad PX24 connected to the panel pads of the first column.

[0095] The first membrane COF1 may also include membrane connection wiring CLX connecting the ninth membrane pad PX21, the eleventh membrane pad PX23 and the twelfth membrane pad PX24.

[0096] The panel pads PDX11, PDX12, PDX13, PDX14 in the first column and the panel pads PDX21, PDX22, PDX23, PDX24 in the second column can be connected to each other through multiple panel connection wiring PPX1, PPX2, PPX3, PPX4.

[0097] Figure 7 The pads PX11, PX12, PX13, PX14, PX15, PX16, PX17, PX18 of the second film COF2; the first wiring PXL1 to the fourth wiring PXL4 of the second film COF2; the ninth film pads PX21 to the twelfth film pads PX24 of the first film COF1; and the film connection wiring CLX of the first film COF1. Figure 9 The ninth panel pad PDX11 to the sixteenth panel pad PDX24 of the display panel 100 and the panel connection wiring PPX1, PPX2, PPX3, and PPX4 of the display panel 100 can constitute Figure 8 The inspection circuit.

[0098] A current can be applied to the eighth pad PX14, and the voltage can be measured in the fifth pad PX11 and the sixth pad PX12 to determine the bonding state of the first film COF1 and the second film COF2.

[0099] exist Figure 8 In this context, RBX2 can be the contact resistance, VPX11 is the voltage of the fifth pad PX11, VPX12 is the voltage of the sixth pad PX12, and RBX1 is the wiring resistance between the fifth pad PX11 and the eighth pad PX14.

[0100] If the contact resistance RBX2 exceeds the reference value, it can be determined that the bonding state of the first film COF1 and the second film COF2 is poor. If the contact resistance RBX2 is below the reference value, it can be determined that the bonding state of the first film COF1 and the second film COF2 is normal.

[0101] According to this embodiment, in a display device including multiple flip-chip thin film structures (i.e., COF1, COF2), bonding inspection of the flip-chip thin films (i.e., COF1, COF2) can be effectively performed.

[0102] Furthermore, the display device includes an inspection unit that simultaneously checks the bonding state of the first film COF1 and the second film COF2, thereby preventing a reduction in the bonding spacing of the printed circuit board (PCB) and preventing a decrease in production caused by a reduction in the bonding spacing of the PCB.

[0103] Figure 10 This is a schematic diagram illustrating the configuration of the display panel included in the first inspection section of a display device according to an embodiment of the present invention.

[0104] In this embodiment, the display device, in addition to the panel pads of the display panel, also includes... Figure 1 to Figure 9 The display devices are essentially the same, therefore the same symbols are used for the same or similar components, and repeated descriptions are omitted.

[0105] Reference Figure 1 to Figure 3b as well as Figure 10 The display device may include the display panel 100, the printed circuit board (PCB), the first film COF1, and the second film COF2.

[0106] The first film COF1 can be connected to the display panel 100 and the printed circuit board PCB. The second film COF2 can be connected to the display panel 100 and the printed circuit board PCB. The first film COF1 and the second film COF2 can partially overlap.

[0107] In this embodiment, the first interval PT1 between the panel pads PD11, PD12, PD13, and PD14 in the first column may be different from the second interval PT2 between the panel pads PD21, PD22, PD23, and PD24 in the second column. For example, the first interval PT1 may be greater than the second interval PT2.

[0108] For example, at least one of the panel connection wiring PP1, PP2, PP3, PP4 connecting the panel pads PD11, PD12, PD13, PD14 of the first column and the panel pads PD21, PD22, PD23, PD24 of the second column may have a slanted portion with the vertical direction as a reference. Figure 10 In the middle, the second panel connecting wiring PP2, the third panel connecting wiring PP3 and the fourth panel connecting wiring PP4 may have inclined parts.

[0109] According to this embodiment, in a display device including multiple flip-chip thin film structures (i.e., COF1, COF2), bonding inspection of the flip-chip thin films (i.e., COF1, COF2) can be effectively performed.

[0110] Furthermore, the display device includes an inspection unit that simultaneously checks the bonding state of the first film COF1 and the second film COF2, thereby preventing a reduction in the bonding spacing of the printed circuit board (PCB) and preventing a decrease in production caused by a reduction in the bonding spacing of the PCB.

[0111] Figure 11 This is a schematic diagram illustrating the configuration of the display panel included in the first inspection section of a display device according to an embodiment of the present invention.

[0112] In this embodiment, the display device, in addition to the panel pads of the display panel, also includes... Figure 1 to Figure 9 The display devices are essentially the same, therefore the same symbols are used for the same or similar components, and repeated descriptions are omitted.

[0113] Reference Figure 1 to Figure 3b and Figure 11 The display device may include the display panel 100, the printed circuit board (PCB), the first film COF1, and the second film COF2.

[0114] The first film COF1 can be connected to the display panel 100 and the printed circuit board PCB. The second film COF2 can be connected to the display panel 100 and the printed circuit board PCB. The first film COF1 and the second film COF2 can partially overlap.

[0115] In this embodiment, the display panel 100 may include a first column of panel pads PD15 and PD16 connected to the first film COF1, a second column of panel pads PD25 and PD26 connected to the second film COF2, and a total of panel pads PD1, PD2, PD3, and PD4 that are connected to both the first film COF1 and the second film COF2.

[0116] The first film COF1 can be connected to the lower end of the total panel pads PD1, PD2, PD3, and PD4, and the second film COF2 can be connected to the upper end of the total panel pads PD1, PD2, PD3, and PD4.

[0117] This embodiment illustrates that... Figure 6 The configuration of the first column of panel pads PD11 to PD14, the second column of panel pads PD21 to PD24, and the panel connection wiring PP1 to PP4 connecting them is replaced by four total panel pads PD1, PD2, PD3, and PD4.

[0118] According to this embodiment, in a display device including multiple flip-chip thin film structures (i.e., COF1, COF2), bonding inspection of the flip-chip thin films (i.e., COF1, COF2) can be effectively performed.

[0119] Furthermore, the display device includes an inspection unit that simultaneously checks the bonding state of the first film COF1 and the second film COF2, thereby preventing a reduction in the bonding spacing of the printed circuit board (PCB) and preventing a decrease in production caused by a reduction in the bonding spacing of the PCB.

[0120] Figure 12 This is a schematic diagram illustrating the first inspection section of a display device according to an embodiment of the present invention. Figure 13 It means Figure 12 A schematic diagram of the configuration of the display panel included in the first inspection section.

[0121] In this embodiment, the display device, in addition to the panel pads of the display panel, also includes... Figure 1 to Figure 9 The display devices are essentially the same, therefore the same symbols are used for the same or similar components, and repeated descriptions are omitted.

[0122] Reference Figure 1 to Figure 3b , Figure 12 and Figure 13 The display device may include a display panel 100A, a printed circuit board (PCB), a first film COF1, and a second film COF2.

[0123] The first film COF1 can be connected to the display panel 100A and the printed circuit board PCB. The second film COF2 can be connected to the display panel 100A and the printed circuit board PCB. The first film COF1 and the second film COF2 can partially overlap.

[0124] In this embodiment, the display panel 100A may include panel pads PD11, PD12, PD13, PD14 in the first column, panel pads PD21, PD22, PD23, PD24 in the second column, and a plurality of panel connection wirings PP1, PP2, PP3, PP4 connecting the panel pads PD11, PD12, PD13, PD14 in the first column and the panel pads PD21, PD22, PD23, PD24 in the second column. For example, the first panel connection wiring PP1 may connect the first panel pad PD11 and the fifth panel pad PD21. For example, the second panel connection wiring PP2 may connect the second panel pad PD12 and the sixth panel pad PD22. For example, the third panel connection wiring PP3 may connect the third panel pad PD13 and the seventh panel pad PD23. For example, the fourth panel connection wiring PP4 may connect the fourth panel pad PD14 and the eighth panel pad PD24.

[0125] In this embodiment, the display panel 100A may further include an alignment pattern AK that is connected to any one of the panel pads in the second column.

[0126] If the voltage of the alignment pattern AK is measured while only the first membrane COF1 is connected, the bonding state of the first membrane COF1 can be checked independently.

[0127] According to this embodiment, in a display device including multiple flip-chip thin film structures (i.e., COF1, COF2), bonding inspection of the flip-chip thin films (i.e., COF1, COF2) can be effectively performed.

[0128] Furthermore, the display device includes an inspection unit that simultaneously checks the bonding state of the first film COF1 and the second film COF2, thereby preventing a reduction in the bonding spacing of the printed circuit board (PCB) and preventing a decrease in production caused by a reduction in the bonding spacing of the PCB.

[0129] (Industry availability)

[0130] The display device of the present invention, as described above, can prevent the reduction of the bonding spacing of the printed circuit board and can prevent the decrease in production caused by the reduction of the bonding spacing of the printed circuit board.

[0131] The above description refers to various embodiments; however, those skilled in the art should understand that various modifications and alterations can be made to the present invention without departing from the spirit and scope of the invention as set forth in the claims.

Claims

1. A display device, characterized in that, include: Display panel; Printed circuit board; The first film is connected to the display panel and the printed circuit board. as well as The second film is connected to the display panel and the printed circuit board. The display panel includes: The panel pads in the first column are located on one side of the display panel and are connected to the first film; The second column of panel pads is located on one side of the display panel and connected to the second film; and Multiple panel connection wirings located on one side of the display panel connect the panel pads of the first column to the panel pads of the second column. The first membrane includes: Multiple film pads connected to the printed circuit board; and Multiple film pads connected to the panel pads in the first column, The second film includes a plurality of pads connected to the panel pads of the second column. The plurality of film pads of the first film connected to the printed circuit board, the plurality of film pads of the first film connected to the panel pads of the first column, the plurality of pads of the second film connected to the panel pads of the second column, the panel pads of the first column, the panel pads of the second column, and the plurality of panel connection wiring located on one side of the display panel are configured to detect the bonding state of the first film and the bonding state of the second film.

2. The display device according to claim 1, characterized in that, The area where the panel pads of the first column are located overlaps at least partially with the area where the panel pads of the second column are located.

3. The display device according to claim 1, characterized in that, The display panel also includes: The panel pads in the third column are located on the other side of the display panel and are connected to the first film. The fourth column of panel pads is located on the other side of the display panel and is connected to the second film; and Multiple panel connection wirings located on the other side of the display panel connect the panel pads of the third column to the panel pads of the fourth column. The first membrane further includes: Multiple film pads connected to the panel pads in the third column, The second membrane also includes: Multiple pads connected to the printed circuit board; and Multiple pads connected to the panel pads in the fourth column, The plurality of pads of the second film connected to the printed circuit board, the plurality of pads of the second film connected to the panel pads of the fourth column, the plurality of film pads of the first film connected to the panel pads of the third column, the panel pads of the third column, the panel pads of the fourth column, and the plurality of panel connection wiring located on the other side of the display panel are configured to detect the bonding state of the first film and the bonding state of the second film.

4. The display device according to claim 1, characterized in that, The first membrane includes: A first film pad, a second film pad, a third film pad, and a fourth film pad connected to the printed circuit board; The fifth, sixth, seventh, and eighth film pads are connected to the panel pads in the first column; A first membrane wiring connecting the first membrane pad and the fifth membrane pad; The third film wiring connects the third film pad to the seventh film pad; The fourth film wiring connecting the fourth film pad and the eighth film pad; and The second membrane wiring connects the second membrane pad to the third membrane wiring.

5. The display device according to claim 4, characterized in that, The second film includes a first pad, a second pad, a third pad, and a fourth pad that are connected to the panel pads of the second column.

6. The display device according to claim 5, characterized in that, The second membrane also includes connecting wiring that connects the first pad, the third pad, and the fourth pad.

7. The display device according to claim 6, characterized in that, A current is applied to the fourth film pad, and the voltage is measured in the first film pad and the second film pad, thereby determining the bonding state of the first film and the bonding state of the second film.

8. The display device according to claim 1, characterized in that, The display panel also includes an alignment pattern that connects to any of the panel pads in the second column.

9. The display device according to claim 3, characterized in that, The second membrane includes: The fifth, sixth, seventh, and eighth pads are connected to the printed circuit board. The ninth, tenth, eleventh, and twelfth pads are connected to the panel pads of the fourth column; The first wiring connects the fifth pad and the ninth pad; The third wiring connects the seventh pad and the eleventh pad; The fourth wiring connecting the eighth pad and the twelfth pad; and The second wiring connects the sixth pad to the third wiring.

10. The display device according to claim 9, characterized in that, The first film includes a ninth film pad, a tenth film pad, an eleventh film pad, and a twelfth film pad connected to the panel pads of the third column.

11. The display device according to claim 10, characterized in that, The first membrane also includes membrane connection wiring connected to the ninth membrane pad, the eleventh membrane pad and the twelfth membrane pad.

12. The display device according to claim 11, characterized in that, A current is applied to the eighth pad, and voltages are measured in the fifth and sixth pads to determine the bonding state of the first film and the bonding state of the second film.

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