Adhesive sheet attaching method, adhesive sheet attaching apparatus, and method for manufacturing semiconductor product

Abstract

This invention provides an adhesive sheet bonding method, an adhesive sheet bonding apparatus, and a method for manufacturing a semiconductor product that can precisely bond an adhesive sheet to the annular protrusion forming surface of a semiconductor wafer with annular protrusions and more reliably avoid damage to the semiconductor wafer. The adhesive sheet bonding method includes a bonding process in which a pressure higher than atmospheric pressure is applied to a wafer composite (M) consisting of an adhesive sheet (DT) attached to the annular protrusion forming surface of a wafer (W) having an annular protrusion (Ka) on one side of its outer periphery, thereby bonding the adhesive sheet (DT) to the annular protrusion forming surface of the wafer (W). During the bonding process, a sufficiently large pressing force (V1) can be applied to the adhesive sheet (DT), thus greatly improving the adhesion between the adhesive sheet (DT) and the wafer (W). Therefore, even after time has passed, the adhesive sheet (DT) can be prevented from peeling off from the wafer (W).

Description

Technical Field

[0001] The present invention relates to an adhesive sheet bonding method, an adhesive sheet bonding apparatus, and a method for manufacturing semiconductor products for bonding an adhesive sheet, such as a strip-shaped adhesive material, to a workpiece, such as a semiconductor wafer (hereinafter appropriately referred to as "wafer") or a substrate. Background Technology

[0002] After the circuit pattern is formed on the surface of the wafer, the back side of the wafer is ground by a back-side grinding process, and then the wafer is cut into multiple chip components by a dicing process. In the back-side grinding process, there is a situation where the outer periphery of the back side of the wafer is left and only the central part is ground, forming an annular protrusion on the outer periphery of the back side of the wafer in a way that surrounds the back-side grinding area.

[0003] In this case, even when the central portion of the wafer is thinned, the wafer is reinforced by the annular protrusions, thus preventing strain during processing. After the back-side grinding process, the wafer with the annular protrusions is placed in the center of the ring holder, and a support adhesive tape (dicing tape) is attached across the ring holder and the back of the wafer. A mounting bracket is created by attaching the dicing tape for use in the dicing process.

[0004] As an example of a method for attaching an adhesive sheet, such as a dicing strip, to a wafer with steps formed by an annular protrusion, a method is proposed as follows: The adhesive sheet is clamped into the joint portion of a cavity consisting of a pair of upper and lower housings. Then, the cavity is depressurized to create a pressure difference between the two spaces separated by the adhesive sheet, and the adhesive strip is bent concavely to attach the adhesive sheet to the back side of the wafer. Then, after the pressure difference in the cavity is eliminated, gas is supplied from a first pressing member to the inner corner of the adhesive sheet that is not fully bonded and has floated up at the inner corner of the annular protrusion, thereby performing a second bonding process (see Patent Document 1).

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-232582 Background Technology

[0007] However, the aforementioned conventional apparatus has the following problems. Specifically, in conventional adhesive bonding methods, the adhesive sheet tends to peel off from the inner corner of the annular protrusion towards the wafer center over time after bonding. Furthermore, conventional adhesive bonding methods also cause damage to the wafer, such as cracks and defects, during the bonding process. Wafer damage occurs more frequently in the thinned portions of the wafer, particularly at the inner corner of the annular protrusion. Summary of the Invention

[0008] The problem the invention aims to solve

[0009] The present invention was made in view of the following circumstances, and its main objective is to provide an adhesive sheet bonding method, adhesive sheet bonding apparatus, and semiconductor product manufacturing method that can accurately bond adhesive sheets relative to the annular protrusion forming surface of a semiconductor wafer having annular protrusions and more reliably avoid damage to the semiconductor wafer.

[0010] Solution for solving the problem

[0011] To address the aforementioned problems, the inventors conducted research and obtained the following insight: In conventional structures where a second bonding process is performed using a first pressing member, the force acting on the adhesive sheet is relatively small. Therefore, it is difficult to sufficiently improve the adhesion between the wafer and the adhesive sheet, and it can be assumed that the adhesive sheet will peel off from the wafer over time.

[0012] Furthermore, during the second bonding process, the inner corners of the annular protrusions on the wafer are subjected to greater pressure compared to the center of the wafer. It can be assumed that this deviation in pressure will cause cracks or defects to occur at a high frequency, particularly at the inner corners of the annular protrusions on the wafer where greater pressure is applied.

[0013] Furthermore, the first pressing member has a gas supply hole and is a columnar member made of metal or resin. In conventional structures, the bottom surface of the first pressing member is brought close to the wafer while gas is supplied. This can lead to the following situation: by bringing the first pressing member close, it may come into contact with the concave central portion of the wafer, which has been thinned, causing damage to the thinner concave portion of the wafer. It can be considered that if the flatness of the bottom surface of the first pressing member is low, even when the first pressing member is close to the inner corner of the annular protrusion of the wafer, it may still come into contact with other parts of the wafer (e.g., the central portion), resulting in wafer damage.

[0014] To achieve this objective, the present invention provides the following solution.

[0015] That is, the present invention provides a method for pasting an adhesive sheet, characterized in that the method includes a pasting process in which a pressure higher than atmospheric pressure is applied to a composite material consisting of an adhesive sheet attached to the annular protrusion forming surface of a workpiece having an annular protrusion on the outer periphery of one side, thereby pasting the adhesive sheet to the annular protrusion forming surface.

[0016] (Functions and Effects)

[0017] This method involves applying pressure higher than atmospheric pressure to the adhesive composite during the bonding process, thereby bonding the adhesive sheet to the annular protrusion forming surface of the workpiece. In this case, sufficiently high pressing force can be applied to the adhesive sheet, thus further improving the adhesion between the adhesive sheet and the annular protrusion forming surface of the workpiece. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece over time.

[0018] Furthermore, in the above invention, it is preferred that the adhesive sheet pasting method includes a storage process of storing the sheet composite in a cavity, wherein the pasting process is performed after the storage process by increasing the pressure of the internal space of the cavity, thereby pasting the adhesive sheet onto the annular protrusion forming surface.

[0019] (Functions and Effects)

[0020] This method involves increasing the pressure within the chamber after housing the wafer composite, thereby applying a pressure higher than atmospheric pressure to the wafer composite. In this case, the pressure applied to the entire adhesive wafer can be uniformly distributed through the increased internal pressure. Therefore, unevenness on the surface of the adhesive wafer due to deviations in the forces acting on it can be reliably avoided, thus improving the flatness of the adhesive wafer when it is bonded to the wafer. Furthermore, it also prevents damage to the wafer caused by deviations in the forces acting on the wafer.

[0021] Furthermore, in the above invention, it is preferred that the chamber comprises an upper shell and a lower shell, and the bonding process includes: an upper and lower space forming process, in which the adhesive sheet is clamped by the upper shell and the lower shell, thereby dividing the internal space of the chamber into a lower space for the workpiece in the state where the annular protrusion forming surface is facing upward, and an upper space opposite to the lower space through the adhesive sheet; and a space pressurizing process, in which the adhesive sheet is bonded to the annular protrusion forming surface by pressurizing at least the upper space and the lower space.

[0022] (Functions and Effects)

[0023] This design divides the internal space of the chamber into a lower space and an upper space by clamping the adhesive sheet between the upper and lower housings. Since the adhesive sheet acts as a sealing material, gas leakage between the lower and upper spaces within the chamber is prevented. Therefore, by pressurizing at least the upper space, the pressure applied to the upper space is precisely applied to the adhesive sheet. This further improves the seal between the adhesive sheet adhered to the workpiece and the annular protrusion forming surface of the workpiece.

[0024] Furthermore, in the above invention, it is preferred that the adhesive sheet has a predetermined shape corresponding to the annular protrusion forming surface of the workpiece and is held by a long conveying sheet, the chamber has an upper shell and a lower shell, and the bonding process includes: an upper and lower space forming process, in which the conveying sheet is clamped by the upper shell and the lower shell to divide the internal space of the chamber into a lower space for the workpiece in the state where the annular protrusion forming surface is facing upward, and an upper space opposite to the lower space by the adhesive sheet held by the conveying sheet; and a space pressurization process, in which at least the upper space is pressurized by pressing the upper space and the lower space to bond the adhesive sheet to the annular protrusion forming surface.

[0025] (Functions and Effects)

[0026] In this design, the adhesive sheet has a predetermined shape corresponding to the annular protrusion forming surface of the workpiece. Therefore, the adhesive sheet can be properly adhered to the annular protrusion forming surface according to its position and shape. Furthermore, since there is no need for processes such as cutting the adhesive sheet into a suitable predetermined shape, the steps for adhering the adhesive sheet can be shortened.

[0027] Furthermore, the adhesive sheet is held by a long conveyor strip, and a cavity is formed by clamping the conveyor strip using the upper and lower housings. In this case, even when a material with high adhesive strength is used as the adhesive sheet to further tighten the bond between the workpiece and the adhesive sheet, the two housings can clamp the conveyor strip without contacting the adhesive sheet. Therefore, it is possible to avoid the situation where the adhesive sheet adheres to the cavity without peeling off, thus hindering the bonding process.

[0028] Furthermore, even when the adhesive sheet is pre-formed into a predetermined shape by holding it in a long strip of conveyor sheet, the adhesive sheet can be conveyed accurately along the predetermined path by releasing and supplying the long strip of conveyor sheet along that predetermined path. That is, it is possible to avoid unnecessary costs incurred by making the adhesive sheet into a long strip shape and to improve the conveying accuracy of the adhesive sheet.

[0029] Furthermore, in the above invention, it is preferable to include a sheet-like elastomer disposed inside the upper housing, the sheet-like elastomer being configured such that the adhesive sheet is held between the upper housing and the lower housing during the formation of the upper and lower spaces, thereby abutting against the adhesive sheet.

[0030] (Functions and Effects)

[0031] Using this method, under the action of pressure difference, the sheet-like elastomer deforms into a convex shape with a more uniform curvature. Therefore, the adhesive sheet easily deforms according to the shape of the annular protrusion forming surface of the workpiece, thus improving the adhesion between the annular protrusion forming surface and the adhesive sheet. Consequently, the adhesive sheet can be bonded to the annular protrusion forming surface with greater precision and accuracy.

[0032] Furthermore, in the above invention, it is preferred that the adhesive sheet pasting method includes a heating process in which the adhesive sheet is heated by heating at least one of the lower space and the upper space. In the pasting process, a pressure higher than atmospheric pressure is applied to the adhesive sheet, which has been heated by the heating process, thereby pasting the adhesive sheet onto the annular protrusion forming surface.

[0033] (Functions and Effects)

[0034] This method utilizes a heating process to heat the adhesive sheet, making it more flexible. That is, the adhesive sheet easily deforms according to the shape of the annular protrusion forming surface of the workpiece, thus improving the adhesion between the annular protrusion forming surface and the adhesive sheet.

[0035] To achieve this objective, the present invention may also adopt the following approach.

[0036] That is, the present invention provides an adhesive sheet pasting device, characterized in that the adhesive sheet pasting device includes a pasting mechanism, which applies a pressure higher than atmospheric pressure to a sheet composite consisting of an adhesive sheet attached to the annular protrusion forming surface of a workpiece having an annular protrusion on the outer periphery of one side, thereby pasting the adhesive sheet to the annular protrusion forming surface.

[0037] (Functions and Effects)

[0038] The bonding mechanism of the present invention applies a pressure higher than atmospheric pressure to the sheet composite, thereby bonding the adhesive sheet to the annular protrusion forming surface of the workpiece. In this case, a sufficiently large pressing force can be applied to the adhesive sheet, thus further improving the adhesion between the adhesive sheet bonded to the workpiece and the annular protrusion forming surface of the workpiece. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece over time.

[0039] To achieve this objective, the present invention may also adopt the following approach.

[0040] That is, the present invention provides a method for manufacturing a semiconductor product, which is used to manufacture a semiconductor product in a state in which an adhesive sheet is adhered to an annular protrusion forming surface of a workpiece having an annular protrusion on the outer periphery of one side. The method for manufacturing the semiconductor product is characterized in that the method for manufacturing the semiconductor product includes an adhesion process in which the adhesive sheet is adhered to a sheet composite formed by attaching the adhesive sheet to the annular protrusion forming surface of the workpiece, thereby adhering the adhesive sheet to the annular protrusion forming surface.

[0041] (Functions and Effects)

[0042] This method enables the manufacture of semiconductor products in which an adhesive sheet is bonded to the annular protrusion-forming surface of a workpiece having an annular protrusion on the outer periphery of one side. Specifically, during the bonding process, the adhesive sheet is bonded to the annular protrusion-forming surface of the workpiece by applying a pressure higher than atmospheric pressure to the wafer composite. In this case, sufficiently large pressing force can be applied to the adhesive sheet, thus further improving the adhesion between the adhesive sheet and the annular protrusion-forming surface of the workpiece within the wafer composite through the bonding process. Therefore, it is more reliable to prevent the adhesive sheet from peeling off from the workpiece over time.

[0043] The effects of the invention

[0044] The adhesive sheet bonding method, adhesive sheet bonding apparatus, and semiconductor product manufacturing method of the present invention bond the adhesive sheet to the annular protrusion forming surface of a workpiece by applying a pressure higher than atmospheric pressure to the sheet composite. In this case, a sufficiently large pressing force can be applied to the adhesive sheet, thereby further improving the adhesion between the adhesive sheet bonded to the workpiece and the annular protrusion forming surface of the workpiece. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece over time. Furthermore, since this large pressing force can be applied uniformly throughout the entire workpiece, damage such as cracks or defects in the workpiece due to deviations in the pressing force applied to the workpiece can be avoided. Attached Figure Description

[0045] Figure 1 This is a diagram showing the structure of the semiconductor wafer in Example 1. Figure 1 (a) is a partial cross-sectional perspective view of a semiconductor wafer. Figure 1 (b) is a three-dimensional view of the back side of a semiconductor wafer. Figure 1 (c) is a partial longitudinal sectional view of a semiconductor wafer.

[0046] Figure 2 This is a longitudinal sectional view showing the structure of the adhesive sheet of Example 1.

[0047] Figure 3 This is a top view of the adhesive sheet pasting device of Embodiment 1.

[0048] Figure 4 This is a front view of the adhesive sheet pasting device of Embodiment 1.

[0049] Figure 5 This is the front view of the pasting unit in Embodiment 1.

[0050] Figure 6 This is a longitudinal sectional view of the chamber in Example 1.

[0051] Figure 7 This is a flowchart illustrating the operation of the adhesive sheet pasting device of Embodiment 1.

[0052] Figure 8 This is a perspective view of the mounting bracket of Example 1.

[0053] Figure 9 This is a diagram illustrating step S2 of Example 1.

[0054] Figure 10 This is a diagram illustrating step S3 of Example 1.

[0055] Figure 11 This is a diagram illustrating step S3 of Example 1.

[0056] Figure 12 This is a diagram illustrating step S4 of Example 1.

[0057] Figure 13 This is a diagram illustrating step S4 of Example 1.

[0058] Figure 14 This is a diagram illustrating step S5 of Example 1.

[0059] Figure 15 This is a diagram illustrating step S6 of Example 1.

[0060] Figure 16 This is a diagram illustrating step S6 of Example 1.

[0061] Figure 17 This is a diagram illustrating step S7 of Example 1.

[0062] Figure 18 This is a diagram showing the structure of the adhesive sheet and the conveying sheet of Example 2. Figure 18 (a) is a perspective view of the back side of the adhesive sheet and the conveying sheet. Figure 18 (b) is a longitudinal sectional view of the adhesive sheet and the conveying sheet.

[0063] Figure 19 This is a flowchart illustrating the operation of the adhesive sheet pasting device in Embodiment 2.

[0064] Figure 20 This is a diagram illustrating step S1 of Example 2.

[0065] Figure 21 This is a diagram illustrating step S2 of Example 2.

[0066] Figure 22 This is a diagram illustrating step S3 of Example 2.

[0067] Figure 23 This is a diagram illustrating step S3 of Example 2.

[0068] Figure 24 This is a diagram illustrating step S4 of Example 2.

[0069] Figure 25 This is a diagram illustrating step S4 of Example 2.

[0070] Figure 26 This is a diagram illustrating step S5 of Example 2.

[0071] Figure 27 This is a diagram illustrating step S6 of Example 2.

[0072] Figure 28 This is a diagram illustrating step S6 of Example 2.

[0073] Figure 29 This is a diagram illustrating step S7 of Example 2.

[0074] Figure 30 This is a diagram illustrating the structure of a modified example.

[0075] Figure 31 This is a diagram illustrating the structure of a modified example. Figure 31 (a) is a longitudinal sectional view showing the structure of the adhesive tape and conveying sheet in a modified example. Figure 31 (b) is a perspective view illustrating the structure of the sheet cutting device in the modified example.

[0076] Figure 32 This is a diagram illustrating the structure of a modified example. Figure 32 (a) is a longitudinal sectional view of a modified example of a structure with an elastic body. Figure 32 (b) is a diagram illustrating the problems that may arise in structures without elastomers. Figure 32 Figure (c) illustrates the advantages of a structure with an elastomer.

[0077] Figure 33 This is a diagram illustrating the structure of a modified example. Figure 33(a) is a longitudinal sectional view showing a modified example of a structure equipped with a heating mechanism. Figure 33 (b) is a longitudinal sectional view illustrating an example of a process of heating adhesive tape using a heating mechanism.

[0078] Explanation of reference numerals in the attached figures

[0079] 1. Adhesive sheet bonding device; 3. Wafer transport mechanism; 5. Container; 6. Rack recovery unit; 7. Aligner; 8. Lifting platform; 9. Holding platform; 12. Rack supply unit; 13. Bonding unit; 16. Wafer transport device; 17. Rack transport device; 23. Holding arm; 27. Adsorption plate; 28. Suction cup; 32. Pressurizing device; 33. Control unit; 38. Rack holding unit; 71. Wafer supply unit; 72. Separating wafer recovery unit; 73. Wafer bonding unit; 74. Wafer recovery unit; 81. Wafer bonding mechanism; 82. Wafer cutting mechanism; 85. Bonding roller; 86. Clamping roller; 95. Cutting tool; f. Ring frame; DT. Adhesive tape; P. Transport sheet; M. Wafer composite; MF. Mounting frame; Ta. Substrate; Tb. Adhesive material; Pa. Substrate; Pb. Adhesive material. Detailed Implementation

[0080]

Example 1

[0081] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. In the adhesive sheet bonding apparatus 1 of Embodiment 1, the adhesive tape DT (cut tape) for support is used as the adhesive sheet, and the workpiece to which the adhesive sheet is bonded is a semiconductor wafer W (hereinafter referred to as "wafer W") and a ring frame f. That is, in the adhesive sheet bonding apparatus 1 of Embodiment 1, the mounting frame MF is fabricated by bonding the adhesive tape DT across the wafer W and the ring frame f.

[0082] like Figure 1 (a)~ Figure 1As shown in (c), with a protective tape PT for circuit protection attached to the surface of the wafer W where the circuit pattern is formed, the wafer W is subjected to back-side grinding. The back side of the wafer W is ground with approximately 3 mm remaining radially on its outer periphery (back-side grinding). That is, the wafer is processed to have a flat recess He formed on the back side and an annular protrusion Ka retained along the outer periphery of the back side. As an example, the processing is performed such that the grinding depth d of the flat recess He is several hundred μm and the wafer thickness J of the flat recess He is 30 μm to 50 μm. Therefore, the annular protrusion Ka formed on the outer periphery of the back side functions as an annular rib to improve the rigidity of the wafer W, suppressing flexural deformation of the wafer W during handling and other processing steps. Furthermore, the inner corner of the annular protrusion Ka is indicated by the reference numeral Kf. The inner corner Kf corresponds to the boundary between the annular protrusion Ka and the flat recess He. The back side of wafer W corresponds to the annular protrusion forming surface of the workpiece in this invention.

[0083] like Figure 2 As shown, the adhesive tape DT used in this embodiment has a strip-shaped structure formed by laminating a non-adhesive substrate Ta and an adhesive material Tb. A release tab S is added to the adhesive material Tb. That is, the release tab S is added to the adhesive surface of the adhesive tape DT, and the adhesive surface of the adhesive tape DT is exposed by peeling the release tab S from the adhesive tape DT.

[0084] Examples of materials constituting the substrate Ta include polyolefins, polyethylene, ethylene-vinyl acetate copolymers, polyesters, polyimides, polyurethanes, vinyl chloride, polyethylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polyvinylidene chloride, polyethylene methacrylate copolymers, polypropylene, terephthalate methacrylate, polyamide-imide, and polyurethane elastomers. Furthermore, materials composed of a combination of multiple of the above materials can also be used as the substrate Ta. Additionally, the substrate Ta can be a single layer or a structure formed by stacking multiple layers.

[0085] The adhesive material Tb is preferably made of a material that can ensure the following functions: maintaining the adhesion of the adhesive tape DT to the wafer W and the ring carrier f, and preventing the chip components from scattering during subsequent dicing processes. Examples of materials constituting the adhesive material Tb include acrylic copolymers. Examples of separators S include strips of paper and plastic. Alternatively, an adhesive material or bonding material may be used instead of the adhesive material Tb.

[0086] <Explanation of the overall structure>

[0087] Here, the overall structure of the adhesive sheet pasting device 1 of Embodiment 1 will be described. Figure 3 This is a top view showing the basic structure of the adhesive sheet pasting device 1 according to Embodiment 1. The adhesive sheet pasting device 1 has a rectangular portion 1a with a relatively long horizontal dimension and a protrusion 1b. The protrusion 1b is connected to the central portion of the rectangular portion 1a and protrudes upward. Furthermore, in the following description, the length direction of the rectangular portion 1a will be referred to as the left-right direction (x-direction), and the horizontal direction orthogonal to it (y-direction) will be referred to as the front-back direction.

[0088] A wafer transport mechanism 3 is provided on the right side of the rectangular section 1a. Two containers 5 containing wafers W are placed side-by-side on the lower right side of the rectangular section 1a. Wafers W, with protective tape PT attached to their surfaces, are stored in multiple layers inside the containers 5 with the surface side facing down. At the left end of the rectangular section 1a, a device for transporting assembled wafers W is provided. Figure 8 The mounting bracket shown is the MF recovery rack recovery section 6.

[0089] Starting from the upper right side of the rectangular portion 1a, an alignment device 7, a lifting platform 8, a holding platform 9, and a holder supply section 12 are sequentially provided. A bonding unit 13 is provided in the protrusion 1b, which bonds the support adhesive tape DT (cutting tape) across the back of the wafer W and the ring holder f.

[0090] like Figure 4 As shown, the wafer transport mechanism 3 is provided with a wafer transport device 16 that is supported on the right side of the guide rail 15 and can move back and forth. The guide rail 15 is horizontally mounted on the upper part of the rectangular portion 1a. In addition, a frame transport device 17 that is supported on the guide rail 15 and can move back and forth is provided on the left side of the guide rail 15.

[0091] The wafer transport device 16 is configured to transport wafers W taken from any container 5 along the left-right and front-back directions. The wafer transport device 16 is equipped with a left-right movable stage 18 and a front-back movable stage 19.

[0092] The left-right movable stage 18 is configured to reciprocate along the guide rail 15 in the left-right direction. The front-back movable stage 19 is configured to reciprocate along the guide rail 20 provided on the left-right movable stage 18 in the front-back direction.

[0093] Furthermore, a holding unit 21 for holding the wafer W is provided at the lower part of the movable stage 19 that moves back and forth. The holding unit 21 is configured to reciprocate in the vertical direction (z direction) along the vertically extending lifting track 22. In addition, the holding unit 21 can rotate about an axis in the z direction using a rotation axis (not shown).

[0094] A horseshoe-shaped holding arm 23 is provided at the lower part of the holding unit 21. Multiple slightly protruding suction cups are provided on the holding surface of the holding arm 23, which are used to hold and hold the wafer W. Furthermore, the holding arm 23 is connected to a compressed air device via a flow path formed inside it and a connecting flow path connected to the base end of this flow path.

[0095] By utilizing the aforementioned movable structure, the holding arm 23 can be used to move the adsorbed and held wafer W back and forth, left and right, and rotate it around the z-axis.

[0096] The rack transport device 17 includes a left-right movable stage 24, a front-back movable stage 25, a telescopic linkage mechanism 26 connected to the lower part of the left-right movable stage 24, and an adsorption plate 27 mounted on the lower end of the telescopic linkage mechanism 26. The adsorption plate 27 adsorbs and holds the wafer W. Multiple suction cups 28 are provided around the adsorption plate 27 to adsorb and hold the annular frame f. Therefore, the rack transport device 17 can adsorb and hold the annular frame f or mounting frame MF placed and held on the holding stage 9 and transport it in lifting, forward, backward, left, and right directions. The suction cups 28 can be adjusted horizontally to correspond to the size of the annular frame f.

[0097] A lifting platform 8 holds the wafer W. As an example, the lifting platform 8 is a metal chuck stage with the same shape as or larger than the wafer W. As a preferred configuration, the lifting platform 8 is configured to hold the wafer W by means of an internal suction device. Figure 5 As shown, the lifting platform 8 is connected to one end of a rod 52 that passes through a support platform 51 that supports the lifting platform 8. The other end of the rod 52 is driven to a drive 53 equipped with a motor or the like. The lifting platform 8 can be moved up and down by means of the rod 52 and the drive 53.

[0098] like Figure 3 and Figure 5 As shown, the lifting platform 8 is configured to reciprocate between an initial position and a pasting position along a track 54 attached in the front-rear direction. The initial position is located inside the rectangular portion 1a. Figure 3 The position of the lifting platform 8 is indicated by a solid line. In this initial position, the wafer W is placed on the lifting platform 8.

[0099] The adhesive is applied inside the protrusion 1b. Figure 3 The position of the lifting platform 8 is indicated by a dashed line. By moving the lifting platform 8 towards the bonding position, the wafer W placed on the lifting platform 8 can come into contact with the adhesive tape DT.

[0100] like Figure 5 and Figure 6As shown, the holding stage 9 is a metal chuck stage with the same shape as or larger than the wafer W, and it is connected to an externally mounted pressure device 32. The operation of the pressure device 32 is controlled by a control unit 33. In addition, the holding stage 9 is equipped with an internal suction device, configured to hold the wafer W.

[0101] In Embodiment 1, the holding platform 9 has an annular protrusion 9a on its outer periphery and is hollow overall. The protrusion 9a is configured to be positioned approximately in line with the configuration of the annular protrusion Ka of the wafer W when viewed from above. The protrusion 9a supports the annular protrusion Ka of the wafer W, thereby enabling the holding platform 9 to hold the wafer W without contacting the thinner flat recess He.

[0102] In addition, such as Figure 5 As shown, the holding platform 9 is housed in the lower housing 29A that constitutes the chamber 29, and is connected to one end of a rod 35 that passes through the lower housing 29A. The other end of the rod 35 is driven to a drive 37 equipped with a motor or the like. Therefore, the holding platform 9 can move up and down inside the chamber 29.

[0103] The lower housing 29A includes a frame holding portion 38 that encloses the lower housing 29A. The frame holding portion 38 is configured such that when the annular frame f is mounted, the upper surface of the annular frame f is flush with the top of the cylinder of the lower housing 29A. In addition, the top of the cylinder of the lower housing 29A is preferably subjected to a demolding process.

[0104] In addition, such as Figure 3 As shown, the retaining platform 9 is configured to reciprocate between an initial position and an adhesive position along a track 40 attached in the front-rear direction, together with the lower housing 29A. The initial position is located inside the rectangular portion 1a. Figure 3 The position of holding platform 9 is indicated by a solid line. In this initial position, the ring frame f is placed on holding platform 9.

[0105] The adhesive is applied inside the protrusion 1b. Figure 3 The position of the holding stage 9 is indicated by a dashed line. By moving the holding stage 9 toward the bonding position, a bonding process can be performed to bond the adhesive tape DT relative to the wafer W placed on the holding stage 9.

[0106] The shelf supply section 12 stores a predetermined number of circular shelf-type boxes in a drawer-style arrangement.

[0107] like Figure 5As shown, the bonding unit 13 comprises a sheet supply section 71, a sheet separation and recycling section 72, a sheet bonding section 73, and a sheet recycling section 74. The sheet supply section 71 includes a supply winding drum filled with a material roll on which adhesive tape DT for support is wound. Furthermore, it is configured such that during the supply of adhesive tape DT from the supply winding drum of the sheet supply section 71 to the bonding position, a peeling roller 75 peels off the sheet separation S. In addition, the supply winding drum of the sheet supply section 71 is connected to an electromagnetic brake and is subjected to appropriate rotational resistance. Therefore, excessive tape release from the supply winding drum can be prevented.

[0108] The separation sheet recovery section 72 is equipped with a recovery winding drum that winds up the separation sheets S peeled off from the adhesive tape DT. The recovery winding drum is driven and controlled by a motor to rotate in both directions.

[0109] The sheet pasting section 73 consists of a chamber 29, a sheet pasting mechanism 81, and a sheet cutting mechanism 82.

[0110] The chamber 29 is composed of a lower housing 29A and an upper housing 29B. The lower housing 29A is disposed in a manner that surrounds the retaining platform 9, and together with the retaining platform 9, it reciprocates in the front-to-back direction between the initial position and the sealed position. The upper housing 29B is provided on the protrusion 1b and is configured to be able to move up and down.

[0111] like Figure 6 As shown, the lower housing 29A and the upper housing 29B are connected to the pressurizing device 32 via a flow path 101. Furthermore, a solenoid valve 103 is provided on the flow path 101 on the upper housing 29B side. Additionally, flow paths 109 are respectively connected to the two housings 29A and 29B, and these flow paths 109 are equipped with solenoid valves 105 and 107 for atmospheric opening.

[0112] Furthermore, a flow path 111 is connected to the upper housing 29B, and this flow path 111 is equipped with a solenoid valve 110 that adjusts the internal pressure after temporary decompression by venting. In addition, the opening and closing operations of these solenoid valves 103, 105, 107, and 110, as well as the operation of the pressurizing device 32, are all performed by the control unit 33.

[0113] That is, the pressurizing device 32 is configured to independently pressurize and regulate the air pressure in the space on the lower housing 29A side and the air pressure in the space on the upper housing 29B side.

[0114] The sheet pasting mechanism 81 includes a movable table 84, a pasting roller 85, and a clamping roller 86. The movable table 84 moves horizontally left and right along a guide rail 88 that is erected in the left-right direction. The pasting roller 85 is supported on a bracket, which is connected to the top of a working cylinder located on the movable table 84. The clamping roller 86 is provided on the side of the sheet recycling section 74 and includes a conveying roller 89 driven by a motor and a clamping roller 90 that is raised and lowered by the working cylinder.

[0115] The sheet cutting mechanism 82 is mounted on a lifting drive table 91 that raises and lowers the upper housing 29B, and includes a support shaft 92 extending in the z-direction and a hub 93 rotatable about the support shaft 92. The hub 93 includes a plurality of support arms 94 extending radially. A circular plate-shaped cutter 95 for cutting the adhesive tape DT along the annular frame f is mounted on the top of at least one support arm 94 in a vertically movable manner. A pressing roller 96 is mounted on the top of the other support arms 94 in a vertically movable manner.

[0116] The sheet recycling unit 74 is equipped with a recycling winding drum that winds up the cut and peeled unwanted adhesive tape DT. The recycling winding drum is driven and rotated in both directions by a motor (not shown).

[0117] like Figure 4 As shown, the rack recovery unit 6 is equipped with a box 41 for loading and recovering the mounting frame MF. The box 41 includes a longitudinal track 45, which is connected and fixed to the device frame 43; and a lifting platform 49, which is helically fed and lifted along the longitudinal track 45 by a motor 47. Therefore, the rack recovery unit 6 is configured to place the mounting frame MF on the lifting platform 49 and perform pitch-feed descent.

[0118] <Action Summary>

[0119] Here, the basic operation of the adhesive sheet pasting device 1 of Embodiment 1 will be explained. Figure 7 This is a flowchart illustrating a series of processes in which adhesive tape DT is bonded to wafer W using adhesive tape bonding device 1.

[0120] Step S1 (Workpiece Supply)

[0121] When a pasting command is issued, a ring frame f is conveyed from the rack supply section 12 to the rack holding section 38 of the lower housing 29A, and a wafer W is conveyed from the container 5 to the lifting platform 8.

[0122] That is, the frame conveying device 17 picks up the annular frame f from the frame supply section 12 and transfers it to the frame holding section 38. After the frame conveying device 17 releases the annular frame f from its grip and raises it, the annular frame f is aligned. As an example, this alignment is performed by synchronously moving multiple support pins, which are erected around the frame holding section 38, in a central direction. While the frame holding section 38 holds the annular frame f, the lower housing 29A and the holding table 9 move together along the track 40 from the initial position to the bonding position on the side of the sheet bonding mechanism 81.

[0123] The carrier transport device 17 transports the ring carrier f, while the wafer transport device 16 inserts holding arms 23 between the wafers W that are housed in multiple layers inside the container 5. The holding arms 23 hold the wafers W and deliver them to the alignment device 7. The alignment device 7 uses a suction cup protruding from its center to hold the center of the wafers W. At the same time, the wafer transport device 16 releases the suction on the wafers W and retracts upward. The alignment device 7 aligns the wafers W according to the notch or the like while holding them with the suction cup and rotating them.

[0124] After alignment is completed, the chuck holding the wafer W protrudes from the face of the aligner 7. The wafer transport device 16 is moved to this position and holds the wafer W. The chuck releases its grip and descends.

[0125] The wafer transport device 16 moves above the lifting platform 8, placing the wafer W on the lifting platform 8 with the side covered by the protective tape PT facing down. While the lifting platform 8 holds the wafer W, it moves along the track 54 from its initial position towards the bonding position on the wafer bonding mechanism 81. Figure 9 The image shows the state of the lifting platform 8 and the holding platform 9 as they move to the pasting position.

[0126] Step S2 (Supply of adhesive sheet)

[0127] After the workpiece is supplied using the wafer transport device 16, adhesive tape DT is supplied in the bonding unit 13. That is, a predetermined amount of adhesive tape DT is released from the wafer supply section 71 while peeling off the separator S. The long strip-shaped adhesive tape DT is guided upwards towards the bonding position along a predetermined transport path.

[0128] Step S3 (First Paste Process)

[0129] After supplying the workpiece and adhesive tape DT, the first bonding process begins. That is, the control unit 33 drives the driver 53 to raise the lifting platform 8. The rising of the lifting platform 8, as... Figure 10 As shown, the back side of wafer W is in contact with adhesive tape DT, and the back side of wafer W is covered by adhesive tape DT.

[0130] Through this contact, the back side of wafer W is attached to the adhesive layer Tb, and wafer W is held by the adhesive tape DT. Hereinafter, the component formed by integrating wafer W and adhesive tape DT is referred to as wafer composite M. After forming wafer composite M, a predetermined amount of adhesive tape DT is released, thereby, as... Figure 11 As shown, the sheet composite M is conveyed above the holding platform 9. Simultaneously with the conveying of the sheet composite M, the lifting platform 8 descends and returns to its initial state. By forming the sheet composite M and conveying it to the holding platform 9, the first bonding process in step S3 is completed.

[0131] Step S4 (Cavity Formation)

[0132] After the sheet composite M is conveyed above the holding table 9, the adhesive roller 85 descends. Then, as... Figure 12 As shown, the adhesive roller 85 rolls on the adhesive tape DT while applying the adhesive tape DT in a manner that spans the top of the annular frame f and the top of the lower housing 29A.

[0133] After the adhesive tape DT is applied to the ring frame f, the adhesive roller 85 is returned to its initial position, and the upper housing 29B is lowered. As the upper housing 29B lowers, as... Figure 13 As shown, the portion of the adhesive tape DT that is attached to the top of the lower housing 29A is clamped between the upper housing 29B and the lower housing 29A to form a chamber 29.

[0134] At this point, the adhesive tape DT functions as a sealing material, and the chamber 29 is divided into two spaces by the adhesive tape DT. That is, it is divided into a lower space H1 on the lower housing 29A side and an upper space H2 on the upper housing 29B side by the adhesive tape DT. The wafer W located in the lower housing 29A approaches and faces the adhesive tape DT with a predetermined gap between them.

[0135] Step S5 (Second Paste Process)

[0136] After chamber 29 is formed, the second bonding process begins. First, control unit 33 controls driver 37 to lower stage 9 to its initial position. Next, control unit 33 closes... Figure 6 When the solenoid valves 105, 107, and 110 are in their indicated states, the pressurizing device 32 is activated to supply gas to the lower space H1 and the upper space H2, pressurizing them to a specific value. Examples of this specific value include 0.3 MPa to 0.5 MPa. By pressurizing the device 32, the gas pressure in both the lower space H1 and the upper space H2 is increased to above atmospheric pressure.

[0137] By pressurizing the upper space H2, such as Figure 14 As shown, a pressing force V1 is applied from the upper space H2 toward the adhesive tape DT. Furthermore, since the entire upper space H2 is pressurized, the pressing force V1 is applied uniformly to the entire adhesive tape DT. Additionally, since the entire lower space H1 is pressurized, a pressing force V2 is applied uniformly from the lower space H1 toward the lower surface of the wafer W (the surface side toward the wafer W in this embodiment). That is, under the action of pressing forces V1 and V2, the adhesive tape DT is precisely adhered to the back side of the wafer W. As a result, the adhesion between the wafer W and the adhesive tape DT is improved, thus preventing the adhesive tape DT from peeling off from the back side of the wafer W over time.

[0138] After applying pressure to the adhesive tape DT and the wafer W for a predetermined time while pressurizing the lower space H1 and upper space H2 to a pressure higher than atmospheric pressure, the control unit 33 stops the pressurizing device 32. Then, the control unit 33 fully opens the solenoid valves 103, 105, 107, and 110, opening the lower space H1 and upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B, opening the chamber 29, and raises the holding stage 9 so that the surface of the wafer W abuts against the wafer holding surface of the holding stage 9. The second bonding process corresponds to the bonding process in this invention.

[0139] Step S6 (cutting the slice)

[0140] Furthermore, during the process of step S5 within chamber 29, the sheet cutting mechanism 82 is activated to cut the adhesive tape DT. At this time, as... Figure 15 As shown, the cutter 95 cuts the adhesive tape DT attached to the ring frame f into the shape of the ring frame f, and the pressing roller 96 follows the cutter 95 while rolling on the cut portion of the ring frame f and pressing.

[0141] Since the second bonding process in step S5 was completed when the upper housing 29B was raised, the clamping roller 90 was raised to release the grip on the adhesive tape DT. Afterwards, as... Figure 16 As shown, the clamping roller 86 is moved to wind up and recycle the cut, unwanted adhesive tape DT toward the wafer recycling section 74, and a predetermined amount of adhesive tape DT is released from the wafer supply section 71. Through each process up to step S6, the wafer composite M is integrated with the ring carrier f. As a result, a mounting frame MF is formed by integrating the ring carrier f and the wafer W with the adhesive tape DT.

[0142] After the unwanted adhesive tape DT is wound up and recycled, the clamping roller 86 and the adhesive roller 85 return to their initial positions. Then, the holding table 9 moves from the adhesive position to the initial position while maintaining the state of the mounting bracket MF.

[0143] Step S7 (Recycling of the mounting bracket)

[0144] While keeping platform 9 returning to its initial position, such as Figure 17 As shown, the suction cup 28 of the rack conveying device 17 adsorbs and holds the mounting frame MF, causing the mounting frame MF to detach from the lower housing 29A. The rack conveying device 17, holding the mounting frame MF, transports the mounting frame MF to the rack recovery section 6. The transported mounting frame MF is then loaded and stored in the box 41.

[0145] The above completes the series of actions for attaching the adhesive tape DT to the wafer W. The above process is then repeated until the mounting bracket MF reaches a predetermined quantity. Thus, the adhesive tape attaching device 1 is used to manufacture a wafer composite M in a state where the adhesive tape DT is tightly attached to the wafer W. The wafer composite M, which has the adhesive tape DT attached to the wafer W through the second attaching process, corresponds to the semiconductor product of this invention.

[0146] <Effects of the structure in Example 1>

[0147] Using the apparatus of Embodiment 1 described above, after the adhesive tape DT is adhered to the wafer W through the first adhesion process, a second adhesion process is performed, thereby adhering the adhesive tape DT to the wafer W with greater precision and tightness. In the second adhesion process of this invention, the air pressure in the lower space H1 and the upper space H2 are pressurized to exceed atmospheric pressure, thereby adhering the adhesive tape DT to the back side of the wafer W with good precision.

[0148] In conventional structures, adhesive tape is bonded to the wafer by applying a pressure difference created by depressurizing the interior of a chamber using a vacuum device. However, the magnitude of the pressure difference generated by depressurization from atmospheric pressure is below atmospheric pressure. That is, when using a pressure difference to bond adhesive tape DT to wafer W, there is an upper limit to the force required to press adhesive tape DT against the back surface of wafer W.

[0149] Therefore, when the adhesive tape DT is brought into contact with the wafer W using a pressure difference based on decompression, the adhesion between the adhesive tape DT and the wafer W is low. Furthermore, in conventional structures where a second bonding is performed using a first pressing member, only a limited portion of the adhesive tape DT can be subjected to pressing force. Moreover, the magnitude of this pressing force is insufficient, making it difficult to improve the adhesion between the adhesive tape DT and the wafer W.

[0150] In contrast, in this invention, a pressurizing device 32 is used to pressurize the upper space H2 and lower space H1 within chamber 29 to a pressure greater than atmospheric pressure. That is, during the second bonding process, pressing pressures V1 and V2, sufficiently greater than the pressure difference generated by depressurization, are applied to the adhesive tape DT and the wafer W. Furthermore, pressing pressures V1 and V2 apply to the entire surface of the adhesive tape DT bonded to the wafer W. Therefore, by performing the second bonding process, the adhesion between the adhesive tape DT and the wafer W can be significantly improved, thus preventing the adhesive tape DT from peeling off from the wafer W even after a period of time following the completion of the bonding process.

[0151] Furthermore, by appropriately controlling the pressure device 32 during the second bonding process, the magnitudes of the pressing pressure V1 and V2 can be adjusted to arbitrary values. Therefore, even with variations in conditions such as the constituent material of the adhesive material Tb, the size of the wafer W, and the thickness of the annular protrusion Ka, the adhesive tape DT can be reliably bonded to the annular protrusion forming surface of the wafer W by appropriately adjusting the magnitudes of the pressing pressure V1 and V2. Moreover, since the appropriate magnitudes of the pressing pressure V1 and V2 are applied evenly across the entire adhesive tape DT, damage to the wafer W caused by excessive pressing pressure or pressure deviation can be avoided.

[0152]

Example 2

[0153] Hereinafter, Embodiment 2 of the present invention will be described with reference to the accompanying drawings. In Embodiment 1, an example was described where, after a strip of adhesive tape DT is pasted across the back side of the wafer W and the ring holder f, the adhesive tape DT is cut into a predetermined shape corresponding to the shape of the workpiece (here, the shape of the wafer W or the ring holder f). In Embodiment 2, an example was described where an adhesive tape having a predetermined shape corresponding to the shape of the workpiece is pasted onto the workpiece. Furthermore, for structures identical to the adhesive sheet pasting device 1 of Embodiment 1, only the same reference numerals are used; different structural parts will be described in detail.

[0154] First, the structure of the adhesive tape DT in Example 2 will be explained. Figure 18 (a) is a perspective view showing the back side of the conveyor sheet P and the adhesive tape DT. Figure 18 (b) is a longitudinal sectional view of the conveyor sheet P and the adhesive tape DT.

[0155] like Figure 18 As shown in (a), the adhesive tape DT of Example 2 is held by a strip-shaped transport sheet P. That is, the adhesive tape DT of a predetermined shape is adhered to one side of the strip-shaped transport sheet P at a predetermined interval and held thereby. The adhesive tape DT is pre-cut into a predetermined shape corresponding to the shape of the forming surface (back side in this example) of the annular protrusion Ka of the wafer W. In Example 2, the adhesive tape DT is pre-cut into a circular shape.

[0156] like Figure 18As shown in (b), the transport sheet P has a structure consisting of a non-adhesive substrate Pa and an adhesive material Pb laminated together. Examples of materials constituting the substrate Pa include polyolefins and polyethylene. Examples of materials constituting the adhesive material Pb include acrylic copolymers. By attaching the substrate Ta of the adhesive tape DT to the adhesive material Pb of the transport sheet P, the transport sheet P holds the adhesive tape DT. In this embodiment, the shape of the adhesive tape DT is circular, but the shape of the adhesive tape DT can be appropriately changed according to the shape of the wafer W.

[0157] The basic structure of the adhesive sheet pasting device 1 in Example 2 is similar to... Figures 3-6 The basic structure of the device shown in Embodiment 1 is the same. However, a conveyor sheet P is loaded into the sheet supply section 71, which holds multiple adhesive tapes DT that have been pre-formed into a predetermined shape. The sheet cutting mechanism 82 cuts the portion of the conveyor sheet P that is adhered to the annular frame f. After the conveyor sheet P is cut by the sheet cutting mechanism 82, the sheet recycling section 74 collects the unwanted conveyor sheets P remaining around the mounting frame MF.

[0158] <Actions in Example 2>

[0159] Here, the operation of the adhesive sheet pasting device 1 of Embodiment 2 will be explained. Figure 19 This is a flowchart illustrating a series of steps in which adhesive tape DT is bonded to wafer W using the adhesive sheet bonding apparatus 1 of Embodiment 2. Steps that are identical to those in the adhesive sheet bonding apparatus 1 of Embodiment 1 are simplified, while different steps are described in detail.

[0160] Step S1 (Workpiece Supply)

[0161] When a bonding command is issued, the wafer W and the ring holder f are supplied in the same manner as in Embodiment 1. That is, the ring holder f housed in the holder supply section 12 is transferred to the holder holding section 38 by the holder conveying device 17. When the holder holding section 38 holds the ring holder f, the lower housing 29A and the holding stage 9 move together along the track 40 from the initial position to the bonding position on the wafer bonding mechanism 81 side.

[0162] Then, the wafer W housed in container 5 is transferred by wafer transport device 16 to lifting platform 8 via alignment device 7. When lifting platform 8 holds substrate 10, it moves along track 54 from its initial position to the bonding position on the wafer bonding mechanism 81 side. Figure 20 The image shows the state of the lifting platform 8 and the holding platform 9 as they move to the pasting position.

[0163] Step S2 (Supply of adhesive sheet)

[0164] After the workpiece is supplied using the wafer transport device 16, adhesive tape DT is supplied in the bonding unit 13. That is, a predetermined amount of adhesive tape DT is released from the wafer supply section 71 along with the transport sheet P while peeling off the separator S. The transport sheet P, which is generally elongated, is guided upwards towards the bonding position along a predetermined transport path. At this time, as... Figure 21 As shown, the adhesive tape DT held by the transport sheet P is positioned above the wafer W placed on the lifting platform 8.

[0165] Step S3 (First Paste Process)

[0166] After supplying the workpiece and wafer W, the first bonding process is performed in the same manner as in Example 1. That is, the control unit 33 drives the driver 53 to raise the lifting platform 8. The rising of the lifting platform 8, as... Figure 22 As shown, the back side of wafer W is in contact with adhesive tape DT, and the back side of wafer W is covered by adhesive tape DT.

[0167] Through this contact, the back side of wafer W is attached to the adhesive layer Tb, and wafer W is held by the adhesive tape DT. Thus, a wafer composite M, integrating wafer W and adhesive tape DT, is fabricated. After fabrication of the wafer composite M, a predetermined amount of adhesive tape DT is released, thereby... Figure 23 As shown, the sheet composite M is conveyed above the holding platform 9. Simultaneously with the conveying of the sheet composite M, the lifting platform 8 descends and returns to its initial state.

[0168] Step S4 (Cavity Formation)

[0169] After the sheet composite M is conveyed above the holding stage 9, a chamber 29 is formed. That is, as... Figure 24 As shown, the adhesive roller 85 is lowered. Then, while rolling on the conveyor sheet P, the adhesive roller 85 adheres the conveyor sheet P to the top of the lower housing 29A and the top of the annular frame f. In conjunction with the movement of the adhesive roller 85, a predetermined amount of adhesive tape DT is released from the sheet supply section 71 along with the conveyor sheet P while peeling off the separating sheet S.

[0170] After the conveying sheet P is adhered to the annular frame f, the adhesion roller 85 is returned to its initial position, and the upper housing 29B is lowered. As the upper housing 29B lowers, as... Figure 25 As shown, the portion of the conveying sheet P that is attached to the top of the lower housing 29A is clamped by the upper housing 29B and the lower housing 29A to form a chamber 29. At this time, the conveying sheet P functions as a sealing material, and the chamber 29 is divided into a lower space H1 and an upper space H2 by the conveying sheet P.

[0171] Step S5 (Second Paste Process)

[0172] After forming chamber 29, the second bonding process is performed in the same manner as in Example 1. First, the control unit 33 lowers the holding platform 9 and activates the pressurizing device 32 to supply gas to the lower space H1 and the upper space H2, pressurizing the lower space H1 and the upper space H2 to a specific value. By activating the pressurizing device 32, the air pressure in both the lower space H1 and the upper space H2 is higher than atmospheric pressure.

[0173] By pressurizing the upper space H2, such as Figure 26 As shown, a pressing force V1 is applied uniformly from the upper space H2 toward the adhesive tape DT. Furthermore, since the entire lower space H1 is pressurized, a pressing force V2 is applied uniformly from the lower space H1 to the downward-facing surface of the wafer W. That is, under the action of sufficiently large pressing forces V1 and V2, the adhesive tape DT is precisely and well adhered to the back side of the wafer W, improving the adhesion between the wafer W and the adhesive tape DT.

[0174] After applying pressure to the adhesive tape DT and the wafer W for a predetermined time while pressurizing the lower space H1 and upper space H2 to a pressure higher than atmospheric pressure, the control unit 33 stops the pressurizing device 32. Then, the control unit 33 fully opens the solenoid valves 103, 105, 107, and 110, opening the lower space H1 and upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B, opening the chamber 29, and raises the holding stage 9 so that the surface of the wafer W abuts against the wafer holding surface of the holding stage 9.

[0175] Step S6 (Cutting of the conveyor sheet)

[0176] Furthermore, during the process of step S5 within chamber 29, the sheet cutting mechanism 82 is activated. In Embodiment 2, the process differs from that of Embodiment 1 in that the sheet cutting mechanism 82 cuts the conveying sheet P. That is, as... Figure 27 As shown, the cutter 95 cuts the conveying sheet P, which is attached to the ring frame f, into the shape of the ring frame f, and the pressing roller 96 follows the cutter 95 while rolling on the cut part of the ring frame f and pressing.

[0177] After the conveyor sheet P is cut into a circle, the upper housing 29B is raised. Since step S5 has been completed when the upper housing 29B is raised, the clamping roller 90 is raised to release the grip on the adhesive tape DT. Then, as... Figure 28 As shown, the clamping roller 86 is moved to wind up the cut-off unwanted conveyor sheet P toward the sheet recycling section 74 and release a predetermined amount of adhesive tape DT together with the conveyor sheet P from the sheet supply section 71.

[0178] Through each step up to step S6, the mounting frame MF is formed. In the mounting frame MF of Embodiment 2, the annular frame f and the wafer W are integrated by means of adhesive tape DT and transport sheet P. After the unwanted transport sheet P is wound up and recycled, the clamping roller 86 and the adhesive roller 85 return to the initial position. Then, the holding table 9 moves from the adhesive position to the initial position while maintaining the state of the mounting frame MF.

[0179] Step S7 (Recycling of the mounting bracket)

[0180] While keeping platform 9 returning to its initial position, such as Figure 29 As shown, the suction cup 28 of the rack conveying device 17 adsorbs and holds the mounting frame MF, causing the mounting frame MF to detach from the lower housing 29A. The rack conveying device 17, holding the mounting frame MF, transports the mounting frame MF to the rack recovery section 6. The transported mounting frame MF is then loaded and stored in the box 41.

[0181] The above completes the series of actions for attaching the adhesive tape DT to the wafer W. The above process is then repeated until the mounting bracket MF reaches a predetermined quantity. By using the adhesive tape attaching device 1 of Embodiment 2, the same effect as in Embodiment 1 can be obtained even when using adhesive tape DT that has been pre-cut into a predetermined shape. That is, when attaching the adhesive tape DT to the annular protrusion forming surface of the wafer W having annular protrusions, the adhesive tape DT can be accurately attached to the wafer W while avoiding damage to the wafer W.

[0182] Furthermore, all inventive points in the disclosed embodiments are illustrative and not restrictive. The scope of the invention is not shown by the above description of the embodiments, but rather by the claims, which include all modifications (variants) within the same meaning and scope as the claims. As an example, the invention can be modified as follows.

[0183] (2) In step S5 of each embodiment, the pressurizing device 32 pressurizes the interiors of both the lower space H1 and the upper space H2, but is not limited thereto. That is, the pressurizing device 32 may also pressurize only the upper space H2 to a pressure higher than atmospheric pressure, and use the pressing force V1 to adhere the adhesive tape DT with greater precision.

[0184] (3) In step S5 of each embodiment, the pressure inside the chamber 29 is made higher than atmospheric pressure by using the pressurizing device 32, thereby generating a pressing force V1 that presses the adhesive tape DT into a tight fit with the wafer W. However, in the process of step S5, the structure is not limited to using the chamber 29 as long as it generates a pressing force greater than atmospheric pressure between the adhesive tape DT and the wafer W.

[0185] As an example of the structure of the omitted chamber 29, such as Figure 30 As shown, the following structure can be described: a pressing plate 141 is provided above the holding platform 9, and the pressing plate 141 is lowered to press the sealing sheet S, thereby applying a pressing force V1.

[0186] The bottom surface of the pressing member 141 is flat, and the pressing member 141 is positioned above the adhesive tape DT. Therefore, by lowering the pressing member 141, the flat bottom surface of the pressing member 141 presses the adhesive tape DT, and the adhesive tape DT can be deformed into a convex shape to contact the wafer W.

[0187] (4) In each embodiment, the structure of attaching the support adhesive tape DT to the wafer W is described as an example, but the adhesive sheet attached to the wafer W is not limited to this. If the structure is a sheet-like adhesive material such as the adhesive tape for circuit protection, the structure of each embodiment can be applied.

[0188] (5) In each embodiment, the wafer W and the ring frame f are exemplified as the workpieces to which the adhesive sheet is attached, but the workpieces are not limited to these. As an example, the ring frame f may be omitted, and the adhesive sheet may be attached only to the wafer W. In addition, for the structure of this embodiment, various semiconductor components such as substrates and panels can be used as workpieces. Furthermore, the shape of the workpiece may be not only circular, but also rectangular, polygonal, or approximately circular.

[0189] (6) In each embodiment, the holding stage 9 is moved up and down at a predetermined time to attach the adhesive tape DT to the wafer W, but the up and down movement of the holding stage 9 can be appropriately changed. As an example, it is not limited to the structure in which the pressure processing of step S5 is performed after the holding stage 9 is lowered, but the pressure processing can also be performed while maintaining the raised state.

[0190] (7) In each embodiment, the holder holding part 38 is disposed on the outside of the lower housing 29A, but the holder holding part 38 may also be disposed inside the lower housing 29A. In this case, the process after step S4 is performed with the annular holder f and the wafer W respectively housed inside the chamber 29.

[0191] (8) In Example 2, the adhesive tape DT is pre-formed into a predetermined shape corresponding to the shape of the annular protrusion forming surface of the wafer W, but is not limited thereto. That is, the wafer supply section 71 may also be filled with a strip-shaped adhesive tape DT having a strip-shaped transport sheet P attached. The structure of the strip-shaped adhesive tape DT having a strip-shaped transport sheet P attached is as follows: Figure 31 As shown in (a). In this case, the adhesive tape pasting device 1 has a tape cutting device 201 upstream of the chamber 29, which shapes the strip-shaped adhesive tape DT into a predetermined shape.

[0192] The structure of the sheet cutting device 201 is as follows Figure 31 As shown in (b), the sheet cutting device 201 includes a support table 203, a cutter 205, and an adhesive sheet recycling section 207. Furthermore, the adhesive tape DT and the conveying sheet P discharged from the sheet supply section 71 are flipped by a flipping device (not shown), and the adhesive tape DT is supplied to the sheet cutting device 201 in a state where it is located above the conveying sheet P.

[0193] The support table 203 is configured to horizontally receive the elongated adhesive tape DT and the conveyor sheet P located on the lower side, which are released and supplied from the sheet supply section 71 along direction L. The cutter 205 is disposed above the support table 203 and can be moved vertically via a movable table (not shown). As an example of the cutter 205, a ring-shaped Thomson cutter can be used.

[0194] By lowering the cutter 205, the adhesive tape DT and the conveyor sheet P are cut off in a circular trajectory K. The structure in which the cutter 205 cuts the adhesive tape DT is not limited to this; other examples include structures where the blade-shaped cutter 205 moves along a circular track to cut the adhesive tape DT in a circular shape.

[0195] The adhesive strip recovery section 207 recovers the unwanted adhesive strip DTn remaining around the cut circular adhesive strip DT. The unwanted portion of the adhesive strip DTn is peeled off from the conveyor sheet P immediately behind the conveyor roller 208. The peeled adhesive strip DTn is guided by the guide roller 209 to the recovery winding drum 210. The recovery winding drum 210 winds up and recovers the adhesive strip DTn peeled off from the conveyor sheet P. Thus, the adhesive strip DT, which has been shaped into a circle by the cutter 205, remains on the conveyor sheet P after being cut by the strip cutting device 201.

[0196] The adhesive tape DT, cut into a circle, is guided into chamber 29 together with the conveyor sheet P. Furthermore, the adhesive tape DT and the conveyor sheet P are flipped again downstream of the sheet cutting device 201 by a flipping device (not shown), so that the adhesive tape DT is guided into chamber 29 in a position below the conveyor sheet P.

[0197] (9) In each embodiment, such as Figure 32 As shown in (a), the chamber 29 may also have a sheet-like elastomer Ds. Hereinafter, the structure of Example 2 will be illustrated and this modified example will be explained.

[0198] The elastomer Ds is disposed inside the upper housing 29B and configured to contact the inner diameter of the upper housing 29B. Furthermore, the lower surface of the elastomer Ds is flush with the cylindrical bottom of the upper housing 29B. Therefore, when the lower housing 29A and the upper housing 29B sandwich the conveyor sheet P to form the cavity 29, the elastomer Ds abuts against the conveyor sheet P. Specifically, the elastomer Ds abuts against the side of the conveyor sheet P opposite to the side holding the adhesive tape DT (the upper surface side in the attached figure). By arranging the elastomer Ds to contact the inner diameter of the lower housing 29A, the elastomer Ds is not sandwiched during the formation of the cavity 29, thus preventing the airtightness of the cavity 29 from being reduced due to the elastomer Ds. Examples of materials constituting the elastomer Ds include rubber, elastomers, or gel-like polymers.

[0199] By incorporating the elastomer Ds in chamber 29, the curvature of the adhesive tape DT can be made more uniform when it is deformed into a convex shape in step S4. The effect of the structure incorporating the elastomer Ds will be explained here. As an example, when the adhesive tape DT is made of a relatively rigid material, such as... Figure 32 As shown in (b), the curvature of the adhesive tape DT is prone to becoming uneven.

[0200] That is, in region P1, where the adhesive tape DT is held by the conveyor sheet P, the adhesive tape DT is present, and therefore the curvature of the conveyor sheet P based on the pressing pressure V1 is relatively small. On the other hand, in region P2, where the adhesive tape DT is not held by the conveyor sheet P, the curvature of the conveyor sheet P based on the pressing pressure V1 is relatively large. That is, under the action of the pressing pressure V1, region P2 is more prone to deformation, thereby further reducing the curvature of the conveyor sheet P in region P1.

[0201] Furthermore, the curvature of the adhesive tape DT is greater on the side near region P2 (peripheral area), and decreases in the central part of the adhesive tape DT. Thus, the curvature of both the adhesive tape DT and the transport sheet P is uneven due to the pressing pressure V1. Consequently, the adhesion between the adhesive tape DT and the wafer W is reduced.

[0202] On the other hand, in the case of an elastomer Ds, such as Figure 32 As shown in (c), under the action of pressure V1, the entire elastomer Ds undergoes uniform convex deformation. Therefore, the curvature of the conveyor sheet P in region P1 increases while the difference between its curvature and that in region P2 decreases, resulting in a more uniform overall curvature of both the conveyor sheet P and the adhesive tape DT. That is, the adhesive tape DT easily deforms according to the shape of the annular protrusion forming surface of the wafer W, thus further improving the adhesion between the adhesive tape DT and the wafer W.

[0203] (10) In various embodiments, a structure for heating the adhesive tape DT may also be provided. As an example of a structure for heating the adhesive tape DT, such as... Figure 33 As shown in (a), the sheet bonding mechanism 81 has a heating mechanism 120 inside the upper housing 29B. The heating mechanism 120 includes a working cylinder 121 and a heating member 123. The working cylinder 121 is connected to the upper part of the heating member 123, and the heating member 123 can be raised and lowered inside the chamber 29 by the movement of the working cylinder 121. Alternatively, if the heating member 123 can heat the adhesive tape DT, it may not be a structure that can be raised and lowered.

[0204] A heater 125 for heating the adhesive tape DT is embedded inside the heating member 123. The heating temperature of the heater 125 is adjusted to a temperature that softens the adhesive tape DT. As an example of this heating temperature, approximately 50°C to 70°C can be taken. The shape of the bottom surface of the heating member 123 can be varied according to the shape of the wafer W. As an example, the heating member 123 is cylindrical in shape.

[0205] Furthermore, it is preferable to preheat the upper space H2 using the heating mechanism 120 before starting step S5. That is, the control unit 33 activates the heater 125 to heat the heating member 123 to a predetermined temperature. By heating the heating member 123, the upper space H2 is heated through heat conduction, thereby heating the adhesive tape DT.

[0206] The adhesive tape DT becomes flexible when heated, thus improving the deformability of the adhesive tape DT based on the pressing pressure V1. That is, when covering the wafer W with the adhesive tape DT, the tracking ability of the adhesive tape DT relative to the wafer W can be further improved. Furthermore, as... Figure 33 As shown in (b), the heating member 123 may be lowered to approach or abut against the adhesive tape DT, and the adhesive tape DT may be directly heated by the heating member 123.

[0207] (11) In the embodiment, the heating mechanism 120 is disposed on the upper space H2 side in the chamber 29 and is a structure for heating the upper space H2, but it is not limited thereto. That is, the heating mechanism 120 can also be a structure for heating the lower space H1. As an example, a structure can be given in which the heater 125 is disposed inside the holding platform 9, and the adhesive tape DT is heated by heating the lower space H1 by the heater 125. In addition, the heating mechanism 120 can also be a structure for heating both the upper space H2 and the lower space H1.

[0208] (12) In each embodiment, the structure of fabricating the wafer composite M by performing the first bonding process of step S3 in the adhesive sheet bonding apparatus 1 is described as an example, but it is not limited to the structure of fabricating the wafer composite M inside the adhesive sheet bonding apparatus 1. That is, it can also be the following structure: a wafer composite M consisting of a wafer W attached to an adhesive tape DT is pre-fabricated, and the adhesive sheet bonding apparatus 1 applies a pressure higher than atmospheric pressure to the wafer composite M, thereby bonding the adhesive tape DT to the wafer W.

Claims

1. An adhesive sheet attaching method characterized by comprising an attaching process in which an adhesive sheet is attached to a ring-shaped protrusion formation surface of a work having a ring-shaped protrusion on an outer periphery of one surface by applying a pressure higher than an atmospheric pressure to a sheet complex in which the adhesive sheet is attached to the ring-shaped protrusion formation surface, in the attaching process, a first pressing force from the adhesive sheet toward the work and a second pressing force from the work toward the adhesive sheet are applied to the sheet complex in a state in which an entirety of a surface of the work on a side opposite to the ring-shaped protrusion formation surface is in contact with a space.

2. The adhesive sheet attaching method according to claim 1, characterized by comprising a housing process in which the sheet complex is housed in a chamber, the attaching process is a process in which the adhesive sheet is attached to the ring-shaped protrusion formation surface by increasing a pressure of an inner space of the chamber after the housing process.

3. The adhesive sheet attaching method according to claim 2, characterized in that the chamber comprises an upper case and a lower case, the attaching process comprises: an upper-and-lower-space forming process in which the inner space of the chamber is divided into a lower space in which the work in a state in which the ring-shaped protrusion formation surface faces upward is disposed and an upper space opposite to the lower space with the adhesive sheet interposed therebetween by sandwiching the adhesive sheet with the upper case and the lower case; and a space pressurizing process in which the adhesive sheet is attached to the ring-shaped protrusion formation surface by pressurizing at least the upper space of the upper space and the lower space.

4. The adhesive sheet attaching method according to claim 2, characterized in that the adhesive sheet has a predetermined shape corresponding to the ring-shaped protrusion formation surface of the work and is held by a long strip-shaped conveyance sheet, the chamber comprises an upper case and a lower case, the attaching process comprises: an upper-and-lower-space forming process in which the inner space of the chamber is divided into a lower space in which the work in a state in which the ring-shaped protrusion formation surface faces upward is disposed and an upper space opposite to the lower space with the adhesive sheet held by the conveyance sheet interposed therebetween by sandwiching the conveyance sheet with the upper case and the lower case; and a space pressurizing process in which the adhesive sheet is attached to the ring-shaped protrusion formation surface by pressurizing at least the upper space of the upper space and the lower space.

5. The adhesive sheet attaching method according to claim 3, characterized by comprising a sheet-shaped elastic body provided in an inner portion of the upper case, the sheet-shaped elastic body is provided so as to abut against the adhesive sheet by sandwiching the adhesive sheet with the upper case and the lower case in the upper-and-lower-space forming process.

6. The adhesive sheet attaching method according to any one of claims 3 to 5, characterized in that ​ ​ ​ ​ ​ ​ ​ The adhesive sheet attaching method includes a heating process in which the adhesive sheet is heated by heating at least one of the lower space and the upper space, In the attaching process, a pressure higher than the atmospheric pressure is applied to the adhesive sheet in the state heated by the heating process, thereby attaching the adhesive sheet to the annular projection formation surface.

7. An adhesive sheet attaching apparatus characterized by comprising: The adhesive sheet attaching apparatus includes an attaching mechanism that attaches an adhesive sheet to an annular projection formation surface of a work having an annular projection on an outer periphery of one surface by applying a pressure higher than the atmospheric pressure to a sheet complex constituted by the adhesive sheet attached to the annular projection formation surface of the work, The attaching mechanism applies a first pressing force from the adhesive sheet toward the work and a second pressing force from the work toward the adhesive sheet to the sheet complex in a state in which the entire surface of the work on the side opposite to the annular projection formation surface is in contact with a space.

8. A method of manufacturing a semiconductor product for manufacturing a semiconductor product in a state in which an adhesive sheet is attached to an annular projection formation surface of a work having an annular projection on an outer periphery of one surface, the method of manufacturing a semiconductor product characterized by comprising: The method of manufacturing a semiconductor product includes an attaching process in which the adhesive sheet is attached to the annular projection formation surface of the work by applying a pressure higher than the atmospheric pressure to a sheet complex constituted by the adhesive sheet attached to the annular projection formation surface of the work, In the attaching process, a first pressing force from the adhesive sheet toward the work and a second pressing force from the work toward the adhesive sheet are applied to the sheet complex in a state in which the entire surface of the work on the side opposite to the annular projection formation surface is in contact with a space.

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