Plasma equipment

Abstract

The present invention relates to a plasma device, which includes a plasma generating component, an airflow guiding structure and an air intake component, wherein the plasma generating component includes two plasma electrodes. The two plasma electrodes arranged at intervals form a plasma chamber so that the plasma chamber can form a plasma field. When the air intake component takes in air into the plasma chamber through an air inlet, the gas is ionized in the plasma chamber to form plasma gas. Since the airflow guiding structure is arranged at the air inlet, the diverter hole on the airflow guiding structure is connected with the plasma chamber, and then when the air intake component takes in air into the plasma chamber through the airflow guiding structure, it needs to be drained through the diverter hole. The diverter hole on the airflow guiding structure is used to guide and drain the airflow ejected from the air intake component, so that the airflow can be more evenly distributed in the plasma chamber after passing through the diverter hole, thereby improving the efficiency of plasma generation and thus improving the efficiency of plasma treatment.

Description

Technical Field

[0001] The invention relates to the field of plasma technology, in particular to plasma equipment. Background Art

[0002] Plasma treatment equipment is widely used in plasma cleaning, etching, plasma plating, plasma coating, plasma ashing, surface activation, modification, etc. However, in traditional plasma treatment equipment, when gas enters the plasma space formed between two electrodes, the gas flow is unevenly distributed between the two electrodes, which leads to uneven distribution of plasma between the two electrodes, and the gas can only be partially ionized between the electrodes, resulting in low efficiency in generating plasma, which reduces the efficiency of plasma treatment. Summary of the invention

[0003] In view of the above problems, the present invention proposes a plasma device which can improve the uniformity of gas distribution and thus improve the efficiency of plasma processing.

[0004] A plasma device, comprising a plasma generating component, an airflow guiding structure and an air intake component, wherein the plasma generating component comprises two plasma electrodes, the two plasma electrodes are arranged at intervals, and the space between the two plasma electrodes forms a plasma chamber, and the interval between the side edges of the two plasma electrodes forms an air intake port connected to the plasma chamber; at least two diversion holes are provided on the airflow guiding structure, each of the diversion holes is arranged at intervals, and the airflow guiding structure is arranged at the air intake port to connect the diversion holes with the plasma chamber; the air intake component is arranged on a side of the airflow guiding structure that is opposite to the plasma chamber, and the air intake component can intake air into the plasma chamber through the diversion holes.

[0005] In one embodiment, the airflow guiding structure is disposed between the two plasma electrodes, and a distance exists between a side of the airflow guiding structure facing the plasma electrode and the plasma electrode.

[0006] In one embodiment, the air intake assembly includes at least two air intake ducts, at least two of which are arranged on a side of the air flow guiding structure facing away from the plasma chamber, and at least one pair of the air intake ducts is located in a gap between the air flow guiding structure and one of the plasma electrodes, and at least another pair of the air intake ducts is located in a gap between the air flow guiding structure and another of the plasma electrodes.

[0007] In one embodiment, there are a plurality of the diverter holes, the plurality of the diverter holes are arranged at intervals, and an arrangement direction of the plurality of the diverter holes intersects with a direction from one plasma electrode toward another plasma electrode.

[0008] In one embodiment, the size of the diversion hole is negatively correlated with the air flow velocity at the location of the diversion hole.

[0009] In one embodiment, the distribution density of each of the diverter holes on the airflow guiding structure is negatively correlated with the airflow velocity at the location of the diverter holes.

[0010] In one of the embodiments, the surface of the airflow guiding structure facing the air intake assembly is a smooth plane or a smooth curved surface.

[0011] In one of the embodiments, the plasma equipment further includes a loading frame, wherein the loading frame is disposed in the plasma chamber and spaced apart from the plasma electrode, a loading slot is formed in the loading frame, and the loading slot penetrates the loading frame to form a connecting port on one side facing the air inlet, and the airflow guiding structure is disposed on the connecting port of the loading frame and covers the connecting port so that the diversion hole is connected with the loading slot.

[0012] In one embodiment, the size of the communication port is larger than the size of the diversion hole.

[0013] In one of the embodiments, the plasma equipment further comprises a plasma box, the plasma electrode is arranged in the plasma box, the air inlet is formed on the top wall of the plasma chamber, and the air inlet assembly is arranged on the top wall of the plasma box.

[0014] In the above-mentioned plasma equipment, two plasma electrodes arranged at intervals form a plasma chamber, so that the plasma chamber can form a plasma field. When the air intake component takes in air into the plasma chamber through the air inlet, the gas is ionized in the plasma chamber to form plasma gas. Since the airflow guiding structure is arranged at the air inlet, the diverter hole on the airflow guiding structure is connected with the plasma chamber, and then when the air intake component takes in air into the plasma chamber through the airflow guiding structure, it needs to be drained through the diverter hole. The diverter hole on the airflow guiding structure is used to guide and drain the airflow ejected from the air intake component, so that the airflow can be more evenly distributed in the plasma chamber after passing through the diverter hole, thereby improving the efficiency of plasma generation and thus improving the efficiency of plasma treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the various elements are drawn only as examples in the drawings and are not necessarily drawn according to the true scale.

[0018] Figure 1 is a top view of a plasma device in one embodiment;

[0019] Figure 2 for Figure 1 A schematic diagram of a partial structure of the plasma device;

[0020] Figure 3 for Figure 2 A side view of the airflow guiding structure in FIG.

[0021] Figure 4 for Figure 3 A top view of the airflow guiding structure shown;

[0022] Figure 5 for Figure 3 The enlarged view of point A in the middle;

[0023] Figure 6 for Figure 1 Enlarged view of point B in the middle.

[0024] Description of reference numerals:

[0025] 10. Plasma equipment; 100. Plasma generating assembly; 110. Plasma electrode; 120. Plasma chamber; 130. Air inlet; 200. Air flow guiding structure; 210. Diverter hole; 220. Mounting portion; 222. Mounting hole; 230. Abutment portion; 300. Air inlet assembly; 310. Air inlet duct; 400. Material placement frame; 410. Material placement slot; 500. Plasma box. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0027] See also Figures 1 to 3 The plasma device 10 in one embodiment of the present invention is used to implement plasma processing. Specifically, the plasma device 10 includes a plasma generating component 100 , an airflow guiding structure 200 and an air intake component 300 . The plasma generating assembly 100 includes two plasma electrodes 110, the two plasma electrodes 110 are arranged at intervals, and the space between the two plasma electrodes 110 forms a plasma chamber 120, and the interval between the side edges of the two plasma electrodes 110 forms an air inlet 130 connected to the plasma chamber 120; at least two diversion holes 210 are opened on the air flow guiding structure 200, and each of the diversion holes 210 is arranged at intervals, and the air flow guiding structure 200 is arranged at the air inlet 130 so that the diversion holes 210 are connected to the plasma chamber 120; the air intake assembly 300 is arranged on the side of the air flow guiding structure 200 that is away from the plasma chamber 120, and the air intake assembly 300 can intake air into the plasma chamber 120 through the diversion holes 210.

[0028] When the air intake component 300 takes in air into the plasma chamber 120 through the air intake port 130, the gas is ionized in the plasma chamber 120 to form plasma gas. Since the airflow guiding structure 200 is arranged at the air intake port 130, the diverter hole 210 on the airflow guiding structure 200 is connected with the plasma chamber 120, and then when the air intake component 300 takes in air into the plasma chamber 120 through the airflow guiding structure 200, it needs to be guided by the diverter hole 210. The diverter hole 210 on the airflow guiding structure 200 is used to guide and drain the airflow ejected from the air intake component 300, so that the airflow can be more evenly distributed in the plasma chamber 120 after passing through the diverter hole 210, thereby improving the efficiency of plasma generation and thus improving the efficiency of plasma treatment.

[0029] See also Figure 2 and Figure 3 In one embodiment, the airflow guiding structure 200 is disposed between the two plasma electrodes 110, and a gap exists between the side of the airflow guiding structure 200 facing the plasma electrode 110 and the plasma electrode 110. Specifically, the two opposite side walls of the airflow guiding structure 200 are spaced apart from the opposite plasma electrodes 110. When the air intake assembly 300 inhales air through the side of the airflow guiding structure 200 facing away from the plasma chamber 120, a part of the airflow can enter the plasma chamber 120 through the diverter hole 210 of the airflow guiding structure 200, and the other part can enter the plasma chamber 120 through the gap between the airflow guiding structure 200 and the plasma electrode 110.

[0030] In the present embodiment, the plasma electrode 110 is a plate-like structure, and the plate surfaces of the two plasma electrodes 110 are spaced relative to each other, thereby forming a flat box-shaped plasma chamber 120. The air inlet 130 is formed at one side of the two plasma electrodes 110. The airflow guiding structure 200 is a strip-like structure, and the long side of the airflow guiding structure 200 is opposite to the plasma electrode 110, so that the airflow guiding structure 200 and the plasma electrode 110 are spaced apart. When the airflow reaches the side of the airflow guiding structure 200 facing away from the plasma chamber 120, the airflow can be divided into three parts, wherein two parts of the airflow enter the plasma chamber 120 through the gaps between the airflow guiding structure 200 and the plasma electrode 110 on both sides, and the workpiece to be processed is arranged in the plasma chamber 120, so that the two parts of the airflow distribution are located on the opposite sides of the workpiece to be processed. The other part enters the plasma chamber 120 through the diversion hole 210, which can be understood as entering the plasma chamber 120 from the top wall side of the workpiece to be processed. This part of the airflow can be evenly diffused to the two opposite surfaces of the workpiece to be processed, further evenly distributing the uniformity of the airflow on the two opposite surfaces of the workpiece to be processed.

[0031] In other embodiments, there may be no gap between the airflow guiding structure 200 and the plasma electrode 110 , and the airflow enters the plasma chamber 120 through the diversion hole 210 of the airflow guiding structure 200 .

[0032] In this embodiment, the air intake assembly 300 includes at least two air intake ducts 310, and at least two of the air intake ducts 310 are disposed on a side of the airflow guiding structure 200 that faces away from the plasma chamber 120, and at least one of the air intake ducts 310 is located in the gap between the airflow guiding structure 200 and one of the plasma electrodes 110, and at least another of the air intake ducts 310 is located in the gap between the airflow guiding structure 200 and another of the plasma electrodes 110. By disposing at least two air intake ducts 310 that are respectively located in the gaps between the airflow guiding structure 200 and the two plasma electrodes 110, the air intake efficiency and air intake uniformity can be further improved.

[0033] In other embodiments, the air inlet pipe 310 may also be aligned with the airflow guiding structure 200 so that the gas ejected from the air inlet pipe 310 is aligned with the airflow guiding structure 200 to facilitate the airflow to enter the plasma chamber 120 through the diverter hole 210 .

[0034] In this embodiment, there are a plurality of the diverter holes 210, the plurality of the diverter holes 210 are arranged at intervals, and the arrangement direction of the plurality of the diverter holes 210 intersects with the direction from one plasma electrode 110 to another plasma electrode 110. Since a plasma chamber 120 is formed between the two plasma electrodes 110, by arranging the plurality of diverter holes 210, it is convenient to more evenly divert the airflow to different positions of the plasma chamber 120, and further improve the uniformity of the airflow entering the plasma chamber 120.

[0035] Specifically, the airflow guiding structure 200 is a strip structure, and the plurality of diverter holes 210 are arranged at intervals along the length direction of the airflow guiding structure 200. In this embodiment, since the plasma chamber 120 is a flat box-shaped cavity, the plurality of diverter holes 210 are arranged at intervals along the length direction of the plasma chamber 120, which facilitates uniform airflow in the length direction and improves the uniformity of the airflow in the plasma chamber 120.

[0036] In other embodiments, some of the diverter holes 210 may also be arranged along a direction from one plasma electrode 110 toward another plasma electrode 110 . Specifically, some of the diverter holes 210 may also be arranged along a width direction of the plasma chamber 120 .

[0037] In one embodiment, the size of the diverter hole 210 is negatively correlated with the airflow velocity at the location of the diverter hole 210. When the airflow velocity is high, the size of the diverter hole 210 at that location is reduced to reduce the airflow entering the plasma chamber 120 through the diverter hole 210 at that location; and when the airflow velocity is low, the size of the diverter hole 210 at that location is increased to allow more airflow to enter the plasma chamber 120 through the diverter hole 210. By reducing the size of the diverter hole 210 at a location with a high airflow velocity and reducing the size of the diverter hole 210 at a location with a low airflow velocity, a balanced airflow entering the plasma chamber 120 through each diverter hole 210 is achieved.

[0038] Specifically, the airflow guiding structure 200 is divided into at least two different parts according to the size of the airflow velocity at different positions corresponding to the airflow guiding structure 200, and the size of the diverter hole 210 on each part corresponds to the average airflow velocity corresponding to the part. For example, the airflow guiding structure 200 is divided into three parts along its length direction, and the size of the diverter hole 210 on each part corresponds to the average airflow velocity corresponding to the part. By dividing the airflow guiding structure 200 into different parts, it is easy to reduce the difficulty of processing the diverter hole 210. Figure 3As shown, at a location where the airflow velocity is relatively high, the number of corresponding diverter holes 210 is multiple, and the multiple diverter holes 210 are arranged at intervals, and the diverter holes 210 can be round holes, and the diameter of a single diverter hole 210 is 1mm-24.5mm; at a location where the airflow velocity is relatively high, the number of diverter holes 210 can be one, two, or other numbers, and the diverter holes 210 can be bar holes, and different diverter holes 210 are arranged at intervals along their length direction, wherein the length of a single diverter hole 210 can be 10mm-1320.8mm, and the width of a single diverter hole 210 can be 1mm-24.5mm. Of course, in other embodiments, the size of the diverter hole 210 can also be set according to the airflow velocity and the size between the plasma electrodes 110.

[0039] In other embodiments, the airflow guiding structure 200 may not be divided into regions, and the sizes of the diverter holes 210 at different locations are directly related to the airflow velocity at the corresponding locations. In this embodiment, the spacing between the diverter holes 210 may be consistent. In other embodiments, the spacing between the diverter holes 210 may be inconsistent.

[0040] In another embodiment, the distribution density of each of the diverter holes 210 on the airflow guiding structure 200 is negatively correlated with the airflow velocity at the location of the diverter holes 210. When the airflow velocity is high, the distribution density of the diverter holes 210 is reduced so as to reduce the amount of airflow entering the plasma chamber 120 through the diverter holes 210. When the airflow velocity is low, the distribution density of the diverter holes 210 is increased so as to increase the amount of airflow entering the plasma chamber 120 through the diverter holes 210, thereby achieving the purpose of uniform airflow in the plasma chamber 120. In this embodiment, the sizes of each of the diverter holes 210 can be consistent. In other embodiments, the sizes of each of the diverter holes 210 can also be inconsistent.

[0041] In one embodiment, the surface of the airflow guiding structure 200 facing the air intake component 300 is a smooth plane. Since the air intake component 300 sprays air onto the airflow guiding structure 200, by setting the surface of the airflow guiding structure 200 facing the air intake component 300 to be a smooth plane, the surface of the airflow guiding structure 200 facing the air intake component 300 is prevented from interfering with the airflow.

[0042] Optionally, the surface of the airflow guiding structure 200 facing the air intake assembly 300 is a smooth arc surface. Alternatively, the surface of the airflow guiding structure 200 facing the air intake assembly 300 can also be a smooth curved surface, which is concave toward the direction of the diverter hole 210 to facilitate guiding the airflow into the diverter hole 210.

[0043] In this embodiment, the airflow guiding structure 200 is a metal part. For example, the airflow guiding structure 200 can be an aluminum alloy part. In other embodiments, the airflow guiding structure 200 can also be an injection molded part or other structural parts.

[0044] See also Figure 1 and Figure 2 In one embodiment, the plasma device 10 further includes a material placement frame 400, which is disposed in the plasma chamber 120 and spaced apart from the plasma electrode 110, and a material placement slot 410 is formed in the material placement frame 400. When in use, the workpiece to be processed can be placed in the material placement slot 410 to achieve a stable placement of the workpiece to be processed in the plasma chamber 120.

[0045] In this embodiment, the material placement frame 400 is open at one side facing the plasma electrode 110 , so as to facilitate the distribution of the airflow between the material placement frame 400 and the plasma electrons on the workpiece to be processed.

[0046] Specifically, the material placement slot 410 penetrates the material placement frame 400 on one side facing the air inlet 130 to form a communication port, and the airflow guiding structure 200 is disposed on the communication port of the material placement frame 400 and covers the communication port, so that the diverter hole 210 is connected to the material placement slot 410. By disposing the airflow guiding structure 200 on the material placement frame 400, the material placement frame 400 can provide support for the airflow guiding structure 200, and the airflow can enter the material placement slot 410 through the diverter hole 210 and the communication port, so that the airflow is distributed to the workpiece to be processed.

[0047] In this embodiment, the size of the communication port is larger than the size of the diverter hole 210. Since the airflow enters the plasma chamber 120 from the diverter hole 210 through the communication port, by making the size of the communication port larger than the size of the diverter hole 210, the communication port is prevented from affecting the diverter hole 210 in guiding the airflow.

[0048] The conventional plasma equipment 10 has no connecting opening formed on the material loading frame 400, and no airflow guiding structure 200 is provided. The airflow can only enter the plasma chamber 120 through the gap between the material loading frame 400 and the plasma electrode 110. When the airflow passes through the air inlet 130 of the plasma chamber 120, it will encounter obstruction of the side of the material loading frame 400, which not only affects the uniformity of the airflow, but also causes the airflow to enter the plasma chamber 120 in a low efficiency. By providing the above-mentioned airflow guiding structure 200, the airflow can enter the plasma chamber 120 through the diverter hole 210, thereby improving the efficiency of the airflow entering the plasma chamber 120. At the same time, the diverter effect of the diverter hole 210 is utilized to improve the uniformity of the airflow, so as to generate uniform plasma gas, increase the plasma processing uniformity of the workpiece to be processed, and improve the processing efficiency.

[0049] See also Figure 2 , Figure 5 and Figure 6 In this embodiment, the airflow guide structure 200 is a strip-shaped structure, and mounting parts 220 are formed on both ends of the strip-shaped airflow guide structure 200. The mounting parts 220 are mounted on the material loading frame 400, and the diversion hole 210 is located between the two mounting parts 220, and the communication port is located between the two mounting parts 220. Specifically, a mounting hole 222 is provided on the mounting part 220, and a matching hole is provided on the material loading frame 400, and the mounting hole 222 can be connected with the matching hole. Connecting screws are inserted into the mounting hole 222 and the matching hole to enable the airflow guide structure 200 to be mounted on the material loading frame 400.

[0050] In other embodiments, the airflow guiding structure 200 may also be integrally formed on the material placement frame 400 .

[0051] See also Figure 1 and Figure 2 In one embodiment, the plasma device 10 further includes a plasma box 500, the plasma electrode 110 is disposed in the plasma box 500, the air inlet 130 is formed on the top wall of the plasma chamber 120, and the air inlet assembly 300 is disposed on the top wall of the plasma box 500. The plasma box 500 is provided to facilitate accommodating the plasma electrode 110 and the air flow guide structure 200, and facilitate the installation of the air inlet assembly 300, thereby providing a stable environment for processing the workpiece to be processed.

[0052] In this embodiment, there are multiple plasma generating assemblies 100 , which are arranged in parallel and at intervals, and each plasma generating assembly 100 is correspondingly provided with an airflow guiding structure 200 .

[0053] See also Figure 2 , Figure 5 and Figure 6 Specifically, a mounting portion 220 of the airflow guiding structure 200 is formed with an abutting portion 230 on one end facing away from the other mounting portion 220, and the abutting portion 230 can abut against the inner wall of the plasma box 500 to limit the position of the airflow guiding structure 200 in the plasma box 500 and ensure the stability of the guided airflow. Furthermore, a matching portion can be formed on the inner wall of the plasma box 500, and the abutting portion 230 can be limitedly matched with the matching portion. In other embodiments, the abutting portion 230 can also be omitted.

[0054] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0057] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0058] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0060] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

Claims

1. A plasma device, characterized in that: The plasma equipment comprises: A plasma generating assembly, wherein the plasma generating assembly comprises two plasma electrodes, the two plasma electrodes are arranged at an interval, and the space between the two plasma electrodes forms a plasma cavity, and the interval between one side of the two plasma electrodes forms an air inlet connected to the plasma cavity; An airflow guiding structure, wherein at least two flow diversion holes are formed on the airflow guiding structure, and each of the flow diversion holes is arranged at intervals, and the airflow guiding structure is arranged at the air inlet so that the flow diversion holes are connected to the plasma chamber; An air intake component, the air intake component is arranged on a side of the airflow guiding structure facing away from the plasma chamber, and the air intake component can intake air into the plasma chamber through the diverter hole; It also includes a material loading frame, the material loading frame is arranged in the plasma chamber and is spaced apart from the plasma electrode, a material loading slot is formed in the material loading frame, the material loading slot penetrates the material loading frame toward the air inlet to form a communication port, the airflow guiding structure is arranged on the communication port of the material loading frame and covers the communication port, so that the diversion hole is connected with the material loading slot; Among them, the plasma electrode is a plate-like structure, and the plate surfaces of the two plasma electrodes are spaced relative to each other to form a flat box-shaped plasma chamber; the air inlet is formed at one side of the two plasma electrodes; the airflow guiding structure is a strip-like structure, and the long side of the airflow guiding structure is opposite to the plasma electrode, so as to facilitate the spacing of the airflow guiding structure and the plasma electrode; when the airflow reaches the side of the airflow guiding structure facing away from the plasma chamber, the airflow can be divided into three parts, of which two parts of the airflow enter the plasma chamber through the gap between the airflow guiding structure and the plasma electrodes on both sides, and the workpiece to be processed is arranged in the plasma chamber, so that the two parts of the airflow are distributed on the opposite sides of the workpiece to be processed, and the other part enters the plasma chamber through the diversion hole, and the part of the airflow can be evenly diffused to the two opposite surfaces of the workpiece to be processed, and the uniformity of the airflow on the two opposite surfaces of the workpiece to be processed is further uniform.

2. The plasma device according to claim 1, characterized in that: The airflow guiding structure is arranged between the two plasma electrodes, and a distance exists between the side of the airflow guiding structure facing the plasma electrode and the plasma electrode.

3. The plasma device according to claim 2, characterized in that: The air intake assembly includes at least two air intake ducts, at least two of which are arranged on a side of the airflow guiding structure facing away from the plasma chamber, and at least one of the air intake duct pairs is located in a gap between the airflow guiding structure and one of the plasma electrodes, and at least another of the air intake duct pairs is located in a gap between the airflow guiding structure and another of the plasma electrodes.

4. The plasma device according to claim 1, characterized in that: There are a plurality of the diverter holes, the plurality of the diverter holes are arranged at intervals, and an arrangement direction of the plurality of the diverter holes intersects with a direction from one plasma electrode toward another plasma electrode.

5. The plasma device according to claim 4, characterized in that: The size of the diversion hole is negatively correlated with the air flow velocity at the location of the diversion hole.

6. The plasma device according to claim 4, characterized in that: The distribution density of each of the diverter holes on the airflow guiding structure is negatively correlated with the airflow velocity at the location of the diverter holes.

7. The plasma device according to any one of claims 1 to 6, characterized in that: The surface of the airflow guiding structure facing the air intake assembly is a smooth plane or a smooth curved surface.

8. The plasma device according to claim 1, characterized in that: The size of the communication port is larger than the size of the diversion hole.

9. The plasma device according to any one of claims 1 to 6, characterized in that: It also includes a plasma box, the plasma electrode is arranged in the plasma box, the air inlet is formed on the top wall of the plasma chamber, and the air inlet component is arranged on the top wall of the plasma box.

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