Resin composition

Abstract

The present invention provides a resin composition that can provide a cured product having a low relative dielectric constant (Dk) and a low dielectric loss tangent (Df). The present invention is a resin composition comprising: (A) a polystyrene resin containing a cyclic imino ether skeleton, (B) a curing agent, and (C) an inorganic filler.

Description

Technical Field

[0001] This invention relates to resin compositions comprising polystyrene resin. It further relates to cured products, sheet-like laminates, resin sheets, printed wiring boards, and semiconductor devices obtained using the resin compositions. Background Technology

[0002] As a manufacturing technology for printed circuit boards, a manufacturing method based on the stacking of alternating insulating and conductor layers is known. In stacking-based manufacturing methods, the insulating layer is typically formed by curing a resin composition. In recent years, the miniaturization and high performance of electronic devices have led to higher signal frequencies, requiring a reduction in the dielectric constant and dielectric loss tangent of the insulating layers in multilayer printed circuit boards.

[0003] It should be noted that resin compositions containing polystyrene resins with cyclic imine ether backbones were previously known (Patent Document 1).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent document 1: Japanese Patent Application Publication No. 2017-36353. Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] The objective of this invention is to provide a resin composition for obtaining a cured product in which the relative permittivity (Dk) and dielectric loss tangent (Df) are suppressed to a low level.

[0009] Methods for solving problems

[0010] In order to achieve the objectives of this invention, the inventors conducted in-depth research and found that by using a resin composition comprising (A) a polystyrene resin containing a cyclic imine ether skeleton, (B) a curing agent, and (C) an inorganic filler, it was unexpected to obtain a cured product in which the relative permittivity (Dk) and dielectric loss tangent (Df) were suppressed to a low level, thereby completing this invention.

[0011] That is, the present invention includes the following:

[0012] [1] A resin composition comprising: (A) a polystyrene resin containing a cyclic imine ether backbone, (B) a curing agent, and (C) an inorganic filler;

[0013] [2] The resin composition according to [1] above, wherein component (A) comprises: a polystyrene resin containing an oxazoline backbone;

[0014] [3] According to the resin composition described in [1] or [2] above, wherein component (A) comprises: a resin having repeating units represented by formula (1) and repeating units represented by formula (2).

[0015] [Chemical Formula 1]

[0016]

[0017] [In the formula, R] 11 R 12 and R 13 Each can independently represent a hydrogen atom or a substituent; R 14 Each represents a substituent independently; a represents an integer from 0 to 5.

[0018] [Chemical Formula 2]

[0019]

[0020] [In the formula, R] 21 R 22 and R 23 Each can independently represent a hydrogen atom or a substituent; R 24 Each element independently represents a substituent; X represents a single bond or a linking group; b represents an integer from 0 to 4; n represents an integer from 1 to 4.

[0021] [4] The resin composition according to any one of [1] to [3] above, wherein when the non-volatile component in the resin composition is set to 100% by mass, the content of component (A) is 50% by mass or less;

[0022] [5] The resin composition according to any one of [1] to [4] above, wherein component (B) comprises a curing agent selected from (B-1) phenolic curing agent, (B-2) acid anhydride curing agent and (B-3) carboxylic acid curing agent;

[0023] [6] The resin composition according to any one of [1] to [5] above, wherein the molar equivalent ratio of the reactive group of component (B) to the cyclic imine ether skeleton of component (A) (reactive group of component (B) / cyclic imine ether skeleton of component (A)) is 1 or less;

[0024] [7] The resin composition according to any one of [1] to [6] above, wherein the mass ratio of component (B) to component (A) (component (B) / component (A)) is 0.01 to 1;

[0025] [8] The resin composition according to any one of [1] to [7] above, wherein component (C) is silicon dioxide;

[0026] [9] The resin composition according to any one of [1] to [8] above, wherein when the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 40% by mass or more;

[0027]

[10] The resin composition according to any one of [1] to [9] above, wherein when the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 70% by mass or less;

[0028]

[11] The resin composition according to any one of [1] to

[10] above, wherein the mass ratio of component (C) to component (A) (component (C) / component (A)) is 0.5 to 10;

[0029]

[12] The resin composition according to any one of [1] to

[11] above, wherein it further comprises (D) epoxy resin;

[0030]

[13] The resin composition according to any one of [1] to

[12] above, wherein it further comprises (G) benzocyclobutene resin;

[0031]

[14] The resin composition according to any one of [1] to

[13] above, wherein, when measured at 5.8 GHz and 23 °C, the dielectric loss tangent of the cured resin composition (curing temperature of 200 °C) is 0.004 or less;

[0032]

[15] The resin composition according to any one of [1] to

[14] above, wherein, when measured at 5.8 GHz and 23 °C, the relative permittivity of the cured resin composition (curing temperature of 200 °C) is 3.0 or less;

[0033]

[16] The resin composition according to any one of [1] to

[15] above is used to form an insulating layer of a printed wiring board;

[0034]

[17] A cured product, which is a cured product of the resin composition described in any one of [1] to

[16] above;

[0035]

[18] A sheet-like laminated material containing any of the resin compositions described in any one of [1] to

[16] above;

[0036]

[19] A resin sheet having a support body and a resin composition layer formed of any one of the resin compositions described in [1] to

[16] disposed on the support body;

[0037]

[20] A printed wiring board having an insulating layer formed from a cured product of the resin composition described in any one of [1] to

[16] above;

[0038]

[21] A semiconductor device comprising the printed wiring board described in

[20] above.

[0039] The effects of the invention

[0040] According to the resin composition of the present invention, a cured product with a low relative permittivity (Dk) and dielectric loss tangent (Df) can be obtained. Detailed Implementation

[0041] The present invention will now be described in detail according to its preferred embodiments. However, the present invention is not limited to the following embodiments and examples, and can be implemented in any way without departing from the scope of the claims and their equivalents.

[0042] <Resin Composition>

[0043] The resin composition of the present invention comprises (A) a polystyrene resin containing a cyclic imine ether backbone, (B) a curing agent, and (C) an inorganic filler. By using such a resin composition, a cured product with a low relative permittivity (Dk) and dielectric loss tangent (Df) can be obtained.

[0044] The resin composition of the present invention may contain any components in addition to (A) a polystyrene resin containing a cyclic imine ether backbone, (B) a curing agent, and (C) an inorganic filler. Examples of such components include (D) an epoxy resin, (E) an epoxy curing agent, (F) an epoxy curing accelerator, (G) a benzocyclobutene resin, (H) other additives, and (I) an organic solvent. The components contained in the resin composition will be described in detail below.

[0045] <(A) Polystyrene resin containing a cyclic imine ether backbone>

[0046] The resin composition of the present invention contains (A) a polystyrene resin containing a cyclic imine ether backbone. Component (A) may be used alone or in combination of two or more.

[0047] The term "cyclic iminoether skeleton" refers to a cyclic skeleton having the structural unit "-N=CR-O-". In one embodiment, component (A) can be a resin obtained by directly or indirectly (preferably directly) bonding the R in the structural unit "-N=CR-O-" to the main chain of a polystyrene resin, either directly or through a linking group. As a cyclic iminoether skeleton, for example, it can be a monocyclic cyclic iminoether skeleton. Specifically, examples include five- to eight-membered (preferably five- or six-membered) monocyclic cyclic iminoether skeletons such as the 2-oxazoline skeleton (hereinafter referred to as "oxazoline skeleton") and the 5,6-dihydro-4H-1,3-oxazine skeleton. In one embodiment, the oxazoline skeleton is preferred. Therefore, in one embodiment, component (A) preferably comprises a polystyrene resin containing an oxazoline skeleton.

[0048] In one embodiment, (A) the polystyrene resin containing a cyclic imine ether backbone is not particularly limited, and may be, for example, a copolymer of monomers containing "an olefinic unsaturated monomer having a cyclic imine ether backbone" and "a styrene monomer".

[0049] Examples of vinyl-based unsaturated monomers with a cyclic imine ether skeleton include: 2-isopropenyl-2-oxazoline, 5-methyl-2-isopropenyl-2-oxazoline, 4,4-dimethyl-2-isopropenyl-2-oxazoline, 4-methyl-2-isopropenyl-2-oxazoline, 4,4,5-trimethyl-2-isopropenyl-2-oxazoline, 2-vinyl-2-oxazoline, 5-methyl-2-vinyl-2-oxazoline, 4,4-dimethyl-2-vinyl-2-oxazoline, 4-methyl-2-vinyl-2-oxazoline, and 4,4,5-trimethyl-2-vinyl-2-oxazoline. Monomers with the oxazoline skeleton; 2-isopropenyl-5,6-dihydro-4H-1,3-oxazine, 6-methyl-2-isopropenyl-5,6-dihydro-4H-1,3-oxazine, 4,4-dimethyl-2-isopropenyl-5,6-dihydro-4H-1,3-oxazine, 4-methyl-2-isopropenyl-5,6-dihydro-4H-1,3-oxazine, 4,4,6-trimethyl-2-isopropenyl-5,6-dihydro-4H-1,3-oxazine Monomers containing a vinyl dihydrooxazine skeleton, such as azines, 2-vinyl-5,6-dihydro-4H-1,3-oxazine, 6-methyl-2-vinyl-5,6-dihydro-4H-1,3-oxazine, 4,4-dimethyl-2-vinyl-5,6-dihydro-4H-1,3-oxazine, 4-methyl-2-vinyl-5,6-dihydro-4H-1,3-oxazine, and 4,4,6-trimethyl-2-vinyl-5,6-dihydro-4H-1,3-oxazine, are considered styrene monomers. Styrene monomers are monomers with a styrene skeleton, including monofunctional styrene monomers such as styrene, α-methylstyrene, 4-methylstyrene, 3-methylstyrene, 2-methylstyrene, 4-ethylstyrene, 4-tert-butylstyrene, 1-vinylnaphthalene, and 2-vinylnaphthalene; and polyfunctional styrene monomers such as p-divinylbenzene and m-divinylbenzene.

[0050] For polystyrene resins containing a cyclic imine ether backbone (A), copolymerization with other monomers is possible, in addition to olefinic unsaturated monomers and styrene monomers having a cyclic imine ether backbone. No particular limitations are placed on other monomers, and examples include: methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, pentyl methacrylate, hexyl methacrylate, heptyl methacrylate, octyl methacrylate, nonyl methacrylate, decyl methacrylate, norbornyl methacrylate, isobornyl methacrylate, adamantyl methacrylate, lauryl methacrylate, tetradecyl methacrylate, stearyl methacrylate, and methacrylate. Aliphatic (meth)acrylate monomers such as isoborneol ester, 2-ethylhexyl (meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate; aromatic (meth)acrylate monomers such as phenoxyethyl (meth)acrylate and phenoxydiethylene glycol (meth)acrylate. Acrylate monomers; hydroxyl-containing (meth)acrylate monomers such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; halogen-containing (meth)acrylate monomers such as 2,2,2-trifluoroethyl (meth)acrylate; olefinic unsaturated carboxylic acid ester monomers such as methyl cyano (meth)acrylate, ethyl cyano (meth)acrylate, propyl cyano (meth)acrylate, and isopropyl cyano (meth)acrylate; olefinic unsaturated carboxylic acid ester monomers such as (meth)acrylamide, maleimide, N-methylmaleimide, N-phenylmaleimide, and N,N'-ethylenebis(meth)acrylamide. The term "(meth)acrylate" refers to unsaturated carboxylic acid amide monomers; olefinic unsaturated carboxylic acid monomers such as (meth)acrylic acid, maleic acid, fumaric acid, and itaconic acid; olefinic unsaturated carboxylic anhydride monomers such as maleic anhydride; olefinic unsaturated nitrile monomers such as (meth)acrylonitrile; olefinic ester monomers such as vinyl acetate, vinyl propionate, allyl acetate, allyl propionate, vinyl butyrate, vinyl benzoate, diallyl phthalate, triallyl isocyanurate, triallyl cyanurate, diallyl maleate, divinyl adipate, and divinyl glutarate; olefinic ether monomers such as allyl ethyl ether, tetraallyloxyethane, and diallyl ether; and conjugated diene monomers such as butadiene and isoprene. "(meth)acrylate" includes both acrylates and methacrylates.The same applies to “(meth)acrylic acid”, “(meth)acrylamide”, and “(meth)acrylonitrile”.

[0051] In one embodiment, component (A) preferably comprises a resin having repeating units represented by formula (1) and repeating units represented by formula (2).

[0052] [Chemical Formula 3]

[0053]

[0054] [In the formula, R] 11 R 12 and R 13 Each can independently represent a hydrogen atom or a substituent; R 14 Each represents a substituent independently; a represents an integer from 0 to 5.

[0055] [Chemical Formula 4]

[0056]

[0057] [In the formula, R] 21 R 22 and R 23 Each can independently represent a hydrogen atom or a substituent; R 24 Each element represents a substituent independently; X represents a single bond or a linking group; b represents an integer from 0 to 4; n represents an integer from 1 to 4.

[0058] It should be noted that the order and arrangement of the repeating units represented by formula (1) and formula (2) are arbitrary, including alternating copolymers, block copolymers, random copolymers, etc. Furthermore, the repeating units represented by formula (1) and formula (2) may be the same or different. Additionally, the resin described above may further have any units other than the repeating units represented by formula (1) and formula (2).

[0059] There are no particular restrictions on the substituents. Examples of monovalent substituents include alkyl, alkenyl, aryl, alkyl-aryl (aryl group substituted with one or more alkyl groups), aryl-aryl (aryl group substituted with one or more aryl groups), aryl-alkyl (alkyl group substituted with one or more aryl groups), alkyl-oxy, alkenyl-oxy, aryl-oxy, alkyl-carbonyl, alkenyl-carbonyl, aryl-carbonyl, alkyl-oxy-carbonyl, alkenyl-oxy-carbonyl, aryl-oxy-carbonyl, alkyl-carbonyl-oxy, alkenyl-carbonyl-oxy, aryl-carbonyl-oxy, etc. Divalent substituents such as oxo (=O) may also be included, as long as they can be substituted.

[0060] The term "alkyl" refers to a straight-chain, branched, and / or cyclic monovalent saturated hydrocarbon group. Unless otherwise specified, alkyl groups are preferably alkyl groups with 1 to 14 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 6 carbon atoms. Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, cyclopentyl, cyclohexyl, methylcyclohexyl, dimethylcyclohexyl, trimethylcyclohexyl, cyclopentylmethyl, and cyclohexylmethyl. The term "alkenyl" refers to a straight-chain, branched, and / or cyclic monovalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond. Unless otherwise specified, alkenyl groups are preferably alkenyl groups with 2 to 14 carbon atoms, more preferably 2 to 10 carbon atoms, and even more preferably 2 to 6 carbon atoms. Examples of alkenyl groups include vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, and cyclohexenyl. An aryl group refers to a monovalent aromatic hydrocarbon group. The aryl group is preferably an aryl group with 6 to 14 carbon atoms. Examples of aryl groups include phenyl, 1-naphthyl, and 2-naphthyl.

[0061] There are no particular limitations on the linking group, and examples include alkylene, alkenylene group, arylene, -O-, -CO-, -S-, -SO-, -SO2-, -COO-, -OCO-, -CONH-, -NHCO-, and combinations thereof. The number of atoms in the main chain of the linking group is not particularly limited, and can be, for example, 1 to 100, preferably 1 to 50, more preferably 1 to 20, and even more preferably 1 to 10.

[0062] The term "alkylene" refers to a straight-chain, branched, or cyclic divalent saturated hydrocarbon group. Unless otherwise specified, alkylene groups are preferably alkylene groups with 1 to 14 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 6 carbon atoms. Examples of alkylene groups include -CH2-, -CH2-CH2-, -CH(CH3)-, -CH2-CH2-CH2-, -CH2-CH(CH3)-, -CH(CH3)-CH2-, -C(CH3)2-, and -CH2-CH2-CH2-CH2-. The term "alkenyl" refers to a straight-chain, branched, or cyclic divalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond. Unless otherwise specified, alkenyl groups are preferably alkenyl groups with 2 to 14 carbon atoms, more preferably 2 to 10 carbon atoms, and even more preferably 2 to 6 carbon atoms. Examples of arylene groups include -CH2=CH2-, -C(=CH2)-, -CH=CH-CH2-, and -CH2-CH=CH-. An arylene group refers to a divalent aromatic hydrocarbon group. Preferably, the arylene group has 6 to 14 carbon atoms. Examples of arylene groups include 1,4-phenylene, 1,3-phenylene, and 2,4-naphthylene.

[0063] R 11 R 12 and R 13 Each of the following independently represents a hydrogen atom or a substituent, preferably a hydrogen atom, an alkyl group, or an aryl group, more preferably a hydrogen atom or an alkyl group, and even more preferably a hydrogen atom. R 14 Each substituent is represented independently, preferably alkyl or aryl, more preferably alkyl, and even more preferably methyl. 'a' represents an integer from 0 to 5, preferably 0 to 2, and more preferably 0.

[0064] R 21 R 22 and R 23 Each of the substituents independently represents a hydrogen atom or a substituent, preferably a hydrogen atom, an alkyl group, or an aryl group, more preferably a hydrogen atom or an alkyl group, and even more preferably R. 21 and R 22 It is a hydrogen atom and R 23 It is an alkyl group, and R is particularly preferred. 21 and R 22 It is a hydrogen atom and R 23 It is methyl. R 24 Each group independently represents a substituent, preferably alkyl or aryl, more preferably alkyl, and even more preferably methyl. X represents a single bond or a linking group, preferably a single bond.

[0065] b represents an integer from 0 to 4, preferably from 0 to 3, more preferably 0 or 1, and even more preferably 0. n represents an integer from 1 to 4, preferably from 1 to 3, more preferably 1 or 2, and even more preferably 1.

[0066] In one embodiment, the repeating unit represented by formula (1) is preferably the repeating unit represented by formula (1').

[0067] [Chemical Formula 5]

[0068]

[0069] (A) The number of repeating units represented by formula (1) in a polystyrene resin molecule containing a cyclic imine ether backbone is not particularly limited, but is preferably 5 to 100,000, more preferably 5 to 10,000, and even more preferably 100 to 5,000.

[0070] In one embodiment, the repeating unit represented by equation (2) is preferably the repeating unit represented by equation (2').

[0071] [Chemical Formula 6]

[0072]

[0073] [In this formula, the symbols are the same as those in formula (2).]

[0074] The repeating unit represented by equation (2) is more preferably any repeating unit represented by equations (2”-1) to (2”-20).

[0075] [Chemical Formula 7]

[0076]

[0077] In one embodiment, the repeating unit represented by formula (2”-1) or (2”-6) is further preferred, and the repeating unit represented by formula (2”-1) is particularly preferred.

[0078] (A) The number of repeating units represented by formula (2) in a polystyrene resin molecule containing a cyclic imine ether backbone is not particularly limited, but is preferably 5 to 5000, more preferably 5 to 500, and even more preferably 10 to 100.

[0079] (A) The ratio of “number of repeating units represented by formula (1)” to “number of repeating units represented by formula (2)” in the polystyrene resin containing a cyclic imine ether skeleton (formula (1) unit / formula (2) unit) is not particularly limited, preferably 3 to 500, more preferably 10 to 100, and even more preferably 20 to 60.

[0080] (A) The weight-average molecular weight (Mw) of the polystyrene resin containing a cyclic imine ether backbone is not particularly limited, but is preferably 10,000 or more, more preferably 50,000 or more, and even more preferably 100,000 or more. (A) The upper limit of the weight-average molecular weight (Mw) of the polystyrene resin containing a cyclic imine ether backbone is not particularly limited, but is preferably 1,000,000 or less, more preferably 500,000 or less, and even more preferably 300,000 or less. (A) The weight-average molecular weight of the component can be determined by gel permeation chromatography (GPC) as a value converted to polystyrene.

[0081] (A) The cyclic imide content of the polystyrene resin containing the cyclic imide backbone is not particularly limited, but is preferably 0.03 mmol / g to 3.00 mmol / g, more preferably 0.05 mmol / g to 1.50 mmol / g, and even more preferably 0.10 mmol / g to 0.30 mmol / g. The cyclic imide content of component (A) is the amount of cyclic imide backbone per 1 g of component (A). The cyclic imide equivalent of the polystyrene resin containing the cyclic imide backbone is not particularly limited, but is preferably 300 g / eq. to 30000 g / eq., more preferably 1000 g / eq. to 10000 g / eq., and even more preferably 2000 g / eq. to 5000 g / eq. The cyclic imide equivalent of component (A) is the mass of resin per 1 equivalent of the cyclic imide backbone.

[0082] Commercially available products containing a cyclic imine ether backbone of polystyrene resin (A) include, for example, "EPOCROS RPS-1005" manufactured by Nippon Shokubai Co., Ltd.

[0083] The content of polystyrene resin (A) containing a cyclic iminoether backbone in the resin composition is not particularly limited. However, from the viewpoint of significantly obtaining the desired effect of the present invention, when the non-volatile component in the resin composition is set to 100% by mass, it is preferably 90% by mass or less, more preferably 70% by mass or less, and even more preferably 60% by mass or less. From the viewpoint of further suppressing the dielectric loss tangent to a low level, it is even more preferably 50% by mass or less, and particularly preferably 40% by mass or less. The lower limit of the content of polystyrene resin (A) containing a cyclic iminoether backbone in the resin composition is not particularly limited. However, from the viewpoint of significantly obtaining the desired effect of the present invention, when the non-volatile component in the resin composition is set to 100% by mass, it is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more.

[0084] <(B) Curing Agent>

[0085] The resin composition of the present invention contains a curing agent (B). The curing agent (B) can be used alone or in combination of two or more. In one embodiment, the curing agent (B) described herein has the function of curing the resin composition by reacting (e.g., an addition reaction) with at least (A) a polystyrene resin containing a cyclic imine ether backbone. Furthermore, regarding the curing agent (B), in one embodiment, when the resin composition contains (D) an epoxy resin or the like, it sometimes has the function of curing the resin composition by reacting not only with component (A) but also with component (D) or the like (e.g., an addition reaction).

[0086] There are no particular limitations on the curing agent (B), and examples include (B-1) phenol-based curing agents, (B-2) acid anhydride-based curing agents, (B-3) carboxylic acid-based curing agents, and (B-4) thiol-based curing agents. The curing agent (B) preferably includes a curing agent selected from (B-1) phenol-based curing agents, (B-2) acid anhydride-based curing agents, and (B-3) carboxylic acid-based curing agents.

[0087] (B-1) A phenolic curing agent is a curing agent having two or more phenolic hydroxyl groups in one molecule. Examples include: biphenyl-type phenolic curing agents, naphthyl-type phenolic curing agents, phenol novolak-type phenolic curing agents, naphthyl ether-type phenolic curing agents, phenolic curing agents containing a triazine skeleton, polyphenylene ether-type phenolic curing agents, phenolaralkyl-type phenolic curing agents, cresol novolak-type phenolic curing agents, bisphenol-type phenolic curing agents, etc. Among them, phenolic curing agents containing a triazine skeleton and polyphenylene ether-type phenolic curing agents are preferred.

[0088] Commercially available (B-1) phenolic curing agents include: biphenyl-type phenolic curing agents "MEH-7700", "MEH-7810", and "MEH-7851" (manufactured by Meiwa Kasei Corporation); naphthylene-type phenolic curing agents "NHN", "CBN", and "GPH" (manufactured by Nippon Kayaku Co., Ltd.); and "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN375", and "SN395". (Made by Nippon Steel Chemical Co., Ltd.), "EXB9500" (Made by DIC), "TD2090" (Made by DIC) of phenolic varnish type phenolic curing agent, "EXB-6000" (Made by DIC) of naphthyl ether type phenolic curing agent, "LA3018", "LA7052", "LA7054", "LA1356" (Made by DIC) of phenolic curing agent containing triazine skeleton, "SA-90" (Made by SABIC) of polyphenylene ether type phenolic curing agent, etc.

[0089] (B-2) Anhydride-based curing agents are curing agents that have one or more carboxylic acid anhydride groups (-CO-O-CO-) in one molecule. Examples include: phthalic anhydride, pyromellitic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3',4,4'-diphenylsulfone tetracarboxylic dianhydride, 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, methylene-4 Aromatic anhydride curing agents such as 4'-diphthalic anhydride; aliphatic anhydride curing agents such as tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, cyclopentanetetracarboxylic anhydride, and cyclohexane-1,2,4,5-tetracarboxylic anhydride; and maleic anhydride polymer curing agents such as styrene / maleic anhydride copolymers and (meth)acrylate / styrene / maleic anhydride copolymers. Among these, maleic anhydride polymer curing agents are preferred, and styrene / maleic anhydride copolymer curing agents are particularly preferred.

[0090] Commercially available (B-2) anhydride-based curing agents include: aliphatic dicarboxylic anhydride-based curing agents such as "HNA-100", "MH-700", "MTA-15", "DDSA", "OSA" (manufactured by Shin Nippon Rikka Co., Ltd.), "YH-306", "YH-307" (manufactured by Mitsubishi Chemical Co., Ltd.), "HN-2200", "HN-5500" (manufactured by Hitachi Chemical Co., Ltd.), and styrene / maleic anhydride copolymer-based curing agents such as "XIRAN1000", "XIRAN2000", "XIRAN2500", "XIRAN3000", "XIRAN3500", "XIRAN3600", "XIRAN4000", "XIRAN6000", "XIRAN9000", "XIRAN EF10", "XIRAN EF30", "XIRAN EF40", "XIRAN EF41", "XIRAN EF61", and "XIRAN EF80" (manufactured by Polyscope Co., Ltd.).

[0091] (B-3) Carboxylic acid-based curing agents are curing agents having two or more carboxyl groups in one molecule. Examples include: aliphatic carboxylic acid-based curing agents such as succinic acid, glutaric acid, adipic acid, and sebacic acid; aromatic carboxylic acid-based curing agents such as phthalic acid, isophthalic acid, and terephthalic acid; acrylic polymer-based curing agents such as polyacrylic acid and polymethacrylic acid; and carboxylic acid-based curing agents containing ester groups, such as styrene / maleic anhydride copolymers and (meth)acrylate / styrene / maleic anhydride copolymers, which are obtained by esterification and hydrolysis of maleic anhydride polymers. Among these, maleic acid polymer-based curing agents are preferred.

[0092] Commercially available (B-3) carboxylic acid curing agents include: "XIRAN1440", "XIRAN17352", "XIRAN2625", and "XIRAN3840" (manufactured by Polyscope), which contain ester groups.

[0093] (B-4) Thiol-based curing agents are curing agents that have two or more thiol groups in one molecule. Examples include: aromatic thiol-based curing agents such as 4,4'-dimercaptobiphenyl, 1,3,5-triazine-2,4,6-trithiol, 2,5-dimercapto-1,3,4-thiadiazole, and benzene-1,4-dithiol; and aliphatic thiol-based curing agents such as trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetra(3-mercaptobutyrate), and tris(3-mercaptopropyl)isocyanurate.

[0094] (B) The reactive group equivalent of the curing agent is preferably 50 g / eq. to 3000 g / eq., more preferably 80 g / eq. to 2000 g / eq., even more preferably 100 g / eq. to 1000 g / eq., and particularly preferably 120 g / eq. to 900 g / eq. The reactive group equivalent is the mass of the curing agent per 1 equivalent of reactive group. Here, "reactive group" refers to, for example, a phenolic hydroxyl group in a phenolic curing agent, a carboxyl group in a carboxylic acid curing agent, a mercapto group in a thiol curing agent, and in the case of an anhydride curing agent, 1 equivalent of a carboxylic acid anhydride group (-CO-O-CO-) is equivalent to 2 equivalents of reactive group.

[0095] The molar equivalent ratio (reactive group of component (B) / cyclic iminoether skeleton of component (A)) of the polystyrene resin containing the cyclic iminoether skeleton in the resin composition is not particularly limited, but is preferably 1 or less, more preferably 0.98 or less, and even more preferably 0.97 or less.

[0096] The content of curing agent (B) in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it is preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 10% by mass or less. The lower limit of the content of curing agent (B) in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, and particularly preferably 1% by mass or more.

[0097] The mass ratio ((B) component / (A) component) of the curing agent (B) in the resin composition to the polystyrene resin (A) containing a cyclic imine ether backbone is not particularly limited, but is preferably 0.001 or more, more preferably 0.01 or more, further preferably 0.03 or more, and particularly preferably 0.04 or more. The upper limit of the mass ratio ((B) component / (A) component) of the curing agent (B) in the resin composition to the polystyrene resin (A) containing a cyclic imine ether backbone is not particularly limited, but is preferably 10 or less, more preferably 1 or less, further preferably 0.5 or less, and particularly preferably 0.3 or less.

[0098] <(C) Inorganic filler materials>

[0099] The resin composition of the present invention contains (C) an inorganic filler. (C) The inorganic filler is contained in the resin composition in the form of particles.

[0100] Inorganic compounds are used as the inorganic filler material in (C). Examples of inorganic filler materials in (C) include: silicon dioxide, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, zirconium tungstate phosphate, ferrite, iron alloys, etc. Among these, silicon dioxide is particularly preferred. Examples of silicon dioxide include amorphous silicon dioxide, fused silicon dioxide, crystalline silicon dioxide, synthetic silicon dioxide, hollow silicon dioxide, etc. In addition, spherical silicon dioxide is preferred as silicon dioxide. (C) Inorganic filler materials can be used alone or in combination of two or more in any ratio.

[0101] Commercially available products as (C) inorganic filler materials include: "UFP-30" manufactured by Denka Kagaku Kogyo Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "UFP-30" manufactured by DENKA Co., Ltd.; "SILFIL NSS-3N", "SILFIL NSS-4N", and "SILFIL NSS-5N" manufactured by Tokuyama Co., Ltd.; "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", and "SC2050-SXF" manufactured by Admatechs Co., Ltd.; and "DAW-03" and "FB-105FD" manufactured by DENKA Co., Ltd.

[0102] (C) The average particle size of the inorganic filler material is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, further preferably 3 μm or less, further more preferably 2 μm or less, and particularly preferably 1 μm or less. (C) The lower limit of the average particle size of the inorganic filler material is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.1 μm or more, further preferably 0.3 μm or more, and particularly preferably 0.5 μm or more. (C) The average particle size of the inorganic filler material can be determined using a laser diffraction-scattering method based on the Mie scattering theory. Specifically, it can be determined by: using a laser diffraction-scattering particle size distribution measuring device, preparing the particle size distribution of the inorganic filler material on a volume basis, and taking the median particle size as the average particle size. The test sample obtained by: weighing 100 mg of inorganic filler material and 10 g of methyl ethyl ketone into a vial bottle, and dispersing it ultrasonically for 20 minutes. For the sample being measured, a laser diffraction particle size distribution measuring device is used. The light source wavelength is set to blue and red, and the particle size distribution of the inorganic filler material is measured in a flow cell manner based on a volume reference. The average particle size is calculated from the obtained particle size distribution as the median particle size. Examples of laser diffraction particle size distribution measuring devices include the "LA-960" manufactured by Horiba Manufacturing Co., Ltd., and the "SALD-2200" manufactured by Shimadzu Corporation.

[0103] (C) The specific surface area of ​​the inorganic filler material is not particularly limited, but is preferably 0.1 m². 2 / g or more, preferably 0.5m 2 / g or more, further preferably 1m 2 / g or more, especially preferably 3m 2 / g or more. (C) There is no particular limit to the upper limit of the specific surface area of ​​the inorganic filler material, but it is preferably 100m². 2 / g or less, preferably 50m 2 / g or less, more preferably 30m 2 / g or less, especially preferably 10m 2 / g or less. The specific surface area of ​​inorganic filler materials can be obtained by the following method: according to the BET method, using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech), nitrogen gas is adsorbed on the sample surface, and the specific surface area is calculated using the BET multi-point method.

[0104] (C) The inorganic filler material is preferably surface-treated with a suitable surface treatment agent. Surface treatment improves the moisture resistance and dispersibility of the (C) inorganic filler material. Examples of surface treatment agents include: vinyl silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-epoxypropoxypropylmethyldimethoxysilane, 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropylmethyldiethoxysilane, and 3-epoxypropoxypropyltriethoxysilane; styrene-based silane coupling agents such as p-styrenetrimethoxysilane; and 3-methacryloyloxypropylmethyldimethoxysilane, 3-methacryloyloxy... Methacrylic acid-based silane coupling agents such as propyltrimethoxysilane, 3-methacryloyloxypropylmethyldiethoxysilane, and 3-methacryloyloxypropyltriethoxysilane; acrylic acid-based silane coupling agents such as 3-acryloyloxypropyltrimethoxysilane; N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, and 3-triethoxysilyl-N-(1,3-dimethyl-butylidene) e) Amino silane coupling agents such as propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-phenyl-8-aminooctyltrimethoxysilane, and N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; isocyanurate silane coupling agents such as tri-(trimethoxysilylpropyl)isocyanurate; ureoyl silane coupling agents such as 3-ureopropyltrialkoxysilane; mercaptoyl silane coupling agents such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; isocyanate silane coupling agents such as 3-isocyanopropyltriethoxysilane. Alkyl coupling agents; anhydride-based silane coupling agents such as 3-trimethoxysilylpropylsuccinic anhydride; other silane coupling agents; non-silane coupling-alkoxysilane compounds such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, 1,6-bis(trimethoxysilyl)hexane, and trifluoropropyltrimethoxysilane. Furthermore, surface treatment agents can be used alone or in combination of two or more in any ratio.

[0105] Commercially available surface treatment agents include, for example: Shin-Etsu Chemical Industry Co., Ltd.'s "KBM-1003", "KBE-1003" (vinyl silane coupling agent); "KBM-303", "KBM-402", "KBM-403", "KBE-402", "KBE-403" (epoxy silane coupling agent); "KBM-1403" (styrene silane coupling agent); "KBM-502", "KBM-503", "KBE-502", "KBE-503" (methacrylic acid silane coupling agent); "KBM-5103" (acrylic acid silane coupling agent); "KBM-602", "KBM-603", "KBM-903", "KBE-903", "KBE-9103P", "KBM-573", and "KBM-575" (…). Amino-based silane coupling agents; "KBM-9659" (isocyanurate-based silane coupling agent); "KBE-585" (urea-based silane coupling agent); "KBM-802" and "KBM-803" (mercapto-based silane coupling agents); "KBE-9007N" (isocyanate-based silane coupling agent); "X-12-967C" (anhydride-based silane coupling agent); "KBM-13", "KBM-22", "KBM-103", "KBE-13", "KBE-22", "KBE-103", "KBM-3033", "KBE-3033", "KBM-3063", "KBE-3063", "KBE-3083", "KBM-3103C", "KBM-3066", "KBM-7103" (non-silane coupling - alkoxysilane compounds), etc.

[0106] From the viewpoint of improving the dispersibility of inorganic filler materials, it is preferable to control the degree of surface treatment based on surface treatment agent within a specified range. Specifically, for 100% by mass of inorganic filler material, it is preferable to have surface treated with 0.2% to 5% by mass of surface treatment agent, more preferably with 0.2% to 3% by mass of surface treatment agent, and even more preferably with 0.3% to 2% by mass of surface treatment agent.

[0107] The degree of surface treatment by the surface treatment agent can be evaluated by the carbon content per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the carbon content per unit surface area of ​​the inorganic filler is preferably 0.02 mg / m². 2 The above, more preferably 0.1 mg / m 2 The above is further preferred to be 0.2 mg / m³. 2 That's all. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition and the melt viscosity in sheet form, 1.0 mg / m³ is preferred.2 The following is more preferably 0.8 mg / m³ 2 The following is a further preferred value: 0.5 mg / m³ 2 the following.

[0108] (C) The carbon content per unit surface area of ​​the inorganic filler material can be determined after washing the surface-treated inorganic filler material with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, it can be determined by adding sufficient MEK as a solvent to the surface-treated inorganic filler material and ultrasonically washing it at 25°C for 5 minutes. After removing the supernatant and drying the solid components, the carbon content per unit surface area of ​​the inorganic filler material is determined using a carbon analyzer. A carbon analyzer such as the "EMIA-320V" manufactured by Horiba Corporation can be used.

[0109] The content of (C) inorganic filler material in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, from the viewpoint of significantly obtaining the desired effect of the present invention, it is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less. From the viewpoint of further improving copper adhesion, it can be even more preferably 70% by mass or less, and particularly preferably 67% by mass or less. The lower limit of the content of (C) inorganic filler material in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, for example, it is 1% by mass or more, 5% by mass or more. From the viewpoint of significantly obtaining the desired effect of the present invention, it is preferably 10% by mass or more, 20% by mass or more, more preferably 30% by mass or more, and 35% by mass or more. From the viewpoint of further suppressing the dielectric loss tangent to a low level, it can be even more preferably 40% by mass or more, even more preferably 50% by mass or more, and particularly preferably 60% by mass or more.

[0110] The mass ratio ((C) component / (A) component) of the inorganic filler material (C) to the polystyrene resin containing the cyclic imine ether backbone (A) in the resin composition is not particularly limited, but is preferably 0.1 or more, more preferably 0.5 or more. From the viewpoint of further suppressing the dielectric loss tangent to a low level, it is further preferably 1 or more, and particularly preferably 1.5 or more. The upper limit of the mass ratio ((C) component / (A) component) of the inorganic filler material (C) to the polystyrene resin containing the cyclic imine ether backbone (A) in the resin composition is not particularly limited, but is preferably 20 or less, more preferably 10 or less, more preferably 5 or less, and particularly preferably 3 or less.

[0111] <(D) Epoxy Resin>

[0112] The resin compositions of the present invention sometimes contain (D) epoxy resin as an optional component. (D) epoxy resin refers to a curable resin having epoxy groups.

[0113] Examples of (D) epoxy resins include: bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, and naphthol phenolic varnish. Novolak type epoxy resin, phenolic varnish type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol phenolic varnish type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, epoxy resin containing spirocyclic ring, cyclohexane type epoxy resin, cyclohexanediol type epoxy resin, naphthylene ether type epoxy resin, tris(hydroxymethyl) type epoxy resin, tetraphenylethane type epoxy resin, isocyanurate type epoxy resin, phenol benzopyrrolidone (phenolphthalimidine) type epoxy resin, phenolphthalein type epoxy resin, etc. (D) Epoxy resin can be used alone or in combination of two or more types.

[0114] For the resin composition, the (D) epoxy resin is preferably an epoxy resin having two or more epoxy groups per molecule. The proportion of epoxy resin having two or more epoxy groups per molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more, relative to 100% by mass of the non-volatile component of the (D) epoxy resin.

[0115] In one embodiment, from the viewpoint of further suppressing the relative permittivity and dielectric loss tangent to a low level, the epoxy resin in the resin composition of the present invention preferably comprises: a fluorinated epoxy resin or an epoxy resin containing an alicyclic backbone.

[0116] The epoxy resin includes an epoxy resin that is liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resin") and an epoxy resin that is solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resin"). For the resin composition of the present invention, the epoxy resin may comprise only liquid epoxy resin, or only solid epoxy resin, or a combination of liquid epoxy resin and solid epoxy resin.

[0117] In one embodiment, although the epoxy resin in the resin composition of the present invention may be only a solid epoxy resin, from the viewpoint of further improving copper adhesion, it is preferable to have only a liquid epoxy resin, or a combination of liquid epoxy resin and solid epoxy resin, and particularly preferably only a liquid epoxy resin.

[0118] As a liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in one molecule is preferred.

[0119] Preferred liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenolic varnish type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexane type epoxy resin, cyclohexanediethanol type epoxy resin, and epoxy resin with butadiene structure.

[0120] Specific examples of liquid epoxy resins include: DIC's "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resin); and Mitsubishi Chemical's "828US", "828EL", "jER828EL", "825", and "EPIKOTE". 828EL (Bisphenol A type epoxy resin); "jER807" and "1750" (Bisphenol F type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER152" (Phenolic varnish type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (Glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (Glycirol type epoxy resin) manufactured by ADEKA Corporation; "EP-3950L" and "EP-3980S" (Glycidylamine type epoxy resin) manufactured by ADEKA Corporation; "EP-4088S" (Dicyclopentadiene type epoxy resin) manufactured by ADEKA Corporation; "ZX1059" (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd.; Nagase ChemteX's "EX-721" (glycidyl ester type epoxy resin); Daicel's "Celloxide2021P" (alicyclic epoxy resin with ester skeleton); Daicel's "PB-3600"; Nippon Soda's "JP-100" and "JP-200" (epoxy resins with butadiene structure); and Nippon Steel Chemical Materials' "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin), etc. These can be used individually or in combination of two or more.

[0121] As a solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferred.

[0122] As solid epoxy resins, preferred types include xylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol phenolic varnish-type epoxy resins, cresol phenolic varnish-type epoxy resins, dicyclopentadiene-type epoxy resins, triphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenol aralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, phenol benzopyrrolidone-type epoxy resins, and phenolphthalein-type epoxy resins.

[0123] Specific examples of solid epoxy resins include: DIC's "HP4032H" (naphthalene-type epoxy resin); DIC's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC's "N-690" (cresol phenolic varnish type epoxy resin); DIC's "N-695" (cresol phenolic varnish type epoxy resin); and DIC's "HP-7200," "HP-7200HH," "HP-7200H," and "HP-7200L" (dicyclopentadiene type epoxy resin). IC Corporation's "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", and "HP6000" (naphthyl ether type epoxy resin); Nippon Kayaku Co., Ltd.'s "EPPN-502H" (triphenol type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC7000L" (naphthol phenolic varnish type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC3000H", "NC3000", "NC3000L", "NC3000FH", and "NC3100" (biphenyl type epoxy resin) Epoxy resins; Nippon Steel Chemical Materials Co., Ltd.'s "ESN475V" (naphthalene-type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ESN485" (naphthol-type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ESN375" (dihydroxynaphthalene-type epoxy resin); Mitsubishi Chemical Corporation's "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bi-xylenol-type epoxy resin); Mitsubishi Chemical Corporation's "YL6121" (biphenyl-type epoxy resin); Mitsubishi Chemical Corporation's "YX8800" (anthracite-type epoxy resin); The following epoxy resins are used: Mitsubishi Chemical Co., Ltd.'s "YX7700" (phenolic aralkyl type epoxy resin); Osaka Gas Chemical Co., Ltd.'s "PG-100" and "CG-500"; Mitsubishi Chemical Co., Ltd.'s "YL7760" (bisphenol AF type epoxy resin); Mitsubishi Chemical Co., Ltd.'s "YL7800" (fluorene type epoxy resin); Mitsubishi Chemical Co., Ltd.'s "jER1010" (bisphenol A type epoxy resin); Mitsubishi Chemical Co., Ltd.'s "jER1031S" (tetraphenylethane type epoxy resin); and Nippon Kayaku Co., Ltd.'s "WHR991S" (phenolic benzopyrrolidone type epoxy resin), etc. They can be used individually or in combination of two or more.

[0124] As for (D) epoxy resin, when liquid epoxy resin and solid epoxy resin are used in combination, their mass ratio (liquid epoxy resin: solid epoxy resin) is preferably 1:1 to 1:20, more preferably 1:1.5 to 1:15, and particularly preferably 1:2 to 1:10. By keeping the mass ratio of liquid epoxy resin to solid epoxy resin within the above range, the desired effects of the present invention can be significantly obtained. Furthermore, when used in the form of resin sheets, moderate adhesiveness is generally achieved. In addition, when used in the form of resin sheets, sufficient flexibility and improved processability are generally obtained. Furthermore, a cured product with sufficient tensile strength is generally obtained.

[0125] (D) The epoxy equivalent of the epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 1,000 g / eq., even more preferably 80 g / eq. to 500 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The epoxy equivalent is the mass of resin per equivalent of epoxy groups. This epoxy equivalent can be determined according to JIS K7236.

[0126] (D) The weight-average molecular weight (Mw) of the epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight-average molecular weight of the resin can be determined by gel permeation chromatography (GPC) as a value converted to polystyrene.

[0127] The content of (D) epoxy resin in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it is preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 10% by mass or less, and particularly preferably 5% by mass or less. The lower limit of the content of (D) epoxy resin in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it can be, for example, 0% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 1% by mass or more, 2% by mass or more, etc.

[0128] <(E) Epoxy Curing Agent>

[0129] In the resin composition of the present invention, when (D) epoxy resin is included, (E) epoxy curing agent is sometimes also included as an optional component. Regarding the (E) epoxy curing agent described herein, in one embodiment, the resin composition is cured by fully reacting (e.g., by addition reaction) with the (D) epoxy resin, provided that the (D) epoxy resin does not react or the reaction rate with the (B) curing agent described above is poor or insufficient. Regarding the (E) epoxy curing agent, in one embodiment, the reaction rate with component (A) is slower or non-reacting compared to the reaction rate with component (D). One type of (E) epoxy curing agent may be used alone, or two or more may be used in combination.

[0130] There are no particular limitations on the (E) epoxy curing agent, and examples include: (E-1) reactive ester-based curing agents, (E-2) carbodiimide-based curing agents, (E-3) amine-based curing agents, (E-4) benzoxazine-based curing agents, (E-5) cyanate ester-based curing agents, etc. In one embodiment, the (E) epoxy curing agent particularly preferably comprises a (E-1) reactive ester-based curing agent.

[0131] As (E-1) reactive ester-based curing agents, compounds with two or more highly reactive ester groups in one molecule, such as phenolic esters, thiophenolic esters, N-hydroxyamine esters, and heterocyclic hydroxyl compounds, are generally preferred.

[0132] (E-1) The reactive ester-based curing agent is preferably obtained by the condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxyl compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, the reactive ester-based curing agent obtained by the reaction of a carboxylic acid compound and a hydroxyl compound is preferred, and the reactive ester-based curing agent obtained by the reaction of a carboxylic acid compound with a phenol compound and / or a naphthol compound is more preferred.

[0133] Examples of (E-1) reactive ester-based curing agents include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenolic or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthol, 1,6-dihydroxynaphthol, 2,6-dihydroxynaphthol, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, pyrophenone, dicyclopentadiene-type diphenol compounds, and linear phenolic resins. Here, "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing two molecules of phenol with one molecule of dicyclopentadiene.

[0134] Specifically, as the (E-1) reactive ester curing agent, dicyclopentadiene-type reactive ester curing agents, naphthalene-type reactive ester curing agents containing a naphthalene structure, reactive ester curing agents containing acetylated linear phenolic resins, and reactive ester curing agents containing benzoylated linear phenolic resins are preferred. More preferably, at least one of dicyclopentadiene-type reactive ester curing agents and naphthalene-type reactive ester curing agents is preferred, and dicyclopentadiene-type reactive ester curing agents are even more preferred. As the dicyclopentadiene-type reactive ester curing agent, a reactive ester curing agent containing a dicyclopentadiene-type diphenol structure is preferred. The term "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit formed from phenylene-dicyclopentylene-phenylene.

[0135] Commercially available (E-1) reactive ester curing agents include: "EXB9451", "EXB9460", "EXB9460S", "EXB-8000L", "EXB-8000L-65M", "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", "HPC-8000H", and "HPC-8000H-65TM" (manufactured by DIC Corporation), which are reactive ester curing agents containing a dicyclopentadiene-type diphenol structure; and "EXB-8100L-65T" and "EXB-8150-6000L-65TM", which are reactive ester curing agents containing a naphthalene structure. "T", "EXB-8150-62T", "EXB-9416-70BK", "HPC-8150-60T", "HPC-8150-62T" (manufactured by DIC Corporation); "EXB9401" (manufactured by DIC Corporation) as a phosphorus-containing reactive ester curing agent; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an acetylated linear phenolic resin reactive ester curing agent; "YLH1026", "YLH1030", "YLH1048" (manufactured by Mitsubishi Chemical Corporation) as a benzoylated linear phenolic resin reactive ester curing agent; "PC1300-02-65MA" (manufactured by Air Water Corporation) as an reactive ester curing agent containing styrene and naphthalene structures, etc.

[0136] As (E-2) carbodiimide-based curing agents, examples include curing agents having one or more, preferably two or more, carbodiimide structures within one molecule. Examples include aliphatic bis(tert-butylcarbodiimide) and cyclohexanebis(methylene-tert-butylcarbodiimide); phenylene-bis(xylylcarbodiimide) Aromatic dicarbodiimides such as carbodiimide; aliphatic polycarbodiimides such as polyhexamethylene carbodiimide, polytrimethylhexamethylene carbodiimide, polycyclohexylcarbodiimide, poly(methylene dicyclohexylcarbodiimide), and poly(isophorone carbodiimide); and polycarbodiimides such as poly(phenylene carbodiimide), poly(naphthylene carbodiimide), poly(benzylene carbodiimide), poly(methyldiisopropylphenylene carbodiimide), poly(triethylphenylene carbodiimide), poly(diethylphenylene carbodiimide), poly(triisopropylphenylene carbodiimide), poly(diisopropylphenylene carbodiimide), poly(xylene carbodiimide), poly(tetramethylxylene carbodiimide), poly(methylene diphenylene carbodiimide), and poly[methylene bis(methylphenylene)carbodiimide]

[0137] Commercially available (E-2) carbodiimide curing agents include, for example: "CARBODILITE V-02B", "CARBODILITE V-03", "CARBODILITE V-04K", "CARBODILITE V-07" and "CARBODILITE V-09" manufactured by Nisshinbo Chemical Co., Ltd.; and "Stabaxol P", "Stabaxol P400" and "Hycasyl 510" manufactured by Rhein Chemie Co., Ltd.

[0138] Examples of (E-3) amine-based curing agents include those having one or more, preferably two or more, amino groups within one molecule. Examples include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. From the viewpoint of achieving the desired effect of the present invention, aromatic amines are preferred. The (E-3) amine-based curing agent is preferably a primary amine or a secondary amine, more preferably a primary amine. Specific examples of (E-3) amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-xylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-diphenyl ether). 2,2-bis(4-aminophenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. (E-3) Amine-based curing agents can be commercially available products, such as "SEIKACURE-S" manufactured by SEIKA Corporation, "KAYABOND C-200S", "KAYABOND C-100", "KAYAHARD AA", "KAYAHARD AB", "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure (エピキュア)W" manufactured by Mitsubishi Chemical Co., Ltd.

[0139] Specific examples of (E-4) benzoxazine curing agents include: "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Co., Ltd.; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; and "Pd" and "Fa" manufactured by Shikoku Chemical Co., Ltd.

[0140] Examples of (E-5) cyanate-based curing agents include: bisphenol A dicyanate, polyphenol cyanates (oligomeric (3-methylene-1,5-phenylene cyanate)), 4,4'-methylene bis(2,6-dimethylphenyl cyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate-phenylpropane), 1,1-bis(4-cyanate-phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate-phenyl-1-(methylethylene))benzene, bis(4-cyanate-phenyl) sulfide, and bis(4-cyanate-phenyl) ether, etc., difunctional cyanate resins, polyfunctional cyanate resins derived from phenolic varnish resins and cresol varnish resins, and prepolymers formed by partially triazinizing these cyanate resins, etc. Specific examples of (E-5) cyanate ester curing agents include "PT30" and "PT60" (both linear phenolic resin-type multifunctional cyanate ester resins), "BA230", and "BA230S75" (prepolymers formed by triazinizing part or all of bisphenol A dicyanate to form a trimer).

[0141] (E) The reactive group equivalent of the epoxy curing agent is preferably 50 g / eq. to 3000 g / eq., more preferably 100 g / eq. to 1000 g / eq., even more preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The reactive group equivalent is the mass of epoxy curing agent per 1 equivalent relative to the reactive group of the epoxy groups in (D) epoxy resin.

[0142] The content of (E) epoxy curing agent in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it is preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 10% by mass or less, and particularly preferably 5% by mass or less. The lower limit of the content of (E) epoxy curing agent in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it can be, for example, 0% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 1% by mass or more, 2% by mass or more, etc.

[0143] <(F) Epoxy Curing Accelerator>

[0144] In the case of the resin composition of the present invention, when (D) epoxy resin is included, (F) epoxy curing accelerator is sometimes also included as an optional component. In one embodiment, the (F) epoxy curing accelerator may function as a catalyst for promoting the curing reaction of the (D) epoxy resin.

[0145] Examples of epoxy curing accelerators (F) include: (F-1) imidazole-based curing accelerators, (F-2) amine-based curing accelerators, (F-3) phosphorus-based curing accelerators, (F-4) urea-based curing accelerators, (F-5) guanidine-based curing accelerators, and (F-6) metal-based curing accelerators. In one embodiment, the epoxy curing accelerator (F) preferably comprises an epoxy curing accelerator selected from (F-1) imidazole-based curing accelerators and (F-2) amine-based curing accelerators. One type of epoxy curing accelerator (F) can be used alone, or two or more types can be used in combination.

[0146] Examples of (F-1) imidazole-based curing accelerators include: 2-methylimidazolium, 2-undecylimidazolium, 2-heptadecylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-methylimidazolium, 1-benzyl-2-phenylimidazolium, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-phenylimidazolium, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolium-( [1')]-Ethyl-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine isocyanuric acid adduct, 2-phenylimidazolyl isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline and other imidazole compounds, and adducts of imidazole compounds with epoxy resins.

[0147] As (F-1) imidazole curing accelerators, commercially available products can be used, such as "1B2PZ", "2MZA-PW", and "2PHZ-PW" manufactured by Shikoku Chemical Industry Co., Ltd., and "P200-H50" manufactured by Mitsubishi Chemical Co., Ltd.

[0148] Examples of (F-2) amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene.

[0149] As a (F-2) amine-based curing accelerator, commercially available products can be used, such as "MY-25" manufactured by Ajinomoto Fine-Techno.

[0150] Examples of (F-3) phosphorus-based curing accelerators include: tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitictetrate, tetrabutylphosphonium hexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, di-tert-butylmethylphosphonium tetraphenylborate, and other aliphatic phosphonium salts; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, and tetraphenylphosphonium bromide. Aromatic phosphonium salts of p-tolyltriphenylphosphonium tetrap-tolylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrap-tolylborate, triphenylethylphosphonium tetraphenylborate, tri(3-methylphenyl)ethylphosphonium tetraphenylborate, tri(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc.; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone addition reactants such as triphenylphosphine-p-benzoquinone addition reactants; tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, etc. Aliphatic phosphines such as di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyl diphenylphosphine, ethyl diphenylphosphine, butyl diphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tri(4-ethylphenyl)phosphine, tri(4-propylphenyl)phosphine, tri(4-isopropylphenyl)phosphine, tri(4-butylphenyl)phosphine, tri(4-tert-butylphenyl)phosphine, tri(2,4-dimethylphenyl)phosphine, tri(2,5-dimethylphenyl)phosphine, tri(2,6 ... Aromatic phosphines include tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether.

[0151] Examples of (F-4) urea-based curing accelerators include: 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)- Aromatic dimethylureas such as 1,1-dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea)[toluenebisdimethylurea], etc.

[0152] Examples of (F-5) guanidine-based curing accelerators include: dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanidine, 1-ethylbiguanidine, 1-n-butylbiguanidine, 1-n-octadecylbiguanidine, 1,1-dimethylbiguanidine, 1,1-diethylbiguanidine, 1-cyclohexylbiguanidine, 1-allylbiguanidine, 1-phenylbiguanidine, 1-(o-tolyl)biguanidine, etc.

[0153] Examples of (F-6) metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include: cobalt(II) acetylacetonate, cobalt(III) acetylacetonate, copper(II) acetylacetonate, zinc(II) acetylacetonate, iron(III) acetylacetonate, nickel(II) acetylacetonate, and manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0154] The content of (F) epoxy curing accelerator in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it is preferably 10% by mass or less, more preferably 1% by mass or less, further preferably 0.1% by mass or less, and particularly preferably 0.05% by mass or less. The lower limit of the content of (F) epoxy curing accelerator in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it can be, for example, 0% by mass or more, 0.0001% by mass or more, 0.001% by mass or more, 0.01% by mass or more, etc.

[0155] <(G) benzocyclobutene resin>

[0156] In the resin compositions of the present invention, (G) benzocyclobutene resin is sometimes included as an optional component. (G) benzocyclobutene resin is a compound having one or more benzocyclobutene rings, preferably two or more. In one embodiment, the (G) component may undergo an addition reaction with an alkene-type unsaturated group.

[0157] In one embodiment, the (G) benzocyclobutene resin preferably also has olefinic unsaturated groups. By giving the (G) component olefinic unsaturated groups, polymerization can be carried out using only the (G) component.

[0158] In one embodiment, the (G) benzocyclobutene resin preferably further comprises an organosiloxane backbone. Examples of organosiloxane backbones include dialkylsiloxane backbones such as dimethylsiloxane backbones and diarylsiloxane backbones such as diphenylsiloxane backbones, with dialkylsiloxane backbones being preferred, and dimethylsiloxane backbones being particularly preferred.

[0159] In one embodiment, (G) benzocyclobutene resin is preferably the resin represented by formula (3).

[0160] [Chemical Formula 8]

[0161]

[0162] [In the formula, R] 1 and R 3 Each of these independently represents a hydrogen atom or a substituent (preferably a hydrogen atom or an alkyl group, particularly preferably a hydrogen atom); R 2 and R 4 Each of the substituents (preferably alkyl or aryl, particularly alkyl) is independently represented; c is an integer from 0 to 3 (preferably 0); m is an integer of 1 or more (preferably an integer from 1 to 3, more preferably 1)).

[0163] Commercially available (G) benzocyclobutene resins include, for example, "CYCLOTENE3022" manufactured by Dow Chemical Company.

[0164] The content of (G) benzocyclobutene resin in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it is preferably 50% by mass or less, more preferably 30% by mass or less, further preferably 20% by mass or less, and particularly preferably 10% by mass or less. The lower limit of the content of (G) benzocyclobutene resin in the resin composition is not particularly limited. When the non-volatile component in the resin composition is set to 100% by mass, it can be, for example, 0% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 0.5% by mass or more, etc. From the viewpoint of suppressing the dielectric loss tangent to a low level, it is preferably 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more.

[0165] <(H) Other Additives>

[0166] The resin composition of the present invention may further include, as a non-volatile component, any additives. Examples of such additives include: maleimide-based free radical polymerizable compounds, vinylphenyl-based free radical polymerizable compounds, (meth)acrylic acid-based free radical polymerizable compounds, allyl-based free radical polymerizable compounds, polybutadiene-based free radical polymerizable compounds, and other free radical polymerizable compounds; peroxide-based free radical polymerization initiators, azo-based free radical polymerization initiators, and other free radical polymerization initiators; and thermoplastic resins such as polyvinyl acetal resin, polyolefin resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, polyetheretherketone resin, and polyester resin. Thermosetting resins other than epoxy resins, including epoxy acrylate resins, polyurethane acrylate resins, polyurethane resins, cyanate ester resins, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, and phenoxy resins; organic fillers such as rubber particles; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium dioxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; and silicone-based homogenizing agents. Homogenizing agents such as acrylic polymer homogenizers; thickeners such as Benton and montmorillonite; defoamers such as silicone-based, acrylic-based, fluorinated, and vinyl resin-based defoamers; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion enhancers such as ureasilanes; adhesion enhancers such as triazole-based, tetraazole-based, and triazine-based adhesion enhancers; antioxidants such as hindered phenolic and hindered amine antioxidants; fluorescent whitening agents such as zirconia derivatives; fluorinated surfactants and silicone-based surfactants. Surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphonic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyethylene-based dispersants, acetylene-based dispersants, organosilicon-based dispersants, anionic dispersants, and cationic dispersants; stabilizers such as borate ester-based stabilizers, titanate ester-based stabilizers, aluminate ester-based stabilizers, zirconate ester-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. (H) Other additives may be used alone or in combination of two or more in any ratio. Those skilled in the art can appropriately determine the content of (H) other additives.

[0167] <(I) Organic Solvents>

[0168] In addition to the non-volatile components described above, the resin composition of the present invention may also contain any organic solvent as a volatile component. As the (I) organic solvent, any known organic solvent may be used appropriately, and there is no particular limitation on its type, as long as it is an organic solvent capable of dissolving at least a portion of the non-volatile component. Examples of the (I) organic solvent include: ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, and diphenyl ether; alcohol solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; and 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, and carbitol acetate. Ether ester solvents such as acetate, γ-butyrolactone, and methyl methoxypropionate; ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (I) Organic solvents may be used alone or in combination of two or more in any ratio. When using organic solvents (I), one may be used alone or in combination of two or more in any ratio.

[0169] In one embodiment, (I) the content of organic solvent is not particularly limited. When all components in the resin composition are set to 100% by mass, for example, it can be 60% or less by mass, 40% or less by mass, 30% or less by mass, 20% or less by mass, 15% or less by mass, 10% or less by mass, etc.

[0170] <Method for manufacturing resin composition>

[0171] The resin composition of the present invention can be manufactured, for example, by adding (A) a polystyrene resin containing a cyclic imine ether backbone, (B) a curing agent, (C) an inorganic filler, (D) an epoxy resin as needed, (E) an epoxy curing agent as needed, (F) an epoxy curing accelerator as needed, (G) a benzocyclobutene resin as needed, (H) other additives as needed, and (I) an organic solvent as needed, in any order and / or simultaneously in any preparation container, and mixing them. Furthermore, during the addition and mixing of the components, the temperature can be appropriately set, and heating and / or cooling can be performed temporarily or continuously. Furthermore, during or after the addition and mixing process, the resin composition can be stirred or agitated using, for example, a mixer or other stirring or shaking device to uniformly disperse it. Furthermore, degassing can be performed under low-pressure conditions such as vacuum while stirring or agitating.

[0172] <Characteristics of the Resin Composition>

[0173] The resin composition of the present invention comprises (A) a polystyrene resin containing a cyclic imine ether backbone, (B) a curing agent, and (C) an inorganic filler. By using such a resin composition, a cured product with a low relative permittivity (Dk) and dielectric loss tangent (Df) can be obtained. Furthermore, in one embodiment, a cured product with excellent copper adhesion can be obtained by using such a resin composition.

[0174] The cured resin composition of the present invention can have a low dielectric loss tangent (Df). Therefore, in one embodiment, as in Test Example 1 below, the dielectric loss tangent (Df) of the cured resin composition (curing temperature 200°C) measured at 5.8 GHz and 23°C is preferably 0.020 or less, 0.010 or less, more preferably 0.008 or less, 0.007 or less, further preferably 0.006 or less, 0.005 or less, particularly preferably 0.004 or less, or 0.003 or less.

[0175] The cured resin composition of the present invention may have a low relative permittivity (Dk). Therefore, in one embodiment, as in Test Example 1 below, the relative permittivity (Dk) of the cured resin composition (curing temperature 200°C) measured at 5.8 GHz and 23°C may preferably be 5.0 or less, more preferably 4.0 or less, further preferably 3.5 or less, further more preferably 3.2 or less, particularly preferably 3.0 or less, 2.9 or less, or 2.8 or less.

[0176] In one embodiment, the cured resin composition of the present invention can exhibit excellent copper adhesion. Therefore, in one embodiment, as in Test Example 2 below, the copper foil peel strength, calculated from the load when the copper foil is peeled vertically from the cured product with laminated copper foil (curing temperature 200°C), is preferably 0.1 kgf / cm or more, more preferably 0.3 kgf / cm or more, further preferably 0.4 kgf / cm or more, further preferably 0.45 kgf / cm or more, and particularly preferably 0.5 kgf / cm or more. There is no particular limitation on the upper limit; for example, it can be 10 kgf / cm or less.

[0177] <Uses of Resin Compositions>

[0178] The resin compositions of the present invention can be suitably used as resin compositions for insulating purposes, particularly as resin compositions for forming insulating layers. Specifically, they can be suitably used as: resin compositions for forming insulating layers (resin compositions for forming insulating layers for forming conductor layers), wherein the insulating layer is an insulating layer for forming conductor layers (including redistribution layers), the conductor layers being formed on the insulating layer. Furthermore, in printed wiring boards described later, they can be suitably used as: resin compositions for forming insulating layers of printed wiring boards (resin compositions for forming insulating layers of printed wiring boards). The resin compositions of the present invention can also be widely used in applications requiring resin compositions, such as resin sheets, prepregs and other sheet laminates, solder resists, underfill materials, chip bonding materials, semiconductor sealing materials, filling resins (through-filling resins), component embedding resins, etc.

[0179] Additionally, for example, when manufacturing a semiconductor chip package through the following processes (1) to (6), the resin composition of the present invention can also be suitably used as: a resin composition for forming a redistribution layer as an insulating layer for forming a redistribution layer (resin composition for forming a redistribution layer), and a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). During the manufacturing of the semiconductor chip package, a redistribution layer can be further formed on the sealing layer;

[0180] (1) The process of laminating a temporary fixing film on a substrate.

[0181] (2) The process of temporarily fixing the semiconductor chip onto the temporary fixing film.

[0182] (3) The process of forming a sealing layer on a semiconductor chip.

[0183] (4) The process of peeling the substrate and temporary fixing film from the semiconductor chip.

[0184] (5) The process of forming a rewiring layer as an insulating layer on the surface of a semiconductor chip where the substrate and temporary fixing film have been stripped, and

[0185] (6) The process of forming a redistribution layer as a conductor layer on the redistribution forming layer.

[0186] Furthermore, the resin composition of the present invention provides an insulating layer with good component embedding properties, thus it can also be used appropriately in cases where the printed wiring board is a circuit board with components embedded in it.

[0187] <Sheet-like laminated materials>

[0188] Although the resin composition of the present invention can also be used in the form of a varnish, in industrial applications, it is generally preferred to use it in the form of a sheet-like laminate containing the resin composition.

[0189] As sheet-like laminated materials, the following resin sheets and prepregs are preferred.

[0190] In one embodiment, the resin sheet includes a support and a resin composition layer disposed on the support, the resin composition layer being formed from the resin composition of the present invention.

[0191] From the viewpoint of achieving thinner printed wiring boards and providing a cured product with excellent insulation even when the cured resin composition is a thin film, the thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less. There is no particular limitation on the lower limit of the resin composition layer thickness; it can typically be 5 μm or more, 10 μm or more, etc.

[0192] Examples of supports include films made of plastic materials, metal foils, and release paper, with films and metal foils made of plastic materials being preferred.

[0193] When a film formed of a plastic material is used as a support, examples of plastic materials include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), acrylic polymers such as polycarbonate (hereinafter sometimes abbreviated as "PC") and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, and polyimide. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0194] When using metal foil as a support, examples of metal foils include copper foil and aluminum foil, with copper foil being preferred. As copper foil, foil formed from copper as a single metal can be used, or foil formed from an alloy of copper and other metals (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used.

[0195] The surface of the support that is bonded to the resin composition layer can be treated with matte finish, corona treatment, and antistatic treatment.

[0196] Additionally, as a support, a support with a release layer can be used on the surface that bonds to the resin composition layer. Examples of release agents for the release layer of a support with a release layer include, for example, one or more release agents selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. Commercially available products can be used as supports with release layers, such as "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Ltd., "Purex" manufactured by Teijin Corporation, and "Unipeel" manufactured by Unitech Co., Ltd., which are PET films having a release layer with an alkyd resin-based release agent as the main component.

[0197] The thickness of the support is not particularly limited, but is preferably in the range of 5μm to 75μm, and more preferably in the range of 10μm to 60μm. It should be noted that when using a support with a release layer, the overall thickness of the support with the release layer is preferably within the above range.

[0198] In one embodiment, the resin sheet may further comprise any layer as needed. Examples of such arbitrary layers include, for instance, a protective film selected according to the support, disposed on the side of the resin composition layer that is not bonded to the support (i.e., the side opposite to the support). The thickness of the protective film is not particularly limited, for example, from 1 μm to 40 μm. By laminating the protective film, it is possible to suppress the adhesion of dust and other contaminants to the surface of the resin composition layer or to prevent damage to the surface of the resin composition layer.

[0199] Resin sheets can be manufactured, for example, by directly coating a liquid resin composition onto a support using a die coater or similar machine, or by preparing a resin varnish made by dissolving the resin composition in an organic solvent and coating the resin varnish onto a support using a die coater or similar machine, and then drying it to form a resin composition layer.

[0200] As an organic solvent, the same organic solvents described as components of the resin composition can be cited. One organic solvent may be used alone, or two or more may be used in combination.

[0201] Drying can be carried out using known methods such as heating or blowing hot air. There are no particular limitations on drying conditions; drying is carried out when the content of organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Although it varies depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when using a resin composition or resin varnish containing 30% to 60% by mass of organic solvent, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0202] Resin sheets can be stored by rolling them into rolls. When resin sheets have a protective film, they can be used by peeling off the protective film.

[0203] In one embodiment, the prepreg is formed by impregnating the resin composition of the present invention into a sheet fiber substrate.

[0204] There are no particular limitations on the sheet fiber substrate used in the prepreg; commonly used sheet fiber substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of thinning printed wiring boards, the thickness of the sheet fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, further preferably 30 μm or less, and particularly preferably 20 μm or less. There is no particular limitation on the lower limit of the thickness of the sheet fiber substrate. It is usually 10 μm or more.

[0205] Prepregs can be manufactured using known methods such as hot-melt methods and solvent methods.

[0206] The thickness of the prepreg can be the same range as the resin composition layer in the resin sheet described above.

[0207] The sheet-like laminated material of the present invention can be suitably used to form an insulating layer of a printed wiring board (for the insulating layer of a printed wiring board), and can be more suitably used to form an interlayer insulating layer of a printed wiring board (for the interlayer insulating layer of a printed wiring board).

[0208] Printed wiring boards

[0209] The printed wiring board of the present invention comprises an insulating layer formed from a cured product obtained by curing the resin composition of the present invention.

[0210] Regarding printed wiring boards, for example, the resin sheet described above can be used to manufacture them using a method including the processes described below (I) and (II);

[0211] (I) A process of laminating a resin sheet on an inner substrate by bonding a resin composition layer of a resin sheet to an inner substrate, and (II) A process of curing the resin composition layer (e.g., thermosetting) to form an insulating layer.

[0212] The "inner layer substrate" used in step (I) refers to a component that becomes the substrate of a printed wiring board, such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, or a thermosetting polyphenylene ether substrate. Furthermore, this substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. Sometimes, an inner layer substrate with conductor layers (circuits) formed on one or both sides of the substrate is called an "inner layer circuit substrate." In addition, intermediate products for which insulating layers and / or conductor layers are to be further formed during the manufacture of the printed wiring board are also included in the term "inner layer substrate" in this invention. When the printed wiring board is a component-integrated circuit board, an inner layer substrate with integrated components can be used.

[0213] The lamination of the inner substrate and the resin sheet can be achieved, for example, by heat-pressing the resin sheet onto the inner substrate from the support side. Examples of components for heat-pressing the resin sheet onto the inner substrate (hereinafter also referred to as "heat-pressing components") include, for example, heated metal plates (SUS end plates, etc.) or metal rollers (SUS rollers). It should be noted that it is preferable not to directly press the heat-pressing component onto the resin sheet, but rather to press it through an elastic material such as heat-resistant rubber, so that the resin sheet fully follows the surface irregularities of the inner substrate.

[0214] The lamination of the inner substrate and the resin sheet can be performed by vacuum lamination. In vacuum lamination, the heating and pressing temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C; the heating and pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa; and the heating and pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably performed under reduced pressure conditions of 26.7 hPa or less.

[0215] Lamination can be performed using commercially available vacuum laminators. Examples of commercially available vacuum laminators include the vacuum pressure laminator manufactured by Meiki Manufacturing Co., Ltd., the vacuum applicator manufactured by Nikko-Materials Co., Ltd., and intermittent vacuum pressure laminators.

[0216] After lamination, the heated pressing member is pressed from the support side under normal pressure (atmospheric pressure), for example, thereby smoothing the laminated resin sheet. The pressing conditions for smoothing can be set to the same conditions as the heated pressing conditions for lamination described above. Smoothing can be performed using a commercially available laminator. It should be noted that lamination and smoothing can be performed continuously using the aforementioned commercially available vacuum laminator.

[0217] The support can be removed between process (I) and process (II), or it can be removed after process (II).

[0218] In step (II), the resin composition layer is cured (e.g., heat-cured) to form an insulating layer formed from the cured resin composition. There are no particular limitations on the curing conditions of the resin composition layer; conditions typically used when forming insulating layers for printed wiring boards can be used.

[0219] For example, the thermosetting conditions of the resin composition layer vary depending on the type of resin composition, etc. In one embodiment, the curing temperature is preferably 120°C to 250°C, more preferably 150°C to 240°C, and even more preferably 170°C to 230°C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0220] The resin composition layer can be preheated at a temperature below the curing temperature before thermal curing. For example, before thermal curing the resin composition layer, it can be preheated at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0221] In manufacturing a printed wiring board, steps (III) of creating holes in the insulating layer, (IV) of roughening the insulating layer, and (V) of forming a conductor layer can be further performed. Steps (III) to (V) can be performed using various methods known to those skilled in the art that are applicable in the manufacture of printed wiring boards. It should be noted that when removing the support after step (II), the removal of the support can be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, as needed, steps (II) to (V) can be repeatedly performed to form the insulating and conductor layers, thereby forming a multilayer printed wiring board.

[0222] In other embodiments, the printed wiring board of the present invention can be manufactured using the prepreg described above. The manufacturing method is basically the same as that used when resin sheets are used.

[0223] Step (III) is the process of creating holes in the insulating layer, thereby forming via holes, through holes, etc. For step (III), depending on the composition of the resin composition used in the formation of the insulating layer, methods such as drills, lasers, and plasma can be used. The size and shape of the holes can be appropriately determined according to the design of the printed circuit board.

[0224] Step (IV) is a roughening process for the insulating layer. Typically, this step (IV) also includes the removal of contaminants. There are no particular limitations on the roughening steps and conditions; known steps and conditions commonly used in forming the insulating layer of a printed wiring board can be employed. For example, the insulating layer can be roughened by sequentially performing a swelling treatment based on a swelling solution, a roughening treatment based on an oxidizing agent, and a neutralization treatment based on a neutralizing solution.

[0225] There are no particular limitations on the swelling solution used in the roughening treatment; examples include alkaline solutions and surfactant solutions, with alkaline solutions being preferred, and sodium hydroxide solutions and potassium hydroxide solutions being more preferred. Commercially available swelling solutions include, for example, "Swelling Dip Securiganth P" and "Swelling Dip Securiganth SBU" manufactured by ATOTECH JAPAN Co., Ltd. There are no particular limitations on the swelling treatment based on the swelling solution; for example, it can be carried out by immersing the insulating layer in a swelling solution at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling solution at 40°C to 80°C for 5 to 15 minutes.

[0226] There are no particular limitations on the oxidant used in the roughening treatment; examples include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment based on oxidants such as alkaline permanganate solutions is preferably performed by immersing the insulating layer in an oxidant solution heated to 60°C to 100°C for 10 to 30 minutes. Furthermore, the concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Commercially available oxidants include, for example, alkaline permanganate solutions such as "Concentrate Compact CP" and "DosingSolution Securiganth P" manufactured by Ammet Japan Co., Ltd.

[0227] In addition, an acidic aqueous solution is preferred as the neutralizing liquid used in the roughening process. For example, commercially available products include "Reduction Solution Securiganth P" manufactured by Ammet Japan Co., Ltd.

[0228] The treatment based on the neutralizing solution can be performed by immersing the surface that has undergone roughening treatment based on the oxidant in a neutralizing solution at 30°C to 80°C for 5 to 30 minutes. From the perspective of operability, it is preferable to immerse the object that has undergone roughening treatment based on the oxidant in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0229] In one embodiment, the arithmetic mean roughness (Ra) of the roughened insulating layer surface is not particularly limited, but is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit; for example, it can be 1 nm or more, 2 nm or more, etc. Furthermore, the root mean square roughness (Rq) of the roughened insulating layer surface is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit; for example, it can be 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0230] Step (V) is the step of forming a conductor layer, which is formed on the insulating layer. There are no particular limitations on the conductor material used in the conductor layer. In a preferred embodiment, the conductor layer comprises one or more metals selected from gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer can be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above-mentioned metals (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). From the viewpoint of versatility, cost, and ease of patterning in conductor layer formation, single metal layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or alloy layers of nickel-chromium alloys, copper-nickel alloys, or copper-titanium alloys, are preferred. Single metal layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or alloy layers of nickel-chromium alloys, are more preferred. A single metal layer of copper is even more preferred.

[0231] The conductor layer can be a single-layer structure or a multi-layer structure consisting of two or more single-metal or alloy layers made of different types of metals or alloys. When the conductor layer is a multi-layer structure, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc, or titanium, or an alloy layer of nickel-chromium alloy.

[0232] The thickness of the conductor layer depends on the desired printed wiring board design, typically 3μm to 35μm, preferably 5μm to 30μm.

[0233] In one embodiment, the conductor layer can be formed by plating. For example, conventionally known techniques such as semi-additive and fully additive methods can be used to plate the surface of the insulating layer to form a conductor layer with the desired wiring pattern. From the viewpoint of ease of manufacturing, the semi-additive method is preferred. Hereinafter, an example of forming a conductor layer using the semi-additive method is shown.

[0234] First, a seed layer is formed on the surface of an insulating layer using electroless plating. Next, a mask pattern is formed on the formed seed layer, corresponding to the desired wiring pattern, exposing a portion of the seed layer. A metal layer is formed on the exposed seed layer using electrolytic plating, and then the mask pattern is removed. Finally, the unwanted seed layer is removed using etching or the like, forming a conductor layer with the desired wiring pattern.

[0235] In other embodiments, the conductor layer can be formed using metal foil. When using metal foil to form the conductor layer, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed, and metal foil is laminated onto the surface of the exposed resin composition layer. The lamination of the resin composition layer and the metal foil can be performed using a vacuum lamination method. The lamination conditions can be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Then, using the metal foil on the insulating layer, a conductor layer with the desired wiring pattern can be formed using conventionally known techniques such as subtractive processing or modified semi-additive processing.

[0236] Metal foils can be manufactured using known methods such as electrolysis and rolling. Commercially available metal foils include, for example, HLP foil and JXUT-III foil manufactured by JX Minerals & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Metals Corporation.

[0237] Semiconductor Devices

[0238] The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention.

[0239] As semiconductor devices, examples include various semiconductor devices that can be used in electrical products (e.g., computers, mobile phones, digital cameras, and televisions) and vehicles (e.g., motorcycles, automobiles, trams, ships, and airplanes).

[0240] Example

[0241] The present invention will now be specifically described through examples. The present invention is not limited to these examples. It should be noted that, unless otherwise explicitly stated, the terms "parts" and "%" in the following description refer to "parts by mass" and "% by mass," respectively. The temperature condition unless otherwise specified is room temperature (25°C). The pressure condition unless otherwise specified is atmospheric pressure (1 atm).

[0242] <Example 1>

[0243] While stirring, 50 parts of polystyrene resin containing oxazoline groups ("RPS-1005" manufactured by Nippon Shokubai Co., Ltd., with an active group equivalent of approximately 3700 g / eq.) were heated and dissolved in 50 parts of toluene and 50 parts of cyclohexanone.

[0244] After cooling to room temperature, 10 parts of a mixed phenolic curing agent (SABIC "SA-90", active group equivalent of approximately 800 g / eq.) and spherical silica (Yaduma "SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., molecular weight 325.2) were used. 2 110 parts of a resin composition were prepared by uniformly dispersing the resin composition (g, average particle size 0.77 μm) using a high-speed rotary mixer and then filtering it using a cartridge filter (ROKITECHNO "SHP020").

[0245] <Example 2>

[0246] Further additions of 12 parts of benzocyclobutene resin (Dow Chemical Company, "CYCLOTEN 3022") and spherical silica (Yarduma, "SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., molecular weight 325.2) were made. 2 The amount of resin composition was changed from 110 parts to 135 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 1 was followed to prepare the resin composition.

[0247] <Example 3>

[0248] Further additions were made of 8 parts of bisphenol AF type epoxy resin (Mitsubishi Chemical Co., Ltd. "YX7760", epoxy equivalent approximately 245 g / eq.), 10 parts of reactive ester-based curing agent (DIC Co., Ltd. "HPC-8000-65T", reactive group equivalent approximately 223 g / eq., toluene solution with a solid content of 65% by mass), and 0.5 parts of curing accelerator (MEK solution with a solid content of 10% of 1B2PZ (1-benzyl-2-phenylimidazolium)). Spherical silica (Yaduma Co., Ltd. "SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., molecular weight 325.2) was also included. 2 The amount of resin composition was changed from 110 parts to 140 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 1 was followed to prepare the resin composition.

[0249] <Example 4>

[0250] Further add 4 parts of alicyclic epoxy resin (Dailul Corporation's "2021P", epoxy equivalent approximately 137 g / eq.), 10 parts of reactive ester curing agent (DIC Corporation's "HPC-8000-65T", reactive group equivalent approximately 223 g / eq., toluene solution with a solid content of 65% by mass), and 0.5 parts of curing accelerator (MEK solution with a solid content of 10% of 1B2PZ (1-benzyl-2-phenylimidazolium)), replacing 10 parts of phenolic curing agent (SABIC Corporation's "SA-90", reactive group equivalent approximately 800 g / eq.), and use an anhydride curing agent (Polyscope Corporation's "XIRAN"). 3.5 parts of spherical silica ("SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., molecular weight 325.2) were prepared with an acid value of approximately 280 g / eq. EF30”. 2 The amount of resin composition was changed from 110 parts to 120 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 1 was followed to prepare the resin composition.

[0251] <Example 5>

[0252] Instead of 4 parts of alicyclic epoxy resin (Daicel Corporation "2021P", epoxy equivalent approximately 137 g / eq.), 5 parts of bisphenol epoxy resin (Nippon Steel Chemical Materials Co., Ltd. "ZX-1059", epoxy equivalent approximately 165 g / eq.) were used; instead of 10 parts of reactive ester curing agent (DIC Corporation "HPC-8000-65T", reactive group equivalent approximately 223 g / eq., toluene solution with 65% by mass solids) were used, 10 parts of reactive ester curing agent (DIC Corporation "HPC-8150-62T", reactive group equivalent approximately 229 g / eq., toluene solution with 62% by mass solids) were used, the resin composition was prepared in the same manner as in Example 4.

[0253] <Example 6>

[0254] Instead of 10 parts of a phenolic curing agent (SABIC's "SA-90", active group equivalent approximately 800 g / eq.), 2.4 parts of a carboxylic acid curing agent containing ester groups (Polyscope's "XIRAN 1440", acid value approximately 185 g / eq.) were used, along with spherical silica (Yaduma's "SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., molecular weight 325.2). 2The amount of resin composition was changed from 110 parts to 96 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure was followed as in Example 1.

[0255] <Example 7>

[0256] Ten parts of benzocyclobutene resin (Dow Chemical Company, "CYCLOTEN 3022") were further added, along with spherical silica (Yaduma, "SC2050-SXF", specific surface area 5.9 m²) that had been surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., molecular weight 325.2). 2 The amount of resin composition was changed from 96 parts to 115 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 6 was followed to prepare the resin composition.

[0257] <Example 8>

[0258] Further additions were made of 4 parts naphthalene-type epoxy resin (DIC Corporation's "HP-4032SS", epoxy equivalent approximately 144 g / eq.), 10 parts reactive ester-based curing agent (DIC Corporation's "HPC-8150-62T", reactive group equivalent approximately 229 g / eq., toluene solution with a solid content of 62% by mass), and 0.5 parts curing accelerator (MEK solution with a solid content of 10% of 1B2PZ (1-benzyl-2-phenylimidazolium)). Spherical silica (Yaduma Corporation's "SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., molecular weight 325.2) was also included. 2 The amount of resin composition was changed from 96 parts to 120 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure was followed as in Example 6.

[0259] <Example 9>

[0260] Spherical silica ("SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., molecular weight 325.2) was used. 2 The amount of resin composition was changed from 110 parts to 140 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 1 was followed to prepare the resin composition.

[0261] <Example 10>

[0262] Spherical silica ("SC2050-SXF", specific surface area 5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., molecular weight 325.2) was used. 2 The amount of resin composition was changed from 110 parts to 40 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 1 was followed to prepare the resin composition.

[0263] <Comparative Example 1>

[0264] 50 parts of a polystyrene resin (RPS-1005, manufactured by Nippon Shokubai Co., Ltd., with an active group equivalent of approximately 3700 g / eq.) without oxazoline groups were used, along with spherical silica (SC2050-SXF, manufactured by Yaduma Co., Ltd., with a specific surface area of ​​5.9 m²) surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., molecular weight 325.2). 2 The amount of resin composition was changed from 110 parts to 120 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 1 was followed to prepare the resin composition.

[0265] <Comparative Example 2>

[0266] Instead of 50 parts of polystyrene resin containing oxazoline groups (RPS-1005 manufactured by Nippon Shokubai Co., Ltd., with an active group equivalent of approximately 3700 g / eq.), 55 parts of epoxy resin (1010 manufactured by Mitsubishi Chemical Co., Ltd., with an epoxy equivalent of approximately 4000 g / eq.) were used, along with spherical silica (SC2050-SXF manufactured by Yaduma Co., Ltd., with a specific surface area of ​​5.9 m²) that had been surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., with a molecular weight of 325.2). 2 The amount of resin composition was changed from 140 parts to 145 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 3 was followed to prepare the resin composition.

[0267] <Comparative Example 3>

[0268] Instead of 50 parts of polystyrene resin containing oxazoline groups (RPS-1005 manufactured by Nippon Shokubai Co., Ltd., with an active group equivalent of approximately 3700 g / eq.), 55 parts of epoxy resin (1010 manufactured by Mitsubishi Chemical Co., Ltd., with an epoxy equivalent of approximately 4000 g / eq.) were used, along with spherical silica (SC2050-SXF manufactured by Yaduma Co., Ltd., with a specific surface area of ​​5.9 m²) that had been surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., with a molecular weight of 325.2). 2The amount of resin composition was changed from 120 parts to 130 parts (g, with an average particle size of 0.77 μm). Otherwise, the preparation of the resin composition was carried out in the same manner as in Example 4.

[0269] <Comparative Example 4>

[0270] Instead of 50 parts of polystyrene resin containing oxazoline groups (RPS-1005 manufactured by Nippon Shokubai Co., Ltd., with an active group equivalent of approximately 3700 g / eq.), 55 parts of epoxy resin (1010 manufactured by Mitsubishi Chemical Co., Ltd., with an epoxy equivalent of approximately 4000 g / eq.) were used, along with spherical silica (SC2050-SXF manufactured by Yaduma Co., Ltd., with a specific surface area of ​​5.9 m²) that had been surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane (Shin-Etsu Chemical Co., Ltd., with a molecular weight of 325.2). 2 The amount of resin composition was changed from 96 parts to 105 parts (with an average particle size of 0.77 μm / g), but otherwise the same procedure as in Example 6 was followed to prepare the resin composition.

[0271] <Determination of the average particle size of inorganic filler materials>

[0272] Weigh 100 mg of inorganic filler, 0.1 g of dispersant (Sannopco "SN9228"), and 10 g of methyl ethyl ketone into a vial and disperse using ultrasound for 20 minutes. Measure the particle size distribution using a laser diffraction particle size distribution analyzer (Shimadzu Corporation "SALD-2200") in a batch cell manner, and calculate the average particle size based on the median particle size.

[0273] <Experimental Example 1: Determination of Relative Permittivity and Dielectric Loss Tangent>

[0274] As a support, a polyethylene terephthalate film (Toray Industries' "Lumirror R80", thickness 38μm, softening point 130℃) that has been molded with an alkyd resin-based release agent (Lintec Corporation's "AL-5") was prepared.

[0275] With the dried resin composition layer having a thickness of 40 μm, the resin compositions prepared in the examples and comparative examples were uniformly coated onto the support using a die coater and dried at 70°C to 95°C for 3 minutes, thereby forming a resin composition layer on the support. Next, a rough surface of a polypropylene film (ALPHAN MA-411, manufactured by Oji F-Tex, with a thickness of 15 μm) was laminated as a protective film onto the surface of the resin composition layer that is not bonded to the support. Thus, a resin sheet having a support, a resin composition layer, and a protective film in sequence was obtained.

[0276] The protective film was peeled off from the obtained resin sheet, and the resin composition layer was heated at 200°C for 90 minutes to thermally cure it. The support was then peeled off to obtain the cured product. Furthermore, regarding the resin sheet obtained from the resin compositions prepared in Examples 2 and 7, it was separated from the former (cured at 200°C for 90 minutes) and heated at 220°C for 90 minutes under a nitrogen atmosphere to thermally cure the resin composition layer. The support was then peeled off to obtain the cured product.

[0277] The obtained cured material was cut into specimens with a width of 2 mm and a length of 80 mm. For these specimens, the relative permittivity and dielectric loss tangent were measured using an Agilent Technologies HP8362B resonant cavity perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23 °C. Measurements were performed on three specimens, and the average value was calculated. Specimens with a relative permittivity below 3.0 and a dielectric loss tangent below 0.004 were rated as "0", while other cases were rated as "×".

[0278] <Experimental Example 2: Determination of Copper Foil Peel Strength (Copper Foil Adhesion Strength)>

[0279] (1) Substrate treatment of copper foil

[0280] For the glossy surface of Mitsui Metals Mining Co., Ltd.'s "3EC-III" (electrolytic copper foil, 35μm), a 1μm etching process was performed using a micro-etching agent (MEC's ​​"CZ8101") to roughen the copper surface. Next, a rust-preventive treatment (CL8300) was applied. Finally, it was heat-treated in an oven at 130°C for 30 minutes. This copper foil is referred to as CZ copper foil.

[0281] (2) Preparation of inner layer substrate

[0282] For the two sides of the glass cloth substrate epoxy resin double copper-clad laminate (copper foil thickness is 18μm, substrate thickness is 0.4mm, Panasonic "R1515A") with inner layer circuits, 1μm etching is performed using micro etchant (MEC "CZ8101") to roughen the copper surface.

[0283] (3) Lamination of copper foil and formation of insulating layer

[0284] The protective film was peeled off from each resin sheet obtained in Test Example 1, exposing the resin composition layer. Using an intermittent vacuum pressure laminator (Nikko-Materials Co., Ltd., 2-stage stacking laminator "CVP700"), the resin composition layer was laminated onto both sides of the inner layer substrate in contact with the inner layer substrate. Lamination was performed as follows: a 30-second depressurization was applied, the pressure was adjusted to below 13 hPa, and then a 30-second pressing was performed at 120°C and 0.74 MPa. Next, a 60-second hot press was performed at 100°C and 0.5 MPa. The CZ copper foil-treated side of this resin composition layer was laminated under the same conditions. Then, the resin composition layer was cured at 200°C for 90 minutes to form an insulating layer, thereby producing an evaluation substrate. Furthermore, the resin sheet obtained from the resin composition prepared in Examples 2 and 7 was separated from the former (cured at 200°C for 90 minutes) and heated at 220°C for 90 minutes under a nitrogen atmosphere to cure the resin composition layer and form an insulating layer, thereby further producing an evaluation substrate.

[0285] (4) Determination of copper foil peel strength

[0286] The prepared evaluation substrate was cut into small pieces of 150×30mm. Using a cutter, 10mm wide and 100mm long slits were made in the copper foil portion of the small pieces. One end of the copper foil was peeled off and held in a clamp. At room temperature, the load (kgf / cm) when peeling 35mm vertically at a speed of 50mm / min was measured to determine the peel strength. A tensile testing machine (TSE Corporation "AC-50C-SL") was used for the measurement. The measurement was performed according to Japanese Industrial Standard (JIS C6481). Cases with a copper foil peel strength of 0.4kgf / cm or higher were rated as "0", and other cases were rated as "×".

[0287] The amount of non-volatile components used in the resin compositions of the examples and comparative examples, the test results, and the judgment results are shown in Table 1 below.

[0288] [Table 1]

[0289]

[0290] As can be seen from the above, by using a resin composition comprising (A) a polystyrene resin containing a cyclic imine ether backbone, (B) a curing agent, and (C) an inorganic filler, a cured product with low relative permittivity (Dk) and dielectric loss tangent (Df) and excellent copper adhesion can be obtained.

Claims

1. A resin composition for forming an insulating layer, wherein, Include: (A) Polystyrene resin containing a cyclic imine ether backbone, (B) Curing agent, and (C) Inorganic filler materials (B) The component contains a curing agent selected from (B-1) phenolic curing agents, (B-2) acid anhydride curing agents, and (B-3) carboxylic acid curing agents. (B-2) contains a styrene / maleic anhydride copolymer curing agent. (B-3) contains a carboxylic acid curing agent with ester groups, which is obtained by esterification and hydrolysis of maleic anhydride polymer. When the non-volatile component in the resin composition is set as 100% by mass, the content of component (A) is 15% by mass or more and 50% by mass or less. When the non-volatile component in the resin composition is set as 100% by mass, the content of component (C) is 40% by mass or more and 80% by mass or less. The mass ratio of component (B) to component (A), i.e., component (B) / (A), is 0.001~0.

3. When measured at 5.8 GHz and 23 °C, the dielectric loss tangent of the cured resin composition was below 0.020°C, with a curing temperature of 200 °C.

2. The resin composition according to claim 1, wherein, (A) The ingredients include: polystyrene resin containing an oxazoline backbone.

3. The resin composition according to claim 1, wherein, (A) The components include: a resin having repeating units shown in formula (1) and repeating units shown in formula (2), In equation (1), R 11 R 12 and R 13 Each can independently represent a hydrogen atom or a substituent; R 14 Each element represents a substituent independently; 'a' represents an integer from 0 to 5. In equation (2), R 21 R 22 and R 23 Each can independently represent a hydrogen atom or a substituent; R 24 Each element represents a substituent independently; X represents a single bond or a linking group; b represents an integer from 0 to 4; n represents an integer from 1 to 4.

4. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (A) is 20% by mass or more.

5. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (A) is 40% by mass or less.

6. The resin composition according to claim 1, wherein, The molar equivalent ratio of the reactive group of component (B) to the cyclic imine ether skeleton of component (A), i.e., the ratio of the reactive group of component (B) to the cyclic imine ether skeleton of component (A), is less than 1.

7. The resin composition according to claim 1, wherein, The molar equivalent ratio of the reactive group of component (B) to the cyclic imine ether skeleton of component (A), i.e., the ratio of the reactive group of component (B) to the cyclic imine ether skeleton of component (A), is 0.97 or less.

8. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (B) is 0.05% by mass or more.

9. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (B) is 1% by mass or more.

10. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (B) is less than 10% by mass.

11. The resin composition according to claim 1, wherein the mass ratio of component (B) to component (A), i.e., component (B) / (A) is 0.01 or more.

12. The resin composition according to claim 1, wherein the mass ratio of component (B) to component (A), i.e., component (B) / (A) is 0.04 or more.

13. The resin composition according to claim 1, wherein, (C) is composed of silicon dioxide.

14. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 50% by mass or more.

15. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 60% by mass or more.

16. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 75% by mass or less.

17. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 70% by mass or less.

18. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 67% by mass or less.

19. The resin composition according to claim 1, wherein, The mass ratio of component (C) to component (A), i.e., component (C) / (A) is 0.8 or higher.

20. The resin composition according to claim 1, wherein, The mass ratio of component (C) to component (A), i.e., component (C) / (A) is 5 or less.

21. The resin composition according to claim 1, wherein, The mass ratio of component (C) to component (A), i.e., component (C) / (A) is 1.5 or more.

22. The resin composition according to claim 1, wherein, The mass ratio of component (C) to component (A), i.e., component (C) / (A) is 3 or less.

23. The resin composition according to claim 1, wherein, It further includes (D) epoxy resin.

24. The resin composition according to claim 23, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (D) is 0.01% by mass or more.

25. The resin composition according to claim 23, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (D) is 2% by mass or more.

26. The resin composition according to claim 23, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (D) is 30% by mass or less.

27. The resin composition according to claim 23, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (D) is less than 5% by mass.

28. The resin composition according to claim 1, wherein, It further includes (G) benzocyclobutene resin.

29. The resin composition according to claim 28, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (G) is 0.01% by mass or more.

30. The resin composition according to claim 28, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (G) is 5% by mass or more.

31. The resin composition according to claim 28, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (G) is 30% by mass or less.

32. The resin composition according to claim 28, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (G) is 10% by mass or less.

33. The resin composition according to claim 1, wherein, When measured at 5.8 GHz and 23 °C, the dielectric loss tangent of the cured resin composition was below 0.004, with a curing temperature of 200 °C.

34. The resin composition according to claim 1, wherein, When measured at 5.8 GHz and 23 °C, the dielectric loss tangent of the cured resin composition was below 0.003, with a curing temperature of 200 °C.

35. The resin composition according to claim 1, wherein, When measured at 5.8 GHz and 23 °C, the relative permittivity of the cured resin composition was below 5.0, with a curing temperature of 200 °C.

36. The resin composition according to claim 1, wherein, When measured at 5.8 GHz and 23 °C, the relative permittivity of the cured resin composition was below 3.0, with a curing temperature of 200 °C.

37. The resin composition according to claim 1, wherein, When measured at 5.8 GHz and 23 °C, the relative permittivity of the cured resin composition was below 2.8, with a curing temperature of 200 °C.

38. The resin composition according to claim 1, used to form an insulating layer of a printed wiring board.

39. A cured product, which is a cured product of the resin composition according to any one of claims 1 to 38.

40. A sheet-like laminated material comprising the resin composition according to any one of claims 1 to 38.

41. A resin sheet, comprising: Support body, and A resin composition layer formed of any one of claims 1 to 38 is disposed on the support.

42. A printed wiring board having an insulating layer formed from a cured resin composition according to any one of claims 1 to 38.

43. A semiconductor device comprising the printed wiring board of claim 42.

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