Resin composition

Abstract

Problems to be solved by the present invention are to provide: a curable product having small warpage, a large elastic modulus, and excellent adhesion to an inorganic material, and a resin composition or a resin paste having excellent peelability from a film material; a curable product, a resin sheet, a printed wiring board, a semiconductor chip package, a semiconductor device, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor chip package. The solution of the present invention is a resin composition comprising (A) an epoxy resin, (B) a compound having a radically polymerizable unsaturated group and a polyoxyalkylene structure and being a compound satisfying specific conditions, (C) an acid anhydride, (D) a radical generator, and (E) an inorganic filler, and the mass ratio [b]:[c] of the component (B) to the component (C) is in the range of 0.2:1 to 1.5:1.

Description

Technical Field

[0001] The present invention relates to a resin composition. Further, it relates to a resin paste, a cured product, a resin sheet, a printed wiring board, a semiconductor chip package, a semiconductor device, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor chip package. Background Art

[0002] In order to seal a printed wiring board or a semiconductor chip included in a semiconductor device, a liquid resin composition is sometimes used as a sealing material. In Patent Document 1, a liquid epoxy resin composition is disclosed as a sealing material, which contains (a) an epoxy resin, (b) a curing agent, (c) a latent catalyst, (d) a polymerizable monomer having two or more radically polymerizable double bonds, (e) a radical polymerization initiator, and (f) an inorganic filler (Claim 2). In Patent Document 2, a liquid epoxy resin composition containing an epoxy resin that is liquid at normal temperature, an amine curing agent, a thermosetting acrylic resin, a thermal polymerization initiator of the thermosetting acrylic resin, and an inorganic filler is disclosed (Claim 1).

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Laid-Open No. 11-255864

[0006] Patent Document 2: Japanese Patent Laid-Open No. 2014-094981. Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] Even as a resin composition for compression molding, a cured product with little warpage is generally required. Further, from the viewpoint of improving the processability of a printed wiring board and a semiconductor chip package, a cured product having a large elastic modulus is required. However, as a result of the inventors' research, a cured product with little warpage tends to have a small elastic modulus. In addition, a cured product with a large elastic modulus tends to have a large warpage. Thus, there is a trade-off (the first trade-off) relationship between reducing warpage and increasing the elastic modulus, and it is difficult to achieve both.

[0009] In addition, for the cured product of the resin composition used as a sealing material, from the viewpoint of reliability, it is required that the cured product has high adhesion (hereinafter also referred to as "inorganic material adhesion") to the inorganic material (such as silicon or copper) in contact therewith. On the other hand, for the resin composition layer (compression molded product) obtained by compression molding the resin composition, excellent peelability from the release film (hereinafter also referred to as "film material peelability") is required. Here, the release film refers to a film material having releasability generally used in compression molding. By interposing the release film between the resin composition layer and the mold during compression molding, direct contact between the resin composition layer and the mold can be prevented, and thus, after compression molding, it can be expected that the resin composition layer can be easily taken out.

[0010] However, the research results of the inventors have shown that: when the cured product of the resin composition has high adhesion to the inorganic material, there is generally a tendency that there is also high adhesion between the resin composition layer (compression molded product) of the resin composition and the release film (the second trade-off). Therefore, there are sometimes cases where: after compression molding, it becomes not as easy as expected to remove the resin composition layer from the mold; or even if the resin composition layer can be removed from the mold, it is difficult to peel the release film from the resin composition layer.

[0011] Due to the above situation, for the resin composition for compression molding, it is required to eliminate both the first trade-off between "reduction of warpage of the cured product" and "increase in elastic modulus of the cured product", and the second trade-off between "high adhesion between the cured product and the inorganic material" and "high peelability of the resin composition layer (compression molded product) from the film material". If these trade-offs are eliminated, it can be expected that the treatment of the resin composition layer (compression molded product) of the resin composition becomes easy, and for example, the treatment of a sealed body obtained by sealing a semiconductor chip with the cured product of the resin composition becomes easy.

[0012] The subject of the present invention is to provide: a resin composition or resin paste capable of obtaining a cured product with small warpage, large elastic modulus, excellent adhesion to inorganic materials, and excellent peelability from the film material; and a cured product, resin sheet, printed wiring board, semiconductor chip package, semiconductor device, method for manufacturing a printed wiring board, and method for manufacturing a semiconductor chip package obtained by using the resin composition or resin paste.

[0013] Solutions for solving the subject

[0014] The present inventors have made intensive studies and as a result, have found that: by containing a specific component in a specific blending amount in the resin composition, the above-mentioned subject can be solved, and thus the present invention has been completed.

[0015] That is, the present invention includes the following contents;

[0016] [1]A resin composition, comprising:

[0017] (A) An epoxy resin,

[0018] (B) A compound having a radically polymerizable unsaturated group and a polyalkylene oxide structure in the molecule, and the compound satisfies the following formula (1):

[0019] E / N-(100×N)≥50···(1)

[0020] (In formula (1), E represents the equivalent weight (g / eq.) of the radically polymerizable unsaturated group, N represents the number of radically polymerizable unsaturated groups in the molecule, and it is an integer of 1 or more),

[0021] (C) An acid anhydride,

[0022] (D) A radical generator, and

[0023] (E) An inorganic filler,

[0024] The mass ratio [b]:[c] of component (B) to component (C) is in the range of 0.2:1 to 1.5:1;

[0025] [2] The resin composition according to [1], wherein the polyalkylene oxide structure of component (B) is represented by the formula: -(R B O) n -, in the above formula, n is an integer of 2 or more, and R B are each independently an alkylene group having 1 to 6 carbon atoms which may optionally have a substituent;

[0026] [3] The resin composition according to [2], wherein among a plurality of groups R B , at least one group R B contains ethylene;

[0027] [4] The resin composition according to any one of [1] to [3], wherein the radically polymerizable unsaturated group of component (B) is one or more selected from vinyl, allyl, 1-butenyl, 2-butenyl, acryloyl, methacryloyl, fumaroyl, maleoyl, vinylphenyl, styryl and cinnamoyl;

[0028] [5] The resin composition according to [4], wherein the radically polymerizable unsaturated group of component (B) contains one or more selected from methacryloyl and acryloyl;

[0029] [6] The resin composition according to [4] or [5], wherein the radically polymerizable unsaturated group of component (B) includes a methacryloyl group;

[0030] [7] The resin composition according to any one of [1] to [6], wherein component (B) includes one or more compounds selected from the compound with N = 1 in formula (1) and the compound with N = 2 in formula (1);

[0031] [8] The resin composition according to [7], wherein the molecular weight of the compound with N = 1 in formula (1) is 150 or more;

[0032] [9] The resin composition according to [7] or [8], wherein the equivalent weight (g / eq.) of the radically polymerizable unsaturated group of the compound with N = 2 in formula (1) is 500 or more;

[0033]

[10] The resin composition according to any one of [1] to [9], wherein the equivalent weight of the radically polymerizable unsaturated group of component (B) is 4500 g / eq. or less;

[0034]

[11] The resin composition according to any one of [1] to

[10] , wherein when the components other than the (E) inorganic filler in the non-volatile components of the resin composition are set to 100% by mass, the content of component (B) is 10% by mass or more and 40% by mass or less;

[0035]

[12] The resin composition according to any one of [1] to

[11] , wherein the value of the equivalent ratio (c) / (a) of "the sum of the values obtained by dividing the amount (g) of component (C) by the equivalent weight (g / eq.) of the acid anhydride group possessed by the component (C)" and "the sum of the values obtained by dividing the amount (g) of component (A) by the equivalent weight (g / eq.) of the epoxy group possessed by the component (A)" is 0.4 or more;

[0036]

[13] The resin composition according to any one of [1] to

[12] , wherein component (D) is one or more selected from radical generators having a 10-hour half-life temperature T10 (°C) in the range of 50°C or more and 110°C or less;

[0037]

[14] The resin composition according to any one of [1] to

[13] , wherein when the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (E) is 70% by mass or more;

[0038]

[15] The resin composition according to any one of [1] to

[14] , which is used for compression molding;

[0039]

[16] The resin composition according to

[15] , wherein the component (D) is one or more selected from radical generators in which the difference ΔT (°C) between the mold temperature Tc (°C) during compression molding and the 10-hour half-life temperature T10 (°C) of the component (D) is in the range of 20°C or more and 80°C or less;

[0040]

[17] The resin composition according to any one of [1] to

[16] , which is used for forming an insulating layer;

[0041]

[18] A resin paste, which contains the resin composition according to any one of [1] to

[17] ;

[0042]

[19] A cured product, which is a cured product of the resin composition according to any one of [1] to

[17] or the resin paste according to

[18] ;

[0043]

[20] A resin sheet, which has:

[0044] a support, and

[0045] a resin composition layer provided on the support and containing the resin composition according to any one of [1] to

[17] or the resin paste according to

[18] ;

[0046]

[21] A printed wiring board, which contains an insulating layer formed by using the cured product of the resin composition according to any one of [1] to

[17] or the resin paste according to

[18] ;

[0047]

[22] A semiconductor chip package, which contains:

[0048]

[21] the printed wiring board, and

[0049] a semiconductor chip mounted on the printed wiring board;

[0050]

[23] A semiconductor chip package, which contains:

[0051] a semiconductor chip, and

[0052] a cured product of the resin composition according to any one of [1] to

[17] or the resin paste according to

[18] for sealing the semiconductor chip;

[0053]

[24] A semiconductor device, which contains the printed wiring board according to

[21] , or the semiconductor chip package according to

[22] or

[23] ;

[0054]

[25] A method for manufacturing a printed wiring board, which includes:

[0055] A step of forming a resin composition layer containing the resin composition according to any one of [1] to

[17] or a resin composition layer containing the resin paste according to

[18] on a circuit board by a compression molding method, and

[0056] A step of curing the resin composition layer;

[0057]

[26] A method for manufacturing a semiconductor chip package, which includes:

[0058] A step of forming a resin composition layer containing the resin composition according to any one of [1] to

[17] or a resin composition layer containing the resin paste according to

[18] on a semiconductor chip by a compression molding method, and

[0059] A step of curing the resin composition layer.

[0060] Effects of the Invention

[0061] According to the present invention, it is possible to provide: a cured product having small warpage, a large elastic modulus, and excellent adhesion to an inorganic material, a resin composition or a resin paste having excellent peelability from a film material; and a cured product, a resin sheet, a printed wiring board, a semiconductor chip package, a semiconductor device, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor chip package obtained by using the resin composition or the resin paste. Detailed Description of the Invention

[0062] Hereinafter, the resin composition, resin paste, cured product, resin sheet, printed wiring board, semiconductor chip package, semiconductor device, method for manufacturing a printed wiring board, and method for manufacturing a semiconductor chip package of the present invention will be described in detail.

[0063] [Resin Composition]

[0064] The resin composition of the present invention contains (A) an epoxy resin, (B) a compound having a radically polymerizable unsaturated group and an alkylene oxide structure and satisfying specific conditions, (C) an acid anhydride, (D) a radical generator, and (E) an inorganic filler, and [b]:[c] representing the mass ratio of component (B) to component (C) is in the range of 0.2:1 to 1.5:1. According to this resin composition, the following effects are exhibited: a cured product having small warpage, a large elastic modulus, and excellent adhesion to an inorganic material, and excellent peelability from a film material can be obtained. If such a resin composition is used, it is possible to provide a resin paste, a cured product, a resin sheet, a printed wiring board, a semiconductor chip package, and a semiconductor device that can exhibit the above effects.

[0065] In the resin composition of the present invention, in addition to the components (A), (B), (C), (D), and (E), any components may be further combined and included. Examples of the optional components include, for example, (F) a curing accelerator, (G) a compound having a radically polymerizable unsaturated group (excluding a compound having a polyoxyalkylene structure), and (H) other additives. Hereinafter, each component contained in the resin composition will be described in detail. It should be noted that in the present invention, unless otherwise specified, the content of each component in the resin composition is based on the value when the non-volatile component in the resin composition is set to 100% by mass.

[0066] <(A) Epoxy resin>

[0067] The resin composition of the present invention contains (A) an epoxy resin. An epoxy resin refers to a resin having one or more epoxy groups in the molecule. By containing (A) an epoxy resin in the resin composition, a cured product having a crosslinked structure can be obtained.

[0068] Examples of the epoxy resin include, for example, bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butylcatechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, epoxy resin containing a spiro ring, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, and oxyalkylene type epoxy resin. The epoxy resin may be used alone or in combination of two or more.

[0069] (A) component preferably contains an epoxy resin having two or more epoxy groups in the molecule. Preferably, when the non-volatile component of (A) component is set to 100% by mass, it is usually 50% by mass or more, preferably 60% by mass or more, and more preferably 70% by mass or more of an epoxy resin having two or more epoxy groups in the molecule.

[0070] The epoxy resin may be (A-1) a liquid epoxy resin or alternatively may be (A-2) a solid epoxy resin. The resin composition may contain both (A-1) a liquid epoxy resin and (A-2) a solid epoxy resin in combination. From the viewpoint of obtaining a resin composition with excellent fluidity during molding, the component (A) is preferably (A-1) a liquid epoxy resin. As needed, the component (A) may further contain (A-2) a solid epoxy resin.

[0071] ((A-1) liquid epoxy resin)

[0072] (A-1) The liquid epoxy resin refers to an epoxy resin that is in a liquid state at a temperature of 20°C. The resin composition preferably contains (A-1) a liquid epoxy resin.

[0073] As the liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in the molecule is preferred, and an aromatic liquid epoxy resin having two or more epoxy groups in the molecule is more preferred. In the present invention, an aromatic epoxy resin refers to an epoxy resin having an aromatic ring in its molecule.

[0074] As the liquid epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin having an ester skeleton, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, glycidylamine type epoxy resin, alkylene oxide type epoxy resin, and epoxy resin having a butadiene structure are preferred, and bisphenol A type epoxy resin, naphthalene type epoxy resin, and glycidylamine type epoxy resin are more preferred.

[0075] As specific examples of the liquid epoxy resin, the following can be cited: "YX7400" manufactured by Mitsubishi Chemical Corporation; "HP4032", "HP4032D", "HP-4032-SS" (naphthalene-type epoxy resin) manufactured by DIC Corporation; "828US", "jER828EL", "825", "828EL" (bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER807", "1750" (bisphenol F-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD" (glycidylamine-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "EP3950L" (glycidylamine-type epoxy resin) manufactured by ADEKA Corporation; "ZX1059" (a mixture of bisphenol A-type epoxy resin and bisphenol F-type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; "EX-721" (glycidyl ester-type epoxy resin) manufactured by Nagase ChemteX Corporation; "CELLOXIDE 2021P" (alicyclic epoxy resin having an ester skeleton) manufactured by Daicel Corporation; "PB-3600" (epoxy resin having a butadiene structure) manufactured by Daicel Corporation; "ZX1658", "ZX1658GS" (liquid 1,4-glycidylcyclohexane-type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., etc. These epoxy resins can be used alone or in combination of two or more. As exemplified in the following examples, it is one of the preferred modes to use one or more liquid epoxy resins selected from "ZX1059" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., "HP-4032-SS" manufactured by DIC Corporation, and "630LSD" manufactured by Mitsubishi Chemical Corporation. From the viewpoint of reducing the warpage of the cured product, it is better to use two or more liquid epoxy resins selected from "ZX1059" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., "HP-4032-SS" manufactured by DIC Corporation, and "630LSD" manufactured by Mitsubishi Chemical Corporation. In addition, from the viewpoint of reducing the warpage of the cured product, it is still better to use "ZX1059" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and two or more selected from "HP-4032-SS" manufactured by DIC Corporation and "630LSD" manufactured by Mitsubishi Chemical Corporation as the liquid epoxy resin.

[0076] From the viewpoints of obtaining the effects resulting from the inclusion of the component (A-1) (e.g., improvement in the processability (flowability during molding) of the resin composition, improvement in compatibility) and obtaining a cured product with little warpage, when the non-volatile components in the resin composition are 100% by mass, the content of the component (A-1) in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Regarding the upper limit of the content of the component (A-1), there is no particular limitation as long as the effects of the present invention are not overly impaired. For example, it is 30% by mass or less or 25% by mass or less. From the viewpoint of obtaining a cured product with a large elastic modulus, it can be set to 20% by mass or less or 15% by mass or less.

[0077] ((A-2) Solid epoxy resin)

[0078] The solid epoxy resin refers to an epoxy resin that is solid at a temperature of 20°C. The resin composition may contain only the (A-1) liquid epoxy resin as the component (A), but from the viewpoint of increasing the crosslinking density, it is preferably a combination of the (A-1) liquid epoxy resin and the (A-2) solid epoxy resin. As the solid epoxy resin, it is preferably a solid epoxy resin having 3 or more epoxy groups in the molecule.

[0079] As the solid epoxy resin, it is preferably a bisxylenol type epoxy resin, a naphthalene type epoxy resin, a naphthalene type tetrafunctional epoxy resin, a cresol novolak type epoxy resin, a dicyclopentadiene type epoxy resin, a triphenol type epoxy resin, a naphthol type epoxy resin, a biphenyl type epoxy resin, a naphthyl ether type epoxy resin, an anthracene type epoxy resin, a bisphenol A type epoxy resin, a bisphenol AF type epoxy resin, a tetraphenylethane type epoxy resin, and more preferably a naphthol type epoxy resin, a bisphenol AF type epoxy resin, a naphthalene type epoxy resin, and a biphenyl type epoxy resin.

[0080] As specific examples of the solid epoxy resin, the following can be cited: "HP4032H" (naphthalene-type epoxy resin) manufactured by DIC Corporation; "HP-4700", "HP-4710" (naphthalene-type tetrafunctional epoxy resin) manufactured by DIC Corporation; "N-690" (cresol novolak-type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolak-type epoxy resin) manufactured by DIC Corporation; "HP7200L", "HP-7200", "HP-7200HH", "HP-7200H" (dicyclopentadiene-type epoxy resin) manufactured by DIC Corporation; "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000", "HP6000L" (naphthyl ether-type epoxy resin) manufactured by DIC Corporation; "EPPN-502H" (triphenol-type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolak-type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl-type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V" (naphthol-type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; "ESN485" (naphthol novolak-type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; "YX4000H", "YX4000", "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX4000HK" (xylenol-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100", "CG-500" manufactured by Osaka Gas Chemical Co., Ltd.; "157S70" (bisphenol A novolak-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7760" (bisphenol AF-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane-type epoxy resin) manufactured by Mitsubishi Chemical Corporation, etc. These can be used alone or in combination of two or more kinds.

[0081] When the non-volatile components in the resin composition are set to 100% by mass, the content of the component (A-2) in the resin composition can be 0% (i.e., not contained). From the viewpoint of obtaining the effects resulting from the inclusion of the component (A-2) (for example, from the viewpoint of reducing the average linear thermal expansion coefficient, improving heat resistance, or having a good crosslinking density), it is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, still more preferably 0.1% by mass or more, and particularly preferably 0.2% by mass or more. The upper limit of the content of the component (A-2) is preferably less than the content of the component (A-1). From the viewpoint of moderately suppressing the crosslinking density, when the non-volatile components in the resin composition are set to 100% by mass, the upper limit of the content of the component (A-2) can be set to 10% by mass or less, 5% by mass or less, 3% by mass or less, or 1% by mass or less.

[0082] As the component (A), in the case of using the (A-1) liquid epoxy resin and the (A-2) solid epoxy resin in combination, their quantitative ratio (liquid epoxy resin: solid epoxy resin) is preferably in the range of 1:0.01 to 1:0.8 by mass ratio. By setting the quantitative ratio of the (A-1) liquid epoxy resin and the (A-2) solid epoxy resin within the above range, the following effects can be obtained: i) appropriate fluidity can be brought during molding, ii) the processability is improved when used in the form of a resin composition molded article, and iii) a cured product having sufficient fracture strength can be obtained. From the viewpoints of obtaining the above effects i) to iii) and moderately suppressing the crosslinking density, the quantitative ratio of the (A-1) liquid epoxy resin and the (A-2) solid epoxy resin (liquid epoxy resin: solid epoxy resin) is more preferably in the range of 1:0.01 to 1:0.5 by mass ratio, and still more preferably in the range of 1:0.01 to 1:0.1 by mass ratio.

[0083] The epoxy equivalent of the component (A) is preferably 50 g / eq. to 5000 g / eq., more preferably 50 g / eq. to 3000 g / eq., still more preferably 70 g / eq. to 2000 g / eq., and even more preferably 70 g / eq. to 1000 g / eq. By being in this range, the crosslinking density of the cured product becomes sufficient, and a cured product having excellent strength and heat resistance can be obtained. It should be noted that the epoxy equivalent can be measured according to JIS K7236, which is the mass of the resin containing 1 equivalent of epoxy groups.

[0084] The weight average molecular weight of the component (A) is preferably 100 to 5000, more preferably 250 to 3000, and still more preferably 400 to 1500. Here, the weight average molecular weight of the epoxy resin is the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC) method.

[0085] From the viewpoint of enhancing the desired effects of the present invention, when the non-volatile components in the resin composition are set to 100% by mass, the content of component (A) in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Regarding the upper limit of the content of component (A), there is no particular limitation as long as the effects of the present invention are not overly impaired. For example, it is 30% by mass or less or 25% by mass or less. From the viewpoint of obtaining a cured product with a large elastic modulus, it can be set to 20% by mass or less or 15% by mass or less.

[0086] From the viewpoint of enhancing the desired effects of the present invention, when the components other than component (E) (inorganic filler) in the non-volatile components of the resin composition are set to 100% by mass, the content of component (A) is preferably 10% by mass or more, more preferably 15% by mass or more, still more preferably 20% by mass or more, and particularly preferably 25% by mass or more. Regarding the upper limit of the content of component (A), there is no particular limitation as long as the effects of the present invention are not overly impaired. For example, it is 70% by mass or less or 65% by mass or less. From the viewpoint of obtaining a cured product with little warpage, it can be set to 50% by mass or less, 48% by mass or less, or 45% by mass or less.

[0087] From the viewpoint of enhancing the desired effects of the present invention, the content (by mass) of component (A) in the resin composition is preferably at least one-fifth, more preferably at least one-fourth, and still more preferably at least three-tenths of the total content (by mass) of component (B) and component (C). The percentage of the mass ratio value [a] / ([b]+[c]) of the "content of component (A)" to the "total content of component (B) and component (C)" in the resin composition is preferably 20% by mass or more, more preferably 25% by mass or more, and still more preferably 30% by mass or more. Regarding the upper limit of the percentage of the mass ratio value [a] / ([b]+[c]), from the viewpoint of further enhancing the desired effects of the present invention, it can be set to 100% by mass or less, 90% by mass or less, or 80% by mass or less.

[0088] <(B) A compound having a radically polymerizable unsaturated group and a polyoxyalkylene structure and satisfying specific conditions>

[0089] The resin composition of the present invention contains: (B) a compound having a radically polymerizable unsaturated group and a polyoxyalkylene structure and satisfying specific conditions (hereinafter also referred to as "the radically reactive polyRO compound of the present invention"). Two or more kinds of the radically reactive polyRO compound of the present invention can be used. It is considered that by including the component (B) in combination with the components (A) and (C) in the resin composition, the component (B) contributes to at least a part of the effects (warpage, adhesion to inorganic materials, elastic modulus, and film peeling property) desired in the present invention. In particular, the flexibility brought by the polyoxyalkylene structure greatly contributes to the reduction of warpage and the improvement of adhesion to inorganic materials of the cured product.

[0090] Examples of the radically polymerizable unsaturated group possessed by the component (B) include groups containing an ethylenic carbon-carbon double bond. As specific examples, one or more selected from vinyl, allyl, 1-butenyl, 2-butenyl, acryloyl, methacryloyl, fumaroyl, maleoyl, vinylphenyl, styryl, and cinnamoyl can be cited. The component (B) may contain two or more radically polymerizable unsaturated groups in one molecule. From the viewpoint of improving reactivity, the radically polymerizable unsaturated group possessed by the component (B) preferably contains one or more selected from methacryloyl and acryloyl, and from the viewpoint of controlling reactivity, more preferably contains methacryloyl. Further, from the viewpoint of obtaining a cured product with small warpage, the component (B) preferably has a radically polymerizable unsaturated group at the molecular end.

[0091] The specific conditions that the component (B) should satisfy are the following formula (1):

[0092] E / N-(100×N)≥50···(1)

[0093] (In the formula (1), E represents the equivalent weight (g / eq.) of the radically polymerizable unsaturated group, and N represents the number of radically polymerizable unsaturated groups in the molecule, which is an integer of 1 or more). The equivalent weight of the radically polymerizable unsaturated group means the mass of the resin containing 1 equivalent of the radically polymerizable unsaturated group. By satisfying this condition, the effects desired in the present invention can be exhibited. N can be set to, for example, 5 or less, 4 or less, or 3 or less.

[0094] The above formula (1) means that the molecular weight per 1 equivalent (corresponding to the term "E / N" in formula (1)) needs to be sufficiently large according to the number N of radically polymerizable unsaturated groups. Specifically, when N is 1, the above formula (1) means that the molecular weight of the compound needs to be 150 or more; when N is 2, it means that the equivalent weight (g / eq.) of the radically polymerizable unsaturated groups of the compound needs to be 500 or more (i.e., the molecular weight is 1000 or more). Thus, it is considered that by making the molecular weight per 1 equivalent of component (B) a larger value according to the number of radically polymerizable unsaturated groups, there is a tendency to suppress an increase in warpage caused by the influence of curing shrinkage of the resin composition.

[0095] Component (B) includes, for example, one or more compounds selected from the compounds in which N is 1 in formula (1) and the compounds in which N is 2 in formula (1). Here, as described above, the compound in which N is 1 in formula (1) is a compound having a molecular weight of 150 or more. Similarly, the compound in which N is 2 in formula (1) is a compound having an equivalent weight (g / eq.) of the radically polymerizable unsaturated groups of 500 or more.

[0096] When component (B) is the compound in which N is 1 in the above formula (1), the equivalent weight of its radically polymerizable unsaturated groups is 150 g / eq. or more, and the lower limit can be set to 250 g / eq. or more or 400 g / eq. or more. When component (B) is the compound in which N is 2 in the above formula (1), the equivalent weight of its radically polymerizable unsaturated groups is 500 g / eq. or more, and the lower limit can be set to 510 g / eq. or more or 600 g / eq. or more. From the viewpoint of improving the desired effects of the present invention, the upper limit of the equivalent weight of the radically polymerizable unsaturated groups of the radically reactive poly RO compound of the present invention can be set to 4500 g / eq. or less. From the viewpoint of improving the fluidity of the resin composition (the viscosity of the resin composition or the filling property of the inorganic filler), the upper limit of the equivalent weight of the radically polymerizable unsaturated groups is preferably 3000 g / eq. or less, more preferably 2000 g / eq. or less, and still more preferably 1500 g / eq. or less. When the resin composition contains a plurality of the radically reactive poly RO compounds of the present invention as component (B), it is preferable that the equivalent weights of the radically polymerizable unsaturated groups of the respective compounds satisfy the above range.

[0097] In the present embodiment, the polyoxyalkylene structure possessed by component (B) is represented by formula (2): -(R B O) n -, where, in formula (2), n is an integer of 2 or more, and R BEach is independently an optionally substituted alkylene group having 1 to 6 carbon atoms. Component (B) contains at least 1 polyoxyalkylene structure in 1 molecule, and from the viewpoint of obtaining a cured product having excellent adhesion to an inorganic material, it is preferably to contain 2 or more polyoxyalkylene structures in 1 molecule. In this case, the plurality of polyoxyalkylene structures may be the same or different from each other. When the radical-reactive poly RO compound of the present invention contains a plurality of polyoxyalkylene structures that are the same or different from each other, the repeating number of the oxyalkylene structure per 1 molecule (hereinafter also referred to as "RO number") is represented by the total of the values of n shown in the formula (2) representing each oxyalkylene structure. That is, the RO number refers to the number of the divalent group R B in the radical-reactive poly RO compound of the present invention contained in 1 molecule.

[0098] In the above formula (2), from the viewpoint of obtaining a cured product having excellent adhesion, n is 2 or more, preferably 4 or more, more preferably greater than 9 or 9 or more, and further preferably 11 or more as an integer. From the viewpoint of improving the fluidity of the resin composition (viscosity of the resin composition or filling property of the inorganic filler), n is usually 101 or less, preferably 90 or less, more preferably 68 or less, and further preferably 65 or less as an integer.

[0099] In the above formula (2), the number of carbon atoms of the alkylene group contained in R B is usually 1 to 6. From the viewpoint of obtaining a cured product having excellent adhesion to an inorganic material by increasing the content ratio of the oxygen atom as a polar part contained in the polyoxyalkylene structure, it is preferably 1 to 5, more preferably 1 to 4, further preferably 1 to 3, and particularly preferably 1 to 2. From the viewpoint of obtaining a cured product with reduced warpage caused by the influence of curing shrinkage, it is preferably 2 to 5, more preferably 2 to 4, and further preferably 2 to 3. In the above formula (2), from the viewpoints of obtaining a cured product having excellent adhesion to an inorganic material and obtaining a cured product with reduced warpage caused by the influence of curing shrinkage, the number of carbon atoms of the alkylene group contained in R B is typically particularly preferably 2. Therefore, in the above formula (2), among the plurality of groups R B , it is a particularly good example that at least one group R B contains ethylene.

[0100] In the above formula (2), the alkylene group contained in R B usually does not have a substituent, but may optionally have a substituent. Examples of such a substituent include: an alkyl group having 1 to 3 carbon atoms, a halogen atom, -OH, -O-C 1-5 alkyl, -N(C 1-5 alkyl)2, C 1-5 alkyl, C 6-10Aryl, -NH2, -CN, -C(O)O-C 1-5 Alkyl, -COOH, -C(O)H, epoxy group, -NO2, etc. From the viewpoint of improving the reactivity with the component (A) and / or the component (C), such substituents are preferably an epoxy group, -OH, -NH2, and -COOH. It should be noted that even when the radical-reactive poly RO compound of the present invention has an epoxy group in the molecule, as long as it is a compound having a radically polymerizable unsaturated group and a polyoxyalkylene structure and satisfies the above specific conditions, it is classified as the component (B). Thus, the radical-reactive poly RO compound of the present invention also preferably contains a group reactive with the component (A) and / or the component (C), preferably a group reactive with the component (A), whereby a crosslinked structure can be formed and a cured product having a high elastic modulus and excellent processability can be obtained. In this case, "one or more radical-reactive poly RO compounds containing a group reactive with the component (A) and / or the component (C)" and "one or more radical-reactive poly RO compounds not containing a group reactive with the component (A) and / or the component (C)" can be used in combination. Further, from the viewpoint of obtaining a cured product having a low dielectric loss tangent, it is preferable to exclude halogen atoms from the substituents of the alkylene group contained in R B . Regarding the substituents, they can be contained alone or in combination of two or more kinds.

[0101] As a specific example of the polyoxyalkylene structure possessed by the component (B), the following can be cited: polyoxyethylene structure (-(C2H4O) n -; here, n is the same as n in the formula (2)), polyoxypropylene structure (-(C3H6O) n -; here, n is the same as n in the formula (2)), polyoxy-n-butylene structure (-(C4H8O) n -; here, n is the same as n in the formula (2)), poly(ethylene oxide-co-propylene oxide) structure, poly(ethylene oxide-ran-propylene oxide) structure, poly(ethylene oxide-alt-propylene oxide) structure, and poly(ethylene oxide-block-propylene oxide) structure. Among them, from the viewpoint of obtaining a cured product having excellent adhesion to an inorganic material, the polyoxyalkylene structure possessed by the component (B) is preferably any of the above polyoxyethylene structure and the above polyoxypropylene structure, and more preferably the above polyoxyethylene structure. However, epoxy resins having an oxyalkylene structure are excluded from the component (B).

[0102] When the radical-reactive poly RO compound of the present invention contains one or more polyethylene oxide structures in one molecule, the number of repetitions of the ethylene oxide structure per molecule (hereinafter also referred to as "EO number") is 2 or more. From the viewpoint of obtaining a cured product with excellent adhesion, it is preferably 4 or more, more preferably more than 9 or 9 or more, further preferably an integer of 11 or more, and usually 101 or less. From the viewpoint of improving the fluidity of the resin composition (viscosity of the resin composition or filling property of the inorganic filler), it is preferably 90 or less, more preferably 68 or less, and further preferably an integer of 65 or less. The EO number refers to the divalent group R in the above formula (1) contained in one molecule of the radical-reactive poly RO compound of the present invention. B The number when O is represented by -(C2H4O)-. The PO number refers to the divalent group R in the above formula (1) contained in one molecule of the radical-reactive poly RO compound of the present invention. B The number when O is represented by -(C3H6O)-.

[0103] As a specific example of the component (B), a compound containing the following radical-polymerizable unsaturated group and the following polyoxyalkylene structure and satisfying the above formula (1) can be cited; the radical-polymerizable unsaturated group is one or more selected from vinyl, allyl, 1-butenyl, 2-butenyl, acryloyl, methacryloyl, fumaroyl, maleoyl, vinylphenyl, styryl, and cinnamoyl; the polyoxyalkylene structure is selected from polyethylene oxide structure (-(C2H4O) n -; here, n is the same as n in formula (2)), polypropylene oxide structure (-(C3H6O) n -; here, n is the same as n in formula (2)), poly(n-butylene oxide) structure (-(C4H8O) n -; here, n is the same as n in formula (2)), poly(ethylene oxide-co-propylene oxide) structure, poly(ethylene oxide-ran-propylene oxide) structure, poly(ethylene oxide-alt-propylene oxide) structure, and poly(ethylene oxide-block-propylene oxide) structure. From the viewpoint of obtaining a cured product with excellent heat resistance, the component (B) preferably contains one or more monovalent or divalent aryl groups in the molecule, and preferably contains two or more monovalent or divalent aryl groups in the molecule. Examples of the monovalent or divalent aryl group include phenyl, 1-naphthyl, 2-naphthyl, phenylene, 1-naphthylene, 2-naphthylene, etc. Two or more monovalent or divalent aryl groups can be directly or via a linking group bonded to each other, and through such bonding, for example, a bisphenol structure, preferably a bisphenol A structure can be formed.

[0104] As the component (B), commercially available products can be used. Examples of the commercially available products include: monofunctional acrylate "AM-90G" (EO number: 9), "AM-130G" (EO number: 13), "AMP-20GY" (EO number: 2) manufactured by Shin-Nakamura Chemical Co., Ltd.; difunctional acrylate "A-1000" (EO number: 23), "A-B1206PE" (EO number: 6, PO number: 12, RO number: 18), "A-BPE-20" (EO number: 17), "A-BPE-30" (EO number: 30); monofunctional methacrylate "M-20G" (EO number: 2), "M-40G" (EO number: 4), "M-90G" (EO number: 9), "M-130G" (EO number: 13), "M-230G" (EO number: 23); and difunctional methacrylate "23G" (EO number: 23), "BPE-900" (EO number: 17), "BPE-1300N" (EO number: 30), "1206PE" (EO number: 6, RO number: 18), and "LIGHT ESTER BC" (EO number: 2), "LIGHT ESTER 041MA" (EO number: 30), "LIGHT ACRYLATE EC-A" (EO number: 2), "LIGHT ACRYLATE EHDG-AT" (EO number: 18) manufactured by Kyoeisha Chemical Co., Ltd.; "FA-023M" manufactured by Hitachi Chemical Co., Ltd.; "BLEMMER (registered trademark) PME-4000" (EO number: 90), "BLEMMER (registered trademark) 50POEO-800B" (EO number: 8, PO number: 7), "BLEMMER (registered trademark) PLE-200" (EO number: 4), "BLEMMER (registered trademark) PLE-1300" (EO number: 30), "BLEMMER (registered trademark) PSE-1300" (EO number: 30), "BLEMMER (registered trademark) 43PAPE-600B" (EO number: 6, PO number: 6), "BLEMMER (registered trademark) ANP-300" (PO number: 5), etc. manufactured by NOF Corporation. Among them, from the viewpoint of improving the effects desired by the present invention, one or more commercially available products selected from, for example, "M-230G", "M-130G", "23G", "M-40G", "M-90G", and "BPE-1300N" can be used.

[0105] The molecular weight of the free-radical reactive poly RO compound of the present invention is 150 or more for the compound where N is 1 in the above formula (1), and can be set to 250 or more or 400 or more. (B) The molecular weight of the free-radical reactive poly RO compound of the present invention is 1000 or more for the compound where N is 2 in the above formula (1), and can be set to 1020 or more or 1200 or more. From the viewpoint of improving the fluidity of the resin composition (the viscosity of the resin composition or the filling property of the inorganic filler), the upper limit of the molecular weight of the free-radical reactive poly RO compound of the present invention is, for example, 5000 or less, preferably 3000 or less, more preferably 2500 or less, still more preferably 2000 or less, and even more preferably 1500 or less. (B) When the component is a commercially available product, the molecular weight as its nominal value is preferably within the above range. (B) When the component is a polymer, its weight-average molecular weight or number-average molecular weight is preferably within the above range. Here, when (B) is a polymer, its weight-average molecular weight or number-average molecular weight is the weight-average molecular weight or number-average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC) method.

[0106] Regarding the content of component (B), there is no limitation as long as the mass ratio of component (B) to component (C) is within the range described later. When the non-volatile components in the resin composition are set to 100% by mass, from the viewpoint of improving the desired effects of the present invention, the content of component (B) is 0.1% by mass or more, 0.2% by mass or more, or 0.3% by mass or more. From the viewpoint of further improving the desired effects of the present invention, it is preferably 1% by mass or more, more preferably 1.5% by mass or more, and even more preferably 2% by mass or more. The upper limit is not particularly limited. For example, it is 20% by mass or less, 15% by mass or less, and preferably less than the content of component (A) when the non-volatile components in the resin composition are set to 100% by mass.

[0107] Regarding the content of component (B), there is no limitation as long as the mass ratio of component (B) to component (C) is within the range described later. When the components other than the (E) inorganic filler in the non-volatile components in the resin composition are set to 100% by mass, from the viewpoint of improving the desired effects of the present invention, it is preferably 10% by mass or more, more preferably 13% by mass or more, even more preferably 15% by mass or more, and particularly preferably 16% by mass or more. The upper limit is not particularly limited. From the viewpoints such as improving the desired effects of the present invention, it is preferably 40% by mass or less, more preferably 39% by mass or less, even more preferably 38% by mass or less. From the viewpoint of obtaining a cured product with a higher elastic modulus, it can be set to 35% by mass or less or 30% by mass or less.

[0108] <(C) Acid anhydride>

[0109] The resin composition contains (C) an acid anhydride. An acid anhydride refers to a compound having an acid anhydride group. The (C) component may be an acid anhydride that is liquid at 20°C (hereinafter also referred to as "liquid acid anhydride"), or may be an acid anhydride that is solid at 20°C (hereinafter also referred to as "solid acid anhydride"), or they may be combined. From the viewpoint of improving the fluidity of the resin composition (the viscosity of the resin composition or the filling property of the inorganic filler), the (C) component is preferably a liquid acid anhydride. As needed, the (C) component may further contain a solid acid anhydride. By including the (C) component in combination with the (A) component and the (B) component in the resin composition, the (C) component contributes to at least a part of the effects expected by the present invention (warpage, inorganic material adhesion, elastic modulus, and film peeling property). In particular, as exemplified in the column of the examples, by including the (C) component in the resin composition, there is a tendency for excellent film release property.

[0110] (C) The acid anhydride can react with the (A) component to cure the resin composition. Specific examples of the acid anhydride include: phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-c]furan-1,3-dione, ethylene glycol bis(trimellitate), polymer-type acid anhydrides such as styrene-maleic acid resin obtained by copolymerizing styrene and maleic acid, etc.

[0111] Examples of commercially available acid anhydrides include: "HNA-100", "MH-700", "MTA-15", "DDSA", "OSA" manufactured by Shin Nippon Rika Co., Ltd., "YH-306", "YH-307" manufactured by Mitsubishi Chemical Corporation, "HN-2200", "HN-5500" manufactured by Hitachi Chemical Co., Ltd., etc.

[0112] In the present invention, [b]:[c] representing the mass ratio of the (B) component to the (C) component, from the viewpoint of exerting the effects expected by the present invention, is in the range of 0.2:1 to 1.5:1, preferably in the range of 0.25:1 to 1.35:1, and more preferably in the range of 0.3:1 to 1.3:1.

[0113] The ratio (equivalent ratio) (c) / (a) of "the sum of the values obtained by dividing the amount (g) of the component (C) by the equivalent weight (g / eq.) of the acid anhydride groups possessed by the component (C)" to "the sum of the values obtained by dividing the amount (g) of the component (A) by the equivalent weight (g / eq.) of the epoxy groups possessed by the component (A)" is preferably 0.4 or more, more preferably 0.5 or more, and even more preferably 0.6 or more from the viewpoint of achieving the desired effects of the present invention. From the viewpoint of obtaining a cured product with little warpage, it is preferably 1.6 or less, more preferably 1.5 or less, and even more preferably 1.4 or less.

[0114] Regarding the content of the component (C), as long as the mass ratio of the component (B) to the component (C) is within the above range, there is no limitation. When the components other than the (E) inorganic filler in the non-volatile components of the resin composition are set to 100% by mass, from the viewpoint of enhancing the desired effects of the present invention, the content of the component (C) can be set to 10% by mass or more, or 15% by mass or more. From the viewpoint of obtaining a resin composition layer (compression molded body) with excellent film release properties, when the components other than the (E) inorganic filler in the non-volatile components of the resin composition are set to 100% by mass, the content of the component (C) is preferably 17% by mass or more, more preferably 20% by mass or more, and even more preferably 23% by mass or more. The upper limit is not particularly limited. For example, it is 60% by mass or less, preferably 58% by mass or less, more preferably 55% by mass or less from the viewpoints such as enhancing the desired effects of the present invention. From the viewpoint of obtaining a cured product with even less warpage, it can be set to 49% by mass or less, or 48% by mass or less.

[0115] Regarding the content of the component (C), as long as the mass ratio of the component (B) to the component (C) is within the above range, there is no limitation. When the non-volatile components of the resin composition are set to 100% by mass, from the viewpoint of enhancing the desired effects of the present invention, the content of the component (C) is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more, or 3% by mass or more. The upper limit is not particularly limited. For example, it is 40% by mass or less, 30% by mass or less, or 20% by mass or less, and is preferably less than twice the content of the component (A) when the non-volatile components of the resin composition are set to 100% by mass.

[0116] <(D) Radical generator>

[0117] The resin composition of the present invention contains a (D) radical generator. As the component (D), it is preferably a thermal radical generator. Thermal radical generators generally generate radicals by imparting thermal energy.

[0118] Examples of the thermal radical generator include: dialkyl peroxides such as di-tert-butyl peroxide, dicumyl peroxide, and tert-hexyl peroxy-2-ethylhexanoate; diacyl peroxides such as lauroyl peroxide, benzoyl peroxide, benzoyl toluoyl peroxide, and toluoyl peroxide; peroxy esters such as tert-butyl peracetate, tert-butyl peroctoate, and tert-butyl perbenzoate; ketone peroxides; peroxycarbonates; peroxyketals such as 1,1-bis(tert-amylperoxy)cyclohexane; azonitrile compounds such as 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(isobutyronitrile), 2,2'-azobis(2-methylbutyronitrile), and 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), and azoamide compounds such as 2,2'-azobis{2-methyl-N-[1,1-bis(hydroxymethyl)-2-hydroxyethyl]propionamide}; azoamidine compounds such as 2,2'-azobis(2-amidinopropane) dihydrochloride and 2,2'-azobis[2-(2-imidazolin-2-yl)propane] dihydrochloride; azoalkane compounds such as 2,2'-azobis(2,4,4-trimethylpentane) and 4,4'-azobis(4-cyanovaleric acid); azo compounds having an oxime skeleton such as 2,2'-azobis(2-methylpropionamide oxime), and azo compounds such as dimethyl 2,2'-azobis(isobutyrate). The thermal radical generator may be used alone or in combination of two or more in any ratio. Azo compounds usually generate nitrogen upon decomposition, and thus tend to form voids in the cured product of the resin composition. However, in the present invention, they can be preferably used. Among the peroxide-based thermal radical generators and azo compound-based thermal radical generators exemplified above as the thermal radical generator, peroxide-based thermal radical generators are more preferably used from the viewpoint of suppressing the generation of voids.

[0119] As the thermal radical generator, a substance having medium-temperature activity is preferred. Specifically, the component (D) is preferably at least one selected from thermal radical generators having a 10-hour half-life temperature T10 (°C) in the range of 50°C to 110°C, more preferably at least one selected from thermal radical generators having a 10-hour half-life temperature T10 (°C) in the range of 50°C to 100°C, and still more preferably at least one selected from thermal radical generators having a 10-hour half-life temperature T10 (°C) in the range of 50°C to 80°C from the viewpoint of obtaining a cured product with less warpage. Examples of such commercially available products include "LUPEROX 531M80" manufactured by Arkema Fuji Co., "PERHEXYL (registered trademark) O" manufactured by NOF Corporation, and "MAIB" manufactured by FUJIFILM Wako Pure Chemical Corporation.

[0120] In addition, it is preferable that the (D) component is one or more of free radical generators in which the difference ΔT (°C) between the mold temperature Tc (°C) during compression molding and the 10-hour half-life temperature T10 (°C) of the (D) component is in the range of 20°C or higher and 80°C or lower, more preferably 30°C or higher and 80°C or lower. That is, when the mold temperature Tc (°C) used during compression molding is clear, it is preferable to select a thermal free radical generator in which the above difference ΔT (°C) satisfies the above range as the (D) component to be included in the resin composition of the present invention. Thereby, a cured product with less warpage can be obtained.

[0121] Regarding the content of the (D) component, there is no limitation as long as the desired effects of the present invention are exhibited. When the non-volatile components in the resin composition are set to 100% by mass, for example, it can be set to 0.02% by mass or more and 5% by mass or less, 0.03% by mass or more and 4% by mass or less, or 0.04% by mass or more and 3% by mass or less. Regarding the content of the (D) component, there is no limitation as long as the desired effects of the present invention are exhibited. When the components other than the (E) inorganic filler in the non-volatile components in the resin composition are set to 100% by mass, for example, it can be set to 0.02% by mass or more and 5% by mass or less, 0.1% by mass or more and 4% by mass or less, or 0.2% by mass or more and 3% by mass or less.

[0122] <(E) Inorganic filler>

[0123] The resin composition of the present invention contains an (E) inorganic filler. By containing the (E) component in the resin composition, a cured product with little warpage can be obtained.

[0124] The material of the inorganic filler is not particularly limited as long as it is an inorganic compound, and examples thereof include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium phosphotungstate. Among them, silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. In addition, as silica, spherical silica is preferable. The inorganic filler can be used alone or in combination of two or more. Examples of commercially available products of silica include "SO-C2" and "SO-C1" manufactured by AdmaFine Corporation, and "UFP-30" and "UFP-40" manufactured by DENKA Company, Limited.

[0125] The average particle diameter of the inorganic filler is usually 30 μm or less, preferably 25 μm or less, more preferably 20 μm or less, and still more preferably 18 μm or less, from the viewpoint of enhancing the desired effects of the present invention. The lower limit of the average particle diameter can be set at 1 nm (0.001 μm) or more, 5 nm or more, 10 nm or more, etc. From the viewpoint of enhancing the desired effects of the present invention, it is preferably 1.0 μm or more, more preferably 1.2 μm or more, and still more preferably 1.4 μm or more.

[0126] The average particle diameter of the inorganic filler can be measured by a laser diffraction-scattering method based on the Mie scattering theory. Specifically, the particle diameter distribution of the inorganic filler can be prepared on a volume basis by a laser diffraction scattering type particle diameter distribution measuring device, and the median particle diameter thereof can be measured as the average particle diameter. As the measurement sample, a sample obtained by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a test tube and dispersing them ultrasonically for 10 minutes can be used. For the measurement sample, using a laser diffraction type particle diameter distribution measuring device, the light source wavelength is set to blue and red, and the volume-based particle diameter distribution of the inorganic filler is measured in a flow cell manner. Then, the average particle diameter is calculated as the median particle diameter from the obtained particle diameter distribution. Examples of the laser diffraction type particle diameter distribution measuring device include "LA-960" manufactured by Horiba, Ltd.

[0127] From the viewpoint of good embedding property, etc., it is preferable that the inorganic filler is treated with a surface treatment agent, and it is more preferable that it is treated with one or more surface treatment agents such as fluorosilane coupling agents, amino-silane coupling agents, epoxy-silane coupling agents, mercapto-silane coupling agents, silane coupling agents, alkoxysilane compounds, organosilazane compounds, acryloyl-silane compounds, methacryloyl-silane compounds, and titanate coupling agents. It is even more preferable that it is treated with an amino-silane-based silane coupling agent. The surface treatment agent preferably has a functional group that reacts with other components, such as a resin, such as an epoxy group, an amino group, or a mercapto group, and more preferably, the functional group is bonded to the terminal group. As commercially available products of the surface treatment agent, for example, there are: silane coupling agent "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., alkoxysilane compound "KBM103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent "KBM-4803" (glycidoxyoctyltrimethoxysilane; long-chain epoxy type silane coupling agent) manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., etc. Among them, as the surface treatment agent, it is preferable to use silane coupling agents "KBM573", "KBM-4803", and "KBM403" manufactured by Shin-Etsu Chemical Co., Ltd. In addition, from the viewpoint of obtaining a cured product with less warpage, a long-chain type silane coupling agent is preferable, and a long-chain epoxy type silane coupling agent, which is a long-chain type silane coupling agent having an epoxy group, is particularly preferable.

[0128] From the viewpoint of good embedding property, etc., the degree of surface treatment with the surface treatment agent is preferably such that 0.2 to 5 parts by mass of the surface treatment agent is used for 100 parts by mass of the component (E), more preferably 0.2 to 4 parts by mass is used, and preferably 0.3 to 3 parts by mass is used.

[0129] The degree of surface treatment with the surface treatment agent can be evaluated by the carbon amount per unit surface area of the inorganic filler. From the viewpoint of good embedding property, etc., the carbon amount per unit surface area of the inorganic filler is preferably 0.02 mg / m 2 or more, more preferably 0.1 mg / m 2 or more, and even more preferably 0.2 mg / m2 The above. On the other hand, from the viewpoint of suppressing the increase in the melt viscosity of the resin varnish and the melt viscosity in the sheet form, it is preferably 1 mg / m 2 or less, more preferably 0.8 mg / m 2 or less, and still more preferably 0.5 mg / m 2 or less.

[0130] The carbon amount per unit surface area of the inorganic filler can be measured after cleaning the surface-treated inorganic filler with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25 °C for 5 minutes. After removing the supernatant and drying the non-volatile components, the carbon amount per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by Horiba, Ltd. can be used.

[0131] The specific surface area of the component (E) is preferably 0.3 m 2 / g or more, more preferably 0.5 m 2 / g or more, and particularly preferably 0.7 m 2 / g or more. There is no particular limitation on the upper limit, and it is preferably 60 m 2 / g or less, 50 m 2 / g or less, or 40 m 2 / g or less. For the specific surface area, nitrogen can be adsorbed on the surface of the sample according to the BET method using a BET full-automatic specific surface area measuring device ("Macsorb HM-1210" manufactured by Mountech Co., Ltd.), and the specific surface area can be obtained by calculating with the BET multi-point method.

[0132] Regarding the content of the component (E), it is preferably highly filled in the resin composition. When the non-volatile components in the resin composition are set to 100% by mass, from the viewpoint of obtaining a cured product with less warpage, it is preferably 70% by mass or more, more preferably 71% by mass or more, and still more preferably 72% by mass or more; regarding the upper limit, it is naturally determined according to the content of other components, and can be set to 95% by mass or less, 93% by mass or less, or 90% by mass or less, for example.

[0133] <(F) Curing Promoter>

[0134] The resin composition may contain an (F) curing promoter. As the curing promoter, for example, a phosphorus-based curing promoter, an amine-based curing promoter, a guanidine-based curing promoter, an imidazole-based curing promoter, and a metal-based curing promoter can be mentioned. A phosphorus-based curing promoter and an imidazole-based curing promoter are preferably used, and an imidazole-based curing promoter is more preferably used. The curing promoter can be used alone or in combination of two or more.

[0135] Examples of the phosphorus-based curing accelerator include, for example, triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium caprate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc. Preferably, triphenylphosphine and tetrabutylphosphonium caprate are used.

[0136] Examples of the amine-based curing accelerator include, for example, trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine (DMAP), benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo[5.4.0]undecene, etc. Preferably, 4-dimethylaminopyridine and 1,8-diazabicyclo[5.4.0]undecene are used. As a commercially available product of the amine-based curing accelerator, for example, "DMP-30" manufactured by Fujifilm Wako Pure Chemical Corporation can be used.

[0137] Examples of the guanidine-based curing accelerator include, for example, dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1-(o-tolyl)biguanide, etc. Preferably, dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene are used. As a commercially available product of the guanidine-based curing accelerator, for example, one or more selected from pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, and 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene can be used.

[0138] As imidazole-based curing accelerators, for example, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline and other imidazole compounds, and adducts of imidazole compounds and epoxy resins. Preferably, 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are used.

[0139] As imidazole-based curing accelerators, commercially available products can be used. For example, imidazole compounds "1B2PZ" and "2E4MZ" manufactured by Shikoku Kasei Co., Ltd., "P200-H50" manufactured by Mitsubishi Chemical Corporation, "2MA-OK-PW" manufactured by Shikoku Kasei Co., Ltd., etc.

[0140] As metal-based curing accelerators, for example, organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin can be cited. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. As organometallic salts, for example, zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate, etc. can be cited.

[0141] When the resin composition contains the component (F), when the non-volatile components in the resin composition are set to 100% by mass, the content of the component (F) can be set to, for example, 0.01% by mass or more and 5% by mass or less, 0.05% by mass or more and 4% by mass or less, or 0.08% by mass or more and 3% by mass or less. When the components other than the (E) inorganic filler in the non-volatile components in the resin composition are set to 100% by mass, the content of the component (F) can be set to, for example, 0.05% by mass or more and 10% by mass or less, 0.1% by mass or more and 5% by mass or less, or 0.2% by mass or more and 3% by mass or less.

[0142] <(G) Compound having a radically polymerizable unsaturated group (however, compounds having a polyoxyalkylene structure are excluded)>

[0143] The resin composition of the present invention preferably further contains (G) a compound having a radically polymerizable unsaturated group (however, compounds having a polyoxyalkylene structure are excluded). Two or more kinds can be used as the component (G). It is considered that by including the component (B) in the resin composition and further including the component (G), the radical polymerization reaction proceeds promotively or competitively, and a part of the function of the component (B) is exerted by the component (G), and the desired effects of the present invention can be improved.

[0144] Examples of the radically polymerizable unsaturated group possessed by the component (G) include groups containing an olefinic carbon-carbon double bond. As specific examples, one or more selected from vinyl, allyl, 1-butenyl, 2-butenyl, acryloyl, methacryloyl, fumaroyl, maleoyl, vinylphenyl, styryl, cinnamoyl, and maleimide group can be mentioned. The component (G) may contain two or more radically polymerizable unsaturated groups in one molecule. From the viewpoint of improving the reactivity, the radically polymerizable unsaturated group possessed by the component (G) preferably contains one or more selected from methacryloyl and acryloyl, and from the viewpoint of controlling the reactivity, more preferably contains methacryloyl.

[0145] As specific examples of the component (G), compounds containing one or more radically polymerizable unsaturated groups selected from vinyl, allyl, 1-butenyl, 2-butenyl, acryloyl, methacryloyl, fumaroyl, maleoyl, vinylphenyl, styryl, cinnamoyl, and maleimide groups can be cited. From the viewpoint of obtaining a cured product having excellent heat resistance, the component (G) preferably contains one or more monovalent or divalent aryl groups in the molecule, and more preferably contains two or more monovalent or divalent aryl groups in the molecule. Examples of the monovalent or divalent aryl group include phenyl, 1-naphthyl, 2-naphthyl, phenylene, 1-naphthylene, 2-naphthylene, and the like. Two or more monovalent or divalent aryl groups can be directly bonded to each other or via a linking group, and by this bonding, for example, a bisphenol structure, preferably a bisphenol A structure, can be formed.

[0146] The component (G) is also preferably a compound further containing a group reactive with the component (A) in the molecule. Thereby, a crosslinked structure can be formed, and warpage in the cured product can be further reduced. Examples of the group reactive with the component (A) include an epoxy group, -OH, -NH2, and -COOH. It should be noted that even when the component (G) is a compound having an epoxy group in the molecule, as long as it is a compound having a radically polymerizable unsaturated group (however, a compound having a polyoxyalkylene structure is excluded), it is classified as the component (G). As the component (G), one or more of "compounds containing a group reactive with the component (A) in the molecule" and one or more of "compounds not containing a group reactive with the component (A) in the molecule" can be used in combination.

[0147] It should be noted that the component (G) can also be a compound having a polyoxyalkylene structure in the molecule. The polyoxyalkylene structure possessed by the component (G) is represented by, for example, the formula (3): -(R C O) n -, where in the formula (3), n is an integer of 1, and R C is an alkylene group having 1 to 6 carbon atoms which may have a substituent.

[0148] Regarding the content of the component (G), as long as it does not overly impair the radical polymerization of the component (B), it is arbitrary. When the components other than the (E) inorganic filler in the non-volatile components of the resin composition are set to 100% by mass, it can be, for example, 20% by mass or less, 19.5% by mass or less, or 19% by mass or less. From the viewpoint of enhancing the desired effects of the present invention, the lower limit is preferably 1% by mass or more, more preferably 1.3% by mass or more, further preferably 1.5% by mass or more, and particularly preferably 1.6% by mass or more.

[0149] <(H) Optional Additives>

[0150] In one embodiment, the resin composition may further contain (H) other additives as needed. Examples of the other additives include, for example: curing agents other than the component (C), thermoplastic resins, organic fillers, organic metal compounds such as organic copper compounds, organic zinc compounds, and organic cobalt compounds, and resin additives such as thickeners, defoaming agents, leveling agents, adhesion imparting agents, and colorants, solvents, etc. Regarding the content of the component (H), it is arbitrary as long as the desired effects of the present invention are not overly impaired. When the non-volatile components in the resin composition are set to 100% by mass, for example, it is 0.1% by mass or more, 0.3% by mass or more, or 0.5% by mass or more, and can be set to 15% by mass or less, 13% by mass or less, or 10% by mass or less, for example.

[0151] Examples of the curing agent other than the component (C) include one or more curing agents selected from active ester-based curing agents, phenol-based curing agents (phenol resin curing agents), naphthol-based curing agents, carbodiimide-based curing agents, benzoxazine-based curing agents, amine-based curing agents, guanidine-based curing agents, and cyanate ester-based curing agents, and commercially available products can be used, for example. From the viewpoint of obtaining a resin composition layer (compression molded body) with excellent mold release properties of the film material, as the curing agent other than the component (C), it is preferable to use one or more curing agents selected from active ester-based curing agents, phenol resin curing agents, naphthol-based curing agents, carbodiimide-based curing agents, benzoxazine-based curing agents, and cyanate ester-based curing agents. One or more curing agents selected from amine-based curing agents (for example, "KAYAHARDA-A" manufactured by Nippon Kayaku Co., Ltd.) and guanidine-based curing accelerators (for example, dicyandiamide ("DICY7" manufactured by Mitsubishi Chemical Corporation)) can be used as long as the desired effects of the present invention are not overly impaired.

[0152] Examples of the thermoplastic resin include, for example, phenoxy resin, polyvinyl acetal resin, polyolefin resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polyetheretherketone resin, polyester resin, etc. The thermoplastic resin preferably contains a reactive functional group, whereby it can be incorporated into the crosslinked structure composed of the component (A). It should be noted that the reactive functional group can be a group that exhibits reactivity by heating or light irradiation. Regarding the content of the thermoplastic resin, it is arbitrary as long as the desired effects of the present invention are not overly impaired. When the non-volatile components in the resin composition are set to 100% by mass, for example, it is 0.1% by mass or more, 0.2% by mass or more, or 0.3% by mass or more, and from the viewpoint of increasing the crosslink density, it can be set to 5% by mass or less, 3% by mass or less, or 1% by mass or less.

[0153] As the organic filler material, any organic filler material that can be used when forming the insulating layer of a printed wiring board can be used. Examples include rubber particles, polyamide fine particles, silicone particles, etc. As the rubber particles, commercially available products can be used. Examples include "EXL2655" manufactured by Dow Chemical Japan Co., Ltd., "AC3401N" and "AC3816N" manufactured by AIKA Industries Co., Ltd. Regarding the content of the organic filler material, it is arbitrary as long as the desired effects of the present invention are not overly impaired. When the non-volatile components in the resin composition are set to 100% by mass, for example, it is 0.1% by mass or more, 0.3% by mass or more, or 0.5% by mass or more, and can be set to, for example, 10% by mass or less, 7% by mass or less, or 5% by mass or less.

[0154] When the resin composition contains a solvent, it is preferably that the amount of the solvent is small. When the non-volatile components of the resin composition are set to 100% by mass, the content of the solvent is more preferably 0.5% by mass or less, still more preferably 0.1% by mass or less, and particularly preferably 0% by mass (excluding). In addition, in order to reduce the amount of the solvent, as at least one component selected from the components (A), (C), (D), (F), and (G), it is preferably to use a liquid component.

[0155] <Properties of the resin composition>

[0156] (Warpage and elastic modulus)

[0157] The cured product obtained by curing the resin composition of the present invention at 150°C for 60 minutes has little warpage. Specifically, as evaluated in the column of the examples, for the laminate including a silicon wafer and the cured product formed on the silicon wafer, the measured warpage amount is, for example, less than 2300 μm, more preferably less than 2000 μm, and still more preferably less than 1500 μm. In addition, the cured product obtained by curing the resin composition of the present invention at 150°C for 60 minutes has a large elastic modulus. Specifically, as evaluated in the column of the examples, the elastic modulus of the cured product at 25°C is, for example, 7 GPa or more, more preferably 9 GPa or more. Therefore, the resin composition of the present invention can obtain a cured product that eliminates the first trade-off.

[0158] (Adhesion to inorganic material and mold release property of film material)

[0159] The cured product obtained by curing the resin composition of the present invention at 150°C for 60 minutes has excellent adhesion to the inorganic material. Specifically, as evaluated in the column of the examples, for the laminate including a copper foil and the cured product formed on the copper foil, the measured adhesion strength (copper foil peel strength) is, for example, 100 kgf / cm 2The above. In addition, the resin composition layer (compression molded body) obtained by curing the resin composition of the present invention at 130°C for 10 minutes has excellent mold release properties for the film material. Specifically, as evaluated in the column of the examples, after the resin composition layer (compression molded body) is compression molded, the mold is opened using a normal driving force, and it is observed that the resin composition layer peels off from the release film and lies on the silicon wafer. Therefore, the resin composition of the present invention can obtain a resin composition layer (compression molded body) and a cured product that eliminate the second trade-off.

[0160] As described above, the resin composition of the present invention can obtain a cured product with small warpage, a large elastic modulus, and excellent adhesion to inorganic materials, and exhibits excellent peeling properties for the film material. The reason for exhibiting the above effects is not completely clear, but it is clear that: the resin composition of the present invention contains components (A) to (E), and the mass ratio of component (B) to component (C) is within a specified range, and thus there is an unexpected tendency to eliminate the above first trade-off and second trade-off. In addition, for the resin composition of the present invention, since the elastic modulus of its cured product, specifically the elastic modulus at 25°C, is large, for example, the processability of a sealed body including a semiconductor chip and a cured product in which the semiconductor chip is embedded can be improved. Further, for the resin composition of the present invention, since its cured product has excellent adhesion to inorganic materials, as a sealing material for sealing a semiconductor chip, for example, it has high reliability. In addition, for the resin composition of the present invention, since the resin composition layer (compression molded body) has excellent mold release properties for the film material, it can be easily removed from the mold after compression molding.

[0161] The resin composition of the present invention can obtain an insulating layer formed of a cured product with small warpage, excellent adhesion to inorganic materials, and a large elastic modulus. Therefore, the resin composition of the present invention can be preferably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for forming an insulating layer of a printed wiring board), and can be more preferably used as a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for forming an interlayer insulating layer of a printed wiring board). In addition, since the resin composition of the present invention provides an insulating layer with small warpage, excellent adhesion to inorganic materials, and a large elastic modulus, it can be preferably used even when the printed wiring board is a board with components embedded. Further, since the resin composition of the present invention provides an insulating layer formed of a cured product with small warpage, excellent adhesion to inorganic materials, and a large elastic modulus, it can be more preferably used as a resin composition for forming a solder resist layer (resin composition for forming a solder resist layer of a printed wiring board). In addition, since the resin composition of the present invention provides an insulating layer formed of a cured product with small warpage, excellent adhesion to inorganic materials, and a large elastic modulus, it can be preferably used as a resin composition for forming a sealing layer (resin composition for forming a sealing layer of a semiconductor chip package) that seals a semiconductor chip for a semiconductor chip package. In addition, the resin composition of the present invention can be preferably used as a resin composition for forming a rewiring formation layer of a semiconductor chip package (resin composition for forming a rewiring formation layer of a semiconductor chip package).

[0162] A semiconductor chip package including a rewiring formation layer can be manufactured, for example, by the following manufacturing method. In addition, when manufacturing a semiconductor chip package including a sealing layer, a rewiring layer can be further formed on the sealing layer.

[0163] <Manufacturing Method of Resin Composition>

[0164] The manufacturing method of the resin composition of the present invention is not particularly limited, and examples thereof include a method of mixing the compounding components with a solvent as needed and dispersing them using a rotary mixer or the like.

[0165] For the resin composition, it can be obtained as a resin varnish by including, for example, a solvent. In one embodiment, the amount of the solvent is preferably small. When the non-volatile component of the resin composition is set to 100% by mass, the amount of the solvent is more preferably 0.5% by mass or less, and further preferably 0.1% by mass or less.

[0166] <Physical Properties and Uses of Resin Composition Layer or Cured Product of Resin Composition>

[0167] (Warpage and Elastic Modulus)

[0168] For the cured product obtained by thermally curing the resin composition of the present invention, warpage is generally small. For example, for a cured product with a thickness of 100 μm of the resin composition, in a laminate including a silicon wafer and the cured product formed on the silicon wafer, the measured warpage amount is, for example, less than 2300 μm, preferably less than 2000 μm, and more preferably less than 1500 μm. In addition, for the cured product obtained by thermally curing the resin composition of the present invention, the elastic modulus is generally large. For example, for the cured product of the resin composition, the elastic modulus at 25°C is generally 7 GPa or more, preferably 9 GPa or more. Therefore, for the cured product of the resin composition of the present invention, the first trade-off can generally be eliminated.

[0169] (Inorganic material adhesion)

[0170] For the cured product obtained by thermally curing the resin composition of the present invention, the adhesion to inorganic materials is generally excellent. For example, for a cured product with a thickness of 300 μm of the resin composition, in a laminate including a copper foil and the cured product formed on the copper foil, the measured adhesion strength (copper foil peel strength) is generally 100 kgf / cm 2 or more. In addition, as described above, the resin composition layer (compression molded body) of the resin composition of the present invention has excellent film release properties, so the cured product obtained by thermally curing the resin composition of the present invention can generally be easily removed from the mold used in compression molding. Therefore, for the cured product of the present invention, the second trade-off can generally be eliminated.

[0171] For the cured product of the resin composition of the present invention, the warpage is small, the adhesion to inorganic materials is excellent, and the elastic modulus is large. Therefore, the cured product of the resin composition of the present invention can preferably be used as an insulating layer of a printed wiring board, and can more preferably be used as an interlayer insulating layer of a printed wiring board. In addition, since the cured product of the resin composition of the present invention can provide an insulating layer with small warpage, excellent adhesion to inorganic materials, and a large elastic modulus, it can be preferably used even when the printed wiring board is a board with components embedded. Further, since the cured product of the resin composition of the present invention can provide an insulating layer formed by a cured product with small warpage, excellent adhesion to inorganic materials, and a large elastic modulus, it can more preferably be used as a solder resist layer. In addition, since the cured product of the resin composition of the present invention can provide an insulating layer with small warpage, excellent adhesion to inorganic materials, and a large elastic modulus, it can preferably be used as a sealing layer for sealing a semiconductor chip for semiconductor chip packaging. In addition, the cured product of the resin composition of the present invention can preferably be used as a rewiring formation layer (insulating layer) for forming a rewiring layer of a semiconductor chip package.

[0172] [Resin paste]

[0173] The resin paste of the present invention contains the aforementioned resin composition. The resin paste of the present invention usually contains only the aforementioned resin composition. The viscosity of the resin paste at 25°C is preferably in the range of 20 Pa·s to 1000 Pa·s. In order to suppress the generation of voids, the heat loss on heating of the resin paste is preferably 5% or less.

[0174] [Resin composition molded body]

[0175] The resin composition of the present invention can be made into a resin composition molded body by compression molding or the like. In addition, the shape of the resin composition molded body is not limited to sheet shape, and the resin composition can be processed into any shape. In addition, by compression molding or a method other than compression molding, a resin composition molded body in the form of powder, granule, or pellet (they can also be referred to as resin powder, resin granule, and resin pellet respectively) can be formed from the resin composition of the present invention.

[0176] [Resin sheet]

[0177] The resin sheet of the present invention includes a support and a resin composition layer containing the resin composition of the present invention provided on the support.

[0178] The thickness of the resin composition layer of the resin sheet is usually 600 μm or less, preferably 500 μm or less, and from the viewpoint of thinning of the printed wiring board, it can be set to 400 μm or less or 300 μm or less. The thickness can also be further reduced. The lower limit of the thickness of the resin composition layer is not particularly limited, and it can usually be set to 1 μm or more, 10 μm or more, 50 μm or more, etc.

[0179] Examples of the support include a film formed of a plastic material, a metal foil, and a release paper, and preferably a film formed of a plastic material or a metal foil.

[0180] When a film formed of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes simply referred to as "PET"), polyethylene naphthalate (hereinafter sometimes simply referred to as "PEN"), polycarbonate (hereinafter sometimes simply referred to as "PC"), acrylic polymers such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyethersulfide (PES), polyether ketone, polyimide, etc. Among them, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0181] When using a metal foil as the support, examples of the metal foil include copper foil, aluminum foil, etc., and preferably copper foil. As the copper foil, a foil formed of single metal of copper can be used, or a foil formed of an alloy of copper and other metals (such as tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used.

[0182] For the support, matte treatment, corona treatment, and antistatic treatment can be performed on the surface that is joined to the resin composition layer.

[0183] In addition, as the support, a support with a release layer having a release layer on the surface joined to the resin composition layer can be used. Examples of the release agent for the release layer of the support with a release layer include one or more release agents selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. Commercially available products can be used for the support with a release layer, and examples include PET films having a release layer mainly composed of an alkyd resin-based release agent, such as "SK-1", "AL-5", "AL-7" manufactured by Lintec Corporation, "LUMIRROR T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Unipeel" manufactured by UNITIKA Ltd.

[0184] The thickness of the support is not particularly limited, preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. It should be noted that when using a support with a release layer, preferably the overall thickness of the support with a release layer is in the above range.

[0185] In one embodiment, the resin sheet may further contain other layers as needed. Examples of the other layers include a protective film selected according to the support provided on the surface of the resin composition layer that is not joined to the support (i.e., the surface opposite to the support). The thickness of the protective film is not particularly limited, for example, it is 1 μm to 40 μm. By laminating the protective film, it is possible to prevent the attachment of garbage, etc. or the formation of damage on the surface of the resin composition layer.

[0186] The resin sheet can be manufactured, for example, as follows: Prepare a resin varnish obtained by dissolving a resin composition in an organic solvent, coat the resin varnish on a support using a die coater, etc., and then dry to form a resin composition layer.

[0187] Examples of the organic solvent include: ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. The organic solvent may be used alone or in combination of two or more. In one embodiment, the amount of the organic solvent is preferably as small as possible (for example, when the nonvolatile component in the resin composition is 100% by mass, it is 0.5% by mass or less, 0.1% by mass or less, 0.01% by mass or less), and it is particularly preferable that no organic solvent is contained.

[0188] Drying can be carried out by known methods such as heating and hot air blowing. The drying conditions are not particularly limited, and drying is carried out under conditions such that the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Depending on the boiling point of the organic solvent in the resin varnish, for example, when using a resin varnish containing 30% to 60% by mass of the organic solvent, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0189] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0190] The resin sheet of the present invention provides an insulating layer formed of a cured product having small warpage, excellent adhesion to an inorganic material, and a large elastic modulus. Therefore, the resin sheet of the present invention can be preferably used as a resin sheet for forming an insulating layer of a printed wiring board (resin sheet for forming an insulating layer of a printed wiring board), and can be more preferably used as a resin sheet for forming an interlayer insulating layer of a printed wiring board (resin sheet for forming an interlayer insulating layer of a printed wiring board). In addition, the resin sheet of the present invention can be preferably used as a resin sheet for forming a solder resist layer of a printed wiring board (resin sheet for forming a solder resist layer of a printed wiring board). In addition, since the resin sheet of the present invention provides an insulating layer formed of a cured product having small warpage, excellent adhesion to an inorganic material, and a large elastic modulus, it can be preferably used as a resin composition for forming a sealing layer (resin sheet for forming a sealing layer of a semiconductor chip package) that seals a semiconductor chip for semiconductor chip packaging. In addition, the resin sheet of the present invention can be preferably used as a resin sheet for forming a rewiring formation layer (insulating layer) of a semiconductor chip package (resin sheet for forming a rewiring formation layer of a semiconductor chip package).

[0191] <Printed Wiring Board>

[0192] The printed wiring board of the present invention includes an insulating layer formed by curing the resin composition of the present invention. The printed wiring board can be manufactured, for example, by a manufacturing method including the following steps (1) and (2):

[0193] (1) A step of forming a resin composition layer containing the resin composition on a substrate using the resin composition of the present invention;

[0194] (2) A step of thermally curing the resin composition layer to form an insulating layer,

[0195] For example, the manufacturing method of the printed wiring board of the present invention includes: a step of forming a resin composition layer containing the resin composition of the present invention or a resin composition layer containing the resin paste of the present invention on a circuit board by a compression molding method, and a step of curing the above resin composition layer.

[0196] In step (1), a substrate is prepared. Examples of the substrate include glass epoxy substrates, metal substrates (such as stainless steel, cold-rolled steel sheets (SPCC), etc.), polyester substrates, polyimide substrates, BT resin substrates, thermosetting polyphenylene ether substrates, and the like. In addition, for the substrate, a metal layer such as a copper foil may be provided on the surface as a part of the substrate. For example, a substrate having a peelable first metal layer and a second metal layer on both surfaces can be used. In the case of using such a substrate, generally, a conductor layer serving as a wiring layer for circuit wiring is formed on the surface of the second metal layer opposite to the first metal layer. Examples of such a substrate having a metal layer include the ultra-thin copper foil "Micro Thin" with a carrier copper foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0197] In addition, a conductor layer may be formed on one or both surfaces of the substrate. In the following description, a member including a substrate and a conductor layer formed on the surface of the substrate may be appropriately referred to as a "substrate with a wiring layer". Examples of the conductor material contained in the conductor layer include materials containing one or more metals selected from gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. As the conductor material, a single metal or an alloy can be used. Examples of the alloy include alloys of two or more metals selected from the above metals (such as nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among them, from the viewpoints of the versatility of conductor layer formation, cost, and ease of pattern formation, it is preferably a single metal such as chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper; and alloys such as nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys. Among them, it is more preferably a single metal of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper; and nickel-chromium alloys, and particularly preferably a single metal of copper.

[0198] For the conductor layer, for example, in order to function as a wiring layer, pattern processing can be performed. At this time, the line width (circuit width) / line spacing (width between circuits) ratio of the conductor layer is not particularly limited, preferably 20 / 20 μm or less (i.e., the spacing is less than 40 μm), more preferably 10 / 10 μm or less, further preferably 5 / 5 μm or less, further preferably 1 / 1 μm or less, and particularly preferably 0.5 / 0.5 μm or more. The spacing does not need to be the same in the entire conductor layer. The minimum spacing of the conductor layer can be, for example, less than 40 μm, less than 36 μm, or less than 30 μm.

[0199] The thickness of the conductor layer depends on the design of the printed wiring board, but is preferably from 3 μm to 35 μm, more preferably from 5 μm to 30 μm, further preferably from 10 μm to 20 μm, particularly preferably from 15 μm to 20 μm.

[0200] The conductor layer can be formed, for example, by a method including the following steps: a step of laminating a dry film (photosensitive resist film) on a substrate; a step of exposing and developing the dry film under prescribed conditions using a photomask to form a pattern, thereby obtaining a pattern dry film; a step of forming a conductor layer by a plating method such as an electrolytic plating method using the developed pattern dry film as a plating mask; and a step of stripping the pattern dry film. As the dry film, a photosensitive dry film formed of a photoresist composition can be used, for example, a dry film formed of a resin such as a novolak resin or an acrylic resin can be used. The lamination conditions of the substrate and the dry film can be the same as the lamination conditions of the substrate and the resin sheet described later. The stripping of the dry film can be implemented, for example, by using an alkaline stripping solution such as a sodium hydroxide solution.

[0201] After the substrate is prepared, the resin composition layer is formed on the substrate. When the conductor layer is formed on the surface of the substrate, the resin composition layer is preferably formed so that the conductor layer is embedded in the resin composition layer.

[0202] The formation of the resin composition layer is carried out, for example, by laminating a resin sheet with a substrate. The lamination can be carried out, for example, by the following method: the resin sheet is heated and pressed to the substrate from the support body side, thereby the resin composition layer is attached to the substrate. As a member (hereinafter sometimes referred to as "heating and pressing member") for heating and pressing the resin sheet to the substrate, for example, a heated metal plate (SUS end plate, etc.) or a metal roller (SUS roller, etc.) can be cited. It should be noted that it is better that the heating and pressing member is not directly pressed to the resin sheet, but in order to make the resin sheet fully follow the surface unevenness of the substrate, it is pressed across an elastic material such as heat-resistant rubber.

[0203] Lamination of the base material and the resin sheet can be carried out, for example, by a vacuum lamination method. In the vacuum lamination method, the heat-pressing temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C. The heat-pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa. The heat-pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably carried out under a reduced-pressure condition of 13 hPa or less.

[0204] After lamination, under normal pressure (atmospheric pressure), for example, the heat-pressed member can be pressed from the support body side, thereby performing a smoothing process on the laminated resin sheet. The pressing conditions for the smoothing process can be set to the same conditions as the heat-pressing conditions for the above lamination. It should be noted that lamination and the smoothing process can be continuously carried out using a vacuum laminator.

[0205] In addition, the formation of the resin composition layer can be carried out, for example, by a compression molding method. The molding conditions can be the same as those for the formation method of the resin composition layer in the process of forming the sealing layer of the semiconductor chip package described later.

[0206] After the resin composition layer is formed on the base material, the resin composition layer is thermally cured to form an insulating layer. Although the thermal curing conditions of the resin composition layer also vary depending on the type of the resin composition, the curing temperature is generally in the range of 120°C to 240°C (preferably in the range of 130°C to 220°C, more preferably in the range of 140°C to 200°C), and the curing time is in the range of 5 minutes to 120 minutes (preferably 10 minutes to 100 minutes, more preferably 15 minutes to 90 minutes).

[0207] Before thermally curing the resin composition layer, a preheating treatment of heating the resin composition layer at a temperature lower than the curing temperature can be carried out. For example, before thermally curing the resin composition layer, the resin composition layer can be preheated at a temperature generally above 50°C and lower than 120°C (preferably above 60°C and below 110°C, more preferably above 70°C and below 100°C) for generally 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).

[0208] As described above, a printed wiring board having an insulating layer can be manufactured. In addition, the manufacturing method of the printed wiring board can further include any process. For example, when manufacturing a printed wiring board using a resin sheet, the manufacturing method of the printed wiring board can include a process of peeling the support body of the resin sheet. The support body can be peeled before the resin composition layer is thermally cured, or the support body can be peeled after the resin composition layer is thermally cured.

[0209] A method for manufacturing a printed wiring board may include, for example, a step of grinding the surface of the insulating layer after forming the insulating layer. The grinding method is not particularly limited. For example, a surface grinder can be used to grind the surface of the insulating layer.

[0210] A method for manufacturing a printed wiring board may include, for example, a step (3) of interlayer connection of a conductor layer, such as a step of forming holes in an insulating layer. Thereby, holes such as vias and through-holes can be formed in the insulating layer. As a method for forming vias, for example, laser irradiation, etching, mechanical drilling, etc. can be cited. The size and shape of the vias can be appropriately determined according to the design of the printed wiring board. It should be noted that for step (3), interlayer connection can be performed by grinding or polishing the insulating layer.

[0211] After forming the vias, it is preferably to perform a step of removing the smear in the vias. This step is sometimes referred to as the smear removal step. For example, in the case where a conductor layer is formed on an insulating layer through a plating process, a wet smear removal treatment can be performed on the vias. In addition, in the case where a conductor layer is formed on an insulating layer through a sputtering process, a dry smear removal process such as a plasma treatment process can be performed. Furthermore, the insulating layer can also be roughened by the smear removal process.

[0212] In addition, the insulating layer can be roughened before forming the conductor layer on the insulating layer. Through this roughening treatment, generally, the surface of the insulating layer including the inside of the vias can be roughened. As the roughening treatment, any of dry and wet roughening treatments can be performed. As an example of the dry roughening treatment, plasma treatment, etc. can be cited. In addition, as an example of the wet roughening treatment, a method of sequentially performing a swelling treatment using a swelling liquid, a roughening treatment using an oxidizing agent, and a neutralization treatment using a neutralizing liquid can be cited.

[0213] After forming the vias, a conductor layer is formed on the insulating layer. By forming a conductor layer at the position where the vias are formed, the newly formed conductor layer is electrically connected to the conductor layer on the substrate surface to perform interlayer connection. Regarding the method for forming the conductor layer, for example, plating methods, sputtering methods, evaporation plating methods, etc. can be cited, and among them, the plating method is preferably used. In a preferred embodiment, using an appropriate method such as semi-additive method, full-additive method, etc., plating is performed on the surface of the insulating layer to form a conductor layer having a desired wiring pattern. In addition, when the support in the resin sheet is a metal foil, a subtractive method can be used to form a conductor layer having a desired wiring pattern. The material of the formed conductor layer can be a single metal or an alloy. In addition, the conductor layer can have a single-layer structure or a multilayer structure including layers of two or more different materials.

[0214] Here, an example of an embodiment of forming a conductor layer on an insulating layer will be described in detail. By electroless plating, a plating seed layer is formed on the surface of the insulating layer. Next, corresponding to a desired wiring pattern, a mask pattern that exposes a part of the plating seed layer is formed on the formed plating seed layer. By electroplating, an electroplated layer is formed on the exposed plating seed layer, and then the mask pattern is removed. Then, the unnecessary plating seed layer is removed by a process such as etching, and a conductor layer having a desired wiring pattern can be formed. It should be noted that when forming the conductor layer, the dry film used in forming the mask pattern is the same as the above-mentioned dry film.

[0215] The method for manufacturing a printed wiring board may include a step (4) of removing a substrate. By removing the substrate, a printed wiring board having an insulating layer and a conductor layer embedded in the insulating layer can be obtained. For example, in the case of using a substrate having a peelable metal layer, this step (4) can be performed.

[0216] <Semiconductor Chip Package>

[0217] The semiconductor chip package according to the first embodiment of the present invention includes: the above-mentioned printed wiring board, and a semiconductor chip mounted on the printed wiring board. This semiconductor chip package can be manufactured by bonding a semiconductor chip to a printed wiring board. The method for manufacturing the semiconductor chip package of the present invention may include: a step of forming a resin composition layer containing the resin composition of the present invention or a resin composition layer containing the resin paste of the present invention on a semiconductor chip by a compression molding method, and a step of curing the above resin composition layer.

[0218] Regarding the bonding conditions between the printed wiring board and the semiconductor chip, any conditions under which the terminal electrodes of the semiconductor chip and the circuit wiring of the printed wiring board can be conductively connected can be adopted. For example, the conditions used in flip chip mounting of a semiconductor chip can be adopted. In addition, for example, between the semiconductor chip and the printed wiring board, bonding can be performed via an insulating adhesive.

[0219] As an example of the bonding method, a method of pressing a semiconductor chip against a printed wiring board can be cited. As the pressing conditions, the pressing temperature is generally in the range of 120°C to 240°C (preferably in the range of 130°C to 200°C, more preferably in the range of 140°C to 180°C), and the pressing time is generally in the range of 1 second to 60 seconds (preferably 5 seconds to 30 seconds).

[0220] In addition, as another example of the bonding method, a method of bonding a semiconductor chip to a printed wiring board by reflow soldering can be cited. The reflow soldering conditions can be in the range of 120°C to 300°C.

[0221] After bonding a semiconductor chip to a printed wiring board, the semiconductor chip can be filled with a molding underfill material. As the molding underfill material, the above resin composition can be used, and in addition, the above resin sheet can also be used.

[0222] The semiconductor chip package according to the second embodiment of the present invention includes: a semiconductor chip and a cured product of the above resin composition that seals the semiconductor chip. In such a semiconductor chip package, usually, the cured product of the resin composition functions as a sealing layer. For example, the manufacturing method of the semiconductor chip package of the present invention may include: a step of forming a resin composition layer containing the resin composition of the present invention or a resin composition layer containing the resin paste of the present invention on the semiconductor chip by a compression molding method, and a step of curing the above resin composition layer.

[0223] The manufacturing method of such a semiconductor chip package may include the following steps:

[0224] (A) A step of laminating a temporary fixing film on a substrate,

[0225] (B) A step of temporarily fixing a semiconductor chip to the temporary fixing film,

[0226] (C) A step of forming a sealing layer on the semiconductor chip,

[0227] (D) A step of peeling the substrate and the temporary fixing film from the semiconductor chip,

[0228] (E) A step of forming a redistribution formation layer as an insulating layer on the surface of the semiconductor chip from which the substrate and the temporary fixing film have been peeled,

[0229] (F) A step of forming a redistribution layer as a conductor layer on the redistribution formation layer, and,

[0230] (G) A step of forming a solder resist layer on the redistribution layer. In addition, the manufacturing method of the above semiconductor chip package may include the following steps:

[0231] (H) A step of dicing a plurality of semiconductor chip packages into individual semiconductor chip packages for singulation.

[0232] (Step (A))

[0233] Step (A) is a step of laminating a temporary fixing film on a substrate. The lamination conditions of the substrate and the temporary fixing film may be the same as the lamination conditions of the substrate and the resin sheet in the manufacturing method of a printed wiring board.

[0234] Examples of the base material include: silicon wafers; glass wafers; glass substrates; metal substrates such as copper, titanium, stainless steel, cold-rolled steel sheets (SPCC); substrates obtained by infiltrating epoxy resins or the like into glass fibers and performing heat curing treatment, such as FR-4 substrates; substrates formed of bismaleimide triazine resins such as BT resins; and the like.

[0235] For the temporary fixing film, any material that can be peeled off from the semiconductor chip and can temporarily fix the semiconductor chip can be used. As commercially available products, “REVALPHA” manufactured by Nitto Denko Corporation and the like can be cited.

[0236] (Step (B))

[0237] Step (B) is a step of temporarily fixing the semiconductor chip to the temporary fixing film. The temporary fixing of the semiconductor chip can be performed using, for example, devices such as a flip chip bonder or a die bonder. The layout and the number of configurations of the semiconductor chips can be appropriately set according to the shape and size of the temporary fixing film, the production number of the target semiconductor chip package, and the like. For example, the semiconductor chips can be arranged in a matrix of multiple rows and multiple columns for temporary fixing.

[0238] (Step (C))

[0239] Step (C) is a step of forming a sealing layer on the semiconductor chip. The sealing layer is formed of a cured product of the above resin composition. The sealing layer is usually formed by a method including the following steps: a step of forming a resin composition layer on the semiconductor chip, and a step of thermally curing the resin composition layer to form the sealing layer.

[0240] The formation of the resin composition layer is preferably performed by a compression molding method. For the compression molding method, generally, the semiconductor chip and the resin composition are arranged in a mold, and in the mold, pressure is applied to the resin composition and heated as needed to form a resin composition layer covering the semiconductor chip.

[0241] The specific operation of the compression molding method can be performed, for example, in the following manner. As a mold for compression molding, an upper mold (upper die) and a lower mold (lower die) are prepared. In addition, the resin composition is coated on the semiconductor chip temporarily fixed to the temporary fixing film as described above. The semiconductor chip coated with the resin composition is mounted on the lower mold together with the base material and the temporary fixing film. Then, the upper mold and the lower mold are closed, heat and pressure are applied to the resin composition, and compression molding is performed.

[0242] In addition, the specific operation of the compression molding method can be carried out, for example, in the following manner. As a mold for compression molding, an upper mold and a lower mold are prepared. The resin composition is placed on the lower mold. In addition, the semiconductor chip, the substrate, and the temporary fixing film are mounted on the upper mold together. Then, the upper mold and the lower mold are closed so that the resin composition placed on the lower mold contacts the semiconductor chip mounted on the upper mold, and heat and pressure are applied to perform compression molding. Generally, in the compression molding method, a release film is provided on the surface of the mold. Therefore, the resin composition can be molded in a state of contacting the release film. By combining the resin composition containing the components (A) to (E) as described above, the releasability from the release film is excellent, and thus the molded resin composition layer or cured product can be smoothly taken out from the mold.

[0243] The molding conditions vary depending on the composition of the resin composition, and appropriate conditions can be adopted to achieve good sealing. For example, the temperature of the mold during molding (mold temperature Tc) is preferably 70 °C or higher, more preferably 80 °C or higher, particularly preferably 90 °C or higher, preferably 200 °C or lower, more preferably 170 °C or lower, particularly preferably 150 °C or lower. In addition, the pressure applied during molding is preferably 1 MPa or higher, more preferably 2 MPa or higher, particularly preferably 3 MPa or higher, preferably 50 MPa or lower, more preferably 30 MPa or lower, particularly preferably 20 MPa or lower. The curing time is preferably 1 minute or longer, more preferably 2 minutes or longer, particularly preferably 3 minutes or longer, preferably 60 minutes or shorter, more preferably 30 minutes or shorter, particularly preferably 20 minutes or shorter. Usually, after forming the resin composition layer, the mold is removed. The removal of the mold can be carried out before the thermal curing of the resin composition layer or after the thermal curing.

[0244] The formation of the resin composition layer can be carried out by laminating a resin sheet and a semiconductor chip. For example, by thermocompression bonding the resin composition layer of the resin sheet and the semiconductor chip, a resin composition layer can be formed on the semiconductor chip. The lamination of the resin sheet and the semiconductor chip can usually be carried out in the same manner as the lamination of the resin sheet and the substrate in the manufacturing method of a printed wiring board, using the semiconductor chip instead of the substrate.

[0245] After forming a resin composition layer on the semiconductor chip, the resin composition layer is thermally cured to obtain a sealing layer covering the semiconductor chip. Thus, the semiconductor chip is sealed with the cured product of the resin composition. The thermal curing conditions of the resin composition layer can be the same as those of the resin composition layer in the manufacturing method of a printed wiring board. Furthermore, before thermally curing the resin composition layer, a preheating treatment of heating the resin composition layer at a temperature lower than the curing temperature can be performed on the resin composition layer. The treatment conditions of this preheating treatment can be the same as those of the preheating treatment in the manufacturing method of a printed wiring board.

[0246] (Process (D))

[0247] Process (D) is a process of peeling the base material and the temporary fixing film from the semiconductor chip. The peeling method is preferably an appropriate method adapted to the material of the temporary fixing film. As the peeling method, for example, a method of peeling by heating, foaming or expanding the temporary fixing film can be cited. In addition, as the peeling method, for example, a method of peeling by irradiating ultraviolet rays through the base material to reduce the adhesion of the temporary fixing film can also be cited.

[0248] In the method of peeling by heating, foaming or expanding the temporary fixing film, the heating conditions are usually heating at 100°C to 250°C for 1 second to 90 seconds or 5 minutes to 15 minutes. In addition, in the method of peeling by irradiating ultraviolet rays to reduce the adhesion of the temporary fixing film, the irradiation amount of ultraviolet rays is usually 10 mJ / cm 2 ~1000 mJ / cm 2 .

[0249] (Process (E))

[0250] Process (E) is a process of forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled.

[0251] Any material having insulating properties can be used as the material of the rewiring formation layer. Among them, from the viewpoint of the ease of manufacturing the semiconductor chip package, a photosensitive resin and a thermosetting resin are preferably used. In addition, as the thermosetting resin, the resin composition of the present invention can be used.

[0252] After forming the rewiring formation layer, in order to perform an interlayer connection between the semiconductor chip and the rewiring layer, vias can be formed in the rewiring formation layer.

[0253] In the method of forming vias when the material of the rewiring formation layer is a photosensitive resin, usually, active energy rays are irradiated through a mask pattern on the surface of the rewiring formation layer to photocure the irradiated portion of the rewiring formation layer. As the active energy rays, for example, ultraviolet rays, visible light, electron beams, X-rays, etc. can be cited, and ultraviolet rays are particularly preferable. The irradiation amount and irradiation time of ultraviolet rays can be appropriately set according to the photosensitive resin. As the exposure method, for example, a contact exposure method in which the mask pattern is closely attached to the rewiring formation layer for exposure, a non-contact exposure method in which parallel light is used for exposure without closely attaching the mask pattern to the rewiring formation layer, etc. can be cited.

[0254] After the rewiring formation layer is photocured, the rewiring formation layer is developed to remove the unexposed portions, thereby forming through-holes. The development can be either wet development or dry development. As the development method, for example, dipping method, spin-on immersion (puddle) method, spraying method, brushing method, scraping method, etc. can be cited. From the viewpoint of resolution, the spin-on immersion method is preferably used.

[0255] As a method for forming through-holes when the material of the rewiring formation layer is a thermosetting resin, for example, laser irradiation, etching, mechanical drilling, etc. can be cited. Among them, laser irradiation is preferably used. Laser irradiation can be carried out using an appropriate laser processing machine that utilizes light sources such as carbon dioxide laser, UV-YAG laser, excimer laser, etc.

[0256] The shape of the through-hole is not particularly limited, but generally a circular shape (substantially circular) is adopted. The top diameter of the through-hole is preferably 50 μm or less, more preferably 30 μm or less, and still more preferably 20 μm or less. Here, the top diameter of the through-hole refers to the opening diameter of the through-hole on the surface of the rewiring formation layer.

[0257] (Process (F))

[0258] Process (F) is a process of forming a rewiring layer as a conductor layer on the rewiring formation layer. The method of forming a rewiring layer on the rewiring formation layer can be the same as the method of forming a conductor layer on an insulating layer in the manufacturing method of a printed wiring board. In addition, processes (E) and (F) can be repeated to alternately stack (pile up) the rewiring layer and the rewiring formation layer.

[0259] (Process (G))

[0260] Process (G) is a process of forming a solder resist layer on the rewiring layer. As the material of the solder resist layer, any material having insulating properties can be used. Among them, from the viewpoint of the ease of manufacturing a semiconductor chip package, photosensitive resin and thermosetting resin are preferably used. In addition, as the thermosetting resin, the resin composition of the present invention can be used.

[0261] In addition, in process (G), bump processing for forming bumps can be carried out as needed. The bump processing can be carried out by methods such as solder balls and solder plating. In addition, the formation of through-holes in the bump processing can be carried out in the same manner as in process (E).

[0262] (Process (H))

[0263] For a method of manufacturing a semiconductor chip package, in addition to including steps (A) to (G), step (H) may also be included. Step (H) is a step of singulating a plurality of semiconductor chip packages into individual semiconductor chip packages. The method of cutting the semiconductor chip packages into individual semiconductor chip packages is not particularly limited.

[0264] <Semiconductor Device>

[0265] The semiconductor device includes a semiconductor chip package. Examples of the semiconductor device include a printed wiring board, a semiconductor chip package, a multi-chip package, a package-on-package, a wafer-level package (e.g., a fan-out type WLP), a panel-level package, a system-level package, etc. Examples of the semiconductor device include various semiconductor devices for electrical products (e.g., computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, medical devices, and televisions, etc.) and transportation means (e.g., motorcycles, automobiles, trains, ships, and airplanes, etc.).

[0266] Examples

[0267] Hereinafter, the present invention will be specifically described by showing examples. However, the present invention is not limited to the following examples. In the following description, unless otherwise specified, "parts" and "%" representing amounts refer to "parts by mass" and "% by mass", respectively. In addition, the operations described below are performed in an environment of normal temperature and pressure unless otherwise specified.

[0268] [Example 1]

[0269] <Preparation of Resin Paste A>

[0270] Using a mixer, 10 parts of an epoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., "ZX-1059", epoxy equivalent: 165 g / eq.) as component (A), 5 parts of a compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-130G", methacryloyl equivalent: 628 g / eq.) as component (B), 8 parts of an acid anhydride-based curing agent (manufactured by Shin Nippon Rika Co., Ltd., "MH-700", acid anhydride equivalent: 163 g / eq.) as component (C), 0.1 part of a thermal free radical generator (manufactured by Arkema Fuji Co., Ltd., "LUPEROX 531M80", 10-hour half-life temperature T10: 93.0 °C, hydrocarbon solution with a peroxide content of 80%) as component (D), 0.15 part of an imidazole-based curing accelerator (manufactured by Shikoku Kasei Co., Ltd., "1B2PZ") as component (F), and an inorganic filler A (average particle size: 1.8 μm, specific surface area: 3.6 m 285 parts of spherical silica treated with "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., with a maximum cut diameter of 5 μm, were uniformly dispersed. Thus, a liquid resin composition was prepared. Hereinafter, the liquid resin composition thus prepared will also be referred to as "resin paste A".

[0271] <Evaluation of the cured product of Resin Paste A>

[0272] Using the obtained resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained, and from the viewpoints of warpage, elastic modulus, adhesion to an inorganic material, and peelability from a film material described later, the obtained compression molded body (resin composition layer) or cured product or evaluation substrate was subjected to evaluation.

[0273] [Examples 2 to 6]

[0274] In Examples 2 to 6, 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-130G") as the component (B) in Example 1 were respectively changed to: 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-230G", methacryloyl equivalent: 1068 g / eq.) as the component (B), 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-23G", methacryloyl equivalent: 568 g / eq.) as the component (B), 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-90G", methacryloyl equivalent: 468 g / eq.) as the component (B), 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-40G", methacryloyl equivalent: 276 g / eq.) as the component (B), and 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-1300N", methacryloyl equivalent: 842 g / eq.) as the component (B).

[0275] Except for the above matters, the operation was the same as in Example 1 to prepare resin paste A. Moreover, using resin paste A, the operation was the same as in Example 1 to obtain a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product, and they were subjected to evaluation in the same manner as in Example 1.

[0276] [Example 7]

[0277] In Example 6, 85 parts of inorganic filler A as component (E) was changed to 140 parts of inorganic filler B as component (E) (average particle size: 2.6 μm, specific surface area: 1.4 m 2 / g, maximum divided particle size: 10 μm, spherical alumina treated with "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.).

[0278] Except for the above matters, the operation was the same as in Example 6 to prepare resin paste A. Moreover, using resin paste A, the operation was the same as in Example 6 to obtain a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product, and they were subjected to evaluation in the same manner as in Example 6.

[0279] [Examples 8 and 9]

[0280] In Example 8, 0.1 part of the thermal radical generator as component (D) in Example 6 ("LUPEROX 531M80" manufactured by Arkema Fuji Co., Ltd., a hydrocarbon solution with a peroxide content of 80%) was changed to 0.1 part of the thermal radical generator as component (D) ("PERHEXYL (registered trademark) O" manufactured by NOF Corporation, 10-hour half-life temperature T10: 69.9 °C). In Example 9, 0.1 part of the thermal radical generator as component (D) in Example 6 ("LUPEROX531M80" manufactured by Arkema Fuji Co., Ltd., a hydrocarbon solution with a peroxide content of 80%) was changed to 0.1 part of the thermal radical generator as component (D) ("MAIB" (dimethyl 2,2'-azobisisobutyrate) manufactured by Fujifilm Wako Pure Chemical Corporation, 10-hour half-life temperature T10: 67.0 °C).

[0281] Except for the above matters, the operation was the same as in Example 6 to prepare resin paste A. Moreover, using resin paste A, the operation was the same as in Example 6 to obtain a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product, and they were subjected to evaluation in the same manner as in Example 6.

[0282] [Example 10]

[0283] In Example 6, 8 parts of the acid anhydride curing agent as component (C) ("MH-700" manufactured by Shin Nippon Rika Co., Ltd.) was changed to 8 parts of the acid anhydride curing agent as component (C) ("HNA-100" manufactured by Shin Nippon Rika Co., Ltd., acid anhydride group equivalent: 179 g / eq.).

[0284] Except for the above matters, resin paste A was prepared in the same manner as in Example 6. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0285] [Example 11]

[0286] In Example 6, 8 parts of the acid anhydride-based curing agent (manufactured by Shin-Nippon Rika Co., Ltd., "MH-700") as component (C) was changed to 15 parts of the acid anhydride-based curing agent (manufactured by Shin-Nippon Rika Co., Ltd., "MH-700") as component (C), and 85 parts of inorganic filler A as component (E) was changed to 100 parts of inorganic filler A as component (E).

[0287] Except for the above matters, resin paste A was prepared in the same manner as in Example 6. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0288] [Example 12]

[0289] In Example 6, 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-1300N") as component (B) was changed to 10 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-1300N") as component (B), and 85 parts of inorganic filler A as component (E) was changed to 95 parts of inorganic filler A as component (E).

[0290] Except for the above matters, resin paste A was prepared in the same manner as in Example 6. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0291] [Example 13]

[0292] In Example 6, for component (A), 10 parts of an epoxy resin (“ZX-1059” manufactured by Nippon Steel Chemical & Material Co., Ltd.) was changed to 5 parts of an epoxy resin (“ZX-1059” manufactured by Nippon Steel Chemical & Material Co., Ltd.) and 5 parts of an epoxy resin (“HP-4032SS” manufactured by DIC Corporation, epoxy equivalent: 143 g / eq.). For component (C), 8 parts of an acid anhydride curing agent (“MH-700” manufactured by Shin Nippon Rika Co., Ltd.) was changed to 9 parts of an acid anhydride curing agent (“MH-700” manufactured by Shin Nippon Rika Co., Ltd.), and 85 parts of inorganic filler A as component (E) was changed to 90 parts of inorganic filler A as component (E).

[0293] Except for the above matters, the resin paste A was prepared in the same manner as in Example 6. Moreover, using the resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0294] [Example 14]

[0295] In Example 6, for component (A), 10 parts of an epoxy resin (“ZX-1059” manufactured by Nippon Steel Chemical & Material Co., Ltd.) was changed to 5 parts of an epoxy resin (“ZX-1059” manufactured by Nippon Steel Chemical & Material Co., Ltd.) and 5 parts of an epoxy resin (“630LSD” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 98 g / eq.). For component (C), 8 parts of an acid anhydride curing agent (“MH-700” manufactured by Shin Nippon Rika Co., Ltd.) was changed to 11 parts of an acid anhydride curing agent (“MH-700” manufactured by Shin Nippon Rika Co., Ltd.), and 85 parts of inorganic filler A as component (E) was changed to 95 parts of inorganic filler A as component (E).

[0296] Except for the above matters, the resin paste A was prepared in the same manner as in Example 6. Moreover, using the resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0297] [Example 15]

[0298] In Example 6, 85 parts of inorganic filler A as component (E) was changed to 95 parts of inorganic filler C as component (E) (average particle size: 1.8 μm, specific surface area: 3.6 m 2 / g, maximum divided particle size: 5 μm, spherical silica treated with “KBM-4803” (epoxypropoxyoctyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.).

[0299] Except for the above matters, resin paste A was prepared in the same manner as in Example 6. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0300] [Example 16]

[0301] In Example 6, 85 parts of inorganic filler A as component (E) was changed to 85 parts of inorganic filler D as component (E) (average particle size: 1.8 μm, specific surface area: 3.6 m 2 / g, maximum divided particle size: 5 μm, spherical silica treated with "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.).

[0302] Except for the above matters, resin paste A was prepared in the same manner as in Example 6. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0303] [Comparative Example 1]

[0304] In Example 1, 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-130G") as component (B) was changed to 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-500", methacryloyl equivalent: 402 g / eq.) as component (B'). That is, component (B) was not used in Comparative Example 1.

[0305] Except for the above matters, resin paste A was prepared in the same manner as in Example 1. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 1, and they were subjected to evaluation in the same manner as in Example 1.

[0306] [Comparative Example 2]

[0307] In Example 6, 8 parts of the acid anhydride curing agent (MH-700 manufactured by Shin Nippon Rika Co., Ltd.) as component (C) was changed to 0.5 part of the amine curing agent (KAYAHARD A-A manufactured by Nippon Kayaku Co., Ltd.) as component (H). That is, component (C) was not used in Comparative Example 2. In addition, in Example 6, 0.15 part of the imidazole curing accelerator (1B2PZ manufactured by Shikoku Chemicals Corporation) as component (F) was changed to 0.2 part of the imidazole curing accelerator (2E4MZ manufactured by Shikoku Chemicals Corporation) as component (F), and 85 parts of the inorganic filler A as component (E) was changed to 60 parts of the inorganic filler A as component (E).

[0308] Except for the above matters, resin paste A was prepared in the same manner as in Example 6. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0309] [Comparative Example 3]

[0310] In Comparative Example 2, 0.5 part of the amine curing agent (KAYAHARD A-A manufactured by Nippon Kayaku Co., Ltd.) as component (H) was changed to 1 part of dicyandiamide (DICY7 manufactured by Mitsubishi Chemical Corporation) as component (H). That is, component (C) was not used in Comparative Example 3 in the same manner as in Comparative Example 2.

[0311] Except for the above matters, resin paste A was prepared in the same manner as in Comparative Example 2. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Comparative Example 2, and they were subjected to evaluation in the same manner as in Comparative Example 2.

[0312] [Comparative Example 4]

[0313] In Comparative Example 2, 0.5 part of the amine curing agent (KAYAHARD A-A manufactured by Nippon Kayaku Co., Ltd.) as component (H) was not used. That is, component (C) was not used in Comparative Example 4 in the same manner as in Comparative Example 2.

[0314] Except for the above matters, resin paste A was prepared in the same manner as in Comparative Example 2. Moreover, using resin paste A, a compression molded body (resin composition layer) or a cured product or an evaluation substrate containing the cured product was obtained in the same manner as in Comparative Example 2, and they were subjected to evaluation in the same manner as in Comparative Example 2.

[0315] [Comparative Example 5]

[0316] In Example 1, 5 parts of the compound having a methacryloyl group and a polyoxyethylene structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "M-130G") as component (B) was not used. That is, in Comparative Example 5, component (B) was not used. Further, in Example 1, 85 parts of inorganic filler A as component (E) was changed to 65 parts of inorganic filler A as component (E).

[0317] Except for the above matters, the resin paste A was prepared in the same manner as in Example 1. Moreover, using the resin paste A, the compression molded body (resin composition layer) or the cured product or the evaluation substrate containing the cured product was obtained in the same manner as in Example 1, and they were subjected to evaluation in the same manner as in Example 1.

[0318] [Comparative Example 6]

[0319] In Example 6, 8 parts of the acid anhydride-based curing agent (manufactured by Shin Nippon Rika Co., Ltd., "MH-700") as component (C) was changed to 3 parts of the acid anhydride-based curing agent (manufactured by Shin Nippon Rika Co., Ltd., "MH-700") as component (C). Further, in Example 6, 85 parts of inorganic filler A as component (E) was changed to 65 parts of inorganic filler A as component (E).

[0320] Except for the above matters, the resin paste A was produced in the same manner as in Example 6. Moreover, using the resin paste A, the compression molded body (resin composition layer) or the cured product or the evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0321] [Comparative Example 7]

[0322] In Example 6, 5 parts of the compound having a methacryloyl group and a polyoxyethylene structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-1300N") as component (B) was changed to 1 part of the compound having a methacryloyl group and a polyoxyethylene structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-1300N") as component (B). Further, in Example 6, 85 parts of inorganic filler A as component (E) was changed to 70 parts of inorganic filler A as component (E).

[0323] Except for the above matters, the resin paste A was prepared in the same manner as in Example 6. Moreover, using the resin paste A, the compression molded body (resin composition layer) or the cured product or the evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were subjected to evaluation in the same manner as in Example 6.

[0324] [Comparative Example 8]

[0325] In Example 6, 5 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-1300N") as component (B) was changed to 13 parts of the compound having a methacryloyl group and a polyethylene oxide structure (manufactured by Shin-Nakamura Chemical Co., Ltd., "BPE-1300N") as component (B). Further, in Example 6, 85 parts of inorganic filler A as component (E) was changed to 110 parts of inorganic filler A as component (E).

[0326] Except for the above matters, the resin paste A was prepared in the same manner as in Example 6. Moreover, using the resin paste A, the compression molded body (resin composition layer) or cured product or evaluation substrate containing the cured product was obtained in the same manner as in Example 6, and they were evaluated in the same manner as in Example 6.

[0327] [Evaluation method]

[0328] The compression molded body (resin composition layer) or cured product or evaluation substrate containing the cured product of the resin paste A obtained in the above Examples and Comparative Examples was obtained, and for them, evaluation was carried out according to the following method from the viewpoints of warpage, elastic modulus, adhesion to the inorganic material, and peelability from the film material. It should be noted that the evaluation results are shown in Tables 1 and 2.

[0329] <Evaluation of peelability from the film material>

[0330] For the resin paste A, its compression molded body (resin composition layer) was obtained, and the peelability from the film material was evaluated as follows.

[0331] (Production of evaluation substrate Bb containing resin composition layer Ba)

[0332] First, a compression molding apparatus equipped with a mold was prepared. A release film (AGC Inc.'s two-sided pear skin surface processed film "AFREX (registered trademark) 50MW") was mounted on the surface of the mold. Using this compression molding apparatus, the resin paste A was compression molded on a 12-inch silicon wafer (substrate) under the conditions of a mold temperature Tc: 130 °C, a pressure of 6 MPa, and a curing time of 10 minutes. Thus, an evaluation substrate formed of "silicon wafer" and "a 150-μm-thick resin composition layer as the compression molded body of the resin paste A formed on the silicon wafer" was produced in the mold. Hereinafter, the resin composition layer and the evaluation substrate thus produced are also referred to as "resin composition layer Ba" and "evaluation substrate Bb", respectively.

[0333] (Evaluation of resin composition layer Ba)

[0334] Moreover, after the compression molding was completed, it was confirmed whether the mold was opened (i.e., whether a pair of opposing molds were separated by the normal driving force set in the compression molding apparatus). Further, in the case where the mold was opened, it was observed whether the resin composition layer Ba was peeled off from the release film and was on the silicon wafer. The results of these confirmations and observations were evaluated according to the following criteria:

[0335] “○”: As a result of the test, it was observed that the mold was opened with the normal driving force, and the resin composition layer B was peeled off from the release film and was on the silicon wafer. Therefore, it was evaluated that the peelability of the resin composition layer B from the film material was excellent;

[0336] “×”: As a result of the test, the mold was not opened with the normal driving force. Or, since the resin composition layer B was not peeled off from the release film, it was observed that (i) the entire evaluation substrate Bb adhered to the release film or (ii) a part or all of the resin composition layer Ba was detached from the silicon wafer. Therefore, it was evaluated that the peelability of the resin composition layer Ba from the film material was not excellent.

[0337] <Evaluation of warpage>

[0338] The resin composition layer Ba contained in the evaluation substrate Bb produced during the evaluation of the peelability from the film material was cured to obtain an evaluation substrate containing the cured product. As described in detail below, the warpage of the cured product was evaluated by measuring the warpage amount of the evaluation substrate.

[0339] (Production of the evaluation substrate Cb of the cured product Ca containing the resin composition layer Ba)

[0340] The resin composition layer Ba contained in the evaluation substrate Bb produced during the evaluation of the peelability from the film material and the silicon wafer were heated at 150 °C for 60 minutes. Thereby, the resin composition layer Ba was thermally cured on the silicon wafer to form a cured product. Hereinafter, the cured product of the resin composition layer and the evaluation substrate produced in this way will be referred to as “cured product Ca” and “evaluation substrate Cb”, respectively. It should be noted that in Comparative Examples 2 to 4 and 6, as a result of the evaluation of the peelability from the film material, the mold was not opened with the normal driving force. Therefore, first, the release film was removed from the compression molding apparatus, and then the evaluation substrate Bb in the state of adhering to the release film was taken out from one of the molds, and further, the release film was peeled off from the resin composition layer Ba, thereby obtaining the evaluation substrate Bb. It should be noted that in Comparative Examples 2 to 4 and 6, no interfacial peeling was confirmed between the resin composition layer Ba and the silicon wafer and between the resin composition layer Ba and the release film. Therefore, even in Comparative Examples 2 to 4 and 6, as described above, the evaluation substrate Cb containing the cured product Ca of the resin composition layer Ba can be obtained.

[0341] (Measurement and evaluation of warpage amount)

[0342] Using a shadow moire measuring device (Thermoire AXP manufactured by Akorometrix), the warpage amount of each evaluation substrate Cb was measured in a room at 25°C. The measurement was carried out in accordance with JEITA EDX-7311-24 of the Electronic Information Technology Industry Association standard. Specifically, the fitting plane calculated by the least squares method for all the data on the substrate surface passing through the measurement area was taken as the reference plane, and the difference between the minimum value and the maximum value in the vertical direction from this reference plane was obtained as the warpage amount.

[0343] The warpage amount obtained was evaluated according to the following criteria;

[0344] “◎”: The warpage amount is less than 1500 μm, and it is evaluated that the warpage amount is extremely small;

[0345] “〇”: The warpage amount is 1500 μm or more and less than 2000 μm, and it is evaluated that the warpage amount is sufficiently small;

[0346] “△”: The warpage amount is 2000 μm or more and less than 2300 μm, and it is evaluated that the warpage amount is small;

[0347] “×”: The warpage amount is 2300 μm or more, and it is evaluated that the warpage amount is large.

[0348] <Evaluation of adhesion to inorganic materials>

[0349] A cured product obtained using resin paste A was obtained, and as described in detail below, the adhesion to inorganic materials was evaluated by measuring the adhesion strength to copper foil.

[0350] (Production of laminate Db of resin composition layer Da containing resin paste A)

[0351] First, a compression molding device equipped with a mold was prepared. Using this compression molding device, under the conditions of a mold temperature Tc: 130°C, pressure: 6 MPa, and curing time: 10 minutes, resin paste A placed on the shiny surface (bright surface) of a copper foil with a thickness of 18 μm was compression molded on a SUS plate (12 inches) coated with a mold release agent. After compression molding, the resin composition layer was peeled off from the SUS plate. Thus, a laminate formed by "a resin composition layer with a thickness of 300 μm as a compression molded body of resin paste A" and "a copper foil provided on this resin composition layer" was obtained. In this laminate, the non-shiny surface (mat surface) of the copper foil was exposed. Hereinafter, the resin composition layer and the laminate produced in this way will be referred to as "resin composition layer Da" and "laminate Db", respectively.

[0352] (Production of laminate Eb of cured product Ea containing resin composition layer Da)

[0353] Next, the laminate Db was heated at 150 °C for 60 minutes. As a result, the resin composition layer Da was thermally cured while maintaining the state with the copper foil, and a cured product was formed. Hereinafter, the cured product of the resin composition layer and the laminate thus produced are also referred to as "cured product Ea" and "laminate Eb", respectively.

[0354] (Fabrication of Specimen F)

[0355] Next, the laminate Eb was cut into squares with a side length of 1 cm. As a result, a plurality of specimen materials with a side length of 1 cm and a thickness of 318 μm were obtained.

[0356] Furthermore, on the matte surface of the copper foil of each specimen material, one stud pin (φ5.8 mm) with an adhesive was vertically installed. Next, a backing plate with an adhesive was overlapped on the surface of the cured product (cured product Ea) of the resin composition layer of the specimen material. As a result, a laminate successively including a backing plate, a specimen material, and a stud pin was obtained. Then, this laminate was heated at 150 °C for 60 minutes. As a result, the adhesive was cured, the copper foil and the stud pin were fixed, and a laminate in which the specimen material and the backing plate were fixed was obtained. Next, in the bonding portion of the copper foil and the stud pin, a cutter was used to cut a notch only on the copper foil along the circumferential surface (φ5.8 mm) of the stud pin. Hereinafter, the laminate thus obtained is also referred to as "specimen F".

[0357] (Measurement and Evaluation of the Bonding Strength between the Cured Product Ea and the Inorganic Material)

[0358] Using a vertical tensile testing machine "ROMULUS" manufactured by QUAD GROUP, a vertical tensile test was performed on each obtained specimen F at a test speed of 0.1 kg / sec, and a measured value representing the peel strength of the copper foil (hereinafter, also simply referred to as "bonding strength") was obtained. Specifically, this measured value generally represents the bonding strength between the cured product Ea and the copper foil as an inorganic material. Five specimens F were measured, and the average value of the measured values of the bonding strength was calculated. Moreover, the average value of the measured values of the bonding strength calculated was evaluated according to the following criteria;

[0359] "○": The average value of the measured values of the bonding strength is 100 kgf / cm 2 Above, it was evaluated that the adhesion between the cured product Ea and the inorganic material is excellent;

[0360] "×": The average value of the measured values of the bonding strength is less than 100 kgf / cm 2 and it was evaluated that the adhesion between the cured product Ea and the inorganic material is not excellent.

[0361] <Evaluation of Elastic Modulus>

[0362] As described in detail below, the elastic modulus of the cured product obtained using Resin Paste A was evaluated.

[0363] (Production of laminate Gb of resin composition layer Ga containing Resin Paste A)

[0364] Using a compression molding device (mold temperature Tc: 130 °C, pressure: 6 MPa, curing time: 10 minutes), Resin Paste A placed on a SUS plate was compression molded in a mold. The SUS plate was a SUS plate with a mold release treatment on its surface. Thus, a laminate formed of a "SUS plate" and a "resin composition layer with a thickness of 300 μm as a compression molded body of Resin Paste A provided on the SUS plate" was obtained. Hereinafter, the resin composition layer and the laminate produced in this way will be referred to as "resin composition layer Ga" and "laminate Gb", respectively.

[0365] (Production of cured product H of resin composition layer Ga)

[0366] Next, the laminate Gb was heated at 150 °C for 60 minutes. Thus, the resin composition layer Ga was thermally cured on the SUS plate to form a cured product. Moreover, the cured product was peeled off from the SUS plate. Hereinafter, the cured product of the resin composition layer produced in this way will also be referred to as "cured product H".

[0367] (Production of test piece I and measurement and evaluation of elastic modulus at 25 °C)

[0368] Next, three test pieces of No. 1 shape, which were dumbbell-shaped in plan view, were cut out from the cured product H. Hereinafter, each test piece obtained in this way will also be referred to as "test piece I". Next, for each test piece I, a tensile test was carried out at 25 °C in a room using a tensile testing machine "RTC-1250A" manufactured by Orientec Co., Ltd., and thus the elastic modulus (GPa) at 25 °C was measured. The measurement was carried out in accordance with JIS K7127:1999. The average value of the measured values of the elastic modulus at 25 °C of the three test pieces I was calculated. Moreover, the average value of the measured values of the elastic modulus at 25 °C calculated was evaluated according to the following criteria;

[0369] "○": The average value of the measured values of the elastic modulus at 25 °C is 9 GPa or more, and it is evaluated that the elastic modulus is high;

[0370] "△": The average value of the measured values of the elastic modulus at 25 °C is 7 GPa or more and less than 9 GPa, and it is evaluated that the elastic modulus is sufficiently high;

[0371] "×": The average value of the measured values of the elastic modulus at 25 °C is less than 7 GPa, and it is evaluated that the elastic modulus is low.

[0372] [Results]

[0373] The results of the above-described examples and comparative examples are shown in Tables 1 and 2 below.

[0374] In Tables 1 and 2 below, the amounts of the respective components are expressed as amounts in terms of non-volatile components. In addition, the "resin component" shown in Tables 1 and 2 refers to the component other than the (E) inorganic filler in the non-volatile components of the resin composition. "Mass ratio [b]:[c]" represents the mass ratio of component (B) to component (C). "Content ratio of component (B) in the resin component" represents the content of component (C) when the resin component in the non-volatile components of the resin composition is set to 100% by mass. "Equivalent ratio (c) / (a)" represents the equivalent ratio (c) / (a) value obtained by dividing the amount (g) of component (C) by the equivalent weight (g / eq.) of the acid anhydride group possessed by component (C) and summing the resulting values, and dividing the amount (g) of component (A) by the equivalent weight (g / eq.) of the epoxy group possessed by component (A) and summing the resulting values. "Content ratio of component (E) in the resin composition" represents the content of component (E) when the content of the non-volatile components of the resin composition is set to 100% by mass. "ΔT of component (D)" represents the difference (°C) between the mold temperature Tc (130 °C) during compression molding and the 10-hour half-life temperature T10 (°C) of component (D).

[0375] [Table 1]

[0376]

[0377] [Table 2]

[0378]

[0379] <Discussion>

[0380] As can be seen from Tables 1 and 2, by comparing the examples and comparative examples, in the examples, the resin composition contains: (A) an epoxy resin, (B) a compound having a radically polymerizable unsaturated group and an alkylene oxide structure and being a compound that satisfies the following formula (1), (C) an acid anhydride, (D) a radical generator, and (E) an inorganic filler,

[0381] E / N-(100×N)≥50···(1)

[0382] (In formula (1), E represents the equivalent weight (g / eq.) of the radically polymerizable unsaturated group, and N represents the number of radically polymerizable unsaturated groups in the molecule, which is an integer of 1 or more)

[0383] The mass ratio [b]:[c] of the component (B) to the component (C) is in the range of 0.2:1 to 1.5:1, whereby it is possible to provide a cured product having small warpage, a large elastic modulus, excellent adhesion to an inorganic material, and excellent peelability from a film material, or a resin composition or a resin paste.

[0384] Furthermore, it is also possible to provide a cured product, a resin sheet, a printed wiring board, a semiconductor chip package, and a semiconductor device obtained by using the resin composition or the resin paste according to the embodiments.

Claims

1. A resin composition, wherein, Comprising: (A) Epoxy resin; (B) A compound having a radically polymerizable unsaturated group and a polyoxyalkylene structure in the molecule, and this compound satisfies the following formula (1): E / N-(100×N)≥50···(1) In formula (1), E represents the equivalent weight (g / eq.) of the radically polymerizable unsaturated group, N represents the number of radically polymerizable unsaturated groups in the molecule, and it is an integer of 1 or more; (C) Acid anhydride; (D) Radical generator; and (E) Inorganic filler, and, the mass ratio [b]︰[c] representing the component (B) and the component (C) is in the range of 0.2︰1 to 1.5︰1, when the components other than the (E) inorganic filler in the non-volatile components in the resin composition are set to 100% by mass, the content of the component (B) is 10% by mass or more and 40% by mass or less, the equivalent ratio (c) / (a) of the sum of the values obtained by dividing the amount (g) of the component (C) by the equivalent weight (g / eq.) of the acid anhydride group possessed by this component (C) and the sum of the values obtained by dividing the amount (g) of the component (A) by the equivalent weight (g / eq.) of the epoxy group possessed by this component (A) is 0.4 or more.

2. The resin composition according to claim 1, wherein, (B) The polyoxyalkylene structure possessed by the component is represented by the formula: -(R B O) n -, where in the above formula, n is an integer of 2 or more, and R B are each independently an alkylene group having 2 to 6 carbon atoms which may optionally have a substituent.

3. The resin composition according to claim 2, wherein Among a plurality of groups R B at least one group R B contains an ethylidene group.

4. The resin composition according to claim 1, wherein, The radically polymerizable unsaturated group possessed by the component (B) is one or more selected from vinyl, allyl, 1-butenyl, 2-butenyl, acryloyl, methacryloyl, fumaroyl, maleoyl, vinylphenyl, styryl and cinnamoyl.

5. The resin composition according to claim 4, wherein The radically polymerizable unsaturated group possessed by the component (B) includes one or more selected from methacryloyl and acryloyl.

6. The resin composition according to claim 4, wherein, The radically polymerizable unsaturated group possessed by the component (B) includes methacryloyl.

7. The resin composition according to claim 1, wherein, The component (B) includes one or more compounds selected from the compound in which N in formula (1) is 1 and the compound in which N in formula (1) is 2.

8. The resin composition according to claim 7, wherein, The molecular weight of the compound in which N in formula (1) is 1 is 150 or more.

9. The resin composition according to claim 7, wherein, The molecular weight of the compound in which N in formula (1) is 1 is 250 or more.

10. The resin composition according to claim 7, wherein, The molecular weight of the compound in which N in formula (1) is 1 is 400 or more.

11. The resin composition according to claim 7, wherein, The molecular weight of the compound in which N in formula (1) is 2 is 1000 or more.

12. The resin composition according to claim 7, wherein, The molecular weight of the compound in which N in formula (1) is 2 is 1200 or more.

13. The resin composition according to claim 1, wherein, The molecular weight of the component (B) is 5000 or less.

14. The resin composition according to claim 1, wherein, The molecular weight of the component (B) is 1500 or less.

15. The resin composition according to claim 7, wherein, The equivalent weight (g / eq.) of the radically polymerizable unsaturated group of the compound in which N in formula (1) is 2 is 500 or more.

16. The resin composition according to claim 7, wherein, The equivalent weight (g / eq.) of the radically polymerizable unsaturated group of the compound in which N in formula (1) is 2 is 600 or more.

17. The resin composition according to claim 7, wherein, The equivalent weight (g / eq.) of the radically polymerizable unsaturated group of the compound in which N in formula (1) is 1 is 150 or more.

18. The resin composition according to claim 7, wherein, The equivalent weight (g / eq.) of the radically polymerizable unsaturated group of the compound in which N in formula (1) is 1 is 400 or more.

19. The resin composition according to claim 1, wherein, The equivalent weight of the radically polymerizable unsaturated group of the component (B) is 4500 g / eq. or less.

20. The resin composition according to claim 1, wherein, The equivalent weight of the radically polymerizable unsaturated group of the component (B) is 3000 g / eq. or less.

21. The resin composition according to claim 1, wherein, The equivalent weight of the radically polymerizable unsaturated group of component (B) is 1500 g / eq. or less.

22. The resin composition according to claim 1, wherein, When the components other than the (E) inorganic filler in the non-volatile components of the resin composition are set to 100% by mass, the content of component (B) is 16% by mass or more.

23. The resin composition according to claim 1, wherein, When the components other than the (E) inorganic filler in the non-volatile components of the resin composition are set to 100% by mass, the content of component (B) is 30% by mass or less.

24. The resin composition according to claim 1, wherein, The equivalent ratio (c) / (a) of the sum of the values obtained by dividing the amount (g) of component (C) by the equivalent weight (g / eq.) of the acid anhydride group possessed by the component (C) and the sum of the values obtained by dividing the amount (g) of component (A) by the equivalent weight (g / eq.) of the epoxy group possessed by the component (A) is 0.6 or more.

25. The resin composition according to claim 1, wherein, The equivalent ratio (c) / (a) of the sum of the values obtained by dividing the amount (g) of component (C) by the equivalent weight (g / eq.) of the acid anhydride group possessed by the component (C) and the sum of the values obtained by dividing the amount (g) of component (A) by the equivalent weight (g / eq.) of the epoxy group possessed by the component (A) is 1.6 or less.

26. The resin composition according to claim 1, wherein, The equivalent ratio (c) / (a) of the sum of the values obtained by dividing the amount (g) of component (C) by the equivalent weight (g / eq.) of the acid anhydride group possessed by the component (C) and the sum of the values obtained by dividing the amount (g) of component (A) by the equivalent weight (g / eq.) of the epoxy group possessed by the component (A) is 1.4 or less.

27. The resin composition according to claim 1, wherein, Component (D) is one or more selected from radical generators having a 10-hour half-life temperature T10 (°C) in the range of 50°C or higher and 110°C or lower.

28. The resin composition according to claim 1, wherein, Component (D) is one or more selected from radical generators having a 10-hour half-life temperature T10 (°C) in the range of 100°C or lower.

29. The resin composition according to claim 1, wherein, Component (D) is one or more selected from radical generators having a 10-hour half-life temperature T10 (°C) in the range of 80°C or lower.

30. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (A) is 1% by mass or more.

31. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (A) is 5% by mass or more.

32. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (A) is 30% by mass or less.

33. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (A) is 15% by mass or less.

34. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (B) is 0.1% by mass or more.

35. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (B) is 2% by mass or more.

36. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (B) is 20% by mass or less.

37. The resin composition according to claim 1, wherein, When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (B) is 15% by mass or less.

38. The resin composition according to claim 1, wherein When the content of the non-volatile components of the resin composition is set to 100% by mass, the content of component (C) is 0.5% by mass or more.

39. The resin composition according to claim 1, wherein, When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (C) is 3% by mass or more.

40. The resin composition according to claim 1, wherein When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (C) is 40% by mass or less.

41. The resin composition according to claim 1, wherein, When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (C) is 20% by mass or less.

42. The resin composition according to claim 1, wherein, When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (D) is 0.02% by mass or more.

43. The resin composition according to claim 1, wherein When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (D) is 0.04% by mass or more.

44. The resin composition according to claim 1, wherein When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (D) is 5% by mass or less.

45. The resin composition according to claim 1, wherein, When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (D) is 3% by mass or less.

46. The resin composition according to claim 1, wherein, When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (E) is 70% by mass or more.

47. The resin composition according to claim 1, wherein When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (E) is 72% by mass or more.

48. The resin composition according to claim 1, wherein, When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (E) is 95% by mass or less.

49. The resin composition according to claim 1, wherein, When the content of the non-volatile components in the resin composition is set to 100% by mass, the content of component (E) is 90% by mass or less.

50. The resin composition according to claim 1, wherein The mass ratio [b]:[c] representing component (B) and component (C) is in the range of 0.25:1 to 1.35:

1.

51. The resin composition according to claim 1, wherein, The mass ratio [b]:[c] representing component (B) and component (C) is in the range of 0.3:1 to 1.3:

1.

52. The resin composition according to claim 1, which is used for compression molding.

53. The resin composition according to claim 52, wherein, Component (D) is one or more selected from free radical generators in which the difference ΔT (°C) between the mold temperature Tc (°C) during compression molding and the 10-hour half-life temperature T10 (°C) of this component (D) is in the range of 20°C or more and 80°C or less.

54. The resin composition according to claim 52, wherein, Component (D) is one or more selected from free radical generators in which the difference ΔT (°C) between the mold temperature Tc (°C) during compression molding and the 10-hour half-life temperature T10 (°C) of this component (D) is in the range of 30°C or more and 80°C or less.

55. The resin composition according to claim 1, which is used for forming an insulating layer.

56. A resin paste, which contains the resin composition according to any one of claims 1 to 55.

57. A cured product, which is a cured product of the resin composition according to any one of claims 1 to 55 or the resin paste according to claim 56.

58. A resin sheet, which has: a support, and a resin composition layer provided on the support and containing the resin composition according to any one of claims 1 to 55 or the resin paste according to claim 56.

59. A printed wiring board comprising an insulating layer formed of a cured product of the resin composition according to any one of claims 1 to 55 or the resin paste according to claim 56.

60. A semiconductor chip package comprising: the printed wiring board according to claim 59, and a semiconductor chip mounted on the printed wiring board.

61. A semiconductor chip package comprising: a semiconductor chip, and a cured product of the resin composition according to any one of claims 1 to 55 or the resin paste according to claim 56 for sealing the semiconductor chip.

62. A semiconductor device comprising the printed wiring board according to claim 59, or the semiconductor chip package according to claim 60 or 61.

63. A method for manufacturing a printed wiring board, wherein, Comprising: a step of forming a resin composition layer containing the resin composition according to any one of claims 1 to 55 or a resin composition layer containing the resin paste according to claim 56 on a circuit board by a compression molding method; and a step of curing the resin composition layer.

64. A manufacturing method of a semiconductor chip package, wherein, Comprising: a step of forming a resin composition layer containing the resin composition according to any one of claims 1 to 55 or a resin composition layer containing the resin paste according to claim 56 on a semiconductor chip by a compression molding method; and a step of curing the resin composition layer.

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