Charger power module

Abstract

The application provides a charger power module, comprising a substrate assembly, a frame assembly, a support capacitor assembly and a DC blocking capacitor assembly, the support capacitor assembly is located at the bottom of the frame assembly, the frame assembly and the support capacitor assembly enclose a frame structure, the frame structure is fixed on one side of the substrate assembly, the frame structure and the substrate assembly enclose a receiving cavity, the DC blocking capacitor assembly is located at the upper part of the receiving cavity and is electrically connected with the frame assembly and the substrate assembly respectively, the substrate assembly comprises a radiator substrate, a magnetic element and a power device electrically connected with the magnetic element, the frame structure is connected with the radiator substrate to enclose the receiving cavity, and the magnetic element and the power device are respectively integrated on the side of the radiator substrate facing the receiving cavity. The charger power module provided by the application has the advantages of compact structure, reasonable layout and high integration degree, and can better realize the miniaturization, light weight and simple design of the charger.

Description

Technical Field

[0001] This invention relates to the field of charger converter technology, and more particularly to a charger power module. Background Technology

[0002] Urban rail transit refers to large- and medium-capacity urban public transportation vehicles operating on different types of tracks in cities. It is a general term for rail transit systems in modern cities, including subways, light rail, monorails, automated guided vehicles, and short-distance maglev trains. The auxiliary power supply system used in urban rail transit vehicles generally includes auxiliary inverters and chargers. The charger provides DC power to the vehicle and charges the battery. Traditional chargers typically use a three-phase semi-controlled rectification technology, requiring low-frequency magnetic components, resulting in a large size and weight. With the increasing demands for size and weight reduction in the rail transit industry, the need for miniaturization and lightweighting of chargers has become increasingly urgent.

[0003] Currently, the method used to achieve miniaturization and weight reduction of chargers is to use high-frequency circuit topology to reduce the size and weight of magnetic components in the charger.

[0004] Although the above methods can make chargers smaller and lighter to some extent, they are still far from meeting the development needs of chargers to become smaller and lighter. Summary of the Invention

[0005] This invention provides a charger power module with a compact structure and reasonable layout, which at least solves the technical problem that chargers are unable to meet the development needs of miniaturization and lightweighting.

[0006] To achieve the above objectives, the present invention provides a charger power module installed in a charger chassis. The charger power module includes: a substrate assembly, a frame assembly, a supporting capacitor assembly, and a DC blocking capacitor assembly.

[0007] The supporting capacitor assembly is located at the bottom of the frame assembly. The frame assembly and the supporting capacitor assembly form a frame structure. The frame structure is fixed to one side of the substrate assembly and the frame structure and the substrate assembly form a receiving cavity. The DC blocking capacitor assembly is located at the top of the receiving cavity and is electrically connected to the frame assembly and the substrate assembly respectively.

[0008] The substrate assembly includes a heat sink substrate, a magnetic element, and a power device electrically connected to the magnetic element. The frame structure is connected to the heat sink substrate to form the receiving cavity.

[0009] The magnetic element and the power device are respectively integrated on one side of the heat sink substrate facing the receiving cavity, with the magnetic element located at one end of the heat sink substrate and the power device located at the other end of the heat sink substrate.

[0010] Optionally, the top of the frame assembly is provided with a terminal, which is electrically connected to the DC blocking capacitor assembly, and the terminal is also used to connect to an external main circuit.

[0011] The frame assembly has an external connector on its side, which is connected to the base plate assembly and is also used to connect to an external control loop.

[0012] Optionally, the supporting capacitor assembly includes: a first mounting plate and a supporting capacitor and a filtering capacitor fixed on the first mounting plate, wherein the supporting capacitor and the filtering capacitor are located within the receiving cavity.

[0013] The supporting capacitor assembly also includes a power switch, a quick-connect guide slot, and a drive assembly base fixed to the other side of the first mounting plate.

[0014] The drive component base is electrically connected to the substrate component.

[0015] In one possible implementation, the charger power module further includes a drive component.

[0016] The drive component is connected to the drive component base via the quick-connect guide groove.

[0017] In one possible implementation, the bottom of the frame assembly is provided with a slide rail.

[0018] The charger module is installed into the charger chassis via the slide rail.

[0019] Optionally, the end of the frame assembly away from the heat sink substrate is bent to form a folded edge, and a handle is provided on the folded edge.

[0020] Optionally, a fan is also provided on the side of the frame assembly, and the receiving cavity exchanges air with the outside through the fan.

[0021] Optionally, the substrate assembly further includes a second mounting plate.

[0022] The magnetic element is fixed to one side of the second mounting plate, and the side of the second mounting plate away from the magnetic element is fixed to the heat sink substrate. A heat insulation layer is provided on the circumferential surface of the magnetic element.

[0023] In one possible implementation, the charger power module further includes a cover plate.

[0024] The cover plate is connected to the frame structure and is used to cover the opening of the receiving cavity. The cover plate is located on the side of the external connector near the heat sink substrate.

[0025] Optionally, a heat pipe for heat dissipation is provided on the surface of the heat sink substrate.

[0026] The charger power module provided in this embodiment of the invention utilizes a stacked modular design for the substrate assembly, frame assembly, supporting capacitor assembly, and DC blocking capacitor assembly. Assembly is simple, requiring only the splicing of all components. This results in a compact structure, rational layout, and high integration, enabling miniaturization, weight reduction, and simplification of the charger power module, meeting the development demands for smaller and lighter chargers. Furthermore, integrating magnetic components and power devices onto the substrate assembly avoids the dispersion of electromagnetic interference sources; only electromagnetic shielding of the charger power module needs to be considered within the charger chassis. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the charger power module provided in an embodiment of the present invention;

[0029] Figure 2 An exploded view of the charger power module provided in an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of the substrate assembly of the charger power module provided in an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the frame assembly of the charger power module provided in an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the supporting capacitor assembly of the charger power module provided in an embodiment of the present invention;

[0033] Figure 6 This is a schematic diagram of the DC blocking capacitor assembly of the charger power module provided in an embodiment of the present invention;

[0034] Figure 7 A schematic diagram of the drive assembly of the charger power module provided in an embodiment of the present invention;

[0035] Figure 8 The circuit diagram of the charger power module provided in the embodiment of the present invention.

[0036] Figure label:

[0037] 100 - Substrate assembly; 1 - Resonant inductor;

[0038] 110 - Heat sink base plate; 2 - High frequency transformer;

[0039] 120 - Magnetic component; 3 - Filter inductor;

[0040] 130 - Power devices; 4 - Three-phase full-bridge rectifier diodes;

[0041] 140 - Second mounting plate; 5 - First insulated gate bipolar transistor (IGBT1);

[0042] 200 - Frame assembly; 6 - Second insulated gate bipolar transistor (IGBT2);

[0043] 210 - Terminal; 7 - First rectifier diode;

[0044] 220 - External connector; 8 - Second rectifier diode;

[0045] 230 - First current sensor assembly; 9 - First absorption resistor;

[0046] 240 - Second current sensor assembly; 10 - Second absorption resistor;

[0047] 250 - Fan; 11 - First thermistor;

[0048] 260 - Slide rail; 12 - Second thermistor;

[0049] 270 - Folded edge; 13 - Third thermistor;

[0050] 271 - Handle; 14 - Composite busbar;

[0051] 300 - Support capacitor assembly; 15 - Resonant capacitor substrate;

[0052] 310 - First mounting plate; 16 - Absorption capacitor substrate;

[0053] 320 - Support capacitor;

[0054] 330-Filter capacitor;

[0055] 340 - Power switch;

[0056] 350-Quick Insert Guide Slot;

[0057] 360-Driver Component Base;

[0058] 370 - Crossbeam;

[0059] 400-DC blocking capacitor assembly;

[0060] 410 - Partition;

[0061] 420-DC blocking capacitor;

[0062] 430 - First voltage sensor;

[0063] 440 - Second voltage sensor;

[0064] 450 - First discharge resistor;

[0065] 460 - Second discharge resistor;

[0066] 500-Frame Structure;

[0067] 600 - Reception cavity;

[0068] 700-Driver Components;

[0069] 800 - Cover plate. Detailed Implementation

[0070] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0071] With the acceleration of urbanization both domestically and internationally, modern transportation modes such as subways and light rail are gradually becoming the main arteries of urban transportation systems due to their advantages of high energy efficiency, low pollution, and large transport capacity. Research on key technologies and the development of major equipment for urban rail transit have emerged in response.

[0072] As a crucial component of urban rail transit vehicles, chargers provide DC power and charge the batteries. With the continuous acceleration of urban rail transit, the industry's requirements for reducing the size and weight of onboard equipment are increasing, making the miniaturization and lightweighting of chargers increasingly urgent. However, current technology is far from meeting the development demands for smaller and lighter chargers.

[0073] This invention provides a charger power module that includes all the electrical components required for a ZVS phase-shifted full-bridge circuit topology. It adopts a modular design approach, dividing the charger power module into five independent parts: a substrate assembly, a frame assembly, a support capacitor assembly, a DC blocking capacitor assembly, and a drive assembly. These five parts are then assembled together, resulting in strong operability, a compact structure, a reasonable layout, and high integration. This design effectively achieves miniaturization, weight reduction, and simplification, meeting the development needs of chargers towards smaller and lighter designs.

[0074] The charger power module according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0075] Figure 1 This is a schematic diagram of the charger power module provided in an embodiment of the present invention. Figure 2 This is an exploded view of the charger power module provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the substrate assembly of the charger power module provided in an embodiment of the present invention.

[0076] refer to Figure 1 and Figure 2 As shown, the charger power module provided in this embodiment of the invention includes: a substrate assembly 100, a frame assembly 200, a supporting capacitor assembly 300, and a DC blocking capacitor assembly 400.

[0077] The supporting capacitor assembly 300 is located at the bottom 200 of the frame assembly. The frame assembly 200 and the supporting capacitor assembly 300 together form a frame structure 500. The frame structure 500 is fixed to one side of the substrate assembly 100, and the frame structure 500 and the substrate assembly 100 together form a receiving cavity 600. The DC blocking capacitor assembly 400 is located at the top of the receiving cavity 600 and is electrically connected to both the frame assembly 200 and the substrate assembly 100. The components can be assembled sequentially or simultaneously. Finally, the components are spliced ​​together to complete the assembly of the charger power module. The structure is compact, highly operable, and easy to perform on an assembly line.

[0078] Continue to refer to Figure 3 As shown, the substrate assembly 100 includes: a heat sink substrate 110, a magnetic element 120, and a power device 130 electrically connected to the magnetic element 120. The frame structure 500 is connected to the heat sink substrate 110 to form a receiving cavity 600.

[0079] Since both the magnetic element 120 and the power device 130 have strong electromagnetic interference, they are integrated on the side of the heat sink substrate 110 facing the receiving cavity 600. By simply taking shielding measures on the entire power module of the charger provided by the present invention, the charger can achieve a good electromagnetic compatibility effect. Compared with taking shielding measures on the magnetic element and the power device separately, the number of parts, weight and installation space can be reduced, making the overall structure more compact and achieving the effect of miniaturization and weight reduction of the charger.

[0080] Furthermore, by placing the magnetic element 120 at one end of the heat sink substrate 110 and the power device 130 at the other end of the heat sink substrate 110, mutual interference between the magnetic element 120 and the power device 130 can be prevented.

[0081] Therefore, from the layout of the charger power module provided by the present invention, it contains all the components required for the ZVS phase-shifted full-bridge circuit topology, and has a compact structure, reasonable layout, and high integration. As long as the external interface is set, the charger power module can have good product adaptability, which helps to simplify the design of the charger power module.

[0082] The heat sink substrate 110 has a resonant inductor 1, a high-frequency transformer 2, and a filter inductor 3 mounted on one end. The heat sink substrate 110 has a three-phase full-bridge rectifier diode 4, a first insulated gate bipolar transistor (IGBT1) 5, a second insulated gate bipolar transistor (IGBT2) 6, a first rectifier diode 7, a second rectifier diode 8, a first absorption resistor 9, a second absorption resistor 10, a first thermistor 11, a second thermistor 12, and a third thermistor 13 mounted on the other end. All the contact surfaces between the components and the heat sink substrate 110 are coated with thermal grease to facilitate the transfer of heat generated by the components to the heat sink substrate 110 and then conduction of heat from the heat sink substrate 110.

[0083] Optionally, the three-phase full-bridge rectifier diode 4 is an uncontrolled rectifier diode with a specification of 1200V / 162A, which can directly rectify three-phase AC380V into DC513V to provide chopping voltage for the first insulated-gate bipolar transistor (IGBT1) 5 and the second insulated-gate bipolar transistor (IGBT2) 6.

[0084] Optionally, the first insulated gate bipolar transistor (IGBT1)5 and the second insulated gate bipolar transistor (IGBT2)6 are high-frequency chopper devices, which can be packaged in a 1200V / 400A dual-transistor package. Under hard switching conditions, the maximum horizontal frequency can reach 30kHz. It should be noted that the first insulated gate bipolar transistor (IGBT1)5 and the second insulated gate bipolar transistor (IGBT2)6 can also be replaced by SiC-IGBTs in the same package.

[0085] Optionally, the first rectifier diode 7 and the second rectifier diode 8 are high-frequency rectifier devices, which can be 1200V / 310A fast recovery diodes with excellent reverse recovery characteristics.

[0086] In one possible implementation, since the first rectifier diode 7, the second rectifier diode 8, the resonant inductor 1, and the filter inductor 3 have a large height difference, considering insulation and ventilation, the embodiment of the present invention can use FBC (epoxy resin coated) copper busbars to achieve electrical connections between components.

[0087] Optionally, the secondary side of the high-frequency transformer 2 has a center tap. Besides the tap terminal, the other two terminals on the secondary side are connected to the first rectifier diode 7 and the second rectifier diode 8 using an FBC copper busbar. One terminal of the filter inductor 3 is connected to the first rectifier diode 7 and the second rectifier diode 8 using an FBC copper busbar. The output terminal is connected to the input terminal of the three-phase full-bridge rectifier diode 4 using an FBC copper busbar. The FBC copper busbar has an insulation withstand voltage of up to AC7200V and an insulation class of E. It can be replaced by a wrapped copper busbar with equivalent characteristics. The remaining current-carrying circuit components are connected using bare copper busbars or cables to reduce the cost of the charger power module.

[0088] After the components on the heat sink substrate 110 are installed, the collector (C1) and emitter (E2) terminals of the first insulated-gate bipolar transistor (IGBT1) 5 and the second insulated-gate bipolar transistor (IGBT2) 6, as well as the output terminals of the three-phase full-bridge rectifier diode 4, are connected to the supporting capacitor assembly 300 using a composite busbar 14. This reduces stray inductance in the chopper circuit and prevents high voltage spikes from occurring during the operation of the first insulated-gate bipolar transistor (IGBT1) 5 and the second insulated-gate bipolar transistor (IGBT2) 6. Furthermore, the AC output terminals of the first insulated-gate bipolar transistor (IGBT1) 5 and the second insulated-gate bipolar transistor (IGBT2) 6 are also led out from the composite busbar 14 and connected to the resonant inductor 1 and the rounded edge terminals of the high-frequency transformer 2, respectively.

[0089] It should be added that a resonant capacitor substrate 15 and an absorption capacitor substrate 16 are also mounted on the heat sink substrate 110. Multiple sets of capacitors connected in parallel on the resonant capacitor substrate 15 are connected in parallel with the first insulated gate bipolar transistor (IGBT1) 5 and the second insulated gate bipolar transistor (IGBT2) 6 through the terminals extending from the composite busbar 14. In this way, the connection is short and effective, which helps to reduce the stray inductance of the resonant cavity. The absorption capacitor substrate is directly mounted on the first absorption resistor 9 and the second absorption resistor 10 by bolts.

[0090] Optionally, the first absorption resistor 9, the second absorption resistor 10, and the absorption capacitor substrate 16 form an RC absorption circuit. The first absorption resistor 9 and the second absorption resistor 10 are low-inductance thick-film resistors, which are cooled by the heat sink substrate 110. The absorption capacitor substrate 16 is in the form of a printed circuit board and is directly mounted on the first absorption resistor 9 and the second absorption resistor 10. The two thin-film capacitors on the absorption capacitor substrate 16 are connected in series with the first absorption resistor 9 and the second absorption resistor 10, respectively, to form an RC absorption circuit. The rectifier is connected in parallel across the first rectifier diode 7 and the second rectifier diode 8 to reduce the voltage spike when the diodes are turned off.

[0091] The resonant capacitor substrate 15 and the resonant inductor 1 form a resonant cavity, which enables the first insulated gate bipolar transistor (IGBT1) 5 and the second insulated gate bipolar transistor (IGBT2) 6 to achieve zero-voltage switching (ZVS), greatly reducing the switching losses of the first insulated gate bipolar transistor (IGBT1) 5 and the second insulated gate bipolar transistor (IGBT2) 6.

[0092] The resonant capacitor substrate 15 is in the form of a printed circuit board, on which there are 12 low-inductance thin film capacitors. Every 3 capacitors are connected in parallel as a group, which is equivalent to 4 capacitors output to the outside. This form can improve the power of the equivalent capacitor, reduce the heat generation of a single capacitor, and extend its life.

[0093] The first thermistor 11, the second thermistor 12, and the third thermistor 13 disposed on the heat sink substrate 110 are used to measure the temperature of the first insulated gate bipolar transistor (IGBT1) 5, the second insulated gate bipolar transistor (IGBT2) 6, the first rectifier diode 7, and the second rectifier diode 8, and to monitor the temperature in real time to ensure the safe operation of the power devices.

[0094] In some embodiments of the present invention, the substrate assembly 100 further includes a second mounting plate 140, the magnetic element 120 is fixed to one side of the second mounting plate 140, the side of the second mounting plate 140 away from the magnetic element 120 is fixed to the heat sink substrate 110, and a high-temperature heat insulation layer is provided on the circumferential surface of the magnetic element 120.

[0095] The magnetic component 120 includes a resonant inductor 1, a high-frequency transformer 2, and a filter inductor 3. The three magnetic components 120 can be formed by aluminum casting. The second mounting plate 140 is less than 0.05 mm thick and is mounted on the heat sink substrate 110. The magnetic component 120 is fixed on the second mounting plate 140. Except for the mounting surface and top surface, the magnetic component 120 is provided with a high-temperature heat insulation layer on its circumferential surface. This allows the heat generated by the magnetic component 120 to be directed to the heat sink substrate 110, thus preventing the magnetic component 120 from causing excessive temperature rise inside the charger power module.

[0096] In some embodiments of the present invention, a heat pipe for heat dissipation can be disposed on the surface of the heat sink substrate 110. The heat sink substrate 110 can be made of aluminum profile, and the heat pipe is embedded on its surface. The heat pipe has high heat dissipation performance and can meet an airflow of 17m³ / h under forced air cooling conditions. 3 The requirements are: / min, total heat dissipation power 2.6KW, and maximum temperature rise of the substrate surface less than 42K.

[0097] Figure 4 This is a schematic diagram of the frame assembly of the charger power module provided in an embodiment of the present invention, with reference to... Figure 4 As shown, in some possible implementations, the top of the frame assembly 200 is provided with a terminal 210, which is electrically connected to the DC blocking capacitor assembly 400 and is also used for connection to an external main circuit. The side of the frame assembly 200 is provided with an external connector 220, which is connected to the substrate assembly 100 and is also used for connection to an external control circuit. The terminal 210 may be an insulator.

[0098] It is easy to understand that the terminals 210 and the external connectors 220 are located far apart, which allows the external main circuit wiring and the external control circuit wiring to be routed separately, avoiding interference between high voltage and low voltage.

[0099] The frame assembly 200 is also provided with a first current sensor assembly 230 and a second current sensor assembly 240 on its top. The first current sensor assembly 230 and the second current sensor assembly 240 sample the output current of the three-phase full-bridge rectifier diode 4 and the filter inductor 3, respectively.

[0100] Optionally, a fan 250 can also be provided on the side of the frame assembly 200. The cavity 600 exchanges air with the outside through the fan 250. Whether the fan 250 is installed depends on the housing structure where the power module is located. In the charger power module provided by the present invention, a through-ventilation channel can be formed between the composite busbar 14, the supporting capacitor assembly 300 and the substrate assembly 100. Installing the fan 250 can realize air convection between the cavity 600 and the outside, and avoid the situation of excessive temperature rise inside the charger power module.

[0101] In some embodiments of the present invention, since the power module is relatively heavy, a slide rail 260 is provided at the bottom of the frame assembly 200. The charger power module can be installed into the charger chassis through the slide rail 260, saving manpower.

[0102] Alternatively, a folded edge 270 can be formed at the end of the frame assembly 200 away from the heat sink substrate 110. A handle 271 can be provided on the folded edge 270. When installing the charger power module provided by the present invention, the charger power module can be raised to be flush with the slide rail on the charger housing by using a trolley. By holding the handle 271, the slide rail 260 can be aligned with the slide rail on the charger housing, and the charger power module can be pushed into the charger housing, saving manpower and improving installation efficiency.

[0103] Figure 5 This is a schematic diagram of the supporting capacitor assembly of the charger power module provided in an embodiment of the present invention, with reference to... Figure 5 As shown, the supporting capacitor assembly 300 of the charger power module provided by the present invention includes: a first mounting plate 310 and a supporting capacitor 320 and a filtering capacitor 330 fixed on the first mounting plate 310. The supporting capacitor 320 and the filtering capacitor 330 are located in the receiving cavity 600.

[0104] The supporting capacitor assembly 300 also includes a power switch 340, a quick-connect guide groove 350, and a drive assembly base 360 ​​fixed on the other side of the first mounting plate 310, wherein the drive assembly base 360 ​​is electrically connected to the substrate assembly 100.

[0105] It should be added that, since the supporting capacitor 320 is relatively heavy and the rail transit industry has high requirements for vibration resistance, a crossbeam 370 can be added to the supporting capacitor assembly 300 to reinforce the supporting capacitor assembly 300.

[0106] Figure 6 This is a schematic diagram of the DC blocking capacitor assembly of the charger power module provided in an embodiment of the present invention. (Refer to...) Figure 6 As shown, the DC blocking capacitor assembly 400 of the charger power module provided in this embodiment of the invention includes a partition 410, a DC blocking capacitor 420, a first voltage sensor 430, a second voltage sensor 440, a first discharge resistor 450, and a second discharge resistor 460. In order to facilitate the connection between the first voltage sensor 430, the second voltage sensor 440, the first discharge resistor 450, and the second discharge resistor 460, an internal adapter connector and a terminal block can be added to the partition 410 to facilitate signal connection between the components.

[0107] Figure 7 This is a schematic diagram of the drive assembly of the charger power module provided in an embodiment of the present invention, with reference to... Figure 7As shown, the charger power module provided in this embodiment of the invention may further include a drive component 700. The drive component 700 is matched and connected to the drive component base 360 ​​through a quick-connect guide groove 350. The connector socket on the drive component 700 is connected to the drive component base 360 ​​on the supporting capacitor component 300 through the quick-connect guide groove 350. Without disassembling the module, the drive component 700 can be quickly maintained and replaced.

[0108] Furthermore, the charger power module provided in this embodiment of the invention may also include a cover plate 800, which is connected to the frame structure 500. The cover plate 800 is used to cover the opening of the receiving cavity 600. In order not to block the external connector 220, the cover plate 800 is located on the side of the external connector 220 close to the heat sink substrate 110.

[0109] The cover plate 800 can be configured with a mesh structure to aid in heat dissipation and to shield and protect the devices in the housing cavity 600, making it both aesthetically pleasing and practical.

[0110] Figure 8 The circuit schematic diagram of the charger power module provided in the embodiment of the present invention is shown below. Figure 8 As shown, the charger power module provided in this embodiment of the invention adopts a ZVS phase-shifted full-bridge circuit topology. The input three-phase AC380V is converted into DC513V by the support of the three-phase full-bridge rectifier diodes (QD)4 and the supporting capacitor (FC)320. Then, it is choppered by the H-bridge composed of the first insulated gate bipolar transistor (IGBT1)5 and the second insulated gate bipolar transistor (IGBT2)6 and isolated and stepped down by the high-frequency transformer (TR)2 to output a 110V square wave. Then, it is rectified by the first rectifier diode (ZD1)7 and the second rectifier diode (ZD2)8 and filtered by the filter inductor (Lf)3 and the filter capacitor (Cf)330 to convert the square wave into DC110V output. The resonant inductor (Lr)1 and the resonant capacitor substrate (Cr)15 form a resonant circuit. Zero-voltage switching (ZVS) is achieved through the first insulated-gate bipolar transistor (IGBT1)5 and the second insulated-gate bipolar transistor (IGBT2)6. The first absorption resistor (Rx1)9, the second absorption resistor (Rx2)10 and the absorption capacitor substrate (Cx)16 form an absorption circuit, which can prevent the first rectifier diode (ZD1)7 and the second rectifier diode (ZD2)8 from having voltage during operation.

[0111] The charger power module provided in this embodiment of the invention utilizes a stacked modular design for the substrate assembly, frame assembly, supporting capacitor assembly, and DC blocking capacitor assembly. Assembly is simple, requiring only the splicing of all components. This results in a compact structure, rational layout, and high integration, enabling miniaturization, weight reduction, and simplification of the charger power module, meeting the development demands for smaller and lighter chargers. Furthermore, integrating magnetic components and power devices onto the substrate assembly avoids the dispersion of electromagnetic interference sources; only electromagnetic shielding of the charger power module needs to be considered within the charger chassis.

[0112] In the description of this invention, it should be understood that the terms "center," "length," "width," "thickness," "top," "bottom," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," "outer," "axial," and "circumferential," etc., used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the indicated position or component must have a specific orientation, or a specific structure and operation, and therefore should not be construed as a limitation of this invention.

[0113] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0114] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0115] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0116] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A charger power module, installed in a charger chassis, characterized in that, include: Substrate assembly, frame assembly, supporting capacitor assembly, and DC blocking capacitor assembly; The supporting capacitor assembly is located at the bottom of the frame assembly. The frame assembly and the supporting capacitor assembly form a frame structure. The frame structure is fixed to one side of the substrate assembly, and the frame structure and the substrate assembly form a receiving cavity. The DC blocking capacitor assembly is located at the top of the receiving cavity, and the DC blocking capacitor assembly is electrically connected to the frame assembly and the substrate assembly respectively. The substrate assembly includes a heat sink substrate, a magnetic element, and a power device electrically connected to the magnetic element. The frame structure is connected to the heat sink substrate to form the receiving cavity. The magnetic element and the power device are respectively integrated on one side of the heat sink substrate facing the receiving cavity, with the magnetic element located at one end of the heat sink substrate and the power device located at the other end of the heat sink substrate.

2. The charger power module according to claim 1, characterized in that, The top of the frame assembly is provided with a terminal, which is electrically connected to the DC blocking capacitor assembly and is also used to connect to an external main circuit; The frame assembly has an external connector on its side, which is connected to the base plate assembly and is also used to connect to an external control loop.

3. The charger power module according to claim 2, characterized in that, The supporting capacitor assembly includes: a first mounting plate and a supporting capacitor and a filtering capacitor fixed on the first mounting plate, wherein the supporting capacitor and the filtering capacitor are located within the receiving cavity; The supporting capacitor assembly also includes a power switch, a quick-connect guide groove, and a drive assembly base fixed to the other side of the first mounting plate; The drive component base is electrically connected to the substrate component.

4. The charger power module according to claim 3, characterized in that, It also includes driver components; The drive component is connected to the drive component base via the quick-connect guide groove.

5. The charger power module according to any one of claims 1-4, characterized in that, The bottom of the frame component is provided with a slide rail; The charger power module is mounted to the charger chassis via the slide rail.

6. The charger power module according to any one of claims 1-4, characterized in that, The end of the frame assembly away from the heat sink substrate is bent to form a folded edge, and a handle is provided on the folded edge.

7. The charger power module according to any one of claims 1-4, characterized in that, A fan is also provided on the side of the frame assembly, and the receiving cavity exchanges air with the outside through the fan.

8. The charger power module according to any one of claims 1-4, characterized in that, The substrate assembly also includes a second mounting plate; The magnetic element is fixed to one side of the second mounting plate, and the side of the second mounting plate away from the magnetic element is fixed to the heat sink substrate. A heat insulation layer is provided on the circumferential surface of the magnetic element.

9. The charger power module according to any one of claims 2-4, characterized in that, Also includes: Cover plate; The cover plate is connected to the frame structure and is used to cover the opening of the receiving cavity. The cover plate is located on the side of the external connector near the heat sink substrate.

10. The charger power module according to any one of claims 1-4, characterized in that, The surface of the radiator substrate is provided with a heat pipe for heat distribution.

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