Resonant body and power splitter combiner

By designing a power splitting combiner with resonant body, the problem that traditional millimeter-wave power amplifiers are difficult to meet the needs of 5G communications is solved, the power amplification effect is achieved, and the reliability and difficulty of components are improved.

CN113810067BActive Publication Date: 2025-04-04AMPAK TECH
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202110658230.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-06-17
Filing Date
2021-06-11
Publication Date
2025-04-04
Estimated Expiration
2041-06-11

AI Technical Summary

Technical Problem

Traditional millimeter-wave power amplifiers are difficult to meet demand in 5G millimeter-wave base station wireless communication, and high-power chips have increased temperatures, difficulty in dissipating heat, short operating life, and are subject to export control, making it difficult to achieve.

Method used

A power division merging device with a resonant body is designed, and the power of the electromagnetic wave signal is divided and individually amplified and then combined to achieve the effect of power amplification.

Benefits of technology

The power amplification effect is achieved. At the same time, since the predetermined power of the power amplification element is small and the temperature is low, overheating is avoided, and the operating life is extended. The low-power element is not subject to outlet control, making it easier to obtain.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN113810067B_ABST
    Figure CN113810067B_ABST
Patent Text Reader

Abstract

The present invention discloses a resonant body and a power splitting combiner, which comprises a resonant body, a circuit board, an upper cover and a lower cover. The resonant body comprises a solid conductive body, a first partition, a second partition, a signal receiving end and a signal transmitting end. The circuit boards are respectively arranged on the sides, and the opposite ends of the circuit boards respectively close one of the first resonant channels and one of the second resonant channels. The circuit board comprises a power amplifying element. The upper cover is arranged on the first partition, and the first resonant channel is located in a first accommodating space formed by the upper cover, the circuit board and the first surface of the solid conductive body. The lower cover is arranged on the second partition, and the second resonant channel is located in a second accommodating space formed by the lower cover, the circuit board and the second surface of the solid conductive body.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to a resonant body, and in particular to a power splitter and combiner having the resonant body. Background Art

[0002] In the traditional method of amplifying the power of millimeter waves, the power amplifier is directly set on a circuit board as a chip to amplify the signal power. The disadvantage of traditional technology is that the signal amplification gain is limited by the predetermined power of the power amplifier chip itself, which usually cannot meet the requirements of 5G millimeter wave base station wireless communications. In addition, the temperature of high-power power amplifier chips will increase during operation, making it difficult to dissipate heat and shortening its operating life. In addition, high-power power amplifier chips are usually export-controlled product items and are not easy to obtain. Summary of the invention

[0003] An object of the present invention is to provide a power dividing and combining device having a resonance body, which can divide the power of received electromagnetic wave signals, amplify them individually and then combine them to complete the power amplification of the electromagnetic wave signals.

[0004] The present invention provides a power splitter and combiner, comprising a resonant body, a plurality of circuit boards, an upper cover and a lower cover. The resonant body comprises a solid conductive body, a plurality of first dividing elements, a plurality of second dividing elements, a signal-receiving end and a signal-transmitting end. The solid conductive body has a first surface and a second surface opposite to each other and a plurality of side surfaces connecting the first surface and the second surface. These first dividing elements are arranged on the first surface and separate a plurality of first resonant channels on the first surface. These first resonant channels intersect in a first common region on the first surface. These second dividing elements are arranged on the second surface and separate a plurality of second resonant channels on the second surface. These second resonant channels intersect in a second common region on the second surface. The signal-receiving end is arranged on the first surface and is located in the first common region. The signal-transmitting end is arranged on the second surface and is located in the second common region.

[0005] The circuit boards are respectively arranged on the side surfaces, and the opposite ends of each circuit board respectively close one of the first resonance channels and one of the second resonance channels. Each circuit board includes a power amplifier element. The upper cover is arranged on the first partitions, and the first resonance channels are located in a first accommodation space formed by the upper cover, the circuit boards and the first surface of the solid conductive body. The lower cover is arranged on the second partitions, and the second resonance channels are located in a second accommodation space formed by the lower cover, the circuit boards and the second surface of the solid conductive body.

[0006] In one embodiment of the present invention, the arrangement of the first resonance channels is symmetrical to the arrangement of the second resonance channels.

[0007] In an embodiment of the present invention, an appearance and a position of the signal receiving end are symmetrical to an appearance and a position of the signal transmitting end respectively.

[0008] In one embodiment of the present invention, the signal receiving end is a cone, and the signal transmitting end is a cone.

[0009] In one embodiment of the present invention, the power splitter and combiner further comprises a plurality of first fixing members and a plurality of second fixing members. The first fixing members are disposed on the upper cover and fix the circuit boards to the side surfaces respectively, and the second fixing members are disposed on the lower cover and fix the circuit boards to the side surfaces respectively.

[0010] In an embodiment of the present invention, each of the first fixing members is in electrical contact with a first ground pad of one of the circuit boards, and each of the second fixing members is in electrical contact with a second ground pad of one of the circuit boards.

[0011] The present invention also provides a resonant body, comprising a solid conductive body, a plurality of first separators, a plurality of second separators, a signal receiving end and a signal transmitting end. The solid conductive body has a first surface and a second surface opposite to each other and a plurality of side surfaces connecting the first surface and the second surface. The first separators are arranged on the first surface and separate a plurality of first resonant channels on the first surface. The first resonant channels intersect in a first common area on the first surface. The second separators are arranged on the second surface and separate a plurality of second resonant channels on the second surface. The second resonant channels intersect in a second common area on the second surface. The signal receiving end is arranged on the first surface and is located in the first common area. The signal transmitting end is arranged on the second surface and is located in the second common area.

[0012] In one embodiment of the present invention, the arrangement of the first resonance channels is symmetrical to the arrangement of the second resonance channels.

[0013] In an embodiment of the present invention, an appearance and a position of the signal receiving end are symmetrical to an appearance and a position of the signal transmitting end respectively.

[0014] In one embodiment of the present invention, the signal receiving end is a cone, and the signal transmitting end is a cone. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional schematic diagram of a power splitting combiner according to an embodiment of the present invention is shown.

[0016] Figure 2 Show Figure 1 A three-dimensional schematic diagram of a power splitting combiner with certain components removed.

[0017] Figure 3 Show Figure 1 Schematic diagram of the resonant body of the power splitting combiner.

[0018] Figure 4 Show Figure 2 A schematic cross-sectional view of a power splitting combiner with certain components removed along line AA′.

[0019] Figure 5 Show Figure 3 Schematic diagram of the cross section of the resonant body along line BB′. DETAILED DESCRIPTION

[0020] Figure 1 A three-dimensional schematic diagram of a power splitting combiner according to an embodiment of the present invention is shown. Figure 2 Show Figure 1 A 3D schematic diagram of a power splitting combiner with some components removed. Figure 1 and Figure 2 The power splitter and combiner 200 of one embodiment of the present invention comprises a resonant body 210, a plurality of circuit boards 220, an upper cover 230 and a lower cover 240. In addition, in this embodiment, the power splitter and combiner 200 further comprises a plurality of first fixing members 250 and a plurality of second fixing members 260.

[0021] Figure 3 Show Figure 1 A three-dimensional schematic diagram of the resonant body of the power splitting combiner. Please refer to Figure 1 , Figure 2 and Figure 3 The resonant body 210 includes a solid conductive body 211, a plurality of first separators 212 and a signal receiving end 213. The solid conductive body 211 has a first surface 211a and a plurality of side surfaces 211b connected to the first surface 211a. The first separators 212 ( Figure 210 first separators 212 are schematically shown in FIG. 1 and are disposed on the first surface 211a of the solid conductive body 211. The first separators 212 separate a plurality of first resonance channels C1 ( Figure 2 10 first resonance channels C1 are schematically shown in FIG. 1 ). These first resonance channels C1 intersect at a first common region R1 on the first surface 211a. The signal receiving end 213 is disposed on the first surface 211a of the solid conductive body 211 and is located in the first common region R1. In this embodiment, the signal receiving end 213 may be located at or close to a center of the first surface 211a of the solid conductive body 211.

[0022] The circuit boards 220 are respectively disposed on the side surfaces 211b of the solid conductive body 211, and a first end 222 of each circuit board 220 closes one of the first resonance channels C1. The upper cover 230 is disposed on the first partitions 212, and the upper cover 230 can be fixed to the first partitions 212 by a plurality of screws (not shown). The first resonance channels C1 are located in a first accommodation space formed by the upper cover 230, the first ends 222 of the circuit boards 220, and the first surface 211a of the solid conductive body 211.

[0023] Figure 4 Show Figure 2 A schematic cross-sectional view of a power splitting combiner with certain components removed along line AA′. Figure 5 Show Figure 3 Schematic diagram of the cross section of the resonant body along line BB′. Please refer to Figure 3 , Figure 4 and Figure 5 The resonant body 210 further includes a plurality of second separators 214 and a signal transmitting end 215. The solid conductive body 211 further has a second surface 211c, which is opposite to the first surface 211a, and each side surface 211b connects the first surface 211a and the second surface 211c. These second separators 214 are disposed on the second surface 211c of the solid conductive body 211. These second separators 214 separate a plurality of second resonant channels C2 on the second surface 211c. These second resonant channels C2 intersect at a second common region R2 on the second surface 211c. The signal transmitting end 215 is disposed on the second surface 211c of the solid conductive body 211 and is located in the second common region R2. In this embodiment, the signal transmitting end 215 may be located at or close to a center of the second surface 211c of the solid conductive body 211.

[0024] It is worth noting that, in the present embodiment, the arrangement of these first resonance channels C1 can be symmetrical to the arrangement of these second resonance channels C2. In detail, the number of these first resonance channels C1 in the present embodiment is the same as the number of these second resonance channels C2. These first resonance channels C1 are arranged in annular shapes at equal angles (for example, 36 degrees in the present embodiment) around the first common region R1, and these second resonance channels C2 are arranged in annular shapes at equal angles around the second common region R2. In addition, a position of each first resonance channel C1 corresponds to a position of one of these second resonance channels C2 in a one-to-one symmetrical manner, and an appearance of each first resonance channel C1 corresponds to an appearance of one of these second resonance channels C2 in a one-to-one symmetrical manner. However, in another embodiment, the arrangement of these first resonance channels can be asymmetrical to the arrangement of these second resonance channels according to design requirements.

[0025] In the present embodiment, a shape and a position of the signal receiving end 213 may be symmetrical to a shape and a position of the signal transmitting end 215, respectively. The signal receiving end 213 and the signal transmitting end 215 may be a cone, respectively. The bottom diameter D1 of the cone is, for example, 5 to 7 mm, the top diameter D2 is, for example, 0.2 to 2 mm, and the height H1 is, for example, 2 to 5 mm. The ratio of the bottom diameter D1, the top diameter D2, and the height H1 of the cone is, for example, approximately 6:1:3.5. The solid conductive body 211, the first separators 212, the second separators 214, the signal receiving end 213, and a signal transmitting end 215 of the present embodiment may be integrally formed, and the material is metal (including a single metal or alloy). However, in another embodiment, the shape and position of the signal receiving end may be asymmetrical to the shape and position of the signal transmitting end according to design requirements.

[0026] Please refer to Figure 1 , Figure 2 and Figure 4 , each circuit board 220 disposed on the corresponding side surface 211b of the solid conductive body 211 has a second end 224 opposite to the first end 222. The second end 224 of each circuit board 220 closes one of the second resonance channels C2. The lower cover 240 is disposed on the second partitions 214, and the lower cover 240 can be fixed to the second partitions 214 by a plurality of screws (not shown). The second resonance channels C2 are located in a second accommodation space formed by the lower cover 240, the second ends 224 of the circuit boards 220 and the second surface 211c of the solid conductive body 211.

[0027] In this embodiment, a ground layer (not shown) on the back side (facing the corresponding side 211b of the solid conductive body 211) of each circuit board 220 can electrically contact the solid conductive body 211. In addition, a power amplifier element 228 (for example, a power amplifier chip) is disposed on a conductive trace 226 on the front side (opposite to the corresponding back side) of each circuit board 220.

[0028] In the present embodiment, the circuit boards 220 are fixed to the side surfaces 211b of the solid conductive body 211 by means of the first fixing members 250 and the second fixing members 260. The first fixing members 250 can be fixed to the upper cover 230 by means of a plurality of screws (not shown) and respectively fix the circuit boards 220 to the side surfaces 211b of the solid conductive body 211, and the second fixing members 260 can be fixed to the lower cover 240 by means of a plurality of screws (not shown) and respectively fix the circuit boards 220 to the side surfaces 211b of the solid conductive body 211. In addition, each of the first fixing members 250 can be in electrical contact with the first grounding pads 221 on the front surface of the corresponding circuit board 220, and each of the second fixing members 260 can be in electrical contact with the second grounding pads 223 on the front surface of the circuit board 220.

[0029] The operation of the power splitter combiner 200 of this embodiment is described below. When an external signal is transmitted to the signal receiving end 213 of the power splitter combiner 200, the external signal is split into a plurality of sub-signals through the first resonance channels C1, and each sub-signal is then transmitted to the corresponding circuit board 220 (which is configured at the end of the corresponding first resonance channel C1) through the corresponding first resonance channel C1. Then, each sub-signal is amplified by the power amplifier element 228 on the corresponding circuit board 220 and then transmitted to the corresponding second resonance channel C2. Furthermore, these sub-signals are combined at the signal transmitting end 215 through the second resonance channels C2, and then the combined signal is transmitted by the signal transmitting end 215.

[0030] Based on the above, the power splitting and combining device of the embodiment of the present invention has at least one of the following advantages. The power splitting and combining device having a resonant body can split the power of the received electromagnetic wave signal, amplify it individually, and then combine it to complete the power amplification of the electromagnetic wave signal. Therefore, compared with the prior art, the predetermined power of each power amplifying element of the power splitting and combining device of the embodiment of the present invention can be smaller, and the temperature of each power amplifying element during operation will be lower, so that it is not easy to overheat and thus its operating life can be extended. In addition, power amplifying elements with lower power are usually not product items subject to export control and are easier to obtain.

[0031]

Explanation of symbols

[0032] 200 Power Splitting Combiner

[0033] 210 resonance body

[0034] 211 Solid conductive body

[0035] 211a First surface

[0036] 211b Side

[0037] 211c Second surface

[0038] 212 First separator

[0039] 213 Signal receiving end

[0040] 214 Second separator

[0041] 215 Signal transmitter

[0042] 220 Circuit Board

[0043] 221 First ground pad

[0044] 222 First End

[0045] 223 Second ground pad

[0046] 224 Second End

[0047] 226 Conductive traces

[0048] 228 Power amplifier components

[0049] 230 Upper cover

[0050] 240 Lower cover

[0051] 250 First fixing piece

[0052] 260 Second fixing piece

[0053] C1 First resonance channel

[0054] C2 Second resonance channel

[0055] D1 Bottom diameter

[0056] D2 Top diameter

[0057] H1 Height

[0058] R1 First common area

[0059] R2 Second common region.

Claims

1. A power splitting combiner, comprising: A resonance body, comprising: A solid conductive body having a first surface and a second surface opposite to each other and a plurality of side surfaces connecting the first surface and the second surface; A plurality of first partitions are disposed on the first surface and separate a plurality of first resonance channels on the first surface, wherein the plurality of first resonance channels intersect at a first common area on the first surface; A plurality of second partitions are disposed on the second surface and separate a plurality of second resonance channels on the second surface, wherein the plurality of second resonance channels intersect at a second common area on the second surface; a signal receiving end, disposed on the first surface and located in the first common area; and A signal transmitting end, disposed on the second surface and located in the second common area; A plurality of circuit boards are respectively disposed on the plurality of side surfaces, wherein two opposite ends of each of the circuit boards respectively close one of the plurality of first resonance channels and one of the plurality of second resonance channels, and each of the circuit boards comprises a power amplifier element; an upper cover, disposed on the plurality of first partitions, wherein the plurality of first resonance channels are located in a first accommodation space formed by the upper cover, the plurality of circuit boards and the first surface of the solid conductive body; and A lower cover is disposed on the plurality of second partitions, wherein the plurality of second resonance channels are located in a second accommodating space formed by the lower cover, the plurality of circuit boards and the second surface of the solid conductive body. 2 . The power splitting combiner as claimed in claim 1 , wherein an arrangement of the plurality of first resonant channels is symmetrical to an arrangement of the plurality of second resonant channels.

3. The power splitting combiner as claimed in claim 1 or 2, wherein an appearance and a position of the signal receiving end are symmetrical to an appearance and a position of the signal transmitting end respectively. 4 . The power splitting combiner as claimed in claim 1 , wherein the signal receiving end is a cone, and the signal transmitting end is a cone.

5. The power splitting combiner of claim 1, further comprising: A plurality of first fixing members, disposed on the upper cover and respectively fixing the plurality of circuit boards to the plurality of side surfaces; and A plurality of second fixing members are disposed on the lower cover and respectively fix the plurality of circuit boards to the plurality of side surfaces.

6. The power splitting combiner as claimed in claim 5, wherein each of the first fixing members is in electrical contact with a first grounding pad of one of the plurality of circuit boards, and each of the second fixing members is in electrical contact with a second grounding pad of one of the plurality of circuit boards.

7. A resonant body, comprising: A solid conductive body having a first surface and a second surface opposite to each other and a plurality of side surfaces connecting the first surface and the second surface; A plurality of first partitions are disposed on the first surface and separate a plurality of first resonance channels on the first surface, wherein the plurality of first resonance channels intersect at a first common area on the first surface; A plurality of second partitions are disposed on the second surface and separate a plurality of second resonance channels on the second surface, wherein the plurality of second resonance channels intersect at a second common area on the second surface; a signal receiving end, disposed on the first surface and located in the first common area; and A signal transmitting end is disposed on the second surface and located in the second common area. 8 . The resonance body as claimed in claim 7 , wherein an arrangement of the plurality of first resonance channels is symmetrical to an arrangement of the plurality of second resonance channels. 9 . The resonant body as claimed in claim 7 , wherein an appearance and a position of the signal receiving end are symmetrical to an appearance and a position of the signal transmitting end respectively. 10 . The resonant body as claimed in claim 7 , wherein the signal receiving end is a cone, and the signal transmitting end is a cone.

Citation Information

Patent Citations

  • Power amplification device and signal receiving and transmitting system

    CN101588195A

  • Parallel transceiver for nuclear magnetic resonance system

    CN1864080A