Camera system

Abstract

A camera system is provided. The camera system includes two or more sensor arrays and an optical path. The sensor arrays are located on the same sensor chip. Each sensor array and each other sensor array include the same field of view (FOV). The optical path includes a main lens and a meta-lens shared by each sensor array and micro-lenses associated with each sensor array. The meta-lens divides the incident light into different spectra and directs each corresponding spectrum to a corresponding sensor array. The different spectra include at least two of visible light, near-infrared light, short-wave infrared, and long-wave infrared, and at least one sensor array includes single-photon avalanche diodes. An image processor that provides image processing, object recognition, and object tracking and / or image fusion functions may be located on the same sensor chip as the sensor arrays.

Description

Technical Field

[0001] The subject matter disclosed herein relates to multi-camera systems. More specifically, the subject matter disclosed herein relates to a multi-camera system including a single sensor chip. Background Art

[0002] Many imaging and sensing systems use multiple cameras. Generally, the multiple cameras of a multi-camera system have different fields of view (FOVs) and different functions. For example, a multi-camera system can include a two-dimensional (2D) wide-angle FOV, a 2D ultra-wide-angle FOV, a 2D telescopic view, and a 3D time-of-flight (TOF) function. Such multi-camera systems typically include high cost, large size, large data bandwidth, and high operating power consumption. Additionally, a large amount of data is generated by all the cameras in the multi-camera system, which also consumes a large amount of input / output (IO) power to send the data to a central processing chip for further processing. The alignment of the cameras increases the complexity of the camera module manufacturing and assembly processes. Moreover, camera alignment can be vulnerable to vibration and physical distortion and may require camera calibration to fuse images from multiple cameras with different FOVs, which further increases the processing power and complexity. Additionally, real-time calibration may be required under highly vibratory conditions. Summary of the Invention

[0003] Example embodiments provide a camera system that can include two or more sensor arrays and an optical path. The two or more sensor arrays can be on the same die. In the two or more sensor arrays, each sensor array can include an array of pixels that sense light, and in the two or more sensor arrays, each sensor array can include the same FOV as each other sensor array. The optical path can include a main lens, a meta-lens, and two or more microlens arrays. The main lens and the meta-lens can be shared by each sensor array, and each microlens array can be associated with a corresponding sensor array. The meta-lens can split the light incident on the meta-lens into different spectra and direct each corresponding spectrum to a corresponding sensor array. In one embodiment, the different spectra can include at least two of visible light, near-infrared light, short-wave infrared, and long-wave infrared. In another embodiment, at least one sensor array can include single-photon avalanche diodes. In yet another embodiment, the meta-lens can include at least one layer of nanostructures formed on a substrate, wherein the at least one layer of nanostructures can diffract and / or focus at least one spectrum of the light incident on the meta-lens to a corresponding sensor array.

[0004] An exemplary embodiment provides a camera system that may include two or more sensor arrays, an optical path, and an image processor. The two or more sensor arrays may be on the same die. In the two or more sensor arrays, each sensor array may include an array of pixels that sense light, and in the two or more sensor arrays, each sensor array may include the same FOV as each other sensor array. The optical path may include a main lens, a meta-lens, and two or more microlens arrays. The main lens and the meta-lens may be shared by each sensor array, and each microlens array may be associated with a corresponding sensor array. The meta-lens may split the light incident on the meta-lens into different spectra and direct each corresponding spectrum to a corresponding sensor array. The image processor may be on the same die as the sensor arrays. The image processor may provide at least one of image processing, object recognition and object tracking of at least one output from the two or more sensor arrays, and image fusion of outputs from the two or more sensor arrays. In one embodiment, the meta-lens may include at least one layer of nanostructures formed on a substrate, wherein the at least one layer of nanostructures may diffract and / or focus at least one spectrum incident on the meta-lens to a corresponding sensor array. The nanostructures of the at least one layer of nanostructures may include a material having a refractive index greater than 1.9. The substrate may include one of a flat surface and a curved surface.

[0005] An exemplary embodiment provides a camera system that may include two or more sensor arrays and an optical path. The two or more sensor arrays may be on the same die. Each sensor array may include an array of pixels that sense light. Each sensor array may include the same FOV as each other sensor array, and at least one sensor array may include single photon avalanche diodes. The optical path may include a main lens, a meta-lens, and two or more microlens arrays. The main lens and the meta-lens may be shared by each sensor array, and each microlens array may be associated with a corresponding sensor array. The meta-lens may split the light incident on the meta-lens into different spectra and direct each corresponding spectrum to a corresponding sensor array. In one embodiment, the different spectra may include at least two of visible light, near infrared light, short wave infrared, and long wave infrared. In another embodiment, the meta-lens may include at least one layer of nanostructures formed on a substrate, wherein the at least one layer of nanostructures may diffract and / or focus at least one spectrum incident on the meta-lens to a corresponding sensor array. The nanostructures of the at least one layer of nanostructures may include a material having a refractive index greater than 1.9, and the substrate may include one of a flat surface and a curved surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In the following sections, aspects of the subject matter disclosed herein will be described with reference to exemplary embodiments shown in the figures, in which:

[0007] Figure 1 An example of a conventional arrangement of a main lens for a conventional multi-camera system including two 2D cameras and one LiDAR camera is depicted;

[0008] Figure 2A An example optical stack for a multi-camera system according to the subject matter disclosed herein is depicted;

[0009] Figure 2B An example embodiment of a metalens that separates visible light and NIR light by focusing visible light onto an RGB pixel array and NIR light onto a SPAD / APD pixel array according to the subject matter disclosed herein is depicted;

[0010] Figure 3 A metalens according to the subject matter disclosed herein that may include an arrangement of nanostructures that diffract and focus visible light (400 nm - 700 nm) onto an RGB pixel array is depicted;

[0011] Figure 4A An example embodiment configuration of an RGB sensor with a metalens having separate R / G / B sub-arrays and that can diffract and / or focus different spectra onto the sub-arrays according to the subject matter disclosed herein is depicted;

[0012] Figure 4B A plan view of an example embodiment of multiple pixel arrays that can each sense different light bands (i.e., R, G, B, NIR, short-wave infrared (SWIR), long-wave infrared (LWIR), etc.) according to the subject matter disclosed herein is depicted;

[0013] Figure 5 An example embodiment of a multi-camera architecture on a chip (single-chip multi-camera sensor) according to the subject matter disclosed herein is depicted; and

[0014] Figure 6 An electronic device including a multi-camera system that includes a single sensor chip according to the subject matter disclosed herein is depicted. DETAILED DESCRIPTION

[0015] In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the disclosure. However, those skilled in the art will understand that aspects of the disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to obscure the subject matter disclosed herein.

[0016] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment disclosed herein. Thus, the phrases "in one embodiment" or "in an embodiment" or "according to an embodiment" (or other phrases having similar meanings) that appear in various places throughout this specification do not necessarily all refer to the same embodiment. In addition, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In this regard, as used herein, the word "exemplary" means "serving as an example, instance, or illustration." Any embodiment described herein as "exemplary" is not to be construed as necessarily superior to or having an advantage over other embodiments. Additionally, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Further, depending on the context discussed herein, a singular term may include the corresponding plural form, and a plural term may include the corresponding singular form.

[0017] Also, depending on the context discussed herein, a singular term may include the corresponding plural form, and a plural term may include the corresponding singular form. It is also noted that the various figures (including component diagrams) shown and discussed herein are for illustrative purposes only and are not drawn to scale. Similarly, the various waveforms and timing diagrams are shown for illustrative purposes only. For example, the dimensions of some elements may be exaggerated relative to other elements for clarity. Additionally, if deemed appropriate, reference numerals are repeated between multiple figures to indicate corresponding and / or similar elements.

[0018] The terms used herein are for the purpose of describing some example embodiments only and are not intended to limit the claimed subject matter. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "an" and "the" are also intended to include the plural forms. It will also be understood that when the terms "comprises" and / or its variants are used in this specification, it is specified that there are the stated features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. The terms "first", "second", etc. as used herein are used as labels for the nouns that follow them and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.), unless explicitly defined as such. In addition, the same reference numerals may be used between two or more figures to refer to parts (components), assemblies, blocks, circuits, units or modules having the same or similar functions. However, such usage is only for the purpose of simplifying the description and facilitating discussion; it does not mean that the construction or architectural details of such components or units are the same in all embodiments, or that these commonly referred to parts / modules are the only way to implement some of the example embodiments disclosed herein.

[0019] It will be understood that when an element or layer is referred to as being "on", "connected to" or "coupled to" another element or layer, the element or layer can be directly on, directly connected to or directly coupled to the other element or layer, or there may be intervening elements or intervening layers. In contrast, when an element is referred to as being "directly on", "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or intervening layers. The same reference numerals always refer to the same elements. As used herein, the term "and / or" includes any combination and all combinations of one or more of the associated listed items.

[0020] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this subject matter belongs. It will also be understood that terms (such as those defined in a common dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0021] As used herein, the term "module" refers to any combination of software, firmware, and / or hardware that is configured to provide the functionality described herein in connection with the module. For example, software can be embodied as a software package, code, and / or instruction set or instructions, and the term "hardware" as used in any of the embodiments described herein can include, for example, components, hardwired circuitry, programmable circuitry, state machine circuitry, and / or firmware that stores instructions executed by the programmable circuitry, either individually or in any combination. A module can be embodied, jointly or individually, as circuitry that forms part of a larger system, such as, by way of non-limiting example, an integrated circuit (IC), a system-on-chip (SoC), a component, and the like.

[0022] The subject matter disclosed herein provides multiple cameras that can be integrated on the same sensor chip and that can cover different spectra. Each camera on the sensor chip has the same FOV, which avoids the alignment and calibration issues that can be associated with traditional multi-camera systems. There is no need to interleave different pixel arrays into a hybrid array because perfect alignment is provided for different cameras. Image processing and fusion functions can be implemented on the sensor chip, which can save power and can reduce latency.

[0023] In one embodiment, the optical stack of the multi-camera system disclosed herein includes a primary lens (a single lens or a group of lenses), a metasurface lens, and a microlens. Each camera on the sensor chip can include an image sensor having an array of pixels. Different pixel arrays on the same sensor chip can be provided with different readout paths such that each pixel array and its corresponding readout circuitry can form a separate image sensor.

[0024] The different image sensors of the multi-camera system can include (but are not limited to) red, green, blue, and near-infrared (RGB+NIR) image sensors, RGB and single-photon avalanche diode (RGB+SPAD) image sensors, 2D and short-wavelength IR (2D+SWIR) image sensors, and / or hyperspectral image sensors. The light passing through the primary lens can be separated by the metasurface lens and redirected to the corresponding image sensor on the chip. Each image sensor has the same FOV.

[0025] In one embodiment, the metasurface lens can be integrated with the primary lens assembly or module. In another embodiment, the metasurface lens can be formed as a cover of the sensor chip. In yet another embodiment, the metasurface lens can be formed as a separate piece. The metasurface lens can be fabricated on a flat or curved surface that can be formed of glass or another transparent material, such as plastic or any low-refractive-index organic / inorganic material that is optically transparent in the visible NIR (400 nm - 1000 nm). The metasurface lens can include a single-layer nanostructure or a multi-layer nanostructure.

[0026] Figure 1Depicts a conventional arrangement 100 of main lenses for an example of a conventional multi-camera system including two 2D cameras 101 and 102 and a LiDAR camera 103. The LiDAR camera 103 includes a lens 103a for a vertical-cavity surface-emitting laser (VCSEL) array and a lens 103b for a SPAD-based LiDAR sensor. Each camera has a different FOV and a separate main lens. Additionally, each camera needs to be calibrated for image fusion.

[0027] Figure 2A Depicts an example optical stack 200 for a multi-camera system according to the subject matter disclosed herein. The optical stack 200 may include a main lens 201, a metasurface (meta-optical device) 202, and a microlens array 203, and the microlens array 203 may be associated with and formed on each (pixel) array 204. As Figure 2A depicted, two types of microlenses 203a and 203b are respectively associated with pixel arrays 204a and 204b and are respectively formed on pixel arrays 204a and 204b, and the two pixel arrays 204a and 204b are formed on a single sensor chip 205. In one embodiment, the pixel array 204 may be a separate 2D and 3D sensor. In another embodiment, the pixel array 204 may be a hybrid 2D and 3D sensor. The peripheral components 206 supporting the pixel array 204 may also be formed on the single sensor chip 205.

[0028] The main lens 201 may include a single lens or a group of lenses. The metasurface 202 may include one or more layers of nanostructures 207 formed on a substrate 208 (such as glass or another transparent substrate (such as plastic or any low-refractive-index organic / inorganic material optically transparent in the visible NIR (400nm - 1000nm))). The nanostructures 207 may be referred to herein as scatterers and / or nanoantennas. The substrate 208 of the metasurface 202 may be flat or curved and may be formed, for example, as a cover of the sensor chip 205, may be formed as part of the main lens 201, or as Figure 2A depicted, formed as a separate piece.

[0029] Figure 2B Depicts an example embodiment of a metasurface 202 that separates visible light and NIR light by focusing visible light onto the RGB pixel array 204a and focusing NIR onto the SPAD / APD pixel array 204b according to the subject matter disclosed herein.

[0030] Figure 3The metalens 202 is depicted as including an arrangement of nanostructures 207 that can diffract and focus visible light (400 nm - 700 nm) onto the RGB pixel array 204a. The metalens 202 can also focus and / or diffract broadband or narrowband NIR light (700 nm - 900 nm) onto the SPAD / APD pixel array 204b. The metalens 202 can include a single layer 301 of nanostructures 207 formed on the surface of a substrate 208. Optionally, the metalens 202 can include multiple layers 301 and 302 of nanostructures 207 that can be formed on opposite surfaces of the substrate 208. The nanostructures 207 can be formed of TiO 2 , Si 3 N 4 or any other high refractive index (> 1.9 at the desired wavelength) semiconductor or oxide that is transparent in both the visible and NIR spectra (400 nm - 1000 nm), and can be formed in cylindrical shapes 303 and / or cuboid shapes 304 of various sizes.

[0031] Figure 4A An example embodiment configuration of an RGB sensor 400 is depicted, the RGB sensor 400 having separate R / G / B sub-arrays 401a, 401b, and 401c and a metalens 202 that can diffract and / or focus different spectra onto the sub-arrays 401a to 401c. Figure 4B A plan view of an example embodiment of multiple pixel arrays 402a, 402b, 402c, 402d, 402e, 402f, 402g, 402h, and 402i that can each sense different light bands (i.e., R, G, B, NIR, short-wave infrared (SWIR), long-wave infrared (LWIR), etc.) is depicted. The different gray shades of the pixel arrays 402a to 402i can represent the different spectra or light bands that the pixel arrays are configured to sense. One or more of the pixel arrays 402a to 402i can be SPAD sensors for time-of-flight (ToF) measurements. For this example embodiment, the metalens ( Figure 4B not shown) separates each different light band and directs it to the corresponding pixel array.

[0032] Figure 5Depicts an example embodiment of a multi-camera architecture on-chip (single-chip multi-camera sensor) 500 according to the subject matter disclosed herein. The single-chip multi-camera sensor 500 may include multiple pixel arrays on the same die, where each pixel array may be a separate camera, and each camera may have the same FOV. Each camera may have an optical path that includes a main lens (single lens or a group of lenses), a meta-lens (single layer or multi-layer), and a microlens (see Figure 2). The main lens and the meta-lens may be shared by all the cameras. The meta-lens may separate the incident light from the main lens and redirect different spectra onto the corresponding pixel arrays. The image processing and fusion functions may be performed on-chip without going through the IO, enabling reduction of system power and also reduction of processing latency.

[0033] The single-chip multi-camera sensor 500 may include pixel arrays 501a and 501b, row drivers (Row DRVR) 502a and 502b, bias circuits 503a and 503b, readout circuits 504a and 504b, a phase-locked loop (PLL) circuit 505, a digital block 506, and an IO circuit 507.

[0034] The pixel array 501a is driven by the row driver 502a in a known manner. The bias circuit 503a provides a bias voltage and a bias current to the pixel array 501a and the row driver 502a. Similarly, the pixel array 501b is driven by the row driver 502b in a known manner, and the bias circuit 503b provides a bias voltage and a bias current to the pixel array 501b and the row driver 502b. The PLL circuit 505 provides synchronization signals and control signals to various circuits of the multi-camera architecture 500 on-chip. The readout circuits 504a and 504b combine the signals output from the pixel arrays 501a and 501b, respectively, into the digital block 506.

[0035] The digital block 506 provides on-chip image processing, on-chip image fusion, on-chip object recognition, and / or on-chip object tracking functions without calibration, since each camera of the multi-camera architecture 500 on-chip has the same FOV. Additionally, data from multiple cameras (i.e., pixel arrays 501a and 501b) do not have to be transmitted outside the chip, since the multi-camera architecture 500 on-chip includes on-chip fusion and on-chip processing, which saves IO power and reduces latency.

[0036] Although Figure 5Two pixel arrays 501a and 501b are depicted, but it should be understood that in another embodiment, more than two pixel arrays may be included in the multi-camera architecture 500 on a chip, in which case additional row drivers 502a and 502b, bias circuits 503a and 503b, and readout circuits 504a and 504b will also be included. It should also be understood that a single die on which multiple pixel arrays are formed is not shown in Figure 5 FIG.

[0037] Figure 6 An electronic device 600 including a multi-camera system including a single sensor chip in accordance with the subject matter disclosed herein is depicted. The electronic device 600 can be used in, but is not limited to, computing devices, personal digital assistants (PDAs), laptop computers, mobile computers, network tablets, wireless telephones, cellular telephones, smart phones, digital music players, or wired or wireless electronic devices. The electronic device 600 can also be, but is not limited to, a part of an ADAS, a mobile device imaging system, an industrial imaging system, a robot, etc. The electronic device 600 can include a controller 610, an input / output device 620 (such as, but not limited to, a keypad, a keyboard, a display, a touch screen display, a camera, and / or an image sensor), a memory 630, an interface 640, a GPU 650, and an image processing unit 660 coupled to each other via a bus 670. The controller 610 can include, for example, at least one microprocessor, at least one digital signal processor, at least one microcontroller, etc. The memory 630 can be configured to store user data or command codes to be used by the controller 610.

[0038] The electronic device 600 and various system components of the electronic device 600 may include an image processing unit 660. In one embodiment, the image processing unit 660 may be part of a multi-camera system including a single sensor chip according to the subject matter disclosed herein. The interface 640 may be configured to include a wireless interface that is configured to transmit data to or receive data from a wireless communication network using RF signals. The wireless interface 640 may include, for example, an antenna, a wireless transceiver, and the like. The electronic device 600 may also be used in communication system interface protocols such as, but not limited to, Code Division Multiple Access (CDMA), Global System for Mobile Communications (GSM), North American Digital Cellular (NADC), Extended Time Division Multiple Access (E-TDMA), Wideband CDMA (WCDMA), CDMA2000, Wi-Fi, Municipal Wi-Fi (Muni WiFi), Bluetooth, Digital Enhanced Cordless Telecommunications (DECT), Wireless Universal Serial Bus (Wireless USB), Fast Low Latency Access Orthogonal Frequency Division Multiplexing with Seamless Handoff (Flash-OFDM), IEEE 802.20, General Packet Radio Service (GPRS), iBurst, Wireless Broadband (WiBro), WiMAX, Advanced WiMAX, Universal Mobile Telecommunications Service - Time Division Duplex (UMTS-TDD), High Speed Packet Access (HSPA), Evolution-Data Optimized (EVDO), Long Term Evolution-Advanced (LTE-Advanced), Multichannel Multipoint Distribution Service (MMDS), etc.

[0039] The embodiments of the subject matter and the operations described in this specification can be implemented in digital electronic circuitry, or in computer software, firmware, or hardware (including the structures disclosed in this specification and their structural equivalents), or in a combination of one or more of them. The embodiments of the subject matter described in this specification can be implemented as one or more computer programs encoded on a computer storage medium for running on a data processing apparatus or for controlling the operation of a data processing apparatus, i.e., one or more modules of computer program instructions. Optionally or additionally, the program instructions can be encoded on an artificially generated propagated signal (e.g., a machine-generated electrical, optical, or electromagnetic signal) that is generated to encode information for transmission to a suitable receiver apparatus for running by a data processing apparatus. The computer storage medium can be a computer-readable storage device, a computer-readable storage substrate, a random or serial access memory array or device, or a combination of them, or be included in a computer-readable storage device, a computer-readable storage substrate, a random or serial access memory array or device, or a combination of them. Further, although a computer storage medium is not a propagated signal, a computer storage medium can be a source or destination of computer program instructions encoded in an artificially generated propagated signal. The computer storage medium can also be one or more separate physical components or media (e.g., multiple CDs, disks, or other storage devices), or be included in one or more separate physical components or media (e.g., multiple CDs, disks, or other storage devices). Additionally, the operations described in this specification can be implemented as operations performed by a data processing apparatus on data stored in one or more computer-readable storage devices or received from other sources.

[0040] Although this specification may contain many specific implementation details, these implementation details should not be construed as limitations on the scope of any claimed subject matter, but rather as descriptions of features specific to particular embodiments. Certain features described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment can also be implemented separately or in any suitable sub-combination in multiple embodiments. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, in some cases one or more features from a claimed combination can be deleted from the combination, and the claimed combination can be directed to a sub-combination or variation of a sub-combination.

[0041] Similarly, although the operations are depicted in the drawings in a particular order, this should not be construed as requiring that the operations be performed in the particular order shown or in a sequential order, or that all of the illustrated operations be performed, to achieve the desired result. In some cases, multitasking and parallel processing may be advantageous. Additionally, the separation of various system components in the foregoing embodiments should not be construed as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

[0042] Accordingly, specific embodiments of the subject matter have been described herein. Other embodiments are within the scope of the claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve the desired result. Additionally, the processes depicted in the drawings do not necessarily require the particular order shown or sequential order to achieve the desired result. In some implementations, multitasking and parallel processing may be advantageous.

[0043] As will be recognized by those of skill in the art, the innovative concepts described herein can be modified and varied over a wide range of applications. Accordingly, the scope of the claimed subject matter should not be limited to any of the specific exemplary teachings discussed above, but is defined by the claims.

Claims

1. A camera system, the camera system comprises: Two or more sensor arrays located on the same die, each sensor array comprising an array of pixels sensitive to light, and each sensor array having the same field of view as each other sensor array; And An optical path comprising a main lens, a metalens, and two or more microlens arrays, the main lens and the metalens being shared by each sensor array, and each microlens array being associated with a corresponding sensor array, the metalens splitting the light incident on the metalens into different spectra and directing each corresponding spectrum to the corresponding sensor array, wherein the metalens comprises at least one layer of nanostructures formed on a substrate, the at least one layer of nanostructures diffracting and / or focusing at least one spectrum incident on the metalens to the corresponding sensor array, wherein the nanostructures of the at least one layer of nanostructures comprise a material having a refractive index greater than 1.

9.

2. The camera system according to claim 1, wherein, the different spectra include at least two of visible light, near-infrared light, short-wave infrared, and long-wave infrared.

3. The camera system according to claim 1, wherein, the at least one layer of nanostructures is formed on a first surface of the substrate.

4. The camera system according to claim 3, wherein, a second layer of nanostructures is formed on a second surface of the substrate opposite to the first surface of the substrate.

5. The camera system according to claim 1, wherein, the substrate comprises one of a flat surface and a curved surface.

6. The camera system according to claim 1, wherein, the camera system is part of a smart phone.

7. A camera system, the camera system comprises: Two or more sensor arrays located on the same die, each sensor array comprising an array of pixels sensitive to light, and each sensor array having the same field of view as each other sensor array; An optical path comprising a main lens, a metalens, and two or more microlens arrays, the main lens and the metalens being shared by each sensor array, and each microlens array being associated with a corresponding sensor array, the metalens splitting the light incident on the metalens into different spectra and directing each corresponding spectrum to the corresponding sensor array; And An image processor located on the same die as the sensor arrays, the image processor providing at least one of image processing, object recognition and object tracking of at least one output from the two or more sensor arrays and image fusion of the outputs from the two or more sensor arrays, wherein the metalens comprises at least one layer of nanostructures formed on a substrate, the at least one layer of nanostructures diffracting and / or focusing at least one spectrum incident on the metalens to the corresponding sensor array, and wherein the nanostructures of the at least one layer of nanostructures comprise a material having a refractive index greater than 1.

9.

8. The camera system according to claim 7, wherein, the different spectra include at least two of visible light, near-infrared light, short-wave infrared, and long-wave infrared, and wherein at least one sensor array comprises single-photon avalanche diodes.

9. The camera system according to claim 7, wherein, The substrate includes either a flat surface or a curved surface.

10. The camera system according to claim 7 or 9, wherein, at least one layer of nanostructures is formed on a first surface of the substrate.

11. The camera system according to claim 10, wherein, a second layer of nanostructures is formed on a second surface of the substrate opposite to the first surface of the substrate.

12. A camera system, the camera system comprising: two or more sensor arrays located on the same die, each sensor array including an array of pixels for sensing light, each sensor array having the same field of view as each other sensor array, and at least one sensor array including single-photon avalanche diodes; and an optical path including a main lens, a metasurface lens, and two or more microlens arrays, the main lens and the metasurface lens being shared by each sensor array, and each microlens array being associated with a corresponding sensor array, the metasurface lens splitting light incident thereon into different spectra and directing each corresponding spectrum to the corresponding sensor array, wherein the metasurface lens includes at least one layer of nanostructures formed on a substrate, the at least one layer of nanostructures diffracting and / or focusing at least one spectrum incident on the metasurface lens to the corresponding sensor array, wherein the nanostructures of the at least one layer of nanostructures include a material having a refractive index greater than 1.

9.

13. The camera system according to claim 12, wherein, the different spectra include at least two of visible light, near-infrared light, short-wave infrared, and long-wave infrared.

14. The camera system according to claim 12 or 13, wherein, the substrate includes either a flat surface or a curved surface.

15. The camera system according to claim 14, the camera system further comprising: an image processor located on the same die as the sensor arrays, the image processor providing at least one of image processing, object recognition, and object tracking of at least one output from the two or more sensor arrays and image fusion of outputs from the two or more sensor arrays.

Images