Wiring circuit board

Abstract

The wiring circuit board (1) has: a metal support layer (2); a substrate insulating layer (3) disposed on one side of the metal support layer (2) in the thickness direction; and a conductor layer (4) disposed on one side of the substrate insulating layer (3) in the thickness direction, having a first terminal (15) and a grounding wire residue (18) electrically connected to the first terminal (15). The thickness of the grounding wire residue (18) is thinner than the thickness of the first terminal (15).

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] A wiring circuit board is known in the past, which has a metal support substrate, a base insulating layer disposed on the metal support substrate, and a conductor pattern disposed on the base insulating layer. The conductor pattern includes a wiring pattern that electrically connects two terminals and a grounding pattern that electrically connects the terminals and the metal support substrate.

[0003] In such wiring circuit boards, chemical plating is sometimes formed on the surface of conductor patterns. However, the deposition rate of chemical plating in wiring patterns and chemical plating in grounding patterns differs depending on whether these patterns are electrically connected to a metal support substrate, making it difficult to form a uniform chemical plating in conductor patterns.

[0004] Therefore, a method for manufacturing a wiring circuit board is proposed as follows: an extension pattern for electrically connecting the terminals of the wiring pattern and the metal support substrate is formed together with a wiring pattern and a ground pattern; after chemical plating is applied to the surface of the wiring pattern and the surface of the ground pattern, the extension pattern is removed to insulate the wiring pattern and the metal support substrate (see, for example, Patent Document 1).

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2010-171040 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] However, in the manufacturing method of the wiring circuit board described in Patent Document 1, since the extension pattern has the same thickness as the terminals of the wiring pattern, there is a drawback that it takes time to remove the extension pattern. In addition, when the extension pattern is removed by etching or the like, sometimes the terminals are etched due to over-etching, which reduces the connection reliability of the terminals.

[0010] The present invention provides a wiring circuit board capable of forming a uniform chemical plating layer on the conductor layer and improving the connection reliability of the terminal portion, as well as a method for manufacturing the wiring circuit board with high manufacturing efficiency.

[0011] Solution for solving the problem

[0012] The present invention [1] includes a wiring circuit board having: a metal support layer; an insulating layer disposed on one side of the metal support layer in the thickness direction; and a conductor layer disposed on one side of the insulating layer in the thickness direction, having a terminal portion and a ground wire residual portion electrically connected to the terminal portion, the thickness of the ground wire residual portion being thinner than the thickness of the terminal portion.

[0013] However, the residual grounding conductor is formed during the manufacturing of the wiring circuit board by removing a portion of the grounding conductor that electrically connects the terminal portion and the metal support layer. Therefore, before the grounding conductor is removed, the terminal portion and the metal support layer are electrically connected, thus enabling the uniform formation of a chemical plating layer on the conductor layer.

[0014] Furthermore, according to the above structure, the thickness of the remaining portion of the grounding wire is thinner than the thickness of the terminal portion. Therefore, compared to the case where the thickness of the remaining portion of the grounding wire is the same as the thickness of the terminal portion, the grounding wire can be removed more easily. In addition, when removing the grounding wire by etching or the like, it is possible to suppress the erosion of the terminal portion due to over-etching, thereby improving the connection reliability of the terminal portion.

[0015] The present invention [2] includes the wiring circuit board described in [1] above, wherein the terminal portion has a plurality of terminal forming layers stacked in the thickness direction, and the grounding wire residual portion has a wire forming layer continuous with at least one of the plurality of terminal forming layers.

[0016] With this structure, since the terminal portion has multiple terminal forming layers and the grounding wire residual portion has a wire forming layer that is continuous with the terminal forming layers, the thickness of the grounding wire residual portion can be reliably set to be thinner than the thickness of the terminal portion.

[0017] The present invention [3] includes the wiring circuit board described in [1] or [2] above, wherein the residual portion of the grounding wire is located at the end of the wiring circuit board.

[0018] With this structure, since the residual portion of the grounding conductor is located at the end of the wiring circuit board, the grounding conductor can be removed more easily during the manufacturing of the wiring circuit board, thus forming the residual portion of the grounding conductor.

[0019] The present invention [4] includes a wiring circuit board according to any one of [1] to [3] above, wherein a portion of the insulating layer protrudes in the direction in which the grounding wire remnant extends, relative to the grounding wire remnant and the metal support layer, to the side opposite to the terminal portion.

[0020] With this structure, since the portion of the insulation layer protrudes to the side opposite to the terminal portion relative to the remaining portion of the grounding conductor and the metal support layer, the remaining portion of the grounding conductor and the metal support layer can be reliably insulated.

[0021] The present invention [5] includes a wiring circuit board according to any one of [1] to [4] above, wherein the residual portion of the grounding conductor is disposed on one side of the insulation layer in the thickness direction.

[0022] With this structure, since the remaining portion of the grounding conductor is disposed on the insulating layer, the remaining portion of the grounding conductor and the metal support layer can be insulated more reliably.

[0023] The present invention [6] includes a method for manufacturing a wiring circuit board, wherein the method comprises: a step of preparing a metal support layer; a step of forming an insulating layer on one side of the metal support layer in the thickness direction; a step of forming a conductor layer having a terminal portion disposed on one side of the insulating layer in the thickness direction and a grounding wire electrically connecting the terminal portion and the metal support layer; a step of chemically plating the conductor layer; and a step of removing a portion of the grounding wire to form a residual portion of the grounding wire to insulate the terminal portion and the metal support layer, wherein the thickness of the residual portion of the grounding wire is thinner than the thickness of the terminal portion.

[0024] According to this method, after forming a conductor layer having a terminal portion and a grounding wire electrically connecting the terminal portion and the metal support layer, the conductor layer is chemically plated. Then, a portion of the grounding wire is removed to form a residual portion of the grounding wire, so as to insulate the terminal portion and the metal support layer.

[0025] That is, during the electroless plating of the conductor layer, the grounding wire electrically connects the terminal portion and the metal support layer, thus enabling the formation of a uniform electroless plating layer on the conductor layer. Furthermore, since the thickness of the remaining portion of the grounding wire is thinner than the thickness of the terminal portion, the grounding wire can be easily removed, thereby improving the connection reliability of the terminal.

[0026] The present invention [7] includes a method for manufacturing a wiring circuit board as described in [6] above, wherein the step of forming the conductor layer includes: a step of simultaneously forming a conductor forming layer and a terminal forming layer, wherein the conductor forming layer constitutes the ground conductor and the terminal forming layer constitutes the terminal portion and is continuous with the conductor forming layer; and a step of forming a terminal forming layer constituting the terminal portion without forming the conductor forming layer constituting the ground conductor.

[0027] According to this method, since the process of forming the conductor layer includes a process of simultaneously forming a conductor forming layer and a terminal forming layer, as well as a process of forming a terminal forming layer without forming a conductor forming layer, the terminal portion is composed of multiple terminal forming layers, and the grounding conductor is composed of fewer conductor forming layers than multiple terminal forming layers. Therefore, it is possible to reliably set the thickness of the grounding conductor to be thinner than the thickness of the terminal portion, and further, it is possible to reliably set the thickness of the remaining portion of the grounding conductor to be thinner than the thickness of the terminal portion.

[0028] The present invention [8] includes a method for manufacturing a wiring circuit board as described in [6] or [7] above, wherein, in the process of removing a portion of the grounding wire, a portion of the metal support layer and a portion of the grounding wire are simultaneously etched.

[0029] According to this method, since both the metal support layer and the grounding conductor are etched simultaneously, the grounding conductor can be easily removed, and the remaining portion of the grounding conductor can be disposed at the end of the wiring circuit board. Furthermore, because both the metal support layer and the grounding conductor are etched simultaneously, the number of manufacturing steps can be reduced compared to etching the metal support layer and the grounding conductor separately.

[0030] The present invention [9] includes a method for manufacturing a wiring circuit board according to any one of [6] to [8] above, wherein the method for manufacturing the wiring circuit board further includes: a step of forming a seed film on one side of the insulating layer in the thickness direction and on one side of the metal support layer exposed from the insulating layer in the thickness direction after the step of forming the insulating layer and before the step of forming the conductor layer; a step of removing the seed film exposed from the conductor layer after the step of forming the conductor layer and before the step of performing the chemical plating; and a step of removing the seed film exposed by the removal of the grounding wire after the step of removing a portion of the grounding wire.

[0031] According to this method, after forming a seed film on the insulating layer and on the metal support layer exposed from the insulating layer, a conductor layer is formed on the seed film. Then, after chemical plating the conductor layer, a portion of the grounding conductor is removed to form a residual portion of the grounding conductor. Finally, the seed film exposed by the removal of the grounding conductor is removed.

[0032] However, if any seed film remains exposed by the removal of the grounding wire, the remaining portion of the grounding wire and the metal support layer may be electrically connected by the seed film. On the other hand, by removing the seed film exposed by the removal of the grounding wire according to the method described above, it is possible to further reliably insulate the remaining portion of the grounding wire and the metal support layer.

[0033] The effects of the invention

[0034] According to the wiring circuit board of the present invention, a uniform chemical plating layer can be formed on the conductor layer, and the connection reliability of the terminal portion can be improved.

[0035] Furthermore, the wiring circuit board manufacturing method according to the present invention can efficiently manufacture the above-mentioned wiring circuit board. Attached Figure Description

[0036] [ Figure 1 ] Figure 1 This is a top view showing a first embodiment of the wiring circuit board of the present invention.

[0037] [ Figure 2 ] Figure 2 express Figure 1 The diagram shows a cross-sectional view of the wiring circuit board along line A-A.

[0038] [ Figure 3 ] Figure 3 A~ Figure 3 E is Figure 2 The diagram shows the manufacturing process of the wiring circuit board. Figure 3 A represents the process of preparing the metal support layer. Figure 3 B indicates the process of forming the base insulating layer. Figure 3 C represents the process of forming the seed film. Figure 3 D represents the process of forming the first conductor layer. Figure 3 E represents the process of forming the second conductor layer.

[0039] [ Figure 4 ] Figure 4 F~ Figure 4 I am next Figure 3 Manufacturing process diagram of the wiring circuit board of E. Figure 4 F indicates the process of removing the seed film exposed from the conductor layer. Figure 4 G indicates the process of forming the first coating layer. Figure 4 H indicates the process of forming the covering insulation layer. Figure 4 I indicates the process of removing the first plating layer exposed from the covering insulation layer.

[0040] [ Figure 5 ] Figure 5 J~ Figure 5 L is next Figure 4 Manufacturing process diagram of the wiring circuit board of I. Figure 5 J indicates the process of forming the residual part of the grounding conductor. Figure 5 K represents the process of removing the seed film exposed by the formation of residual portions through the grounding wire. Figure 5 L indicates the process of forming the second coating layer.

[0041] [ Figure 6 ] Figure 6 It has Figure 3 E shows a top view of the conductor layer of the grounding wire.

[0042] [ Figure 7 ] Figure 7 A side sectional view showing a second embodiment of the wiring circuit board of the present invention.

[0043] [ Figure 8 ] Figure 8 This is a top view showing a third embodiment of the wiring circuit board of the present invention.

[0044] [ Figure 9 ] Figure 9 express Figure 8 The diagram shows a B-B cross-sectional view of the wiring circuit board.

[0045] [ Figure 10 ] Figure 10 It has the same Figure 8 A top view of the conductor layer of the grounding conductor corresponding to the remaining portion of the grounding conductor shown. Detailed Implementation

[0046] <First Embodiment>

[0047] 1. Wiring circuit board

[0048] Reference Figure 1 and Figure 2 The wiring circuit board 1, which is the first embodiment of the wiring circuit board of the present invention, will be described.

[0049] like Figure 1 and Figure 2 As shown, the wiring circuit board 1 is in the shape of a sheet with thickness. The wiring circuit board 1 has a rectangular shape, for example, when viewed from above. Examples of wiring circuit boards 1 include flexible printed wiring boards with a metal support layer 2 as a reinforcing layer and suspended boards with circuits having a metal support layer 2 as a suspension (spring) layer.

[0050] Specifically, such as Figure 2 As shown, the wiring circuit board 1 has a metal support layer 2, a base insulating layer 3 as an example of an insulating layer, a seed film 6, a conductor layer 4, a first plating layer 7, a cover insulating layer 5, and a second plating layer 8.

[0051] The metal support layer 2 has a flat plate shape. The thickness of the metal support layer 2 is not particularly limited.

[0052] The material of the metal support layer 2 can be appropriately selected and used from known or conventional metallic materials (specifically, metallic materials). Specifically, examples of metallic materials include metals classified as Groups 1 to 16 in the periodic table, alloys containing two or more of these metals, etc. Furthermore, the metal element can also be any of transition metals or typical metals.

[0053] More specifically, as metallic elements, examples include Group 2 main metals such as calcium, Group 4 subgroup metals such as titanium and zirconium, Group 5 subgroup metals such as vanadium, Group 6 subgroup metals such as chromium, molybdenum, and tungsten, Group 7 subgroup metals such as manganese, Group 8 subgroup (column 8) metals such as iron, Group 8 subgroup (column 9) metals such as cobalt, Group 8 subgroup (column 10) metals such as nickel and platinum, Group 1 subgroup metals such as copper, silver, and gold, Group 2 subgroup metals such as zinc, Group 3 main metals such as aluminum and gallium, and Group 4 main metals such as germanium and tin.

[0054] Such metallic materials can be used alone or in combination with two or more. Among metallic materials, alloys containing two or more metallic elements are preferred, alloys that can be etched simultaneously with conductor layer 4 are more preferred, and stainless steel and copper-containing alloys are particularly preferred.

[0055] The substrate insulating layer 3 is disposed on one side of the metal support layer 2 in the thickness direction, specifically, on one side of the metal support layer 2 in the thickness direction. The substrate insulating layer 3 has the same external shape as the wiring circuit board 1. The substrate insulating layer 3 has a thickness and has a flat side in the thickness direction and another side.

[0056] like Figure 1 As shown, the substrate insulating layer 3 has a first terminal configuration portion 30, a second terminal configuration portion 31, and a wiring configuration portion 32. The first terminal configuration portion 30 and the second terminal configuration portion 31 are located at a distance from each other, sandwiching the wiring configuration portion 32. The first terminal configuration portion 30 is continuous with the wiring configuration portion 32. The first terminal configuration portion 30 has a free end 30A located on the side opposite to the wiring configuration portion 32. The free end 30A protrudes from the end face 2A of the metal support layer 2 toward the side opposite to the wiring configuration portion 32 (see reference). Figure 2 ).

[0057] The second terminal configuration portion 31 is located on the opposite side of the first terminal configuration portion 30 relative to the wiring configuration portion 32. The second terminal configuration portion 31 is continuous with the wiring configuration portion 32. Neither the first terminal configuration portion 30 nor the second terminal configuration portion 31 is covered by the covering insulation layer 5 and is exposed from it. The wiring configuration portion 32 is located between the first terminal configuration portion 30 and the second terminal configuration portion 31. The wiring configuration portion 32 is covered by the covering insulation layer 5.

[0058] Examples of materials that can be used as the base insulating layer 3 include resins such as polyimide (insulating resin materials). The thickness of the base insulating layer 3 is not particularly limited, but may be, for example, 1 μm or more and 1000 μm or less.

[0059] like Figure 2 As shown, the seed film 6 is disposed on one side of the substrate insulating layer 3 in the thickness direction. The seed film 6 has a pattern corresponding to the conductor layer 4. Examples of materials for the seed film 6 include metals such as copper, chromium, and nickel, and their alloys. The seed film 6 can be formed from one layer or from two or more layers. The thickness of the seed film 6 is, for example, 0.01 μm or more, for example, 1 μm or less, preferably 0.1 μm or less.

[0060] The conductor layer 4 is disposed on one side of the substrate insulating layer 3 in the thickness direction, specifically, on one side of the seed film 6 in the thickness direction. For example... Figure 1 As shown, conductor layer 4 includes grounding pattern 10 and multiple wiring patterns 11.

[0061] The grounding pattern 10 has a grounding terminal 12 and a grounding wiring 13.

[0062] The grounding terminal 12 is disposed on one side of the first terminal placement portion 30 in the thickness direction. Specifically, the grounding terminal 12 is disposed on one side of the first terminal placement portion 30 in the thickness direction through the seed film 6. The grounding terminal 12 extends in a predetermined direction and has a rectangular shape (square pad shape) when viewed from above.

[0063] Grounding wiring 13 electrically connects grounding terminal 12 and metal support layer 2. Grounding wiring 13 is continuous from grounding terminal 12 and extends from first terminal configuration portion 30 to wiring configuration portion 32. Specifically, grounding wiring 13 is disposed across the thickness direction of first terminal configuration portion 30 and the thickness direction of wiring configuration portion 32, separated by seed film 6. Grounding wiring 13 penetrates wiring configuration portion 32 in the thickness direction and is grounded in metal support layer 2. The width direction (direction orthogonal to the length direction) of grounding wiring 13 is smaller than the width direction (direction orthogonal to the length direction) of grounding terminal 12.

[0064] Each of the multiple wiring patterns 11 has a first terminal 15, a second terminal 16, a connecting wiring 17, and a grounding wire residue 18, which are examples of terminal portions. That is, the conductor layer 4 has multiple first terminals 15 and multiple grounding wire residues 18.

[0065] The first terminal 15 is disposed on one side of the first terminal placement portion 30 in the thickness direction. Specifically, the first terminal 15 is disposed on one side of the first terminal placement portion 30 in the thickness direction, with the seed film 6 in between (see reference). Figure 2 The first terminal 15 extends along a predetermined direction and has a rectangular shape (square pad shape) when viewed from above. The ground terminal 12 and the plurality of first terminals 15 are arranged at intervals from each other in the width direction (orthogonal to the length direction) of the first terminal 15.

[0066] The second terminal 16 is disposed on one side of the second terminal placement portion 31 in the thickness direction. Specifically, the second terminal 16 is disposed on one side of the second terminal placement portion 31 in the thickness direction, separated by the seed film 6. The second terminal 16 extends in a predetermined direction and has a rectangular shape (square pad shape) when viewed from above. A plurality of second terminals 16 are arranged at intervals from each other in the width direction (a direction orthogonal to the length direction) of the second terminal 16.

[0067] The connecting wire 17 electrically connects the first terminal 15 and the second terminal 16. The connecting wire 17 extends continuously from the first terminal 15 on the first terminal configuration portion 30, passes through the wiring configuration portion 32, and connects to the second terminal 16 on the second terminal configuration portion 31. Specifically, the connecting wire 17 is disposed across the thickness direction of the first terminal configuration portion 30, the thickness direction of the wiring configuration portion 32, and the thickness direction of the second terminal configuration portion 31, separated by the seed film 6. The width direction (orthogonal to the length direction) of the connecting wire 17 is smaller than the width direction (orthogonal to the length direction) of the first terminal 15.

[0068] The grounding conductor residue 18 is the remaining portion of the grounding conductor 19 after partial removal during the manufacturing method of the wiring circuit board 1 described later (see reference). Figure 5 The residual portion 18 of the grounding conductor is disposed on one side of the first terminal placement portion 30 in the thickness direction (see reference). Figure 2Specifically, the grounding wire residue 18 is disposed on one side of the first terminal arrangement portion 30 in the thickness direction, separated by the seed film 6. The grounding wire residue 18 is electrically connected to the first terminal 15. The grounding wire residue 18 extends continuously from the first terminal 15 to the side opposite to the connecting wiring 17. The grounding wire residue 18 is located at the end of the wiring circuit board 1. The grounding wire residue 18 is disposed on the side of the first terminal 15 with a gap between the end face of the free end 30A of the first terminal arrangement portion 30. That is, the free end 30A of the first terminal arrangement portion 30 protrudes to the side opposite to the first terminal 15 in the direction in which the grounding wire residue 18 extends, relative to the grounding wire residue 18 and the metal support layer 2.

[0069] The thickness of the grounding wire residue 18 is thinner than the thickness of the first terminal 15. When the thickness of the first terminal 15 is set to 100, the thickness of the grounding wire residue 18 is, for example, 1 or more, preferably 5 or more, for example, 90 or less, preferably 80 or less.

[0070] Specifically, the thickness of the residual portion 18 of the grounding conductor is, for example, 1 μm or more, for example, 200 μm or less, preferably 100 μm or less, and more preferably 50 μm or less. The thickness of the first terminal 15 is, for example, 10 μm or more, preferably 20 μm or more, for example, 300 μm or less, and preferably 200 μm or less.

[0071] like Figure 2 As shown, such a conductor layer 4 is composed of multiple layers. In this embodiment, the conductor layer 4 has a first conductor layer 40 and a second conductor layer 41. Furthermore, there is no particular limitation on the number of layers constituting the conductor layer 4, and it can also be three or more layers.

[0072] The first conductor layer 40 is disposed on one side of the seed film 6 in the thickness direction. The first conductor layer 40 has a plurality of first terminal forming layers 42, a plurality of wire forming layers 43 and a plurality of wiring forming layers 44, which are examples of terminal forming layers.

[0073] The first terminal forming layer 42 constitutes the first terminal 15. The conductor forming layer 43 is continuous with the first terminal forming layer 42, constituting the grounding conductor residual portion 18. The wiring forming layer 44 is continuous with the first terminal forming layer 42, constituting the connecting wiring 17.

[0074] The thickness of the first conductor layer 40 is, for example, the same as the thickness of the grounding wire residue 18 described above.

[0075] The second conductor layer 41 is disposed on one side of the first conductor layer 40 in the thickness direction. The second conductor layer 41 has a plurality of second terminal forming layers 45, which are examples of terminal forming layers.

[0076] The second terminal forming layer 45 constitutes the first terminal 15. The second terminal forming layer 45 is disposed on one side of the first terminal forming layer 42 in the thickness direction. That is, the first terminal forming layer 42 and the second terminal forming layer 45 are stacked in the thickness direction.

[0077] When the thickness of the first conductor layer 40 is set to 100, the thickness of the second conductor layer 41 is, for example, 1 or more, preferably 5 or more, for example, 1000 or less, preferably 500 or less. Specifically, the thickness of the second conductor layer 41 is, for example, 1 μm or more, for example, 200 μm or less, preferably 100 μm or less.

[0078] In addition, the first conductor layer 40 also has a ground terminal forming layer constituting the ground terminal 12, a ground wiring forming layer constituting the ground wiring 13, and a third terminal forming layer constituting a plurality of second terminals 16, which are not shown in the figure.

[0079] In this embodiment, as described above, the first terminal 15 has a plurality of terminal forming layers (first terminal forming layer 42 and second terminal forming layer 45) stacked in the thickness direction, preferably consisting of the first terminal forming layer 42 and the second terminal forming layer 45. Furthermore, the number of terminal forming layers in the first terminal 15 is not particularly limited, and may be three or more.

[0080] Furthermore, the grounding conductor residual portion 18 has a conductor forming layer 43 that is continuous with the first terminal forming layer 42, and is preferably composed of the conductor forming layer 43. In addition, there is no particular limitation as long as the number of conductor forming layers in the grounding conductor residual portion 18 is less than the number of terminal forming layers in the first terminal 15, and it may also be two or more layers.

[0081] Furthermore, the connecting wiring 17 has a wiring forming layer 44 that is continuous with the first terminal forming layer 42, and is preferably composed of the wiring forming layer 44. In addition, there is no particular limitation on the number of wiring forming layers of the connecting wiring 17, and it may be two or more layers.

[0082] Materials used for such conductor layers 4 (first conductor layer 40 and second conductor layer 41) include, for example, metallic elements such as copper, silver, gold, iron, aluminum, and chromium, as well as alloys containing two or more of these metallic elements, with copper and copper alloys being preferred examples.

[0083] The first plating layer 7 improves the adhesion between the conductor layer 4 and the covering insulating layer 5. The first plating layer 7 is a chemical plating layer located between the conductor layer 4 and the covering insulating layer 5. Specifically, the first plating layer 7 is configured to cover the surfaces of the grounding wiring 13 and the connecting wiring 17 located on the wiring configuration portion 32. Examples of materials for the first plating layer 7 include metallic elements such as nickel, tin, silver, and palladium, as well as alloys containing two or more of these metallic elements; nickel is preferred. The first plating layer 7 can be formed in one layer or in two or more layers. The thickness of the first plating layer 7 is, for example, 0.01 μm or more, preferably 0.02 μm or more, for example, 1 μm or less, preferably 0.5 μm or less.

[0084] The insulating layer 5 is disposed on one side of the wiring arrangement portion 32 in the thickness direction, covering the grounding wiring 13 and the connecting wiring 17. Additionally, the insulating layer 5 exposes the grounding terminal 12, a plurality of first terminals 15, a plurality of grounding wire remnants 18, and a plurality of second terminals 16 (see reference). Figure 1 The material used for the covering insulating layer 5 may be, for example, the same material as the base insulating layer 3. The thickness of the covering insulating layer 5 is not particularly limited, but may be, for example, 1 μm or more and 1000 μm or less.

[0085] The second plating layer 8 is a chemical plating layer, which covers the surface of the conductor layer 4 exposed from the covering insulating layer 5 (specifically, the grounding terminal 12, the plurality of first terminals 15, the plurality of grounding wire remnants 18, and the plurality of second terminals 16) and the surface of the metal support layer 2. The material of the second plating layer 8 can be, for example, metallic elements such as nickel and gold, and alloys containing these metallic elements. The second plating layer 8 can be formed by one layer or by two or more layers. For example, the second plating layer 8 can also be formed by laminating a first layer containing nickel and a second layer containing gold. The thickness of the second plating layer 8 is, for example, 0.1 μm or more, preferably 0.25 μm or more, for example, 5 μm or less, preferably 2.5 μm or less.

[0086] 2. Manufacturing method of wiring circuit board

[0087] Next, refer to Figure 3 A~ Figure 6 The manufacturing method of wiring circuit board 1 will be explained.

[0088] The manufacturing method of the wiring circuit board 1 includes a process of preparing the metal support layer 2 (see reference). Figure 3 A) The process of forming the substrate insulating layer 3 (refer to...) Figure 3 B) The process of forming seed membrane 6 (refer to...) Figure 3 C) The process of forming conductor layer 4A (refer to...) Figure 3 D and Figure 3E) The process of removing the seed film 6 exposed from the conductor layer 4A (refer to...) Figure 4 F), the process of forming the first coating layer 7 (refer to...) Figure 4 G), the process of forming the covering insulation layer 5 (refer to...) Figure 4 H), the process of removing the first plating layer 7 exposed from the covering insulation layer 5 (refer to...) Figure 4 I) The process of forming the residual part 18 of the grounding conductor (refer to) Figure 5 J), the process of removing the seed film 6 exposed by the formation of the residual portion 18 through the grounding wire (refer to...). Figure 5 K) and the process of forming the second coating layer 8 (refer to K) Figure 5 L).

[0089] like Figure 3 As shown in Figure A, firstly, prepare the metal support layer 2.

[0090] Next, as Figure 3 As shown in Figure B, a substrate insulating layer 3 is formed on one side of the metal support layer 2 in the thickness direction. Specifically, a varnish containing the aforementioned resin is applied to one side of the metal support layer 2 in the thickness direction and allowed to dry to form a substrate film. Then, the substrate film is exposed and developed using a photomask (not shown), and cured by heating as needed, so that the substrate insulating layer 3 is formed as described above.

[0091] In this substrate insulating layer 3, the free end 30A of the first terminal configuration portion 30 is located inside the wiring circuit board 1, closer to the peripheral end face of the metal support layer 2. Therefore, a portion of one side of the metal support layer 2 in the thickness direction is exposed from the substrate insulating layer 3. Furthermore, the portion of the metal support layer 2 exposed from the substrate insulating layer 3 will be designated as the ground portion 20 below.

[0092] Next, as Figure 3 As shown in Figure C, a seed film 6 is formed on one side of the substrate insulating layer 3 in the thickness direction and on the other side of the ground portion 20 (the portion of the metal support layer 2 exposed from the substrate insulating layer 3) in the thickness direction. Methods for forming the seed film 6 include, for example, sputtering, electroplating, or electroless plating, with sputtering being the preferred method.

[0093] Next, as Figure 3 D and Figure 3 As shown in Figure E, a conductor layer 4A is formed on one side of the seed film 6 in the thickness direction. Figure 6 As shown, conductor layer 4A has a plurality of grounding wires 19 replacing the plurality of grounding wire remnants 18, and otherwise has the same structure as conductor layer 4. Furthermore, conductor layer 4A with grounding wires 19 will be referred to below as preconductor layer 4A to distinguish it from conductor layer 4 with grounding wire remnants 18.

[0094] Grounding conductor 19 electrically connects the first terminal 15 and the grounding portion 20. Grounding conductor 19 extends continuously from the first terminal 15 to the side opposite to the connecting wiring 17, beyond the free end 30A of the first terminal configuration portion 30, and is located on the grounding portion 20. Grounding conductor 19 is located at the end of the preconductor layer 4A. Grounding conductor 19 has a first portion 19A and a second portion 19B.

[0095] Part 19A is located on one side of the first terminal configuration portion 30 in the thickness direction. Specifically, it is disposed on one side of the first terminal configuration portion 30 in the thickness direction, separated by the seed film 6 (see reference). Figure 3 E). Part 19A is continuous with Terminal 15. Part 29B electrically connects Part 19A and Ground Part 20. Part 29B is continuous with Part 19A and is located on one side of Ground Part 20 in the thickness direction. Specifically, Part 29B contacts the side of Ground Part 20 in the thickness direction through Seed Film 6 (see reference). Figure 3 E).

[0096] To form such a preconductor layer 4A, such as Figure 3 D and Figure 3 As shown in E, after the first conductor layer 40A is formed on one side of the seed film 6 in the thickness direction, the second conductor layer 41 is formed on the other side of the first conductor layer 40A in the thickness direction.

[0097] To form the first conductor layer 40A, a photoresist having a pattern complementary to the first conductor layer 40A is disposed on the seed film 6, for example, by electroplating (preferably copper plating), which is not illustrated. Then, the photoresist is removed.

[0098] The first conductor layer 40A has a plurality of conductor forming layers 46 replacing the plurality of conductor forming layers 43, and otherwise has the same structure as the first conductor layer 40. The conductor forming layers 46 are continuous with the first terminal forming layer 42 and constitute the grounding conductor 19. That is, in the formation of the first conductor layer 40A, the conductor forming layer 46 constituting the grounding conductor 19 and the first terminal forming layer 42 constituting the first terminal 15 and continuous with the conductor forming layer 46 are formed simultaneously.

[0099] Next, as Figure 3 As shown in Figure E, a second conductor layer 41 is formed. To form the second conductor layer 41, a resist having a pattern complementary to the second conductor layer 41 is disposed on the first conductor layer 40A, for example, by electroplating (preferably copper plating), which is not shown. Then, the resist is removed.

[0100] Therefore, instead of forming a conductor forming layer constituting the grounding conductor 19, a second terminal forming layer 45 constituting the first terminal 15 is formed. The second terminal forming layer 45 is formed on one side of the first terminal forming layer 42 in the thickness direction, and the second terminal forming layer 45 forms the first terminal 15.

[0101] Based on the above, a preconductor layer 4A having a first terminal 15 and a grounding wire 19 is formed.

[0102] Next, as Figure 4 As shown in Figure F, the seed film 6 exposed from the preconductor layer 4A is removed by a known etching method (e.g., wet etching). Examples of etching solutions for the seed film 6 include aqueous sodium hydroxide solution, potassium permanganate solution, and sodium metasilicate solution.

[0103] Next, as Figure 4 As shown in G, the preconductor layer 4A is chemically plated using a first chemical plating solution containing metal ions (e.g., nickel ions) of the material of the first plating layer 7 described above.

[0104] Thus, the first plating layer 7 is formed in such a way as to cover the exposed preconductor layer 4A (grounding terminal 12, grounding wiring 13, first terminal 15, second terminal 16, connecting wiring 17, and grounding wire 19).

[0105] Next, as Figure 4 As shown in H, the covering insulating layer 5 is formed on one side of the base insulating layer 3 in the thickness direction, specifically on one side of the wiring configuration portion 32 in the thickness direction, so as to cover the grounding wiring 13 and the connecting wiring 17. Furthermore, the covering insulating layer 5 is formed in the pattern described above.

[0106] Specifically, a varnish containing the aforementioned resin is applied to one side of the substrate insulating layer 3 in the thickness direction and allowed to dry to form a cover film. Then, the cover film is exposed and developed using a photomask (not shown), and cured by heating as needed, so that the cover insulating layer 5 is formed into the pattern described above.

[0107] Next, as Figure 4 As shown in Figure 1, the first plating layer 7 exposed from the covering insulating layer 5 is removed by a known etching method (e.g., wet etching). Examples of etching solutions for the first plating layer 7 include, for example, hydrogen peroxide sulfate and hydrogen peroxide nitric acid.

[0108] Next, as Figure 5 As shown in Figure J, the grounding portion 20 of the metal support layer 2 and the second portion 19B of the grounding wire 19 are simultaneously etched to remove a portion of the grounding wire 19, thereby insulating the first terminal 15 from the metal support layer 2. Specifically, the grounding portion 20 and the second portion 19B are removed simultaneously by wet etching. Examples of such etching solutions include, for instance, ferric chloride solution.

[0109] At this point, after removing the grounding portion 20, the etching solution further etches the metal support layer 2 so that the end face 2A of the metal support layer 2 is positioned closer to the first terminal 15 than the free end 30A of the first terminal configuration portion 30. Additionally, after removing the second portion 19B, the etching solution further etches the grounding wire 19 until the end face of the first portion 19A is positioned closer to the first terminal 15 than the free end 30A.

[0110] Thus, a grounding wire residual portion 18 is formed, and the free end 30A of the first terminal configuration portion 30 protrudes to the side opposite to the first terminal 15 relative to the grounding wire residual portion 18 and the metal support layer 2.

[0111] Next, as Figure 5 As shown in K, the seed film 6 exposed by the removal via the grounding wire 19 is removed. Specifically, the seed film 6 located on the free end 30A is removed by a known etching method (e.g., wet etching).

[0112] Next, as Figure 5 As shown in Figure L, a second chemical plating solution containing metal ions of the material described above as the second plating layer 8 is used to perform chemical plating on the portions of the conductor layer 4 exposed from the covering insulating layer 5 (specifically, the grounding terminal 12, the first terminal 15, the remaining portion 18 of the grounding wire, and the second terminal 16) and the metal support layer 2. Furthermore, if the second plating layer 8 is formed of multiple layers, the chemical plating is repeated. For example, after chemical plating using a second chemical plating solution containing first metal ions (e.g., nickel ions), chemical plating is performed using a second chemical plating solution containing second metal ions (e.g., gold ions).

[0113] Thus, the second plating layer 8 is formed in such a way that it covers the exposed conductor layer 4 (specifically the grounding terminal 12, the first terminal 15, the grounding wire remnant 18, and the second terminal 16) and the metal support layer 2.

[0114] Based on the above, a wiring circuit board 1 is manufactured.

[0115] The application of such a wiring circuit board 1 is not particularly limited and can be used in various fields. The wiring circuit board 1 is used in various applications such as wiring circuit boards for electronic devices (wiring circuit boards for electronic components) and wiring circuit boards for electrical equipment (wiring circuit boards for electrical components). Examples of wiring circuit boards for electronic devices and electrical devices include, for example, sensor wiring circuit boards used in sensors such as position information sensors, obstacle detection sensors, and temperature sensors; conveyor wiring circuit boards used in conveyor vehicles such as automobiles, trams, airplanes, and work vehicles; video device wiring circuit boards used in video devices such as flat panel displays, flexible displays, and projection video devices; communication relay equipment wiring circuit boards used in communication relay equipment such as network equipment and large communication equipment; information processing terminal wiring circuit boards used in information processing terminals such as computers, tablets, smartphones, and home game consoles; movable equipment wiring circuit boards used in movable devices such as drones and robots; medical device wiring circuit boards used in medical devices such as wearable medical devices and medical diagnostic devices; electrical device wiring circuit boards used in electrical devices such as refrigerators, washing machines, vacuum cleaners, and air conditioning equipment; and video recording electronic devices wiring circuit boards used in video recording electronic devices such as digital cameras and DVD recording devices.

[0116] like Figure 1 As shown, the residual portion 18 of the grounding wire is formed during the manufacturing of the wiring circuit board 1 by removing a portion of the grounding wire 19 that electrically connects the first terminal 15 and the metal support layer 2 (see reference). Figure 5 J). Therefore, before the grounding wire 19 is removed, the first terminal 15 and the metal support layer 2 are electrically connected, which enables the first plating layer 7 to be uniformly formed on the conductor layer 4.

[0117] In addition, such as Figure 2 As shown, the thickness of the remaining portion 18 of the grounding wire is thinner than the thickness of the first terminal 15. Therefore, the grounding wire 19 can be removed smoothly.

[0118] Furthermore, there are no particular limitations on the method of etching a portion of the grounding conductor 19; either wet etching or dry etching can be used. However, when removing a portion of the grounding conductor 19 by wet etching, if the thickness of the remaining portion 18 of the grounding conductor is greater than or equal to the thickness of the first terminal 15, it may sometimes be impossible to sufficiently remove the portion of the grounding conductor 19.

[0119] In this regard, in the wiring circuit board 1, since the thickness of the residual portion 18 of the grounding wire is thinner than the thickness of the first terminal 15, wet etching can reliably remove the local portion of the grounding wire 19, and can suppress the erosion of the first terminal 15 due to over-etching, thereby improving the connection reliability of the first terminal 15.

[0120] like Figure 2 As shown, the first terminal 15 has a first terminal forming layer 42 and a second terminal forming layer 45, and the grounding wire residual portion 18 has a wire forming layer 43 that is continuous with the first terminal forming layer 42. Therefore, the thickness of the grounding wire residual portion 18 can be reliably set to be thinner than the thickness of the first terminal 15. In addition, since the first terminal forming layer 42 and the wire forming layer 43 are continuous with each other, the reliability of the conduction between the first terminal forming layer 42 and the wire forming layer 43 can be improved.

[0121] like Figure 1 As shown, the grounding wire residue 18 is located at the end of the wiring circuit board 1. Therefore, during the manufacturing of the wiring circuit board 1, it is possible to more easily remove a portion of the grounding wire 19 and form the grounding wire residue 18.

[0122] like Figure 2 As shown, the grounding wire residue 18 is disposed on the first terminal configuration portion 30, and the free end 30A of the first terminal configuration portion 30 protrudes in the direction in which the grounding wire residue 18 extends, relative to the grounding wire residue 18 and the metal support layer 2, to the side opposite to the first terminal 15. Therefore, the grounding wire residue 18 and the metal support layer 2 can be reliably insulated.

[0123] In addition, such as Figure 4 F~ Figure 5 As shown in Figure J, in the manufacturing method of the wiring circuit board 1, after forming the preconductor layer 4A having the first terminal 15 and the ground wire 19 (refer to Figure J), Figure 4 F), chemical plating is performed on the preconductor layer 4A (refer to...). Figure 4 G), then, remove the second portion 19B of the grounding wire 19 to form the grounding wire residue 18, so as to insulate the first terminal 15 and the metal support layer 2 (see reference). Figure 5 J).

[0124] That is, during the chemical plating of the preconductor layer 4A, the grounding wire 19 electrically connects the first terminal 15 and the metal support layer 2, thus enabling the formation of a uniform first plating layer 7 in the preconductor layer 4A. Furthermore, since the thickness of the remaining portion 18 of the grounding wire is thinner than the thickness of the first terminal 15, the grounding wire 19 can be easily removed, and the connection reliability of the first terminal 15 can be improved.

[0125] In addition, such as Figure 3 D and Figure 3 As shown in E, the process of forming conductor layer 4 includes a process of simultaneously forming conductor forming layer 46 and first terminal forming layer 42, and a process of forming second terminal forming layer 45 without forming conductor forming layer. Therefore, first terminal 15 is composed of multiple terminal forming layers, and grounding conductor 19 is composed of fewer conductor forming layers than multiple terminal forming layers. Therefore, the thickness of grounding conductor 19 can be reliably set to be thinner than the thickness of first terminal 15, and further, the thickness of the remaining portion 18 of grounding conductor can be reliably set to be thinner than the thickness of first terminal 15.

[0126] In addition, such as Figure 5 As shown in Figure J, the ground portion 20 of the metal support layer 2 and the second portion 19B of the grounding wire 19 can be etched simultaneously. Therefore, the second portion 19B of the grounding wire 19 can be easily removed, the remaining portion 18 of the grounding wire can be disposed at the end of the wiring circuit board 1, and the number of manufacturing steps can be reduced. Furthermore, the etching of the metal support layer 2 and the etching of the grounding wire 19 can also be performed separately.

[0127] In addition, such as Figure 5 As shown in K, the seed film 6 exposed by the removal of the grounding wire 19 is removed. Therefore, the residual portion 18 of the grounding wire and the metal support layer 2 can be insulated more reliably.

[0128] <Second Implementation>

[0129] Next, refer to Figure 7 This section describes a second embodiment of the wiring circuit board of the present invention. Furthermore, in the second embodiment, components identical to those in the first embodiment described above are labeled with the same reference numerals, and their descriptions are omitted.

[0130] In the first embodiment described above, such as Figure 2 As shown, the first conductor layer 40 has a first terminal forming layer 42, a wire forming layer 43 and a wiring forming layer 44, and the second conductor layer 41 has a second terminal forming layer 45, but the structure of the conductor layer 4 is not limited to this.

[0131] In the second embodiment, such as Figure 7 As shown, the first conductor layer 40 has a first terminal forming layer 42, and the second conductor layer 41 has a second terminal forming layer 45, a conductor forming layer 43, and a wiring forming layer 44. In this case, the conductor forming layer 43 is not continuous with the first terminal forming layer 42 but is continuous with the second terminal forming layer 45. The wiring forming layer 44 is not continuous with the first terminal forming layer 42 but is continuous with the second terminal forming layer 45.

[0132] This second embodiment can achieve the same effect as the first embodiment described above.

[0133] <Third Implementation>

[0134] Next, refer to Figure 8 and Figure 9 This section describes a third embodiment of the wiring circuit board of the present invention. Furthermore, in this third embodiment, components identical to those in the first embodiment described above are labeled with the same reference numerals, and their descriptions are omitted.

[0135] In the first embodiment described above, such as Figure 2 As shown, the grounding conductor residual portion 18 consists only of the portion that is continuous with the first terminal 15, but the structure of the grounding conductor residual portion is not limited to this.

[0136] In the third embodiment, such as Figure 8 As shown, the grounding conductor residual portion 22 has a first residual portion 22A and a second residual portion 22B.

[0137] like Figure 9 As shown, the first residual portion 22A is disposed on one side of the first terminal configuration portion 30 in the thickness direction. Specifically, the first residual portion 22A is disposed on one side of the first terminal configuration portion 30 in the thickness direction, with the seed film 6 in between. The first residual portion 22A is electrically connected to the first terminal 15. The first residual portion 22A extends continuously from the first terminal 15 to the side opposite to the connecting wiring 17.

[0138] The second residual portion 22B is located on the side opposite to the first terminal 15, spaced apart from the first residual portion 22A. The second residual portion 22B is electrically connected to the metal support layer 2 via a through hole 33 in the first terminal configuration portion 30. Specifically, the second residual portion 22B fills the through hole 33 and contacts the thickness direction side of the metal support layer 2 through the seed film 6.

[0139] To manufacture the wiring circuit board 1 of the third embodiment, a preconductor layer 4B having a first terminal 15 and a ground wire 21 is formed, similarly to that of the first embodiment. Figure 10 As shown, the grounding wire 21 has a first portion 21A corresponding to the first residual portion 22A and a second portion 21B corresponding to the second residual portion 22B. The first portion 21A connects the first terminal 15 and the second portion 21B.

[0140] Then, similarly to the first embodiment, after chemically plating the preconductor layer 4B and forming the first plating layer 7 (see reference...) Figure 4 G), forming a covering insulating layer 5 (refer to G), Figure 4H), then, the first plating layer 7 exposed from the covering insulating layer 5 is removed (see H). Figure 4 I), then, as Figure 8 As shown, the portion between the continuous portion of the first part 21A and the second part 21B of the grounding wire 21 is removed, forming a residual portion 22 of the grounding wire to insulate the first terminal 15 and the metal support layer 2. Therefore, the first residual portion 22A, which is continuous with the first terminal 15, is not located at the end of the wiring circuit board 1. Then, as... Figure 9 As shown, the seed film 6 exposed by the removal through the grounding wire 21 is removed, and then a second plating layer 8 is formed on the exposed conductor layer 4.

[0141] The wiring circuit board 1 of the third embodiment was manufactured according to the above.

[0142] According to this third embodiment, the same effect as the first embodiment described above can be achieved. On the other hand, in the third embodiment, a portion of the seed film 6 may remain between the first residual portion 22A and the second residual portion 22B. Therefore, from the viewpoint of ensuring the insulation between the first terminal 15 and the metal support layer 2, the first and second embodiments are preferred over the third embodiment.

[0143] <Variation Example>

[0144] In the first to third embodiments described above, as Figure 4 I and Figure 5 As shown in Figure J, after removing the first plating 7 exposed from the covering insulation layer 5, a portion of the grounding conductor 19 is removed, but the order of removing the first plating and the grounding conductor is not limited to this. Alternatively, the first plating exposed from the covering insulation layer can be removed after the portion of the grounding conductor is removed.

[0145] Furthermore, in the first to third embodiments described above, as follows: Figure 5 As shown in L, the second plating layer 8 is formed by chemical plating, but the method for forming the second plating layer is not limited to this. For example, after removing the first plating layer and before removing a portion of the grounding wire, the grounding wire can also be used as the electroplating wire to form the second plating layer by electroplating (see reference). Figure 4 I).

[0146] Furthermore, in the first to third embodiments described above, the first terminal is composed of multiple terminal forming layers, and the remaining portion of the grounding wire is composed of fewer wire forming layers than the multiple terminal forming layers. However, it is also possible that the first terminal is composed of a single terminal forming layer, and the remaining portion of the grounding wire is composed of a single wire forming layer continuous with that terminal forming layer. In this case, the remaining portion of the grounding wire is formed, for example, by etching to be thinner than the first terminal.

[0147] Furthermore, in the first to third embodiments described above, after forming the seed film, the conductor layer is formed by an additive method of forming a conductor layer on the seed film; however, the method of forming the conductor layer is not limited to this. The conductor layer can also be formed by a subtractive method.

[0148] Such modifications can achieve the same effect as the first embodiment described above. Furthermore, the first to third embodiments and their modifications can be appropriately combined.

[0149] Furthermore, the above-described invention is provided as an illustrative embodiment of the present invention, but it is merely illustrative and should not be interpreted as limiting. Modifications of the invention that will be apparent to those skilled in the art are included in the foregoing claims.

[0150] Industrial availability

[0151] The wiring circuit board of the present invention is applicable to various uses, such as wiring circuit boards for electronic devices (wiring circuit boards for electronic components) and wiring circuit boards for electrical equipment (wiring circuit boards for electrical components).

[0152] Explanation of reference numerals in the attached figures

[0153] 1. Wiring circuit board; 2. Metal support layer; 3. Substrate insulating layer; 4. Conductor layer; 4A. Preconductor layer; 4B. Preconductor layer; 6. Seed film; 15. Terminal 1; 18. Residual portion of grounding wire; 19. Grounding wire; 21. Grounding wire; 22. Residual portion of grounding wire; 40. First conductor layer; 41. Second conductor layer; 42. Terminal 1 forming layer; 43. Conductor forming layer; 45. Terminal 2 forming layer; 46. Conductor forming layer.

Claims

1. A wiring circuit board, characterized in that, The wiring circuit board has the following features: Metal support layer; An insulating layer disposed on one side of the metal support layer in the thickness direction; and A conductor layer disposed on one side of the insulation layer in the thickness direction, having a terminal portion and a residual portion of a grounding wire electrically connected to the terminal portion. The thickness of the remaining portion of the grounding conductor is thinner than the thickness of the terminal portion. A portion of the insulating layer protrudes in the direction in which the grounding conductor remnant extends, relative to the grounding conductor remnant and the metal support layer, toward the side opposite to the terminal portion.

2. A wiring circuit board, characterized in that, The wiring circuit board has the following features: Metal support layer; An insulating layer disposed on one side of the metal support layer in the thickness direction; and A conductor layer, disposed on one side of the insulating layer in the thickness direction, has: a grounding pattern having a grounding terminal electrically connected to the metal support layer; a wiring pattern having a terminal portion not electrically connected to the metal support layer; and a grounding wire residue portion electrically connected to the terminal portion of the wiring pattern but not connected to the grounding pattern. The thickness of the remaining portion of the grounding conductor is thinner than the thickness of the terminal portion.

3. The wiring circuit board according to claim 1 or 2, characterized in that, The terminal portion has a plurality of terminal forming layers stacked in the thickness direction. The remaining portion of the grounding conductor has a conductor forming layer that is continuous with at least one of the plurality of terminal forming layers.

4. A wiring circuit board, characterized in that, The wiring circuit board has the following features: Metal support layer; An insulating layer disposed on one side of the metal support layer in the thickness direction; A conductor layer disposed on one side of the insulation layer in the thickness direction, having a terminal portion and a residual portion of a grounding wire electrically connected to the terminal portion; A covering insulating layer is disposed on one side of the insulating layer in the thickness direction, covering a portion of the conductor layer; as well as A plating layer covering the remaining portion of the grounding conductor. The thickness of the remaining portion of the grounding conductor is thinner than the thickness of the terminal portion. The terminal portion has a plurality of terminal forming layers, including a first terminal forming layer disposed on one side of the insulating layer in the thickness direction, and a second terminal forming layer disposed on one side of the first terminal forming layer in the thickness direction. The second terminal forming layer is disposed at a distance from the covering insulating layer in a direction orthogonal to the thickness direction. The plating layer covers one side of the second terminal forming layer in the thickness direction and the other side of the second terminal forming layer in the direction orthogonal to the thickness direction.

5. The wiring circuit board according to claim 4, characterized in that, The remaining portion of the grounding conductor has a conductor forming layer that is continuous with at least one of the plurality of terminal forming layers.

6. The wiring circuit board according to any one of claims 1, 2, and 4, characterized in that, The remaining portion of the grounding conductor is located at the end of the wiring circuit board.

7. The wiring circuit board according to any one of claims 1, 2, and 4, characterized in that, The remaining portion of the grounding conductor is disposed on one side of the insulation layer in the thickness direction.

8. A method for manufacturing a wiring circuit board, characterized in that, It is a method for manufacturing the wiring circuit board according to any one of claims 1 to 7. The manufacturing method of the wiring circuit board includes: The process of preparing the metal support layer; The process of forming an insulating layer on one side of the metal support layer in the thickness direction; The process of forming a conductor layer, the conductor layer having a terminal portion disposed on one side of the thickness direction of the insulating layer and a grounding wire electrically connecting the terminal portion and the metal support layer; The process of performing chemical plating on the conductor layer; and The process of removing a portion of the grounding wire to form a residual portion of the grounding wire, thereby insulating the terminal portion and the metal support layer. The thickness of the remaining portion of the grounding conductor is thinner than the thickness of the terminal portion.

9. A method for manufacturing a wiring circuit board, characterized in that, The manufacturing method of the wiring circuit board includes: The process of preparing the metal support layer; The process of forming an insulating layer on one side of the metal support layer in the thickness direction; The process of forming a conductor layer, the conductor layer having a terminal portion disposed on one side of the thickness direction of the insulating layer and a grounding wire electrically connecting the terminal portion and the metal support layer; The process of performing chemical plating on the conductor layer; and The process of removing a portion of the grounding wire to form a residual portion of the grounding wire, thereby insulating the terminal portion and the metal support layer. The thickness of the remaining portion of the grounding conductor is thinner than the thickness of the terminal portion. In the process of removing the local portion of the grounding conductor, the local portion of the metal support layer and the local portion of the grounding conductor are etched simultaneously.

10. The method for manufacturing a wiring circuit board according to claim 8 or 9, characterized in that, The process of forming the conductor layer includes: The process of simultaneously forming a conductor forming layer and a terminal forming layer, wherein the conductor forming layer constitutes the grounding conductor, and the terminal forming layer constitutes the terminal portion and is continuous with the conductor forming layer; and A process of forming a terminal forming layer that constitutes the terminal portion without forming a conductor forming layer that constitutes the grounding conductor.

11. The method for manufacturing a wiring circuit board according to claim 8 or 9, characterized in that, The manufacturing method of the wiring circuit board also includes: A process of forming a seed film on one side of the insulating layer in the thickness direction and on the side of the metal support layer exposed from the insulating layer in the thickness direction, after the process of forming the insulating layer and before the process of forming the conductor layer; A process of removing the seed film exposed from the conductor layer after the process of forming the conductor layer and before the process of electroless plating; and After the process of removing the local portion of the grounding wire, a process of removing the seed film exposed by the removal of the grounding wire.

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