Temperature balancing plate with enhanced two-phase flow boiling structure

Abstract

The present invention provides a temperature equalizing plate with an enhanced two-phase flow boiling structure, comprising: a main body, the main body is formed by a first plate body and a second plate body correspondingly covering each other to form an airtight chamber, the airtight chamber has a condensation side and an evaporation side and is filled with a working fluid, the surface of the evaporation side is configured with a plurality of convex portions and a plurality of concave portions, and a capillary structure is provided, so that the convex portion penetrates and protrudes outside the capillary structure, and the capillary structure covers but does not fill the plurality of concave portions, so that the concave portions form a space that can accommodate the working fluid, and through the arrangement of the concave and convex structure, the effect of two-phase flow boiling inside the temperature equalizing plate can be greatly improved.

Description

Technical Field

[0001] The invention relates to a temperature averaging plate with an enhanced two-phase flow boiling structure, in particular to an enhanced temperature averaging plate structure for increasing the two-phase flow boiling effect inside the temperature averaging plate. Background Art

[0002] VC is the abbreviation of temperature equalizing plate, which consists of a shell with an airtight chamber, a capillary wick and a working fluid (water, refrigerant, methanol, acetone, liquid ammonia, etc.) inside. The shell on the market is mostly made of copper, aluminum, and stainless steel. Because the working fluid inside it undergoes a phase change latent heat mechanism to conduct heat, its heat conduction ability is well used in electronics, aerospace, military industry, petrochemical and other industries.

[0003] However, in recent years, the heat flux density of chip packaging has become increasingly higher. For example, the power consumption of Asic chips can reach 1000W, and the heat flux density is 250W / cm 2 , and the chip grain hot spot problem, which places more stringent requirements on the evaporation thermal resistance of VC. In addition, the current IC design also tends to be a bare crystal design structure. Since the bare crystal is not shielded by other structures, its heat diffuses outward more directly and quickly, so the heat generated instantly is extremely high. The problem of rapid and immediate heat dissipation is more emphasized. If the heat dissipation speed is too slow, it will easily cause the chip to overheat and become disabled or even damaged. Therefore, the high heat generated by the bare crystal must be quickly and quickly conducted away through the heat conduction element for heat dissipation.

[0004] However, most of the current industry uses two-phase flow heat conduction elements such as vapor chambers or heat pipes to conduct heat to dissipate heat from the heat source. However, the structure of the traditional vapor chamber is still the most basic type, that is, a shell with a vacuum chamber plus a working fluid and a capillary structure. The working fluid passes through the evaporation side of the shell that contacts the heat source, absorbs heat and then heats the working fluid to perform heat exchange through evaporation (boiling) and condensation.

[0005] In the two-phase change application of the working fluid of the traditional temperature-averaging plate and heat pipe, the surface of the capillary wick inside the temperature-averaging plate is only simple evaporation or evaporation + film boiling, which means that the working fluid in the airtight chamber evaporates (boils) on the wall of the airtight chamber and produces a vaporization phenomenon, and after condensation, it flows back to the heated area through the capillary structure, that is, the working fluid undergoes the aforementioned two-phase flow conversion of evaporation + film boiling and condensation reflux in the airtight chamber, and the airtight chamber inside the traditional temperature-averaging plate must wait until the temperature-averaging plate as a whole is heated to a boiling temperature before heating the working fluid to produce boiling phenomenon and then evaporation and vaporization occur, while the part inside the temperature-averaging plate that can heat the working fluid to boiling phenomenon and produce vaporization effect is only the working fluid The direct contact part, and because the working liquid has a small contact area with the temperature equalizer, the working liquid needs to be heated until the evaporation efficiency is poor and slow. As for the phase change latent heat working mechanism, the more intense the phase change, the stronger the latent heat exchange capacity. Therefore, the traditional temperature equalizer structure cannot provide fast and immediate heat relief for the current high-heat-generating ICs such as bare crystals. The traditional evaporation + film boiling as a two-phase flow working heat conduction is actually insufficient for heat relief work for heat sources that generate high heat quickly or instantly. Therefore, how to increase pool boiling or flow boiling inside the temperature equalizer to provide a fast and immediate two-phase flow phase change structure that is sufficient to cope with the current high-heat-generating chips and high heat generated by bare crystals is the current top priority. Summary of the invention

[0006] Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a temperature balancing plate with a structure for enhancing two-phase flow boiling, which can enhance the effect of two-phase flow boiling inside the temperature balancing plate.

[0007] To achieve the above object, the technical solution adopted by the present invention is:

[0008] A temperature balancing plate with a two-phase flow boiling enhancement structure, characterized by comprising:

[0009] A main body has a first plate and a second plate which are covered together to form an airtight chamber, the airtight chamber has a condensation side and an evaporation side, and the airtight chamber is filled with a working fluid, the surface of the evaporation side has a capillary structure, and the evaporation side has a plurality of convex portions and a plurality of concave portions, the convex portion penetrates and protrudes from the capillary structure, and the concave portion is recessed under the capillary structure and is not filled by the capillary structure to form a space capable of accommodating the working fluid.

[0010] The temperature equalizing plate with enhanced two-phase flow boiling structure, wherein: the convex portion protrudes upward from the surface of the evaporation side to form a convex body, the top ends of the multiple convex portions do not contact the aforementioned condensation side, and the concave portion is recessed downward toward the surface of the evaporation side to form a pit.

[0011] The temperature equalizing plate with enhanced two-phase flow boiling structure, wherein: the side of the body opposite to the evaporation side is in contact with at least one heat source to absorb heat, and the evaporation side has a heating zone corresponding to the heat source, and the plurality of convex portions and the plurality of concave portions are arranged in the heating zone.

[0012] The temperature equalizing plate with enhanced two-phase flow boiling structure, wherein: the airtight chamber has a plurality of supporting structures, and the two ends of the plurality of supporting structures are respectively connected to the condensation side and the evaporation side.

[0013] The temperature equalizing plate with the enhanced two-phase flow boiling structure, wherein: any one of the convex part and the concave part is polygonal.

[0014] The temperature equalizing plate with the enhanced two-phase flow boiling structure, wherein: the top of the protrusion is in the form of an obtuse angle or an acute angle.

[0015] The temperature equalizing plate with enhanced two-phase flow boiling structure, wherein: the capillary structure is any one or any combination of sintered powder, mesh body, and braided body.

[0016] The temperature equalizing plate with enhanced two-phase flow boiling structure, wherein: the condensation side is formed on the inner surface of the first plate body, and the evaporation side is formed on the inner surface of the second plate body.

[0017] The present invention greatly improves the boiling effect of the two-phase flow inside the temperature equalizing plate by disposing the concave and convex parts.

[0018] The surface of a traditional capillary structure is usually evaporation plus film boiling, and because the more intense the phase change in the two-phase flow phase change latent heat working mechanism, the stronger the latent heat heat exchange capacity, the present invention sets concave and convex parts on the evaporation side surface of the temperature equalizing plate to increase the intense phase change and enhance the latent heat heat exchange capacity, and protrudes from the capillary structure surface and is lower than the capillary structure surface to form a space for accommodating the working fluid, thereby forming multiple structures that can increase pool boiling, film boiling, and flow boiling, so that bubbles can quickly detach from the capillary structure and the concave and convex parts, thereby enhancing the latent heat exchange capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional exploded view of the first embodiment of the temperature equalizing plate with an enhanced two-phase flow boiling structure of the present invention;

[0020] Figure 2 It is a combined cross-sectional view of the first embodiment of the temperature equalizing plate with enhanced two-phase flow boiling structure of the present invention.

[0021] Explanation of the reference numerals: main body 1; first plate body 1a; second plate body 1b; airtight chamber 11; condensation side 111; evaporation side 112; convex portion 1121; concave portion 1122; support structure 12; heated area 13; working fluid 2; capillary structure 3; through hole 31; support structure 12; heat source 4. DETAILED DESCRIPTION

[0022] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0023] See also Figure 1 , Figure 2 , is a three-dimensional exploded and combined cross-sectional view of a temperature averaging plate with an enhanced two-phase flow boiling structure of the present invention. As shown in the figure, the temperature averaging plate with an enhanced two-phase flow boiling structure of the present invention comprises: a body 1;

[0024] The main body 1 is a hollow shell and has a first plate body 1a (having a first inner side and a first outer side) and a second plate body 1b (having a second inner side and a second outer side). The first and second plates are correspondingly covered to form an airtight chamber 11. The airtight chamber 11 has a condensation side 111 (i.e., the first inner side) and an evaporation side 112 (i.e., the second inner side). The airtight chamber 11 is filled with a working fluid 2. The surface of the evaporation side 112 is provided with a capillary structure 3. The capillary structure 3 is a sintered powder or a mesh body or a woven body or a fiber body or a combination thereof. This embodiment uses a woven body as an illustrative embodiment but is not limited thereto. The woven body capillary structure has a plurality of through holes.

[0025] The airtight chamber 11 has a plurality of support structures 12 in it, and the two ends of the plurality of support structures 12 are respectively connected to the condensation side 111 and the evaporation side 112. The support structure 12 is a plurality of support protrusions or support rings. In this embodiment, the support protrusions are selected as an illustrative implementation but are not limited to this. The support protrusions can be separated or directly generate the protruding support structure 12 on the condensation side 111 or the evaporation side 112 to the other side.

[0026] The evaporation side 112 is configured with a plurality of convex portions 1121 and a plurality of concave portions 1122. The convex portion 1121 is a through hole that penetrates the capillary structure and protrudes out of the capillary structure 3. The diameter of the through hole is exactly the same as or larger than the diameter of the convex portion. Since the capillary structure 3 is flatly arranged on the surface of the evaporation side 112, the concave portion 1122 is a pit (pit) formed by the surface of the evaporation side 112 being depressed downward, so that the capillary structure 3 can cover but not fill the inner space of the plurality of concave portions 1122, that is, the plurality of concave portions 1122 are located below the capillary structure 3 and have a plurality of spaces that can accommodate the working fluid 2. The top ends of the plurality of convex portions 1121 do not contact the aforementioned condensation side 111.

[0027] The other side corresponding to the evaporation side 112 of the main body 1 (i.e., the outer surface of the main body 1) contacts at least one heat source 4 to absorb heat, and the evaporation side 112 (i.e., the inner side of the main body 1) has a heating zone 13 corresponding to the heat source 4. In this embodiment, the plurality of convex portions 1121 and the plurality of concave portions 1122 are arranged in the heating zone 13, but can also be arranged in a non-heating zone, i.e., at the periphery of the heating zone; in addition, the plurality of convex portions 1121 and the concave portions 1122 can be arranged in an equidistant or unequal manner, or can be densely arranged in parallel or dispersedly arranged, or can be any combination of the same or different sizes, thicknesses, and hole depths.

[0028] The capillary structure 3 has a through hole 31 at a position corresponding to the plurality of protrusions 1121. The through hole 31 is selected to be larger than or equal to the outer diameter of the plurality of protrusions 1121, that is, when the aperture of the through hole 31 is larger than the outer diameter of the protrusion 1121, there is a gap between the through hole 31 and the protrusion 1121. When the aperture of the through hole 31 is equal to the outer diameter of the protrusion 1121, the capillary structure 3 is attached to the protrusion 1121.

[0029] When the aperture of these through holes 31 is the same as the outer diameter of the protrusion 1121, the working fluid 2 attached to the outside of the protrusion 1121 after partial condensation can quickly flow back to the evaporation area along the capillary structure 3 in contact with the protrusion 1121. If the aperture of the through hole 31 is larger than the outer diameter of the protrusion 1121, the evaporated working fluid 2 can quickly diffuse outward from the gap between the through hole 31 and the protrusion 1121.

[0030] In the present invention, the shapes of the multiple protrusions 1121 and the recesses 1122 can be conical or polygonal. The conical shape is the best in this embodiment, and the protrusion 1121 is a right cone with an obtuse or acute angle at the top. The width of the multiple protrusions 1121 is about 1.5 mm, and they protrude from the surface of the capillary structure 3 by about 1 to 2 mm. The width of the multiple recesses 1122 is about 0.3 to 0.5 mm, and the depth is about 0.2 to 0.3 mm. The capillary structure 3 is located exactly in the middle of the protrusion 1121 and the recess 1122.

[0031] It is known from the literature that when a liquid boils, it can be divided into two categories according to the boiling conditions. One is that the boiling vapor nucleus is generated by the bulk phase of the liquid, and there is no solid heating surface in the liquid, which is called homogeneous boiling. The other type of boiling occurs on the solid heating surface in contact with the liquid, which is called heterogeneous boiling. Among them, heterogeneous boiling is the most common and most practical type of boiling in daily life and industry.

[0032] According to the state of liquid flow, boiling can be divided into two categories: pool boiling and flow boiling. The boiling that takes place when the heating surface is placed in a pool of liquid without stirring is called pool boiling. Flow boiling means that the boiling phenomenon occurs during the flow of liquid. Both types of boiling operations have important applications in engineering.

[0033] The existing vapor chamber only has traditional evaporation + film boiling as two-phase flow heat conduction. It cannot provide fast heat conduction work in time for the high heat generated by high-power chips or bare chips. It is necessary to increase the boiling state in the vapor chamber to improve the overall heat transfer efficiency.

[0034] The present invention mainly adopts the method that when the main body 1 is heated, the plurality of convex portions 1121 can guide the evaporated working fluid 2 to be converted into steam and diffuse upward, and due to the low-lying areas formed between the convex portions 1121 and the small water pits (plural small pits or multiple small puddles) formed at the concave portion 1122, the large area where the original main body 1 and the working fluid 2 are in contact is divided into a plurality of small areas, and these small areas can increase the rapid boiling of water at small "nuclei" in the main body 1 after the working fluid 2 is heated (nucleate boiling phenomenon), so that the bubbles generated by the evaporation of the working fluid 2 can quickly break away and Evaporation forms the phenomena of pool boiling and flow boiling, and increases the drastic change of the two phases of the working fluid inside the main body 1. The difference between the main body 1 of the present case and the existing temperature equalizing plate is that the main body 1 of the present case has boiling phase changes such as pool boiling, film boiling, and flow boiling at the same time, which can accelerate the heat transfer phenomenon of the two-phase flow change, so that the temperature equalizing plate can immediately or instantly provide a temperature equalization effect. Compared with the existing traditional evaporation and film boiling heat transfer efficiency provided only by capillary structure, it is more significant. Therefore, compared with the traditional temperature equalizing plate, the present invention can also provide a kind of ability to produce drastic phase change and increase latent heat exchange.

Claims

1. A temperature-homing plate with a two-phase flow boiling enhancement structure, characterized in that: Include: A body, comprising a first plate and a second plate correspondingly covering each other to form an airtight chamber, the airtight chamber having a condensation side and an evaporation side, and the airtight chamber being filled with a working fluid, the surface of the evaporation side having a capillary structure, and the evaporation side having a plurality of convex portions and a plurality of concave portions, the convex portion penetrating through and protruding from the capillary structure, the concave portion being recessed under the capillary structure and not filled by the capillary structure, so as to form a space capable of accommodating the working fluid; The convex portion protrudes upward from the surface of the evaporation side to form a convex body, the top ends of the plurality of convex portions do not contact the aforementioned condensation side, and the concave portion is recessed downward toward the surface of the evaporation side to form a pit.

2. The temperature equalizing plate with enhanced two-phase flow boiling structure according to claim 1, characterized in that: The side of the main body opposite to the evaporation side contacts with at least one heat source to absorb heat, and the evaporation side has a heating zone corresponding to the heat source, and the plurality of convex parts and the plurality of concave parts are arranged in the heating zone.

3. The temperature homogenizing plate with enhanced two-phase flow boiling structure according to claim 1, characterized in that: A plurality of supporting structures are arranged in the airtight chamber, and two ends of the plurality of supporting structures are respectively connected to the condensation side and the evaporation side.

4. The temperature homogenizing plate with enhanced two-phase flow boiling structure according to claim 1, characterized in that: Either the convex portion or the concave portion is polygonal.

5. The temperature homogenizing plate with enhanced two-phase flow boiling structure according to claim 1, characterized in that: The top of the protrusion is in the form of an obtuse angle or an acute angle.

6. The temperature homogenizing plate with enhanced two-phase flow boiling structure according to claim 1, characterized in that: The capillary structure is any one or any combination of sintered powder, mesh body, and braided body.

7. The temperature homogenizing plate with enhanced two-phase flow boiling structure according to claim 1, characterized in that: The condensation side is formed on the inner surface of the first plate body, and the evaporation side is formed on the inner surface of the second plate body.

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