Includes solid-state switching devices embedded with control electronics

Abstract

Various embodiments of the present disclosure relate to solid-state switching devices including embedded control electronics. A solid-state switching device, such as a solid-state circuit breaker, includes at least one heat sink, a control electronics printed circuit board (PCB), and a power electronics device. The power electronics device is used to regulate the flow of current from one terminal to another terminal of the solid-state switching device. The power electronics device may include one or more solid-state devices, such as: FET, thyristor, parallel thyristor + SiC JFET, IGBT and IGCT. The control PCB may include various circuit elements for performing the function of a gate driver for activating the solid-state device of the power electronics device. The heat sink includes one or more signal vias, and the signal vias are formed through the heat sink to allow the control PCB to be embedded in the heat sink.

Description

Technical Field

[0001] The present disclosure relates generally to solid-state switching devices and, more particularly, but not exclusively, to solid-state circuit breakers having one or more heat sinks. Background Art

[0002] The present invention generally relates to power switches such as solid-state circuit breakers. Power systems need to protect the following items from damage by fault currents: power electronic device converters, energy storage systems, capacitor banks and other equipment. Solid-state circuit breakers can provide ultra-fast fault protection, load connection, and disconnection for various power-critical applications. Existing solid-state circuit breakers are affected by many disadvantages and shortcomings. There are still unmet needs, including reducing equipment costs and reducing power losses during fault-free operation. For example, conventional solid-state circuit breakers are more expensive and have greater conduction losses than traditional electromechanical circuit breakers. In view of these and other shortcomings in the art, there is a significant need for the unique devices, methods, systems and techniques disclosed herein. Some existing systems have various disadvantages with respect to certain applications. Therefore, there is still a need for further contributions in this field of technology. Summary of the invention

[0003] One embodiment of the present disclosure is a unique solid-state circuit breaker. Other embodiments include apparatus, systems, devices, hardware, methods, and combinations thereof to position control electronics relative to a heat sink of a solid-state circuit breaker. Additional embodiments, forms, features, aspects, benefits, and advantages of the present application should be derived from the description and drawings provided herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 One embodiment of a solid state switching device is depicted.

[0005] Figure 2 One embodiment of a heat sink is depicted.

[0006] Figure 3A and Figure 3B An embodiment of a solid-state circuit breaker is depicted.

[0007] Figure 4 An embodiment of a solid state switching device is depicted.

[0008] Figure 5 Another embodiment of a solid state switching device is depicted.

[0009] Figure 6 An embodiment of a signal via formed through a heat sink is depicted. DETAILED DESCRIPTION

[0010] In order to promote an understanding of the principles of the present invention, reference will now be made to the embodiments illustrated in the accompanying drawings, and specific language will be used to describe them. However, it should be understood that it is not intended to limit the scope of the present invention. Any changes and further modifications in the described embodiments, as well as any further applications of the principles of the present invention as described herein, are contemplated as would normally occur to a person skilled in the art to which the present invention relates.

[0011] refer to Figure 1 , a power switch 50 for regulating (e.g., interrupting) current between terminals 52 and 54 is shown. In some forms, the power switch 50 may take the form of a solid-state circuit breaker (SSCB). For ease of description below, reference will be made to the solid-state circuit breaker (SSCB) 50, but it should be understood that there is no limitation that the description below applicable to other types of power switches is limited to SSBCs. For example, in some embodiments, the SSCB 50 may alternatively be another type of power switch, just to name a few examples, including: a solid-state contactor, a state transfer switch, a multi-function disconnect switch, a quarter-connection interconnection switch, a bypass switch, another type of power switch configured to prevent faults, or another type of power switch that connects power to a load. It should also be understood that the SSCB 50 can be implemented in a variety of applications, just to name a few examples, including low-voltage DC distribution systems, medium-voltage DC distribution systems, AC distribution systems, data centers, and marine power systems. In some embodiments, the low voltage may include any voltage less than 1500V, and the medium voltage may include a voltage range between 1500V and 73kV.

[0012] The SSCB 50 includes terminals 52 and 54, and a heat sink and electronics package 56, which includes: a power electronic device 58, a control electronics printed circuit board (PCB) 60, and heat sinks 62 and 64 for removing heat from the power electronic device 58. Although two heat sinks 62 and 64 are illustrated, in some forms, the SSCB 50 may include only one heat sink. In addition, in some forms, one or both of the heat sinks 62 and 64 positioned on opposite sides of the power electronic device 58 may include multiple heat sinks that together form a cooperative heat sink for a particular side of the power electronic device 58. In these embodiments, these heat sinks that together form the cooperative heat sink for a particular side of the power electronic device 58 may be identical, but need not be identical. In Figure 1 The components depicted in the drawings may be arranged and stacked in a vertical manner as shown, but other embodiments may include other orderings and / or locations of components. For example, although the control electronics PCB 60 is shown arranged at the top of the component stack, in some forms, the control PCB 60 may be located lateral to at least the power electronics circuit 58.

[0013] The power electronics 58 includes a semiconductor switch configuration 66, which may include one or more semiconductor switch elements (two are shown in the schematic diagram for illustration purposes). The semiconductor switch element may take various forms, including, to name a few non-limiting examples, FET, thyristor, parallel thyristor + SiC JFET, IGBT, IGCT, or any other combination of these forms. The switch element 66 may be used to regulate the current between the terminals 52 and 54, such as, but not limited to, interrupting the current between the terminals 52 and 54. In some non-limiting embodiments, the SSCB 50 is bidirectional, so that current may flow from the terminal 52 to the terminal 54, or from the terminal 54 to the terminal 52. When turned on, the current may flow through the switch element 66 in a forward direction rather than in a backward direction, and in some forms, the current may flow in a reverse direction, and in yet other forms, the current may flow in both the forward and backward directions. The orientation of the plurality of independent switch elements 66 may ensure that the current flows from the terminal 52 to the terminal 54 through at least another element 66, and the current flows from the terminal 52 to the terminal 54 through at least another element 66. As will be appreciated by those skilled in the art, such a device may have separate elements 66 in an anti-parallel configuration. Examples of such circuit breakers may be found in U.S. Patent Application No. 16 / 707,426, filed December 9, 2019, which is incorporated herein by reference in its entirety.

[0014] A control PCB 60 is provided to monitor the current between the terminals 52 and 54, and to control the solid-state devices 66 of the power electronics 58 to regulate and / or interrupt the current. Such monitoring and / or control may occur via a communication link 67, which may take any form, including but not limited to pins, leads, or other types of conductive means that electrically connect the control PCB 60 to the power electronics 58 and / or other locations of the SSCB 52. It will also be appreciated by those skilled in the art that other forms and functions of the communication link 67 are further described below. The control PCB 60 may be comprised of digital circuit devices, analog circuit devices, or a hybrid combination of these two types, which may include any kind of conventional circuit elements, solid-state devices, etc. In one form, the control PCB 60 includes one or more gate drivers to activate the solid-state elements 66 of the power electronics 58.

[0015] The control PCB 60 includes a printed circuit board (PCB) 68, which can be used to mechanically support and interconnect various circuit elements 70 (for simplicity, only one circuit element 70 is shown, but it should be understood that the PCB 68 can include other elements 70). The PCB 68 can be arranged in a variety of arrangements, including single-sided (one copper layer), double-sided (two copper layers on both sides of the substrate layer), or multiple layers, to illustrate just a few non-limiting examples. The PCB 68 can be made of a variety of materials, generally dielectric in nature, which can include cloth and paper impregnated with thermosetting resins. Common substrate materials include: phenolic paper, woven fiberglass, polyimide foil, and polyimide-fluoropolymer composite foil.

[0016] In some forms, the printed circuit board 68 is relatively flat, has a relatively thin thickness and extends in a planar manner, but not all printed circuit boards need to be arranged in this manner. It should be understood that the printed circuit board can have a variety of cross-sectional shapes in the direction of its thickness, including: square, rectangular or another polygonal shape. For example, in Figure 1 In the schematic diagram shown, the PCB 68 is rectangular in shape, having a length along its larger dimension and a width along its shorter dimension. The thickness (not shown) is to be understood to extend to Figure 1 In some forms, the printed circuit board may be viewed as extending along an elongated axis (e.g., along its length and / or width) that lies within the plane of the planar shaped printed circuit board 68. Although the printed circuit board may extend along each of three separate axes, the elongated axis may be viewed as an extended axis that includes a larger dimension than the other extended axes, as shown in the side view of the accompanying drawings.

[0017] Heat sinks 62 and 64 may be attached to package 56 by welding, sintering, gluing, or screwing into place, etc. In addition, heat sinks 62 and 64 may cover the entire area of ​​power electronic device 58, or only a portion thereof. For example, heat sinks 62 and / or 64 may extend across the entire distance of one dimension of power electronic device 58 (e.g., its width), but may not extend across the entire distance of another dimension of power electronic device 58 (e.g., its length).

[0018] The heat sinks 62 and 64 may be made from a variety of materials using a variety of different manufacturing processes. For example, the heat sinks 62 and / or 64 may be made from a thermally conductive material such as a metal or a polymer. In one form further described below, the heat sinks 62 and 64 may include a base from which a plurality of individual heat sink fins 74 extend. The heat sinks 62 and 64 may be manufactured by bonding the heat sink fins to a base, the fins may be folded into shape and bonded / brazed / welded to the base, the fins may be stamped encapsulated with a die cast base, the fins may be forged into shape, the fins may be scraped onto the base, the fins may be machined from stock into an integral base and fins, the fins may be CNC machined, the fins may be extruded, etc. As shown in FIG. Figure 1 As shown, when installed, the base 72 of the heat sink 64 can extend parallel to the power electronic device package 58. Figure 1 In one form shown, the base 72 extends parallel to the power electronic device component 58, and the base 72 has a uniform thickness along the length and / or width of the heat sink, but not all forms of heat sinks need to include a base 72 of constant thickness. Therefore, the base 72 of the heat sink may include, for example, Figure 1 The elongated axis shown may be its length or width. Although the printed circuit board may extend along each of the three separate axes, the elongated axis, as shown in the side view of the drawings, may be considered to be an extended axis that includes a larger dimension than another extended axis.

[0019] The fins may take various forms, such as pins, foils, and posts. In this regard, the fins 74 may have a common cross-sectional shape along their respective lengths, but not all embodiments of the heat sink need to have a common shape in their respective fins 74. Two or more different shapes are also contemplated for the fins 74 in any given heat sink.

[0020] In some forms, the fins 74 may be equally spaced along the dimensions of the substrate (e.g., along its length and / or width), but not all forms need include equally spaced fins. In yet another embodiment, the fins may be equally spaced in a portion of the heat sink, while providing open space in another portion of the heat sink not occupied by the fins. In addition, the heat sinks 62 and 64 need not be made of the same material and / or need not be manufactured using the same process. In short, the heat sinks 62 and 64 may be different from each other.

[0021] The fins 74 may extend to a vertical height above the base 72 of the heat sink. In some forms, all of the fins 74 may extend to a common height above the base, but in other forms, the fins may extend to two or more different heights above the base 72. Figure 2One non-limiting embodiment of a heat sink is illustrated in , which illustrates a plurality of fins 74 extending from a base 72 .

[0022] Generally speaking, the heat sink and electronics package 56 is defined by a package envelope 76, which represents the volume space occupied by the package components. Figure 1 The dashed line identified by reference numeral 76 in FIG. 1 is conceptual only and is used only for Figure 1 The dashed line 76 is not reflected in the Figure 1 The actual volumetric encapsulation of the package 56 in the embodiment will be understood, but the concept nevertheless applies to an enclosure that can identify the components that contain the package 56, and some forms of the package 56 can be minimized by appropriate relative positioning and orientation of the constituent components (e.g., power electronics 58, control PCB 60, heat sinks 72 and / or 74), which reduces at least one of the width, height or depth of the package. In various forms, the control electronics PCB 60 can be mounted in a position close to one or both heat sinks so that the space occupied by the heat sink and the electronics package 56 is minimized.

[0023] Figure 3A and Figure 3B Two non-limiting embodiments of the SSCB 50 discussed herein are illustrated. Figure 3A , but it should be understood that other embodiments may have different dimensions. It should be understood that embodiments include a housing, and wherein the heat sink and electronic device package 56 are at least partially placed inside the housing (in some embodiments, may be completely placed inside the housing).

[0024] In applications with specific requirements for space and size, the development of solid-state circuit breakers involves the challenge of designing devices with miniaturized physical formats and capable of operating at high currents. The control PCB 60 can be arranged in various different orientations relative to the power electronic device 58, relative to the heat sink 62 and / or 64, and / or relative to the overall volume size of the heat sink and the electronic device package 56. The size of the heat sink and the electronic device package 56 should minimize the package envelope 76 to reduce one or more dimensions of the package and / or reduce the volume requirements required for merging the electronic switch device 50. The package size can include the height, width and depth defined by the various parts of the package. For example, the heat sink fan extending from the top heat sink base can define an edge, and the heat sink fan extending from the bottom heat sink base can define another edge, wherein the distance between the two edges defines the height of the package. The various attributes of the package can be derived from these constraints. For example, the size of the heat sink and the electronic device package can be such that the upper portion of the control electronics extends no more than the upper portion of the top heat sink.

[0025] Now go to Figure 4 , shows an embodiment of a heat sink and electronic device package 56 that includes a control PCB 60 positioned between laterally spaced heat sinks 74. The control PCB 60 is shown nested between two laterally spaced heat sinks 74 on either side of the control PCB 60, but it should be understood that if the heat sinks 74 are positioned as shown in FIG. Figure 2 In the form of separate heat sinks depicted in the matrix arrangement shown, the control PCB 60 can also be defined by additional heat sinks 74 distributed in and outside the page. It should also be understood that in some embodiments, one or more heat sinks can be across Figure 4 The images shown are front-side distribution and on the other side of the control PCB 60, in these embodiments, the control PCB 60 is positioned inside a set of heat sinks 74 distributed around the control PCB 60. In short, there are several different arrangements in which two or more heat sinks can surround the PCB 60.

[0026] As shown, the control PCB 60 is mounted horizontally relative to the heat sink 62. As used herein, the terms "vertical" and "horizontal" are used for simplicity of description and are not intended to convey precise limitations on the configuration of the SSCB 50 as installed. Figure 4 In the embodiment shown in FIG. 6 , the PCB 68 is aligned parallel to the base 72 of the heat sink 62, but in other forms, the PCB 68 may be arranged at an angle, including at a 90 degree angle (see, for example, FIG. 6A ). Figure 5 ).

[0027] The control PCB 60 may be connected to the power electronics 58 via one or more pins, leads, and other similar devices depicted at reference numeral 78 that serve as the communication link 67 described above. The following discussion will refer to reference numeral 78 as a pin, but it will be understood that any conductive device that connects the control PCB 60 to the power electronics 58 is contemplated herein. The pins 78 may have various thicknesses and configurations, and are shown extending through the heat sink 62 via signal vias 80 formed in the heat sink. The pins 78 are shown in conductive communication with one or more electronic paths shown in the figures in both the control PCB 60 and the power electronics 58.

[0028] The control PCB 60 may be offset from the heat sink 62 to provide some measure of insulation from the heat sink 62, fins 74, and / or substrate 72. In some forms, pins 78 are used to structurally support the control PCB 60 and provide an air gap offset from the substrate 72. In some forms, a physical insulator may be disposed between the control PCB 60 and the power electronics 58 in lieu of and / or in addition to the air gap.

[0029] exist Figure 4 The embodiment in also includes a thermal paste disposed between the power electronics 58 and each heat sink 62 and 64 to serve as a thermally conductive but electrically insulating material. The thermal paste can be used to bond the heat sink to the power electronics device. The thermal paste is used to eliminate air gaps or spaces from the interface area between the power electronics 58 and the sinks 62 and 64. Some forms of the SSCB 50 need not include such a material. For example, in some forms, the heat sink can be attached to the power electronics device using screws.

[0030] Figure 5 Another embodiment is depicted in which multiple separate control PCBs 60 are used to communicate and / or control the power electronics 58. The control PCBs 60 can be configured to each control the gate drive solid state devices of the power electronics 58. The PCBs 60 are each nested between adjacent fins 74. The control PCBs 60 are shown mounted relative to the heat sink 62. Figure 5 In the embodiment shown in FIG. 6 , the PCB 68 is aligned perpendicularly to the base 72 of the heat sink 62 , but in other forms, the PCB 68 may be arranged at other angles, including parallel to the base 72 .

[0031] In some forms, separate PCBs 60 may be positioned adjacent to one another, with the fins 74 positioned on the outside (e.g., Figure 5 60 are removed). The fins 74 may be positioned around the various PCBs 60 in a manner similar to the above-described embodiments (e.g., extending around the periphery of one or both of the PCBs 60). In some forms, the PCBs 60 may be identical, but not all forms need include identical PCBs 60. It should be understood that in Figure 5 In some embodiments, the encapsulation 76 extends to the top of the PCB 60. Figure 5 One or both of the PCBs 60 are completely located below the top of the fins 74. It should also be understood that the thin dimension (i.e., thickness) of the PCB 68 is as Figure 4 and Figure 5 As shown, the length and depth of PCB 68 extend into the page and / or extend out of the page. Figure 4 As shown, in Figure 5 Heat sink paste is arranged in the PCB, but in some forms, heat sink paste need not be present. It will also be understood that the pins 78 are in conductive communication with one or more circuit paths shown in the control PCB 60 and the power electronics device 58.

[0032] Figure 6An embodiment is depicted in which the pin 78 passes through a signal via 80 formed in the heat sink 62. The signal via 80 can take any different shape with any different cross-sectional dimensions. In some forms, an insulator 82 is disposed between the pin 78 and the wall of the signal via 80. The insulator 82 can be an electrical insulator, and in some forms can also be a thermal insulator. As described in the discussion of the air gap used as an insulator above, the insulator 82 can be air, a polymer / gel, etc. The insulator 82 can be installed after the insertion of the pin 78, but in some embodiments, the pin 78 can be pre-insulated and then inserted into the signal via 80.

[0033] One way to construct the package 56 of any of the embodiments disclosed herein includes attaching one or more heat sinks to the power electronics 58, inserting the pins 78 through the signal vias 80, and connecting the control PCB 60 to the power electronics 58. Prior to being inserted into the vias 80, the pins 78 may be pre-connected to either the power electronics 58 or the control PCB 60.

[0034] One aspect of the present application includes a device comprising: a solid-state current interrupt device having a first power terminal and a second power terminal, the solid-state current interrupt device comprising: a power electronic device module having at least one solid-state component for regulating the flow of current between the first power terminal and the second power terminal; a heat sink positioned in thermal contact with the power electronic device module so that heat generated from the power electronic device module is dissipated through the heat sink, the heat sink having a signal through hole formed in the heat sink, the signal through hole extending from a first side of the heat sink to a second side of the heat sink; and a control electronic device printed circuit board configured to provide a control signal to at least one solid-state component of the power electronic device module; wherein the power electronic device parallel is placed on the first side of the heat sink, wherein the control electronic device printed circuit board is placed on the second side of the heat sink, and wherein a signal-carrying conductive lead is positioned in the signal through hole, the signal-carrying conductive lead is electrically connected to the control electronic device printed circuit board at one end, and is electrically connected to the power electronic device at an opposite end of the signal-carrying conductive lead.

[0035] Features of the present application include that at least one of the solid-state components is a gate drive component for stopping current flow.

[0036] Another feature of the present application includes where the at least one solid-state component is in the form of one of the following: a FET, a thyristor, an IGBT, and a RB-IGCT, and where the solid-state current interrupting device is a solid-state circuit breaker.

[0037] A feature of the present application includes wherein the thermal heat sink includes a plurality of heat sink fins extending from a base of the heat sink, wherein the heat sink includes a heat sink fin on a first lateral side of the heat sink, and the heat sink includes a second heat sink fin on an opposite second lateral side of the heat sink, and wherein a control electronics printed circuit board is positioned between the first heat sink fin and the second heat sink fin.

[0038] Yet another additional feature of the present application includes wherein each of the plurality of control electronics printed circuit boards is each disposed between adjacent ones of the plurality of heat sink fins.

[0039] Still another additional feature of the present application includes where the control electronics printed circuit board includes a top surface and a bottom surface, the bottom surface of the control electronics printed circuit board is offset from the heat sink such that transfer of thermal energy from the heat sink to the control electronics printed circuit board is inhibited.

[0040] Yet another additional feature of the present application includes wherein a thermal insulator is disposed between the control electronics printed circuit board and the heat sink.

[0041] Additional features of the present application include wherein the signal carrying conductive lead positioned in the signal via is in the form of one of a pin and a terminal.

[0042] Yet another additional feature of the present application includes wherein the signal carrying conductive leads are isolated from the heat sink by an electrical insulator.

[0043] Still another additional feature of the present application includes where the signal carrying conductive leads are configured to structurally support the control electronics printed circuit board such that an offset from the heat sink is maintained through the signal carrying conductive leads.

[0044] Another aspect of the present application includes a device including a solid-state circuit breaker configured to monitor current flow in a circuit connection between a power input and a power output, the solid-state circuit breaker including a heat sink and an electronic device package, the heat sink and the electronic device package including: a power electronic device module including at least one switchable solid-state device, a heat sink having a plurality of laterally spaced heat sink fins extending from a base of the heat sink, and a control electronic device printed circuit board, the control electronic device printed circuit board being configured to monitor current flow between the power input and the power output and to issue a control signal to at least one switchable solid-state component to disconnect the circuit connection, wherein at least a majority of the volume of the control electronic device printed circuit board is positioned between two of the laterally spaced heat sink fins, and at least a majority of the volume of the control electronic device printed circuit board is vertically placed between at least one end of the laterally spaced heat sink fins and the base.

[0045] Features of the present application include wherein the heat sink includes a signal via formed through the thickness of the heat sink, and wherein a signal carrying conductive lead is positioned in the signal via and the signal carrying conductive lead is electrically connected to a control electronics printed circuit board and a power electronics module.

[0046] Another feature of the present application includes wherein the control electronics printed circuit board includes an elongated extension axis oriented parallel to the base of the heat sink.

[0047] Another feature of the present application includes wherein the base of the heat sink extends along a base axis that is perpendicular to an extension axis of a control electronics printed circuit board, wherein the control electronics printed circuit board includes an elongated extension axis that is angled relative to the base of the plurality of laterally spaced heat sink fins.

[0048] Yet another feature of the present application includes where the heat sink and electronics package are defined by a height, a width, and a depth, and where the control electronics printed circuit board is positioned so that it is completely within the height, width, and depth of the heat sink and electronics package.

[0049] Yet another feature of the present application includes wherein the heat sink includes a plurality of signal vias formed through a thickness of the heat sink, and wherein the solid-state current interrupt device includes a plurality of control electronics printed circuit boards, each of the plurality of control electronics printed circuit boards being coupled to a power electronics module.

[0050] Yet another additional feature of the present application includes where the heat sink and electronics package includes a plurality of control electronics printed circuit boards.

[0051] Yet another additional feature of the present application includes wherein each control electronics printed circuit board of the plurality of control electronics printed circuit boards is located between respective adjacent fins of the plurality of laterally spaced heat sink fins.

[0052] Yet another additional feature of the present application also includes a plurality of signal vias formed through a thickness of the heat sink.

[0053] Additional features of the present application include where the heat sink and electronic device package includes another heat sink positioned adjacent to the power electronic device module with the plurality of laterally spaced heat sink fins.

[0054] Yet another aspect of the present application includes a method comprising: attaching a first heat sink to a power electronic device module, the first heat sink including a signal through hole formed through the first heat sink; embedding a control electronic device printed circuit board between laterally spaced fins of the heat sink, the laterally spaced fins extending from a base of the heat sink; positioning a signal-carrying conductive lead in the signal through hole of the first heat sink; and electrically connecting the control electronic device printed circuit board to the power electronic device module via the signal-carrying conductive lead.

[0055] The present application also includes the following features: attaching a second heat sink to the power electronic device module opposite to the first heat sink, the second heat sink module including a plurality of second heat sink fins.

[0056] Another feature of the present application also includes insulating the signal carrying conductive leads from the base of the heat sink.

[0057] Although the present invention has been described and described in detail in the drawings and the foregoing description, it should be considered illustrative rather than restrictive, and it should be understood that only preferred embodiments are shown and described, and it is desired to protect all changes and modifications within the spirit of the present invention. It should be understood that although the use of words such as preferred, preferably, preferred or more preferred in the above description indicates that the features described in this way may be more ideal, it may not be necessary, and embodiments lacking this description may be considered within the scope of the present invention, and the scope of the present invention is defined by the scope of the following claims. When reading the claims, it is intended that when words such as "one", "one", "at least one" or "at least a portion" are used, unless the opposite revelation is clearly indicated in the claims, it is not intended to limit the claims to only one item. If the language of "at least a portion" and / or "a portion" is used, the item may include a portion and / or the entire item unless otherwise expressly stated. Unless otherwise specified or limited, terms such as "mounting", "connection", "support" and "coupling" and their variations are widely used, including direct and indirect mounting, connection, support and coupling. In addition, "connection" and "coupling" are not limited to physical or mechanical connection or coupling.

Claims

1. An apparatus comprising a solid-state switching device, comprising: A solid-state current interrupt device having a first power terminal and a second power terminal, the solid-state current interrupt device comprising: a power electronics module having at least one solid-state component for regulating the flow of current between the first power terminal and the second power terminal; a heat sink positioned in thermal contact with the power electronics module such that heat generated from the power electronics module is dissipated through the heat sink, the heat sink having a signal via formed therein and extending from a first side of the heat sink to a second side of the heat sink; and at least one control electronics printed circuit board configured to provide control signals to the at least one solid-state component of the power electronics module; wherein the power electronics module is placed on the first side of the heat sink, wherein the at least one control electronics printed circuit board is placed on the second side of the heat sink, and wherein a signal carrying conductive lead is positioned in the signal through hole, and the signal carrying conductive lead is electrically connected to the at least one control electronics printed circuit board on one end and to the power electronics on an opposite end of the signal carrying conductive lead. 2 . The apparatus of claim 1 , wherein the at least one solid-state component is a gate drive component for stopping current flow.

3. The apparatus of claim 2, wherein the at least one solid-state component is in the form of one of the following: a FET, a thyristor, an IGBT, and a RB-IGCT, and wherein the solid-state current interrupting device is a solid-state circuit breaker.

4. The apparatus of claim 1 , wherein the heat sink comprises a plurality of heat sink fins extending from a base of the heat sink, wherein the heat sink comprises a first heat sink fin on a first lateral side of the heat sink, and wherein the heat sink comprises a second heat sink fin on an opposite second lateral side of the heat sink, and wherein the at least one control electronics printed circuit board is positioned between the first heat sink fin and the second heat sink fin.

5. The apparatus of claim 4, wherein the at least one control electronics printed circuit board comprises a plurality of control electronics printed circuit boards, and each of the plurality of control electronics printed circuit boards is respectively arranged between adjacent ones of the plurality of heat sink fins.

6. The device of claim 1 , wherein the at least one control electronics printed circuit board comprises a top surface and a bottom surface, the bottom surface of the at least one control electronics printed circuit board being offset from the heat sink so that transfer of thermal energy from the heat sink to the at least one control electronics printed circuit board is inhibited.

7. The apparatus of claim 1, wherein a thermal insulator is disposed between the at least one control electronics printed circuit board and the heat sink. 8 . The apparatus of claim 1 , wherein the signal carrying conductive lead positioned in the signal via is in the form of one of a pin and a terminal.

9. The apparatus of claim 8, wherein the signal carrying conductive leads are isolated from the heat sink by an electrical insulator.

10. The apparatus of claim 8, wherein the signal carrying conductive leads are configured to structurally support the at least one control electronics printed circuit board such that an offset from the heat sink is maintained by the signal carrying conductive leads.

11. An apparatus comprising a solid-state switching device, comprising: A solid-state circuit breaker configured to monitor current flow in a circuit connection between a power input and a power output, the solid-state circuit breaker comprising a heat sink and an electronics package, the heat sink and electronics package comprising: a power electronics module including at least one switchable solid-state component, a heat sink having a plurality of laterally spaced heat sink fins extending from a base of the heat sink, and at least one control electronics printed circuit board configured to monitor current flow between the power input and the power output and to issue a control signal to the at least one switchable solid-state component to disconnect the circuit connection, wherein at least a majority of the volume of the at least one control electronics printed circuit board is positioned between two of the laterally spaced heat sink fins, and at least a majority of the volume of the control electronics printed circuit board is vertically disposed between at least one end of the laterally spaced heat sink fins and the base; wherein the heat sink comprises a signal via formed through a thickness of the heat sink, and wherein a signal carrying conductive lead is positioned in the signal via and is electrically connected to the at least one control electronics printed circuit board and the power electronics module.

12. The apparatus of claim 11, wherein the at least one control electronics printed circuit board includes an elongated axis of extension oriented parallel to the base of the heat sink.

13. The apparatus of claim 11, wherein the base of the heat sink extends along a base axis that is perpendicular to an extension axis of the at least one control electronics printed circuit board, wherein the at least one control electronics printed circuit board includes an elongated extension axis that is angled relative to a base of the plurality of laterally spaced heat sink fins.

14. The apparatus of claim 11, wherein the heat sink and electronics package are defined by a height, a width, and a depth, wherein the at least one control electronics printed circuit board is positioned so that it is completely within the height, width, and depth of the heat sink and electronics package.

15. The apparatus of claim 11, wherein the heat sink comprises a plurality of signal vias formed through a thickness of the heat sink, and wherein the solid-state circuit breaker comprises a plurality of control electronics printed circuit boards, each of the plurality of control electronics printed circuit boards being coupled to the power electronics module.

16. The apparatus of claim 11, wherein the heat sink and electronics package comprises a plurality of control electronics printed circuit boards.

17. The apparatus of claim 16, wherein the at least one control electronics printed circuit board comprises a plurality of control electronics printed circuit boards, and each of the plurality of control electronics printed circuit boards is located between corresponding adjacent fins of the plurality of laterally spaced heat sink fins.

18. The apparatus of claim 17, further comprising a plurality of signal vias formed through a thickness of the heat sink.

19. The apparatus of claim 11, wherein the heat sink and electronics package includes another heat sink positioned adjacent to the power electronics module opposite the heat sink having the plurality of laterally spaced heat sink fins.

20. A method for installing a solid-state switching device, comprising: attaching a first heat sink to a power electronics module, the first heat sink comprising a signal via formed through the first heat sink; nesting at least one control electronics printed circuit board between laterally spaced fins of the heat sink, the laterally spaced fins extending from a base of the heat sink; positioning a signal carrying conductive lead in the signal through hole of the first heat sink; as well as The at least one control electronics printed circuit board is electrically connected to the power electronics module using the signal carrying conductive leads.

21. The method according to claim 20, further comprising: A second heat sink is attached to the power electronics module opposite the first heat sink, the second heat sink including a second plurality of heat sink fins.

22. The method according to claim 20, further comprising: The signal carrying conductive leads are insulated from the base of the heat sink.

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