Chip on film, display device, method and apparatus for manufacturing chip on film

Abstract

The present application relates to a chip on film for a display device, a display device, a method and apparatus for manufacturing a chip on film. The chip on film includes a base substrate, a lead disposed on the base substrate, and a driving chip connected to the lead, wherein the lead includes a first lead portion having a first thickness, and a second lead portion disposed between the first lead portion and the driving chip and having a second thickness greater than the first thickness, the second lead portion being connected to the driving chip. The first lead portion and the second lead portion include the same material.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0069111, filed on June 8, 2020, which is incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to display devices, and more specifically, to a chip-on-film including leads, a display device having the chip-on-film, a method for manufacturing the chip-on-film, and an apparatus for manufacturing the chip-on-film. Background Technology

[0004] A liquid crystal display (LCD) device, one of the most commonly used display devices, comprises two substrates and a liquid crystal layer disposed between the two substrates. Field generation electrodes, such as pixel electrodes and common electrodes, are formed on the substrates. To display an image, a voltage is applied to the field generation electrodes to generate an electric field across the liquid crystal layer. The liquid crystal molecules in the liquid crystal layer are aligned by the electric field to control the polarization of incident light.

[0005] In liquid crystal display devices, vertically oriented liquid crystal display devices have attracted attention due to their high contrast ratio and ease of achieving a wide reference viewing angle. In vertically oriented liquid crystal display devices, liquid crystal molecules are arranged such that their long axes are perpendicular to the upper and lower display panels when no electric field is applied.

[0006] The information disclosed in this background section is only for understanding the background technology of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0007] Since each of the leads includes a first guide portion having a first thickness and a second guide portion having a second thickness greater than the first thickness, the chip-on-film and the display device having the chip-on-film constructed according to the principles and exemplary implementations of the present invention can prevent short circuits between the leads.

[0008] The method for manufacturing a chip-on-film according to the principles and exemplary implementations of the present invention can manufacture a chip-on-film in which short circuits between leads are prevented.

[0009] The apparatus for manufacturing chip-on-film, constructed according to the principles and exemplary implementations of the present invention, is capable of manufacturing chip-on-film in which short circuits between leads are prevented.

[0010] Other features of the inventive concept will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practice of the inventive concept.

[0011] According to an aspect of the present invention, a chip-on-film for a display device is provided, the chip-on-film comprising: a base substrate; leads disposed on the base substrate; and a driving chip connected to the leads, wherein the leads comprise: a first guiding portion having a first thickness; and a second guiding portion disposed between the first guiding portion and the driving chip, and having a second thickness greater than the first thickness, the second guiding portion being connected to the driving chip. The first guiding portion and the second guiding portion comprise the same material.

[0012] One end of the first guiding portion can be aligned with one end of the base substrate.

[0013] The first guide portion can extend from the second guide portion along the first direction, and the lead wire can include multiple lead wires, and the multiple lead wires can be arranged along a second direction that intersects the first direction.

[0014] The second guide portion may include a curved portion, and the second guide portion may extend from the portion connected to the driver chip along a direction intersecting the first direction and the second direction, and may then extend from the curved portion along the first direction.

[0015] The first thickness can be approximately 80% or less of the second thickness.

[0016] The surface of the first guiding portion may include a carbonized surface.

[0017] The surface of the first guide portion may include surface irregularities, and the surface roughness of the first guide portion may be greater than the surface roughness of the second guide portion.

[0018] One surface of the base substrate may include a first base surface disposed overlapping the first guide portion, and a second base surface between adjacent first guide portions. The second base surface may include a first sub-base surface spaced apart from the first base surface, and a second sub-base surface located between the first sub-base surface and the first base surface. The second sub-base surface may include a carbonized surface.

[0019] The surface of the base substrate may include a first base surface overlapping the first guide portion and a second base surface between adjacent first guide portions. The second base surface may include a first sub-base surface spaced apart from the first base surface and a second sub-base surface located between the first sub-base surface and the first base surface. The second sub-base surface may include surface irregularities, and the roughness of the second sub-base surface may be greater than each of the roughness of the first base surface and the roughness of the first sub-base surface.

[0020] The base substrate may include a first base portion overlapping the first guide portion and a second base portion between adjacent first guide portions. The second base portion may include a first sub-base portion spaced apart from the first base portion and a second sub-base portion located between the first sub-base portion and the first base portion. The thickness of the second sub-base portion may be less than each of the thickness of the first base portion and the thickness of the first sub-base portion.

[0021] The leads can make direct contact with the base substrate.

[0022] According to another aspect of the present invention, a display device includes: a first substrate including a display base substrate and pads disposed on the display base substrate; and a chip-on-film (chip-on-film) connected to the pads, wherein the chip-on-film includes: a base substrate; leads disposed on the base substrate and connected to the pads; and a driver chip connected to the leads, wherein the leads include: a first guiding portion having a first thickness; and a second guiding portion disposed between the first guiding portion and the driver chip, and having a second thickness greater than the first thickness, the second guiding portion being connected to the driver chip. The first guiding portion and the second guiding portion are made of the same material.

[0023] One end of the first guiding portion can be aligned with one end of the base substrate.

[0024] The first guide portion and a portion of the second guide portion can be connected to the pads.

[0025] The display device may also include an anisotropic conductive film disposed between the leads and the pads. The leads can be electrically connected to the pads through the anisotropic conductive film.

[0026] According to another aspect of the present invention, a method for manufacturing a chip-on-film for a display device is provided, the method comprising the steps of: preparing a master film, the master film defining a first portion and a second portion, wherein the first portion corresponds to the inner side of a dicing line having a rectangular frame shape, and the second portion corresponds to the outer side of the dicing line, the master film including a driving chip and leads, wherein the driving chip is mounted on the first portion, and the leads have an inner wiring portion disposed in the first portion and connected to the driving chip, and an outer wiring portion disposed in the second portion and connected to the inner wiring portion; laser processing a portion of the inner wiring portion adjacent to the dicing line; and cutting the master film along the dicing line.

[0027] In the step of preparing the mother film: the outer wiring portion of the cutting line can extend from the inner wiring portion of the cutting line along a first direction, the lead wire can include multiple leads, and the multiple leads can be arranged along a second direction that intersects the first direction.

[0028] In the step of preparing the mother film: the outer wiring portion of the cutting line may include: a first outer wiring portion of the cutting line having a first width; and a second outer wiring portion of the cutting line having a second width greater than the first width.

[0029] After performing laser processing on the portion of the wiring section adjacent to the dicing line, the method may further include the following steps: forming a first guide portion adjacent to the dicing line and having a first thickness, and a second guide portion disposed between the first guide portion and the driver chip and having a second thickness greater than the first thickness.

[0030] According to another aspect of the invention, an apparatus for manufacturing a chip-on-film for a display device is provided, the apparatus comprising: a roll supply unit configured to supply a master film, the master film defining a first portion and a second portion, wherein the first portion corresponds to the inner side of a dicing line having a rectangular frame shape, and the second portion corresponds to the outer side of the dicing line; the master film including a driving chip and leads, wherein the driving chip is mounted on the first portion, and the leads have an inner wiring portion disposed in the first portion and connected to the driving chip, and an outer wiring portion disposed in the second portion and connected to the inner wiring portion; a laser unit configured to laser process a portion of the inner wiring portion of the master film supplied from the roll supply unit that is adjacent to the dicing line; and a cutting unit configured to cut the master film processed by the laser unit along the dicing line.

[0031] It will be understood that both the foregoing overview and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0032] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the specification, serve to illustrate the inventive concept.

[0033] Figure 1 This is a plan view of an exemplary embodiment of a chip-on-film constructed according to the principles of the present invention.

[0034] Figure 2 It is along Figure 1 A cross-sectional view of the first exemplary embodiment, taken by line I-I'.

[0035] Figure 3 It is along Figure 1 A cross-sectional view of the first exemplary embodiment, taken by line II-II'.

[0036] Figure 4 It is along Figure 1 A cross-sectional view of the second exemplary embodiment, taken by line I-I'.

[0037] Figure 5 It is along Figure 1 A cross-sectional view of the second exemplary embodiment, taken by line II-II'.

[0038] Figure 6 It is along Figure 1 A cross-sectional view of the third exemplary embodiment, taken by line I-I'.

[0039] Figure 7 It is along Figure 1 A cross-sectional view of the third exemplary embodiment, taken from line II-II'.

[0040] Figure 8 This is a cross-sectional view of another exemplary embodiment of chip-on-film.

[0041] Figure 9 This is a cross-sectional view of yet another exemplary embodiment of a chip-on-film.

[0042] Figure 10 This is a cross-sectional view of yet another exemplary embodiment of a chip-on-film.

[0043] Figure 11 This is a flowchart of an exemplary embodiment of a method for manufacturing a chip-on-film according to the principles of the present invention.

[0044] Figure 12 It is shown Figure 11 A plan view of one process step in the method of manufacturing chip-on-film.

[0045] Figure 13 It is along Figure 12The sectional view taken from line III-III'.

[0046] Figure 14 and Figure 15 It shows the manufacturing process. Figure 11 Cross-sectional view of other process steps in the chip-on-film method.

[0047] Figure 16 This is a plan view of an exemplary embodiment of a display device constructed according to the principles of the present invention.

[0048] Figure 17 It is along Figure 16 A sectional view taken from line IV-IV'.

[0049] Figure 18 It is along Figure 16 A sectional view taken by line V-V'.

[0050] Figure 19 This is a cross-sectional view of another exemplary embodiment of the display device.

[0051] Figure 20 This is a cross-sectional view of yet another exemplary embodiment of the display device.

[0052] Figure 21 This is a block diagram of an exemplary embodiment of an apparatus for manufacturing chips on a film, constructed according to the principles of the present invention. Detailed Implementation

[0053] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatuses or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other examples, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, a particular shape, configuration, and characteristic of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0054] Unless otherwise stated, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects (hereinafter individually or collectively referred to as “elements”) of various embodiments may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0055] The use of crosshairs and / or shading in the accompanying drawings is generally to clarify the boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between illustrated elements, and / or any other characteristics, properties, or characteristics of the elements. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, the specific order of processes may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description. Furthermore, the same reference numerals denote the same elements.

[0056] When an element, such as a layer, is referred to as being "on," "connected to," or "attached to" another element or layer, it may be directly on, directly connected to, or attached to the other element or layer, or there may be an intermediate element or layer. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly attached to" another element or layer, there is no intermediate element or layer. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection, with or without an intermediate element. Furthermore, the DR1, DR2, and DR3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the DR1, DR2, and DR3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the set consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0057] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0058] Spatial relative terms such as “beneath,” “below,” “under,” “lower,” “above,” “upper,” “over,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and thus to describe the relationship of one element to another(s) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will then be oriented “above” other elements or features. Thus, the exemplary term “below” can cover both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and thus the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0059] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, as used herein. Furthermore, when used in this specification, the terms “comprising,” “including,” “including,” and / or “comprising” indicate the presence of stated features, integrals, steps, operations, elements, components, and / or sets thereof, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or sets thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than terms of degree, and are therefore used to allow for inherent deviations in measurements, calculated values, and / or provided values ​​that will be recognized by those skilled in the art.

[0060] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0061] Figure 1 This is a plan view of an exemplary embodiment of a chip-on-film constructed according to the principles of the present invention.

[0062] Reference Figure 1 Chip-on-film (COF) can be applied to display devices, which will be described later. COF may include a base substrate (BS), a driver chip IC on the base substrate (BS), and leads (LE) on the base substrate (BS) connected to the driver chip IC.

[0063] The base substrate BS can support the driver chip IC and the leads LE. The base substrate BS can be formed of an insulating material such as a polymer resin. Examples of polymer materials may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof. The base substrate BS may include polyimide (PI). However, exemplary embodiments are not limited thereto, and the base substrate BS may be a rigid substrate made of glass, quartz, etc.

[0064] The base substrate BS can have a rectangular shape. The base substrate BS can include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. The first direction DR1 can be the horizontal direction of the on-film chip COF, and the second direction DR2 can be the vertical direction of the on-film chip COF, which intersects with the first direction DR1.

[0065] The corner where the short and long sides of the base substrate BS intersect can be angled. However, it is not limited to this; it can be rounded.

[0066] The planar shape of the base substrate BS is not limited to this and can be square, circular, elliptical, or other polygonal shapes. In the following description, the base substrate BS will be described under the assumption that it has a rectangular shape in a planar view.

[0067] The driver chip IC can be located in the central portion of the base substrate BS. The driver chip IC can be used to transmit data voltages, data control signals, or scan control signals to the display device via leads LE.

[0068] The lead LE may include a first guide portion LE1 and a second guide portion LE2. The second guide portion LE2 may be disposed between the first guide portion LE1 and the driver chip IC. The first guide portion LE1 and the second guide portion LE2 may be physically connected. The first guide portion LE1 may extend along a first direction DR1 from the point connected to the second guide portion LE2. The second guide portion LE2 may be connected to the driver chip IC.

[0069] One end of the first guiding portion LE1 can be aligned with one end of the base substrate BS. For example, one end of the first guiding portion LE1 can be aligned with the long edge of the base substrate BS.

[0070] The second guide portion LE2 and the first guide portion LE1 can have different thicknesses. This will be discussed later. Figure 2 and Figure 3 Describe it.

[0071] For example, each of the first guide portion LE1 and the second guide portion LE2 may include at least one metal selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). In one exemplary embodiment, the first guide portion LE1 and the second guide portion LE2 may include the same material. For example, the first guide portion LE1 and the second guide portion LE2 may include copper (Cu).

[0072] Multiple leads LE can be provided. The multiple leads LE can be arranged along the second direction DR2. At least one of the multiple second guide portions LE2 may include a bent portion. For example... Figure 1 As shown, located Figure 1 The second guide portion LE2 on the left side of the plane can extend from the driver chip IC along the direction between the first direction DR1 and the second direction DR2 (e.g., from the driver chip IC along the lower left direction), and can then be bent in the curved portion to extend along the first direction DR1. Located in Figure 1 The second guide portion LE2 on the right side of the plane can extend from the driver chip IC along the direction between the first direction DR1 and the second direction DR2 (e.g., from the driver chip IC along the lower right direction), and can then be bent in the curved portion to extend along the first direction DR1. Located in Figure 1 The second guide portion LE2 in the central part of the plane can extend from the driver chip IC along the first direction DR1.

[0073] In the multiple leads LE, the portions of the first guide portion LE1 and the second guide portion LE2 adjacent to the first guide portion LE1 can form a circuit pad region PA_C. As described below, the circuit pad region PA_C can overlap with the pads of the display device in the thickness direction and can be connected to the pads of the display device.

[0074] Figure 2 It is along Figure 1 A cross-sectional view of the first exemplary embodiment, taken by line I-I'. Figure 3 It is along Figure 1 A cross-sectional view of the first exemplary embodiment, taken by line II-II'.

[0075] Reference Figure 2 and Figure 3 The lead LE can be directly placed on one surface BSa of the base substrate BS. (See above reference.) Figure 1 As described, the first guide portion LE1 and the second guide portion LE2 can have different thicknesses than each other. For example, the first guide portion LE1 can have a first thickness t1, and the second guide portion LE2 can have a second thickness t2. The second thickness t2 can be greater than the first thickness t1. In other words, the first thickness t1 can be less than the second thickness t2. The surface LE1a of the first guide portion LE1 can be positioned as a surface BSa closer to the base substrate BS than the top surface of the second guide portion LE2.

[0076] For example, the first thickness t1 can be about 80% or less of the second thickness t2. In an exemplary embodiment, the first thickness t1 can be about 20% to about 80% of the second thickness t2. For example, the second thickness t2 can be about 8 μm and the first thickness t1 can be about 4 μm, but they are not limited thereto. In the lead LE, the second guide portion LE2 having the second thickness t2 and the first guide portion LE1 having the first thickness t1 less than the second thickness t2 can be formed by a laser process described later.

[0077] Reference Figure 3 Adjacent first guide portions LE1 can be spaced apart from each other.

[0078] According to an exemplary embodiment, the lead LE includes a second guiding portion LE2 having a second thickness t2, and a first guiding portion LE1 having a first thickness t1 that is less than the second thickness t2. Therefore, when the on-film chip COF is cut along the dicing line on a mother film basis, the lead LE can be pushed less because the first guiding portion LE1 corresponding to the dicing line has a small thickness. This prevents short circuits between adjacent leads LE. Furthermore, because the first guiding portion LE1 has a small thickness, the on-film chip COF can be cut on a mother film basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0079] In the following, another exemplary embodiment of the above-described chip-on-film (COF) will be described. In the exemplary embodiments below, the same components as those in the above exemplary embodiments are indicated by the same reference numerals, and their descriptions will be omitted or simplified.

[0080] Figure 4 It is along Figure 1 A cross-sectional view of the second exemplary embodiment, taken by line I-I'. Figure 5 It is along Figure 1 A cross-sectional view of the second exemplary embodiment, taken by line II-II'.

[0081] Reference Figure 4 and Figure 5 COF_1 on the membrane chip and Figures 1 to 3 The difference between the chip-on-film (COF) and the lead LE_1 is that the lead LE_1 includes a first guide portion LE1_1 and a second guide portion LE2, and the surface LE1a_1 of the first guide portion LE1_1 includes a carbonized surface.

[0082] That is, the lead LE_1 of the on-film chip COF_1 may include a first guide portion LE1_1 and a second guide portion LE2.

[0083] The surface LE1a_1 of the first guiding portion LE1_1 may include a carbonized surface. For example... Figure 4 and Figure 5 As shown, during the laser process, a carbonized surface can be generated on the surface LE1a_1 of the first guide portion LE1_1 due to the intensity of the laser and the processing time.

[0084] According to the exemplary embodiment shown, lead LE_1 includes a second guide portion LE2 having a second thickness t2, and a first guide portion LE1_1 having a first thickness t1 less than the second thickness t2. Therefore, when the on-film chip COF_1 is cut along the dicing line on a mother film basis, the lead LE_1 can be pushed less due to the small thickness of the first guide portion LE1_1 corresponding to the dicing line. This prevents short circuits between adjacent leads LE_1. Furthermore, because the first guide portion LE1_1 has a small thickness, the on-film chip COF_1 can be cut on a mother film basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0085] Figure 6 It is along Figure 1 A cross-sectional view of the third exemplary embodiment, taken by line I-I'. Figure 7 It is along Figure 1 A cross-sectional view of the third exemplary embodiment, taken from line II-II'.

[0086] Reference Figure 6 and Figure 7 COF_2 on the film chip and Figures 1 to 3 The difference between the chip-on-film (COF) and the lead LE_2 is that the lead LE_2 includes a first guide portion LE1_2 and a second guide portion LE2, and the surface LE1a_2 of the first guide portion LE1_2 includes a surface irregularity.

[0087] That is, the lead LE_2 of the on-film chip COF_2 may include a first guide portion LE1_2 and a second guide portion LE2.

[0088] The surface LE1a_2 of the first guiding portion LE1_2 may include surface irregularities. For example... Figure 6 and Figure 7 As shown, during the laser process, due to the laser intensity and processing time, surface irregularities can be generated on the surface LE1a_2 of the first guide portion LE1_2. In other words, the surface roughness of the first guide portion LE1_2, LE1a_2, can be greater than the surface roughness of the second guide portion LE2.

[0089] According to the exemplary embodiment shown, lead LE_2 includes a second guide portion LE2 having a second thickness t2 and a first guide portion LE1_2 having a first thickness t1 less than the second thickness t2. Therefore, when the on-film chip COF_2 is cut along the dicing line on a mother film basis, the lead LE_2 can be pushed less because the first guide portion LE1_2 corresponding to the dicing line has a small thickness. Thus, short circuits between adjacent leads LE_2 can be prevented. Furthermore, because the first guide portion LE1_2 has a small thickness, the on-film chip COF_2 can be cut on a mother film basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0090] Figure 8 This is a cross-sectional view of another exemplary embodiment of a chip-on-film. For example, Figure 8 It can correspond to Figure 3 , Figure 5 and Figure 7 A sectional view.

[0091] Reference Figure 8 According to the exemplary embodiment shown, the chip-on-film and Figures 1 to 3 The difference in the chip-on-film (COF) is that one surface BSa_1 of the base substrate BS_1 includes a first base surface BSa1_1 overlapping with the first guide portion LE1, and second base surfaces BSa2_1 and BSa3_1 between adjacent first guide portions LE1. The second base surfaces BSa2_1 and BSa3_1 include a first sub-base surface BSa2_1 spaced apart from the first base surface BSa1_1, and a second sub-base surface BSa3_1 located between the first sub-base surface BSa2_1 and the first base surface BSa1_1. The second sub-base surface BSa3_1 includes a carbonized surface.

[0092] That is, a surface BSa_1 of the base substrate BS_1 of the chip-on-film according to the exemplary embodiment shown may include a first base surface BSa1_1 overlapping with the first guide portion LE1, and second base surfaces BSa2_1 and BSa3_1 between adjacent first guide portions LE1, and the second base surfaces BSa2_1 and BSa3_1 may include a first sub-base surface BSa2_1 spaced apart from the first base surface BSa1_1, and a second sub-base surface BSa3_1 located between the first sub-base surface BSa2_1 and the first base surface BSa1_1.

[0093] like Figure 8 As shown, the second sub-base surface BSa3_1 may include a carbonized surface.

[0094] Due to the above references Figure 2 and Figure 3 The laser process for the first guiding portion LE1 is performed with process margin in mind, so that a carbonized surface of the second sub-base surface BSa3_1 can be generated in a portion of a surface BSa_1 of the base substrate BS_1 adjacent to the first guiding portion LE1.

[0095] According to the exemplary embodiment shown, the lead LE includes a second guide portion LE2 having a second thickness t2, and a first guide portion LE1 having a first thickness t1 that is less than the second thickness t2. Therefore, when the on-film chip is cut along the dicing line on a per-mold basis, the lead LE can be pushed less because the first guide portion LE1 corresponding to the dicing line has a small thickness. This prevents short circuits between adjacent leads LE. Furthermore, because the first guide portion LE1 has a small thickness, the on-film chip can be cut on a per-mold basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0096] Figure 9 This is a cross-sectional view of yet another exemplary embodiment of a chip-on-film. For example, Figure 9 It can correspond to Figure 3 , Figure 5 and Figure 7 A sectional view.

[0097] Reference Figure 9 According to the exemplary embodiment shown, the chip-on-film and Figure 8 The difference in the chip-on-film is that one surface BSa_2 of the base substrate BS_2 includes a first base surface BSa1_2 overlapping with the first guide portion LE1, and second base surfaces BSa2_2 and BSa3_2 between adjacent first guide portions LE1. The second base surfaces BSa2_2 and BSa3_2 include a first sub-base surface BSa2_2 spaced apart from the first base surface BSa1_2, and a second sub-base surface BSa3_2 located between the first sub-base surface BSa2_2 and the first base surface BSa1_2. The second sub-base surface BSa3_2 includes surface irregularities.

[0098] That is, according to the exemplary embodiment shown, a surface BSa_2 of the base substrate BS_2 of the chip on film may include a first base surface BSa1_2 overlapping with the first guide portion LE1, and second base surfaces BSa2_2 and BSa3_2 between adjacent first guide portions LE1, and the second base surfaces BSa2_2 and BSa3_2 may include a first sub-base surface BSa2_2 spaced apart from the first base surface BSa1_2, and a second sub-base surface BSa3_2 located between the first sub-base surface BSa2_2 and the first base surface BSa1_2.

[0099] like Figure 9 As shown, the second sub-base surface BSa3_2 may include surface irregularities. (This is based on the above references.) Figure 2 and Figure 3 The laser process for the first guiding portion LE1 is performed with process margin in mind. Therefore, surface irregularities of the second sub-base surface BSa3_2 can be generated in the portion of a surface BSa_2 of the base substrate BS_2 adjacent to the first guiding portion LE1. In other words, the roughness of the second sub-base surface BSa3_2 can be greater than the roughness of the first base surface BSa1_2 and the roughness of the first sub-base surface BSa2_2.

[0100] According to the exemplary embodiment shown, the lead LE includes a second guide portion LE2 having a second thickness t2, and a first guide portion LE1 having a first thickness t1 that is less than the second thickness t2. Therefore, when the on-film chip is cut along the dicing line on a per-mold basis, the lead LE can be pushed less because the first guide portion LE1 corresponding to the dicing line has a small thickness. This prevents short circuits between adjacent leads LE. Furthermore, because the first guide portion LE1 has a small thickness, the on-film chip can be cut on a per-mold basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0101] Figure 10 This is a cross-sectional view of yet another exemplary embodiment of a chip-on-film. For example, Figure 10 It can correspond to Figure 3 , Figure 5 and Figure 7 A sectional view.

[0102] Reference Figure 10 According to the exemplary embodiment shown, the chip-on-film and Figures 1 to 3The difference between the chip-on-film (COF) and the substrate BS_3 is that the substrate BS_3 includes a first base portion BS1 overlapping with the first guide portion LE1, and second base portions BS2 and BS3 between adjacent first guide portions LE1. The second base portions BS2 and BS3 include a first sub-base portion BS2 spaced apart from the first base portion BS1, and a second sub-base portion BS3 disposed between the first sub-base portion BS2 and the first base portion BS1. The thicknesses of the first base portion BS1, the first sub-base portion BS2, and the second sub-base portion BS3 are different from each other.

[0103] That is, the base substrate BS_3 of the chip on film according to the exemplary embodiment shown may include a first base portion BS1 overlapping with the first guide portion LE1, and second base portions BS2 and BS3 between adjacent first guide portions LE1, and the second base portions BS2 and BS3 may include a first sub-base portion BS2 spaced apart from the first base portion BS1, and a second sub-base portion BS3 disposed between the first sub-base portion BS2 and the first base portion BS1.

[0104] like Figure 10 As shown, the first base portion BS1 may have a third thickness t3, the first sub-base portion BS2 may have a fourth thickness t4, and the second sub-base portion BS3 may have a fifth thickness t5. The fifth thickness t5 may be less than the third thickness t3 and the fourth thickness t4.

[0105] Due to the above references Figure 2 and Figure 3 The laser process of the first guiding portion LE1 is performed with process margin in mind, so the second sub-base portion BS3 can have a minimum fifth thickness t5 in the portion of the base substrate BS_3 adjacent to the first guiding portion LE1.

[0106] According to the exemplary embodiment shown, the lead LE includes a second guide portion LE2 having a second thickness t2, and a first guide portion LE1 having a first thickness t1 that is less than the second thickness t2. Therefore, when the on-film chip is cut along the dicing line on a per-mold basis, the lead LE can be pushed less because the first guide portion LE1 corresponding to the dicing line has a small thickness. This prevents short circuits between adjacent leads LE. Furthermore, because the first guide portion LE1 has a small thickness, the on-film chip can be cut on a per-mold basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0107] In some exemplary embodiments, carbonized surfaces and surface irregularities (as described above) are formed on the top surfaces of the first guide portions LE1_1 and LE1_2 or around the first guide portion LE1. Figures 4 to 10 (It has been described) They can coexist.

[0108] The method for manufacturing the above-described chip-on-film (COF) will be described below. In the exemplary embodiments below, the same components as those in the exemplary embodiments described above are indicated by the same reference numerals, and their description will be omitted or simplified.

[0109] Figure 11 This is a flowchart of an exemplary embodiment of a method for manufacturing a chip-on-film according to the principles of the present invention. Figure 12 It is shown Figure 11 A plan view of one process step in the method of manufacturing chip-on-film. Figure 13 It is along Figure 12 The sectional view taken from line III-III'. Figure 14 and Figure 15 It shows the manufacturing process. Figure 11 Cross-sectional view of other process steps in the chip-on-film method.

[0110] Reference Figures 11 to 13 According to the method for manufacturing a chip-on-film, firstly, a master film COFa is prepared (step S10). The master film COFa defines a first portion P1 and a second portion P2. The first portion P1 corresponds to the inner side of a dicing line CL having a rectangular frame shape, and the second portion P2 corresponds to the outer side of the dicing line CL. Here, the master film COFa includes a driver chip IC and a lead LEa. The driver chip IC is mounted on the first portion P1, and the lead LEa has an inner wiring portion LEaa and outer wiring portions LEab and LEac. The inner wiring portion LEaa is disposed in the first portion P1 and connected to the driver chip IC, while the outer wiring portions LEab and LEac are disposed in the second portion P2 and connected to the inner wiring portion LEaa. The lead LEa and the driver chip IC can be arranged on a base substrate BS'.

[0111] The mother film COFa can have a rectangular shape. The mother film COFa can include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. The first direction DR1 can be the horizontal direction of the mother film COFa, and the second direction DR2 can be the vertical direction of the mother film COFa, which intersects with the first direction DR1.

[0112] The corners where the short and long sides of the mother membrane COFa intersect can be angled. However, it is not limited to this; it can also be rounded.

[0113] The planar shape of the mother film COFa is not limited to this, and can be square, circular, elliptical, or other polygonal shapes. In the following description, we will assume that the mother film COFa has a rectangular shape in the planar view.

[0114] like Figure 12 As shown, a cutting line CL can be defined in the mother film COFa. The cutting line CL can have a rectangular frame shape. The mother film COFa can be divided relative to the cutting line CL into a first portion P1 corresponding to the inner side of the cutting line CL and a second portion P2 corresponding to the outer side of the cutting line CL.

[0115] The driver chip IC can be located in the central part of the mother film COFa. The driver chip IC can be located in the first part P1.

[0116] The lead LEa may include the inner wiring portion LEaa disposed in the first part P1, and the outer wiring portions LEab and LEac disposed in the second part P2 and connected to the inner wiring portion LEaa.

[0117] The wiring portion LEaa inside the cut line may not be set in the second part P2, and the wiring portions LEab and LEac outside the cut line may not be set in the first part P1.

[0118] The in-cut wiring portion LEaa can be physically connected to the out-of-cut wiring portions LEab and LEac. The out-of-cut wiring portions LEab and LEac can include a first out-of-cut wiring portion LEab connected to the in-cut wiring portion LEaa, and a second out-of-cut wiring portion LEac spaced apart from the in-cut wiring portion LEaa, with the first out-of-cut wiring portion LEab located between the second out-of-cut wiring portion LEac and the in-cut wiring portion LEaa.

[0119] The wiring portions LEaa inside the cut line and LEab and LEac outside the cut line can be made of the same material. For example, the wiring portions LEaa inside the cut line and LEab and LEac outside the cut line can be made of copper (Cu).

[0120] The outer wiring portions LEab and LEac of the cut line can extend from the inner wiring portion LEaa along the first direction DR1.

[0121] Multiple leads LEa can be set, and multiple leads LEa can be arranged along the second direction DR2.

[0122] The first cleaved line outer routing portion LEab may have a first width, and the second cleaved line outer routing portion LEac may have a second width greater than the first width. The second cleaved line outer routing portion LEac may be a test pad, but is not limited thereto.

[0123] Planar shape and reference of the wiring section LEaa within the cut line Figure 1 The planar shapes of the described leads LE are substantially the same, and therefore repeated descriptions are omitted.

[0124] Subsequently, referring to Figure 11 and Figure 14 Together Figures 1 to 3 The portion adjacent to the cutting line CL in the wiring section LEaa within the cutting line is processed using laser LS (step S20). This process allows for the formation of... Figures 1 to 3 The leads LE (LE1 and LE2) described above are shown in the diagram. The leads LE can be directly disposed on one surface BSa of the base substrate BS. The first guide portion LE1 and the second guide portion LE2 can have different thicknesses than each other. For example, refer to... Figure 2 , Figure 14 and Figure 15 The first guiding portion LE1 may have a first thickness t1, and the second guiding portion LE2 may have a second thickness t2. The second thickness t2 may be greater than the first thickness t1. In other words, the first thickness t1 may be less than the second thickness t2. The surface LE1a of the first guiding portion LE1 may be positioned as a surface BSa closer to the base substrate BS than the top surface of the second guiding portion LE2.

[0125] For example, the first thickness t1 can be about 80% or less of the second thickness t2. In a preferred exemplary embodiment, the first thickness t1 can be about 20% to about 80% of the second thickness t2. For example, the second thickness t2 can be about 8 μm and the first thickness t1 can be about 4 μm, but they are not limited thereto.

[0126] Through laser LS processing (step S20), the portion of the outer wiring portion LEab adjacent to the cutting line CL can also have a reduced thickness. Laser LS processing (step S20) can be performed by a laser unit. The laser can include a continuous wave laser (CW laser) or a pulsed laser.

[0127] Next, refer to Figure 11 and Figure 15 Together Figures 1 to 3 The second part P2 is cut off along the cutting line CL (step S30). The cutting of the second part P2 (step S30) can be performed by the cutting unit.

[0128] According to exemplary embodiments, such as Figure 2 and Figure 15 As shown, the lead LE includes a second guide portion LE2 having a second thickness t2, and a first guide portion LE1 having a first thickness t1 less than the second thickness t2. Therefore, when cutting the mother film COFa along the cutting line CL, the lead LEa can be pushed less because the first guide portion LE1 corresponding to the cutting line CL, or both the first guide portion LE1 corresponding to the cutting line CL and the first outer wiring portion LEab, have a small thickness. This prevents short circuits between adjacent leads LEa. Furthermore, because the first guide portion LE1, or both the first guide portion LE1 and the first outer wiring portion LEab, have a small thickness, the mother film COFa can be cut even with a small cutting force, thereby increasing the lifespan of the cutting unit.

[0129] In the following description, a display device comprising the chip-on-film (COF) described above will be described. In the exemplary embodiments described below, components identical to those in the exemplary embodiments described above are indicated by the same reference numerals, and their description will be omitted or simplified.

[0130] Figure 16 This is a plan view of an exemplary embodiment of a display device constructed according to the principles of the present invention. Figure 17 It is along Figure 16 A sectional view taken from line IV-IV'. Figure 18 It is along Figure 16 A sectional view taken by line V-V'.

[0131] Reference Figures 16 to 18 as well as Figures 1 to 3 Display device 1 can represent any electronic device that provides a display screen. Examples of display device 1 may include televisions, laptops, monitors, billboards, mobile phones, smartphones, tablet PCs, electronic watches, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, game consoles, digital cameras, Internet of Things devices, etc.

[0132] Display device 1 can be classified differently based on the display method. For example, the types of display device 1 may include liquid crystal displays (LCDs), organic light-emitting displays (OLEDs), inorganic light-emitting displays (inorganic ELs), quantum dot light-emitting displays (QEDs), micron LED displays, nano LED displays, plasma display panels (PDPs), field emission displays (FEDs), cathode ray tube (CRT) displays, electrophoretic displays (EPDs), etc. In the following description, liquid crystal displays (LCDs) will be used as an example of display device 1. Display device 1 may have a rectangular shape in a plan view (i.e., when viewed in a plan view).

[0133] The display device 1 may include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. However, the exemplary embodiment is not limited thereto, and the short side of the display device 1 may extend along the second direction DR2, and its long side may extend along the first direction DR1.

[0134] Display device 1 may include a display area DA and a non-display area NDA. The display area DA is the effective area in which an image is displayed. In a plan view, the display area DA may have a rectangular shape similar to the overall shape of display device 1.

[0135] The display area DA can include multiple pixels. A pixel can be the basic unit used to display an image.

[0136] The non-display area NDA can be disposed around the display area DA. The non-display area NDA can completely or partially surround the display area DA. The display area DA can have a rectangular shape, and the non-display area NDA can be disposed adjacent to the four sides of the display area DA. The non-display area NDA can form the frame of the display device 1.

[0137] A chip-on-film (COF) equipped with a driving circuit or driving element for driving the display area DA can be disposed in the non-display area NDA. For example, multiple COFs can be disposed in the non-display area NDA adjacent to the lower long side of the display device 1 in the first direction DR1.

[0138] The chip-on-film (COF) is not limited to this, and can also be configured in the non-display area NDA to be adjacent to the upper long side of the display device 1 in the first direction DR1.

[0139] The scan driver SP can be configured in the non-display area NDA to be adjacent to the left short side of the display device 1 in the second direction DR2. The scan driver SP can also be configured in the non-display area NDA to be adjacent to the right short side of the display device 1 in the second direction DR2.

[0140] The circuit pad area PA_C of the chip on film COF can be attached to the non-display area NDA of the display device 1.

[0141] The display device 1 may include a lower substrate 10, an upper substrate 20, a sealing member SEAL disposed between the upper substrate 20 and the lower substrate 10, and a liquid crystal layer LC. The lower substrate 10 includes a display base substrate 11 and a pad PAD.

[0142] The planar dimensions of the lower substrate 10 and the upper substrate 20 may be different from each other. For example, the planar dimensions of the lower substrate 10 may be larger than the planar dimensions of the upper substrate 20. In a plan view, at least one side of the lower substrate 10 may protrude relative to the upper substrate 20.

[0143] The chip-on-film (COF) described above can be attached to a portion of the lower substrate 10 that protrudes relative to the upper substrate 20 in the first direction DR1. The sealing member SEAL can be positioned in a plan view adjacent to all long and short sides of the upper substrate 20. The sealing member SEAL can be located at the central portion or inside all long and short sides of the upper substrate 20 in the plan view. In the plan view, all long and short sides of the upper substrate 20 can completely surround the sealing member SEAL. In the plan view, the sealing member SEAL can have a rectangular frame shape extending continuously along all long and short sides of the upper substrate 20.

[0144] In the plan view, the liquid crystal layer LC can be surrounded by the sealing component SEAL.

[0145] The pads can be electrically connected to the pixels of the display area DA. The pads can also be electrically connected to the pixel's data line.

[0146] The pad PAD and the lead LE can be connected via an anisotropic conductive film (ACF) inserted therebetween. The pad PAD and the lead LE can be electrically connected via the anisotropic conductive film (ACF) inserted therebetween. A portion of the first guide portion LE1 and a portion of the second guide portion LE2 of the lead LE can overlap with the pad PAD in the thickness direction.

[0147] Anisotropic conductive film (ACF) can directly contact the side and top surfaces of pads (PADs) and the side and bottom surfaces of leads (LEs). Anisotropic conductive film (ACF) can fill the spaces between adjacent pads (PADs) and between adjacent leads (LEs).

[0148] According to the exemplary embodiments shown, such as Figures 1 to 3As shown, the lead LE includes a second guiding portion LE2 having a second thickness t2, and a first guiding portion LE1 having a first thickness t1 that is less than the second thickness t2. Therefore, when the on-film chip is cut along the dicing line on a per-mold basis, the lead LE can be pushed less because the first guiding portion LE1 corresponding to the dicing line has a small thickness. This prevents short circuits between adjacent leads LE. Furthermore, because the first guiding portion LE1 has a small thickness, the on-film chip can be cut on a per-mold basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0149] Figure 19 This is a cross-sectional view of another exemplary embodiment of the display device. For example, Figure 19 It can correspond to Figure 17 A sectional view.

[0150] Reference Figure 19 The display device 2 according to the exemplary embodiment shown and Figures 16 to 18 The difference of display device 1 is that it uses an organic light-emitting display device.

[0151] That is, the organic light-emitting display device can be used as display device 2 according to the exemplary embodiment shown. Figures 16 to 18 Unlike display device 1, display device 2 may also include an organic light-emitting element that does not include a liquid crystal layer (LC).

[0152] According to the exemplary embodiments shown, such as Figures 1 to 3 As shown, the lead LE includes a second guiding portion LE2 having a second thickness t2, and a first guiding portion LE1 having a first thickness t1 that is less than the second thickness t2. Therefore, when the on-film chip is cut along the dicing line on a per-mold basis, the lead LE can be pushed less because the first guiding portion LE1 corresponding to the dicing line has a small thickness. This prevents short circuits between adjacent leads LE. Furthermore, because the first guiding portion LE1 has a small thickness, the on-film chip can be cut on a per-mold basis even with a small cutting force, thereby increasing the lifespan of the dicing unit.

[0153] Figure 20 This is a cross-sectional view of yet another exemplary embodiment of the display device. For example, Figure 20 It can correspond to Figure 17 A sectional view.

[0154] Reference Figure 20 The display device 3 according to the exemplary embodiment shown and Figures 16 to 18 The difference in the display device 1 shown is that the chip on film (COF) is attached to the side surfaces of the lower substrate 10 and the upper substrate 20.

[0155] That is, such as Figure 20 As shown, in the display device 3 according to the illustrated exemplary embodiment, the chip-on-film (COF) can be attached to the side surface of the lower substrate 10 and the side surface of the upper substrate 20.

[0156] The pads (PADs) can be disposed on the side surfaces of the lower substrate 10 and the upper substrate 20. The display device 3 according to the illustrated exemplary embodiment may further include pillar spacers (CS) disposed between the lower substrate 10 and the upper substrate 20. The side surfaces of the pillar spacers (CS) can be aligned with the side surfaces of the lower substrate 10 and the upper substrate 20. The pads (PADs) can be disposed on the side surfaces of the pillar spacers (CS), the lower substrate 10, and the upper substrate 20. Other configurations are consistent with the above references. Figures 16 to 18 The configurations described are the same, and therefore, duplicate descriptions have been omitted.

[0157] Figure 21 This is a block diagram of an exemplary embodiment of an apparatus for manufacturing chips on a film, constructed according to the principles of the present invention.

[0158] Reference Figure 21 The apparatus 100 for manufacturing chip-on-film according to the exemplary embodiment shown may include a roll supply unit RSP, a laser unit LSP, a cutting unit CTP, and a roll retraction unit RCP.

[0159] The reel supply unit RSP can be used to supply references Figure 12 and Figure 13 The described mother film COFa is transferred to the laser unit LSP.

[0160] As referenced above Figure 14 As described, the laser unit LSP can be used to laser process the portion of the wiring portion LEaa within the dicing line adjacent to the dicing line CL. Therefore, leads LE (LE1 and LE2) as described above can be formed. Furthermore, the laser unit LSP can irradiate the portion of the wiring portion LEab outside the first dicing line adjacent to the dicing line CL with a laser, thereby reducing the thickness of the portion of the wiring portion LEab outside the first dicing line adjacent to the dicing line CL. The laser irradiated from the laser unit LSP can include a continuous wave laser (CW laser) or a pulsed laser.

[0161] like Figure 15 As shown, the cutting unit CTP can be used to remove the second part P2 from the mother membrane COFa, which has already been treated by the laser unit LSP, along the cutting line CL.

[0162] COF on film diced by the CTP dicing unit (see...) Figures 1 to 3 It can be retracted via the retraction unit RCP.

[0163] According to the embodiment, the lead LE includes a second guide portion LE2 having a second thickness t2, and a first guide portion LE1 having a first thickness t1 less than the second thickness t2. Therefore, when cutting the mother film COFa along the cutting line CL, since the first guide portion LE1 corresponding to the cutting line CL, or both the first guide portion LE1 corresponding to the cutting line CL and the first outer wiring portion LEab of the cutting line have a small thickness, the lead LEa can be pushed less. Therefore, short circuits between adjacent leads LEa can be prevented. Furthermore, since the first guide portion LE1, or both the first guide portion LE1 and the first outer wiring portion LEab of the cutting line have a small thickness, the mother film COFa can be cut even with a small cutting force, thereby increasing the lifespan of the cutting unit.

[0164] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from that description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. A chip-on-film for a display device, the chip-on-film comprising: Basic substrate; Lead wires are disposed on the base substrate; as well as The driver chip is connected to the lead. The lead wire includes: The first guiding portion has a first thickness; and A second guide portion is disposed between the first guide portion and the driver chip, and has a second thickness greater than the first thickness. The second guide portion is connected to the driver chip. The first guide portion and the second guide portion both comprise the same material. The base substrate includes a first base portion overlapping the first guiding portion, and a second base portion between adjacent first guiding portions. The second base portion includes a first sub-base portion spaced apart from the first base portion, and a second sub-base portion located between the first sub-base portion and the first base portion. The thickness of the second sub-base portion is less than the thickness of the first base portion and the thickness of the first sub-base portion.

2. The chip-on-film according to claim 1, wherein, One end of the first guiding portion is aligned with one end of the base substrate.

3. The chip-on-film according to claim 2, wherein, The first guide portion extends from the second guide portion along a first direction. The leads include multiple leads, and The multiple leads are arranged along a second direction that intersects the first direction.

4. The chip-on-film according to claim 3, wherein, The second guide portion includes a curved portion, and The second guide portion extends from the portion connected to the driver chip along a direction that intersects the first direction and the second direction, and then extends from the curved portion along the first direction.

5. The chip-on-film according to claim 4, wherein, The first thickness has a value of 80% or less of the second thickness.

6. The chip-on-film according to claim 1, wherein, The surface of the first guiding portion includes a carbonized surface.

7. A display device, comprising: The first substrate includes a display base substrate and pads disposed on the display base substrate; as well as The chip on the film is connected to the pad. The on-film chip includes: Basic substrate; Leads, disposed on the base substrate and connected to the pads; and The driver chip is connected to the leads, and The lead wire includes: The first guiding portion has a first thickness; and A second guide portion is disposed between the first guide portion and the driver chip, and has a second thickness greater than the first thickness. The second guide portion is connected to the driver chip. The first guide portion and the second guide portion both comprise the same material. The base substrate includes a first base portion overlapping the first guiding portion, and a second base portion between adjacent first guiding portions. The second base portion includes a first sub-base portion spaced apart from the first base portion, and a second sub-base portion located between the first sub-base portion and the first base portion. The thickness of the second sub-base portion is less than the thickness of the first base portion and the thickness of the first sub-base portion.

8. The display device according to claim 7, wherein, One end of the first guiding portion is aligned with one end of the base substrate.

9. A method for manufacturing a chip-on-film for a display device, the method comprising the following steps: A master film is prepared, wherein the master film defines a first part and a second part, wherein the first part corresponds to the inner side of a dicing line having a rectangular frame shape, and the second part corresponds to the outer side of the dicing line. The master film includes a driver chip and leads, wherein the driver chip is mounted on the first part, and the leads have an inner wiring portion disposed in the first part and connected to the driver chip, and an outer wiring portion disposed in the second part and connected to the inner wiring portion of the dicing line. The portion of the wiring section within the cut line adjacent to the cut line is laser-processed, such that the lead includes a first guiding portion and a second guiding portion. The first guiding portion is adjacent to the cut line and has a first thickness. The second guiding portion is disposed between the first guiding portion and the driver chip and has a second thickness greater than the first thickness. as well as The mother film is cut along the cutting line. The mother film includes a first base portion overlapping the first guide portion and a second base portion between adjacent first guide portions. The second base portion includes a first sub-base portion spaced apart from the first base portion, and a second sub-base portion located between the first sub-base portion and the first base portion. The thickness of the second sub-base portion is less than the thickness of the first base portion and the thickness of the first sub-base portion.

10. An apparatus for manufacturing a chip-on-film for a display device, the apparatus comprising: A roll supply unit is configured to supply a master film, the master film defining a first portion and a second portion, wherein the first portion corresponds to the inner side of a cut line having a rectangular frame shape, and the second portion corresponds to the outer side of the cut line. The master film includes a driver chip and leads, wherein the driver chip is mounted on the first portion, and the leads have an inner wiring portion of the cut line disposed in the first portion and connected to the driver chip, and an outer wiring portion of the cut line disposed in the second portion and connected to the inner wiring portion of the cut line. A laser unit is configured to perform laser processing on a portion of the wiring portion within the cut line of the mother film supplied from the roll supply unit that is adjacent to the cut line, such that the lead includes a first guide portion and a second guide portion, the first guide portion being adjacent to the cut line and having a first thickness, and the second guide portion being disposed between the first guide portion and the driving chip and having a second thickness greater than the first thickness. as well as A cutting unit is configured to cut the mother film processed by the laser unit along the cutting line. The mother film includes a first base portion overlapping the first guide portion and a second base portion between adjacent first guide portions. The second base portion includes a first sub-base portion spaced apart from the first base portion, and a second sub-base portion located between the first sub-base portion and the first base portion. The thickness of the second sub-base portion is less than the thickness of the first base portion and the thickness of the first sub-base portion.

Images