Signal processing device and antenna system

Abstract

The present disclosure relates to a signal processing device and an antenna system. The signal processing device includes a feeding device, and the feeding device includes a first conductor, an insulating medium, and a second conductor; a first portion of the insulating medium is covered by the second conductor, and a second portion of the insulating medium extends beyond a first end of the second conductor. A first portion of the first conductor is covered by both the second conductor and the insulating medium, a second portion of the first conductor extends beyond the first end of the second conductor and is covered by the insulating medium, and a third portion of the first conductor extends beyond a first end of the insulating medium. The third portion of the first conductor is configured to be connected to a target device to feed a radio frequency signal to the target device and is configured to form a capacitive impedance with the target device. The second portion of the first conductor is configured to form an inductive impedance with the target device, and an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technologies, and more particularly, to a signal processing device and an antenna system. Background Art

[0002] In the process of signal processing, it is often necessary to feed a radio frequency signal to a certain target device to achieve corresponding functions. However, since radio frequency signals, especially U-band signals, etc. are highly sensitive to inductive impedance and capacitive impedance, it is difficult to achieve a good feeding effect using traditional feeding structures. Summary of the Invention

[0003] One object of the present disclosure is to provide a new signal processing device and an antenna system.

[0004] According to a first aspect of the present disclosure, there is provided a signal processing device, the signal processing device including a target device and a feeding device; wherein, the feeding device includes: a first conductor configured to transmit a radio frequency signal; an insulating medium covering the first conductor; and a second conductor covering the insulating medium; wherein, a first portion of the insulating medium is covered by the second conductor, and a second portion of the insulating medium extends beyond a first end of the second conductor, wherein, a first portion of the first conductor is covered by both the second conductor and the insulating medium, a second portion of the first conductor extends beyond the first end of the second conductor and is covered by the insulating medium, and a third portion of the first conductor extends beyond a first end of the insulating medium, wherein, the third portion of the first conductor is configured to be connected to the target device to feed the radio frequency signal to the target device, and is configured to form a capacitive impedance with the target device, the second portion of the first conductor is configured to form an inductive impedance with the target device, and an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

[0005] According to a second aspect of the present disclosure, there is provided a signal processing device, the signal processing device including: a target circuit board, the target circuit board including a substrate, a conductive component connecting a first side and an opposite second side of the substrate, and a target circuit provided on the first side, the conductive component being electrically connected to the target circuit; and a feeding cable, the feeding cable including a first conductor, the first conductor being electrically connected to the conductive component on the second side of the substrate; wherein, the feeding cable is configured such that a maximum bending curvature of the feeding cable in its extending direction is less than or equal to a preset curvature threshold.

[0006] According to a third aspect of the present disclosure, a signal processing device is provided. The signal processing device includes a target device and a feeding device. Among them, the feeding device includes: a first connecting component configured to form a capacitive impedance with the target device; a second connecting component electrically connected to the first connecting component, the second connecting component being configured to form an inductive impedance with the target device. Among them, at least one of the first connecting component and the second connecting component is configured to be directly electrically connected to the target device to feed a radio frequency signal transmitted through the first connecting component and the second connecting component to the target device, and the absolute value of the sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

[0007] According to a fourth aspect of the present disclosure, a signal processing device is provided. The signal processing device includes: a feeding cable configured to transmit a radio frequency signal; a feeding circuit board including a feeding circuit electrically connected to the feeding cable, and the feeding circuit is configured to transmit the radio frequency signal; and a target circuit board including a target circuit electrically connected to the feeding circuit, and the target circuit board is mechanically connected to the feeding circuit board. Among them, the position of the feeding circuit board relative to the target circuit board is configured such that the maximum bending curvature of the feeding cable is less than or equal to a preset curvature threshold.

[0008] According to a fifth aspect of the present disclosure, an antenna system is provided. The antenna system includes the signal processing device as described above.

[0009] Other features and advantages of the present disclosure will become clearer through the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings. Description of the Drawings

[0010] The drawings forming a part of the specification depict embodiments of the present disclosure and, together with the specification, are used to explain the principles of the present disclosure.

[0011] Referring to the accompanying drawings, the present disclosure can be more clearly understood according to the following detailed description, where:

[0012] Figure 1 is a top view structural schematic diagram showing a signal processing device;

[0013] Figure 2 is shown Figure 1 a side view structural schematic diagram of the signal processing device;

[0014] Figure 3 is a top view structural schematic diagram showing another signal processing device;

[0015] Figure 4 is a schematic side view structure diagram of a signal processing device shown Figure 3 ;

[0016] Figure 5 is a schematic side view structure diagram of a signal processing device according to an exemplary embodiment of the present disclosure;

[0017] Figure 6 is a schematic bottom view structure diagram of a signal processing device shown Figure 5 ;

[0018] Figure 7 is a schematic structure diagram of a signal processing device according to another exemplary embodiment of the present disclosure;

[0019] Figure 8 is a schematic enlarged structure diagram of part A shown Figure 7 ;

[0020] Figure 9 is a schematic partial structure diagram of a feed circuit board of a signal processing device shown Figure 7 ;

[0021] Note that in the embodiments described below, in some cases, the same reference numerals are used commonly between different drawings to represent the same parts or parts with the same functions, and the repeated description thereof is omitted. In some cases, similar reference numerals and letters are used to represent similar items. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0022] For ease of understanding, the positions, dimensions, ranges, etc. of the various structures shown in the drawings and the like sometimes do not represent the actual positions, dimensions, ranges, etc. Therefore, the present disclosure is not limited to the positions, dimensions, ranges, etc. disclosed in the drawings and the like.

[0023] Among them, the components shown by the dashed lines in the drawings will be blocked by other components from the perspective of this drawing. Detailed Embodiments

[0024] Various exemplary embodiments of the present disclosure will be described in detail below with reference to the drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0025] The following description of at least one exemplary embodiment is merely illustrative and is in no way a limitation of the present disclosure or its application or use. That is, the structures and methods herein are shown in an exemplary manner to illustrate different embodiments of the structures and methods in the present disclosure. Those skilled in the art should understand that these examples are merely indicative of the embodiments of the present disclosure in an illustrative manner, rather than in an exhaustive manner. In addition, the drawings need not be drawn to scale, and some features may be enlarged to show details of some specific components.

[0026] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0027] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and non - restrictive. Thus, other examples of the exemplary embodiments may have different values.

[0028] In a signal processing device, as Figure 1 and Figure 2 shown, the feed cable 100' can extend along a direction parallel or substantially parallel to the surface of the target circuit board 200', and the feed cable 100' can be located on the back side of the target circuit board 200' (as shown by the dashed line in Figure 1 ). In order to electrically connect the feed cable 100' to the target circuit 210' located on the front side of the target circuit board 200' to feed the communication signal (e.g., radio frequency signal) carried by the feed cable 100' to the target circuit 210', at an appropriate position, the inner conductor 110' of the feed cable 100' can be exposed and bent towards the target circuit board 200', and electrically connected to the target circuit 210' through, for example, a solder joint 300'. In such a signal processing device, since the feed cable 100' is basically extending along a direction parallel to the surface of the target circuit board 200', its bending can be very small, and thus usually only a single solder joint and a single soldering process can well achieve a connection that meets the structural strength requirements between the feed cable 100' and the target circuit board 200' without adding additional fasteners, etc. However, in such a signal processing device, at least the exposed inner conductor 110', the air or other dielectrics between the inner conductor 110' and the target circuit board 200', and the target circuit board 200' will form an inductive impedance, resulting in low power conversion efficiency of the fed radio frequency signal and poor feeding effect.

[0029] In another signal processing device, as Figure 3 and Figure 4As shown, at a position close to the target circuit board 200', the feeding cable 100' can extend vertically or substantially vertically with respect to the target circuit board 200' so as to be connected to the target circuit 210' of the target circuit board 200' in a directly vertical feeding manner. This directly vertical feeding (stem feeding) method can effectively reduce the magnitude of the impedance formed by the feeding cable 100' and the target circuit board 200', thereby ensuring the power conversion efficiency during the feeding process and achieving a better feeding effect with respect to radio frequency signals. However, in such a signal processing device, the extending direction of the feeding cable 100' is greatly restricted, which often results in large bends (not shown in the figure) in the feeding cable 100' in practice, and further leads to large stress at the connection (such as the solder joint 300') between the feeding cable 100' and the target circuit 210'. This stress can cause the feeding cable 100' to inadvertently fall off from the target circuit 210'. To avoid the occurrence of the above-mentioned detachment, fasteners 400' can be additionally added to the outer periphery of the feeding cable 100' to increase the strength of the connection structure. However, the added fasteners 400' will lead to an increase in material costs. In addition, in order to fix the fasteners 400', secondary soldering is often required, resulting in an increase in process difficulty and costs.

[0030] Exemplary embodiments of the present disclosure provide a signal processing device, aiming to ensure a better feeding effect for radio frequency signals, avoid excessive bending of the feeding cable, enable the feeding structure to have good structural strength, and minimize material and process costs as much as possible.

[0031] In an exemplary embodiment of the present disclosure, a signal processing device is provided. The signal processing device includes a target device and a feeding device. Among them, the feeding device includes a first connecting component 102 configured to form a capacitive impedance with the target device and a second connecting component 104 configured to form an inductive impedance with the target device. The first connecting component 102 and the second connecting component 104 are electrically connected to each other, and at least one of the first connecting component 012 and the second connecting component 104 is directly electrically connected to the target device to feed the radio frequency signal transmitted through the first connecting component 102 and the second connecting component 104 to the target device. The capacitive impedance and the inductive impedance can have opposite signs, and thus the capacitive impedance can at least partially cancel the inductive impedance. Therefore, by providing both the capacitive impedance and the inductive impedance, a better feeding effect of the radio frequency signal can be achieved.

[0032] In some embodiments, such as Figure 5 and Figure 6As shown, the feeding device may include a feeding cable 100. The feeding cable 100 may include a first conductor 110, an insulating medium 120, and a second conductor 130. Among them, the first connection component 102 of the feeding device may correspond to a section of the first conductor 110 of the feeding cable 100, and the second connection component 104 may correspond to another section of the first conductor 110 of the feeding cable 100.

[0033] In the feeding cable 100, the first conductor 110 may be configured to transmit radio frequency signals. In some embodiments, the radio frequency signal may be a U-band signal having a frequency range of 3.6 to 5 GHz, although the embodiments of the present invention are not limited thereto.

[0034] As Figure 5 and Figure 6 shown, a first part of the insulating medium 120 is covered by the second conductor 130, and a second part of the insulating medium 120 extends beyond the first end of the second conductor 130. In addition, a first part of the first conductor 110 is covered by both the second conductor 130 and the insulating medium 120, a second part of the first conductor 110 extends beyond the first end of the second conductor 130 and is covered by the insulating medium 120, and a third part of the first conductor 110 extends beyond the first end of the insulating medium 120. The exposed third part of the first conductor 110 (corresponding to the first connection component 102) is configured to be connected to the target device to feed the radio frequency signal to the target device and may form a capacitive impedance with the target device.

[0035] The exposed second part of the insulating medium 120 and the second part of the first conductor 110 (within the exposed part of the insulating medium 120 and corresponding to the second connection component 104) together may form an inductive impedance with the target device. The exposed part of the second conductor 130 may electrically insulate the first part of the first conductor 110 contained therein from a part of the target device (such as the target circuit board described later) to avoid short-circuiting of the first conductor 110.

[0036] In some embodiments, the feeding cable 100 may be a coaxial cable, where the first conductor 110 corresponds to the inner conductor of the coaxial cable, the insulating medium 120 corresponds to the dielectric layer of the coaxial cable, and the second conductor 130 corresponds to the outer conductor of the coaxial cable. In a coaxial cable, the inner conductor, the dielectric layer, and the outer conductor are coaxially arranged so that analog signals and / or digital signals can be transmitted. The inner conductor and the outer conductor form a current loop, and the outer conductor can be grounded, so that the radio frequency signal emitted from the inner conductor is isolated by the outer conductor to improve the signal transmission effect.

[0037] It will be understood that in other embodiments, the feeding device may also be in other forms and is not limited to a feeding cable. Moreover, the first connecting component and the second connecting component of the feeding device can similarly form a capacitive impedance and an inductive impedance with the target device respectively, where the capacitive impedance and the inductive impedance at least partially cancel each other out to improve the feeding effect.

[0038] Ideally, when the absolute value of the capacitive impedance is equal to the absolute value of the inductive impedance, the capacitive impedance and the inductive impedance can completely cancel each other out, and the signal processing device can have the best feeding effect. However, in actual situations, there may be a slight difference between the absolute values of the capacitive impedance and the inductive impedance. But as long as the absolute value of the sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold, a good feeding effect can also be obtained. The preset impedance threshold can be determined according to actual requirements. For example, the preset impedance threshold can be 25%, 20%, 15%, 10%, or 5% of the absolute value of the capacitive impedance or 25%, 20%, 15%, 10%, or 5% of the absolute value of the inductive impedance, etc.

[0039] Furthermore, in the signal processing device, the extending direction of the feeding cable 100 can be configured such that its maximum bending curvature is less than or equal to a preset curvature threshold. For example, in some embodiments, the extending direction of the feeding cable 100 can be parallel to the main surface of the target device. When the maximum bending curvature of the feeding cable 100 is too large, it is very likely to introduce large stress therein, resulting in an adverse effect on the structural strength of the connection between the feeding cable 100 and the target device. By configuring the extending direction of the feeding cable 100 such that its maximum bending curvature is less than or equal to the preset curvature threshold, large stress caused by excessive bending can be effectively avoided, so that there is no need to ensure the structural strength by secondary welding or adding other fasteners, etc.

[0040] Furthermore, when the bending of the feeding cable 100 is small, the exposed third part of the first conductor 110 of the feeding cable 100 can also be connected to the target device through a single welding process. The single welding process can help effectively reduce the material and process costs.

[0041] As Figure 5 and Figure 6 shown, in some embodiments, the target device may include a target circuit board 200. The target circuit board 200 may be a printed circuit board. The printed circuit board can be grounded together with the second conductor 130 of the feeding cable 100. The target circuit board 200 may include a substrate 290, conductive components connecting the first side and the opposite second side of the substrate 290, and a target circuit 210 provided on the first side (only shown in Figure 6In some embodiments, the target circuit 210 may include a calibration circuit for beamforming calibration, a power distribution circuit for allocating signal power to different communication links, a phase shifter circuit, or one or more other circuits with specific functions, etc.

[0042] The exposed third portion of the first conductor 110 of the feed cable 100 is electrically connected to the conductive component on the second side of the substrate 290, and the first conductor 110 is electrically connected to the target circuit 210 on the first side of the substrate 290 through the conductive component connecting the first side and the second side of the substrate 290, so as to feed the radio frequency signal to the target circuit 210. Due to the presence of the conductive component, the extending direction of the feed cable 100 can be configured more flexibly, so that the maximum bending curvature of the feed cable 100 is less than or equal to a preset curvature threshold.

[0043] In some embodiments, as Figure 5 and Figure 6 shown, the conductive component may include a first pad 231, a second pad 232, and a pad hole 220. Among them, the first pad 231 is disposed on the first side of the substrate 290, and the first pad 231 is electrically connected to the target circuit 210. The second pad 232 is disposed on the second side of the substrate 290, and the second pad 232 is electrically connected to the first conductor 110. And, the pad hole 220 penetrating through the substrate 290 physically and electrically connects the first pad 231 and the second pad 232. For example, the pad hole 220 may be a conductive via filled with a conductive material. In some embodiments, the first pad 231 is directly connected to the target circuit 210, and the second pad 232 is directly connected to the first conductor 110. In some embodiments, the first conductor 110 may be electrically connected to the second pad 232 by welding.

[0044] The sizes of the first pad 231, the second pad 232, and the exposed second portion of the insulating medium 120 can be designed to cancel out the capacitive impedance and the inductive impedance as much as possible. Specifically, by adjusting the relationship between the first pad area of the first pad 231, the second pad area of the second pad 232, and the extending length of the exposed second portion of the insulating medium 120, the absolute value of the sum of the capacitive impedance and the inductive impedance can be made smaller to improve the feeding effect.

[0045] In some embodiments, the first pad 231 and the second pad 232 are separated by the substrate 290, and the first pad 231 and the second pad 232 are disposed opposite to each other. As the overlapping area between the projections of the first pad 231 and the second pad 232 on the plane of the substrate 290 increases, the capacitive impedance also increases accordingly to cancel out more inductive impedance.

[0046] In Figure 6In the specific example shown, the area of the first pad can be designed to be larger than the area of the second pad (e.g., the width of the first pad 231 in the direction perpendicular to the extending direction of the feeding cable 100 is larger than the width of the second pad 232 in this direction), so that the capacitive impedance and the inductive impedance can cancel each other out as much as possible to improve the feeding effect of the signal.

[0047] In some embodiments, as Figure 6 shown, on the second side of the target circuit board 200, an electrically isolated area 250 can also be provided. The material in the electrically isolated area 250 is insulating, so that the first conductor 110 can be electrically isolated from the ground of the target circuit board to avoid the first conductor 110 being short-circuited to the ground.

[0048] In the above exemplary embodiments, due to at least partial cancellation between the capacitive impedance and the inductive impedance, a high power conversion efficiency can be achieved between the feeding device and the target device. Since the direction of the feeding device (e.g., the feeding cable) can be flexibly set, the requirement for the placement space is relatively low, so that on the one hand, the bending can be reduced as much as possible, and on the other hand, the structural strength of the feeding structure can be achieved without a secondary soldering process or additional fasteners, etc., thereby effectively reducing the material cost and the process cost.

[0049] In another exemplary embodiment of the present disclosure, another signal processing device is provided for realizing the connection between the feeding device and the target device through a feeding circuit board. As Figure 7 and Figure 8 shown, the signal processing device may include a feeding cable 100, a feeding circuit board 500, and a target circuit board 200.

[0050] The feeding cable 100 is configured to transmit radio frequency signals. In some embodiments, the radio frequency signal may be a U-band signal having a center frequency within the frequency band of 3.6 to 5 GHz. The feeding cable 100 may also be a coaxial cable. Similar to the coaxial cable in the above embodiments, the first conductor of the feeding cable corresponds to the inner conductor of the coaxial cable, the insulating medium corresponds to the dielectric layer of the coaxial cable, and the second conductor corresponds to the outer conductor of the coaxial cable. Among them, the first conductor can form a loop with the grounded second conductor to transmit radio frequency signals.

[0051] The feeding circuit board 500 may include a feeding circuit 510, which is electrically connected to the feeding cable 100 and is configured to transmit radio frequency signals. In some embodiments, the feeding circuit board 500 may also be a printed circuit board.

[0052] As Figure 7 and Figure 8As shown, in a specific configuration for connecting a feed cable 100 and a feed circuit 510, the feed circuit board 500 may further include a connection hole 520 that penetrates the first side and the second side of the feed circuit board 500. The first conductor of the feed cable 100 may pass through the connection hole 520 from the second side of the feed circuit board 500 to the first side of the feed circuit board 500 to be electrically connected to the feed circuit 510 provided on the first side of the feed circuit board 500. The first conductor may be connected to the feed circuit 510 through a single soldering process, such as being electrically connected to corresponding terminals, pads, etc. included in the feed circuit 510.

[0053] The structure of the feed circuit board is generally of a stacked type and may include a ground layer and an insulating layer that are at least partially overlapped and arranged from the second side to the first side. That is to say, the ground layer may be located on the second side of the feed circuit board for grounding, while the insulating layer of the feed circuit board is generally located between the layer where the feed circuit is located and the ground layer to prevent the feed circuit from being short-circuited to the ground. Further, to prevent the first conductor passing through the connection hole 520 from being short-circuited to the ground layer on the second side of the feed circuit board, as Figure 9 shown, on the second side of the feed circuit board, a part of the ground layer 593 may be removed / omitted to expose the part of the insulating layer 592 surrounding the connection hole 520. In this way, when the first conductor penetrates into the connection hole 520, if it contacts the peripheral wall of the connection hole 520, then it will be in direct contact with the exposed insulating layer 592 instead of the ground layer 593, so that the first conductor and the ground layer 593 can be electrically isolated from each other.

[0054] In some embodiments, the second conductor on the outer side of the feed cable may be electrically connected to the ground layer of the feed circuit board, so that the feed cable and the feed circuit board share the same ground.

[0055] To achieve the connection between the target circuit board 200 and the feed circuit board 500, as Figure 7 and Figure 8As shown, the target circuit board 200 may include a first pad 231, a second pad 232, and a pad hole 220. Among them, the first pad 231 is disposed on the first side of the target circuit board 200, and the first pad 231 is electrically connected to the target circuit 210 disposed on the first side of the target circuit board 200. The second pad 232 is disposed on the second side of the target circuit board 200, and the second pad 232 is electrically connected to the feeding circuit 510. The pad hole 220 penetrates the target circuit board 200 and electrically connects the first pad 231 and the second pad 232. For example, the pad hole 220 may be a conductive via filled with a conductive material. In some embodiments, the first pad 231 is directly connected to the target circuit 210, and the second pad 232 is directly connected to the feeding circuit 510. In some embodiments, the feeding circuit 510 may be electrically connected to the second pad 232 by welding. In this way, the radio frequency signal carried by the feeding cable 100 can be fed to the target circuit 210 through the feeding circuit 510.

[0056] To further enhance the structural strength and stability of the signal processing device, the target circuit board 200 may also be mechanically connected to the feeding circuit board 500 in other ways. As Figure 7 and Figure 8 shown, the target circuit board 200 may include a slot 260, and the feeding circuit board 500 is inserted into the slot 260 to be mechanically connected to the target circuit board 200.

[0057] Specifically, considering that the area of the target circuit board 200 is usually larger than the area of the feeding circuit board 500, more sufficient space can be provided. Therefore, the slot 260 may be opened on the target circuit board 200. Since the thickness of the target circuit board 200 is usually thin, in order to ensure that the feeding circuit board 500 can be stably connected to the target circuit board 200, the slot 260 may be a through slot that penetrates the target circuit board 200, and the feeding circuit board 500 may be inserted into or removed from the slot 260 in a direction perpendicular or substantially perpendicular to the surface of the target circuit board 200. As Figure 7 and Figure 8 shown, the entire peripheral wall of the slot 260 can surround the periphery of the feeding circuit board 500 to help maintain the reliability of the plug-in structure between the feeding circuit board 500 and the target circuit board 200.

[0058] It can be understood that in other embodiments, the target circuit board 200 and the feeding circuit board 500 may also be mechanically connected in other ways to ensure the structural stability of the signal processing device.

[0059] In some embodiments, the position of the feeding circuit board 500 relative to the target circuit board 200 can be configured such that the maximum bending curvature of the feeding cable 100 is less than or equal to a preset curvature threshold. That is to say, by setting the feeding circuit board 500, it is possible to achieve the electrical connection between the target circuit board 200 and the feeding cable 100 while maintaining the corresponding ideal placement directions of the target circuit board 200 and the feeding cable 100, so as to feed radio frequency signals.

[0060] As Figure 7 and Figure 8 shown, the feeding circuit board 500 can be configured to be perpendicular to the target circuit board 200, and the extending direction of the feeding cable 100 can be configured to be parallel to the surface of the target circuit board 200 and perpendicular to the surface of the feeding circuit board 500.

[0061] In this exemplary embodiment, due to the stem - type connection between the feeding cable and the feeding circuit board, the introduction of additional impedance is effectively avoided, overcoming the problem that radio frequency signals, especially U - band signals, are highly sensitive to capacitive impedance and inductive impedance, ensuring a high power conversion efficiency, and achieving a good feeding effect. In addition, due to the introduction of the feeding circuit board, the setting directions of the feeding cable and the target circuit board are more flexible, thus helping to avoid excessive bending of the target circuit board and / or the feeding cable and possible damage caused by excessive bending, so as to obtain higher structural reliability. At the same time, in the signal processing device of this embodiment, there is no need for a secondary soldering process to connect the feeding device and the target device, which helps to reduce the process cost and difficulty.

[0062] The present disclosure also provides an antenna system, which may include the signal processing device described in the above embodiments.

[0063] In some embodiments, the operating band of the antenna system may be in the 3.6 - 5 GHz band or a part thereof.

[0064] In some embodiments, the antenna system may be a beam - forming antenna system to enable the transmission or reception of directional signals.

[0065] In addition, the embodiments of the present disclosure may also include the following examples:

[0066] 1. A signal processing device, the signal processing device includes a target device and a feeding device;

[0067] Wherein, the feeding device includes:

[0068] A first conductor configured to transmit radio frequency signals;

[0069] An insulating medium covering the first conductor; and

[0070] a second conductor covering the insulating medium;

[0071] wherein, a first portion of the insulating medium is covered by the second conductor, and a second portion of the insulating medium extends beyond a first end of the second conductor;

[0072] wherein, a first portion of the first conductor is covered by both the second conductor and the insulating medium, a second portion of the first conductor extends beyond the first end of the second conductor and is covered by the insulating medium, and a third portion of the first conductor extends beyond a first end of the insulating medium;

[0073] wherein, the third portion of the first conductor is configured to be connected to the target device to feed the radio frequency signal to the target device, and is configured to form a capacitive impedance with the target device, the second portion of the first conductor is configured to form an inductive impedance with the target device, and an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

[0074] 2. The device according to claim 1, wherein an absolute value of the capacitive impedance is equal to an absolute value of the inductive impedance.

[0075] 3. The device according to claim 1, wherein the third portion of the first conductor is configured to be connected to the target device by a single soldering process.

[0076] 4. The device according to claim 1, wherein the second conductor is configured to be grounded with the target device.

[0077] 5. The device according to claim 1, wherein the feeding device comprises a feeding cable.

[0078] 6. The device according to claim 5, wherein a maximum bending curvature of the feeding cable is less than or equal to a preset curvature threshold.

[0079] 7. The device according to claim 5, wherein the feeding cable is a coaxial cable.

[0080] 8. A signal processing device, the signal processing device comprising:

[0081] a target circuit board, the target circuit board comprising a substrate, a conductive component connecting a first side and an opposite second side of the substrate, and a target circuit disposed on the first side, the conductive component being electrically connected to the target circuit; and

[0082] a feeding cable, the feeding cable comprising a first conductor, the first conductor being electrically connected to the conductive component on the second side of the substrate;

[0083] Wherein, the feeding cable is configured such that a maximum bending curvature of the feeding cable in its extending direction is less than or equal to a preset curvature threshold.

[0084] 9. The device according to 8, wherein an extending direction of the feeding cable is parallel to a surface of the substrate.

[0085] 10. The device according to 8, wherein the feeding cable further comprises:

[0086] an insulating medium covering the first conductor; and

[0087] a second conductor covering the insulating medium,

[0088] wherein a first portion of the insulating medium is covered by the second conductor, and a second portion of the insulating medium extends beyond a first end of the second conductor,

[0089] wherein a first portion of the first conductor is covered by both the second conductor and the insulating medium, a second portion of the first conductor extends beyond the first end of the second conductor and is covered by the insulating medium, and a third portion of the first conductor extends beyond a first end of the insulating medium,

[0090] wherein the target circuit board forms a capacitive impedance with the third portion of the first conductor, the target circuit board forms an inductive impedance with the second portion of the first conductor, and an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

[0091] 11. The device according to 10, wherein an absolute value of the capacitive impedance is equal to an absolute value of the inductive impedance.

[0092] 12. The device according to 10, wherein the conductive component comprises:

[0093] a first pad disposed on a first side of the substrate and electrically connected to the target circuit;

[0094] a second pad disposed on a second side of the substrate and electrically connected to the first conductor; and

[0095] a pad hole penetrating through the substrate and electrically connecting the first pad and the second pad.

[0096] 13. The device according to 12, wherein a first pad area of the first pad, a second pad area of the second pad, and an extending length of the second portion of the insulating medium are configured such that an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

[0097] 14. The device according to claim 13, wherein the area of the first pad is larger than the area of the second pad.

[0098] 15. The device according to claim 12, wherein the first conductor is electrically connected to the second pad by soldering.

[0099] 16. The device according to claim 10, wherein the second conductor is grounded together with the target circuit board.

[0100] 17. The device according to claim 10, wherein the feed cable is a coaxial cable.

[0101] 18. The device according to claim 8, wherein an electrically isolated area is further provided on the first side of the target circuit board to electrically insulate the first conductor from the ground terminal of the target circuit board.

[0102] 19. The device according to claim 8, wherein the target circuit includes at least one of a calibration circuit and a power distribution circuit.

[0103] 20. A signal processing device, comprising a target device and a feed device;

[0104] Wherein, the feed device includes:

[0105] A first connection component configured to form a capacitive impedance with the target device;

[0106] A second connection component electrically connected to the first connection component and configured to form an inductive impedance with the target device;

[0107] Wherein, at least one of the first connection component and the second connection component is configured to be directly electrically connected to the target device to feed a radio frequency signal transmitted through the first connection component and the second connection component to the target device, and the absolute value of the sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

[0108] 21. The device according to claim 20, wherein the absolute value of the capacitive impedance is equal to the absolute value of the inductive impedance.

[0109] 22. A signal processing device, comprising:

[0110] A feed cable configured to transmit a radio frequency signal;

[0111] A feed circuit board including a feed circuit electrically connected to the feed cable and configured to transmit the radio frequency signal; and

[0112] A target circuit board, wherein the target circuit board includes a target circuit, the target circuit is electrically connected to the feeding circuit, and the target circuit board is mechanically connected to the feeding circuit board;

[0113] Wherein, the position of the feeding circuit board relative to the target circuit board is configured such that the maximum bending curvature of the feeding cable is less than or equal to a preset curvature threshold.

[0114] 23. The device according to 22, wherein the target circuit board includes a slot, and the feeding circuit board is inserted into the slot to be mechanically connected to the target circuit board.

[0115] 24. The device according to 22, wherein the feeding circuit board further includes a connection hole that penetrates the first side and the second side of the feeding circuit board, and the feeding circuit is disposed on the first side of the feeding circuit board;

[0116] The feeding cable includes a first conductor configured to transmit a radio frequency signal, and the first conductor penetrates from the second side to the first side of the feeding circuit board through the connection hole to be electrically connected to the feeding circuit.

[0117] 25. The device according to 24, wherein the feeding circuit board includes a ground layer and an insulating layer that are at least partially overlapped from the second side to the first side, and a part of the insulating layer surrounding the connection hole is exposed outside the ground layer to electrically isolate the first conductor and the ground layer.

[0118] 26. The device according to 22, wherein the first conductor is connected to the feeding circuit by a single soldering process.

[0119] 27. The device according to 22, wherein the target circuit board includes:

[0120] A first pad disposed on the first side of the target circuit board, and the first pad is electrically connected to a target circuit disposed on the first side of the target circuit board;

[0121] A second pad disposed on the second side of the target circuit board, and the second pad is electrically connected to the feeding circuit; and

[0122] A pad hole that penetrates the target circuit board, and the pad hole connects the first pad and the second pad.

[0123] 28. The device according to 22, wherein the feeding circuit board is configured to be perpendicular to the target circuit board, and the extending direction of the feeding cable is configured to be parallel to the surface of the target circuit board and perpendicular to the surface of the feeding circuit board.

[0124] 29. An antenna system, the antenna system comprising the signal processing device according to any one of 1 to 28.

[0125] 30. The antenna system according to 29, wherein the antenna system is configured to operate in all or part of the 3.6 to 5 GHz frequency band.

[0126] 31. The antenna system according to 29, wherein the antenna system is a beamforming antenna system.

[0127] As used herein, the words "front", "rear", "top", "bottom", "above", "below", etc., if any, are used for descriptive purposes and not necessarily to describe an invariant relative position. It should be understood that such words are interchangeable under appropriate circumstances, such that the embodiments of the present disclosure described herein, for example, can operate in other orientations different from those shown or otherwise described herein.

[0128] As used herein, the word "exemplary" means "serving as an example, instance, or illustration", rather than as a "model" to be precisely replicated. Any implementation described herein as exemplary is not necessarily to be construed as preferred or advantageous over other implementations. Moreover, the present disclosure is not limited by any theory expressed or implied in the above technical field, background art, summary of the invention, or detailed description.

[0129] As used herein, the word "substantially" means including any minor variations caused by design or manufacturing defects, tolerances of devices or components, environmental effects, and / or other factors. The word "substantially" also allows for differences from a perfect or ideal situation due to parasitic effects, noise, and other practical considerations that may exist in an actual implementation.

[0130] Additionally, the previous description may have referred to elements or nodes or features that are "connected" or "coupled" together. As used herein, unless otherwise expressly stated, "connected" means that one element / node / feature is connected (or in communication) with another element / node / feature electrically, mechanically, logically, or otherwise. Similarly, unless otherwise expressly stated, "coupled" means that one element / node / feature can be linked to another element / node / feature either directly or indirectly mechanically, electrically, logically, or otherwise to allow interaction, even if the two features may not be directly connected. That is, "coupled" is intended to encompass both direct and indirect connections of elements or other features, including connections using one or more intermediate elements.

[0131] Additionally, for reference purposes only, terms such as "first", "second", etc. may also be used herein and are not intended to be limiting. For example, unless the context clearly indicates otherwise, words such as "first", "second", and other such numerical words referring to a structure or element do not imply an order or sequence.

[0132] It should also be noted that, as used herein, the words "comprises", "comprising", "has", and any other variants thereof specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0133] In the present disclosure, the term "provide" is used broadly to encompass all ways of obtaining an object, so "providing an object" includes, but is not limited to, "purchasing", "preparing / manufacturing", "arranging / setting", "installing / assembling", and / or "ordering" the object, etc.

[0134] Those skilled in the art should also realize that the boundaries between the above operations are merely illustrative. Multiple operations can be combined into a single operation, a single operation can be distributed over additional operations, and operations can be performed at least partially overlapping in time. Moreover, alternative embodiments can include multiple instances of a particular operation, and the order of operations can be changed in various other embodiments. However, other modifications, variations, and substitutions are also possible. Therefore, the specification and drawings should be regarded as illustrative rather than restrictive.

[0135] Although some specific embodiments of the present disclosure have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The embodiments disclosed herein can be combined with each other arbitrarily without departing from the spirit and scope of the present disclosure. Those skilled in the art should also understand that the above embodiments can be modified without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A signal processing device, characterized in that, the signal processing device includes a target device and a feeding device; wherein, the feeding device includes: a first conductor configured to transmit a radio frequency signal; an insulating medium covering the first conductor; and a second conductor covering the insulating medium; wherein, a first portion of the insulating medium is covered by the second conductor, and a second portion of the insulating medium extends beyond a first end of the second conductor, wherein, a first portion of the first conductor is covered by both the second conductor and the insulating medium, a second portion of the first conductor extends beyond the first end of the second conductor and is covered by the insulating medium, and a third portion of the first conductor extends beyond a first end of the insulating medium, wherein, the third portion of the first conductor is configured to be connected to the target device to feed the radio frequency signal to the target device, and is configured to form a capacitive impedance with the target device, the second portion of the first conductor is configured to form an inductive impedance with the target device, and an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

2. The signal processing device according to claim 1, characterized in that, the absolute value of the capacitive impedance is equal to the absolute value of the inductive impedance.

3. The signal processing device according to claim 1, characterized in that, the third portion of the first conductor is configured to be connected to the target device by a single soldering process.

4. The signal processing device according to claim 1, characterized in that, the second conductor is configured to be grounded with the target device.

5. The signal processing device according to claim 1, characterized in that, the feeding device includes a feeding cable.

6. The signal processing device according to claim 5, characterized in that, a maximum bending curvature of the feeding cable is less than or equal to a preset curvature threshold.

7. The signal processing device according to claim 5, characterized in that, the feeding cable is a coaxial cable.

8. A signal processing device, characterized in that, the signal processing device includes: a target circuit board, the target circuit board includes a substrate, a conductive component connecting a first side and an opposite second side of the substrate, and a target circuit provided on the first side, the conductive component being electrically connected to the target circuit; and a feeding cable, the feeding cable includes a first conductor, an insulating medium covering the first conductor, and a second conductor covering the insulating medium, wherein, the first conductor is electrically connected to the conductive component on the second side of the substrate, a first portion of the insulating medium is covered by the second conductor, a second portion of the insulating medium extends beyond a first end of the second conductor, a first portion of the first conductor is covered by both the second conductor and the insulating medium, a second portion of the first conductor extends beyond the first end of the second conductor and is covered by the insulating medium, and a third portion of the first conductor extends beyond a first end of the insulating medium; Wherein, the target circuit board forms a capacitive impedance with a third portion of the first conductor, and the target circuit board forms an inductive impedance with a second portion of the first conductor. An absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold, and the feeding cable is configured such that a maximum bending curvature of the feeding cable in its extending direction is less than or equal to a preset curvature threshold.

9. The signal processing device according to claim 8, wherein, an extending direction of the feeding cable is parallel to a surface of the substrate.

10. The signal processing device according to claim 8, wherein, an absolute value of the capacitive impedance is equal to an absolute value of the inductive impedance.

11. The signal processing device according to claim 8, wherein, the conductive component includes: a first pad disposed on a first side of the substrate, and the first pad is electrically connected to the target circuit; a second pad disposed on a second side of the substrate, and the second pad is electrically connected to the first conductor; and a pad hole penetrating through the substrate, and the pad hole electrically connects the first pad and the second pad.

12. The signal processing device according to claim 11, wherein, a first pad area of the first pad, a second pad area of the second pad, and an extending length of the second portion of the insulating medium are configured such that an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

13. The signal processing device according to claim 12, wherein, the first pad area is greater than the second pad area.

14. The signal processing device according to claim 11, wherein, the first conductor is electrically connected to the second pad by soldering.

15. The signal processing device according to claim 8, wherein, the second conductor is grounded together with the target circuit board.

16. The signal processing device according to claim 8, wherein, the feeding cable is a coaxial cable.

17. The signal processing device according to claim 8, wherein, an electrical isolation area is further provided on the first side of the target circuit board to electrically insulate the first conductor from a ground terminal of the target circuit board.

18. The signal processing device according to claim 8, wherein, the target circuit includes at least one of a calibration circuit and a power distribution circuit.

19. A signal processing device, wherein, the signal processing device includes a target device and a feeding device; wherein, the feeding device includes: a first connection component configured to form a capacitive impedance with the target device; a second connection component electrically connected to the first connection component, and the second connection component is configured to form an inductive impedance with the target device; Wherein, at least one of the first connection component and the second connection component is configured to be directly electrically connected to the target device to feed the radio frequency signals transmitted through the first connection component and the second connection component to the target device, and the absolute value of the sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold.

20. The apparatus according to claim 19, wherein, the absolute value of the capacitive impedance is equal to the absolute value of the inductive impedance.

21. An antenna system, wherein, the antenna system includes the signal processing device according to any one of claims 1 to 20.

22. The antenna system according to claim 21, wherein, the antenna system is configured to operate in all or a part of the frequency band from 3.6 to 5 GHz.

23. The antenna system according to claim 21, wherein, the antenna system is a beamforming antenna system.

Images