A driving package module

Abstract

This application discloses a driver packaging module, relating to the field of LED current conversion technology. It includes a package body, within which a first functional module, a second functional module, and multiple package pins are packaged. The first functional module includes a rectifier module, which is soldered to the corresponding package pins for electrical connection. The second functional module includes an AC-DC control unit, which is wire-bonded to the corresponding package pins for electrical connection. This application achieves improved production efficiency and yield of the driver packaging module by soldering the first functional module with the rectifier module to the corresponding package pins for electrical connection, and by wire-bonding the second functional module with the AC-DC control unit to the corresponding package pins for electrical connection, while effectively reducing packaging difficulty.

Description

Technical Field

[0001] This application relates to the field of LED current conversion technology, and in particular to a driver packaging module. Background Technology

[0002] LEDs have been widely used in lighting products due to their energy efficiency, high efficiency, and environmental friendliness. Since LEDs require DC drive, LED lighting products need a driver power supply to convert AC power into DC power required by the LEDs before outputting it to the LED load. Existing driver power supplies typically mount the driving components, such as rectifier diodes and constant current chips, separately on a driver power supply board. This results in a large driver power supply due to the large number of components and complex wiring, occupying a significant amount of space. To reduce the size of the driver power supply, it is necessary to integrate the driving components.

[0003] Chinese patent application CN110474541A discloses a power module including an AC-DC chip and a rectifier diode chip. The AC-DC chip and the rectifier diode chip are integrated into a package with multiple pins. Four rectifier diode chips are bridged through processes such as soldering to a copper frame and wire bonding. The AC-DC chip is functionally connected to the circuit through soldering or silver paste bonding to the copper frame and multiple bonding leads.

[0004] However, the packaging method of this power module requires wire bonding between the AC-DC chip and the pins of the rectifier diode chips, resulting in low efficiency. In addition, in order to withstand the impact of sudden pulse voltage and high current and to prevent single lead breakage of the rectifier diode chips under pulse voltage and high current, multiple leads are usually required to improve reliability. This further reduces production efficiency. Furthermore, more leads will also reduce the yield of the module and increase the packaging difficulty of the power module, which needs to be improved. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a driver packaging module to improve production efficiency, product yield, and reduce packaging difficulty. The specific solution is as follows:

[0006] A driver packaging module includes a package body, wherein a first functional module, a second functional module, and a plurality of package pins are packaged and disposed within the package body.

[0007] The first functional module includes a rectifier module, which is electrically connected to the corresponding package pins;

[0008] The second functional module includes an AC-DC control unit, which is electrically connected to the corresponding package pin leads via wire bonding.

[0009] Optionally, in the drive packaging module, the package body is provided with a first connector and a second connector; the rectifier module is located between the first connector and the second connector, and the rectifier module includes a plurality of rectifier diode chips for converting AC power into DC power.

[0010] Optionally, in the driver packaging module, the first connector is provided with a first pad, a first substrate area, and a first AC input pin that are matched and combined with each other, as well as a second pad, a second substrate area, and a second AC input pin that are matched and combined with each other; the second connector is provided with a third pad, a fourth pad, and a DC positive output pin that are matched and combined with each other, as well as a third substrate area, a fourth substrate area, and a DC negative output pin that are matched and combined with each other; and the plurality of rectifier diode chips are connected to the corresponding first connector and second connector.

[0011] Optionally, in the drive packaging module, the rectifier diode chip is composed of a first rectifier diode chip, a second rectifier diode chip, a third rectifier diode chip, and a fourth rectifier diode chip. The positive terminal of the first rectifier diode chip is soldered to the first substrate area, and the negative terminal is soldered to the third pad. The negative terminal of the second rectifier diode chip is soldered to the first pad, and the positive terminal is soldered to the third substrate area. The positive terminal of the third rectifier diode chip is soldered to the second substrate area, and the negative terminal is soldered to the fourth pad. The negative terminal of the fourth rectifier diode chip is soldered to the second pad, and the positive terminal is soldered to the fourth substrate area.

[0012] Optionally, in the drive package module, one end of the first AC input pin, the second AC input pin, the DC positive output pin, and the DC negative output pin extends out of the package body and is bent to connect to an external circuit board.

[0013] Optionally, in the driving package module, the package pin includes a drain pin and a sampling pin; the drain pin is fixedly connected to the second connector, and the sampling pin is fixedly connected to the first connector; one end of the package pin extends out of the package body and is used to connect to an external circuit board.

[0014] Optionally, in the drive packaging module, the AC-DC control unit includes an AC-DC chip for managing and controlling the packaging module, wherein a metal-oxide-semiconductor field-effect transistor (MOSFET) is disposed within the AC-DC chip; a base island for mounting the AC-DC chip is disposed within the package, and a plurality of chip pads are disposed on the outer surface of the AC-DC chip for wire bonding and fixing to the drain pin, for wire bonding and fixing to the sampling pin, and for wire bonding and fixing to the ground pin.

[0015] Optionally, in the drive packaging module, the base island is integrally connected to the second connector, and any chip pad on the outer surface of the AC-DC chip is wire-connected to the DC negative output pin.

[0016] Optionally, in the drive packaging module, the base island is an independent unit, and a grounding pin is provided at one end of the base island, with its end extending out of the package body. Any of the chip pads on the outer surface of the AC-DC chip is wire-connected to the grounding pin.

[0017] Optionally, in the drive packaging module, one end of the packaging pin extending out of the package body is bent.

[0018] This application provides a driver packaging module, including a package body, in which a first functional module, a second functional module, and a plurality of package pins are packaged; the first functional module includes a rectifier module, which is soldered to a corresponding package pin for electrical connection; the second functional module includes an AC-DC control unit, which is wire-bonded to a corresponding package pin for electrical connection.

[0019] In this application, the rectifier module and the AC-DC control unit are fixed in different areas through two different functional modules, which spatially separates the connection points of the two functional modules and their corresponding package pins. This avoids the disadvantages of excessive interconnected leads, difficult wiring, and high packaging difficulty in the prior art. At the same time, in order to meet the requirements of the rectifier module to withstand sudden pulse voltage and high current impacts, the first functional module containing the rectifier module is soldered and fixed to the corresponding package pins, so that it can withstand higher current and voltage. While improving the working stability and connection reliability, this further reduces the number of leads in the package and reduces the packaging difficulty. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the first connector disclosed in Embodiment 1 of this application;

[0022] Figure 2 This is a schematic diagram of the structure of the second connector disclosed in Embodiment 1 of this application;

[0023] Figure 3 This is a schematic diagram of the structure of the second connector disclosed in Embodiment 2 of this application.

[0024] Explanation of reference numerals in the attached figures: 1. Package body; 2. First connector; 21. First pad; 22. Second pad; 23. First substrate area; 24. Second substrate area; 25. First AC input pin; 26. Second AC input pin; 27. Sampling pin; 3. Second connector; 31. Third pad; 32. Fourth pad; 33. Third substrate area; 34. Fourth substrate area; 35. DC positive output pin; 36. DC negative output pin; 37. Drain pin; 4. Base island; 41. Ground pin; 5. AC-DC chip; 51. Chip pad. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] Example 1

[0027] like Figure 1 As shown, a driver packaging module includes a package body 1. A first functional module, a second functional module, and multiple package pins are packaged and disposed within the package body 1. One end of each package pin extends out of the package body 1, and this end is bent to reduce the difficulty of soldering to an external circuit board.

[0028] Among them, such as Figure 1 , Figure 2 As shown, the first functional module includes a rectifier module, which is soldered to corresponding package pins for electrical connection. The second functional module includes an AC-DC control unit, which is wire-bonded to corresponding package pins for electrical connection. The package pins consist of a first AC input pin 25, a second AC input pin 26, a DC positive output pin 35, a DC negative output pin 36, a drain pin 37, and a sampling pin 27.

[0029] It should be mentioned that the package 1 is provided with a first connector 2 and a second connector 3. The rectifier module is located between the first connector 2 and the second connector 3, and the rectifier module includes a plurality of rectifier diode chips for converting alternating current into direct current.

[0030] The first connector 2 is provided with a first pad 21, a first substrate area 23, and a first AC input pin 25 that are matched together, as well as a second pad 22, a second substrate area 24, and a second AC input pin 26 that are matched together. The second connector 3 is provided with a third pad 31, a fourth pad 32, and a DC positive output pin 35 that are matched together, as well as a third substrate area 33, a fourth substrate area 34, and a DC negative output pin 36 that are matched together. Therefore, multiple rectifier diode chips can be connected to the corresponding first connector 2 and second connector 3 to achieve stable connection and improve connection reliability.

[0031] The rectifier diode chip consists of a first rectifier diode chip, a second rectifier diode chip, a third rectifier diode chip, and a fourth rectifier diode chip.

[0032] The positive terminal of the first rectifier diode chip is soldered to the first substrate area, and the negative terminal is soldered to the third pad 31. The negative terminal of the second rectifier diode chip is soldered to the first pad 21, and the positive terminal is soldered to the third substrate area 33. The positive terminal of the third rectifier diode chip is soldered to the second substrate area 24, and the negative terminal is soldered to the fourth pad 32. The negative terminal of the fourth rectifier diode chip is soldered to the second pad 22, and the positive terminal is soldered to the fourth substrate area 34.

[0033] like Figure 1 , Figure 2 As shown, the drain pin 37 is fixedly connected to the second connector 3, and the sampling pin 27 is fixedly connected to the first connector 2. The AC-DC control unit includes an AC-DC chip 5 for managing and controlling the packaged module. A metal-oxide-semiconductor field-effect transistor (MOSFET) is disposed within the AC-DC chip 5, and a base island 4 for mounting the AC-DC chip 5 is disposed within the package 1. Multiple chip pads 51 are disposed on the outer surface of the AC-DC chip 5, respectively for wire bonding and fixing to the drain pin 37, for wire bonding and fixing to the sampling pin 27, and for wire bonding and connecting to the ground pin 41. In this embodiment, the base island 4 is integrally connected to the second connector 3, and any chip pad 51 on the outer surface of the AC-DC chip 5 is wire bonded to the DC negative output pin 36.

[0034] This application provides a driver packaging module, including a package body 1, wherein a first functional module, a second functional module, and a plurality of package pins are packaged and disposed within the package body 1; the first functional module includes a rectifier module, which is soldered to the corresponding package pin for electrical connection; the second functional module includes an AC-DC control unit, which is wire-bonded to the corresponding package pin for electrical connection.

[0035] In this application, the rectifier module and the AC-DC control unit are fixed in different areas through two different functional modules, which spatially separates the connection points of the two functional modules and their corresponding package pins. This avoids the disadvantages of excessive interconnected leads, difficult wiring, and high packaging difficulty in the prior art. At the same time, in order to meet the requirements of the rectifier module to withstand sudden pulse voltage and high current impacts, the first functional module containing the rectifier module is soldered and fixed to the corresponding package pins, so that it can withstand higher current and voltage. While improving the working stability and connection reliability, this further reduces the number of leads in the package and reduces the packaging difficulty.

[0036] Example 2

[0037] The difference between Example 2 and Example 1 is that in Example 2, base island 4 is an independent monomer. For example... Figure 3 As shown, a grounding pin 41 is provided at one end of the base island 4, with its end extending from inside the package 1, and any chip pad 51 on the outer surface of the AC-DC chip 5 is wired to the grounding pin 41.

[0038] In summary, the driver packaging module of this application achieves electrical connection by soldering a first functional module with a rectifier module to the corresponding package pins, thereby improving the production efficiency and yield of the driver packaging module and effectively reducing packaging difficulty. Similarly, it achieves electrical connection by wire bonding a second functional module with an AC-DC control unit to the corresponding package pins, further improving production efficiency and yield while reducing packaging difficulty. Simultaneously, by forming a rectifier module composed of a first, second, third, and fourth rectifier diode chip, a stable rectifier connection structure is formed between the rectifier module, the first connector 2, and the second connector 3, thereby improving the connection reliability of the driver packaging module. Furthermore, mounting the AC-DC chip 5 on the base island 4 and connecting it via the ground pin 41 effectively enhances the connection reliability of the driver packaging module.

[0039] The terms “first,” “second,” “third,” “fourth,” etc., used in this application (if applicable) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, or apparatus that includes a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, or apparatus.

[0040] It should be noted that the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0041] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A driver packaging module, comprising a package body, characterized in that, The package body encapsulates a first functional module, a second functional module, and multiple package pins. The first functional module includes a rectifier module, which is electrically connected to the corresponding package pins; The second functional module includes an AC-DC control unit, which is electrically connected to the corresponding package pin leads by wire bonding; The package is provided with a first connector and a second connector; the rectifier module is located between the first connector and the second connector, and the rectifier module includes a plurality of rectifier diode chips for converting alternating current into direct current; The first connector is provided with a first pad, a first substrate area, and a first AC input pin that are matched and combined with each other, as well as a second pad, a second substrate area, and a second AC input pin that are matched and combined with each other; the second connector is provided with a third pad, a fourth pad, and a DC positive output pin that are matched and combined with each other, as well as a third substrate area, a fourth substrate area, and a DC negative output pin that are matched and combined with each other; a plurality of rectifier diode chips are connected to the corresponding first connector and second connector; The package pins include a drain pin and a sampling pin; the drain pin is fixedly connected to the second connector, and the sampling pin is fixedly connected to the first connector; one end of the package pin extends out of the package body and is used to connect to an external circuit board. The AC-DC control unit includes an AC-DC chip for managing and controlling the packaged module. The AC-DC chip contains a metal-oxide-semiconductor field-effect transistor (MOSFET). The package contains a base island for mounting the AC-DC chip. The outer surface of the AC-DC chip has multiple chip pads for wire bonding to the drain pin, wire bonding to the sampling pin, and wire bonding to the ground pin. The base island is integrally connected to the second connector, and any chip pad on the outer surface of the AC-DC chip is wire-connected to the DC negative output pin; or, the base island is an independent unit, and a grounding pin with its end extending out of the package is provided at one end of the base island, and any chip pad on the outer surface of the AC-DC chip is wire-connected to the grounding pin. The rectifier diode chip is composed of a first rectifier diode chip, a second rectifier diode chip, a third rectifier diode chip, and a fourth rectifier diode chip. The positive terminal of the first rectifier diode chip is soldered to the first substrate area, and the negative terminal is soldered to the third pad. The negative terminal of the second rectifier diode chip is soldered to the first pad, and the positive terminal is soldered to the third substrate area. The positive terminal of the third rectifier diode chip is soldered to the second substrate area, and the negative terminal is soldered to the fourth pad. The negative terminal of the fourth rectifier diode chip is soldered to the second pad, and the positive terminal is soldered to the fourth substrate area. One end of the first AC input pin, the second AC input pin, the DC positive output pin, and the DC negative output pin extends out of the package and is bent to connect to an external circuit board. The end of the package pin that extends out of the package body is bent.

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