Substrate processing device, substrate processing method, and computer-readable storage medium

Abstract

In order to improve the quality of the substrate, the substrate processing device includes a substrate holding part, a first drive part, a chemical liquid spraying part, a cup part, a second drive part and a control part. The substrate holding part holds a substrate having a first surface and a second surface opposite to the first surface in a horizontal position. The first drive part rotates the substrate holding part around an imaginary axis. The chemical liquid spraying part sprays chemical liquid toward the first surface of the substrate held by the substrate holding part. The cup part surrounds the circumference of the substrate holding part. The second drive part changes the relative position of the cup part in the vertical direction relative to the substrate holding part. The control part changes the relative position of the cup part in the vertical direction relative to the substrate holding part through the second drive part while performing chemical liquid processing. The chemical liquid processing is as follows: while the substrate holding part is rotated around the imaginary axis by the first drive part, the chemical liquid spraying part sprays chemical liquid toward the first surface of the substrate held by the substrate holding part to process the first surface.

Description

Technical Field

[0001] The present invention relates to a technology for treating substrates such as semiconductor wafers, liquid crystal display substrates, plasma display substrates, organic EL (Electro-Luminescence) substrates, field emission display (FED) substrates, optical display substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, and solar cell substrates using a treatment liquid. Background Art

[0002] For example, a substrate processing apparatus is known (e.g., Patent Document 1) that rotates a substrate about an imaginary axis extending in a plumb direction while holding the substrate in a horizontal position by a holding portion, while sequentially spraying various processing liquids onto the substrate, thereby performing various processing on the substrate. The various processing includes, for example, etching using a chemical solution and cleaning using a rinse solution.

[0003] In such a substrate processing apparatus, for example, a cup provided around a holding portion catches and recovers processing liquids such as a chemical solution and a rinse liquid that scatter from the substrate.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-121024 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] However, in the substrate processing apparatus of Patent Document 1, for example, droplets flying off the substrate may collide with droplets adhering to the inner wall surface of the cup, generating a splash of numerous tiny droplets. When these tiny droplets adhere to the substrate, they may contaminate the substrate surface due to the adhesion of tiny dust particles and dissolve the substrate surface due to the tiny droplets of chemical solution, potentially degrading the substrate quality.

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing technology capable of improving the quality of a substrate.

[0010] Means used to solve problems

[0011] In order to solve the above-mentioned problems, a first form of a substrate processing device includes a substrate holding part, a first drive part, a chemical liquid ejection part, a cup part, a second drive part, and a control part. The substrate holding part holds a substrate in a horizontal position, and the substrate has a first surface and a second surface opposite to the first surface. The first drive part rotates the substrate holding part around an imaginary axis. The chemical liquid ejection part ejects chemical liquid toward the first surface of the substrate held by the substrate holding part. The cup part surrounds the circumference of the substrate holding part. The second drive part changes the relative position of the cup part in the vertical direction relative to the substrate holding part. The control part changes the relative position of the cup part in the vertical direction relative to the substrate holding part through the second drive part while performing chemical liquid processing. During the chemical liquid processing, the substrate holding part is rotated around the imaginary axis by the first drive part, and the chemical liquid ejection part ejects the chemical liquid toward the first surface of the substrate held by the substrate holding part to process the first surface.

[0012] The second form of the substrate processing device is that, in the substrate processing device described in the first form, the control unit controls the liquid processing from the first moment of starting to execute the liquid processing to the second moment of ending to execute the liquid processing in the following manner: the relative position of the cup portion in the up and down directions relative to the substrate holding portion is moved downward by the second driving unit and does not move upward.

[0013] The third form of the substrate processing device is that, in the substrate processing device described in the second form, the control unit controls the speed at which the cup portion moves in the downward direction relative to the substrate holding portion in the vertical direction through the second driving unit during the liquid medicine processing, so that droplets of the liquid medicine fly from the substrate toward the dry portion of the inner wall surface of the cup portion.

[0014] A fourth form of the substrate processing apparatus is the substrate processing apparatus described in the second form or the third form, wherein the control unit controls after the second moment in the following manner: stopping the second driving unit from moving the relative position of the cup portion in the vertical direction relative to the substrate holding portion toward the downward direction.

[0015] The fifth form of the substrate processing device is a substrate processing device described in any one of the second to fourth forms, wherein the control unit controls in the following manner before the first moment: the second driving unit starts to move the relative position of the cup portion in the up and down directions relative to the substrate holding portion toward the downward direction.

[0016] A sixth aspect of the substrate processing apparatus is the substrate processing apparatus according to the first aspect, wherein the control unit controls the substrate processing apparatus so that a first operation and a second operation are alternately performed during the execution of the chemical liquid treatment. In the first operation, the second drive unit moves the cup portion downward relative to the substrate holding portion in the vertical direction. In the second operation, the second drive unit moves the cup portion upward relative to the substrate holding portion in the vertical direction.

[0017] The seventh form of the substrate processing device is that, in the substrate processing device described in the sixth form, the control unit, during the execution of the chemical liquid processing, causes the chemical liquid spraying unit to stop spraying the chemical liquid toward the first surface of the substrate held by the substrate holding unit when the second action is performed by the second driving unit.

[0018] The eighth form of the substrate processing device is, in the substrate processing device described in the sixth form or the seventh form, the control unit causes the chemical liquid spraying unit to stop spraying the chemical liquid toward the first surface of the substrate held by the substrate holding unit before stopping the execution of the first action and the second action through the second driving unit.

[0019] The ninth form of the substrate processing device is a substrate processing device described in any one of the sixth to eighth forms, wherein the control unit causes the chemical liquid spraying unit to start spraying the chemical liquid toward the first surface of the substrate held by the substrate holding unit after the control unit starts to execute the first action and the second action through the second driving unit.

[0020] A tenth aspect of the substrate processing apparatus is the substrate processing apparatus according to any one of the first to ninth aspects, further comprising: a cleaning liquid spray unit that sprays cleaning liquid toward the first surface of the substrate held by the substrate holding unit. Here, after executing the chemical liquid treatment, the control unit changes the vertical position of the cup portion relative to the substrate holding unit while executing the cleaning process. During the cleaning process, the cleaning liquid spray unit sprays the cleaning liquid toward the first surface of the substrate held by the substrate holding unit while rotating the substrate holding unit about the imaginary axis by the first driving unit, thereby cleaning the first surface.

[0021] An eleventh aspect of the substrate processing apparatus is the substrate processing apparatus according to any one of the first to ninth aspects, further comprising: a cleaning liquid ejection unit for ejecting cleaning liquid toward the first surface of the substrate held by the substrate holder; and a gas ejection unit for ejecting gas toward the first surface of the substrate held by the substrate holder. The control unit sequentially executes the chemical liquid treatment, cleaning treatment, and drying treatment. During the cleaning treatment, the cleaning liquid ejection unit ejects the cleaning liquid toward the first surface of the substrate held by the substrate holder while the first drive unit rotates the substrate holder about the imaginary axis to clean the first surface. During the drying treatment, the gas ejection unit ejects the gas toward the first surface of the substrate held by the substrate holder while the first drive unit rotates the substrate holder about the imaginary axis to dry the first surface. Furthermore, the control unit, while executing the drying treatment, changes the vertical position of the cup portion relative to the substrate holder through the second drive unit.

[0022] The twelfth form of the substrate processing device is a substrate processing device described in any one of the first to eleventh forms, wherein the control unit prohibits starting the chemical liquid treatment on the second substrate following the first substrate after completing the chemical liquid treatment on the first substrate until a predetermined time required for drying the cup portion has passed.

[0023] A thirteenth aspect of the substrate processing apparatus is the substrate processing apparatus according to any one of the first to twelfth aspects, further comprising a protective portion capable of covering the second surface of the substrate held by the substrate holding portion. In this embodiment, the control portion controls the protective portion to cover the second surface without spraying liquid onto the second surface during the chemical liquid treatment.

[0024] A fourteenth aspect of a substrate processing method is a substrate processing method in a substrate processing apparatus, the apparatus comprising a processing unit and a control unit for controlling the operation of the processing unit. The processing unit comprises a substrate holder, a first drive unit, a chemical liquid discharge unit, a cup unit, and a second drive unit. The substrate holder holds a substrate in a horizontal position, the substrate having a first surface and a second surface opposite the first surface. The first drive unit rotates the substrate holder about an imaginary axis. The chemical liquid discharge unit is capable of discharging chemical liquid toward the first surface of the substrate held by the substrate holder. The cup unit surrounds the substrate holder. The second drive unit is capable of changing the relative position of the cup unit in a vertical direction relative to the substrate holder. The substrate processing method comprises a first step and a second step. In the first step, the control unit performs chemical liquid processing by causing the chemical liquid discharge unit to discharge the chemical liquid toward the first surface of the substrate held by the substrate holder while rotating the substrate holder about the imaginary axis via the first drive unit, thereby treating the first surface. In the second step, the control unit changes the relative position of the cup portion with respect to the substrate holding portion in the vertical direction via the second driving unit during execution of the chemical liquid treatment in the first step.

[0025] A fifteenth aspect of a computer-readable storage medium stores a program that, when executed by a processor in a substrate processing apparatus comprising a processing unit and a control unit for controlling the operation of the processing unit, implements a first step and a second step. The processing unit comprises a substrate holder, a first drive unit, a chemical liquid discharge unit, a cup unit, and a second drive unit. The substrate holder holds a substrate in a horizontal position, the substrate having a first surface and a second surface opposite the first surface. The first drive unit is capable of rotating the substrate holder about an imaginary axis. The chemical liquid discharge unit is capable of discharging chemical liquid toward the first surface of the substrate held by the substrate holder. The cup unit surrounds the substrate holder. The second drive unit is capable of changing the relative position of the cup unit in a vertical direction relative to the substrate holder. In the first step, the control unit performs chemical liquid processing by causing the chemical liquid discharge unit to discharge the chemical liquid toward the first surface of the substrate held by the substrate holder while the first drive unit rotates the substrate holder about the imaginary axis, thereby treating the first surface. In the second step, the control unit changes the relative position of the cup portion with respect to the substrate holding portion in the vertical direction via the second driving unit during execution of the chemical liquid treatment in the first step.

[0026] Effects of the Invention

[0027] According to any of the substrate processing apparatuses of the first to thirteenth aspects, the substrate processing method of the fourteenth aspect, and the computer-readable storage medium of the fifteenth aspect, when, for example, a substrate is processed using a chemical liquid, the region of the inner wall surface of the cup portion that receives chemical liquid droplets scattered from the rotating substrate moves vertically. This makes it less likely that chemical liquid droplets scattered from the rotating substrate will collide with droplets adhering to the inner wall surface of the cup portion. As a result, the splashing of numerous tiny chemical liquid droplets from the inner wall surface of the cup portion is less likely to occur, thereby improving substrate quality.

[0028] According to the substrate processing apparatus of any one of the second to fifth aspects, for example, during chemical liquid processing, the cup portion moves downward relative to the substrate holding portion in the vertical direction. This makes it difficult for droplets of chemical liquid scattered from the rotating substrate to collide with droplets adhering to the inner wall surface of the cup portion. Consequently, for example, splashing of numerous minute droplets from the inner wall surface of the cup portion is less likely to occur, thereby improving substrate quality.

[0029] According to the third aspect of the substrate processing apparatus, even if a chemical liquid splashing from a rotating substrate is caught in a dry area on the inner wall of the cup, it is unlikely to cause many tiny droplets to splash from the inner wall of the cup. Therefore, for example, substrate quality can be improved.

[0030] According to the fourth aspect of the substrate processing apparatus, for example, after droplets of the chemical liquid stop flying from the rotating substrate toward the cup, downward movement of the cup relative to the substrate holding portion in the vertical direction is stopped. Consequently, for example, droplets of the chemical liquid flying from the rotating substrate are less likely to collide with droplets adhering to the inner wall surface of the cup. Consequently, for example, splashing of numerous tiny droplets from the inner wall surface of the cup is less likely to occur, thereby improving substrate quality.

[0031] According to the fifth aspect of the substrate processing apparatus, for example, droplets of chemical solution scattered from a rotating substrate are less likely to continuously collide with the same portion of the inner wall surface of the cup portion. This reduces the likelihood of splashing, such as numerous tiny droplets scattering from the inner wall surface of the cup portion, thereby improving substrate quality.

[0032] According to the substrate processing apparatus of any of the sixth to ninth aspects, for example, during chemical processing, the area on the inner wall surface of the cup portion that receives chemical droplets scattered from a rotating substrate changes. Consequently, for example, chemical droplets scattered from the rotating substrate are less likely to collide with droplets adhering to the inner wall surface of the cup portion. This reduces the likelihood of splashing, such as numerous tiny droplets scattered from the inner wall surface of the cup portion, thereby improving substrate quality.

[0033] According to the seventh aspect of the substrate processing apparatus, for example, during chemical liquid processing, when the cup portion moves upward relative to the substrate holding portion in the vertical direction, chemical liquid droplets are less likely to fly from the rotating substrate toward the cup portion. This reduces the chances of chemical liquid droplets flying from the rotating substrate colliding with droplets adhering to the inner wall surface of the cup portion. As a result, for example, splashing of numerous tiny droplets from the inner wall surface of the cup portion is less likely to occur, thereby improving substrate quality.

[0034] According to the eighth and ninth aspects of the substrate processing apparatus, for example, droplets of chemical solution scattered from a rotating substrate are less likely to continuously collide with the same portion of the inner wall surface of the cup. This reduces the likelihood of splashing, for example, caused by numerous minute droplets scattering from the inner wall surface of the cup, thereby improving substrate quality.

[0035] According to the tenth aspect of the substrate processing apparatus, for example, when cleaning a substrate after chemical liquid treatment, the relative position of the cup portion in the vertical direction relative to the substrate holding portion is changed, thereby catching droplets of cleaning liquid scattered from the rotating substrate over a wide range of the inner wall surface of the cup portion. Therefore, for example, the chemical liquid adhering to the inner wall surface of the cup portion can be rinsed with cleaning liquid during chemical liquid treatment. Thus, for example, the amount of chemical liquid adhering to the inner wall surface of the cup portion can be reduced when chemical liquid treatment is performed on the next substrate. As a result, for example, when the inner wall surface of the cup portion catches droplets of chemical liquid scattered from the rotating substrate during chemical liquid treatment of the next substrate, it becomes difficult to generate splashes of many tiny droplets from the inner wall surface of the cup portion. Therefore, for example, the quality of the substrate can be improved.

[0036] According to the eleventh aspect of the substrate processing apparatus, for example, after performing chemical treatment and cleaning on a substrate, when performing a substrate drying process, the relative position of the cup portion relative to the substrate holding portion in the vertical direction is changed. This allows the gas flowing from the first surface of the rotating substrate to be sprayed over a wide area of ​​the inner wall surface of the cup portion. Therefore, for example, the inner wall surface of the cup portion can be dried over a wide area. Thus, for example, when performing chemical treatment on the next substrate, the drier inner wall surface of the cup portion can catch droplets of chemical solution that fly off the next rotating substrate. As a result, the splash of numerous tiny droplets from the inner wall surface of the cup portion is reduced, thereby improving the quality of the substrates.

[0037] According to the twelfth aspect of the substrate processing apparatus, for example, the cup portion is fully dried. Therefore, when the inner wall surface of the cup portion receives droplets of chemical liquid scattered from the rotating substrate during chemical liquid processing on the next substrate, it is less likely to cause splashing of numerous minute droplets from the inner wall surface of the cup portion. Consequently, for example, substrate quality can be improved.

[0038] According to the thirteenth aspect of the substrate processing apparatus, for example, when the second surface is in a dry state and a chemical liquid treatment is being performed on the first surface, splashing of numerous tiny droplets from the inner wall surface of the cup portion is less likely to occur. Consequently, for example, tiny droplets of chemical liquid are less likely to adhere to the second surface, which is intended to be kept dry, thereby degrading the quality of the second surface. This can, for example, improve substrate quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a plan view showing an example of a schematic structure of the substrate processing apparatus according to the first embodiment.

[0040] Figure 2 This is a block diagram showing a configuration example of a control unit.

[0041] Figure 3 It is a side view schematically showing a structural example of a processing unit.

[0042] Figure 4 It is a side view schematically showing a structural example of a processing unit.

[0043] Figure 5 This is an enlarged view showing an example of a cross section of the lower supply unit and its vicinity.

[0044] Figure 6 This is a schematic block diagram showing an example of a gas-liquid supply unit.

[0045] Figure 7 : is a diagram showing one example of the flow of processing using the processing unit.

[0046] Figure 8 (a) and (b) are diagrams schematically showing changes in the position of the cup portion when substrate processing is performed.

[0047] Figure 9 (a) to (c) are timing charts illustrating changes in the position of the cup portion when performing liquid medicine treatment.

[0048] Figure 10 (a) and (b) are timing charts illustrating changes in the position of the cup portion during the cleaning process.

[0049] Figure 11 (a) and (b) are timing charts illustrating changes in the position of the cup portion when the drying process is performed.

[0050] Figure 12 1 is a diagram illustrating an example of a flow of processing using the processing unit of the first modification.

[0051] Figure 13(a) and (b) are diagrams schematically showing an example of a change in the position of the cup portion in the processing unit of the second modification.

[0052] Figure 14 This is a timing chart illustrating changes in the position of the cup portion when performing preliminary pure water treatment and chemical liquid treatment according to the second modification.

[0053] Figure 15 This is a schematic block diagram showing an example of a gas-liquid supply unit according to a third modification.

[0054] Figure 16 It is a side view schematically showing a configuration example of a processing unit according to a third modification.

[0055] Figure 17 (a) and (b) are diagrams schematically showing an example of a change in the position of the cup portion when substrate processing is performed according to the third modification. DETAILED DESCRIPTION

[0056] Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. The constituent elements described in each embodiment are merely illustrative and are not intended to limit the scope of the present invention to these embodiments. The drawings are merely schematic diagrams. In the drawings, the dimensions and quantities of the various components are sometimes exaggerated or simplified as needed for easy understanding. In the drawings, the same reference numerals are given to parts having the same structure and function, and repeated descriptions are omitted as appropriate. Figure 1 、 Figures 3 to 5 、 Figure 8 (a) Figure 8 (b) Figure 13 (a) Figure 13 (b) Figures 16 and 17 (b) in the figure shows a right-handed XYZ coordinate system. In this XYZ coordinate system, a horizontal direction is defined as the +X direction, a direction along the plumb bob (also called the downward direction) is defined as the -Z direction, and a direction perpendicular to both the +X and +Z directions (also called the upward direction) is defined as the +Y direction.

[0057] [1. First embodiment]

[0058] [1-1. Substrate processing apparatus]

[0059] Reference Figure 1 The structure of the substrate processing apparatus 100 will be described.

[0060] Figure 1 It is a plan view showing an example of a schematic structure of the substrate processing apparatus 100 according to the first embodiment.

[0061] The substrate processing apparatus 100 can, for example, sequentially and continuously process a plurality of substrates W. In the following description, the substrate W to be processed in the substrate processing apparatus 100 is, for example, a circular semiconductor wafer.

[0062] The substrate processing apparatus 100 includes, for example, a plurality of zones (specifically, an indexer cell 110 and a processing cell 120 ) arranged side by side and a control unit 2 for controlling various motion mechanisms of the plurality of zones (the indexer cell 110 and the processing cell 120 ).

[0063] The index area 110 can, for example, transfer unprocessed substrates W received from outside the apparatus to the processing area 120, and can also unload processed substrates W received from the processing area 120 to outside the apparatus. The index area 110 includes, for example, a carrier stage 111 capable of mounting multiple carriers C, and a substrate transport device (transfer robot IR) capable of loading and unloading substrates W from each carrier C.

[0064] A carrier C containing one or more unprocessed substrates W can be brought in from outside the substrate processing apparatus 100 and placed on the carrier table 111 by an OHT (overhead hoist transfer) or the like. For example, unprocessed substrates W are removed from the carrier C one by one and processed within the substrate processing apparatus 100, and processed substrates W that have been processed within the substrate processing apparatus 100 are again stored in the carrier C. The carrier C containing processed substrates W can be unloaded outside the substrate processing apparatus 100 by an OHT or the like. In this way, the carrier table 111 functions as a substrate accumulation unit capable of accumulating unprocessed and processed substrates W. The carrier C can be, for example, a FOUP (front opening unified pod) for storing substrates W in a sealed space, a SMIF (standard mechanical interface) cassette, or an OC (open cassette) for exposing stored substrates W to the outside air.

[0065] The transfer robot IR includes, for example, a hand 112 capable of holding a substrate W in a horizontal position (with the main surface of the substrate W horizontal) by supporting the substrate W from below, and a hand drive mechanism 113 capable of driving the hand 112. The transfer robot IR is capable of, for example, removing an unprocessed substrate W from a carrier C mounted on the carrier table 111 and transferring the removed substrate W to a transport robot CR (described later) at a substrate transfer position P. Furthermore, the transfer robot IR is capable of, for example, receiving a processed substrate W from the transport robot CR at the substrate transfer position P and storing the received substrate W on a carrier C mounted on the carrier table 111.

[0066] The processing area 120 is capable of processing substrates W. The processing area 120 includes, for example, a plurality of processing units 1 and a substrate transport device (transport robot CR) for transporting substrates W into and out of the plurality of processing units 1. Here, for example, a plurality of (for example, three) processing units 1 are stacked in the vertical direction to form a processing unit group 130. Furthermore, for example, a plurality of (in Figure 1 In the example, four processing unit groups 130 are arranged in a cluster around the transfer robot CR.

[0067] Each of the multiple processing units 1 includes, for example, a processing chamber 140, which defines a processing space therein. Each processing chamber 140 includes, for example, a loading / unloading port 15 for inserting the hand 121 of the transfer robot CR into the processing chamber 140. Therefore, the processing units 1 are positioned in a space where the transfer robot CR is located, such that the loading / unloading port 15 faces the processing chamber 140. The specific structure of the processing units 1 will be described later.

[0068] The transport robot CR includes, for example, a hand 121 capable of holding the substrate W in a horizontal position by supporting the substrate W from below, and a hand drive mechanism 122 capable of driving the hand 121. Here, the transport robot CR (specifically, the base of the transport robot CR) is located, for example, approximately in the center of a space surrounded by a plurality of processing unit groups 130. The transport robot CR can, for example, remove a processed substrate W from a designated processing unit 1 and transfer the removed substrate W to the transfer robot IR at the substrate transfer position P. In addition, the transport robot CR can, for example, receive an unprocessed substrate W from the transfer robot IR at the substrate transfer position P and transfer the received substrate W to the designated processing unit 1.

[0069] Furthermore, the substrate processing apparatus 100 includes, for example, a structure for separately supplying chemical liquids, pure water, isopropyl alcohol (IPA), and gases used when performing various processes in each processing unit 1. For example, the substrate processing apparatus 100 includes piping connected to the chemical liquid supply source 71 and valves for opening and closing the flow path of the chemical liquid from the chemical liquid supply source 71 to each processing unit 1. Figure 6 ). The chemical liquid supply source 71 includes, for example, a tank for storing chemical liquid and a pump for delivering chemical liquid from the tank. The chemical liquid is, for example, a hydrofluoric peroxide mixture (FPM), diluted hydrofluoric acid (DHF) or phosphoric acid, which is a liquid capable of etching the substrate W. In addition, for example, the substrate processing apparatus 100 has a pipe connected to the pure water supply source 72 and a valve for opening and closing the flow of pure water (DIW (de-ionized water)) from the pure water supply source 72 to each processing unit 1 ( Figure 6 The pure water supply source 72 includes, for example, a drum for storing pure water and a pump for delivering pure water from the drum. In addition, for example, the substrate processing apparatus 100 includes a pipe connected to the IPA supply source 73 and a valve for opening and closing the flow path of IPA from the IPA supply source 73 to each processing unit 1 ( Figure 6 ). The IPA supply source 73 includes, for example, a drum tank for storing IPA and a pump for delivering IPA from the drum tank. In addition, for example, the substrate processing apparatus 100 includes a pipe connected to the gas supply source 74 and a valve for opening and closing the flow path of the gas from the gas supply source 74 to each processing unit 1 ( Figure 6 The gas supply source 74 includes, for example, a cylindrical tank for storing gas and a pressure regulating valve for adjusting the pressure of the gas. Suitable gases include, for example, nitrogen (N2) or other inert gases. The chemical solution supply source 71, the pure water supply source 72, the IPA supply source 73, and the gas supply source 74 may be provided separately in the substrate processing apparatus 100, or may be provided in common in multiple substrate processing apparatuses 100, or may already be provided in a factory where the substrate processing apparatus 100 is provided.

[0070] The control unit 2 can control the operation of each component including each processing unit 1 in the substrate processing apparatus 100 , for example. Figure 2This is a block diagram showing a configuration example of the control unit 2. The control unit 2 is implemented by, for example, a general computer, and includes a communication unit 201, an input unit 202, an output unit 203, a storage unit 204, a processing unit 205, and a drive 206 connected via a bus 200Bu.

[0071] The communication unit 201 can transmit and receive signals to and from each processing unit 1 via a communication line, for example. The communication unit 201 can also receive signals from a management server for managing the substrate processing apparatus 100, for example.

[0072] The input unit 202 can input signals corresponding to, for example, an operator's actions, and includes, for example, an operating unit such as a mouse and a keyboard that can input signals corresponding to operations, a microphone that can input signals corresponding to sounds, and various sensors that can input signals corresponding to actions.

[0073] The output unit 203 can output various information in a form recognizable to the operator. The output unit 203 may include, for example, a display unit that visually outputs various information and a speaker that audibly outputs various information. The display unit may also be in the form of a touch panel integrated with at least a portion of the input unit 202.

[0074] The storage unit 204 can store, for example, the program Pg1 and various information. The storage unit 204 is composed of, for example, a non-volatile storage medium such as a hard disk or flash memory. The storage unit 204 may have a single storage medium, a structure having two or more storage media integrally, or a structure in which two or more storage media are divided into two or more parts.

[0075] The processing unit 205 includes, for example, an arithmetic processing unit 205a that functions as a processor and a memory 205b for temporarily storing information. The arithmetic processing unit 205a may be, for example, an electronic circuit such as a central processing unit (i.e., a CPU (Central Processing Unit)), and the memory 205b may be, for example, a random access memory (RAM) or the like. The processing unit 205 can realize the functions of the control unit 2 by, for example, reading and executing the program Pg1 stored in the storage unit 204. Therefore, the program Pg1 can be executed, for example, by the arithmetic processing unit 205a of the control unit 2. In addition, for example, the storage unit 204 including a storage medium storing the program Pg1 can be read by a computer. In the control unit 2, for example, the processing unit 205 performs arithmetic processing according to the order described in the program Pg1, thereby realizing various functional units for controlling the actions of the various components of the substrate processing apparatus 100. That is, the functions and operations of the substrate processing apparatus 100 are realized by executing the program Pg1 by the control unit 2 included in the substrate processing apparatus 100. In addition, part or all of the functions realized by the control unit 2 may be realized by hardware such as a dedicated logic circuit.

[0076] The drive 206 is, for example, a portion capable of attaching and detaching a portable storage medium Sm1. When the storage medium Sm1 is installed, the drive 206 can, for example, transfer data between the storage medium Sm1 and the processing unit 205. Furthermore, when the storage medium Sm1 storing the program Pg1 is installed in the drive 206, the drive 206 can read the program Pg1 from the storage medium Sm1 and store it in the storage unit 204. Here, the storage medium Sm1 storing the program Pg1 can, for example, be read by a computer.

[0077] Next, refer to Figure 1 The overall operation of the substrate processing apparatus 100 will be described. In the substrate processing apparatus 100, the control unit 2 controls the various components of the substrate processing apparatus 100 according to a processing recipe describing the transport order and processing conditions of substrates W, thereby executing a series of operations described below.

[0078] When a carrier C containing an unprocessed substrate W is placed on the carrier stage 111, the transfer robot IR removes the unprocessed substrate W from the carrier C. The transfer robot IR then moves the hand 112 holding the unprocessed substrate W to the substrate transfer position P and transfers the unprocessed substrate W to the transport robot CR at the substrate transfer position P. The transport robot CR, having received the unprocessed substrate W on its hand 121, then carries the unprocessed substrate W into the processing unit 1 specified by the processing program. The transfer of substrates W between the transfer robot IR and the transport robot CR can be performed directly between the hand 112 and the hand 121, or through a placement unit or the like provided at the substrate transfer position P.

[0079] In the processing unit 1 to which the substrate W has been loaded, predetermined processing is performed on the substrate W. The processing unit 1 will be described in detail later.

[0080] When processing of the substrate W is completed in the processing unit 1, the transport robot CR removes the processed substrate W from the processing unit 1. Next, the transport robot CR moves the hand 121 holding the processed substrate W to the substrate delivery position P and transfers the processed substrate W to the transfer robot IR at the substrate delivery position P. The transfer robot IR, having received the processed substrate W on its hand 112, stores the processed substrate W in a carrier C.

[0081] In the substrate processing apparatus 100 , the transfer robot CR and the transfer robot IR repeatedly perform the above-described transfer operation according to a processing program, and each processing unit 1 processes the substrate W according to the processing program. Thus, the substrates W are processed successively.

[0082] [1-2. Processing unit]

[0083] Figure 3 as well as Figure 4 Each of the figures schematically shows a side view of a configuration example of the processing unit 1. The processing unit 1 is, for example, a blade-type processing unit capable of performing a series of substrate processing operations, which sequentially includes etching to remove a thin film exposed from a resist on the lower surface (also called the back surface) Wb of a substrate W such as a semiconductor wafer, cleaning the substrate W, and drying the substrate W.

[0084] The processing unit 1 has, for example, a spin chuck 20 that holds the substrate W in a roughly horizontal position and rotates the substrate W. The spin chuck 20 has, for example, a center shaft 21, a rotation mechanism 22, a spin base 23, and a plurality of chuck pins 24. The center shaft 21 is a rod-shaped component having a longitudinal direction along the up-down direction and a true circular cross-section. The rotation mechanism 22 is a portion (also referred to as a first drive portion) that generates a driving force such as a motor for rotating the center shaft 21. The spin base 23 is a disk-shaped component in a roughly horizontal position, and the approximate center of the lower surface of the spin base 23 is fixed to the upper end of the center shaft 21 by a fastening member such as a screw. The plurality of chuck pins 24 are, for example, the following portion (also referred to as a substrate holding portion): a portion that is erected near the peripheral portion of the upper surface side of the spin base 23 and can hold the substrate W by gripping the peripheral portion of the substrate W. Specifically, for example, a plurality of chuck pins 24 can hold a substrate W in a horizontal position, wherein the substrate W has a lower surface Wb as a first surface and an upper surface Wu as a second surface opposite to the lower surface Wb. In other words, the upper surface Wu of the substrate W is held upward by rotating the chuck 20. In order to reliably hold, for example, a circular substrate W, it is sufficient to provide three or more chuck pins 24, which are arranged at equal angular intervals along the peripheral portion of the rotating base 23. Each chuck pin 24 has a portion for supporting the peripheral portion of the substrate W from below (also referred to as a substrate supporting portion) and a portion for pressing the outer peripheral end surface of the substrate W supported by the substrate supporting portion and holding the substrate W (also referred to as a substrate holding portion). In addition, each chuck pin 24 is configured to be able to switch between a pressed state and a released state, wherein the pressed state is a state in which the substrate holding portion presses the outer peripheral end surface of the substrate W, and the released state is a state in which the substrate holding portion is separated from the outer peripheral end surface of the substrate W. Here, when the transfer robot CR transfers the substrate W to the rotating base 23, each chuck pin 24 is set to a released state. When substrate processing is performed on the substrate W, each chuck pin 24 is set to a pressed state. When each chuck pin 24 is in the pressed state, each chuck pin 24 grips the peripheral edge of the substrate W, and the substrate W and the rotating base 23 are maintained in a substantially horizontal position with a predetermined distance therebetween. Here, for example, when the central axis 21 is rotated by the rotation mechanism 22 in accordance with an action command from the control unit 2, the rotating base 23 fixed to the central axis 21 rotates about an imaginary axis (also referred to as an imaginary axis P0) extending in the vertical direction. In other words, the rotation mechanism 22 can rotate the rotating base 23 and the plurality of chuck pins 24 about the imaginary axis P0. Thus, for example, the substrate W held in a substantially horizontal position by the plurality of chuck pins 24 can be rotated about the imaginary axis P0.

[0085] Furthermore, the processing unit 1 includes a lower supply portion 25 , for example, in a substantially central portion of the upper surface of the rotating base 23 . Figure 5This is an enlarged view showing an example of a cross-section of the lower supply unit 25 and the portion near the lower supply unit 25. The lower supply unit 25 includes, for example, a generally cylindrical main body 25b centered on the imaginary axis P0, and a generally annular plate-shaped flange 25a extending radially outward from the upper end of the main body 25b. The main body 25b is inserted into, for example, a generally cylindrical through-hole formed to pass vertically through the center of the rotating base 23. A first ejection unit 25o and a second ejection unit 26o are provided approximately in the center of the upper end surface of the main body 25b. The first ejection unit 25o and the second ejection unit 26o may be configured as openings (also referred to as ejection ports) capable of ejecting liquid. A gas flow path (also referred to as a lower annular flow path 27p) is formed between the side surface of the main body 25b and the inner circumference of the through-hole of the rotating base 23. Furthermore, an annular third ejection portion 27o is formed between the upper surface 23u of the rotating base 23 and the main body 25b, capable of ejecting gas from the lower annular flow path 27p. The flange portion 25a is arranged to extend upward from the upper surface 23u of the rotating base 23 and to extend radially outward along the upper surface 23u relative to the imaginary axis P0. The lower surface of the flange portion 25a is substantially parallel to the upper surface 23u.

[0086] In addition, the processing unit 1 has, for example, a blocking member 40, which is arranged above the rotary chuck 20. The blocking member 40 is, for example, a disc-shaped member. The lower surface of the blocking member 40 becomes a surface facing the upper surface Wu of the substrate W in approximately parallel (also called the substrate-facing surface), and has a size equal to or larger than the diameter of the substrate W. The blocking member 40 is, for example, mounted approximately horizontally on the lower end of a support shaft 42 having an approximately circular shape. The support shaft 42 is held by an arm 43 extending in the horizontal direction, for example, via a rotating mechanism 44 and a lifting mechanism 45, so as to be rotatable around a plumb axis passing through the center of the substrate W. The rotating mechanism 44 is, for example, capable of rotating the support shaft 42 around a plumb axis passing through the center of the substrate W according to an action command from the control unit 2. In addition, the control unit 2 is, for example, capable of controlling the action of the rotating mechanism 44 and rotating the blocking member 40 in the same rotation direction as the substrate W and at approximately the same rotation speed as the substrate W according to the rotation of the substrate W held by the rotary chuck 20. The lifting mechanism 45 can, for example, be configured to dispose the blocking member 40 at a position close to the spin base 23 or at a position away from the spin base 23 according to an operation command from the control unit 2. For example, the control unit 2 can control the operation of the lifting mechanism 45 to raise the blocking member 40 to a distance position (above the spin chuck 20) ​​when loading or unloading a substrate W relative to the processing unit 1. Figure 3On the other hand, when a predetermined substrate process is performed on the substrate W in the processing unit 1, the blocking member 40 is lowered to a position close to the upper surface Wu of the substrate W held by the spin chuck 20 ( Figure 4 Here, the blocking member 40 is lowered to the close position, thereby functioning as a portion (also referred to as a protection portion) capable of covering the upper surface Wu of the substrate W held by the spin chuck 20 .

[0087] Figure 6 This is a schematic block diagram illustrating an example of a gas-liquid supply unit 70 included in the processing unit 1. The gas-liquid supply unit 70 includes, for example, a lower supply unit 25 disposed approximately in the center of the rotating base 23. The lower supply unit 25 includes a first ejection unit 25o, a second ejection unit 26o, and a third ejection unit 27o. Furthermore, the gas-liquid supply unit 70 includes, for example, an upper supply unit 46 disposed approximately in the center of the lower surface of the barrier member 40. The upper supply unit 46 includes, for example, a fourth ejection unit 72o. The upper supply unit 46 may also include, for example, a fifth ejection unit 73o.

[0088] The lower supply unit 25 is connected to a chemical liquid supply source 71, a pure water supply source 72, and an IPA supply source 73, for example, via respective valves. For example, by selectively opening and closing the respective valves in response to an operation command from the control unit 2, chemical liquid, pure water, or IPA can be selectively supplied from the chemical liquid supply source 71, the pure water supply source 72, and the IPA supply source 73 to the lower supply unit 25. Furthermore, for example, the chemical liquid supplied from the chemical liquid supply source 71 to the lower supply unit 25 passes through a flow path extending through the lower supply unit 25 and is ejected from a first ejection unit 25o disposed in an upper portion of the lower supply unit 25 toward the lower surface Wb of the substrate W. In other words, the first ejection unit 25o, serving as a chemical liquid ejection unit, can eject the chemical liquid toward the lower surface Wb, serving as the first surface, of the substrate W held by a plurality of chuck pins 24, serving as a substrate holding unit. Therefore, the following processing (also referred to as chemical liquid processing) can be executed based on an operation signal from the control unit 2: while the rotation base 23 and the plurality of chuck pins 24 are rotated about the imaginary axis P0 by the rotation mechanism 22, the chemical liquid is ejected from the first ejection unit 25o toward the lower surface Wb of the substrate W held by the plurality of chuck pins 24 to treat the lower surface Wb. Furthermore, a cleaning liquid (also referred to as a cleaning liquid) such as pure water or IPA supplied to the lower supply unit 25 from the pure water supply source 72 or the IPA supply source 73 passes through a flow path extending through the lower supply unit 25 and is ejected from the second ejection unit 26o, which is provided at the upper portion of the lower supply unit 25 and serves as a cleaning liquid ejection unit, toward the lower surface Wb of the substrate W held by the spin chuck 20. Therefore, for example, the following processing (also called cleaning processing) can be performed according to the action signal from the control unit 2: while the rotating base 23 and the multiple chuck pins 24 are rotated around the imaginary axis P0 by the rotating mechanism 22, pure water or IPA or other cleaning liquid is sprayed toward the lower surface Wb of the substrate W held by the multiple chuck pins 24 through the second spray unit 26o, thereby cleaning the lower surface Wb.

[0089] The lower annular flow path 27p of the lower supply unit 25 is connected to the gas supply source 74 via a valve, for example. Here, for example, the valve is opened and closed according to an operation command from the control unit 2, thereby enabling gas (for example, an inert gas such as nitrogen gas) to be supplied from the gas supply source 74 toward the lower annular flow path 27p. Furthermore, the gas supplied from the gas supply source 74 to the lower annular flow path 27p is ejected from the annular third ejection unit 27o, which serves as a gas ejection unit, toward the lower surface Wb of the substrate W held by the spin chuck 20. Therefore, for example, the following process (also referred to as a drying process) can be performed according to an operation signal from the control unit 2: while the rotation base 23 and the plurality of chuck pins 24 are rotated about the imaginary axis P0 by the rotation mechanism 22, the third ejection unit 27o ejects gas toward the lower surface Wb of the substrate W held by the plurality of chuck pins 24, thereby drying the lower surface Wb.

[0090] The upper supply unit 46 is connected to the gas supply source 74 via a valve, for example. The valve can be opened and closed, for example, in response to an operation command from the control unit 2, thereby supplying gas (e.g., an inert gas such as nitrogen) from the gas supply source 74 to the upper supply unit 46. The gas supplied from the gas supply source 74 to the upper supply unit 46 is then ejected from the fourth ejection unit 72o toward the upper surface Wu of the substrate W. Therefore, for example, the following process for maintaining the upper surface Wu in a dry state (also referred to as a dry state) or a drying process for drying the upper surface Wu can be executed based on an action signal from the control unit 2: with the barrier member 40 positioned in a state extremely close to the upper surface Wu of the substrate W held by the spin chuck 20 (also referred to as a close state), the fourth ejection unit 72o ejects gas toward the upper surface Wu of the substrate W held by the chuck pins 24 while rotating the spin base 23 and the plurality of chuck pins 24 about the imaginary axis P0 by the rotation mechanism 22, thereby maintaining the upper surface Wu in a dry state or drying the upper surface Wu. At this time, for example, the gas ejected from the fourth ejection unit 72o flows through the gap between the barrier member 40 and the upper surface Wu of the substrate W toward the peripheral edge of the substrate W.

[0091] Alternatively, the upper supply unit 46 may be connected to the pure water supply source 72 and the IPA supply source 73 via respective valves. In this case, for example, the valves can be selectively opened and closed in response to an operation command from the control unit 2, thereby enabling the selective supply of pure water or IPA from the pure water supply source 72 and the IPA supply source 73 to the upper supply unit 46. The pure water or IPA supplied from the pure water supply source 72 or the IPA supply source 73 to the upper supply unit 46 passes through a flow path extending through the upper supply unit 46 and is ejected from a fifth ejection portion 73o provided at the lower portion of the upper supply unit 46 toward the upper surface Wu of the substrate W. Therefore, the following cleaning process can be performed according to the action signal from the control unit 2: when the blocking member 40 is arranged in a close position extremely close to the upper surface Wu of the substrate W held by the rotary chuck 20, the rotating base 23 and the multiple chuck pins 24 are rotated around the imaginary axis P0 by the rotating mechanism 22, and pure water or IPA or other cleaning liquid is sprayed toward the upper surface Wu of the substrate W held by the multiple chuck pins 24 through the fifth spray unit 73o, thereby cleaning the upper surface Wu.

[0092] In addition, the processing unit 1 has, for example, a cup portion 30, and the cup portion 30 is configured in a manner surrounding the periphery of the rotary chuck 20. The cup portion 30 has, for example, a plurality of cup members, and the plurality of cup members can be raised and lowered independently of each other by the lifting drive portion 34. Specifically, the cup portion 30 has, for example, an inner cup member 31a, a middle cup member 31b, and an outer cup member 31c. The lifting drive portion 34 can be applied to various mechanisms such as a ball screw mechanism or an air cylinder. Thus, the lifting drive portion 34 functions as, for example, a portion (also referred to as a second drive portion) that can change the relative positions of the inner cup member 31a, the middle cup member 31b, and the outer cup member 31c in the respective up and down directions relative to the rotary chuck 20 according to an action instruction from the control portion 2.

[0093] The inner cup member 31a has, for example, a shape that surrounds the spin chuck 20 and is roughly rotationally symmetrical with respect to an imaginary axis P0 passing through the center of the substrate W held by the spin chuck 20. The inner cup member 31a has, for example, a side wall portion having a cylindrical shape centered on the imaginary axis P0, and an upper inclined portion having an annular shape centered on the imaginary axis P0, and extending obliquely upward from the upper end of the side wall portion to approach the imaginary axis P0. In addition, the middle cup member 31b has, for example, a shape that further surrounds the outer peripheral portion of the inner cup member 31a configured to surround the spin chuck 20 and is roughly rotationally symmetrical with respect to the imaginary axis P0 passing through the center of the substrate W held by the spin chuck 20. The middle cup member 31b has, for example, a side wall portion having a cylindrical shape centered on the imaginary axis P0, and an upper inclined portion having an annular shape centered on the imaginary axis P0, and extending obliquely upward from the upper end of the side wall portion to approach the imaginary axis P0. Furthermore, the outer cup member 31c has, for example, a shape that further surrounds the outer peripheries of the inner cup member 31a and the middle cup member 31b, which are sequentially arranged around the spin chuck 20, and is substantially rotationally symmetrical with respect to an imaginary axis P0 passing through the center of the substrate W held by the spin chuck 20. The outer cup member 31c has, for example, a sidewall portion having a cylindrical shape centered on the imaginary axis P0, and an upper inclined portion having an annular shape centered on the imaginary axis P0, extending obliquely upward from the upper end of the sidewall portion so as to approach the imaginary axis P0.

[0094] Here, for example, when the inner cup member 31a is arranged to surround the rotating base 23 and the plurality of chuck pins 24 from the side, the liquid ejected toward the substrate W held and rotated by the spin chuck 20 flies toward the inner cup member 31a and is caught by the wall surface (also referred to as the inner wall surface) Iwa on the side of the imaginary axis P0 of the inner cup member 31a. The liquid caught by the inner cup member 31a flows down, for example, along the inner wall surface Iwa of the inner cup member 31a and is recovered through the first drain groove 32a and the first drain port 33a. In addition, for example, when the inner cup member 31a descends to the lowest part and the middle cup member 31b is arranged to surround the rotating base 23 and the plurality of chuck pins 24 from the side, the liquid ejected toward the substrate W held and rotated by the spin chuck 20 flies toward the middle cup member 31b and is caught by the wall surface (also referred to as the inner wall surface) Iwb on the side of the imaginary axis P0 of the middle cup member 31b. The liquid caught by the middle cup member 31b flows down, for example, along the inner wall surface Iwb of the middle cup member 31b and is recovered through the second drainage groove 32b and the second drainage port 33b. In addition, for example, when the inner cup member 31a and the middle cup member 31b are respectively lowered to the lowest part and the outer cup member 31c is arranged to surround the rotating base 23 and the plurality of chuck pins 24 from the side, the liquid ejected toward the substrate W held and rotated by the rotary chuck 20 is scattered toward the outer cup member 31c and is caught by the wall surface (also referred to as the inner wall surface) Iwc on the side of the imaginary axis P0 of the outer cup member 31c. The liquid caught by the outer cup member 31c flows down, for example, along the inner wall surface Iwc of the outer cup member 31c and is recovered through the third drainage groove 32c and the third drainage port 33c.

[0095] In addition, the processing unit 1 has, for example, an FFU (fan filter unit) 50. The FFU 50 can further clean the air in the clean room where the substrate processing device 100 is installed and supply it to the space in the processing chamber 140. The FFU 50 is installed on the top wall of the processing chamber 140, for example. The FFU 50 has a fan and a filter (for example, a HEPA filter (High Efficiency Particulate Air Filter)) for taking in the air in the clean room and transporting it to the processing chamber 140, and can form a downflow of clean air in the processing space in the processing chamber 140. In order to evenly disperse the clean air supplied from the FFU 50 into the processing chamber 140, a punching plate with a plurality of blow-out holes can also be arranged directly below the top wall. In addition, for example, an exhaust duct 60 connected to the exhaust mechanism is provided on a portion of the side wall of the processing chamber 140 and near the bottom wall of the processing chamber 140. Thus, for example, the air of the clean air supplied from the FFU 50 and flowing down the processing chamber 140 that has passed through the vicinity of the cup portion 30 and the like is exhausted to the outside of the apparatus through the exhaust duct 60 .

[0096] [1-3. Processing using processing units]

[0097] Figure 7 This diagram illustrates an example of a process flow using processing unit 1. This process flow is achieved by controlling the operation of various components by control unit 2. In this case, program Pg1 can be executed, for example, by a processor included in processing unit 205 of control unit 2. Here, the description focuses on one processing unit 1 in substrate processing apparatus 100.

[0098] In the substrate processing apparatus 100, the transfer robot CR first loads an unprocessed substrate W into the processing unit 1 via the loading / unloading port 15 of the processing chamber 140 (step St1). At this point, the unprocessed substrate W is held in a substantially horizontal position by a plurality of chuck pins 24. Here, the unprocessed substrate W is in a state where at least a portion of the thin film is exposed on the upper surface Wu, and a portion of the thin film is exposed from the resist on the lower surface Wb. Suitable materials for the thin film include, for example, conductive materials such as copper.

[0099] Next, in the processing unit 1, a liquid chemical treatment is performed on the lower surface Wb of the substrate W (step St2). Here, first, the blocking member 40 is lowered to a position very close to the upper surface Wu of the substrate W held by the rotary chuck 20. Thereafter, the control unit 2 performs a process for performing the following liquid chemical treatment (also referred to as the first process): while rotating the rotating base 23 and the plurality of chuck pins 24 around the imaginary axis P0 through the rotating mechanism 22, the liquid chemical is sprayed toward the lower surface Wb of the substrate W held by the plurality of chuck pins 24 through the first spray unit 25o and the lower surface Wb is treated. At this time, for example, an inert gas such as nitrogen gas is sprayed toward the upper surface Wu of the substrate W through the fourth spray unit 72o to maintain the upper surface Wu in a dry state. In addition, the control unit 2 performs the following process (also referred to as the second process): during the execution of the liquid chemical treatment in the first process, the relative position of the cup portion 30 in the vertical direction relative to the rotary chuck 20 is changed by the lifting drive unit 34. Thus, for example, when a chemical liquid treatment is performed on the substrate W, the area of ​​the inner wall surface of the cup portion 30 that receives droplets of chemical liquid scattered from the rotating substrate W moves in the vertical direction. Therefore, for example, it becomes difficult for droplets of chemical liquid scattered from the rotating substrate W to collide with droplets adhering to the inner wall surface of the cup portion 30. As a result, for example, it becomes difficult for many tiny droplets of chemical liquid scattered from the inner wall surface of the cup portion 30 to splash, and it becomes difficult for tiny droplets of chemical liquid to reach the upper surface Wu of the substrate W. Therefore, for example, it is difficult to cause problems such as contamination of the upper surface Wu of the substrate W and unintended treatment of the upper surface Wu of the substrate W, thereby improving the quality of the substrate W. Specific examples of actions when performing chemical liquid treatment will be described later.

[0100] After the above-described chemical liquid treatment is performed, a cleaning process is performed on the lower surface Wb of the substrate W in the processing unit 1 (step St3). For example, the control unit 2 performs the following cleaning process: while the rotation mechanism 22 rotates the spin base 23 and the plurality of chuck pins 24 about the imaginary axis P0, the second spray unit 26o sprays a cleaning liquid (such as pure water) toward the lower surface Wb of the substrate W held by the plurality of chuck pins 24, thereby cleaning the lower surface Wb. This removes chemical liquid and particles adhering to the lower surface Wb of the substrate W. For example, the control unit 2 may also change the vertical position of the cup 30 relative to the spin chuck 20 via the lift drive 34 while performing the cleaning process. In this case, for example, droplets of cleaning liquid scattered from the rotating substrate W are caught over a wide area of ​​the inner wall of the cup 30. Thus, the chemical liquid adhering to the inner wall of the cup 30 can be flushed away with the cleaning liquid during the chemical liquid treatment. This can, for example, reduce the amount of chemical liquid adhering to the inner wall surface of the cup portion 30 until chemical liquid treatment is performed on the next substrate W. As a result, when the inner wall surface of the cup portion 30 catches droplets of chemical liquid scattered from the rotating substrate W during chemical treatment of the next substrate W, it is less likely that many tiny droplets of chemical liquid will splash from the inner wall surface of the cup portion 30, thereby improving substrate quality. Furthermore, for example, cleaning liquid can be sprayed from the fifth discharge portion 73o toward the upper surface Wu of the substrate W in parallel with the cleaning of the lower surface Wb of the substrate W, thereby cleaning the upper surface Wu of the substrate W. Specific examples of the cleaning process will be described later.

[0101] After the above-mentioned cleaning process, a drying process is performed on the lower surface Wb of the substrate W in the processing unit 1 (step St4). Here, for example, the control unit 2 performs the following drying process: while rotating the rotating base 23 and the plurality of chuck pins 24 around the imaginary axis P0 through the rotating mechanism 22, the third ejection unit 27o ejects gas toward the lower surface Wb of the substrate W held by the plurality of chuck pins 24, thereby drying the lower surface Wb. As a result, the processing liquid and the like attached to the lower surface Wb of the substrate W are removed, so that the lower surface Wb of the substrate W becomes dry. Here, for example, the control unit 2 may also perform the drying process while changing the relative position of the cup portion 30 in the vertical direction relative to the rotating chuck 20 through the lifting drive unit 34. In this case, for example, gas flowing along the lower surface Wb of the rotating substrate W is ejected in a wide range on the inner wall surface of the cup portion 30. At this time, for example, along the arrow Dp0 ( Figure 8 (a) and Figure 8The gas flowing along the path depicted in (b)) is sprayed onto the inner wall surface of the cup portion 30. Therefore, for example, the inner wall surface of the cup portion 30 can be dried over a wide range. Thus, for example, when the next substrate W is subjected to liquid treatment, the droplets flying from the rotating substrate W can be caught by the drier inner wall surface of the cup portion 30. As a result, it becomes difficult to generate splashes of many tiny droplets of liquid flying from the inner wall surface of the cup portion 30, thereby improving the quality of the substrate W. In addition, for example, gas can be sprayed from the fourth ejection portion 72o toward the upper surface Wu of the substrate W in parallel with the drying process for the lower surface Wb of the substrate W, thereby drying the upper surface Wu of the substrate W. Specific examples of actions when performing the drying process will be described later.

[0102] Next, the processed substrate W is unloaded from the processing unit 1 through the loading / unloading port 15 of the processing chamber 140 by the transfer robot CR (step St5 ).

[0103] Next, the control unit 2 refers to a processing program, for example, to determine whether the next substrate W to be processed exists in the processing unit 1 (step St6). If an unprocessed substrate W to be processed exists in the processing unit 1, the process returns to step St1. If no unprocessed substrate W to be processed exists in the processing unit 1, the series of processes using the processing unit 1 ends.

[0104] [1-3-1. Specific operation example when executing chemical liquid treatment]

[0105] Figure 8 (a) and Figure 8 (b) in FIG. 1 is a diagram schematically showing a change in the position of the cup portion 30 in the vertical direction when substrate processing is performed. Figure 8 (a) and Figure 8 In the example (b), when the inner cup member 31a is lowered to the lowest position, the middle cup member 31b and the outer cup member 31c move between an ascending predetermined first position H0 and a descending predetermined second position L0. Figure 8 (a) shows a state where the middle cup member 31b and the outer cup member 31c are raised to a predetermined first position H0. Figure 8 (b) in FIG. 3 illustrates a state where the middle cup member 31b and the outer cup member 31c are lowered to a predetermined second position L0. Figure 8 (a) and Figure 8In (b), the double-dashed arrow Dp0 depicts the following path: by rotating the substrate W around the imaginary axis P0 using the rotary chuck 20, the droplets of the liquid or the like sprayed toward the lower surface Wb of the substrate W are scattered toward the cup portion 30. Specifically, the state in which the droplets of the liquid or the like sprayed toward the lower surface Wb of the substrate W are scattered toward the area of ​​the inner wall surface Iwb of the middle cup member 31b (also referred to as the liquid receiving area Ar1) is shown. Furthermore, in Figure 8 In (a), the double-dashed arrow Af0 depicts an example of a path of the downflow of clean air from the FFU 50 toward the inner side of the cup portion 30 (specifically, the inner wall surface Iwb of the middle cup member 31b).

[0106] Figure 9 (a) to Figure 9 (c) in FIG. 1 is a timing chart illustrating changes in the vertical position of the cup portion 30 when executing a liquid medicine treatment. Figure 9 (a) to Figure 9 (c) in the figure respectively shows the opening and closing of the valve (also called the valve for the medicinal liquid) for supplying the medicinal liquid from the medicinal liquid supply source 71 to the lower supply part 25 relative to the passage of time, and the respective changes in the position of the cup part 30 (specifically, the middle cup component 31b) in the upper and lower directions relative to the passage of time.

[0107] Here, consider e.g. Figure 9 As shown in (a) in FIG. 1 , the control unit 2 controls the period from the first moment for opening the valve for the liquid medicine and starting the liquid medicine treatment to the second moment for closing the valve for the liquid medicine and ending the liquid medicine treatment (also referred to as the liquid medicine treatment period PD1) in the following manner: the cup portion 30 (specifically, the middle cup member 31b) is moved downward in the relative position in the vertical direction relative to the rotary chuck 20 by the lifting drive unit 34 and does not move upward. When such a form is adopted, in Figure 8 (a) and Figure 8 In the example (b) of FIG, the liquid receiving area Ar1 on the inner wall surface Iwb moves upward over time. Therefore, for example, as long as the inner wall surface Iwb is dry before the start of the liquid treatment, it becomes difficult for droplets of liquid medicine scattered from the rotating substrate W to collide with droplets adhering to the inner wall surface Iwb. This reduces the likelihood of many tiny droplets of liquid medicine scattering from the inner wall surface Iwb, and makes it difficult for tiny droplets of liquid medicine to reach the upper surface Wu of the substrate W. As a result, for example, contamination of the upper surface Wu of the substrate W and unintended treatment of the upper surface Wu of the substrate W are reduced, thereby improving the quality of the substrate W.

[0108] Here, for example, the control unit 2 may control the speed at which the cup portion 30 (specifically, the middle cup member 31b) is moved downward relative to the spin chuck 20 in the vertical direction by the lifting drive unit 34 during the chemical liquid processing period PD1, so that droplets of the chemical liquid are scattered from the substrate W toward the dry portion of the inner wall surface Iwb. Such a movement speed can be determined in advance, for example, by experiments using an apparatus having a structure equivalent to that of the processing unit 1, or by simulation based on the structure of the processing unit 1. By adopting such a structure, for example, even if droplets of chemical liquid scattered from the rotating substrate W are caught in the dry area of ​​the inner wall surface Iwb, it is difficult to cause splashing of many tiny droplets from the inner wall surface Iwb, thereby improving the quality of the substrate W.

[0109] Furthermore, for example, if the control unit 2 does not spray liquid onto the upper surface Wu via the upper supply unit 46 during chemical treatment, but instead covers the upper surface Wu with the barrier member 40, the problem of small droplets of chemical liquid adhering to the upper surface Wu, which is intended to be kept dry, and thus degrading the quality of the upper surface Wu, is less likely to occur. For example, the control unit 2 may not cause the fifth ejection unit 73o to spray a cleaning liquid such as pure water or IPA onto the upper surface Wu, but instead covers the upper surface Wu with the barrier member 40. Furthermore, in this case, even if large droplets of chemical liquid splash back onto the inner wall surface Iwb, the barrier member 40 and the flow of inert gas from the fourth ejection unit 72o in the gap between the barrier member 40 and the upper surface Wu of the substrate W protect the upper surface Wu, preventing large droplets of chemical liquid from reaching the upper surface Wu of the substrate W. As a result, for example, problems such as contamination of the upper surface Wu of the substrate W and unintended processing of the upper surface Wu of the substrate W are less likely to occur, and the quality of the substrate W can be improved.

[0110] In addition, here, Figure 9 As shown in the example (a) in FIG. 1 , the control unit 2 may also control the cup portion 30 (specifically, the middle cup member 31b) to stop moving downward relative to the spin chuck 20 in the vertical direction via the lift drive 34 after the second moment of the end of the chemical liquid treatment period PD1. In this manner, for example, after the chemical liquid droplets from the rotating substrate W have finished scattering, simply stopping the cup portion 30 (specifically, the middle cup member 31b) from moving downward relative to the spin chuck 20 in the vertical direction makes it difficult for the chemical liquid droplets scattered from the rotating substrate W to collide with the droplets adhering to the inner wall surface 1wb. This makes it difficult for many tiny droplets of chemical liquid scattered from the inner wall surface 1wb to splash, thereby improving the quality of the substrate W.

[0111] In addition, here, Figure 9As shown in example (a) of FIG. 1 , the control unit 2 controls the cup portion 30 (specifically, the middle cup member 31b) to begin downward movement of the vertical position relative to the spin chuck 20 via the lift drive 34 before the first moment of the start of the chemical liquid processing period PD1. This control prevents, for example, chemical liquid droplets scattered from the rotating substrate W from continuously colliding with the same portion of the inner wall surface of the cup portion 30 (specifically, the inner wall surface Iwb of the middle cup member 31b). This reduces the likelihood of numerous tiny chemical liquid droplets scattering from the inner wall surface Iwb, thereby improving the quality of the substrate W.

[0112] In addition, for example, when the chemical liquid treatment period PD1 is a long time such as tens of seconds or more, Figure 9 As shown in (b) in FIG. 1 , the control unit 2 alternately performs the following two actions during the execution of the chemical liquid treatment: an action (also referred to as a first action) in which the cup portion 30 (specifically, the middle cup member 31b) is moved downward relative to the vertical position of the spin chuck 20 by the lifting drive unit 34; and an action (also referred to as a second action) in which the cup portion 30 (specifically, the middle cup member 31b) is moved upward relative to the vertical position of the spin chuck 20 by the lifting drive unit 34. According to such actions, for example, during the execution of the chemical liquid treatment, the liquid receiving area Ar1 on the inner wall surface Iwb for receiving droplets of the chemical liquid scattered from the rotating substrate W can be changed. At this time, for example, compared with a case where the liquid receiving area Ar1 on the inner wall surface Iwb does not change, it becomes difficult for droplets of the chemical liquid scattered from the rotating substrate W to collide with droplets attached to the inner wall surface Iwb. Furthermore, for example, even when the second action is performed, droplets of the chemical solution scattered from the rotating substrate W collide with the film-like chemical solution flowing down the inner wall surface Iwb, and splashing of many tiny droplets of the scattered chemical solution is unlikely to occur.

[0113] Furthermore, at this time, for example, as long as the liquid receiving area Ar1 in the inner wall surface Iwb is lowered by the second action, the wider area above the liquid receiving area Ar1 in the inner wall surface Iwb can be dried by the downflow of clean air along the path depicted by the arrow Af0. Therefore, in the next first action, it becomes easy to catch the droplets of the liquid medicine flying from the rotating substrate W in the relatively dry area in the inner wall surface Iwb. As a result, it is difficult to generate splashes of many tiny droplets of the liquid medicine flying from the inner wall surface Iwb. Furthermore, at this time, for example, when the middle cup member 31b is moved toward the predetermined first position H0 by the second action, as shown in FIG. Figure 8As shown in (a) in the figure, the downflow of the clean air in the path depicted by the arrow Af0 tends to flow toward the inner wall surface Iwb. Therefore, for example, even if many tiny droplets of flying liquid are splashed on the inner wall surface Iwb, the tiny droplets will be difficult to float up due to the downflow of the clean air in the path depicted by the arrow Af0. Furthermore, for example, the downflow of the clean air in the processing chamber 140 generates a flow toward the outer periphery of the blocking member 40 on the upper surface side of the blocking member 40, so that even if many tiny droplets of flying liquid are splashed on the inner wall surface Iwb, the tiny droplets of the liquid will hardly reach the upper surface Wu of the substrate W. As a result, it is difficult to cause the problem of contamination of the upper surface Wu of the substrate W and unintentional treatment of the upper surface Wu of the substrate W.

[0114] Here, if Figure 9 As shown in the example (b) in FIG, if the control unit 2 stops the first ejection unit 25o from ejecting the chemical solution toward the lower surface Wb of the substrate W held by the rotary chuck 20 before stopping the first and second actions by the lifting drive unit 34, it will become difficult for the droplets of chemical solution scattered from the rotating substrate W to continuously collide with the same portion of the inner wall surface Iwb. As a result, for example, it becomes difficult to generate splashes of many tiny droplets of chemical solution scattered from the inner wall surface Iwb, which can improve the quality of the substrate W. In addition, here, as Figure 9 As shown in the example (b) of FIG. 1 , if the control unit 2 starts to cause the first discharge unit 25o to discharge the chemical liquid toward the lower surface Wb of the substrate W held by the spin chuck 20 after the first and second operations are started by the elevating drive unit 34, it becomes difficult for chemical liquid droplets scattered from the rotating substrate W to continuously collide with the same portion of the inner wall surface 1wb. This reduces the likelihood of many tiny chemical liquid droplets scattered from the inner wall surface 1wb from splashing, thereby improving the quality of the substrate W.

[0115] Furthermore, for example, if the control unit 2 rapidly switches between the first and second operations via the lifting drive unit 34, the time it takes for droplets of the chemical solution scattered from the rotating substrate W to continuously collide with the same portion of the inner wall surface 1wb is shortened. This reduces the likelihood of many tiny droplets of chemical solution scattered from the inner wall surface 1wb from splashing, thereby improving the quality of the substrate W.

[0116] In addition, here, Figure 9As shown in example (c) of FIG. 1 , the control unit 2 may also stop the first ejection unit 25o from ejecting the chemical liquid toward the lower surface Wb of the substrate W held by the spin chuck 20 when the lift drive unit 34 executes the second action during chemical liquid processing. With this configuration, for example, chemical liquid droplets scattered from the rotating substrate W are less likely to collide with droplets adhering to the inner wall surface 1wb. This reduces the likelihood of numerous tiny chemical droplets scattering from the inner wall surface 1wb, thereby improving the quality of the substrate W.

[0117] [1-3-2. Specific Operation Example When Executing the Cleaning Process]

[0118] Figure 10 (a) and Figure 10 (b) in FIG. 1 is a timing chart illustrating changes in the position of the cup portion 30 in the vertical direction when the cleaning process is performed. Figure 10 (a) and Figure 10 (b) shows the opening and closing of the valve (also called the pure water valve) for supplying pure water from the pure water supply source 72 to the lower supply part 25 relative to the passage of time, and the respective changes in the position of the cup part 30 (specifically, the middle cup component 31b) in the upper and lower directions relative to the passage of time.

[0119] Here, consider e.g. Figure 10 As shown in (a) of FIG. 1 , the control unit 2 controls the cup portion 30 (specifically, the middle cup member 31b) in the upward direction relative to the rotary chuck 20 by means of the lifting drive 34 during the period from the moment when the valve for pure water is opened and the cleaning process is started to the moment when the valve for pure water is closed and the cleaning process is finished (also referred to as the cleaning process period PD2). Figure 10 As in the example (a) in FIG. 2 , the control unit 2 may also start moving the relative position of the cup portion 30 (specifically, the middle cup member 31b) in the vertical direction relative to the rotary chuck 20 via the lifting drive unit 34 after starting the cleaning process. In addition, the control unit 2 may also end moving the relative position of the cup portion 30 (specifically, the middle cup member 31b) in the vertical direction relative to the rotary chuck 20 via the lifting drive unit 34 before ending the cleaning process. Thus, for example, in the chemical liquid attached to the inner wall surface of the cup portion 30 due to the chemical liquid treatment, it becomes difficult to produce a portion that is not flushed by the cleaning liquid. As a result, the amount of chemical liquid attached to the inner wall surface of the cup portion 30 can be reduced until the chemical liquid treatment is performed on the next substrate W.

[0120] In addition, if Figure 10As shown in (b), the control unit 2 can also alternately perform the first action and the second action during the cleaning process. The first action is to move the cup part 30 (specifically, the middle cup component 31b) downward relative to the vertical position of the rotating chuck 20 through the lifting drive unit 34, and the second action is to move the cup part 30 (specifically, the middle cup component 31b) upward relative to the vertical position of the rotating chuck 20 through the lifting drive unit 34.

[0121] [1-3-3. Specific Operation Example When Drying Process is Executed]

[0122] Figure 11 (a) and Figure 11 (b) in FIG. 1 is a timing chart illustrating changes in the position of the cup portion 30 in the vertical direction when the drying process is performed. Figure 11 (a) and Figure 11 (b) shows the opening and closing of the valve (also called the gas valve) for supplying gas from the gas supply source 74 to the lower annular flow path 27p relative to the passage of time, and the respective changes in the position of the cup portion 30 (specifically, the middle cup component 31b) in the upper and lower directions relative to the passage of time.

[0123] Here, consider e.g. Figure 11 In the form shown in (a) of FIG. 1 , the control unit 2 controls the cup portion 30 (specifically, the middle cup member 31b) in the upward direction relative to the rotary chuck 20 by means of the lifting drive 34 during the period from the moment when the gas valve is opened and the drying process is started to the moment when the gas valve is closed and the drying process is finished (also referred to as the drying process period PD3). Here, as shown in FIG. Figure 11 As in the example (a) of FIG. 2 , the control unit 2 may also start moving the cup portion 30 (specifically, the middle cup member 31 b) in the vertical direction relative to the spin chuck 20 via the lift drive 34 after starting the drying process. Furthermore, the control unit 2 may end moving the cup portion 30 (specifically, the middle cup member 31 b) in the vertical direction relative to the spin chuck 20 via the lift drive 34 before ending the drying process. This makes it less likely that unevenness will occur in the drying of liquid adhering to the inner wall surface of the cup portion 30 due to, for example, a cleaning process. Therefore, the inner wall surface of the cup portion 30 can be kept even drier until the next substrate W is subjected to the chemical liquid treatment.

[0124] In addition, if Figure 11As shown in (b) in the figure, the control unit 2 can also alternately perform a first action and a second action during the drying process. The first action is to move the cup part 30 (specifically, the middle cup component 31b) downward relative to the relative position in the vertical direction of the rotating chuck 20 through the lifting drive unit 34, and the second action is to move the cup part 30 (specifically, the middle cup component 31b) upward relative to the relative position in the vertical direction of the rotating chuck 20 through the lifting drive unit 34.

[0125] [1-4. Summary]

[0126] As described above, in the substrate processing apparatus 100 of the first embodiment, for example, the control unit 2 changes the vertical relative position of the cup portion 30 with respect to the spin chuck 20 via the lift drive unit 34 while executing chemical liquid processing. This chemical liquid processing involves rotating the spin base 23 and the plurality of chuck pins 24 about the imaginary axis P0 via the rotation mechanism 22 while the first discharge unit 25o discharges the chemical liquid toward the lower surface Wb of the substrate W held by the plurality of chuck pins 24 to perform the treatment on the lower surface Wb. In other words, for example, during chemical liquid processing on the substrate W, the liquid receiving area Ar1 on the inner wall of the cup portion 30, which receives droplets of chemical liquid scattered from the rotating substrate W, moves vertically. This makes it less likely that droplets of chemical liquid scattered from the rotating substrate W will collide with droplets adhering to the inner wall of the cup portion 30. As a result, for example, many tiny droplets of the chemical solution are unlikely to splash from the inner wall surface of the cup portion 30, and the tiny droplets of the chemical solution are unlikely to reach the upper surface Wu of the substrate W. Therefore, for example, contamination of the upper surface Wu of the substrate W and unintended treatment of the upper surface Wu of the substrate W are unlikely to occur, thereby improving the quality of the substrate W.

[0127] [2. Modifications]

[0128] The present invention is not limited to the above-described first embodiment, and various changes and improvements can be made without departing from the spirit of the present invention.

[0129] In the first embodiment described above, for example, the control unit 2 may prohibit the start of chemical liquid treatment on a second substrate W, the next substrate W to be processed after the chemical liquid treatment is completed in the processing unit 1, until a predetermined time period has elapsed for drying the cup 30. With this configuration, for example, by fully drying the cup 30, the inner wall of the cup 30 is less likely to catch droplets of chemical liquid scattered from the rotating substrate W during chemical liquid treatment of the next substrate W to be processed. This reduces the likelihood of numerous tiny droplets of chemical liquid scattering from the inner wall of the cup 30. This can, for example, improve the quality of the substrates W.

[0130] Figure 12 1 is a diagram showing an example of a process flow using the processing unit 1 according to the first modification. Figure 12 The flowchart of Figure 7 The flowchart is based on the flowchart of FIG1 , but is modified to return to step St2 via steps St7A and St8A, instead of returning to step St1 if an unprocessed substrate W to be processed next exists in the processing unit 1 in step St6. Here, for example, similar to step St1, in step St7A, the unprocessed substrate W is loaded into the processing unit 1 via the loading / unloading port 15 of the processing chamber 140 by the transfer robot CR. Next, the control unit 2 determines whether the specified time has elapsed from the reference time (step St8A). The determination in step St8A is repeated, and the process returns to step St2 if the specified time has elapsed from the reference time. Here, the reference time can be, for example, the time when the substrate W is loaded in step St7A, or any time during the operations from steps St2 to St6. The specified time can be a predetermined time required for drying the cup portion 30. This specified time can be determined in advance through experiments using a device having a structure equivalent to that of the processing unit 1, or through simulations based on the structure of the processing unit 1. The predetermined time can be set to, for example, a few minutes or less. By adopting such a processing flow, the chemical liquid processing can be performed on the substrate W to be processed next after the cup portion 30 is sufficiently dried.

[0131] In the first embodiment, for example, the example in which droplets of the chemical solution sprayed toward the lower surface Wb of the substrate W are scattered toward the liquid receiving area Ar1 of the inner wall surface Iwb of the middle cup member 31b is used for explanation, but the present invention is not limited to this. Either the inner cup member 31a or the outer cup member 31c can replace the middle cup member 31b and serve as the middle cup member 31b.

[0132] In the first embodiment, for example, the cup portion 30 includes a plurality of cup members that can be independently raised and lowered by the raising and lowering drive unit 34 , but the present invention is not limited thereto. For example, the cup portion 30 only needs to include one or more cup members. Figure 13 (a) and Figure 13 (b) is a diagram schematically showing an example of the movement of the cup portion 30B in the processing unit 1 of the second modified example. The cup portion 30B has, for example, a cup member 31B that can be raised and lowered by a lifting drive unit 34, instead of the structure having the inner cup member 31a, the middle cup member 31b, and the outer cup member 31c as in the cup portion 30 of the first embodiment. Figure 13 (a) in the Figure 8 FIG. 3 shows a diagram in which the cup portion 30 in (a) is replaced with a cup portion 30B. Figure 13 (b) in the Figure 8 The cup portion 30 in (b) is replaced with the cup portion 30B. Figure 13 (a) and Figure 13 (b) in the figure shows an example in which the cup member 31B moves between a first predetermined rising position H0 and a second predetermined falling position L0. In this case, for example, the cup member 31B and the inner wall surface IwB of the cup member 31B play the role of the middle cup member 31b and the inner wall surface Iwb of the middle cup member 31b in the first embodiment. Figure 13 (a) in FIG. 3 illustrates a state where the cup member 31B rises to a predetermined first position H0. Figure 13 (b) in FIG. 3 illustrates a state where the cup member 31B has descended to a predetermined second position L0 .

[0133] Here, for example, the following pre-treatment (also referred to as pre-purified water treatment) may be performed immediately before the start of the chemical liquid treatment: while the spin chuck 20 rotates the substrate W about the imaginary axis P0, the second spray unit 26o sprays pure water onto the lower surface Wb of the substrate W, causing the pure water to adhere to the lower surface Wb. In this case, for example, before the start of the pre-purified water treatment or the start of the chemical liquid treatment, the lift drive unit 34 may begin to move the cup member 31B downward relative to the spin chuck 20 in the vertical direction. Thus, for example, in the initial stages of the chemical liquid treatment, dry areas of the inner wall surface IwB of the cup member 31B that were not wetted by the pre-purified water treatment can catch droplets of chemical liquid that fly from the lower surface Wb of the rotating substrate W. This, for example, reduces the chance of many tiny droplets of chemical liquid flying off the inner wall surface IwB of the cup 30B from splashing, and makes it difficult for the tiny droplets of chemical liquid to reach the upper surface Wu of the substrate W. As a result, for example, problems such as contamination of the upper surface Wu of the substrate W and unintended processing of the upper surface Wu of the substrate W are less likely to occur, and the quality of the substrate W can be improved.

[0134] Figure 14 This is a timing chart illustrating changes in the position of the cup portion 30 (specifically, the cup member 31B) during execution of the preliminary pure water treatment and the chemical liquid treatment according to the second modification. Figure 14 The opening and closing of the valve for supplying pure water from the pure water supply source 72 to the lower supply part 25 (also referred to as the pure water valve) and the opening and closing of the valve for supplying liquid medicine from the liquid medicine supply source 71 to the lower supply part 25 (also referred to as the liquid medicine valve) are respectively shown relative to the passage of time, and the respective changes in the position of the cup part 30 (specifically, the middle cup member 31B) in the vertical direction relative to the passage of time. Figure 142 shows an example in which the vertical position of the cup member 31B relative to the spin chuck 20 is moved downward by the lift drive 34 from before the start of the preliminary pure water treatment to after the completion of the chemical liquid treatment.

[0135] In the first embodiment described above, for example, the first surface to which the chemical liquid is sprayed during chemical liquid treatment is the lower surface Wb of the substrate W. However, the present invention is not limited thereto, and the first surface may also be the upper surface Wu of the substrate W. Here, for example, the chemical liquid may be sprayed toward the upper surface Wu of the substrate W from the upper supply portion 46 provided on the barrier member 40; or the chemical liquid may be sprayed toward the upper surface Wu of the substrate W from a nozzle that is movable between an area between the barrier member 40 and the rotating base 23, which is positioned away from the rotating base 23, and an area that is withdrawn from the rotating base 23. In addition, in this case, the rotating base 23 may adopt other structures capable of holding the substrate W in place of the plurality of chuck pins 24, such as a vacuum chuck capable of adsorbing the lower surface Wb of the substrate W.

[0136] Figure 15 : is a schematic block diagram showing an example of a gas-liquid supply unit 70C of a third modified example. The gas-liquid supply unit 70C is based on the gas-liquid supply unit 70 of the first embodiment described above, and the upper supply unit 46 is changed to an upper supply unit 46C. The upper supply unit 46C further includes a sixth ejection unit 71o as a liquid chemical ejection unit. The sixth ejection unit 71o can eject the liquid chemical supplied from the liquid chemical supply source 71 via the valve toward the upper surface Wu of the substrate W. Figure 15 In the example of FIG. 5 , the sixth discharge unit 71 o discharges the chemical liquid toward the upper surface Wu of the substrate W rotated about the imaginary axis P0 by the spin chuck 20 , thereby performing chemical liquid treatment on the upper surface Wu of the substrate W.

[0137] Figure 16 FIG. 1 is a side view schematically showing a configuration example of a processing unit 1C according to a third modification. Figure 16 In the example, the processing unit 1C is based on the processing unit 1 of the above-mentioned first embodiment and further has: a processing liquid supply part 60C, when the blocking member 40 is arranged at a position away from the rotating base 23, the nozzle part 61C of the processing liquid supply part 60C as the liquid ejection part can be moved between the area between the blocking member 40 and the rotating base 23 and the area retreated from the rotating base 23 by rotating the arm 62C. Figure 16 The nozzle portion 61C is shown in the figure as being located in the region between the barrier member 40 and the rotating base 23. Figure 16In the example, when the nozzle portion 61C is located in the region between the barrier member 40 and the spin base 23 , the nozzle portion 61C can eject the chemical solution toward the upper surface Wu of the substrate W rotated about the imaginary axis P0 by the spin chuck 20 .

[0138] When performing a chemical liquid treatment on the upper surface Wu of the substrate W, for example, the third discharge unit 27o discharges gas toward the lower surface Wb of the substrate W. Similar to the chemical liquid treatment on the lower surface Wb in the first embodiment, by adjusting the vertical position of the cup 30 relative to the spin chuck 20 using the lift drive 34, the numerous tiny droplets of chemical liquid that scatter from the inner wall of the cup 30 are less likely to splash, and the tiny droplets of chemical liquid are less likely to reach the lower surface Wb of the substrate W. As a result, for example, contamination of the lower surface Wb of the substrate W and unintended treatment of the lower surface Wb of the substrate W are less likely to occur, thereby improving the quality of the substrate W.

[0139] Figure 17 (a) and Figure 17 (b) is a diagram schematically showing an example of a change in the position of the cup portion 30 when substrate processing is performed in the third modification. Figure 8 (a) and Figure 8 Similarly, in the example (b) Figure 17 (a) and Figure 17 In the example (b), when the inner cup member 31a is lowered to the lowest position, the middle cup member 31b and the outer cup member 31c move between an ascending predetermined first position H0 and a descending predetermined second position L0. Figure 17 (a) shows a state where the middle cup member 31b and the outer cup member 31c are raised to a predetermined first position H0. Figure 17 (b) in FIG. 3 illustrates a state where the middle cup member 31b and the outer cup member 31c are lowered to a predetermined second position L0. Figure 17 (a) and Figure 17 In (b), the double-dashed arrow Dp0 depicts the following path: the path of the droplets of the liquid sprayed toward the upper surface Wu of the substrate W through the nozzle portion 61C flying toward the cup portion 30 due to the substrate W being rotated around the imaginary axis P0 by the rotary chuck 20. Specifically, the state of the droplets of the liquid sprayed toward the upper surface Wu of the substrate W flying toward the liquid receiving area Ar1 of the inner wall surface Iwb of the middle cup member 31b is shown. Figure 8 Similarly, in (a) Figure 17 In (a), the double-dashed arrow Af0 depicts an example of a path of the downflow of clean air from the FFU 50 toward the inner side of the cup portion 30 (specifically, the inner wall surface Iwb of the middle cup member 31b).

[0140] Here, for example, when the control unit 2 changes the relative position of the cup portion 30 in the vertical direction with respect to the spin chuck 20 via the lifting drive unit 34 during the execution of the chemical liquid treatment for spraying the chemical liquid toward the upper surface Wu of the substrate W through the nozzle portion 61C to treat the upper surface Wu (during the chemical liquid treatment), the liquid receiving area Ar1 on the inner wall surface of the cup portion 30 for receiving the droplets of the chemical liquid flying from the rotating substrate W moves in the vertical direction. As a result, for example, the droplets of the chemical liquid flying from the rotating substrate W become less likely to collide with the inner wall surface of the cup portion 30 (in the case of the liquid droplet). Figure 17 In the example, the droplets are on the inner wall surface 1wb of the middle cup member 31b. As a result, for example, it is difficult to produce splashes of many tiny droplets of the liquid medicine flying from the inner wall surface of the cup portion 30. Therefore, for example, it is difficult for the tiny droplets of the liquid medicine to reach the lower surface Wb of the substrate W that is not the object of the liquid medicine treatment, and it is difficult for the tiny droplets of the liquid medicine to reach the upper surface Wu of the substrate W that is the object of the liquid medicine treatment. As a result, for example, it is difficult to produce problems such as contamination of the lower surface Wb of the substrate W and unintentional treatment of the lower surface Wb of the substrate W. In addition, for example, it is difficult to produce problems such as contamination of the upper surface Wu of the substrate W and unintentional excessive treatment of the upper surface Wu of the substrate W. Therefore, the quality of the substrate W can be improved. In addition, similar to the first embodiment described above, the form in which the relative position of the cup portion 30 in the vertical direction relative to the rotating chuck 20 is changed by the lifting drive portion 34 can also be applied to the form in which the cup portion 30 (for example, the middle cup component 31b) is moved downward in the relative position in the vertical direction relative to the rotating chuck 20 by the lifting drive portion 34 and does not move upward. The form in which the lifting drive portion 34 alternately performs a first action and a second action can also be applied, wherein the first action is the action in which the cup portion 30 (for example, the middle cup component 31b) moves downward in the relative position in the vertical direction relative to the rotating chuck 20, and the second action is the action in which the cup portion 30 (for example, the middle cup component 31b) moves upward in the relative position in the vertical direction relative to the rotating chuck 20.

[0141] In the first embodiment described above, for example, the first discharge portion 25o serving as the chemical liquid discharge portion and the second discharge portion 26o serving as the cleaning liquid discharge portion in the lower supply portion 25 may be separate discharge portions or the same discharge portion. Furthermore, the sixth discharge portion 71o serving as the chemical liquid discharge portion and the fifth discharge portion 73o serving as the cleaning liquid discharge portion in the upper supply portion 46 may be separate discharge portions or the same discharge portion.

[0142] In the first embodiment described above, for example, as long as the cup portion 30 (for example, the middle cup member 31b) is moved downward relative to the vertical position of the rotary chuck 20 by the lifting drive portion 34 at the end of the liquid treatment period PD1, unintentional treatment and excessive treatment are unlikely to occur on the upper surface Wu and the lower surface Wb of the substrate W until the start of the cleaning treatment period PD2.

[0143] In the first embodiment described above, for example, the cup portion 30 is raised and lowered by the lift drive 34, thereby changing the vertical position of the cup portion 30 relative to the spin chuck 20. However, the present invention is not limited thereto. The lift drive 34 may also raise and lower at least one of the spin chuck 20 and the cup portion 30, thereby changing the vertical position of the cup portion 30 relative to the spin chuck 20.

[0144] In the first embodiment described above, for example, when the vertical position of the cup portion 30 relative to the spin chuck 20 is moved downward by the elevating drive 34, the vertical position of the cup portion 30 relative to the spin chuck 20 may be slightly vibrated or shaken while the cup portion 30 is moved downward. Therefore, the configuration in which the vertical position of the cup portion 30 relative to the spin chuck 20 is controlled so as to be moved downward and not moved upward by the elevating drive 34 includes, for example, a configuration in which the vertical position of the cup portion 30 relative to the spin chuck 20 is moved downward while the vertical position of the cup portion 30 relative to the spin chuck 20 is slightly vibrated or shaken. In addition, for example, in at least one of the first action and the second action, the relative position of the cup portion 30 in the vertical direction relative to the rotary chuck 20 can be changed in a manner of slight vibration or shaking. The first action is an action of moving the relative position of the cup portion 30 in the vertical direction relative to the rotary chuck 20 downward by the lifting drive portion 34, and the second action is an action of moving the relative position of the cup portion 30 in the vertical direction relative to the rotary chuck 20 upward by the lifting drive portion 34.

[0145] In the first embodiment described above, for example, a sensor such as an imaging element capable of monitoring the dryness of the inner wall surface of the cup portion 30 may be provided in the processing unit 1, and various image processing such as binarization may be performed on the image obtained by the sensor, thereby enabling recognition of the dryness of the inner wall surface of the cup portion 30. In this case, for example, the control unit 2 may control the speed at which the cup portion 30 is moved downward relative to the spin chuck 20 in the vertical direction by the lift drive unit 34 during the chemical liquid processing period PD1, based on the recognition result of the dryness of the inner wall surface of the cup portion 30, so as to cause droplets of the chemical liquid to fly from the substrate W toward the dry portion of the inner wall surface 1wb.

[0146] Of course, all or part of the contents constituting the first embodiment and the various modifications described above can be appropriately combined within a range that does not conflict with the above.

[0147] Description of Reference Numerals

[0148] 1, 1C: processing unit,

[0149] 2: Control Department,

[0150] 20: Rotating chuck,

[0151] 22: Rotating mechanism,

[0152] 23: rotating base,

[0153] 24: Chuck pin,

[0154] 25: Lower supply unit,

[0155] 25°: First ejection part,

[0156] 26o: Second ejection part,

[0157] 27o: The third ejection part,

[0158] 30, 30B: cup,

[0159] 31B: cup component,

[0160] 31a: inner cup component,

[0161] 31b: middle cup component,

[0162] 31c: outer cup component,

[0163] 34: Lifting drive unit,

[0164] 40: blocking components,

[0165] 46, 46C: upper supply part,

[0166] 60C: Treatment liquid supply unit,

[0167] 61C: nozzle part,

[0168] 70, 70C: gas and liquid supply part,

[0169] 71o: Sixth ejection part,

[0170] 72o: Fourth ejection part,

[0171] 73o: Fifth ejection part,

[0172] 100: substrate processing equipment,

[0173] 205: Processing Department,

[0174] Ar1: Liquid receiving area,

[0175] H0: first position,

[0176] L0: second position,

[0177] P0: imaginary axis,

[0178] PD1: During the treatment period,

[0179] PD2: During cleaning process,

[0180] PD3: During the drying process,

[0181] Pg1: Program,

[0182] W: substrate,

[0183] Wb: lower surface,

[0184] Wu: upper surface.

Claims

1. A substrate processing device, wherein: have: a substrate holding portion for holding a substrate in a horizontal position, wherein the substrate has a first surface and a second surface opposite to the first surface; The first driving unit rotates the substrate holding unit around an imaginary axis. a chemical liquid ejecting portion ejecting a chemical liquid toward the first surface of the substrate held by the substrate holding portion; a cup portion surrounding the substrate holding portion, a second driving portion that changes the relative position of the cup portion in the vertical direction with respect to the substrate holding portion, and The control unit changes the relative position of the cup portion in the vertical direction with respect to the substrate holding portion via the second driving unit while performing the chemical liquid treatment. During the chemical liquid treatment, the substrate holding portion is rotated about the imaginary axis via the first driving unit, while the chemical liquid ejecting unit ejects the chemical liquid toward the first surface of the substrate held by the substrate holding portion to treat the first surface. The control unit controls the liquid treatment period from the first moment of starting to execute the liquid treatment to the second moment of ending to execute the liquid treatment in the following manner: starting from the second driving unit moving the cup portion downward in the relative position in the up and down directions with respect to the substrate holding portion, during the period from the beginning to the end of the liquid treatment period, the liquid scattered from the substrate is caught by a cup member in the cup portion.

2. The substrate processing apparatus according to claim 1, wherein: During the chemical liquid treatment, the control unit controls the second drive unit so that the relative position of the cup portion with respect to the substrate holding portion in the vertical direction moves downward and does not move upward.

3. The substrate processing apparatus according to claim 2, wherein: During the liquid medicine treatment, the control unit controls the speed at which the cup portion moves downward in the vertical direction relative to the substrate holding portion through the second driving unit, so that droplets of the liquid medicine fly from the substrate toward the dry portion of the inner wall surface of the cup portion.

4. The substrate processing apparatus according to claim 2 or 3, wherein: After the second timing, the control unit controls the second drive unit to stop moving the relative position of the cup portion with respect to the substrate holding portion in the vertical direction in the downward direction.

5. The substrate processing apparatus according to claim 2 or 3, wherein: The control unit controls the second drive unit to start moving the relative position of the cup portion with respect to the substrate holding portion in the vertical direction in the downward direction before the first time. The substrate processing apparatus according to claim 1 , wherein: During the execution of the liquid medicine treatment, the control unit controls the first action and the second action to be performed alternately, wherein the first action is to move the relative position of the cup portion in the up-down direction relative to the substrate holding portion downwardly through the second driving unit, and the second action is to move the relative position of the cup portion in the up-down direction relative to the substrate holding portion upwardly.

7. The substrate processing apparatus according to claim 6, wherein: The control unit controls the chemical liquid discharge unit to stop discharging the chemical liquid toward the first surface of the substrate held by the substrate holding unit when the second operation is performed by the second driving unit during the chemical liquid treatment.

8. The substrate processing apparatus according to claim 6 or 7, wherein: The control unit controls the chemical liquid discharge unit to stop discharging the chemical liquid toward the first surface of the substrate held by the substrate holding unit before the second drive unit stops performing the first operation and the second operation.

9. The substrate processing apparatus according to claim 6 or 7, wherein: The control unit controls the chemical liquid discharge unit to start discharging the chemical liquid toward the first surface of the substrate held by the substrate holding unit after the second drive unit starts executing the first operation and the second operation.

10. The substrate processing apparatus according to any one of claims 1 to 3, 6, and 7, wherein: The device comprises: a cleaning liquid spraying portion for spraying cleaning liquid toward the first surface of the substrate held by the substrate holding portion; After executing the liquid treatment, the control unit performs a cleaning process while changing the relative position of the cup portion in the up and down directions relative to the substrate holding portion through the second driving unit. During the cleaning process, the substrate holding portion is rotated about the imaginary axis through the first driving unit, while the cleaning liquid spraying unit is caused to spray the cleaning liquid toward the first surface of the substrate held by the substrate holding portion to clean the first surface.

11. The substrate processing apparatus according to any one of claims 1 to 3, 6, and 7, wherein: have: a cleaning liquid ejecting portion configured to eject cleaning liquid toward the first surface of the substrate held by the substrate holding portion; and a gas ejection portion ejecting gas toward the first surface of the substrate held by the substrate holding portion; The control unit sequentially executes: The liquid treatment, cleaning processing, wherein the cleaning liquid ejecting unit ejects the cleaning liquid toward the first surface of the substrate held by the substrate holding unit while the substrate holding unit is rotated about the imaginary axis by the first driving unit to clean the first surface; and a drying process in which the first driving unit rotates the substrate holding unit about the imaginary axis while the gas ejecting unit ejects the gas toward the first surface of the substrate held by the substrate holding unit to dry the first surface; The control unit changes the relative position of the cup portion with respect to the substrate holding portion in the vertical direction via the second driving unit while executing the drying process.

12. The substrate processing apparatus according to any one of claims 1 to 3, 6, and 7, wherein: After the chemical liquid treatment on the first substrate is completed, the control unit prohibits starting the chemical liquid treatment on the second substrate following the first substrate until a preset time required for drying the cup portion has elapsed.

13. The substrate processing apparatus according to any one of claims 1 to 3, 6, and 7, wherein: comprising: a protection portion capable of covering the second surface of the substrate held by the substrate holding portion; When executing the chemical liquid treatment, the control unit does not discharge liquid onto the second surface but causes the protection unit to cover the second surface.

14. A substrate processing method, which is a substrate processing method in a substrate processing apparatus, wherein: The substrate processing apparatus includes a processing unit and a control unit that controls the operation of the processing unit; The processing unit has: a substrate holding portion for holding a substrate in a horizontal position, wherein the substrate has a first surface and a second surface opposite to the first surface; The first driving unit rotates the substrate holding unit around an imaginary axis. The chemical liquid ejecting portion is capable of ejecting the chemical liquid toward the first surface of the substrate held by the substrate holding portion. a cup portion surrounding the substrate holding portion, and a second driving portion capable of changing a relative position of the cup portion with respect to the substrate holding portion in a vertical direction; The substrate processing method includes a first step and a second step. In the first step, the control unit performs the following chemical liquid treatment: while rotating the substrate holding unit about the imaginary axis by the first driving unit, the chemical liquid ejecting unit ejects the chemical liquid toward the first surface of the substrate held by the substrate holding unit to treat the first surface. In the second step, the control unit changes the relative position of the cup portion with respect to the substrate holding portion in the vertical direction via the second driving unit during the execution of the chemical liquid treatment in the first step. In the second process, the control unit controls the liquid treatment period from the first moment of starting to execute the liquid treatment in the first process to the second moment of ending to execute the liquid treatment in the following manner: starting from the second driving unit moving the cup portion downwardly relative to the substrate holding portion in the vertical direction, during the period from the beginning to the end of the liquid treatment period, the liquid scattered from the substrate is caught by a cup member in the cup portion.

15. A computer-readable storage medium storing a program, wherein: The program realizes the first step and the second step when executed by a processor of a control unit in a substrate processing apparatus having a processing unit and a control unit for controlling the operation of the processing unit; The processing unit has: a substrate holding portion for holding a substrate in a horizontal position, wherein the substrate has a first surface and a second surface opposite to the first surface; a first driving unit capable of rotating the substrate holding unit about an imaginary axis; a chemical liquid ejecting portion capable of ejecting chemical liquid toward the first surface of the substrate held by the substrate holding portion; a cup portion surrounding the substrate holding portion; as well as a second driving portion capable of changing a relative position of the cup portion with respect to the substrate holding portion in a vertical direction; In the first step, the control unit executes the following chemical liquid treatment: while the first driving unit rotates the substrate holding unit about the imaginary axis, the chemical liquid discharge unit discharges the chemical liquid toward the first surface of the substrate held by the substrate holding unit to treat the first surface; In the second step, the control unit changes the relative position of the cup portion with respect to the substrate holding portion in the vertical direction via the second driving unit during the execution of the chemical liquid treatment in the first step. In the second process, the control unit controls the liquid treatment period from the first moment of starting to execute the liquid treatment in the first process to the second moment of ending to execute the liquid treatment in the following manner: starting from the second driving unit moving the cup portion downwardly relative to the substrate holding portion in the vertical direction, during the period from the beginning to the end of the liquid treatment period, the liquid scattered from the substrate is caught by a cup member in the cup portion.

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