IC tray feeding device, IC processing equipment and IC tray feeding method

Abstract

The embodiments of the present application belong to the field of mechanical processing, and relate to an IC tray feeding device, IC processing equipment, and IC tray feeding method. The IC tray feeding device of the present application includes: a mounting frame, an adjustment component, a discharge component, and a conveying component. The adjustment component includes an adjustment rail, an adjustment block, and a locking piece. The adjustment rail is installed on the mounting frame, and the locking piece is connected to the adjustment block; the conveying component includes a first guide bar, a second guide bar, and a transmission component. The first guide bar is fixed on the mounting frame, and the second guide bar is arranged parallel to the first guide bar to form a conveying track. The second guide bar is fixedly connected to the adjustment block, and the conveying track includes a feed end and a discharge end; the discharge component is connected to the feed end of the conveying track. The solution provided by the present application is easy to operate, saves material costs, and improves machine utilization.

Description

Technical Field

[0001] The present application relates to the field of mechanical processing, and more specifically, to an IC tray feeding device, IC processing equipment and an IC tray feeding method. Background Art

[0002] The currently commonly used IC tray feeding device is mainly a guide structure designed individually according to the size of a certain IC tray, and is not adjustable. That is, the existing IC tray feeding device can only be used for a single IC tray. If ICs of different sizes need to be processed, the corresponding IC tray size will change, and it is necessary to replace multiple structural parts in the IC tray feeding device, which will result in high material costs, cumbersome replacement operations, and large workloads. In addition, after the structural parts are replaced, debugging is required, and the debugging process is time-consuming and labor-intensive, which correspondingly leads to reduced IC processing efficiency. Summary of the invention

[0003] Based on the above background, an embodiment of the present application provides an IC tray feeding device, IC processing equipment and IC tray feeding method to solve the problem in the prior art that when processing different IC sizes, multiple structural parts in the IC tray feeding device need to be replaced, the material cost is high, the replacement operation is cumbersome, the workload is large, and debugging is required after the replacement of the structural parts, which correspondingly leads to low efficiency.

[0004] In order to solve the above technical problems, the embodiment of the present application provides an IC tray feeding device, comprising: a mounting frame, an adjustment component, a material discharge component and a conveying component, wherein:

[0005] The adjustment assembly comprises an adjustment rail, an adjustment block and a locking member, wherein the adjustment rail is mounted on the mounting frame, the adjustment block can slide on the adjustment rail, and the locking member is connected to the adjustment block, and the locking member can fix the adjustment block at any position of the adjustment rail;

[0006] The conveying assembly includes a first guide bar, a second guide bar and a transmission component, the first guide bar is fixed to the mounting frame, the second guide bar is arranged in parallel with the first guide bar to form a conveying track, the second guide bar is fixedly connected to the adjustment block so that the distance between the second guide bar and the first guide bar is adjustable, the conveying track includes a feed end and a discharge end, and the transmission component can reciprocate between the feed end and the discharge end;

[0007] The discharge assembly is connected to the feeding end of the conveying track.

[0008] Furthermore, the material discharging assembly includes a first material discharging baffle, a first driving member, a second material discharging baffle, a second driving member, a bearing plate and a third driving member, wherein:

[0009] The first material discharge baffle is parallel to the second material discharge baffle, and a material discharge space is formed between the first material discharge baffle, the second material discharge baffle and the carrying plate;

[0010] A first buckle is provided on one side of the first material discharge baffle plate facing the material discharge space, and the first buckle is at a distance from the lower end edge by the thickness of an IC tray. The first driving member is fixedly mounted on the mounting frame, and the first driving member horizontally drives the first material discharge baffle plate to approach or move away from the second material discharge baffle plate.

[0011] A second buckle is provided on a side of the second material discharge baffle plate facing the material discharge space, and the second buckle is at a distance from the lower end edge by the thickness of an IC tray. The second driving member is fixedly mounted on the mounting frame, and the second driving member horizontally drives the second material discharge baffle plate to approach or move away from the first material discharge baffle plate.

[0012] The bearing plate is located below the first buckle and the second buckle, the third driving member is fixedly connected to the mounting frame, and the third driving member drives the bearing plate to move up and down in the vertical direction;

[0013] The lowest position at which the carrying plate descends is connected with the feeding end of the conveying track.

[0014] Furthermore, the adjustment component also includes a scale and a pointer, the scale is fixedly mounted on the mounting frame; the pointer is fixedly mounted on the adjustment block, and the pointer points to the scale of the scale.

[0015] Furthermore, the adjustment component also includes a slide rail limiting plate, which is fixedly mounted on an end of the adjustment rail away from the second guide bar, and the slide rail limiting plate limits the sliding range of the adjustment block.

[0016] Furthermore, the locking member is a toggle clamp.

[0017] Furthermore, the transmission component includes a material moving rod and a fourth driving member, the fourth driving member is fixedly connected to the mounting frame, the end of the material moving rod away from the fourth driving member is located between the second guide bar and the first guide bar, and the fourth driving member drives the material moving rod to move, so that the material moving rod reciprocates between the feed end and the discharge end.

[0018] Furthermore, the feeding device of the IC tray includes at least two adjusting components, and the adjusting components are evenly installed on the mounting frame along the length direction of the second guide bar, and the second guide bar is fixedly connected to the adjusting blocks of each adjusting component at the same time.

[0019] Furthermore, the feeding device of the IC tray also includes a reflux component, which is a pipeline structure. One end of the reflux component is connected to the discharge end, and the other end extends to the bottom of the mounting frame. After the IC material is taken out, the IC tray is recovered through the reflux component.

[0020] In order to solve the above-mentioned technical problems, an embodiment of the present application also provides an IC processing equipment, which includes a material picking component and an IC material tray feeding device as described above, wherein the material picking component is installed on one side of the mounting frame, and the material picking component of the material picking component is located at the upper end of the material discharge end.

[0021] The present application also provides an IC tray feeding method, which is applied to the IC tray feeding device mentioned above, and the method comprises the following steps:

[0022] Step S1: adjusting the distance between the second guide bar and the first guide bar by the adjusting component so that the distance adapts to the size of the IC tray;

[0023] Step S2: loading the IC tray to the feeding end of the conveying track through the unloading assembly;

[0024] Step S3: driving the IC tray by the transmission component to move the IC tray from the feeding end of the conveying track to the IC tray taking position;

[0025] Step S4: After the IC material is taken out, the transmission component drives the IC tray to continue to move until the discharge end of the conveying track completes the discharge of the IC tray;

[0026] Step S5: the transmission component returns to the initial position;

[0027] Step S6: Repeat steps S2 to S5 to perform a cyclic operation of feeding the IC tray.

[0028] Compared with the prior art, the IC tray feeding device, IC processing equipment and IC tray feeding method provided in the embodiments of the present application have at least the following beneficial effects:

[0029] By setting an adjustment component, the distance between the first guide bar and the second guide bar of the conveying component can be controlled. There is no need to design structural parts of different sizes according to the specific size of the IC material tray, which improves the utilization rate of each structural part and saves material costs. At the same time, since there is no need to replace the corresponding structural parts according to different IC material tray sizes, cumbersome replacement steps and debugging procedures are avoided, the workload is reduced, and the work efficiency can be effectively improved. The IC material tray feeding device of the present application has greater adjustability, strong versatility, and easy operation, which greatly improves the IC processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the scheme of the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 A schematic diagram of the structure of the IC tray feeding device provided in an embodiment of the present application;

[0032] Figure 2 A schematic structural diagram of an IC tray feeding device including a reflow component provided in another direction of an embodiment;

[0033] Figure 3 for Figure 1 A is an enlarged schematic diagram;

[0034] Figure 4 for Figure 1 A magnified schematic diagram of B;

[0035] Figure 5 for Figure 4 A magnified schematic diagram of middle C;

[0036] Figure 6 A schematic diagram of an IC tray feeding device provided in an embodiment of the present application including multiple groups of adjustment components and reflow components;

[0037] Figure 7 A schematic diagram of the action of the material removal rod and the buckle provided in the embodiment of the present application;

[0038] Figure 8 A schematic diagram of the feeding process provided in the embodiment of the present application;

[0039] Fig. 9 A schematic diagram of an IC tray feeding device including a material taking component provided in an embodiment of the present application;

[0040] Fig.10 A step diagram of the IC tray feeding method provided in an embodiment of the present application;

[0041] Fig.11 for Fig.10 A detailed step diagram of step S2 in the IC tray feeding method is provided.

[0042] Reference numerals:

[0043] 1-installation frame; 2-adjustment assembly; 21-adjustment guide rail; 211-slide rail limiting plate; 22-adjustment block; 23-locking piece; 24-scale; 25-pointer; 3-discharging assembly; 31-first discharging baffle; 311-first driving member; 312-first buckle; 32-second discharging baffle; 321-second driving member; 322-second buckle; 33-carrying plate; 331-third driving member; 4-conveying assembly; 41-first guide bar; 42-second guide bar; 43-transmission component; 430-discharging rod; 431-fourth driving member; 5-reflux assembly; 6-feeding assembly;

[0044] The same reference numerals are used in different positions in the figures to indicate that the structures and functions of the indicated components are the same. DETAILED DESCRIPTION

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0046] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0047] The embodiment of the present application provides an IC tray feeding device, comprising: a mounting frame, an adjustment component, a material discharge component and a conveying component, wherein the adjustment component comprises an adjustment rail, an adjustment block and a locking member, the adjustment rail is mounted on the mounting frame, the adjustment block can slide on the adjustment rail, the locking member is connected to the adjustment block, and the locking member can fix the adjustment block at any position of the adjustment rail;

[0048] The conveying assembly includes a first guide bar, a second guide bar and a transmission component, the first guide bar is fixed to the mounting frame, the second guide bar is arranged in parallel with the first guide bar to form a conveying track, the second guide bar is fixedly connected to the adjustment block so that the distance between the second guide bar and the first guide bar is adjustable, the conveying track includes a feed end and a discharge end, and the transmission component can reciprocate between the feed end and the discharge end;

[0049] The discharge assembly is connected to the feeding end of the conveying track.

[0050] Based on the above-mentioned IC tray feeding and feeding device, an embodiment of the present application also provides an IC processing equipment, including a reflow component and an IC tray feeding and feeding device as described in any of the above items, the reflow component is an irregular long pipe, one end of the reflow component is connected to the discharge end, and the other end extends to the bottom of the mounting frame, and the IC tray is recovered through the reflow component after the IC material is completely taken out.

[0051] Based on the above-mentioned IC tray feeding device, the embodiment of the present application further provides an IC tray feeding method, the method comprising the following steps:

[0052] Step S1: adjusting the distance between the second guide bar and the first guide bar by the adjusting component so that the distance adapts to the size of the IC tray;

[0053] Step S2: loading the IC tray to the feeding end of the conveying track through the unloading assembly;

[0054] Step S3: driving the IC tray by the transmission component to move the IC tray from the feeding end of the conveying track to the IC tray taking position;

[0055] Step S4: After the IC material is taken out, the transmission component drives the IC tray to continue to move until the discharge end of the conveying track completes the discharge of the IC tray;

[0056] Step S5: the transmission component returns to the initial position;

[0057] Step S6: Repeat steps S2 to S5 to perform a cyclic operation of feeding the IC material tray.

[0058] Compared with the prior art, the IC tray feeding device, IC processing equipment and IC tray feeding method provided in the embodiments of the present application mainly have the following beneficial effects:

[0059] By setting an adjustment component, the distance between the first guide bar and the second guide bar of the conveying component can be controlled. There is no need to design structural parts of different sizes according to the specific size of the IC material tray, which improves the utilization rate of each structural part and saves material costs. At the same time, since there is no need to replace the corresponding structural parts according to different IC material tray sizes, cumbersome replacement steps and debugging procedures are avoided, the workload is reduced, and the work efficiency can be effectively improved. The IC material tray feeding device of the present application has greater adjustability, strong versatility, and easy operation, which greatly improves the IC processing efficiency.

[0060] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0061] like Figure 1 , Figure 2 and Figure 3 As shown, the embodiment of the present application provides an IC tray feeding device, comprising: a mounting frame 1, an adjustment component 2, a discharge component 3 and a conveying component 4. The adjustment component 2 comprises an adjustment rail 21, an adjustment block 22 and a locking member 23. The adjustment rail 21 is mounted on the mounting frame 1, the adjustment block 22 can slide on the adjustment rail 21, the locking member 23 is connected to the adjustment block 22, and the locking member 23 can fix the adjustment block 22 at any position of the adjustment rail 21;

[0062] like Figure 4 As shown, the conveying assembly 4 includes a first guide bar 41, a second guide bar 42 and a transmission component 43, the first guide bar 41 is fixed on the mounting frame 1, the second guide bar 42 is arranged in parallel with the first guide bar 41 to form a conveying track, the second guide bar 42 is fixedly connected to the adjustment block 22, so that the distance between the second guide bar 42 and the first guide bar 41 is adjustable, the conveying track includes a feed end and a discharge end, and the transmission component 43 can reciprocate between the feed end and the discharge end;

[0063] The discharge assembly 3 is connected to the feeding end of the conveying track.

[0064] In some embodiments, the locking member and the adjusting block are detachably connected. The advantage of such a configuration is that modular assembly and replacement can be achieved quickly.

[0065] like Figure 4 As shown, in some embodiments, the discharge assembly 3 includes a first discharge baffle 31, a first driving member 311, a second discharge baffle 32, a second driving member 321, a bearing plate 33 and a third driving member 331, wherein:

[0066] The first material discharge baffle 31 is parallel to the second material discharge baffle 32, and a material discharge space is formed between the first material discharge baffle 31, the second material discharge baffle 32 and the supporting plate 33;

[0067] like Figure 4 and Figure 5 As shown, a first buckle 312 is provided on a side of the first material discharge baffle 31 facing the material discharge space, and the first buckle 312 is at a distance from the lower end edge by the thickness of an IC tray, and the first driving member 311 is fixedly mounted on the mounting frame 1, and the first driving member 311 horizontally drives the first material discharge baffle 31 to approach or move away from the second material discharge baffle 32;

[0068] A second buckle 322 is provided on the side of the second material discharge baffle 32 facing the material discharge space. The second buckle 322 is at a distance from the lower edge by the thickness of an IC tray. The second driving member 321 is fixedly mounted on the mounting frame 1. The second driving member 321 horizontally drives the second material discharge baffle 32 to approach or move away from the first material discharge baffle 31.

[0069] The bearing plate 33 is located below the first buckle 312 and the second buckle 322, and the third driving member 331 is fixedly connected to the mounting frame 1, and the third driving member 331 drives the bearing plate 33 to move up and down in the vertical direction;

[0070] The lowest position of the support plate 33 is connected with the feeding end of the conveying track.

[0071] By setting the conveying track of the adjusting component 2, the IC tray feeding device of the present application can be used for IC trays of various sizes, which greatly improves the applicability of the IC tray feeding device; in addition, through the cooperation of the first clip 312, the second clip 322 and the supporting plate 33, the third driving member 431 and the material pushing rod 430, the IC tray feeding device can stably transmit the IC trays in sequence.

[0072] In some embodiments, the first buckle 312 can be freely adjusted on the first discharge baffle 31, and the first buckle 312 can be adjusted up and down in a direction perpendicular to the plane where the feed end is located. The second buckle 322 can be freely adjusted on the second discharge baffle 32, and the second buckle 322 can be adjusted up and down in a direction perpendicular to the plane where the feed end is located.

[0073] The first buckle 312 and the second buckle 322 are freely adjustable, and can adapt to IC trays of different thicknesses, greatly improving the versatility of the IC tray feeding device of the present application. In some embodiments, on the basis that the first buckle 312 and the second buckle 322 are adjustable, the first discharge baffle 31 is provided with a scale (not shown) along a direction perpendicular to the plane where the feed end is located, and the second discharge baffle 32 is provided with a scale (not shown) along a direction perpendicular to the plane where the feed end is located.

[0074] By setting the scale, the value of the IC material tray can be easily recorded, which is convenient for rapid positioning and adjustment when processing known IC material tray thickness dimensions, thereby improving processing efficiency.

[0075] like Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the adjustment component 2 also includes a scale 24 and a pointer 25, the scale 24 is fixedly mounted on the mounting frame 1; the pointer 25 is fixedly mounted on the adjustment block 22, and the pointer 25 points to the scale of the scale 24.

[0076] By setting the scale 24 and the pointer 25, more accurate position information can be obtained each time the adjustment block 22 slides on the adjustment guide rail 21, so that when replacing an IC material tray of a similar size as that adjusted before, the position of the adjustment block 22 can be quickly determined based on the previous value of the pointer 25 on the scale 24, thereby reducing the time for loading and improving IC processing efficiency.

[0077] like Figure 3 As shown, in some embodiments, the adjustment assembly 2 further includes a slide rail limiting plate 211 , which is fixedly mounted on one end of the adjustment rail 21 away from the second guide bar 42 , and the slide rail limiting plate 211 limits the sliding range of the adjustment block 22 .

[0078] In some embodiments, the slide rail limiting plate 211 is arranged in pairs, including a first slide rail limiting plate (not shown) and a second slide rail limiting plate (not shown). The first slide rail limiting plate is fixedly installed at one end of the adjustment guide rail 21 away from the second guide bar 42, and the second slide rail limiting plate is fixedly installed in the conveying track formed by the second guide bar 42 and the first guide bar 41 being arranged parallel to each other. The first slide rail limiting plate and the second slide rail limiting plate limit the sliding range of the adjustment block 22.

[0079] By setting the slide rail limiting piece 211, the adjustment block 22 slides along the adjustment guide rail 21, thereby driving the second guide bar 42 fixedly connected to the adjustment block 22, and then adjusting the conveying track to adapt to the IC tray. By setting the slide rail limiting piece 211, the conveying track can be adjusted along a certain path, thereby improving the stability of the IC tray feeding device of the present application and improving the IC processing efficiency.

[0080] In some embodiments, the locking member 23 is a toggle clamp.

[0081] The handle attached to the elbow clamp facilitates the movement of the adjustment block 22 fixedly connected to the locking member 23, and also facilitates the clamping of the adjustment block 22 at any time to prevent the adjustment block 22 from deviating due to vibration generated during the IC tray feeding process.

[0082] In some embodiments, since the locking member is detachably connected to the adjustment block, the locking member 23 can be replaced with a workpiece with the same locking function, such as a tightening clamp. The tightening clamp fixes the adjustment block and thereby the second guide bar by tightening the bolt.

[0083] like Figure 4 , Figure 7 and Figure 8 As shown, in some embodiments, the transmission component 43 includes a material moving rod 430 and a fourth driving member 431, the fourth driving member 431 is fixedly connected to the mounting frame 1, and the end of the material moving rod 430 away from the fourth driving member 431 is located between the second guide bar 42 and the first guide bar 41, and the fourth driving member 431 drives the material moving rod 430 to move, so that the material moving rod 430 reciprocates between the feed end and the discharge end.

[0084] Through the cooperation between the first clip 312, the second clip 322, the carrier plate 33, the third driving member 331 and the material shifting rod 430, the IC material tray feeding device can transfer the IC material tray in an orderly, stable and sequential manner.

[0085] like Figure 6 As shown, in some embodiments, the feeding device of the IC material tray includes at least two adjusting components 2, each of the adjusting components 2 is evenly installed on the mounting frame 1 along the length direction of the second guide bar 42, and the second guide bar 42 is fixedly connected to the adjusting block 22 of each of the adjusting components 2 at the same time.

[0086] By setting up multiple adjustment components 2, the second guide bar 42 will not be offset due to multiple adjustments on one side, and the setting up of multiple adjustment components 2 also makes the conveying track more stable. In some embodiments, a first guide groove (not shown) is set on the side of the first guide bar 41 toward the second guide bar 42, and a second guide groove (not shown) is set on the side of the second guide bar 42 toward the first guide bar 41;

[0087] The first guide groove and the second guide groove both extend from the feeding end to the discharging end of the conveying track, and the groove width of the first guide groove and the second guide groove is the thickness of an IC tray.

[0088] When the carrying plate 33 descends to the lowest position where it is connected to the feeding end of the conveying track, it is conveyed to the discharging end by the conveying component 43 .

[0089] By setting the guide groove, support can be provided for the IC tray during the transmission process, and the position of the IC tray during transportation can be limited without deviating from the transportation track, thereby making the IC tray transmission process more stable and improving the feeding efficiency.

[0090] like Figure 2 and Figure 6 As shown, in some embodiments, the feeding device of the IC material tray also includes a reflux component 5, which is an irregular long pipe, one end of the reflux component 5 is connected to the discharge end, and the other end extends to the bottom of the mounting frame 1. After the IC material is taken out, the IC material tray is recovered through the reflux component 5.

[0091] By connecting the reflux component 5 with the discharging end, the IC tray can be promptly recovered and processed after it is not taken out, avoiding the IC tray stagnation on the conveying track to affect the conveying process, thereby greatly improving the conveying efficiency.

[0092] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0093] The IC tray feeding device of the present application does not need to design a guide structure separately according to the size of a certain IC tray, which improves the machine utilization rate and saves material costs; at the same time, since there is no need to switch the corresponding structural parts according to different IC tray sizes, the cumbersome replacement and debugging procedures are avoided and the workload is reduced; the IC tray feeding device of the present application also has greater adjustability, easy and simple operation, and greatly improves efficiency.

[0094] The present application also provides an IC processing device, such as Fig. 9As shown, the IC processing equipment includes a material picking component 6 and an IC material tray feeding device as described in any of the above items, the material picking component 6 is installed on one side of the mounting frame 1, and the material picking component of the material picking component 6 is located at the upper end of the discharge end, when the IC material tray is transported to the discharge end via the conveying track, the IC material tray is grabbed to complete the IC picking.

[0095] The IC processing equipment of the present application has the same beneficial effects as the IC tray feeding device provided in the above-mentioned embodiment.

[0096] The present application also provides an IC tray feeding method, which is applied to the IC tray feeding device mentioned above. Fig.10 As shown, the method comprises the following steps:

[0097] Step S1: adjusting the distance between the second guide bar and the first guide bar by the adjusting component so that the distance adapts to the size of the IC tray;

[0098] Step S2: loading the IC tray to the feeding end of the conveying track through the unloading assembly;

[0099] Step S3: driving the IC tray by the transmission component to move the IC tray from the feeding end of the conveying track to the IC tray taking position;

[0100] Step S4: After the IC material is taken out, the transmission component drives the IC tray to continue to move until the discharge end of the conveying track completes the discharge of the IC tray;

[0101] Step S5: the transmission component returns to the initial position;

[0102] Step S6: Repeat steps S2 to S5 to perform a cyclic operation of feeding the IC tray.

[0103] For the above step S1, Figure 3 As shown, step S1: adjusting the distance between the second guide bar 42 and the first guide bar 41 by the adjusting component 2 so that the distance adapts to the size of the IC tray.

[0104] Specifically, Figure 1 and Figure 2 As shown, the adjusting block 22 is adjusted by the locking piece 23 so as to slide along the adjusting guide rail 21 under the limitation of the slide rail limiting plate 211; when the adjusting block 22 moves to the corresponding position of the size of the IC tray recorded on the scale 24 according to the pointer 25 and is clamped and fixed by the locking piece 23, the second guide bar 42 fixedly connected to the locking piece 23 is driven to move to the corresponding position and be fixed, thereby adjusting the distance between the second guide bar 42 and the first guide bar 41.

[0105] For step S2, in some embodiments, the IC tray loading process is as follows: Fig.11 As shown:

[0106] Step S21: the first material discharging baffle 31 and the second material discharging baffle 32 are separated;

[0107] Step S22: the carrying plate 33 is lowered by a TRAY spacing;

[0108] Step S23: The two unloading baffles are clamped, and the first buckle 312 and the second buckle 322 at the lower ends of the two baffles are respectively inserted into the gap between the last two layers of TRAY;

[0109] Step S24: the carrier plate descends, the lowermost TRAY is separated from the upper layer and enters the conveying track formed by the first guide bar 41 and the second guide bar, and the upper TRAY is supported by the buckles at the lower ends of the two baffles to prevent it from falling down;

[0110] Specifically, step S21 is as follows: Figure 6 As shown, the first driving member 311 drives the first material discharge baffle 31 away from the second material discharge baffle 32; the second driving member 321 drives the second material discharge baffle 32 away from the first material discharge baffle 31;

[0111] Step S22 and step S23 are as follows Figure 7 As shown, the third driving member 331 drives the carrying plate 33 to descend by a material tray spacing, and then the two material discharge baffles move relative to each other under the driving of the driving member until the material tray is clamped. At this time, as shown in FIG. Figure 5 As shown, the first buckle 312 and the second buckle 322 at the lower ends of the two baffles are respectively inserted into the gap between the last two layers of material trays;

[0112] Step S24 is as follows Figure 7 As shown, the carrying plate 33 continues to descend, the bottom material tray is separated from the upper layer and enters the conveying track formed by the first guide bar 41 and the second guide bar, and the upper material tray is supported by the first buckle 312 and the second buckle 322 at the lower ends of the two baffles to prevent it from falling down;

[0113] For step S3, in some embodiments, combined with Figure 4 and Figure 8 The process of the transmission component driving the IC tray is as follows:

[0114] The fourth driving member 431 in the transmission component 43 drives the material shifting rod 430 fixedly connected thereto, and the highest point of the material shifting rod 430 does not exceed the thickness of the IC material tray. The material shifting rod 430 shifts the IC material tray to make the IC material tray move along the feeding end of the conveying track to the IC material tray picking position.

[0115] For step S4, in some embodiments, combined with Figure 8 and Fig. 9 The material-moving rod 430 in the transmission component 43 drives the IC tray to move along the conveying track, and the material-moving component 6 takes the material until the material-moving rod 430 moves to the discharging end to complete the discharging of the IC tray.

[0116] The IC tray feeding method provided in the present application has the same beneficial effects as the IC tray feeding device described above.

[0117] In step S5 and step S6, the material-moving rod 430 is driven by the fourth driving member 431 to return to the initial position, and then Figure 6 , Figures 7 and 8 As shown, steps S2 to S5 are repeated to perform a cyclic operation of feeding the IC material tray.

[0118] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. An IC tray feeding device, characterized in that: include: Installation frame, adjustment assembly, discharge assembly and conveying assembly, wherein: The adjustment assembly comprises an adjustment rail, an adjustment block and a locking member, wherein the adjustment rail is mounted on the mounting frame, the adjustment block can slide on the adjustment rail, the locking member is connected to the adjustment block, and the locking member can fix the adjustment block at any position of the adjustment rail, wherein the locking member is a toggle clamp; The conveying assembly includes a first guide bar, a second guide bar and a transmission component, the first guide bar is fixed to the mounting frame, the second guide bar is arranged in parallel with the first guide bar to form a conveying track, the second guide bar is fixedly connected to the adjustment block so that the distance between the second guide bar and the first guide bar is adjustable, the conveying track includes a feed end and a discharge end, and the transmission component can reciprocate between the feed end and the discharge end; The discharge assembly is connected to the feeding end of the conveying track; The material discharging assembly includes a first material discharging baffle, a first driving member, a second material discharging baffle, a second driving member, a bearing plate and a third driving member, wherein: The first material discharge baffle is parallel to the second material discharge baffle, and a material discharge space is formed between the first material discharge baffle, the second material discharge baffle and the carrying plate; A first buckle is provided on one side of the first material discharge baffle plate facing the material discharge space, and the first buckle is at a distance from the lower end edge by the thickness of an IC tray. The first driving member is fixedly mounted on the mounting frame, and the first driving member horizontally drives the first material discharge baffle plate to approach or move away from the second material discharge baffle plate. A second buckle is provided on a side of the second material discharge baffle plate facing the material discharge space, and the second buckle is at a distance from the lower end edge by the thickness of an IC tray. The second driving member is fixedly mounted on the mounting frame, and the second driving member horizontally drives the second material discharge baffle plate to approach or move away from the first material discharge baffle plate. The bearing plate is located below the first buckle and the second buckle, the third driving member is fixedly connected to the mounting frame, and the third driving member drives the bearing plate to move up and down in the vertical direction; The lowest position of the carrying plate is connected with the feeding end of the conveying track; The transmission component includes a material moving rod and a fourth driving member, the fourth driving member is fixedly connected to the mounting frame, the end of the material moving rod away from the fourth driving member is located between the second guide bar and the first guide bar, and the fourth driving member drives the material moving rod to move so that the material moving rod reciprocates between the feed end and the discharge end.

2. The IC tray feeding device according to claim 1, characterized in that: The adjustment component also includes a scale and a pointer. The scale is fixedly mounted on the mounting frame; the pointer is fixedly mounted on the adjustment block, and the pointer points to the scale of the scale.

3. The IC tray feeding device according to claim 2, characterized in that: The adjustment assembly further comprises a slide rail limiting piece, which is fixedly mounted on an end of the adjustment rail away from the second guide bar, and the slide rail limiting piece limits the sliding range of the adjustment block.

4. The IC tray feeding device according to claim 1, characterized in that: The device comprises at least two adjusting assemblies, each of which is evenly mounted on the mounting frame along the length direction of the second guide bar, and the second guide bar is fixedly connected to the adjusting block of each of the adjusting assemblies at the same time.

5. The IC tray feeding device according to claim 1, characterized in that: The feeding device of the IC tray also includes a reflux component, which is a pipeline structure. One end of the reflux component is connected to the discharge end, and the other end extends to the bottom of the mounting frame. After the IC material is taken out, the IC tray is recovered through the reflux component.

6. An IC processing equipment, characterized in that: It comprises a material picking component and an IC material tray feeding device as described in any one of claims 1 to 5, wherein the material picking component is installed on one side of the mounting frame, and the material picking part of the material picking component is located at the upper end of the discharge end after completing IC picking.

7. An IC tray feeding method, applied to an IC tray feeding device according to any one of claims 1 to 5, characterized in that: The method comprises the following steps: Step S1: adjusting the distance between the second guide bar and the first guide bar by the adjusting component so that the distance adapts to the size of the IC tray; Step S2: loading the IC tray to the feeding end of the conveying track through the unloading assembly; Step S3: driving the IC tray by the transmission component to move the IC tray from the feeding end of the conveying track to the IC tray taking position; Step S4: After the IC material is taken out, the transmission component drives the IC tray to continue to move until the discharge end of the conveying track completes the discharge of the IC tray; Step S5: the transmission component returns to the initial position; Step S6: Repeat steps S2 to S5 to perform a cyclic operation of feeding the IC material tray.

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