Chip, chip production system and method, recycled chip and method for producing the same

Abstract

The present application relates to chip production and processing technology field, disclose a kind of chip, chip production system and method, regenerative chip and its production method.Chip production system includes: material inlet unit, can hold chip and chip is discharged from export end with preset orientation each;First charging unit is detachably connected with first container, one end of conveying unit is connected with the export end of material inlet unit, and the other end is connected with first charging unit, so that chip is sequentially loaded into first container;Feeding unit can store several first containers and can sequentially send the chip in first container into conveying unit, conveying unit can convey chip to at least one test unit, and test unit can test chip operation;Second charging unit can load the chip completed operation in test unit into second container.The chip production system, method, regenerative chip production method of the present application have high degree of automation and high production efficiency.The chip and regenerative chip of the present application have high production efficiency and low cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip production processing technical field, and particularly relates to a chip, a chip production system and method, a regenerated chip and a production method thereof. BACKGROUND

[0002] The printing device needs to use printing consumables such as ink cartridges or toner cartridges in the working process. The printing consumables are provided with a chip for recording information of the ink cartridge or the toner cartridge. In the chip production process, the chip needs to be sent into a test unit in a preset direction to perform data writing, verification, performance detection and other operations, so as to write, read or rewrite the information stored in the chip.

[0003] Before being sent into the test unit, a large number of chips are irregularly stacked together. Since the size of the chip is very small, the direction of the chip needs to be accurately placed one by one by manual operation before being sent into the test unit, and the production efficiency is very low. In order to improve the production efficiency, the scheme commonly used in the prior art is to arrange the directions of a plurality of chips at one time and place them in a tray, and the tray is sent into the test unit as a whole to process information. Although this method can improve the production efficiency to a certain extent, the entire production process still depends on manual operation, and the degree of automation is low, the improvement of production efficiency has limitations, and the chip cost cannot be effectively reduced.

[0004] Therefore, there is an urgent need for a chip, a chip production system and method, a regenerated chip and a production method thereof to solve the above technical problems. SUMMARY

[0005] A first object of the present application is to provide a chip production system with high automation degree and high production efficiency.

[0006] A second object of the present application is to provide a chip production method with high automation degree and high production efficiency by using the above chip production system.

[0007] A third object of the present application is to provide a chip with high production efficiency and low cost by using the above chip production system.

[0008] A fourth object of the present application is to provide a regenerated chip production method with high automation degree and high production efficiency by using the above chip production system.

[0009] A fifth object of the present application is to provide a regenerated chip with high production efficiency and low cost by using the above regenerated chip production method.

[0010] To achieve the above objects, the present application adopts the following technical solutions:

[0011] A chip production system comprises:

[0012] a feeding unit capable of containing the chips and sequentially discharging the chips from an outlet end in a preset orientation;

[0013] a conveying unit and a first loading unit, the first loading unit being detachably connected with a first container, one end of the conveying unit being connected with the outlet end of the feeding unit, and the other end being capable of being docked with the first loading unit so as to sequentially load the chips into the first container;

[0014] a feeding unit, a conveying unit and at least one testing unit, the feeding unit being capable of storing a plurality of the first containers and sequentially feeding the chips in the first containers into the conveying unit, the conveying unit being capable of sequentially conveying the chips to at least one testing unit, and the testing unit being capable of testing the chips;

[0015] a second loading unit capable of loading the chips completed with the testing unit into a second container.

[0016] Optionally, the chip production system further comprises:

[0017] a surface assembly unit for mounting the wafer and / or the element on a PCB board and forming a bare chip;

[0018] a packaging unit for packaging the bare chip, electrically connecting the wafer and / or the element with the PCB board, and forming the chip;

[0019] a transfer unit for feeding the chips into the feeding unit.

[0020] Optionally, the chip production system further comprises a glue scraping unit, the glue scraping unit being used for scraping the glue on the old chips and the wafer in the glue, and conveying the remaining PCB board to the surface assembly unit.

[0021] Optionally, the glue scraping unit comprises a feeding mechanism, a heating mechanism and a glue scraping mechanism, wherein:

[0022] the feeding mechanism is used for transferring the chips with the glue on the surfaces of the chips in the same orientation;

[0023] the heating mechanism is arranged on a transfer path of the chips and is used for heating the chips;

[0024] the glue scraping mechanism comprises a scraper capable of moving relative to the chips to scrape the glue on the surfaces of the heated chips.

[0025] Optionally, the feeding unit comprises:

[0026] a vibrating mechanism capable of containing the chips and generating vibration;

[0027] The screening mechanism comprises a conveying track for moving the chips in a standing state forward, one end of the conveying track is connected with the outlet end of the vibrating mechanism, the other end is connected with the conveying unit, at least one screening part is arranged on the conveying track, and the screening part is used for screening the chips placed in a preset orientation on the conveying track.

[0028] Optionally, the conveying track comprises side plates and a supporting plate arranged at the side of the side plates for supporting the chips moving in a standing state.

[0029] Along the extension direction of the conveying track, the chip screening device has a first screening part, and at least one of a second screening part, a third screening part and a fourth screening part arranged after the first screening part, wherein:

[0030] The first screening part is used for screening the adhesive surface orientation of the chips, the width of the supporting plate at the first screening part is arranged based on the PCB plate thickness of the chips, so that the adhesive surface of the chips can be shaken off when facing the side plate; when the adhesive surface of the chips faces away from the side plate, the chips can pass through the first screening part and continue to move forward;

[0031] The second screening part is configured as a first hollow window penetrating through the side plate, and the first hollow window is arranged so that the chips with a height exceeding the upper boundary of the first hollow window along the extension direction of the side plate can pass through.

[0032] The third screening part is used for screening the notch orientation of the chips, the side plate is provided with a second hollow window penetrating through the side plate at the third screening part, the third screening part comprises a protrusion, the protrusion protrudes from the upper boundary of the second hollow window to the inside of the second hollow window with reference to the conveying direction of the chips, the protrusion is arranged so that the chips fall through the second hollow window when the notch of the chips aligns with the protrusion, and the spacing between the protrusion and both sides of the second hollow window does not exceed the width of the chips.

[0033] The fourth screening part is used for screening the element orientation of the chips, the fourth screening part comprises a longitudinal plate body connected to the conveying track, and a bent plate body arranged at the upper end of the longitudinal plate body, the bent plate body is bent back at the upper end of the longitudinal plate body and forms a downwardly open chute, the chute extends in a straight line direction, and a protruding strip extending along the extension direction of the chute is arranged in the chute, when the upper end of the chip enters the chute, the element on the chip cooperates with the protruding strip so that the chip can slide along the chute.

[0034] Optionally, the conveying unit comprises a distributing assembly and a conveying track, one end of the conveying track is connected with the outlet end of the feeding unit, and the other end is capable of being docked with the first container on the first loading unit, and the distributing assembly enables the chips on the conveying track to be sequentially conveyed into the first container on the first loading unit.

[0035] Optionally, the first loading unit is arranged lower than the feeding unit, and the conveying track is arranged in an inclined manner.

[0036] Optionally, the distributing assembly comprises a pressing member and a blocking member arranged downstream of the pressing member, the blocking member is used to block the chip arranged at the lowermost position on the conveying track, and the pressing member is used to press the chips adjacent to the chip at the lowermost position on the conveying track.

[0037] Optionally, one end of the conveying track connected with the outlet end of the feeding unit is provided with a feeding detection member for detecting whether the chip enters the conveying track.

[0038] One end of the conveying track connected with the first loading unit is provided with a discharging detection member for detecting whether the chip enters the first loading unit.

[0039] Optionally, the chip production system further comprises at least one auxiliary distributing assembly, and the auxiliary distributing assembly enables the chips on the conveying track to be smoothly conveyed to the first loading unit.

[0040] Optionally, the first loading unit comprises:

[0041] A loading plate, on which a plurality of first containers are capable of being arranged side by side;

[0042] A driving assembly, which drives the loading plate to move so as to enable different first containers to be respectively docked with the other end of the conveying track.

[0043] Optionally, the chip production system comprises a support, the feeding unit, the conveying unit and the testing unit are arranged on the support, the feeding unit comprises a storage, a conveyor and a feeder, the storage is used to store the first containers, the conveyor is used to take out and transfer the first containers in the storage to a feeding position, and the feeder is capable of transferring the chips contained in the first containers at the feeding position to the conveying unit.

[0044] Optionally, the storage comprises a first storage rack and a second storage rack oppositely arranged on the support, the first storage rack and the second storage rack are respectively provided with a first storage groove and a second storage groove extending along a first direction on opposite surfaces thereof, the first storage rack and the second storage rack are respectively provided with a discharge port at bottom ends thereof, two ends of the first container are respectively located in the first storage groove and the second storage groove, and the first container can slide out of the discharge port along a second direction perpendicular to the first direction.

[0045] Optionally, the conveyor comprises a moving plate provided with a first placement portion, the moving plate is slidably arranged on the support along the second direction, the moving plate has a picking position close to the storage and a feeding position close to the feeder; the storage further comprises a discharging member slidably arranged on the support along the first direction, the discharging member has a top supporting position for supporting the lowermost first container above the discharge port and a dropping position opposite to the discharge port; when the discharging member is located at the top supporting position, the moving plate can move to the picking position, and when the discharging member is located at the dropping position, the first container falls into the first placement portion and can be transferred to the feeding position by the moving plate.

[0046] Optionally, the feeder comprises:

[0047] a feeding rack, the support comprises a support plate, the feeding rack is rotatably arranged on the support plate and has a receiving position for receiving the first container and a discharging position for placing the first container obliquely, the feeding rack is provided with a bearing portion;

[0048] a pressing block slidably arranged on the feeding rack and having a pressing position close to the bearing portion for pressing the first container on the bearing portion and a releasing position away from the bearing portion for releasing the first container.

[0049] Optionally, the support comprises a support plate, the support plate is arranged obliquely, the conveying unit comprises a main channel assembly and a sub-channel assembly arranged on the support plate, the sub-channel assembly is located below the main channel assembly, the chip production system comprises a plurality of test units arranged along a second direction, and the plurality of test units are located below the sub-channel assembly;

[0050] the main channel assembly can receive and simultaneously accommodate a plurality of chips from the first container, and can release the chips one by one to the sub-channel assembly;

[0051] the sub-channel assembly can drive the chips to move on the support plate along the second direction to selectively distribute the chips to any one of the plurality of test units.

[0052] Optionally, the test unit comprises a write-read carrier plate, a write-read cover plate, a write-read code assembly and a first write-read stopper, the support plate is obliquely arranged, the write-read carrier plate is arranged on the support plate, the write-read cover plate is arranged on the write-read carrier plate to form a working channel, and the first write-read stopper is used to block a chip to be written.

[0053] Optionally, the second loading unit comprises a loading assembly arranged on the support plate and a fixing frame arranged below the loading assembly, and a plurality of second containers can be mounted on the fixing frame, the loading assembly can receive the chips from the test unit and selectively put the chips into any of the second containers.

[0054] Optionally, the test unit comprises a write-read code assembly capable of writing, reading and checking data of the chips, and / or a performance detection assembly capable of detecting performance of the chips entering the test unit, and / or a marking assembly capable of performing marking work on the chips, and / or a data rewriting assembly capable of rewriting data of chips needing to be upgraded; the write-read code assembly and / or the performance detection assembly and / or the marking assembly and / or the data rewriting assembly are respectively communicatively and / or electrically connected with a loading assembly of the second loading unit, and the loading assembly can put the chips into different second containers according to a detection result of the performance detection assembly, and / or a checking result of the write-read code assembly, and / or a work result of the marking assembly, and / or a test result of the data rewriting assembly.

[0055] A chip production method using the chip production system, specifically comprising the following steps:

[0056] Surface components and packaging are performed on the PCB to form chips;

[0057] The chips are sorted in a preset orientation;

[0058] The sorted chips are sequentially transported to the test unit for performance detection and / or data writing and / or data checking and / or marking work;

[0059] According to the work result of the test unit, the chips are respectively loaded into different second containers.

[0060] Optionally, the test unit comprises a write-read code assembly capable of data writing, reading and checking on the chip; and / or, the test unit comprises a performance detection assembly capable of performance detection on the chip entering the test unit; and / or, the test unit comprises a marking assembly capable of marking operation on the chip; and / or, the test unit comprises a data rewriting assembly capable of data flashing on the chip needing upgrading;

[0061] The second loading unit comprises a loading assembly, and the write-read code assembly, the performance detection assembly, the marking assembly and the data rewriting assembly are respectively communicatively and / or electrically connected with the loading assembly. The loading assembly is capable of putting the chip into different second containers according to the detection result of the performance detection assembly, the checking result of the write-read code assembly, the operation result of the marking assembly and / or the test result of the data rewriting assembly.

[0062] A regenerated chip production method using the chip production system, specifically comprising the following steps:

[0063] The colloid on the old chip and the wafer in the colloid are removed, and the PCB board is reserved;

[0064] The PCB board is subjected to surface assembly and packaging to form a regenerated chip;

[0065] The regenerated chip is sorted in a preset orientation;

[0066] The sorted regenerated chip is sequentially transported to the test unit for performance detection and / or data writing and / or data checking and / or marking operation;

[0067] The regenerated chip is respectively loaded into different second containers according to the operation result of the test unit.

[0068] Optionally,

[0069] The test unit comprises a write-read code assembly capable of data writing, reading and checking on the regenerated chip; and / or, the test unit comprises a performance detection assembly capable of performance detection on the regenerated chip entering the test unit; and / or, the test unit comprises a marking assembly capable of marking operation on the regenerated chip; and / or, the test unit comprises a data rewriting assembly capable of data flashing on the regenerated chip needing upgrading;

[0070] The second loading unit comprises a loading assembly, and the writing and reading code assembly, the performance detection assembly, the marking assembly and the data rewriting assembly are respectively connected with the loading assembly in communication and / or electricity, and the loading assembly can put the regenerated chips into different second containers according to the detection result of the performance detection assembly, the checking result of the writing and reading code assembly, the operation result of the marking assembly and / or the test result of the data rewriting assembly.

[0071] A chip manufactured by the chip manufacturing method.

[0072] A regenerated chip manufactured by the regenerated chip manufacturing method.

[0073] The chip manufacturing system of the present application has the following advantages:

[0074] The chip manufacturing system of the present application has the following advantages:

[0075] The chip manufacturing method and the regenerated chip manufacturing method of the present application can greatly improve the production efficiency, reduce the use of labor and lower the production cost by using the above chip manufacturing system.

[0076] The chip manufactured by the chip manufacturing method of the present application can improve the chip production efficiency and lower the chip cost.

[0077] The regenerated chip manufactured by the regenerated chip manufacturing method of the present application can improve the regenerated chip production efficiency and lower the regenerated chip cost. BRIEF DESCRIPTION OF DRAWINGS

[0078] Figure 1 is a perspective structural schematic view of the feeding unit, the conveying unit and the first loading unit of the chip manufacturing system provided by the first embodiment of the present application;

[0079] Figure 2 is a perspective structural schematic view of the feeding unit, the conveying unit, the testing unit and the second loading unit of the chip manufacturing system provided by the first embodiment of the present application;

[0080] Figure 3 is a perspective structural schematic view of a chip provided by embodiment one of the present application;

[0081] Figure 4 is a perspective structural schematic view of a vibrating mechanism and a screening mechanism provided by embodiment one of the present application from one perspective;

[0082] Figure 5 is a perspective structural schematic view of a vibrating mechanism and a screening mechanism provided by embodiment one of the present application from another perspective;

[0083] Figure 6 is a side structural schematic view of a first screening part provided by embodiment one of the present application, in which a glue-free surface of a chip is attached to a side plate;

[0084] Figure 7 is a side structural schematic view of a first screening part provided by embodiment one of the present application, in which a glue surface of a chip is close to a side plate;

[0085] Figure 8 is an enlarged structural schematic view of A in Figure 5 ;

[0086] Figure 9 is a front structural schematic view of a second screening part provided by embodiment one of the present application, in which an upper end of a chip exceeds an upper boundary of a first hollow window;

[0087] Figure 10 is a front structural schematic view of a second screening part provided by embodiment one of the present application, in which an upper end of a chip is lower than an upper boundary of a first hollow window;

[0088] Figure 11 is an enlarged structural schematic view of B in Figure 5 ;

[0089] Figure 12 is a front structural schematic view of a third screening part provided by embodiment one of the present application, in which a notch of a chip is arranged upward;

[0090] Figure 13 is a front structural schematic view of a third screening part provided by embodiment one of the present application, in which a notch of a chip is arranged downward;

[0091] Figure 14 is an enlarged structural schematic view of C in Figure 5 ;

[0092] Figure 15 is a sectional structural schematic view of a fourth screening part provided by embodiment one of the present application, in which an element on a chip is arranged downward;

[0093] Figure 16is the paving structure schematic view of the fourth screening unit provided by the embodiment one of the present application, the elements on the chip in the figure are set upward;

[0094] Figure 17 is the three-dimensional structure schematic view of the feeding unit, the conveying unit and the first charging unit of the chip production system in one perspective provided by the embodiment one of the present application;

[0095] Figure 18 is Figure 17 the enlarged structure schematic view of D in the figure;

[0096] Figure 19 is the three-dimensional structure schematic view of the back of the conveying unit provided by the embodiment one of the present application;

[0097] Figure 20 is Figure 19 the enlarged structure schematic view of E in the figure;

[0098] Figure 21 is the three-dimensional structure schematic view of the feeding unit provided by the embodiment one of the present application;

[0099] Figure 22 is the three-dimensional structure schematic view of the storage provided by the embodiment one of the present application;

[0100] Figure 23 is the local structure schematic view of the feeder provided by the embodiment one of the present application Figure 1 ;

[0101] Figure 24 is the local structure schematic view of the feeder provided by the embodiment one of the present application Figure 2 ;

[0102] Figure 25 is the local structure schematic view of the feeder provided by the embodiment one of the present application;

[0103] Figure 26 is the three-dimensional structure schematic view of the main material channel assembly provided by the embodiment one of the present application;

[0104] Figure 27 is the local structure schematic view of the material channel assembly provided by the embodiment one of the present application Figure 1 ;

[0105] Figure 28 is the local structure schematic view of the material channel assembly provided by the embodiment one of the present application Figure 2 ;

[0106] Figure 29 is the local structure schematic view of the first angle of the test unit provided by the embodiment one of the present application;

[0107] Figure 30is a local structure schematic view of a second angle of the test unit provided by the embodiment one of the present application;

[0108] Figure 31 is a local structure schematic view of a third angle of the test unit provided by the embodiment one of the present application;

[0109] Figure 32 is a three-dimensional structure schematic view of the second charging unit provided by the embodiment one of the present application;

[0110] Figure 33 is a flow schematic view of the chip production method provided by the embodiment one of the present application;

[0111] Figure 34 is a three-dimensional structure schematic view of the glue scraping unit provided by the embodiment two of the present application;

[0112] Figure 35 is a three-dimensional structure schematic view of the inside of the glue scraping unit in a first perspective provided by the embodiment two of the present application;

[0113] Figure 36 is a three-dimensional structure schematic view of the inside of the glue scraping unit in a second perspective provided by the embodiment two of the present application;

[0114] Figure 37 is a three-dimensional structure schematic view of the inside of the glue scraping unit in a third perspective provided by the embodiment two of the present application;

[0115] Figure 38 is a three-dimensional structure schematic view of the heating mechanism provided by the embodiment two of the present application; Figure 35

[0116] Figure 39 is a three-dimensional structure schematic view of the heating mechanism provided by the embodiment two of the present application; Figure 36

[0117] Figure 40 is a three-dimensional structure schematic view of the heating mechanism provided by the embodiment two of the present application; Figure 37

[0118] Figure 41 is a three-dimensional structure schematic view of the heating mechanism provided by the embodiment two of the present application;

[0119] Figure 42 is a top view of the heating mechanism provided by the embodiment two of the present application;

[0120] Figure 43 is a working principle diagram of the elastic jacking device provided by the embodiment two of the present application;

[0121] Figure 44 is a flow schematic view of the regenerated chip production method provided by the embodiment two of the present application.

[0122] In the figure: ​​​

[0123] 100, chip; 101, PCB board; 102, glue; 103, element; 104, notch; 200, first container; 300, second container; 400, support; 401, support plate; 402, bearing plate; 500, display unit;

[0124] 1, scraping glue unit; 11, feeding mechanism; 111, transmission assembly; 1111, transmission track; 1112, pushing assembly; 1112a, driving source; 1112b, feeding brush; 112, vibrating device; 12, heating mechanism; 121, heat-conducting table; 1211, conveying groove; 1212, top outlet; 122, limiting baffle; 1221, tool travel groove; 1222, polishing groove; 13, glue removing mechanism; 131, scraper; 132, tool holder assembly; 133, supporting assembly; 1331, guide slide rail; 134, impact unit; 14, cleaning mechanism; 15, polishing mechanism; 151, rolling brush; 16, base; 17, machine cover; 171, touch screen; 172, function button; 173, temperature control device; 174, indicator light; 18, dust removing mechanism;

[0125] 2, feeding unit; 21, vibrating mechanism; 211, outlet end; 22, screening mechanism; 221, conveying track; 2211, side plate; 2211a, outer side surface; 2211b, inner side surface; 2212, supporting plate; 222, first screening part; 223, second screening part; 2231, first hollow window; 224, third screening part; 2241, second hollow window; 2242, protrusion; 225, fourth screening part; 2251, longitudinal plate body; 2252, bent plate body; 2253, sliding groove; 2254, convex strip;

[0126] 3, conveying unit; 31, conveying track; 311, first track; 312, second track; 32, distributing assembly; 321, pressing piece; 322, blocking piece; 33, first detection piece; 34, second detection piece; 35, feeding detection piece; 36, discharging detection piece; 37, downward sliding detection piece;

[0127] 4, first loading unit; 41, loading plate; 42, driving assembly; 421, lead screw; 422, nut; 423, driving motor;

[0128] 5, auxiliary distributing assembly;

[0129] 6, feeding unit; 61, storage; 611, first storage rack; 6111, first storage groove; 6112, discharge port; 612, second storage rack; 6121, second storage groove; 613, ballast block; 614, ballast limiting piece; 615, unloading piece; 62, conveyor; 621, moving plate; 6211, first placing part; 6212, second placing part; 622, rolling piece; 623, first pushing block; 624, fixed driving piece; 625, pushing driving piece; 626, second pushing block; 627, empty container jacking piece; 63, feeder; 631, feeding rack; 6311, bearing part; 632, rotating driving piece; 633, pressing block; 634, downward pressing driving piece; 635, pushing driving piece; 636, pushing piece; 64, collection area;

[0130] 7, transmission unit; 71, main channel assembly; 711, main bearing plate; 712, main cover plate; 713, first main pressing piece; 714, second main pressing piece; 715, main stop piece; 716, first main detection piece; 717, second main detection piece; 718, third main detection piece; 72, sub-channel assembly; 721, sub-bearing plate; 722, sub-cover plate; 723, sub-stop piece; 724, sub- material transmission belt; 725, sub-material transmission driving piece; 726, sub-material driving wheel; 727, sub-material driven wheel;

[0131] 8, test unit; 81, write-read bearing plate; 82, write-read cover plate; 83, write-read code assembly; 84, first write-read stop piece; 85, second write-read stop piece; 86, third write-read stop piece; 87, write-read pressing piece; 88, first write-read detection piece; 89, second write-read detection piece;

[0132] 9, second feeding unit; 91, feeding assembly; 911, feeding bearing plate; 912, feeding cover plate; 913, feeding stop piece; 92, fixed rack; 921, container placing bottom plate; 922, container placing cover plate; 923, spring piece; 93, feeding power assembly. DETAILED DESCRIPTION

[0133] The application will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the application, and are not a limitation on the application. In addition, it should be noted that, for the convenience of description, only the parts related to the application are shown in the drawings, not all structures.

[0134] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0135] In the present application, unless otherwise explicitly specified and limited, "on" or "under" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "above" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0136] In the description of the present embodiment, the terms "up", "down", "right", and other orientation or position relationships are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0137] Embodiment one

[0138] The present embodiment provides a chip production system, a chip production method and a chip, which can be used to produce a chip 100 in a printing consumable. The chip production system comprises a surface assembly unit and a packaging unit, the surface assembly unit is used to mount a wafer, an element 103, etc. on a PCB board 101. Thus forming a bare chip 100, the packaging unit is used to package the bare chip 100, so that the wafer and the element 103 are respectively electrically connected with the PCB board 101 to form the chip 100. Without departing from the inventive concept of the present application, the surface assembly unit and the packaging unit can be any one of the prior art, which will not be described here.

[0139] Preferably, as Figure 1 and Figure 2As shown, the chip production system further comprises a transfer unit, a feeding unit 2, a conveying unit 3, a first loading unit 4, a feeding unit 6, a transmission unit 7, at least one testing unit 8 and a second loading unit 9. The feeding unit 2 is capable of containing the chips 100 and sequentially discharging the chips 100 from an outlet end in a preset orientation. The first loading unit 4 is detachably connected with a first container 200. One end of the conveying unit 3 is connected with the outlet end of the feeding unit 2, and the other end is capable of being docked with the first loading unit 4, so that the chips 100 are sequentially loaded into the first container 200. The feeding unit 6 is capable of storing a plurality of first containers 200 and sequentially feeding the chips 100 in the first containers 200 into the transmission unit 7. The transmission unit 7 is capable of sequentially conveying the chips 100 to the at least one testing unit 8. The testing unit 8 is capable of testing the chips 100. The second loading unit 9 is capable of loading the chips 100, which have completed the work in the testing unit 8, into a second container 300. It should be noted that the testing unit 8 can be used for, but not limited to, code writing and reading work and / or performance detection and / or marking work. Specifically, code writing and reading means data writing and data checking of the chips 100. Performance detection is generally used to detect whether various performances of the chips 100 meet the requirements, such as whether sensor parameters meet the requirements, whether the data writing speed meets the requirements, etc. It can be understood that the first container 200 mounted on the first loading unit 4 can be removed by a mechanical hand or manually after being filled with the chips 100 and placed in the feeding unit 6 for storage.

[0140] The chip production system of the embodiment can automatically screen the orientation of the chips 100 through the feeding unit 2, and sequentially discharge one by one for subsequent use by being loaded into the first container 200. The feeding unit 6 and the transmission unit 7 cooperate to sequentially feed the chips 100 in the first container 200 one by one into the testing unit 8 for corresponding work. The second loading unit 9 loads the chips 100, which have completed the work, into the second container 300, thereby facilitating the subsequent use or sale of the chips 100. The entire process does not require manual adjustment of the orientation of the chips 100, manual feeding of the chips 100 one by one into the testing unit 8, or manual collection of the chips 100, which have completed the work, thereby greatly improving the production efficiency of the chips 100, reducing labor, and reducing production costs.

[0141] In the embodiment, the first container 200 and the second container 300 are both tubes matching the size of the chips 100, i.e., only one chip 100 can be contained in the width direction of the tube, and a plurality of chips 100 are arranged in sequence in the length direction of the tube.

[0142] As Figure 3As shown, in the embodiment, the formed chip 100 includes a PCB board 101, a glue body 102 and an element 103, wherein the PCB board 101 is rectangular, and the PCB board 101 is provided with a notch 104, the PCB board 101 includes a glue surface and a non-glue surface, and the glue body 102 and the element 103 are arranged on the glue surface.

[0143] Preferably, as shown in Figure 4 and Figure 5 shown, the feeding unit 2 includes a vibrating mechanism 21 and a screening mechanism 22, the vibrating mechanism 21 is capable of containing the chips 100 in a stack and in a disorderly manner and is capable of generating vibration, the vibrating mechanism 21 has an outlet end 211 for continuously outputting the chips 100 outward, and the screening mechanism 22 includes a conveying track 221, one end of the conveying track 221 is connected with the outlet end 211 of the vibrating mechanism 21, and the other end is connected with the conveying unit 3, the conveying track 221 is capable of moving the chips 100 in a standing state forward, and the conveying track 221 has at least one screening part for screening the chips 100 arranged in a preset orientation on the conveying track 221. It should be noted that, in the embodiment, the "standing state" includes that the chips 100 are strictly vertically arranged, and also includes that the chips 100 are arranged at a certain inclination angle with the vertical direction.

[0144] Specifically, as shown in Figure 4 , the conveying track 221 can include a side plate 2211 and a supporting plate 2212 arranged on the side of the side plate 2211, and the lower end of the PCB board 101 of the chip 100 is supported on the supporting plate 2212. Since the screening mechanism 22 is used in cooperation with the vibrating mechanism 21, in an embodiment, the conveying track 221 is arranged in an arc shape and surrounds the upper end of the vibrating mechanism 21. In this way, the conveying track 221 substantially surrounds the trough of the vibrating mechanism 21, and when the chips 100 that fail to pass through the screening part fall from the conveying track 221, they can fall back into the trough of the vibrating mechanism 21. The side plate 2211 has an outer side surface 2211a located on the outer side of the arc shape, and an inner side surface 2211b opposite to the outer side surface 2211a, and the supporting plate 2212 is arranged on the outer side surface 2211a of the side plate 2211.

[0145] In the embodiment, as shown in Figure 5As shown, the screening unit includes a first screening unit 222, a second screening unit 223, a third screening unit 224, and a fourth screening unit 225, wherein the first screening unit 222 is used to screen the orientation of the adhesive surface of the chip 100, the second screening unit 223 is used to screen the length and width direction of the rectangular chip 100, the third screening unit 224 is used to screen the orientation of the notch 104 on the chip 100, and the fourth screening unit 225 is used to screen the orientation of the element 103. It can be understood that in other embodiments, the specific shape of the chip 100 can be changed on the basis of the embodiment, for example, the rectangular shape is changed to a square shape, or the notch 104 is not provided, or the element 103 is not provided, and the like. When the specific structure of the chip 100 is changed, the corresponding screening unit can be adaptively selected and arranged.

[0146] The first screening unit 222 is used to screen the orientation of the adhesive surface of the chip 100. Specifically, as shown in Figure 4 、 Figure 6 and Figure 7 , the width of the tray 2212 of the conveying track 221 at the first screening unit 222 is set based on the thickness of the PCB board 101 of the chip 100, so that when the non-adhesive surface of the chip 100 is attached to the side plate 2211 and the adhesive surface is away from the side plate 2211 (i.e., the orientation shown in Figure 6 ), the chip 100 can smoothly pass through the first screening unit 222 and continue to be conveyed forward; and when the adhesive surface of the chip 100 is oriented toward the side plate 2211 (i.e., the orientation shown in Figure 7 ), the chip 100 will be shaken off due to the small width d of the tray 2212 and the vibration of the conveying track 221 itself with the vibration mechanism 21, and the height of the protrusion of the adhesive 102 is generally between 1 mm and 1.2 mm. In some embodiments, the width d of the tray 2212 at this position can be approximately equal to the thickness of the PCB board 101, and the difference between the upper and lower thicknesses does not exceed 0.15 mm. In this way, the chips 100 passing through the first screening unit 222 are all conveyed forward with the non-adhesive surface attached to the side plate 2211.

[0147] Referring to Figure 6 and Figure 7 , in some embodiments, in order to make the chip 100 in the orientation shown in Figure 6 pass through the first screening unit 222 more stably, the side plate 2211 is inclinedly arranged, and the tray 2212 is arranged substantially perpendicular to the side plate 2211, so that the chip 100 is attached to the side plate 2211 under the action of its own gravity. Further, the side plate 2211 can have an included angle a between the side attached to the non-adhesive surface of the PCB board 101 and the vertical direction, and 20°≤a≤40°.

[0148] The second screening unit 223 is used to screen the length and width direction of the rectangular chip 100. Referring to Figure 5 and Figure 8As shown, the side plate 2211 is provided with a first hollow window 2231 penetrating the side plate 2211 at the second screening part 223. Referring to Figure 9 As shown in the orientation, the height of the first hollow window 2231 is Y, the length of the long side of the PCB board 101 of the chip 100 is y, and the length of the short side is x, and the length y of the long side is greater than the height Y of the first hollow window 2231, and the length x of the short side is less than the height Y of the first hollow window 2231. In this way, when the chip 100 is conveyed to the second screening part 223 in the orientation, the upper end edge of the PCB board 101 exceeds the upper boundary of the first hollow window 2231, and thus the chip 100 can pass smoothly. Figure 9 As shown in the orientation, the upper end edge of the PCB board 101 is below the upper boundary of the first hollow window 2231, and thus the chip 100 can fall from the first hollow window 2231. In this way, all the chips 100 passing through the second screening part 223 are in the Figure 10 orientation shown. Figure 9

[0149] The third screening part 224 is used to screen the orientation of the notch 104 of the chip 100. Specifically, referring to Figure 11 As shown, the side plate 2211 is provided with a second hollow window 2241 penetrating the side plate 2211 at the third screening part 224, and referring to the orientation shown, the third screening part 224 includes a protrusion 2242 extending from the upper boundary of the second hollow window 2241 into the hollow region of the second hollow window 2241, and the shape and size of the protrusion 2242 are designed based on the notch 104 on the chip 100. The width of the notch 104 is slightly greater than the width Z3 of the protrusion 2242. The distance between the protrusion 2242 and the left and right sides of the second hollow window 2241 is Z1 and Z2 respectively, and the values of Z1 and Z2 are not more than the width of the chip 100, so as to avoid the chip 100 falling on the left or right side of the protrusion 2242, and the height of the chip 100 is less than the height of the second hollow window 2241. In this way, in comparison with Figure 12 and Figure 13 , the chip 100 can pass through the second hollow window 2241 smoothly. Figure 12 In the orientation shown in Figure 13 , the notch 104 on the chip 100 is upwardly arranged, so that when the chip 100 is conveyed to the orientation in which the notch 104 is aligned with the protrusion 2242, the chip 100 falls through the second hollow window 2241; and in the orientation shown in Figure 11 , the notch 104 is downwardly arranged, and the PCB board 101 can be attached to the protrusion 2242 and thus pass through the second hollow window 2241 smoothly. As shown in

[0150] ​Since the second and third screening units 224 are both in the form of hollowed regions to screen the chips 100 in the preset orientation, in order to facilitate the chips 100 to drop from the first or second hollowed window 2231 or 2241, the side plate 2211 can be arranged in the same manner as the inclination in Figure 6 and Figure 7 .

[0151] The fourth screening unit 225 is used to screen the orientation of the element 103 on the chip 100. Referring to the orientation shown in Figure 14 , the fourth screening unit 225 comprises a longitudinal plate body 2251 connected to the conveying track 221, and a bent plate body 2252 arranged at the upper end of the longitudinal plate body 2251, which is bent back at the upper end of the longitudinal plate body 2251 and forms an open downward chute 2253, the chute 2253 extends in a straight line, and the chute 2253 is provided with a protruding strip 2254 extending in the same direction as the chute 2253. Referring to the orientation shown in Figure 15 , the distance between the left side of the protruding strip 2254 and the right side of the chute 2253 is not less than the thickness of the PCB board 101. Compared with Figure 15 and Figure 16 , when the element 103 enters the chute 2253 upward (i.e. the orientation shown in Figure 15 ), the element 103 is supported by the protruding strip 2254, so that the upper end of the chip 100 cannot come out of the chute 2253, and the chip 100 can continue to slide along the chute 2253; when the element 103 enters the chute 2253 downward (i.e. the orientation shown in Figure 16 ), since the element 103 cannot cooperate with the protruding strip 2254, the chip 100 will drop out of the fourth screening unit 225 in the direction indicated by the arrow in Figure 15 . As described above, the supporting plate 2212 on the conveying track 221 is used to support the lower end of the chip 100, in order to avoid the supporting plate 2212 affecting the chip 100 to drop out of the fourth screening unit 225, the conveying track 221 can be stopped before the fourth screening unit 225, or can be extended for a period of time after the chute 2253 and then stopped.

[0152] Further, as shown in Figure 1 , the fourth screening unit 225 extends to the conveying unit 3, and the chip 100 moves to the end of the fourth screening unit 225 and falls on the conveying unit 3. It can be understood that in order to ensure that the direction of the chip 100 after falling on the conveying unit 3 remains consistent, a corresponding guide structure can be provided. The chip 100 is provided with a contact for data writing, and in this embodiment, the contact is arranged upward after the chip 100 falls on the conveying unit 3 through the appropriate guide structure.

[0153] Preferably, as shown in Figure 1 , Figure 17 and Figure 18As shown, the conveying unit 3 comprises a distributing assembly 32 and a conveying track 31, one end of the conveying track 31 is connected with the outlet end of the feeding unit 2, the feeding unit 2 makes the chips 100 enter into the conveying track 31, and the conveying track 31 makes the chips 100 arrange in sequence, the other end of the conveying track 31 is connected with the first loading unit 4, the distributing assembly 32 makes the chips 100 on the conveying track 31 orderly conveyed to the first loading unit 4, and the first loading unit 4 is used for distributing the chips 100.

[0154] In the embodiment, the chips 100 screened from the feeding unit 2 are conveyed into the conveying track 31, the conveying track 31 makes the chips 100 arrange in sequence in the conveying track 31, the distributing assembly 32 makes the chips 100 on the conveying track 31 orderly conveyed to the first loading unit 4, and the first loading unit 4 distributes the chips 100, so as to realize the automatic loading of the chips 100, and the loading of the chips 100 is orderly, the production efficiency is improved, and the automatic production of the chips 100 is realized.

[0155] In the embodiment, as shown in Figure 1 , the first loading unit 4 is arranged lower than the feeding unit 2, and the conveying track 31 is arranged obliquely, so that the chips 100 entering into the conveying track 31 slide into the first loading unit 4 by gravity. The structure is simple, and the equipment cost is low. Preferably, the inclination angle of the conveying track 31 is greater than or equal to 45° and less than 90°, and the chips 100 slide on the conveying track 31 by gravity.

[0156] In the embodiment, as shown in Figure 1 , the conveying track 31 comprises a first track 311 and a second track 312, one end of the first track 311 is connected with the outlet end of the feeding unit 2, the other end is connected with one end of the second track 312, and the other end of the second track 312 is connected with the first loading unit 4. The first track 311 can be a pipe matched with the shape of the chips 100, and the chips 100 are arranged in single column in the first track 311, so that the conveying of the chips 100 is orderly. The second track 312 is provided with a sliding groove matched with the shape of the chips 100, and the chips 100 are arranged in single column in the sliding groove. The distributing assembly 32 is arranged at the position of the second track 312, so as to control the orderly movement of the chips 100.

[0157] Optionally, in the embodiment, as shown in Figure 17 and Figure 18As shown, the material distribution assembly 32 comprises a pressing member 321 and a blocking member 322 arranged downstream of the pressing member 321, the blocking member 322 is used to block the lowermost chip 100 on the conveying track 31, and the pressing member 321 is used to press the chip 100 adjacent to the lowermost chip 100 on the conveying track 31. The pressing member 321 and the blocking member 322 cooperate with each other to make the chips 100 orderly slide to the first loading unit 4, and only one chip 100 slides at a time. Specifically, in actual production, a plurality of chips 100 are arranged upstream of the blocking member 322 in sequence, the pressing member 321 presses the chip 100 adjacent to the lowermost chip 100 to block the chip 100 and the chips 100 upstream from sliding, at this time, the blocking member 322 is removed, the lowermost chip 100 is made to slide to the first loading unit 4, then the blocking member 322 is reset to continue to block the chips 100, the pressing member 321 is removed, and all the chips 100 slide downward in sequence, the lowermost chip 100 is blocked by the blocking member 322, the pressing member 321 presses the chip 100 adjacent to the lowermost chip 100, then the blocking member 322 is removed again, and the process is repeated to realize the orderly conveying of the chips 100 to the first loading unit 4.

[0158] In order to make the pressing member 321 and the blocking member 322 automatically act, in the embodiment, as shown in Figure 18 The position where the pressing member 321 presses is provided with a first detection member 33 for detecting the chip 100, and the position where the blocking member 322 blocks the lowermost chip 100 on the conveying track 31 is provided with a second detection member 34 for detecting the chip 100. The blocking member 322 will only perform the action of being removed when the second detection member 34 detects the signal of the chip 100. The pressing member 321 will only act to press the chip 100 when the first detection member 33 detects the signal of the chip 100.

[0159] Optionally, the first detection member 33 and the second detection member 34 are both reflective sensors, and an avoiding hole is arranged on the conveying track 31, the transmitting end of the reflective sensor is arranged on one side of the conveying track 31, and the receiving end is arranged on the other side of the conveying track 31. The sensor has good detection stability, high precision, and simple installation method.

[0160] In the embodiment, the pressing member 321 includes a pressing driving member and a pressing contact, the pressing contact is connected with the output end of the pressing driving member, and the pressing driving member drives the pressing contact to press the chip 100 on the conveying track 31. Alternatively, in the embodiment, the pressing driving member and the pressing contact are arranged on the back of the second track 312, a hole is formed on the second track 312 to allow the pressing contact to extend out, the pressing contact extends out to press against the chip 100, and the two sides of the slot of the sliding groove of the second track 312 are provided with baffles, and the chip 100 is limited in the sliding groove by the baffles. In other embodiments, the pressing contact and the pressing driving member can also be arranged above the second track 312 to press the chip 100 on the bottom of the sliding groove of the second track 312. The pressing contact and the pressing driving member can also be arranged on the side of the second track 312 to press the chip 100 on the side wall of the sliding groove of the second track 312, which is not limited here. The pressing driving member can be a pneumatic cylinder or an electric push rod.

[0161] In order to avoid damaging the chip 100, a rubber sleeve is sleeved on the pressing contact to protect the chip 100 from being damaged and also to play a buffering role.

[0162] In the embodiment, the blocking member 322 includes a blocking driving member and a blocking block, the blocking block is connected with the output end of the blocking driving member, and the blocking driving block drives the blocking block to extend and retract. Alternatively, in the embodiment, the blocking driving member and the blocking block are arranged on the back of the second track 312, a hole is formed on the second track 312 to allow the blocking block to extend out, and the blocking block extends out to block the chip 100 from sliding downward. In other embodiments, the blocking driving member and the blocking block can also be arranged above the second track 312 or on the side of the second track 312, which is not limited here. The blocking driving member can be a pneumatic cylinder or an electric push rod.

[0163] In order to improve the stability of the conveying unit 3 in operation and stop running in time when the conveying unit 3 fails, in the embodiment, as shown in Figure 18 The conveying track 31 is provided with an inlet detection member 35 at one end connected with the outlet end of the inlet unit 2 to detect whether the chip 100 enters the conveying track 31. The conveying track 31 is provided with an outlet detection member 36 at one end connected with the first charging unit 4 to detect whether the chip 100 enters the first charging unit 4 and has the function of counting the number of chips 100 entering the first charging unit 4.

[0164] To further improve the stability of the conveying unit 3, a slide detection member 37 is arranged between the outfeed detection member 36 and the second detection member 34, and the slide detection member 37 is used to detect whether the chip 100 has been slid down, so as to avoid the problem that if the conveying unit 3 continues to run when the chip 100 is stuck, the chip 100 is damaged.

[0165] Optionally, the infeed detection member 35, the outfeed detection member 36 and the slide detection member 37 are all reflective sensors, and a avoiding hole is arranged on the conveying track 31, the transmitting end of the reflective sensor is arranged on one side of the conveying track 31, and the receiving end is arranged on the other side of the conveying track 31, the sensor has good stability, high precision and simple installation mode. Preferably, the infeed detection member 35 and the outfeed detection member 36 are arranged at two ends of the second track 312.

[0166] In the embodiment, in order to make the chip 100 smoothly pass through the conveying track 31 and enter the first loading unit 4, and reduce the failure rate of the device, the chip production system further comprises at least one auxiliary distribution assembly 5, the auxiliary distribution assembly 5 makes the chip 100 on the conveying track 31 smoothly conveyed to the first loading unit 4, and avoids the chip 100 being stuck on the conveying track 31.

[0167] Optionally, the auxiliary distribution assembly 5 comprises an air nozzle and a gas supply component for supplying gas to the air nozzle, the air nozzle blows air towards the chip 100 in the conveying track 31, the weight of the chip 100 is small, and the air flow can adjust the position of the chip 100, so that the chip 100 smoothly slides to the first loading unit 4. In other embodiments, the auxiliary distribution assembly 5 can also have other structures, which are not limited here.

[0168] A plurality of auxiliary distribution assemblies 5 can be arranged along the length direction of the conveying track 31, so as to improve the production efficiency and reduce the failure rate.

[0169] The first loading unit 4 is used for distributing the chips 100, so as to facilitate the turnover and transportation of the chips 100, in the embodiment, the first loading unit 4 is combined with a first conveying track 41, a first loading track 42 and a first loading mechanism 43. Figure 1 、 Figure 19 and Figure 20As shown, the first loading unit 4 comprises a loading plate 41 and a driving assembly 42, a plurality of first containers 101 for containing the chips 100 are arranged side by side on the loading plate 41. Specifically, the loading plate 41 has a plurality of loading tracks, one first container 101 is arranged in each loading track, the chips 100 in the conveying track 31 fall into the loading tracks and enter the first containers 101 to realize the sub-packaging of the chips 100. After one first container 101 is filled, the driving assembly 42 drives the loading plate 41 to move so that the adjacent empty first container 101 is connected with the other end of the conveying track 31 to contain the chips 100 in the conveying track 31. The number of chips 100 contained in each first container 101 is fixed, and the discharge detection member 36 counts, after the number of chips 100 entering the first container 101 reaches a preset value, the driving assembly 42 drives the loading plate 41 to move so that the adjacent empty first container 101 is connected with the conveying track 31.

[0170] Optionally, as shown, the driving assembly 42 provided by the embodiment comprises a lead screw 421, a nut 422 and a driving motor 423, the loading plate 41 is connected with the nut 422, and the driving motor 423 drives the lead screw 421 to rotate to drive the nut 422 to move along the lead screw 421, thereby driving the loading plate 41 to move. Specifically, the lead screw 421, the nut 422 and the driving motor 423 are arranged on the inner side of the rack, and the loading plate 41 is arranged on the outer side of the rack to improve the overall aesthetics of the device. Figure 20 The output end of the driving motor 423 can be directly connected with the lead screw 421, or can be connected with the lead screw 421 through a transmission member. The transmission member can be a synchronous belt wheel structure or a chain wheel structure, which is not limited here.

[0171] In other embodiments, the first loading unit 4 can also comprise at least one guide rail, one end of the guide rail is connected with the conveying track 31, and the other end of the guide rail is connected with other production equipment to realize direct conveying and avoid the process of transfer. If a plurality of guide rails are arranged, different guide rails can be switched to be connected with the conveying track 31 to realize multi-directional conveying of the chips 100, thereby improving the use flexibility.

[0172] The conveying track 31 described above is inclined, in other embodiments, the first track 311 is inclined to receive the chips 100 conveyed by the feeding unit 2, the second track 312 is horizontally arranged, the chip 100 in the second track 312 is pushed into the first loading unit 4 by the sub-packaging assembly 32, and the first loading unit 4 sub-packages the chips 100. The structure of the sub-packaging assembly 32 is the prior art, which will not be described in detail here.

[0173]

[0174] ​When the first container 200 at the first loading unit 4 is filled with the chips 100, the first container 200 can be carried to the feeding unit 6 for storage by a mechanical hand or manually.

[0175] Preferably, as shown in Figure 2 and Figure 21 , the chip production system comprises a support 400, wherein the support 400 comprises a horizontally arranged bearing plate 402 and an obliquely arranged support plate 401. The feeding unit 6 comprises a storage 61, a conveyor 62 and a feeder 63; the storage 61 is used for storing the first container 200, the conveyor 62 is used for taking out the first container 200 in the storage 61 and transferring the first container 200 to a feeding position, and the feeder 63 is used for transferring the chips 100 in the first container 200 at the feeding position to the conveying unit 7, the conveying unit 7 is used for conveying the chips 100 to the testing unit 8, the testing unit 8 is used for performing performance detection and / or data writing and / or data verification and / or marking on the chips 100, and the second loading unit 9 is used for loading the chips 100 after the testing unit 8 completes the operation into the second container 300.

[0176] In the embodiment, the above arrangement realizes the full-automatic production of the chips 100, and by arranging multiple testing units 8, the single testing unit 8 can be used for production or multiple testing units 8 can be used for simultaneous production, which greatly improves the production efficiency and meets the production demand of the chips 100 in the printing consumables. In the embodiment, as shown in Figure 21 , the X direction represents a first direction and is a vertical direction, the Y direction represents a second direction, and the Z direction represents a third direction, wherein the X direction, the Y direction and the Z direction are perpendicular to each other, and the Y direction and the Z direction are both horizontal directions.

[0177] Regarding the arrangement of the storage 61, in combination with Figure 21 and Figure 22As shown, the storage 61 comprises two first storage racks 611 and second storage racks 612 oppositely arranged on the bearing plate 402, and the first storage racks 611 and second storage racks 612 are respectively provided with first storage grooves 6111 and second storage grooves 6121 extending along the first direction on the opposite sides of the first storage racks 611 and second storage racks 612, and the bottom ends of the first storage racks 611 and second storage racks 612 are respectively provided with discharge ports 6112 facing the conveying device 62, and the two ends of the first container 200 along the third direction are respectively located in the first storage grooves 6111 and second storage grooves 6121, and the first container 200 can move along the first direction in the first storage grooves 6111 and second storage grooves 6121, and when the first container 200 moves to the lowermost position, it can be separated from the storage groove by moving along the second direction towards the conveying device 62. In the embodiment, the arrangement can realize the stacking storage of multiple first containers 200 in the storage groove, and when the lowermost first container 200 is removed, the remaining first containers 200 can sequentially move down one position, and the falling of the first container 200 relies on gravity, without the need for additional driving, thus the structure is simple and the cost is low.

[0178] Specifically, as shown in Figure 22 , the first storage racks 611 and second storage racks 612 each comprise a storage vertical plate and two storage enclosures arranged at intervals on the storage vertical plate, and the first storage grooves 6111 are formed between the two storage enclosures of the first storage racks 611, and the second storage grooves 6121 are formed between the two storage enclosures of the second storage racks 612.

[0179] Preferably, the storage 61 further comprises a ballast block 613, and the two ends of the ballast block 613 along the third direction are respectively slidably arranged in the first storage grooves 6111 and second storage grooves 6121, and the ballast block 613 is placed above the multiple first containers 200 arranged in stacks, and the arrangement of the ballast block 613 can assist in driving the first container 200 to move downward. Preferably, the size of the ballast block 613 along the first direction is greater than the size of the discharge port 6112 along the first direction, so that when there is no first container 200 in the storage groove, the ballast block 613 falls at the lowermost end of the storage groove, and the ballast block 613 will not be separated from the discharge port 6112.

[0180] In an optional embodiment, as shown in Figure 22 , the storage 61 further comprises a ballast limiting member 614, one end of the ballast limiting member 614 is connected to the ballast block 613, and the other end of the ballast limiting member 614 can abut against the bearing plate 402, and when the ballast limiting member 614 abuts against the bearing plate 402, the ballast block 613 is located above the discharge port 6112. At this time, there is only one first container 200 below the ballast block 613, and the first container 200 can slide out of the discharge port 6112. The arrangement makes the ballast block 613 located above the discharge port 6112 when there is no first container 200 below the ballast block 613, which avoids the ballast block 613 entering the discharge port 6112 region and being mistakenly taken out as a first container 200.

[0181] In other embodiments in the present embodiment, the bottom of the storage vertical plate is provided with a mounting plate, the storage vertical plate is fixedly connected with the bearing plate 402 through the mounting plate, and the other end of the ballast limiting piece 614 can abut against the upper surface of the mounting plate. When the ballast limiting piece 614 abuts against the upper surface of the mounting plate, the ballast block 613 is located above the discharge port 6112.

[0182] In the present embodiment, as shown in Figure 21 the feeding device 63, the storage device 61 further includes a discharging piece 615, the discharging piece 615 is slidably arranged on the support 400 along the first direction, that is, the discharging piece 615 can perform lifting movement, the discharging piece 615 can at least partially extend below the lowermost first container 200, and has a top supporting position for lifting all the first containers 200 downwardly so that the lowermost first container 200 is lifted above the discharge port 6112, and a discharging position for dropping the lowermost first container 200 opposite to the discharge port 6112. When the discharging piece 615 is located at the top supporting position, the moving plate 621 can be moved to the taking position, at this time, the first placing part 6211 is located below the lowermost first container 200; then, the discharging piece 615 moves downwardly and is located at the discharging position, at this time, the lowermost first container 200 at least partially falls on the first placing part 6211, and the moving plate 621 moves along the second direction to take the lowermost first container 200 out of the discharge port 6112. By means of the above structure, the first container 200 in the storage device 61 can be taken out and transferred to the feeding position by cooperation of the horizontal movement of the moving plate 621 and the vertical movement of the discharging piece 615.

[0183] Specifically, as shown in Figure 21 the first placing part 6211 includes a first placing groove arranged on the moving plate 621. The transport device 62 further includes a transport device driving piece arranged on the bearing plate 402, the moving plate 621 is connected to the output end of the transport device driving piece, and the transport device driving piece can drive the moving plate 621 to move along the second direction relative to the bearing plate 402. Optionally, the transport device driving piece includes a driving motor, a lead screw and a nut, the motor is arranged on the bearing plate 402, the lead screw is rotationally arranged on the bearing plate 402, the nut is threadedly connected with the lead screw and connected with the moving plate 621, and the moving plate 621 is slidably arranged on the bearing plate 402 through a sliding rail and sliding block assembly.

[0184] In order to avoid that the position of the first container 200 on the moving plate 621 deviates due to vibration factors during the transportation process, so that the first container 200 cannot accurately reach the feeding position, in the present embodiment,Figure 21 As shown, the transporter 62 further comprises a fixing assembly for fixing the first container 200 located at the first placement portion 6211 of the moving plate 621. Specifically, the fixing assembly comprises a first pushing block 623 and a fixing driving member 624, the fixing driving member 624 is arranged on the moving plate 621, the first pushing block 623 is slidingly arranged on the moving plate 621 along the second direction and is connected to the output end of the fixing driving member 624, the first pushing block 623 has a clamping position close to the first placement slot and abutting the first container 200 located in the first placement slot against the sidewall of the first placement slot and a releasing position away from the first placement slot to release the first container 200 in the first placement slot. In other modes in the embodiment, the first pushing block 623 can be directly installed on the output end of the fixing driving member 624.

[0185] In addition, as shown, Figure 21 The feeding unit 6 further comprises a collection area 64 arranged on the bearing plate 402, the collection area 64 and the storage 61 are respectively arranged at two ends of the moving plate 621 along the second direction. The moving plate 621 further comprises a second placement portion 6212, the moving plate 621 further has a waste position close to the collection area 64, the first container 200 located at the feeding position can be placed in the second placement portion 6212 when the moving plate 621 is located at the taking position, and the first container 200 can be placed in the collection area 64 when the moving plate 621 moves to the waste position.

[0186] In the embodiment, specifically, the transporter 62 further comprises a pushing assembly, the output end of the pushing assembly can move along the second direction relative to the moving plate 621, for pushing the first container 200 located at the second placement portion 6212 to the collection area 64. Specifically, the pushing assembly comprises a pushing driving member 625 and a second pushing block 626, the pushing driving member 625 is arranged on the moving plate 621, and the second pushing block 626 is arranged on the output end of the pushing driving member 625.

[0187] The second placing part 6212 comprises a second placing groove penetrating through the moving plate 621 along the third direction, and the support 400. Two empty container jacking members 627 are arranged on the output ends of two empty container jacking driving members. The empty container jacking driving members drive the empty container jacking members 627 to ascend and descend along the first direction, so as to jack up two ends of the first container 200 in the second placing part 6212, thereby jacking out the first container 200 from the second placing groove. At this time, the output end of the pushing assembly moves along the second direction, and the first container 200 can be pushed to the collection area 64. In the embodiment, the cross section of the second placing groove can be rectangular. Of course, in other embodiments of the embodiment, the cross section of the second placing groove can be arc-shaped or semicircular. In the embodiment, the empty container jacking members 627 and the empty container jacking driving members can not be arranged, and the first container 200 can be directly pushed out of the second placing groove by the pushing assembly and placed in the collection area 64. In addition, the pushing assembly can also be replaced by a blowing member. The blowing member blows air to the first container 200, so that the first container 200 is transferred from the second placing groove to the collection area 64, or the first container 200 is blown to the collection area 64 after being jacked up by the empty container jacking members 627.

[0188] In combination Figures 23-24 As shown in the figure, in the embodiment, the feeder 63 comprises a feeding frame 631 and a pressing block 633. The feeding frame 631 is rotationally arranged on the support 400. The feeding frame 631 has a material receiving position for receiving the first container 200 and a material discharging position for tilting the first container 200. The feeding frame 631 is provided with a bearing part 6311. When the feeding frame 631 is located at the material discharging position, the first container 200 can deliver the chips 100 to the conveying unit 7. The pressing block 633 is slidingly arranged on the feeding frame 631. The pressing block 633 has a pressing position close to the bearing part 6311 for pressing the first container 200 against the bearing part 6311 and a releasing position away from the bearing part 6311 for releasing the first container 200. Specifically, the feeder 63 further comprises a rotation driving member 632 and a pressing driving member 634. The rotation driving member 632 is arranged on the support 400. The feeding frame 631 is provided with a hinged part hinged to the output end of the rotation driving member 632. The pressing driving member 634 is arranged on the feeding frame 631. The pressing block 633 is arranged on the output end of the pressing driving member 634. By means of the above arrangement, the first container 200 can be rotated from the horizontal position to the tilted position, so that the chips 100 contained in the first container 200 can automatically slide out, thereby saving the transmission power of the chips 100 and saving energy.

[0189] In combination Figure 21As shown, the feeder 63 further comprises a pushing assembly for pushing the first container 200 at the feeding position to the preset position of the bearing part 6311. This arrangement ensures that the first container 200 at the feeding position can enter the preset position of the bearing part 6311. Specifically, the pushing assembly comprises a pushing drive 635 arranged on the bracket 400 and a pushing member 636 arranged on the output end of the pushing drive 635.

[0190] In combination Figure 25 As shown, in the embodiment, the fixing assembly further comprises a plurality of rolling members 622 arranged along the third direction at intervals on the first pushing block 623. Specifically, the rolling members 622 comprise deep groove ball bearings, the axis of the deep groove ball bearings is parallel to the first direction, and the first container 200 and the plurality of deep groove ball bearings are tangent when the first pushing block 623 is at the clamping position. This arrangement makes the movement of the first container 200 along the second direction and the rolling members 622 have rolling friction, thereby reducing the friction coefficient.

[0191] When the first container 200 is rotated from the horizontal position to the inclined position under the action of the feeder 63, the outlet of the first container 200 is just opposite to the inlet of the conveying unit 7, so that the chips 100 in the first container 200 can automatically fall into the conveying unit under the action of gravity.

[0192] In combination Figure 2 and Figure 26 As shown, in the embodiment, the conveying unit 7 comprises a main channel assembly 71 and a sub-channel assembly 72, both of which are arranged on the support plate 401, the sub-channel assembly 72 is located downstream of the main channel assembly 71, the main channel assembly 71 can accommodate a plurality of chips 100 at the same time and release the chips 100 one by one to the sub-channel assembly 72; the sub-channel assembly 72 is used for receiving the chips 100 from the main channel assembly 71 and selectively placing the chips 100 into any one of the test units 8. With the above arrangement, the chips 100 can be distributed one by one in an orderly manner.

[0193] In the embodiment, the angle between the support plate 401 and the horizontal plane ranges from a, where 45 degrees ≤ a < 90 degrees. This arrangement can realize the automatic sliding of the chips 100. Of course, in other embodiments, the support plate 401 can also be in a horizontal state, and in the embodiment, a pushing power assembly is arranged at each conveying part to push the chips 100.

[0194] As shown, Figure 26As shown, the main material channel assembly 71 includes a main support plate 711, a main cover plate 712, a first main pressing member 713, and a main stop member 715. The main support plate 711 is disposed on the support plate 401, and the main cover plate 712 covers the main support plate 711. A main channel is formed between the main support plate 711 and the main cover plate 712, allowing multiple chips 100 to slide downwards simultaneously within the main channel. The first main pressing member 713 is used to press against the chips 100 to prevent them from sliding further downwards. The main stop member 715 can extend into the main channel to... To prevent chip 100 from continuing to slide down, the main stop 715 is located downstream of the first main pressure member 713 and spaced one chip 100 apart. That is, the chip 100 blocked by the main stop 715 is adjacent to the chip 100 pressed by the first main pressure member 713. When the main stop 715 extends into the main channel, all chips 100 in the main channel stop sliding down. When the first main pressure member 713 presses down on a chip 100 and the main stop 715 is withdrawn from the main channel, the downstreammost chip 100 slides out of the main channel. This configuration allows for the sequential release of chips 100 within the main channel. Specifically, the main cover plate 712 has a through hole, and the first main pressing member 713 is located on the support plate 401. It passes through the through hole and presses against the chip 100 to press the chip 100 onto the main support plate 711. The main support plate 711 has a through hole, and the main stop member 715 passes through the through hole and extends into the main channel. Further, the main material channel assembly 71 also includes a second main pressing member 714, which is located upstream of the first main pressing member 713. Multiple chips 100 are spaced between the first and second main pressing members 713. Preferably, three chips 100 are spaced between the first and second main pressing members 713 and 714. The main stop member 715 can be a pneumatic float.

[0195] The first main pressing member 713 and the second main pressing member 714 have the same structure. The first main pressing member 713 may include a telescopic rod and a pressing drive member. The pressing drive member is disposed on the support plate 401. One end of the telescopic rod is disposed at the output end of the pressing drive member, and the other end can abut against the chip 100. Further, a buffer member is provided at the abutment end of the telescopic rod and the chip 100. The buffer member is preferably a rubber rod.

[0196] Optionally, such as Figure 26 As shown, at least one auxiliary material distribution component 5 is provided at the main channel inlet and outlet respectively. The auxiliary material distribution component 5 is used to assist the chip 100 in smoothly sliding down the main channel. At least one auxiliary material distribution component 5 is provided at the inlet and outlet of the working channel respectively. The auxiliary material distribution component 5 is used to assist the chip 100 in smoothly sliding down the working channel. Specifically, the auxiliary material distribution component 5 includes an air nozzle that can blow air into the main channel or the working channel, so that the chip 100 with burrs or the chip 100 blocked by obstacles can continue to slide down.

[0197] Preferably, as shown in Figure 26 The first main detection member 716 is arranged at the entrance of the main channel. The second main detection member 717 is arranged between the first main compression member 713 and the second main compression member 714, downstream of the second main compression member 714, and is used to detect the adjacent chip 100 compressed by the second main compression member 714. The third main detection member 718 is arranged downstream of the main stop member 715.

[0198] In combination with Figure 2 In the embodiment, the plurality of test units 8 are arranged at the support plate 401 in the second direction and below the distribution channel assembly 72. The distribution channel assembly 72 is movable relative to the support plate 401 in the second direction so that the distribution channel assembly 72 can selectively place the chip 100 in any of the test units 8.

[0199] In combination with Figure 27 and 28 The distribution channel assembly 72 includes a distribution carrier plate 721, a distribution cover plate 722, and a distribution stop member 723. The distribution carrier plate 721 is slidably arranged at the support plate 401 in the second direction. The distribution cover plate 722 is arranged on the distribution carrier plate 721. The distribution carrier plate 721 and the distribution cover plate 722 form a distribution channel therebetween, which can accommodate one chip 100. The distribution stop member 723 can extend into the distribution channel to block the chip 100. Specifically, the distribution cover plate 722 is provided with a distribution cover through hole penetrating the distribution cover plate 722. The distribution stop member 723 can pass through the distribution cover through hole to enter the distribution channel.

[0200] Optionally, as shown in Figure 28 The distribution channel assembly 72 further includes a distribution power assembly. The distribution power assembly is arranged at the support plate 401. The distribution carrier plate 721 is arranged at the output end of the distribution power assembly. Specifically, the distribution power assembly includes a distribution transmission belt 724, a distribution driving wheel 726, a distribution driven wheel 727, and a distribution transmission driving member 725. The distribution transmission driving member 725 is arranged at the support plate 401. The distribution driving wheel 726 is arranged at the output end of the distribution transmission driving member 725. The distribution driven wheel 727 is rotatably arranged at the support plate 401. The distribution transmission belt 724 is arranged around the distribution driving wheel 726 and the distribution driven wheel 727. The distribution carrier plate 721 is fixed to the distribution transmission belt 724. The distribution carrier plate 721 is slidably arranged at the support plate 401 by a slide rail and slide block assembly.

[0201] Preferably, the entrance of the distribution channel is provided with a first distribution detection member. The exit of the distribution channel is provided with a second distribution detection member.

[0202] As shown in Figure 29 and Figure 30As shown, the test unit 8 comprises a write-read carrier plate 81, a write-read cover plate 82, a write-read code assembly 83 and a first write-read stopper 84; the write-read carrier plate 81 is arranged on the support plate 401, the write-read cover plate 82 is arranged on the write-read carrier plate 81, and a work channel is formed between the write-read carrier plate 81 and the write-read cover plate 82; the first write-read stopper 84 is used to block the chip 100 to be worked, i.e., to stop the chip 100 to be worked at a work position. This arrangement can realize the work operation on multiple chips 100 at the same time.

[0203] Specifically, the position relationship between the first write-read stopper 84 and the work channel is similar to the position relationship between the main stopper 715 and the main channel. Specifically, the write-read carrier plate 81 is provided with a write-read carrier hole penetrating through the write-read carrier plate 81, and the first write-read stopper 84 extends into the work channel through the write-read carrier hole to complete the stopping of the chip 100 to be worked.

[0204] When the work is completed, the chip 100 to be worked needs to be supplemented to the work position. Since the work channel is relatively long, the supplement time is relatively long.

[0205] Therefore, in the embodiment, as shown in the figure, Figure 31 the test unit 8 further comprises a second write-read stopper 85, which is arranged upstream of the first write-read stopper 84 and is used to stop the chip 100 to be worked. Preferably, the second write-read stopper 85 and the first write-read stopper 84 are separated by one or two positions of the chip 100. This arrangement makes it possible to store one chip 100 in the work channel during the work process, so as to shorten the time for supplementing the next chip 100 to the work position.

[0206] Further, the test unit 8 further comprises a write-read pressure contact piece 87, which is located upstream of the second write-read stopper 85, and the chip 100 pressed by the write-read pressure contact piece 87 is adjacent to the chip 100 stopped by the second write-read stopper 85. This arrangement makes it possible to store multiple chips 100 to be worked in the work channel. Preferably, five chips 100 to be worked can be stored in the work channel. It should be noted that the second write-read stopper 85 has the same structure as the first write-read stopper 84, and the write-read pressure contact piece 87 has the same structure as the first main pressure contact piece 713, so the structure of the second write-read stopper 85 and the write-read pressure contact piece 87 will not be described here. The first write-read stopper 84 and the second write-read stopper 85 can be selected as pneumatic floating beads.

[0207] Optionally, as shown in the figure, Figure 29 the entrance and the exit of the work channel are respectively provided with a first write-read detection piece 88 and a second write-read detection piece 89. The first write-read detection piece 88 is used to detect whether the chip 100 to be worked in the test unit 8 enters the work channel, and the second write-read detection piece 89 is used to detect whether the chip 100 completing the work is successfully released.

[0208] In combination Figure 32 As shown, the loading unit 9 comprises a loading assembly 91 and a fixing frame 92 capable of mounting a plurality of second containers 300, the loading assembly 91 and the fixing frame 92 are both arranged on the support plate 401, and the fixing frame 92 is located downstream of the loading assembly 91, and the plurality of second containers 300 are arranged side by side on the fixing frame 92; the loading assembly 91 is used for selectively loading the finished chip 100 into the second container 300.

[0209] The loading assembly 91 comprises a loading bearing plate 911, a loading cover plate 912, and a loading stopper 913, the loading bearing plate 911 is movable relative to the support plate 401 in the second direction, the loading cover plate 912 is arranged on the loading bearing plate 911, and a loading passage is formed between the loading bearing plate 911 and the loading cover plate 912, the loading passage is capable of accommodating one chip 100, and the loading stopper 913 is capable of extending into the loading passage to stop the chip 100. Specifically, the loading cover plate 912 is provided with a loading through hole penetrating through the loading cover plate 912, and the loading stopper 913 is capable of penetrating through the loading through hole into the loading passage. Optionally, the loading stopper 913 and the first main pressure contact piece 713 are of the same structure, and thus the specific structure thereof will not be described herein again.

[0210] Optionally, the loading unit 9 further comprises a loading power assembly 93, the loading power assembly 93 is arranged on the support plate 401, and the loading bearing plate 911 is arranged on the output end of the loading power assembly 93. Specifically, the loading power assembly 93 and the distribution power assembly are of the same structure, and thus the structure of the loading power assembly 93 will not be described herein again.

[0211] In this embodiment, the fixing frame 92 comprises a container placement bottom plate 921 and a container placement cover plate 922, the container placement bottom plate 921 is provided with a plurality of container placement grooves penetrating through the container placement bottom plate 921 and arranged at intervals in the second direction, the container placement bottom plate 921 is arranged on the support plate 401, and the container placement cover plate 922 is arranged on the container placement bottom plate 921, a plurality of container placement passages are formed between the container placement cover plate 922 and the container placement bottom plate 921, and the plurality of second containers 300 are respectively arranged in the plurality of container placement passages. Further, the groove bottom of the container placement groove is provided with an elastic piece 923, the elastic piece 923 is used for pressing the second container 300 against the container placement cover plate 922. This arrangement improves the stability of the second container 300. Specifically, one end of the elastic piece 923 is fixed to the groove bottom of the container placement groove, and the other end of the elastic piece 923 is inclined to the container placement cover plate 922 in the direction from the outlet to the inlet of the container placement groove.

[0212] The loading assembly 91 needs to receive the finished chips 100 between the multiple test units 8. When the number of test units 8 is large enough, the loading assembly 91 cannot timely receive the finished chips 100 from the multiple test units 8, and thus the second write-read stopper 85 cannot be opened after the test units 8 finish the work of the chips 100, at this time, the write-read code assembly 83 needs to stop working, which affects the work efficiency.

[0213] To this end, in the embodiment, as shown in Figure 30 The test unit 8 further comprises a third write-read stopper 86, which is arranged downstream of the first write-read stopper 84 and is used to stop the finished chips 100. This arrangement makes the finished chips 100 stopped by the third write-read stopper 86 after being released by the test unit 8, and thus can wait for the loading assembly 91 to receive, without stopping the write-read code assembly 83, thereby improving the work efficiency of the write-read code assembly 83.

[0214] Preferably, the chip production system further comprises a detection unit, a controller and a display unit 500. The detection unit comprises various detection members and sensors, and the controller controls the operation of the feeding unit 6, the conveying unit 7, the test unit 8, the loading unit 9 and the like by controlling the detection unit. The display unit 500 is used to display the state of the equipment and realize the human-computer interaction operation. The controller is well known to those skilled in the art, and thus the structure and control principle of the controller will not be described again.

[0215] Preferably, in the embodiment, the code writing and reading assembly 83 can write, read and check data of the chip 100, so as to check whether the data stored in the chip 100 is qualified. Preferably, the test unit 8 further comprises a performance detection assembly, which can detect the performance of the chip 100 entering the test unit 8. Specifically, the performance detection is generally used to detect whether various performances of the chip 100 meet the requirements, such as whether the sensor parameters meet the requirements, whether the data writing speed meets the requirements, and the like. Further, the test unit 8 further comprises a marking assembly, which can perform marking work on the chip 100. The test unit further comprises a data rewriting assembly, which can rewrite data of the chip 100 which needs to be upgraded. The code writing and reading assembly 83, the performance detection assembly, the marking assembly and the data rewriting assembly are respectively in communication connection and / or electrical connection with the loading assembly 91. The loading assembly 91 can put the chip 100 into different second containers 300 according to the detection result of the performance detection assembly, the checking result of the code writing and reading assembly 83, the work result of the marking assembly and the test result of the data rewriting assembly. Specifically, the loading assembly 91 sends the product with unqualified performance detection to one second container 300, puts the chip 100 with unqualified data read and checked by the code writing and reading assembly 83 into another second container 300, and puts the chip 100 with qualified performance detection, qualified data checking and completed marking work into still another second container 300, so as to monitor the production quality of the entire chip 100.

[0216] The embodiment also provides a chip production method, which is performed by using the chip production system and specifically includes the following steps:

[0217] Step 10: performing surface assembly and packaging on the PCB board 101 to form the chip 100;

[0218] Step 20: sorting the chips 100 in a preset orientation;

[0219] Step 30: sequentially conveying the sorted chips 100 to the test unit 8 to perform performance detection and / or data writing and / or data checking and / or marking work;

[0220] Step 40: loading the chips 100 into different second containers 300 according to the work result of the test unit 8.

[0221] The chip production method of the embodiment first realizes automatic sequencing of the chips 100 by using the chip production system, and then sequentially sends the sequenced chips 100 to the testing unit 8 for operation. The whole process does not need manual adjustment of the orientation of the chips 100, does not need manual sending of the chips 100 to the testing unit 8, and does not need manual collection of the chips 100 after operation, thereby greatly improving the production efficiency of the chips 100, reducing labor, and reducing production cost.

[0222] It should be noted that the surface assembly technology and packaging technology of the chips 100 in step 10 are existing mature technologies, which will not be described here.

[0223] Preferably, after the packaging of the chips 100 is completed, the packaging result needs to be detected, and the chips 100 with unqualified packaging result are taken out and repaired.

[0224] Preferably, in step 20, the process of sequencing the chips 100 in a preset orientation includes:

[0225] In step 21, the feeding unit 2 of the chip production system of the embodiment is used to sequentially discharge the chips 100 from the outlet end in a preset direction.

[0226] In step 22, the feeding unit 3 and the first feeding unit 4 of the embodiment are used to load the chips 100 discharged from the outlet end of the feeding unit 2 into the first container 200.

[0227] By setting the first container 200 to store the sequenced chips 100, and then directly sending the chips 100 loaded in the first container 200 to the testing unit 8 for operation, it can be avoided that when the feeding unit 2 for sequencing fails, the normal operation of the testing unit 8 is affected.

[0228] Further, in step 30, the feeding unit 6 and the transmission unit 7 sequentially arranged by the chip production system of the embodiment are cooperated to sequentially send the chips 100 loaded in the first container 200 to the testing unit 8 for operation.

[0229] Preferably, the test unit 8 of the embodiment can perform data writing, reading and checking, performance testing, and marking on the chip 100. Specifically, the test unit 8 can perform data writing, reading and checking on the chip 100 through the write-reading component 83, so as to check whether the data stored in the chip 100 is qualified. The test unit 8 can perform performance testing on the chip 100 entering the test unit 8 through the performance testing component. Specifically, the performance testing is generally used to check whether various performances of the chip 100 meet the requirements, such as whether the sensor parameters meet the requirements, whether the data writing speed meets the requirements, and the like. Further, the test unit 8 can perform marking on the chip 100 through the marking component. The test unit can perform data flashing on the chip 100 that needs to be upgraded through the data rewriting component. The write-reading component 83, the performance testing component, the marking component, and the data rewriting component are respectively communicatively and / or electrically connected with the loading component 91. The loading component 91 can place the chip 100 in different second containers 300 according to the detection result of the performance testing component, the checking result of the write-reading component 83, the operation result of the marking component, and the testing result of the data rewriting component. Specifically, the loading component 91 can place the chip 100 that fails in the performance testing in a second container 300, and the second container 300 can be marked as “NG” due to the unqualified performance. The loading component 91 can place the chip 100 that fails in the data writing in another second container 300, and the second container 300 can be marked as “NG” due to the data writing failure. The loading component 91 can place the chip 100 that fails in the data checking in another second container 300, and the second container 300 can be marked as “NG” due to the unqualified data checking. The chip 100 (hereinafter referred to as a good product) that passes the performance testing, the data writing, the checking, and the marking is placed in the remaining second containers 300, and the good product in the second containers 300 is subsequently packaged.

[0230] In summary, the process flow of the chip production method of the embodiment is as shown in Figure 33 , which includes:

[0231] The PCB board 101 is surface-mounted and packaged to form the chip 100.

[0232] The packaging result of the chip 100 is detected, and the chip 100 that fails in the detection is sent for repair, and the chip 100 that passes the detection is subjected to the next step.

[0233] The chip 100 that passes the detection is sent to the feeding unit 2, and the feeding unit 2 sequentially discharges the chip 100 in a preset orientation.

[0234] The chip 100 is sequentially sent to the conveying unit 3 and the first loading unit 4, so as to load the chip 100 into the first container 200.

[0235] The feeding unit 6 and the conveying unit 7 send the chips 100 in the first container 200 to one or more test units 8;

[0236] The test units 8 perform performance detection on the chips 100, and the unqualified chips are sent to the second container 300A;

[0237] The qualified chips are then subjected to data writing, and the unsuccessful chips are sent to the second container 300B;

[0238] The qualified chips are then subjected to data reading and verification, and the unqualified chips are sent to the second container 300C;

[0239] The qualified chips are then subjected to marking work and are sent to the second container 300D;

[0240] The chips 100 in the second container 300D are then packaged.

[0241] Hereinafter, the chip production method using the chip production system of the embodiment, and the chip production system including three test units are taken as examples for description:

[0242] The time required for the main lane assembly 71 of the conveying unit 7 to send one chip 100 to the branch lane assembly 72 is 0.2-1 second, and the branch lane assembly 72 sends five chips 100 to the three test units 8 respectively in one cycle. The time required for each chip 100 to be sent to the main lane assembly 71 after returning from each test unit 8 is 0.2-0.6 second, and preferably, the time required for each chip 100 to be sent to the test units 8 on the two sides and then return to the main lane assembly 71 is 0.4 second; and the time required for each chip 100 to be sent to the test unit 8 in the middle is 0.2 second.

[0243] Optionally, after the chip 100 enters the test unit 8, first, the first write-read stopper 84 extends, then the second write-read stopper 85 retracts in the state of the write-read pressure contact piece 87 pressure contact, and one chip 100 is released to the working position and stopped by the first write-read stopper 84. The write-read code assembly 83 and the performance detection assembly perform corresponding work respectively, and at the same time, the second write-read stopper 85 extends, the write-read pressure contact piece 87 is released, the chip 100 descends to the second write-read stopper 85, and then the write-read pressure contact piece 87 pressure contacts; after the write-read code assembly 83 and the performance detection assembly complete the work, the third write-read stopper 86 extends, and then the first write-read stopper 84 retracts to release the chip 100 after completing the work and stop it by the third write-read stopper 86; and then the next cycle begins.

[0244] Optionally, in the test unit 8, the time t1 is needed for the chip 100 stored in the working channel to enter the working position, the time t2 is needed for the chip 100 to be written and read by the writing and reading code assembly 83, and the time t3 is needed for the chip 100 to slide out of the working position after the working is completed, i.e. the time needed for the working position to be emptied is t3. When t2 is greater than t1, the production time of each chip 100 is determined by the sum of t2 and t3 or by t2. When t2 is less than t1, the production time of each chip 100 is determined by the sum of t1 and t3 or by t1.

[0245] Optionally, after the chip 100 completing the working is released by the third writing and reading stopper 86, the time 0.2-1 second is needed for the chip 100 to enter the loading channel of the loading assembly 91, the loading assembly 91 places the chip 100 in the second container 300, and the time 1-2 second is needed for another test unit 8 to wait to receive the chip 100 completing the working. Specifically, the time of each link can be adjusted according to the actual situation, and is not limited thereto. For example, when the number of test units 8 increases, the time needed for each chip 100 to be sent and returned to the main channel assembly 71 per minute needs to be reduced. Specifically, when the number of test units 8 is 8, the time needed for each chip 100 to be sent to the test units 8 on both sides and returned to the main channel assembly 71 per minute is 0.2 second. The time needed for each chip 100 to be sent to the test units 8 in the middle per minute is 0.1 second. Specifically, the increase of the distribution process can accelerate the air blowing device.

[0246] In addition, the number of chips 100 sent by the distribution channel assembly 72 to each test unit 8 per cycle can be adjusted according to the actual situation, and is not limited thereto. For example, when the number of test units 8 increases, the number of chips 100 sent by the distribution channel assembly 72 to each test unit 8 per cycle increases. Specifically, when the number of test units 8 is 8, the number of chips 100 sent by the distribution channel assembly 72 to each test unit 8 per cycle can be 10.

[0247] The embodiment also provides a chip, and the chip 100 is made by using the chip production method provided by the embodiment. It can be understood that the chip 100 can be used in printing consumables, or can be used in other fields, which is not limited herein.

[0248] Embodiment two

[0249] This embodiment provides a chip manufacturing system, a method for manufacturing recycled chips, and a recycled chip. The chip manufacturing system in this embodiment includes the chip manufacturing system in Embodiment 1. In addition, the chip manufacturing system in this embodiment also includes a scraping unit 1. The scraping unit 1 removes the adhesive 102 and the wafer within the adhesive 102 from one side of the PCB board 101 of the recycled old chip. The remaining PCB board 101 and the components 103 on it can be re-surface-mounted and packaged, thereby realizing the recycling of the old chip.

[0250] Preferably, such as Figures 34-37 As shown, the adhesive removal unit 1 includes a feeding mechanism 11, a heating mechanism 12, and an adhesive removal mechanism 13, wherein the feeding mechanism 11 is used to convey the old chip forward according to a preset orientation. In one embodiment, the feeding mechanism 11 includes a transmission component 111 and a vibration device 112. The vibration device 112 can be a device similar to a vibratory feeder that continuously outputs material using vibration.

[0251] The transmission component 111 may include a transmission track 1111 and a pushing component 1112. The transmission track 1111 is connected to the material output port of the vibration device 112, and the old chip can be output from the vibration device 112 onto the transmission track 1111. The pushing component 1112 includes a drive source 1112a and a feeding brush 1112b connected to the motion output end of the drive source 1112a. The drive source 1112a can be configured as any device capable of outputting uniform rotation, such as a motor. The feeding brush 1112b rotates at a uniform speed under the drive of the drive source 1112a. The feeding brush 1112b is suspended above the transmission track 1111, and the bristles on the feeding brush 1112b can contact the old chip on the transmission track 1111. By utilizing the uniform rotation of the feeding brush 1112b itself, the old chip is pushed forward at a substantially uniform speed. In other embodiments, the transmission component 111 may also adopt a structure similar to a conveyor belt, that is, the old chip is directly transferred forward through the transmission track 1111, eliminating the feed brush 1112b, or other forms may be adopted, as long as the old chip output by the vibration device 112 can be pushed forward and transferred.

[0252] A space sensor can also be installed on the transfer track 1111 to detect whether there is a space on the transfer track 1111. In this way, when there is no old chip on the transfer track 1111 or the old chip transfer is interrupted, the space sensor can send an electrical signal to the central control unit of the glue scraping unit 1. For example, when there is no old chip in the vibration device 112, there is no old chip on the transfer track 1111. At this time, the space sensor can detect the material shortage in the vibration device 112 and send a signal to the central control system of the glue scraping unit 1.

[0253] In order to cooperate with the subsequent heating and glue removing process, the old chips need to be arranged according to certain rules, and the old chips arranged according to the rules are conveyed to the transmission track 1111. The structure of the chip screening unit can be realized by the feeding unit 2, which will not be described here.

[0254] The heating mechanism 12 is arranged on the path of the old chips to heat the old chips. Referring to Figure 41 and Figure 42 , the heating mechanism 12 can include a heat conduction table 121 and a heating component (not shown in the figure) arranged in the heat conduction table 121. The heating component generates heat and raises the temperature of the heat conduction table 121. The PCB board 101 of the old chip receives heat, and the temperature of the PCB board 101 gradually rises, so that the glue 102 in contact with the PCB board 101 softens first. It can be understood that since the PCB board 101 needs to be used to bind new wafers in the future, the temperature of the heating cannot affect the structure of the PCB board 101. Generally, the sensor circuit or logic circuit element 103 on the old chip is connected to the PCB board 101 by high-temperature soldering. The melting point of such high-temperature solder is generally above 150°, so as long as the temperature transferred to the PCB board 101 is lower than the melting point of the solder, the original structure of the PCB board 101 will not be damaged.

[0255] Further, in order to avoid the temperature of the heating component or the heat conduction table 121 being too high, a temperature control device 173 for controlling the temperature can be arranged at the heating mechanism 12 or other positions of the glue scraping unit 1.

[0256] In order to enable the old chips on the transmission track 1111 to receive heat from the heat conduction table 121, the transmission track 1111 can be directly extended through the heat conduction table 121, or as shown in Figure 38 、 Figure 41 and Figure 42 , a conveying groove 1211 for the old chips to continue to pass forward is arranged on the heat conduction table 121. In this way, the old chips can be directly or indirectly heated with the heat conduction table 121 without the need for heat conduction through the transmission track 1111.

[0257] Referring to Figure 38 、 Figure 40 and Figure 42As shown, the adhesive removal mechanism 13 includes a scraper 131, a guide assembly 32 for mounting the scraper 131, and a support assembly 133 mounted at a fixed position. The support assembly 133 is mounted at a fixed position of the adhesive removal unit 1, and is equipped with an impact unit 134 for driving the scraper 131 to extend / retract rapidly. In some embodiments, the impact unit 134 can be configured as a cylinder, hydraulic cylinder, etc. In order to enable the scraper 131 to obtain a faster movement speed, the cylinder, hydraulic cylinder, etc., serving as the impact unit 134 can also be connected to a rapid action control circuit so that it can drive the scraper 131 to extend and retract rapidly.

[0258] Furthermore, to more precisely control the movement trajectory of the blade 131, a guide rail 1331 is also provided on the support assembly 133, and the blade holder assembly 132 is slidably connected to the guide rail 1331. When the impact unit 134 is activated, it can drive the blade holder assembly 132 to move along the guide rail 1331, thus making the movement path of the blade 131 mounted on the blade holder assembly 132 more precise.

[0259] Without limiting the structural dimensions, multiple scrapers 131 can be used along the direction of forward transfer of the old chip to simultaneously complete the adhesive removal action. The structure of the old chip not only differs in terms of the presence or absence of components 103 and notches 104, but also in the thickness of the PCB board 101 for some old chips with roughly the same structure: the PCB board 101 of some old chips is thicker, while that of others is thinner. However, the upper surface of the transfer track 1111 or the upper surface of the transfer groove 1211 on the heat conduction platform 121 is at the same height. That is to say, the horizontal height of the adhesive-coated surface of the old chip is also different due to the different thicknesses of the PCB board 101. The process of scraping off the adhesive 102 by the scraper 131 may damage the PCB board 101 or fail to completely remove the adhesive 102.

[0260] To solve this problem, combined with Figures 41 to 43 As shown, a limiting baffle 122 is provided on the heat conduction stage 121. In some embodiments, two limiting baffles 122 may be provided and respectively provided on both sides of the forward transfer direction of the old chip. The side of the pair of limiting baffles 122 that are close to each other extends to the top of the transfer groove 1211. In this way, the upward movement of the old chip transferred to the transfer groove 1211 is restricted by the lower surface of the limiting baffle 122.

[0261] The adhesive removal mechanism 13 also includes a lifting device (not shown) installed at the heat-conducting table 121, see reference. Figure 43 As shown, the lifting device can lift the old chip upwards along the direction of the hollow arrow in the figure. When the lifting device lifts the old chip, the lower surface of the limiting baffle 122 restricts the old chip from moving further upwards. Therefore, the lifting device can make the adhesive side of the old chip adhere to the lower surface of the limiting baffle 122. Figure 43The horizontal straight line shown in the figure represents the lower surface of the limiting baffle 122, so that the adhesive surfaces of the old chips can be all fixed on the same plane, and the force pushing the old chips can also make the old chips relatively fixed at the position of being lifted. In this way, the adhesive surfaces of the old chips are placed against the lower surface of the limiting baffle 122 by the lifting device, so that the shovel 131 can be installed based on the lower surface of the limiting baffle 122, that is, the cutting edge of the shovel 131 is flush with the lower surface of the limiting baffle 122, so as to ensure that the glue removing effect of the shovel 131 is not affected by the different thicknesses of the PCB 101.

[0262] Referring to Figure 42 As shown in the figure, the heat conduction table 121 can also be provided with a lifting outlet 1212, which can accommodate the upper end of the aforementioned lifting device to lift the old chips in the conveying groove 1211. The position of the lifting outlet 1212 can be set based on the position of the shovel 131. In an embodiment, the lifting device is arranged in the heat conduction table 121 and can receive heat from the heat conduction table 121. When the old chip is lifted, the heat is conducted to the old chip by the lifting device. After about 10 seconds, the glue 102 at the junction of the old chip and the PCB 101 softens. At this time, the shovel 131 is controlled to act, and the glue 102 can be removed. It can be understood that the purpose of the lifting device is to lift the old chip upward at a predetermined position (such as the glue removing position of the shovel 131) so that the adhesive surface of the old chip is in contact with the lower surface of the limiting baffle 122. Therefore, the lifting device can include but is not limited to a hydraulic lifting device, a pneumatic lifting device, or an elastic lifting device connected with an elastic element (such as a spring). In addition, the lifting device can also make the adhesive surface of the old chip and the lower surface of the limiting baffle 122 have a certain normal pressure. The friction between the adhesive surface and the lower surface of the limiting baffle 122 caused by the normal pressure can better avoid the influence of the movement of the old chip on the glue removing effect when the shovel 131 acts.

[0263] Referring to Figures 40 to 42 As shown in the figure, the limiting baffle 122 is also provided with a tool path groove 1221 penetrating the limiting baffle 122, and the number of the tool path grooves 1221 corresponds to the number of the shovels 131. The shovel 131 can extend into the tool path groove 1221 to the position where the cutting edge is flush with the lower surface of the limiting baffle 122. In this way, when the shovel 131 moves in the tool path groove 1221 in the direction of the solid arrow in Figure 40 and Figure 41 , the cutting edge of the shovel 131 can be flush with the lower surface of the limiting baffle 122 to remove the glue 102 on the old chip from the junction of the adhesive surface of the old chip and the glue 102.

[0264] Referring to Figure 38As shown in the figures, the glue scraping unit 1 further comprises a cleaning mechanism 14, which is correspondingly arranged at the end of the scraping movement of the scraper 131 and can take away the scraped glue 102. In some embodiments, the cleaning mechanism 14 can be configured as a negative pressure suction device to take away the scraped glue 102 by negative pressure; or in other embodiments, the cleaning mechanism 14 can also be a blowing device capable of blowing out gas to blow away the glue 102 by the blown gas, so as to avoid the influence of the scraped glue 102 on the next glue scraping action of the scraper 131; in addition, other forms of cleaning mechanism structure can also be adopted as long as the scraped glue 102 can be taken away in time.

[0265] In addition, as shown in Figure 39 、 Figure 41 and Figure 42 , the glue scraping unit 1 further comprises a polishing mechanism 15, which is arranged after the glue scraping mechanism 13 and is used for polishing the area after the old chip is scraped. In one embodiment, the polishing mechanism 15 can include a rotary driving source and a roller brush 151 connected thereto, which can not only scrape the area after the old chip is scraped to remove a small amount of residual glue 102, but also will not scratch the surface of the PCB 101. Similar to the tool moving groove 1221, a polishing groove 1222 penetrating the limiting baffle 122 is also provided on the limiting baffle 122 corresponding to the position of the roller brush 151, and the roller brush 151 can partially extend into the polishing groove 1222 to better polish the surface of the old chip. Since the polishing mechanism 15 is arranged adjacent to the glue scraping mechanism 13, the aforementioned cleaning mechanism 14 can also suck away part of the powder generated in the polishing process.

[0266] In some related prior art, it is proposed to complete the glue scraping process by laser cutting or melting the glue 102 at high temperature. However, the temperature of the laser beam is high and difficult to control, and when the glue 102 is melted at high temperature, the PCB 101 is also easily melted, or the solder in the PCB 101 is melted. As described above, the thickness of the PCB 101 of the old chip is different, and the surface is not necessarily completely flat. Therefore, when the glue 102 is cut by laser, it is difficult to achieve efficient automatic cutting due to the difference in the state of the PCB 101, and the scrap rate is high. In the present application, the glue surface of the old chip is fixed to a unified plane by the lifting device, and the scraping effect of the scraper 131 is controllable as long as the displacement is accurate. Even if there is residual glue 102 on the PCB 101 due to factors such as warping and unevenness of the PCB 101, the polishing mechanism 15 can further remove the residual glue 102 by scraping and polishing.

[0267] As shown in Figure 34As shown, the glue scraping unit 1 further comprises a base 16 and a machine cover 17, the machine cover 17 is arranged on the upper surface of the base 16 and forms a space on the upper surface of the base 16, and the aforementioned feeding mechanism 11, heating mechanism 12, glue removing mechanism 13, cleaning mechanism 14, polishing mechanism 15 and the like can be arranged in the cover space of the machine cover 17. In addition, the machine cover 17 is further provided with a dust removal mechanism 18, which is used to remove dust, impurities and the like in the machine cover 17.

[0268] The machine cover 17 is further provided with a touch screen 171, a function button 172, a temperature control device 173 and an indicator light 174, and these devices are electrically connected with the corresponding units in the machine cover 17 to form a complete glue scraping unit 1.

[0269] Therefore, when the glue scraping unit 1 is working, the central control unit in the glue scraping unit 1 can first issue a self-checking instruction to execute a self-checking program of each unit and feed back self-checking information to the central control unit.

[0270] Wherein:

[0271] The vibration device 112 in the feeding mechanism 11 starts to work, and the empty space sensor can send an electrical signal to the central control unit to prompt that there is no old chip in the vibration device 112;

[0272] The heating element in the heating mechanism 12 receives the electrical signal of the central control unit and starts to heat the heat-conducting table 121 according to the temperature parameter set by the program. At this time, the temperature control device 173 in the device detects the temperature in the device, and when the temperature rises to the set temperature, the central control unit sends a signal to stop heating, and when the temperature is lower than the set temperature value, the heating element continues to heat;

[0273] The touch screen 171 embedded on the outer surface of the machine cover 17 can display the above-mentioned state information at the same time, so that the user can understand the working condition of each unit in the machine cover 17 through the displayed state information, and when everything in the device is normal, the indicator light 174 is lit to prompt the user to add the old chip into the vibration device 112 and start to work.

[0274] The embodiment also provides a regenerated chip production method, which comprises the chip production method provided in the embodiment, and the difference lies in that the regenerated chip production method comprises a glue scraping step, and the glue scraping step comprises the following steps: Figure 44 As shown:

[0275] The old chip is recovered, and the glue 102 and the wafer of the old chip are scraped off, and the PCB board is reserved;

[0276] The PCB board is surface mounted and packaged to form a regenerated chip;

[0277] The recycled chip packaging result is detected, the unqualified recycled chip is sent to repair, and the qualified one is sent to the next step;

[0278] The qualified one is sent to the feeding unit 2, and the feeding unit 2 discharges the recycled chips in a preset direction;

[0279] The recycled chips are sequentially sent to the conveying unit 3 and the first feeding unit, so as to load the recycled chips into the first container 200;

[0280] The feeding unit 6 and the conveying unit 7 send the recycled chips in the first container 200 to one or more test units 8;

[0281] The test unit 8 detects the performance of the recycled chips, and the unqualified one is sent to the second container 300A;

[0282] The qualified one is then subjected to data writing, and the unsuccessful one is sent to the second container 300B;

[0283] The qualified one is then subjected to data reading and verification, and the unqualified one is sent to the second container 300C;

[0284] The qualified one is subjected to marking work and is sent to the second container 300D;

[0285] The recycled chips in the second container 300D are packaged again.

[0286] The embodiment also provides a recycled chip, and the recycled chip is made by using the recycled chip production method provided in the embodiment. It can be understood that the recycled chip can be used in printing consumables or other fields, which is not limited herein.

[0287] Obviously, the above embodiment of the application is only an example for clearly illustrating the application, and is not a limitation on the embodiments of the application. For those skilled in the art, according to the idea of the application, the specific embodiments and application range can be changed, and the content of the description should not be understood as a limitation on the application. Any modification, equivalent replacement and improvement within the spirit and principle of the application should be included in the protection scope of the claims of the application.

Claims

1. A chip manufacturing system, characterized in that, include: The feeding unit (2) is capable of holding the chips and discharging them one by one from the outlet end in a preset orientation; The conveying unit (3) and the first loading unit (4) are provided. The first loading unit (4) is detachably connected to the first container (200). One end of the conveying unit (3) is connected to the outlet end of the feeding unit (2), and the other end can dock with the first loading unit (4) so ​​that the chip is loaded into the first container (200) in an orderly manner. The feeding unit (6), the transmission unit (7), and at least one testing unit (8) are provided. The feeding unit (6) can store a plurality of the first containers (200) and can feed the chips in the first containers (200) into the transmission unit (7) one by one. The transmission unit (7) can transport the chips to at least one of the testing units (8) in sequence. The testing unit (8) can perform testing operations on the chips. The second loading unit (9) can load the chip that has completed the test in the test unit (8) into the second container (300). The feeding unit (2) includes: Vibration mechanism (21) is capable of holding the chip and generating vibration; The screening mechanism (22) includes a conveying track (221) for moving the chip forward in an upright position. One end of the conveying track (221) is connected to the outlet end of the vibration mechanism (21), and the other end is connected to the conveying unit (3). At least one screening part is provided on the conveying track (221), and the screening part is used to screen the chip placed on the conveying track (221) in a preset position. The chip manufacturing system includes a support (400), and the feeding unit (6), the transmission unit (7) and the testing unit (8) are all disposed on the support (400). The feeding unit (6) includes a storage unit (61), a transport unit (62) and a feeder (63). The storage unit (61) is used to store the first container (200). The transport unit (62) is used to take out the first container (200) in the storage unit (61) and transfer it to the feeding position. The feeder (63) can transfer the chip contained in the first container (200) located at the feeding position to the transmission unit (7). The transfer track (221) includes a side plate (2211) and a tray (2212), the tray (2212) being disposed on the side of the side plate (2211) for supporting the chip moving in an upright position; Along the extension direction of the conveying track (221), the chip screening device has a first screening section (222) and at least one of a second screening section (223), a third screening section (224) and a fourth screening section (225) disposed after the first screening section (222); the first screening section (222) is used to screen the chip with the adhesive side facing; the second screening section (223) is configured to penetrate the side plate (2211) through a first cutout window (2231), the first cutout window (2231) being configured to allow the chip with a height exceeding the upper boundary of the first cutout window (2231) along the extension direction of the side plate (2211) to pass through; the third screening section (224) is used to screen the chip with the notch (104) facing; the fourth screening section (225) is used to screen the chip with the component facing.

2. The chip manufacturing system according to claim 1, characterized in that, The chip manufacturing system also includes: A surface mount unit for mounting wafers and / or components (103) on a PCB board (101) and forming bare chips; A packaging unit is used to package the bare chip, so that the wafer and / or the component (103) are electrically connected to the PCB board (101) to form the chip; A transfer unit is used to feed the chip into the feeding unit (2).

3. The chip manufacturing system according to claim 2, characterized in that, The chip manufacturing system also includes a glue removal unit (1), which is used to remove the glue (102) on the old chip and the wafer inside the glue (102), and transport the remaining PCB board (101) to the surface assembly unit.

4. The chip manufacturing system according to claim 3, characterized in that, The adhesive removal unit (1) includes a feeding mechanism (11), a heating mechanism (12), and an adhesive removal mechanism (13), wherein: The feeding mechanism (11) is used to convey the chip forward with the colloid (102) on its surface facing the same orientation; The heating mechanism (12) is disposed on the transmission path of the chip and is used to heat the chip; The adhesive removal mechanism (13) includes a scraper (131) that is movable relative to the chip to remove the adhesive (102) from the surface of the heated chip.

5. The chip manufacturing system according to claim 1, characterized in that, The first screening section (222) is used to screen the orientation of the adhesive side of the chip. The width of the tray (2212) at the first screening section (222) is set based on the thickness of the PCB board (101) of the chip so that the chip can be shaken off when the adhesive side of the chip faces the side plate (2211); when the adhesive side of the chip faces away from the side plate (2211), the chip can pass through the first screening section (222) and continue to move forward. The side plate (2211) has a second cutout window (2241) that penetrates the third screening section (224). The third screening section (224) includes a protrusion (2242). Referring to the chip's transport direction, the protrusion (2242) protrudes from the upper boundary of the second cutout window (2241) toward the interior of the second cutout window (2241). The protrusion (2242) is configured such that when the chip's notch (104) is aligned with the protrusion (2242), it falls through the second cutout window (2241). Furthermore, the distance between the protrusion (2242) and the two sides of the second cutout window (2241) does not exceed the width of the chip. The fourth screening unit (225) includes a longitudinal plate (2251) connected to the conveying track (221) and a bent plate (2252) disposed at the upper end of the longitudinal plate (2251). The bent plate (2252) bends back at the upper end of the longitudinal plate (2251) to form a downward-opening groove (2253). The groove (2253) extends in a straight line direction. A protrusion (2254) extending along the extension direction of the groove (2253) is disposed in the groove (2253). When the upper end of the chip enters the groove (2253), the components on the chip cooperate with the protrusion (2254) so ​​that the chip can slide along the groove (2253).

6. The chip manufacturing system according to any one of claims 1-4, characterized in that, The conveying unit (3) includes a material distribution component (32) and a conveying track (31). One end of the conveying track (31) is connected to the outlet end of the feeding unit (2), and the other end can dock with the first container (200) on the first loading unit (4). The material distribution component (32) enables the chips on the conveying track (31) to be conveyed in an orderly manner into the first container (200) on the first loading unit (4).

7. The chip manufacturing system according to claim 6, characterized in that, The first loading unit (4) is positioned below the feeding unit (2), and the conveying track (31) is inclined.

8. The chip manufacturing system according to claim 7, characterized in that, The material distribution assembly (32) includes a pressing member (321) and a blocking member (322) disposed downstream of the pressing member (321). The blocking member (322) is used to block the chip located at the bottom on the conveying track (31), and the pressing member (321) is used to press the chip adjacent to the bottom chip against the conveying track (31).

9. The chip manufacturing system according to claim 6, characterized in that, One end of the conveying track (31) connected to the outlet end of the feeding unit (2) is provided with a feeding detection device (35) for detecting whether the chip enters the conveying track (31). The end of the conveying track (31) connected to the first loading unit (4) is provided with a discharge detection device (36) for detecting whether the chip has entered the first loading unit (4).

10. The chip manufacturing system according to claim 6, characterized in that, The chip production system also includes at least one auxiliary feeding component (5), which enables the chip on the conveying track (31) to be smoothly conveyed to the first loading unit (4).

11. The chip manufacturing system according to claim 6, characterized in that, The first loading unit (4) includes: A loading plate (41) on which multiple first containers (200) can be mounted side by side; A drive assembly (42) drives the loading plate (41) to move so that the different first containers (200) respectively dock with the other end of the conveying track (31).

12. The chip manufacturing system according to claim 1, characterized in that, The storage device (61) includes two first storage racks (611) and second storage racks (612) disposed opposite to each other on the support (400). The opposite surfaces of the first storage rack (611) and the second storage rack (612) are respectively provided with a first storage groove (6111) and a second storage groove (6121) extending along a first direction. The bottom ends of the first storage rack (611) and the second storage rack (612) are each provided with a discharge port (6112). The two ends of the first container (200) are respectively located in the first storage groove (6111) and the second storage groove (6121), and can slide out from the discharge port (6112) along a second direction, which is perpendicular to the first direction.

13. The chip manufacturing system according to claim 12, characterized in that, The transporter (62) includes a movable plate (621) having a first placement portion (6211). The movable plate (621) is slidably disposed on the support (400) along the second direction. The movable plate (621) has a material-retrieving position near the storage container (61) and a material-feeding position near the feeder (63). The storage container (61) also includes a discharge component (615) slidably disposed on the support (400) along the first direction. The discharge component (615) has... The bottom first container (200) is lifted to the top support position above the discharge port (6112) and the bottom first container (200) is lowered to the discharge position opposite to the discharge port (6112); when the unloading component (615) is in the top support position, the moving plate (621) can move to the picking position; when the unloading component (615) is in the discharge position, the first container (200) falls into the first placement part (6211) and can be transferred to the feeding position by the moving plate (621).

14. The chip manufacturing system according to claim 1, characterized in that, The feeder (63) includes: The feeding rack (631) includes a support plate (401) on the support plate (401). The feeding rack (631) is rotatably mounted on the support plate (401) and has a receiving position for receiving the first container (200) and a discharging position for tilting the first container (200). The feeding rack (631) is provided with a bearing part (6311). The pressing block (633) is slidably disposed on the feeding rack (631), having a pressing position close to the bearing part (6311) to press the first container (200) against the bearing part (6311) and a releasing position away from the bearing part (6311) to release the first container (200).

15. The chip manufacturing system according to claim 1, characterized in that, The bracket (400) includes a support plate (401) which is inclined. The transmission unit (7) includes a main material channel assembly (71) and a material channel assembly (72) disposed on the support plate (401). The material channel assembly (72) is located below the main material channel assembly (71). The chip production system includes a plurality of test units (8) arranged along a second direction. The plurality of test units (8) are located below the material channel assembly (72). The main feed channel assembly (71) can receive and simultaneously accommodate multiple chips from the first container (200), and can release the chips one by one to the feed channel assembly (72). The feed channel assembly (72) can drive the chip to move along the second direction on the support plate (401) to selectively distribute the chip to any one of the plurality of test units (8).

16. The chip manufacturing system according to claim 1, characterized in that, The test unit (8) includes a write-read support plate (81), a write-read cover plate (82), a write-read code assembly (83), and a first write-read stop (84). The bracket (400) includes an inclined support plate (401). The write-read support plate (81) is disposed on the support plate (401). The write-read cover plate (82) is disposed on the write-read support plate (81) to form a working channel. The first write-read stop (84) is used to block the chip to be written with data. The write-read code assembly (83) can write, read, and verify data on the chip.

17. The chip manufacturing system according to claim 16, characterized in that, The second loading unit (9) includes a loading assembly (91) and a fixing frame (92) disposed on the support plate (401). The fixing frame (92) is disposed below the loading assembly (91). Multiple second containers (300) can be installed on the fixing frame (92). The loading assembly (91) can receive the chip from the test unit (8) and can selectively place the chip into any one of the second containers (300).

18. The chip manufacturing system according to claim 1, characterized in that, The test unit (8) includes a write-read code component (83), which is capable of writing, reading, and verifying data on the chip; and / or, the test unit (8) includes a performance detection component, which is capable of performing performance detection on the chip entering the test unit (8); and / or, the test unit (8) includes a marking component, which is capable of marking the chip; and / or, the test unit (8) includes a data rewriting component, which is capable of rewriting data on the chip that needs to be upgraded. The second loading unit (9) includes a loading component (91). The write-read component (83) and / or the performance detection component and / or the marking component and / or the data rewriting component are respectively connected to the loading component (91) for communication and / or electrical connection. The loading component (91) can put the chip into different second containers (300) according to the detection result of the performance detection component, and / or the verification result of the write-read component (83), and / or the operation result of the marking component, and / or the test result of the data rewriting component.

19. A chip manufacturing method, characterized in that, The chip manufacturing system according to any one of claims 1-18 specifically includes the following steps: Surface mount components and encapsulation are applied to a PCB board to form a chip; The chips are sorted according to a preset orientation; The ordered chips are sequentially sent to the test unit (8) for performance testing and / or data writing and / or data verification and / or data rewriting and / or marking operations; Based on the results of the test unit (8), the chips are respectively loaded into different second containers (300).

20. The chip manufacturing method according to claim 19, characterized in that, The test unit (8) includes a write-read code component (83), which is capable of writing, reading, and verifying data on the chip; and / or, the test unit (8) includes a performance detection component, which is capable of performing performance detection on the chip entering the test unit (8); and / or, the test unit (8) includes a marking component, which is capable of marking the chip; and / or, the test unit (8) includes a data rewriting component, which is capable of rewriting data on the chip that needs to be upgraded. The second loading unit (9) includes a loading component (91). The write-read component (83) and / or the performance detection component and / or the marking component and / or the data rewriting component are respectively connected to the loading component (91) for communication and / or electrical connection. The loading component (91) can put the chip into different second containers (300) according to the detection result of the performance detection component, and / or the verification result of the write-read component (83), and / or the operation result of the marking component, and / or the test result of the data rewriting component.

21. A method for producing recycled chips, characterized in that, The chip manufacturing system according to any one of claims 1-18 specifically includes the following steps: Remove the colloid (102) on the old chip and the wafer inside the colloid (102), and keep the PCB board; Surface mount technology (SMT) and encapsulation are applied to PCB boards to form recycled chips. The regenerated chips are sorted in a preset orientation; The sorted regenerated chips are sequentially sent to the test unit (8) for performance testing and / or data writing and / or data verification and / or data rewriting and / or marking operations; Based on the results of the test unit (8), the regenerated chips are respectively loaded into different second containers (300).

22. The method for producing regenerated chips according to claim 21, characterized in that, The test unit (8) includes a write-read code component (83), which is capable of writing, reading, and verifying data on the regenerated chip; and / or, the test unit (8) includes a performance detection component, which is capable of performing performance detection on the regenerated chip entering the test unit (8); and / or, the test unit (8) includes a marking component, which is capable of marking the regenerated chip; and / or, the test unit (8) includes a data rewriting component, which is capable of rewriting data on the regenerated chip that needs to be upgraded. The second loading unit (9) includes a loading component (91). The code writing and reading component (83) and / or the performance detection component and / or the marking component and / or the data rewriting component are respectively connected to the loading component (91) for communication and / or electrical connection. The loading component (91) can put the regenerated chip into different second containers (300) according to the detection result of the performance detection component, and / or the verification result of the code writing and reading component (83), and / or the operation result of the marking component, and / or the test result of the data rewriting component.

23. A chip, characterized in that, The chip is manufactured using the chip manufacturing method described in claim 19 or 20.

24. A regenerable chip, characterized in that, The regenerated chip is manufactured using the regenerated chip manufacturing method described in claim 21 or 22.

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