Contactless Wafer Unloader

Abstract

The invention discloses a contactless and wax-free wafer unloader, comprising a support frame, a turntable, a rotating suction cup and an inclination driving cylinder, wherein a pick-up and placement platform is arranged on the inner side of the support frame, a load trolley is parked on one side close to the pick-up and placement platform, a placement slot is arranged on the load trolley, and a ceramic disk is placed on the placement slot, and a shower nozzle is fixedly installed on the support frame on one side of the pick-up and placement platform, and the upper surface of the pick-up and placement platform is fixedly connected to the slide slot, and the inner side of the slide slot is slidably connected to the bottom peripheral side of the limiting suction cup, and a first stopping cylinder and an electric wheel hub are fixedly installed on the upper surface of the pick-up and placement platform on both sides of the slide slot, and the upper surface of the inner side plate of the support frame is hingedly connected to the bottom of the inclined platform away from one side of the pick-up and placement platform, and the wafer is flushed by the shower nozzle and slides on the down ramp, so as to avoid the operator using the wafer unloading shovel to lift and remove the wafer from the groove of the polishing ceramic disk, and at the same time, the operator grabs the wafer for pick-up and placement, thereby reducing the risk of scratching the wafer when inserted into the wafer box carrier slot.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a contactless wax-free wafer unloader. Background Art

[0002] In the semiconductor industry, product quality must be strictly controlled, and the surface must be free of scratches, stains, etc. The polishing process is also an important part of it. There are wax polishing and wax-free polishing processes. The wafer is fixed on the polishing disc in various ways, but removing the wafer from the polishing disc is challenging.

[0003] In the wax-free wafer unloading process, the wafer to be polished needs to be placed in the groove of a special ceramic disc grinding disc, and the moisture and air are discharged to make the wafer close to the groove of the ceramic disc. However, when unloading, the wafer in the groove needs to be taken out and placed in a loading box. At this time, manual intervention, manually tilting the wafer and grabbing it to place it in the loading box, will put the surface finish and surface scratch degree of the wafer to the test.

[0004] Therefore, it is urgent to find a way to easily remove the wafer from the groove of the polishing ceramic disk and avoid the wafer from contacting and bumping with objects through mechanical transfer techniques to reduce the adverse factors in the wafer removal process.

[0005] Therefore, we propose a non-contact wax-free wafer unloader to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to provide a contactless wax-free wafer unloader to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a contactless wax-free wafer unloader, comprising a support frame, a turntable, a rotating suction cup and a tilt-angle driving cylinder, a pick-up and placement platform is provided on the inner side of the support frame, a load trolley is parked on the side close to the pick-up and placement platform, a placement slot is provided on the load trolley, ceramic discs are placed on the placement slot, a shower head is fixedly installed on the support frame on one side of the pick-up and placement platform, the upper surface of the pick-up and placement platform is fixedly connected to a slide slot, the inner side of the slide slot is slidably connected to the bottom side of the limiting suction cup, a first stopping cylinder and an electric wheel hub are fixedly installed on the upper surface of the pick-up and placement platform on both sides of the slide slot, the upper surface of the inner side plate of the support frame is hingedly connected to the bottom of the tilting platform on the side away from the pick-up and placement platform, and a turntable is fixedly installed on the tilting platform.

[0008] Preferably, the electric wheel hub is symmetrically arranged on the inner side of the first blocking cylinder.

[0009] Preferably, a plurality of groups of auxiliary rollers are provided on the upper surface of the inclined platform.

[0010] Preferably, the lower surface of the tilting platform close to the lower surface of the pick-and-place platform is hingedly connected to the top of the tilting drive cylinder, and the bottom of the tilting drive cylinder is hingedly connected to the inner plate of the support frame.

[0011] Preferably, the bottom of the rotating suction cup is connected to a negative pressure pump.

[0012] Preferably, the bottom of the down ramp away from the pick-up and placement platform is inclined downward, and a storage groove is provided at the bottom of the down ramp.

[0013] Preferably, a rotating suction cup is clamped on the top of the turntable.

[0014] Preferably, a plurality of second stopping cylinders are installed on the upper surface of the tilting platform, and the second stopping cylinders are located outside the turntable.

[0015] Compared with the prior art, the invention has the following beneficial effects: by using a shower head to flush the wafer and sliding it on the down ramp, the operator is prevented from using a wafer shovel to lift and remove the wafer from the groove of the polishing ceramic plate, and at the same time the operator grabs the wafer to take and place it, thereby reducing the risk of scratching the wafer when it is inserted into the slot of the wafer box carrier;

[0016] During the wafer unloading process, a water film is formed between the wafer and its relatively moving parts to prevent the wafer from sliding on the ramp and scratching the surface, thereby protecting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention;

[0018] Figure 2 It is a schematic diagram of the dispersion of the turntable and the rotating suction cup in the present invention;

[0019] Figure 3 It is a schematic diagram of the structure of the tilting platform in the present invention;

[0020] Figure 4 It is a schematic side view of the tilting platform in the present invention.

[0021] In the figure: 1. load trolley; 101. placement slot; 2. ceramic plate; 3. shower nozzle; 4. support frame; 5. pick-up and placement table; 51. electric wheel hub; 52. first stop cylinder; 53. slide slot; 54. limit suction cup; 6. second stop cylinder; 61. auxiliary roller; 62. negative pressure pump; 63. rotating suction cup; 64. turntable; 7. tilting table; 71. tilt drive cylinder; 8. down ramp; 9. storage slot. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-4 The present invention provides a technical solution: a contactless wax-free wafer unloader, comprising a support frame 4, a turntable 64, a rotating suction cup 63 and an inclination drive cylinder 71, a pick-up and placement platform 5 is arranged inside the support frame 4, a load trolley 1 is parked on one side close to the pick-up and placement platform 5, a placement groove 101 is arranged on the load trolley 1, a ceramic plate 2 is placed on the placement groove 101, a shower head 3 is fixedly installed on the support frame 4 on one side of the pick-up and placement platform 5, a slide groove 53 is fixedly connected to the upper surface of the pick-up and placement platform 5, a limit suction cup 54 is slidably connected to the inner side of the slide groove 53, and the limit suction cup 54 can absorb the bottom of the ceramic plate 2 and slide inside the slide groove 53 to prevent the ceramic plate 2 from falling;

[0024] The first stopping cylinder 52 and the electric hub 51 are fixedly installed on the upper surface of the pick-up and placement table 5 on both sides of the slide slot 53. The electric hub 51 can move independently and is used to drive the ceramic disk 2 for transportation. There are no motion transmission parts such as chains, which are used in clean rooms and have low impact on the environment. The ceramic disk 2 is transferred and transported under the electric hub 41. The first stopping cylinder 52 is used for stopping and positioning. The upper surface of the inner plate of the support frame 4 is hingedly connected to the bottom of the tilting table 7 away from the side of the pick-up and placement table 5. The tilting table 7 is fixedly installed with a turntable 64, which is used to control the rotation of the tilted ceramic disk 2;

[0025] The electric wheel hub 51 is symmetrically arranged inside the first stopping cylinder 52. The electric wheel hub 51 is used to transfer and transport the ceramic plate 2, and the first stopping cylinder 52 is used for stopping and positioning.

[0026] A plurality of auxiliary rollers 61 are provided on the upper surface of the tilting platform 7 to facilitate the movement of the ceramic sheet 2;

[0027] The lower surface of the tilting platform 7 near the lower surface of the pick-up and place platform 5 is hingedly connected to the top of the tilting drive cylinder 71, and the bottom of the tilting drive cylinder 71 is hingedly connected to the inner plate of the support frame 4. The tilting drive cylinder 71 can lift the tilting platform 7 to make it parallel to the lower ramp 8, so as to facilitate the shower head 3 to flush the slices;

[0028] The bottom of the rotating suction cup 63 is connected to the negative pressure pump 62, and the negative pressure generated by the negative pressure pump 62 can act on the ceramic plate 2 through the rotating suction cup 63 to adsorb the ceramic plate 2;

[0029] The bottom of the down ramp 8 is inclined downward away from the pick-up and placement platform 5, and a storage slot 9 is provided at the bottom of the down ramp 8. The down ramp 8 is convenient for washing the wafers with water through the shower head, so that the wafers enter the storage slot 9;

[0030] A rotating suction cup 63 is clamped on the top of the turntable 64, and the suction cup 63 absorbs the ceramic plate to make it rotate stably in a tilted state;

[0031] A plurality of second stopping cylinders 6 are installed on the upper surface of the tilting platform 7, and the second stopping cylinders 6 are outside the turntable 64. The electric wheel hub 51 is used to transfer and transport the ceramic disc 2, and the second stopping cylinders 6 are used for stopping and positioning.

[0032] Working principle: When the present invention is used, the ceramic disk of the wafer is taken out from the trolley of the loading port and placed on the pick-up and placement table 5. The limiting suction cup 54 can absorb the bottom of the ceramic disk 2 and slide inside the slide groove 53 to prevent the ceramic disk 2 from falling. The ceramic disk 2 is transported to the tilting table 7 through the electric wheel hub 51. The first stopping cylinder 52 is used for stopping and positioning. The inclination driving cylinder 71 can lift the tilting table 7 to make it parallel to the down ramp 8. A rotating suction cup 63 is clamped on the top of the turntable 64. The negative pressure generated by the negative pressure pump 62 can act on the ceramic disk 2 through the rotating suction cup 63. The suction cup 63 absorbs the ceramic disk to make it rotate stably in a tilted state. The operator rotates the shower head 3 to flush the wafers on the ceramic disk 2 into the down ramp 8 one by one. During this period, a water film is formed on the surface of the ramp to prevent the wafers from sliding on the ramp and scratching the surface. Finally, the wafers enter the water storage tank 9 through the ramp to complete the unloading.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A contactless wax-free wafer unloader, comprising a support frame (4), a turntable (64), a rotary suction cup (63) and an inclination drive cylinder (71), characterized in that: A pick-up and placement platform (5) is provided on the inner side of the support frame (4), a load trolley (1) is parked on one side close to the pick-up and placement platform (5), a placement groove (101) is provided on the load trolley (1), a ceramic plate (2) is placed on the placement groove (101), a shower head (3) is fixedly installed on the support frame (4) on one side of the pick-up and placement platform (5), the upper surface of the pick-up and placement platform (5) is fixedly connected to a slide groove (53), the inner side of the slide groove (53) is slidably connected to the bottom peripheral side of a limiting suction cup (54), and a first stopping cylinder (52) and an electric wheel hub (51) are fixedly installed on the upper surface of the pick-up and placement platform (5) on both sides of the slide groove (53). The upper surface of the inner plate of the support frame (4) is hingedly connected to the bottom of the tilting platform (7) on the side away from the pick-up and placement platform (5), and the tilting platform (7) is fixedly installed with a turntable (64); the electric wheel hub (51) is symmetrically arranged on the inner side of the first blocking cylinder (52); a plurality of auxiliary rollers (61) are arranged on the upper surface of the tilting platform (7); the lower surface of the lower surface of the tilting platform (7) close to the pick-up and placement platform (5) is hingedly connected to the top of the tilting drive cylinder (71), and the bottom of the tilting drive cylinder (71) is hingedly connected to the inner plate of the support frame (4); the bottom of the rotating suction cup (63) is connected to the negative pressure pump (62); the down ramp (8) is away from the pick-up and placement platform (5) ) has a bottom that is tilted downward on one side, and a storage groove (9) is provided at the bottom of the down ramp (8); a rotating suction cup (63) is clamped on the top of the turntable (64); a plurality of second stopping cylinders (6) are installed on the upper surface of the tilting table (7), and the second stopping cylinders (6) are outside the turntable (64); the ceramic disk of the wafer is taken out from the trolley at the loading port and placed on the pick-and-place table (5), the limiting suction cup (54) can absorb the bottom of the ceramic disk (2), slide inside the slide groove (53) to prevent the ceramic disk (2) from falling, and the ceramic disk (2) is transported to the tilting table (7) through the electric wheel hub (51), and the first stopping cylinder (52) is used to Stop positioning, the tilt drive cylinder (71) can lift the tilt table (7) so that it is parallel to the down ramp (8), and a rotating suction cup (63) is clamped on the top of the turntable (64). The negative pressure generated by the negative pressure pump (62) can act on the ceramic plate (2) through the rotating suction cup (63). The suction cup (63) adsorbs the ceramic plate to make it rotate stably in a tilted state. The operator rotates the shower head (3) to flush the wafers on the ceramic plate (2) into the down ramp (8) one by one. During this period, a water film is formed on the surface of the ramp to prevent the wafers from sliding on the ramp and scratching the surface. Finally, the wafers pass through the ramp into the water storage tank (9) to complete the unloading.

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