Overhead crane monitoring system and method
By introducing the combination of a first detection device and a second detection device into the semiconductor equipment, the problem of false alarms from the light sensor was solved, enabling workers to observe and photograph wafers without interference during overhead crane transportation, thus improving operational convenience and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGXIN MEMORY TECH INC
- Filing Date
- 2020-07-09
- Publication Date
- 2026-07-03
Smart Images
Figure CN113921417B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor equipment, and in particular to a crane monitoring system and method. Background Technology
[0002] During the wafer fabrication process, wafer pods (FOUPs) containing wafers are transported to semiconductor equipment by overhead cranes and loaded onto the wafer pod loading port of the semiconductor equipment.
[0003] When a crane moves wafer cassettes up and down, if there are foreign objects (such as workers or other objects) in the area between the wafer cassette loading platform and the crane, the wafer cassettes may be damaged by collisions. To avoid this, existing technology installs a light sensor on the semiconductor equipment. A light emitter is installed at one end of the equipment, and a light receiver at the other. When a foreign object is detected within the sensor's range, the semiconductor equipment issues a warning signal, and the crane stops moving the wafer cassettes, thus preventing workers from colliding with them.
[0004] However, the existing technology has a drawback: when the semiconductor equipment is in operation, the light sensor remains active. Therefore, when there is no overhead crane moving up or down, it is difficult for staff to observe or photograph the wafers inside the semiconductor equipment at close range, which can easily trigger the light sensor and cause false alarms. Summary of the Invention
[0005] Based on this, it is necessary to provide a crane monitoring system and method to address the above-mentioned technical problems, which facilitates workers to observe or photograph wafers inside semiconductor equipment at close range.
[0006] A crane monitoring system, comprising:
[0007] The first detection device is used to detect the position of the overhead crane. When the overhead crane is above the wafer cassette loading stage of the semiconductor equipment, it sends out a first detection signal, and when the overhead crane leaves the wafer cassette loading stage, it sends out a second detection signal.
[0008] The processing device is electrically connected to the first detection device and is used to generate a start control signal when the first detection signal is received, and to generate a stop control signal when the second detection signal is received.
[0009] The second detection device, electrically connected to the processing device, is used to start detecting whether there are foreign objects between the overhead crane and the wafer cassette loading stage after receiving the start control signal, and to stop detecting after receiving the stop control signal.
[0010] According to the above technical solution, the second detection device is normally in the off state. When the crane arrives above the wafer cassette loading stage in the semiconductor equipment, preparing to lower the wafer cassette to the designated position, the first detection device detects the crane and sends a first detection signal. After receiving the first detection signal, the processing device outputs a start control signal to trigger the second detection device. Only then will the second detection device turn on and begin detection. Therefore, when the crane is not stopped above the wafer cassette loading stage 44 of the semiconductor equipment 43, or when the crane 40 leaves the wafer cassette loading stage 44 of the semiconductor equipment 43, the second detection device will not perform detection. At this time, whether the operator is observing or photographing the wafer, they will not be detected by the second detection device, facilitating observation and photography.
[0011] In one embodiment, the processing device continuously receives the first detection signal for a preset time, generates the start control signal, and sends it to the second detection device.
[0012] In one embodiment, the overhead crane moves along the overhead crane track; the first detection device is a light sensor, including a light emitting device and a light receiving device, the light emitting device and the light receiving device are located on the upper and lower sides of the overhead crane track, and the light receiving device is located on the optical path of the detection light emitted by the light emitting device.
[0013] In one embodiment, the second detection device is a ranging detector.
[0014] In one embodiment, after the second detection device detects that there are no foreign objects between the overhead crane and the wafer cassette loading stage, the wafer cassette can be transported between the overhead crane and the wafer cassette loading stage; and the second detection device is also used to detect the transport speed of the wafer cassette and whether the wafer cassette is tilted when the wafer cassette is transported between the overhead crane and the wafer cassette loading stage, so as to determine whether there is any abnormality in the transport process of the wafer cassette.
[0015] In one embodiment, the processing device includes a transmission module for transmitting the detection data detected by the second detection device to the main system for storage.
[0016] In one embodiment, the processing device includes a statistics unit for counting the number of times the second detection device is started and stopped, and for counting the semiconductor equipment capacity based on the number of times the second detection device is started and stopped.
[0017] In one embodiment, the detection range of the second detection device covers the area between the overhead crane and all the wafer cassette loading stages on the semiconductor equipment.
[0018] This application also provides a crane monitoring method, including the following steps:
[0019] Based on the position of the overhead crane detected by the first detection device, a first detection signal is issued when the overhead crane is above the wafer cassette loading stage of the semiconductor equipment, and a second detection signal is issued when the overhead crane leaves the wafer cassette loading stage.
[0020] The processing device generates a start control signal when it receives the first detection signal, and generates a stop control signal when it receives the second detection signal;
[0021] Upon receiving the start control signal, the second detection device starts detecting whether there are foreign objects between the overhead crane and the wafer cassette loading stage, and stops detecting upon receiving the stop control signal.
[0022] In one embodiment, the processing device continuously receives the first detection signal for a preset time, generates the start control signal, and sends it to the second detection device.
[0023] In one embodiment, after receiving the start control signal, the second detection device starts detecting whether there is a foreign object between the overhead crane and the wafer cassette loading stage, and after receiving the stop control signal, it stops detecting and further includes:
[0024] After the second detection device detects that there are no foreign objects between the overhead crane and the wafer cassette loading platform, the wafer cassette can be transported between the overhead crane and the wafer cassette loading platform. The second detection device also detects the transport speed of the wafer cassette and whether the wafer cassette is tilted when the wafer cassette is transported between the overhead crane and the wafer cassette loading platform, so as to determine whether there is any abnormality in the transport process of the wafer cassette.
[0025] In one embodiment, after receiving the start control signal, the second detection device starts detecting whether there is a foreign object between the overhead crane and the wafer cassette loading stage, and after receiving the stop control signal, it stops detecting and further includes:
[0026] The detection data detected by the second detection device is transmitted to the main system for storage.
[0027] The number of times the second detection device is started and stopped is counted, and the semiconductor equipment production capacity is calculated based on the number of times the second detection device is started and stopped. Attached Figure Description
[0028] Figure 1 This is a schematic diagram illustrating the structure of a semiconductor device and an overhead crane in one embodiment of the present invention;
[0029] Figure 2This is a schematic diagram illustrating the structure of the overhead crane inspection system in one embodiment of the present invention;
[0030] Figure 3 This is a schematic diagram illustrating the structure of a first detection device according to an embodiment of the present invention;
[0031] Figure 4 This is a schematic diagram illustrating the detection direction of the second detection device according to an embodiment of the present invention;
[0032] Figure 5 This is a flowchart of an embodiment of the overhead crane detection method of the present invention;
[0033] Figure 6 This is a flowchart of another embodiment of the overhead crane detection method of the present invention.
[0034] Reference numerals: 10, processing device; 20, first detection device; 201, light emitting device; 202, light receiving device; 30, second detection device; 40, overhead crane; 41, overhead crane track; 42, wafer cassette; 43, semiconductor equipment; 44, wafer cassette loading platform. Detailed Implementation
[0035] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0037] In the description of this invention, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the method or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.
[0038] like Figure 1 As shown, during the wafer processing, wafer cassette 42 is used to store and transport wafers, and the wafer cassette is transported to semiconductor equipment 43 and loaded onto wafer cassette loading stage 44 of semiconductor equipment 43 by overhead crane 40.
[0039] When the overhead crane 40 is transporting the wafer cassette 42 up and down, if there are foreign objects (such as workers or other objects) in the area between the wafer cassette loading stage of the semiconductor equipment and the overhead crane, the workers or other objects may collide with the wafer cassette 42, causing damage to the wafer. To avoid this situation, the prior art installs a light sensor on the semiconductor equipment 43. A light emitting end is installed at one end of the semiconductor equipment 43, and a light receiving end is installed at the other end. When there is a foreign object in the detection range of the light sensor, the semiconductor equipment 43 will issue a warning signal, and the overhead crane 40 will not transport the wafer cassette 42 up and down, thereby preventing workers from colliding with the wafer cassette 42.
[0040] However, the existing technology has a drawback: when the semiconductor device 43 is in operation, the light sensor will remain in operation. Therefore, when the overhead crane 40 is not in operation, it is difficult for staff to observe the wafer inside the semiconductor device 43 or take pictures of the wafer at close range, which may trigger the light sensor and cause a false alarm.
[0041] like Figure 2 As shown, to solve the above problems, this application provides a crane 40 detection system, including: a first detection device 20, used to detect the position of the crane 40, issuing a first detection signal when the crane 40 is above the wafer cassette loading stage 44, and issuing a second detection signal when the crane 40 leaves the wafer cassette loading stage 44; a processing device 10, electrically connected to the first detection device 20, used to generate a start control signal when receiving the first detection signal, and generate a stop control signal when receiving the second detection signal; and a second detection device 30, electrically connected to the processing device 10, used to start detecting whether there is a foreign object between the crane 40 and the wafer cassette loading stage 44 after receiving the start control signal, and to stop the detection after receiving the stop control signal.
[0042] When the overhead crane 40 reaches above the wafer cassette loading stage 44 of the semiconductor equipment 43, the first detection device 20 detects the overhead crane 40 and sends a first detection signal. Upon receiving the first detection signal, the processing device 10 outputs a start control signal to trigger the second detection device 30. Only then will the second detection device 30 activate and begin detection. Therefore, if the overhead crane 40 is not stopped above the wafer cassette loading stage 44 of the semiconductor equipment 43, or if the overhead crane 40 has left the wafer cassette loading stage 44 of the semiconductor equipment 43, the second detection device 30 will not perform detection. During this time, whether the operator is observing or photographing the wafer, they will not be detected by the second detection device 30, facilitating observation and photography.
[0043] In an optional embodiment, after continuously receiving the first detection signal for a preset time, the processing device 10 generates a start control signal and sends it to the second detection device 30. The start control signal can be set to be generated and sent after a certain delay compared to receiving the first detection signal, such as 1 to 2 seconds. If the overhead crane 40 leaves the semiconductor device 43 within 1 to 2 seconds and the processing device 10 does not continuously receive the first detection signal for the preset time, then the processing device 10 will not generate and send the start control signal, that is, the second detection device 30 will not receive the start control signal. This greatly reduces the possibility of the second detection device 30 being accidentally activated because the overhead crane 40 passes over the semiconductor device 43. When the overhead crane 40 simply passes over the semiconductor device 43, it will not affect the observation and filming of the staff.
[0044] like Figure 3 As shown, in an optional embodiment, the overhead crane 40 moves along the overhead crane track 41; the first detection device 20 is a photodetector, including a light emitting device 201 and a light receiving device 202, located on the upper and lower sides of the overhead crane track 41. The light emitting device 201 emits detection light, and the light receiving device 202 is located on the optical path of the detection light emitted by the light emitting device 201. In an optional example, the direction of the optical path of the detection light is perpendicular to the direction of movement of the overhead crane 40. The light emitting device 201 and the light receiving device 202 of the first detection device 20 are fixedly connected to the overhead crane track 41. The overhead crane 40 passes between the light emitting device 201 and the light receiving device 202. When the overhead crane 40 is located between the light emitting device 201 and the light receiving device 202, the light receiving device 202 cannot receive the light emitted by the photodetector, thereby generating a first detection signal. When the light receiving device 202 can receive the detection light emitted by the light emitting device 201, the first detection device 20 generates a second detection signal. Of course, in other examples, the first detection device 20 can also be a sound wave detector, etc. Any detector that can perform the above functions can be used here as the first detection device 20.
[0045] Combination Figure 1 and Figure 4In an optional embodiment, the second detection device 30 is a distance measuring detector. The distance measuring detector detects the distance between the overhead crane 40 and the wafer cassette loading stage 44, and transmits the detected data to the processing device 10. The processing device 10 determines whether there are foreign objects between the overhead crane 40 and the wafer cassette loading stage 44 based on the detection data. When there are foreign objects between the overhead crane 40 and the wafer cassette loading stage 44, the processing device 10 issues a warning signal, and the wafer cassette transfer operation between the overhead crane 40 and the wafer cassette loading stage 44 will not be performed. After the second detection device 30 detects that there are no foreign objects between the overhead crane 40 and the wafer cassette loading stage 44, the wafer cassette 42 can be transferred between the overhead crane 40 and the wafer cassette loading stage 44. During the transfer of the wafer cassette 42 between the overhead crane 40 and the wafer cassette loading stage 44, the second detection device 30 is also used to measure the distance between the wafer cassette 42 and the overhead crane 40.
[0046] The ranging detector can be an ultrasonic ranging sensor, a laser ranging sensor, or an infrared ranging sensor. An ultrasonic ranging sensor is a sensor developed using the properties of ultrasonic waves. It mainly consists of a piezoelectric crystal and can both emit and receive ultrasonic waves. When ultrasonic waves encounter impurities or interfaces, they produce significant reflections, forming echoes. When the second detection device 30 is an ultrasonic ranging sensor, it is fixedly connected to the overhead crane track 41, and the sound wave emission direction of the second detection device 30 is towards the wafer cassette loading stage 44. During the transfer of the wafer cassette 42 between the wafer cassette loading stage 44 and the overhead crane 40 (including the transfer of the wafer cassette 42 from the overhead crane 40 to the wafer loading stage 44 and the movement of the wafer cassette 42 from the wafer loading stage 44 to the overhead crane 40), the detection data of the second detection device 30 includes the distance between the wafer cassette 42 and the overhead crane 40.
[0047] The working principle of the laser rangefinder sensor is as follows: After the laser diode emits a laser pulse at the target, the laser light is reflected by the target and scattered in all directions. Some of the scattered light returns to the sensor receiver and is imaged onto the avalanche photodiode after being received by the optical system. The avalanche photodiode is an optical sensor with internal amplification function, so it can detect extremely weak light signals. By recording and processing the time elapsed from the emission of the laser pulse to its return and reception, the distance to the target can be determined. When the second detection device 30 is a laser rangefinder sensor, it is fixedly connected to the overhead crane track 41. The emission direction of the laser diode is towards the wafer cassette loading stage 44. When the wafer cassette 42 is transported between the wafer cassette loading stage 44 and the overhead crane 40, the detection data of the second detection device 30 includes the distance between the wafer cassette 42 and the overhead crane 40.
[0048] The infrared rangefinder sensor has a pair of infrared signal emitting and receiving diodes. It emits a beam of infrared light, which is reflected after hitting an object. The reflected light is received by the sensor, and the time difference between the emission and reception is processed by a CCD image processor. The distance to the object is then calculated after processing by the signal processor. When the second detection device 30 is a laser rangefinder sensor, it is fixedly connected to the overhead crane track 41. The infrared light emitted by the infrared rangefinder sensor is directed towards the wafer cassette loading stage 44. As the wafer cassette 42 is transported between the wafer cassette loading stage 44 and the overhead crane 40, the detection data from the second detection device 30 includes the distance between the wafer cassette 42 and the overhead crane 40.
[0049] In an optional embodiment, by measuring the distance between the wafer cassette 42 and the overhead crane 40, the conveying speed of the wafer cassette 42 and whether the wafer cassette 42 is tilted can be detected during the conveying of the wafer cassette 42 between the overhead crane 40 and the wafer cassette loading stage 44, so as to determine whether there is any abnormality in the conveying process of the wafer cassette 42. Specifically, the processing device 10 obtains the running speed trend graph and / or the sway balance trend graph of the wafer cassette 42 based on the detection data detected by the second detection device 30. The processing device 10 can be a central processing unit to process the information. When the second detection device 30 detects the wafer cassette 42, it measures the distance between the wafer cassette 42 and the overhead crane track 41. This data is transmitted to the processing device 10. By measuring the change in the distance between the two, the speed of the wafer cassette 42 can be calculated, and a speed trend graph of the wafer cassette 42 can be generated based on the detection data and historical detection data. It can also detect whether the wafer cassette 42 is tilted when it is being transported between the overhead crane 40 and the wafer cassette loading platform 44, thereby obtaining a swing balance trend graph. By comparing the current detection data with the speed trend graph and / or the swing balance trend graph, it can be determined whether there is any abnormal movement of the wafer cassette 42. At the same time, based on the data from the semiconductor device 43, it can be determined whether the abnormal movement of the wafer cassette 42 is caused by the semiconductor device 43 or by the overhead crane 40 itself.
[0050] In an optional embodiment, the processing device 10 includes a transmission module for transmitting the detection data detected by the second detection device 30 to the main system for storage. Uploading the detection data to the main system via the transmission module avoids data loss due to system failures, and ensures that the data is retained even if the device is replaced, facilitating subsequent research.
[0051] In another optional embodiment, the processing device 10 includes a statistics unit for counting the number of times the second detection device 30 is started and stopped, and for calculating the production capacity of the corresponding semiconductor device 43 for a specified time period based on the number of times the second detection device 30 is started and stopped. Since the second detection device 30 only operates when the semiconductor device 43 interacts with the wafer cassette 42, the number of times the second detection device 30 is turned on and off corresponds to the output of the semiconductor device 43. By specifying a time period, such as an hour, day, or month, the output of the semiconductor device 43 during this specified time period can be calculated by counting the number of times the second detection device 30 is turned on and off within this specified time period.
[0052] In an optional embodiment, the detection range of the second detection device 30 covers the area between the overhead crane 40 and all the wafer cassette loading stages 44 on the semiconductor equipment 43, thus reducing the likelihood of under-detection or false detection.
[0053] like Figure 5 As shown, this application also provides a method for monitoring overhead crane 40. The method for monitoring overhead crane 40 can be executed based on the overhead crane monitoring system described in the above embodiments. The specific structure of the overhead crane monitoring system can be found in the above embodiments and will not be repeated here. It includes the following steps:
[0054] Step S10: Based on the position of the crane 40 detected by the first detection device 20, a first detection signal is issued when the crane 40 is above the wafer cassette loading stage 44 of the semiconductor equipment 43, and a second detection signal is issued when the crane 40 leaves the wafer cassette loading stage 44.
[0055] Step S20: The processing device 10 generates a start control signal when it receives the first detection signal, and generates a stop control signal when it receives the second detection signal;
[0056] Step S30: After receiving the start control signal, the second detection device 30 starts to detect whether there are foreign objects between the overhead crane 40 and the wafer cassette loading stage 44, and stops the detection after receiving the stop control signal.
[0057] In an optional embodiment, for step S10, specifically, the overhead crane 40 moves along the overhead crane track 41; the first detection device 20 can be a light detector, including a light emitting device 201 and a light receiving device 202, located on the upper and lower sides of the overhead crane track 41. The light emitting device 201 emits detection light, and the light receiving device 202 is located in the optical path of the detection light emitted by the light emitting device 201. In an optional example, the optical path direction of the detection light is perpendicular to the movement direction of the overhead crane 40. The light emitting device 201 and the light receiving device 202 of the first detection device 20 are fixedly connected to the overhead crane track 41. The overhead crane 40 passes between the light emitting device 201 and the light receiving device 202. When the overhead crane 40 is located between the light emitting device 201 and the light receiving device 202, the light receiving device 202 cannot receive the light emitted by the light detector, thereby generating a first detection signal. When the light receiving device 202 can receive the detection light emitted by the light emitting device 201, the first detection device 20 generates a second detection signal.
[0058] In an optional embodiment, for step S20, the first detection device 20 is electrically connected to the processing device 10. When the processing device 10 receives the first detection signal, it generates a start control signal and when it receives the second detection signal, it generates a stop control signal. The processing device 10 can be a central processing unit to process the information.
[0059] In an optional embodiment, after continuously receiving the first detection signal for a preset time, the processing device 10 generates a start control signal and sends it to the second detection device 30. The start control signal can be set to be generated and sent after a certain delay compared to receiving the first detection signal, such as 1 to 2 seconds. If the overhead crane 40 leaves the semiconductor device 43 within 1 to 2 seconds and the processing device 10 does not continuously receive the first detection signal for the preset time, then the processing device 10 will not generate and send the start control signal, that is, the second detection device 30 will not receive the start control signal. This greatly reduces the possibility of the second detection device 30 being accidentally activated because the overhead crane 40 passes over the semiconductor device 43. When the overhead crane 40 simply passes over the semiconductor device 43, it will not affect the observation and filming of the staff.
[0060] In an optional embodiment, for step S30, the second detection device 30 is a distance measuring detector. The distance measuring detector is used to detect the distance between the overhead crane 40 and the wafer cassette loading stage 44, and transmits the detected data to the processing device 10. The processing device 10 determines whether there is a foreign object between the overhead crane 40 and the wafer cassette loading stage 44 based on the detection data. When there is a foreign object between the overhead crane 40 and the wafer cassette loading stage 44, the processing device 10 issues a warning signal.
[0061] The ranging detector can be an ultrasonic ranging sensor, a laser ranging sensor, or an infrared ranging sensor. An ultrasonic ranging sensor is a sensor developed using the properties of ultrasound, mainly composed of a piezoelectric crystal. It can both emit and receive ultrasonic waves; when the ultrasonic waves encounter impurities or interfaces, they will produce significant reflections, forming echoes. When the second detection device 30 is an ultrasonic ranging sensor, it is fixedly connected to the overhead crane track 41, and the sound wave emission direction of the second detection device 30 is towards the wafer cassette loading stage 44. When the wafer cassette 42 is transported between the wafer cassette loading stage 44 and the overhead crane 40, the detection data from the second detection device 30 includes the distance between the wafer cassette 42 and the overhead crane 40.
[0062] The working principle of the laser rangefinder sensor is as follows: After the laser diode emits a laser pulse at the target, the laser light is reflected by the target and scattered in all directions. Some of the scattered light returns to the sensor receiver and is imaged onto the avalanche photodiode after being received by the optical system. The avalanche photodiode is an optical sensor with internal amplification function, so it can detect extremely weak light signals. By recording and processing the time elapsed from the emission of the laser pulse to its return and reception, the distance to the target can be determined. When the second detection device 30 is a laser rangefinder sensor, it is fixedly connected to the overhead crane track 41. The emission direction of the laser diode is towards the wafer cassette loading stage 44. When the wafer cassette 42 is transported between the wafer cassette loading stage 44 and the overhead crane 40, the detection data of the second detection device 30 includes the distance between the wafer cassette 42 and the overhead crane 40.
[0063] The infrared rangefinder sensor has a pair of infrared signal emitting and receiving diodes. It emits a beam of infrared light, which is reflected after hitting an object. The reflected light is received by the sensor, and the time difference between the emission and reception is processed by a CCD image processor. The distance to the object is then calculated after processing by the signal processor. When the second detection device 30 is a laser rangefinder sensor, it is fixedly connected to the overhead crane track 41. The infrared light emitted by the infrared rangefinder sensor is directed towards the wafer cassette loading stage 44. As the wafer cassette 42 is transported between the wafer cassette loading stage 44 and the overhead crane 40, the detection data from the second detection device 30 includes the distance between the wafer cassette 42 and the overhead crane 40.
[0064] In an optional embodiment, the detection range of the second detection device 30 covers the area between the overhead crane 40 and all the wafer cassette loading stages 44 on the semiconductor equipment 43, thus reducing the likelihood of under-detection or false detection.
[0065] like Figure 6 As shown, in an optional embodiment, step S30 is followed by:
[0066] Step S40: After the second detection device 30 detects that there are no foreign objects between the overhead crane 40 and the wafer cassette loading stage 44, the wafer cassette 42 can be transported between the overhead crane 40 and the wafer cassette loading stage 44; and the second detection device 30 also detects the transport speed of the wafer cassette 42 and whether the wafer cassette is tilted when the wafer cassette 42 is transported between the overhead crane 40 and the wafer cassette loading stage 44, so as to determine whether there is any abnormality in the transport process of the wafer cassette 42.
[0067] Specifically, the second detection device 30 is electrically connected to the processing device 10 and transmits the detected data to the processing device 10. After the second detection device 30 detects that there are no foreign objects between the overhead crane 40 and the wafer cassette loading stage 44, the wafer cassette 42 can be transferred between the overhead crane 40 and the wafer cassette loading stage 44. During the transfer of the wafer cassette 42 between the overhead crane 40 and the wafer cassette loading stage 44, the second detection device 30 can measure the distance between the wafer cassette 42 and the overhead crane 40 in real time.
[0068] The second detection device 30 is also used to detect the conveying speed of the wafer cassette 42 and whether the wafer cassette 42 is tilted during the transfer between the overhead crane 40 and the wafer cassette loading stage 44, in order to determine whether there is any abnormality during the transfer of the wafer cassette 42. The processing device 10 obtains a trend graph of the operating speed of the wafer cassette 42 and / or a trend graph of its sway balance based on the detection data detected by the second detection device 30. The processing device 10 can be a central processing unit to process the information. When the second detection device 30 detects the wafer cassette 42, it measures the distance between the wafer cassette 42 and the overhead crane track 41. This data is transmitted to the processing device 10. By measuring the change in the distance between the two, the speed of the wafer cassette 42 can be calculated, and a speed trend graph of the wafer cassette 42 can be generated based on the detection data and historical detection data. It can also detect whether the wafer cassette 42 is tilted when it is being transported between the overhead crane 40 and the wafer cassette loading platform 44, thereby obtaining a swing balance trend graph. By comparing the current detection data with the speed trend graph and / or the swing balance trend graph, it can be determined whether there is any abnormal movement of the wafer cassette 42. At the same time, based on the data from the semiconductor device 43, it can be determined whether the abnormal movement of the wafer cassette 42 is caused by the semiconductor device 43 or by the overhead crane 40 itself.
[0069] like Figure 6 As shown, in an optional embodiment, after step S40, the method further includes:
[0070] Step S50: Transmit the detection data detected by the second detection device 30 to the main system for storage;
[0071] Step S60: Count the number of times the second detection device 30 is started and stopped, and calculate the production capacity of the semiconductor device 43 based on the number of times the second detection device 30 is started and stopped.
[0072] Specifically, in step S50, the processing device 10 includes a transmission module for transmitting the detection data detected by the second detection device 30 to the main system for storage. Uploading the detection data to the main system via the transmission module avoids data loss due to system failures, and ensures that the data is retained even if the equipment is replaced, facilitating subsequent research.
[0073] For step S60, specifically, the processing device 10 includes a statistics unit, which is used to count the number of times the second detection device 30 is started and stopped, and to count the production capacity of the corresponding semiconductor device 43 for a specified time period based on the number of times the second detection device 30 is started and stopped. Since the second detection device 30 only works when the semiconductor device 43 interacts with the wafer cassette 42, the number of times the second detection device 30 is turned on and off corresponds to the output of the semiconductor device 43. By specifying a time period, such as an hour, day, or month, the output of the semiconductor device 43 during this specified time period can be counted by counting the number of times the second detection device 30 is turned on and off during this specified time period.
[0074] In this application, when the overhead crane 40 arrives directly above the wafer cassette loading platform 44, preparing to lower the wafer cassette 42 to the designated position, the first detection device 20 detects the overhead crane 40 and sends a first detection signal. Upon receiving the first detection signal, the processing device 10 outputs a start control signal to trigger the second detection device 30. Only then will the second detection device 30 activate and begin its detection work. Therefore, when the overhead crane 40 is not transporting the wafer cassette 42, the second detection device 30 will not perform any detection. At this time, whether the operator is observing or photographing the wafer, they will not be detected by the second detection device 30, facilitating observation and photography.
[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0076] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
Claims
1. A crane monitoring system, characterized in that, include: The first detection device is used to detect the position of the overhead crane. When the overhead crane is above the wafer cassette loading stage of the semiconductor equipment, it sends out a first detection signal, and when the overhead crane leaves the wafer cassette loading stage, it sends out a second detection signal. The processing device is electrically connected to the first detection device and is used to generate a start control signal when the first detection signal is received, and to generate a stop control signal when the second detection signal is received. The second detection device, electrically connected to the processing device, is used to detect whether there is a foreign object between the overhead crane and the wafer cassette loading stage after receiving the start control signal, and to stop the detection after receiving the stop control signal; the processing device generates the start control signal and sends it to the second detection device after continuously receiving the first detection signal for a preset time; after the second detection device detects that there is no foreign object between the overhead crane and the wafer cassette loading stage, the wafer cassette is transferred between the overhead crane and the wafer cassette loading stage; and the second detection device is also used to detect the transfer speed of the wafer cassette and whether the wafer cassette is tilted when the wafer cassette is transferred between the overhead crane and the wafer cassette loading stage, so as to determine whether there is any abnormality in the transfer process of the wafer cassette.
2. The overhead crane monitoring system according to claim 1, characterized in that, The overhead crane moves along the overhead crane track; the first detection device is a light sensor, including a light emitting device and a light receiving device, the light emitting device and the light receiving device are located on the upper and lower sides of the overhead crane track, and the light receiving device is located on the optical path of the detection light emitted by the light emitting device.
3. The overhead crane monitoring system according to claim 1, characterized in that, The second detection device is a ranging detector.
4. The overhead crane monitoring system according to claim 1, characterized in that, The processing device includes a transmission module for transmitting the detection data detected by the second detection device to the main system for storage.
5. The overhead crane monitoring system according to claim 1, characterized in that, The processing device includes a statistics unit, which is used to count the number of times the second detection device is started and stopped, and to count the semiconductor equipment capacity based on the number of times the second detection device is started and stopped.
6. The overhead crane monitoring system according to claim 1, characterized in that, The detection range of the second detection device covers the area between the overhead crane and all the wafer cassette loading stages on the semiconductor equipment.
7. A crane monitoring method, characterized in that, Includes the following steps: Based on the position of the overhead crane detected by the first detection device, a first detection signal is issued when the overhead crane is above the wafer cassette loading stage of the semiconductor equipment, and a second detection signal is issued when the overhead crane leaves the wafer cassette loading stage. The processing device generates a start control signal when it receives the first detection signal, and generates a stop control signal when it receives the second detection signal; Upon receiving the start control signal, the second detection device starts detecting whether there are foreign objects between the overhead crane and the wafer cassette loading stage, and stops detecting upon receiving the stop control signal; the processing device continuously receives the first detection signal for a preset time, generates the start control signal, and sends it to the second detection device. After receiving the start control signal, the second detection device starts detecting whether there are foreign objects between the overhead crane and the wafer cassette loading stage, and stops detecting after receiving the stop control signal. The second detection device also includes: After the second detection device detects that there are no foreign objects between the overhead crane and the wafer cassette loading platform, the wafer cassette is transferred between the overhead crane and the wafer cassette loading platform. The second detection device also detects the transfer speed of the wafer cassette and whether the wafer cassette is tilted when the wafer cassette is transferred between the overhead crane and the wafer cassette loading platform, so as to determine whether there is any abnormality in the transfer process of the wafer cassette.
8. The overhead crane monitoring method according to claim 7, characterized in that, After receiving the start control signal, the second detection device starts detecting whether there are foreign objects between the overhead crane and the wafer cassette loading stage, and stops detecting after receiving the stop control signal. The second detection device also includes: The detection data detected by the second detection device is transmitted to the main system for storage. The number of times the second detection device is started and stopped is counted, and the semiconductor equipment production capacity is calculated based on the number of times the second detection device is started and stopped.