Method for Displaying Chip Pin Connection Status, Computer Device, and Storage Medium

Abstract

The present invention provides a method for displaying the connection status of chip pin positions, including: generating a two-dimensional matrix with n rows and m columns according to the total number n of solder balls and the total number of pins m of the chip; detecting an input signal and the corresponding input position on the two-dimensional matrix; and performing corresponding display on the two-dimensional matrix according to the type of the input signal and the corresponding input position. The present invention also provides a computer device and a storage medium for implementing the method for displaying the connection status of chip pin positions. The present invention can display the connection relationship between the chip pins and the solder balls, facilitating the operator to quickly confirm the connection relationship between the pins and the solder balls and improving the operation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and particularly to a method for displaying the connection state of chip pins, a computer device, and a storage medium. Background Art

[0002] Generally, a chip may include hundreds or thousands of pins. Correspondingly, operators need to confirm the connection relationship between these hundreds or thousands of pins and solder balls. It can be seen that during the chip production process, operators need to spend a lot of time to complete the confirmation work of the connection relationship between pins and solder balls. Summary of the Invention

[0003] In view of the above, it is necessary to provide a method for displaying the connection state of chip pins, a computer device, and a storage medium, which can display the connection relationship between chip pins and solder balls, facilitate operators to quickly confirm the connection relationship between pins and solder balls, and improve work efficiency.

[0004] The method for displaying the connection state of chip pins includes: generating a two-dimensional matrix with n rows and m columns according to the total number n of solder balls and the total number m of pins of the chip; detecting an input signal and the input position corresponding to the input signal from the two-dimensional matrix; and performing corresponding display on the two-dimensional matrix according to the type of the input signal and the input position corresponding to the input signal.

[0005] The computer-readable storage medium stores at least one instruction, and when the at least one instruction is executed by a processor, the method for displaying the connection state of chip pins is implemented.

[0006] The computer device includes a memory and at least one processor. At least one instruction is stored in the memory, and when the at least one instruction is executed by the at least one processor, the method for displaying the connection state of chip pins is implemented.

[0007] Compared with the prior art, the method for displaying the connection state of chip pins, the computer device, and the storage medium can display the connection relationship between chip pins and solder balls, facilitate operators to quickly confirm the connection relationship between pins and solder balls, and improve work efficiency. Brief Description of the Drawings

[0008] Figure 1 is the architecture diagram of the computer device of the preferred embodiment of the present invention.

[0009] Figure 2 is the functional module diagram of the chip pin connection state display system of the preferred embodiment of the present invention.

[0010] Figure 3 is the flowchart of the method for displaying the connection state of chip pins of the preferred embodiment of the present invention.

[0011] Figure 4 Generate a two-dimensional matrix as an example.

[0012] Figure 5A and Figure 5B Generate multiple two-dimensional matrices as an example.

[0013] Figure 6 Illustrate the keyword input interface as an example.

[0014] Figure 7 Illustrate the target icon as an example.

[0015] Description of main component symbols

[0016]

[0017]

[0018] The following specific implementation manners will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific implementation manners

[0019] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be described in detail below in conjunction with the drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0020] Many specific details are set forth in the following description in order to provide a thorough understanding of the present invention. The described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

[0022] Refer to Figure 1 As shown, it is the architecture diagram of the computer device provided by the preferred embodiment of the present invention.

[0023] In this embodiment, the computer device 3 includes a memory 31 and at least one processor 32 that are electrically connected to each other.

[0024] Those skilled in the art should understand that Figure 1 The structure of the computer device 3 shown does not constitute a limitation of the embodiments of the present invention. The computer device 3 may further include more than Figure 1More or less other hardware or software, or different component arrangements.

[0025] It should be noted that the computer device 3 is only an example. Other existing or future computer devices that can be adapted to the present invention should also be included within the protection scope of the present invention and are hereby incorporated by reference.

[0026] In some embodiments, the memory 31 can be used to store program codes of computer programs and various data. For example, the memory 31 can be used to store the chip pin connection status display system 30 installed in the computer device 3, and can achieve high-speed and automatic access to programs or data during the operation of the computer device 3. The memory 31 can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), a one-time programmable read-only memory (OTPROM), an electrically-erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM), or other optical disc memories, magnetic disc memories, tape memories, or any other non-volatile computer-readable storage medium that can be used to carry or store data.

[0027] In some embodiments, the at least one processor 32 can be composed of integrated circuits. For example, it can be composed of a single packaged integrated circuit, or can be composed of multiple integrated circuits with the same or different functions, including a combination of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips. The at least one processor 32 is the control core of the computer device 3, connects various components of the entire computer device 3 through various interfaces and circuits, and executes programs, modules, or instructions stored in the memory 31, as well as calls data stored in the memory 31 to perform various functions of the computer device 3 and process data. For example, the function of displaying the chip pin connection status (specific details are described later in the introduction of Figure 3 ).

[0028] In this embodiment, the chip pin connection status display system 30 may include one or more modules, which are stored in the memory 31 and executed by at least one or more processors (processor 32 in this embodiment) to implement the function of displaying the chip pin connection status (for specific details, refer to the following description of Figure 3 ).

[0029] In this embodiment, according to the functions it performs, the chip pin connection status display system 30 can be divided into multiple modules. Refer to Figure 2 As shown, the multiple modules include an execution module 301 and a detection module 302. The modules referred to in the present invention refer to a series of computer-readable instruction segments that can be executed by at least one processor (such as processor 32) and can complete fixed functions, and are stored in a memory (such as the memory 31 of the computer device 3). In this embodiment, the functions of each module will be described in detail later in combination with Figure 3 .

[0030] In this embodiment, the integrated unit implemented in the form of a software function module can be stored in a non-volatile readable storage medium. The above software function module includes one or more computer-readable instructions, and the computer device 3 or a processor executes the one or more computer-readable instructions to implement part of the methods of the various embodiments of the present invention, such as Figure 3 the method of displaying the chip pin connection status as shown.

[0031] In a further embodiment, in combination with Figure 2 , the at least one processor 32 can execute various application programs (such as the chip pin connection status display system 30) and program codes installed in the computer device 3.

[0032] In a further embodiment, the memory 31 stores program codes of a computer program, and the at least one processor 32 can call the program codes stored in the memory 31 to execute related functions. For example, Figure 2 the various modules of the chip pin connection status display system 30 described in Figure 3 are program codes stored in the memory 31 and executed by the at least one processor 32, so as to implement the functions of the various modules to achieve the purpose of displaying the chip pin connection status (for details, refer to the description of

[0033] In one embodiment of the present invention, the memory 31 stores one or more computer-readable instructions, and the one or more computer-readable instructions are executed by the at least one processor 32 to achieve the purpose of displaying the connection state of the chip pins. Specifically, the specific implementation method of the at least one processor 32 for the above computer-readable instructions is described in detail in the following text for Figure 3 description.

[0034] Figure 3 is a flowchart of a method for displaying the connection state of chip pins provided by a preferred embodiment of the present invention.

[0035] In this embodiment, the method for displaying the connection state of chip pins can be applied to the computer device 3. For a computer device 3 that needs to display the connection state of chip pins, the function for displaying the connection state of chip pins provided by the method of the present invention can be directly integrated on the computer device 3, or run on the computer device 3 in the form of a Software Development Kit (SDK).

[0036] As Figure 3 shown, the method for displaying the connection state of chip pins specifically includes the following steps. According to different requirements, the order of the steps in this flowchart can be changed, and some steps can be omitted.

[0037] Step S1: The execution module 301 generates a two-dimensional matrix with n rows and m columns according to the total number n of solder balls and the total number m of pins of the chip.

[0038] The n solder balls are used to connect to the m pins of the chip. The n and m are positive integers.

[0039] In one embodiment, before generating the two-dimensional matrix, the execution module 301 first determines the sizes of n and m.

[0040] In one embodiment, the execution module 301 can obtain the total number n of solder balls and the names corresponding to the n solder balls respectively in response to user input. That is, the execution module 301 determines the value of n and the names corresponding to the n solder balls respectively according to user input.

[0041] In other embodiments, the execution module 301 can read a specified document, obtain the total number n of solder balls from the specified document, and the names corresponding to the n solder balls respectively. The specified document can be a TXT document that records the names corresponding to the n solder balls.

[0042] In one embodiment, the execution module 301 may obtain the total number m of pins of the chip and the names corresponding to the m pins respectively from an IBIS (Input / Output Buffer Information Specification) model. The IBIS model records all the pins of the chip and the name of each pin.

[0043] In one embodiment, when there are multiple IBIS models, the execution module 301 correspondingly generates multiple two-dimensional matrices, and each of the multiple two-dimensional matrices corresponds to one of the multiple IBIS models.

[0044] It should be noted that each of the multiple IBIS models corresponds to a chip, and the chips corresponding to the multiple IBIS models need to be integrated into the same package. For example, the chip corresponding to one of the multiple IBIS models is a WIFI chip, and the chip corresponding to another IBIS model is a Bluetooth chip. The pins of the chips corresponding to the multiple IBIS models respectively need to be connected to the n solder balls, and the number of pins of the chips corresponding to each of the multiple IBIS models is the same. Therefore, the number of rows included in each of the multiple two-dimensional matrices is equal, that is, the n value is the same; the number of columns included in each of the multiple two-dimensional matrices is equal, that is, the m value is the same.

[0045] In one embodiment, the execution module 301 may display the multiple two-dimensional matrices in pages, for example, display one two-dimensional matrix per page.

[0046] Step S2: The execution module 301 sets the names of the solder balls represented by the n rows of the two-dimensional matrix according to the names of the n solder balls, and sets the names of the pins represented by the m columns of the two-dimensional matrix according to the names of the m pins.

[0047] In one embodiment, the execution module 301 may randomly assign the names corresponding to the n solder balls to the n rows of the two-dimensional matrix, so that each row of the two-dimensional matrix corresponds to the name of one of the n solder balls.

[0048] In one embodiment, the execution module 301 may randomly assign the names corresponding to the m pins to the m columns of the two-dimensional matrix, so that each column of the two-dimensional matrix corresponds to the name of one of the m pins.

[0049] For example, refer to Figure 4As described above, the execution module 301 generates a two-dimensional matrix 4 with six rows and six columns. Each row of this two-dimensional matrix 4 corresponds to a solder ball name, and each column corresponds to a pin name. For example, the first row of this two-dimensional matrix 4 corresponds to the solder ball name "MEM_CLK", and the first column of this two-dimensional matrix 4 corresponds to the pin name "X_AP_MEM_CLK".

[0050] In other embodiments, when the execution module 301 generates multiple two-dimensional matrices, the solder ball names corresponding to each row of each two-dimensional matrix in the multiple two-dimensional matrices are the same, and the pin names corresponding to each column of each two-dimensional matrix are determined according to the pin names of the chip corresponding to each two-dimensional matrix.

[0051] In other embodiments, when the execution module 301 generates multiple two-dimensional matrices, the execution module 301 also sets the voltage value of the pin represented by each column for each two-dimensional matrix. It should be noted that the voltage value of the pin represented by each column can be obtained from the IBIS model, and this IBIS model records the voltage value of each pin of the chip.

[0052] For example, referring to Figure 5A and Figure 5B As shown, the solder ball names corresponding to each row of the two-dimensional matrix 5 generated by the execution module 301 are the same as those corresponding to each row of the two-dimensional matrix 6. The pin names corresponding to each column of the two-dimensional matrix 5 correspond to the pin names of the chip CHIP_1 corresponding to this two-dimensional matrix 5. The pin names corresponding to each column of the two-dimensional matrix 6 correspond to the pin names of the chip CHIP_2 corresponding to this two-dimensional matrix 6. In addition, the execution module 301 also sets the voltage value of the pin represented by each column of the two-dimensional matrix 5; and sets the voltage value of the pin represented by each column of the two-dimensional matrix 6. For example, referring to Figure 5A and Figure 5B As shown, the voltage value of the pin represented by the first column of the two-dimensional matrix 5 is set to 1.8 volts, and the voltage value of the pin represented by the first column of the two-dimensional matrix 6 is set to 1 volt.

[0053] Step S3: The detection module 302 detects the input signal and the input position corresponding to the input signal from the two-dimensional matrix.

[0054] Step S4: The execution module 301 performs corresponding display at the input position corresponding to the input position on the two-dimensional matrix according to the type of the input signal and the input position corresponding to the input signal.

[0055] In one embodiment, the types of the input signals include, but are not limited to, hover signals and click signals.

[0056] In one embodiment, when the input signal is a hover signal, performing corresponding display at the input position corresponding to the input signal type and the input position on the two-dimensional matrix includes (a1)-(a3):

[0057] (a1) When the input position corresponding to the hover signal is on any row of the two-dimensional matrix, display the solder ball name corresponding to that row at the input position corresponding to the hover signal.

[0058] In one embodiment, the execution module 301 also marks that any row, for example, can enhance the brightness of that any row, such as performing a halo effect processing on that any row.

[0059] (a2) When the input position corresponding to the hover signal is on any column of the two-dimensional matrix, display the pin name corresponding to that column at the input position corresponding to the hover signal.

[0060] In one embodiment, the execution module 301 also marks that any column. For example, enhance the brightness of that any column, such as performing a halo effect processing on that any row.

[0061] (a3) When the input position corresponding to the hover signal is at the intersection of any row and any column of the two-dimensional matrix, display the solder ball name corresponding to that any row and the pin name corresponding to that any column at the input position corresponding to the hover signal.

[0062] In one embodiment, the execution module 301 also marks that any row and that any column.

[0063] For example, referring to Figure 4 As shown, when the input position corresponding to the hover signal is at the intersection position 42 of the two-dimensional matrix, the execution module 301 also enhances the brightness of the row and column corresponding to the intersection position 42.

[0064] In one embodiment, when the input signal is a click signal, performing corresponding display at the input position corresponding to the input signal type and the input position on the two-dimensional matrix further includes:

[0065] When the input position corresponding to the click signal is at the intersection of any row and any column of the two-dimensional matrix, display a preset icon at the input position corresponding to the click signal. The preset icon is used to indicate that the solder ball represented by that any row and the pin represented by that any column are in a connected state.

[0066] For example, referring to Figure 4As shown, the icon 41 in the two-dimensional matrix 4 represents that the solder ball "MEM_CLK" corresponding to the row where the icon 41 is located is in a connected state with the pin "X_AP_MEM_CLK" corresponding to the column where the icon 41 is located.

[0067] In one embodiment, the execution module 301 can also retrieve the solder ball names represented by the n rows of the two-dimensional matrix and the pin names represented by the m columns according to the set keywords; when the solder ball name represented by any one of the n rows matches the set keyword, the brightness of each of the other rows in the n rows except this any one row is reduced (for example, the other rows are displayed in gray); and when the pin name represented by any one of the m columns matches the set keyword, the brightness of each of the other columns in the m columns except this any one column is reduced (for example, the other columns are displayed in gray).

[0068] In one embodiment, that the solder ball name represented by any one of the n rows matches the set keyword may mean that the solder ball name represented by any one of the n rows includes the set keyword. That the pin name represented by any one of the m columns matches the set keyword means that the pin name represented by any one of the m columns includes the set keyword.

[0069] In one embodiment, the execution module 301 can provide an input interface for the operator to input the keyword. The execution module 301 can display the input interface in response to the user's input. For example, the execution module 301 can display the input interface when the operator clicks a preset button.

[0070] For example, referring to Figure 6 As shown, the execution module 301 provides the input interface 51 for the user to input the keyword.

[0071] In the input interface 51, when a keyword is input in the field corresponding to "Chip / Ball", the execution module 301 retrieves the pin names represented by the m columns of the two-dimensional matrix displayed on each page, searches for the pin names that contain the input keyword therefrom, and retrieves the solder ball names represented by the n rows of the two-dimensional matrix displayed on each page, searches for the solder ball names that contain the input keyword therefrom.

[0072] When a keyword is input in the field corresponding to "All Chips", the execution module 301 retrieves the pin names represented by the m columns of the two-dimensional matrix displayed on each page, searches for the pin names that contain the input keyword therefrom.

[0073] When a keyword is entered in the field corresponding to "Selected Chip", the execution module 301 retrieves the pin names represented by the m columns of the two-dimensional matrix displayed on the current page, and searches for the pin names that contain the entered keyword among them.

[0074] When a keyword is entered in the field corresponding to "Ball", the execution module 301 retrieves the ball names represented by the n rows of the two-dimensional matrix displayed on the current page, and searches for the ball names that contain the entered keyword among them. In one embodiment, the execution module 301 can also detect whether the pins and balls of the chip are correctly connected according to the preset icons included in the two-dimensional matrix; and when it is detected that the connection between the pins and balls of the chip is incorrect, perform corresponding prompts.

[0075] In one embodiment, the detecting whether the pins and balls of the chip are correctly connected; and when it is detected that the connection between the pins and balls of the chip is incorrect, performing corresponding prompts includes:

[0076] Detecting whether each row in the two-dimensional matrix includes the preset icon; and detecting whether each column in the two-dimensional matrix includes the preset icon; when any row does not include the preset icon, marking that any row to achieve the purpose of prompting; and when any column does not include the preset icon, marking that any column to achieve the purpose of prompting.

[0077] It should be noted that since each ball must be connected to at least one pin, and each pin must be connected to at least one ball, therefore, when any row does not include the preset icon, it means that the ball corresponding to that any row has not been connected to any pin. When any column does not include the preset icon, it means that the pin corresponding to that any column has not been connected to any ball.

[0078] In one embodiment, the marking of any row may refer to enhancing the brightness of that any row. For example, a halo effect can be applied to that any row. The marking of any column may refer to enhancing the brightness of that any column. For example, a halo effect can be applied to that any column.

[0079] In one embodiment, the detecting whether the pins and balls of the chip are correctly connected; and when it is detected that the connection between the pins and balls of the chip is incorrect, performing corresponding prompts further includes:

[0080] Obtain the solder ball name and pin name corresponding to each of the preset icons in the two-dimensional matrix; determine whether the solder ball name corresponding to any one of the preset icons is consistent with the preset solder ball name, and determine whether the pin name corresponding to any one of the preset icons is consistent with the preset pin name; when the solder ball name corresponding to any one of the preset icons is consistent with the preset solder ball name, and the pin name corresponding to any one of the preset icons is consistent with the preset pin name, determine that the connection between the solder ball and the pin corresponding to any one of the preset icons is correct; when the solder ball name corresponding to any one of the preset icons is inconsistent with the preset solder ball name, and / or the pin name corresponding to any one of the preset icons is inconsistent with the preset pin name, determine that the connection between the solder ball and the pin corresponding to any one of the preset icons is incorrect, and when it is determined that the connection between the solder ball and the pin corresponding to any one of the preset icons is incorrect, mark the row and column corresponding to any one of the preset icons, so as to achieve the purpose of making a prompt.

[0081] In one embodiment, marking the row and column corresponding to any one of the preset icons, such as enhancing the brightness of the row and column corresponding to any one of the preset icons.

[0082] It should be noted that the solder ball corresponding to any one of the preset icons is also the solder ball represented by the row corresponding to any one of the preset icons, and the pin corresponding to any one of the preset icons is also the pin represented by the column corresponding to any one of the preset icons.

[0083] In one embodiment, detecting whether the connection between the pins and solder balls of the chip is correct; and when it is detected that the connection between the pins and solder balls of the chip is incorrect, the corresponding prompt further includes:

[0084] Determine whether there is a target icon among all the preset icons included in the two-dimensional matrix, where the row where the target icon is located corresponds to the solder ball representing the power supply positive VDD, and the column where the target icon is located corresponds to the pin representing the power supply negative GND;

[0085] When the target icon exists in the two-dimensional matrix, mark the row and column where the target icon is located, so as to achieve the purpose of making a prompt.

[0086] It should be noted that this is to detect whether there is a short circuit connection between VDD and GND.

[0087] For example, Figure 7 The preset icon 71 of the two-dimensional matrix 7 shown is the target icon.

[0088] In one embodiment, the execution module 301 may also derive relevant information of the chip from the two-dimensional matrix, for example, export the relevant information of the chip to a specified file such as an excel file. The relevant information includes, but is not limited to, the name of the solder ball connected to each pin, the total number of solder balls connected to each pin, the name of the pin connected to each solder ball, the total number of pins connected to each solder ball, etc.

[0089] It should be noted that the execution module 301 may export the relevant information of the chip according to the requirements of the manufacturer of the packaged chip.

[0090] It should be noted that the chip pin connection status display method provided by the present invention is applicable to packaging fields such as 2.5D / 3D IC, fan out wafer level package, system in package, etc.

[0091] In several embodiments provided by the present invention, it should be understood that the disclosed device and method can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation.

[0092] The modules described as separate components may or may not be physically separated. The components shown as modules may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0093] In addition, in each embodiment of the present invention, the functional modules can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above integrated unit can be implemented in the form of hardware, or in the form of hardware plus software functional modules.

[0094] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed within the present invention. Any reference signs in the claims should not be construed as limiting the claims concerned. In addition, it is obvious that the word "comprising" does not exclude other elements or units, and the singular does not exclude the plural. The multiple elements or units stated in the apparatus claims can also be implemented by one element or unit through software or hardware. The words such as "first" and "second" are used to denote names and do not represent any particular order.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for displaying the connection status of chip pins, characterized in that, the method includes: Obtaining the total number n of solder balls and the names respectively corresponding to the n solder balls from a specified document, obtaining the total number m of pins of the chip from the Input / Output Buffer Information Specification (IBIS) model, and the names respectively corresponding to the m pins; Generating a two-dimensional matrix with n rows and m columns according to the total number n of solder balls and the total number m of pins of the chip; Setting the solder ball names respectively represented by the n rows of the two-dimensional matrix according to the names of the n solder balls, and setting the pin names respectively represented by the m columns of the two-dimensional matrix according to the names of the m pins; Detecting an input signal and the input position corresponding to the input signal on the two-dimensional matrix; and Performing corresponding display on the two-dimensional matrix according to the type of the input signal and the input position corresponding to the input signal.

2. The method for displaying the connection status of chip pins according to claim 1, characterized in that, after generating the two-dimensional matrix, the method further includes: Setting the solder ball names respectively represented by the n rows of the two-dimensional matrix according to the names of the n solder balls, and setting the pin names respectively represented by the m columns of the two-dimensional matrix according to the names of the m pins.

3. The method for displaying the connection status of chip pins according to claim 2, characterized in that, the types of the input signal include a hover signal and a click signal.

4. The method for displaying the connection status of chip pins according to claim 3, characterized in that, the performing corresponding display on the two-dimensional matrix according to the type of the input signal and the input position corresponding to the input signal includes: When the input signal is a hover signal and the input position corresponding to the hover signal is on any row of the two-dimensional matrix, displaying the solder ball name corresponding to the any row at the input position corresponding to the hover signal; When the input signal is a hover signal and the input position corresponding to the hover signal is on any column of the two-dimensional matrix, displaying the pin name corresponding to the any column at the input position corresponding to the hover signal; and When the input signal is a hover signal and the input position corresponding to the hover signal is at the intersection position of any row and any column of the two-dimensional matrix, displaying the solder ball name corresponding to the any row and the pin name corresponding to the any column at the input position corresponding to the hover signal.

5. The method for displaying the connection status of chip pins according to claim 4, characterized in that, the method further includes: When the input signal is a hover signal and the input position corresponding to the hover signal is on any row of the two-dimensional matrix, marking the any row; When the input signal is a hover signal and the input position corresponding to the hover signal is on any column of the two-dimensional matrix, marking the any column; and When the input signal is a hover signal and the input position corresponding to the hover signal is at the intersection position of any row and any column of the two-dimensional matrix, marking the any row and the any column.

6. The method for displaying the connection status of chip pins as described in claim 3, characterized in that, the performing of corresponding display on the two-dimensional matrix according to the type of the input signal and the input position corresponding to the input signal includes: when the input signal is a click signal, and the input position corresponding to the click signal is at the intersection of any row and any column of the two-dimensional matrix, a preset icon is displayed at the input position corresponding to the click signal, and the preset icon is used to indicate that the solder ball represented by the any row is in a connected state with the pin represented by the any column.

7. The method for displaying the connection status of chip pins as described in claim 6, characterized in that, the method further includes: detecting whether the pins and solder balls of the chip are correctly connected according to the preset icons included in the two-dimensional matrix; and when it is detected that the connection between the pins and solder balls of the chip is incorrect, performing corresponding prompts.

8. The method for displaying the connection status of chip pins as described in claim 2, characterized in that, the method further includes: retrieving the solder ball names represented by the n rows and the pin names represented by the m columns of the two-dimensional matrix according to the set keywords; when the solder ball name represented by any row in the n rows matches the set keyword, reducing the brightness of each of the other rows in the n rows except the any row; and when the pin name represented by any column in the m columns matches the set keyword, reducing the brightness of each of the other columns in the m columns except the any column.

9. A computer-readable storage medium, characterized in that, the computer-readable storage medium stores at least one instruction, and when the at least one instruction is executed by a processor, the method for displaying the connection status of chip pins as described in any one of claims 1 to 8 is implemented.

10. A computer device, characterized in that, the computer device includes a memory and at least one processor, and a plurality of modules are stored in the memory, and when the plurality of modules are executed by the at least one processor, the method for displaying the connection status of chip pins as described in any one of claims 1 to 8 is implemented.

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