Chip packaging structure and manufacturing method thereof

Abstract

The present invention discloses a chip packaging structure and a manufacturing method thereof. The chip packaging structure comprises a PCB board; a chip, the chip is arranged on a first side of the PCB board and is electrically connected to the PCB board; a packaging layer, the packaging layer is arranged on the first side of the PCB board, a pipeline is arranged in the packaging layer, the pipeline is filled with a cooling medium for phase change heat transfer, and the packaging layer covers the chip and the pipeline.

Description

Technical Field

[0001] The present invention belongs to the field of packaging technology, and in particular, the present invention relates to a chip packaging structure and a method for manufacturing the chip packaging structure. Background Art

[0002] Existing packaging structures usually use transmission packaging module heat dissipation technology, such as mounting heat sinks to achieve heat dissipation. However, most actual packaging applications do not allow or accept the installation of heat sinks due to reasons such as volume and height restrictions, so traditional heat dissipation methods have great limitations. Summary of the invention

[0003] An object of the present invention is to provide a chip packaging structure.

[0004] Another object of the present invention is to provide a method for manufacturing a chip packaging structure.

[0005] According to a first aspect of the present invention, a chip packaging structure is provided, comprising: a PCB board; a chip, wherein the chip is arranged on a first side of the PCB board and is electrically connected to the PCB board; a packaging layer, wherein the packaging layer is arranged on the first side of the PCB board, wherein a pipe is arranged in the packaging layer, wherein the pipe is filled with a cooling medium for phase change heat transfer, and wherein the packaging layer covers the chip and the pipe.

[0006] Optionally, the pipeline is a closed annular pipeline arranged around the chip.

[0007] Optionally, the pipeline includes: a steam circuit; a condensate circuit, the first end of the condensate circuit is connected to the first end of the steam circuit, the second end of the condensate circuit is connected to the second end of the steam circuit, and the condensate circuit and the steam circuit cooperate to form the annular pipeline; the packaging structure also includes: a driving member, the driving member is arranged on the pipeline, and the driving member can drive the cooling medium to circulate between the steam circuit and the condensate circuit.

[0008] Optionally, the chip packaging structure further includes: a heat extractor, which is disposed between the first end of the steam loop and the first end of the condensate loop, and receives heat to transform the cooling medium from liquid phase to gas phase.

[0009] Optionally, the chip packaging structure further includes: a condenser, which is disposed between the second end of the steam loop and the second end of the condensate loop, and the condenser can transform the cooling medium from a gas phase to a liquid phase.

[0010] Optionally, an average distance between the chip and the steam circuit is greater than an average distance between the chip and the condensate circuit.

[0011] Optionally, the chip is a flip chip.

[0012] Optionally, the chip packaging structure further includes: a redistribution layer, which is arranged on a side of the PCB board close to the chip and is electrically connected to the chip and the PCB board respectively.

[0013] Another aspect of the present invention provides a method for manufacturing a chip packaging structure, comprising the following steps: setting a PCB board; installing a chip electrically connected to the PCB board on a first side surface of the PCB board; setting a pipe on the first side surface of the PCB board, the pipe being filled with a cooling medium for phase change heat transfer; setting a packaging layer on the first side surface of the PCB board, the packaging layer covering the chip and the pipe.

[0014] Another aspect of the present invention provides a method for manufacturing a chip packaging structure, comprising the following steps: providing a carrier; providing a redistribution layer on a first side of the carrier; installing a chip electrically connected to the redistribution layer on the first side of the redistribution layer; providing a pipe on the first side of the redistribution layer, the pipe being filled with a cooling medium for phase change heat transfer; providing an encapsulation layer on the first side of the carrier, the encapsulation layer covering the chip and the pipe; removing the carrier; providing a solder ball electrically connected to the redistribution layer on the second side of the redistribution layer; and electrically connecting the solder ball to a PCB board.

[0015] One technical effect of the present invention is that the packaging structure of the present application is not only applicable to fan-out packaging with a high degree of integration, but also applicable to organic substrate packaging. That is, any structure with a packaging process can be used. After the pipeline is buried in the packaging layer, heat dissipation is achieved through the phase change material inside the pipeline. Compared with the prior art, the heat dissipation efficiency of the present application is higher, and since the pipeline is set in the packaging layer, the volume and height of the product will not be increased.

[0016] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0018] Figure 1 It is a schematic structural cross-sectional view corresponding to step 2' of the method for manufacturing the chip packaging structure provided by the present invention;

[0019] Figure 2 It is a schematic structural cross-sectional view corresponding to step 3' of the method for manufacturing the chip packaging structure provided by the present invention;

[0020] Figure 3 It is a schematic structural cross-sectional view corresponding to step 4' of the method for manufacturing the chip packaging structure provided by the present invention;

[0021] Figure 4 It is a schematic structural cross-sectional view corresponding to step 5' of the method for manufacturing the chip packaging structure provided by the present invention;

[0022] Figure 5 It is a schematic structural cross-sectional view corresponding to step 6' of the method for manufacturing the chip packaging structure provided by the present invention;

[0023] Figure 6 It is a schematic structural cross-sectional view corresponding to step 7' of the method for manufacturing the chip packaging structure provided by the present invention;

[0024] Figure 7 It is a schematic diagram of assembling a chip, a pipeline and a carrier of the chip packaging structure provided by the present invention.

[0025] Reference numerals

[0026] A chip packaging structure 100;

[0027] Chip 10;

[0028] Encapsulation layer 20;

[0029] Pipeline 30; steam circuit 31; condensate circuit 32;

[0030] Carrier 40 ; redistribution layer 50 ; fixing glue 60 ; solder balls 70 . DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0033] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0034] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] The chip packaging structure 100 according to the embodiment of the present application includes: a PCB board, a chip 10 and a packaging layer 20 .

[0037] Specifically, the chip 10 is arranged on the first side of the PCB board and is electrically connected to the PCB board. The packaging layer 20 is arranged on the first side of the PCB board. A pipe 30 is provided in the packaging layer 20. The pipe 30 is filled with a cooling medium for phase change heat transfer. The packaging layer 20 covers the chip 10 and the pipe 30.

[0038] In other words, the chip packaging structure 100 according to the embodiment of the present application is mainly composed of a PCB board, a chip 10 and a packaging layer 20. The chip 10 is provided on the first side of the PCB board, and the chip 10 is electrically connected to the PCB board. A pipe 30 and a packaging layer 20 are also provided on the first side of the PCB board. Optionally, the packaging layer 20 is epoxy resin (EMC).

[0039] The encapsulation layer 20 can cover the pipe 30 and the chip 10. When laying the pipe 30, the extension direction of the pipe 30 can be made consistent with the extension direction of the encapsulation layer 20, that is, the pipe 30 is laid flat in the encapsulation layer 20, and the pipe 30 is completely buried in the encapsulation layer 20. In other words, the present application uses an embedded method, which will not increase the size of the encapsulation structure. Compared with the external heat dissipation solution of the prior art, the present application can achieve no increase in volume and better heat dissipation effect.

[0040] In addition, the pipe 30 is filled with a cooling medium, which can undergo a phase change and absorb and release heat during the phase change. For example, the conversion of gas to liquid is an exothermic process, and the conversion of liquid to gas is an endothermic process. The heat of components such as the chip 10 can be transferred to the cooling medium in the pipe 30 via the packaging layer 20, and heat exchange occurs with the cooling medium. When the temperature of the pipe 30 drops, the temperature of the packaging layer 20 near the pipe 30 can also be reduced, thereby reducing the temperature of the chip 10 installed in the packaging layer 20. In other words, the heat emitted by components such as the chip 10 is absorbed through the phase change process of the cooling medium.

[0041] For example, when the chip packaging structure 100 is arranged in the up-down direction, the chip 10 can be arranged above the PCB board. A pipe 30 is also arranged above the PCB board, and a cooling medium is filled inside the pipe 30. A packaging layer 20 is also arranged above the PCB board, and the pipe 30 and the chip 10 can be covered by the packaging layer 20. When the chip 10 and other components emit heat, the heat can be transferred to the pipe 30 through the packaging layer 20, and heat exchange occurs with the cooling medium inside the pipe 30. Since the cooling medium can undergo phase change heat, for example, when heat is exchanged with the heat emitted by the component, the cooling medium changes from liquid to gas, and absorbs heat in the process of changing from liquid to gas. The gaseous state can be converted into a liquid state after being cooled, and continue to participate in heat exchange. In other words, the present application uses the technology of gas-liquid interaction, and the heat dissipation effect is better.

[0042] In this embodiment, it is not only applicable to fan-out packaging with a high degree of integration, but also applicable to organic substrate packaging. That is, any structure with a packaging process can be used. After the pipe 30 is buried in the packaging layer 20, heat dissipation is achieved through the phase change material inside the pipe 30. Compared with the prior art, the heat dissipation efficiency of the present application is higher, and since the pipe 30 is set in the packaging layer 20, the volume and height of the product will not be increased.

[0043] According to one embodiment of the present application, Figure 7 As shown, the pipeline 30 is a closed annular pipeline 30 arranged around the chip 10. By adopting an annular heat dissipation structure, it can be more in contact with the packaging layer 20, such as contact with epoxy resin, to achieve a larger contact area, which is more conducive to heat dissipation.

[0044] In some specific embodiments of the present application, Figure 3 and Figure 7 As shown, the pipeline 30 includes: a steam loop 31 and a condensate loop 32. The first end of the condensate loop 32 is connected to the first end of the steam loop 31, and the second end of the condensate loop 32 is connected to the second end of the steam loop 31. The condensate loop 32 and the steam loop 31 cooperate to form an annular pipeline 30. When the number of chips 10 is single, in order to facilitate processing, the chip 10 can be set at the center of the annular pipeline 30. The center position here can be a geometric center or a center of gravity position, which is not limited here.

[0045] Optionally, the packaging structure 100 further includes: a driving member, which is arranged in the pipeline 30 and can drive the cooling medium to circulate between the steam circuit 31 and the condensate circuit 32. By providing the driving member, it is beneficial to carry out gas-liquid alternating circulation in the pipeline 30, realize the rapid transfer of heat energy inside the package, and solve the purpose of rapid heat dissipation inside the module. Optionally, the driving member is an electronically controlled pump unit, which has the advantage of a wide range of sources.

[0046] In some specific embodiments of the present application, the chip packaging structure 100 also includes a heat extractor, which is arranged between the first end of the steam loop 31 and the first end of the condensate loop 32, and the heat extractor receives heat to transform the cooling medium from the liquid phase to the gas phase. By providing the heat extractor, it is helpful to shorten the time required for the liquid phase to transform into the gas phase. In addition, when the packaging layer 20 is made of epoxy resin and the packaging layer 20 extends in the horizontal direction, the heat is easier to diffuse in the horizontal direction. In other words, the heat is not easy to diffuse in the vertical direction in the packaging layer 20, but is easier to diffuse in the horizontal direction.

[0047] Optionally, the chip packaging structure 100 further includes a micro-fin group, which is located between the first end of the steam loop 31 and the first end of the condensate loop 32, and can further increase the contact area and further shorten the time required for the liquid phase to transform into the gas phase.

[0048] According to an embodiment of the present application, the chip packaging structure 100 further includes: a condenser, which is disposed between the second end of the steam loop 31 and the second end of the condensate loop 32, and the condenser can transform the cooling medium from a gas phase to a liquid phase. The condenser is provided to help shorten the time required for the gas phase to transform into a liquid phase. In order to further reduce the volume of the packaging structure, a micro condenser can be selected for the condenser.

[0049] Optionally, the chip packaging structure 100 further includes a fin group, which is located between the second end of the steam loop 31 and the second end of the condensate loop 32, and can further increase the contact area and further shorten the time required for the gas phase to transform into the liquid phase.

[0050] Optionally, a heat dissipation structure is embedded in the epoxy resin, and the heat dissipation structure is mainly composed of five micro components: an electronic control unit, a heat extractor (such as a heat extractor), a condenser (such as a condenser), a steam circuit 31, and a liquid circuit. By adopting the above composition, gas-liquid alternating circulation can be achieved, thereby achieving rapid transfer of heat energy inside the package and solving the purpose of rapid heat dissipation inside the module.

[0051] In some specific embodiments of the present application, the average distance between the chip 10 and the steam loop 31 is greater than the average distance between the chip 10 and the condensate loop 32. That is, compared with the steam loop 31, the chip 10 is closer to the condensate loop 32, which is conducive to improving the heat exchange rate.

[0052] According to one embodiment of the present application, Figure 2As shown, the chip 10 is a flip chip 10. The flip chip 10 has no binding wires, but is instead directly packaged by precipitating tin. Compared with the wire-bonded chip 10, the use of the flip chip 10 includes but is not limited to the following advantages: it has excellent electrical and thermal properties; the number of I / Os can be very high in the case of a medium solder ball 70 spacing; it is not limited by the size of the pad; it can be suitable for mass production; and the size and weight can be greatly reduced. In addition, the packaging form of the flip chip 10 is generally used in the packaging of chips 10 that have high requirements on the volume of the chip 10, such as the chip 10 in mobile phones and tablets. In other words, the chip packaging structure 100 of the present application has a wide range of applications and can be applied to mobile phones, tablets, etc.

[0053] In some specific embodiments of the present application, Figure 2 As shown, the chip package structure 100 further includes a redistribution layer 50, which is disposed on a side of the PCB board close to the chip 10 and is electrically connected to the chip 10 and the PCB board respectively. The redistribution layer 50 is provided to facilitate the design of a fan-out package.

[0054] The present application also discloses a method for manufacturing a chip packaging structure 100, comprising the following steps:

[0055] Step 1: Set up the PCB board.

[0056] Step 2: Install the chip 10 electrically connected to the first side of the PCB board.

[0057] Step 3, a pipe 30 is arranged on the first side of the PCB board, and the pipe 30 is filled with a cooling medium for phase change heat. The cooling medium can change between different phases to achieve heat release and heat absorption. For example, the change from liquid phase to gas phase is an endothermic process, and the change from gas phase to liquid phase is an exothermic process. In addition, a pipe 30 is arranged above the PCB board, and the pipe 30 can be pre-filled with a cooling medium. Optionally, the pipe 30 is spaced apart from the chip 10. Further, the pipe 30 is an annular closed pipe 30, and is arranged around the chip 10, which can achieve rapid heat dissipation for power components such as the chip 10.

[0058] Step 4: a packaging layer 20 is disposed on the first side of the PCB board, wherein the packaging layer 20 covers the chip 10 and the pipe 30 .

[0059] It should be noted that in this embodiment, it can be used to realize conventional organic substrate packaging. The steps of the manufacturing method of the present application are not limited to the above-mentioned order, and the latter order can be performed first, and then the former order can be performed, which is not limited here.

[0060] The present application also discloses a method for manufacturing a chip packaging structure 100, comprising the following steps:

[0061] Step 1': setting a carrier 40.

[0062] Step 2', disposing a redistribution layer 50 on the first side of the carrier 40. For example, Figure 1 As shown, a fixing glue 60 is attached to the upper surface of the carrier 40 , and a redistribution layer 50 is disposed on the upper side of the fixing glue 60 .

[0063] Step 3', installing a chip 10 electrically connected to the first side of the redistribution layer 50. Figure 2 As shown, the chip 10 is attached to a portion of the upper surface of the redistribution layer 50. The chip 10 and the redistribution layer 50 are electrically connected.

[0064] Step 4', a pipe 30 is provided on the first side of the redistribution layer 50, and the pipe 30 is filled with a cooling medium for phase change heat transfer. The cooling medium can change between different phases to achieve heat release and heat absorption. For example, the change from liquid phase to gas phase is an endothermic process, and the change from gas phase to liquid phase is an exothermic process. In addition, a pipe 30 is provided on the upper surface of the redistribution layer 50, and the pipe 30 can be pre-filled with a cooling medium. Optionally, as Figure 3 As shown, the pipeline 30 is spaced apart from the chip 10. Further, the pipeline 30 is an annular closed pipeline 30 and is arranged around the chip 10.

[0065] Step 5', Figure 4 As shown, a packaging layer 20 is disposed on a first side of the carrier 40, and the packaging layer 20 covers the chip 10 and the pipeline 30. The chip 10 and the pipeline 30 can be sealed by the packaging layer 20. In the package structure after molding, the pipeline 30 is located in the packaging layer 20.

[0066] Step 6', Figure 5 As shown, the carrier 40 is removed. After the carrier 40 is removed, if there is a fixing glue 60 between the carrier 40 and the redistribution layer 50, the fixing glue 60 can be removed.

[0067] Step 7', Figure 6 As shown, a solder ball 70 electrically connected to the second side surface of the redistribution layer 50 is disposed. For example, the solder ball 70 is implanted on the lower surface of the redistribution layer 50 .

[0068] Step 8': electrically connect the solder ball 70 to the PCB board.

[0069] It should be noted that in this embodiment, the Fan-out process can be implemented. The steps of the manufacturing method of the present application are not limited to the above-described order, and the latter order can be performed first, and then the former order can be performed, which is not limited here.

[0070] Optionally, for any of the above two packaging structure manufacturing methods, the pipeline 30 can be divided into a steam loop 31 and a condensate loop 32. The condensate loop 32 is closer to the chip 10 than the steam loop 31, which is conducive to absorbing the heat of the chip 10 and other heating elements through phase change.

[0071] Optionally, for any of the above two methods of making the packaging structure, the driving component (such as an electronically controlled pump), the heat extraction component, the condensation component and other structures can be buried together in the packaging layer 20. And the heat extraction component and the condensation component are respectively located at the connection position of the steam circuit 31 and the condensate circuit 32. In other words, the driving component, the heat extraction component, the condensation component. The steam circuit 31, the condensate circuit 32, etc. can form a formed heat dissipation structure with gas-liquid interactive circulation. By burying the formed heat dissipation structure in the packaging layer 20, the wide range of sources and the convenience of assembly of the heat dissipation structure are improved. That is, the existing heat dissipation structure can be used to achieve heat dissipation of the packaging structure, avoiding increasing the overall volume and height of the packaging structure.

[0072] In summary, according to the chip packaging structure 100 of the embodiment of the present application, a molded pipe 30 is embedded in the packaging layer 20 (such as EMC), innovatively proposing a high-integration, high-power packaging heat dissipation method. The present application can take into account the efficient heat dissipation function without increasing the original packaging volume.

[0073] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A chip packaging structure, It is characterized in that include: PCB board; A chip, wherein the chip is disposed on the first side of the PCB and is electrically connected to the PCB; An encapsulation layer, the encapsulation layer is arranged on the first side of the PCB board, a pipe is arranged in the encapsulation layer, the pipe is filled with a cooling medium for phase change heat transfer, the encapsulation layer covers the chip and the pipe; the pipe is a closed annular pipe arranged around the chip; The pipeline includes: Steam circuit; A condensate circuit, wherein a first end of the condensate circuit is connected to a first end of the steam circuit, a second end of the condensate circuit is connected to a second end of the steam circuit, and the condensate circuit and the steam circuit cooperate to form the annular pipeline; The packaging structure further includes: a driving member, the driving member being disposed on the pipeline and capable of driving the cooling medium to circulate between the steam circuit and the condensate circuit; An average distance between the chip and the steam circuit is greater than an average distance between the chip and the condensate circuit.

2. The chip packaging structure according to claim 1, It is characterized in that Also includes: A heat extractor is provided between the first end of the steam circuit and the first end of the condensate circuit, and receives heat to transform the cooling medium from a liquid phase to a gas phase.

3. The chip packaging structure according to claim 1, It is characterized in that Also includes: A condenser is provided between the second end of the steam circuit and the second end of the condensate circuit, and the condenser can transform the cooling medium from a gas phase to a liquid phase.

4. The chip packaging structure according to claim 1, It is characterized in that The chip is a flip chip.

5. The chip packaging structure according to claim 1, It is characterized in that Also includes: The redistribution layer is arranged on a side of the PCB board close to the chip and is electrically connected to the chip and the PCB board respectively.

6. A method for manufacturing a chip packaging structure, It is characterized in that The following steps are involved: Set up the PCB board; Installing a chip electrically connected to the first side of the PCB board; A pipe is arranged on the first side of the PCB board, and the pipe is filled with a cooling medium for phase change heat transfer; A packaging layer is arranged on the first side of the PCB board, wherein the packaging layer covers the chip and the pipeline; Wherein, the pipeline is a closed annular pipeline arranged around the chip; The pipeline includes: Steam circuit; A condensate circuit, wherein a first end of the condensate circuit is connected to a first end of the steam circuit, a second end of the condensate circuit is connected to a second end of the steam circuit, and the condensate circuit and the steam circuit cooperate to form the annular pipeline; The packaging structure further includes: a driving member, the driving member being disposed on the pipeline and capable of driving the cooling medium to circulate between the steam circuit and the condensate circuit; An average distance between the chip and the steam circuit is greater than an average distance between the chip and the condensate circuit.

7. A method for manufacturing a chip packaging structure, It is characterized in that The following steps are involved: Set the carrier; Disposing a redistribution layer on the first side of the carrier; Installing a chip electrically connected to the first side of the redistribution layer; A pipeline is arranged on the first side of the redistribution layer, wherein the pipeline is filled with a cooling medium for phase change heat transfer; Disposing a packaging layer on the first side of the carrier, wherein the packaging layer covers the chip and the pipeline; removing the carrier; Disposing a solder ball electrically connected to the second side surface of the redistribution layer; The solder ball is electrically connected to the PCB board; Wherein, the pipeline is a closed annular pipeline arranged around the chip; The pipeline includes: Steam circuit; A condensate circuit, wherein a first end of the condensate circuit is connected to a first end of the steam circuit, a second end of the condensate circuit is connected to a second end of the steam circuit, and the condensate circuit and the steam circuit cooperate to form the annular pipeline; The packaging structure further includes: a driving member, the driving member being disposed on the pipeline and capable of driving the cooling medium to circulate between the steam circuit and the condensate circuit; An average distance between the chip and the steam circuit is greater than an average distance between the chip and the condensate circuit.

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