electronic devices

Abstract

This application discloses an electronic device, including: a shielding cover having a first metal layer; a second metal layer spaced apart from the first metal layer, the second metal layer having slots and being disposed outside the shielding cover; a metal component disposed between the first and second metal layers, forming a resonant cavity, the metal component being electrically connected to both the first and second metal layers, the first and second metal layers constituting a first resonant cavity antenna, and a feeding structure for feeding the resonant cavity. In the electronic device of this application embodiment, the first and second metal layers constitute the first resonant cavity antenna, which allows for the placement of a high-radiation-efficiency antenna above the shielding cover, utilizing the space above the shielding cover to create an additional high-performance antenna. The first metal layer in the shielding cover serves as part of the first resonant cavity antenna, integrating the shielding cover and the resonant cavity antenna, resulting in excellent structural consistency and full utilization of space.

Description

Technical Field

[0001] This application belongs to the field of terminal technology, specifically relating to an electronic device. Background Technology

[0002] With the increasing number of antennas and frequency bands on current 5G mobile terminals, arranging antennas around the perimeter has become overly crowded, creating isolation issues between antennas that directly impact performance. Therefore, maximizing space utilization is crucial while keeping the overall device size constant. Typically, shielding covers are used as standalone shielding structures, leaving the space above them unused, thus hindering the full utilization of the overall device space. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device to solve the problem that the space above the shielding cover cannot be fully utilized by the antenna.

[0004] This application provides an electronic device, including:

[0005] A shielding cover having a first metal layer;

[0006] A second metal layer is provided at a distance from the first metal layer, and the second metal layer has grooves and slots, and the second metal layer is disposed outside the shielding cover;

[0007] A metal component is disposed between the first metal layer and the second metal layer, and the metal component forms a resonant cavity. The metal component is electrically connected to the first metal layer and the second metal layer respectively, and the first metal layer and the second metal layer constitute a first resonant cavity antenna.

[0008] A power supply structure for powering the resonant cavity.

[0009] Wherein, the metal component extends circumferentially along the second metal layer; or

[0010] The metal components are multiple, and the multiple metal components are arranged at circumferential intervals along the second metal layer.

[0011] The metal component includes:

[0012] A first metal component, which is electrically connected to the first metal layer and the second metal layer respectively, and the first metal component is arranged along the circumference of the second metal layer and forms a first resonant cavity;

[0013] The second metal component is electrically connected to the first metal layer and the second metal layer respectively. The second metal component is arranged along the circumference of the second metal layer and forms a second resonant cavity. The second resonant cavity is located inside the first resonant cavity.

[0014] The second metal part is provided in multiple parts, and the second metal parts are distributed on both sides of the groove.

[0015] A dielectric layer is filled between the first metal layer and the second metal layer.

[0016] Wherein, the second metal layer has multiple slots, and the multiple slots are spaced apart; and / or

[0017] The slot is elongated, arc-shaped, annular, or L-shaped; and / or

[0018] The slot is located in the edge region of the second metal layer; and / or

[0019] The resonant cavity is cylindrical, elliptical, or polygonal.

[0020] The length of the slot is half the operating wavelength of the radio frequency signal in the medium within the slot.

[0021] The groove is elongated, and the ratio of the length of the groove to the width of the groove is greater than or equal to 10.

[0022] The slot extends inward from one side edge of the second metal layer and exits through the other side edge of the second metal layer.

[0023] This also includes:

[0024] A third metal layer is disposed between the first metal layer and the second metal layer and located in the resonant cavity. The third metal layer is spaced apart from the first metal layer and the second metal layer respectively, and the edge of the third metal layer is electrically connected to the metal component.

[0025] The metal component extends circumferentially along the second metal layer, the third metal layer is rectangular, and the two adjacent edges of the third metal layer are electrically connected to the metal component.

[0026] The shield has multiple shields and multiple second metal layers. The first metal layer of each shield and a corresponding second metal layer constitute a first resonant cavity antenna.

[0027] The shielding cover has multiple layers, and the second metal layer has one layer. The first metal layers on the multiple shielding covers are all arranged correspondingly to the second metal layer to form a first resonant cavity antenna.

[0028] The first metal layer and the second metal layer are provided with a plurality of resonant cavities, and the second metal layer is provided with slots at positions corresponding to the resonant cavities.

[0029] It also includes a power feeding structure for powering the resonant cavity.

[0030] It also includes a tuning element, through which the feeding structure feeds the resonant cavity.

[0031] It also includes: a motherboard, and the shielding cover is disposed on the motherboard.

[0032] It also includes: a first antenna, which is disposed on the second metal layer.

[0033] This also includes a second antenna, which is disposed in the edge region of the electronic device.

[0034] It also includes: a battery and a back cover, wherein the battery and the back cover are spaced apart along the thickness direction of the battery, and a second resonant cavity antenna is provided between the battery and the back cover.

[0035] It also includes: a display screen and a frame, wherein the display screen is disposed on the frame and a third resonant cavity antenna is provided between the display screen and the frame.

[0036] The electronic device in this embodiment includes: a shielding cover having a first metal layer; a second metal layer spaced apart from the first metal layer, the second metal layer having slots, and the second metal layer being disposed outside the shielding cover; a metal component disposed between the first metal layer and the second metal layer, the metal component forming a resonant cavity, the metal component being electrically connected to the first metal layer and the second metal layer respectively, the first metal layer and the second metal layer constituting a first resonant cavity antenna; and a feeding structure for feeding the resonant cavity. In the electronic device of this application embodiment, a metal component is disposed between the first metal layer and the second metal layer of the shielding cover, the metal component forming a resonant cavity. A slot is disposed on the second metal layer, so that the first metal layer and the second metal layer constitute a first resonant cavity antenna. This allows a high-radiation-efficiency antenna to be disposed above the shielding cover, utilizing the space above the shielding cover to create an additional high-performance antenna, making full use of the space above the shielding cover. The first metal layer in the shielding cover serves as part of the first resonant cavity antenna, and the shielding cover and the resonant cavity antenna are integrated, resulting in excellent structural consistency. The upper region of the second metal layer in the resonant cavity antenna can be used as a support for other antennas, such as NFC, UWB, or millimeter-wave antennas, making full use of the space. Attached Figure Description

[0037] Figure 1a This is a schematic diagram of the structure of an electronic device in an embodiment of this application;

[0038] Figure 1b This is a side view of an electronic device in an embodiment of this application;

[0039] Figure 1c This is another structural schematic diagram of the electronic device in the embodiments of this application;

[0040] Figure 1d This is another side view of the electronic device in an embodiment of this application;

[0041] Figure 2a This is a schematic diagram of the shape of a resonant cavity;

[0042] Figure 2b This is a schematic diagram of another shape of the resonant cavity;

[0043] Figure 2c This is another schematic diagram of a resonant cavity shape;

[0044] Figure 3 This is yet another structural schematic diagram of the electronic device in the embodiments of this application;

[0045] Figure 4 A schematic diagram of a filling dielectric layer;

[0046] Figure 5a A schematic diagram showing the installation of a third metal layer;

[0047] Figure 5b Another schematic diagram showing the installation of the third metal layer;

[0048] Figure 6a This is a schematic diagram of a non-enclosed metal component.

[0049] Figure 6b This is a schematic diagram showing the process of passing through a slot;

[0050] Figure 7a A schematic diagram illustrating one possible design of a groove;

[0051] Figure 7b This is a schematic diagram of another setting for the groove;

[0052] Figure 7c This is a schematic diagram of another possible setting for the groove;

[0053] Figure 8 A schematic diagram showing the connection between the tuning element and the power supply structure;

[0054] Figure 9a A schematic diagram for multiple shielding covers;

[0055] Figure 9b Another schematic diagram when multiple shielding covers are used;

[0056] Figure 9c Another schematic diagram when multiple shielding covers are used;

[0057] Figure 9d Another schematic diagram when multiple shielding covers are used;

[0058] Figure 10 This is another structural schematic diagram of the electronic device in the embodiments of this application.

[0059] Figure Labels

[0060] Shielding cover 10; First metal layer 11; Dielectric layer 12;

[0061] Second metal layer 20; slot 21;

[0062] Metal component 30; second metal component 32; third metal layer 33;

[0063] Power supply structure 40; Flexible circuit board 51;

[0064] Tuning component 50; Mainboard 60; RF module 61;

[0065] First antenna 70; Second antenna 80; Flexible circuit board 81;

[0066] Battery 90. Detailed Implementation

[0067] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0068] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0069] The following is in conjunction with the appendix Figures 1a to 10 As shown, the electronic device provided in this application will be described in detail through specific embodiments and application scenarios.

[0070] like Figures 1a to 10 As shown, the electronic device in this embodiment includes: a shielding cover 10, a second metal layer 20, a metal component 30, and a power supply structure 40. The shielding cover 10 has a first metal layer 11, which may include at least one surface of the shielding cover 10. The shielding cover 10 can be soldered onto the main ground layer of the motherboard and can provide electromagnetic shielding for chip modules or discrete power amplifier devices on the motherboard, thus providing a shielding function. The first metal layer 11 can be located at the top of the shielding cover 10, that is, on the side furthest from the motherboard.

[0071] The second metal layer 20 and the first metal layer 11 can be arranged alternately or parallel to each other. The thickness of the second metal layer 20 can be 0.5mm-2mm. The second metal layer 20 is disposed outside the shielding cover 10. The second metal layer 20 can have slots 21. The number of slots 21 can be one or more. The number, shape and position of the slots 21 can be selected according to the actual situation. The metal component 30 can be disposed between the first metal layer 11 and the second metal layer 20. The metal component 30 can form a resonant cavity. The slot 21 can be disposed on the second metal layer 20 at a position corresponding to the resonant cavity. The metal component 30 can extend along the circumference of the second metal layer 20. The metal component 30 can extend along the edge region of the second metal layer 20. The metal component 30 can be circular or arc-shaped. The metal component 30 can be electrically connected to the first metal layer 11 and the second metal layer 20 respectively. The first metal layer 11 and the second metal layer 20 can form a first resonant cavity antenna. The feeding structure 40 can be used to feed the resonant cavity. The signal can be fed into the resonant cavity through the feeding structure 40. The radio frequency signal can be radiated from the slot 21 after resonance of the resonant cavity. A high radiation efficiency antenna can be realized above the shielding cover 10.

[0072] In the electronic device of this application embodiment, a metal component 30 is disposed between the first metal layer 11 and the second metal layer 20 of the shielding cover 10. The metal component 30 can form a resonant cavity. A slot 21 is provided on the second metal layer 20, so that the first metal layer 11 and the second metal layer 20 constitute a first resonant cavity antenna. This allows a high-radiation-efficiency antenna to be disposed above the shielding cover 10, utilizing the space above the shielding cover 10 to create an additional high-performance antenna, making full use of the space above the shielding cover 10. The first metal layer 11 in the shielding cover 10 serves as part of the first resonant cavity antenna, and the shielding cover 10 and the resonant cavity antenna are integrated, resulting in excellent structural consistency. The upper region of the second metal layer 20 in the resonant cavity antenna can be used as a support for other antennas, such as near-field communication (NFC) antennas, ultra-wideband (UWB) antennas, or millimeter-wave antennas, making full use of space. Implementing the resonant cavity antenna near the shielding cover 10 (0 clearance, low profile) can achieve high radiation performance, making full use of the overall space and enabling more antennas.

[0073] In some embodiments, such as Figure 1b As shown, the metal component 30 can extend circumferentially along the second metal layer 20. The metal component 30 can be located at the edge region between the first metal layer 11 and the second metal layer 20. The metal component 30 can be annular or arc-shaped. The metal component 30 between the first metal layer 11 and the second metal layer 20 can form a resonant cavity, which can be cylindrical, cuboid, or cubic. Figure 1dAs shown, there can be multiple metal components 30. Each metal component 30 can be columnar or arc-shaped. These multiple metal components 30 can be spaced apart circumferentially along the second metal layer 20, and can be evenly spaced. The multiple metal components 30 can form a resonant cavity. The metal component 30 can be a non-enclosed annular metal sheet, such as... Figure 6a As shown by the dashed line a, openings can be made on a portion of the surface to enable mode control of the antenna.

[0074] The first metal layer 11, the second metal layer 20, and the metal part 30 do not have to be integrally formed. The metal part 30 can be a metal spring or a screw post. The first metal layer 11 and the second metal layer 20 can be two separate structural parts. The position of the spring can be flexibly adjusted according to the actual debugging situation to control the resonant frequency of the resonant cavity antenna. The debugging cycle is short and efficient, avoiding the inconvenience of debugging caused by the integrated antenna structure, the need for overall replacement when changing, and the long prototyping cycle.

[0075] In other embodiments, such as Figure 3 As shown, the metal component 30 may include a first metal component and a second metal component 32. The first metal component can be electrically connected to the first metal layer 11 and the second metal layer 20, respectively. The first metal component can be arranged along the circumference of the second metal layer 20 and form a first resonant cavity. The first metal component can extend along the circumference of the second metal layer 20. The first metal component can be located at the edge region of the first metal layer 11 and the second metal layer 20. The first metal component can be annular or arc-shaped. The first resonant cavity can be formed by the first metal component between the first metal layer 11 and the second metal layer 20. The first resonant cavity can be cylindrical, cuboid, or cubic. There can be multiple first metal components. The first metal component can be columnar or arc-shaped. Multiple first metal components can be arranged at intervals along the circumference of the second metal layer 20. They can be evenly spaced and can form a first resonant cavity.

[0076] The second metal element 32 is electrically connected to both the first metal layer 11 and the second metal layer 20. The second metal element 32 is arranged circumferentially along the second metal layer 20 and forms a second resonant cavity, which is located within the first resonant cavity. The second metal element 32 can extend circumferentially along the second metal layer 20 and can be annular or arc-shaped. The second metal element 32 between the first metal layer 11 and the second metal layer 20 can form a second resonant cavity, which can be cylindrical, cuboid, or cubic. Multiple second metal elements 32 can be present, and they can be columnar or arc-shaped. These multiple second metal elements 32 can be spaced evenly along the circumferential direction of the second metal layer 20, forming a second resonant cavity. The first and second resonant cavities can excite various higher-order modes, broadening the frequency band covered by the antenna.

[0077] In the embodiments of this application, there may be multiple second metal parts 32, and second metal parts 32 may be distributed on both sides of the slot 21. The second metal parts 32 may be spring pieces or metal pillars. The second metal parts 32 connect the first metal layer 11 and the second metal layer 20, enabling antenna mode control and achieving wideband coverage. The distribution of the second metal parts 32 on both sides of the slot 21 can excite the antenna to generate multiple higher-order modes, thus widening the frequency band covered by the antenna.

[0078] In some embodiments, such as Figure 4 As shown, a dielectric layer 12 is filled between the first metal layer 11 and the second metal layer 20. The dielectric layer 12 can be filled inside or partially filled in the resonant cavity to reduce the antenna resonant frequency and reduce the required length and width dimensions of the cavity. Optionally, the loss tangent factor of the dielectric layer 12 can be less than 0.005.

[0079] In the embodiments of this application, such as Figure 9d As shown, the second metal layer 20 may have multiple slots 21, which may be spaced apart, and the specific spacing may be selected according to actual needs.

[0080] Optionally, such as Figures 7a to 7c As shown, the groove 21 can be elongated, arc-shaped, annular, or L-shaped. Multiple grooves 21 can intersect to form a cross-shaped groove, for example, as shown. Figure 7a As shown, the two elongated slots 21 intersect to form a cross shape, and the specific shape can be selected according to the actual situation. The slot 21 serves as the radiation aperture of the antenna, and its shape is not limited to the shape described above.

[0081] Optionally, the slot 21 can be located at the edge of the second metal layer 20 to facilitate antenna radiation, while the middle area of ​​the second metal layer 20 can be used to set up other antennas. For example, the middle area can be reserved for UWB or millimeter-wave antennas, making the layout more reasonable.

[0082] Optionally, such as Figures 2a to 2c As shown, the resonant cavity can be cylindrical, elliptical cylindrical, or polygonal. It can also be other shapes of cavity composed of arcs and straight lines. For example, the resonant cavity can be cuboid or cube-shaped. The specific shape can be selected according to the actual situation and the design can be adjusted accordingly based on the actual antenna mode, bandwidth, and other requirements.

[0083] In some embodiments, the length of the slot 21 can be half the operating wavelength of the radio frequency signal in the medium within the slot 21.

[0084] Optionally, the slot 21 is elongated, and the ratio of the length of the slot 21 to the width of the slot 21 can be greater than or equal to 10.

[0085] Optionally, such as Figure 6b As shown, the slot 21 can extend inward from one side edge of the second metal layer 20 and exit through the other side edge of the second metal layer 20. The slotted portion of the second metal layer 20 can extend to the edge, which can divide the second metal layer 20 into two parts, so that the resonant cavity is divided into two half-cavities. The dimensions of these two half-cavities can be equal or unequal, which can realize multi-frequency resonance and play the role of antenna impedance tuning.

[0086] In some embodiments, such as Figures 5a to 5b As shown, the electronic device may further include: a third metal layer 33, which may be disposed between the first metal layer 11 and the second metal layer 20, and located in the resonant cavity. The third metal layer 33 may be spaced apart from the first metal layer 11 and the second metal layer 20, and may be parallel to the first metal layer 11 and the second metal layer 20, respectively. The edge of the third metal layer 33 may be electrically connected to the metal component 30. The metal component 30 may extend circumferentially along the second metal layer 20. The third metal layer 33 may be rectangular. The first metal layer 11, the second metal layer 20, and the third metal layer 33 may all be rectangular. The resonant cavity may be cuboid. Two adjacent edges of the third metal layer 33 may be electrically connected to the metal component 30, while the other two adjacent edges of the third metal layer 33 may not be electrically connected to the metal component 30 and may be spaced apart by a certain distance. The third metal layer 33 is parallel to the first metal layer 11 and the second metal layer 20, and the third metal layer 33 can be connected to two sides of the resonant cavity but not to the other two sides, forming an L-shaped cavity portion. A third metal layer 33 can be added inside the resonant cavity to realize a folded resonant cavity, thereby reducing the antenna resonant frequency and reducing the required length and width dimensions of the cavity.

[0087] In some embodiments, such as Figure 9cAs shown, there can be multiple shielding covers 10 and multiple second metal layers 20. The first metal layer 11 of each shielding cover 10, together with a corresponding second metal layer 20, forms a first resonant cavity antenna. For example, there can be four shielding covers 10 and four second metal layers 20, with each shielding cover 10's first metal layer 11 forming a first resonant cavity antenna with a corresponding second metal layer 20, thus forming four first resonant cavity antennas. A metal component 30 is placed between the first metal layer 11 and the corresponding second metal layer 20 of each shielding cover 10. The metal component 30 can form a resonant cavity. A slot 21 is provided on the second metal layer 20, allowing each shielding cover 10's first metal layer 11 and second metal layer 20 to form a first resonant cavity antenna, enabling the placement of a high-radiation-efficiency antenna above the shielding cover 10. Each shield 10 has an integrated resonant cavity antenna on top. Multiple shields 10 can correspond to multiple resonant cavity antennas. These resonant cavity antennas can operate in the same frequency band to achieve MIMO antenna function, or operate in different frequency bands to achieve diversity or MIMO antenna function with other types of antennas.

[0088] In other embodiments, such as Figure 9a and Figure 9b As shown, there can be multiple shielding covers 10, such as four, and one second metal layer 20. The first metal layers on the multiple shielding covers 10 are all corresponding to the second metal layer 20 to form a first resonant cavity antenna. For example, there can be four shielding covers 10 and one second metal layer 20. The second metal layer 20 can be rectangular, and the four shielding covers 10 can be located at the corners of the second metal layer 20. The first metal layers 11 on the four shielding covers 10 are all corresponding to the second metal layer 20 to form a first resonant cavity antenna.

[0089] like Figure 9a and Figure 9b As shown, the first metal layer 11 above the multiple shielding covers 10 corresponds to a large second metal layer 20, which is used to cope with situations where the antenna operating frequency needs to be lower. Metal components 30, such as metal springs, can be placed above the multiple shielding covers 10. These metal components 30 can be electrically connected to the second metal layer 20 to form a first resonant cavity antenna, which is used to cope with situations where the antenna operating frequency needs to be lower. This implementation method offers more flexible adjustment. The metal component 30 can be a screw post, and the first metal layer 11 and the second metal layer 20 on the shielding cover 10 can be electrically connected by tightening screws.

[0090] In the embodiments of this application, such as Figure 9dAs shown, multiple resonant cavities, such as three, can be formed between the first metal layer 11 and the second metal layer 20. Slots 21 are provided on the second metal layer 20 at positions corresponding to the resonant cavities, allowing for flexible arrangement of multiple antennas. Metal components 30, which can be metal springs, can be placed above the multiple shielding covers 10. Through the proper arrangement of these springs, the first metal layer 11 and the second metal layer 20 are electrically connected and divided to form different resonant cavities. Three slots 21 can be opened on the second metal layer 20 to correspond to the antenna radiation aperture of each resonant cavity, enabling flexible arrangement of multiple antennas. For example, there can be four shielding covers 10 and one second metal layer 20. The second metal layer 20 can be rectangular, and the four shielding covers 10 can be located at the corners of the second metal layer 20. Three resonant cavities are formed between the first metal layer 11 and the second metal layer 20 on the four shielding covers 10. Slots 21 can be provided on the second metal layer 20 at positions corresponding to each resonant cavity, enabling flexible arrangement of multiple antennas.

[0091] In some embodiments, such as Figures 1a to 1d As shown, the electronic device may further include a power supply structure 40 for powering the resonant cavity. The power supply structure 40 may include a coaxial line through which the resonant cavity can be powered. One end of the coaxial line may be connected to the baseband and the radio frequency module 61, and the inner core of the other end of the coaxial line may be connected to one side of the slot 21, while the outer ground layer may be connected to the other side of the slot 21.

[0092] The slot 21 of the resonant cavity antenna can be fed through coupling with the flexible circuit board 51, and can also be fed through coupling with the second metal layer 20 via the flexible circuit board 51. Figure 8 As shown, the coaxial line in the feeding structure 40 can be connected to the flexible circuit board 51. The end of the flexible circuit board 51 can be electrically connected to one end of the tuning element 50. The other end of the tuning element 50 is connected to one side of the slot 21, which provides an additional degree of freedom for antenna control. By modifying the shape of the flexible circuit board 51 and the device values ​​of the electronic components, multi-frequency tuning can be achieved, the antenna impedance can be optimized, and the tuning can be more flexible.

[0093] In some embodiments, such as Figure 8 As shown, the electronic device may further include: a tuning element 50, through which the feeding structure 40 feeds the resonant cavity. The tuning element may include electronic components, which may be capacitors, inductors, or switching devices. The number of electronic components is not less than two. Multi-frequency tuning can be achieved through the tuning element, thereby optimizing the antenna impedance.

[0094] Optionally, such as Figure 1a , Figure 1c and Figure 10As shown, the electronic device may further include: a motherboard 60, and a shielding cover 10 may be disposed on the motherboard 60. The shielding cover 10 may be soldered to the main ground layer of the motherboard 60, and may provide electromagnetic shielding for chip modules or discrete power amplifier devices on the motherboard 60. The first metal layer 11 may be located on the top of the shielding cover 10, that is, on the side away from the motherboard.

[0095] In some embodiments, such as Figure 10 As shown, the electronic device may further include a first antenna 70, which can be disposed on the second metal layer 20. The shielding cover 10 may be located in the middle of the motherboard 60, which may be the location of the chip shielding cover. Since the radiation aperture (at the slot) is at the edge of the second metal layer 20, the actual space occupied is very small, and the entire structure can be considered reused. At the same time, the second metal layer 20 can also be used as a support, serving as a support for the first antenna 70. The first antenna 70 may include at least one of a UWB antenna, an NFC antenna, and a millimeter-wave antenna. In this way, an additional antenna can be set in areas where conventional antenna design is restricted, improving space utilization.

[0096] In other embodiments, such as Figure 10 As shown, the electronic device may further include a second antenna 80, which may be disposed in the edge region of the electronic device. The second antenna 80 may include antennas in the 6 GHz band or below, such as cellular antennas and WIFI antennas. Positioning it at the edge of the electronic device facilitates radiation and improves antenna performance. The electronic device may also include a flexible circuit board 81, for example, the flexible circuit board 81 can power the second antenna 80.

[0097] In some embodiments, such as Figure 10 As shown, the electronic device may also include: a battery 90 and a back cover. The battery 90 and the back cover may be spaced apart along the thickness direction of the battery 90. A second resonant cavity antenna may be provided between the battery 90 and the back cover. The second resonant cavity antenna can be constructed by utilizing the metal layer on the battery 90. This can make full use of the space between the battery 90 and the back cover, improve space utilization, increase the number of antennas, and enhance the overall antenna performance.

[0098] In other embodiments, the electronic device may further include: a display screen and a frame, wherein the display screen may be disposed on the frame, and a third resonant cavity antenna may be provided between the display screen and the frame, which can make full use of the space between the display screen and the frame, improve space utilization, increase the number of antennas, and enhance the overall antenna performance.

[0099] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: A shielding cover having a first metal layer; A second metal layer is provided at a distance from the first metal layer, and the second metal layer has grooves and slots, and the second metal layer is disposed outside the shielding cover; A metal component is disposed between the first metal layer and the second metal layer, and the metal component forms a resonant cavity. The metal component is electrically connected to the first metal layer and the second metal layer respectively, and the first metal layer and the second metal layer constitute a first resonant cavity antenna. A feeding structure for feeding the resonant cavity; The metal component includes: A first metal component, which is electrically connected to the first metal layer and the second metal layer respectively, and the first metal component is arranged along the circumference of the second metal layer and forms a first resonant cavity; The second metal component is electrically connected to the first metal layer and the second metal layer respectively. The second metal component is arranged along the circumference of the second metal layer and forms a second resonant cavity. The second resonant cavity is located inside the first resonant cavity.

2. The electronic device according to claim 1, characterized in that, The metal component extends circumferentially along the second metal layer; or The metal components are multiple, and the multiple metal components are arranged at circumferential intervals along the second metal layer.

3. The electronic device according to claim 1, characterized in that, The second metal part is multiple, and the second metal parts are distributed on both sides of the slot.

4. The electronic device according to claim 1, characterized in that, A dielectric layer is filled between the first metal layer and the second metal layer.

5. The electronic device according to claim 1, characterized in that, The groove is elongated, and the ratio of the length of the groove to the width of the groove is greater than or equal to 10.

6. The electronic device according to claim 1, characterized in that, Also includes: A third metal layer is disposed between the first metal layer and the second metal layer and located in the resonant cavity. The third metal layer is spaced apart from the first metal layer and the second metal layer respectively, and the edge of the third metal layer is electrically connected to the metal component.

7. The electronic device according to claim 6, characterized in that, The metal component extends circumferentially along the second metal layer, the third metal layer is rectangular, and the two adjacent edges of the third metal layer are electrically connected to the metal component.

8. The electronic device according to claim 1, characterized in that, The shield has multiple shields and multiple second metal layers. The first metal layer of each shield and a corresponding second metal layer respectively constitute a first resonant cavity antenna.

9. The electronic device according to claim 1, characterized in that, The shielding cover has multiple layers, and the second metal layer has one layer. The first metal layers on the multiple shielding covers are all arranged correspondingly to the second metal layer to form a first resonant cavity antenna.

10. The electronic device according to claim 1 or 9, characterized in that, A plurality of resonant cavities are formed between the first metal layer and the second metal layer, and slots are respectively provided on the second metal layer at positions corresponding to the resonant cavities.

11. The electronic device according to claim 1, characterized in that, Also includes: A tuning element, wherein the feeding structure supplies power to the resonant cavity through the tuning element.

12. The electronic device according to claim 1, characterized in that, Also includes: The motherboard, and the shielding cover is disposed on the motherboard.

13. The electronic device according to claim 1, characterized in that, Also includes: The first antenna is disposed on the second metal layer.

Images