A cooling system and a control method thereof

Abstract

The present application provides a cooling system and a control method thereof, which relate to the field of semiconductor chip preparation technology. The cooling system includes a control device, a carrier platform, and a cooling machine connected to the carrier platform pipeline through a water inlet and a water outlet. A first temperature sensor is provided on the carrier platform to collect the first temperature of the carrier platform, and a second temperature sensor is provided at the water inlet of the cooling machine to collect the second temperature of the water inlet of the cooling machine. The carrier platform is used to place the chip to be cooled, and the first temperature sensor, the second temperature sensor and the cooling machine are all electrically connected to the control device; the control device is used to adjust the water volume at the water outlet of the cooling machine according to the first temperature and the second temperature obtained. The cooling system and the control method provided by the present application have the effect of being able to adjust the heat dissipation capacity of the carrier platform.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip preparation, and in particular to a cooling system and a control method thereof. Background Art

[0002] During the chip ion implantation process, low-temperature deionized water is needed to remove excess heat in real time to prevent excessive ion diffusion and chip stress effects caused by high temperature.

[0003] At present, a cooling machine is usually used to cool the chip during ion implantation. By connecting the water inlet and outlet of the cooling machine with the carrier, deionized water is injected into the carrier to achieve chip cooling.

[0004] However, during the chip cooling process, due to possible hardware aging of the carrier, the coolant flowing through the carrier channel may not achieve the expected cooling effect, and the carrier may fail to reach the preset temperature. Summary of the invention

[0005] The purpose of the present application is to provide a cooling system and a control method thereof to solve the problem in the prior art that the support platform cannot achieve a preset cooling effect.

[0006] In order to achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0007] On the one hand, an embodiment of the present application provides a cooling system, including a control device, a support platform, and a cooler connected to the support platform through a water inlet and a water outlet. A first temperature sensor is provided on the support platform to collect the first temperature of the support platform, and a second temperature sensor is provided at the water inlet of the cooler to collect the second temperature of the water inlet of the cooler. The support platform is used to place the chip to be cooled, and the first temperature sensor, the second temperature sensor and the cooler are all electrically connected to the control device; the control device is used to adjust the water volume at the water outlet of the cooler according to the first temperature and the second temperature obtained.

[0008] Optionally, the first temperature sensor is used to collect a first temperature on the surface of the support platform, and the control device is used to adjust the amount of water at the water outlet of the cooler according to the difference between the first temperature and the second temperature; wherein, when the difference between the first temperature and the second temperature is greater than a first threshold value, the control device is used to reduce the amount of water at the water outlet of the cooler to reduce the amount of water input to the support platform; when the difference between the first temperature and the second temperature is less than a second threshold value, the control device is used to increase the amount of water at the water outlet of the cooler to increase the amount of water input to the support platform, wherein the first threshold value is greater than the second threshold value.

[0009] Optionally, the first temperature sensor is used to collect a first temperature of the surface of the support platform, and the control device is also used to adjust the water temperature input into the support platform pipeline according to the acquired first temperature and second temperature; wherein, when the difference between the first temperature and the second temperature is greater than a first threshold value, the control device is used to increase the water temperature input into the support platform pipeline; when the difference between the first temperature and the second temperature is less than a second threshold value, the control device is used to reduce the water temperature input into the support platform pipeline; wherein, the first threshold value is greater than the second threshold value.

[0010] Optionally, the cooling system also includes a coolant injection pipe, which is also connected to the support platform and is used to inject coolant into the support platform pipe; and the temperature of the coolant injected into the coolant injection pipe is lower than the water temperature of the water inlet of the cooling machine; the control device is used to adjust the injection ratio of the coolant injection pipe and the cooling machine.

[0011] Optionally, the water inlet and water outlet of the cooler are both provided with flow meters, and the control device is also used to adjust the water volume at the water inlet of the cooler according to the water volume obtained at the water outlet of the cooler, so that the water volume at the water inlet and water outlet of the cooler is equal.

[0012] Optionally, when the difference between the first temperature and the second temperature is greater than a first threshold, the control device is used to increase the water volume ratio of the cooling machine water outlet and reduce the ratio of the coolant injected into the coolant injection pipe;

[0013] When the difference between the first temperature and the second temperature is less than a second threshold, the control device is used to reduce the water volume ratio of the cooling machine water outlet and increase the ratio of the coolant injected into the coolant injection pipe.

[0014] Optionally, the control device includes a host computer and a temperature comparison control device, the host computer is electrically connected to the first temperature sensor, the second temperature sensor and the temperature comparison control device, respectively, and the temperature comparison control device is also electrically connected to the cooler; the host computer is used to obtain the first temperature and the second temperature transmitted by the first temperature sensor and the second temperature sensor, and transmit the first temperature and the second temperature to the temperature comparison control device, and the temperature comparison control device is used to adjust the water volume at the water outlet of the cooler according to the difference between the first temperature and the second temperature.

[0015] On the other hand, an embodiment of the present application also provides a cooling system control method, including: obtaining a first temperature of a carrier platform and a second temperature of a water inlet of a cooler, wherein the carrier platform is used to place a chip to be cooled; and adjusting the amount of water delivered to the carrier platform from a water outlet of the cooler according to the first temperature and the second temperature.

[0016] Optionally, the step of adjusting the amount of water delivered from the water outlet of the cooler to the supporting platform based on the first temperature and the second temperature includes: when the difference between the first temperature and the second temperature is greater than a first threshold, reducing the amount of water at the water outlet of the cooler to reduce the amount of water input to the supporting platform; when the difference between the first temperature and the second temperature is less than a second threshold, increasing the amount of water at the water outlet of the cooler to increase the amount of water input to the supporting platform, wherein the first threshold is greater than the second threshold.

[0017] Optionally, after the step of obtaining the first temperature of the support platform and the second temperature of the water inlet of the cooling machine, the method further includes: when the difference between the first temperature and the second temperature is greater than a first threshold, increasing the temperature of water input into the pipeline of the support platform; when the difference between the first temperature and the second temperature is less than a second threshold, reducing the temperature of water input into the pipeline of the support platform.

[0018] Optionally, the step of increasing the temperature of water input into the support platform pipeline includes:

[0019] Increase the proportion of water volume at the water outlet of the cooling machine, and reduce the proportion of coolant injected into the coolant injection pipe; the step of reducing the water temperature of the water input into the support platform pipeline includes: reducing the proportion of water volume at the water outlet of the cooling machine, and increasing the proportion of coolant injected into the coolant injection pipe.

[0020] Optionally, the water inlet and the water outlet of the cooler are both provided with flow meters, and the method further includes: respectively obtaining the flow values ​​of the water inlet and the water outlet of the cooler; and adjusting the water volume of the water inlet of the cooler so that the water volume of the water inlet of the cooler is equal to the water volume of the water outlet of the cooler.

[0021] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0022] The embodiment of the present application provides a cooling system and a control method thereof, the cooling system includes a control device, a support platform, and a cooling machine connected to the support platform pipeline through a water inlet and a water outlet, a first temperature sensor is arranged on the support platform to collect the first temperature of the support platform, a second temperature sensor is arranged at the water inlet of the cooling machine to collect the second temperature of the water inlet of the cooling machine, the support platform is used to place the chip to be cooled, the first temperature sensor, the second temperature sensor and the cooling machine are all electrically connected to the control device; the control device is used to adjust the water volume of the cooling machine outlet according to the first temperature and the second temperature obtained. Since the control device in the present application can adjust the water volume of the cooling machine outlet according to the first temperature and the second temperature, and the water volume is related to the heat dissipation effect of the support platform, that is, when the water volume is large, the heat dissipation capacity of the support platform is better, and when the water volume is small, the heat dissipation capacity of the support platform is poor. Therefore, by adjusting the water volume of the cooling machine outlet, the heat dissipation capacity of the support platform can be adjusted, so that the support platform reaches the preset temperature.

[0023] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A schematic diagram of a module of a cooling system provided in an embodiment of the present application.

[0026] Figure 2 Another module schematic diagram of a cooling system provided in an embodiment of the present application.

[0027] Figure 3 A schematic diagram of submodules of a control device provided in an embodiment of the present application.

[0028] Figure 4 A schematic flowchart of a cooling system control method provided in an embodiment of the present application.

[0029] Figure 5 Provided in the embodiments of this application Figure 4 Flowchart of sub-steps of S104.

[0030] Figure 6 Another schematic flow chart of a cooling system control method provided in an embodiment of the present application.

[0031] Figure 7 Provided in the embodiments of this application Figure 6 A sub-step flow chart of S106.

[0032] Figure 8 Provided in the embodiments of this application Figure 6 Another seed step flow chart of S106.

[0033] In the figure: 100-cooling system; 110-control device; 111-host computer; 112-temperature comparison control device; 120-carrying platform; 130-cooling machine; 140-first temperature sensor; 150-second temperature sensor; 160-cooling liquid injection pipeline; 170-cooling liquid output pipeline. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0036] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0038] In the description of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0041] First embodiment

[0042] As described in the background technology, currently, a cooling machine is usually used to cool the chip during ion implantation. By connecting the water inlet and outlet of the cooling machine with the carrier, deionized water is injected into the carrier, and the chip is cooled by heat transfer. However, due to hardware aging problems such as the carrier or the cooling machine, the coolant flowing through the carrier channel cannot achieve the expected cooling effect, and the carrier cannot reach the preset temperature.

[0043] In view of this, in order to solve the problem that the support platform cannot reach the preset temperature, the present application provides a cooling system, which obtains the first temperature of the support platform and the second temperature of the water inlet of the cooler through a control device, and adjusts the water volume of the water outlet of the cooler accordingly, so that the support platform reaches the preset temperature.

[0044] The following is an exemplary description of the cooling system provided by the present application:

[0045] As an alternative implementation, see Figure 1 The cooling system 100 includes a control device 110, a carrier 120, and a cooler 130 connected to the carrier 120 through a water inlet and a water outlet. A first temperature sensor 140 is provided on the carrier 120 to collect a first temperature of the carrier 120, and a second temperature sensor 150 is provided at the water inlet of the cooler 130 to collect a second temperature of the water inlet of the cooler 130. The carrier 120 is used to place the chip to be cooled, and the first temperature sensor 140, the second temperature sensor 150 and the cooler 130 are all electrically connected to the control device 110. The control device 110 is used to adjust the water volume at the water outlet of the cooler 130 according to the first temperature and the second temperature obtained.

[0046] It should be noted that in the present application, the cooler 130 includes a cooling component, which can cool down the coolant flowing in through the water inlet of the cooler 130, so that the coolant flowing out through the water outlet of the cooler 130 is in a low temperature state. For example, the temperature of the coolant flowing in through the water inlet of the cooler 130 is 40°C. After cooling by the cooling component, the temperature of the coolant can be reduced to 10°C and flow out from the water outlet of the cooler 130.

[0047] In addition, the cooling machine 130 described in the present application is connected with the support platform 120 pipeline through the water inlet and the water outlet, which means that the water outlet of the cooling machine 130 is connected with the water inlet of the support platform 120, and the water outlet of the support platform 120 is connected with the water inlet of the cooling machine 130, thereby forming a passage for the flow of the coolant, that is, the coolant passes through the passage of "cooler 130 water outlet-support platform 120-cooler 130 water inlet", so as to realize the discharge of low-temperature coolant from the water outlet of the cooling machine 130. When passing through the support platform 120, the coolant absorbs heat, so that the support platform 120 achieves the heat dissipation effect, and at the same time increases the temperature of the coolant. The coolant with increased temperature enters the cooling machine 130 again through the water inlet of the cooling machine 130, and is cooled by the cooling components in the cooling machine 130, thereby forming a circulation flow of the coolant.

[0048] Among them, for the carrier platform 120, the carrier platform 120 pipeline is set inside the carrier platform 120 or on the back of the carrier platform 120, and the surface of the carrier platform 120 is used to place the chip to be cooled. During the ion implantation process of the chip to be cooled, a large amount of heat is generated. Through the heat transfer of the carrier platform 120, part of the heat is transferred to the coolant to achieve the heat dissipation effect.

[0049] During the heat dissipation process of the chip on the carrier 120, the temperature of the chip to be cooled will inevitably rise due to part of the heat transferred to the coolant, and the coolant absorbs energy, while the heat of the chip to be cooled decreases. Therefore, when the carrier 120 is under ideal heat dissipation conditions, the difference between the temperature of the surface of the carrier 120 and the water inlet of the cooler 130 is within a preset value or a preset range. For example, when the difference between the temperature of the carrier 120 and the water inlet of the cooler 130 is between 10°C and 12°C, it is an ideal heat dissipation condition; if the surface temperature of the carrier 120 is 50°C and the temperature at the water inlet of the cooler 130 is 40°C, then the heat dissipation of the carrier 120 is normal at this time, and if the surface temperature of the carrier 120 is 50°C and the temperature at the water inlet of the cooler 130 is 45°C, then it indicates an abnormality and the water volume at the water outlet of the cooler 130 needs to be adjusted. Of course, in some other embodiments, after obtaining the first temperature and the second temperature, the water volume at the coolant outlet may be adjusted by other means, such as by using the ratio of the two. This application does not impose any limitation on this.

[0050] The specific adjustment method of the coolant outlet is analyzed below:

[0051] When the difference between the first temperature and the second temperature is greater than the first threshold, it means that the difference between the temperature of the surface of the carrier 120 and the temperature of the water inlet of the cooler 130 is too large. The reason for this situation is that the amount of coolant input is large, so that the heat absorbed by the coolant per unit volume is small, and then the temperature of the coolant after passing through the pipe of the carrier 120 is small, which eventually leads to a large difference between the two. The more the amount of coolant discharged from the water outlet of the cooler 130, the more energy it consumes. Therefore, in this case, the control device 110 will control the cooler 130 to reduce the amount of water at the water outlet, thereby reducing the amount of water input to the carrier 120, so as to achieve the purpose of saving energy.

[0052] It should be noted that, in order to facilitate the control of the water volume at the water outlet of the cooling machine 130, an electronic valve may be provided at the water outlet of the cooling machine 130, and the electronic valve is electrically connected to the control device 110. The control device 110 can adjust the water volume at the water outlet of the cooling machine 130 by controlling the opening and closing degree of the electronic valve. For example, when it is necessary to reduce the water volume at the water outlet, the control device 110 may reduce the opening and closing degree of the electronic valve, so that the amount of coolant discharged through the water outlet of the cooling machine 130 per unit time is reduced.

[0053] When the difference between the first temperature and the second temperature is less than the second threshold, it means that the difference between the temperature of the surface of the carrier 120 and the temperature of the water inlet of the cooling machine 130 is too small. The reason for this situation is that the amount of water input to the coolant is small, so that the coolant absorbs more heat per unit volume, and then the temperature of the coolant after passing through the pipe of the carrier 120 is greatly increased, and finally the difference between the two is large. When the amount of water input to the pipe of the carrier 120 is too small, the heat transfer will be inhibited due to the small temperature difference between the coolant and the carrier 120, which may cause the heat of the chip to be cooled on the carrier 120 to not be completely dissipated. For example, the chip to be cooled needs to dissipate 100KJ of heat, but due to the small amount of coolant, it can only absorb 80KJ of heat, which will cause the required heat dissipation of the chip to be cooled to remain, which is not conducive to the preparation of the chip. Therefore, in this case, the control device 110 will control the cooling machine 130 to increase the amount of water at the water outlet, thereby increasing the amount of water input to the carrier 120.

[0054] Since a chip needs to be placed on the carrier 120, if the first temperature sensor 140 is directly installed on the surface of the carrier 120, it will be inconvenient to place the chip. In view of this, the first temperature sensor 140 provided in the present application can be an infrared temperature sensor, which can be installed above the carrier 120 and collect the surface temperature of the carrier 120 in a non-contact manner. In addition, the second temperature sensor 150 can be an infrared temperature sensor or not. For example, the second temperature sensor 150 can be a contact temperature sensor, and the present application does not make any limitation on this.

[0055] It should be noted that the first threshold of the present application is greater than the second threshold, for example, the first threshold is 12°C and the second threshold is 10°C.

[0056] Furthermore, as another optional implementation of the present application, the temperature of the water input into the pipeline of the support platform 120 may be adjusted so that the support platform 120 can achieve a preset cooling effect.

[0057] That is, when the difference between the first temperature and the second temperature is greater than the first threshold, the control device 110 can increase the water temperature of the pipe input to the carrier platform 120, thereby increasing the water temperature at the water inlet of the cooling machine 130, and the difference between the surface temperature of the carrier platform 120 and the water temperature at the water inlet of the cooling machine 130 is within a preset range. At the same time, since the water temperature of the pipe input to the carrier platform 120 is increased, the power consumption required for refrigeration can be reduced.

[0058] When the difference between the first temperature and the second temperature is less than the second threshold, the control device 110 can reduce the water temperature of the pipe input into the support platform 120, thereby reducing the water temperature at the water inlet of the cooling machine 130. The coolant input into the pipe of the support platform 120 can absorb more heat, thereby making the difference between the surface temperature of the support platform 120 and the water temperature at the water inlet of the cooling machine 130 within a preset value.

[0059] Since the water temperature at the outlet of the cooling machine 130 is relatively constant, it is difficult to change the water temperature at the outlet of the cooling machine 130. Therefore, as an implementation method, please refer to Figure 2 The cooling system 100 also includes a coolant injection pipe 160, which is also connected to the support platform and is used to inject coolant into the support platform pipe; and the temperature of the coolant injected into the coolant injection pipe 160 is lower than the water temperature of the water inlet of the cooling machine 130. The control device 110 can adjust the injection ratio of the coolant injection pipe 160 and the cooling machine 130 to achieve the purpose of adjusting the water temperature of the input support platform 120 pipe.

[0060] It is understandable that the coolant injected into the coolant injection pipe 160 is made of the same material as the coolant discharged from the water outlet of the cooler 130. In the present application, deionized water is used. At the same time, the coolant discharged from the water outlet of the coolant injection pipe 160 and the water outlet of the cooler 130 merge at the water inlet of the support platform pipe and flow into the support platform pipe at the same time. Since the temperature of the coolant injected into the liquid injection pipe is lower than the water temperature of the water inlet of the cooler 130, when the water outlet of the coolant injection pipe 160 is different from the water outlet of the cooler 130, the temperature of the mixed coolant is also different, thereby achieving temperature regulation.

[0061] The adjustment method can be:

[0062] When the difference between the first temperature and the second temperature is greater than the first threshold, the control device 110 controls to increase the water volume ratio of the water outlet of the cooling machine 130, and reduce the proportion of the coolant injected into the coolant injection pipe 160. When the difference between the first temperature and the second temperature is less than the second threshold, the control device 110 is used to reduce the water volume ratio of the water outlet of the cooling machine 130, and increase the water volume ratio injected into the coolant injection pipe 160.

[0063] In order to facilitate the temperature regulation of the coolant, an electronic valve is also provided at the water outlet of the coolant injection pipe 160, and the electronic valve is also electrically connected to the control device 110, so that the opening and closing degrees of the electronic valves of the coolant injection pipe 160 and the cooling machine 130 can be simultaneously controlled by the control device 110.

[0064] For example, when the difference between the first temperature and the second temperature is greater than the first threshold, it means that the water temperature of the input support platform 120 pipeline needs to be increased. At this time, it is necessary to increase the opening degree of the electronic valve of the cooling machine 130 and reduce the opening degree of the electronic valve of the coolant injection pipeline 160. For example, the current opening degree of the electronic valve of the cooling machine 130 is 0.5, and the opening degree of the electronic valve of the coolant injection pipeline 160 is also 0.5. The control device 110 can adjust the opening degree of the electronic valve of the cooling machine 130 to 0.7, and adjust the opening degree of the electronic valve of the coolant injection pipeline 160 to 0.3.

[0065] When the difference between the first temperature and the second temperature is less than the second threshold, it means that the water temperature of the input support platform 120 pipeline needs to be lowered. At this time, it is necessary to reduce the opening and closing degree of the electronic valve of the cooling machine 130 and increase the opening and closing degree of the electronic valve of the coolant injection pipeline 160. For example, the current opening and closing degree of the electronic valve of the cooling machine 130 is 0.5, and the opening and closing degree of the electronic valve of the coolant injection pipeline 160 is also 0.5. The control device 110 can adjust the opening and closing degree of the electronic valve of the cooling machine 130 to 0.3, and adjust the opening and closing degree of the electronic valve of the coolant injection pipeline 160 to 0.7.

[0066] It should be noted that, since a passage has been formed between the cooling machine 130 and the pipeline of the carrier platform 120, when the coolant is introduced into the injection pipeline 160, the amount of coolant in the passage will actually increase, resulting in an imbalance in the amount of coolant in the passage between the cooling machine 130 and the pipeline of the carrier platform 120. Therefore, in the present application, the water inlet of the cooling machine 130 is also provided with an electronic valve, which is electrically connected to the control device 110, and the water outlet of the pipeline of the carrier platform 120 is also connected to the coolant output pipeline 170, so that the coolant passing through the pipeline of the carrier platform 120 is divided through the water inlet of the cooling machine 130 and the coolant output pipeline 170 after the temperature is increased, so that a part of the coolant returns to the cooling machine 130 to continue cooling, and the other part of the coolant is discharged through the coolant output pipeline 170, so as to maintain the balance of the coolant in the passage between the carrier platform 120 and the cooling machine 130.

[0067] In order to more accurately achieve the regulation of the amount of coolant entering the cooler 130, as an optional implementation method, the water inlet and the water outlet of the cooler 130 are both provided with flow meters, and the control device 110 can adjust the water amount at the water inlet of the cooler 130 according to the water amount obtained at the water outlet of the cooler 130, so that the water amount at the water inlet and the water outlet of the cooler 130 are equal.

[0068] And, as an implementation, see Figure 3 The control device 110 includes a host computer 111 and a temperature comparison control device 112. The host computer 111 is electrically connected to the first temperature sensor 140, the second temperature sensor 150 and the temperature comparison control device 112 respectively. The temperature comparison control device 112 is also electrically connected to the cooler 130. The host computer 111 is used to obtain the first temperature and the second temperature transmitted by the first temperature sensor 140 and the second temperature sensor 150, and transmit the first temperature and the second temperature to the temperature comparison control device 112. The temperature comparison control device 112 is used to adjust the water volume or water temperature at the water outlet of the cooler 130 according to the difference between the first temperature and the second temperature.

[0069] Second embodiment

[0070] Based on the first embodiment, the present application also provides a cooling system control method, see Figure 4 , the method comprising:

[0071] S102, obtaining a first temperature of a carrier platform and a second temperature of a water inlet of a cooling machine, wherein the carrier platform is used to place a chip to be cooled.

[0072] S104, adjusting the amount of water delivered from the cooling machine water outlet to the supporting platform according to the first temperature and the second temperature.

[0073] Among them, see Figure 5 , S104 includes:

[0074] S1041, determine whether the difference between the first temperature and the second temperature is greater than a first threshold, wherein the first threshold is greater than the second threshold. If yes, execute S1042; if no, execute S1043.

[0075] S1042, reducing the amount of water at the cooling machine outlet to reduce the amount of water input to the support platform.

[0076] S1043, determine whether the difference between the first temperature and the second temperature is less than a second threshold, if yes, execute S1044, if no, execute S1045.

[0077] S1044, increase the amount of water at the cooling machine outlet to increase the amount of water input to the support platform.

[0078] S1055, run according to current parameters.

[0079] It can be understood that during the operation of the cooling system, the control device can obtain the first temperature of the support platform collected by the first temperature sensor in real time, and can also obtain the second temperature at the water inlet of the cooling machine collected by the second temperature sensor in real time. By calculating the difference, the amount of water input to the support platform is adjusted in real time, so that the support platform reaches the preset temperature after heat dissipation.

[0080] As an implementation, see Figure 6 After S102, the method may include:

[0081] S106, adjusting the temperature of the water input into the support platform pipeline according to the first temperature and the second temperature.

[0082] When the difference between the first temperature and the second temperature is greater than a first threshold, the water temperature of the input support platform pipeline is increased; when the difference between the first temperature and the second temperature is less than a second threshold, the water temperature of the input support platform pipeline is reduced.

[0083] For example, when the water temperature of the input pipe of the support platform is 10°C, the temperature of the surface of the support platform is 50°C, and the temperature of the water inlet of the cooler is 35°C, the difference between the temperature of the water inlet of the cooler and the surface temperature of the support platform is large, indicating that in this application scenario, the temperature of the coolant input into the pipe of the support platform is low, resulting in energy waste. The water temperature of the input pipe of the support platform should be appropriately increased, such as increasing the water temperature of the input pipe of the support platform to 15°C.

[0084] When the water temperature of the input carrier platform pipeline is 10°C, the temperature of the carrier platform surface is 50°C, and the temperature of the cooler water inlet is 45°C, the difference between the temperature of the cooler water inlet and the carrier platform surface temperature is small, indicating that in this application scenario, the temperature of the coolant input into the carrier platform pipeline is relatively high, and the heat generated by the chip to be cooled during the ion implantation process may not be completely dissipated through heat transfer. The water temperature of the input carrier platform pipeline should be appropriately lowered, such as lowering the water temperature of the input carrier platform pipeline to 5°C.

[0085] As an optional implementation, the cooling system further includes a coolant injection pipe, which is connected to the carrier platform and is used to inject coolant into the carrier platform pipe, and the temperature of the coolant injected into the coolant injection pipe is lower than the water temperature of the water inlet of the cooling machine. Figure 7 , S106 includes:

[0086] S1061, determine whether the difference between the first temperature and the second temperature is greater than a first threshold, wherein the first threshold is greater than the second threshold. If yes, execute S1062; if no, execute S1063.

[0087] S1062, increasing the water volume ratio at the cooling machine water outlet and reducing the ratio of coolant injected into the coolant injection pipe.

[0088] S1063, determine whether the difference between the first temperature and the second temperature is less than a second threshold, if yes, execute S1064, if no, execute S1065.

[0089] S1064, reducing the water volume ratio at the cooling machine outlet and increasing the ratio of the coolant injected into the coolant injection pipe.

[0090] S1065, run according to current parameters.

[0091] In order to make the water volume at the water inlet and outlet of the cooling machine equal, flow meters are installed at both the water inlet and outlet of the cooling machine. Figure 8 , S106 also includes:

[0092] S1066, respectively obtain the flow values ​​of the water inlet and outlet of the cooling machine.

[0093] S1067, adjusting the water volume of the water inlet of the cooling machine so that the water volume of the water inlet of the cooling machine is equal to the water volume of the water outlet of the cooling machine.

[0094] By adjusting the water volume at the water inlet of the cooler to be equal to the water volume at the water outlet of the cooler, it is possible to ensure that the coolant in the cooler and the support platform pipeline is always balanced during the operation of the cooling system, which is beneficial to the normal operation of the cooling system.

[0095] It should be noted that there is no order of precedence between S1066-S1067 and S1061-S1065.

[0096] In summary, the embodiment of the present application provides a cooling system and a control method thereof, the cooling system includes a control device, a carrier platform, and a cooling machine connected to the carrier platform pipeline through a water inlet and a water outlet, a first temperature sensor is provided on the carrier platform to collect the first temperature of the carrier platform, a second temperature sensor is provided at the water inlet of the cooling machine to collect the second temperature of the water inlet of the cooling machine, the carrier platform is used to place the chip to be cooled, the first temperature sensor, the second temperature sensor and the cooling machine are all electrically connected to the control device; the control device is used to adjust the water volume at the water outlet of the cooling machine according to the first temperature and the second temperature obtained. Since the control device in the present application can adjust the water volume at the water outlet of the cooling machine according to the first temperature and the second temperature, and the water volume is related to the heat dissipation effect of the carrier platform, that is, when the water volume is large, the heat dissipation capacity of the carrier platform is better, and when the water volume is small, the heat dissipation capacity of the carrier platform is poor. Therefore, by adjusting the water volume at the water outlet of the cooling machine, the heat dissipation capacity of the carrier platform can be adjusted, and then the carrier platform reaches the preset temperature.

[0097] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0098] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A cooling system, characterized in that: The invention comprises a control device, a carrier platform and a cooling machine connected to the carrier platform through a water inlet and a water outlet, wherein a first temperature sensor is arranged on the carrier platform to collect a first temperature of the carrier platform, a second temperature sensor is arranged at the water inlet of the cooling machine to collect a second temperature of the water inlet of the cooling machine, the carrier platform is used to place a chip to be cooled, and the first temperature sensor, the second temperature sensor and the cooling machine are all electrically connected to the control device; The control device is used to adjust the water volume of the cooling machine water outlet according to the first temperature and the second temperature obtained; The first temperature sensor is used to collect the first temperature of the surface of the support platform, and the control device is used to adjust the water volume of the cooling machine outlet according to the difference between the first temperature and the second temperature; wherein, When the difference between the first temperature and the second temperature is greater than a first threshold, the control device is used to reduce the amount of water at the water outlet of the cooling machine to reduce the amount of water input to the supporting platform; When the difference between the first temperature and the second temperature is less than a second threshold, the control device is used to increase the water volume of the cooling machine outlet to increase the water volume input to the support platform, wherein the first threshold is greater than the second threshold.

2. The cooling system according to claim 1, characterized in that The first temperature sensor is used to collect the first temperature of the surface of the support platform, and the control device is also used to adjust the water temperature input into the pipeline of the support platform according to the first temperature and the second temperature obtained; wherein, When the difference between the first temperature and the second temperature is greater than a first threshold, the control device is used to increase the temperature of water input into the pipeline of the support platform; When the difference between the first temperature and the second temperature is less than a second threshold, the control device is used to reduce the temperature of water input into the support platform pipeline; wherein the first threshold is greater than the second threshold.

3. The cooling system according to claim 2, characterized in that The cooling system further comprises a coolant injection pipeline, which is also connected to the carrier platform and is used to inject coolant into the carrier platform pipeline; and the temperature of the coolant injected into the coolant injection pipeline is lower than the water temperature of the water inlet of the cooling machine; The control device is used to adjust the injection ratio of the coolant injection pipeline and the cooling machine water inlet.

4. The cooling system according to claim 3, characterized in that The water inlet and outlet of the cooler are both provided with flow meters, and the control device is also used to adjust the water volume at the water inlet of the cooler according to the water volume at the water outlet of the cooler so that the water volume at the water inlet and water outlet of the cooler are equal.

5. The cooling system according to claim 1, characterized in that: The control device includes a host computer and a temperature comparison control device, the host computer is electrically connected to the first temperature sensor, the second temperature sensor and the temperature comparison control device respectively, and the temperature comparison control device is also electrically connected to the cooler; the host computer is used to obtain the first temperature and the second temperature transmitted by the first temperature sensor and the second temperature sensor, and transmit the first temperature and the second temperature to the temperature comparison control device, and the temperature comparison control device is used to adjust the water volume at the water outlet of the cooler according to the difference between the first temperature and the second temperature.

6. A cooling system control method, characterized in that: include: Acquire a first temperature of a carrier platform and a second temperature of a water inlet of a cooling machine, wherein the carrier platform is used to place a chip to be cooled; When the difference between the first temperature and the second temperature is greater than a first threshold, increasing the temperature of water input into the pipeline of the supporting platform; When the difference between the first temperature and the second temperature is less than a second threshold, lowering the temperature of water input into the pipeline of the supporting platform; The amount of water delivered to the supporting platform from the water outlet of the cooling machine is adjusted according to the first temperature and the second temperature.

7. The cooling system control method according to claim 6, characterized in that: The step of adjusting the amount of water delivered from the cooling machine outlet to the supporting platform according to the first temperature and the second temperature comprises: When the difference between the first temperature and the second temperature is greater than a first threshold, reducing the amount of water at the water outlet of the cooling machine to reduce the amount of water input to the supporting platform; When the difference between the first temperature and the second temperature is less than a second threshold, the amount of water at the water outlet of the cooling machine is increased to increase the amount of water input to the supporting platform, wherein the first threshold is greater than the second threshold.

8. The cooling system control method according to claim 6, characterized in that: Increasing the temperature of water input into the support platform pipeline includes: Increase the water volume ratio of the cooling machine water outlet and reduce the proportion of coolant injected into the coolant injection pipe; The step of lowering the temperature of water input into the support platform pipeline comprises: Reduce the proportion of water volume at the water outlet of the cooling machine and increase the proportion of coolant injected by the coolant injection pipe; wherein the coolant injection pipe is connected to the support platform and is used to inject coolant into the support platform pipe, and the temperature of the coolant injected by the coolant injection pipe is lower than the water temperature of the water inlet of the cooling machine.

9. The cooling system control method according to claim 6, characterized in that: The water inlet and the water outlet of the cooling machine are both provided with flow meters, and the method further comprises: Respectively obtain the flow values ​​of the water inlet and the water outlet of the cooling machine; The water volume of the water inlet of the cooling machine is adjusted so that the water volume of the water inlet of the cooling machine is equal to the water volume of the water outlet of the cooling machine.

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