Semiconductor process equipment

Abstract

The present invention discloses a semiconductor process equipment, including a loading chamber and a sealing device, wherein the chamber wall of the loading chamber has an opening, the sealing device is used to seal the opening, and the sealing device includes a sealing door assembly, a support frame, a first driving mechanism and a second driving mechanism, wherein: the support frame is arranged on the sealing door assembly, the second driving mechanism is arranged on the support frame and connected to the sealing door assembly, the distance between the second driving mechanism and the sealing door assembly is adjustable, and the sealing door assembly is adjusted by adjusting the distance between the second driving mechanism and the sealing door assembly to adjust the parallelism with the support frame; when the sealing door assembly is opposite to the opening, the second driving mechanism is used to drive the sealing door assembly away from the support frame so that the sealing door assembly presses the chamber wall. The above scheme can solve the problem of poor sealing reliability when the sealing door assembly seals the opening.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a semiconductor process equipment. Background Art

[0002] As a precision component, the production process of semiconductor devices has very high requirements on the environment. Therefore, semiconductor devices need to be processed in the chamber of semiconductor equipment with a special environment.

[0003] The chamber wall of the semiconductor equipment is usually provided with an opening for semiconductor devices to enter and exit the chamber. During the process of processing the semiconductor devices in the chamber, the sealing door assembly needs to seal the opening of the chamber to meet the environmental requirements in the chamber. When the sealing door assembly seals the opening, it is necessary to adjust the parallelism between the sealing door assembly and the chamber wall so that the sealing door assembly can seal the opening well. Since it is necessary to perform complex adjustments after the sealing door assembly is pressed against the chamber wall where the opening is located when adjusting the parallelism between the sealing door assembly and the chamber wall, this adjustment method requires repeated adjustments to achieve a sealing effect, and there is a problem of poor sealing reliability. Summary of the invention

[0004] The invention discloses a semiconductor process equipment to solve the problem of poor sealing reliability when a sealing door assembly seals an opening.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] The present invention discloses a semiconductor process equipment, comprising a loading chamber and a sealing device, wherein the chamber wall of the loading chamber has an opening, the sealing device is used to seal the opening, and the sealing device comprises a sealing door assembly, a support frame, a first driving mechanism and a second driving mechanism, wherein:

[0007] The support frame is arranged on the sealing door assembly, and the first driving mechanism is connected to the support frame and is used to drive the support frame to move, so that the support frame drives the sealing door assembly to move to a position opposite to or offset from the opening;

[0008] The second driving mechanism is disposed on the support frame and connected to the sealing door assembly. The distance between the second driving mechanism and the sealing door assembly is adjustable. The sealing door assembly adjusts its parallelism with the support frame by adjusting the distance between the second driving mechanism and the sealing door assembly.

[0009] When the sealing door assembly is opposite to the opening, the second driving mechanism is used to drive the sealing door assembly away from the supporting frame so that the sealing door assembly is pressed against the chamber wall.

[0010] The technical solution adopted by the present invention can achieve the following technical effects:

[0011] The semiconductor process equipment disclosed in the present invention is provided with a first driving mechanism, and the first driving mechanism is connected to a support frame, so that the first driving mechanism can drive the support frame to move, and then the support frame can drive the sealing door assembly to move to a position opposite to or offset from the opening; because the distance between the second driving mechanism and the sealing door assembly is adjustable, when the sealing door assembly is opposite to the opening, the parallelism between the sealing door assembly and the support frame can be adjusted by adjusting the distance between the second driving mechanism and the sealing door assembly, and then the parallelism between the sealing door assembly and the chamber wall can be adjusted, so that when the sealing door assembly seals the opening, the sealing door assembly is pressed against the chamber wall, and there is good parallelism between the sealing door assembly and the chamber wall, so that the sealing door assembly has a good sealing effect on the opening, and finally effectively improves the reliability of the sealing door assembly sealing the opening; the adjustment of the parallelism between the sealing door assembly and the support frame can be carried out before the sealing door assembly seals the opening, and the adjustment method is simple, and the time required for sealing can also be effectively saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A schematic diagram of the structure of a semiconductor process equipment disclosed in an embodiment of the present invention;

[0013] Figure 2 It is a structural schematic diagram of a sealing device disclosed in an embodiment of the present invention when it is opposite to an opening at a first viewing angle;

[0014] Figure 3 It is a structural schematic diagram of a sealing device disclosed in an embodiment of the present invention when it is opposite to an opening at a second viewing angle;

[0015] Figure 4 A schematic diagram of the coordination of a second driving mechanism, a support frame and a sealing door assembly disclosed in an embodiment of the present invention;

[0016] Figure 5 A schematic diagram of the structure of a sealing ring disclosed in an embodiment of the present invention;

[0017] Figure 6 This is a schematic diagram of a sealing ring installed in a mounting groove disclosed in an embodiment of the present invention.

[0018] Description of reference numerals:

[0019] 100-loading chamber, 110-chamber wall,

[0020] 200-sealed door assembly, 210-door plate, 211-mounting groove, 220-sealing ring, 221 mounting portion, 222-sealing portion, 230-boss,

[0021] 300-support frame, 310-sliding block,

[0022] 400- first driving mechanism,

[0023] 500-second driving mechanism, 510-cylinder body, 520-piston rod, 521-first limiting nut, 522-second limiting nut,

[0024] 600-door frame, 610-sliding shaft, 620-fixed beam. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] Please refer to Figures 1 to 6 The embodiment of the present invention discloses a semiconductor process equipment, and the disclosed semiconductor process equipment includes a loading chamber 100 and a sealing device. The loading chamber 100 is a place for processing semiconductor devices. The chamber wall 110 of the loading chamber 100 has an opening, and the opening is used for the semiconductor device to enter and exit the loading chamber 100. The sealing device is used to seal the opening to separate the environment in the loading chamber 100 from the external environment, and ensure that the environment in the loading chamber 100 is isolated and sealed.

[0028] The sealing device includes a sealing door assembly 200, a support frame 300, a first driving mechanism 400 and a second driving mechanism 500. The sealing door assembly 200 is the main body of the sealing opening, and the support frame 300 is arranged on the sealing door assembly 200. The support frame 300 can be arranged at the edge of the sealing door assembly 200. The support frame 300 should have a certain strength and a structure that is not easily deformed after being subjected to force. For example, the support frame 300 can be an angle iron structure, and the support frame 300 can be arranged along the edge of the sealing door assembly 200 to form a closed frame structure.

[0029] The first driving mechanism 400 is connected to the support frame 300, and is used to drive the support frame 300 to move, so that the support frame 300 drives the sealing door assembly 200 to move to a position opposite to or dislocated from the opening. The first driving mechanism 400 can be fixedly connected to the chamber wall 110. The first driving mechanism 400 can be used to support the support frame 300 and the sealing door assembly 200, and is also a structure that drives the support frame 300 to move. The first driving mechanism 400 can also be connected to other components of the sealing device. For example, the sealing device includes a door frame 600, and the first driving mechanism 400 is arranged on the door frame 600. Specifically, the first driving mechanism 400 can be a hydraulic telescopic component, a pneumatic telescopic component, a shape memory alloy, etc., and there is no specific limitation on the first driving mechanism 400.

[0030] The second driving mechanism 500 is provided on the support frame 300 and is connected to the sealing door assembly 200. The second driving mechanism 500 may be fixedly connected to the support frame 300, and the sealing door assembly 200 may be connected to the support frame 300 through the second driving mechanism 500, so that the movement of the support frame 300 can drive the sealing door assembly 200 to move. Of course, the support frame 300 can be directly connected to the sealing door assembly 200, for example, the four corners of the support frame 300 can be provided with pillars, and the pillars can connect the sealing door assembly 200 and the support frame 300, so that the movement of the support frame 300 can drive the sealing door assembly 200 to move.

[0031] The distance between the second driving mechanism 500 and the sealing door assembly 200 is adjustable. The sealing door assembly 200 can adjust the parallelism with the support frame 300 by adjusting the distance between the second driving mechanism 500 and the sealing door assembly 200. When the sealing door assembly 200 is pressed against the chamber wall 110, the support frame 300 and the chamber wall 110 have good parallelism. By adjusting the parallelism of the sealing door assembly 200 relative to the support frame 300, when the sealing door assembly 200 is pressed against the chamber wall 110, the sealing door assembly 200 and the chamber wall 110 also have good parallelism. The parallelism between the support frame 300 and the sealing door assembly 200 can be adjusted by adjusting the distance between the second driving mechanism 500 and the sealing door assembly 200. The second driving mechanism 500 is provided on the support frame 300, thereby indirectly adjusting the distance between the sealing door assembly 200 and the support frame 300 at the second driving mechanism 500. The parallelism between the sealing door assembly 200 and the support frame 300 can be adjusted by adjusting the distance. Specifically, the sealing door assembly 200 may be provided with a groove, and a plurality of spaced mounting holes are provided on two opposite side walls of the groove. The connection between the second driving mechanism 500 and the sealing door assembly 200 may be a clip structure, and the clip structure may cooperate with the mounting holes on the two opposite side walls of the groove to connect the second driving mechanism 500 with the sealing door assembly 200. By cooperating between the clip structure and different spaced mounting holes, the spacing between the second driving mechanism 500 and the sealing door assembly 200 may be changed. Of course, the second driving mechanism 500 and the sealing door assembly 200 may be connected by a telescopic member, and the distance between the second driving mechanism 500 and the sealing door assembly 200 may be changed by the telescopic member. The second driving mechanism 500 may be a hydraulic telescopic member, a pneumatic telescopic member, a shape memory alloy, etc., and the second driving mechanism 500 is not specifically limited here.

[0032] When the sealing door assembly 200 needs to seal the opening, the first driving mechanism 400 drives the sealing door assembly 200 to move to a position opposite to the opening; when the sealing door assembly 200 is opposite to the opening, the second driving mechanism 500 drives the sealing door assembly 200 away from the support frame 300, so that the sealing door assembly 200 presses the chamber wall 110 to seal the opening.

[0033] When the sealing door assembly 200 needs to open an opening, the second driving mechanism 500 can drive the sealing door assembly 200 away from the opening and close to the support frame 300, and the first driving mechanism 400 drives the sealing door assembly 200 to move to a position misaligned with the opening.

[0034] In a specific implementation process, the support frame 300 is arranged at the edge of the sealing door assembly 200, the first driving mechanism 400 is connected to the support frame 300, and is used to drive the support frame 300 to move, so that the support frame 300 drives the sealing door assembly 200 to move to a position opposite to or offset from the opening, the second driving mechanism 500 is arranged on the support frame 300, and is connected to the sealing door assembly 200, the spacing between the second driving mechanism 500 and the sealing door assembly 200 is adjustable, and the sealing door assembly 200 adjusts the parallelism between the sealing door assembly 200 and the support frame 300 by adjusting the spacing between the second driving mechanism 500 and the sealing door assembly 200; when the sealing door assembly 200 is opposite to the opening, the second driving mechanism 500 drives the sealing door assembly 200 away from the support frame 300, so that the sealing door assembly 200 presses the chamber wall 110 to seal the opening.

[0035] In the embodiment of the semiconductor process equipment disclosed in the present invention, the support frame 300 is arranged at the edge of the sealing door assembly 200, so that the second driving mechanism 500 is arranged on the support frame 300 and connected to the sealing door assembly 200. The support frame 300 is only arranged at the edge of the sealing door, which can reduce the overall weight of the sealing device and save costs; by setting the first driving mechanism 400, the first driving mechanism 400 is connected to the support frame 300, so that the first driving mechanism 400 can drive the support frame 300 to move, and then the support frame 300 can drive the sealing door assembly 200 to move to a position opposite to or offset from the opening; because the distance between the second driving mechanism 500 and the sealing door assembly 200 is adjustable, when the sealing door assembly 200 is opposite to the opening, by adjusting the second driving mechanism 500 The distance between the driving mechanism 500 and the sealing door assembly 200 can adjust the parallelism between the sealing door assembly 200 and the support frame 300, and further adjust the parallelism between the sealing door assembly 200 and the chamber wall 110, so that when the sealing door assembly 200 seals the opening, the sealing door assembly 200 is pressed against the chamber wall 110, and there is good parallelism between the sealing door assembly 200 and the chamber wall 110, so that the sealing door assembly 200 has a good sealing effect on the opening, and finally effectively improves the reliability of the sealing door assembly 200 in sealing the opening; the parallelism between the sealing door assembly 200 and the support frame 300 can be adjusted before the sealing door assembly 200 seals the opening, and the adjustment method is simple, which can also effectively save the time required for sealing.

[0036] In an optional embodiment, the second driving mechanism 500 can be a fluid driving system, which includes a cylinder 510 and a piston rod 520. The support frame 300 is provided with an avoidance hole, and the piston rod 520 is partially arranged in the cylinder 510, and the end away from the cylinder 510 passes through the avoidance hole and is connected to the sealing door assembly 200, and the cylinder 510 is fixedly connected to the support frame 300. The interior of the cylinder 510 can be connected to the air source, and the piston rod 520 can be controlled to move along the cylinder 510 by controlling the pressure inside the cylinder 510. The piston rod 520 can be connected by a telescopic rod, and the distance between the sealing door assembly 200 and the cylinder 510 can be adjusted by adjusting the telescopic rod. Of course, the sealing door assembly 200 can also be provided with a mounting hole, and the end of the piston rod 520 away from the cylinder 510 is inserted into the mounting hole, and the distance between the sealing door assembly 200 and the cylinder 510 is controlled by controlling the amount of the piston rod 520 inserted into the mounting hole. The cylinder body 510 is fixedly connected to the support frame 300 , so that the parallelism between the sealing door assembly 200 and the support frame 300 can be adjusted.

[0037] The second driving mechanism 500 is set as a fluid driving system, so that when the second driving mechanism 500 drives the sealing door assembly 200 to press the chamber wall 110, it can be pressed against the chamber wall 110 smoothly, effectively avoiding excessive impact force when the sealing door assembly 200 is pressed against the chamber wall 110; the cylinder body 510 is fixed to the support frame 300, and the end of the piston rod 520 away from the cylinder body 510 is connected to the sealing door assembly 200 through the avoidance hole, so that by adjusting the distance between the cylinder body 510 and the sealing door assembly 200, the parallelism of the sealing door assembly 200 relative to the support frame 300 can be adjusted.

[0038] Further, one end of the piston rod 520 away from the cylinder body 510 is threadedly connected to the sealing door assembly 200. Specifically, an external thread is provided on the end of the piston rod 520 away from the cylinder body 510, and a threaded hole is provided at the place where the sealing door assembly 200 and the piston rod 520 are connected. The external thread of the piston rod 520 cooperates with the internal thread of the sealing door assembly 200, so that the sealing door assembly 200 and the piston rod 520 are threadedly connected; by adjusting the tightening amount of the external thread and the internal thread, the length of the piston rod 520 extending into the threaded hole can be adjusted, and then the distance between the sealing door assembly 200 and the cylinder body 510 can be adjusted. Since the cylinder body 510 is fixed to the support frame 300, the distance between the sealing door assembly 200 and the support frame 300 at the cylinder body 510 can be adjusted, so that the parallelism of the sealing door assembly 200 and the support frame 300 at the cylinder body 510 can be adjusted.

[0039] The end of the piston rod 520 away from the cylinder body 510 is threadedly connected to the sealing door assembly 200, so that the connection method is simple and the economy can be improved; by adjusting the tightening amount of the threaded fit between the piston rod 520 and the sealing door assembly 200, the distance between the sealing door assembly 200 and the cylinder body 510 can be adjusted, so that the parallelism of the sealing door assembly 200 relative to the support frame 300 can be adjusted, so that the adjustment method is relatively simple and the adjustment accuracy is relatively high.

[0040] In an optional embodiment, a boss 230 may be provided on the side of the sealing door assembly 200 opposite to the support frame 300, and the boss 230 is used to connect with the side of the piston rod 520 away from the cylinder body 510. The boss 230 is provided so that the end of the piston rod 520 away from the cylinder body 510 is connected to the boss 230, which can avoid deformation or damage of the sealing door assembly 200 at the connection. At the same time, the boss 230 can also provide a connection margin for the connection between the sealing door assembly 200 and the piston rod 520, and will not cause the problem of unstable connection due to insufficient thickness of the sealing door assembly 200.

[0041] In an optional embodiment, the piston rod 520 is provided with a first limiting nut 521 and a second limiting nut 522 at a position between the support frame 300 and the sealing door assembly 200, and the first limiting nut 521 and the second limiting nut 522 are respectively used to abut against the support frame 300 and the sealing door assembly 200. Specifically, the piston rod 520 is provided with an external thread at a position between the support frame 300 and the sealing door assembly 200, and the first limiting nut 521 and the second limiting nut 522 are respectively matched with the external thread on the piston rod 520. When adjusting the parallelism of the sealing door assembly 200 and the support frame 300, the first limiting nut 521 and the second limiting nut 522 do not abut against the support frame 300 and the sealing assembly; after adjusting the parallelism, the first limiting nut 521 and the second limiting nut 522 are respectively rotated to abut against the support frame 300 and the sealing door assembly 200, so that the relative position between the sealing door assembly 200 and the support frame 300 is fixed, which can effectively ensure that no relative movement occurs between the sealing door assembly 200 and the support frame 300 after adjusting the parallelism, thereby keeping the parallelism between the support frame 300 and the sealing door assembly 200 stable.

[0042] In an optional embodiment, there may be multiple fluid drive systems, each of which is spaced apart on the support frame 300. By providing multiple fluid drive systems, which are spaced apart on the support frame 300, the parallelism adjustment of the sealing door assembly 200 relative to the support frame 300 is made more precise, and multiple fluid drive systems simultaneously drive the sealing door assembly 200 to press the chamber wall 110 where the opening is located, so that the sealing door moves more smoothly, and the pressing force of the sealing door assembly 200 pressing the chamber wall 110 is more evenly distributed, which effectively improves the sealing performance of the sealing door assembly 200 on the opening.

[0043] In an optional embodiment, the sealing device may further include a door frame 600, which is disposed on the chamber wall 110 and surrounds the opening. The first driving mechanism 400 may be disposed on the door frame 600, and the side of the support frame 300 away from the sealing door assembly 200 is slidably connected to the door frame 600. The first driving mechanism 400 is used to drive the support frame 300 to slide along the door frame 600. A connecting protrusion may be provided on the side of the support frame 300 away from the sealing door assembly 200, and a guide rail may be provided on the door frame 600. The connecting protrusion may be connected to the guide rail and may slide relatively; of course, the support frame 300 and the door frame 600 may be connected together by a sliding member so that the support frame 300 and the door frame 600 are slidably connected.

[0044] By setting the door frame 600, the support frame 300 can stably and accurately slide to the corresponding position along the door frame 600 under the driving action of the first driving mechanism 400, so that the support frame 300 can drive the sealing door assembly 200 to move, making the movement of the sealing door assembly 200 more stable and the moving position more precise.

[0045] Further, the door frame 600 includes two sliding shafts 610 arranged opposite to each other, the extending direction of the sliding shafts 610 is consistent with the direction in which the first driving mechanism 400 drives the support frame 300 to move, and the two sides of the support frame 300 opposite to the sliding shafts 610 are provided with fixedly connected sliding blocks 310, and the sliding blocks 310 are sleeved on the sliding shafts 610. Specifically, the slider can be fixedly connected to the support frame 300, for example, the slider is welded to the support frame 300, or fixedly connected to the support frame 300 by screws. The slider has a through hole, and the slider is sleeved on the sliding shaft 610 through the through hole.

[0046] By setting a slider and a sliding shaft 610, the slider can slide along the sliding shaft 610, and then the support frame 300 can slide along the sliding shaft 610, so that the sliding of the support frame 300 along the door frame 600 can be made more stable; the cooperation between the slider structure and the sliding shaft 610 can also reduce the sliding contact area, thereby reducing the resistance of the support frame 300 when sliding along the sliding shaft 610.

[0047] Further, the door frame 600 may also include two fixed beams 620 arranged opposite to each other, the two fixed beams 620 and the two sliding shafts 610 form a frame structure, the two fixed beams 620 are fixedly connected to the chamber wall 110, and support the two sliding shafts 610, so that when the support frame 300 drives the sealing door assembly 200 to move along the sliding shaft 610, there is a gap between the chamber wall 110. The two sliding shafts 610 are supported by the two fixed beams 620, so that when the support frame 300 drives the sealing door assembly 200 to slide along the sliding shaft 610, there is a certain gap between the chamber wall 110, which effectively avoids the friction between the sealing door assembly 200 and the chamber wall 110 when the sealing door assembly 200 moves along the sliding shaft 610.

[0048] In an optional embodiment, the sealing door assembly 200 includes a door plate 210 and a sealing ring 220. The sealing ring 220 is arranged along the edge of the door plate 210. When the sealing door assembly 200 is pressed against the chamber wall 110, the sealing ring 220 is pressed between the door plate 210 and the chamber wall 110, and elastic deformation is generated to seal the opening. By providing the sealing ring 220, when the sealing door assembly 200 is pressed against the chamber wall 110, the sealing ring 220 is pressed between the door plate 210 and the chamber wall 110, and the door plate 210 and the chamber wall 110 can be effectively sealed, thereby ensuring that the interior of the loading chamber 100 is isolated from the external environment.

[0049] Further, the door panel 210 is provided with a mounting groove 211, the cross section of which is a trapezoidal structure with an opening contraction, the sealing ring 220 includes a mounting portion 221 and a sealing portion 222, the cross section of the mounting portion 221 is rectangular, the cross section of the sealing portion 222 is arc-shaped, the mounting portion 221 is used to elastically cooperate with the mounting groove 211 to prevent the mounting portion 221 from falling out of the mounting groove 211, and the sealing portion 222 is exposed in the mounting groove 211. Specifically, when the mounting portion 221 is installed in the mounting groove 211, the mounting portion 221 needs to be extruded and deformed so that the mounting portion 221 is installed in the mounting groove 211 with a contracted opening, and when the mounting portion 221 is installed in the mounting groove 211, the portion of the mounting portion 221 located in the mounting groove 211 recovers the deformation, and the mounting portion 221 located at the opening is still in an extruded state, thereby limiting the mounting portion 221 from falling out of the opening of the mounting groove 211. When the mounting portion 221 is installed in the mounting groove 211, a layer of adhesive may be provided in the mounting groove 211 to make the mounting portion 221 more firmly installed in the mounting groove 211. The sealing portion 222 is configured in an arc shape so that the arc shape forms a surface seal between the door panel 210 and the chamber wall 110 when squeezed, thereby improving the sealing effect.

[0050] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0051] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A semiconductor process equipment, characterized in that: The invention comprises a loading chamber (100) and a sealing device, wherein a chamber wall (110) of the loading chamber (100) is provided with an opening, and the sealing device is used to seal the opening, and the sealing device comprises a sealing door assembly (200), a support frame (300), a first driving mechanism (400) and a second driving mechanism (500), wherein: The support frame (300) is arranged on the sealing door assembly (200), and the first driving mechanism (400) is connected to the support frame (300) and is used to drive the support frame (300) to move, so that the support frame (300) drives the sealing door assembly (200) to move to a position opposite to or offset from the opening; The second driving mechanism (500) is arranged on the support frame (300) and is connected to the sealing door assembly (200); the second driving mechanism (500) indirectly adjusts the distance between the sealing door assembly (200) and the support frame (300) at the second driving mechanism (500) to adjust the parallelism between the sealing door assembly (200) and the support frame (300), thereby adjusting the parallelism between the sealing door assembly (200) and the chamber wall (110); When the sealing door assembly (200) is opposite to the opening, the second driving mechanism (500) is used to drive the sealing door assembly (200) away from the support frame (300) so that the sealing door assembly (200) is pressed against the chamber wall (110).

2. The semiconductor process equipment according to claim 1, characterized in that: The second driving mechanism (500) is a fluid driving system, which includes a cylinder body (510) and a piston rod (520). The support frame (300) is provided with an avoidance hole. The piston rod (520) is partially arranged in the cylinder body (510), and one end away from the cylinder body (510) passes through the avoidance hole and is connected to the sealing door assembly (200). The cylinder body (510) is fixedly connected to the support frame (300).

3. The semiconductor process equipment according to claim 2, characterized in that: One end of the piston rod (520) away from the cylinder body (510) is threadedly connected to the sealing door assembly (200).

4. The semiconductor process equipment according to claim 2, characterized in that: A boss (230) is provided on the side of the sealing door assembly (200) opposite to the support frame (300), and the boss (230) is used to connect with the side of the piston rod (520) away from the cylinder body (510).

5. The semiconductor process equipment according to claim 2, characterized in that: The piston rod (520) is sleeved with a first limiting nut (521) and a second limiting nut (522) at a position between the support frame (300) and the sealing door assembly (200), and the first limiting nut (521) and the second limiting nut (522) are used to abut against the support frame (300) and the sealing door assembly (200), respectively.

6. The semiconductor process equipment according to claim 2, characterized in that: There are a plurality of fluid drive systems, and the plurality of fluid drive systems are arranged at intervals on the support frame (300).

7. The semiconductor process equipment according to claim 1, characterized in that: The sealing device further comprises a door frame (600), wherein the door frame (600) is arranged on the chamber wall (110) and surrounds the opening, wherein the first driving mechanism (400) is arranged on the door frame (600), and the side of the support frame (300) facing away from the sealing door assembly (200) is slidably connected to the door frame (600), and the first driving mechanism (400) is used for driving the support frame (300) to slide along the door frame (600).

8. The semiconductor process equipment according to claim 7, characterized in that: The door frame (600) includes two sliding shafts (610) arranged opposite to each other, the extension direction of the sliding shaft (610) is consistent with the direction in which the first driving mechanism (400) drives the support frame (300) to move, and the two sides of the support frame (300) opposite to the sliding shaft (610) are provided with fixedly connected sliding blocks (310), and the sliding blocks (310) are sleeved on the sliding shaft (610).

9. The semiconductor process equipment according to claim 8, characterized in that: The door frame (600) further comprises two fixed beams (620) arranged opposite to each other, wherein the two fixed beams (620) and the two sliding shafts (610) form a frame structure, and the two fixed beams (620) are fixedly connected to the chamber wall (110) and support the two sliding shafts (610) so that the support frame (300) drives the sealing door assembly (200) to have a gap with the chamber wall (110) when moving along the sliding shaft (610).

10. The semiconductor process equipment according to claim 1, characterized in that: The sealing door assembly (200) comprises a door plate (210) and a sealing ring (220), wherein the sealing ring (220) is arranged along the edge of the door plate (210), and when the sealing door assembly (200) is pressed against the chamber wall (110), the sealing ring (220) is pressed between the door plate (210) and the chamber wall (110), and generates elastic deformation to seal the opening.

11. The semiconductor process equipment according to claim 10, characterized in that: The door panel (210) is provided with a mounting groove (211), the cross section of which is an open and contracted trapezoidal structure; the sealing ring (220) comprises a mounting portion (221) and a sealing portion (222); the cross section of the mounting portion (221) is rectangular, the cross section of the sealing portion (222) is arc-shaped, the mounting portion (221) is used to elastically cooperate with the mounting groove (211) to prevent the mounting portion (221) from falling out of the mounting groove (211), and the sealing portion (222) is exposed outside the mounting groove (211).

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