Antenna stacking structure

Abstract

An antenna stack structure according to an embodiment of the present invention includes: an antenna substrate layer; an antenna element disposed on the top surface of the antenna substrate layer, the antenna element including a radiation pattern and an antenna pad; and a display panel including a ground element disposed on the bottom surface of the antenna substrate layer. The antenna pad is superimposed on the ground element in a plan view. The antenna pad can be used to improve signal and radiation characteristics.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2020-0092535 filed on July 24, 2020, in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to an antenna laminate structure, and more particularly to an antenna laminate structure comprising an antenna layer and a ground layer. Background Art

[0004] With the development of mobile communication technology, antennas for implementing high-frequency band or ultra-high-frequency band communications are applied to display devices such as smartphones, various objects or structures such as vehicles and buildings, and the like.

[0005] The display device may include optical structures such as polarizing plates and various sensor structures. Therefore, when the display device includes an antenna, the antenna needs to be properly arranged and constructed to avoid interference between the optical structure and the sensor structure.

[0006] In addition, the space where the antenna can be applied may be limited by the optical structure and the sensor structure. If an additional film or structure is formed for inserting the antenna, the overall thickness and volume of the display device may increase.

[0007] Therefore, there is a need for an antenna structure that can achieve sufficient radiation and gain characteristics of the antenna within a limited space.

[0008] For example, Korean Patent Application Publication No. 10-2013-0113222 discloses an antenna structure embedded in a portable terminal, but does not fully disclose an antenna design considering optical and radiation characteristics in the above-mentioned display device. Summary of the Invention

[0009] According to one aspect of the present invention, there is provided an antenna stack structure having improved radiation characteristics.

[0010] (1) An antenna stack structure comprising: an antenna substrate layer; an antenna unit disposed on a top surface of the antenna substrate layer, the antenna unit comprising a radiation pattern and an antenna pad; and a display panel comprising a ground element disposed on a bottom surface of the antenna substrate layer, wherein the antenna pad is superimposed on the ground element in a plan view.

[0011] (2) The antenna stack structure according to (1) above, wherein the display panel has a display area and a non-display area, and the ground element is provided in the non-display area.

[0012] (3) The antenna stack structure according to (2) above, wherein the display panel includes a TFT electrode and a display device provided in a display region.

[0013] (4) The antenna stack structure according to (3) above, wherein the TFT electrode of the display panel includes an extension portion extending to the non-display area, and the extension portion of the TFT electrode serves as a ground element.

[0014] (5) The antenna stack structure according to (3) above, wherein the display panel further includes a bus bar connected to the TFT electrode and provided in the non-display area, and the bus bar serves as a ground element.

[0015] (6) The antenna stack structure according to (3) above, wherein the display panel includes a ground structure provided at the same layer as the display device in the non-display area, and the ground structure serves as the ground element.

[0016] (7) The antenna stack structure according to (3) above, wherein the display device serves as a ground portion of the antenna unit.

[0017] (8) The antenna laminate structure according to (1) above, wherein the antenna substrate layer comprises glass or an optical film.

[0018] (9) The antenna stack structure according to (8) above, wherein the optical film includes a polarizing plate.

[0019] (10) The antenna stack structure according to (1) above, further comprising a cover window provided on the top surface of the antenna unit.

[0020] (11) The antenna stack structure according to (10) above further includes a polarizing plate disposed between the cover window and the antenna unit.

[0021] (12) The antenna stack structure according to (1) above, further comprising a touch sensing structure provided on the top surface of the display panel.

[0022] (13) The antenna stack structure according to (1) above, wherein the antenna pad includes a signal pad connected to the radiation pattern and a ground pad formed around the signal pad.

[0023] (14) The antenna stack structure according to (1) above, wherein the radiation pattern has a mesh structure.

[0024] (15) The antenna stack structure according to (14) above, wherein the antenna unit further includes a dummy mesh pattern arranged around the radiation pattern.

[0025] The antenna stack structure according to an embodiment of the present invention may include a display panel including a ground element overlapping an antenna pad in a plan view. The antenna pad may be used to match the resonant frequency and optimize the impedance, thereby improving the gain and radiation characteristics of the antenna.

[0026] In some embodiments, the electrode layer of the display panel can serve as a radiation ground, and an antenna stack structure integrated with the display panel can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic top plan view illustrating an antenna stack structure according to an exemplary embodiment.

[0028] Figure 2 is a schematic cross-sectional view illustrating a laminated structure of an antenna according to an exemplary embodiment.

[0029] Figure 3 is a schematic cross-sectional view illustrating a laminated structure of an antenna according to an exemplary embodiment.

[0030] Figure 4 is a schematic cross-sectional view illustrating a display panel according to an exemplary embodiment.

[0031] Figure 5 is a schematic top plan view illustrating an antenna stack structure according to an exemplary embodiment.

[0032] Figure 6 is a schematic cross-sectional view illustrating a laminated structure of an antenna according to an exemplary embodiment. DETAILED DESCRIPTION

[0033] According to an exemplary embodiment of the present invention, there is provided an antenna stack structure in which a pad of an antenna unit and a ground element of a display panel may overlap each other in a plan view.

[0034] The antenna stack structure may include, for example, a microstrip patch antenna fabricated in the form of a transparent film. The antenna stack structure may be applied to communication devices such as high-frequency or ultra-high-frequency mobile communications corresponding to 3G, 4G, 5G, or higher mobile communications, Wi-Fi, Bluetooth, NFC, and GPS.

[0035] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art should understand that these embodiments described with reference to the accompanying drawings are provided to further understand the spirit of the present invention and are not intended to limit the subject matter disclosed in the detailed description and the appended claims.

[0036] Figure 1 is a schematic top plan view illustrating an antenna stack structure according to an exemplary embodiment. Figure 2is a schematic cross-sectional view illustrating a laminated structure of an antenna according to an exemplary embodiment. Figure 2 Only one antenna unit is shown, but a plurality of antenna units may be provided in an array on the antenna substrate layer 110 .

[0037] Reference Figure 1 and Figure 2 The antenna stack structure 10 may include an antenna substrate layer 110 , an antenna unit 120 and a display panel 200 .

[0038] The antenna substrate layer 110 may be disposed between the antenna unit 120 and the display panel 200 to serve as a dielectric layer of the antenna.

[0039] The antenna substrate layer 110 may include, for example, a transparent resin material. For example, the antenna substrate layer 110 may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, cycloolefin or polyolefin having a norbornene structure, and ethylene-propylene copolymer; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. These may be used alone or in combination of two or more.

[0040] In some embodiments, an adhesive film such as an optically clear adhesive (OCA) or an optically clear resin (OCR) may be included in the antenna substrate layer 110 .

[0041] In some embodiments, the antenna substrate layer 110 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0042] In one embodiment, the antenna substrate layer 110 may be provided as a substantially single layer. In one embodiment, the antenna substrate layer 110 may include a multi-layer structure of at least two layers.

[0043] Capacitance or inductance may be formed between the antenna unit 120 and a ground element included in the display panel 200 , thereby making it possible to adjust a frequency band in which the antenna stack structure 10 may operate.

[0044] In some embodiments, the dielectric constant of the antenna substrate layer 110 can be adjusted to a range of approximately 1.5 to approximately 12. When the dielectric constant exceeds approximately 12, the driving frequency may be excessively reduced, and thus, desired high-frequency or ultra-high-frequency driving may not be achieved. For example, if the antenna substrate layer 110 includes glass, the antenna substrate layer 110 may have a dielectric constant of 3.5 to 8.

[0045] A cover window 150 may be provided on the antenna unit 120. The cover window 150 may be provided on an opposite side of the antenna substrate layer 110. The cover window 150 may be provided on a viewing surface or an outermost surface of the antenna stack structure 10.

[0046] The cover window 150 may include, for example, glass or a flexible resin material such as polyimide, polyethylene terephthalate (PET), acrylic resin, silicone-based resin, or the like.

[0047] In some embodiments, the cover window 150 may have a thickness of about 10 μm to 1000 μm. Preferably, the cover window 150 may have a thickness of about 300 μm to 700 μm when the cover window is formed of a flexible resin material, or 10 μm to 100 μm when the cover window is formed of thin glass.

[0048] In some embodiments, the upper surface of the antenna unit 120 may directly contact the cover window 150 .

[0049] In some embodiments, an insulating layer 130 may be provided on the antenna unit 120. The insulating layer 130 may cover the upper surface of the antenna unit 120. The insulating layer 130 may passivate and planarize the upper surface of the antenna unit 120 and may serve as a support layer for the polarization layer 140 and the cover window 150.

[0050] In exemplary embodiments, the insulating layer 130 may include at least one of an organic insulating layer and an inorganic insulating layer.

[0051] The organic insulating layer may include polyacrylate, polymethacrylate (e.g., PMMA), polyimide, polyamide, polyvinyl alcohol, polyamic acid, polyolefin (e.g., PE, PP), polystyrene, polynorbornene, phenylmaleimide copolymer, polyazobenzene, polyphenylene phthalamide, polyester (e.g., PET, PBT), polyarylate, cinnamate polymer, coumarin polymer, benzo[c]pyrrolidone polymer, chalcone polymer, aromatic acetylene polymer, etc. These may be used alone or in combination.

[0052] For example, the organic insulating layer may be formed by coating and drying a composition including the above-mentioned polymer material. The thickness of the organic insulating layer may be about 1 μm to 5 μm, preferably about 1.5 μm to 2.5 μm.

[0053] The inorganic insulating layer may include a single layer or a multilayer structure and may be formed of a metal oxide or a metal nitride. For example, the inorganic insulating layer may include at least one of SiNx, SiON, Al2O3, SiO2, and TiO2.

[0054] For example, the inorganic insulating layer may be formed as a SiON layer or a SiO 2 layer, or a double layer of a SiON layer and a SiO 2 layer.

[0055] For example, the inorganic insulating layer may be formed by a deposition process such as a chemical vapor deposition (CVD) process. The thickness of the inorganic insulating layer may be about 100 nm to 1000 nm, preferably about 200 nm to 400 nm.

[0056] In an exemplary embodiment, the insulating layer 130 may further include an adhesive layer. The adhesive layer may include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR), including acrylic resin, silicone resin, epoxy resin, etc. For example, the organic / inorganic insulating layer may be bonded to the polarizing layer 140 or the cover window 150 via the adhesive layer.

[0057] In exemplary embodiments, the thickness of the adhesive layer may be approximately 25 to 300 μm.

[0058] In an exemplary embodiment, the polarization layer 140 may be provided on the upper surface of the antenna unit 120. For example, the polarization layer 140 may be provided between the insulating layer 130 and the cover window 150. The polarization layer 140 may be bonded to the insulating layer 130 via an adhesive layer. An additional adhesive layer may be formed on the polarization layer 140. In this case, the polarization layer 140 and the cover window 150 may be bonded to each other via the additional adhesive layer.

[0059] The polarizing layer 140 may include a cladding type polarizer or a polarizing plate. The cladding type polarizer may include a liquid crystal cladding layer having a polymerizable liquid crystal compound and a dichroic dye. In this case, the polarizing layer may further include an alignment layer for providing an orientation of the liquid crystal cladding layer.

[0060] For example, the polarizing layer 140 may include a polyvinyl alcohol-based polarizer and a protective film attached to at least one surface of the polyvinyl alcohol-based polarizer.

[0061] For example, the protective film may include a polymer film such as a COP-based, TAC-based, acrylic-based, or PET-based film.

[0062] Figure 3 Schematic cross-sectional view showing the antenna stack structure according to an exemplary embodiment. Figure 2 Detailed description of elements and structures that are substantially the same or similar to those described.

[0063] Reference Figure 3 The antenna substrate layer 110 of the antenna stack structure 11 may include an optical film.

[0064] In some embodiments, the optical film may include a polarizing plate 111. For example, the optical film may include a laminate of a polarizer 112 and polarizer protective films 114 and 115 formed on at least one surface of the polarizer 112. The polarizer 112 and the polarizer protective films 114 and 115 may be bonded, for example, by an adhesive layer.

[0065] In exemplary embodiments, when the optical film includes a polarizing plate, the polarizing layer 140 may not be interposed between the antenna unit 120 and the cover window 150 .

[0066] In one embodiment, a blackening layer may be formed on the viewing side of the antenna unit 120. In this case, visual recognition of the electrodes may be prevented by the blackening layer.

[0067] In an exemplary embodiment, the thickness of the antenna substrate layer 110 may be 5 μm to 600 μm. If the antenna substrate layer 110 includes the polarizer 112, the thickness of the polarizer 112 may be 50 μm to 200 μm. In this case, the gain and efficiency of the antenna may be improved.

[0068] The antenna unit 120 may be provided on one surface (eg, the top surface) of the antenna substrate layer 110. For example, the antenna unit 120 may be directly formed on the top surface of the antenna substrate layer 110.

[0069] The antenna unit 120 may include a radiation pattern 122 , a transmission line 124 , and / or an antenna pad.

[0070] For example, the antenna unit 120 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. These may be used alone or in combination.

[0071] For example, the antenna unit 120 may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (eg, copper-calcium (CuCa)) to achieve low resistance and a fine line width pattern.

[0072] In some embodiments, the antenna unit 120 may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnOx), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), etc.

[0073] In some embodiments, antenna unit 120 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, antenna unit 120 may include a double-layer structure of a transparent conductive oxide layer and a metal layer, or a triple-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer. In this case, the metal layer can improve flexibility, and the low resistance of the metal layer can also increase signal transmission speed. The transparent conductive oxide layer can also improve corrosion resistance and transparency.

[0074] In some embodiments, the thickness of the antenna unit 120 may be approximately Below, preferably about to Within this range, it is possible to suppress a color shift phenomenon from a viewing surface of the antenna stack structure while preventing an increase in resistance of the antenna unit 120 .

[0075] The radiation pattern 122 may have a shape of, for example, a polygonal flat plate, and the transmission line 124 may extend from one side of the radiation pattern 122 to be electrically connected to the signal pad 126. The transmission line 124 may be formed as a single member substantially integral with the radiation pattern 122.

[0076] In some embodiments, the antenna pad may include a signal pad 126 and may further include a ground pad 128. For example, a pair of ground pads 128 may be provided with the signal pad 126 interposed therebetween. The ground pad 128 may be electrically separated from the signal pad 126 and the transmission line 124.

[0077] In one embodiment, the ground pad 128 may be omitted. The signal pad 126 may be formed as an integral member at the end of the transmission line 124 .

[0078] In some embodiments, an end portion of the antenna unit 120 may be electrically connected to a circuit connection structure, which may include, for example, a flexible printed circuit board (FPCB).

[0079] The antenna pad can be electrically connected to an antenna driving integrated circuit (IC) chip through a circuit connection structure such as a flexible printed circuit board. Therefore, the antenna unit can be fed and driven by the antenna driving IC chip.

[0080] The driver IC chip can be directly mounted on the flexible circuit board. For example, the flexible circuit board (FPCB) can further include circuits or contacts that electrically connect the driver IC chip and the antenna unit. The flexible circuit board (FPCB) and the driver IC chip can be positioned close to each other, thereby shortening the signal transmission / reception path and suppressing signal loss.

[0081] In one embodiment, the antenna unit 120 may be formed in a mesh structure. For example, the antenna unit 120 may be directly formed on the top surface of the antenna substrate layer 110 by a sputtering process.

[0082] In an exemplary embodiment, the radiation pattern 122 may have a mesh structure. In some embodiments, the transmission line 124 connected to the radiation pattern 122 may also have a mesh structure.

[0083] The radiation pattern 122 may include a mesh structure so that light transmittance can be improved even when the radiation pattern 122 is disposed in a display area of ​​a display device, thereby preventing electrodes from being visually recognized and preventing image quality from being deteriorated.

[0084] A dummy mesh pattern may be provided around the radiation pattern 122 and the transmission line 124. The dummy mesh pattern may be electrically and physically spaced apart from the radiation pattern 122 and the transmission line 124 by a separation region.

[0085] For example, a conductive layer including the aforementioned metal or alloy may be formed on the antenna substrate layer 110. The conductive layer may be partially etched along the contours of the radiation pattern 122 and the transmission line 124 to form a mesh structure while also forming a separation region. Thus, the antenna element 120 and the dummy mesh pattern, separated by the separation region, may be formed on the antenna substrate layer 110.

[0086] In some embodiments, the signal pad 126 can be formed as a solid structure to reduce the feeding resistance. For example, the signal pad 126 can be disposed in a non-display area or a light shielding area of ​​the display device to engage or connect to the flexible circuit board and / or the antenna driver IC chip.

[0087] Thus, the signal pad 126 may be disposed outside of a user's viewing area or display area DA. In one embodiment, the signal pad 126 may consist essentially of a metal or an alloy.

[0088] The display panel 200 may be formed on a surface of the antenna substrate layer 110 opposite to the antenna unit 120 (eg, a bottom surface of the antenna substrate layer 110 ).

[0089] The display panel 200 may include a liquid crystal display device, an organic LED display device, an inorganic LED display device, a plasma display device, etc., and may preferably be a self-luminous display device such as an organic LED display device or an inorganic LED display device.

[0090] Figure 4 is a schematic cross-sectional view illustrating a display panel according to an exemplary embodiment.

[0091] Reference Figure 4 The display panel 200 may include a panel substrate 205, a display device, and an encapsulation layer 250 covering the display device. The display device may include an electrode layer, a pixel defining layer 220, and a display layer 230. The electrode layer may include a pixel electrode 210 and an opposing electrode 240.

[0092] A display device and an encapsulation layer 250 may be sequentially formed on the panel substrate 205 .

[0093] A pixel circuit including a thin film transistor (TFT) electrode 270 may be formed on the panel substrate 205, and an insulating layer may be formed to cover the pixel circuit. The pixel electrode 210 may be electrically connected to a drain electrode of the TFT on the insulating layer, for example.

[0094] A pixel defining layer 220 may be formed on the insulating layer to expose the pixel electrode 210, thereby defining a pixel region. A display layer 230 may be formed on the pixel electrode 210, and the display layer 230 may include, for example, a liquid crystal layer or an organic light-emitting layer. Preferably, the display layer 230 may include an organic light-emitting layer, and the display panel 200 may be an OLED panel.

[0095] The counter electrode 240 may be provided on the pixel defining layer 220 and the display layer 230. The counter electrode 240 may function as, for example, a common electrode or a cathode of the display panel 200. An encapsulation layer 250 for protecting the display panel 200 may be stacked on the counter electrode 240.

[0096] In an exemplary embodiment, the display device 260 of the display panel 200 may overlap the radiation pattern 122 of the antenna unit 120 in the thickness direction of the antenna stack structure 10. In this case, the counter electrode 240 may function as a ground portion of the radiation pattern 122.

[0097] In an exemplary embodiment, the encapsulation layer 250 may serve as the antenna substrate layer 110. In this case, the display panel 200 and the antenna stack structure 10 may be integrated to provide a thin film structure.

[0098] The display panel 200 may include a ground element overlapping the antenna pad of the antenna unit 120 in a plan view of the antenna stack structure 10 .

[0099] The ground element can be coupled to the antenna pad to form an inductor or capacitor. Therefore, the antenna's resonant frequency and impedance can be adjusted by using the antenna pad. As a result, the antenna's gain and radiation characteristics can be improved.

[0100] The display panel 200 may include a display area DA displaying an image and a non-display area NDA surrounding the display area DA. For example, a display device 260 and a TFT electrode 270 may be provided in the display area DA. A ground element may be formed in the non-display area NDA.

[0101] Reference Figure 2 and Figure 3 , the ground element may include the TFT electrode 270 .

[0102] In an exemplary embodiment, the TFT electrode 270 may extend beyond the display area DA to the non-display area NDA. In this case, the portion located in the display area DA may be defined as a display portion 272, and the portion extending to the non-display area NDA may be defined as an extension portion 274.

[0103] Therefore, if Figure 1 As shown, the antenna pads 126 and 128 may be superimposed on the extension 274 in plan view, and the extension 274 may serve as a ground element.

[0104] In exemplary embodiments, the extension portion 274 may include a conductive wiring of the TFT electrode 270 , a trace connected to the TFT electrode 270 , or a bus bar (not shown) connected to the TFT electrode 270 .

[0105] For example, the TFT electrodes 270, traces, and bus bars can be formed of a low-resistance metal, such as silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals, without regard to transparency. Preferably, the low-resistance metal may include copper, aluminum, silver-palladium-copper alloy, or copper-calcium alloy. In this case, the frequency and impedance of the antenna can be effectively adjusted and matched.

[0106] Figure 5 is a schematic top plan view illustrating an antenna stack structure according to an exemplary embodiment. Figure 6Schematic cross-sectional view showing the antenna stack structure according to an exemplary embodiment. Figures 1 to 4 Detailed description of elements and structures that are substantially the same or similar to those described.

[0107] Reference Figure 5 and Figure 6 The display panel 201 of the antenna stack structure 20 may include a ground structure 280. The ground structure 280 may be formed on the same layer or level as the display device 260.

[0108] In an exemplary embodiment, a ground structure 280 may be formed in the non-display area NDA. Therefore, the antenna pads 126 and 128 of the antenna unit 120 disposed in the non-display area NDA may be superimposed on the ground structure. In this case, the ground structure 280 may be coupled to the antenna pads 126 and 128 as a ground element, and may effectively adjust the frequency and impedance of the antenna.

[0109] For example, the ground structure 280 may include the same material as that of the TFT electrode 270 described above as an example, and may be formed in a stripe or plate shape. In some embodiments, the ground structure 280 may include a mesh structure or a solid structure.

[0110] In some embodiments, the ground structure 280 can be formed of the same material as the TFT electrode 270, and the extension portion 274 of the TFT electrode 270, the ground structure 280, and the antenna pad of the antenna unit 120 can be sequentially stacked so as to overlap each other. In this case, the extension portion 274 of the TFT electrode 270, the ground structure 280, and the antenna unit 120 can be coupled together to improve the gain of the antenna.

[0111] In an exemplary embodiment, the ground structure 280 can be electrically connected to the ground pad 128 of the antenna unit 120. For example, the ground structure 280 and the ground pad 128 of the antenna unit 120 can be connected via vias or contacts that penetrate the antenna substrate layer 110. In some embodiments, the ground structure 280 can be electrically connected to the ground pad 128 of the antenna unit 120 via a ground trace that bypasses the lateral side of the antenna substrate layer 110. In this case, the gain of the antenna can be improved.

[0112] In an exemplary embodiment, the ground structure 280 may be provided on a surface (e.g., a bottom surface) of the antenna substrate layer 110 opposite to the antenna unit 120. For example, the ground structure 280 may be provided below the antenna pads 126 and 128. In this case, the ground structure 280 and the display device 260 may be electrically and physically separated.

[0113] In an exemplary embodiment, the display device 260 may overlap the radiation pattern 122 of the antenna unit 120 in the thickness direction of the antenna stack structure 10. In this case, the radiation pattern 122 and the entire antenna pad may be used to adjust the resonant frequency and impedance of the antenna.

[0114] In some embodiments, the display device 260 may be formed only in the display area DA and may not overlap with the antenna pad. In one embodiment, the display device 260 may overlap with the entire area of ​​the antenna unit 120.

[0115] In an exemplary embodiment, the antenna stack structure 10 may further include a touch sensing structure. The touch sensing structure may be provided at any area on the upper surface of the display panel 200.

[0116] In some embodiments, the touch sensing structure may be formed inside the antenna unit 120. For example, the touch sensing structure may be formed at the same layer as the antenna unit.

[0117] In some embodiments, the touch sensing structure may be formed inside the antenna substrate layer 110. For example, if the antenna substrate layer 110 includes the polarizing plate 111, the touch sensing structure may be embedded in the polarizer protection films 114 and 115.

[0118] The touch sensing structure may include, for example, capacitive sensing electrodes. For example, the horizontal row sensing electrodes and the vertical column sensing electrodes may be arranged to intersect each other. The touch sensing structure may also include traces connecting the sensing electrodes to the driver IC chip. The touch sensing structure may also include a substrate on which the sensing electrodes and traces are formed.

Claims

1. An antenna stack structure, characterized in that: It includes: Antenna substrate layer; an antenna unit disposed on a top surface of the antenna substrate layer, the antenna unit comprising a radiation pattern and an antenna pad; as well as a display panel including a ground element provided on a bottom surface of the antenna substrate layer, wherein the antenna pad includes a signal pad connected to the radiation pattern and a ground pad formed around the signal pad, and The antenna pad is superimposed on the ground element in a plan view, and the radiation pattern is not superimposed on the ground element in a plan view.

2. The antenna stack structure according to claim 1, wherein: The display panel has a display area and a non-display area, and the ground element is disposed in the non-display area.

3. The antenna stack structure according to claim 2, wherein: The display panel further includes a TFT electrode and a display device disposed in the display area.

4. The antenna stack structure according to claim 3, wherein: The TFT electrode of the display panel includes an extending portion extending to the non-display area, and the extending portion of the TFT electrode serves as the ground element.

5. The antenna stack structure according to claim 3, wherein: The display panel further includes a bus bar connected to the TFT electrode and disposed in the non-display area, and the bus bar serves as the ground element.

6. The antenna stack structure according to claim 3, wherein: The display panel includes a ground structure provided at the same layer as the display device in a non-display area, and the ground structure serves as the ground element.

7. The antenna stack structure according to claim 3, wherein: The display device serves as a ground portion of the antenna unit.

8. The antenna stack structure according to claim 1, wherein: The antenna substrate layer includes glass or an optical film.

9. The antenna stack structure according to claim 8, wherein: The optical film includes a polarizing plate.

10. The antenna stack structure according to claim 1, wherein: It also includes a cover window provided on the top surface of the antenna unit.

11. The antenna stack structure according to claim 10, wherein: It also includes a polarizing plate disposed between the cover window and the antenna unit.

12. The antenna stack structure according to claim 1, wherein: It also includes a touch sensing structure disposed on the top surface of the display panel.

13. The antenna stack structure according to claim 1, wherein: The radiation pattern has a mesh structure.

14. The antenna stack structure according to claim 13, wherein: The antenna unit further includes a dummy mesh pattern arranged around the radiation pattern.

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