Wafer carrier device for semiconductor process equipment and semiconductor process equipment

Abstract

The present application discloses a wafer carrier device of semiconductor process equipment and semiconductor process equipment, and relates to the field of semiconductor equipment. A wafer carrier device includes: a rotatable base body, the base body has a bearing slot, and the bearing slot is used to accommodate wafers; a plurality of positioning components arranged on the base body, and the plurality of positioning components are arranged around the bearing slot around the rotation axis of the base body, and each positioning component includes a positioning member and a driving member, the positioning member can move relative to the base body, and the driving member can drive the positioning member toward the rotation axis under the action of the centrifugal force generated by the rotation of the base body to drive the wafer to move so that the center of the wafer is located on the rotation axis. A semiconductor process equipment includes a process chamber, and the process chamber is provided with the above-mentioned wafer carrier device. The present application can solve the problem that the position of the wafer on the graphite base is deviated, resulting in poor uniformity of the thin film generated in the process.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor equipment technology, and specifically relates to a wafer carrier device of semiconductor process equipment and semiconductor process equipment. Background Art

[0002] Chemical vapor deposition epitaxial growth involves delivering reactive gases into a reaction chamber, where they react through heating and other methods, causing growth atoms to deposit on the wafer and grow a single crystal layer. A graphite susceptor is typically used to support the wafer in the reaction chamber. During the process, the wafer is transferred to the graphite susceptor and positioned in a groove on its upper surface. A uniform process gas flow enters the reaction chamber, where a chemical reaction occurs at high temperature to form a thin film. The graphite susceptor can also rotate the wafer.

[0003] However, when the wafer is transferred to the graphite base, the position of the wafer on the graphite base will deviate from the rotation center of the graphite base. As a result, during the rotation of the graphite base, the wafer will be close to the edge or overlap of the groove. Due to the asymmetry of the edge, the thickness of the film generated during the process will be uneven, which will affect the product quality. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a wafer carrier device and semiconductor process equipment for semiconductor process equipment, which can solve the problem of deviation in the position of the wafer on the graphite base, resulting in poor uniformity of the thin film generated in the process.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] An embodiment of the present application provides a wafer carrier device for semiconductor process equipment, the wafer carrier device comprising:

[0007] A rotatable base body having a bearing slot for accommodating a wafer;

[0008] A plurality of positioning components are arranged on the base body, and the plurality of positioning components are arranged around the supporting groove around the rotation axis of the base body. Each of the positioning components includes a positioning member and a driving member. The positioning member can move relative to the base body. The driving member can drive the positioning member toward the rotation axis under the action of the centrifugal force generated by the rotation of the base body, so as to drive the wafer to move so that the center of the wafer is located on the rotation axis.

[0009] An embodiment of the present application further provides a semiconductor process equipment, which includes a process chamber, in which the above-mentioned wafer carrying device is arranged.

[0010] In the embodiment of the present application, the position of the wafer in the supporting slot can be adjusted from multiple orientations through multiple positioning components, so that the center of the wafer can be ensured to be located on the rotation axis of the base body, that is, the position of the wafer in the supporting slot is centered. In this way, when the base body rotates, the symmetry of the wafer edge is ensured, and the phenomenon of asymmetric edge of the epitaxial film thickness is avoided, thereby improving the uniformity of the thin film on the wafer surface and ensuring the normal progress of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a first structural schematic diagram of a wafer carrier device of a semiconductor process equipment disclosed in an embodiment of the present application;

[0012] Figure 2 A second structural schematic diagram of a wafer carrier device of a semiconductor process equipment disclosed in an embodiment of the present application;

[0013] Figure 3 A schematic diagram of a partial structure of a wafer carrier device of a semiconductor process equipment disclosed in an embodiment of the present application in a stationary state;

[0014] Figure 4 A schematic diagram of a partial structure of a wafer carrier device of a semiconductor process equipment disclosed in an embodiment of the present application in a rotating state;

[0015] Figure 5 A schematic structural diagram of a driving member disclosed in an embodiment of the present application;

[0016] Figure 6 This is a schematic structural diagram of the positioning member disclosed in an embodiment of the present application.

[0017] Description of reference numerals:

[0018] 100 - base body; 110 - swing groove; 120 - first through hole; 130 - receiving groove; 140 - bearing groove; 141 - bearing surface; 142 - side wall; 150 - avoidance hole; 160 - assembly groove;

[0019] 200 - positioning assembly; 210 - driving member; 211 - rocker; 2111 - first rod segment; 2112 - second rod segment; 212 - rocker; 220 - positioning member; 221 - second through hole;

[0020] 300-support mechanism; 310-thimble; 320-support frame;

[0021] 400-rotating mechanism; 410-rotating pin; 420-rotating frame;

[0022] 500-wafer;

[0023] M-first gap; N-second gap. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0026] refer to Figures 1 to 6 , an embodiment of the present application discloses a wafer carrier device of a semiconductor process equipment, which can adjust the position accuracy of the wafer 500 thereon, thereby positioning the wafer 500 to ensure that the wafer 500 does not deviate from the center line of the wafer carrier device, thereby ensuring process accuracy.

[0027] refer to Figure 1 and Figure 2 The disclosed wafer carrying device includes a rotatable base body 100 and a plurality of positioning components 200 , and the plurality of positioning components 200 are disposed on the base body 100 .

[0028] Among them, the base body 100 is the basic installation and support member of the wafer carrying device, which can provide an installation base for structures such as the positioning component 200, and can also provide a support base for the wafer 500. In some embodiments, the base body 100 has a bearing groove 140, which is used to accommodate the wafer 500. It is understandable that during normal use of the wafer carrying device, the base body 100 can rotate around its own rotation axis to make the thickness of the thin film formed on the surface of the wafer 500 during the process more uniform, thereby improving product quality. Optionally, the bearing groove 140 is located in the upper end area of ​​the base body 100.

[0029] The positioning assembly 200 is a power component and positioning component in the wafer carrying device, which can adjust the position of the wafer 500 in the carrying slot 140 to make the position of the wafer 500 on the base body 100 more precise, thereby achieving the positioning function of the wafer 500.

[0030] The plurality of positioning assemblies 200 are disposed around the bearing slot 140 and around the rotation axis of the base body 100 , so that the wafer 500 can be positioned from multiple orientations by the plurality of positioning assemblies 200 .

[0031] In some embodiments, each positioning assembly 200 includes a positioning member 220 and a driving member 210, wherein the positioning member 220 can move relative to the base body 100, and the driving member 210 can drive the positioning member 220 to move toward the rotation axis under the action of the centrifugal force generated by the rotation of the base body 100, so as to drive the wafer 500 to move and make the center of the wafer 500 located on the rotation axis.

[0032] Based on the above-mentioned arrangement, during the process of the embodiment of the present application, the base body 100 rotates and drives the wafer 500 thereon to rotate synchronously. At the same time, the driving members 210 in the multiple positioning assemblies 200 also rotate with the base body 100. Under the action of centrifugal force, the driving members 210 move relative to the base body 100 and drive the positioning members 220 to move relative to the base body 100, thereby causing the positioning members 220 in the multiple positioning assemblies 200 to move toward the rotation axis from multiple directions to squeeze the edge of the wafer 500 and move the wafer 500 in the supporting groove 140, thereby aligning the center of the wafer 500 with the rotation axis, thereby realizing the positioning of the wafer 500, thereby ensuring the symmetry of the edge of the wafer 500, avoiding the phenomenon of asymmetric edge of the epitaxial film thickness, thereby improving the uniformity of the thin film on the surface of the wafer 500 and ensuring the normal progress of the process.

[0033] refer to Figure 2 In order to drive the positioning member 220 to move through the driving member 210 when the base body 100 rotates, in some embodiments, the driving member 210 is swingably provided on the base body 100, and the positioning member 220 is movably provided on the base body 100. The driving member 210 can swing under the action of the centrifugal force generated by the rotation of the base body 100, and can contact the positioning member 220 when the driving member 210 swings, so that the positioning member 220 is close to or away from the rotation axis of the base body 100.

[0034] Optionally, the driving member 210 and the base body 100 can be hinged to achieve relative swing, including: through pin connection, spherical connection, etc. The specific connection method between the driving member 210 and the base body 100 is not limited in the embodiment of the present application, as long as the driving member 210 can swing relative to the base body 100.

[0035] Optionally, relative movement between the positioning member 220 and the base body 100 can be achieved by sliding, including: the positioning member 220 and the base body 100 are connected by a sliding rail and a sliding groove structure. Of course, the specific connection method between the positioning member 220 and the base body 100 is not limited in the embodiment of the present application, as long as the positioning member 220 can be moved relative to the base body 100.

[0036] Based on the above arrangement, during the forward swing of the driving member 210 relative to the base body 100, the driving member 210 can drive the positioning member 220 to move relative to the base body 100, thereby allowing the positioning member 220 to approach the wafer 500 and contact the edge of the wafer 500 from multiple directions, thereby driving the wafer 500 to move relative to the base body 100 to adjust the position of the wafer 500 and achieve positioning of the wafer 500. Of course, the driving member 210 can also swing in the reverse direction. At this time, the driving member 210 can drive the positioning member 220 to move in the opposite direction relative to the base body 100, thereby allowing the positioning member 220 to move away from the wafer 500, so that the positioning member 220 is separated from the edge of the wafer 500. The above-mentioned forward and reverse directions are intended to indicate the meaning of two opposite directions, and there is no meaning of specifically referring to a specific direction.

[0037] It should be noted here that the power for the driving member 210 to swing relative to the base body 100 comes from the centrifugal force generated by the rotation of the base body 100. At this time, there is a certain distance between the center of gravity of the driving member 210 and the swing point or swing axis of the driving member 210 relative to the base body 100 to form a swinging torque. In this way, when the base body 100 rotates, the centrifugal force generates a centrifugal torque, thereby causing the driving member 210 to swing relative to the base body 100.

[0038] refer to Figures 3 to 5 In some embodiments, the driving member 210 includes a rocker arm 211 and a swinging body 212, wherein the swinging body 212 is arranged on the rocker arm 211, and the base body 100 is provided with a plurality of swinging grooves 110, and the plurality of swinging grooves 110 are centrally symmetrically arranged around the bearing groove 140 around the rotation axis, and the plurality of swinging bodies 212 are arranged one by one in the swinging grooves 110.

[0039] Based on the above arrangement, the rocker arm 211 can be separated into a first segment 2111 and a second segment 2112 by the rocker body 212, that is, the rocker body 212 is located between the first segment 2111 and the second segment 2112, and the center of gravity of the rocker arm 211 is located on the second segment 2112. Since the center of gravity is not located on the axis of the rocker body 212, during the swinging of the driving member 210 relative to the base body 100, the centrifugal force generated on the driving member 210 can be regarded as acting at the center of gravity, and the axis of the swinging of the driving member 210 relative to the base body 100 is located on the rocker body 212. In this way, a centrifugal torque is generated, and further, when the base body 100 rotates, the driving member 210 can be made to swing at a certain angle relative to the base body 100.

[0040] It should be noted that when the first and second rod segments 2111, 2112 are made of the same material and have the same cross-sectional area, in order to locate the center of gravity of the pendulum rod 211 at the second rod segment 2112, the length of the second rod segment 2112 can be greater than the length of the first rod segment 2111. Alternatively, the first rod segment 2111 can be a short column, and the second rod segment 2112 can be a long column. In this way, when the base body 100 rotates, the second rod segment 2112 moves away from the rotation axis of the base body 100, while the first rod segment 2111 moves toward the rotation axis of the base body 100, thereby causing the pendulum rod 211 to swing relative to the base body 100.

[0041] Alternatively, the swinging body 212 may be a sphere, a hemisphere, a cylinder, etc., and accordingly, the swinging groove 110 may be a spherical groove, a hemisphere groove, a cylindrical groove, etc. To increase the swinging freedom of the driving member 210, the swinging body 212 may be a hemisphere, and in this case, the swinging groove 110 may be a hemisphere. Based on this, the flexibility of the swinging of the driving member 210 relative to the base body 100 can be increased.

[0042] refer to Figure 5 In a more specific embodiment, the swinging member 212 is a hemisphere, and the first rod segment 2111 and the second rod segment 2112 are respectively coaxially arranged with the hemisphere. The hemisphere may include a hemispherical surface and a flat surface, with the first rod segment 2111 connected to the flat surface and the second rod segment 2112 connected to the hemispherical surface. To enable the driving member 210 to swing when the base body 100 rotates, the second rod segment 2112 can be made longer than the first rod segment 2111. This allows the second rod segment 2112 to swing outward while the first rod segment 2111 swings inward when the base body 100 rotates.

[0043] In addition, in order to facilitate the production and manufacturing of the driving member 210, in some embodiments, the first rod segment 2111, the second rod segment 2112 and the swinging body 212 can be set as an integral whole, that is, the driving member 210 is an integral structure. In this case, the driving member 210 can be manufactured at one time, which can shorten the production and manufacturing cycle to a certain extent, improve efficiency, and reduce costs.

[0044] Continue to refer Figure 3 and Figure 4 In order to swingably mount the driving member 210 to the base body 100, in some embodiments, the wall surface of the swing groove 110 is penetrated to the side of the base body 100 facing away from the bearing groove 140, thereby forming a first through-hole 120. The first through-hole 120 penetrates the wall surface of the swing groove 110 to allow the driving member 210 to pass through. Based on this, when installing the driving member 210, the second rod segment 2112 is inserted into the first through-hole 120 through the swing groove 110 and exits from the side of the base body 100 facing away from the bearing groove 140, so that the swinging body 212 is embedded in the swing groove 110, achieving the cooperation between the swinging body 212 and the swing groove 110. At the same time, the first through-hole 120 allows the second rod segment 2112 to avoid the swinging body 212.

[0045] Taking into account that the driving member 210 needs to swing relative to the base body 100, at this time, the second rod segment 2112 needs to swing in the first through hole 120. In order to prevent the first through hole 120 from limiting the swing of the second rod segment 2112, in the embodiment of the present application, a first gap M is formed between the second rod segment 2112 and the first through hole 120. The first gap M can ensure that the second rod segment 2112 has a certain floating amount in the first through hole 120, thereby ensuring that the swing of the driving member 210 relative to the base body 100 is not restricted.

[0046] It should be noted that the cross-sectional area of ​​the first through-hole 120 is larger than the cross-sectional area of ​​the second rod segment 2112 to ensure a first gap M between the second rod segment 2112 and the first through-hole 120. However, considering that the first through-hole 120 can limit the floating amount of the second rod segment 2112, thereby limiting the swing amount of the entire driving member 210, the cross-sectional area of ​​the first through-hole 120 in the embodiment of the present application is slightly larger than the cross-sectional area of ​​the second rod segment 2112. For example, when both cross-sections are circular, the difference in radius between the first through-hole 120 and the second rod segment 2112 can be between 0.5 and 5 mm. Of course, in the embodiment of the present application, there is no specific limitation on the relative size between the second rod segment 2112 and the first through-hole 120, as long as it can meet practical requirements.

[0047] In order to drive the positioning member 220 to move relative to the base body 100 via the driving member 210, in the embodiment of the present application, the first rod segment 2111 is brought into contact with the positioning member 220, so that when the driving member 210 swings, the positioning member 220 can be brought into contact with the positioning member 220, causing the positioning member 220 to move. It should be noted that the first rod segment 2111 and the positioning member 220 can abut against each other, and of course, can also be movably connected. In the embodiment of the present application, there is no limitation on the relative relationship between the first rod segment 2111 and the positioning member 220, as long as the positioning member 220 can be driven and motion interference can be avoided.

[0048] In order to enable the driving member 210 to drive the positioning member 220 to move, some embodiments provide a second through hole 221 on the positioning member 220, and pass the first rod segment 2111 through the second through hole 221. In this way, when the driving member 210 swings relative to the base body 100, the positioning member 220 can be driven to move by the first rod segment 2111 contacting the inner wall of the second through hole 221, so that the positioning member 220 can be moved close to or away from the edge of the wafer 500.

[0049] Since the driving member 210 swings relative to the base body 100 and the positioning member 220 moves relative to the base body 100, in order to prevent motion interference between the driving member 210 and the positioning member 220, a second gap N is formed between the first rod segment 2111 and the second through hole 221. The second gap N can ensure that the first rod segment 2111 has a certain floating amount in the second through hole 221, thereby ensuring that the respective movements of the driving member 210 and the positioning member 220 will not interfere with each other.

[0050] It should be noted that the cross-sectional area of ​​the second through hole 221 is larger than the cross-sectional area of ​​the first rod segment 2111 to ensure a second gap N between the first rod segment 2111 and the second through hole 221. However, considering that during the swinging process of the driving member 210, the first rod segment 2111 needs to contact the inner wall of the second through hole 221 to drive the positioning member 220 to move, the cross-sectional area of ​​the second through hole 221 is not infinite.

[0051] Based on the above configuration, when the cross-sectional area of ​​the first through hole 120 and the second through hole 221 is large, the swing range of the driving member 210 is also large. To meet the process requirements, it is necessary to appropriately adjust the cross-sectional area of ​​the first through hole 120 and the second through hole 221, that is, to adjust the size of the first through hole 120 and the second through hole 221. Figure 4As shown, when the second rod segment 2112 of the driving member 210 swings in the direction away from the rotation axis of the base body 100, the positioning member 220 can be driven by the first rod segment 2111 to move in the direction close to the rotation axis of the base body 100, and the movement amplitude of the positioning member 220 should exceed a preset distance, for example, 1.5 mm beyond the edge of the wafer 500.

[0052] refer to Figure 3 In order to enable the positioning member 220 to contact the edge of the wafer 500 when the base body 100 rotates, and to detach from the edge of the wafer 500 when the base body 100 is stationary, in the embodiment of the present application, the first rod segment 2111 has a first side close to the rotation axis and a second side away from the rotation axis. Correspondingly, the second through hole 221 has a third side corresponding to the first side and a fourth side corresponding to the second side. In this way, when the center line of the driving member 210 is parallel to the rotation axis, the distance between the first side and the third side is greater than the distance between the second side and the fourth side. The above-mentioned first side and second side are the two opposite sides of the largest diameter of the first rod segment 2111. Similarly, the third side and fourth side are the two opposite sides of the largest diameter of the second through hole 221.

[0053] It is understood that when the base body 100 is stationary, the center line of the driving member 210 is parallel to the rotation axis of the base body 100. At this time, the driving member 210 is in a vertical arrangement, such as Figure 3 As shown, the leftmost side of the first rod segment 2111 is separated from the leftmost side of the second through hole 221 by a first distance, while the rightmost side of the first rod segment 2111 is separated from the rightmost side of the second through hole 221 by a second distance. The first distance is greater than the second distance, that is, the first rod segment 2111 is closer to the rightmost side of the second through hole 221.

[0054] The main reason for the above design is: when the driving member 210 is restored to the vertical position by swinging, the first rod segment 2111 contacts the inner wall of the second through hole 221, so that the positioning member 220 is away from the rotation axis, and the first rod segment 2111 finally fits the rightmost side of the second through hole 221. If there is a large distance between the rightmost side of the first rod segment 2111 and the rightmost side of the second through hole 221, the first rod segment 2111 is still fitted with the rightmost side of the second through hole 221 after the first swing of the first rod segment 2111 for the first time, then the distance between the leftmost side of the first rod segment 2111 and the leftmost side of the second through hole 221 becomes larger, and when the positioning member 220 is moved to the preset position by swinging again, the driving member 210 needs to have a larger swing amplitude; when the driving member 210 is restored to the vertical position by swinging, the driving member 210 pushes the positioning member 220 away from the edge of the wafer 500 to restore it to the initial position.

[0055] refer to Figure 2In order to accommodate the positioning member 220, in the embodiment of the present application, a plurality of accommodating grooves 130 are opened on the base body 100. The plurality of accommodating grooves 130 are centrally symmetrically arranged around the supporting groove 140 around the rotation axis of the base body 100, and the plurality of positioning members 220 are arranged one-to-one in the plurality of accommodating grooves 130 and can be extended or retracted relative to the accommodating grooves 130. The plurality of swinging grooves 110 are opened one-to-one in the bottom walls of the plurality of accommodating grooves 130.

[0056] Based on the above settings, the accommodating groove 130 can provide installation space for the positioning member 220, and the positioning member 220 can extend relative to the accommodating groove 130 to achieve contact with the edge of the wafer 500. The positioning member 220 can also retract relative to the accommodating groove 130 to disengage from the edge of the wafer 500, thereby releasing the restriction on the wafer 500; and the swing groove 110 is opened on the bottom wall of the accommodating groove 130, thereby providing installation space for the driving member 210.

[0057] Optionally, the shape of the receiving groove 130 can be adapted to the shape of the positioning member 220. This not only accommodates the positioning member 220 but also improves the movement precision of the positioning member 220. For example, the positioning member 220 can be a rectangular block, and the receiving groove 130 can be a rectangular groove accordingly; the positioning member 220 can also be an arc-shaped block, and the receiving groove 130 can be an arc-shaped groove accordingly. It should be noted that a certain floating clearance can be provided between the positioning member 220 and the receiving groove 130.

[0058] In a more specific embodiment, there are three receiving slots 130, with an angle difference of 120° between adjacent receiving slots 130. Accordingly, there are three positioning assemblies 200, with the positioning members of each of the three positioning assemblies 200 contacting the edge of the wafer 500 at three angles, namely, 120°, 240°, and 360°. This allows the position of the wafer 500 to be adjusted in three directions to achieve precise positioning of the wafer 500 in the receiving slot 140.

[0059] Continue to refer Figure 2 In some embodiments, the loading tank 140 includes a loading surface 141 for supporting the wafer 500 and a sidewall 142 surrounding the loading surface 141. Multiple receiving slots 130 are centrally symmetrically arranged on the sidewall 142 about the rotation axis. Therefore, when the wafer 500 is transferred to the base body 100, the loading surface 141 supports the wafer 500, while the sidewall 142 of the loading tank 140 limits the wafer 500, thereby ensuring accurate transfer of the wafer 500.

[0060] In order to enable the positioning members 220 of the multiple positioning assemblies 200 to contact the edge of the wafer 500 from multiple directions, in some embodiments, multiple receiving grooves 130 are opened on the side wall 142 of the supporting groove 140 in a centrally symmetrical manner around the rotation axis. In this way, the multiple positioning members 220 are evenly located around the wafer 500, so that when the multiple positioning members 220 are respectively extended relative to the multiple receiving grooves 130, they can contact the edge of the wafer 500 from multiple directions to achieve the positioning effect on the wafer 500.

[0061] refer to Figure 6 In order to ensure good contact between the positioning member 220 and the edge of the wafer 500, in an embodiment of the present application, an arc structure can be designed on the side wall of the positioning member 220 facing the rotation axis, and the arc structure is adapted to the edge shape of the wafer 500. In this way, when the positioning member 220 contacts the edge of the wafer 500, the contact area can be increased, the contact stability can be improved, and good contact can be ensured between the positioning member 220 and the edge of the wafer 500.

[0062] Of course, the contact between the positioning member 220 and the edge of the wafer 500 is not limited to arc surface contact, and can also be point contact or line contact, as long as the positioning member 220 can push the wafer 500 to achieve centering.

[0063] refer to Figure 1 In order to rotate the base body 100, the wafer carrying device may further include a rotating mechanism 400, which includes a rotating frame 420 and a rotating pin 410. Among them, a plurality of rotating arms are provided at one end of the rotating frame 420, and a rotating pin 410 is provided on each rotating arm. Accordingly, a plurality of assembly grooves 160 are provided on the side of the base body 100 away from the carrying surface 141, and the plurality of rotating pins 410 are provided in the assembly grooves 160 in a one-to-one correspondence, so that the connection between the rotating mechanism 400 and the base body 100 is realized by the cooperation between the rotating pins 410 and the assembly grooves 160. In this way, the base body 100 can be supported by the rotating frame 420, and the base body 100 can also be driven to rotate by the rotating frame 420.

[0064] In order to rotate the rotating frame 420, a power source can be connected to the other end of the rotating frame 420. The power source can be a motor or other component. The power source provides a rotational driving force for the rotating frame 420, and finally the rotating frame 420 and the rotating pin 410 thereon drive the base body 100 to rotate to meet the process requirements.

[0065] Continue to refer Figure 1In order to enable the wafer 500 to detach from the base body 100, the wafer carrying device may further include a support mechanism 300, and the support mechanism 300 includes a support frame 320 and a ejector pin 310. Among them, the support frame 320 may include a fixed shaft sleeve, and a plurality of support arms are provided at one end of the fixed shaft sleeve, and an ejector pin 310 is correspondingly provided above each support arm. Optionally, a directional hole is provided on each rotating arm of the rotating frame 420, and the ejector pin 310 is correspondingly inserted into the directional hole, and the ejector pin 310 can be raised and lowered along the directional hole. In addition, a plurality of avoidance holes 150 for passing the ejector pin 310 are also provided on the base body 100, so that the ejector pin 310 can pass through the base body 100 and lift the wafer 500.

[0066] In this way, when the support frame 320 moves in one direction of the rotation axis relative to the base body 100, the corresponding ejector pin 310 can be lifted by the support arm, so that the ejector pin 310 extends out of the avoidance hole 150, and the wafer 500 on the carrying surface 141 is lifted by the ejector pin 310; when the support frame 320 moves in the other direction of the rotation axis relative to the base body 100, the support arm releases the lifting effect on the ejector pin 310, and the ejector pin 310 retracts into the avoidance hole 150 to release the support for the wafer 500, so that the wafer 500 falls on the carrying surface 141.

[0067] During the above process, the base body 100 may be lifted or lowered, or the support mechanism 300 may be lifted or lowered. As long as the wafer 500 can be separated from the carrying surface 141 or placed on the carrying surface 141 , the specific method is not limited.

[0068] In order to achieve relative lifting of the base body 100 relative to the support mechanism 300, a lifting power source can be set, such as a cylinder, a hydraulic cylinder, an electric cylinder and other components. The lifting power source can drive the base body 100 to rise and fall through the rotating mechanism 400, or directly drive the support mechanism 300 to rise and fall to meet process requirements.

[0069] It should be noted here that the specific structure and working principle of the supporting mechanism 300 and the rotating mechanism 400 can also refer to other related technologies.

[0070] The specific working principle of the wafer carrier device of the semiconductor process equipment provided in the embodiment of the present application is as follows:

[0071] During the process, the base body 100 rotates rapidly. At this time, the driving member 210 is acted upon by centrifugal force, causing the second rod segment 2112 to swing toward the outside of the base body 100 (away from the rotation axis). Correspondingly, the first rod segment 2111 swings toward the inside of the base body 100 (close to the rotation axis), and the first rod segment 2111 contacts the side wall of the second through hole 221 close to the rotation axis, and the first rod segment 2111 pushes the positioning member 220 to move toward the rotation axis. In this way, multiple positioning members 220 contact the edge of the wafer 500 at the same time, exerting force on the wafer 500 to achieve the center positioning of the wafer 500 on the base body 100.

[0072] After the process is completed, the base body 100 stops rotating and the driving member 210 returns to a vertical state. The driving member 210 contacts the side wall of the second through hole 221 away from the rotation axis through the first rod segment 2111, and the first rod segment 2111 pushes the positioning member 220 to move away from the rotation axis. In this way, multiple positioning members 220 are simultaneously separated from the edge of the wafer 500, thereby restoring the multiple positioning members 220 to their initial positions to prepare for the next process.

[0073] The wafer supporting device of the semiconductor process equipment provided in the embodiment of the present application realizes that when the base body 100 rotates, the centrifugal force generated by the rotation is used to drive the positioning member 220 to move through the driving member 210 to center the position of the wafer 500, thereby maintaining a uniform gap between the wafer 500 and the supporting slot 140, avoiding the phenomenon of asymmetric edge thickness of the epitaxial film, and ensuring product quality.

[0074] Based on the wafer carrier device of the above-mentioned semiconductor process equipment, an embodiment of the present application also discloses a semiconductor process equipment. The disclosed semiconductor process equipment includes a process chamber, in which the above-mentioned wafer carrier device is arranged. In this way, the semiconductor process equipment can also achieve the technical effect achieved by the above-mentioned wafer carrier device.

[0075] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A wafer carrier device for semiconductor process equipment, characterized in that: The wafer carrying device includes: A rotatable base body (100), the base body (100) having a bearing slot (140), the bearing slot (140) being used to accommodate a wafer (500); A plurality of positioning assemblies (200) are arranged on the base body (100), and the plurality of positioning assemblies (200) are arranged around the bearing slot (140) around the rotation axis of the base body (100), and each positioning assembly (200) includes a positioning member (220) and a driving member (210), wherein the positioning member (220) can move relative to the base body (100), and a second through hole (221) is provided on the positioning member (220), and one end of the driving member (210) is passed through the second through hole (221), and a second gap (N) is formed between the driving member (210) and the second through hole (221), and the driving member (210) can drive the positioning member (220) to move toward the rotation axis under the action of the centrifugal force generated by the rotation of the base body (100), so as to drive the wafer (500) to move so that the center of the wafer (500) is located on the rotation axis.

2. The wafer carrier device according to claim 1, wherein: The driving member (210) is swingably arranged on the base body (100), and the positioning member (220) is movably arranged on the base body (100). The driving member (210) can swing under the action of the centrifugal force generated by the rotation of the base body (100). When the driving member (210) swings, it can contact the positioning member (220), so that the positioning member (220) approaches or moves away from the rotation axis.

3. The wafer carrier device according to claim 2, wherein: The driving member (210) comprises a rocking rod (211) and a swinging body (212) arranged on the rocking rod (211); the swinging body (212) separates the rocking rod (211) into a first rod segment (2111) and a second rod segment (2112); the center of gravity of the rocking rod (211) is located in the second rod segment (2112); and the first rod segment (2111) is used to contact the positioning member (220); The base body (100) is provided with a plurality of swing grooves (110), the plurality of swing grooves (110) are centrally symmetrically arranged around the bearing groove (140) around the rotation axis, and the plurality of swing bodies (212) are arranged in the swing grooves (110) in a one-to-one correspondence; The wall surface of the swing groove (110) is connected to the side of the base body (100) facing away from the bearing groove (140) to form a first through hole (120); the second rod segment (2112) is passed through the first through hole (120), and a first gap (M) is formed between the second rod segment (2112) and the first through hole (120).

4. The wafer carrying device according to claim 3, characterized in that: The first rod segment (2111) is passed through the second through hole (221), and a second gap (N) is formed between the first rod segment (2111) and the second through hole (221).

5. The wafer carrying device according to claim 4, characterized in that: The first rod segment (2111) has a first side close to the rotation axis and a second side away from the rotation axis, and the second through hole (221) has a third side corresponding to the first side and a fourth side corresponding to the second side; When the center line of the driving member (210) is parallel to the rotation axis, the distance between the first side and the third side is greater than the distance between the second side and the fourth side.

6. The wafer carrying device according to claim 3, wherein: A plurality of accommodating grooves (130) are provided on the base body (100), and the plurality of accommodating grooves (130) are centrally symmetrically arranged around the bearing groove (140) around the rotation axis; The plurality of positioning members (220) are arranged in a one-to-one correspondence with the plurality of accommodating slots (130), and can extend or retract relative to the accommodating slots (130); The plurality of swing grooves (110) are opened on the bottom walls of the plurality of accommodating grooves (130) in a one-to-one correspondence.

7. The wafer carrying device according to claim 6, characterized in that: The bearing slot (140) comprises a bearing surface (141) for supporting the wafer (500) and a side wall (142) arranged around the bearing surface (141), and a plurality of the accommodating slots (130) are opened on the side wall (142) in a centrally symmetrical manner around the rotation axis.

8. The wafer carrying device according to claim 3, wherein: The swinging body (212) is a hemisphere, and the first rod segment (2111) and the second rod segment (2112) are respectively coaxially arranged with the hemisphere; And / or, the first rod segment (2111), the second rod segment (2112) and the swinging body (212) are integrally arranged.

9. The wafer carrying device according to claim 1 or 2, characterized in that: An arc-shaped structure adapted to the edge of the wafer (500) is provided on the side wall of the positioning member (220) facing the rotation axis.

10. A semiconductor process equipment, comprising a process chamber, characterized in that: The process chamber is provided with a wafer carrying device as described in any one of claims 1 to 9.

Images