Wafer bonding packaging method

Abstract

The application provides a wafer bonding packaging process method, and belongs to the technical field of semiconductor manufacturing. The method specifically comprises the following steps: providing a first substrate and a second substrate, and preparing a support layer on the first substrate; printing bonding glue on the support layer; aligning the second substrate and the first substrate with the bonding glue printed thereon in a vacuum environment, and gradually making the two substrates contact and adhere to form an adhered body; and curing or pre-curing the adhered body. Through the processing scheme, a special wafer clamping jig is not needed, the process flow is simplified, various risks affecting the bonding quality are eliminated, the wafer bonding quality and yield are effectively improved, the production cost is reduced, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a wafer bonding packaging method. BACKGROUND

[0002] Wafer bonding process is widely used in the fields of integrated circuit manufacturing, micro-electro-mechanical device manufacturing, wafer-level advanced packaging manufacturing, display panel manufacturing, LED device manufacturing, printed circuit board manufacturing, touch screen manufacturing, solar photovoltaic manufacturing, etc. In particular, it is widely used in the fields of advanced packaging 2.5D or 3D technology, compound semiconductor application, and wafer-level image sensor manufacturing.

[0003] In the field of wafer bonding using organic glue, such as wafer-level image sensor (CIS, CMOS Image Sensor) packaging bonding, in the traditional bonding process, before bonding two wafers, a special jig is needed to fix the two wafers that have been aligned and to separate the two wafers. The stability of the structure of the jig will affect the quality of the final wafer bonding, and the transmission process of the jig also increases the complexity of the process.

[0004] In the process from wafer alignment to wafer bonding, there are also processes such as transferring the jig, removing the isolation device to bond the two wafers, and applying temperature and pressure for bonding. Each process step may cause additional positional deviation between the two wafers.

[0005] Due to factors such as wafer warping, deformation, clamping, etc., the wafer pair clamped and separated on the jig may contact in some areas before the vacuumizing and bonding process, thereby causing the risk of partial bonding failure. SUMMARY

[0006] Therefore, the embodiments of the present application provide a wafer bonding packaging method to at least partially solve the problems in the prior art.

[0007] In a first aspect, the embodiments of the present application provide a wafer bonding packaging method, which comprises:

[0008] providing a first substrate and a second substrate, and preparing a support layer on the first substrate;

[0009] printing bonding glue on the support layer;

[0010] aligning the second substrate and the first substrate with the printed bonding glue in a vacuum environment, and gradually making the two substrates contact and bond to form a bonded body;

[0011] Optionally, the bonded body is cured or pre-cured.

[0012] According to a specific implementation manner of the embodiment of the present application, after the step of printing the bonding glue on the support layer, further comprising: coating a line of light-curing glue on the edge of the first substrate or the second substrate; the line of light-curing glue is cured by light irradiation in the curing or pre-curing stage, so as to form a vacuum sealed cavity between the first substrate and the second substrate.

[0013] According to a specific implementation manner of the embodiment of the present application, the bonding glue is a combination of one or more of heat-curing bonding glue and light-curing bonding glue, and the first substrate / second substrate is wafer-level glass, flat plate type glass, wafer-level mold seal, flat plate type mold seal, wafer-level silicon wafer, solar substrate or PCB board.

[0014] According to a specific implementation manner of the embodiment of the present application, when the bonding glue is heat-curing bonding glue, the lamination is cured or pre-cured by applying heat; when the bonding glue is light-curing bonding glue, the lamination is cured or pre-cured by applying light.

[0015] According to a specific implementation manner of the embodiment of the present application, after the step of curing or pre-curing the lamination, further comprising:

[0016] placing the lamination into an atmospheric environment;

[0017] transferring the single or multiple laminations into a heat oven, a light oven or a bonding machine with pressure and temperature control for single or batch bonding.

[0018] According to a specific implementation manner of the embodiment of the present application, the support layer is an ordered arrangement of hollow grid structure formed by exposure and development of photosensitive material, or by screen printing / glue forming of glue material, or by inkjet printing of ink material.

[0019] According to a specific implementation manner of the embodiment of the present application, the way of printing the bonding glue on the support layer is screen printing or glue coating system.

[0020] In a second aspect, the embodiment of the present application further provides a wafer bonding packaging method, comprising:

[0021] providing a first substrate and a second substrate, printing a layer of bonding glue on the first substrate, the bonding glue covering an area corresponding to the bonding area of the second substrate;

[0022] aligning the second substrate and the first substrate with the bonding glue printed thereon in a vacuum environment, and gradually making them contact and laminate to form a lamination;

[0023] Optionally, curing or pre-curing the lamination.

[0024] According to a specific implementation manner of the embodiment of the present application, after printing a layer of bonding glue on the first substrate, further comprising: coating a circle of light-curing glue line on the edge of the first substrate or the second substrate; the light-curing glue line is cured by exposure in the curing or pre-curing stage, so as to form a vacuum sealed cavity between the first substrate and the second substrate.

[0025] According to a specific implementation manner of the embodiment of the present application, the bonding glue is a combination of one or more of heat-curing bonding glue and light-curing bonding glue, and the first substrate / second substrate is wafer-level glass, flat plate type glass, wafer-level mold seal, flat plate type mold seal, wafer-level silicon wafer, solar substrate or PCB board.

[0026] Advantages

[0027] The wafer bonding packaging method in the embodiment of the present application and the wafer bonding process proposed in the present application do not need a special wafer clamping jig, simplify the process flow, eliminate various risks affecting the bonding quality, and can effectively improve the wafer bonding quality. Since the present application is performed under vacuum alignment, the wafer will not be in contact in advance before vacuumizing, eliminating the wafer warping, deformation, clamping and other factors causing the bonding problem. And after the wafer alignment is completed, there is no additional position offset risk, and the alignment is stable and reliable. The process method can be more suitable for highly automated operation, and the process method can reduce product cost, improve product quality, improve product production efficiency and product yield. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0029] Figure 1 It is a schematic diagram of alignment and attachment under vacuum for the wafer bonding packaging method according to the embodiment of the present application;

[0030] Figure 2 It is a schematic diagram of the side view of the attached body according to the embodiment of the present application;

[0031] Figure 3 It is a schematic diagram of the inside of the attached body according to the embodiment of the present application;

[0032] Figure 4 It is a schematic diagram of batch bonding according to the embodiment of the present application;

[0033] Figure 5 It is a schematic diagram of the side view of the attached body according to another embodiment of the present application;

[0034] Figure 6 Internal view of the assembly according to another embodiment of the application.

[0035] In the figure: 1 - first substrate; 2 - second substrate; 3 - support layer; 4 - UV glue line. DETAILED DESCRIPTION

[0036] The embodiments of the present application will be described in detail with reference to the drawings, wherein:

[0037] The above embodiments are only used to illustrate the technical solutions of the present application, and are not used to limit the scope of the present application. Therefore, any changes, modifications, equivalents, and improvements made on the basis of the above embodiments should be covered by the scope of the present application.

[0038] It should be noted that various aspects of the embodiments described below are within the scope of the claims. It should be apparent that the aspects described herein can be implemented in a very wide variety of forms and that any specific structure and / or function described herein is merely illustrative. Based on the teachings provided herein one skilled in the art will appreciate the various ways in which the aspects described herein can be implemented.

[0039] It should also be noted that the figures provided in the following embodiments are only schematically illustrating the basic concept of the present application, and only the components related to the present application are shown in the figures, not the number, shape and size of the components when actually implemented. The actual implementation of each component may be a random change in shape, number and proportion, and the layout of the components may also be more complex.

[0040] In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, one skilled in the art will understand that the aspects described can be practiced without these specific details.

[0041] The current CIS packaging bonding process is generally as follows: two wafers are aligned on an alignment device, then a specific jig is used to fix the positions of the two wafers and separate the two wafers by a specific distance, so as to facilitate subsequent vacuum extraction between the two wafers; then the jig with the two aligned wafers is placed in a bonding device, vacuum is extracted, the isolation device between the two wafers is removed, and the two wafers are bonded in a vacuum state; finally, a specific temperature and pressure are applied to the wafers to cure the bonding glue between the two wafers.

[0042] In the above process, the applicant finds that each step can cause a positional deviation between the two wafers, resulting in inaccurate wafer alignment; before the vacuum extraction and bonding process step, due to factors such as wafer warping, deformation, clamping, etc., there can be partial contact in advance, thereby causing the risk of partial bonding failure.

[0043] To solve the above problems, the wafer bonding packaging method provided in the embodiments of the present application is described in detail as follows.

[0044] Embodiment 1

[0045] The wafer bonding packaging method provided in the embodiments of the present application is to modify the alignment device and add a vacuum device, so that the wafers are aligned and bonded in a vacuum environment. The method specifically includes the following steps:

[0046] S101, providing a first substrate 1 and a second substrate 2, and preparing a support layer 3 on the first substrate 1. Specifically, the support layer 3 with an ordered arrangement of hollow grid structures is first formed on the first substrate 1 by using a photosensitive material through exposure and development, or by using a glue material through screen printing / gluing, or by using an ink material through inkjet printing, as shown in Figure 3 .

[0047] S102, printing bonding glue on the support layer 3. In this embodiment, a layer of photocurable bonding glue or thermosetting bonding glue or light-heat combined curing bonding glue is printed on the support layer 3 by a screen printing process or a gluing process.

[0048] S103, aligning the second substrate 2 and the first substrate 1 with printed bonding glue in a vacuum environment, and gradually making them contact and bond to form a bonded body, as shown in Figure 1 . This step is performed in the alignment device with the added vacuum device. After the first substrate 1 with the glue and the second substrate 2 are extracted in vacuum in the alignment device, they are aligned and gradually made to fully contact and bond.

[0049] S104, curing the bonded body. Depending on the characteristics of the bonding glue, a suitable curing or pre-curing method should be selected during curing. If the bonding glue is a light-curing bonding glue, light is applied to the bonded body in the aligning machine to cure or pre-cure; if the bonding glue is a heat-curing bonding glue, the bonded body is heated in the aligning machine to cure or pre-cure; or, the bonding glue automatically cures or pre-cures after the first substrate and the second substrate are bonded under vacuum for a certain period of time.

[0050] S105, taking the aligned and bonded substrates out of the aligning device and placing them in an atmospheric environment. Since the previous bonding process forms a vacuum-sealed environment between the two substrates, the pressure difference between the inside and outside of the substrates achieves the effect of clamping the two substrates, as shown in FIG. 5. Since the clamping force formed by the pressure difference between the inside and outside keeps the aligned position fixed, the bonded body can be normally transferred by the mechanical hand. Figure 2

[0051] If the curing effect of step S104 has reached the bonding requirement, subsequent heat curing or light curing processes are not needed. If the curing effect needs further heat curing or light curing, step S106 needs to be performed.

[0052] S106, applying a specific pressure, temperature or light (usually ultraviolet light or infrared light) to the bonded body to cure the bonding glue between the two substrates, completing the process of bonding the substrates. The bonding process of the substrates can be performed in a traditional bonding device with heating and pressurization. Batch bonding of the substrates can also be performed in a light oven or a heat oven, as shown in FIG. 6. The light oven or the heat oven can accommodate a single or multiple bonded bodies for further bonding. If the pressure applied to the bonded body is different from the pressure of 1 atmosphere, the air pressure in the oven can be treated as negative pressure or overpressure, so as to achieve the application of a specific bonding pressure. Figure 4

[0053] In this embodiment, the alignment and bonding of the two substrates are directly performed in a vacuum environment, which is achieved by arranging the vacuum device in the aligning device. The two aligned substrates do not need to be fixed by a specific jig, eliminating the bonding quality risk caused by the bonding jig. After the alignment of the substrates in this embodiment, there is no additional risk of positional deviation, improving the yield and quality of the products. The process flow is simplified, and the process is more suitable for highly automated operation, improving the production efficiency of the products.

[0054] Embodiment 2

[0055] The difference between this embodiment and embodiment 1 is that a circle of light-curing glue lines 4 is coated on the edge of the first substrate 1 or the second substrate 2 after the step of printing the bonding glue on the support layer 3, as shown in FIG. 7. Figure 5 and Figure 6 ​​, the applied edge glue line can be cured using a light-curing method, and the first substrate 1 and the second substrate 2 are cured by light irradiation to form a good sealing and supporting effect. The method of the embodiment specifically includes the following steps:

[0056] S201, providing a first substrate 1 and a second substrate 2, and preparing a support layer 3 on the first substrate 1. Specifically, the first substrate 1 first needs to form an ordered arrangement of hollow grid structure support layer 3 by exposing and developing a photosensitive material, or by screen printing / pasting a glue material, or by inkjet printing a glue material.

[0057] S202, printing bonding glue on the support layer 3. In the embodiment, a layer of thermally cured bonding glue or light-thermal combined cured bonding glue is printed on the support layer 3 by a screen printing process.

[0058] S203, applying a circle of light-cured glue (generally ultraviolet or infrared) glue line 4 on the edge of the first substrate 1 or the second substrate 2, the position of the light-cured glue line 4 does not affect all the bonding areas of the substrate, refer to Figure 5 and Figure 6 .

[0059] S204, aligning the first substrate 1 and the second substrate 2 formed after the above steps in a vacuum environment, and gradually contacting and bonding them to form a bonded body. This step is carried out in an alignment device with a vacuum device. After the first substrate 1 and the second substrate 2 coated with glue are extracted under vacuum in the alignment device, they are aligned and gradually contacted and bonded.

[0060] S205, curing the bonded body. Since a circle of light-cured glue line 4 is applied on the edge of the first substrate 1 or the second substrate 2, a light-curing method is needed to cure by light (generally ultraviolet light or infrared light) irradiation, and the light-cured glue line 4 forms a good sealing and supporting effect. At this time, the thermally cured bonding glue or light-thermal combined cured bonding glue on the support layer 3 does not need to be bonded.

[0061] S206, taking the aligned and bonded bonded body out of the alignment device and placing it in an atmospheric environment. Since the edge glue line is cured by light, it plays a sealing and supporting role, and forms a vacuum sealed environment between the two substrates. The pressure difference between the inside and outside of the two substrates achieves the effect of clamping the two substrates, so the position of the two substrates will remain fixed, and the bonded body can be normally transferred by a mechanical hand.

[0062] If the curing effect of step S205 has reached the bonding requirement, the subsequent thermal curing process is not needed. If the curing effect needs further thermal curing or light curing, step S207 needs to be performed.

[0063] S207, applying specific pressure, temperature or light (usually ultraviolet light or infrared light) on the bonded body to solidify the bonding glue between the two substrates, and complete the process of substrate bonding. The bonding process of the substrate can be carried out in a conventional bonding device with heating and pressure; or the batch bonding of the substrate can be carried out in a light oven or a heat oven, as shown in Figure 4 The oven can place one or more bonded bodies for further bonding. If the pressure applied to the bonded body is different from the pressure of 1 atmosphere, the pressure in the oven can also be treated with negative pressure or overpressure, so as to achieve the application of specific bonding pressure.

[0064] Embodiment 3

[0065] The difference between this embodiment and embodiment 1 is that in this embodiment, the support layer 3 is not prepared, and the bonding glue is directly coated or printed on the substrate. The method of this embodiment specifically comprises the following steps:

[0066] S301, providing a first substrate 1 and a second substrate 2.

[0067] S302, coating a layer of bonding glue on the first substrate 1 to ensure that all bonding areas on the second substrate 2 can be covered. In this embodiment, the bonding glue is a heat-curable bonding glue or a light-curable bonding glue or a light-heat combined curing bonding glue.

[0068] S303, aligning the second substrate 2 and the first substrate 1 coated with the bonding glue in a vacuum environment, and gradually contacting and bonding the two to form a bonded body. This step is carried out in an alignment device with a vacuum device. After the first substrate 1 coated with the glue and the second substrate 2 are vacuumed in the alignment device, they are aligned and gradually contacted and bonded.

[0069] S304, curing or pre-curing the bonded body. Specifically, if the bonding glue is a light-curable bonding glue, light is applied to the bonded body in the alignment machine for curing or pre-curing; if the bonding glue is a heat-curable bonding glue, the bonded body is heated in the alignment machine for curing or pre-curing; or the bonding glue automatically cures or pre-cures after the first substrate and the second substrate are bonded in the vacuum for a certain time. The bonding glue can also play the role of vacuum sealing by its own adhesion, forming a good sealing and supporting effect.

[0070] S305, taking out the aligned and bonded substrates from the alignment device and placing them in an atmospheric environment. Due to the previous bonding process, a vacuum sealing environment is formed between the two substrates, and the pressure difference between the inside and outside of the substrate realizes the effect of clamping the two substrates, as shown in Figure 4 The clamping force formed by the pressure difference will keep the aligned position fixed, and the bonded body can be normally transferred by the mechanical hand.

[0071] If the curing effect of step S304 has reached the bonding requirement, no subsequent photocuring or thermal curing process is needed. If the above curing effect needs further photocuring or thermal curing, step S306 is needed.

[0072] S306, applying specific temperature and pressure on the bonded body to cure the bonding glue between the two substrates, and complete the process of bonding the substrates. The bonding process of the substrates can be carried out in a conventional bonding device with heating and pressure. Batch bonding of the substrates can also be carried out in a photo oven or a thermal oven, as shown in Figure 3 The oven can place one or more bonded bodies for further bonding. If the pressure applied to the bonded body needs to be different from the pressure of 1 atmosphere, the air pressure in the oven can also be treated with negative pressure or overpressure to achieve the application of specific bonding pressure.

[0073] Example 4

[0074] The difference between this embodiment and example 2 is that no support layer 3 is prepared in this embodiment, and the bonding glue is directly printed on the substrate. The method of this embodiment specifically includes the following steps:

[0075] S401, providing a first substrate 1 and a second substrate 2.

[0076] S402, applying a layer of whole bonding glue on the first substrate 1. In this embodiment, the bonding glue is a thermal curing bonding glue or a photo-thermal combined curing bonding glue, to ensure that all bonding areas (except the edge area) of the second substrate 2 can be covered.

[0077] S403, applying a circle of photocuring glue (usually ultraviolet or infrared) glue line 4 on the edge of the first substrate 1 or the second substrate 2, and the position of the photocuring glue line 4 does not affect all bonding areas of the substrate.

[0078] S404, aligning the first substrate 1 and the second substrate 2 formed after the above steps in a vacuum environment, and gradually contacting and bonding them to form a bonded body. This step is carried out in an alignment device with a vacuum device. The first substrate 1 and the second substrate 2 with glue are aligned after being vacuumized in the alignment device, and gradually contacted and bonded.

[0079] S405, curing the bonded body. Since the applied edge glue line is a photocuring glue line 4, photocuring method is needed. After irradiation, the cured edge wire forms a good sealing and supporting effect. At this time, the thermal curing bonding glue or the photo-thermal combined curing bonding glue does not need to achieve bonding.

[0080] S406, the aligned and attached assembly is taken out of the alignment device and placed into the atmosphere. Since the edge glue line is cured by light, it plays a role of sealing and supporting, and forms a vacuum sealed environment between the two substrates. The pressure difference between the inside and outside of the two substrates achieves the effect of clamping the two substrates. Therefore, the position of the alignment of the two substrates will remain fixed, and the assembly can be normally transferred by the mechanical hand.

[0081] If the curing effect of step S405 has reached the bonding requirement, subsequent heat curing process is not needed. If the curing effect needs further heat curing, step S407 needs to be performed.

[0082] S407, a specific temperature and pressure are applied to the assembly to cure the bonding glue between the two substrates, and the process of bonding the substrates is completed. The bonding process of the substrates can be performed in a conventional heating and pressing bonding device. Batch bonding of the substrates can also be performed in a light oven or a heat oven, as shown in FIG. 4. One or more assemblies can be placed in the oven for further bonding. If the pressure applied to the assembly is different from the pressure of 1 atmosphere, the pressure in the oven can also be treated as negative pressure or overpressure, so as to achieve the application of a specific bonding pressure. Figure 4

[0083] Embodiment 5

[0084] Different from the above-mentioned embodiments 1-4, in this embodiment, there is no support layer 3 in the first substrate 1 and the second substrate 2, and the bonding glue is coated on the first substrate 1, and the debonding glue is coated on the second substrate 2. This embodiment is suitable for temporary bonding process in advanced packaging process. The method of this embodiment specifically includes the following steps:

[0085] S501, a first substrate 1 and a second substrate 2 are provided. The first substrate 1 can be a wafer-level glass, a flat plate glass, a wafer-level mold encapsulant, a flat plate mold encapsulant, a wafer-level silicon wafer, a solar substrate or a PCB board. The second substrate 2 can be a silicon wafer, a glass or an iron plate.

[0086] S502, a layer of whole-surface bonding glue is coated on the first substrate 1 to ensure that all bonding areas on the second substrate 2 can be covered. In this embodiment, the bonding glue is a heat-curable bonding glue or a light-curable bonding glue or a light-heat combined curing bonding glue, so as to ensure that the bonding glue can cover all areas of the substrate that need to be attached.

[0087] S502, a layer of whole-surface debonding glue is coated on the second substrate 2, and the area of the debonding glue corresponds to the area of the bonding glue.

[0088] ​S503, the second substrate 2 coated with debonding glue and the first substrate 1 printed with bonding glue are aligned under vacuum environment, and gradually contacted to form a bonded body. This step is performed in an alignment device with a vacuum device. The first substrate 1 and the second substrate 2 coated with glue are aligned after being vacuumed in the alignment device, and gradually contacted to form a bonded body.

[0089] S504, the bonded body is cured or pre-cured. Specifically, if the bonding glue is a light-cured bonding glue, the bonded body is cured or pre-cured by applying light in the alignment machine; if the bonding glue is a heat-cured bonding glue, the bonded body is cured or pre-cured by applying heat in the alignment machine; or the bonding glue is automatically cured or pre-cured after the first substrate and the second substrate are bonded under vacuum for a certain period of time. The bonding glue can also play the role of vacuum sealing by its own adhesion, forming a good sealing and supporting effect.

[0090] S505, the aligned and bonded substrate is taken out of the alignment device and placed in an atmospheric environment. Since the previous bonding process forms a sealed environment between the two substrates, the pressure difference between the inside and outside of the substrate achieves the effect of clamping the two substrates, as shown in FIG. 5C. The clamping force formed by the pressure difference inside and outside keeps the aligned position fixed, and the bonded body can be normally transferred by a mechanical hand. Figure 4

[0091] If the curing effect of step S504 meets the bonding requirements, subsequent light curing or heat curing processes are not required. If the curing effect needs further light curing or heat curing, step S506 needs to be performed.

[0092] S506, a specific temperature and pressure are applied to the bonded body to cure the bonding glue between the two substrates, completing the process of bonding the substrates. The bonding process of the substrates can be performed in a conventional bonding device with heating and pressure. Batch bonding of substrates can also be performed in a heat oven or a light oven, as shown in FIG. 5E. One or more bonded bodies can be placed in the oven for further bonding. If the pressure applied to the bonded body is different from the pressure of 1 atmosphere, the air pressure in the oven can also be treated with negative pressure or overpressure, so as to achieve the application of a specific bonding pressure. Figure 3 It needs to be explained that the debonding glue in embodiment 5 can also play the role of bonding glue, such as thermal debonding glue, which can not need to be coated on the first substrate 1, but only through the debonding glue coated on the second substrate 2 to bond the two substrates.

[0093] It needs to be explained that the debonding glue in embodiment 5 can also be coated on the first substrate 1, and the bonding glue is coated on the second substrate 2.

[0094] It needs to be explained that the debonding glue in embodiment 5 can also be coated on the first substrate 1, and the bonding glue is coated on the second substrate 2.​

[0095] It should be noted that the first substrate 1 and the second substrate 2 in the above embodiments 1 to 5 can be a wafer-level glass, a flat plate glass, a wafer-level mold compound, a flat plate mold compound, a wafer-level silicon wafer, a solar substrate or a PCB board, but are not limited to the above, and should be determined according to actual process requirements.

[0096] In addition, the material of the support layer 3 in the above embodiments 1 to 2 can be a green paint material or a black paint material, but is not limited to the above, and should be determined according to actual process requirements.

[0097] The embodiments provided by the application solve the problem that a specific jig is needed to affect the bonding quality in the conventional wafer bonding, and a wafer bonding packaging process method is provided. In the conventional CIS packaging process, two wafers are bonded together by high-temperature bonding glue. One of the wafers first needs to form a hollow support layer by exposure of green paint material, and a layer of bonding glue is printed on the support layer by a screen printing process. Then, the wafer coated with the glue and the other wafer are aligned in an aligner, and are clamped by a jig to ensure that they do not contact and are fixed in a horizontal position. Next, the two wafers clamped by the jig are placed in a bonding machine to extract vacuum, and are combined together in a case that the two wafers do not deviate from the horizontal position. Then, the two wafers are bonded together by a bonding process flow through a pressurizing and heating device in the bonding machine. This method cannot bond multiple pairs of wafers at the same time, and there are many factors affecting the bonding quality in the operation process, and the process is complex.

[0098] Compared with the conventional bonding process, the bonding process of the application does not need a special jig to fix the wafers, the process flow is simple, stable and reliable, multiple pairs of bonded bodies can be bonded at the same time, and the production efficiency and quality of the product are improved.

[0099] The above is only a specific embodiment of the application, but the protection scope of the application is not limited thereto. Any changes or replacements within the technical range disclosed in the application can be easily thought of by those skilled in the art, and should be covered within the protection scope of the application. Therefore, the protection scope of the application should be subject to the protection scope of the claims.

Claims

1. A wafer bonding and packaging method, characterized in that, The method includes: A first substrate and a second substrate are provided, and a support layer having an ordered hollow grid structure is prepared on the first substrate; Bonding adhesive is printed on the support layer; a ring of photocurable adhesive line is coated on the edge of the first substrate or the second substrate; the photocurable adhesive line is cured by light irradiation during the curing or pre-curing stage, so that a vacuum-sealed cavity is formed between the first substrate and the second substrate. The second substrate and the first substrate printed with bonding adhesive are aligned in a vacuum environment and gradually brought into contact and bonded to form a bonded body. A vacuum device is added to the alignment device to achieve alignment and bonding of the second substrate and the first substrate printed with bonding adhesive in the alignment device. The pressure difference between the internal pressure and the external pressure between the first substrate and the second substrate forms a clamping force to clamp the first substrate and the second substrate. The bonding material is further cured or pre-cured.

2. The wafer bonding and packaging method according to claim 1, characterized in that, The bonding adhesive is one or more of thermosetting bonding adhesive and photocuring bonding adhesive. The first substrate includes: wafer-level glass, wafer-level molding compound, and wafer-level silicon wafer. The second substrate includes: silicon wafer and glass.

3. The wafer bonding and packaging method according to claim 2, characterized in that, When the bonding adhesive is a thermosetting bonding adhesive, the bond is cured or pre-cured by increasing the temperature; when the bonding adhesive is a photocurable bonding adhesive, the bond is cured or pre-cured by applying ultraviolet light; or, the bonding adhesive is automatically cured or pre-cured after the first substrate and the second substrate are bonded under vacuum for a certain period of time.

4. The wafer bonding and packaging method according to claim 1, characterized in that, After the curing or pre-curing step of the adhesive, the following steps are also included: Place the assembly into the atmospheric environment; One or more of the laminates are fed to a hot oven, light oven, or bonding machine with pressure and temperature control for single or batch bonding.

5. The wafer bonding and packaging method according to claim 1, characterized in that, The support layer is formed by using photosensitive materials through exposure and development, adhesive materials through screen printing / coating, or ink materials through inkjet printing.

6. The wafer bonding and packaging method according to claim 5, characterized in that, The bonding adhesive is printed on the support layer by screen printing or by applying adhesive using an adhesive coating system.

7. A wafer bonding and packaging method, characterized in that, The method includes: A first substrate and a second substrate are provided. A layer of bonding adhesive is printed on the first substrate, and the area covered by the bonding adhesive corresponds to the bonding area of ​​the second substrate. A ring of photocurable adhesive line is coated on the edge of the first substrate or the second substrate. The photocurable adhesive line is cured by light irradiation during the curing or pre-curing stage, so that a vacuum-sealed cavity is formed between the first substrate and the second substrate. The second substrate and the first substrate printed with bonding adhesive are aligned in a vacuum environment and gradually brought into contact and bonded to form a bonded body. A vacuum device is added to the alignment device to achieve alignment and bonding of the second substrate and the first substrate printed with bonding adhesive in the alignment device. The pressure difference between the internal pressure and the external pressure between the first substrate and the second substrate forms a clamping force to clamp the first substrate and the second substrate. The bonding material is cured or pre-cured.

8. The wafer bonding and packaging method according to claim 7, characterized in that, The bonding adhesive is one or more of thermosetting bonding adhesive and photocuring bonding adhesive. The first substrate includes: wafer-level glass, wafer-level molding compound, and wafer-level silicon wafer. The second substrate includes: silicon wafer and glass.

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