A power module

Abstract

The embodiment of the present application discloses a power module, comprising: a substrate, the surface of which has a conductive circuit; at least two pin sockets, electrically connected to the conductive circuit; a drainage base, fixed on the substrate; and a glue layer, the glue layer is laid on the surface of the substrate and covers the conductive circuit, the drainage base and the pin sockets; two adjacent pin sockets are at a first distance threshold, and at least one drainage base is arranged between the two pin sockets. A power module of the embodiment of the present application has the advantages of low cost and good electrical insulation performance.

Description

Technical Field

[0001] The present application relates to the field of packaging, and in particular to a power module. Background Art

[0002] In the prior art, the composition and production process of the power module are as follows: a circuit is etched on one side of a copper-clad ceramic substrate (DBC), a chip and a pin base are welded on it, the chip and the circuit are connected by metal wires, the DBC is installed on a plastic shell, a metal pin is inserted into the pin base, and a glue layer is poured into the inside of the shell.

[0003] However, in the current filling process, the amount of material used in the rubber layer is generally too much, which makes the cost high. In addition, due to fluidity problems, the rubber layer is exposed, resulting in poor electrical insulation performance. Summary of the invention

[0004] In view of this, the embodiments of the present application hope to provide a power module to improve the problems of high cost and poor electrical insulation performance.

[0005] To achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

[0006] A power module, comprising:

[0007] A substrate, wherein a surface layer of the substrate has a conductive circuit;

[0008] At least two pin sockets electrically connected to the conductive circuit;

[0009] A drainage base, fixed on the substrate;

[0010] and an adhesive layer, the adhesive layer being laid on the surface of the substrate and covering the conductive circuit, the drainage base and the pin seat;

[0011] Two adjacent pin seats are at a first distance threshold, and at least one drainage base is arranged between the two pin seats.

[0012] Furthermore, the adhesive layer is a silicone gel layer.

[0013] Furthermore, the difference in thickness of the adhesive layer at various locations is no greater than 1 mm.

[0014] Furthermore, the first distance threshold is greater than or equal to 1 cm.

[0015] Further, the power module includes a chip, and the chip is electrically connected to the conductive circuit;

[0016] The chip is located between two adjacent pin sockets, and the two pin sockets are at a first distance threshold, and at least one drainage base is arranged between the two pin sockets.

[0017] Furthermore, the surface layer of the substrate has at least two conductive circuits, and each of the conductive circuits is electrically connected to at least one of the pin seats;

[0018] Two adjacent conductive lines are electrically connected via a bonding structure;

[0019] The adhesive layer covers the bonding structure.

[0020] Furthermore, the bonding structure is located between two adjacent pin seats, and the two pin seats are at a first distance threshold, and at least one drainage base is arranged between the two pin seats.

[0021] Furthermore, the drainage base is higher than the bonding structure.

[0022] Further, the drainage base is arranged on the conductive line; or,

[0023] The drainage base is arranged on a region of the substrate excluding the conductive circuit.

[0024] Furthermore, the power module comprises a shell covering the substrate, and the adhesive layer is laid on a surface area of ​​the shell covering the substrate.

[0025] A power module according to an embodiment of the present application is provided with a substrate, at least two pin sockets, a drainage base and a glue layer, wherein two adjacent pin sockets are at a first distance threshold, and at least one drainage base is provided between the two pin sockets. Through the infiltration effect of the drainage base, the liquid level of the glue layer near the drainage base will not be concave due to being away from the pin sockets, thereby ensuring that the liquid level of the glue layer between the two pin sockets remains flat, that is, the thickness of the liquid level of the glue layer is basically the same at various locations, thereby preventing the conductive circuits or other electronic components on the power module from being exposed from weak points, so that all structures inside the power module are adequately and non-redundantly protected, so that the electrical insulation performance of the power module is good and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a physical schematic diagram of the exposed aluminum wire of the power module in the prior art;

[0027] Figure 2 It is a schematic diagram of the structure of the power module with exposed aluminum wire in the prior art, and the dotted line is the surface of the glue layer;

[0028] Figure 3 It is a schematic diagram of the structure of a power module in the prior art, and the dotted line is the surface of the glue layer;

[0029] Figure 4A schematic diagram of the structure of a power module according to an embodiment of the present application;

[0030] Figure 5 It is a three-dimensional schematic diagram of a power module according to an embodiment of the present application, wherein the housing, the adhesive layer and the bonding structure are omitted;

[0031] Figure 6 It is a top view of the power module of the first embodiment of the present application, wherein the housing and the adhesive layer are omitted;

[0032] Figure 7 for Figure 6 A front view of a power module, wherein the dotted line is the surface of the glue layer;

[0033] Figure 8 It is a top view of the power module of the second embodiment of the present application, in which the housing and the adhesive layer are omitted;

[0034] Fig. 9 for Figure 8 A front view of a power module, wherein the dotted line is the surface of the glue layer;

[0035] Fig.10 It is a top view of the power module of the third embodiment of the present application, in which the housing and the adhesive layer are omitted;

[0036] Fig.11 for Fig.10 A front view of a power module, wherein the dotted line is the surface of the glue layer;

[0037] Fig.12 It is a top view of the power module of the fourth embodiment of the present application, in which the housing and the adhesive layer are omitted;

[0038] Fig.13 for Fig.12 A front view of a power module, wherein the dotted line is the surface of the glue layer;

[0039] Fig.14 It is a top view of the power module of the fifth embodiment of the present application, in which the housing and the adhesive layer are omitted;

[0040] Fig.15 for Fig.14 A front view of a power module, wherein the dotted line is the surface of the glue layer;

[0041] Fig.16 It is a top view of the power module of the sixth embodiment of the present application, in which the housing and the adhesive layer are omitted;

[0042] Fig.17 for Fig.16 A front view of a power module, wherein the dotted line is the surface of the glue layer. DETAILED DESCRIPTION

[0043] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed descriptions in the specific implementation methods should be understood as explanations of the present application and should not be regarded as improper limitations on the present application.

[0044] In the description of the embodiments of the present application, the directions or positional relationships of "up", "down", "left", "right", "front", and "rear" are based on the attached Figure 4 Regarding the orientation or positional relationship shown, it should be understood that these orientation terms are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0045] In related technologies, such as Figures 1 to 3 As shown, when the liquid gel layer 1' contacts the solid, a thin liquid layer is formed at the contact point, which is called an adhesion layer. The molecules inside the adhesion layer are attracted by both the liquid molecules and the solid molecules. For most of the gel layers 1', the attraction of the external solid molecules on the liquid gel molecules is greater than the attraction between the gel molecules, so the molecular density of the adhesion layer will be greater than the molecular density of the liquid gel. At this time, the molecular interaction in the adhesion layer manifests as repulsion, and the liquid surface shows a tendency to diffuse, forming an infiltration phenomenon.

[0046] Due to the existence of the infiltration phenomenon, the surface of the glue layer 1' inside the module is not flat, but concentrated on the surrounding shell 2' and the base 4' for inserting each metal pin 3'. In the area far away from the shell 2' and without the base 4', the glue layer 1' will be shallow, and at this time it may not meet the required thickness for protection, resulting in a compromise in the electrical insulation performance of the chip 6', or the surface 11' of the glue layer 1' will be lower than the metal wire 5' or the chip 6', thereby causing it to be exposed to the air, resulting in electrical failure.

[0047] like Figure 3 As shown, in order to ensure the electrical insulation performance, the operator usually adds an excessive amount of glue layer 1' so that the weakest part of the glue layer 1' can also reach the corresponding thickness A' to completely cover the corresponding electrical components and metal wires 5'; however, this practice will increase the filling cost, and due to the wetting effect, if the sealing is not done properly, the weakest part A' of the glue layer 1' may still expose the metal wires 5'.

[0048] The present application embodiment provides a power module, such as Figures 4 to 17 As shown, the power module includes: a substrate 10 , at least two pin sockets 20 , a drainage base 30 and a glue layer 40 .

[0049] The surface of the substrate 10 has a conductive circuit 11. The pin holder 20 is fixed on the surface of the substrate 10 and electrically connected to the conductive circuit 11. The pin holder 20 is used to install the pin 21. The pin 21 is electrically connected to the conductive circuit 11 through the pin holder 20, and then electrically connected to other electronic components arranged on the substrate 10. The electronic components can be the necessary elements to complete the functions of the power module, such as the chip 60 (mentioned below). One end of the pin 21 is connected to the pin holder 20, and the other end passes through the housing 50 (mentioned below) for connecting to an external circuit.

[0050] The drainage base 30 is fixed on the substrate 10; the adhesive layer 40 is laid on the surface of the substrate 10 and covers the conductive line 11, the drainage base 30 and the pin socket 20. Among them, two adjacent pin sockets 20 are at a first distance threshold, and at least one drainage base 30 is arranged between the two pin sockets 20.

[0051] Specifically, the first distance threshold is greater than or equal to 1 cm, and the pin seat 20 itself generates a wetting phenomenon when it contacts the glue layer 40, so that the liquid level of the glue layer 40 close to the pin seat 20 is relatively high, while the liquid level of the glue layer 40 far away from the pin seat 20 is relatively low. When the distance between the two pin seats 20 is close, the liquid level of the glue layer 40 does not change significantly, so the liquid level thickness of the glue layer 40 will be relatively consistent; when the distance between the two pin seats 20 is too large, that is, greater than or equal to 1 cm, the liquid level of the glue layer 40 in the middle between the two pin seats 20 will be significantly concave; by providing at least one drainage base 30 between the two pin seats 20, the glue layer 40 in the middle between the two pin seats 20 is in contact with the drainage base 30, and a thin layer of liquid adhesion layer is formed at the contact point. The molecules inside the attachment layer are attracted by the drainage base 30, and the liquid surface shows a tendency to diffuse, forming an infiltration phenomenon, so that the liquid surface of the glue layer 40 near the drainage base 30 will not be concave due to being away from the pin seat 20, ensuring that the liquid surface of the glue layer 40 between the two pin seats 20 remains flat, that is, the thickness of the liquid surface of the glue layer 40 is basically the same everywhere, preventing the glue layer 40 from forming a slurry on the conductive line 11 or other electronic components. Figure 3 The weak point A' shown can prevent the conductive line 11 or other electronic components on the power module from being exposed from the weak point, so that all structures inside the power module are adequately and non-redundantly protected, so that the electrical insulation performance of the power module is good and the cost of the glue layer 40 is low.

[0052] It can be understood that in each embodiment of the present application, under the infiltration effect of the drainage base 30, the liquid surface of the adhesive layer 40 is basically the same thickness at all locations, so the operator does not need to add excessive adhesive layer 40, thereby saving the amount of adhesive layer 40, having good processability and low cost.

[0053] In each embodiment of the present application, Figure 4and Figure 5 As shown, the substrate 10 includes a matrix 12, the top surface 12a of the matrix 12 faces the housing 50, the conductive circuit 11 is laid on the top surface 12a of the matrix 12, and the bottom surface 12b of the matrix 12 faces away from the housing 50. The bottom surface 12b of the matrix 12 may be provided with a bottom conductive plate 13 as needed, or it may not be provided.

[0054] The matrix 12 may be, for example, a ceramic such as alumina, silicon nitride, or aluminum nitride ceramic, while the substrate 10 may be configured, for example, as a direct copper bond (DCB), direct aluminum bond (DAB), or active metal brazing (AMB) substrate.

[0055] The conductive circuit 11 may be an etched copper foil circuit, and the bottom conductive plate 13 may be a whole piece of copper foil.

[0056] The pin socket 20 may be a copper base, and the pin socket 20 and the conductive circuit 11 may be fixedly connected by welding.

[0057] In each embodiment of the present application, Figures 4 to 7 ,as well as Figures 12 to 15 As shown, two adjacent pin seats 20 are at a first distance threshold, for example, the distance between the two adjacent pin seats 20 is 1.6 cm, and a drainage base 30 can be set between the two pin seats 20, so that the distance from the drainage base 30 to the pin seat 20 is at a second distance threshold. Usually, the second distance threshold is a threshold other than the first distance threshold. Taking the first distance threshold being greater than or equal to 1 cm as an example, the second distance threshold may be less than 1 cm; thereby, through the infiltration effect of a drainage base 30, the liquid surface of the glue layer 40 between the two pin seats 20 and the drainage base 30 is made flat.

[0058] In some cases, two adjacent pin sockets 20 are at a first distance threshold. After a drainage base 30 is inserted between the two adjacent pin sockets 20, the distance from the drainage base 30 to the pin socket 20 is still within the first distance threshold. For example, the distance between the two adjacent pin sockets 20 is 3 cm. The infiltration effect of a single drainage base 30 can only raise the liquid level of the adhesive layer 40 within a certain range around it. Therefore, after inserting a drainage base 30, the distance from the drainage base 30 to the pin socket 20 is 1.5 cm. The distance is still too large, and the liquid level of the adhesive layer 40 between the drainage base 30 and the pin socket 20 will still appear significantly concave, resulting in a weak portion.

[0059] Therefore, in each embodiment of the present application, Figures 8 to 11 ,as well as Figure 16 to Figure 17As shown, two adjacent pin seats 20 are at a first distance threshold, and two drainage bases 30 can be arranged between the two pin seats 20; so that the distance from the drainage base 30 to the pin seat 20 and the distance between the drainage base 30 and the drainage base 30 are at a second distance threshold, so that the liquid surface of the glue layer 40 near the drainage base 30 will not be concave due to being away from the pin seat 20, ensuring that the liquid surface of the glue layer 40 between the drainage base 30 and the pin seat 20 and between the drainage base 30 and the drainage base 30 remains flat, that is, the thickness of the liquid surface of the glue layer 40 is basically the same everywhere, preventing the glue layer 40 from forming a concave surface above the conductive circuit 11 or other electronic components. Figure 3 The weak point A' shown can prevent the conductive line 11 or other electronic components on the power module from being exposed from the weak point, so that the electrical insulation performance of the power module is good.

[0060] It is understandable that in some other embodiments, the number of drainage bases 30 can be adjusted according to the distance between two pin seats 20 .

[0061] In various embodiments of the present application, depending on the material of the adhesive layer 40 used, the first distance threshold may be greater than or equal to 1 cm, and the second distance threshold may correspond to less than 1 cm. The first distance threshold may be greater than or equal to 2 cm, and the second distance threshold may correspond to less than 2 cm.

[0062] In one embodiment, the adhesive layer 40 is a silicone gel layer. Silicone gel is a special encapsulant that can solidify from a liquid to an extremely soft material after being heated, and forms good adhesion on the material. The cured gel retains most of the stress relief ability and self-healing properties of the liquid, while providing the dimensional stability of the elastomer, which is very important for delicate parts. Silicone gel is used to isolate circuits from the harmful effects of moisture and other contaminants, and to provide electrical insulation for high voltages. Another use is to provide stress relief to protect circuits and interconnects from thermal and mechanical stresses. Silicone gel is usually applied in the form of a thick layer wrap to completely encapsulate a structure of a certain thickness. The viscosity of the mixed silicone gel is generally between 400 and 500 cps, which is comparable to vegetable oil and is a liquid with good fluidity. Medium and large power modules basically use silicone gel to protect semiconductor chips, form solid insulation, prevent external impurities from invading, and keep the overall stress of the module released.

[0063] In each embodiment of the present application, Figures 4 to 17As shown, the adhesive layer 40 should be able to completely cover the drainage base 30, the pin seat 20, the chip 60 and other structures. The covering thickness of the adhesive layer 40 is designed according to the electrical insulation design standard, and the thickness is usually not less than 5 mm. In addition, by adding the drainage base 30, under the infiltration effect of the drainage base 30, the thickness of the liquid surface 40a of the adhesive layer 40 is basically the same at various locations, that is, the difference in thickness of the adhesive layer 40 at various locations is not higher than 1 mm, that is, the height difference D of the liquid surface 40a at the highest point B and the lowest point C is not higher than 1 mm. Therefore, the operator does not need to add excessive adhesive layer 40, thereby saving the amount of adhesive layer 40, and has good processability and low cost.

[0064] In one embodiment, if Figures 4 to 17 As shown, the power module includes a chip 60 , which is fixed on the surface of the substrate 10 and electrically connected to the conductive line 11 .

[0065] The chip 60 may be an IGBT chip, a MOS chip, an FRD chip, etc. of a power semiconductor. The chip 60 is bonded to other electrical components (not shown) of the power module by means of a conductive line 11 and through a bonding structure 111, for example, bonded to contact joints, metal pins 21, and / or other power semiconductor chips 60.

[0066] The chip 60 is located between two adjacent pin seats 20 , and the two pin seats 20 are at a first distance threshold, and at least one drainage base 30 is disposed between the two pin seats 20 ; to ensure that the liquid surface of the glue layer 40 completely covers the chip 60 .

[0067] Specifically, Figure 8 and Fig. 9 As shown, a chip 60 and two pin sockets 20 are connected to a conductive line 11, the chip 60 is located between two adjacent pin sockets 20, and the glue layer 40 is laid on the surface of the substrate 10 and covers the conductive line 11, the chip 60 and the pin socket 20. By arranging drainage bases 30 on both sides of the chip 60, the distance from the drainage base 30 to the pin socket 20 and the distance between the drainage bases 30 and the drainage bases 30 are at a second distance threshold, for example, the second distance threshold is less than 1 cm, so that the liquid level of the glue layer 40 near the drainage base 30 will not be concave due to being away from the pin socket 20, ensuring that the distance from the drainage base 30 to the pin socket 20 and the liquid level of the glue layer 40 between the drainage bases 30 and the drainage bases 30 remain flat, preventing the glue layer 40 from forming a weak point above the chip 60, and preventing it from being exposed from the weak point, so that the electrical insulation performance of the power module is good.

[0068] like Fig.12 and Fig.13As shown, each of the two conductive circuits 11 is connected to a pin socket 20, the chip 60 is arranged on any one of the conductive circuits 11, and is electrically connected to the other conductive circuit 11 through a bonding structure 111 (mentioned below), the chip 60 is located between two adjacent pin sockets 20, and the glue layer 40 is laid on the surface of the substrate 10 and covers the two conductive circuits 11, the chip 60 and the pin sockets 20. By setting a drainage base 30 on one of the conductive lines 11, the distance from the drainage base 30 to the pin seat 20 and the distance between the drainage base 30 and the drainage base 30 are at a second distance threshold, for example, the second distance threshold is less than 1 cm, so that the liquid level of the glue layer 40 near the drainage base 30 will not appear concave due to being away from the pin seat 20, ensuring that the distance from the drainage base 30 to the pin seat 20 and the liquid level of the glue layer 40 between the drainage base 30 and the drainage base 30 remain flat, preventing the glue layer 40 from forming a weak point above the chip 60, and thus preventing it from being exposed from the weak point, so that the electrical insulation performance of the power module is good.

[0069] like Fig.16 and Fig.17 As shown, each of the two conductive circuits 11 is connected to a pin socket 20, the chip 60 is arranged on one of the conductive circuits 11 and is electrically connected to the other conductive circuit 11 through a bonding structure 111 (mentioned below), the chip 60 is located between two adjacent pin sockets 20, and the glue layer 40 is laid on the surface of the substrate 10 and covers the two conductive circuits 11, the chip 60 and the pin sockets 20. By arranging two drainage bases 30 on the matrix 12 of the substrate 10 between the two conductive lines 11, the distance from the drainage base 30 to the pin seat 20 and the distance between the drainage base 30 and the drainage base 30 are at a second distance threshold, for example, the second distance threshold is less than 1 cm, so that the liquid level of the glue layer 40 near the drainage base 30 will not appear concave due to being away from the pin seat 20, ensuring that the distance from the drainage base 30 to the pin seat 20 and the liquid level of the glue layer 40 between the drainage base 30 and the drainage base 30 remain flat, preventing the glue layer 40 from forming a weak point above the chip 60, and thus preventing it from being exposed from the weak point, so that the electrical insulation performance of the power module is good.

[0070] like Figure 4 and Figure 5 As shown, a pin socket 20 is connected to each of the two conductive circuits 11, and the chip 60 is separately arranged on the third conductive circuit 11 and electrically connected to the other two conductive circuits 11 through a bonding structure 111. The adhesive layer 40 is laid on the surface of the substrate 10 and covers the two conductive circuits 11, the chip 60 and the pin socket 20, which will not be repeated here.

[0071] In one embodiment, if Figure 4 , Figure 5 ,as well as Figures 10 to 17 As shown, the surface layer of the substrate 10 has at least two conductive circuits 11, that is, the top surface 12a of the matrix 12 has at least two conductive circuits 11 independent of each other; each conductive circuit 11 is electrically connected to at least one pin holder 20, that is, one conductive circuit 11 can be directly connected to one pin holder 20 as a whole, or one conductive circuit 11 can be directly connected to two or more pin holders 20 as a whole, which is subject to the specific design.

[0072] Each pin socket 20 is plugged with a pin 21, and the pin 21 is electrically connected to the conductive circuit 11 through the pin socket 20. Two adjacent conductive circuits 11 are electrically connected through a bonding structure 111. The bonding structure 111 can be made of gold wire bonding technology, or aluminum wire or copper wire. The adhesive layer 40 covers the bonding structure 111 to achieve electrical insulation.

[0073] In one embodiment, if Figure 4 , Figure 5 ,as well as Figures 10 to 17 As shown, the bonding structure 111 is located between two adjacent pin seats 20, and the two pin seats 20 are at a first distance threshold, and at least one drainage base 30 is arranged between the two pin seats 20; so that the liquid level of the glue layer 40 completely covers the bonding structure 111, and the drainage base 30 is arranged in a relatively open area of ​​the substrate 10 of the power module (that is, away from the pin seats 20 and the housing 50), and the drainage base 30 is fixed on the substrate 10, which plays a role in balancing the liquid level of the glue layer 40, so that the thickness of the glue layer 40 inside the entire power module is basically consistent, and all bonding structures 111 are adequately and non-redundantly protected.

[0074] In some embodiments, Fig.10 , Fig.11 , 14 as well as Fig.15 As shown, at least one pin seat 20 is connected to each of the two conductive circuits 11, the two conductive circuits 11 are electrically connected via a bonding structure 111, and the drainage base 30 is fixed on the substrate 10;

[0075] Two adjacent pin sockets 20 are at a first distance threshold, and one, two or more drainage bases 30 can be set between the two pin sockets 20; so that the distance from the drainage base 30 to the pin socket 20 and the distance between the drainage base 30 are at a second distance threshold, so that the liquid level of the glue layer 40 near the drainage base 30 will not appear concave due to the distance from the pin socket 20; it plays a role in balancing the liquid level of the glue layer 40, so that the thickness of the glue layer 40 inside the entire power module is basically consistent, and all conductive circuits 11 and bonding structures 111 are adequately and non-redundantly protected.

[0076] In some embodiments, Figure 4 , Figure 5 , 12 . Fig.13 , Fig.16 and Fig.17 As shown, at least one pin socket 20 is connected to each of the two conductive circuits 11, and the two conductive circuits 11 are electrically connected via a bonding structure 111. The chip 60 is arranged on any one of the conductive circuits 11 or is arranged on one of the conductive circuits 11 alone. The drainage base 30 is fixed on the substrate 10, and the chip 60 is located between two adjacent pin sockets 20. The glue layer 40 is laid on the surface of the substrate 10 and covers the two conductive circuits 11, the chip 60 and the pin socket 20.

[0077] Two adjacent pin sockets 20 are at a first distance threshold, and one, two or more drainage bases 30 can be set between the two pin sockets 20; so that the distance from the drainage base 30 to the pin socket 20 and the distance between the drainage base 30 are at a second distance threshold, so that the liquid level of the glue layer 40 near the drainage base 30 will not appear concave due to the distance from the pin socket 20; it plays a role in balancing the liquid level of the glue layer 40, so that the thickness of the glue layer 40 inside the entire power module is basically consistent, and all chips 60 and conductive circuits 11, bonding structures 111 are adequately and non-redundantly protected.

[0078] In one embodiment, if Figures 4 to 17 As shown, the height of the drainage base 30 should be higher than the arch height of the bonding structure 111, so that the liquid level of the glue layer 40 near the drainage base 30 will not be concave due to being away from the pin seat 20, resulting in exposure of the bonding structure 111; it plays a role in balancing the liquid level of the glue layer 40, so that the thickness of the glue layer 40 inside the entire power module remains basically consistent, and all conductive circuits 11 and bonding structures 111 are adequately protected without redundancy.

[0079] like Figures 4 to 17 As shown, the height of the drainage base 30 should be higher than or equal to the height of the pin seat 20, which plays a role in balancing the liquid level of the glue layer 40, so that the thickness of the glue layer 40 is basically consistent throughout the power module.

[0080] like Figures 4 to 17 As shown, the height of the drainage base 30 should be higher than or equal to the height of the chip 60, so that the liquid level of the glue layer 40 near the drainage base 30 will not be concave due to being away from the pin seat 20, resulting in the chip 60 being exposed.

[0081] In one embodiment, if Figures 4 to 13 As shown, the drainage base 30 is arranged on the conductive line 11 .

[0082] Specifically, between two adjacent conductive lines 11, the distance between a pin socket 20 connected to one conductive line 11 and a pin socket 20 connected to another conductive line 11 is at a first distance threshold; at least one drainage base 30 is provided between the two pin sockets 20; the drainage base 30 is provided on one of the two conductive lines 11, or on a single conductive line 11, and plays a role in balancing the liquid level of the glue layer 40, so that the thickness of the glue layer 40 is basically consistent inside the entire power module, and all structures are adequately and non-redundantly protected. The drainage base 30 can be made of metal material or plastic, and fixed on the conductive line 11 by snapping or bonding. In addition, the drainage base 30 can be a copper base, which is fixed to the conductive line 11 by welding, and has good connection strength. The drainage base 30 can adopt the same structure as the pin holder 20, that is, the materials of the two are common. The pin 21 needs to be connected to the pin holder 20, and the drainage base 30 is not connected, and simply serves as a drainage for the glue layer 40, so that the thickness of the glue layer 40 inside the entire power module remains basically consistent.

[0083] In one embodiment, if Figures 14 to 17 As shown, the drainage base 30 is disposed on the area of ​​the substrate 10 excluding the conductive circuit 11 , that is, the drainage base 30 is disposed on the matrix 12 .

[0084] Specifically, between two adjacent conductive lines 11, the distance between a pin socket 20 connected to one conductive line 11 and a pin socket 20 connected to another conductive line 11 is at a first distance threshold; at least one drainage base 30 is arranged between the two pin sockets 20; the drainage base 30 is arranged on the matrix 12 of the substrate 10 except the two conductive lines 11. It plays a role in balancing the liquid level of the glue layer 40, so that the thickness of the glue layer 40 in the entire power module is basically consistent, and all structures are adequately protected without redundancy.

[0085] The drainage base 30 can be made of ceramic and the matrix 12 in one piece, or can be prepared separately and then connected and fixed by means of clamping, bonding, friction welding, etc.

[0086] In various embodiments of the present application, the drainage base 30 may be in the shape of a cylinder, a cylindrical body, a square pile, a semi-cylinder, or the like.

[0087] like Figure 4 and Figure 5 As shown, the drainage base 30 includes a cylindrical body 31, an upper connecting portion 32 and a lower connecting portion 33; the upper connecting portion 32 and the lower connecting portion 33 are in a circular or annular shape and protrude radially along the body 31. The body 31, the upper connecting portion 32 and the lower connecting portion 33 can be connected as a whole or assembled after being processed separately.

[0088] In one embodiment, if Figure 4 and Figure 5 As shown, the power module includes a shell 50 covering the substrate 10. The shell 50 is usually made of plastic and is welded to the substrate 10 to form a closed space to accommodate various components of the power module. The glue layer 40 is laid on the surface area of ​​the shell 50 covering the substrate 10 to serve as a filling area so that all conductive circuits 11, bonding structures 111, and chips 60 are adequately and non-redundantly protected.

[0089] The housing 50 is provided with a plurality of pin holes 51 corresponding to the pins 21 . One end of the pin 21 is connected to the pin seat 20 , and the other end thereof passes through the pin hole 51 of the housing 50 for connecting to an external circuit.

[0090] The various embodiments / implementations provided in this application can be combined with each other without causing any contradiction.

[0091] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power module, characterized in that: include: A substrate (10), wherein a surface layer of the substrate (10) has a conductive circuit (11); At least two pin sockets (20) electrically connected to the conductive circuit (11); A drainage base (30) fixed on the substrate (10); and an adhesive layer (40), the adhesive layer (40) being laid on the surface of the substrate (10) and covering the conductive circuit (11), the drainage base (30) and the pin seat (20); Two adjacent pin seats (20) are at a first distance threshold, and at least one drainage base (30) is provided between the two pin seats (20); The pin socket (20) is used to mount a pin (21), and the pin (21) is electrically connected to the conductive circuit (11) through the pin socket (20).

2. The power module according to claim 1, characterized in that: The adhesive layer (40) is a silicone gel layer.

3. The power module according to claim 1, characterized in that: The difference in thickness of the adhesive layer (40) at various locations is no greater than 1 mm.

4. The power module according to any one of claims 1 to 3, characterized in that: The first distance threshold is greater than or equal to 1 cm.

5. The power module according to any one of claims 1 to 3, characterized in that: The power module comprises a chip (60), and the chip (60) is electrically connected to the conductive line (11); The chip (60) is located between two adjacent pin sockets (20), and the two pin sockets (20) are at a first distance threshold, and at least one drainage base (30) is arranged between the two pin sockets (20).

6. The power module according to any one of claims 1 to 3, characterized in that: The surface layer of the substrate (10) has at least two conductive circuits (11), and each of the conductive circuits (11) is electrically connected to at least one of the pin sockets (20); Two adjacent conductive lines (11) are electrically connected via a bonding structure (111); The adhesive layer (40) covers the bonding structure (111).

7. The power module according to claim 6, characterized in that: The bonding structure (111) is located between two adjacent pin seats (20), and the two pin seats (20) are at a first distance threshold, and at least one drainage base (30) is arranged between the two pin seats (20).

8. The power module according to claim 6, characterized in that: The drainage base (30) is higher than the bonding structure (111).

9. The power module according to any one of claims 1 to 3, characterized in that: The drainage base (30) is arranged on the conductive line (11); or, The drainage base (30) is arranged on a region of the substrate (10) excluding the conductive line (11).

10. The power module according to any one of claims 1 to 3, characterized in that: The power module comprises a housing (50) covered on the substrate (10), and the adhesive layer (40) is laid on a surface area of ​​the housing (50) covered on the substrate (10).

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