Electronic devices

Abstract

The present application discloses an electronic device, comprising: a housing assembly, comprising a frame portion and a rear cover portion, the rear cover portion covering the frame portion and forming a receiving space with the frame portion; a circuit board, arranged in the receiving space, the circuit board and the rear cover portion being arranged opposite to each other; a first antenna module, arranged in the receiving space, the first antenna module comprising a first radiating portion for transmitting and receiving electromagnetic wave signals, the first radiating portion being arranged on the circuit board or on one side of the circuit board, the radiating surface of the first radiating portion being inclined relative to the board surface of the circuit board; and a reflective assembly, arranged on one side of the first radiating portion and spaced apart from the first radiating portion, the reflective assembly being used to reflect at least part of the electromagnetic wave signal radiated by the first radiating portion. The present application provides an electronic device capable of improving the spatial coverage and gain of an antenna module.

Description

Technical Field

[0001] The present application relates to the field of communication electronic technology, and in particular to an electronic device. Background Art

[0002] Since electronic devices include a variety of electronic devices, the antenna module has a complex environment. How to improve the spatial coverage and gain of the antenna module in the electronic device has become a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides an electronic device for improving the spatial coverage and gain of an antenna module.

[0004] In a first aspect, an electronic device provided by an embodiment of the present application includes:

[0005] The housing assembly comprises a frame portion and a rear cover portion, wherein the rear cover portion covers the frame portion and forms a receiving space with the frame portion;

[0006] A circuit board is arranged in the receiving space, and the circuit board is arranged opposite to the rear cover;

[0007] a first antenna module, disposed in the receiving space, the first antenna module comprising a first radiating portion for transmitting and receiving electromagnetic wave signals, the first radiating portion being disposed on the circuit board or on one side of the circuit board, and a radiating surface of the first radiating portion being inclined relative to a surface of the circuit board; and

[0008] The reflective component is disposed at one side of the first radiating portion and is spaced apart from the first radiating portion, and is used for reflecting at least a portion of the electromagnetic wave signal radiated by the first radiating portion.

[0009] In a second aspect, an electronic device provided by an embodiment of the present application includes:

[0010] Shell assembly;

[0011] A first antenna module, disposed in a space surrounded by the housing assembly, the first antenna module being used to transmit and receive electromagnetic wave signals of a preset frequency band;

[0012] A display screen, wherein the display screen covers the housing assembly, and a signal coverage range of the first antenna module on the side where the display screen is located is a first angle range; and

[0013] A reflective component is arranged in the space surrounded by the shell component or on the shell component. The reflective component is spaced apart from the first antenna module. The reflective component is used to reflect part of the electromagnetic wave signal to the side where the display screen is located, so that the signal coverage range of the first antenna module on the side where the display screen is located is a second angle range, wherein the second angle range is larger than the first angle range.

[0014] In a third aspect, an electronic device provided by an embodiment of the present application includes:

[0015] A housing assembly, comprising a rear cover portion, a first frame portion and a second frame portion, wherein the rear cover portion comprises a first arc portion, a middle portion and a second arc portion connected in sequence, wherein the first arc portion is connected to the first frame portion, and the second arc portion is connected to the second frame portion;

[0016] A circuit board, wherein a board surface of the circuit board is arranged opposite to the middle portion;

[0017] A first antenna submodule, wherein a radiation surface of the first antenna submodule is inclined from a surface direction of the circuit board toward the first frame portion;

[0018] A second antenna submodule, wherein a radiation surface of the second antenna submodule is inclined from a surface direction of the circuit board toward the second frame portion;

[0019] A first reflective component, disposed on the first arc-shaped portion, for reflecting at least a portion of the electromagnetic wave signal radiated by the first antenna sub-module; and

[0020] The second reflective component is disposed on the second arc-shaped portion and is used to reflect at least a portion of the electromagnetic wave signal radiated by the second antenna sub-module.

[0021] The electronic device provided in the embodiment of the present application, by setting the radiating surface of the first radiating part to be inclined relative to the board surface of the circuit board, and setting a reflecting component on the side of the first radiating part close to the rear cover part, so that the direction of the radiated electromagnetic wave signal of the first radiating part is deflected toward the frame part and the energy of the electromagnetic wave signal is concentrated toward the frame part, thereby improving the signal coverage (signal coverage angle range) of the first antenna module on the side of the electronic device, and improving the gain of the electronic device's side receiving and transmitting antenna signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a structural schematic diagram of an electronic device provided in Embodiment 1 of the present application;

[0024] Figure 2 is a cross-sectional view of the first electronic device provided in Embodiment 1 of the present application along line AA;

[0025] Figure 3 yes Figure 2 The enlarged view of the part in the middle dotted circle;

[0026] Figure 4 is a partial enlarged view of the second electronic device provided in Example 1 of the present application;

[0027] Figure 5 is a partial enlarged view of the third electronic device provided in the first embodiment of the present application;

[0028] Figure 6 is a partial enlarged view of the fourth electronic device provided in Example 1 of the present application;

[0029] Figure 7 is a partial enlarged view of the fifth electronic device provided in Example 1 of the present application;

[0030] Figure 8 yes Figure 2 A partial exploded view of the electronic equipment in the

[0031] Fig. 9 is a circuit block diagram of a first antenna module of an electronic device provided in Embodiment 1 of the present application;

[0032] Fig.10 is a partial enlarged view of the sixth electronic device provided in the first embodiment of the present application;

[0033] Fig.11 is a partial enlarged view of the seventh electronic device provided in Example 1 of the present application;

[0034] Fig.12 is a partial enlarged view of the eighth electronic device provided in the first embodiment of the present application;

[0035] Fig.13 is a partial enlarged view of the ninth electronic device provided in the first embodiment of the present application;

[0036] Fig.14 is a partial enlarged view of the tenth electronic device provided in the first embodiment of the present application;

[0037] Fig.15 is a partial enlarged view of the eleventh electronic device provided in the first embodiment of the present application;

[0038] Fig.16is a schematic structural diagram of a first reflective assembly provided in an embodiment of the present application;

[0039] Fig.17 is a schematic structural diagram of a second reflective assembly provided in an embodiment of the present application;

[0040] Fig.18 is a schematic structural diagram of a third reflective assembly provided in an embodiment of the present application;

[0041] Fig.19 It is a schematic diagram of the layout structure of an electronic device provided in Embodiment 2 of the present application;

[0042] Fig. 20 It is a schematic diagram of the layout structure of the first electronic device provided in the third embodiment of the present application;

[0043] Fig.21 It is a schematic diagram of the layout structure of the second electronic device provided in the third embodiment of the present application;

[0044] Fig. 22 is a partial cross-sectional view of the electronic device provided in the fourth embodiment of the present application when no reflective component is provided;

[0045] Fig.23 is a partial cross-sectional view of the electronic device provided in the fourth embodiment of the present application when a reflective component is provided;

[0046] Fig.24 is a cross-sectional view of a first electronic device provided in Embodiment 5 of the present application;

[0047] Fig.25 is a cross-sectional view of a second electronic device provided in Embodiment 5 of the present application;

[0048] Fig.26 yes Figure 3 Two-dimensional directional diagrams of the provided electronic device in the H polarization direction when no reflective component is provided, when a 25 mm × 6 mm reflective component is provided, and when a 25 mm × 10 mm reflective component is provided;

[0049] Fig. 27 yes Figure 3 The provided electronic device has two-dimensional directional diagrams in the V polarization direction when no reflective component is provided, when a 25mm×6mm reflective component is provided, and when a 25mm×10mm reflective component is provided. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. The embodiments listed in the present application can be appropriately combined with each other.

[0051] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of an electronic device provided in Example 1 of the present application. The electronic device 100 includes, but is not limited to, a telephone, a television, a tablet computer, a mobile phone, a camera, a personal computer, a laptop computer, a vehicle-mounted device, a headset, a watch, a wearable device, a base station, a vehicle-mounted radar, a customer premise equipment (Customer Premise Equipment, CPE) and other devices capable of transmitting and receiving electromagnetic wave signals. This application takes the electronic device 100 as an example of a mobile phone. For the sake of ease of description, the electronic device 100 is defined as being in the first viewing angle as a reference. The width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device 100 is defined as the Z direction. The direction indicated by the arrow is the positive direction.

[0052] See also Figure 2 The electronic device 100 includes a housing component 10 , a circuit board 20 , a first antenna module 30 and a reflective component 40 .

[0053] See also Figure 2 and Figure 3 The housing assembly 10 includes a rear cover portion 11 and a frame portion 12. The rear cover portion 11 covers the frame portion 12 and forms a receiving space 13 with the frame portion 12. When the electronic device 100 is a mobile phone, the rear cover portion 11 is roughly rectangular. The rear cover portion 11 is in the shape of a straight plate, or in a curved shape or other special shapes. The frame portion 12 is in the shape of a rectangular frame. The outer periphery of the rear cover portion 11 is connected to the inner periphery of one side of the frame portion 12 to form a receiving space 13. The receiving space 13 may be similar to a box shape. The structure of the frame portion 12 and the rear cover portion 11 may be split or integrated. Optionally, the present application does not specifically limit the material of the rear cover portion 11 and the frame portion 12. The material of the rear cover portion 11 and the frame portion 12 includes but is not limited to one or more of plastic, ceramic, glass, polymer composite materials, etc. The material of the rear cover portion 11 and the frame portion 12 may also be a splicing material with metal. In other words, the back cover portion 11 and the frame portion 12 may be provided with non-shielding areas to allow antenna signals to pass through.

[0054] For further information, see Figure 2 The electronic device 100 may further include a display screen 50, which covers the housing assembly 10 so that the receiving space 13 forms an approximately closed space.

[0055] See also Figure 3, the circuit board 20 is arranged in the receiving space 13. The circuit board 20 is arranged opposite to the rear cover portion 11. The board surface of the circuit board 20 faces the rear cover portion 11. The circuit board 20 and the rear cover portion 11 are arranged along the Z-axis direction. Among them, the board surface 201 of the circuit board 20 refers to the surface on the circuit board 20 used to carry circuits and devices, which is generally the outer surface of the circuit board 20. And it is generally the surface with the largest area among the outer surfaces of the circuit board 20. Generally speaking, there are two board surfaces 201 of the circuit board 20, among which one board surface of the circuit board 20 faces the rear cover portion 11, and the other board surface faces away from the rear cover portion 11.

[0056] Optionally, the present application has one, two or more antenna modules. When there are multiple antenna modules, the present application names the first antenna module 30, the second antenna module, and the third antenna module to distinguish them. The present application does not limit the number of first antenna modules 30 to one. In other words, the number of first antenna modules 30 can be multiple. The same is true for the second antenna module and the third antenna module. In addition, the present application does not limit the structure of the first antenna module 30 to be the same or different from that of the second antenna module. In other words, the structure of the first antenna module 30 is the same or different from that of the second antenna module, and the same is true for other antenna modules.

[0057] See also Figure 3 , the first antenna module 30 is arranged in the receiving space 13. The first antenna module 30 includes a first radiating portion 31 for transmitting and receiving electromagnetic wave signals. Among them, the first radiating portion 31 does not limit the first antenna module 30 to be provided with a second radiating portion. In other words, the number of radiating portions of the first antenna module 30 can be one or more. The first radiating portion 31 is the radiating portion of the first antenna module 30. Specifically, the structural form of the first radiating portion 31 includes but is not limited to the patch form of a patch antenna, the laminated form of a laminated antenna, the dipole form of a dipole antenna, the magnetoelectric dipole form of a magnetoelectric dipole antenna, and the quasi-Yagi form of a quasi-Yagi antenna. At least one or a combination of multiple. It can be understood that the first radiating portion 31 is a port on the first antenna module 30 for transmitting and receiving electromagnetic wave signals. The material of the first radiating portion 31 is a conductive material. Specific materials include but are not limited to metals, conductive oxides (for example, indium tin oxide ITO), carbon nanotubes, graphene, and the like.

[0058] Optionally, the first radiation portion 31 may be disposed on the circuit board 20, which includes the first radiation portion 31 being disposed on one of the two surfaces of the circuit board 20, or on the side of the circuit board 20. The side of the circuit board 20 is the connection surface between the two surfaces of the circuit board 20.

[0059] The first radiation portion 31 may be disposed on the board surface 201 of the circuit board 20 .

[0060] Optional, see Figure 3, the first radiating portion 31 may also be disposed in the receiving space 13 and located on one side of the circuit board 20. In other words, the first radiating portion 31 may be spaced apart from the circuit board 20, and the spacing does not affect the connection between the first radiating portion 31 and the circuit board 20 through other structures. The radiating surface of the first radiating portion 31 is inclined relative to the board surface 201 of the circuit board 20. The radiating surface 311 of the first radiating portion 31 may be a surface of the first radiating portion 31 facing the air in the radiating direction in terms of physical position, and the surface is disposed opposite to the surface bearing the first radiating portion 31.

[0061] See also Figure 3 and Figure 4 The radiation surface 311 of the first radiation portion 31 may be inclined at an angle of 0° to 90° (including 0° and 90°) relative to the board surface 201 of the circuit board 20. Figure 3 , when the radiating surface 311 of the first radiating portion 31 is inclined at an angle of 90° relative to the board surface 201 of the circuit board 20, the radiating surface 311 of the first radiating portion 31 is perpendicular to the board surface 201 of the circuit board 20. By setting the radiating surface 311 of the first radiating portion 31 to be inclined relative to the board surface 201 of the circuit board 20, the signal radiation range formed by the first radiating portion 31 can be shifted toward the frame portion 12. It should be noted that in this application, unless otherwise specified, the frame portion 12 refers to the portion close to the side of the circuit board 20.

[0062] Optional, see Figure 3 The reflective component 40 is disposed on one side of the first radiating portion 31 and is spaced apart from the first radiating portion 31. The reflective component 40 may be located within the range of the electromagnetic wave signal radiated by the first radiating portion 31. The reflective component 40 is used to reflect at least part of the electromagnetic wave signal radiated by the first radiating portion 31 (e.g. Figure 3 The first radiating portion 31 is provided with a dotted arrow in the middle to increase the antenna signal gain of the electromagnetic wave signal radiated by the first radiating portion 31 in a preset direction, thereby increasing the coverage of the electromagnetic wave signal radiated by the first radiating portion 31. The preset direction may be the direction in which the frame portion 12 is located.

[0063] In the conventional technology, the display screen 50 is provided with a large number of metal structures, so that the display screen 50 has a shielding effect on electromagnetic wave signals, and thus, the electromagnetic wave signals on the side of the electronic device 100 and the side where the display screen 50 is located are small. Moreover, with the development of the curved display screen 50, the area of ​​the side occupied by the display screen 50 increases, so that the display screen 50 has a larger shielding range for electromagnetic waves.

[0064] The electronic device 100 provided in the embodiment of the present application is configured to have a radiation surface 311 of the first radiation portion 31 inclined relative to the board surface 201 of the circuit board 20, and to have a reflection component 40 on the side of the first radiation portion 31 close to the rear cover portion 11, so that the direction of the radiated electromagnetic wave signal of the first radiation portion 31 is deflected toward the frame portion 12 and the energy of the electromagnetic wave signal is concentrated toward the frame portion 12, thereby improving the signal coverage (signal coverage angle range) of the first antenna module 30 on the side of the electronic device 100 and improving the gain of the antenna signal received and transmitted on the side of the electronic device 100.

[0065] The present application does not limit the specific form of the first antenna module 30 and the frequency band of the antenna signal received and transmitted by the first antenna module 30. Optionally, the frequency band of the antenna signal received and transmitted by the first antenna module 30 includes but is not limited to at least one of the millimeter wave band, submillimeter wave band, terahertz wave band, Sub-6G band, second generation mobile communication signal (2G), third generation mobile communication signal (3G), and fourth generation mobile communication signal (4G). The present application takes the signal received and transmitted by the first antenna module 30 as a millimeter wave band as an example. The first radiation unit 31 may include a plurality of radiation units arranged in an array or a linear queue. The plurality of radiation units are arranged at intervals, and the plurality of radiation units all receive and transmit antenna signals. The phases of the antenna signals received and transmitted by the plurality of radiation units are controlled by means of phase shifters, antenna lenses, etc., so that the antenna signals received and transmitted by the plurality of radiation units are beamformed to improve the antenna gain and directivity.

[0066] The following is an example of the installation position of the first radiating portion 31 through a specific implementation. Of course, the installation position of the first radiating portion 31 provided in this application includes but is not limited to the following implementations. In this embodiment, the radiation surface 311 of the first radiating portion 31 is perpendicular to the board surface 201 of the circuit board 20. This method can effectively reduce the space occupied by the first radiating portion 31 in the X-axis direction and achieve more signal coverage on the side of the electronic device 100. Of course, in other implementations, the first radiating portion 31 can also be tilted at other angles.

[0067] In one possible implementation, see Figure 3, the first radiation part 31 is arranged between the frame part 12 and the side of the circuit board 20 to save space on the circuit board 20. In other words, the frame part 12, the first radiation part 31 and the circuit board 20 are arranged in sequence, which can not only reduce the shielding of the first radiation part 31 in the process of radiating electromagnetic waves toward the frame part 12, but also reduce the space occupied by the frame part 12 on the circuit board 20 (on the XY plane); moreover, when the first radiation part 31 is arranged obliquely on the circuit board 20, the first radiation part 31 occupies more space in the Z-axis direction. By arranging the first radiation part 31 between the frame part 12 and the side of the circuit board 20, the size of the electronic device 100 in the Z-axis direction can also be reduced.

[0068] In other embodiments, the first radiating portion 31 may be disposed on the surface of the circuit board 20 facing the rear cover portion 11. By disposing a wedge-shaped gasket on the circuit board 20, the radiating surface 311 of the first radiating portion 31 is tilted relative to the surface 201 of the circuit board 20, so that the signal beam radiated by the first radiating portion 31 is offset from the normal direction (Z-axis direction) of the circuit board 20 toward the frame portion 12, wherein the offset angle is related to the tilt angle of the radiating surface 311 of the first radiating portion 31 relative to the surface 201 of the circuit board 20.

[0069] This embodiment is described by taking the first radiation portion 31 as being disposed between the frame portion 12 and the side surface of the circuit board 20 as an example. The rear cover portion 11, the first radiation portion 31 and the display screen 50 are arranged in sequence along the Z axis direction. Figure 3 , the distance h1 between the first radiation portion 31 and the rear cover portion 11 is smaller than the distance h2 between the first radiation portion 31 and the display screen 50 and the first radiation portion 31. Since the display screen 50 has a shielding effect on the first radiation portion 31, the first radiation portion 31 is relatively far away from the display screen 50 to reduce the shielding of the electromagnetic wave signal received and sent by the first radiation portion 31 by the display screen 50.

[0070] For details, please refer to Figure 3 The electronic device 100 further includes an injection-molded substrate portion 60. The injection-molded substrate portion 60 may be made of a plastic material. These plastic materials may be formed on the frame portion 12 by an injection molding process to form positioning holes, mounting grooves, and separate different mounting positions in the frame portion 12, so that the circuit board 20, batteries, and other devices can be neatly installed in the frame portion 12. The plastic material between the inner surface of the frame portion 12 and the circuit board 20 forms the injection-molded substrate portion 60. In other words, the injection-molded substrate portion 60 is disposed on the surface of the frame portion 12 facing the circuit board 20.

[0071] Optional, see Figure 5 and Figure 6 There is a gap between the injection molding base material portion 60 and the side surface of the circuit board 20. Figure 5The first radiation portion 31 is attached to the side of the circuit board 20 facing the injection molding substrate portion 60, and the normal direction of the side may be the X-axis direction. Figure 6 The first radiating portion 31 is attached to the side of the circuit board 20 facing the injection molding substrate portion 60, and the normal direction of the side may intersect with the X-axis direction. At this time, the circuit board 20 is also used as a bearing structure for the first radiating portion 31, so as to avoid the need for an additional bearing structure for the first radiating portion 31, thereby improving the integration of the first antenna module 30 and the circuit board 20.

[0072] Optional, see Figure 7 The first radiating portion 31 can also be molded on the supporting member 32. The supporting member 32 can be fixed on the surface of the injection molding substrate portion 60 facing the side of the circuit board 20 and have a gap with the surface. The first radiating portion 31 is arranged on the supporting member 32 and is located between the supporting member 32 and the injection molding substrate portion 60. In this way, the first radiating portion 31 can be fixed on the injection molding substrate portion 60 and maintain a preset distance from the injection molding substrate portion 60. The preset distance is beneficial to improving the signal radiation efficiency of the first radiating portion 31.

[0073] Optional, see Figure 3 The injection molding substrate portion 60 may be provided with a receiving groove 61, and the first radiation portion 31 is at least partially embedded in the receiving groove 61 of the injection molding substrate portion 60. In this way, the first radiation portion 31 is at least partially embedded in the receiving groove 61, and the receiving groove 61 forms a protective member around the first radiation portion 31, which can effectively protect the first radiation portion 31 and reduce the interference of the electronic devices and metals around the first radiation portion 31 on the signal emitted by the first radiation portion 31.

[0074] For further information, see Figure 8 , the side of the receiving groove 61 facing the circuit board 20 has at least one isolating member 63. The optional number of isolating members 63 is multiple, and the multiple isolating members 63 are arranged at intervals along the Y-axis direction. The multiple isolating members 63 enable the radiation surface of the first radiation portion 31 and the side of the receiving groove 61 facing the circuit board 20 to be arranged at intervals or to form a preset gap therebetween, and the preset gap is used to improve the radiation efficiency of the first radiation portion 31.

[0075] The above is an example description of a specific implementation of the first radiation portion 31 being installed on the injection molding base material portion 60 .

[0076] Optional, see Fig. 9, the first antenna module 30 includes an antenna part 33, a radio frequency front end 34 and a baseband circuit 35 connected in sequence. Among them, the baseband circuit 35 can be encapsulated in the baseband circuit 35, and the baseband circuit 35 is responsible for signal processing and protocol processing. The radio frequency front end 34 can be encapsulated in a radio frequency chip, and the radio frequency front end 34 is responsible for radio frequency transmission and reception, frequency synthesis, power amplification, etc. The antenna part 33 includes a first radiating part 31, a feeding part 331 and a matching part 332 connected in sequence. The matching part 332 is connected to the radio frequency front end 34, and is used to receive the radio frequency signal transmitted by the radio frequency front end 34, and impedance matching the radio frequency signal through a matching circuit composed of capacitors and / or inductors to improve the efficiency of transmission and reception. The feeding part 331 is used to feed the matched radio frequency signal into the first radiating part 31, and the first radiating part 31 is used to radiate the radio frequency signal of the preset frequency band into the air or receive the radio frequency signal of the preset frequency band from the air. Optionally, the RF front end 34 and the baseband circuit 35 are arranged on the circuit board 20, and the antenna part 33 is arranged as a whole on the surface of the injection molding substrate part 60 or in the receiving groove 61 of the injection molding substrate part 60. Optionally, in the antenna part 33, the first radiating part 31 can be arranged on the surface of the injection molding substrate part 60 or in the receiving groove 61 of the injection molding substrate part 60, and the matching part 332 and the feeding part 331 are arranged on the circuit board 20. Optionally, in the antenna part 33, the first radiating part 31 and the feeding part 331 can be arranged on the surface of the injection molding substrate part 60 or in the receiving groove 61 of the injection molding substrate part 60, and the matching part 332 is arranged on the circuit board 20. The above multiple settings can be flexibly set according to actual conditions, so as to diversify the setting methods of the first antenna module 30 of the electronic device 100, and reasonably reduce the occupied space on the circuit board 20, or reduce the signal interference of other devices on the circuit board 20.

[0077] In this embodiment, the injection molding substrate portion 60 has a receiving groove 61, and the first radiation portion 31 is at least partially disposed in the receiving groove 61 for further description. Figure 3 , the opening 62 formed by the receiving groove 61 on the injection molding substrate part 60 faces the rear cover part 11. At this time, the first radiating part 31 can be quickly installed on the injection molding substrate part 60 by arranging the first radiating part 31 in the receiving groove 61. By setting the opening 62 of the receiving groove 61 toward the rear cover, on the one hand, it is convenient to install the first radiating part 31 from the rear cover part 11 side, and on the other hand, it is convenient to connect the first radiating part 31 with the circuit board 20 through the line, reduce the path of the connecting line and prevent winding.

[0078] Of course, in other embodiments, the first radiation portion 31 may also be located at a position such as the surface of the injection molding substrate portion 60 facing the rear cover portion 11 .

[0079] The following embodiments illustrate the relative position relationship between the reflective component 40 and the first radiating portion 31. Of course, the relative position relationship between the reflective component 40 and the first radiating portion 31 provided in the present application includes but is not limited to the following embodiments.

[0080] Optional, see Figure 3 , the reflective component 40 is disposed on the side of the rear cover portion 11 of the first radiation portion 31. The orthographic projection of the reflective component 40 in the normal direction (Z-axis direction) of the circuit board 20 at least partially covers the opening 62 formed by the accommodating groove 61 on the injection molding substrate portion 60. Further, the orthographic projection of the reflective component 40 in the normal direction (Z-axis direction) of the circuit board 20 can completely cover the opening 62 formed by the accommodating groove 61 on the injection molding substrate portion 60.

[0081] See also Figure 3 The orthographic projection of the reflective component 40 in the normal direction (X-axis direction) of the radiation surface 311 at least partially covers the radiation surface 311 of the first radiation portion 31 .

[0082] Through the above design, a part of the reflection component 40 is located on the side of the first radiation part 31 (positive direction of the Z axis), and a part of the reflection component 40 is located on the front side of the first radiation part 31 (positive direction of the X axis). The reflection component 40 reflects the signal radiated from the side of the first radiation part 31 close to the rear cover part 11, thereby shifting or concentrating the signal radiated from the first radiation part 31 toward the side where the display screen 50 is located, thereby improving the directivity and thereby improving the gain.

[0083] For further information, see Figure 3 , the area of ​​the part of the orthographic projection of the first radiating portion 31 in the normal direction (positive direction of the X-axis) located on the reflective component 40 is smaller than the area of ​​the part located outside the reflective component 40. In other words, the reflective component 40 corresponds to a small part of the first radiating portion 31 in the X-axis direction, while most of the first radiating portion 31 is not blocked by the reflective component 40 in the X-axis direction, so as to reduce the blocking of the first radiating portion 31 in the orientation direction by the reflective component 40, and ensure that the first radiating portion 31 radiates signals toward the frame portion 12.

[0084] The following embodiments illustrate the structure of the reflective component 40 . Of course, the structure of the reflective component 40 provided in the present application includes but is not limited to the following embodiments.

[0085] In a specific embodiment, see Figure 3 The reflective component 40 is in a sheet or coating shape. The electronic device 100 further includes a bearing surface 101. At least a portion of the bearing surface 101 is a curved surface. At least a portion of the reflective component 40 is attached to the curved surface on the bearing surface 101, so that the reflective component 40 is in an arc shape.

[0086] Alternatively, see Fig.10 At least a portion of the bearing surface 101 is an inclined surface inclined relative to the radiation surface 311 of the first radiation portion 31 . At least a portion of the reflective component 40 is attached to the inclined surface on the bearing surface 101 , so that the reflective component 40 is inclined relative to the radiation surface 311 of the first radiation portion 31 .

[0087] By setting the reflective component 40 to be arc-shaped or inclined relative to the radiation surface 311 of the first radiation portion 31, the reflective component 40 can deflect the electromagnetic wave signal radiated by the first radiation portion 31 toward the side of the reflective component 40, thereby increasing the electromagnetic wave coverage angle on the side of the electronic device 100 and the signal directivity of the first antenna module 30, thereby increasing the signal gain of the first antenna module 30.

[0088] Of course, in other embodiments, the reflective component 40 may also be a special-shaped structure such as a curved surface or an inclined surface facing the first radiating portion 31, and a flat surface away from the first radiating portion 31, so as to enable the reflective component 40 to deflect the electromagnetic wave signal radiated by the first radiating portion 31 toward the side of the reflective component 40.

[0089] The following embodiments illustrate the position of the reflective component 40 . Of course, the position of the reflective component 40 provided in the present application includes but is not limited to the following embodiments.

[0090] In a first possible implementation, see Figure 3 , the portion where the back cover 11 connects to the frame 12 is an arc portion 111. In other words, the back cover 11 can be a curved back cover, so that the operator can hold the electronic device 100 with his hand, and the narrow space at the corner of the right-angle housing assembly 10 is eliminated, thereby improving the space utilization rate inside the housing assembly 10.

[0091] The bearing surface 101 is the inner surface of the arc-shaped portion 111 , the outer surface of the arc-shaped portion 111 , or a surface disposed between the inner surface of the arc-shaped portion 111 and the outer surface of the arc-shaped portion 111 .

[0092] In other words, the reflective component 40 is disposed on the arc portion 111 of the rear cover portion 11, so that the rear cover portion 11 serves as a supporting structure for the reflective component 40. There is no need to provide an additional structure for supporting the reflective component 40. By using the rear cover portion 11 as a supporting structure, the rear cover portion 11 can be fully utilized.

[0093] Optional, see Fig.11, the reflective component 40 is disposed on the outer surface of the rear cover 11, and the outer surface of the rear cover 11 is the surface facing the outside of the electronic device 100. Specifically, the reflective component 40 can be attached to the outer surface of the rear cover 11 by adhesive; or, the reflective component 40 can be directly formed on the outer surface of the rear cover 11 by printing, spraying and other processes. By arranging the reflective component 40 on the outer surface of the rear cover 11, the rear cover 11 can separate the reflective component 40 and the first radiation part 31. In this way, a gap is naturally formed between the reflective component 40 and the first radiation part 31 due to the separation of the rear cover 11, and there is no need to form an additional gap between the first radiation part 31 and the rear cover 11, so as to reduce the size of the housing component 10.

[0094] Furthermore, the reflective component 40 may be made of a transparent material to reduce the effect of the reflective component 40 on the appearance of the electronic device 100. Of course, an insulating protective layer may also be provided on the reflective component 40 to protect both the reflective component 40 and the user who accidentally touches the reflective component 40.

[0095] Optional, see Figure 3 , the reflective component 40 is arranged on the inner surface of the rear cover 11, and the inner surface of the rear cover 11 is the surface facing the internal space of the electronic device 100. Similar to the above, the reflective component 40 can be attached to the inner surface of the rear cover 11 by adhesive; or, the reflective component 40 can be directly formed on the inner surface of the rear cover 11 by printing, spraying and other processes. By arranging the reflective component 40 on the inner surface of the rear cover 11, the electromagnetic waves radiated by the first radiation part 31 can be efficiently and directly reflected by the reflective component 40, thereby avoiding the surface wave loss of some electromagnetic waves on the inner surface of the rear cover 11 and the internal loss of the rear cover 11.

[0096] Optional, see Fig.12 , the reflective component 40 may be partially embedded in the rear cover 11, and the other part may be disposed on the side where the inner surface of the rear cover 11 is located, or disposed on the side where the outer surface of the rear cover 11 is located. When the reflective component 40 has a certain thickness, the design of this embodiment can make a part of the thickness of the reflective component 40 overlap with a part of the thickness of the rear cover 11, thereby reducing the overall thickness of the reflective component 40 and the rear cover 11.

[0097] Optional, see Fig.13 The reflective component 40 is entirely disposed within the rear cover portion 11 , which can achieve the effect of hiding the reflective component 40 on one hand, and can reduce the space occupied by the reflective component 40 on the inner surface side or the outer surface side of the rear cover portion 11 on the other hand.

[0098] In a second possible implementation, see Fig.14, the electronic device 100 also includes a carrier 102. The carrier 102 is located between the injection molding substrate portion 60 and the back cover portion 11. The carrier 102 is connected to the injection molding substrate portion 60; or, the carrier 102 is connected to the back cover portion 11; or, the carrier 102 is connected to the injection molding substrate portion 60 and the back cover portion 11. The surface of the carrier 102 facing the back cover portion 11 is the bearing surface 101. The material of the carrier 102 can be a hard material or a flexible material. When the carrier 102 is a hard material, the carrier 102 can be spaced apart from the back cover portion 11 (or the injection molding substrate portion 60), and the carrier 102 is connected to the back cover portion 11 (or the injection molding substrate portion 60) through a connector. When the carrier 102 is a flexible material, the carrier 102 can adjust its shape to match the arc portion 111 to fit the arc portion 111.

[0099] Optional, see Fig.14 , the carrier 102 can be made of a hard material, and the carrier 102 can be arc-shaped. The portion where the rear cover portion 11 is connected to the frame portion 12 is an arc-shaped portion 111. An arc-shaped space 103 is formed between the arc-shaped portion 111 and the injection molding substrate portion 60. The carrier 102 is located in the arc-shaped space 103. By setting the carrier 102 to be arc-shaped, the carrier 102 is arranged in the arc-shaped space 103 formed between the rear cover portion 11 and the injection molding substrate portion 60, so as to make full use of the special-shaped structural gap in the electronic device 100.

[0100] Furthermore, the arc-shaped extension trend of the carrier 102 may be the same as or similar to the extension trend of the arc-shaped space 103 , so as to fully utilize the irregular gap of the electronic device 100 .

[0101] In a third possible implementation, see Fig.15 , the portion where the rear cover portion 11 connects to the frame portion 12 is an arc portion 111. The bearing surface 101 is disposed on the injection molding substrate portion 60 and faces the arc portion 111. By disposing the reflective component 40 on the injection molding substrate, the injection molding substrate portion 60 can form a separation position in the frame portion 12 and can carry the first radiation portion 31, while also being able to serve as a bearing structure for the reflective component 40, thereby achieving multiple uses of the injection molding substrate portion 60. Moreover, disposing both the first radiation portion 31 and the reflective component 40 on the injection molding substrate portion 60 can facilitate the installation of the first radiation portion 31 and the reflective component 40. Compared with the case where the reflective component 40 is disposed on the rear cover portion 11, the positional relationship between the first radiation portion 31 and the reflective component 40 can be conveniently and accurately controlled.

[0102] See also Fig.15, the portion where the back cover 11 connects to the frame 12 is the arc portion 111. A portion of the orthographic projection of the first radiating portion 31 in the normal direction (X-axis direction) is located in the arc portion 111, and the other portion is located in the frame 12, and the orthographic projection area of ​​the first radiating portion 31 on the arc portion 111 is larger than the orthographic projection area of ​​the first radiating portion 31 on the frame 12. In other words, the first radiating portion 31 is disposed closer to the back cover 11. When the first radiating portion 31 has a signal shielding member on the side facing away from the back cover 11, by disposing the first radiating portion 31 closer to the back cover 11, the shielding of the signal radiated by the first radiating portion 31 can be reduced, so that the first radiating portion 31 forms a larger coverage on the side of the electronic device 100.

[0103] The following embodiments illustrate the specific structure of the reflective component 40 . Of course, the specific structure of the reflective component 40 provided in the present application includes but is not limited to the following embodiments.

[0104] Specifically, the material of the reflective component 40 is a conductive material to electromagnetically couple with the electromagnetic waves received and transmitted by the first radiating portion 31. The material of the reflective component 40 includes, but is not limited to, a conductive metal layer, a conductive non-metallic film layer, etc. Specifically, the material of the reflective component 40 includes, but is not limited to, graphene, graphite, carbon black, single-walled and multi-walled carbon nanotubes, metals, metal oxides, metal nanowires, metal nanoparticles, or metal oxide nanoparticles. The metal includes, but is not limited to, gold, silver, copper, aluminum, or nickel. The metal oxide includes, but is not limited to, indium tin oxide (ITO) or fluorine-doped tin oxide (FTO), etc. In this embodiment, the material of the reflective component 40 may be a conductive silver paste, etc.

[0105] When the first radiating portion 31 transmits and receives electromagnetic wave signals, the first radiating portion 31 and the reflective component 40 generate electromagnetic coupling, and a current distribution can be formed on the reflective component 40. The current distribution on the reflective component 40 causes the reflective component 40 to form a band-stop structure for the electromagnetic waves radiated by the first radiating portion 31. The band-stop structure means that the electromagnetic waves cannot penetrate or have a very low transmittance. The reflective component 40 can block the electromagnetic wave signal radiated by the first radiating portion 31 toward the reflective component 40, so that the electromagnetic wave signal is deflected toward the direction of the reflective component 40, thereby enhancing the directivity and gain of the electromagnetic wave signal of the first antenna module 30 at the frame portion 12.

[0106] In one possible implementation, see Figure 8, the reflective component 40 may be a whole solid structure. Specifically, the reflective component 40 may be a whole metal sheet. Further, when the first radiating portion 31 includes a plurality of radiating units arranged in a queue, the first radiating portion 31 is roughly rectangular. The length direction of the first radiating portion 31 is the length direction of the electronic device 100, that is, the Y-axis direction. The width direction of the first radiating portion 31 is the thickness direction of the electronic device 100, that is, the Z-axis direction. The reflective component 40 may be rectangular, and the length direction of the reflective component 40 corresponds to the length direction of the first radiating portion 31, that is, the Y-axis direction. The width direction of the reflective component 40 corresponds to the width direction of the first radiating portion 31, that is, the Z-axis direction. Optionally, the length dimension of the reflective component 40 is greater than or equal to 0.85 times the length dimension of the first radiating portion 31. Further, the length dimension of the reflective component 40 may be greater than the length dimension of the first radiating portion 31, so that in the Y-axis direction, the reflective component 40 can act on the electromagnetic waves radiated by the first radiating portion 31 as much as possible. Optionally, the width of the reflective component 40 is greater than or equal to 1 / 2 wavelength of the electromagnetic wave radiated by the first radiation portion 31, so that the reflective component 40 can form an electric current under the excitation of the electromagnetic wave radiated by the first radiation portion 31, thereby achieving the blocking and reflection effect on the electromagnetic wave radiated by the first radiation portion 31.

[0107] The present application does not make any specific limitation on the shape of the reflective component 40. The shape of the reflective component 40 can be rectangular, circular, elliptical, diamond-shaped, etc., and the length dimension of the reflective component 40 in the Y-axis direction must be greater than or equal to 0.85 times the length dimension of the first radiation portion 31; and the width dimension of the reflective component 40 in the Z-axis direction must be greater than or equal to 1 / 2 wavelength of the electromagnetic wave radiated by the first radiation portion 31.

[0108] In another possible implementation, see Fig.16 The reflective assembly 40 includes a plurality of reflective members 41 disposed at intervals. The spacing between two adjacent reflective members 41 is much smaller than the wavelength of the electromagnetic wave received and transmitted by the first radiating portion 31, so that the electromagnetic wave signal radiated by the first radiating portion 31 cannot pass through the gap between the two adjacent reflective members 41.

[0109] The present application does not specifically limit the specific shape, arrangement and spacing of the reflective element 41. In other words, the reflective element 41 can be rectangular, circular, rectangular, diamond, elliptical, etc.

[0110] Optional, see Fig.17 When the reflective assembly 40 includes a plurality of reflective members 41, the reflective members 41 are strip-shaped. The plurality of reflective members 41 are arranged side by side and at intervals. Fig.17 , the extending direction of the reflector 41 may be along the length direction of the housing assembly 10. Fig.18, the extending direction of the reflector 41 may also be along the width direction of the housing assembly 10, or along a direction intersecting both the length direction of the housing assembly 10 and the width direction of the housing assembly 10. In other words, the reflector assembly 40 is a bar grid structure, and such a design can reduce the amount of material for preparing the reflector assembly 40, especially when the reflector assembly 40 is mass-produced, it can greatly save materials and costs. Of course, the structures of the multiple reflectors 41 constituting the reflector assembly 40 may be different.

[0111] The above is an example of the specific structure of the electronic device 100 in the first embodiment. In this embodiment, by tilting the first radiating portion 31 relative to the board surface 201 of the circuit board 20, designing the position of the first radiating portion 31, designing the position of the reflective component 40 relative to the first radiating portion 31, designing the setting position and structure of the reflective component 40, etc., the electromagnetic wave signal received and sent by the first radiating portion 31 is offset toward the direction where the display screen 50 is located and the energy of the electromagnetic wave signal is concentrated toward the direction where the display screen 50 is located, thereby improving the signal coverage (signal coverage angle range) of the first antenna module 30 on the side of the electronic device 100 and improving the gain of the antenna signal received and sent on the side of the electronic device 100.

[0112] Please refer to Fig.19 , Fig.19 A view of the inner side of a shell assembly 10 of an electronic device 100 provided in Embodiment 2 of the present application. This embodiment is substantially the same as the electronic device 100 of Embodiment 1, with the main difference being that the frame portion 12 includes at least one metal segment 121. The electronic device 100 also includes a second antenna module (not shown). The second antenna module includes at least one second radiating portion 71. The second radiating portion 71 and the first radiating portion 31 transmit and receive electromagnetic waves in a different or the same frequency band. The second radiating portion 71 is one of the at least one metal segment 121. The second radiating portion 71 is close to the reflective component 40. The second radiating portion 71 can be electromagnetically coupled with the reflective component 40.

[0113] In other words, the frame portion 12 may include a plurality of metal segments 121, and two adjacent metal segments 121 are insulated from each other. The metal segments 121 may be used as the radiation portion of the second antenna module to receive and transmit electromagnetic wave signals. Thus, by using the frame portion 12 as the radiation portion of the second antenna module, the frame portion 12 may be fully utilized to achieve multiple uses of one object. Since the metal segments 121 of the frame portion 12 are not blocked, the second antenna module may receive and transmit electromagnetic wave signals more smoothly and efficiently.

[0114] The reflective component 40 is arranged close to the metal segment 121, and the length of the reflective component 40 along the Y-axis direction is greater than or equal to the wavelength of the electromagnetic wave signal radiated by the second radiating portion 71, so that the electromagnetic wave signal radiated by the second radiating portion 71 can excite a current signal in the reflective component 40, thereby realizing electromagnetic coupling between the reflective component 40 and the second radiating portion 71, thereby realizing signal enhancement of the electromagnetic wave signal radiated by the second radiating portion 71 and improving the radiation efficiency of the second antenna module. In other words, the reflective component 40 is arranged close to the second radiating portion 71 and can be used as a signal enhancer for the second radiating portion 71, thus realizing the multiple uses of the reflective component 40. On the other hand, the current distribution on the reflective component 40 is excited by coupling, so that the energy distribution on the reflective component 40 is uniform, and the specific absorption rate (SAR) value is reduced, that is, the radiation to the human body is reduced.

[0115] Optionally, the reflection of the electromagnetic wave signal received and transmitted by the first radiation part 31 by the reflection component 40 and the function of the reflection component 40 as a signal enhancer of the second radiation part 71 may be performed in a time-sharing manner or simultaneously.

[0116] The frequency bands of the electromagnetic wave signals received and transmitted by the first radiating portion 31 and the second radiating portion 71 may be the same or different. For example, the frequency band of the electromagnetic wave signals received and transmitted by the first radiating portion 31 includes at least one of millimeter wave signals, submillimeter wave signals, and terahertz wave signals, and the electromagnetic wave signals received and transmitted by the second radiating portion 71 include at least one of Sub-6G signals, Wi-Fi signals, and mobile communication signals. In this way, the electronic device 100 can cover multiple antenna signal frequency bands.

[0117] In another embodiment, the reflective component 40 can also serve as the radiation portion of the second antenna module, that is, the reflective component 40 can also serve as the second radiation portion 71 , and there is no need to set up the second radiation portion 71 to reduce the number of components of the electronic device 100 .

[0118] Please refer to Fig. 20 , Fig. 20 A view of the inside of a housing assembly 10 of an electronic device 100 provided in Embodiment 3 of the present application. This embodiment is substantially the same as the electronic device 100 of Embodiment 1, with the main difference being that the electronic device 100 further includes a third antenna module (not shown). The third antenna module includes a radiation coil 81. For example, the second antenna module may be a Near Field Communication (NFC) antenna. The reflective assembly 40 forms a portion of the radiation coil 81.

[0119] For further information, please refer to Fig.21, the reflective component 40 may include a plurality of strip-shaped reflective members 41 extending along the Y-axis direction. At least one of the strip-shaped reflective members 41 may be connected in series to a radiation coil 81. In this way, the reflective component 40 can be used as a reflective component 40 of the first radiation portion 31 and also as a part of the radiation coil 81, thereby achieving multiple uses of one object, improving the utilization rate of the reflective component 40, reducing the number of components, and saving cost and space.

[0120] Of course, two of the plurality of strip-shaped reflective elements 41 can be respectively used as parts of two different radiation coils 81 to further improve the utilization rate of the reflective elements 41 .

[0121] Optionally, a time period in which the reflective component 40 is used as the radiation coil 81 of the third antenna module and a time period in which the reflective component 40 is used as the reflection structure of the first radiation portion 31 are different time periods.

[0122] In other embodiments, the second embodiment and the third embodiment can be combined with each other. In other words, the reflective component 40 can be used as a reflective structure of the first antenna module 30, as a signal enhancer of the second antenna module, and as a part of the radiation coil 81 of the third antenna module. In this way, one object can be used for multiple purposes.

[0123] Please refer to Fig. 22 , Fig. 22 This is a cross-sectional view of an electronic device 100 provided in Embodiment 4 of the present application.

[0124] Please refer to Fig. 22 The electronic device 100 includes a housing assembly 10, a first antenna module 30 and a display screen 50. The first antenna module 30 is disposed in a space surrounded by the housing assembly 10. The first antenna module 30 is used to transmit and receive electromagnetic wave signals of a preset frequency band. The display screen 50 covers the housing assembly 10. The signal coverage range of the first antenna module 30 on the side where the display screen 50 is located is a first angle range θ1.

[0125] Please refer to Fig.23 The electronic device 100 further includes a reflective component 40, which is disposed in a space surrounded by the housing component 10 or on the housing component 10. The reflective component 40 is spaced apart from the first antenna module 30. The structure of the housing component 10, the structure and position of the first antenna module 30, the structure and position of the display screen 50, and the structure and position of the reflective component 40 in this embodiment can all refer to the relevant descriptions in Embodiments 1 to 3.

[0126] Please refer to Fig.23The reflective component 40 is used to reflect part of the electromagnetic wave signal to the side where the display screen 50 is located, so that the signal coverage range of the first antenna module 30 on the side where the display screen 50 is located is a second angle range θ2. The second angle range θ2 is greater than the first angle range θ1.

[0127] For example, when the reflective component 40 is not disposed on the side of the first radiating portion 31 close to the housing component 10, the signal coverage range of the first radiating portion 31 on the side where the display screen 50 is located is 30° (ie Fig. 22 The first angle range θ1).

[0128] For example, when the reflective component 40 is disposed on a side of the first radiating portion 31 close to the housing component 10, the signal coverage range of the first radiating portion 31 on the side where the display screen 50 is located is 45° (ie Fig.23 Thus, it can be seen that the reflective component 40 can increase the angle range of the signal coverage of the first antenna module 30 on the side where the display screen 50 is located, thereby improving the antenna signal coverage at the display screen 50 and improving the antenna communication quality.

[0129] By setting a reflective component 40 on the side of the first antenna module 30 close to the shell component 10 to reflect the electromagnetic wave signal radiated by the first radiation part 31, the angle range of the signal coverage of the first antenna module 30 on the side where the display screen 50 is located can be increased, thereby improving the antenna signal coverage at the display screen 50 and improving the antenna communication quality.

[0130] Please refer to Fig.23 , the electronic device 100 also includes a circuit board 20. The circuit board 20 in this embodiment can refer to the circuit board 20 in the first embodiment. The board surface 201 of the circuit board 20 is arranged opposite to or opposite to the display screen 50. Specifically, one board surface of the circuit board 20 is arranged opposite to the display screen 50, and the other board surface of the circuit board 20 is arranged opposite to the display screen 50. The radiation surface of the first antenna module 30 is inclined relative to the board surface 201 of the circuit board 20, so that the direction of the electromagnetic wave signal radiated by the first antenna module 30 is deflected toward the side where the display screen 50 is located, combined with the function of the reflection component 40, so that the energy of the electromagnetic wave signal radiated by the first antenna module 30 is concentrated toward the side where the display screen 50 is located, thereby improving the signal coverage (signal coverage angle range) of the first antenna module 30 on the side of the electronic device 100, and improving the gain of the electronic device 100 receiving and transmitting antenna signals on the side.

[0131] Please refer to Fig.23The housing assembly 10 includes a frame portion 12. The frame portion 12 in this embodiment can refer to the frame portion 12 in the first embodiment. The frame portion 12 is opposite to the side of the circuit board 20 and is arranged at an interval. The first antenna module 30 is arranged between the frame portion 12 and the side of the circuit board 20, and the radiation surface of the first antenna module 30 is at least partially opposite to the frame portion 12, so as to make full use of the space between the circuit board 20 and the frame portion 12 and save space on the circuit board 20.

[0132] For further information, please refer to Fig.23 The shell assembly 10 also includes a rear cover portion 11 connected to the frame portion 12. The portion of the rear cover portion 11 connected to the frame portion 12 is an arc portion 111. The reflective component 40 is disposed on the arc portion 111. On the one hand, the rear cover portion 11 is used as a bearing structure of the reflective component 40, and there is no need to additionally set up a bearing structure of the reflective component 40. In addition, the arc portion 111 on the rear cover portion 11 is fully utilized so that the reflective component 40 is also arc-shaped. The arc-shaped reflective component 40 can reflect part of the electromagnetic wave signal radiated by the first antenna module 30 to the side where the display screen 50 is located, so that the electromagnetic wave signal radiated by the first antenna module 30 is offset toward the side where the display screen 50 is located and the energy of the electromagnetic wave signal is concentrated toward the side where the display screen 50 is located, thereby making the first antenna module 30 more directional, thereby increasing the signal gain of the first antenna module 30.

[0133] The orthographic projection of the reflective component 40 in the normal direction (Z-axis direction) of the circuit board 20 at least partially covers the side surface of the first antenna module 30. The orthographic projection of the first antenna module 30 in the normal direction (X-axis direction) is at least partially located on the reflective component 40. The area of ​​the portion of the orthographic projection of the first antenna module 30 in the normal direction (X-axis direction) located on the reflective component 40 is smaller than the area of ​​the portion located outside the reflective component 40.

[0134] Through the above design, the reflective component 40 corresponds to a small part of the first antenna module 30 in the X-axis direction, while most of the first antenna module 30 is not blocked by the reflective component 40 in the X-axis direction, so as to reduce the blocking of the first antenna module 30 in the orientation direction by the reflective component 40 and ensure that the first antenna module 30 radiates signals toward the frame portion 12.

[0135] Please refer to Fig.24 , Fig.24A schematic diagram of the structure of an electronic device 100 provided in Embodiment 5 of the present application. The electronic device 100 includes a housing assembly 10, a circuit board 20, a first antenna submodule 91, a second antenna submodule 92, a first reflective assembly 42, and a second reflective assembly 43. The structure of the first antenna submodule 91 can refer to any one of the first antenna modules 30 in Embodiments 1 to 4 above, and the structure of the second antenna submodule 92 can refer to any one of the first antenna modules 30 in Embodiments 1 to 4 above. The housing assembly 10 can refer to the housing assembly 10 in Embodiment 1 above, and the circuit board 20 can also refer to the circuit board 20 in Embodiment 1.

[0136] Please refer to Fig.24 The housing assembly 10 includes a rear cover portion 11, a first frame portion 121 and a second frame portion 122. The rear cover portion 11 may refer to the rear cover portion 11 in the first embodiment, and the first frame portion 121 and the second frame portion 122 may be located at two opposite frame bars of the rectangular frame portion 12 in the first embodiment, wherein the frame bars extend in a straight line.

[0137] Please refer to Fig.24 The rear cover 11 includes a first arc portion 112, a middle portion 113 and a second arc portion 114 connected in sequence. The board surface 201 of the circuit board 20 is arranged opposite to the middle portion 113. The first arc portion 112 is connected to the first frame portion 121. The second arc portion 114 is connected to the second frame portion 122.

[0138] The radiation surface of the first antenna submodule 91 is tilted from the board surface 201 of the circuit board 20 toward the first frame portion 121, and the tilt angle thereof can be 0 to 90 degrees, including 0 degrees and 90 degrees. The radiation surface of the second antenna submodule 92 is tilted from the board surface 201 of the circuit board 20 toward the second frame portion 122, and the tilt angle thereof can be 0 to 90 degrees, including 0 degrees and 90 degrees.

[0139] The first reflective component 42 is disposed on the first arc portion 112, and is used to reflect at least part of the electromagnetic wave signal radiated by the first antenna submodule 91 to the direction of the first frame portion 121. The second reflective component 43 is disposed on the second arc portion 114, and is used to reflect at least part of the electromagnetic wave signal radiated by the second antenna submodule 92 to the direction of the second frame portion 122. The above design enables the first antenna submodule 91 and the second antenna submodule 92 to have a certain range of electromagnetic wave signal transceiving performance on the opposite sides of the electronic device 100, and combines the design of the first reflective component 42 and the second reflective component 43, so that the electromagnetic wave signal received and transmitted by the first antenna submodule 91 is offset and the energy is concentrated toward the side where the display screen 50 is located, thereby improving the antenna gain; and the electromagnetic wave signal received and transmitted by the second antenna submodule 92 is offset and the energy is concentrated toward the side where the display screen 50 is located, thereby improving the antenna gain.

[0140] Furthermore, the first antenna submodule 91 is located between one side of the circuit board 20 and the first frame portion 121, and the second antenna submodule 92 is located between the other side of the circuit board 20 and the second frame portion 122, so that the first antenna submodule 91 and the second antenna submodule 92 fully utilize the space on both sides of the circuit board 20 and save space on the circuit board 20.

[0141] Please refer to Fig.25 The electronic device 100 further includes a third antenna submodule 93. The third antenna submodule 93 is disposed on the circuit board 20. The radiation surface of the third antenna submodule 93 faces the middle portion 113. The third antenna submodule 93 forms an antenna signal coverage within a certain angle range on the side of the back cover portion 11 of the electronic device 100, the first antenna submodule 91 forms an antenna signal coverage within a certain angle range on the side of the first frame portion 121 of the electronic device 100, and the second antenna submodule 92 forms an antenna signal coverage within a certain angle range on the side of the second frame portion 122 of the electronic device 100. The antenna signal coverage angle range between the first antenna submodule 91 and the third antenna submodule 93 overlaps with each other, and the antenna signal coverage angle range between the second antenna submodule 92 and the third antenna submodule 93 overlaps with each other. The three angle ranges converge to form the signal coverage angle range of the antenna of the electronic device 100. Due to the setting of the first reflection component 42 and the second reflection component 43, the two boundaries of the antenna signal coverage angle range of the electronic device 100 are offset toward the side where the display screen 50 is located, thereby increasing the antenna signal coverage angle range of the electronic device 100 and improving the communication capability of the electronic device 100.

[0142] According to the actual test results, this application Figure 3 The electronic device 100 shown can achieve a gain of 8.1 dB in the H polarization direction and a gain of 7 dB in the V polarization direction when the reflective component 40 is not provided. The H polarization direction is the Y-axis direction, which is also the length direction of the first antenna module 30; the V polarization direction is the width direction of the first antenna module 30. Obviously, the difference between the gain in the H polarization direction and the gain in the V polarization direction is 1.1 dB.

[0143] This application Figure 3 The electronic device 100 shown in the figure can achieve a gain of 8.28dB in the H polarization direction and a gain of 7.59dB in the V polarization direction when a 25mm (length direction)×6mm (width direction) metal sheet is provided as a reflective component 40. Obviously, the difference between the gain in the H polarization direction and the gain in the V polarization direction is 0.0.69dB. Compared with the case where no reflective component is provided, the H polarization is improved by 0.18dB and the V polarization is improved by 0.59dB.

[0144] This application Figure 3 The electronic device 100 shown can achieve a gain of 8.3 dB in the H polarization direction and a gain of 8 dB in the V polarization direction when a 25 mm (length direction) × 10 mm (width direction) metal sheet is provided as the reflective component 40. Obviously, the difference between the gain in the H polarization direction and the gain in the V polarization direction is 0.3 dB.

[0145] From the above, it can be seen that after the reflective component 40 is set, the gain of the electronic device 100 in the H polarization direction and the V polarization direction are increased, which is beneficial to improving the radiation efficiency of the antenna signal; the gain difference between the H polarization direction and the V polarization direction is reduced, which is beneficial to the uniformity of the signal in the dual polarization direction, forming a dual-polarization antenna.

[0146] As the width of the reflective component 40 increases to a suitable size, the gain of the electronic device 100 in the H polarization direction and the V polarization direction increases, which is beneficial to improving the radiation efficiency of the antenna signal; the gain difference in the H polarization direction and the V polarization direction decreases, which is beneficial to uniform signals in the dual polarization directions, forming a dual-polarization antenna.

[0147] See also Fig.26 , Fig.26 It is the 2D gain pattern of the electronic device 100 in the H polarization direction. Among them, L1 represents the 2D gain pattern in the H polarization direction when the reflective component is not set; L2 represents the 2D gain pattern in the H polarization direction when a 25mm (length direction) × 6mm (width direction) metal sheet is used as the reflective component 40; L3 represents the 2D gain pattern in the H polarization direction when a 25mm (length direction) × 10mm (width direction) metal sheet is used as the reflective component 40. Among them, 0~90° is the display screen direction area, with 30° as the reference point. The gains corresponding to L1, L2, and L3 at the reference point are -6.37dB, -4dB, and -4dB, respectively. Obviously, the gain at the 30° position in the display screen direction area gradually increases with the setting of the reflective component and the increase of the width of the reflective component. It can be seen from the figure that after the reflective component is set, the gain coverage on the display screen side is improved.

[0148] See also Fig. 27 , Fig. 27It is the 2D gain pattern of the electronic device 100 in the V polarization direction. Among them, L1 represents the 2D gain pattern in the V polarization direction when the reflective component is not set; L2 represents the 2D gain pattern in the V polarization direction when a 25mm (length direction) × 6mm (width direction) metal sheet is used as the reflective component 40; L3 represents the 2D gain pattern in the V polarization direction when a 25mm (length direction) × 10mm (width direction) metal sheet is used as the reflective component 40. Among them, 0~90° is the display screen direction area, with 30° as the reference point. The gains corresponding to L1, L2, and L3 at the reference point are 2.34dB, 3.71dB, and 4.91dB, respectively. Obviously, the gain at the 30° position in the display screen direction area gradually increases with the setting of the reflective component and the increase of the width of the reflective component. It can be seen from the figure that after the reflective component is set, the gain coverage on the display screen side is improved.

[0149] The above are some implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: include: The housing assembly comprises a frame portion and a rear cover portion, wherein the rear cover portion covers the frame portion and forms a receiving space with the frame portion; A circuit board is arranged in the receiving space, and the circuit board is arranged opposite to the rear cover; a first antenna module, disposed in the receiving space, the first antenna module comprising a first radiating portion for transmitting and receiving electromagnetic wave signals, the first radiating portion being disposed on the circuit board or on one side of the circuit board, and a radiating surface of the first radiating portion being inclined relative to a surface of the circuit board; and A reflective component is arranged on one side of the first radiating part and is spaced apart from the first radiating part, and the orthographic projection of the reflective component in the normal direction of the radiating surface at least partially covers the radiating surface of the first radiating part; the reflective component is used to reflect at least part of the electromagnetic wave signal radiated by the first radiating part, so that the signal radiation range formed by the first radiating part is offset toward the frame part.

2. The electronic device according to claim 1, wherein: The first radiation portion is disposed between the frame portion and a side surface of the circuit board.

3. The electronic device according to claim 2, characterized in that: The electronic device also includes an injection-molded substrate portion, which is disposed on the surface of the frame portion facing the circuit board; the first radiating portion is disposed on the surface of the injection-molded substrate portion facing the side of the circuit board; or, the first radiating portion is at least partially embedded in the injection-molded substrate portion; or, the first radiating portion is disposed on the side of the circuit board facing the injection-molded substrate portion.

4. The electronic device according to claim 3, characterized in that: The injection molding base material part has a containing groove, the opening of the containing groove formed on the injection molding base material part faces the rear cover part, and the first radiation part is at least partially arranged in the containing groove.

5. The electronic device according to claim 4, characterized in that: The reflective component is arranged on the side where the back cover portion of the first radiating portion is located, and the orthographic projection of the reflective component in the normal direction of the circuit board at least partially covers the opening formed by the accommodating groove on the injection-molded substrate portion; the orthographic projection of the reflective component in the normal direction of the radiating surface at least partially covers the radiating surface of the first radiating portion.

6. The electronic device according to claim 5, characterized in that: The area of ​​a portion of the orthographic projection of the first radiating portion in the normal direction located on the reflective component is smaller than the area of ​​a portion located outside the reflective component.

7. The electronic device according to any one of claims 3 to 6, characterized in that: The reflective component is in sheet or coating form, and the electronic device also includes a carrying surface; at least a portion of the carrying surface is a curved surface, and at least a portion of the reflective component is attached to the curved surface on the carrying surface; or, at least a portion of the carrying surface is an inclined surface inclined relative to the radiating surface of the first radiating part, and at least a portion of the reflective component is attached to the inclined surface on the carrying surface.

8. The electronic device according to claim 7, characterized in that: The portion of the rear cover portion connected to the frame portion is an arc-shaped portion, and the bearing surface is the inner surface of the arc-shaped portion, the outer surface of the arc-shaped portion, or a surface arranged between the inner surface of the arc-shaped portion and the outer surface of the arc-shaped portion.

9. The electronic device according to claim 7, characterized in that: The electronic device further comprises a carrier, wherein the carrier is located between the injection molding substrate portion and the rear cover portion, the carrier is connected to the injection molding substrate portion and / or the rear cover portion, and the surface of the carrier facing the rear cover portion is the carrier surface.

10. The electronic device according to claim 9, characterized in that: The supporting component is arc-shaped, the portion of the rear cover portion connected to the frame portion is an arc-shaped portion, an arc-shaped space is formed between the arc-shaped portion and the injection molding substrate portion, and the supporting component is located in the arc-shaped space.

11. The electronic device according to claim 7, characterized in that: The portion of the rear cover portion connected to the frame portion is an arc-shaped portion, and the bearing surface is arranged on the injection molding substrate portion and faces the arc-shaped portion.

12. The electronic device according to any one of claims 1 to 6, characterized in that: The portion of the rear cover portion connecting the frame portion is an arc-shaped portion, a portion of the orthographic projection of the first radiating portion in the normal direction is located in the arc-shaped portion, and the other portion is arranged on the frame portion, and the orthographic projection area of ​​the first radiating portion on the arc-shaped portion is larger than the orthographic projection area of ​​the first radiating portion on the frame portion.

13. The electronic device according to any one of claims 1 to 6, characterized in that: The reflective component is made of a conductive material to be electromagnetically coupled with the electromagnetic waves received and transmitted by the first radiating portion.

14. The electronic device according to any one of claims 1 to 6, characterized in that: The reflective assembly is a whole solid structure, or the reflective assembly includes a plurality of reflective elements arranged at intervals, and the distance between two adjacent reflective elements is smaller than the wavelength of the electromagnetic wave received and transmitted by the first radiating portion.

15. The electronic device according to claim 14, characterized in that: When the reflective assembly includes a plurality of reflective elements, the reflective elements are in a strip shape, and the plurality of reflective elements are arranged side by side and at intervals.

16. The electronic device according to any one of claims 1 to 6, characterized in that: The frame portion includes at least one metal segment, and the electronic device also includes a second antenna module, the second antenna module includes at least one second radiating part, the electromagnetic wave frequency band received and transmitted by the second radiating part is different from or the same as that of the first radiating part, the second radiating part is one of the at least one metal segment, the second radiating part is close to the reflective component, and the second radiating part can be electromagnetically coupled with the reflective component.

17. The electronic device according to claim 16, characterized in that: The electromagnetic wave signals received and sent by the first radiating unit include at least one of millimeter wave signals, submillimeter wave signals, and terahertz wave signals; the electromagnetic wave signals received and sent by the second radiating unit include Sub-6G signals, Wi-Fi signals, and mobile communication signals.

18. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further includes a third antenna module, the third antenna module includes a radiation coil, and the reflection component forms a part of the radiation coil.

19. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device also includes a display screen, which covers the shell assembly, and the back cover, the first radiation part and the display screen are arranged in sequence, and the distance between the first radiation part and the back cover is smaller than the distance between the first radiation part and the display screen and the first radiation part.

20. An electronic device, characterized in that: include: Shell assembly; A first antenna module, disposed in a space surrounded by the housing assembly, the first antenna module being used to transmit and receive electromagnetic wave signals of a preset frequency band; A display screen, wherein the display screen covers the housing assembly, and a signal coverage range of the first antenna module on the side where the display screen is located is a first angle range; a circuit board, wherein the board surface of the circuit board is arranged opposite to or opposite to the display screen, and A reflective component is arranged in the space surrounded by the shell component or on the shell component, the reflective component is spaced apart from the first antenna module, and the orthographic projection of the reflective component in the normal direction of the circuit board at least partially covers the side of the first antenna module; the reflective component is used to reflect part of the electromagnetic wave signal to the side where the display screen is located, so that the signal coverage range of the first antenna module on the side where the display screen is located is a second angle range, wherein the second angle range is larger than the first angle range.

21. The electronic device according to claim 20, characterized in that: The radiation surface of the first antenna module is inclined relative to the board surface of the circuit board.

22. The electronic device according to claim 21, characterized in that The shell assembly includes a frame portion, which is opposite to and spaced from the side of the circuit board. The first antenna module is arranged between the frame portion and the side of the circuit board, and the radiation surface of the first antenna module is at least partially opposite to the frame portion.

23. The electronic device according to claim 22, characterized in that: The housing assembly further comprises a rear cover portion connected to the frame portion, a portion of the rear cover portion connected to the frame portion is an arc-shaped portion, and the reflective assembly is disposed on the arc-shaped portion.

24. The electronic device according to claim 23, characterized in that The reflective component corresponds to a portion of the first antenna module in a direction opposite to the side surface of the frame portion and the circuit board, and the orthographic projection of the first antenna module in the normal direction is at least partially located on the reflective component; The area of ​​a portion of the orthographic projection of the first antenna module in the normal direction located on the reflective component is smaller than the area of ​​a portion located outside the reflective component.

25. An electronic device, characterized in that: include: A housing assembly, comprising a rear cover portion, a first frame portion and a second frame portion, wherein the rear cover portion comprises a first arc portion, a middle portion and a second arc portion connected in sequence, wherein the first arc portion is connected to the first frame portion, and the second arc portion is connected to the second frame portion; A circuit board, wherein a board surface of the circuit board is arranged opposite to the middle portion; A first antenna submodule, wherein a radiation surface of the first antenna submodule is inclined from a surface direction of the circuit board toward the first frame portion; A second antenna submodule, wherein a radiation surface of the second antenna submodule is inclined from a surface direction of the circuit board toward the second frame portion; a first reflective component, disposed on the first arc-shaped portion, and used to reflect at least a portion of the electromagnetic wave signal radiated by the first antenna sub-module, wherein the orthographic projection of the first reflective component in the normal direction of the circuit board at least partially covers the side surface of the first antenna sub-module, so that the signal radiation range formed by the first antenna sub-module is offset toward the first frame portion; and A second reflecting component is arranged on the second arc-shaped portion, and the orthographic projection of the second reflecting component in the normal direction of the circuit board at least partially covers the side surface of the second antenna sub-module, and is used to reflect at least part of the electromagnetic wave signal radiated by the second antenna sub-module, so that the signal radiation range formed by the second antenna sub-module is offset toward the second border portion.

26. The electronic device according to claim 25, characterized in that The electronic device further includes a third antenna sub-module, which is disposed on the circuit board, and a radiation surface of the third antenna sub-module faces the middle portion.

27. The electronic device according to claim 25, characterized in that The first antenna submodule is located between one side surface of the circuit board and the first frame portion, and the second antenna submodule is located between the other side surface of the circuit board and the second frame portion.

Images