Circuit board testing methods

Abstract

The present invention provides a circuit board testing method, including a test type determination step, a function board assembly step and a circuit board testing step. In the test type determination step, the test type performed by the circuit board testing device is determined, and the test type is software and file burning test, online open and short circuit test, function test or wireless radio frequency test. In the function board assembly step, the circuit board testing device includes a first function board, a second function board, a third function board and a fourth function board. According to the test type, one of the first function board and the second function board is selected to be assembled on a base of the circuit board testing device, or the first function board and the second function board are selected to be assembled on the base of the circuit board testing device after being overlapped, or the third function board, the second function board and the fourth function board are selected to be overlapped and assembled in sequence on the base of the circuit board testing device. In this way, different probe types can be used and costs can be reduced.

Description

Technical Field

[0001] The present invention relates to a testing device and a testing method, and in particular to a circuit board testing device and a circuit board testing method. Background Art

[0002] Technological advances have led to the widespread use of electronic products with more and more functions. The circuit boards used in electronic products are also becoming more and more complex, and require a variety of tests such as online testing to ensure that the circuit boards can operate normally.

[0003] Based on this, some industry insiders have developed a test device, which includes a base and a PCB board. The base has a space for placing the circuit board, and the probes on the PCB board correspond to different test points on the circuit board, so the circuit board can be tested. Generally speaking, the PCB board will uniformly use the highest specification probes to correspond to the tests of different functions such as power supply, ground, wireless radio frequency, etc. on the circuit board, which causes the probe function to overflow, which easily wastes costs. Furthermore, even with the highest specification probes, there will still be more suitable tests, and when the tests of all functions use probes of the same specification, unstable tests may also occur. In addition, when a probe with a single function is damaged, the entire PCB board or test device needs to be disassembled and replaced, which easily causes maintenance difficulties and increased costs.

[0004] In view of this, how to improve the structure of the testing device has become a goal of relevant industry players. Summary of the invention

[0005] According to another embodiment of the present invention, a circuit board testing method is provided, which is used to test a circuit board placed in a circuit board testing device. The circuit board testing method includes a test type determination step, a function board assembly step, and a circuit board testing step. In the test type determination step, a test type to be performed by the circuit board testing device is determined, and the test type is a software and file burning test, an online open and short circuit test, a functional test, or a wireless radio frequency test. In the function board assembly step, the circuit board testing device includes a base, a PCB board, a first function board, a second function board, a third function board, and a fourth function board. The base includes a accommodating space for placing the circuit board and a lower opening connected to the accommodating space; the first function board includes a plurality of first probes for corresponding to a plurality of first test points of the circuit board, and at least one elastic transfer pin is arranged at intervals with the first probe; the second function board includes at least one second probe for corresponding to at least one second test point of the circuit board, and a height of the second probe is less than a height of each first probe; the third function board includes at least one third probe for corresponding to at least one third test point of the circuit board, and the fourth function board includes a plurality of clearance holes. The first function board assembly The second function board is arranged on the base and corresponds to the lower opening. The second function board group is detachably arranged between the first function board and the base. The PCB board group is arranged on the side of the first function board away from the second function board. The first function board also includes a top holding member that abuts between the first function board and the second function board, and a bottom holding member that abuts between the first function board and the PCB board. The second function board also includes a plurality of through holes corresponding to the first probes. According to the test type, the first function board and the second function board are stacked and assembled on the base of the circuit board test device, so that when the circuit board is tested, the second probe abuts against the second test point of the circuit board, the elastic adapter pin contacts and is electrically connected with the second probe, and each first probe passes through each through hole to abut against each first test point of the circuit board. In the circuit board testing step, the circuit board is tested according to the test type. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 A three-dimensional schematic diagram of a circuit board testing device according to an embodiment of the present invention is shown;

[0007] Figure 2 Draw Figure 1 A schematic partial cross-sectional view of a circuit board testing device and a circuit board of an embodiment;

[0008] Figure 3 Draw Figure 1 A schematic top view of a third functional board and a voltage and current system of the embodiment;

[0009] Figure 4 Draw Figure 1 A schematic top view of a fourth functional board of the embodiment; and

[0010] Figure 5A block diagram of the steps of a circuit board testing method according to another embodiment of the present invention is shown.

[0011] The reference numerals are described as follows:

[0012] 100: Circuit board test device

[0013] 110: First function board

[0014] 111: The First Probe

[0015] 112: Elastic adapter pin

[0016] 113: The first ontology

[0017] 114: Top holder

[0018] 115: Bottom holder

[0019] 120: Second function board

[0020] 121: Perforation

[0021] 122: Second probe

[0022] 123: Second Body

[0023] 130: The third function board

[0024] 131: The Third Probe

[0025] 140: Fourth Function Board

[0026] 141: Metal body

[0027] 142: Make way hole

[0028] 143: Absorbent glue

[0029] 150: Upper cover

[0030] 160: Pressure plate

[0031] 170: Screws

[0032] 180: Base

[0033] 190: PCB board

[0034] 200: Circuit board testing method

[0035] 210: Test type decision step

[0036] 220: Function board assembly steps

[0037] 230: Circuit board testing steps

[0038] C1: Circuit board

[0039] C11: First test point

[0040] C12: Second test point

[0041] M1: Voltage and current system

[0042] S1: Accommodation space DETAILED DESCRIPTION

[0043] See also Figure 1 and Figure 2 ,in Figure 1 FIG. 1 is a three-dimensional schematic diagram of a circuit board testing device 100 according to an embodiment of the present invention. Figure 2 Draw Figure 1 A schematic diagram of a partial cross-section of a circuit board testing device 100 and a circuit board C1 of an embodiment. The circuit board testing device 100 includes a base 180, a first functional board 110, and a second functional board 120. The base 180 includes a receiving space S1 and a lower opening (not shown). The receiving space S1 is for placing a circuit board C1 to be tested, and the lower opening is connected to the receiving space S1. The first functional board 110 is assembled on the base 180 and corresponds to the lower opening. The first functional board 110 includes a plurality of first probes 111 and at least one elastic transfer pin 112. The first probes 111 correspond to a plurality of first test points C11 of the circuit board C1, respectively. The elastic transfer pins 112 and the first probes 111 are arranged at intervals. The second functional board 120 is detachably assembled between the first functional board 110 and the base 180 and includes a plurality of through holes 121 and at least one second probe 122. Each through hole 121 corresponds to each first probe 111. The second probe 122 corresponds to the elastic transfer pin 112 and corresponds to at least one second test point C12 of the circuit board C1. A height of the second probe 122 is less than a height of each first probe 111. When the circuit board C1 is tested, the second probe 122 abuts against the second test point C12 of the circuit board C1, the elastic transfer pin 112 contacts and is electrically connected to the second probe 122, and each first probe 111 passes through each through hole 121 to abut against the first test point C11 of the circuit board C1.

[0044] Thus, the first probe 111 can pass through the through hole 121 of the second functional board 120 and contact the first test point C11, and the second probe 122 can be electrically connected to the PCB board 190 below through the transfer of the elastic transfer pin 112 of the first functional board 110, so that the first probe 111 can use a specification suitable for the first test point C11 or a dedicated probe thereof, and the second probe 122 can use a specification suitable for the second test point C12 or a dedicated probe thereof, and the advantages of cost reduction and easy maintenance can be achieved. The details of the circuit board testing device 100 will be described in detail later.

[0045] The circuit board testing device 100 may further include an upper cover 150, a pressing plate 160 and a PCB board 190. The upper cover 150 can be lifted and covered on the base 180. The pressing plate 160 is arranged on the lower surface of the upper cover 150. The PCB board 190 is assembled on the side of the first functional board 110 away from the second functional board 120. When the circuit board C1 is placed in the accommodating space S1, the upper cover 150 is closed, and the pressing plate 160 presses the circuit board C1 downward, so that the first probe 111 can abut against the first test point C11, and the second probe 122 can abut against the second test point C12, and then the test is performed. Among them, the upper cover 150, the pressing plate 160 and the PCB board 190 are known and are not the focus of improvement of this case, and the details are not repeated.

[0046] The first functional board 110 may include a first body 113, and the second functional board 120 may also include a second body 123. The width of the first body 113 and the width of the second body 123 are the same as the width of the base 180. That is to say, the length and width of the first body 113, the second body 123 and the base 180 are the same, and the first body 113 can be made of plastic steel material with good insulation performance, stable structure and small deformation, but it is not limited to this.

[0047] The first probe 111 and the elastic transfer pin 112 are both inserted into the first body 113, so that the upper and lower ends of the first probe 111 and the upper and lower ends of the elastic transfer pin 112 are exposed. The first probe 111 is a probe type suitable for testing open and short circuits and may also have a spring pin structure, so it can be slightly compressed after being pressed to avoid damage to the PCB board 190 and the circuit board C1. The second probe 122 is inserted into the second body 123 so that the upper and lower ends are exposed, and the second probe 122 is a probe type suitable for testing wireless radio frequency and also has a spring pin structure, and the through hole 121 vertically penetrates the second body 123. In terms of structural configuration, the upper end height of the elastic transfer pin 112 can be lower than the upper end height of the first probe 111, so when the second probe 122 is pressed down and abuts against the elastic transfer pin 112, the upper end of the first probe 111 can pass through the through hole 121 and contact the first test point C11, so that testing can be performed.

[0048] In other embodiments, the first functional board may include a first upper body and a first lower body, wherein the first upper body is disposed above the first lower body and includes a plurality of upper through holes. A portion of the first probe may have a tinned probe structure and be disposed in the first lower body, and may then pass through the upper through hole of the first upper body to expose its upper end; an elastic adapter pin may also pass through the first lower body, and may then pass through the upper through hole of the first upper body to expose its upper end; in addition, another portion of the first probe may have a gold-plated probe structure and be disposed in the first upper body, and pass through the lower through hole of the first lower body to expose its lower end to abut against the PCB board, so that a first functional board with different probe structures can be assembled, which can be more suitable for different test types and has the advantage of easy maintenance, but the present invention is not limited thereto.

[0049] In addition, the first functional board 110 may further include a top holding member 114 and a bottom holding member 115. The top holding member 114 may be pressed between the first functional board 110 and the second functional board 120, and the bottom holding member 115 may be pressed between the first functional board 110 and the PCB board 190. The top holding member 114 and the bottom holding member 115 may have a columnar spring structure.

[0050] Specifically, if Figure 1 and Figure 2 As shown, the PCB board 190, the first functional board 110 and the second functional board 120 are assembled with the base 180 in sequence from bottom to top through the screw 170. A part of the screw 170 has a thread that can be locked into the base 180, and the remaining part without a thread can allow the PCB board 190, the second functional board 120 and the first functional board 110 to make a small upward and downward displacement. This screw 170 is not the focus of improvement of this case and will not be repeated.

[0051] Before the upper cover 150 is closed, the first function board 110 can be positioned between the PCB board 190 and the second function board 120 by the support of the top holding member 114 and the bottom holding member 115. At this time, the first probe 111 does not pass through the through hole 121 of the second function board 120, and the elastic transfer pin 112 can be in contact with or not in contact with the second probe 122. When the upper cover 150 is closed, the pressing plate 160 presses down the circuit board C1, and the circuit board C1 moves downward. At this time, the top holding member 114 and the bottom holding member 115 are compressed, so that the first probe 111 of the first function board 110 can pass through the through hole 121 of the second function board 120, and the second probe 122 can contact the compressed elastic transfer pin 112, and the first test point C11 and the second test point C12 can be electrically connected with the PCB board 190 through the first probe 111 and the second probe 122 respectively and start to be tested, but it is not limited to this.

[0052] See also Figure 3 , and see also Figure 1 ,in Figure 3 Draw Figure 1 A schematic top view of a third functional board 130 and a voltage and current system M1 of an embodiment. The circuit board testing device 100 may further include a third functional board 130, and the third functional board 130 includes at least one third probe 131 for corresponding to at least one third test point (not shown) of the circuit board C1. The number of the third probes 131 can be changed according to actual needs, and the present invention is not limited thereto. In order to meet different needs, probe types of different specifications can be used for the special current and voltage settings required by the circuit board C1 itself. Therefore, in this embodiment, the third functional board 130 is configured for special voltage and current, and a third probe 131 of specific specifications is used for voltage and current input, and can be further electrically connected to a voltage and current system M1 to monitor abnormal current and voltage, and at the same time, the effect of voltage stabilization can also be achieved. During operation, the third functional board 130 can be separately assembled between the base 180 and the PCB board 190, and the circuit board C1 can be tested.

[0053] See also Figure 4 , and see also Figure 1 ,in Figure 4 Draw Figure 1 A schematic top view of a fourth functional board 140 of an embodiment. The circuit board testing device 100 may further include a fourth functional board 140, which may include a metal body 141, a plurality of clearance holes 142 and a plurality of wave-absorbing glues 143, wherein the clearance holes 142 are spaced apart from each other and penetrate the metal body 141, and each wave-absorbing glue 143 is filled in each clearance hole 142. The fourth functional board 140 is used for signal shielding, and may be configured according to the actual layout, masking capacity requirements, etc., and is not limited to the above disclosure. When the fourth functional board 140 is combined, the fourth functional board 140 may be located above the PCB board 190, and the fourth functional board 140 may be locked with the housing of the PCB board 190 to be grounded and short-circuited, and the probe on the PCB board 190 may be equipped with an insulating sleeve, for example, so that the probe on the PCB board 190 will not contact the wave-absorbing glue 143 when passing through the clearance hole 142, and will not affect the transmission of the signal, and the signal shielding function may be increased by the wave-absorbing glue 143.

[0054] Since the circuit board testing device 100 includes a first function board 110, a second function board 120, a third function board 130 and a fourth function board 140, etc., different test types can be selected, and the test type can be a software and file burning test (OS), an online open and short circuit test (ICT), a functional test (FCT) or a wireless radio frequency test. For example, the first function board 110 and the second function board 120 can be overlapped to perform software and file burning tests; only the first function board 110 can be used to perform online open and short circuit tests; only the third function board 130 can be used to perform online open and short circuit tests or functional tests; or, the third function board 130, the second function board 120 and the fourth function board 140 can be overlapped to perform wireless radio frequency tests, and the through hole 121 of the second function board 120 can further allow the third probe 131 on the third function board 130 to pass through to contact the PCB board 190, and the third function board 130 may also include a hole for the second probe 122 on the second function board 120 to pass through to contact the circuit board C1, but it is not limited to the above disclosure.

[0055] See also Figure 5 , and see also Figures 1 to 4 ,in Figure 5 A block diagram of the steps of a circuit board testing method 200 according to another embodiment of the present invention is shown. The details of the circuit board testing method 200 will be described below in conjunction with the circuit board testing device 100. The circuit board testing method 200 is used to test a circuit board C1 placed in a circuit board testing device 100. The circuit board testing method 200 includes a test type determination step 210, a function board assembly step 220, and a circuit board testing step 230.

[0056] In the test type determination step 210 , a test type to be performed by the circuit board testing apparatus 100 is determined.

[0057] In the function board assembly step 220, the circuit board testing device 100 includes a first function board 110 and a second function board 120 with the same width. The first function board 110 includes at least one first probe 111 for corresponding to at least one first test point C11 of the circuit board C1, and the second function board 120 includes at least one second probe 122 for corresponding to at least one second test point C12 of the circuit board C1. Depending on the test type, one of the first function board 110 and the second function board 120 is assembled on a base 180 of the circuit board testing device 100, or the first function board 110 and the second function board 120 are overlapped and assembled on the base 180 of the circuit board testing device 100.

[0058] In the circuit board testing step 230 , the circuit board C1 is tested according to the test type, which may be software and file burning test, online open and short circuit test, functional test or wireless radio frequency test.

[0059] Specifically, if the software and file burning test is selected in the test type determination step 210, then in the function board assembly step 220, the first function board 110 and the second function board 120 may be stacked, and when the first function board 110 and the second function board 120 are stacked and assembled on the base 180 of the circuit board testing device 100, the first probe 111 of the first function board 110 corresponds to the through hole 121 of the second function board 120, and the elastic transfer pin 112 of the first function board 110 corresponds to the second probe 122 of the second function board 120. In this way, in the circuit board testing step 230, the first probe 111 of the first function board 110 can pass through the through hole 121 of the second function board 120 to make the first test point C11 electrically connected to the PCB board 190, that is, the second test point C12 is electrically connected to the PCB board 190 through the second probe 122 of the second function board 120 and the elastic transfer pin 112 of the first function board 110.

[0060] In addition, the circuit board testing device 100 includes a third function board 130 and a fourth function board 140. The third function board 130 includes a third probe 131 for corresponding to the third test point of the circuit board C1, and the fourth function board 140 includes a clearance hole 142. Therefore, if wireless radio frequency testing is selected in the test type determination step 210, then in the function board assembly step 220, the third function board 130, the second function board 120 and the fourth function board 140 can be sequentially stacked and assembled on the base 180 of the circuit board testing device 100.

[0061] Accordingly, the circuit board testing device 100 can select the function board (first function board 110, second function board 120, third function board 130 and fourth function board 140) to be assembled according to the test type, and quickly replace the function board, thereby improving the test efficiency. Furthermore, through each independent function board, different probe types can be set respectively to match different test functions, while reducing costs and facilitating maintenance. In addition, the cross-validation method can be used to quickly determine which fault has occurred, so that replacement and maintenance can be facilitated.

[0062] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the appended claims.

Claims

1. A circuit board testing method for testing a circuit board placed in a circuit board testing device, characterized in that: The circuit board testing method includes: a test type determination step, determining a test type to be performed by the circuit board testing device, the test type being a software and file burning test, an online open and short circuit test, a functional test or a wireless radio frequency test; A function board assembly step, the circuit board testing device comprises a base, a PCB board, a first function board, a second function board, a third function board and a fourth function board, the base comprises a containing space for placing the circuit board and a lower opening connected to the containing space; the first function board comprises a plurality of first probes for corresponding to a plurality of first test points of the circuit board, and at least one elastic transfer needle is arranged at intervals with the plurality of first probes; the second function board comprises at least one second probe for corresponding to at least one second test point of the circuit board, and a height of the at least one second probe is less than a height of each of the first probes; the third function board comprises at least one third probe for corresponding to at least one third test point of the circuit board, the fourth function board comprises a plurality of clearance holes, the first function board is assembled on the base and corresponds to the lower opening, The second function board is detachably assembled between the first function board and the base, the PCB board is assembled on a side of the first function board away from the second function board, the first function board further comprises a top holding member abutting between the first function board and the second function board, and a bottom holding member abutting between the first function board and the PCB board, and the second function board further comprises a plurality of through holes corresponding to the plurality of first probes; according to the test type, the first function board and the second function board are stacked and assembled on the base of the circuit board test device, so that when the circuit board is tested, the at least one second probe abuts against the at least one second test point of the circuit board, the at least one elastic transfer pin contacts and is electrically connected with the at least one second probe, and each of the first probes passes through each of the through holes to abut against each of the first test points of the circuit board; and A circuit board testing step is to test the circuit board according to the test type.

2. The circuit board testing method according to claim 1, characterized in that: The fourth functional plate further comprises a plurality of absorbing glues, each of which is filled in each of the clearance holes.

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