Electronic ultra-high vacuum evaporation source

Abstract

The present invention discloses an electronically-acted ultra-high vacuum evaporation source, which includes a base, an evaporation component, a water-cooling protective sleeve and a temperature control component. The evaporation component is arranged on the base; the water-cooling protective sleeve is arranged on the base and sleeved outside the evaporation component; the water-cooling protective sleeve and the base form an evaporation inner cavity; the temperature control component is arranged on the base and is electrically connected to the evaporation component and the water-cooling protective sleeve, and is used to monitor and control the temperature in the evaporation inner cavity in real time. The electronically-acted ultra-high vacuum evaporation source disclosed in the present application adjusts the temperature during the evaporation process by arranging a temperature control component on the base, thereby controlling the evaporation rate and improving the evaporation effect.

Description

Technical Field

[0001] The invention relates to the technical field of ultra-high vacuum evaporation, in particular to an electronic ultra-high vacuum evaporation source. Background Art

[0002] At present, in the field of materials science, vacuum coating technology is a new material synthesis and processing technology. With the rapid development of global manufacturing and information technology, the application of vacuum coating technology is becoming more and more extensive. Vacuum coating technology and its equipment have a broad application market and development prospects. Vacuum coating adopts the evaporation method, the principle of which is to place the evaporated material in the crucible of the vacuum evaporation source device, and heat the crucible to convert the material from solid to gaseous atoms, atomic groups or molecules, and then condense to the surface of the substrate to be coated to form a thin film.

[0003] However, in the traditional evaporation process, only the crucible is heated, and the temperature in the heating environment cannot be monitored and controlled. In other words, the evaporation rate cannot be regulated, resulting in poor uniformity of the thickness of the formed coating and poor evaporation effect.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an electronic ultra-high vacuum evaporation source, aiming to solve the problem that the ultra-high vacuum evaporation source cannot control the evaporation rate during evaporation, resulting in poor evaporation effect.

[0006] The technical solution of the present invention is as follows:

[0007] An electronically-acting ultra-high vacuum evaporation source comprises a base, an evaporation component, a water-cooling protective sleeve and a temperature control component, wherein the evaporation component is arranged on the base; the water-cooling protective sleeve is arranged on the base and sleeved outside the evaporation component; the water-cooling protective sleeve and the base form an evaporation inner cavity; the temperature control component is arranged on the base and is electrically connected to the evaporation component and the water-cooling protective sleeve, and is used to monitor and control the temperature in the evaporation inner cavity in real time.

[0008] The electron-activated ultra-high vacuum evaporation source, wherein the base includes a first surface and a second surface that are opposite to each other, and the water-cooling protective sleeve is arranged on the second surface; the evaporation component includes a transmission rod, a driving structure, an evaporation crucible and an electron emitter, the transmission rod is arranged through the base, and the transmission rod can be raised and lowered relative to the base; the driving structure is connected to the end of the transmission rod extending out of the first surface, and is used to control the lifting and lowering of the transmission rod; the evaporation crucible is connected to the end of the transmission rod extending out of the second surface, is located in the evaporation inner cavity, and is used to hold evaporation materials; the electron emitter is arranged on the second surface, is located in the evaporation inner cavity, and the electron emitter is located directly above the evaporation crucible.

[0009] The electronic ultra-high vacuum evaporation source, wherein the evaporation crucible is detachably connected to the transmission rod.

[0010] The electronically acted ultra-high vacuum evaporation source, wherein the temperature control component includes a temperature sensor, a control module and a water pressure regulator, the temperature sensor is arranged on the transmission rod; the control module is arranged on the base and is electrically connected to the temperature sensor; the water pressure regulator is arranged on the water cooling protective sleeve and is electrically connected to the control module.

[0011] The electronic ultra-high vacuum evaporation source, wherein the water-cooling protective sleeve comprises a sleeve body arranged on the base and a water-cooling circulation pipeline arranged inside the sleeve body, and the water pressure regulator is installed at the water inlet end of the water-cooling circulation pipeline.

[0012] The electron-acting ultra-high vacuum evaporation source, wherein a shielding layer is provided on the side of the casing facing the evaporation crucible; and / or a light-shielding layer is provided on the side of the casing facing the evaporation crucible.

[0013] The electronically acted ultra-high vacuum evaporation source, wherein an evaporation nozzle is formed at one end of the water-cooling protective cover away from the base; the electronically acted ultra-high vacuum evaporation source also includes a baffle assembly, which is arranged on the base and is used to close or open the evaporation nozzle.

[0014] The electronically acted ultra-high vacuum evaporation source, wherein the baffle assembly includes a rotating rod, a rotating driving member and a baffle, wherein the rotating rod passes through the base and can rotate on the base; the rotating driving member is connected to one end of the rotating rod and is used to drive the rotating rod to rotate; the baffle is connected to the other end of the rotating rod and is arranged opposite to the evaporation nozzle; when the rotating rod rotates, the baffle is driven to open and close the evaporation nozzle.

[0015] The electronically acted ultra-high vacuum evaporation source, wherein the temperature control component is electrically connected to the rotary drive component.

[0016] The electron-activated ultra-high vacuum evaporation source has a water cooling channel in the base.

[0017] Compared with the prior art, the embodiments of the present invention have the following advantages:

[0018] The electronic ultra-high vacuum evaporation source disclosed in the present application comprises an evaporation inner cavity through a water-cooling protective sleeve and a base, and controls the cooling effect of the water-cooling protective sleeve by electrically connecting the water-cooling protective sleeve through a temperature control component, thereby adjusting the temperature in the evaporation inner cavity, so that the evaporation rate of the evaporation component arranged in the evaporation inner cavity can be regulated; when the electronic ultra-high vacuum evaporation source is working, the evaporation component gradually heats up, thereby increasing the temperature in the evaporation inner cavity, causing the evaporation material to gradually melt, and the temperature control component is simultaneously turned on to monitor the temperature on the evaporation component in real time. When the temperature in the evaporation inner cavity deviates from the temperature condition required for the evaporation of the evaporation material, the cooling power of the water-cooling protective sleeve is adjusted to thereby adjust the temperature in the evaporation inner cavity, control the evaporation rate of the evaporation material, make the film layer formed by evaporation more uniform, and obtain a better evaporation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of the structure of the electron-assisted ultra-high vacuum evaporation source in the present invention;

[0021] Figure 2 Another schematic diagram of the structure of the electron-assisted ultra-high vacuum evaporation source in the present invention.

[0022] Among them, 10, base; 11, first surface; 12, second surface; 20, evaporation component; 21, transmission rod; 22, driving structure; 23, evaporation crucible; 24, electron emitter; 30, water-cooled protective cover; 31, cover body; 32, water-cooled circulation pipeline; 33, evaporation nozzle; 40, evaporation inner cavity; 50, temperature control component; 51, temperature sensor; 52, control module; 53, water pressure regulator; 60, baffle assembly; 61, rotating rod; 62, rotating drive member; 63, baffle. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that the present invention takes an electron-acting ultra-high vacuum evaporation source as an example to introduce the specific structure and working principle of the present invention. The electron-acting ultra-high vacuum evaporation source disclosed in this application can be used to evaporate high-melting-point metals such as tungsten, molybdenum, tantalum, niobium, or oxides and non-metallic materials with extremely high melting points such as zirconium oxide and graphite, but the application of the present invention is not limited to these objects, and can also be applied to other similar evaporation processes.

[0025] like Figure 1 As shown, in one embodiment of the present invention application, an electronic ultra-high vacuum evaporation source is disclosed, which includes a base 10, an evaporation component 20, a water-cooling protective cover 30 and a temperature control component 50, wherein the evaporation component 20 is arranged on the base 10; the water-cooling protective cover 30 is arranged on the base 10, and is sleeved outside the evaporation component 20; the water-cooling protective cover 30 and the base 10 form an evaporation cavity 40; the temperature control component 50 is arranged on the base 10, and is electrically connected to the evaporation component 20 and the water-cooling protective cover 30, for real-time monitoring and control of the temperature in the evaporation cavity 40.

[0026] The electronic ultra-high vacuum evaporation source disclosed in the present application is composed of a water-cooling protective sleeve 30 and a base 10 to form an evaporation cavity 40, and the temperature control component 50 is electrically connected to the water-cooling protective sleeve 30 to control the cooling effect of the water-cooling protective sleeve 30, thereby adjusting the temperature in the evaporation cavity 40, so that the evaporation rate of the evaporation component 20 arranged in the evaporation cavity 40 can be regulated; when the electronic ultra-high vacuum evaporation source is working, the evaporation component 20 gradually heats up, the temperature in the evaporation cavity 40 is increased, and the evaporation material gradually melts, and the temperature control component 50 is turned on synchronously to monitor the temperature on the evaporation component 20 in real time. When the temperature in the evaporation cavity 40 deviates from the temperature condition required for the evaporation of the evaporation material, the cooling power of the water-cooling protective sleeve 30 is adjusted to adjust the temperature in the evaporation cavity 40, control the evaporation rate of the evaporation material, make the film layer formed by evaporation better uniform, and obtain a better evaporation effect.

[0027] Specifically, as an implementation of this embodiment, the base 10 is disclosed to be a metal sealing flange. The metal sealing flange has high hardness, strong bearing capacity, is not easily deformed during assembly, has good air tightness, and is convenient to form an evaporation cavity 40 with good air tightness with the water-cooling protective sleeve 30, reduces unnecessary heat dissipation during evaporation, and ensures the evaporation rate of the evaporation cavity 40.

[0028] like Figure 1 As shown, as an implementation of this embodiment, it is disclosed that the base 10 includes a first surface 11 and a second surface 12 that are opposite to each other, and the water-cooling protective sleeve 30 is arranged on the second surface 12; the evaporation component 20 includes a transmission rod 21, a driving structure 22, an evaporation crucible 23 and an electron emitter 24, the transmission rod 21 is arranged through the base 10, and the transmission rod 21 can be lifted and moved relative to the base 10; the driving structure 22 is connected to the end of the transmission rod 21 extending out of the first surface 11, and is used to control the lifting and lowering of the transmission rod 21; the evaporation crucible 23 is connected to the end of the transmission rod 21 extending out of the second surface 12, is located in the evaporation cavity 40, and is used to hold the evaporation material; the electron emitter 24 is arranged on the second surface 12, is located in the evaporation cavity 40, and the electron emitter 24 is located directly above the evaporation crucible 23. The different parts of the evaporation assembly 20 are arranged on different sides of the base 10, so that only the evaporation crucible 23, the electron emitter 24 and part of the transmission rod 21 are in the evaporation cavity 40, which can prevent the high temperature in the evaporation cavity 40 from affecting the operation of the drive structure 22 during operation. In this embodiment, the electron emitter 24, the evaporation crucible 23, and the transmission rod 21 can all be made of high-temperature resistant metal materials, and the drive structure 22 is a drive motor with a complex structure, so it has requirements on the ambient temperature during operation and cannot overheat; secondly, the drive structure 22 occupies a large space, and arranging it on the other side of the base 10 can save space in the evaporation cavity 40, and the water-cooling protective cover 30 can be designed to be smaller, saving space and cost.

[0029] In addition, the driving structure 22 and the transmission rod 21 are provided to facilitate the lifting and lowering of the evaporation crucible 23, thereby adjusting the distance between the evaporation crucible 23 and the electron emitter 24, and further controlling the evaporation rate of the evaporation material. In actual operation, by adding the evaporation material into the evaporation crucible 23 and then adjusting it to an appropriate height, the evaporation material in the evaporation crucible 23 is melted and evaporated by the electron emitter 24 emitting electrons, so as to obtain a more uniform evaporation layer and achieve a good evaporation effect.

[0030] Specifically, in another implementation of this embodiment, the evaporation crucible 23 may be a ceramic crucible. Ceramic materials have good heat resistance and are suitable for high temperature environments.

[0031] Specifically, as another implementation of this embodiment, the evaporation crucible 23 is detachably connected to the transmission rod 21. After the electronic ultra-high vacuum evaporation source has been used for a period of time, the crucible will inevitably be damaged after repeated heating and cooling, so it needs to be replaced. The evaporation crucible 23 is detachably connected to the transmission rod 21 to facilitate the operation of replacing the crucible; in addition, if the requirements for the crucible of a special material are different, the model and material of the crucible can be flexibly selected, which is conducive to better evaporation.

[0032] like Figure 2 As shown, as another implementation of this embodiment, the water-cooling protective sleeve 30 is disclosed to include a sleeve body 31 disposed on the base 10 and a water-cooling circulation pipe 32 disposed inside the sleeve body 31, and the water pressure regulator 53 is installed at the water inlet end of the water-cooling circulation pipe 32. The water-cooling circulation pipe 32 is disposed in the sleeve body 31, and the side walls of the water-cooling circulation pipe 32 are all formed by the sleeve body 31. When the water flows through, the heat of the sleeve body 31 can be taken away in all directions, so that the cooling effect of the water-cooling circulation system can be controlled within a larger range, thereby improving the cooling capacity of the water-cooling protective sleeve 30.

[0033] Specifically, as another implementation of this embodiment, it is disclosed that a shielding layer (not shown in the drawings) is provided on the side of the sleeve 31 facing the evaporation crucible 23; and / or, a light-shielding layer (not shown in the drawings) is provided on the side of the sleeve 31 facing the evaporation crucible 23. A shielding layer is provided on the inner wall of the sleeve 31, that is, on the side facing the evaporation crucible 23, for example, by coating a high-temperature resistant shielding material, so as to reduce radiation during the evaporation process and prevent adverse effects on operators or surrounding instruments. Similarly, the light-shielding layer is provided to avoid light leakage, and an opaque high-temperature resistant coating can be coated on the surface of the sleeve 31.

[0034] Specifically, as another implementation of this embodiment, it is disclosed that the end of the water-cooling protective sleeve 30 away from the base 10 is formed with an evaporation nozzle 33; the electronic ultra-high vacuum evaporation source also includes a baffle assembly 60, which is arranged on the base 10 and is used to close or open the evaporation nozzle 33. After the evaporation material is heated and evaporated, it moves to the component to be coated through the evaporation nozzle 33. The baffle assembly 60 is set to freely control the opening and closing of the evaporation nozzle 33. The operator can close the evaporation nozzle 33 for heating, observe the temperature control component 50 at the same time, and wait until the temperature in the evaporation cavity 40 reaches the standard before opening the evaporation nozzle 33 for evaporation, which is conducive to shortening the evaporation time; in addition, the evaporation nozzle 33 is opened after the evaporation rate is stable, so that the evaporation rate during the evaporation process is maintained stable, which is conducive to forming a coating with better uniformity.

[0035] like Figure 2As shown, as another implementation of this embodiment, the temperature control component 50 includes a temperature sensor 51, a control module 52 and a water pressure regulator 53. The temperature sensor 51 is arranged on the transmission rod 21; the control module 52 is arranged on the base 10 and is electrically connected to the temperature sensor 51; the water pressure regulator 53 is arranged on the water cooling protective sleeve 30 and is electrically connected to the control module 52. The temperature information in the evaporation cavity 40 is transmitted to the control module 52 through the temperature sensor 51. The control module 52 determines the real-time temperature condition in the evaporation cavity 40 through analysis and processing, further selects the water pressure of the water pressure regulator 53, adjusts the water circulation speed of the water cooling protective sleeve 30, and changes its cooling efficiency, thereby affecting the temperature in the evaporation cavity 40, controlling the evaporation rate of the evaporation material, avoiding the evaporation material from forming a coating too fast or too slow, and making the formed coating more uniform.

[0036] Specifically, as another implementation of this embodiment, it is disclosed that the control module 52 can be arranged on a side of the base 10 away from the evaporation cavity 40. The control module 52 can be a circuit board integrated with a receiver, a processor and a transmitter. Arranging the control module 52 at a position away from the evaporation cavity 40 is conducive to protecting various components on the integrated circuit board and preventing the high temperature in the evaporation cavity 40 from affecting the normal operation of the control module 52.

[0037] For example Figure 2 As shown, as another implementation of this embodiment, the baffle assembly 60 includes a rotating rod 61, a rotating driving member 62 and a baffle 63. The rotating rod 61 is arranged through the base 10, and the rotating rod 61 can rotate on the base 10; the rotating driving member 62 is connected to one end of the rotating rod 61, and is used to drive the rotating rod 61 to rotate; the baffle 63 is connected to the other end of the rotating rod 61, and is arranged opposite to the evaporation nozzle 33; when the rotating rod 61 rotates, the baffle 63 is driven to open and close the evaporation nozzle 33. The baffle 63 is automatically controlled by the rotating driving member 62, which can improve the automation of the equipment, reduce manual operations, and improve the control precision.

[0038] Specifically, as another implementation of this embodiment, the temperature control component 50 is disclosed to be electrically connected to the rotary drive member 62. By electrically connecting the temperature control component 50 to the rotary drive member 62, the temperature control component 50 directly controls the start and stop of the rotary drive member 62; when the temperature in the evaporation cavity 40 reaches the preset condition, the rotary drive member 62 is directly started to control the connection rod to rotate, drive the baffle 63 to rotate, and move the baffle 63 away from the evaporation nozzle 33 to start the evaporation process; when the evaporation is completed, the baffle 63 can be controlled by the temperature control component 50 to rotate back to the evaporation nozzle 33. The entire process is determined by the temperature control component 50 to judge the temperature of the evaporation cavity 40 in real time, thereby improving the intelligence of equipment processing.

[0039] Specifically, as another implementation of this embodiment, a water cooling channel (not shown in the drawings) is provided in the base 10. The evaporation inner cavity 40 is composed of the base 10 and the water cooling protective sleeve 30. The water cooling channel is provided in the base 10 and is used in conjunction with the water cooling circulation pipe 32 in the water cooling protective sleeve 30. When the temperature of the evaporation nozzle 33 needs to be adjusted, faster and more effective adjustment can be achieved.

[0040] In summary, the present application discloses an electronically-acting ultra-high vacuum evaporation source, which includes a base 10, an evaporation component 20, a water-cooling protective cover 30 and a temperature control component 50. The evaporation component 20 is arranged on the base 10; the water-cooling protective cover 30 is arranged on the base 10 and is sleeved on the outside of the evaporation component 20; the water-cooling protective cover 30 and the base 10 form an evaporation cavity 40; the temperature control component 50 is arranged on the base 10, and is electrically connected to the evaporation component 20 and the water-cooling protective cover 30, for real-time monitoring and control of the temperature in the evaporation cavity 40. The electronic ultra-high vacuum evaporation source disclosed in the present application is composed of a water-cooling protective sleeve 30 and a base 10 to form an evaporation cavity 40, and the temperature control component 50 is electrically connected to the water-cooling protective sleeve 30 to control the cooling effect of the water-cooling protective sleeve 30, thereby adjusting the temperature in the evaporation cavity 40, so that the evaporation rate of the evaporation component 20 arranged in the evaporation cavity 40 can be regulated; when the electronic ultra-high vacuum evaporation source is working, the evaporation component 20 gradually heats up, the temperature in the evaporation cavity 40 is increased, and the evaporation material gradually melts, and the temperature control component 50 is turned on synchronously to monitor the temperature on the evaporation component 20 in real time. When the temperature in the evaporation cavity 40 deviates from the temperature condition required for the evaporation of the evaporation material, the cooling power of the water-cooling protective sleeve 30 is adjusted to adjust the temperature in the evaporation cavity 40, control the evaporation rate of the evaporation material, make the film layer formed by evaporation better uniform, and obtain a better evaporation effect.

[0041] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0042] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0043] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An electron-assisted ultra-high vacuum evaporation source, characterized in that: include: Pedestal; An evaporation component is disposed on the base; A water-cooling protective sleeve is arranged on the base and sleeved outside the evaporation component; The water-cooling protective sleeve and the base form an evaporation inner cavity, and an evaporation nozzle is formed at one end of the water-cooling protective sleeve away from the base; A baffle assembly, disposed on the base, for closing or opening the evaporation nozzle; as well as a temperature control component, which is disposed on the base and is electrically connected to the evaporation component and the water-cooling protective sleeve, and is used to monitor and control the temperature in the evaporation inner cavity in real time, and the temperature control component is electrically connected to the baffle component, and is used to control the baffle component to open or close the evaporation nozzle; The temperature control component comprises: A temperature sensor is arranged on the evaporation component; a control module, disposed on the base and electrically connected to the temperature sensor; and A water pressure regulator, disposed on the water cooling protective jacket and electrically connected to the control module; The water-cooling protective jacket comprises a jacket body arranged on the base and a water-cooling circulation pipeline arranged inside the jacket body, and the water pressure regulator is installed at the water inlet end of the water-cooling circulation pipeline to adjust the water circulation speed in the water-cooling circulation pipeline and change its cooling efficiency; A water cooling channel is provided in the base, and the water cooling channel is used in conjunction with the water cooling circulation pipeline; The evaporation assembly comprises: A transmission rod, the transmission rod is arranged through the base, the transmission rod can be lifted and moved relative to the base, and the temperature sensor is arranged on the transmission rod; An evaporation crucible, located in the evaporation inner cavity, for containing evaporation materials; the evaporation crucible is detachably connected to the transmission rod; The control module is arranged on a side of the base away from the evaporation inner cavity, and the control module is a circuit board integrated with a receiver, a processor and a transmitter; The baffle assembly comprises: A rotating rod is arranged through the base, and the rotating rod can rotate on the base; a rotation driving member connected to one end of the rotating rod and used for driving the rotating rod to rotate; and A baffle is connected to the other end of the rotating rod and is arranged opposite to the evaporation nozzle; when the rotating rod rotates, the baffle is driven to open and close the evaporation nozzle; The temperature control component is electrically connected to the rotary drive member, and the temperature control component controls the start and stop of the rotary drive member.

2. The electron-activated ultra-high vacuum evaporation source according to claim 1, characterized in that: The base comprises a first surface and a second surface which are opposite to each other, and the water-cooling protective sleeve is arranged on the second surface; the evaporation component comprises: a driving structure connected to the end of the transmission rod extending out of the first surface, and used to control the lifting and lowering of the transmission rod; and The electron emitter is arranged on the second surface and is located in the evaporation inner cavity, and the electron emitter is located directly above the evaporation crucible.

3. The electron-activated ultra-high vacuum evaporation source according to claim 1, characterized in that: A shielding layer is provided on the side of the sleeve body facing the evaporator crucible; and / or a light shielding layer is provided on the side of the sleeve body facing the evaporator crucible.

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