Packaging fixture and packaging method for packaging LED structure

Abstract

The present invention relates to a packaging jig for packaging LED structures, including a glue injection positioning jig, the glue injection positioning jig including a base and a cover plate, the base is provided with a groove for accommodating a fixed substrate, the cover plate is provided with a seal to cover the outer periphery of the substrate when it is covered on the base, the cover plate is provided with a through hole to expose a crystal placement area and an LED array from the cover plate, and is used for injecting packaging glue from the through hole to cover the LED chip array and the crystal placement area when injecting packaging glue into the LED structure, wherein the outer periphery of the substrate is sealed and covered by the cover plate, and when the packaging glue is injected from the through hole, only the LED chip array and the crystal placement area are covered. By using the glue injection positioning jig, the packaging glue only covers the crystal placement area of ​​the substrate, so that when cutting or grinding the area of ​​the substrate other than the crystal placement area, it is not necessary to cut or grind the glue layer but only the substrate, thereby avoiding the problem of separation of the packaging glue from the crystal placement area of ​​the substrate.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a packaging fixture and a packaging method for packaging an LED structure. Background Art

[0002] Micro-LED devices are widely used in display technology, signal lights, interior and exterior vehicle indicators, traffic lights, mobile phones, electronic instruments, indoor and outdoor displays, information processing, communications and other fields due to their low power consumption, small size, long life, low driving voltage, durability and good monochromaticity.

[0003] The existing Micro-LED product manufacturing process is mainly divided into three steps: bonding the chip to the substrate; sealing the chip and substrate; and cutting and grinding the sealed substrate in the blank area outside the chip area.

[0004] At present, there are two ways to cut the blank area of ​​the sealed substrate outside the chip area. One is to use a knife wheel to make a continuous scratch on the surface of the substrate, and then rely on external force to split the glued substrate. Since the adhesion between the glue and the substrate is not enough to resist the impact of the cutting split, the glue and the substrate will separate during the split; the other is to use laser cutting, but there are two materials, the substrate and the black glue, on the cutting line of the glued substrate. Due to the different absorption rates and penetration rates of the two materials, the same laser cannot be used to cut the two materials. If two lasers are used for cutting, there will be misalignment problems due to cutting accuracy.

[0005] In addition, the substrate will have edge collapse after cutting, which will reduce the strength of the substrate itself and make it easy to break. Therefore, the substrate needs to be ground after cutting, and the problem of separation of the adhesive layer and the substrate is easy to occur during the grinding process. Summary of the invention

[0006] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a packaging jig and a packaging method for encapsulating LED structures, by shrinking the sealing glue area so that the sealing glue only covers the crystal placement area of ​​the substrate, so that when cutting or grinding the area of ​​the substrate except the crystal placement area, there is no need to cut or grind the glue layer but only the substrate, thereby avoiding the problem of separation of the sealing glue and the crystal placement area of ​​the substrate.

[0007] A packaging jig for packaging an LED structure, used for packaging an LED structure, the LED structure includes a substrate and an LED chip array, the substrate includes a crystal placement portion and a peripheral portion surrounding the crystal placement portion, the surface of the crystal placement portion is provided with a crystal placement area, and the LED chip array is provided in the crystal placement area. The packaging jig includes a glue injection positioning jig, the glue injection positioning jig includes a base and a cover plate, the base is provided with a groove, the groove is used to accommodate and fix the substrate, the cover plate is detachably covered on the base, when the cover plate is covered on the base, the peripheral portion of the substrate is sealed and covered, the cover plate is provided with a through hole, the through hole is used to expose the crystal placement area and the LED array from the cover plate, and when the packaging glue is injected into the LED structure, the packaging glue is injected from the through hole to cover the LED chip array and the crystal placement area, wherein the peripheral portion of the substrate is sealed and covered by the cover plate, and when the packaging glue is injected from the through hole, only the LED chip array and the crystal placement area are covered.

[0008] The above-mentioned packaging jig for encapsulating LED structures shrinks the sealing glue area so that the sealing glue only covers the crystal placement area of ​​the substrate. When cutting or grinding the area of ​​the substrate except the crystal placement area, there is no need to cut or grind the glue layer but only the substrate, thereby avoiding the problem of separation of the sealing glue and the crystal placement area of ​​the substrate.

[0009] Optionally, the packaging jig also includes a cutting and positioning jig, which is used to fix the glue-injected substrate during the process of cutting the glue-injected substrate. The cutting and positioning jig includes a first base and a first limiter. The first base is used to fix and support the surface of the glue-injected substrate away from the crystal placement area. The first limiter includes a first main body and a first step portion that are stacked and fixed. The first step portion protrudes from the first main body in a direction perpendicular to the stacking direction to form a first limiter in a stepped shape. One end of the first step portion protruding from the first main body is used to abut against the side wall of the first base. The first main body is used to abut against the side wall of the glue-injected substrate when the glue-injected substrate is placed on the first base, so that the preset position of the glue-injected substrate is fixed to the first base. The orthographic projection of the first base on the glue-injected substrate is located in the crystal placement area of ​​the glue-injected substrate. When the glue-injected substrate is cut, by removing the first limiter, the outer periphery of the glue-injected substrate is exposed to the first base for cutting and removing the outer periphery of the glue-injected substrate. The cutting positioning jig fixes the preset position of the glue-injected substrate to the first base through the first limiting piece, so that when the cutting equipment cuts the glue-injected substrate, it can quickly position to the preset position of the glue-injected substrate and cut off the outer portion of the glue-injected substrate.

[0010] Optionally, the first base of the cutting and positioning jig is provided with an air extraction hole that penetrates the first base, and the air extraction hole extends to the bearing surface of the first base for bearing the substrate after the injection of glue, and the air extraction hole is used to provide air extraction so that the substrate after the injection of glue is vacuum adsorbed on the first base. By providing the air extraction hole on the first base, the substrate after the injection of glue can be fixed on the first base by vacuum adsorption. This fixing method is simple, convenient and easy to operate, and it is easy to remove the substrate after the injection of glue from the first base.

[0011] Optionally, the bearing surface of the first base is provided with an adsorption groove, and the adsorption groove is used to increase the vacuum adsorption area of ​​the first base and the substrate after the injection of glue, so that the substrate after the injection of glue is stably adsorbed on the first base.

[0012] Optionally, the packaging jig also includes a grinding and positioning jig for fixing the cut substrate during the process of grinding the side wall of the cut substrate, the grinding and positioning jig includes a second base and a second limiter, the second base is used to fix and support the cut substrate on the surface of the cut substrate away from the crystal placement area, the second limiter includes a stacked and fixed second step portion and a second main body portion, the second step portion protrudes from the second main body portion in a direction perpendicular to the stacking direction to form a stepped second limiter, one end of the second step portion protruding from the second main body portion is used to abut against the side wall of the second base, the second main body portion is used to abut against the side wall of the cut substrate when the cut substrate is placed on the second base, so that the preset position of the cut substrate is fixed to the second base, and the orthographic projection of the second base on the cut substrate is located in the crystal placement area of ​​the cut substrate, wherein, when grinding the cut substrate, by removing the second limiter, the side wall of the cut substrate is exposed to the second base for grinding, so that the side wall surface of the cut substrate is flat and uniform. The grinding positioning fixture fixes the preset position of the cut substrate to the second base through the second limiter, so that the grinding equipment can quickly position to the preset position of the cut substrate for grinding when grinding the side wall of the cut substrate.

[0013] Based on the same inventive concept, the present application also provides a packaging method for an LED structure, wherein the LED structure includes a substrate and an LED chip array, wherein the substrate includes a crystal placement portion and a peripheral portion surrounding the crystal placement portion, wherein the surface of the crystal placement portion is provided with a crystal placement area, and the LED chip array is provided in the crystal placement area. The packaging method includes the following steps: providing a glue injection positioning jig, wherein the glue injection positioning jig includes a base and a cover plate, wherein the base is provided with a groove, wherein the cover plate is detachably covered on the base, wherein the cover plate is provided with a through hole so that part of the groove is exposed; placing the substrate in the groove, and covering the cover plate on the base, wherein when the cover plate is covered on the base, the peripheral portion of the substrate is sealed and covered, and the crystal placement area and the LED chip array are exposed in the through hole; and injecting packaging glue from the through hole, wherein the packaging glue covers the LED chip array and the crystal placement area.

[0014] The packaging method of the above-mentioned LED structure uses a glue injection positioning jig to seal the substrate, so that the packaging glue only covers the crystal placement area of ​​the substrate. When cutting or grinding the area of ​​the substrate except the crystal placement area, there is no need to cut or grind the glue layer but only the substrate, thereby avoiding the problem of separation of the packaging glue and the crystal placement area of ​​the substrate.

[0015] Optionally, the packaging method further comprises: cutting and removing the outer periphery of the substrate after the glue injection.

[0016] Optionally, the cutting and removing of the outer portion of the glue-injected substrate includes: providing a cutting positioning jig, the cutting positioning jig including a first base and a first limiting member, the first limiting member including a first main body portion and a first step portion that are stacked and fixed, the first step portion protruding from the first main body portion in a direction perpendicular to the stacking direction to form the first limiting member in a step shape, and abutting one end of the first step portion protruding from the first main body portion against the side wall of the first base; placing the glue-injected substrate on the first base, the first base being supported on a surface of the glue-injected substrate away from the crystal placement area, abutting the side wall of the glue-injected substrate against the first main body portion and fixing the glue-injected substrate on the first base, wherein the orthographic projection of the first base on the glue-injected substrate is located within the crystal placement area of ​​the glue-injected substrate; and removing the first limiting member to cut and remove the outer portion of the glue-injected substrate. When the cutting and positioning jig is used to cut the glue-injected substrate, the preset position of the glue-injected substrate can be fixed on the first base through the first limiting member, so that the cutting equipment can quickly position to the preset position of the glue-injected substrate when cutting the glue-injected substrate, and cut the outer periphery of the glue-injected substrate.

[0017] Optionally, the packaging method further comprises: grinding the sidewalls of the cut substrate to make the surface of the sidewalls of the cut substrate flat and uniform.

[0018] Optionally, the grinding process of the side wall of the cut substrate comprises: providing a grinding positioning jig, the grinding positioning jig comprising a second base and a second limiter, the second limiter comprising a second step portion and a second main body portion which are stacked and fixed, the second step portion protruding from the second main body portion in a direction perpendicular to the stacking direction to form a second step-shaped limiter, and abutting one end of the second step portion protruding from the second main body portion against the side wall of the second base; placing the cut substrate on the second base, the second base being supported on the surface of the cut substrate away from the crystal placement area, abutting the side wall of the cut substrate against the second main body portion and fixing the cut substrate on the second base, wherein the orthographic projection of the second base on the cut substrate is located in the crystal placement area of ​​the cut substrate; and removing the second limiter, grinding the side wall of the cut substrate to make the surface of the side wall of the cut substrate flat and uniform. When the cut substrate is ground using the grinding positioning jig, the preset position of the cut substrate can be fixed to the second base through the second limit member, so that the grinding equipment can be quickly positioned to the preset position of the cut substrate when grinding the side wall of the cut substrate, and grind the side wall of the cut substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a packaging fixture provided in an embodiment of the present application;

[0020] Figure 2 It is a structural schematic diagram of an LED structure;

[0021] Figure 3 A schematic diagram of the structure of a packaging fixture provided in another embodiment of the present application;

[0022] Figure 4 A schematic diagram of the structure of a packaging fixture provided in yet another embodiment of the present application;

[0023] Figure 5 A flow chart of a packaging method for an LED structure provided in an embodiment of the present application;

[0024] Figure 6-8 For Figure 5 Schematic diagram of the process corresponding to the steps in the figure;

[0025] Fig. 9 A schematic diagram of a substrate after glue injection obtained after removing the glue injection positioning jig;

[0026] Fig.10 A flow chart of a method for cutting and removing the outer periphery of a substrate after glue injection;

[0027] Figure 11-14For Fig.10 Schematic diagram of the process corresponding to the steps in the figure;

[0028] Fig.15 is a schematic diagram of a cut substrate obtained after removing the first base;

[0029] Fig.16 A flow chart of a method for grinding the sidewall of a cut substrate;

[0030] Figure 17-20 For Fig.16 Schematic diagram of the process corresponding to the steps in .

[0031] Description of reference numerals:

[0032] 100-Packaging fixture;

[0033] 10-LED structure;

[0034] 11-Substrate;

[0035] 111-crystal placement unit;

[0036] 112- peripheral part;

[0037] 1111-crystal placement area;

[0038] 12-LED chip array;

[0039] 20-Glue injection positioning fixture;

[0040] 21- base;

[0041] 211- positioning column;

[0042] 22-cover plate;

[0043] 221-positioning hole;

[0044] 23- groove;

[0045] 231-opening;

[0046] 24-through hole;

[0047] 30-Cutting and positioning fixture;

[0048] 31- first base;

[0049] 311-first air extraction hole;

[0050] 312-first adsorption tank;

[0051] 32-first limiter;

[0052] 321- first main body;

[0053] 3211-first sub-main body;

[0054] 3212-second sub-main body;

[0055] 322-first step;

[0056] 3221-first sub-step portion;

[0057] 3222-second sub-step portion;

[0058] 40-Grinding positioning fixture;

[0059] 41- second base;

[0060] 411- second air extraction hole;

[0061] 412-second adsorption tank;

[0062] 42- second limiting member;

[0063] 421- second main body;

[0064] 4211-third sub-main body;

[0065] 4212-the fourth sub-main body;

[0066] 422- second step portion;

[0067] 4221-third sub-step;

[0068] 4222-the fourth sub-step;

[0069] 25-Packaging glue. DETAILED DESCRIPTION

[0070] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0071] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0072] In the description of the present application, the terms "first", "second", "third", "fourth", etc. are used to distinguish different objects rather than to describe a specific order. In addition, the terms "upper", "lower", "inner", "outer", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.

[0073] In the description of this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0074] It should be noted that the illustrations provided in the embodiments of the present application are only used to illustrate the basic concept of the present application in a schematic manner. The illustrations only show the components related to the present application rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0075] Please also read Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of a packaging fixture 100 for packaging an LED structure provided in an embodiment of the present application. Figure 2 Schematic diagram of the structure of the LED structure 10. Figure 2 As shown, the LED structure 10 includes a substrate 11 and an LED chip array 12. The substrate 11 includes a crystal placement portion 111 and a peripheral portion 112 surrounding the crystal placement portion 111. The surface of the crystal placement portion 111 is provided with a crystal placement area 1111. The LED chip array 12 is provided in the crystal placement area 1111. Figure 1As shown, the packaging jig 100 includes a glue injection positioning jig 20, and the glue injection positioning jig 20 includes a base 21 and a cover plate 22. The base 21 is provided with a groove 23, and the groove 23 is used to accommodate and fix the substrate 11. The cover plate 22 is detachably covered on the base 21. When the cover plate 22 is covered on the base 21, it seals and covers the outer portion 112 of the substrate 11. The cover plate 22 is provided with a through hole 24, and the through hole 24 is used to expose the chip placement area 1111 and the LED array 12 from the cover plate 22, and is used for the packaging glue to be injected from the through hole 24 to cover the LED chip array 12 and the chip placement area 1111 when the packaging glue is injected into the LED structure 10.

[0076] The outer periphery 112 of the substrate 11 is sealed and covered by the cover plate 22 , and when the packaging glue is injected from the through hole 24 , it only covers the LED chip array 12 and the die-placement area 1111 .

[0077] The present application shrinks the sealing area, that is, uses the cover plate 22 to seal and cover the outer portion 112 of the substrate 11, so that the sealing glue only covers the crystal placement area 1111 of the substrate 11. When the outer portion 112 is cut or ground, there is no need to cut or grind the glue layer but only the outer portion 112, thereby avoiding the problem of separation of the sealing glue and the crystal placement area 1111.

[0078] The chip placement portion 111 is provided with a driving circuit, and the driving circuit is electrically connected to the LED chip array 12 for controlling the LED chip array 12 to emit light.

[0079] The substrate 11 may be made of any one or more of glass, ceramic, quartz, silicon or sapphire.

[0080] The shape of the groove 23 is adapted to the shape of the substrate 11 , and the inner contour dimension of the groove 23 is slightly larger than or equal to the outer contour dimension of the substrate 11 , so that the groove 23 can accommodate and fix the substrate 11 .

[0081] Please refer again Figure 1 In some embodiments, two opposite side walls of the groove 23 each have two openings 231 , so that the substrate 11 can be placed in the groove 23 or removed from the groove 23 manually or by a grasping tool through the two openings 231 .

[0082] In some embodiments, the base 21 includes at least one positioning column 211, and the at least one positioning column 211 is arranged around the outside of the groove 23. The cover plate 22 includes at least one positioning hole 221. When the at least one positioning column 211 is fixedly inserted in the at least one positioning hole 221, the at least one positioning hole 221 corresponds to the at least one positioning column 211 one by one. The cover plate 22 is covered on the base 21, and the through hole 24 only exposes the crystal placement area 1111 and the LED chip array 12. The cover plate 22 seals and covers the outer portion 112. By providing the positioning columns 211 and the positioning holes 221, the cover plate 22 and the base 21 are precisely aligned and assembled, and the through hole 24 only exposes the crystal placement area 1111 and the LED chip array 12. Therefore, when the LED structure 10 is injected with glue, it is beneficial for the packaging glue to only cover the crystal placement area 1111 and the LED chip array 12. Obviously, in other embodiments, the base 21 may include a positioning hole, and the cover plate 22 may include a positioning column.

[0083] See also Figure 3 , Figure 3 FIG. 1 is a schematic diagram of a packaging fixture 100 provided in another embodiment of the present application. Figure 3 As shown, in some embodiments, the packaging jig 100 further includes a cutting and positioning jig 30 for fixing the glue-injected substrate 11 during the process of cutting the glue-injected substrate 11 .

[0084] The cutting positioning fixture 30 includes a first base 31 and a first stopper 32. The first base 31 is used to fix and support the surface of the substrate 11 after the injection of glue away from the crystal placement area 1111. The first stopper 32 includes a first main body 321 and a first step 322 that are stacked and fixed. The first step 322 protrudes from the first main body 321 in a direction perpendicular to the stacking direction to form the first stopper 32 in a step shape. The stacking direction is the direction between the first main body 321 and the first step 322. In the stacking direction of the first step portion 322, one end of the first step portion 322 protruding from the first main body portion 321 is used to abut against the side wall of the first base 31, and the first main body portion 321 is used to abut against the side wall of the substrate 11 after the injection of glue when the substrate 11 after the injection of glue is placed on the first base 31, so that the preset position of the substrate 11 after the injection of glue is fixed to the first base 31, and the orthographic projection of the first base 31 on the substrate 11 after the injection of glue is located in the crystal placement area 1111 of the substrate 11 after the injection of glue. Among them, the preset position of the substrate 11 after the injection of glue is the position corresponding to the crystal placement area 1111.

[0085] When the glue-injected substrate 11 is cut, the first stopper 32 is removed so that the outer portion 112 of the glue-injected substrate 11 is exposed from the first base 31 for cutting and removing the outer portion 112 of the glue-injected substrate 11 .

[0086] The first main body portion 321 and the first step portion 322 may be integrally formed, or fixedly connected by welding, riveting, screwing, or other connection methods.

[0087] The cutting positioning jig 30 fixes the preset position of the glue-injected substrate 11 to the first base 31 through the first limiting member 32, so that the cutting equipment can quickly position to the preset position of the glue-injected substrate 11 when cutting the glue-injected substrate 11, and cut the outer portion 112 of the glue-injected substrate 11.

[0088] like Figure 3 As shown, in some embodiments, the substrate 11 after injection is a rectangular parallelepiped, the first main body 321 includes a first sub-main body 3211 and a second sub-main body 3212, the end of the first sub-main body 3211 is vertically connected to the end of the second sub-main body 3212, and forms an L-shaped first main body 321 that abuts against two adjacent side walls of the substrate 11 after injection. The first base 31 is a rectangular parallelepiped, the first step portion 322 includes a first sub-step portion 3221 and a second sub-step portion 3222, the end of the first sub-step portion 3221 is vertically connected to the end of the second sub-step portion 3222, and forms an L-shaped first step portion 322 that abuts against two adjacent side walls of the first base 31. The first main body portion 321 and the first step portion 322 are stacked to form an L-shaped first limiter 32, the first sub-step portion 3221 protrudes from the first sub-main body portion 3211 along a direction perpendicular to the stacking direction, and the second sub-step portion 3222 protrudes from the second sub-main body portion 3212 along a direction perpendicular to the stacking direction.

[0089] When cutting the glue-injected substrate 11, assemble the first limiting member 32 with the first base 31, wherein two adjacent side walls of the first base 31 respectively abut against the side wall of the first sub-step portion 3221 protruding from the first sub-main body portion 3211 and the side wall of the second sub-step portion 3222 protruding from the second sub-main body portion 3212, and then place the glue-injected substrate 11 on the first base 31, wherein the two adjacent side walls of the glue-injected substrate 11 respectively abut against the side wall of the first sub-main body portion 3211 and the side wall of the second sub-main body portion 3212, wherein the orthographic projection of the first base 31 on the glue-injected substrate 11 is located in the crystal placement area 1111 of the glue-injected substrate 11, and then fix the glue-injected substrate 11 on the first base 31, so that the preset position of the glue-injected substrate 11 is fixed to the first base 31. Therefore, it is convenient for a cutting device, such as a laser device or a cutter wheel device, to quickly locate to a preset position of the substrate 11 after the injection of glue and cut the peripheral portion 112 .

[0090] The first sub-body portion 3211 and the second sub-body portion 3212 may be integrally formed, or fixedly connected by welding, riveting, screwing, etc. The first sub-step portion 3221 and the second sub-step portion 3222 may be integrally formed, or fixedly connected by welding, riveting, screwing, etc.

[0091] In some other embodiments, the substrate 11 after glue injection is a cylinder or an elliptical column, the first main body 321 and the first step 322 of the first stopper 32 may both be arc-shaped, and the first base 31 may be a cylinder or an elliptical column; or, the substrate 11 after glue injection is a regular polyhedron, such as a regular octahedron or a regular dodecahedron, the first stopper 32 may be V-shaped, and the first base 31 may be a regular polyhedron. The shape of the first main body 321 of the first stopper 32 may be set according to the shape of the substrate 11 after glue injection, so that the side wall of the substrate 11 after glue injection can be adaptively abutted against the first main body 321. The shape of the first step 322 of the first stopper 32 may be set according to the shape of the first base 31, so that the side wall of the first base 31 can be adaptively abutted against the first step 322.

[0092] Please refer again Figure 3In some embodiments, the first base 31 of the cutting and positioning jig 30 is provided with a first air extraction hole 311 penetrating the first base 31, the first air extraction hole 311 extending to the bearing surface of the first base 31 for bearing the substrate 11 after the injection of glue, and the first air extraction hole 311 is used to provide air extraction so that the substrate 11 after the injection of glue is vacuum-adsorbed on the first base 31. Specifically, a vacuum extraction device may be provided at one end of the first air extraction hole 311 away from the bearing surface of the first base 31, the vacuum extraction device is connected to the first air extraction hole 311, and the vacuum extraction device includes a vacuum pump, and the air between the substrate 11 after the injection of glue and the first base 31 is extracted from the first air extraction hole 311 by the vacuum pump, so that the substrate 11 after the injection of glue is adsorbed and fixed on the first base 31.

[0093] By providing the first air extraction hole 311 on the first base 31, the substrate 11 after the injection of glue can be fixed on the first base 31 by vacuum adsorption. This fixing method is simple, convenient and easy to operate, and it is easy to remove the substrate 11 after the injection of glue from the first base 31. In addition, the substrate 11 after the injection of glue will not be damaged.

[0094] Please refer again Figure 3 In some embodiments, a first adsorption groove 312 is provided on the bearing surface of the first base 31, and the first adsorption groove 312 is used to increase the vacuum adsorption area of ​​the first base 31 and the substrate 11 after the injection of glue, so that the substrate 11 after the injection of glue is stably adsorbed on the first base 31.

[0095] See also Figure 4 , Figure 4 FIG. 1 is a schematic diagram of a packaging fixture 100 provided in another embodiment of the present application. Figure 4 As shown, in some embodiments, the packaging jig 100 further includes a grinding and positioning jig 40 for fixing the cut substrate 11 during the process of grinding the sidewall of the cut substrate 11 .

[0096] The grinding and positioning fixture 40 includes a second base 41 and a second stopper 42, wherein the second base 41 is used to fix and carry the cut substrate 11 on the surface of the cut substrate 11 away from the crystal placement area 1111, and the second stopper 42 includes a stacked and fixed second main body portion 421 and a second step portion 422, wherein the second step portion 422 protrudes from the second main body portion 421 in a direction perpendicular to the stacking direction of the second main body portion 421 to form a stepped second stopper 42, wherein the stacking direction is the second main body portion 421. 21 and the stacking direction of the second step portion 422, the end of the second step portion 422 protruding from the second main body portion 421 is used to abut against the side wall of the second base 41, and the second main body portion 421 is used to abut against the side wall of the cut substrate 11 when the cut substrate 11 is placed on the second base 41, so that the preset position of the cut substrate 11 is fixed to the second base 41, and the orthographic projection of the second base 41 on the cut substrate 11 is located in the crystal placement area 1111 of the cut substrate 11. The preset position of the cut substrate 11 is the position corresponding to the crystal placement area 1111.

[0097] When grinding the cut substrate 11 , by removing the second stopper 42 , the side wall of the cut substrate 11 is exposed on the second base 41 for grinding, so that the side wall surface of the cut substrate 11 is flat and uniform.

[0098] The second main body portion 421 and the second step portion 422 may be integrally formed, or fixedly connected by welding, riveting, screwing, or other connection methods.

[0099] The grinding positioning jig 40 fixes the preset position of the cut substrate 11 on the second base 41 through the second limit member 42, so that the grinding equipment can quickly position to the preset position of the cut substrate 11 when grinding the cut substrate 11, and grind the side wall of the crystal placement part 111 of the cut substrate 11.

[0100] like Figure 4As shown, in some embodiments, the cut substrate 11 is a rectangular parallelepiped, and the second main body 421 includes a third sub-main body 4211 and a fourth sub-main body 4212, and the end of the third sub-main body 4211 is vertically connected to the end of the fourth sub-main body 4212, so as to form an L-shaped second main body 421 that abuts against two adjacent side walls of the cut substrate 11. The second step portion 422 includes a third sub-step portion 4221 and a fourth sub-step portion 4222, and the end of the third sub-step portion 4221 is vertically connected to the end of the fourth sub-step portion 4222, so as to form an L-shaped second step portion 422 that abuts against two adjacent side walls of the second base 41. The second base 41 is a rectangular parallelepiped, and the second main body 421 and the second step portion 422 are stacked to form an L-shaped second limiting member 42, the third sub-step portion 4221 protrudes from the third sub-main body 4211 along a direction perpendicular to the stacking direction, and the fourth sub-step portion 4222 protrudes from the fourth sub-main body 4212 along a direction perpendicular to the stacking direction.

[0101] When grinding the cut substrate 11, the second limiter 42 is assembled with the second base 41, wherein two adjacent side walls of the second base 41 are respectively abutted against the side wall of the third sub-step portion 4221 protruding from the third sub-main body portion 4211 and the side wall of the fourth sub-step portion 4222 protruding from the fourth sub-main body portion 4212, and then the cut substrate 11 is placed on the second base 41, and two adjacent side walls of the cut substrate 11 are respectively abutted against the side wall of the third sub-main body portion 4211 and the side wall of the fourth sub-main body portion 4212, wherein the orthographic projection of the second base 41 on the cut substrate 11 is located in the crystal placement area 1111 of the cut substrate 11, and then the cut substrate 11 is fixed on the second base 41, so that the preset position of the cut substrate 11 is fixed to the second base 41. Therefore, it is convenient for a grinding device, such as a CNC (numerical control machine) grinding device, to quickly locate to a preset position of the cut substrate 11 and grind the side wall of the die placement portion 111 of the cut substrate 11 .

[0102] The third sub-body part 4211 and the fourth sub-body part 4212 may be integrally formed, or fixedly connected by welding, riveting, screwing, etc. The third sub-body part 4211 and the fourth sub-body part 4212 may be integrally formed, or fixedly connected by welding, riveting, screwing, etc.

[0103] In some other embodiments, the cut substrate 11 is a cylinder or an elliptical column, the second main body 421 and the second step 422 of the second stopper 42 may both be arc-shaped, and the second base 41 may be a cylinder or an elliptical column; or, the cut substrate 11 is a regular polyhedron, such as a regular octahedron or a regular dodecahedron, the second stopper 42 may be V-shaped, and the second base 41 may be a regular polyhedron. The shape of the second main body 421 of the second stopper 42 may be set according to the shape of the cut substrate 11, so that the side wall of the cut substrate 11 may be adaptively abutted against the second main body 421. The shape of the second step 422 of the second stopper 42 may be set according to the shape of the second base 41, so that the side wall of the second base 41 may be adaptively abutted against the second step 422.

[0104] Please refer again Figure 4 In some embodiments, the second base 41 of the grinding and positioning jig 40 is provided with a second air extraction hole 411 penetrating the second base 41, the second air extraction hole 411 extending to the bearing surface of the second base 41 for bearing the cut substrate 11, and the second air extraction hole 411 is used to provide air extraction so that the cut substrate 11 is vacuum-adsorbed on the second base 41. Specifically, a vacuum extraction device may be provided at one end of the second air extraction hole 411 away from the bearing surface of the second base 41, the vacuum extraction device is connected to the second air extraction hole 411, and the vacuum extraction device includes a vacuum pump, and the air between the cut substrate 11 and the second base 41 is extracted from the second air extraction hole 411 by the vacuum pump, so that the cut substrate 11 is adsorbed and fixed on the second base 41.

[0105] By providing the second air extraction hole 411 on the second base 41, the cut substrate 11 can be fixed on the second base 41 by vacuum adsorption, and this fixing method is simple, convenient and easy to operate, and the cut substrate 11 can be easily removed from the second base 41. In addition, the cut substrate 11 will not be damaged.

[0106] Please refer again Figure 4 In some embodiments, a second adsorption groove 412 is provided on the supporting surface of the second base 41 , and the second adsorption groove 412 is used to increase the vacuum adsorption area of ​​the second base 41 and the cut substrate 11 , so that the cut substrate 11 is stably adsorbed on the second base 41 .

[0107] See also Figure 1 as well as Figures 5 to 8 , Figure 5This is a flow chart of a packaging method of an LED structure 10 provided in an embodiment of the present application. Figures 6 to 8 Indicated Figure 5 The LED structure 10 comprises a substrate 11 and an LED chip array 12. The substrate 11 comprises a crystal placement portion 111 and a peripheral portion 112 surrounding the crystal placement portion 111. A crystal placement area 1111 is disposed on the surface of the crystal placement portion 111. The LED chip array 12 is disposed in the crystal placement area 1111. Figure 5 As shown, the packaging method of the LED structure 10 includes the following steps:

[0108] S101: Provide Figure 1 The glue injection positioning jig 20 shown includes a base 21 and a cover plate 22. The base 21 is provided with a groove 23. The cover plate 22 is detachably covered on the base 21. The cover plate 22 is provided with a through hole 24 so that part of the groove 23 is exposed.

[0109] S102: Place the substrate 11 (such as Figure 6 As shown), the cover plate 22 is covered on the base 21 (as shown Figure 7 As shown), when the cover plate 22 is covered on the base 21 , it seals and covers the outer portion 112 of the substrate 11 , and the chip placement area 1111 and the LED chip array 12 are exposed from the through hole 24 .

[0110] S103: injecting packaging glue 25 from the through hole 24, the packaging glue 25 covers the LED chip array 12 and the chip placement area 1111, and the result is as follows: Figure 8 shown.

[0111] The glue injection positioning jig 20 includes the glue injection positioning jig 20 provided by any of the aforementioned embodiments.

[0112] See also Fig. 9 , Fig. 9 The schematic diagram of the substrate 11 after the injection is shown in FIG. 1 , in which the die-placement area 1111 of the substrate 11 after the injection is covered by the packaging glue 25 , and the outer periphery 112 of the substrate 11 after the injection is not covered by the packaging glue.

[0113] The packaging method provided in the embodiment of the present application uses the glue injection positioning fixture 20 to shrink the sealing area of ​​the LED structure 10, that is, uses the cover plate 22 to seal and cover the outer portion 112 of the substrate 11, so that the packaging glue 25 only covers the crystal placement area 1111 of the substrate 11, and when the outer portion 112 is cut or ground, there is no need to cut or grind the glue layer but only the outer portion 112, thereby avoiding the problem of separation of the packaging glue 25 and the crystal placement area 1111.

[0114] In some embodiments, the packaging method further includes: cutting and removing the outer peripheral portion 112 of the substrate 11 after the glue injection.

[0115] See also Figure 3 as well as Figures 10 to 14 , Fig.10 A flow chart of a method for cutting and removing the outer portion 112 of the substrate 11 after the glue injection. Figures 11 to 14 Indicated Fig.10 The process from step S202 to step S203 in FIG. Fig.10 As shown, the cutting and removing of the outer periphery 112 of the substrate 11 after the injection of glue comprises the following steps:

[0116] S201: Provide Figure 3 The cutting positioning fixture 30 shown in the figure comprises a first base 31 and a first stopper 32, wherein the first stopper 32 comprises a first main body portion 321 and a first step portion 322 fixed in a stacked manner, wherein the first step portion 322 protrudes from the first main body portion 321 in a direction perpendicular to the stacking direction to form a stepped first stopper 32, and an end of the first step portion 322 protruding from the first main body portion 321 is brought into contact with a side wall of the first base 31, as shown in FIG. Fig.11 shown.

[0117] S202: placing the glue-injected substrate 11 on the first base 31, the first base 31 is supported on the surface of the glue-injected substrate 11 away from the crystal placement area 1111, the side wall of the glue-injected substrate 11 is abutted against the first main body 321 and the glue-injected substrate 11 is fixed on the first base 31, wherein the orthographic projection of the first base 31 on the glue-injected substrate 11 is located in the crystal placement area 1111 of the glue-injected substrate 11, and the result is as follows: Fig.12 shown.

[0118] S203: Remove the first limiting member 32 (such as Fig.13 As shown), the outer portion 112 of the substrate 11 after the injection is cut and removed (the result is as shown Fig.14 shown).

[0119] Wherein, the cutting positioning jig 30 includes the cutting positioning jig 30 provided by any of the aforementioned embodiments.

[0120] The substrate 11 after the injection can be placed on the first base 31 by vacuum adsorption. Specifically, Figure 3 As shown, the first base 31 of the cutting and positioning jig 30 is provided with a first air extraction hole 311 penetrating the first base 31, and the first air extraction hole 311 extends to the bearing surface of the first base 31 for bearing the substrate 11 after the injection of glue, and a vacuum extraction device is arranged at one end of the first air extraction hole 311 away from the bearing surface of the first base 31, and the vacuum extraction device is connected to the first air extraction hole 311, and the vacuum extraction device includes a vacuum pump, and the air between the substrate 11 after the injection of glue and the first base 31 is extracted from the first air extraction hole 311 by the vacuum pump, so that the substrate 11 after the injection of glue is adsorbed and fixed on the first base 31.

[0121] See also Fig.15 , Fig.15 The schematic diagram of the cut substrate 11 obtained after removing the first base 31 is shown. The cut substrate 11 includes a die-placing portion 111 and a die-placing region 1111 . The die-placing region 1111 of the cut substrate 11 is covered by the packaging glue 25 .

[0122] The packaging method provided in the embodiment of the present application uses the cutting positioning jig 30 to fix the preset position of the substrate 11 after the injection of glue on the first base 31, so that when the substrate 11 after the injection of glue is cut, the cutting equipment can be quickly positioned to the preset position of the substrate 11 after the injection of glue and cut the outer portion 112 of the substrate 11 after the injection of glue.

[0123] In some embodiments, the packaging method further includes: grinding the sidewalls of the cut substrate 11, that is, grinding the sidewalls of the die placement portion 111 of the cut substrate 11, so that the sidewall surface of the die placement portion 111 of the cut substrate 11 is flat and uniform. Since the cut substrate 11 obtained after cutting the glue-injected substrate 11 is prone to edge collapse, burrs, etc., which leads to a decrease in the strength of the cut substrate 11, it is necessary to grind the sidewalls of the cut substrate 11 to make the sidewall surface of the cut substrate 11 flat and uniform.

[0124] See also Figure 4 as well as Figures 16 to 20 , Fig.16 A flow chart of a method for grinding the side wall of the cut substrate 11. Figures 17 to 20 Indicated Fig.16The process from step S302 to step S303 in FIG. Fig.16 As shown, the grinding process for the side wall of the cut substrate 11 includes the following steps:

[0125] S301: Provide Figure 4 The grinding positioning fixture 40 shown in the figure comprises a second base 41 and a second stopper 42, wherein the second stopper 42 comprises a second main body portion 421 and a second step portion 422 fixed in a stacked manner, wherein the second step portion 422 protrudes from the second main body portion 421 in a direction perpendicular to the stacking direction to form a stepped second stopper 42, and an end of the second step portion 422 protruding from the second main body portion 421 is brought into contact with the side wall of the second base 41, as shown in FIG. Fig.17 shown.

[0126] S302: placing the cut substrate 11 on the second base 41, the second base 41 is supported on the surface of the cut substrate 11 away from the crystal placement area 1111, the side wall of the cut substrate 11 is abutted against the second main body 421 and the cut substrate 11 is fixed on the second base 41, wherein the orthographic projection of the second base 41 on the cut substrate 11 is located in the crystal placement area 1111 of the cut substrate 11, and the result is as follows: Fig.18 shown.

[0127] S303: Remove the second limiting member 42 (such as Fig.19 The side wall of the cut substrate 11 is ground to make the side wall surface of the cut substrate 11 flat and uniform (the result is shown in FIG. Fig. 20 shown).

[0128] The grinding and positioning fixture 40 includes the grinding and positioning fixture 40 provided by any of the aforementioned embodiments.

[0129] The cut substrate 11 can be placed on the second base 41 by vacuum adsorption. Specifically, Figure 4 As shown, the second base 41 of the grinding and positioning jig 40 is provided with a second air extraction hole 411 penetrating the second base 41, and the second air extraction hole 411 extends to the bearing surface of the second base 41 for bearing the cut substrate 11, and a vacuum extraction device is arranged at one end of the second air extraction hole 411 away from the bearing surface of the second base 41, and the vacuum extraction device is connected to the second air extraction hole 411, and the vacuum extraction device includes a vacuum pump, and the air between the cut substrate 11 and the second base 41 is extracted from the second air extraction hole 411 by the vacuum pump, so that the cut substrate 11 is adsorbed and fixed on the second base 41.

[0130] The packaging method provided in the embodiment of the present application uses the grinding positioning jig 40 to fix the preset position of the cut substrate 11 on the second base 41, so that when the cut substrate 11 is ground, the grinding equipment can be quickly positioned to the preset position of the cut substrate 11 to grind the side wall of the crystal placement portion 111 of the cut substrate 11.

[0131] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A packaging fixture for packaging an LED structure, wherein the LED structure comprises a substrate and an LED chip array, wherein the substrate comprises a die placement portion and a peripheral portion surrounding the die placement portion, wherein a die placement area is provided on the surface of the die placement portion, and the LED chip array is provided in the die placement area, wherein: The packaging fixture comprises: The glue injection positioning fixture comprises a base and a cover plate, wherein the base is provided with a groove, and the groove is used to accommodate and fix the substrate, and the cover plate is detachably covered on the base, and when the cover plate is covered on the base, the outer portion of the substrate is sealed and covered, and the cover plate is provided with a through hole, and the through hole is used to expose the chip placement area and the LED array from the cover plate, and is used for the packaging glue to be injected from the through hole to cover the LED chip array and the chip placement area when the packaging glue is injected into the LED structure, wherein the outer portion of the substrate is sealed and covered by the cover plate, and when the packaging glue is injected from the through hole, it only covers the LED chip array and the chip placement area.

2. The packaging jig according to claim 1, characterized in that: The packaging jig also includes a cutting and positioning jig, which is used to fix the glue-injected substrate during the process of cutting the glue-injected substrate. The cutting and positioning jig includes a first base and a first stopper. The first base is used to fix and carry the glue-injected substrate on the surface of the glue-injected substrate away from the crystal placement area. The first stopper includes a first main body and a first step portion that are stacked and fixed. The first step portion protrudes from the first main body along a direction perpendicular to the stacking direction to form a first stopper in a stepped shape. One end of the first step portion protruding from the first main body is used to abut against the side wall of the first base. The first main body is used to abut against the side wall of the glue-injected substrate when the glue-injected substrate is placed on the first base, so that the preset position of the glue-injected substrate is fixed to the first base. The orthographic projection of the first base on the glue-injected substrate is located in the crystal placement area of ​​the glue-injected substrate. When the glue-injected substrate is cut, by removing the first stopper, the outer periphery of the glue-injected substrate is exposed to the first base for cutting and removing the outer periphery of the glue-injected substrate.

3. The packaging jig according to claim 2, characterized in that: The first base of the cutting and positioning fixture is provided with an exhaust hole that penetrates the first base, and the exhaust hole extends to the supporting surface of the first base for supporting the substrate after injection of glue. The exhaust hole is used to provide air to enable the substrate after injection to be vacuum adsorbed on the first base.

4. The packaging jig according to claim 3, characterized in that: The bearing surface of the first base is provided with an adsorption groove, and the adsorption groove is used to increase the vacuum adsorption area of ​​the first base and the substrate after the injection of glue.

5. The packaging jig according to claim 4, characterized in that: The packaging jig also includes a grinding and positioning jig for fixing the cut substrate during the grinding of the side wall of the cut substrate. The grinding and positioning jig includes a second base and a second stopper. The second base is used to fix and carry the cut substrate on the surface of the cut substrate away from the crystal placement area. The second stopper includes a stacked and fixed second step portion and a main body portion. The second step portion protrudes from the second main body portion in a direction perpendicular to the stacking direction to form a stepped second stopper. One end of the second step portion protruding from the second main body portion is used to abut against the side wall of the second base. The second main body portion is used to abut against the side wall of the cut substrate when the cut substrate is placed on the second base, so that the preset position of the cut substrate is fixed to the second base. The orthographic projection of the second base on the cut substrate is located in the crystal placement area of ​​the cut substrate. When the cut substrate is ground, by removing the second stopper, the side wall of the cut substrate is exposed to the second base for grinding, so that the surface of the side wall of the cut substrate is flat and uniform.

6. A packaging method for an LED structure, wherein the LED structure comprises a substrate and an LED chip array, wherein the substrate comprises a die placement portion and a peripheral portion surrounding the die placement portion, wherein a die placement area is provided on the surface of the die placement portion, and the LED chip array is provided in the die placement area, wherein: The packaging method comprises the following steps: A glue injection positioning jig is provided, the glue injection positioning jig comprises a base and a cover plate, the base is provided with a groove, the cover plate is detachably covered on the base, and the cover plate is provided with a through hole so that part of the groove is exposed; The substrate is placed in the groove, and the cover is placed on the base. When the cover is placed on the base, the outer periphery of the substrate is sealed and covered, and the chip placement area and the LED chip array are exposed from the through hole; and Packaging glue is injected from the through hole, and the packaging glue covers the LED chip array and the chip placement area.

7. The packaging method according to claim 6, characterized in that: The packaging method further comprises: The outer periphery of the substrate after the injection is cut and removed.

8. The packaging method according to claim 7, characterized in that: The method of cutting and removing the outer periphery of the substrate after the injection of glue comprises: A cutting positioning jig is provided, the cutting positioning jig comprising a first base and a first stopper, the first stopper comprising a first main body portion and a first step portion which are stacked and fixed, the first step portion protruding from the first main body portion in a direction perpendicular to the stacking direction to form the first stopper in a stepped shape, and an end of the first step portion protruding from the first main body portion is brought into contact with a side wall of the first base; Placing the glue-injected substrate on the first base, the first base being supported on a surface of the glue-injected substrate away from the crystal placement area, abutting the side wall of the glue-injected substrate against the first main body and fixing the glue-injected substrate on the first base, wherein the orthographic projection of the first base on the glue-injected substrate is located in the crystal placement area of ​​the glue-injected substrate; and The first limiting member is removed, and the outer periphery of the substrate after the injection of glue is cut and removed.

9. The packaging method according to claim 7 or 8, characterized in that: The packaging method further comprises: The sidewall of the cut substrate is ground to make the surface of the sidewall of the cut substrate flat and uniform.

10. The packaging method according to claim 9, characterized in that: The grinding process of the side wall of the cut substrate comprises: A grinding and positioning fixture is provided, the grinding and positioning fixture comprising a second base and a second stopper, the second stopper comprising a second step portion and a second main body portion which are stacked and fixed, the second step portion protruding from the second main body portion in a direction perpendicular to the stacking direction to form a stepped second stopper, and one end of the second step portion protruding from the second main body portion abuts against a side wall of the second base; Placing the cut substrate on the second base, the second base being supported on a surface of the cut substrate away from the crystal placement area, and abutting the side wall of the cut substrate against the second main body to fix the cut substrate on the second base, wherein the orthographic projection of the second base on the cut substrate is located in the crystal placement area of ​​the cut substrate; and The second limiting member is removed, and the side wall of the cut substrate is ground to make the surface of the side wall of the cut substrate flat and uniform.

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