Combined frame for integrated drive element, integrated drive assembly and manufacturing method thereof

Abstract

The present application discloses a combined frame for an integrated drive element, an integrated drive assembly, and a manufacturing method thereof, comprising a first frame, a second frame stacked on the first frame, and a third frame stacked on the second frame; the first frame comprises at least one first connector, the first connector comprises a first welding area, the second frame comprises at least one second connector, the second connector comprises a second welding area, the first welding area and the second welding area are used to electrically connect to the electrodes of the first drive element; the third frame comprises at least one base island and a pin, the base island is used to support the second drive element, and the pin is used to electrically connect to the second drive element. In the combined frame of the present application, the first connector of the first frame comprises a first welding area, and the second connector of the second frame comprises a second welding area, so that the first drive element can be welded between the first connector and the second connector, avoiding wire bonding, reducing the occurrence of cold solder joints and lead breakage, and improving yield.

Description

Technical Field

[0001] The present application relates to the field of packaging, and in particular to a combined frame for an integrated drive element, an integrated drive assembly, and a manufacturing method thereof. Background Art

[0002] LEDs (Light-Emitting Diodes) are widely used in lighting products due to their energy-saving, high-efficiency, and environmentally friendly characteristics. LEDs require a DC power source, so LED lighting products require a driver power supply to convert AC mains power into the DC power required by the LED lighting product and then output it to the LED lighting product.

[0003] At present, the driving power supply is to install the driving elements (such as rectifier diode chips and constant current chips) separately on the driving power supply board. Due to the large number of driving elements and the complex wiring, the driving power supply is large and occupies a large space. In order to reduce the volume of the driving power supply, the driving elements need to be integrated. For example, the rectifier diode chip and the constant current chip are integrated into a package with multiple pins. The four rectifier diode chips are welded to the base island and the lead bonding process to realize bridge rectification. The constant current chip realizes the functional connection of the circuit by base island welding or silver paste bonding and multiple bonding wires. This integration method is first punched into a functional frame with multiple base islands and pins during production, and then the four rectifier diode chips and the constant current chip are solid-crystal welded on their respective base islands. The four rectifier diode chips are connected by wire bonding, and the constant current chip is connected to the pins by wire bonding. Then, they are plastic-sealed, and the pins are electroplated and cut to form a single integrated module. This type of integrated module is prone to cold solder joints due to multiple wire bonding, which reduces the yield of the integrated module. At the same time, it is easy to cause lead breakage during the plastic sealing process, increasing the difficulty of packaging the power module.

[0004] Therefore, how to solve the above technical problems should be the focus of those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a combined frame for an integrated drive element, an integrated drive assembly and a manufacturing method thereof, so as to reduce the number of wire bonding times, improve the yield rate and reduce the difficulty of packaging.

[0006] In order to solve the above technical problems, the present application provides a combined frame for an integrated drive element, comprising a first frame, a second frame stacked on the first frame, and a third frame stacked on the second frame;

[0007] The first frame includes at least one first connector, the first connector includes a first welding area, the second frame includes at least one second connector, the second connector includes a second welding area, the first welding area and the second welding area are used to electrically connect to the electrode of the first driving element;

[0008] The third frame includes at least one base island and pins, the base island is used to support the second driving element, and the pins are used to be electrically connected to the second driving element.

[0009] Optionally, the first welding area includes a first welding pad, a second welding pad, a first carrier area and a second carrier area, and the second welding area includes a third welding pad, a fourth welding pad, a third carrier area and a fourth carrier area.

[0010] Optionally, the first connector also includes a DC positive output pin and a DC negative output pin, the first soldering pad and the second soldering pad are connected to the first connecting rib of the first frame through the DC positive output pin, and the first carrier area and the second carrier area are connected to the first connecting rib through the DC negative output pin.

[0011] Optionally, the second connector also includes a first AC input pin and a second AC input pin, the third solder pad and the third carrier area are connected to the second connecting rib of the second frame through the first AC input pin, and the fourth solder pad and the fourth carrier area are connected to the second connecting rib through the second AC input pin.

[0012] Optionally, the second connecting rib is located in the middle of the adjacent first connecting rib.

[0013] Optionally, the pins include a ground pin, a drain pin and a sampling pin.

[0014] Optionally, the drain pin and the sampling pin are arranged opposite to each other, and the drain pin and the sampling pin are respectively connected to two adjacent third connecting ribs in the third frame.

[0015] Optionally, the DC positive output pin, the DC negative output pin, the first AC input pin, the second AC input pin, the ground pin, the drain pin and the sampling pin are all in the same plane.

[0016] The present application also provides an integrated drive assembly, comprising any one of the above-mentioned combined frames for integrated drive elements, a first drive element, and a second drive element.

[0017] The present application also provides a method for manufacturing an integrated drive assembly, comprising:

[0018] A first frame is made of a first plate, wherein the first frame includes at least one first connector, and the first connector includes a first welding area;

[0019] Printing solder paste on the first welding area and placing the first driving element on the solder paste;

[0020] A second frame is made of a second plate material, wherein the second frame includes at least one second connector, and the second connector includes a second welding area;

[0021] Printing solder paste on the second welding area, and overlapping the second frame with the side printed with solder paste on the first frame, so that the first driving element is connected to the second frame through the solder paste;

[0022] Performing high-temperature treatment on the stacked first frame, the second frame, and the first driving element, so that the first driving element is welded between the first welding area and the second welding area;

[0023] Using a third plate to form a third frame, the third frame includes at least one base island and pins;

[0024] Applying adhesive on the base island, bonding the second driving element to the base island using the adhesive, and electrically connecting the second driving element to the pin;

[0025] A third frame connected to a second drive element is superimposed on the second frame to obtain an integrated drive assembly.

[0026] The present application provides a combined frame for an integrated driving element, comprising a first frame, a second frame stacked on the first frame, and a third frame stacked on the second frame; the first frame comprises at least one first connector, the first connector comprises a first welding area, the second frame comprises at least one second connector, the second connector comprises a second welding area, the first welding area and the second welding area are used to electrically connect to the electrode of the first driving element; the third frame comprises at least one base island and a pin, the base island is used to carry the second driving element, and the pin is used to electrically connect to the second driving element.

[0027] It can be seen that the combined frame in the present application includes a first frame, a second frame and a third frame stacked together in the vertical direction, the third frame includes a base island and pins, the second driving element can be arranged on the base island and electrically connected to the pins, the first connector of the first frame includes a first welding area, and the second connector of the second frame includes a second welding area, which can enable the first driving element to be welded between the first connector and the second connector, avoiding wire connection, reducing the occurrence of cold soldering, improving the yield, and at the same time reducing the occurrence of lead breakage, reducing the difficulty of packaging.

[0028] In addition, the present application also provides an integrated drive assembly and a manufacturing method thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 A schematic structural diagram of a combined frame for an integrated drive element provided in an embodiment of the present application;

[0031] Figure 2 A partially enlarged view of a combined frame for an integrated drive element provided in an embodiment of the present application

[0032] Figure 3 A schematic structural diagram of a first framework provided in an embodiment of the present application;

[0033] Figure 4 A schematic diagram of the structure of a second frame provided in an embodiment of the present application;

[0034] Figure 5 A partially enlarged view of a first frame provided in an embodiment of the present application;

[0035] Figure 6 A partially enlarged view of a second frame provided in an embodiment of the present application;

[0036] Figure 7 A schematic diagram of the structure of a third frame provided in an embodiment of the present application;

[0037] Figure 8 A partially enlarged view of a third frame provided in an embodiment of the present application;

[0038] Figure 9 This is a circuit schematic diagram of the first driving element in the integrated driving assembly when the number of the first driving elements is four in the embodiment of the present application;

[0039] Figure 10 This is a flow chart of a method for manufacturing an integrated drive assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. Obviously, the embodiments described are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative efforts are within the scope of protection of the present application.

[0041] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0042] As described in the background technology section, the driving components are connected to the base island or pins by wire bonding, and multiple wire bonding processes are required, which can easily cause cold solder joints and reduce the yield of the integrated module. At the same time, it can easily cause lead breakage during the plastic sealing process, increasing the difficulty of packaging the power module.

[0043] In view of this, this application provides a combined frame for integrated drive components, please refer to Figures 1 to 8 , comprising a first frame 1, a second frame 2 stacked on the first frame 1, and a third frame 3 stacked on the second frame 2;

[0044] The first frame 1 includes at least one first connector 11, the first connector 11 includes a first welding area, the second frame 2 includes at least one second connector 21, the second connector 21 includes a second welding area, and the first welding area and the second welding area are used to electrically connect to the electrodes of the first driving element;

[0045] The third frame 3 includes at least one base island 31 and pins. The base island 31 is used to support the second driving element, and the pins are used to be electrically connected to the second driving element.

[0046] The structural diagram of the first frame 1 is as follows Figure 3 As shown, the first frame 1 further includes first side bands 12 arranged opposite to each other, a plurality of first connecting ribs 13 arranged longitudinally and in parallel between the first side bands 12 , and the first connector 11 is connected to the first connecting ribs 13 .

[0047] The present application does not limit the first welding area, as long as it can be welded to the electrode of the first driving element. Furthermore, the present application does not limit the number of weldable areas included in the first welding area, which depends on the situation.

[0048] The structural diagram of the second frame 2 is as follows Figure 4As shown, the second frame 2 further includes second side strips 22 arranged opposite to each other, a plurality of second connecting ribs 23 arranged longitudinally and in parallel between the second side strips 22 , and the second connector 21 is connected to the second connecting ribs 23 .

[0049] The present application does not limit the second welding area, as long as it can be welded to the electrode of the first driving element. Furthermore, the present application does not limit the number of weldable areas included in the second welding area, and the number of weldable areas in the second welding area is equal to the number of weldable areas in the first welding area.

[0050] Optional, as an implementation option, please refer to Figure 5 and Figure 6 The first welding area includes a first welding pad 111, a second welding pad 112, a first carrier area 113 and a second carrier area 114, and the second welding area includes a third welding pad 211, a fourth welding pad 212, a third carrier area 213 and a fourth carrier area 214. That is, four first driving elements can be welded between the first welding area and the second welding area. For example, the negative electrode of the first first driving element is welded on the first welding pad 111, and the positive electrode is welded on the third carrier area 213; the negative electrode of the second first driving element is welded on the second welding pad 112, and the positive electrode is welded on the fourth carrier area 214; the positive electrode of the third first driving element is welded on the first carrier area 113, and the negative electrode is welded on the third welding pad 211; the positive electrode of the fourth first driving element is welded on the second carrier area 114, and the negative electrode is welded on the fourth welding pad 212.

[0051] The first soldering pad 111, the second soldering pad 112, the first carrier area 113 and the second carrier area 114 are all connected to the first connecting rib 13. In one embodiment of the present application, the first connector 11 also includes a DC positive output pin 115 and a DC negative output pin 116. The first soldering pad 111 and the second soldering pad 112 are connected to the first connecting rib 13 of the first frame 1 through the DC positive output pin 115, and the first carrier area 113 and the second carrier area 114 are connected to the first connecting rib 13 through the DC negative output pin 116.

[0052] The third solder pad 211, the fourth solder pad 212, the third carrier area 213 and the fourth carrier area 214 are all connected to the second connecting rib 23. In one embodiment of the present application, the second connector 21 also includes a first AC input pin 215 and a second AC input pin 216. The third solder pad 211 and the third carrier area 213 are connected to the second connecting rib 23 of the second frame 2 through the first AC input pin 215, and the fourth solder pad 212 and the fourth carrier area 214 are connected to the second connecting rib 23 through the second AC input pin 216.

[0053] The second frame 2 is stacked on the first frame 1 . To facilitate the second connectors 21 in the second frame 2 to cover the corresponding first connectors 11 on the first frame 1 , the second connecting ribs 23 are located between adjacent first connecting ribs 13 .

[0054] The structural diagram of the third frame 3 is as follows Figure 7 and Figure 8 As shown, the third frame 3 further includes third side strips 32 arranged opposite to each other and a plurality of third connecting ribs 33 arranged longitudinally and in parallel between the third side strips 32. The base island 31 is connected to the third connecting ribs 33 via pins.

[0055] The pins are not limited in this application, and the specific structure of the pins is set according to the electrodes of the second driving element. For example, when the second driving element is a metal oxide semiconductor field-effect transistor (MOSFET), the second driving element includes three electrodes. In this case, the pins include a ground pin 34, a drain pin 35, and a sampling pin 36. One electrode is connected to the drain pin 35 by bonding, one electrode is connected to the sampling pin 36 by bonding, and one electrode is connected to the ground pin 34 by bonding. That is, the electrodes of the second driving element are connected to the pins including the ground pin 34, the drain pin 35, and the sampling pin 36 through the lead 4. When the second driving element includes two electrodes, the number of pins is two. When the second driving element includes four electrodes, the number of pins is four, and so on.

[0056] It should be noted that the arrangement of the pins is not limited in this application and depends on the circumstances. When the pins include a ground pin 34, a drain pin 35, and a sampling pin 36, the drain pin 35 and the sampling pin 36 are arranged opposite each other and are respectively connected to two adjacent third connecting ribs 33 in the third frame 3. The base island 31 is connected to the third connecting rib 33 via the ground pin 34. The ground pin 34, the drain pin 35, and the sampling pin 36 are arranged in a triangular pattern to facilitate wire bonding between the second driving element and the pins.

[0057] There is no direct connection between the first frame 1 and the second frame 2. The electrodes of the first driving element are welded to the first and second welding areas, respectively. This means that the first frame 1 and the second frame 2 are indirectly connected via the first driving element. The third sideband 32 of the third frame 3 can be connected to the second sideband 22 of the second frame 2 using connectors such as clips and screws.

[0058] When the integrated drive component assembly frame includes the first and second drive components, to facilitate subsequent soldering with an external circuit board, as one possible implementation, the DC positive output pin 115, the DC negative output pin 116, the first AC input pin 215, the second AC input pin 216, the ground pin 34, the drain pin 35, and the sampling pin 36 are all located in the same plane. Specifically, the DC positive output pin 115 and the DC negative output pin 116 are bent and connected to the first connecting rib 13; the first AC input pin 215 and the second AC input pin 216 are bent and connected to the second connecting rib 23; and the ground pin 34, the drain pin 35, and the sampling pin 36 are bent and connected to the third connecting rib 33.

[0059] The combined frame in the present application includes a first frame 1, a second frame 2 and a third frame 3 stacked together in a vertical direction. The third frame 3 includes a base island 31 and pins. The second driving element can be arranged on the base island 31 and electrically connected to the pins. The first connector 11 of the first frame 1 includes a first welding area, and the second connector 21 of the second frame 2 includes a second welding area. The first driving element can be welded between the first connector 11 and the second connector 21, avoiding wire bonding, reducing the occurrence of cold soldering, improving the yield, and at the same time reducing the occurrence of lead breakage, reducing the difficulty of packaging.

[0060] The present application also provides an integrated drive assembly, comprising the combined frame for the integrated drive element described in any of the above embodiments, a first drive element, and a second drive element.

[0061] The first driving element is welded between the first connecting body and the second connecting body of the combined frame for integrating the driving element, and the second driving element is arranged in the third frame of the combined frame for integrating the driving element.

[0062] The second driving element integrated in the third frame is not electrically connected to the DC positive output pin and DC negative output pin in the first frame, the first AC input pin and the second AC input pin in the second frame, and the first driving element.

[0063] It should be noted that the types of the first driving element and the second driving element are not limited in this application and can be set as desired. For example, the first driving element can be a rectifier diode chip, and the second driving element can be a metal oxide semiconductor field effect transistor.

[0064] It should also be noted that the number of the first driving elements and the second driving elements is not specifically limited in this application and is determined according to the circumstances. For example, the number of the first driving elements can be one, two, four, five, etc., and the number of the second driving elements can be one, two, etc.

[0065] When the number of the first driving elements is four, the circuit schematic diagram of the first driving element in the integrated driving assembly is as follows: Figure 9 shown.

[0066] This application also provides a method for manufacturing an integrated drive assembly, please refer to Figure 10 , the method comprising:

[0067] Step S101: using a first plate to make a first frame, wherein the first frame includes at least one first connector, and the first connector includes a first welding area.

[0068] The first frame further includes first side bands arranged opposite to each other, a plurality of first connecting ribs arranged longitudinally and in parallel between the first side bands, and the first connector is connected to the first connecting ribs.

[0069] As an implementation method, the first welding area includes a first welding pad, a second welding pad, a first carrier area and a second carrier area.

[0070] The first plate may be a copper plate or other metal plates, and the first frame may be manufactured by stamping.

[0071] Step S102: printing solder paste on the first welding area, and placing a first driving element on the solder paste.

[0072] Step S103: using a second plate to make a second frame, wherein the second frame includes at least one second connector, and the second connector includes a second welding area.

[0073] The second frame further includes second side bands arranged opposite to each other, a plurality of second connecting ribs arranged longitudinally and in parallel between the second side bands, and the second connector is connected to the second connecting ribs.

[0074] As an implementation method, the second welding area includes a third welding pad, a fourth welding pad, a third carrier area and a fourth carrier area.

[0075] The second plate may be a copper plate or other metal plates, and the second frame may be manufactured by stamping.

[0076] Step S104: printing solder paste on the second welding area, and overlapping the second frame with the solder paste printed on the first frame, so that the first driving element is connected to the second frame through the solder paste.

[0077] When there are multiple first driving elements, a part of the first driving elements can be set on the solder paste of the first welding area, and the other part of the first driving elements can be set on the solder paste of the second welding area. Taking the number of first driving elements as four as an example, in step S102, two first driving elements are placed on the solder paste, and in this step, another two first driving elements are placed on the solder paste. The negative electrode of the first first driving element is welded on the first solder pad, and the positive electrode is welded on the third carrier area; the negative electrode of the second first driving element is welded on the second solder pad, and the positive electrode is welded on the fourth carrier area; the positive electrode of the third first driving element is welded on the first carrier area, and the negative electrode is welded on the third solder pad; the positive electrode of the fourth first driving element is welded on the second carrier area, and the negative electrode is welded on the fourth solder pad.

[0078] Step S105: performing high temperature treatment on the stacked first frame, the second frame and the first driving element, so that the first driving element is welded between the first welding area and the second welding area.

[0079] The high temperature treatment causes the solder paste to melt, thereby soldering the first driving element between the first frame and the second frame.

[0080] Step S106: using a third plate material to manufacture a third frame, wherein the third frame includes at least one base island and pins.

[0081] The third frame further includes third side bands arranged opposite to each other and a plurality of third connecting ribs arranged longitudinally and in parallel between the third side bands.

[0082] As an implementation method, when the second driving element is a metal oxide semiconductor field effect transistor, the pins include a ground pin, a drain pin, and a sampling pin.

[0083] The third plate may be a copper plate or other metal plates, and the third frame may be manufactured by stamping.

[0084] Step S107: applying adhesive on the base island, and using the adhesive to bond the second driving element to the base island, and electrically connecting the second driving element to the pin.

[0085] Specifically, the electrodes of the second driving element are electrically connected to the pins by wire bonding.

[0086] Step S108: superimposing the third frame connected to the second driving element on the second frame to obtain an integrated driving assembly.

[0087] It should be noted that in this step, after the third frame is superimposed on the second frame, it is necessary to perform plastic sealing, electroplating on the pins, and cutting on the pins to form a single integrated drive assembly.

[0088] It should be noted that the present application does not specifically limit the order of the steps in the above embodiment, and the production can also be carried out in the order of step S101, step S103, step S106, step S102, step S104, step S105, step S107, and step S108.

[0089] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from the other embodiments. Reference can be made to the descriptions of the identical or similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the methods.

[0090] The above is a detailed introduction to the combined frame for integrated drive elements, the integrated drive assembly and the manufacturing method thereof provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A combined frame for an integrated drive element, characterized in that: It comprises a first frame, a second frame stacked on the first frame, and a third frame stacked on the second frame; The first frame includes at least one first connector, the first connector includes a first welding area, the second frame includes at least one second connector, the second connector includes a second welding area, the first welding area and the second welding area are used to electrically connect to the electrode of the first driving element; The third frame includes at least one base island and a pin, wherein the base island is used to support the second driving element, and the pin is used to be electrically connected to the second driving element; The third frame further includes third side strips arranged opposite to each other, and a plurality of third connecting ribs arranged longitudinally and in parallel between the third side strips, wherein the base island is connected to the third connecting ribs via the pins; The third side band of the third frame is connected to the second side band of the second frame by means of buckles and screws.

2. The combined frame for integrated drive elements according to claim 1, wherein: The first welding area includes a first welding pad, a second welding pad, a first carrier area and a second carrier area, and the second welding area includes a third welding pad, a fourth welding pad, a third carrier area and a fourth carrier area.

3. The combined frame for integrated drive elements according to claim 2, wherein: The first connector also includes a DC positive output pin and a DC negative output pin, the first soldering pad and the second soldering pad are connected to the first connecting rib of the first frame through the DC positive output pin, and the first carrier area and the second carrier area are connected to the first connecting rib through the DC negative output pin.

4. The combined frame for integrated drive elements according to claim 3, wherein: The second connector also includes a first AC input pin and a second AC input pin, the third solder pad and the third carrier area are connected to the second connecting rib of the second frame through the first AC input pin, and the fourth solder pad and the fourth carrier area are connected to the second connecting rib through the second AC input pin.

5. The combined frame for integrated drive elements according to claim 4, wherein: The second connecting rib is located between adjacent first connecting ribs.

6. The combined frame for integrated drive elements according to claim 5, wherein: The pins include a ground pin, a drain pin and a sampling pin.

7. The combined frame for integrated drive elements according to claim 6, wherein: The drain pin and the sampling pin are arranged opposite to each other, and are respectively connected to two adjacent third connecting ribs in the third frame.

8. The combined frame for integrated drive elements according to claim 7, wherein: The DC positive output pin, the DC negative output pin, the first AC input pin, the second AC input pin, the ground pin, the drain pin and the sampling pin are all located in the same plane.

9. An integrated drive assembly, characterized in that: It comprises the combined frame for integrated drive elements as described in any one of claims 1 to 8, a first drive element, and a second drive element.

10. A method for manufacturing an integrated drive assembly, characterized in that: include: A first frame is made of a first plate, wherein the first frame includes at least one first connector, and the first connector includes a first welding area; Printing solder paste on the first welding area and placing the first driving element on the solder paste; A second frame is made of a second plate material, wherein the second frame includes at least one second connector, and the second connector includes a second welding area; Printing solder paste on the second welding area, and overlapping the second frame with the side printed with solder paste on the first frame, so that the first driving element is connected to the second frame through the solder paste; Performing high-temperature treatment on the stacked first frame, the second frame, and the first driving element, so that the first driving element is welded between the first welding area and the second welding area; Using a third plate to form a third frame, the third frame includes at least one base island and pins; Applying adhesive on the base island, bonding the second driving element to the base island using the adhesive, and electrically connecting the second driving element to the pin; A third frame connected to a second drive element is superimposed on the second frame to obtain an integrated drive assembly.

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