Heating assembly and aerosol generating device

Abstract

This application provides a heating assembly and an aerosol-generating device. The heating assembly comprises a substrate, a heating layer, and a temperature-measuring layer. The substrate houses an aerosol-generating substrate; the heating layer is disposed on the surface of the substrate and is configured to heat and atomize the aerosol-generating substrate when energized; and the temperature-measuring layer is disposed on the surface of the substrate and / or the heating layer, and has a temperature coefficient of resistance characteristic. This heating assembly is not only easy to install but also occupies a small space.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization devices, and in particular to a heating component and an aerosol generating device. Background Art

[0002] Heat Not Burning (HNB) aerosol generating devices are gaining more and more attention and favor due to their advantages such as safety, convenience, health and environmental protection.

[0003] Existing heat-not-burn aerosol-generating devices generally include a heating assembly and a power supply assembly. The heating assembly is used to heat and atomize the aerosol-generating substrate when powered on, and the power supply assembly is connected to the heating assembly to supply power to the heating assembly. During the heating process, it is often necessary to monitor the temperature of the heating assembly or the aerosol-generating substrate within the heating assembly in real time to adjust the temperature field to meet varying temperature requirements. Currently, this is typically accomplished by adding an external temperature measuring element, such as a thermocouple temperature sensor, to measure the heating assembly's temperature in real time, facilitating timely adjustment of the heating temperature.

[0004] However, measuring temperature by adding a separate temperature sensor or temperature measuring element not only takes up a large space but is also inconvenient to install. Summary of the Invention

[0005] The present application provides a heating assembly and an aerosol generating device. The heating assembly can solve the problem that the existing method of measuring temperature by adding a separate temperature sensor or temperature measuring element not only takes up a large space but is also inconvenient to install.

[0006] In a first aspect, the present application provides a heating assembly comprising a substrate, a heating layer, and a temperature measuring layer. The substrate is configured to accommodate an aerosol-generating substrate; the heating layer is disposed on a surface of the substrate and configured to heat and atomize the aerosol-generating substrate when energized; and the temperature measuring layer is disposed on a surface of the substrate and / or the heating layer, and the temperature measuring layer has a temperature coefficient of resistance (TCR) characteristic.

[0007] The temperature measuring layer is arranged on the heating layer and is located on the surface of the side away from the substrate.

[0008] The temperature measuring layer is arranged on the surface of the substrate, and is located on the same surface of the substrate as the heating layer and is spaced apart from each other.

[0009] The temperature measuring layer is arranged on the surface of the substrate, and is located between the substrate and the heating layer.

[0010] The temperature measuring layer is arranged on the surface of the substrate, and is arranged on a different surface from the heating layer.

[0011] The temperature measuring layer is arranged along the circumferential direction of the substrate.

[0012] The temperature measuring layer is located at the end of the substrate.

[0013] The temperature measuring layer is located in the middle of the substrate and is distributed in a wave-like manner along the circumferential direction of the substrate.

[0014] The temperature measuring layer at least covers the highest temperature area of ​​the heating component.

[0015] Among them, the heating layer is an infrared heating film.

[0016] The base is a hollow column, and the heating layer is arranged on the outer surface of the base of the hollow column.

[0017] The base is a hollow column, and the heating layer is arranged on the inner surface of the base of the hollow column.

[0018] The heating layer and the temperature measuring layer are both arranged on the outer surface of the substrate by silk screen printing or coating, and the area of ​​the temperature measuring layer is smaller than that of the heating layer.

[0019] Wherein, the matrix is ​​quartz.

[0020] In a second aspect, the present application provides an aerosol-generating device. The aerosol-generating device includes a heating component, a power supply component, and a controller. The heating component is configured to heat and atomize an aerosol-generating substrate when powered on. The heating component is the aforementioned aerosol-generating device. The power supply component is connected to the heating component and is configured to supply power to the heating component. The controller is configured to control the power supply component to supply power to the heating component, detect the resistance value of the temperature-measuring layer in real time, and monitor the temperature of the heating component based on the resistance value.

[0021] The heating component and aerosol generating device provided by the present application, the heating component is provided with a substrate to accommodate the aerosol generating matrix. At the same time, a heating layer is provided on the surface of the substrate to heat and atomize the aerosol generating matrix when powered on. In addition, a temperature measuring layer is provided on the surface of the substrate and / or the heating layer, and the temperature measuring layer has a temperature coefficient of resistance (TCR) characteristic, so that the heating component can monitor the temperature value of the heating component by detecting the resistance value of the temperature measuring layer. Compared with the prior art, since the temperature measuring layer is in a film shape, it can be directly deposited on the surface of the substrate and / or the heating layer, and there is no need to provide a mounting groove on the surface of the substrate and / or the heating layer or to use screws or other fixings to install and fix it, so that the temperature measuring layer is not only easy to set up, but also occupies less space. In addition, since the temperature measuring layer can choose to cover certain specific positions of the substrate and / or the heating layer and choose to cover a larger area of ​​the substrate and / or the heating layer surface according to actual needs, it can measure the temperature of specific areas on the surface of the substrate and / or the heating layer. The temperature measurement accuracy is high, and the temperature of most areas of the substrate and / or the heating layer can be measured, effectively expanding the temperature measurement range of the heating component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0023] Figure 1 A schematic structural diagram of a heating assembly provided in the first embodiment of the present application;

[0024] Figure 2 for Figure 1 A simplified structural diagram of the corresponding heating component;

[0025] Figure 3 A schematic structural diagram of a heating assembly provided in a second embodiment of the present application;

[0026] Figure 4 for Figure 3 A cross-sectional view of the heating assembly taken along the line AA;

[0027] Figure 5 A schematic structural diagram of a heating assembly provided in the third embodiment of the present application;

[0028] Figure 6 for Figure 5 A simplified structural diagram of the corresponding heating component;

[0029] Figure 7A schematic structural diagram of a heating assembly provided in a fourth embodiment of the present application;

[0030] Figure 8 This is a schematic structural diagram of an aerosol generating device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0033] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0035] See also Figure 1 and Figure 2 , Figure 1 A schematic structural diagram of a heating assembly provided in the first embodiment of the present application; Figure 2 for Figure 1A schematic diagram of the corresponding heating assembly. In this embodiment, a heating assembly 10 is provided. The heating assembly 10 is specifically configured to heat and atomize an aerosol-generating substrate to form an aerosol when powered. The heating assembly 10 can be used in various fields, such as electronic atomization. Specifically, the heating assembly 10 includes a substrate 11, a heating layer 12, and a temperature measuring layer 13.

[0036] Among them, the base 11 can be in the shape of a hollow column, and the hollow structure of the base 11 is formed into a receiving cavity 111, and the receiving cavity 111 is used to receive the aerosol generating matrix. Among them, the aerosol generating matrix can be a plant grass leaf matrix or a paste matrix, etc. The base 11 is made of an insulating material, and the base 11 can be a high-temperature resistant insulating material such as quartz glass, ceramic or mica to prevent the two electrodes from short-circuiting. Preferably, the base 11 can be transparent quartz. Of course, the base 11 can also be made of a conductive material, in which case an insulating layer can be coated on the surface of the base 11. In a specific embodiment, the base 11 is a cylindrical ceramic tube. It should be noted that the inner surface of the base 11 involved in the following embodiments refers to the inner wall surface of the receiving cavity 111, and the outer surface of the base 11 refers to the outer wall surface of the receiving cavity 111.

[0037] The heating layer 12 is disposed on the surface of the substrate 11 and is used to generate heat when powered, thereby heating and atomizing the aerosol-generating matrix. Specifically, the heating layer 12 can be formed on the inner or outer surface of the substrate 11 by screen printing, sputtering, coating, or printing. Because infrared light has a certain degree of penetrability and does not require a medium, it has high heating efficiency and more uniform baking of the aerosol-generating matrix.

[0038] In a specific embodiment, the heating layer 12 can specifically use an infrared heating layer, such as an infrared ceramic coating. The infrared heating layer can be an infrared heating film, and the thickness and area of ​​the infrared heating film are not limited and can be selected as needed. Among them, the infrared heating layer can be a metal layer, a conductive ceramic layer or a conductive carbon layer. The shape of the infrared heating layer can be a continuous film, a porous mesh or a strip. Among them, the material, shape and size of the infrared heating layer can be set as needed. In a specific embodiment, the infrared heating layer radiates infrared rays when energized to heat the aerosol in the receiving cavity 111 to generate a matrix. Among them, the infrared heating wavelength is 2.5um to 20um. In view of the characteristics of heating the aerosol to form a matrix, the heating temperature usually needs to be above 350°C, and the energy radiation extreme value is mainly in the 3-5um band.

[0039] The temperature measuring layer 13 is arranged on the surface of the substrate 11 and / or the heating layer 12, and the temperature measuring layer 13 has a temperature coefficient of resistance (TCR) characteristic. That is, the resistance value of the temperature measuring layer 13 has a monotonous one-to-one correspondence with its own temperature value. For example, the resistance value of the temperature measuring layer 13 increases as its temperature value increases; or, the resistance value of the temperature measuring layer 13 decreases as its temperature value increases. In this way, the heating component 10 can monitor the temperature value of the heating component 10 by detecting the resistance value of the temperature measuring layer 13, and then adjust the temperature field of the heating component 10 to achieve the best effect of the puffing taste. Compared with the solution in the prior art that requires a separate temperature measuring element such as a temperature sensor, since the temperature measuring layer 13 is in a film shape, it can be directly deposited on the surface of the substrate 11 and / or the heating layer 12, and there is no need to set a mounting groove on the surface of the substrate 11 and / or the heating layer 12 or use screws or other fixings to install and fix it, so that the temperature measuring layer 13 is not only easy to set up, but also occupies less space. In addition, since the temperature measuring layer 13 can choose to cover certain specific positions of the substrate 11 and / or the heating layer 12 and choose to cover a larger area of ​​the substrate 11 and / or the heating layer 12 surface according to actual needs, it is possible to measure the temperature of specific areas on the surface of the substrate 11 and / or the heating layer 12, with high temperature measurement accuracy, and can measure the temperature of most areas of the substrate 11 and / or the heating layer 12, effectively expanding the temperature measurement range of the heating component 10.

[0040] The temperature measuring layer 13 can also be formed on the surface of the substrate 11 and / or the heating layer 12 by silk screen printing, sputtering, coating, printing, etc. The temperature measuring layer 13 can at least cover the highest temperature area of ​​the heating component 10 to avoid the problem of excessive local temperature affecting the heated taste of the aerosol generating matrix. It can be understood that in a specific embodiment, if the highest temperature area of ​​the heating component 10 corresponds to a certain area of ​​the substrate 11, the temperature measuring layer 13 at least covers the position of the substrate 11; if the highest temperature area of ​​the heating component 10 corresponds to a certain position of the heating layer 12, the temperature measuring layer 13 at least covers the position of the heating layer 12.

[0041] In one embodiment, the sheet resistance of the temperature measuring layer 13 is 1 Ω / □ to 5 Ω / □, and the temperature coefficient of resistance of the temperature measuring layer 13 is 300 ppm / °C to 3500 ppm / °C. Furthermore, the sheet resistance of the temperature measuring layer 13 is 2 Ω / □ to 4 Ω / □, and the temperature coefficient of resistance of the temperature measuring layer 13 is 700 ppm / °C to 2000 ppm / °C.

[0042] Because the temperature-measuring layer 13 has a relatively high resistance and performs only temperature measurement, in a specific embodiment, the area of ​​the temperature-measuring layer 13 can be smaller than that of the heating layer 12. This not only reduces energy consumption but also maintains the heating effect of the infrared heating layer 12. Furthermore, the overall temperature field of the heating layer 12 can be consistent. Specifically, the area ratio of the temperature-measuring layer 13 to the heating layer 12 can range from 1:5 to 1:10.

[0043] Specifically, the resistor paste for preparing the temperature measuring layer 13 includes an organic carrier, an inorganic binder and a conductive agent. In terms of mass, the organic carrier accounts for 10 to 20 parts, the inorganic binder accounts for 30 to 45 parts, and the conductive agent accounts for 30 to 50 parts. The inorganic binder includes glass powder, and the conductive agent is selected from at least one of silver and palladium.

[0044] In one embodiment, the organic carrier is selected from at least one of terpineol, ethyl cellulose, butyl carbitol, polyvinyl butyral, tributyl citrate and polyamide wax.

[0045] In one embodiment, the inorganic binder includes glass frit having a melting point of 700° C. to 780° C.

[0046] like Figure 1 As shown, the temperature measuring layer 13 can be arranged along the circumference of the substrate 11. In this embodiment, two electrodes can be provided at two predetermined positions on the temperature measuring layer 13, and the two electrodes are used to connect to the positive lead and the negative lead, respectively, to detect the resistance value of the temperature measuring layer 13. Of course, in other embodiments, the temperature measuring layer 13 can also be in an arc shape with a notch along the circumference of the substrate 11, and the two ends of the notch of the temperature measuring layer 13 can be formed into two electrodes for connecting to the positive lead and the negative lead. This application is not limited to this.

[0047] Specifically, the temperature measuring layer 13 can be distributed in a wavy pattern along the circumferential direction of the substrate 11 to cover as many different regions of the heating assembly 10 as possible, thereby sensing the temperature at different positions of the heating assembly 10 and monitoring the temperature of different regions of the heating assembly 10. For example, when the substrate 11 is tubular, the temperature measuring layer 13 is disposed in the middle of the substrate 11 and undulates along the length of the substrate 11, thereby covering different regions along the length of the substrate 11. Of course, in other embodiments, the temperature measuring layer 13 can also be distributed along the circumferential direction of the substrate 11 in a linear pattern, a connected "Z" pattern, a U-shape, a zigzag pattern, a dot pattern, or the like.

[0048] Specifically, the temperature measuring layer 13 and the heating layer 12 may be made of the same material.

[0049] In a specific embodiment, the temperature measuring layer 13 and the heating layer 12 can be arranged on the same surface of the substrate 11, or on different surfaces of the substrate 11, for example, one is arranged on the inner surface of the substrate 11 and the other is arranged on the outer surface of the substrate 11. The temperature measuring layer 13 can be arranged only on the surface of the heating layer 12, or only on the surface of the substrate 11, or can be arranged on the surfaces of both the heating layer 12 and the substrate 11, for example, one part is arranged on the surface of the heating layer 12 and the other part is arranged on the surface of the substrate 11. The temperature measuring layer 13 can be arranged on the side of the heating layer 12 facing away from the substrate 11, or on the side of the heating layer 12 close to the substrate 11.

[0050] In the first specific embodiment, Figure 1 and Figure 2 As shown, the heating layer 12 is disposed on the outer surface of the substrate 11, and the temperature measuring layer 13 is disposed only on the surface of the heating layer 12 facing away from the substrate 11. After the heating layer 12 is energized, the temperature of the heating layer 12 increases, and the temperature of the temperature measuring layer 13 also increases with the increase in the temperature of the heating layer 12. The resistance value of the temperature measuring layer 13 changes with the change in its temperature, and the temperature value of the heating assembly 10 is monitored in real time by detecting the resistance value of the temperature measuring layer 13.

[0051] Specifically, such as Figure 1 As shown, the substrate 11 is hollow and cylindrical, and the heating layer 12 can cover the entire outer surface of the substrate 11. This prevents heat loss from the heating layer 12 after conduction through the substrate 11, which can lead to large errors in temperature measurement results. It also prevents the heating layer 12 from being scratched by the aerosol-generating matrix. In this embodiment, the temperature measuring layer 13 can be located in the middle of the substrate 11 along its axial direction and is arranged around the outer surface of the substrate 11.

[0052] In the second specific embodiment, see Figure 3 and Figure 4 , Figure 3 A schematic structural diagram of a heating assembly provided in a second embodiment of the present application; Figure 4 for Figure 3 The heating layer 12 is provided on the inner surface of the substrate 11, and the temperature measuring layer 13 is provided on the surface of the heating layer 12 facing away from the substrate 11, which is not limited in the present application.

[0053] In the third specific embodiment, see Figure 5 and Figure 6 , Figure 5 A schematic structural diagram of a heating assembly provided in the third embodiment of the present application; Figure 6 for Figure 5A simplified structural diagram of the corresponding heating assembly. The temperature measuring layer 13 is disposed on the surface of the substrate 11 and is located on the same surface of the substrate 11 as the heating layer 12, but spaced apart. In this specific embodiment, the heating layer 12 generates heat when energized, and the temperature of the heating layer 12 is transferred to the surface of the substrate 11. The temperature of the temperature measuring layer 13 disposed on the surface of the substrate 11 changes with the temperature of the substrate 11, and the resistance of the temperature measuring layer 13 also changes with the temperature change. The temperature of the heating assembly 10 is thus monitored in real time by detecting the resistance of the temperature measuring layer 13.

[0054] In this embodiment, the position of the temperature measuring layer 13 is specifically selected to be set at any position of the substrate 11 or any position covering the substrate 11 according to actual needs. For example, if the temperature of the first end of the substrate 11 is to be monitored, the temperature measuring layer 13 can be set at the first end. If the temperature of the middle of the substrate 11 is to be monitored, the temperature measuring layer 13 can be set at the middle position of the substrate 11, such as Figure 1 As shown. If the temperatures of the first and second ends of the substrate 11 are to be monitored simultaneously, multiple temperature measuring layers 13 may be provided, with one temperature measuring layer 13 covering the first end and another temperature measuring layer 13 covering the second end, so as to monitor the temperatures of corresponding positions of the substrate 11. Preferably, in a specific embodiment, the heating layer 12 may be provided at the first end of the outer surface of the substrate 11, and the temperature measuring layer 13 may be provided at the second end of the substrate 11, and spaced apart from the heating layer 12, so as to detect the temperature value of the second end of the substrate 11 by detecting the resistance value of the temperature measuring layer 13.

[0055] See also Figure 5 The substrate 11 is hollow cylindrical, and the heating layer 12 is disposed on the outer surface of the substrate 11 with only one end of the substrate 11 exposed. The temperature measuring layer 13 is disposed in the exposed area of ​​the outer surface of the substrate 11 and is spaced apart from the heating layer 12. The temperature measuring layer 13 is disposed around the circumference of the substrate 11. The temperature measuring layer 13 can be disposed in a circle along the circumference of the substrate 11, that is, the temperature measuring layer 13 is in a closed loop; of course, the temperature measuring layer 13 can also be disposed in an open loop along the circumference of the substrate 11, that is, the arc corresponding to the temperature measuring layer 13 is less than 360 degrees.

[0056] In the fourth specific embodiment, see Figure 7 , Figure 7This is a schematic structural diagram of the heating component provided in the fourth embodiment of the present application. The temperature measuring layer 13 and the heating layer 12 are located on the same surface of the substrate 11, such as the outer surface, and the temperature measuring layer 13 can be provided on one side surface of the substrate 11 and the side surface of the heating layer 12 facing away from the substrate 11. Among them, the temperature measuring layer 13 provided on the substrate 11 can be spaced apart from the heating layer 12, and the temperature measuring layer 13 provided on the substrate 11 can be arranged in a circle along the circumferential direction of the substrate 11 and be in a straight line. The temperature measuring layer 13 provided on the side surface of the heating layer 12 facing away from the substrate 11 can specifically correspond to the middle position of the substrate 11 along its axial direction, and can specifically be arranged in a wave-like manner around the circumferential direction of the substrate 11. Among them, the specific method of performing resistance detection on the two temperature measuring layers 13 can be referred to the above-mentioned relevant text description, which will not be repeated here.

[0057] Among them, by arranging the temperature measuring layer 13 on the surface of the heating layer 12 and the surface of the substrate 11, the temperature measuring layer 13 can simultaneously sense the temperature of the substrate 11 and the heating layer 12, so as to ensure that the temperature measuring layer 13 at least covers the highest temperature area of ​​the heating component 10, and avoid the problem that the highest temperature area of ​​the heating component 10 appears in other areas not covered by the temperature measuring layer 13, resulting in large errors in the temperature measurement results.

[0058] In the fifth embodiment, the temperature measuring layer 13 is provided on the surface of the substrate 11 and is specifically located between the substrate 11 and the heating layer 12. It is understood that in this embodiment, the temperature measuring layer 13 and the heating layer 12 are located on the same surface of the substrate 11.

[0059] In a sixth specific embodiment, the temperature measuring layer 13 is located on the surface of the substrate 11, and the temperature measuring layer 13 and the heating layer 12 are arranged on different surfaces of the substrate 11. For example, the heating layer 12 is arranged on the inner surface of the hollow cylindrical substrate 11, and the temperature measuring layer 13 is arranged on the outer surface of the substrate 11. After the heating layer 12 is energized and heated, the temperature is transferred to the substrate 11, and the temperature of the substrate 11 is further transferred to the temperature measuring layer 13, so that the resistance of the temperature measuring layer 13 changes with the change of its temperature. Alternatively, the heating layer 12 is arranged on the outer surface of the substrate 11, and the temperature measuring layer 13 is arranged on the inner surface of the substrate 11.

[0060] The heating component 10 provided in this embodiment is provided with a base 11 to accommodate the aerosol generating matrix. At the same time, a heating layer 12 is provided on the surface of the base 11 so that the aerosol generating matrix is ​​heated and atomized by the heating layer 12 when power is turned on. In addition, a temperature measuring layer 13 is provided on the surface of the base 11 and / or the heating layer 12, and the temperature measuring layer 13 has a temperature coefficient of resistance (TCR) characteristic, so that the heating component 10 can monitor the temperature value of the heating component 10 by detecting the resistance value of the temperature measuring layer 13. Compared with the prior art, the temperature measuring layer 13 is not only easy to set up, but also occupies less space. In addition, since the temperature measuring layer 13 can be selected to cover a larger area of ​​the base 11 and / or the heating layer 12 surface according to actual needs, it is possible to measure the temperature of most areas on the surface of the base 11 and / or the heating layer 12, effectively expanding the temperature measurement range of the heating component 10.

[0061] See also Figure 8 , Figure 8 Schematic diagram of the structure of an aerosol generating device provided in one embodiment of the present application. In this embodiment, an aerosol generating device 100 is provided. The aerosol generating device 100 includes a heating component 10, a power component 20, and a controller 30.

[0062] The heating assembly 10 is used to heat and atomize the aerosol-generating substrate to form an aerosol when powered. The heating assembly 10 can be any of the heating assembly 10 described in the above embodiments. Its specific structure and function can refer to the description of the specific structure and function of the heating assembly 10 in the above embodiments, and can achieve the same or similar technical effects. For details, please refer to the following.

[0063] The power supply assembly 20 is connected to the heating assembly 10 for supplying power to the heating assembly 10. The heating assembly 10 and the power supply assembly 20 may be detachably connected to facilitate replacement of the heating assembly 10 and improve the utilization of the power supply assembly 20. Of course, in other embodiments, the power supply assembly 20 and the heating assembly 10 may also be integrally provided, and this application is not limited thereto.

[0064] The controller 30 is used to control the power supply component 20 to supply power to the heating component 10, detect the resistance value of the temperature measuring layer 13 on the heating component 10 in real time, and monitor the temperature of the heating component 10 based on the resistance value, thereby adjusting the temperature field of the heating component 10 to achieve the best effect of the smoking taste.

[0065] In a specific embodiment, the aerosol generating device 100 further includes a housing 40 . The heating component 10 is specifically accommodated in the housing 40 and connected to the power supply component 20 .

[0066] The aerosol generating device 100 provided in this embodiment is provided with a heating component 10, and the heating component 10 is provided with a substrate 11 to accommodate the aerosol generating matrix. At the same time, a heating layer 12 is provided on the surface of the substrate 11, so that the heating layer 12 heats and atomizes the aerosol generating matrix when powered on. In addition, a temperature measuring layer 13 is provided on the surface of the substrate 11 and / or the heating layer 12, and the temperature measuring layer 13 has a temperature coefficient of resistance (TCR) characteristic, so that the heating component 10 can monitor the temperature value of the heating component 10 by detecting the resistance value of the temperature measuring layer 13. Compared with the prior art, the temperature measuring layer 13 is not only easy to set up, but also occupies less space. In addition, since the temperature measuring layer 13 can be selected to cover a larger area of ​​the substrate 11 and / or the heating layer 12 surface according to actual needs, it is possible to measure the temperature of most areas on the surface of the substrate 11 and / or the heating layer 12, effectively expanding the temperature measurement range of the heating component 10.

[0067] The above is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heating component, characterized in that: include: a substrate for accommodating an aerosol-generating matrix; a heating layer, disposed on the surface of the substrate; The heating layer is an infrared heating layer, which is used to radiate infrared rays when powered on to heat and atomize the aerosol generating matrix; A temperature measuring layer is arranged on the surface of the substrate and the heating layer, and the temperature measuring layer has a resistance temperature coefficient characteristic; the square resistance of the temperature measuring layer is 1Ω / □~5Ω / □, and the resistance temperature coefficient of the temperature measuring layer is 300ppm / ℃~3500ppm / ℃; the temperature measuring layer covers at least the highest temperature area of ​​the heating component, and the ratio of the area of ​​the temperature measuring layer to the area of ​​the infrared heating layer is 1:5-1:10; wherein, the temperature measuring layer arranged on the substrate is spaced apart from the heating layer and is arranged around the circumferential direction of the substrate; the temperature measuring layer arranged on the surface of the heating layer corresponds to the middle position of the substrate, and is arranged in a wave-like manner around the circumferential direction of the substrate.

2. The heating assembly according to claim 1, wherein The temperature measuring layer is arranged on the heating layer and is located on a surface on a side away from the substrate.

3. The heating assembly according to claim 1, wherein The temperature measuring layer is arranged on the surface of the substrate, and is located on the same surface of the substrate as the heating layer and is spaced apart from each other.

4. The heating assembly according to claim 1, wherein: The temperature measuring layer is arranged on the surface of the substrate, and the temperature measuring layer is located between the substrate and the heating layer.

5. The heating assembly according to claim 1, wherein: The temperature measuring layer is arranged on the surface of the substrate, and is arranged on a different surface from the heating layer.

6. The heating assembly according to claim 1, wherein The temperature measuring layer is arranged along the circumferential direction of the substrate.

7. The heating assembly according to claim 1 or 6, characterized in that: The temperature measuring layer is located at the end of the substrate.

8. The heating assembly according to claim 1 or 6, characterized in that: The temperature measuring layer is located in the middle of the substrate and is distributed in a wave-like manner along the circumferential direction of the substrate.

9. The heating assembly according to claim 1, wherein: The heating layer is an infrared ceramic coating.

10. The heating assembly according to claim 1, wherein The base is a hollow columnar body, and the heating layer is arranged on the outer surface of the base of the hollow columnar body.

11. The heating assembly according to claim 1, wherein The base is a hollow columnar body, and the heating layer is arranged on the inner surface of the base of the hollow columnar body.

12. The heating assembly according to claim 10, wherein: The heating layer and the temperature measuring layer are both arranged on the outer surface of the substrate by silk screen printing or coating, and the area of ​​the temperature measuring layer is smaller than that of the heating layer.

13. The heating assembly according to claim 10, wherein: The substrate is quartz.

14. An aerosol generating device, characterized in that include: A heating component, for heating and atomizing the aerosol-generating substrate when powered on; the heating component is a heating component according to any one of claims 1 to 13; a power supply component, connected to the heating component and used to supply power to the heating component; The controller is used to control the power supply component to supply power to the heating component, detect the resistance value of the temperature measuring layer in real time, and monitor the temperature of the heating component according to the resistance value.

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