Pressure Sensing Module, Pressure Sensing Detection Method, Device and Electronic Device

Abstract

The present application discloses a pressure sensing module, a pressure sensing detection method, a device and an electronic device, belonging to the technical field of electronic products. The pressure sensing module includes a pressure sensitive resistor layer and a pressing structure layer which are stacked. The pressing structure layer is provided with M grooves on a surface close to the pressure sensitive resistor layer, wherein the setting positions of the grooves correspond to the pressing detection points; the pressure sensitive resistor layer is electrically connected to a detection circuit, and the detection circuit outputs a voltage signal.

Description

Technical Field

[0001] This application belongs to the technical field of electronic products, and particularly relates to a pressure sensing module, a pressure sensing detection method, a device, and an electronic device. Background Art

[0002] Currently, most manufacturers of under-screen pressure sensing designs use the piezoresistive effect to detect the pressing pressure. The piezoresistive resistor changes its resistance under the action of pressure, and then the change in resistance is converted into an electrical signal through a Wheatstone bridge. After the electrical signal is converted into a digital signal by an ADC, it is sent to a processor for processing. As Figure 1 shown, it shows an existing under-screen pressure sensing module unit 100, where 101 is a mechanical component for fixing the strain resistor, 102, 103, 104, and 105 are strain resistors, and each pressure sensing module unit is a detection point. The pressure sensing module units are arranged in a certain manner (as Figure 2 shown), and the pressure conditions at various positions of the screen can be detected under the screen. When an object presses the screen, the deformation generated by the screen will be transmitted to the nearby pressure sensing units. After receiving the deformation, the pressure sensing units will send electrical signals to the processor, and the processor will deduce the pressing position based on the position of the pressed pressure sensing unit(s) by identifying which pressure sensing unit or units are pressed.

[0003] Currently, when used under a screen with strong rigidity, the pressure sensing module can provide insufficient pressure sensing feedback, resulting in poor sensitivity. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a pressure sensing module, a pressure sensing detection method, a device, and an electronic device, which can solve the problem of poor sensitivity of existing pressure sensing modules.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of this application provides a pressure sensing module, including: a piezoresistive resistor layer and a pressing structure layer arranged in a stacked manner. The pressing structure layer is provided with M grooves on a surface close to the piezoresistive resistor layer, where the setting positions of the grooves correspond to the pressing detection points;

[0007] The piezoresistive resistor layer is electrically connected to a detection circuit, and the detection circuit outputs a voltage signal.

[0008] In a second aspect, an embodiment of this application provides an electronic device, including a display screen and the pressure sensing module as described in the first aspect; wherein, the pressure sensing module is located inside the display screen and is laid flat in the entire sensing area.

[0009] In a third aspect, an embodiment of this application provides a pressure sensing detection method, which is applied to the electronic device as described in the second aspect, and the method includes:

[0010] Obtain the voltage signal output by the pressure sensing module;

[0011] Detect the pressure value received by the display screen of the electronic device according to the voltage signal.

[0012] In a fourth aspect, an embodiment of the present application provides a pressure sensing detection device, which is applied to the electronic device as described in the second aspect. The device includes:

[0013] An obtaining module, configured to obtain the voltage signal output by the pressure sensing module;

[0014] A detecting module, configured to detect the pressure value received by the display screen of the electronic device according to the voltage signal.

[0015] In a fifth aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or instruction stored on the memory and executable on the processor. When the program or instruction is executed by the processor, the steps of the method as described in the third aspect are implemented.

[0016] In a sixth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the method as described in the third aspect are implemented.

[0017] In a seventh aspect, an embodiment of the present application provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor, and the processor is configured to run a program or instruction to implement the method as described in the third aspect.

[0018] In the embodiment of the present application, the pressure sensing module includes a pressure-sensitive resistor layer and a pressing structure layer arranged in a stacked manner. The pressing structure layer is provided with M grooves on a surface close to the pressure-sensitive resistor layer. Among them, the setting positions of the grooves correspond to the pressing detection points; the pressure-sensitive resistor layer is electrically connected to the detection circuit, and the detection circuit outputs a voltage signal. Further, according to the voltage signal, the pressure value received by the display screen of the electronic device can be detected. In the embodiment of the present application, by adding a pressing structure layer and providing M grooves corresponding to the pressing detection points on a surface close to the pressure-sensitive resistor layer, in this way, when the pressure-sensitive resistor layer is pressed, the groove structure can increase the deformation amount of the pressure-sensitive resistor, thereby improving the sensitivity of the pressure sensing module. Description of the Drawings

[0019] Figure 1 A schematic structural diagram showing an existing pressure sensing module unit;

[0020] Figure 2 A schematic layout diagram showing an existing pressure sensing module unit;

[0021] Figure 3 One of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention;

[0022] Figure 4 Two of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention;

[0023] Figure 5 Three of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention;

[0024] Figure 6 Four of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention;

[0025] Figure 7 Five of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention;

[0026] Figure 8 Six of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention.

[0027] Figure 9 Seven of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention;

[0028] Figure 10 Eight of the schematic structural diagrams of the pressure sensing module according to an embodiment of the present invention.

[0029] Figure 11 Schematic diagram of the processing architecture of the electronic device according to an embodiment of the present invention;

[0030] Figure 12 Flowchart of the pressure sensing detection method according to an embodiment of the present invention;

[0031] Figure 13 Schematic diagram of the structure of the pressure sensing detection device according to an embodiment of the present invention;

[0032] Figure 14 Schematic block diagram of the electronic device according to an embodiment of the present invention;

[0033] Figure 15 Schematic diagram of the hardware structure of the electronic device according to an embodiment of the present invention.

[0034] Explanation of reference numerals:

[0035] 201 - First elastic layer; 202 - Second elastic layer; 200 - Varistor layer; 311 - First analog switch; 312 - First varistor; 313, 413 - Conducting wires; 314 - First fixing member; 411 - Second analog switch; 412 - Second varistor; 414 - Second fixing member; 501 - Third elastic layer; 502 - Fourth elastic layer; 503 - Fifth elastic layer; R1 - First resistor; R2 - Second resistor; R3 - Third resistor; R4 - Fourth resistor; R5 - Fifth resistor; R6 - Sixth resistor; V1 - First power supply; V2 - Second power supply; △u1 - First voltage signal; △u2 - Second voltage signal. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0037] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the associated objects before and after.

[0038] Next, in conjunction with the accompanying drawings, the control method provided by the embodiments of the present application will be described in detail through specific embodiments and their application scenarios.

[0039] An embodiment of the present invention provides a pressure sensing module, including: a varistor layer and a pressing structure layer arranged in a stacked manner, wherein the pressing structure layer is provided with M grooves on a surface close to the varistor layer, and the positions of the grooves correspond to the pressing detection points; the varistor layer is electrically connected to a detection circuit, and the detection circuit outputs a voltage signal; the voltage signal is used to detect the magnitude of the pressing force received by the varistor.

[0040] In this embodiment, by adding a pressing structure layer and providing M grooves on a surface close to the varistor layer, and making the positions of the grooves correspond to the pressing detection points, in this way, when the varistor layer is pressed, the groove structure can increase the deformation amount of the varistor, thereby improving the sensitivity of the pressure sensing module.

[0041] Such as Figure 3 and Figure 4As shown, in one embodiment, the pressing structure layer includes: a first elastic layer 201 and a second elastic layer 202; wherein, the piezoresistive layer 200 is clamped between the first elastic layer 201 and the second elastic layer 202;

[0042] Wherein, on one side of the first elastic layer 201 and the second elastic layer 202 close to the piezoresistive layer, grooves are provided. For each elastic layer, a convex structure is formed between the two grooves; the grooves on the first elastic layer are arranged in a staggered manner with the grooves on the second elastic layer, and the grooves on the first elastic layer 201 are opposite to the convex structures on the second elastic layer 202, as Figure 3 shown, which shows a cross-sectional schematic diagram when not pressed, as Figure 4 shown, which shows a cross-sectional schematic diagram after deformation due to pressing.

[0043] In this embodiment, through the structural cooperation of the grooves and the protrusions, the sensitivity of the piezoresistive module can be further increased. As Figures 5 to 7 shown, the detection circuit includes: a first detection circuit and a second detection circuit; the piezoresistive layer 200 includes: a first resistance layer and a second resistance layer arranged in a stacked manner;

[0044] Refer to Figure 6 , the first resistance layer includes N first piezoresistors 312 arranged in parallel along a first direction, and the first ends of the N first piezoresistors 312 are connected to a first analog switch 311, and the first analog switch 311 is connected to the second ends of the N first piezoresistors 312 through the first detection circuit;

[0045] Refer to Figure 7 , the second resistance layer includes N second piezoresistors 412 arranged in parallel along a second direction, and the first ends of the N second piezoresistors 412 are connected to a second analog switch 411, and the second analog switch 411 is connected to the second ends of the N second piezoresistors 412 through the second detection circuit;

[0046] Wherein, refer to Figure 5 , the pressing detection point is the position where the first piezoresistor and the second piezoresistor intersect; the first direction and the second direction are perpendicular to each other; and the voltage signals include: a first voltage signal and a second voltage signal respectively output by the first detection circuit and the second detection circuit.

[0047] Specifically, the first piezoresistor 312 and the second piezoresistor 412 are strip-shaped or filamentous with a first length; wherein, the first length is set according to the size of the pressure sensing area.

[0048] It should be noted that Figures 5 to 7The quantities of the first varistor 312 and the second varistor 412 shown are only examples, and the specific value of N can be set according to the requirements of the detection area and the number of detection points.

[0049] It should be noted that the first resistance layer and the second resistance layer are discrete and insulated from each other.

[0050] In this embodiment, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N first varistors 312 to be connected to the first detection circuit in sequence; the second analog switch 411 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N second varistors 412 to be connected to the second detection circuit; when a varistor is pressed, the first voltage signal output by the first detection circuit and the second voltage signal output by the second detection circuit can be used to detect the magnitude of the pressure value; since N first varistors 312 and N second varistors 412 arranged perpendicular to each other can respectively feedback the coordinates in the X-axis and Y-axis directions, therefore, by obtaining the switch states of the N switches in the first analog switch 311 and the second analog switch 411 corresponding to when the pressure value is detected, the specific pressing position can be determined.

[0051] Further, as Figures 8 to 10 shown, in an embodiment, the pressure sensing module includes: a third elastic layer 501, a fourth elastic layer 502, and a fifth elastic layer 503; wherein, the fourth elastic layer 502, the first resistance layer, the third elastic layer 501, the second resistance layer, and the fifth elastic layer 503 are sequentially stacked;

[0052] The third elastic layer 501 is provided with M first grooves arranged in parallel along the second direction on a surface close to the first resistance layer; the fourth elastic layer 502 is provided with M second grooves arranged in parallel along the second direction on a surface close to the first resistance layer; the first grooves and the second grooves are arranged in a staggered manner;

[0053] The third elastic layer 501 is provided with M third grooves arranged in parallel along the first direction on a surface close to the second resistance layer; the fifth elastic layer 503 is provided with M fourth grooves arranged in parallel along the first direction on a surface close to the second resistance layer; the third grooves and the fourth grooves are arranged in a staggered manner.

[0054] As Figure 8 shown, it shows an exploded view of the fourth elastic layer 502, the first resistance layer, the third elastic layer 501, the second resistance layer, and the fifth elastic layer 503 sequentially stacked;

[0055] Exemplarily, asFigure 9 and 10 As shown in the cross-sectional schematic diagram in, when the pressure-sensitive module is subjected to a pressing force in the direction shown by the arrow, the first resistance layer and the second resistance layer change from the Figure 9 state before being stressed to the Figure 10 state when being stressed. As shown in Figure 10 , both the first resistance layer and the second resistance layer undergo large deformation amounts, thereby increasing the sensitivity of the pressure-sensitive module.

[0056] In this embodiment, after the screen is pressed, the deformation of the screen is transmitted to the pressure-sensitive module. The third elastic layer 510 with grooves on both middle sides, the fourth elastic layer 502 with grooves on the upper side, and the fifth elastic layer 503 with grooves on the upper side can all generate certain deformations when stressed and return to their original states when not stressed due to their certain elasticity. After being stressed, this mechanism will press downward, causing the middle pressure-sensitive resistor to deform. Compared with the ordinary structure, this structure can increase the deformation amount of the pressure-sensitive resistor in the pressing area, and the pressure applied to the screen is correspondingly reduced when the same deformation is achieved. Therefore, the sensitivity of the pressure-sensitive module can be improved.

[0057] Furthermore, as shown in Figure 6 , in an embodiment, the pressure-sensitive module further includes: a first fixing member 314; wherein, both ends of the N first pressure-sensitive resistors 312 are fixedly connected to the fourth elastic layer 502 or the third elastic layer 501 through the first fixing member 314.

[0058] A second fixing member 414; wherein, both ends of the N second pressure-sensitive resistors 412 are fixedly connected to the fifth elastic layer 503 or the third elastic layer 501 through the second fixing member 414.

[0059] In this embodiment, the first fixing member 314 is used to straighten and fix the N first pressure-sensitive resistors 312 at both ends of the fourth elastic layer 502 or the third elastic layer 501, and the second fixing member 413 is used to straighten and fix the N first pressure-sensitive resistors 412 at both ends of the fifth elastic layer 502 or the third elastic layer 501, thereby fixing the positions of the first resistance layer and the second resistance layer and avoiding large deformations that cannot occur due to the position movement of the first resistance layer and the second resistance layer.

[0060] As shown in Figure 3 , in an embodiment, the first detection circuit includes: a first resistor R1, a second resistor R2, and a third resistor R3 connected in series in sequence; one end of the first resistor R1 away from the second resistor R2 is connected to one end of a first power supply V1; the other end of the second resistor R2 away from the first resistor R1 is connected to the other end of the first power supply V1;

[0061] Output the first voltage signal △u1 between the first connection point and the second connection point; wherein the first connection point is the connection point between the first resistor R1 and the second resistor R2, and the second connection point is the connection point between the third resistor R3 and the first varistor 312;

[0062] One end of the first resistor R1 far from the second resistor R2 is also connected to the first analog switch 311, and one end of the third resistor R3 far from the second resistor R2 is connected to the second ends of the N first varistors 312.

[0063] As Figure 3 As shown, in one embodiment, the second detection circuit includes: a fourth resistor R4, a fifth resistor R5, and a sixth resistor R6 connected in series in sequence; one end of the fourth resistor R4 far from the fifth resistor R5 is connected to one end of the second power supply V2; one end of the fifth resistor R5 far from the fourth resistor 54 is connected to the other end of the second power supply V2;

[0064] Output the second voltage signal △u2 between the third connection point and the fourth connection point; wherein the third connection point is the connection point between the fourth resistor R4 and the fifth resistor R5, and the fourth connection point is the connection point between the sixth resistor R6 and the second varistor 412;

[0065] One end of the fourth resistor R4 far from the fifth resistor R5 is connected to the second analog switch 411, and one end of the sixth resistor R6 far from the fifth resistor R5 is connected to the second ends of the N second varistors 412.

[0066] Wherein, 313 and 413 are both wires, and only examples are marked in the figure.

[0067] It should be noted that, in order to reduce the calculation amount, the resistance values of the first resistor, the second resistor, the third resistor, the fourth resistor, the fifth resistor, and the sixth resistor are the same; the first power supply V1 and the second power supply V2 are the power supplies input to the Wheatstone bridge and can also be set to be equal.

[0068] The first detection circuit and the second detection circuit are Wheatstone bridges. By detecting the voltage (the first voltage signal) across the series-connected second resistor R2 and third resistor R3, the resistance value change of the first varistor 312 connected to the first detection circuit can be detected, so as to judge whether the first varistor 312 is pressed; similarly, by detecting the voltage (the second voltage signal) across the series-connected second four-resistor R4 and fifth resistor R5, the resistance value change of the second varistor 412 connected to the second detection circuit can be detected, so as to judge whether the second varistor 412 is pressed.

[0069] In the above solution, a pressing structure with grooves is provided, which increases the deformation amount of the piezoresistor and improves the sensitivity of the pressure-sensitive module; the perpendicular layout of the piezoresistors can accurately locate the position of the pressing point by scanning the states of the piezoresistors.

[0070] The present invention also provides an electronic device, including a display screen and the pressure-sensitive module as described above; wherein, the pressure-sensitive module is located inside the display screen and is laid flat in the entire sensing area.

[0071] Wherein, the electronic device further includes: a processor, configured to obtain the voltage signal output by the pressure-sensitive module and detect the pressure value received by the display screen according to the voltage signal; specifically, the processor is a central processing unit MCU. After the voltage signal is amplified by an operational amplifier OPA and then processed by an analog-to-digital conversion module ADC, it is input into the MCU. The MCU calculates the pressure value received by the display screen according to the processed voltage signal.

[0072] In this embodiment, the sizes of the piezoresistor layer and the pressing structure layer, the number of grooves, and the number selections of the first piezoresistor 312 and the second piezoresistor 412 in the pressure-sensitive module, as well as the interval distances between two first piezoresistors 312 and between two second piezoresistors 412 can be selected and adjusted according to the needs of the detection area and detection performance, and finally the pressure-sensitive module is laid flat in the entire under-screen sensing area. Through this embodiment, when the display screen is pressed, the pressing structure with grooves in the pressure-sensitive module can increase the deformation amount of the piezoresistor, thereby improving the sensitivity of the pressure-sensitive module.

[0073] Furthermore, the pressing structure layer includes: a third elastic layer, a fourth elastic layer, and a fifth elastic layer; wherein, when the fourth elastic layer, the first resistor layer, the third elastic layer, the second resistor layer, and the fifth elastic layer are stacked in sequence, when the display screen is pressed, the pressing force is transmitted to one or more first piezoresistors 312 and second piezoresistors 412, causing the first piezoresistors 312 and the second piezoresistors 412 to deform. The magnitude of the pressure value can be detected through the first voltage signal output by the first detection circuit and the second voltage signal output by the second detection circuit; moreover, since N first piezoresistors 312 and N second piezoresistors 412 arranged perpendicular to each other can respectively feedback the coordinates in the X-axis and Y-axis directions, therefore, by obtaining the switch states of N switches in the corresponding first analog switch 311 and second analog switch 411 when the pressure value is detected, the specific pressing position can be determined.

[0074] Wherein, the electronic device obtains the first voltage signal and the second voltage signal through the processor; and detects the pressure value received by the display screen according to the first voltage signal and the second voltage signal.

[0075] Exemplarily, as Figure 11 shown, the processor is a central processing unit MCU. After the first voltage signal △u1 and the second voltage signal △u2 are amplified by the operational amplifier OPA respectively, and then processed by the analog-to-digital conversion module ADC, they are input into the MCU. The MCU calculates the pressure value received by the display screen according to the processed first voltage signal and second voltage signal.

[0076] Furthermore, in one embodiment, as Figure 11 shown, the processor is communicatively connected to the first analog switch and the second analog switch respectively through a data bus; the processor controls the N analog switches in the first analog switch 311 to close in sequence and controls the N analog switches in the second analog switch 411 to close in sequence by outputting an electrical signal; wherein, the N analog switches in the first analog switch 311 are respectively used to control N first varistors 312 to be connected to the first detection circuit, and the N analog switches in the second analog switch 411 are respectively used to control N second varistors 412 to be connected to the second detection circuit;

[0077] The processor determines the pressing position corresponding to the pressure value according to the switching states of the N analog switches in the first analog switch 311 and the second analog switch 411 when the pressure value is received correspondingly.

[0078] In this embodiment, the processor MCU communicates with the first analog switch 311 and the second analog switch 411 through a data bus, can control N first varistors 312 and N second varistors 412 to be connected to the bridge (the first detection circuit and the second detection circuit) in sequence, and can also determine the coordinates of the pressing position according to the first varistors 312 and the second varistors 412 currently connected to the circuit.

[0079] It should be noted that the structure of this varistor module can be used not only for the detection of under-screen pressure sensing, but also for the detection of mobile device keys.

[0080] As Figure 12 shown, the present invention also provides a pressure sensing detection method, which is applied to the electronic device as described above. The method includes:

[0081] Step 101, obtaining the voltage signal output by the pressure sensing module;

[0082] Step 102, detecting the pressure value received by the display screen of the electronic device according to the voltage signal.

[0083] Specifically, the voltage signal includes: the first voltage signal and the second voltage signal respectively output by the first detection circuit and the second detection circuit. In one embodiment, the above method further includes:

[0084] Determine the switch states corresponding to N analog switches among the first analog switch and the second analog switch when the pressure value is detected according to the electrical signals output from the electronic device to the first analog switch and the second analog switch;

[0085] Determine the pressing position corresponding to the pressure value according to the switch states.

[0086] In this embodiment, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N first piezoresistors 312 to be sequentially connected to the first detection circuit; the second analog switch 411 also includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N second piezoresistors 412 to be connected to the second detection circuit; when a piezoresistor is pressed, by acquiring the first voltage signal output from the first detection circuit and the second voltage signal output from the second detection circuit, the magnitude of the pressure value can be detected; since N first piezoresistors 312 and N second piezoresistors 412 arranged perpendicular to each other can respectively feedback the coordinates in the X-axis and Y-axis directions, therefore, when the pressure value is detected according to the first voltage signal and the second voltage signal, by obtaining the switch states of the N switches in the corresponding first analog switch 311 and second analog switch 411 when the pressure value is detected, the specific pressing position can be determined.

[0087] It should be noted that for the pressure sensing detection method provided in the embodiments of the present application, the execution subject may be a pressure sensing detection device, or a control module in the pressure sensing detection device for executing the pressure sensing detection method. In the embodiments of the present application, the pressure sensing detection method is executed by the pressure sensing detection device as an example to illustrate the pressure sensing detection device provided in the embodiments of the present application.

[0088] As Figure 13 shown, the present invention also provides a pressure sensing detection device, which is applied to the electronic device as described above. The device 1300 includes:

[0089] An acquisition module 1301, configured to acquire a voltage signal output by a pressure sensing module;

[0090] A detection module 1302, configured to detect the pressure value received by the display screen of the electronic device according to the voltage signal.

[0091] Optionally, the voltage signal includes: a first voltage signal and a second voltage signal respectively output by a first detection circuit and a second detection circuit; the device 1300 further includes:

[0092] A first determination module, configured to determine, according to the electrical signals output by the electronic device to the first analog switch 311 and the second analog switch 411, the switch states of N analog switches in the first analog switch 311 and the second analog switch 411 when the pressure value is detected;

[0093] A second determination module, configured to determine the pressing position corresponding to the pressure value according to the switch states.

[0094] In the device 1300, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N first piezoresistors 312 to be sequentially connected to the first detection circuit; the second analog switch 411 both includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N second piezoresistors 412 to be connected to the second detection circuit; when a piezoresistor is pressed, by acquiring a first voltage signal output by the first detection circuit and a second voltage signal output by the second detection circuit, the magnitude of the pressure value can be detected; since N first piezoresistors 312 and N second piezoresistors 412 arranged perpendicular to each other can respectively feedback the coordinates in the X-axis and Y-axis directions, therefore, by obtaining the switch states of the N switches in the corresponding first analog switch 311 and second analog switch 411 when the pressure value is detected, the specific pressing position can be determined.

[0095] The pressure sensing device in the embodiments of the present application may be a device, or a component, an integrated circuit, or a chip in a terminal. The device may be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device may be a mobile phone, a tablet computer, a laptop computer, a handheld computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and the non-mobile electronic device may be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc., and the embodiments of the present application do not make specific limitations.

[0096] The pressure sensing device in the embodiments of the present application may be a device with an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, and the embodiments of the present application do not make specific limitations.

[0097] The pressure sensing detection device provided by the embodiment of the present application can implement Figure 12 each process implemented by the method embodiment. To avoid repetition, it will not be elaborated here.

[0098] Optionally, as Figure 14 shown, the embodiment of the present application further provides an electronic device 1400, including a processor 1401, a memory 1402, a program or instruction stored on the memory 1402 and executable on the processor 1401. When the program or instruction is executed by the processor 1401, it implements each process of the above-mentioned pressure sensing detection method embodiment and can achieve the same technical effect. To avoid repetition, it will not be elaborated here.

[0099] It should be noted that the electronic device in the embodiment of the present application includes the above-mentioned mobile electronic device and non-mobile electronic device.

[0100] Figure 15 Schematic diagram of the hardware structure of an electronic device for implementing the embodiment of the present application.

[0101] The electronic device 1500 includes but is not limited to: a radio frequency unit 1501, a network module 1502, an audio output unit 1503, an input unit 1504, a sensor 1505, a display unit 106, a user input unit 1507, an interface unit 1508, a memory 1509, and a processor 1510 and other components.

[0102] Those skilled in the art can understand that the electronic device 1500 may further include a power supply (such as a battery) for supplying power to each component. The power supply can be logically connected to the processor 1510 through a power management system, so as to realize functions such as management of charging, discharging, and power consumption management through the power management system. Figure 15 The structure of the electronic device shown in does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements, which will not be elaborated here.

[0103] Among them, the processor 1510 is used to obtain the voltage signal output by the pressure sensing module;

[0104] According to the voltage signal, detect the pressure value received by the display screen of the electronic device.

[0105] Optionally, the voltage signal includes: a first voltage signal and a second voltage signal; the processor 1510 is further used to: determine, according to the electrical signals output by the electronic device to the first analog switch 311 and the second analog switch 411, the switch states of N analog switches in the first analog switch 311 and the second analog switch 411 when the pressure value is detected; and determine the pressing position corresponding to the pressure value according to the switch states.

[0106] In the electronic device, the first analog switch 311 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N first varistors 312 to be sequentially connected to the first detection circuit; the second analog switch 411 includes N analog switches, and the N analog switches are sequentially switched off at a certain frequency, respectively used to correspondingly control N second varistors 412 to be connected to the second detection circuit; when a varistor is pressed, by obtaining a first voltage signal output by the first detection circuit and a second voltage signal output by the second detection circuit, the magnitude of the pressure value can be detected; since N first varistors 312 and N second varistors 412 arranged perpendicular to each other can respectively feedback the coordinates in the X-axis and Y-axis directions, therefore, by obtaining the switch states of the N switches in the corresponding first analog switch 311 and second analog switch 411 when the pressure value is detected, the specific pressing position can be determined.

[0107] It should be understood that in the embodiment of the present application, the input unit 1504 may include a Graphics Processing Unit (GPU) 15041 and a microphone 15042. The graphics processor 15041 processes the image data of static pictures or videos obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode. The display unit 1506 may include a display panel 15061, and the display panel 15061 may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 1507 includes a touch panel 15071 and other input devices 15072. The touch panel 15071 is also called a touch screen. The touch panel 15071 may include two parts: a touch detection device and a touch controller. The other input devices 15072 may include but are not limited to a physical keyboard, function keys (such as volume control keys, power on / off keys, etc.), a trackball, a mouse, a joystick, which will not be elaborated here. The memory 1509 can be used to store software programs and various data, including but not limited to application programs and operating systems. The processor 1510 may integrate an application processor and a modem processor. Among them, the application processor mainly processes the operating system, user interface, application programs, etc., and the modem processor mainly processes wireless communication. It can be understood that the above-mentioned modem processor may not be integrated into the processor 1510.

[0108] The embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, it realizes each process of the above-mentioned pressure sensing detection method embodiment and can achieve the same technical effect. To avoid repetition, it will not be elaborated here.

[0109] Among them, the processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disc.

[0110] Another embodiment of the present application provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor. The processor is used to run programs or instructions to implement each process of the pressure sensing detection method embodiment described above, and can achieve the same technical effects. To avoid repetition, it will not be elaborated here.

[0111] It should be understood that the chip mentioned in the embodiments of the present application may also be referred to as a system-on-chip, system chip, chip system, or system-on-chip, etc.

[0112] It should be noted that in this article, the term "including", "comprising", or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article, or device. Without further limitation, the element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article, or device including that element. In addition, it should be pointed out that the methods and devices in the embodiments of the present application are not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0113] Through the description of the above embodiments, those skilled in the art can clearly understand that the methods in the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. The computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disc) and includes several instructions to enable a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present application.

[0114] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the specific embodiments described above. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. A pressure sensing module, characterized in that, Comprising: A varistor layer and a pressing structure layer arranged in a stacked manner. The pressing structure layer is provided with M grooves on a surface close to the varistor layer. Among them, the arrangement positions of the grooves correspond to the pressing detection points; The varistor layer is electrically connected to a detection circuit, and the detection circuit outputs a voltage signal; Among them, the pressing structure layer includes: a first elastic layer and a second elastic layer; among them, the varistor layer is clamped between the first elastic layer and the second elastic layer; Among them, a raised structure is formed between two of the grooves; the grooves on the first elastic layer and the grooves on the second elastic layer are arranged in a staggered manner, and the grooves on the first elastic layer are opposite to the raised structures on the second elastic layer.

2. The pressure sensing module according to claim 1, wherein The varistor layer includes: a first resistor layer and a second resistor layer arranged in a stacked manner; the detection circuit includes: a first detection circuit and a second detection circuit; among them, The first resistor layer includes N first varistors arranged in parallel along a first direction, and the first ends of the N first varistors are connected to a first analog switch, and the first analog switch is connected to the second ends of the N first varistors through the first detection circuit; The second resistor layer includes N second varistors arranged in parallel along a second direction, and the first ends of the N second varistors are connected to a second analog switch, and the second analog switch is connected to the second ends of the N second varistors through the second detection circuit; among them, the pressing detection point is the position where the first varistor intersects with the second varistor; The first direction is perpendicular to the second direction; and the voltage signal includes: a first voltage signal and a second voltage signal respectively output by the first detection circuit and the second detection circuit.

3. The pressure sensing module according to claim 2, wherein The pressing structure layer includes: a third elastic layer, a fourth elastic layer and a fifth elastic layer; among them, the fourth elastic layer, the first resistor layer, the third elastic layer, the second resistor layer and the fifth elastic layer are sequentially arranged in a stacked manner; The third elastic layer is provided with M first grooves arranged in parallel along the second direction on a surface close to the first resistor layer; the fourth elastic layer is provided with M second grooves arranged in parallel along the second direction on a surface close to the first resistor layer; the first grooves and the second grooves are arranged in a staggered manner; The third elastic layer is provided with M third grooves arranged in parallel along the first direction on a surface close to the second resistor layer; the fifth elastic layer is provided with M fourth grooves arranged in parallel along the first direction on a surface close to the second resistor layer; the third grooves and the fourth grooves are arranged in a staggered manner.

4. The pressure sensing module according to claim 3, wherein Further comprising: A first fixing member; among them, both ends of the N first varistors are fixedly connected to the fourth elastic layer or the third elastic layer through the first fixing member.

5. The pressure sensing module according to claim 3, characterized in that, Further comprising: A second fixing member; among them, both ends of the N second varistors are fixedly connected to the fifth elastic layer or the third elastic layer through the second fixing member.

6. The pressure sensing module according to claim 2, characterized in that, The first detection circuit includes: a first resistor, a second resistor, and a third resistor connected in series in sequence; one end of the first resistor away from the second resistor is connected to one end of a first power supply; the other end of the second resistor away from the first resistor is connected to the other end of the first power supply; A first voltage signal is output between a first connection point and a second connection point; wherein the first connection point is the connection point between the first resistor and the second resistor, and the second connection point is the connection point between the third resistor and the first varistor; The end of the first resistor away from the second resistor is further connected to the first analog switch, and the end of the third resistor away from the second resistor is connected to the second ends of the N first varistors.

7. The pressure sensing module according to claim 2, wherein The second detection circuit includes: a fourth resistor, a fifth resistor, and a sixth resistor connected in series in sequence; one end of the fourth resistor away from the fifth resistor is connected to one end of a second power supply; the other end of the fifth resistor away from the fourth resistor is connected to the other end of the second power supply; A second voltage signal is output between a third connection point and a fourth connection point; wherein the third connection point is the connection point between the fourth resistor and the fifth resistor, and the fourth connection point is the connection point between the sixth resistor and the second varistor; The end of the fourth resistor away from the fifth resistor is connected to the second analog switch, and the end of the sixth resistor away from the fifth resistor is connected to the second ends of the N second varistors.

8. The pressure sensing module according to claim 2, wherein The first varistor and the second varistor are strip-shaped or filament-shaped with a first length; Wherein, the first length is set according to the size of the pressure sensing area.

9. An electronic device, characterized in that, It includes a display screen and the pressure sensing module as described in any one of claims 1 to 8; wherein, the pressure sensing module is located inside the display screen and is laid flat in the entire sensing area.

10. A pressure sensing detection method, characterized in that, Applied to the electronic device as described in claim 9, the method includes: Obtaining the voltage signal output by the pressure sensing module; Detecting the pressure value received by the display screen of the electronic device according to the voltage signal.

11. The pressure sensing detection method according to claim 10, wherein The voltage signal includes: a first voltage signal and a second voltage signal respectively output by the first detection circuit and the second detection circuit; The method further includes: Determining, according to the electrical signals output by the electronic device to the first analog switch and the second analog switch, the switch states of the N-way analog switches in the first analog switch and the second analog switch when the pressure value is detected; Determining the pressing position corresponding to the pressure value according to the switch states.

12. A pressure sensing device, characterized in that, Applied to the electronic device as described in claim 9, the device includes: An obtaining module, configured to obtain the voltage signal output by the pressure sensing module; A detecting module, configured to detect the pressure value received by the display screen of the electronic device according to the voltage signal.

13. The pressure sensing detection device according to claim 12, characterized in that, The voltage signal includes: a first voltage signal and a second voltage signal respectively output by the first detection circuit and the second detection circuit; The device further includes: A first determination module, configured to determine, according to electrical signals output by the electronic device to a first analog switch and a second analog switch, switch states corresponding to N analog switches in the first analog switch and the second analog switch when the pressure value is detected; A second determination module, configured to determine a pressing position corresponding to the pressure value according to the switch states.

14. An electronic device, characterized in that, It includes a processor, a memory, and a program or instruction stored on the memory and executable on the processor. When the program or instruction is executed by the processor, the steps of the pressure sensing detection method as claimed in claim 10 or 11 are implemented.

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