Carrying sheet box

Abstract

This invention discloses a wafer carrier cassette, comprising: a carrier frame, the carrier frame including clamping arms, the clamping arms including a first clamping arm and a second clamping arm spaced apart in a horizontal direction, defining a clamping space between the first clamping arm and the second clamping arm, the silicon wafer being adapted to be placed within the clamping space, and the first clamping arm and the second clamping arm abutting against the two side surfaces of the silicon wafer in the thickness direction. According to the wafer carrier cassette of this invention, by providing the first and second clamping arms spaced apart in a horizontal direction, and by having both the first and second clamping arms abutting against the two side surfaces of the silicon wafer in the thickness direction, the edges of the silicon wafer do not contact the carrier frame, avoiding uneven corrosion and cleaning at the wafer edges, thereby ensuring uniform morphology around the wafer edges and preventing damage caused by contact between the wafer edges and the carrier frame.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a carrier die. Background Technology

[0002] Related technologies indicate that contamination, surface damage, and unsatisfactory gloss levels can occur after silicon wafers are sliced, affecting product quality. Etching and cleaning are necessary. However, etching and cleaning silicon wafers placed in a wafer cassette cannot guarantee uniform morphology and thickness around the wafers. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a wafer carrier box, which has a simple structure and is conducive to uniform morphology around the silicon wafer during etching and cleaning.

[0004] According to the present invention, the wafer carrier includes a support frame, the support frame including clamping arms, the clamping arms including a first clamping arm and a second clamping arm spaced apart in a horizontal direction, the first clamping arm and the second clamping arm defining a clamping space, the silicon wafer being adapted to be placed in the clamping space, and the first clamping arm and the second clamping arm abutting against the two side surfaces of the silicon wafer in the thickness direction.

[0005] According to the present invention, the carrier wafer cassette is provided with a first clamping arm and a second clamping arm arranged at intervals in the horizontal direction, and both the first clamping arm and the second clamping arm abut against the two side surfaces of the silicon wafer in the thickness direction, so that the edge of the silicon wafer does not contact the carrier frame, ensuring that the silicon wafer can be vertically suspended in the carrier frame. When cleaning and etching the silicon wafer, it avoids different degrees of etching and cleaning at the edge of the silicon wafer, thereby ensuring that the morphology around the edge of the silicon wafer is uniform and avoiding damage caused by the edge of the silicon wafer contacting the carrier frame.

[0006] In some embodiments, the first clamping arm includes a first fixing portion, and the second clamping arm includes a second fixing portion arranged opposite to the first fixing portion. The clamping space is defined between the first fixing portion and the second fixing portion, and the distance between the first fixing portion and the second fixing portion gradually decreases and then gradually increases in the direction from one end of the clamping arm to the other end.

[0007] In some embodiments, the first fixing portion is formed as an arc-shaped plate recessed toward the direction where the second fixing portion is located, and the second fixing portion is formed as an arc-shaped plate recessed toward the direction where the first fixing portion is located.

[0008] In some embodiments, a first abutting surface is formed on the side surface of the first fixing part facing the second fixing part, the first abutting surface being a plane extending vertically, and a second abutting surface is formed on the side surface of the second fixing part facing the first fixing part, the second abutting surface being a plane extending vertically, and the two sides of the silicon wafer in the thickness direction abut against the first abutting surface and the second abutting surface, respectively.

[0009] In some embodiments, the first abutting surface and the second abutting surface are circular surfaces, and the diameter of either the first abutting surface or the second abutting surface is in the range of 10mm-50mm.

[0010] In some embodiments, the first clamping arm includes a first fixing portion, and the second clamping arm includes a second fixing portion arranged opposite to the first fixing portion. A first rib protruding toward the second fixing portion is formed on the first fixing portion, and a second rib protruding toward the first fixing portion is formed on the second fixing portion. The first rib and the second rib abut against the two side surfaces of the silicon wafer, and at least one of the first rib and the second rib includes at least two ribs arranged at intervals along the length direction of the clamping arm.

[0011] In some embodiments, the first rib and the second rib are formed in a ring shape, the diameter of the first rib being in the range of 5 mm to 20 mm, and the diameter of the second rib being in the range of 5 mm to 20 mm.

[0012] In some embodiments, the clamping arm further includes an elastic element connected between the first clamping arm and the second clamping arm, the elastic element always having a force that brings the first clamping arm and the second clamping arm closer to each other.

[0013] In some embodiments, the first clamping arm includes two first connecting segments respectively connected to both ends of the first fixing part along its length, and the second clamping arm includes two second connecting segments respectively connected to both ends of the second fixing part along its length. The two first connecting segments and the two second connecting segments correspond one-to-one and are arranged in parallel at intervals.

[0014] In some embodiments, the support frame includes a plurality of clamping arms, which are arranged parallel and spaced apart in the horizontal direction.

[0015] In some embodiments, the spacing between two adjacent clamping arms is in the range of 10mm-30mm.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a carrier sheet cassette according to an embodiment of the present invention;

[0018] Figure 2 yes Figure 1 A schematic diagram of the left view of the carrier cassette shown;

[0019] Figure 3 yes Figure 1 A schematic diagram of the clamping arm shown;

[0020] Figure 4 This is a schematic diagram of a clamping arm according to another embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the left view of a carrier film box according to yet another embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of a clamping arm according to another embodiment of the present invention.

[0023] Figure label:

[0024] Carrying film cassette 100,

[0025] Clamping arm 1,

[0026] First clamping arm 11, first fixing part 111, first connecting section 112, first protruding rib 113

[0027] Second clamping arm 12, second fixing part 121, second connecting section 122, second protruding rib 123

[0028] Clamping space 13,

[0029] Elastic element 14,

[0030] Box body 2, immersion chamber 21,

[0031] Anti-detachment frame 3, first rod 31, second rod 32. Detailed Implementation

[0032] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0033] The following is for reference. Figures 1-3 A carrier cartridge 100 according to an embodiment of the first aspect of the present invention is described.

[0034] like Figure 1As shown, the carrier cassette 100 according to a first aspect embodiment of the present invention includes a carrier frame.

[0035] Specifically, the support frame includes clamping arms 1, which includes a first clamping arm 11 and a second clamping arm 12 arranged at intervals in the horizontal direction. A clamping space 13 is defined between the first clamping arm 11 and the second clamping arm 12. The silicon wafer is adapted to be placed in the clamping space 13, and the first clamping arm 11 and the second clamping arm 12 abut against the two side surfaces of the silicon wafer in the thickness direction.

[0036] In other words, the clamping arm 1 includes a first clamping arm 11 and a second clamping arm 12, which are arranged at intervals in the horizontal direction. A clamping space 13 suitable for placing the silicon wafer is formed between the first clamping arm 11 and the second clamping arm 12. In order to ensure that the silicon wafer is suspended in the carrier wafer box 100, the two sides of the silicon wafer in the thickness direction abut against the first clamping arm 11 and the second clamping arm 12, respectively. Thus, when the silicon wafer is placed in the carrier frame, the edge of the silicon wafer is prevented from contacting the carrier frame, and the morphology around the edge of the silicon wafer is ensured to be uniform during cleaning and etching.

[0037] Reference Figure 1 As shown, in the horizontal direction, the first clamping arm 11 and the second clamping arm 12 are spaced apart in the front-to-back direction, and the clamping space 13 is formed between the first clamping arm 11 and the second clamping arm 12. The clamping space 13 is used to accommodate and clamp the silicon wafer. The first clamping arm 11 and the second clamping arm 12 abut against the two side surfaces of the silicon wafer in the thickness direction, so that the silicon wafer is vertically suspended in the support frame.

[0038] According to an embodiment of the present invention, the wafer carrier cassette 100, by providing first clamping arms 11 and second clamping arms 12 spaced apart in the horizontal direction, with both first clamping arms 11 and second clamping arms 12 abutting against the two side surfaces of the silicon wafer in the thickness direction, ensures that the edge of the silicon wafer does not contact the carrier frame, thus guaranteeing that the silicon wafer can be vertically suspended within the carrier frame. During cleaning and etching of the silicon wafer, this avoids uneven etching and cleaning at the wafer edge, thereby ensuring a uniform morphology around the edge of the silicon wafer and preventing damage caused by contact between the wafer edge and the carrier frame. This is particularly helpful for edge detection, such as slip line detection and minority carrier lifetime detection.

[0039] In some embodiments of the present invention, the first clamping arm 11 includes a first fixing portion 111, and the second clamping arm 12 includes a second fixing portion 121 arranged opposite to the first fixing portion 111. In the direction from one end of the clamping arm 1 to the other end, the distance between the first fixing portion 111 and the second fixing portion 121 first gradually decreases and then gradually increases. (Refer to...) Figure 3As shown, the first clamping arm 11 has a first fixing part 111, and the second clamping arm 12 has a second fixing part 121. The first fixing part 111 and the second fixing part 121 are arranged opposite to each other in the front-back direction. In the direction from the left end to the right end of the clamping arm 1, the distance between the first fixing part 111 and the second fixing part 121 first gradually decreases and then gradually increases, and the silicon wafer is clamped between the first fixing part 111 and the second fixing part 121. This avoids the edge of the silicon wafer from contacting the support frame, ensures the uniformity of the morphology of the silicon wafer edge etching and cleaning, and thus guarantees the quality of the silicon wafer.

[0040] In some embodiments of the present invention, the first fixing portion 111 is formed as an arc-shaped plate recessed toward the direction where the second fixing portion 121 is located, and the second fixing portion 121 is formed as an arc-shaped plate recessed toward the direction where the first fixing portion 111 is located. (Refer to...) Figure 3 As shown, the first fixing part 111 of the first clamping arm 11 faces the direction where the second fixing part 121 is located (e.g., Figure 1 The second fixing part 121 of the second clamping arm 12 is recessed (as shown in the rear direction), and the first fixing part 111 is formed into an arc-shaped plate. The second fixing part 121 of the second clamping arm 12 faces the direction where the first fixing part 111 is located (e.g., Figure 1 The first fixing part 111 and the second fixing part 121 are recessed (as shown in the front direction), and the second fixing part 121 is formed into an arc-shaped plate. As a result, the friction between the clamping arm 1 and the silicon wafer is reduced, and the first fixing part 111 and the second fixing part 121 have greater elasticity when deformed, which enhances the force of the clamping arm 1 against the silicon wafer.

[0041] In some embodiments of the present invention, a first abutting surface is formed on the side surface of the first fixing part 111 facing the second fixing part 121. The first abutting surface is a plane extending vertically. A second abutting surface is formed on the side surface of the second fixing part 121 facing the first fixing part 111. The second abutting surface is a plane extending vertically. The two sides of the silicon wafer in the thickness direction abut against the first abutting surface and the second abutting surface, respectively. That is, the first abutting surface is formed on the side surface of the first fixing part 111 facing the second fixing part 121 (e.g., Figure 1 The second abutment surface is formed on the rear surface of the first fixing part 111 (as shown), and the second abutment surface is formed on the side surface of the second fixing part 121 facing the first fixing part 111 (e.g., the rear surface of the first fixing part 111). Figure 1 The front surface of the second fixing part 121 shown is provided, and both the first abutment surface and the second abutment surface are formed as planes extending vertically. As a result, the two sides of the silicon wafer in the thickness direction abut against the first abutment surface and the second abutment surface, respectively, ensuring that the silicon wafer can be stably suspended in the support frame.

[0042] In some embodiments of the present invention, the first abutment surface and the second abutment surface are circular surfaces, and the diameter of either the first abutment surface or the second abutment surface is in the range of 10mm-50mm. It is well known that when the side length of a square and the diameter of a circle are equal, the area of ​​the circle is smaller. Therefore, by forming the first abutment surface and the second abutment surface as circular surfaces, the contact area between the clamping arm 1 and the silicon wafer is minimized as much as possible, ensuring that the degree of etching and cleaning of the silicon wafer is approximately the same, and improving the product quality of the silicon wafer.

[0043] Furthermore, in some embodiments, the diameter of the first abutment surface can be in the range of 10mm-50mm, the diameter of the second abutment surface can be in the range of 10mm-50mm, or both the diameters of the first and second abutment surfaces can be in the range of 10mm-50mm. The diameters of the first and second abutment surfaces can be the same or different. That is, the diameters of both the first and second abutment surfaces are in the range of 10mm-50mm, and their diameters are the same. This ensures that the degree of etching and cleaning on both sides of the silicon wafer in the thickness direction is the same, thereby ensuring a uniform morphology of the silicon wafer edge etching and cleaning.

[0044] For example, if the diameters of the first contact surface and the second contact surface are the same, then the diameters of the first contact surface and the second contact surface can be: 10mm, 15mm, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm, 50mm, etc.

[0045] In other embodiments of the present invention, the first clamping arm 11 includes a first fixing portion 111, and the second clamping arm 12 includes a second fixing portion 121 arranged opposite to the first fixing portion 111. The first fixing portion 111 has a first rib 113 protruding toward the second fixing portion 121, and the second fixing portion 121 has a second rib 123 protruding toward the first fixing portion 111. The first rib 113 and the second rib 123 respectively abut against the two side surfaces of the silicon wafer. At least one of the first rib 113 and the second rib 123 includes at least two ribs spaced apart along the length of the clamping arm 1. This improves the stability of the clamping arm 1 in holding the silicon wafer, ensures that the degree of etching and cleaning of the silicon wafer is approximately the same, and thus improves the product quality of the silicon wafer.

[0046] That is, a first protrusion 113 is formed on the first fixing part 111, the first protrusion 113 protrudes toward the second fixing part 121, and a second protrusion 123 is formed on the second fixing part 121, the second protrusion 123 protrudes toward the first fixing part 111. The first protrusion 113 and the second protrusion 123 abut against the two side surfaces of the silicon wafer in the thickness direction. In the length direction of the clamping arm 1, two first protrusions 113 can be arranged at intervals on the first fixing part 111 and one second protrusion 123 can be provided on the second fixing part 121, or one first protrusion 113 can be provided on the first fixing part 111 and two second protrusions 123 can be arranged at intervals on the second fixing part 121, or two first protrusions 113 can be arranged at intervals on the first fixing part 111 and two second protrusions 123 can be arranged at intervals on the second fixing part 121.

[0047] Reference Figure 4 As shown, two first ribs 113 are arranged at intervals on the first fixing part 111, and two second ribs 123 are arranged at intervals on the second fixing part 121. Raised rings are formed on both sides of the silicon wafer in the thickness direction. The first rib 113 contacts the raised ring on one side of the silicon wafer, and the second rib 123 contacts the raised ring on the other side of the silicon wafer. In this way, the contact area between the clamping arm 1 and the silicon wafer is reduced.

[0048] It should be noted that the length direction of the clamping arm 1 refers to the direction from the end of the clamping arm 1 connected to one side wall of the carrier plate box 100 to the other end of the clamping arm 1 connected to the other side wall of the carrier plate box 100.

[0049] Furthermore, the first rib 113 and the second rib 123 are formed into annular shapes, with the diameter of both the first rib 113 and the second rib 123 ranging from 5 mm to 20 mm. This allows for better clamping of the silicon wafer, preventing it from slipping out of the clamping arm 1.

[0050] For example, the diameter of the first rib 113 can be 5mm, 8mm, 11mm, 14mm, 17mm, 20mm, etc.; the diameter of the second rib 123 can be 5mm, 8mm, 11mm, 14mm, 17mm, 20mm, etc.

[0051] In some other embodiments of the invention, the clamping arm 1 further includes an elastic member 14, which is connected between the first clamping arm 11 and the second clamping arm 12, and the elastic member 14 always has a force that brings the first clamping arm 11 and the second clamping arm 12 closer together. (Refer to...) Figure 6As shown, an elastic element 14 is connected between one end of the first clamping arm 11 and one end of the second clamping arm 12, and an elastic element 14 is also connected between the other end of the first clamping arm 11 and the other end of the second clamping arm 12. The elastic element 14 keeps the first clamping arm 11 and the second clamping arm 12 close to each other. Thus, by setting the elastic element 14, the stability of the clamping arm 1 in clamping the silicon wafer is improved, and the silicon wafer is prevented from falling off the clamping arm 1.

[0052] Optionally, the elastic element 14 can be a spring, a rubber ring, etc.

[0053] In some embodiments of the present invention, since the thickness of the silicon wafer is between 1mm and 3mm, in order to ensure that the clamping arm 1 can stably clamp the silicon wafer, the distance between the first abutment surface and the second abutment surface is set to be in the range of 0mm-0.5mm. For example, the distance between the first abutment surface and the second abutment surface can be: 0mm, 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, etc.

[0054] In some embodiments of the present invention, the first clamping arm 11 includes two first connecting segments 112 respectively connected to both ends of the first fixing part 111 along its length, and the second clamping arm 12 includes two second connecting segments 122 respectively connected to both ends of the second fixing part 121 along its length. The two first connecting segments 112 and the two second connecting segments 122 are arranged in a one-to-one correspondence and parallel spacing. Thus, the first clamping arm 11 and the second clamping arm 12 have simple structures and ingenious designs, avoiding contact between the silicon wafer and the support frame, and ensuring uniform morphology of the silicon wafer edge etching and cleaning.

[0055] Reference Figure 3 As shown, the first clamping arm 11 includes two first connecting sections 112, which are respectively connected to the two ends of the first fixing part 111 in the length direction (e.g., Figure 1 The first fixing part 111 shown has two ends on the left and right sides. The second clamping arm 12 includes two second connecting sections 122, which are respectively connected to the two ends of the second fixing part 121 in the length direction (e.g., the left and right ends on the first fixing part 111 shown). Figure 1 (As shown, the left and right ends of the second fixing part 121) are connected by a first connecting segment 112 connected to the left end of the first fixing part 111 and a second connecting segment 122 connected to the left end of the second fixing part 121, which are arranged in parallel and spaced apart. The first connecting segment 112 connected to the right end of the first fixing part 111 and a second connecting segment 122 connected to the right end of the second fixing part 121 are also arranged in parallel and spaced apart.

[0056] Other embodiments, see reference to Figure 5As shown, the first clamping arm 11 includes three first connecting segments 112, which are respectively connected to the circumferential direction of the first fixing part 111. The second clamping arm 12 includes three second connecting segments 122, which are respectively connected to the circumferential direction of the second fixing part 121. The three first connecting segments 112 and the three second connecting segments 122 are arranged in a one-to-one correspondence and parallel spacing. Thus, by providing three connecting segments in one clamping arm, the clamping force of the clamping arm 1 is enhanced, and the silicon wafer is clamped more stably.

[0057] In some embodiments of the present invention, since the thickness of the silicon wafer is between 1mm and 3mm, in order to ensure that the silicon wafer does not contact the first clamping arm 11 and the second clamping arm 12, the distance between the first connecting segment 112 and the second connecting segment 122 is set to be in the range of 10mm-30mm. For example, the distance between the first connecting segment 112 and the second connecting segment 122 can be: 10mm, 12mm, 14mm, 16mm, 18mm, 20mm, 22mm, 24mm, 26mm, 28mm, 30mm, etc.

[0058] In some embodiments of the present invention, the support frame includes a plurality of clamping arms 1, which are arranged parallel and spaced apart in the horizontal direction. This allows for the simultaneous etching and cleaning of multiple silicon wafers, improving production efficiency and reducing production costs.

[0059] In some embodiments of the present invention, the distance between two adjacent clamping arms 1 is in the range of 10mm-30mm. For example, the distance between the first connecting segment 112 and the second connecting segment 122 can be: 10mm, 12mm, 14mm, 16mm, 18mm, 20mm, 22mm, 24mm, 26mm, 28mm, 30mm, etc.

[0060] In some embodiments of the present invention, the number of clamping arms 1 is in the range of 5 to 50. For example, the number of clamping arms 1 can be: 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, etc.

[0061] In some embodiments of the present invention, the carrier wafer cassette 100 further includes: a cassette body 2, the cassette body 2 defining an immersion cavity 21, a carrier frame disposed within the immersion cavity 21, and a silicon wafer suspended in the immersion cavity 21 by the carrier frame. (See also...) Figure 1 As shown, the interior of the box body 2 is an immersion chamber 21, and the support frame is located inside the immersion chamber 21. The top of the immersion chamber 21 is open to facilitate the placement of silicon wafers on the support frame. The silicon wafers are clamped by the clamping arms 1 of the support frame, thus suspending them within the immersion chamber 21. Therefore, the overall structure of the support wafer box 100 is simple, the difficulty of placing silicon wafers is low, it is easy for personnel to operate, and it improves production efficiency.

[0062] In some embodiments of the present invention, the wafer carrier cassette 100 further includes an anti-detachment frame 3, which is disposed within the immersion chamber 21 and located below the clamping arm 1. The anti-detachment frame 3 includes a first rod 31 and a second rod 32 extending along the thickness direction of the silicon wafer. The first rod 31 and the second rod 32 are arranged parallel to each other and spaced apart along the length direction of the first clamping arm 11, and the distance between the first rod 31 and the second rod 32 is smaller than the diameter of the silicon wafer. Therefore, the anti-detachment frame 3 prevents the silicon wafer from falling out of the wafer carrier cassette 100, thereby ensuring the quality of the etching and cleaning of the silicon wafer and improving the production efficiency of the silicon wafer.

[0063] Reference Figure 1 As shown, the first rod 31 and the second rod 32 extend in the front-to-back direction. The front ends of the first rod 31 and the second rod 32 are connected to the front sidewall of the housing body 2, and the rear ends of the first rod 31 and the second rod 32 are connected to the rear sidewall of the housing body 2. The first rod 31 and the second rod 32 are parallel and spaced apart in the left-to-right direction, and the diameter of the silicon wafer is greater than or equal to the distance between the first rod 31 and the second rod 32.

[0064] The following will refer to Figures 1-3 A carrier cartridge 100 according to a specific embodiment of the present invention is described.

[0065] Reference Figure 1 As shown, the carrier box 100 includes a carrier frame, a box body 2 and an anti-detachment frame 3. The box body 2 defines an immersion chamber 21. The carrier frame is disposed in the immersion chamber 21. The anti-detachment frame 3 is also disposed in the immersion chamber 21 and is located below the carrier frame. The anti-detachment frame 3 includes a first rod 31 and a second rod 32 that are arranged in parallel and spaced apart.

[0066] The support frame includes five clamping arms 1, which are evenly spaced in the front-back direction. Each clamping arm 1 includes a first clamping arm 11 and a second clamping arm 12. Each first clamping arm 11 includes a first fixing part 111 and two first connecting sections 112 connected to both ends of the first fixing part 111. Each second clamping arm 12 includes a second fixing part 121 and two second connecting sections 122 connected to both ends of the second fixing part 121. The distance between the first fixing part 111 and the second fixing part 121 gradually decreases and then gradually increases. The first fixing part 111 is formed as an arc-shaped plate concave towards the direction of the second fixing part 121. The second fixing part 121 is formed as an arc-shaped plate concave towards the direction of the first fixing part 111. A first abutting surface is formed on the side surface of the first fixing part 111 facing the second fixing part 121. A second abutting surface is formed on the side surface of the second fixing part 121 facing the first fixing part 111. Both the first abutting surface and the second abutting surface are formed as circular surfaces. The distance between the first abutting surface and the second abutting surface is less than the thickness of the silicon wafer.

[0067] In use, place the silicon wafer on the clamping arm 1 of the support frame, so that the middle part of the two sides of the silicon wafer in the thickness direction abuts against the first abutting surface and the second abutting surface respectively.

[0068] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0070] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0072] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A substrate holder, characterized in that, include: A support frame includes clamping arms, each clamping arm including a first clamping arm and a second clamping arm spaced apart in a horizontal direction, defining a clamping space between the first clamping arm and the second clamping arm, wherein a silicon wafer is adapted to be placed within the clamping space, and the first clamping arm and the second clamping arm abut against two side surfaces of the silicon wafer in the thickness direction, the first clamping arm including a first fixing portion, the second clamping arm including a second fixing portion arranged opposite to the first fixing portion, the first fixing portion having a first rib protruding toward the second fixing portion, the second fixing portion having a second rib protruding toward the first fixing portion, the first rib and the second rib abutting against the two side surfaces of the silicon wafer, and at least one of the first rib and the second rib including at least two spaced apart in the length direction of the clamping arm.

2. The carrier cartridge according to claim 1, characterized in that, The first clamping arm includes a first fixing part, and the second clamping arm includes a second fixing part arranged opposite to the first fixing part. The clamping space is defined between the first fixing part and the second fixing part. In the direction from one end of the clamping arm to the other end, the distance between the first fixing part and the second fixing part first gradually decreases and then gradually increases.

3. The carrier cartridge according to claim 2, characterized in that, The first fixing part is formed as an arc-shaped plate recessed in the direction of the second fixing part, and the second fixing part is formed as an arc-shaped plate recessed in the direction of the first fixing part.

4. The carrier cartridge according to claim 3, characterized in that, The first fixing part has a first abutting surface on the side facing the second fixing part, and the first abutting surface is a plane extending vertically. The second fixing part has a second abutting surface on the side facing the first fixing part, and the second abutting surface is a plane extending vertically. The two sides of the silicon wafer in the thickness direction abut against the first abutting surface and the second abutting surface, respectively.

5. The carrier cartridge according to claim 4, characterized in that, The first abutting surface and the second abutting surface are circular surfaces, and the diameter of either the first abutting surface or the second abutting surface is in the range of 10mm-50mm.

6. The carrier cartridge according to claim 5, characterized in that, The first rib and the second rib are formed into a ring, and the diameter of the first rib is in the range of 5 mm to 20 mm, and the diameter of the second rib is in the range of 5 mm to 20 mm.

7. The carrier cartridge according to any one of claims 1-6, characterized in that, The clamping arm further includes an elastic element connected between the first clamping arm and the second clamping arm, the elastic element always having a force that brings the first clamping arm and the second clamping arm closer to each other.

8. The carrier cartridge according to claim 2, characterized in that, The first clamping arm includes two first connecting segments respectively connected to both ends of the first fixing part along its length direction, and the second clamping arm includes two second connecting segments respectively connected to both ends of the second fixing part along its length direction. The two first connecting segments and the two second connecting segments correspond one-to-one and are arranged in parallel at intervals.

9. The carrier cartridge according to any one of claims 1-8, characterized in that, The support frame includes multiple clamping arms, which are arranged parallel and spaced apart in the horizontal direction.

10. The carrier cartridge according to claim 9, characterized in that, The distance between two adjacent clamping arms is in the range of 10mm-30mm.

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