Cooling system and control method thereof

Abstract

The present invention discloses a heat dissipation system and a control method thereof. The heat dissipation system includes: a row of cabinets; an integral frame installed in the row of cabinets; a plurality of heat pipe back plates, which are integrally installed on the integral frame, each heat pipe back plate is arranged opposite to the cabinet, and the channel between the cabinet and the integral frame is a local heat channel; a plurality of sensors, which are respectively installed at the return air places of the corresponding heat pipe back plates, and are used to monitor the return air temperature of the heat pipe back plates; wherein the return air temperature is used to determine the fan working condition of the heat pipe back plates. The present invention solves the technical problem in the related art that the heat pipe back plates correspond to the cabinets one by one, and if the heat of some cabinets in a row of cabinets is too high, the local heat will be too high.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation systems, and in particular to a heat dissipation system and a control method thereof. Background Art

[0002] In the related technology, the heat pipe backplane products in the heat dissipation system are controlled one-to-one with the cabinets. When some of the cabinets generate a lot of heat under certain operating conditions and the heat pipe backplane detects that the return air temperature is too high, it will only increase the fan speed of the corresponding heat pipe backplane. When the fan speed of the heat pipe backplane reaches the maximum value, and the return air temperature of the heat pipe backplane still cannot drop to the set drop temperature, this part of the cabinet will form a local hot spot. At the same time, the adjacent heat pipe backplanes do not operate at maximum power, resulting in the total cooling capacity of this row of backplanes being greater than the heat generated by this row of cabinets, and the cooling capacity of the adjacent heat pipe backplanes of other cabinets is insufficient.

[0003] To address the above-mentioned problems, no effective solution has been proposed yet. Summary of the invention

[0004] The embodiment of the present invention provides a heat dissipation system and a control method thereof, so as to at least solve the technical problem in the related art that the heat pipe back plate corresponds to the cabinet one by one, and if the heat of some cabinets in a row of cabinets is too high, the local heat will be too high.

[0005] According to one aspect of an embodiment of the present invention, a control method for a heat dissipation system is provided, wherein the heat dissipation system comprises: a row of cabinets, an overall frame installed in the row of cabinets, a plurality of heat pipe back plates installed as a whole on the overall frame, each heat pipe back plate is arranged opposite to the cabinet, and a channel between the cabinet and the overall frame is a local heat channel, wherein the control method comprises: monitoring the return air temperature of a first heat pipe back plate, wherein the first heat pipe back plate is any one of the heat pipe back plates installed in the overall frame; and controlling the fan operating conditions of the first heat pipe back plate and the heat pipe back plates adjacent to the first heat pipe back plate based on the return air temperature of the first heat pipe back plate.

[0006] Optionally, based on the return air temperature of the first heat pipe backplate, the fan operating conditions of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate are controlled, including: if the return air temperature of the first heat pipe backplate exceeds a first temperature value, controlling the fan of the first heat pipe backplate to operate at a high-speed condition.

[0007] Optionally, based on the return air temperature of the first heat pipe backplate, controlling the fan operating conditions of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate also includes: if the return air temperature of the first heat pipe backplate exceeds a second temperature value, controlling the fan of the first heat pipe backplate to operate at a high-speed condition, and controlling the fan of the heat pipe backplate adjacent to the first heat pipe backplate to operate at a high-speed condition, wherein the second temperature value is greater than the first temperature value.

[0008] Optionally, the duration during which the return air temperature of the first heat pipe back plate exceeds the second temperature value is counted, and if the duration exceeds a predetermined duration, a prompt message is issued, wherein the prompt message includes: a prompt to replace the back plate and / or a prompt to reduce equipment.

[0009] Optionally, based on the return air temperature of the first heat pipe backplate, controlling the operating conditions of the fans of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate also includes: if the return air temperature of the first heat pipe backplate drops to a third temperature value, controlling the fan of the heat pipe backplate adjacent to the first heat pipe backplate to resume rated operating conditions, wherein the third temperature value is calculated based on the difference between the second temperature value and the first preset temperature.

[0010] Optionally, based on the return air temperature of the first heat pipe backplate, controlling the operating conditions of the fans of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate, further includes: if the return air temperature of the first heat pipe backplate drops to a fourth temperature value, controlling the fan of the first heat pipe backplate to resume rated operating conditions, and controlling the fan of the heat pipe backplate adjacent to the first heat pipe backplate to resume rated operating conditions, wherein the fourth temperature value is calculated based on the difference between the first temperature value and a second preset temperature, and the fourth temperature value is less than the first temperature value.

[0011] Optionally, each heat pipe back plate is installed with a sensor, and the sensor is installed at the return air position of the corresponding heat pipe back plate to detect the return air temperature of the heat pipe back plate.

[0012] Optionally, when a fan of any heat pipe backplate fails or the cooling capacity does not meet the standard, fans of other heat pipe backplates are controlled to operate, wherein the other heat pipe backplates are heat pipe backplates adjacent to the failed heat pipe backplate.

[0013] According to another aspect of an embodiment of the present invention, a heat dissipation system is also provided, comprising: a row of cabinets; an overall frame installed in the row of cabinets; a plurality of heat pipe back plates, which are integrally installed on the overall frame, each heat pipe back plate is arranged opposite to the cabinet, and the channel between the cabinet and the overall frame is a local heat channel; a plurality of sensors, which are respectively installed at the return air positions of the corresponding heat pipe back plates, and are used to monitor the return air temperature of the heat pipe back plates; wherein the return air temperature is used to determine the fan operating condition of the heat pipe back plates.

[0014] Optionally, the fan operating conditions of any one heat pipe back plate and the heat plate back plate adjacent thereto are controlled based on the return air temperature, wherein the fan operating conditions include: rated operating conditions and high-speed operating conditions.

[0015] In an embodiment of the present invention, a heat pipe backplane is installed in a row of cabinets, an integral frame is installed, and then the heat pipe backplane is installed on the frame. The position of the heat pipe backplane still corresponds to the cabinet, but the entire frame is interconnected. There is a local heat channel between the cabinet and the heat pipe backplane. The local heat channel concentrates the heat dissipation of the entire row of cabinets in this local heat channel, and can to a certain extent distribute a part of the heat generated by the equipment in the entire row of cabinets among the heat pipe backplanes. The heat pipe backplane products can complement each other in capacity. Even if one of the heat pipe backplane fans fails, other nearby heat pipe backplane products can also assume the corresponding cooling capacity, thereby eliminating local hot spots and solving the technical problem that the heat pipe backplane corresponds to the cabinet one by one in the related technology, and if some cabinets in a row of cabinets have too high heat, the local heat will be too high. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 is a schematic diagram of an optional heat dissipation system according to an embodiment of the present invention;

[0018] Figure 2 is a flow chart of an optional control method of a heat dissipation system according to an embodiment of the present invention. DETAILED DESCRIPTION

[0019] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0020] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0021] The following embodiments of the present invention can be applied to the heat dissipation system to which the heat pipe backplane product belongs. The heat pipe backplane is installed in a row of cabinets, and an overall frame is installed. Then, the heat pipe backplane is installed on the overall frame. The position of the heat pipe backplane still corresponds to the cabinet, but the entire frame is connected inside. There is a local heat channel between the cabinet and the heat pipe backplane. The local heat channel concentrates the heat dissipation of the entire row of cabinets in this local heat channel. To a certain extent, the heat generated by the equipment in the entire row of cabinets can be partially apportioned among the heat pipe backplanes to eliminate local hot spots. At the same time, when the cooling capacity of the local heat pipe backplane is significantly weaker than the heat generated by the equipment in the cabinet, there is a function of performing system analysis, thereby prompting the corresponding heat pipe backplane to be replaced. The embodiments of the present invention are described in detail below in conjunction with the heat dissipation system and its control method.

[0022] Embodiment 1 Cooling system

[0023] Figure 1 is a schematic diagram of an optional heat dissipation system according to an embodiment of the present invention, such as Figure 1 As shown, the heat dissipation system includes: a row of cabinets 101, an overall frame 102, a heat pipe back plate 103, and a sensor 104, wherein:

[0024] A row of cabinets 101; Figure 1 As shown, a row of cabinets 101 are named JG-1, JG-2...JG-N respectively, and servers or other equipment that generates heat during operation are placed in the cabinets.

[0025] An integral frame 102 is mounted in a row of cabinets.

[0026] A plurality of heat pipe back plates 103 are integrally mounted on the overall frame, each heat pipe back plate is arranged opposite to the cabinet, and the channel between the cabinet and the overall frame is a local heat channel 010; Figure 1As shown, the heat pipe backplanes corresponding to the respective cabinets are named B-1, B-2...BN, where N≥2.

[0027] Multiple sensors 104 are respectively installed at the return air places of the corresponding heat pipe back plate to monitor the return air temperature of the heat pipe back plate; wherein the return air temperature is used to determine the fan working condition of the heat pipe back plate. Figure 1 As shown, sensors are respectively arranged at the return air positions of the heat pipe back plate, and the corresponding sensors of the heat pipe back plate are named 011, 012, 013, 014, 015, 016, and 01N.

[0028] The above-mentioned heat dissipation system can install the heat pipe backplane 103 in a row of cabinets 101, install an overall frame 102, and then install the heat pipe backplane on the frame. The position of the heat pipe backplane still corresponds to the cabinet, but the entire frame is connected inside. There is a local heat channel between the cabinet and the heat pipe backplane. The local heat channel concentrates the heat dissipation of the entire row of cabinets in this local heat channel, and can to a certain extent distribute a part of the heat generated by the equipment in the entire row of cabinets among each heat pipe backplane. The heat pipe backplane products can complement each other in capacity. Even if one of the heat pipe backplane fans fails, other nearby heat pipe backplane products can also assume the corresponding cooling capacity, thereby eliminating local hot spots and solving the technical problem that the heat pipe backplane corresponds to the cabinet one by one in the related technology. If some cabinets in a row of cabinets have too high heat, the local heat will be too high.

[0029] Optionally, the fan operating conditions of any heat pipe back plate and the heat plate back plate adjacent thereto are controlled based on the return air temperature, wherein the fan operating conditions include: rated operating conditions and high-speed operating conditions.

[0030] Embodiment 2 Control method of heat dissipation system

[0031] According to an embodiment of the present invention, an embodiment of a control method for a heat dissipation system is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0032] The control method of the heat dissipation system provided in an embodiment of the present invention, wherein the heat dissipation system includes: a row of cabinets, an overall frame installed in the row of cabinets, a plurality of heat pipe back plates installed as a whole on the overall frame, each heat pipe back plate is arranged opposite to the cabinet, and the channel between the cabinet and the overall frame is a local heat channel.

[0033] Optionally, each heat pipe back plate is equipped with a sensor, which is installed at the return air position of the corresponding heat pipe back plate to detect the return air temperature of the heat pipe back plate. The return air temperature of the heat pipe back plate is detected by the sensor to adjust the operation of the fan of the heat pipe back plate.

[0034] Figure 2 is a flow chart of an optional control method of a heat dissipation system according to an embodiment of the present invention. Figure 2 As shown, the method comprises the following steps:

[0035] Step S202, monitoring the return air temperature of the first heat pipe back plate, wherein the first heat pipe back plate is any heat pipe back plate installed in the overall frame;

[0036] Step S204, based on the return air temperature of the first heat pipe back plate, controlling the fan operating conditions of the first heat pipe back plate and the heat pipe back plates adjacent to the first heat pipe back plate.

[0037] Through the above steps, when controlling the heat dissipation system, the return air temperature of the first heat pipe back plate can be monitored first, wherein the first heat pipe back plate is any heat pipe back plate installed in the overall frame, and based on the return air temperature of the first heat pipe back plate, the fan operating conditions of the first heat pipe back plate and the heat pipe back plate adjacent to the first heat pipe back plate are controlled. In this embodiment, by detecting the return air temperature of the heat pipe back plate, the heat pipe back plate and the fan operating conditions are controlled, and each heat pipe back plate product can complement the capabilities. Even if the fan of one of the heat pipe back plates fails, other nearby heat pipe back plate products can also assume the corresponding cooling capacity and eliminate local hot spots, thereby solving the technical problem in the related technology that the heat pipe back plate corresponds to the cabinet one by one, and if some cabinets in a row of cabinets have too high heat, the local heat will be too high.

[0038] In the embodiment of the present invention, when the cooling capacity of the local heat pipe back plate is obviously weaker than the heat generated by the equipment in the cabinet, there is a function of performing system analysis, thereby prompting the corresponding heat pipe back plate to be replaced, thereby ensuring the safe and reliable operation of the entire system.

[0039] Optionally, based on the return air temperature of the first heat pipe backplate, the fan operating conditions of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate are controlled, including: if the return air temperature of the first heat pipe backplate exceeds the first temperature value, controlling the fan of the first heat pipe backplate to operate at a high speed.

[0040] The first heat pipe back plate can be understood as the heat pipe back plate currently controlled. When the return air temperature of the first heat pipe back plate exceeds the set first temperature value, the fan of the first heat pipe back plate is adjusted to operate at a high speed.

[0041] The first temperature value can be set by yourself, which is a temperature threshold for judging whether to turn on the fan of the first heat pipe back plate. For example, the first temperature value is set to 30 degrees Celsius.

[0042] Optionally, based on the return air temperature of the first heat pipe backplate, controlling the fan operating conditions of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate also includes: if the return air temperature of the first heat pipe backplate exceeds a second temperature value, controlling the fan of the first heat pipe backplate to operate at a high-speed condition, and controlling the fan of the heat pipe backplate adjacent to the first heat pipe backplate to operate at a high-speed condition, wherein the second temperature value is greater than the first temperature value.

[0043] The second temperature value refers to the temperature threshold at which the return air temperature of the first heat pipe back plate increases rapidly and the temperature rises. The second temperature value can be set by yourself, for example, the second temperature value is set to 35 degrees Celsius. When the return air temperature reaches the second temperature value, not only the fan of the first heat pipe back plate needs to be turned on and operated at a high speed, but also the fan of the adjacent heat pipe back plate needs to be turned on and operated at a high speed.

[0044] Optionally, the control method further includes: counting the time that the return air temperature of the first heat pipe backplane exceeds the second temperature value, and if the time exceeds a predetermined time, issuing a prompt message, wherein the prompt message includes: a prompt to replace the backplane and / or a prompt to reduce the number of devices. For example, the time that the return air temperature exceeds the temperature T2 in one day is m; when m>k (predetermined time), it indicates that the air volume of the heat pipe backplane corresponding to the cabinet is insufficient, and a prompt is given to replace a backplane product with a larger cooling capacity or reduce the number of devices in the corresponding cabinet.

[0045] Another optional method is to control the fan operating conditions of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate based on the return air temperature of the first heat pipe backplate, and also includes: if the return air temperature of the first heat pipe backplate drops to a third temperature value, controlling the fan of the heat pipe backplate adjacent to the first heat pipe backplate to resume rated operating conditions, wherein the third temperature value is calculated based on the second temperature value and the first preset temperature difference.

[0046] In order to avoid frequent switching of the fan state of the heat pipe backplate when the actual temperature of the system is near the set temperature, and to avoid frequent switching of the fan state caused by errors in temperature detection, the present application does not immediately switch the fan operating conditions of adjacent heat pipe backplates when the return air temperature drops below the second temperature value, but adjusts the fan operating conditions of adjacent heat pipe backplates when the return air temperature drops to a certain threshold (i.e., when it drops to the third temperature value). For example, the first preset temperature difference is set to 3 degrees Celsius, and the second temperature value minus the first preset temperature difference is 32 degrees Celsius. That is, when the return air temperature drops to 32 degrees Celsius, the fans of adjacent heat pipe backplates are adjusted to restore the rated operating conditions.

[0047] In the case of returning to the rated operating condition, for the fan operating at a high speed due to temperature rise, when it is detected that the return air temperature is less than the first set temperature minus the first preset temperature difference (a temperature constant), the fans of adjacent heat pipe backplates resume the rated operating condition. The reason for not resuming the rated condition when the return air temperature is less than the second temperature value is to avoid frequent switching of the operating speed of the fans of adjacent heat pipe backplates near the second temperature value.

[0048] As an optional embodiment of the present invention, based on the return air temperature of the first heat pipe backplate, controlling the operating conditions of the fans of the first heat pipe backplate and the heat pipe backplates adjacent to the first heat pipe backplate further includes: if the return air temperature of the first heat pipe backplate drops to the fourth temperature value, controlling the fan of the first heat pipe backplate to resume operating at the rated condition and controlling the fans of the heat pipe backplates adjacent to the first heat pipe backplate to resume operating at the rated condition, where the fourth temperature value is calculated based on the first temperature value and the second preset temperature difference, and the fourth temperature value is less than the first temperature value.

[0049] The setting of the above fourth temperature value is also to avoid frequent switching of the operating speed of the fan of this heat pipe backplate. The fourth temperature value is set to be less than the first temperature value. For example, the second preset temperature difference is set to 3 degrees Celsius, and 30 degrees Celsius minus 3 degrees Celsius of the first temperature value is 27 degrees Celsius. That is, when the return air temperature of the first heat pipe backplate is less than 27 degrees Celsius, the fan of the first heat pipe backplate is adjusted to resume operating at the rated condition.

[0050] Alternatively, when the fan of any heat pipe backplate fails or the refrigeration capacity does not meet the standard, control the fans of other heat pipe backplates to operate, where the other heat pipe backplates are the heat pipe backplates adjacent to the position of the heat pipe backplate with a fault.

[0051] The control method of the heat dissipation system will be described below in combination with a detailed embodiment.

[0052] Set the set temperatures T1 and T2, and the set temperature adjustment error constants a and b (a and b are temperature control overshoot amounts, and the values of a and b can be the same or different), T1 < T2. The sensor 01n on the backplate B-n measures the return air temperature as tn (1 ≤ n ≤ N), the return air temperature corresponding to the backplate B-3 is t3, and the backplate fans operate in the rated condition and the high-speed condition. The following is an example:

[0053] If tn ≤ T1, the fan of B-n operates in the rated condition;

[0054] When tn > T1, the fan of B-n operates in the high-speed condition;

[0055] When tn ≥ T2, the fan of B-n operates in the high-speed condition; when 1 < n < N, the fans of B-(n-1) and B-(n+1) operate in the high-speed condition; when n = 1, the fan of B-2 operates in the high-speed condition; when n = N, the fan of B-(N-1) operates in the high-speed condition;

[0056] When tn < T2 - a, the fan of B-n operates in the high-speed condition; when 1 < n < N, the fans of B-(n-1) and B-(n+1) resume the rated condition operation; when n = 1, the fan of B-2 resumes the rated condition operation; when n = N, the fan of B-(N-1) resumes the rated condition operation;

[0057] When tn < T1 - b, the fan of B-n resumes the rated condition operation.

[0058] When there is a conflict between the high-speed condition and the rated condition operation modes of the fans on the same backplane, the fans operate at high speed.

[0059] Meanwhile, set a constant k. The detection system detects that the time when the return air temperature exceeds the temperature T2 within a day is m. When m > k, it indicates that the air volume of the heat pipe backplane corresponding to this cabinet is insufficient, and a prompt is given to replace the backplane product with a larger cooling capacity or reduce the number of devices in the corresponding cabinet.

[0060] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0061] In the above embodiments of the present invention, the descriptions of each embodiment have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0062] In several embodiments provided by the present application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only illustrative. For example, the division of the units can be a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed mutual coupling or direct coupling or communication connection can be through some interfaces. The indirect coupling or communication connection of the units or modules can be in an electrical or other form.

[0063] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0064] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0065] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

[0066] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A control method for a heat dissipation system, characterized in that: The heat dissipation system comprises: a row of cabinets, an overall frame installed in the row of cabinets, the interiors of the overall frames are connected, a plurality of heat pipe back plates are installed on the overall frame as a whole, each heat pipe back plate is arranged opposite to the cabinet, and the channel between the cabinet and the overall frame is a local heat channel, and the heat dissipation of the entire row of cabinets is concentrated in the local heat channel, wherein the control method comprises: Monitoring the return air temperature of the first heat pipe back plate, wherein the first heat pipe back plate is any one of the heat pipe back plates installed in the overall frame; Based on the return air temperature of the first heat pipe backplate, the fan operating conditions of the first heat pipe backplate and the heat pipe backplate adjacent to the first heat pipe backplate are controlled.

2. The control method according to claim 1, characterized in that: Based on the return air temperature of the first heat pipe back plate, controlling the fan operating conditions of the first heat pipe back plate and the heat pipe back plate adjacent to the first heat pipe back plate includes: If the return air temperature of the first heat pipe back plate exceeds a first temperature value, the fan of the first heat pipe back plate is controlled to operate at a high-speed condition.

3. The control method according to claim 2, characterized in that: Based on the return air temperature of the first heat pipe back plate, controlling the fan operating conditions of the first heat pipe back plate and the heat pipe back plate adjacent to the first heat pipe back plate, further comprising: If the return air temperature of the first heat pipe backplate exceeds a second temperature value, the fan of the first heat pipe backplate is controlled to operate at a high-speed condition, and the fan of the heat pipe backplate adjacent to the first heat pipe backplate is controlled to operate at a high-speed condition, wherein the second temperature value is greater than the first temperature value.

4. The control method according to claim 3, characterized in that: The duration during which the return air temperature of the first heat pipe back plate exceeds the second temperature value is counted, and if the duration exceeds a predetermined duration, a prompt message is issued, wherein the prompt message includes: a prompt to replace the back plate and / or a prompt to reduce equipment.

5. The control method according to claim 3, characterized in that: Based on the return air temperature of the first heat pipe back plate, controlling the fan operating conditions of the first heat pipe back plate and the heat pipe back plate adjacent to the first heat pipe back plate, further comprising: If the return air temperature of the first heat pipe backplate drops to a third temperature value, the fan of the heat pipe backplate adjacent to the first heat pipe backplate is controlled to resume rated operation, wherein the third temperature value is calculated based on the second temperature value and the first preset temperature difference.

6. The control method according to claim 5, characterized in that: Based on the return air temperature of the first heat pipe back plate, controlling the fan operating conditions of the first heat pipe back plate and the heat pipe back plate adjacent to the first heat pipe back plate, further comprising: If the return air temperature of the first heat pipe backplate drops to a fourth temperature value, the fan of the first heat pipe backplate is controlled to resume operation at rated conditions, and the fan of the heat pipe backplate adjacent to the first heat pipe backplate is controlled to resume operation at rated conditions, wherein the fourth temperature value is calculated based on the difference between the first temperature value and a second preset temperature, and the fourth temperature value is less than the first temperature value.

7. The control method according to claim 1, characterized in that: Each heat pipe back plate is installed with a sensor, and the sensor is installed at the return air position of the corresponding heat pipe back plate to detect the return air temperature of the heat pipe back plate.

8. The control method according to claim 1, characterized in that: When the fan of any heat pipe back plate fails or the cooling capacity does not meet the standard, the fans of other heat pipe back plates are controlled to work, wherein the other heat pipe back plates are heat pipe back plates adjacent to the failed heat pipe back plate.

9. A heat dissipation system, characterized in that: include: A row of cabinets; An integral frame installed in the row of cabinets, the interiors of the integral frames being communicated with each other; A plurality of heat pipe back plates are integrally mounted on the overall frame, each heat pipe back plate is arranged opposite to a cabinet, and a channel between the cabinet and the overall frame is a local heat channel, which concentrates the heat dissipation of the entire row of cabinets in the local heat channel; Multiple sensors are installed at the return air places of the corresponding heat pipe back plates respectively to monitor the return air temperature of the heat pipe back plates; Wherein, the return air temperature is used to determine the fan operating condition of the heat pipe backplate.

10. The heat dissipation system according to claim 9, characterized in that: Based on the return air temperature, the fan operating conditions of any heat pipe back plate and the heat plate back plate adjacent thereto are controlled, wherein the fan operating conditions include: rated operating conditions and high-speed operating conditions.

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