Method and apparatus for treating low specific resistance substances

Abstract

A method and device for treating a low specific resistance substance. The treatment method includes the following steps: using a conductive electrode (301) to conduct electrons to the low specific resistance substance to make the low specific resistance substance charged; using an adsorption electrode (302) to attract the charged low specific resistance substance to make the charged low specific resistance substance move towards the adsorption electrode (302). By the way of conducting electrons to make the low specific resistance substance charged, the problem caused by the easy loss of electricity after the low specific resistance substance is charged is overcome, so that the low specific resistance substance can quickly obtain electrons after losing electrons, increasing the probability of charging the low specific resistance substance and making the low specific resistance substance maintain a charged state. In this way, the adsorption electrode (302) can continuously apply an attractive force to the low specific resistance substance to adsorb the low specific resistance substance, and the method for treating the low specific resistance substance has a strong collection ability and high collection efficiency for the low specific resistance substance.

Description

Technical Field

[0001] The present invention relates to a method and device for treating low specific resistance substances, and particularly to a method and device for treating low specific resistance substances with higher efficiency in collecting low specific resistance substances. Background Art

[0002] In the current environmental protection field, after going through processes such as dust removal, desulfurization, denitrification, and demisting, the black smoke, blue smoke, and yellow smoke emitted from chimneys have disappeared, but white smoke has increased. Most of the components of the white smoke are water mist, which also contains fine particles, ammonium salts, calcium, nitric acid, aerosols, etc. These are the main pollutants that need to be solved urgently at present. The currently used cyclone dust collectors, bag dust collectors, condensation demisters, wet electrostatic precipitators, acid mist demisters, etc. are basically ineffective. For example, at the end of ozone denitrification and the wet treatment of flue gas from boilers and sintering machines, a demister is used to remove the water carried by the flue gas. However, due to the temperature difference and the characteristics of fine mist, the actual demister simply cannot achieve the removal effect. Currently, wet electrostatic precipitators are mainly used as treatment means, but due to the deviation in structure and charging principle, it is impossible to make the water mist charged and adsorbed, and the efficiency of treating white smoke is also extremely low. In this way, a large amount of the above pollutants are discharged into the atmosphere, forming haze and acid rain. Due to the entrainment and emission of escaped dust, ammonium salts, desulfurization agents, denitrification agents, phenols, heavy metals with high valence, etc., it seriously affects the health of local people. At the same time, a large amount of industrial water is discharged, which is not conducive to saving water resources.

[0003] The above-mentioned discharged water mist is a low specific resistance substance. The existing technologies for treating low specific resistance substances have problems caused by the easy loss of electricity after the low specific resistance substances are charged, and it is impossible to remove the low specific resistance substances discharged into the air. For example, the purification and collection of acid mist in industrial waste gas are still technical problems that need to be solved urgently today. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the technical problem to be solved by the present invention is to provide a method and device for treating low specific resistance substances that can collect low specific resistance substances with high collection efficiency.

[0005] To achieve the above object and other related objects, the present invention provides the following examples:

[0006] 1. Example 1 provided by the present invention: A method for treating low specific resistance substances, comprising the following steps:

[0007] Conduct electrons to the low specific resistance substance with a conductive electrode to make the low specific resistance substance charged;

[0008] Attract the charged low specific resistance substance with an adsorption electrode to make the charged low specific resistance substance move towards the adsorption electrode.

[0009] 2. Example 2 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 1. Among them, the step of conducting electrons to the low specific resistance substances with the conducting electrode includes: electrons are transferred between the low specific resistance substances located between the conducting electrode and the adsorption electrode, making more low specific resistance substances charged.

[0010] 3. Example 3 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 1 or 2. Among them, electrons are conducted between the conducting electrode and the adsorption electrode through the low specific resistance substances and a current is formed.

[0011] 4. Example 4 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 3. Among them, the step of conducting electrons to the low specific resistance substances with the conducting electrode includes: the conducting electrode makes the low specific resistance substances charged by contacting with the low specific resistance substances.

[0012] 5. Example 5 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 4. Among them, the conducting electrode is in the shape of a plane, a net, a perforated plate, a plate, a spherical cage, a box, or a tube.

[0013] 6. Example 6 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 5. Among them, the conducting electrode is one or a combination of multiple forms of a solid, a liquid, a gas molecular group, a plasma, a conductive mixed - state substance, a natural conductive substance in a biological mixture, or a conductive substance formed by artificial processing of an object.

[0014] 7. Example 7 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 6. Among them, the conducting electrode is a solid - state metal, graphite, or contains an ion - conductive liquid.

[0015] 8. Example 8 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 7. Among them, the adsorption electrode is in the shape of a multi - layer net, a net, a perforated plate, a tube, a barrel, a spherical cage, a box, a plate, a granular accumulation layer, or a bent plate.

[0016] 9. Example 9 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 8. Among them, at least one through - hole is provided on the conducting electrode.

[0017] 10. Example 10 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 9. Among them, the step of conducting electrons to the low specific resistance substances with the conducting electrode includes: making the low specific resistance substances pass through the through - hole of the conducting electrode to make the low specific resistance substances charged.

[0018] 11. Example 11 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 9 or 10, wherein the shape of the through holes on the conductive electrode is polygonal, circular, elliptical, square, rectangular, trapezoidal, or rhombic.

[0019] 12. Example 12 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 9 - 11, wherein the aperture of the through holes on the conductive electrode is 0.1 - 3 millimeters.

[0020] 13. Example 13 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 12, wherein at least one through hole is provided on the adsorption electrode.

[0021] 14. Example 14 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 13, wherein the shape of the through holes of the adsorption electrode is polygonal, circular, elliptical, square, rectangular, trapezoidal, or rhombic.

[0022] 15. Example 15 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 13 or 14, wherein the aperture of the through holes of the adsorption electrode is 0.1 - 3 millimeters.

[0023] 16. Example 16 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 15, wherein the adsorption electrode is made of a conductive substance, or the surface of the adsorption electrode has a conductive substance.

[0024] 17. Example 17 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 16, wherein an electric field is formed between the conductive electrode and the adsorption electrode.

[0025] 18. Example 18 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 17, wherein the conductive electrode is perpendicular or parallel to the adsorption electrode.

[0026] 19. Example 19 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 18, wherein the conductive electrode is in a mesh shape, the adsorption electrode is in a planar shape, and the conductive electrode is parallel to the adsorption electrode.

[0027] 20. Example 20 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 19, wherein both the conductive electrode and the adsorption electrode are in a planar shape, and the conductive electrode is parallel to the adsorption electrode.

[0028] 21. Example 21 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 20, wherein the conductive electrode uses a metal wire mesh.

[0029] Example 22 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-21, wherein the conducting electrode is planar or spherical.

[0030] Example 23 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-22, wherein the adsorption electrode is curved or spherical.

[0031] Example 24 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-23, wherein the conducting electrode is electrically connected to one electrode of the power supply, and the adsorption electrode is electrically connected to the other electrode of the power supply.

[0032] Example 25 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-24, wherein the conducting electrode is electrically connected to the negative electrode of the power supply, and the adsorption electrode is electrically connected to the positive electrode of the power supply.

[0033] Example 26 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-25, wherein the power supply driving voltage range of the power supply can be 5-50 KV.

[0034] Example 27 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-26, wherein the power supply driving voltage of the power supply is less than the initial corona voltage.

[0035] Example 28 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-27, wherein the power supply driving voltage of the power supply is 0.1-2 kv / mm.

[0036] Example 29 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-28, wherein the power supply driving voltage waveform of the power supply is a DC waveform, a sine wave, or a modulated waveform.

[0037] Example 30 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-29, wherein the power supply is an AC power supply, and the frequency conversion pulse range of the power supply is 0.1 Hz - 5 GHz.

[0038] Example 31 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-30, wherein both the conducting electrode and the adsorption electrode extend in the left-right direction, and the left end of the conducting electrode is to the left of the left end of the adsorption electrode.

[0039] Example 32 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 31. Among them, there are two adsorption electrodes, and the conducting electrode is located between the two adsorption electrodes.

[0040] Example 33 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 32. Among them, the conducting electrode and the adsorption electrode form an adsorption unit, and there are multiple adsorption units.

[0041] Example 34 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 33. Among them, all the adsorption units are distributed in one or more directions among the longitudinal direction, the transverse direction, the diagonal direction, and the spiral direction.

[0042] Example 35 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 34. Among them, both the conducting electrode and the adsorption electrode are installed in a housing, and the housing has an inlet and an outlet.

[0043] Example 36 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 35. Among them, it further includes a flow channel, and the flow channel is located in the housing between the inlet and the outlet.

[0044] Example 37 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 35 or 36. Among them, the inlet is circular, and the diameter of the inlet is 300 - 1000 mm, or 500 mm.

[0045] Example 38 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 35 or 36. Among them, the outlet is circular, and the diameter of the outlet is 300 - 1000 mm, or 500 mm.

[0046] Example 39 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 38. Among them, the material of the housing is metal, non - metal, conductor, non - conductor, water, various conductive liquids, various porous materials, or various foam materials.

[0047] Example 40 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1 - 39. Among them, the material of the housing is stainless steel, aluminum alloy, ferroalloy, conductive liquid, cloth, sponge, molecular sieve, activated carbon, foam iron, or foam silicon carbide.

[0048] Example 41 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-40. Among them, the outer shell includes a first barrel body, a second barrel body, and a third barrel body that are sequentially distributed from the inlet to the outlet direction. The inlet is located at one end of the first barrel body, and the outlet is located at one end of the third barrel body.

[0049] Example 42 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 41. Among them, the contour size of the first barrel body gradually increases from the inlet to the outlet direction.

[0050] Example 43 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 41 or 42. Among them, the first barrel body is in a straight tubular shape.

[0051] Example 44 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 41-43. Among them, the second barrel body is in a straight tubular shape, and the conductive electrode and the adsorption electrode are installed in the second barrel body.

[0052] Example 45 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 41-44. Among them, the contour size of the third barrel body gradually decreases from the inlet to the outlet direction.

[0053] Example 46 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 41-45. Among them, the cross-section of the second barrel body is rectangular.

[0054] Example 47 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-46. Among them, the conductive electrode is fixedly connected to the outer shell through an insulating member.

[0055] Example 48 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 47. Among them, the material of the insulating member is insulating mica.

[0056] Example 49 provided by the present invention: It includes the method for treating low specific resistance substances described in Example 47 or 48. Among them, the insulating member is in a columnar shape or a tower shape.

[0057] Example 50 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-49. Among them, a first connection portion is provided on the conductive electrode, and the first connection portion is fixedly connected to the insulating member.

[0058] Example 51 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-50. Among them, a second connection portion is provided on the inner wall of the outer shell, and the second connection portion is fixedly connected to the insulating member.

[0059] Example 52 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-51, wherein the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%, or 90%-10%, or 80%-20%, or 70%-30%, or 60%-40%, or 50%.

[0060] Example 53 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-52, wherein the low specific resistance substance is one or a combination of multiple forms among liquid state, fog state, solid state, or plasma state.

[0061] Example 54 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-53, wherein the low specific resistance substance is one or a combination of multiple forms among conductive liquid, conductive fog, conductive particles, charged liquid, charged fog, charged particles, water, emulsion, aerosol, liquefied dust, multi-substance mixture liquid, multi-state mixture liquid, multi-substance multi-state mixture liquid, water fog, emulsion fog, multi-substance mixture fog, multi-state mixture fog, multi-substance multi-state mixture fog, haze, steam, acid fog, water-containing tail gas, water-containing flue gas, gaseous molecular cluster, ion cluster, plasma, conductive powder body, conductive droplets, conductive dust, ion cluster in liquid, ion cluster in gas, compound in liquid, compound in gas.

[0062] Example 55 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-54, wherein the low specific resistance substance is an organism containing water, emulsion, multi-substance mixture liquid, multi-state mixture liquid, or multi-substance multi-state mixture liquid.

[0063] Example 56 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-55, wherein the low specific resistance substance is a conductor or a semiconductor.

[0064] Example 57 provided by the present invention: It includes the method for treating low specific resistance substances described in any one of Examples 1-56, and includes the following steps:

[0065] The low specific resistance substance enters the flow channel from the inlet and moves towards the outlet direction; when the low specific resistance substance passes through the pole, the conductive electrode conducts electrons to the low specific resistance substance, and the low specific resistance substance becomes charged.

[0066] Example 58 provided by the present invention: A device for treating low specific resistance substances, including:

[0067] A conductive electrode that can conduct electrons to the low specific resistance substance; when electrons are conducted to the low specific resistance substance, the low specific resistance substance becomes charged;

[0068] An adsorption pole that can apply an attractive force to the charged low specific resistance substance.

[0069] Example 59 provided by the present invention: It includes the low specific resistance material processing device described in Example 58, wherein the conductive electrode is in the shape of a plane, a net, a perforated plate, a plate, a spherical cage, a box, or a tube.

[0070] Example 60 provided by the present invention: It includes the low specific resistance material processing device described in Example 58 or 59, wherein the conductive electrode is one or a combination of multiple forms of a solid, a liquid, a gas molecular group, a plasma, a conductive mixed state material, a natural conductive material mixed by organisms, or a conductive material formed by artificial processing of an object.

[0071] Example 61 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 60, wherein the conductive electrode is a solid-state metal, graphite, or an ionic conductive liquid.

[0072] Example 62 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 61, wherein the adsorption electrode is in the shape of a multi-layer net, a net, a perforated plate, a tube, a barrel, a spherical cage, a box, a plate, a granular accumulation layer, or a bent plate.

[0073] Example 63 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 62, wherein at least one through hole is provided on the conductive electrode.

[0074] Example 64 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 63, wherein the step of conducting electrons to the low specific resistance material by the conductive electrode includes: passing the low specific resistance material through the through hole of the conductive electrode to charge the low specific resistance material.

[0075] Example 65 provided by the present invention: It includes the low specific resistance material processing device described in Example 63 or 64, wherein the shape of the through hole on the conductive electrode is a polygon, a circle, an ellipse, a square, a rectangle, a trapezoid, or a rhombus.

[0076] Example 66 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 63 - 64, wherein the aperture of the through hole on the conductive electrode is 0.1 - 3 millimeters.

[0077] Example 67 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 66, wherein at least one through hole is provided on the adsorption electrode.

[0078] Example 68 provided by the present invention: It includes the low specific resistance material processing device described in Example 67, wherein the shape of the through holes of the adsorption electrode is polygonal, circular, elliptical, square, rectangular, trapezoidal, or rhombic.

[0079] Example 69 provided by the present invention: It includes the low specific resistance material processing device described in Example 67 or 68, wherein the aperture of the through holes of the adsorption electrode is 0.1 - 3 mm.

[0080] Example 70 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 69, wherein the adsorption electrode is made of a conductive material, or the surface of the adsorption electrode has a conductive material.

[0081] Example 71 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 70, wherein an electric field is formed between the conductive electrode and the adsorption electrode.

[0082] Example 72 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 71, wherein the conductive electrode is perpendicular or parallel to the adsorption electrode.

[0083] Example 73 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 72, wherein the conductive electrode is in a mesh shape, the adsorption electrode is in a planar shape, and the conductive electrode is parallel to the adsorption electrode.

[0084] Example 74 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 73, wherein both the conductive electrode and the adsorption electrode are in a planar shape, and the conductive electrode is parallel to the adsorption electrode.

[0085] Example 75 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 74, wherein the conductive electrode uses a metal wire mesh.

[0086] Example 76 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 75, wherein the conductive electrode is in a planar shape or a spherical shape.

[0087] Example 77 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 76, wherein the adsorption electrode is in a curved surface shape or a spherical shape.

[0088] Example 78 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58 - 77, wherein the conductive electrode is electrically connected to one electrode of the power supply, and the adsorption electrode is electrically connected to the other electrode of the power supply.

[0089] Example 79 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-78, wherein the conductive electrode is electrically connected to the negative electrode of the power supply, and the adsorption electrode is electrically connected to the positive electrode of the power supply.

[0090] Example 80 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-79, wherein the power supply driving voltage range of the power supply can be 5-50 KV.

[0091] Example 81 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-80, wherein the power supply driving voltage of the power supply is less than the initial corona voltage.

[0092] Example 82 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-81, wherein the power supply driving voltage of the power supply is 0.1 kV / mm - 2 kV / mm.

[0093] Example 83 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-82, wherein the waveform of the power supply driving voltage of the power supply is a DC waveform, a sine wave, or a modulated waveform.

[0094] Example 84 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-83, wherein the power supply is an AC power supply, and the frequency conversion pulse range of the power supply is 0.1 Hz - 5 GHz.

[0095] Example 85 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-84, wherein both the conductive electrode and the adsorption electrode extend in the left-right direction, and the left end of the conductive electrode is to the left of the left end of the adsorption electrode.

[0096] Example 86 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-85, wherein there are two adsorption electrodes, and the conductive electrode is located between the two adsorption electrodes.

[0097] Example 87 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-86, wherein the conductive electrode and the adsorption electrode form an adsorption unit, and there are multiple adsorption units.

[0098] Example 88 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58-87, wherein all the adsorption units are distributed in one or more directions among the longitudinal direction, the transverse direction, the diagonal direction, or the spiral direction.

[0099] Example 89 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58 - 88, and further includes a housing having an inlet and an outlet, wherein both the conductive electrode and the adsorption electrode are installed in the housing.

[0100] Example 90 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58 - 89, and further includes a flow channel, and the flow channel is located in the housing between the inlet and the outlet.

[0101] Example 91 provided by the present invention: It includes the low specific resistance material treatment device described in Example 89 or 90, wherein the inlet is circular, and the diameter of the inlet is 300 - 1000 mm, or 500 mm.

[0102] Example 92 provided by the present invention: It includes the low specific resistance material treatment device described in Example 89 or 90, wherein the outlet is circular, and the diameter of the outlet is 300 - 1000 mm, or 500 mm.

[0103] Example 93 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58 - 92, wherein the material of the housing is metal, non - metal, conductor, non - conductor, water, various conductive liquids, various porous materials, or various foam materials.

[0104] Example 94 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58 - 93, wherein the material of the housing is stainless steel, aluminum alloy, ferroalloy, conductive liquid, cloth, sponge, molecular sieve, activated carbon, foam iron, or foam silicon carbide.

[0105] Example 95 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 58 - 94, wherein the housing includes a first barrel body, a second barrel body, and a third barrel body distributed in sequence from the inlet to the outlet direction, the inlet is located at one end of the first barrel body, and the outlet is located at one end of the third barrel body.

[0106] Example 96 provided by the present invention: It includes the low specific resistance material treatment device described in Example 95, wherein the contour size of the first barrel body gradually increases from the inlet to the outlet direction.

[0107] Example 97 provided by the present invention: It includes the low specific resistance material treatment device described in Example 95 or 96, wherein the first barrel body is in a straight - tube shape.

[0108] Example 98 provided by the present invention: It includes the low specific resistance material treatment device described in any one of Examples 95 - 97, wherein the second barrel body is in a straight - tube shape, and the conductive electrode and the adsorption electrode are installed in the second barrel body.

[0109] Example 99 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 95-98, wherein the contour size of the third barrel body gradually decreases from the inlet to the outlet direction.

[0110] Example 100 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 95-99, wherein the cross-section of the second barrel body is rectangular.

[0111] Example 101 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58-100, wherein the conducting electrode is fixedly connected to the outer shell through an insulating member.

[0112] Example 102 provided by the present invention: It includes the low specific resistance material processing device described in Examples 39-101, wherein the insulating member is made of insulating mica.

[0113] Example 103 provided by the present invention: It includes the low specific resistance material processing device described in Example 101 or 102, wherein the insulating member is columnar or tower-shaped.

[0114] Example 104 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58-103, wherein a first connection portion is provided on the conducting electrode, and the first connection portion is fixedly connected to the insulating member.

[0115] Example 105 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58-104, wherein a first connection portion is provided on the inner wall of the outer shell, and the first connection portion is fixedly connected to the insulating member.

[0116] Example 106 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58-105, wherein the ratio of the cross-sectional area of the conducting electrode to the cross-sectional area of the flow channel is 99%-10%, or 90-10%, or 80-20%, or 70-30%, or 60-40%, or 50%.

[0117] Example 107 provided by the present invention: It includes the low specific resistance material processing device described in any one of Examples 58-106, wherein the low specific resistance material is one or a combination of liquid, mist, solid, or plasma state.

[0118] Example 108 provided by the present invention: It includes the low specific resistance substance treatment device described in any one of Examples 58-107. Among them, the low specific resistance substance is one or a combination of several forms of conductive liquid, conductive fog, conductive particles, charged liquid, charged fog, charged particles, water, emulsion, aerosol, liquefied dust, multi-substance mixture, multi-state mixture, multi-substance multi-state mixture, water mist, emulsion fog, multi-substance mixture fog, multi-state mixture fog, multi-substance multi-state mixture fog, haze, steam, acid fog, water-containing tail gas, water-containing flue gas, gaseous molecular cluster, ion cluster, plasma, conductive powder body, conductive droplets, conductive dust, ion cluster in liquid, ion cluster in gas, compound in liquid, compound in gas.

[0119] Example 109 provided by the present invention: It includes the low specific resistance substance treatment device described in any one of Examples 58-108. Among them, the low specific resistance substance is an organism containing water, emulsion, multi-substance mixture, multi-state mixture, or multi-substance multi-state mixture.

[0120] Example 110 provided by the present invention: It includes the low specific resistance substance treatment device described in any one of Examples 58-109. Among them, the low specific resistance substance is a conductor or a semiconductor.

[0121] Example 111 provided by the present invention: It includes the low specific resistance substance treatment device described in any one of Examples 58-110. Among them, it includes an inlet, an outlet, and a flow channel located between the inlet and the outlet. A conductive electrode capable of conducting electrons to the low specific resistance substance is installed in the flow channel; and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%. The low specific resistance substance treatment device also includes an adsorption electrode capable of applying an attractive force to the charged low specific resistance substance.

[0122] The working principle of the low specific resistance substance treatment device in the present invention is as follows: The conductive electrode is used to conduct electrons to the low specific resistance substance, making the low specific resistance substance charged, and the adsorption electrode is used to apply an attractive force to the charged low specific resistance substance to attract the low specific resistance substance to move towards the adsorption electrode until the low specific resistance substance adheres to the adsorption electrode, thereby realizing the collection of the low specific resistance substance on the adsorption plate; at the same time, in the low specific resistance substance treatment device of the present invention, the low specific resistance substance is charged by the above-mentioned method of conducting electrons. This method overcomes the problem that the low specific resistance substance is prone to losing electrons after being charged, enables the low specific resistance substance to quickly obtain electrons after losing electrons, increases the probability of charging the low specific resistance substance, and enables the low specific resistance substance to maintain a charged state. In this way, the adsorption electrode can continuously apply an attractive force to the low specific resistance substance to adsorb the low specific resistance substance, and makes the collection ability and collection efficiency of the low specific resistance substance treatment device for the low specific resistance substance stronger and higher.

[0123] The method for treating low specific resistance substances provided by the present invention can collect low specific resistance substances with higher collection efficiency.

[0124] As described above, the treatment method involved in the present invention has the following beneficial effects:

[0125] Based on the above method, the present invention realizes collecting low specific resistance substances on the adsorption plate; and this treatment method overcomes the problem brought about by the easy loss of electricity after the low specific resistance substances are charged, enabling the low specific resistance substances to quickly obtain electrons after losing electrons to ensure that the low specific resistance substances remain charged. In this way, the adsorption pole can continuously exert an attractive force on the low specific resistance substances to attract them, thereby making the collection efficiency of this treatment method for low specific resistance substances higher.

[0126] The present invention installs the conductive electrode in the flow channel, and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99% - 10%, enabling the conductive electrode to effectively conduct electrons to the low specific resistance substances. Description of the Drawings

[0127] Figure 1 It is a schematic structural diagram of the device for treating low specific resistance substances in the first embodiment of the present invention.

[0128] Figure 2 It is a left view of the device for treating low specific resistance substances in the first embodiment of the present invention.

[0129] Figure 3 It is a perspective view of the device for treating low specific resistance substances in the first embodiment of the present invention.

[0130] Figure 4 It is a schematic structural diagram of the device for treating low specific resistance substances in the second embodiment of the present invention.

[0131] Figure 5 It is a top view of the device for treating low specific resistance substances in the second embodiment of the present invention.

[0132] Figure 6 It is a schematic structural diagram of the intake device in a gas treatment system based on an engine in a specific embodiment of the present invention.

[0133] Figure 7 It is a schematic structural diagram of another embodiment of the first water filtration mechanism arranged in the intake device in a gas treatment system based on an engine in a specific embodiment of the present invention.

[0134] Figure 8 It is a schematic principle structural diagram of the exhaust gas treatment system of a diesel engine in the twenty-first embodiment of the present invention.

[0135] Description of Component Labels

[0136] 301 Conductive electrode

[0137] 3011 First connection part

[0138] 302 Adsorption electrode

[0139] 303 Housing

[0140] 3031 Inlet

[0141] 3032 Outlet

[0142] 3033 First barrel part

[0143] 3034 Second barrel part

[0144] 3035 Third barrel part

[0145] 3036 Flow channel

[0146] 304 Insulating part

[0147] 101 Air inlet device

[0148] 1011 Air inlet

[0149] 1012 Separation mechanism

[0150] 1013 First water filtration mechanism

[0151] 1014 Electrostatic precipitator mechanism

[0152] 10141 Anode dust accumulation part

[0153] 10142 Cathode discharge part

[0154] 1015 First insulation mechanism

[0155] 1016 Air distribution mechanism

[0156] 1017 Second water filtration mechanism

[0157] 1018 Ozone mechanism

[0158] 201 Ozone generator

[0159] 202 Reaction field

[0160] 2021 Honeycomb cavity

[0161] 2022 Gap

[0162] 203 Denitration device

[0163] 2031 Electrocoagulation demisting unit

[0164] 2032 Denitration liquid collection unit

[0165] 204 Ozone Disposer Specific Embodiments

[0166] Through extensive research, the inventors of the present invention have provided the following low specific resistance material treatment device and treatment method. The low specific resistance material treatment method and device can collect low specific resistance materials with higher collection efficiency. At the same time, in the present invention, the low specific resistance material refers to a material with a unit volume resistance less than 1×10 9 ohm, where the unit volume refers to a cubic centimeter; that is, for each cubic centimeter of the low specific resistance material, its resistance is less than 1×10 9 ohm.

[0167] Some embodiments of the present invention provide a low specific resistance material treatment device, including:

[0168] A conducting electrode that can conduct electrons to the low specific resistance material; when electrons are conducted to the low specific resistance material, the low specific resistance material becomes charged;

[0169] An adsorption electrode that can apply an attractive force to the charged low specific resistance material.

[0170] The working principle of the low specific resistance material treatment device in the present invention is as follows: using the conducting electrode to conduct electrons to the low specific resistance material, making the low specific resistance material charged, and using the adsorption electrode to apply an attractive force to the charged low specific resistance material to attract the low specific resistance material to move towards the adsorption electrode until the low specific resistance material adheres to the adsorption electrode, thereby realizing the collection of the low specific resistance material on the adsorption plate; at the same time, in the low specific resistance material treatment device of the present invention, the low specific resistance material is charged by the above-mentioned method of conducting electrons, which overcomes the problem that the low specific resistance material is prone to losing electrons after being charged, enabling the low specific resistance material to quickly obtain electrons after losing electrons, increasing the probability of charging the low specific resistance material, and keeping the low specific resistance material charged. In this way, the adsorption electrode can continuously apply an attractive force to the low specific resistance material to adsorb the low specific resistance material, and make the collection ability of the low specific resistance material treatment device for the low specific resistance material stronger and the collection efficiency higher.

[0171] At the same time, the present invention provides a low specific resistance material treatment method, including the following steps:

[0172] Use a conducting electrode to conduct electrons to the low specific resistance material to make the low specific resistance material charged;

[0173] Use an adsorption electrode to attract the charged low specific resistance material to make the charged low specific resistance material move towards the adsorption electrode.

[0174] In the present invention, the treatment method realizes collecting low specific resistance substances on the adsorption plate based on the above steps; moreover, this treatment method overcomes the problems brought about by the easy loss of electricity after the low specific resistance substances are charged, enabling the low specific resistance substances to quickly obtain electrons after losing electrons to ensure that the low specific resistance substances remain charged. In this way, the adsorption pole can continuously apply an attractive force to the low specific resistance substances to attract the low specific resistance substances, thereby making the collection efficiency of this treatment method for low specific resistance substances higher.

[0175] Some embodiments of the present invention provide a device for treating low specific resistance substances, including an inlet, an outlet, and a flow channel located between the inlet and the outlet. A conductive electrode capable of conducting electrons to the low specific resistance substances is installed in the flow channel; and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99% - 10%. The device for treating low specific resistance substances further includes an adsorption pole capable of applying an attractive force to the charged low specific resistance substances. The working principle of the device for treating low specific resistance substances in the present invention is as follows: The low specific resistance substances enter the flow channel from the inlet. The conductive electrode installed in the flow channel conducts electrons to the low specific resistance substances, causing the low specific resistance substances to be charged. The adsorption pole applies an attractive force to the charged low specific resistance substances, and the low specific resistance substances move towards the adsorption pole until the low specific resistance substances adhere to the adsorption pole, thereby realizing collecting the low specific resistance substances on the adsorption plate; at the same time, in the present invention, the conductive electrode is installed in the flow channel, and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99% - 10%, enabling the conductive electrode to effectively conduct electrons to the low specific resistance substances; in addition, for the device for treating low specific resistance substances in the present invention, the low specific resistance substances are charged by the above-mentioned method of conducting electrons, which overcomes the problems brought about by the easy loss of electricity after the low specific resistance substances are charged, enabling the low specific resistance substances to quickly obtain electrons after losing electrons, increasing the probability of charging the low specific resistance substances, and making the low specific resistance substances remain charged. In this way, the adsorption pole can continuously apply an attractive force to the low specific resistance substances to adsorb the low specific resistance substances, and make the collection ability and collection efficiency of this device for treating low specific resistance substances stronger and higher.

[0176] Some embodiments of the present invention provide a device for treating low specific resistance substances, including an inlet, an outlet, and a flow channel located between the inlet and the outlet. A conductive electrode capable of conducting electrons to the low specific resistance substances is installed in the flow channel; and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99% - 10%. The device for treating low specific resistance substances further includes an adsorption pole capable of applying an attractive force to the charged low specific resistance substances.

[0177] Some embodiments of the present invention provide that the treatment method for the low specific resistance substances includes the following steps:

[0178] The low specific resistance material enters the flow channel from the import and moves towards the outlet direction; when the low specific resistance material passes through the conducting electrode, the conducting electrode conducts electrons to the low specific resistance material, and the low specific resistance material becomes charged; the charged low specific resistance material is attracted by the adsorption electrode, causing the charged low specific resistance material to move towards the adsorption electrode.

[0179] In the method for treating low specific resistance material of the present invention, the low specific resistance material is collected on the adsorption plate based on the above steps; meanwhile, in the present invention, the conducting electrode is installed in the flow channel, and the ratio of the cross-sectional area of the conducting electrode to the cross-sectional area of the flow channel is 99 - 10%, enabling the low specific resistance material to pass through the conducting electrode, increasing the contact area between the low specific resistance material and the conducting electrode, so that the conducting electrode can effectively conduct electrons to the low specific resistance material, and this treatment method overcomes the problem brought about by the easy loss of electricity after the low specific resistance material becomes charged, enabling the low specific resistance material to quickly obtain electrons after losing electrons to ensure that the low specific resistance material remains charged. In this way, the adsorption electrode can continuously apply an attractive force to the low specific resistance material to attract the low specific resistance material, thereby making the collection efficiency of the low specific resistance material by this treatment method higher.

[0180] In an embodiment of the present invention, the conducting electrode is located in the flow channel. The cross-sectional area of the conducting electrode in the present invention refers to the sum of the areas of the solid parts of the conducting electrode along the cross-section. Additionally, in some embodiments of the present invention, the ratio of the cross-sectional area of the conducting electrode to the cross-sectional area of the flow channel can be 99 - 10%, or 90 - 10%, or 80 - 20%, or 70 - 30%, or 60 - 40%, or 50%.

[0181] In the present invention, the form of the low specific resistance substance can be one or a combination of multiple forms among liquid, mist, solid, or plasma state. For example, the low specific resistance substance in the present invention can be conductive liquid, conductive mist, conductive particles, charged liquid, charged mist, charged particles, water, emulsion, aerosol, liquefied dust, multi-substance mixture liquid, multi-state mixture liquid, multi-substance multi-state mixture liquid, water mist, emulsion mist, multi-substance mixture mist, multi-state mixture mist, multi-substance multi-state mixture mist, haze, steam, acid mist, water-containing tail gas, water-containing flue gas, gaseous molecular cluster, ion cluster, plasma, conductive powder body, conductive droplets, conductive dust, ion cluster in liquid, ion cluster in gas, compound in liquid, compound in gas, etc. The low specific resistance substance in the present invention can also be an organism containing water, emulsion, multi-substance mixture liquid, multi-state mixture liquid, or multi-substance multi-state mixture liquid. The low specific resistance substance in the present invention can be a conductor or a semiconductor. The present invention can collect the low specific resistance substance on the adsorption electrode through the above treatment method. The treatment device in the present invention can be used as an electric coagulation demister and can be applied to ozone denitrification tail gas recovery, wet flue gas desulfurization dehydration, wet dust removal escape water recovery, industrial tail gas demister, emulsion purifier, oil mist purifier, electronic cigarette, nuclear fusion confinement device. For example, when this treatment device is applied to ozone denitrification tail gas recovery, the acid mist formed in the ozone denitrification tail gas is a kind of low specific resistance substance, and the resistance of the tail gas containing acid mist per cubic centimeter is 0.1 to 1000 ohms; at this time, the specific steps of this low specific resistance substance treatment method are as follows: the ozone denitrification tail gas flows through the conducting electrode, and the conducting electrode conducts electrons to the acid mist in the ozone denitrification tail gas and makes the acid mist charged; the adsorption electrode applies an attractive force to the charged acid mist; the acid mist moves towards the adsorption electrode and adheres to the adsorption electrode, thereby realizing the recovery of the acid mist in the ozone denitrification tail gas, avoiding the direct emission of the acid mist in the ozone denitrification tail gas into the atmosphere and causing pollution to the atmosphere. At this time, the above treatment method is also called an acid mist electrostatic recovery method. The treatment device and treatment method in the present invention can be used for the de-white treatment of escape fog, aerosol, etc. discharged from the chimneys of power plants, glass factories, steel factories, and chemical factories. The present invention solves the problem that traditional wet electrostatic precipitators cannot remove low specific resistance substances contained in the discharged gas, including water mist, acid mist, aerosol, emulsion, liquefied dust, etc., and adopts an electric method in space to directly adsorb and recover the low specific resistance substances contained in the tail gas by using an electric field. In addition, the treatment method and device in the present invention can also be used to separate or enrich the target substance, that is, the low specific resistance substance, from gas phase, liquid phase, or sol colloid.

[0182] In an embodiment of the present invention, the conducting electrode is electrically connected to one electrode of the power supply; the adsorption electrode is electrically connected to the other electrode of the power supply. In an embodiment of the present invention, the conducting electrode is specifically electrically connected to the negative electrode of the power supply, and the adsorption electrode is specifically electrically connected to the positive electrode of the power supply.

[0183] In the present invention, the method of energizing the low specific resistance material is to introduce positive or negative electrons into the low specific resistance material by means of a conducting electrode. This method of energizing enables the low specific resistance material to quickly obtain electrons after it is prone to losing electrons, so that the low specific resistance material remains in a charged state, and further enables the above-mentioned adsorption electrode to continuously attract the low specific resistance material, so as to adsorb the low specific resistance material. At the same time, the conducting electrode in the present invention can have a positive potential or a negative potential; when the conducting electrode has a positive potential, the adsorption electrode has a negative potential; when the conducting electrode has a negative potential, the adsorption electrode has a positive potential. In the present invention, both the conducting electrode and the adsorption electrode are electrically connected to the power supply for energization. Specifically, the conducting electrode and the adsorption electrode can be respectively electrically connected to the positive and negative electrodes of the power supply for energization. The voltage of this power supply for energization is called the driving voltage for energization, and the selection of the magnitude of the driving voltage for energization is related to the ambient temperature, the medium temperature, etc. For example, the range of the driving voltage for energization of the power supply for energization can be 5 - 50 KV, 10 - 50 KV, 5 - 10 KV, 10 - 20 KV, 20 - 30 KV, 30 - 40 KV, or 40 - 50 KV, from bioelectricity to electricity for controlling space haze. The power supply for energization can be a DC power supply or an AC power supply, and the waveform of its driving voltage for energization can be DC, sine wave, or modulated waveform. The DC power supply is used for the basic application of adsorption; the sine wave is used for movement, such as when the driving voltage for energization of the sine wave acts between the conducting electrode and the adsorption electrode, the electric field generated will drive the charged particles in the electric field, such as droplets, to move towards the adsorption electrode; the ramp wave is used for pulling, and the modulated waveform is adjusted according to the pulling force requirement. For example, at the two ends of the non-symmetric electric field, the pulling force generated on the medium therein has an obvious directionality to drive the medium in the electric field to move along this direction. When the power supply for energization uses an AC power supply, the range of its frequency conversion pulse can be 0.1 Hz - 5 GHz, 0.1 Hz - 1 Hz, 0.5 Hz - 10 Hz, 5 Hz - 100 Hz, 50 Hz - 1 KHz, 1 KHz - 100 KHz, 50 KHz - 1 MHz, 1 MHz - 100 MHz, 50 MHz - 1 GHz, 500 MHz - 2 GHz, or 1 GHz - 5 GHz, which is applicable to the adsorption of organisms to pollutant particles. The conducting electrode of the present invention can be used as a wire, and when it comes into contact with the low specific resistance material, it directly introduces positive and negative electrons into the low specific resistance material. At this time, the low specific resistance material itself can be used as an electrode. In the present invention, during the movement of the low specific resistance material from the conducting electrode to the adsorption electrode, it will repeatedly obtain and lose electrons; at the same time, a large number of electrons are transferred between multiple low specific resistance materials located between the conducting electrode and the adsorption electrode, and finally reach the adsorption electrode, thus forming a current, which is also called the driving current for energization. The magnitude of the driving current for energization is related to the ambient temperature, the medium temperature, the amount of electrons, the amount of adsorbed substances, and the escape amount. For example, as the amount of electrons increases, the movable particles, such as droplets, increase, and the current formed by the moving charged particles will increase accordingly. The more charged substances, such as droplets, are adsorbed per unit time, the greater the current.The escaped droplets are only charged but do not reach the adsorption electrode, that is, effective charge neutralization is not formed. Therefore, under the same conditions, the more escaped droplets there are, the smaller the current. Under the same conditions, the higher the ambient temperature, the faster the gas particles and droplets move, and the higher their own kinetic energy. The probability of their collision with the conductive electrode and the adsorption electrode will be greater, and it is also less likely to be adsorbed by the adsorption electrode, resulting in escape. However, since their escape occurs after charge neutralization and may occur after repeated charge neutralizations, the electron conduction speed is correspondingly increased, and the current also increases accordingly. At the same time, due to the higher ambient temperature, the momentum of gas molecules, droplets, etc. is higher, and it is less likely to be adsorbed by the adsorption electrode. Even after being adsorbed by the adsorption electrode, the probability of escaping again from the adsorption electrode, that is, escaping after charge neutralization, is also greater. Therefore, when the distance between the conductive electrode and the adsorption electrode remains unchanged, it is necessary to increase the above-mentioned upper power driving voltage, and the limit of this upper power driving voltage is to achieve the effect of air breakdown. In addition, the influence of the medium temperature is basically equivalent to that of the ambient temperature. The lower the medium temperature, the smaller the energy required to excite the medium, such as to charge the droplets, and the smaller the kinetic energy it has itself. Under the action of the same electric field force, it is more likely to be adsorbed onto the adsorption electrode, resulting in a larger current. In the present invention, the treatment device has a better adsorption effect on cold substances. As the concentration of the medium, such as droplets, increases, the probability of electron transfer between the charged medium and other media before colliding with the adsorption electrode is greater, so the chance of forming effective charge neutralization will also be greater, and the formed current will also be correspondingly larger. Therefore, when the medium concentration is higher, the formed current is larger. The relationship between the upper power driving voltage and the medium temperature is basically the same as the relationship between the upper power driving voltage and the ambient temperature.

[0184] In an embodiment of the present invention, the power-on driving voltage of the power-on power supply can be less than the initial corona voltage of the corona power supply. In the absence of corona discharge, the electrode of the present invention can also charge the low specific resistance material, and it can conduct electricity without ionization; when the power-on driving voltage is greater than the initial corona voltage of the corona power supply, corona discharge and the electrode conduct electrons to the low specific resistance material, so that the low specific resistance material is charged simultaneously. The corona power supply is a power supply that can cause the electrode or the adsorption electrode to discharge when both the electrode and the adsorption electrode are electrically connected to the corona power supply. When the electrode or the adsorption electrode discharges, it will ionize the gas, so that substances such as soot particles in the gas obtain negative charges. The voltage of this corona power supply is called the corona voltage, and the minimum value of the corona voltage is called the initial corona voltage; that is, in the case where both the electrode and the adsorption electrode are electrically connected to the corona power supply, the minimum voltage value that can cause the electrode or the adsorption electrode to discharge and ionize the gas is called the initial corona voltage. For different gases and different working environments, etc., the magnitude of the initial corona voltage may be different. However, for those skilled in the art, for a determined gas and working environment, the corresponding initial corona voltage is determined. At the same time, in some embodiments of the present invention, the power-on driving voltage can specifically be 0.1 - 2 kv / mm. The power-on driving voltage of the power-on power supply is less than the air corona voltage. In addition, the method for treating low specific resistance materials in the present invention can be applied to treat the exhaust gas of an engine, especially the low specific resistance materials such as water mist in the exhaust gas of the engine can be treated by using the device and method for treating low specific resistance materials in the present invention.

[0185] In an embodiment of the present invention, both the electrode and the adsorption electrode extend in the left-right direction, and the left end of the electrode is to the left of the left end of the adsorption electrode.

[0186] In an embodiment of the present invention, there are two adsorption electrodes, and the electrode is located between the two adsorption electrodes.

[0187] In the present invention, the distance between the conductive electrode and the adsorption electrode can be set according to the magnitude of the applied driving voltage between the two, the flow rate of the low specific resistance substance, and the charging ability of the low specific resistance substance, etc. For example, the distance between the conductive electrode and the adsorption electrode can be 5 - 50 mm, 5 - 10 mm, 10 - 20 mm, 20 - 30 mm, 30 - 40 mm, or 40 - 50 mm. The larger the distance between the conductive electrode and the adsorption electrode, the higher the applied driving voltage required to form a sufficiently strong electric field for driving the charged medium to move rapidly towards the adsorption electrode to prevent the medium from escaping. Under the same conditions, the larger the distance between the conductive electrode and the adsorption electrode, along the direction of the gas flow, the closer to the central position, the faster the substance flow rate; the slower the flow rate of the substance closer to the adsorption electrode; and perpendicular to the gas flow direction, for charged medium particles, such as fog particles, without collision, the longer the time of being accelerated by the electric field with the increase of the distance between the conductive electrode and the adsorption electrode, so the greater the moving speed of the substance in the vertical direction before approaching the adsorption electrode. Under the same conditions, if the applied driving voltage remains unchanged, with the increase of the distance, the electric field strength continuously decreases, and the charging ability of the medium in the electric field becomes weaker.

[0188] In some embodiments of the present invention, the conductive electrode can be one or a combination of multiple forms such as solid, liquid, gas molecular group, or plasma. When the conductive electrode is solid, the conductive electrode can be made of solid metal, such as 304 steel, or other solid conductors, such as graphite, etc.; when the conductive electrode is liquid, the conductive electrode can be an ionic conductive liquid. Additionally, in some embodiments of the present invention, the conductive electrode can also be a conductive mixed-state substance, a natural mixed conductive substance of an organism, or a conductive substance formed by artificial processing of an object. In the present invention, the adsorption electrode is made of a conductive substance, or the surface of the adsorption electrode has a conductive substance.

[0189] In some embodiments of the present invention, the shape of the conductive electrode can be planar, reticular, orifice plate-shaped, plate-shaped, spherical cage-shaped, box-shaped, or tubular. In the present invention, the reticular shape includes any shape with a porous structure. When the conductive electrode is plate-shaped, spherical cage-shaped, box-shaped, or tubular, the conductive electrode can be a non-porous structure or a porous structure. When the conductive electrode is a porous structure, one or more through-holes can be provided on the conductive electrode, and the shape of the through-holes on the conductive electrode can be polygonal, circular, oval, square, rectangular, trapezoidal, or rhombic, etc. The contour size of the through-holes on the conductive electrode can be 0.1 - 3 mm, 0.1 - 0.3 mm, 0.3 - 0.5 mm, 0.5 - 0.8 mm, 0.8 - 1.0 mm, 1.0 - 1.2 mm, 1.2 - 1.0 mm, 1.0 - 1.5 mm, 1.5 - 1.8 mm, 1.8 - 2.0 mm, 2.0 - 2.3 mm, 2.3 - 2.5 mm, 2.5 - 2.8 mm, or 2.8 - 3.0 mm. Additionally, in some embodiments of the present invention, the shape of the conductive electrode can also be the natural form of other substances or the processed form of substances. In the present invention, when the low specific resistance substance passes through the through-holes on the conductive electrode, the low specific resistance substance penetrates through the conductive electrode, increasing the contact area between the low specific resistance substance and the conductive electrode and enhancing the charging efficiency. In the present invention, the through-holes on the conductive electrode are any holes that allow substances to flow through the conductive electrode.

[0190] Meanwhile, in some embodiments of the present invention, the shape of the adsorption electrode can be multi-layer reticular, reticular, orifice plate-shaped, tubular, barrel-shaped, spherical cage-shaped, box-shaped, plate-shaped, granular accumulation layer-shaped, bent plate-shaped, or panel-shaped. When the adsorption electrode is plate-shaped, spherical cage-shaped, box-shaped, or tubular, the adsorption electrode can also be a non-porous structure or a porous structure. When the adsorption electrode is a porous structure, one or more through-holes can be provided on the adsorption electrode, and the shape of the through-holes on the adsorption electrode can be polygonal, circular, oval, square, rectangular, trapezoidal, or rhombic, etc. The contour size of the through-holes on the adsorption electrode can be 0.1 - 3 mm, 0.1 - 0.3 mm, 0.3 - 0.5 mm, 0.5 - 0.8 mm, 0.8 - 1.0 mm, 1.0 - 1.2 mm, 1.2 - 1.0 mm, 1.0 - 1.5 mm, 1.5 - 1.8 mm, 1.8 - 2.0 mm, 2.0 - 2.3 mm, 2.3 - 2.5 mm, 2.5 - 2.8 mm, or 2.8 - 3.0 mm. In the present invention, the through-holes on the adsorption electrode are any holes that allow substances to flow through the adsorption electrode.

[0191] In some embodiments of the present invention, an electric field is formed between the conductive electrode and the adsorption electrode, and the electric field can be various electric fields such as a mesh surface electric field or a mesh barrel electric field. For example: the conductive electrode is in a mesh shape, the adsorption electrode is in a planar shape, and the conductive electrode is parallel to the adsorption electrode, thus forming a mesh surface electric field; or the conductive electrode is in a mesh shape and is fixed by metal wires or metal needles, the adsorption electrode is in a barrel shape, and the conductive electrode is located at the geometric symmetry center of the adsorption electrode, thus forming a mesh barrel electric field. When the adsorption electrode is in a planar shape, it can specifically be a planar shape, a curved surface shape, or a spherical surface shape. When the conductive electrode is in a mesh shape, it can specifically be a planar shape, a spherical surface shape, or other geometric surface shapes, and can also be rectangular or irregular in shape. When the adsorption electrode is in a barrel shape, the adsorption electrode can further evolve into various box shapes. The conductive electrode can also be correspondingly changed to form an electrode and an electric field layer sleeve.

[0192] In one embodiment of the present invention, the conductive electrode is perpendicular to the adsorption electrode. In one embodiment of the present invention, the conductive electrode and the adsorption electrode are parallel to each other. In one embodiment of the present invention, both the conductive electrode and the adsorption electrode are in a planar shape, and the conductive electrode and the adsorption electrode are parallel to each other. In one embodiment of the present invention, the conductive electrode uses a metal wire mesh. In one embodiment of the present invention, the conductive electrode is in a planar shape or a spherical surface shape. In one embodiment of the present invention, the adsorption electrode is in a curved surface shape or a spherical surface shape. In one embodiment of the present invention, the conductive electrode is in a mesh shape, the adsorption electrode is in a barrel shape, the conductive electrode is located inside the adsorption electrode, and the conductive electrode is located on the central symmetry axis of the adsorption electrode.

[0193] In the present invention, the conductive electrode and the adsorption electrode form an adsorption unit. There may be one or more adsorption units, and the specific number is determined according to actual needs. In one embodiment, there is one adsorption unit. In another embodiment, there are multiple adsorption units to adsorb more low specific resistance substances by using multiple adsorption units, thereby improving the efficiency of collecting low specific resistance substances. When there are multiple adsorption units, the distribution form of all the adsorption units can be flexibly adjusted according to needs; all the adsorption units can be the same or different. For example, all the adsorption units can be distributed in one or more directions among the longitudinal, transverse, diagonal, and spiral directions to meet the requirements of different air volumes. All the adsorption units can be distributed in a rectangular array or in a pyramid shape. The conductive electrodes and adsorption electrodes of the above various shapes can be freely combined to form an adsorption unit. For example, a linear conductive electrode is inserted into a tubular adsorption electrode to form an adsorption unit, and then combined with a linear conductive electrode to form a new adsorption unit. At this time, the two linear conductive electrodes can be electrically connected; the new adsorption unit is then distributed in one or more directions among the longitudinal, transverse, diagonal, and spiral directions. For another example, a linear conductive electrode is inserted into a tubular adsorption electrode to form an adsorption unit, and this adsorption unit is distributed in one or more directions among the longitudinal, transverse, diagonal, and spiral directions to form a new adsorption unit, and this new adsorption unit is then combined with the conductive electrodes of the above various shapes to form a new adsorption unit. In the present invention, the distance between the conductive electrode and the adsorption electrode in the adsorption unit can be arbitrarily adjusted to adapt to the requirements of different working voltages and adsorption objects. Different adsorption units in the present invention can be combined. Different adsorption units in the present invention can use the same power-on power supply or different power-on power supplies. When using different power-on power supplies, the power-on driving voltages of each power-on power supply can be the same or different. In addition, there may be multiple processing devices in the present invention, and all the processing devices can be distributed in one or more directions among the longitudinal, transverse, diagonal, and spiral directions.

[0194] In an embodiment of the present invention, the low specific resistance material treatment device further includes a housing, which includes an inlet, an outlet, and a flow channel. The two ends of the flow channel are respectively communicated with the inlet and the outlet. In an embodiment of the present invention, the inlet is circular, and the diameter of the inlet is 300 - 1000 mm, or 500 mm. In an embodiment of the present invention, the outlet is circular, and the diameter of the outlet is 300 - 1000 mm, or 500 mm. In an embodiment of the present invention, the housing includes a first barrel body, a second barrel body, and a third barrel body that are sequentially distributed in the direction from the inlet to the outlet. The inlet is located at one end of the first barrel body, and the outlet is located at one end of the third barrel body. In an embodiment of the present invention, the contour size of the first barrel body gradually increases in the direction from the inlet to the outlet. In an embodiment of the present invention, the first barrel body is in a straight tube shape. In an embodiment of the present invention, the second barrel body is in a straight tube shape, and the conductive electrode and the adsorption electrode are installed in the second barrel body. In an embodiment of the present invention, the contour size of the third barrel body gradually decreases in the direction from the inlet to the outlet. In an embodiment of the present invention, the cross-sections of the first barrel body, the second barrel body, and the third barrel body are all rectangular. In an embodiment of the present invention, the cross-section of the second barrel body is rectangular. In an embodiment of the present invention, the material of the housing is stainless steel, aluminum alloy, ferroalloy, cloth, sponge, molecular sieve, activated carbon, foam iron, or foam silicon carbide. In an embodiment of the present invention, the conductive electrode is connected to the housing through an insulating member. In an embodiment of the present invention, the material of the insulating member is insulating mica. In an embodiment of the present invention, the insulating member is in a columnar shape or a tower shape. In an embodiment of the present invention, the conductive electrode is provided with a cylindrical front connection portion, and the front connection portion is fixedly connected to the insulating member. In an embodiment of the present invention, a cylindrical rear connection portion is provided on the adsorption electrode or the inner wall of the housing, and the rear connection portion is fixedly connected to the insulating member.

[0195] In some embodiments of the present invention, the low specific resistance material treatment device further includes a housing having an inlet and an outlet, and the above-mentioned conductive electrode and adsorption electrode are both installed in the housing. During the process of collecting the low specific resistance material, the low specific resistance material enters the housing from the inlet and moves towards the outlet; during the movement of the low specific resistance material towards the outlet, the low specific resistance material will pass through the conductive electrode and become charged; the adsorption electrode will adsorb the charged low specific resistance material to collect the low specific resistance material on the adsorption electrode. The present invention uses the housing to guide the low specific resistance material to flow through the conductive plate, so as to charge the low specific resistance material by using the conductive electrode and collect the low specific resistance material by using the adsorption electrode, thereby effectively reducing the amount of the low specific resistance material flowing out from the outlet. In some embodiments of the present invention, the material of the housing can be metal, non-metal, conductor, non-conductor, water, various conductive liquids, various porous materials, or various foam materials, etc. When the material of the housing is metal, the specific material can be stainless steel, or aluminum alloy, etc. When the material of the housing is non-metal, the specific material can be cloth, or sponge, etc. When the material of the housing is a conductor, the specific material can be ferroalloy, etc. When the material of the housing is a non-conductor, a water layer is formed on its surface and the water becomes the electrode, such as a sand layer after absorbing water. When the material of the housing is water and various conductive liquids, the housing is stationary or flowing. When the material of the housing is various porous materials, the specific material can be molecular sieve or activated carbon. When the material of the housing is various foam materials, the specific material can be foam iron, foam silicon carbide, etc. In an embodiment of the present invention, the conductive electrode is fixedly connected to the housing through an insulating member, and the material of the insulating member can be insulating mica. At the same time, in an embodiment of the present invention, the adsorption electrode is directly electrically connected to the housing, and this connection method enables the housing to have the same electric potential as the adsorption electrode, so that the housing can also adsorb the charged low specific resistance material, and the housing also constitutes an adsorption electrode. The above-mentioned flow channel is provided in the housing, and the conductive electrode is installed in the flow channel.

[0196] When low specific resistance materials such as water mist adhere to the adsorption electrode, condensation will form. In some embodiments of the present invention, the adsorption electrode can extend in the up and down direction. In this way, when the condensation accumulated on the adsorption electrode reaches a certain weight, it will flow downward along the adsorption electrode under the action of gravity and finally converge at a set position or in the device, so as to realize the recovery of the low specific resistance materials adhering to the adsorption electrode. This treatment device can be used for refrigeration and defogging. In addition, an external electric field can also be used to collect the materials adhering to the adsorption plate. The collection direction of the materials on the adsorption plate can be the same as the air flow or different from the air flow direction. In specific implementation, because it is necessary to make full use of the gravity effect to make the water droplets or water layer on the adsorption electrode flow into the collection tank as soon as possible; at the same time, the air flow direction and its acting force will be utilized as much as possible to accelerate the flow rate of the water on the adsorption electrode. Therefore, according to different installation conditions, as well as the convenience, economy and feasibility of insulation, etc., the above-mentioned purpose will be achieved as much as possible, without being restricted to a specific direction.

[0197] In some embodiments of the present invention, the above-mentioned processing device can be used independently as an adsorption device for low specific resistance substances. At the same time, in some embodiments of the present invention, the above-mentioned processing device can also be used in combination with a refrigeration device, a catalytic device, a corona device, a heating device, a centrifugal device, a screening device, an electromagnetic device, an irradiation device, etc. to achieve functions such as condensation, catalysis, corona, heating, centrifugation, screening, etc. In addition, the above-mentioned devices can be arbitrarily combined according to the on-site needs.

[0198] In addition, the existing electrostatic field charging theory uses corona discharge to ionize oxygen to generate a large number of negative oxygen ions. The negative oxygen ions contact the dust, and the dust is charged. The charged dust is adsorbed by the opposite pole. However, when encountering low specific resistance substances such as water mist, metal particles, and conductor dust, the existing electric field adsorption effect is almost non-existent. Because low specific resistance substances are prone to losing electricity after getting electricity. When the moving negative oxygen ions charge the low specific resistance substances, the low specific resistance substances will quickly lose electricity again, and the negative oxygen ions only move once, resulting in the low specific resistance substances being difficult to be charged again after losing electricity, or this charging method greatly reduces the charging probability of the low specific resistance substances, making the low specific resistance substances in an overall uncharged state. In this way, it is difficult for the opposite pole to continuously apply an adsorption force to the low specific resistance substances, ultimately resulting in extremely low adsorption efficiency of the existing electric field for low specific resistance substances. In some embodiments of the present invention, the above-mentioned processing device and processing method do not use the charging method to charge these low specific resistance substances, but directly transfer electrons to the low specific resistance substances to make them charged. After a certain low specific resistance substance is charged and then loses electricity, new electrons will quickly be transferred from the conducting electrode and through other low specific resistance substances to the low specific resistance substance that has lost electricity, enabling the low specific resistance substance to quickly get electricity again after losing electricity, greatly increasing the charging probability of the low specific resistance substances. Repeating this process makes the low specific resistance substances in an overall charged state, and enables the adsorption pole to continuously apply an attractive force to the low specific resistance substances until the low specific resistance substances are adsorbed, thereby ensuring higher collection efficiency of the present processing device for low specific resistance substances. The method for charging low specific resistance substances adopted by the present invention does not require the use of a corona wire, a corona electrode, or a corona plate, etc., simplifies the overall structure of the present processing device, and reduces the manufacturing cost of the present processing device. At the same time, by adopting the above-mentioned power-on method, a large number of electrons on the conducting electrode will be transferred to the adsorption pole through the low specific resistance substances and form a current. When the concentration of the low specific resistance substances flowing through the present processing device is higher, the electrons on the conducting electrode are more likely to be transferred to the adsorption pole through the low specific resistance substances, and more electrons will be transferred between the low specific resistance substances, making the current formed between the conducting electrode and the adsorption pole larger, increasing the charging probability of the low specific resistance substances, and making the collection efficiency of the present processing device for low specific resistance substances higher. The above-mentioned processing method in the present invention can be used as a new method for chimney white smoke removal and demisting. The processing device in the present invention can be added to a wet electrostatic precipitator.

[0199] In an embodiment of the present invention, a method for treating low specific resistance substances is provided, including the following steps:

[0200] Let the low specific resistance substances flow through the conducting electrode;

[0201] When the low specific resistance substances flow through the conducting electrode, the conducting electrode charges the low specific resistance substances, and the adsorption electrode exerts an attractive force on the charged low specific resistance substances, causing the low specific resistance substances to move towards the adsorption electrode until the low specific resistance substances adhere to the adsorption electrode.

[0202] In an embodiment of the present invention, the step of letting the low specific resistance substances flow through the conducting electrode includes: electrons are transferred between the low specific resistance substances located between the conducting electrode and the adsorption electrode, causing more low specific resistance substances to be charged.

[0203] In an embodiment of the present invention, electrons are conducted between the conducting electrode and the adsorption electrode through the low specific resistance substances and a current is formed.

[0204] In an embodiment of the present invention, the step of letting the low specific resistance substances flow through the conducting electrode includes: the conducting electrode charges the low specific resistance substances by contacting with the low specific resistance substances.

[0205] In an embodiment of the present invention, the low specific resistance substances adhering to the adsorption electrode gather together.

[0206] In an embodiment of the present invention, let the gas with nitric acid mist flow through the conducting electrode; when the gas with nitric acid mist flows through the conducting electrode, the conducting electrode charges the nitric acid mist in the gas, and the adsorption electrode exerts an attractive force on the charged nitric acid mist, causing the nitric acid mist to move towards the adsorption electrode until the nitric acid mist adheres to the adsorption electrode.

[0207] In an embodiment of the present invention, the step of the conducting electrode introducing electrons into the nitric acid mist includes: electrons are transferred between the droplets located between the conducting electrode and the adsorption electrode, causing more droplets to be charged.

[0208] In an embodiment of the present invention, electrons are conducted between the conducting electrode and the adsorption electrode through the nitric acid mist and a current is formed.

[0209] In an embodiment of the present invention, the step of the conducting electrode introducing electrons into the nitric acid mist includes: the conducting electrode charges the nitric acid mist by contacting with the nitric acid mist.

[0210] In the above embodiments of the present invention, a housing is further included. The inlet and the outlet are both arranged on the housing. The conducting electrode and the adsorption electrode are both installed in the housing, and the flow channel is located in the housing between the inlet and the outlet.

[0211] In an embodiment of the present invention, a method for treating low specific resistance substances is provided, including the following steps:

[0212] Conduct electrons to the low specific resistance material through a conducting electrode to charge the low specific resistance material;

[0213] Use an adsorption electrode to attract the charged low specific resistance material, causing the charged low specific resistance material to move towards the adsorption electrode;

[0214] At least one through hole is provided on the conducting electrode. When the low specific resistance material passes through the through hole on the conducting electrode, the low specific resistance material passes through the conducting electrode to charge the low specific resistance material.

[0215] In the above embodiments of the present invention, the step of conducting electrons to the low specific resistance material through the conducting electrode includes: enabling electrons to be transferred between the low specific resistance materials located between the conducting electrode and the adsorption electrode, so that more low specific resistance materials are charged.

[0216] In the above embodiments of the present invention, electrons are conducted between the conducting electrode and the adsorption electrode through the low specific resistance material and a current is formed, which is the discharge current of the conducting electrode.

[0217] In the above embodiments of the present invention, the step of conducting electrons to the low specific resistance material through the conducting electrode includes: the conducting electrode charges the low specific resistance material by contacting the low specific resistance material.

[0218] In an embodiment of the present invention, both the conducting electrode and the adsorption electrode are installed in a housing, and the housing has an inlet and an outlet.

[0219] In the above embodiments of the present invention, a flow channel is further included in the housing, and the flow channel is located in the housing between the inlet and the outlet.

[0220] In the above embodiments of the present invention, the ratio of the cross-sectional area of the conducting electrode to the cross-sectional area of the flow channel is 99% - 10%.

[0221] An embodiment of the present invention provides a low specific resistance material processing device, including:

[0222] A conducting electrode capable of conducting electrons to a low specific resistance material; when electrons are conducted to the low specific resistance material, the low specific resistance material is charged;

[0223] An adsorption electrode capable of applying an attractive force to the charged low specific resistance material;

[0224] At least one through hole is provided on the conducting electrode.

[0225] In the above embodiments of the present invention, when the low specific resistance material passes through the through hole on the conducting electrode, the low specific resistance material passes through the conducting electrode to charge the low specific resistance material.

[0226] In the above embodiments of the present invention, it further includes a housing having an inlet and an outlet, and both the conductive electrode and the adsorption electrode are installed in the housing.

[0227] In the above embodiments of the present invention, a flow channel is further included in the housing, and the flow channel is located in the housing between the inlet and the outlet.

[0228] In the above embodiments of the present invention, the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99% - 10%.

[0229] In one embodiment of the present invention, a method for treating a low specific resistance substance is provided, including the following steps:

[0230] The low specific resistance substance enters the flow channel from the inlet and moves towards the outlet direction; electrons are conducted to the low specific resistance substance by the conductive electrode to make the low specific resistance substance charged;

[0231] The charged low specific resistance substance is attracted by the adsorption electrode to make the charged low specific resistance substance move towards the adsorption electrode;

[0232] The ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99% - 10%.

[0233] In the above embodiments of the present invention, the step of conducting electrons to the low specific resistance substance by the conductive electrode includes: electrons are transferred between the low specific resistance substances located between the conductive electrode and the adsorption electrode to make more low specific resistance substances charged.

[0234] In the above embodiments of the present invention, electrons are conducted between the conductive electrode and the adsorption electrode through the low specific resistance substance and a current is formed, which is the discharge current of the conductive electrode.

[0235] In the above embodiments of the present invention, the step of conducting electrons to the low specific resistance substance by the conductive electrode includes: the conductive electrode makes the low specific resistance substance charged by contacting the low specific resistance substance.

[0236] In the above embodiments of the present invention, both the conductive electrode and the adsorption electrode are installed in a housing, and the housing has an inlet and an outlet.

[0237] In the above embodiments of the present invention, the flow channel is located in the housing between the inlet and the outlet.

[0238] In one embodiment of the present invention, a device for treating a low specific resistance substance is provided, including:

[0239] Including an inlet, an outlet, and a flow channel located between the inlet and the outlet;

[0240] A conductive electrode, located in the flow channel, can conduct electrons to a low specific resistance substance; when the electrons are conducted to the low specific resistance substance, the low specific resistance substance becomes charged;

[0241] An adsorption electrode, located in the flow channel, can apply an attractive force to the charged low specific resistance substance;

[0242] The ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99% - 10%.

[0243] In some embodiments of the present invention, "conducting" electrons to the low specific resistance substance by the conductive electrode means that when the conductive electrode contacts the uncharged low specific resistance substance, the electrons on the conductive electrode are transferred to the low specific resistance substance, making the low specific resistance substance carry the same charge as the conductive electrode, and the charged low specific resistance substance transfers the charge to other uncharged low specific resistance substances, making more low specific resistance substances charged.

[0244] The following is a description of the embodiments of the present invention by specific specific examples. Those familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0245] It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have technical essential significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle", and "one" cited in this specification are only for the convenience of description and are not used to limit the scope under which the present invention can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present invention can be implemented.

[0246] The first embodiment

[0247] As Figures 1 to 3 shown, this embodiment provides a low specific resistance substance treatment device, including:

[0248] A conductive electrode 301, which can conduct electrons to a low specific resistance substance; when the electrons are conducted to the low specific resistance substance, the low specific resistance substance becomes charged;

[0249] An adsorption electrode 302, which can apply an attractive force to the charged low specific resistance substance.

[0250] At the same time, as Figure 1As shown in the figure, in this embodiment, the low specific resistance material treatment device further includes a housing 303 having an inlet 3031 and an outlet 3032. The conductive electrode 301 and the adsorption electrode 302 are both installed in the housing 303. The conductive electrode 301 is fixedly connected to the inner wall of the housing 303 through an insulating member 304, and the adsorption electrode 302 is directly fixedly connected to the housing 303. In this embodiment, the insulating member 304 is columnar and is also called an insulating column. In another embodiment, the insulating member 304 can also be tower-shaped, etc. The main function of this insulating member 304 is to prevent pollution and leakage of electricity. In this embodiment, both the conductive electrode 301 and the adsorption electrode 302 are in a mesh shape (that is, a number of through holes are provided on both the conductive electrode and the adsorption electrode), and both are between the inlet 3031 and the outlet 3032. The conductive electrode 301 has a negative electric potential, and the adsorption electrode 302 has a positive electric potential. At the same time, in this embodiment, the housing 303 and the adsorption electrode 302 have the same electric potential, and the housing 303 also has an adsorption effect on charged substances. In this embodiment, a flow channel 3036 is provided in the housing, and the conductive electrode 301 and the adsorption electrode 302 are both installed in the flow channel 3036, and the cross-sectional area ratio of the conductive electrode 301 to the cross-sectional area of the flow channel 3036 is 70%.

[0251] This embodiment also provides a method for treating low specific resistance substances, which is used to treat industrial waste gas containing acid mist (in this embodiment, the industrial waste gas is the exhaust gas of an engine), and includes the following steps: using the conductive electrode 301 to conduct electrons to the acid mist in the industrial waste gas to make the acid mist charged; using the adsorption electrode 302 to attract the charged acid mist to make the charged acid mist move towards the adsorption electrode 302. Specifically, in this embodiment, the inlet 3031 is connected to the port for discharging industrial waste gas, as Figure 1 shown, the working process and working principle are as follows: The industrial waste gas flows into the housing 303 from the inlet 3031 and flows out through the outlet 3032; during this process, the industrial waste gas will flow through the conductive electrode 301. When the acid mist in the industrial waste gas contacts the conductive electrode 301 or reaches a certain distance from the conductive electrode 301, the conductive electrode 301 transfers electrons to the acid mist, making the acid mist charged. The adsorption electrode 302 exerts an attractive force on the charged acid mist, and the acid mist moves towards the adsorption electrode 302 and adheres to the adsorption electrode 302; due to the characteristic that the acid mist is easy to carry and lose electrons, a certain charged droplet will lose electrons during the movement towards the adsorption electrode 302. At this time, other charged droplets will quickly transfer electrons to the droplet that has lost electrons. This process repeats, and the droplets are in a continuous charged state. The adsorption electrode 302 can continuously exert an adsorption force on the droplets and make the droplets adhere to the adsorption electrode 302, thereby realizing the removal of acid mist in the industrial waste gas, avoiding the direct emission of acid mist into the atmosphere and causing pollution to the atmosphere.

[0252] The parameters in the treatment method and treatment device provided in this embodiment are shown in Table 1 as follows:

[0253] Table 1

[0254] 1 The voltage between the conductive electrode and the adsorption electrode, i.e., the power-on driving voltage 12 KV 2 Conductive electrode discharge current 0.01A 3 Initial corona voltage 5.5 KV 4 Ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel 70％ 5 Spacing between the conductive electrode and the adsorption electrode 10 mm

[0255] In this embodiment, the conductive electrode 301 and the adsorption electrode 302 form an adsorption unit. And when there is only one adsorption unit, the low specific resistance substance treatment device and treatment method in this embodiment can remove 80% of the acid mist in the industrial waste gas, greatly reducing the emission of acid mist and having a significant environmental protection effect.

[0256] As Figure 2 shown, in this embodiment, there are 3 first connection parts 3011 provided on the conductive electrode 301, and the 3 first connection parts 3011 are respectively fixedly connected to 3 second connection parts on the inner wall of the outer shell 303 through 3 insulating parts 304. This connection form can effectively enhance the connection strength between the conductive electrode 301 and the outer shell 303. In this embodiment, the first connection part 3011 is cylindrical, and in other embodiments, the first connection part 3011 can also be in the shape of a tower, etc. In this embodiment, the insulating part 304 is cylindrical, and in other embodiments, the insulating part 304 can also be in the shape of a tower, etc. In this embodiment, the second connection part is cylindrical, and in other embodiments, the insulating part 304 can also be in the shape of a tower, etc. As Figure 1 shown, in this embodiment, the outer shell 303 includes a first barrel part 3033, a second barrel part 3034, and a third barrel part 3035 that are sequentially distributed in the direction from the inlet 3031 to the outlet 3032. The inlet 3031 is located at one end of the first barrel part 3033, and the outlet 3032 is located at one end of the third barrel part 3035. The contour size of the first barrel part 3033 gradually increases in the direction from the inlet 3031 to the outlet 3032, and the contour size of the third barrel part 3035 gradually decreases in the direction from the inlet 3031 to the outlet 3032. In this embodiment, the cross-section of the second barrel part 3034 is rectangular. The outer shell 303 in this embodiment adopts the above structural design, so that the waste gas reaches a certain inlet flow rate at the inlet 3031, and more importantly, it can make the gas flow distribution more uniform, so that the medium in the waste gas, such as droplets, is more likely to be charged under the excitation of the conductive electrode 301. At the same time, the outer shell 303 is more convenient to encapsulate, reduces the material usage, saves space, can be connected by pipes, and also takes into account insulation. Any outer shell 303 that can achieve the above effects is acceptable.

[0257] In this embodiment, both the inlet 3031 and the outlet 3032 are circular. The inlet 3031 can also be called the air inlet, and the outlet 3032 can also be called the air outlet. In this embodiment, the diameter of the inlet 3031 is 300 mm - 1000 mm, specifically 500 mm. At the same time, in this embodiment, the diameter of the outlet 3032 is 300 mm - 1000 mm, specifically 500 mm.

[0258] The second embodiment

[0259] As Figure 4 and Figure 5As shown, this embodiment provides a low specific resistance material processing device, including:

[0260] A conducting electrode 301 that can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material becomes charged.

[0261] An adsorption electrode 302 that can apply an attractive force to the charged low specific resistance material.

[0262] As Figure 4 and Figure 5 shown, in this embodiment, there are two conducting electrodes 301, and both of the two conducting electrodes 301 are net-shaped and spherical cage-shaped. In this embodiment, there is one adsorption electrode 302, and this adsorption electrode 302 is net-shaped and spherical cage-shaped. The adsorption electrode 302 is located between the two conducting electrodes 301. At the same time, as Figure 4 shown, the low specific resistance material processing device in this embodiment further includes a housing 303 having an inlet 3031 and an outlet 3032, and both the conducting electrode 301 and the adsorption electrode 302 are installed in the housing 303. And the conducting electrode 301 is fixedly connected to the inner wall of the housing 303 through an insulating member 304, and the adsorption electrode 302 is directly fixedly connected to the housing 303. In this embodiment, the insulating member 304 is columnar and is also called an insulating column. In this embodiment, the conducting electrode 301 has a negative electric potential, and the adsorption electrode 302 has a positive electric potential. At the same time, in this embodiment, the housing 303 and the adsorption electrode 302 have the same electric potential, and this housing 303 also has an adsorption effect on the charged material.

[0263] This embodiment also provides a processing method using the above low specific resistance material processing device for processing industrial waste gas containing acid mist, including the following steps: using the conducting electrode 301 to conduct electrons to the acid mist in the industrial waste gas to make the acid mist charged; using the adsorption electrode 302 to attract the charged acid mist to make the charged acid mist move towards the adsorption electrode 302. Specifically, in this embodiment, the inlet 3031 is connected to the port for discharging industrial waste gas, as Figure 4As shown in the figure, the working process and principle are as follows: The industrial waste gas flows into the outer shell 303 from the inlet 3031 and flows out through the outlet 3032; during this process, the industrial waste gas will first flow through one of the conductive electrodes 301. When the acid mist in the industrial waste gas contacts the conductive electrode 301 or reaches a certain distance from the conductive electrode 301, the conductive electrode 301 transfers electrons to the acid mist, and part of the acid mist becomes charged. The adsorption electrode 302 exerts an attractive force on the charged acid mist, and the acid mist moves towards the adsorption electrode 302 and adheres to the adsorption electrode 302; another part of the acid mist is not adsorbed on the adsorption electrode 302, and this part of the acid mist continues to flow towards the outlet 3032. When this part of the acid mist contacts another conductive electrode 301 or reaches a certain distance from another conductive electrode 301, this part of the acid mist will become charged, and the outer shell 303 exerts an adsorption force on this part of the charged acid mist, causing this part of the charged acid mist to adhere to the inner wall of the outer shell 303, thus greatly reducing the emission of acid mist in the industrial waste gas. In this embodiment, the treatment device and the treatment method can remove 90% of the acid mist in the industrial waste gas, and the effect of removing acid mist is very remarkable. In addition, in this embodiment, both the inlet 3031 and the outlet 3032 are circular. The inlet 3031 can also be called the air inlet, and the outlet 3032 can also be called the air outlet.

[0264] The parameters in the treatment method and treatment device provided in this embodiment are shown in Table 2:

[0265] Table 2

[0266] 1 The voltage between the conductive electrode and the adsorption electrode, i.e., the power-on driving voltage 5 KV 2 Conductive electrode discharge current 0.005A 3 Initial corona voltage 5.5 KV 4 Ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel 75％ 5 Spacing between the conductive electrode and the adsorption electrode 10 mm

[0267] The third embodiment

[0268] This embodiment provides a treatment device for low specific resistance substances, including:

[0269] A conductive electrode that can conduct electrons to the low specific resistance substance; when electrons are conducted to the low specific resistance substance, the low specific resistance substance becomes charged;

[0270] An adsorption electrode that can exert an attractive force on the charged low specific resistance substance.

[0271] In this embodiment, the conductive electrode is in a mesh shape and the conductive electrode has a negative electric potential. At the same time, in this embodiment, the adsorption electrode is in a planar shape and the adsorption electrode has a positive electric potential. This adsorption electrode is also called a collecting electrode. In this embodiment, the adsorption electrode is specifically in a planar shape and the conductive electrode is parallel to the adsorption electrode. In this embodiment, a mesh surface electric field is formed between the conductive electrode and the adsorption electrode. In addition, in this embodiment, the conductive electrode is made of a mesh structure formed by metal wires, and the conductive electrode is composed of a metal wire mesh. In this embodiment, the area of the adsorption electrode is larger than the area of the conductive electrode.

[0272] The fourth embodiment

[0273] This embodiment provides a treatment device for low specific resistance substances, including:

[0274] A conductive electrode that can conduct electrons to a low specific resistance substance; when the electrons are conducted to the low specific resistance substance, the low specific resistance substance becomes charged;

[0275] An adsorption electrode that can apply an attractive force to the charged low specific resistance substance.

[0276] In this embodiment, the conductive electrode is in a mesh shape and the conductive electrode has a negative electric potential. At the same time, in this embodiment, the adsorption electrode is in a barrel shape and the adsorption electrode has a positive electric potential. This adsorption electrode is also called a collection electrode. In this embodiment, the conductive electrode is fixed by a metal wire or a metal needle. And in this embodiment, the conductive electrode is located at the geometric symmetry center of the barrel-shaped adsorption electrode. A mesh-barrel electric field is formed between the conductive electrode and the adsorption electrode in this embodiment.

[0277] The fifth embodiment

[0278] This embodiment provides a low specific resistance substance treatment device, including:

[0279] A conductive electrode that can conduct electrons to a low specific resistance substance; when the electrons are conducted to the low specific resistance substance, the low specific resistance substance becomes charged;

[0280] An adsorption electrode that can apply an attractive force to the charged low specific resistance substance.

[0281] In this embodiment, there are two adsorption electrodes, and the conductive electrode is located between the two adsorption electrodes. The length of the conductive electrode in the left-right direction is greater than the length of the adsorption electrode in the left-right direction, and the left end of the conductive electrode is located to the left of the adsorption electrode. The left end of the conductive electrode and the left end of the adsorption electrode form a power line extending obliquely. An asymmetric electric field is formed between the conductive electrode and the adsorption electrode in this embodiment. When in use, low specific resistance substances, such as droplets, enter between the two adsorption electrodes from the left. After some droplets become charged, they move obliquely from the left end of the conductive electrode to the left end of the adsorption electrode, thus forming a pulling effect on the droplets.

[0282] The sixth embodiment

[0283] This embodiment provides a low specific resistance substance treatment device, including:

[0284] A conductive electrode that can conduct electrons to a low specific resistance substance; when the electrons are conducted to the low specific resistance substance, the low specific resistance substance becomes charged;

[0285] An adsorption electrode that can apply an attractive force to the charged low specific resistance substance.

[0286] In this embodiment, the conductive electrode and the adsorption electrode form an adsorption unit. In this embodiment, there are multiple adsorption units, and all the adsorption units are distributed horizontally. Specifically, all the adsorption units in this embodiment are distributed in the left-right direction.

[0287] The seventh embodiment

[0288] This embodiment provides a low specific resistance material processing device, including:

[0289] A conductive electrode that can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material becomes charged;

[0290] An adsorption electrode that can apply an attractive force to the charged low specific resistance material.

[0291] In this embodiment, the conductive electrode and the adsorption electrode constitute an adsorption unit. There are multiple adsorption units in this embodiment, and all the adsorption units are distributed along the longitudinal direction.

[0292] The eighth embodiment

[0293] This embodiment provides a low specific resistance material processing device, including:

[0294] A conductive electrode that can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material becomes charged;

[0295] An adsorption electrode that can apply an attractive force to the charged low specific resistance material.

[0296] In this embodiment, the conductive electrode and the adsorption electrode constitute an adsorption unit. There are multiple adsorption units in this embodiment, and all the adsorption units are distributed obliquely.

[0297] The ninth embodiment

[0298] This embodiment provides a low specific resistance material processing device, including:

[0299] A conductive electrode that can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material becomes charged;

[0300] An adsorption electrode that can apply an attractive force to the charged low specific resistance material.

[0301] In this embodiment, the conductive electrode and the adsorption electrode constitute an adsorption unit. There are multiple adsorption units in this embodiment, and all the adsorption units are distributed in a spiral direction.

[0302] The tenth embodiment

[0303] This embodiment provides a low specific resistance material processing device, including:

[0304] A conductive electrode that can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material becomes charged;

[0305] An adsorption electrode that can apply an attractive force to the charged low specific resistance material.

[0306] In this embodiment, the conductive electrode and the adsorption electrode form an adsorption unit. There are multiple adsorption units in this embodiment, and all the adsorption units are distributed horizontally, vertically, and obliquely.

[0307] The eleventh embodiment

[0308] This embodiment provides a gas treatment system based on an engine, including the above-mentioned low specific resistance material treatment device and a venturi plate. In this embodiment, the low specific resistance material treatment device is used in combination with the venturi plate.

[0309] The twelfth embodiment

[0310] This embodiment provides a gas treatment system based on an engine, including the above-mentioned low specific resistance material treatment device, a venturi plate, a NOx oxidation catalytic device, and an ozone decomposition device. In this embodiment, the low specific resistance material treatment device and the venturi plate are located between the NOx oxidation catalytic device and the ozone decomposition device. And the NOx oxidation catalytic device has a NOx oxidation catalyst, and the ozone decomposition device has an ozone decomposition catalyst.

[0311] The thirteenth embodiment

[0312] This embodiment provides a gas treatment system based on an engine, including the above-mentioned low specific resistance material treatment device, a corona device, and a venturi plate, wherein the low specific resistance material treatment device is located between the corona device and the venturi plate.

[0313] The fourteenth embodiment

[0314] This embodiment provides a gas treatment system based on an engine, including the above-mentioned low specific resistance material treatment device, a heating device, and an ozone decomposition device, wherein the heating device is located between the low specific resistance material treatment device and the ozone decomposition device.

[0315] The fifteenth embodiment

[0316] This embodiment provides a gas treatment system based on an engine, including the above-mentioned low specific resistance material treatment device, a centrifugal device, and a venturi plate, wherein the low specific resistance material treatment device is located between the centrifugal device and the venturi plate.

[0317] The sixteenth embodiment

[0318] This embodiment provides a gas treatment system based on an engine, including the above-mentioned low specific resistance material treatment device, a corona device, a venturi plate, and a molecular sieve, wherein the venturi plate and the low specific resistance material treatment device are located between the corona device and the molecular sieve.

[0319] The seventeenth embodiment

[0320] This embodiment provides a gas treatment system based on an engine, which includes the above-mentioned low specific resistance substance treatment device, corona device and electromagnetic device, wherein the low specific resistance substance treatment device is located between the corona device and the electromagnetic device.

[0321] The eighteenth embodiment

[0322] This embodiment provides a gas treatment system based on an engine, which includes the above-mentioned low specific resistance substance treatment device, corona device and irradiation device, wherein the irradiation device is located between the corona device and the low specific resistance substance treatment device.

[0323] The nineteenth embodiment

[0324] This embodiment provides a gas treatment system based on an engine, which includes the above-mentioned low specific resistance substance treatment device, corona device and wet electrostatic precipitator, wherein the wet electrostatic precipitator is located between the corona device and the low specific resistance substance treatment device.

[0325] The twentieth embodiment

[0326] As Figure 6 shown, this embodiment provides a gas treatment system based on an engine, which includes an intake device. Figure 1 is a schematic structural diagram of the intake device. The intake device 101 includes an intake port 1011, a separation mechanism 1012, a first water filtration mechanism 1013, an electrostatic dust removal mechanism 1014, an insulation mechanism 1015, an air distribution mechanism, a second water filtration mechanism 1017 and / or an ozone mechanism 1018. In this embodiment, the first water filtration mechanism 1013 is the low specific resistance substance treatment device provided by the present invention.

[0327] As Figure 6 shown, the intake port 1011 is arranged on the intake wall of the separation mechanism 1012 to receive the gas with particulate matter.

[0328] The electrostatic dust removal mechanism 1014 includes an anode dust accumulation part 10141 and a first cathode discharge part 10142 arranged in the anode dust accumulation part 10141. An asymmetric electrostatic field is formed between the anode dust accumulation part 10141 and the cathode discharge part 10142.

[0329] The first water filtration mechanism 1013 arranged in the separation mechanism 1012 includes a conductive electrode arranged at the intake port 1011, which is a conductive grid plate. The conductive grid plate is used to conduct electrons to the low specific resistance substance after being powered on. The adsorption electrode for adsorbing the charged low specific resistance substance is the anode dust accumulation part 10141 of the electrostatic dust removal mechanism 1014 in this embodiment.

[0330] Please refer to Figure 7, which shows another schematic structural view of the first water filtering mechanism disposed in the intake device. The conducting electrode 10131 of the first water filtering mechanism is disposed at the air inlet, and the conducting electrode 10131 is a negatively charged conductive mesh plate. At the same time, the adsorption electrode 10132 is disposed in the intake device in a planar mesh shape, and the adsorption electrode 10132 has a positive charge, and the adsorption electrode 10132 is also called a collecting electrode. In this embodiment, the adsorption electrode 10132 is specifically in a planar mesh shape, and the conducting electrode 10131 is parallel to the adsorption electrode 10132. In this embodiment, a mesh surface electric field is formed between the conducting electrode 10131 and the adsorption electrode 10132. In addition, the conducting electrode 10131 is a mesh structure made of metal wires, and the conducting electrode 10131 is composed of a metal wire mesh. The area of the adsorption electrode 10132 is larger than the area of the conducting electrode 10131.

[0331] The gas treatment system based on the engine further includes an exhaust gas treatment device, and the exhaust gas treatment device includes a third water filtering mechanism. In this embodiment, the first water filtering mechanism is also applicable to the third water filtering mechanism of the exhaust gas treatment device of the gas treatment system based on the engine.

[0332] The twenty-first embodiment

[0333] An exhaust gas treatment system for a diesel engine, as Figure 8 shown, includes:

[0334] A denitration (NO x ) device for removing nitrogen oxides (NO x ) from the exhaust gas of the diesel engine; the denitration (NO x ) device includes: an ozone source such as an ozone generator 201 for providing ozone; a reaction field 202 for mixing and reacting the exhaust gas of the diesel engine with ozone; a denitration device 203 for removing nitric acid from the exhaust gas of the diesel engine after being treated by the denitration (NO x ) device; the denitration device 203 includes an electrocoagulation demisting unit 2031, which is a low specific resistance material treatment device for electrocoagulating the exhaust gas of the engine after being treated with ozone, and the water mist containing nitric acid accumulates on the adsorption electrode in the low specific resistance material treatment device. The denitration device 203 further includes a denitration liquid collection unit 2032 for storing the aqueous nitric acid solution and / or the aqueous nitrate solution removed from the waste gas; an ozone decomposer 204 for decomposing ozone in the exhaust gas of the diesel engine after being treated by the denitration device. The ozone decomposer can decompose ozone by means of ultraviolet rays, catalysis, etc.

[0335] In this embodiment, the low specific resistance material treatment device, i.e., the electrocoagulation demisting unit 2031, includes: a conductive electrode 301 that can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material becomes charged; and an adsorption electrode 302 that can apply an attractive force to the charged low specific resistance material.

[0336] In this embodiment, there are two conductive electrodes 301, and both of the two conductive electrodes 301 are mesh-shaped and spherical cage-shaped. In this embodiment, there is one adsorption electrode 302, and the adsorption electrode 302 is mesh-shaped and spherical cage-shaped. The adsorption electrode 302 is located between the two conductive electrodes 301. At the same time, as Figure 4 shown, in this embodiment, the low specific resistance material treatment device further includes a housing 303 having an inlet 3031 and an outlet 3032, and the conductive electrode 301 and the adsorption electrode 302 are both installed in the housing 303. The conductive electrode 301 is fixedly connected to the inner wall of the housing 303 through an insulating member 304, and the adsorption electrode 302 is directly fixedly connected to the housing 303. In this embodiment, the insulating member 304 is columnar and is also called an insulating column. In this embodiment, the conductive electrode 301 has a negative electric potential, and the adsorption electrode 302 has a positive electric potential. At the same time, in this embodiment, the housing 303 and the adsorption electrode 302 have the same electric potential, and the housing 303 also has an adsorption effect on the charged material.

[0337] This embodiment also provides a treatment method using the above low specific resistance substance treatment device for treating industrial tail gas containing acid mist, which includes the following steps: The conductive electrode 301 conducts electrons to the acid mist in the industrial tail gas to make the acid mist charged; the adsorption electrode 302 attracts the charged acid mist to make the charged acid mist move towards the adsorption electrode 302. Specifically, in this embodiment, the inlet 3031 is connected to the port discharging the industrial tail gas, and the working process and principle are as follows: The industrial tail gas flows into the housing 303 from the inlet 3031 and flows out through the outlet 3032; during this process, the industrial tail gas will first flow through one of the conductive electrodes 301. When the acid mist in the industrial tail gas contacts the conductive electrode 301 or reaches a certain distance from the conductive electrode 301, the conductive electrode 301 transfers electrons to the acid mist, and part of the acid mist becomes charged. The adsorption electrode 302 exerts an attractive force on the charged acid mist, and the acid mist moves towards the adsorption electrode 302 and adheres to the adsorption electrode 302; another part of the acid mist is not adsorbed on the adsorption electrode 302, and this part of the acid mist continues to flow towards the outlet 3032. When this part of the acid mist contacts another conductive electrode 301 or reaches a certain distance from another conductive electrode 301, this part of the acid mist will become charged, and the housing 303 exerts an adsorption force on this part of the charged acid mist, making this part of the charged acid mist adhere to the inner wall of the housing 303, thereby greatly reducing the emission of acid mist in the industrial tail gas. Moreover, in this embodiment, the treatment device and the treatment method can remove 90% of the acid mist in the industrial tail gas, and the effect of removing acid mist is very remarkable. In addition, in this embodiment, both the inlet 3031 and the outlet 3032 are circular. The inlet 3031 can also be called the air inlet, and the outlet 3032 can also be called the air outlet.

[0338] The parameters in the treatment method and treatment device provided in this embodiment are shown in Table 3 as follows:

[0339] Table 3

[0340] 1 The voltage between the conductive electrode and the adsorption electrode, i.e., the power-on driving voltage 12 KV 2 Conductive electrode discharge current 0.018A 3 Initial corona voltage 6.5 KV 4 Ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel 90％ 5 Spacing between the conductive electrode and the adsorption electrode 10 mm

[0341] In summary, the present invention effectively overcomes various drawbacks in the prior art and has high industrial utilization value.

[0342] The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A method for treating a low specific resistance substance, comprising the following steps: Conduct electrons to the low specific resistance substance with a conducting electrode to charge the low specific resistance substance; Wherein, The conducting electrode charges the low specific resistance substance by contacting the low specific resistance substance; an adsorption electrode attracts the charged low specific resistance substance to cause the charged low specific resistance substance to move towards the adsorption electrode; At least one through hole is provided on the conducting electrode to allow the low specific resistance substance to pass through the through hole of the conducting electrode to charge the low specific resistance substance; the conducting electrode is parallel to the adsorption electrode; The conducting electrode is electrically connected to one electrode of a power supply, and the adsorption electrode is electrically connected to the other electrode of the power supply; the power driving voltage of the power supply is less than the initial corona voltage; the ratio of the power driving voltage of the power supply to the distance between the conducting electrode and the adsorption electrode is 0.1 - 2 kv / mm.

2. The method for treating a low specific resistance substance according to claim 1, Characterized in that, The step of conducting electrons to the low specific resistance substance with a conducting electrode includes: enabling electrons to be transferred between the low specific resistance substances located between the conducting electrode and the adsorption electrode to charge more low specific resistance substances.

3. The method for treating a low specific resistance substance according to claim 1 or 2, Characterized in that, Electrons are conducted between the conducting electrode and the adsorption electrode through the low specific resistance substance to form a current.

4. A device for treating a low specific resistance substance, Comprising: A conducting electrode capable of conducting electrons to a low specific resistance substance; When electrons are conducted to the low specific resistance substance, the low specific resistance substance is charged; the conducting electrode charges the low specific resistance substance by contacting the low specific resistance substance; At least one through hole is provided on the conducting electrode to allow the low specific resistance substance to pass through the through hole of the conducting electrode to charge the low specific resistance substance, and the conducting electrode is parallel to the adsorption electrode; An adsorption electrode capable of applying an attractive force to the charged low specific resistance substance, The conducting electrode is electrically connected to one electrode of a power supply, and the adsorption electrode is electrically connected to the other electrode of the power supply; the power driving voltage of the power supply is less than the initial corona voltage; the ratio of the power driving voltage of the power supply to the distance between the conducting electrode and the adsorption electrode is 0.1 - 2 kv / mm.

5. The device for treating a low specific resistance substance according to claim 4, Characterized in that, Electrons are transferred between the low specific resistance substances located between the conducting electrode and the adsorption electrode to charge more of the low specific resistance substances.

6. The device for treating a low specific resistance substance according to claim 4, Characterized in that, It further includes a housing having an inlet and an outlet, and both the conducting electrode and the adsorption electrode are installed in the housing; and a flow channel is further included in the housing, and the flow channel is located in the housing between the inlet and the outlet.

7. The device for treating a low specific resistance substance according to claim 6, Characterized in that, The ratio of the cross-sectional area of the conducting electrode to the cross-sectional area of the flow channel is 99% - 10%.

8. The device for treating a low specific resistance substance according to claim 4, Characterized in that, The guiding electrode is in a planar shape, a net shape, a perforated plate shape, a plate shape, a spherical cage shape, a box shape, or a tubular shape; and / or the adsorption electrode is in a multi-layer net shape, a net shape, a perforated plate shape, a tubular shape, a barrel shape, a spherical cage shape, a box shape, a plate shape, a granular accumulation layer shape, or a bent plate shape.

9. The low specific resistance material processing device according to claim 4, characterized in that at least one through hole is provided on the adsorption electrode.

10. The low specific resistance material processing device according to claim 4, characterized in that the adsorption electrode is made of a conductive material, or the surface of the adsorption electrode has a conductive material.

11. The low specific resistance material processing device according to claim 4, characterized in that an electric field is formed between the guiding electrode and the adsorption electrode.

12. The low specific resistance material processing device according to claim 4, characterized in that the guiding electrode is in a net shape, the adsorption electrode is in a planar shape, and the guiding electrode is parallel to the adsorption electrode; or both the guiding electrode and the adsorption electrode are in a planar shape, and the guiding electrode is parallel to the adsorption electrode.

13. The low specific resistance material processing device according to claim 12, characterized in that the guiding electrode uses a metal wire mesh; and / or the guiding electrode is in a planar shape or a spherical shape; and / or the adsorption electrode is in a curved surface shape or a spherical shape.

14. The low specific resistance material processing device according to claim 4, characterized in that both the guiding electrode and the adsorption electrode extend in the left-right direction, and the left end of the guiding electrode is to the left of the left end of the adsorption electrode.

15. The low specific resistance material processing device according to claim 4, characterized in that wherein there are two adsorption electrodes, and the guiding electrode is located between the two adsorption electrodes.

16. The low specific resistance material processing device according to claim 4, characterized in that the guiding electrode and the adsorption electrode form an adsorption unit, and there are multiple adsorption units.

17. The low specific resistance material processing device according to claim 16, characterized in that all the adsorption units are distributed in one or more directions among the longitudinal direction, the transverse direction, the oblique direction, and the spiral direction.

18. The low specific resistance material processing device according to claim 4, characterized in that the housing includes a first barrel body, a second barrel body, and a third barrel body that are sequentially distributed from the inlet to the outlet direction. The inlet is located at one end of the first barrel body, and the outlet is located at one end of the third barrel body; wherein the contour size of the first barrel body gradually increases from the inlet to the outlet direction, or the first barrel body is in a straight pipe shape; the second barrel body is in a straight pipe shape, and the guiding electrode and the adsorption electrode are installed in the second barrel body; and the contour size of the third barrel body gradually decreases from the inlet to the outlet direction.

19. The low specific resistance material processing device according to claim 18, characterized in that wherein the guiding electrode is fixedly connected to the housing through an insulating member.

20. The low specific resistance material processing device according to claim 4, characterized in that the low specific resistance material is a conductor or a semiconductor.

21. The low specific resistance material processing device according to claim 4, characterized in that the aperture of the through hole on the guiding electrode is 0.1 - 3 millimeters; and / or the aperture of the through hole of the adsorption electrode is 0.1 - 3 millimeters.

22. A gas treatment system based on an engine, characterized in that, it includes the low specific resistance substance treatment device according to any one of claims 4-21.

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