Inductor parts

Abstract

The present invention relates to an inductor component. A substrate is composed of a magnetic layer (50), a first insulating resin (61), a second insulating resin and an insulating layer (90). The substrate has a main surface. A first inductor wiring (20) extends in a direction along the main surface inside the magnetic layer (50). A first vertical wiring (71) is connected to the upper surface of a first pad (22) of the first inductor wiring (20). The upper surface of the first vertical wiring (71) is exposed from the main surface of the substrate. A first external terminal (81) is connected to the upper surface of the first vertical wiring (71). The first external terminal (81) protrudes from the main surface to the upper side in the thickness direction (Td). The first external terminal (81) is composed of a metal layer (81A) covering the upper surface of the first vertical wiring (71) and a solder portion (81B) arranged on the upper surface of the metal layer (81A). Therefore, the upper side portion of the first external terminal (81) including the protruding end (P) becomes a solder portion (81B) composed of a tin alloy.

Description

Technical Field

[0001] The present disclosure relates to inductor components. Background Art

[0002] In the inductor component described in Patent Document 1, the inductor wiring extends inside the substrate. External terminals are stacked on the main surface of the substrate. The external terminals are electrically connected to the inductor wiring. The material of the external terminals is a metal such as copper, silver, tin, or nickel.

[0003] Patent Document 1: Japanese Patent No. 6614207 Summary of the invention

[0004] When mounting the inductor component described in Patent Document 1 on the surface of a substrate, solder is often first applied to the surface of the substrate, and then the solder is heated to melt and the inductor component is placed on the substrate for soldering. When mounting the inductor component on the substrate by such soldering, it is difficult to accurately control the amount of solder applied to the surface of the substrate for each external terminal of the inductor component, and there is a case where the amount of solder is excessive or insufficient with respect to the external terminals of the inductor component.

[0005] One embodiment of the present disclosure provides an inductor component, comprising: a base having a main surface; an inductor wiring extending in the base in parallel with the main surface; a vertical wiring connected to the inductor wiring and extending in a thickness direction orthogonal to the main surface to be exposed from the main surface; and an external terminal, which is arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion of the end including the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring.

[0006] According to the above structure, a part of the external terminal including the protruding end becomes the solder portion, so when the inductor component is mounted on the substrate, it is not necessary to apply solder on the surface of the substrate. Therefore, it is possible to suppress the excess or shortage of solder relative to the inductor component due to the difficulty in controlling the amount of solder applied to the substrate.

[0007] Provided is an inductor component that can be mounted with an appropriate amount of solder. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is an exploded perspective view of the inductor components.

[0009] Figure 2 is a transparent top view of the inductor components.

[0010] Figure 3 It is along Figure 2 A cross-sectional view of the inductor component of the 3-3 line.

[0011] Figure 4 It is along Figure 2 A cross-sectional view of a 4-4 wire inductor component.

[0012] Figure 5 This is a diagram for explaining a method of manufacturing an inductor component.

[0013] Figure 6 This is a diagram for explaining a method of manufacturing an inductor component.

[0014] Figure 7 This is a diagram for explaining a method of manufacturing an inductor component.

[0015] Figure 8 This is a diagram for explaining a method of manufacturing an inductor component.

[0016] Fig. 9 This is a diagram for explaining a method of manufacturing an inductor component.

[0017] Fig.10 This is a diagram for explaining a method of manufacturing an inductor component.

[0018] Fig.11 This is a diagram for explaining a method of manufacturing an inductor component.

[0019] Fig.12 This is a diagram for explaining a method of manufacturing an inductor component.

[0020] Fig.13 This is a diagram for explaining a method of manufacturing an inductor component.

[0021] Fig.14 This is a diagram for explaining a method of manufacturing an inductor component.

[0022] Fig.15 This is a diagram for explaining a method of manufacturing an inductor component.

[0023] Fig.16 This is a diagram for explaining a method of manufacturing an inductor component.

[0024] Fig.17 This is a diagram for explaining a method of manufacturing an inductor component.

[0025] Fig.18 This is a diagram for explaining a method of manufacturing an inductor component.

[0026] Fig.19 It is an explanatory diagram of a method of mounting an inductor component according to a comparative example.

[0027] Fig. 20 It is an explanatory diagram of a method of mounting an inductor component according to a comparative example.

[0028] Fig.21This is a diagram showing how to install the inductor parts.

[0029] Fig. 22 This is a diagram showing how to install the inductor parts.

[0030] Fig.23 is a cross-sectional view of an inductor component.

[0031] Fig.24 is a cross-sectional view of an inductor component.

[0032] Fig.25 is a cross-sectional view of an inductor component.

[0033] Fig.26 is a cross-sectional view of an inductor component.

[0034] Fig. 27 is a top view of the inductor component.

[0035] Fig.28 It is along Fig. 27 A cross-sectional view of the inductor component of line 28-28 in FIG.

[0036] Fig.29 This is a diagram for explaining a method of manufacturing an inductor component.

[0037] Fig.30 This is a diagram for explaining a method of manufacturing an inductor component.

[0038] Fig.31 Indicates an inductor component.

[0039] Description of Reference Numerals

[0040] 10…inductor component; 20…first inductor wiring; 21…first wiring body; 22…first solder pad; 23…second solder pad; 30…second inductor wiring; 31…second wiring body; 32…third solder pad; 33…fourth solder pad; 41…first dummy wiring; 42…second dummy wiring; 43…third dummy wiring; 44…fourth dummy wiring; 50…magnetic layer; 51…inner magnetic circuit portion; 52…outer magnetic circuit portion; 53…insulating resin magnetic layer; 54…first magnetic layer; 55…second magnetic layer; 61…first insulating resin; 62…second insulating resin; 71…first vertical wiring; 72…second vertical wiring; 73…third vertical wiring; 74…fourth vertical wiring; 81…first external terminal; 81A…metal layer; 81B…solder portion; 82…second external terminal; 83…third external terminal; 84…fourth external terminal; BD…substrate; MF…main surface DETAILED DESCRIPTION

[0041] Hereinafter, one embodiment of the inductor component will be described. In addition, the drawings may show components in an enlarged manner for easy understanding. The dimensional ratios of the components may differ from the actual ones or from those in other drawings.

[0042] like Figure 1 As shown in FIG. 1 , the inductor component 10 as a whole has a structure in which five layers are stacked in the thickness direction Td. In the following description, one side in the thickness direction Td is referred to as the upper side, and the opposite side is referred to as the lower side.

[0043] The first layer L1 is composed of the first inductor wiring 20, the second inductor wiring 30, the first dummy wiring 41, the second dummy wiring 42, the third dummy wiring 43, the fourth dummy wiring 44, the inner magnetic circuit portion 51, and the outer magnetic circuit portion 52. When viewed from the thickness direction Td, the first layer L1 is a rectangular shape. In addition, the direction parallel to the long side of the rectangular shape is set as the long side direction Ld, and the direction parallel to the short side is set as the short side direction Wd.

[0044] In the first layer L1, the first inductor wiring 20 is composed of a first wiring body 21, a first pad 22, and a second pad 23. The first wiring body 21 extends substantially in the longitudinal direction Ld. The first wiring body 21 is located closer to the first end in the transverse direction Wd than the center in the transverse direction Wd of the first layer L1.

[0045] The central portion 21A of the first wiring main body 21 in the extending direction extends in a straight line. The end portion 21B on the first end side of the long side direction Ld of the first wiring main body 21 is bent. In addition, the end portion 21C on the second end side of the long side direction Ld of the first wiring main body 21 is bent. The first end portion 21B and the second end portion 21C of the first wiring main body 21 are bent by approximately 90 degrees so as to face the central side of the short side direction Wd of the first layer L1.

[0046] The number of turns of the first inductor wiring 20 is determined based on an imaginary vector. The starting point of the imaginary vector is arranged on an imaginary center line that passes through the center of the wiring width of the first inductor wiring 20 and extends in the extension direction of the first inductor wiring 20. Moreover, when the imaginary vector is observed from the thickness direction Td, when the direction of the imaginary vector is rotated by 360 degrees when the starting point of the first inductor wiring 20 is moved from the state arranged at one end to the other end of the imaginary center line, the number of turns is determined to be 1.0 turns. Therefore, for example, if it is wound 180 degrees, the number of turns is 0.5 turns. In the present embodiment, the direction of the imaginary vector imaginarily arranged on the first inductor wiring 20 is rotated 90 degrees at the first end 21B and 90 degrees at the second end 21C. Therefore, the number of turns of the first inductor wiring 20 wound is 0.5 turns in the present embodiment. Furthermore, when viewed from the upper side in the thickness direction Td, the first inductor wiring 20 is wound counterclockwise from the first pad 22 to the second pad 23. Therefore, the winding direction of the first inductor wiring 20 when viewed from the upper side in the thickness direction Td is counterclockwise.

[0047] The first inductor wiring 20 is made of a conductive material. In the present embodiment, the first inductor wiring 20 has a composition of copper of 99 wt % or more and a composition of sulfur of 0.1 wt % or more and 1.0 wt % or less.

[0048] The first pad 22 is connected to the first end portion 21B of the first inductor wiring 20 . The first pad 22 has a substantially square shape when viewed from the thickness direction Td. The material of the first pad 22 is the same as that of the first wiring body 21 .

[0049] The first dummy wiring 41 extends from the first pad 22 to the outer edge of the first layer L1 . The first dummy wiring 41 extends to the side surface of the first end of the first layer L1 in the longitudinal direction Ld and is exposed on the outer surface of the inductor component 10 .

[0050] The second pad 23 is connected to the second end portion 21C of the first inductor wiring 20 . The second pad 23 has a substantially square shape when viewed from the thickness direction Td. The material of the second pad 23 is the same as that of the first wiring body 21 .

[0051] The second dummy wiring 42 extends from the second pad 23 to the outer edge of the first layer L1. The second dummy wiring 42 extends to the side surface of the second end side of the long side direction Ld of the first layer L1, and is exposed on the outer surface of the inductor component 10. In addition, in the present embodiment, the first wiring body 21, the first pad 22, the second pad 23, the first dummy wiring 41, and the second dummy wiring 42 are integrated.

[0052] Here, if Figure 2As shown in FIG. 1 , a straight line passing through the center of the short side direction Wd of the first layer L1 and extending in the long side direction Ld is set as the symmetry axis AX. At this time, in the first layer L1, the second inductor wiring 30, the third dummy wiring 43, and the fourth dummy wiring 44 are arranged to be line symmetrical with respect to the first inductor wiring 20, the first dummy wiring 41, and the second dummy wiring 42 with respect to the symmetry axis AX.

[0053] like Figure 1 As shown, the second inductor wiring 30 includes a second wiring body 31, a third pad 32, and a fourth pad 33. When viewed in the thickness direction Td, the second wiring body 31 is located closer to the second end in the short side direction Wd than the center in the short side direction Wd of the rectangular first layer L1.

[0054] The center portion 31A of the second wiring main body 31 in the extending direction extends in a straight line. The end portion 31B on the first end side of the long side direction Ld of the second wiring main body 31 is bent. In addition, the second end portion 31C on the second end side of the long side direction Ld of the second wiring main body 31 is bent. Both the first end portion 31B and the second end portion 31C of the second wiring main body 31 are bent by approximately 90 degrees toward the center side of the short side direction Wd of the first layer L1.

[0055] The number of turns of the second inductor wiring 30 is 0.5 turns, which is the same as the number of turns of the first inductor wiring 20. In addition, when viewed from the upper side of the thickness direction Td, the second inductor wiring 30 is wound clockwise from the third pad 32 to the fourth pad 33. Therefore, the winding direction of the second inductor wiring 30 when viewed from the upper side of the thickness direction Td is clockwise. Therefore, the winding direction of the first inductor wiring 20 is opposite to the winding direction of the second inductor wiring 30. In addition, the material of the second inductor wiring 30 is composed of the same conductive material as the first inductor wiring 20.

[0056] The third pad 32 is connected to the first end portion 31B of the second inductor wiring 30 . The third pad 32 has a substantially square shape when viewed from the thickness direction Td. The material of the third pad 32 is the same as that of the second wiring body 31 .

[0057] The third dummy wiring 43 extends from the third pad 32 to the outer edge of the first layer L1 . The third dummy wiring 43 extends to the side surface of the first end of the first layer L1 in the longitudinal direction Ld and is exposed on the outer surface of the inductor component 10 .

[0058] The fourth pad 33 is connected to the second end portion 31C of the second inductor wiring 30 . The fourth pad 33 has a substantially square shape when viewed from the thickness direction Td. The material of the fourth pad 33 is the same as that of the second wiring body 31 .

[0059] The fourth dummy wiring 44 extends from the fourth pad 33 to the outer edge of the first layer L1. The fourth dummy wiring 44 extends to the side surface of the second end side of the long side direction Ld of the first layer L1, and is exposed on the outer surface of the inductor component 10. In addition, in the present embodiment, the second wiring body 31, the third pad 32, the fourth pad 33, the third dummy wiring 43, and the fourth dummy wiring 44 are integrated.

[0060] In the first layer L1, the region between the first inductor wiring 20 and the second inductor wiring 30 becomes the inner magnetic circuit portion 51. The material of the inner magnetic circuit portion 51 is a magnetic material. Specifically, the material of the inner magnetic circuit portion 51 is a resin composite material containing metal magnetic powder composed of an iron-silicon alloy or an amorphous alloy. More specifically, it is an amorphous alloy containing iron, silicon and chromium.

[0061] In the first layer L1, when viewed in the thickness direction Td, the region outside the first inductor wiring 20 in the short-side direction Wd and the region outside the second inductor wiring 30 in the short-side direction Wd are the outer magnetic path portion 52. The outer magnetic path portion 52 is made of the same magnetic material as the inner magnetic path portion 51.

[0062] The second layer L2 having the same rectangular shape as the first layer L1 when viewed in the thickness direction Td is stacked on the lower surface of the first layer L1. The second layer L2 is composed of the first insulating resin 61, the second insulating resin 62 and the insulating resin magnetic layer 53.

[0063] The first insulating resin 61 covers the first inductor wiring 20, the first dummy wiring 41, and the second dummy wiring 42 from the bottom. When viewed from the thickness direction Td, the first insulating resin 61 is formed into a shape that covers a range slightly wider than the outer edges of the first inductor wiring 20, the first dummy wiring 41, and the second dummy wiring 42. As a result, the first insulating resin 61 is formed as a whole into a strip shape extending along the long side direction Ld of the second layer L2. The first insulating resin 61 is an insulating resin, and its insulating property is higher than that of the first inductor wiring 20, the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, and the insulating resin magnetic layer 53.

[0064] The second insulating resin 62 covers the second inductor wiring 30, the third dummy wiring 43, and the fourth dummy wiring 44 from the bottom. When viewed from the thickness direction Td, the second insulating resin 62 is formed in a shape that covers a slightly wider range than the outer edges of the second inductor wiring 30, the third dummy wiring 43, and the fourth dummy wiring 44. As a result, the second insulating resin 62 is formed in a strip shape extending along the long side direction Ld of the second layer L2 as a whole. The second insulating resin 62 is an insulating resin, and its insulating property is higher than that of the second inductor wiring 30.

[0065] In the second layer L2, the portion other than the first insulating resin 61 and the second insulating resin 62 is the insulating resin magnetic layer 53. The insulating resin magnetic layer 53 is made of the same magnetic material as the inner magnetic path portion 51 and the outer magnetic path portion 52 described above.

[0066] The third layer L3 having the same rectangular shape as the second layer L2 when viewed from the thickness direction Td is stacked on the lower surface of the second layer L2 in the thickness direction Td. The third layer L3 is the first magnetic layer 54. Therefore, the first magnetic layer 54 is arranged at a lower side than the first inductor wiring 20 and the second inductor wiring 30. The first magnetic layer 54 is a magnetic material. Specifically, it is a resin composite material containing metal magnetic powder composed of an iron-silicon alloy or an amorphous alloy, similar to the above-mentioned inner magnetic circuit portion 51, the outer magnetic circuit portion 52, and the insulating resin magnetic layer 53.

[0067] On the other hand, a fourth layer L4 having the same rectangular shape as the first layer L1 when viewed from the thickness direction Td is stacked on the upper side of the first layer L1 in the thickness direction Td. The fourth layer L4 is composed of the first vertical wiring 71, the second vertical wiring 72, the third vertical wiring 73, the fourth vertical wiring 74 and the second magnetic layer 55.

[0068] The first vertical wiring 71 is directly connected to the upper surface of the first pad 22 without passing through other layers. The material of the first vertical wiring 71 is the same as that of the first inductor wiring 20. The first vertical wiring 71 is a wiring extending along the thickness direction Td. Specifically, the first vertical wiring 71 is in the shape of a regular quadrangular prism, and the axial direction of the regular quadrangular prism coincides with the thickness direction Td.

[0069] like Figure 2 As shown, when viewed from the thickness direction Td, the dimension DV1 of each side of the square-shaped first vertical wiring 71 is slightly smaller than the dimension of each side of the square-shaped first pad 22. In addition, since the first vertical wiring 71 is in the shape of a regular quadrangular prism, when viewed from the upper side in the thickness direction Td, the geometric center CV1 of the upper end surface of the first vertical wiring 71 is located on the central axis of the regular quadrangular prism-shaped first vertical wiring 71. When viewed from the thickness direction Td, the geometric center of the first pad 22 coincides with the geometric center CV1 of the first vertical wiring 71.

[0070] like Figure 1 As shown, the second vertical wiring 72 is directly connected to the upper surface of the second pad 23 without passing through other layers. The material of the second vertical wiring 72 is the same as that of the first inductor wiring 20. The second vertical wiring 72 is in the shape of a regular quadrangular prism, and the axis direction of the regular quadrangular prism coincides with the thickness direction Td.

[0071] like Figure 2As shown, when viewed from the thickness direction Td, the dimension DV2 of each side of the square-shaped second vertical wiring 72 is slightly smaller than the dimension of each side of the square-shaped second pad 23. In addition, since the second vertical wiring 72 is in the shape of a regular quadrangular prism, when viewed from the upper side in the thickness direction Td, the geometric center CV2 of the upper end surface of the second vertical wiring 72 is located on the central axis of the regular quadrangular prism-shaped second vertical wiring 72. When viewed from the thickness direction Td, the geometric center of the second pad 23 coincides with the geometric center CV2 of the second vertical wiring 72.

[0072] like Figure 1 As shown, the third vertical wiring 73 is directly connected to the upper surface of the third pad 32 without passing through other layers. The material of the third vertical wiring 73 is the same as that of the second inductor wiring 30. The third vertical wiring 73 is in the shape of a regular quadrangular prism, and the axis direction of the regular quadrangular prism coincides with the thickness direction Td.

[0073] like Figure 2 As shown, when viewed from the thickness direction Td, the dimension DV3 of each side of the square-shaped third vertical wiring 73 is slightly smaller than the dimension of each side of the square-shaped third pad 32. In addition, since the third vertical wiring 73 is in the shape of a regular quadrangular prism, when viewed from the upper side in the thickness direction Td, the geometric center CV3 of the upper end surface of the third vertical wiring 73 is located on the central axis of the regular quadrangular prism-shaped third vertical wiring 73. When viewed from the thickness direction Td, the geometric center of the third pad 32 coincides with the geometric center CV3 of the third vertical wiring 73.

[0074] like Figure 1 As shown, the fourth vertical wiring 74 is directly connected to the upper surface of the fourth pad 33 without passing through other layers. The material of the fourth vertical wiring 74 is the same as that of the second inductor wiring 30. The fourth vertical wiring 74 is in the shape of a regular quadrangular prism, and the axis direction of the regular quadrangular prism coincides with the thickness direction Td.

[0075] like Figure 2 As shown, when viewed from the thickness direction Td, the dimension DV4 of each side of the square-shaped fourth vertical wiring 74 is slightly smaller than the dimension of each side of the square-shaped fourth pad 33. In addition, since the fourth vertical wiring 74 is in the shape of a regular quadrangular prism, when viewed from the upper side in the thickness direction Td, the geometric center CV4 of the upper end surface of the fourth vertical wiring 74 is located on the central axis of the regular quadrangular prism-shaped fourth vertical wiring 74. When viewed from the thickness direction Td, the geometric center of the fourth pad 33 coincides with the geometric center CV4 of the fourth vertical wiring 74.

[0076] like Figure 1As shown, in the fourth layer L4, the portion other than the first vertical wiring 71, the second vertical wiring 72, the third vertical wiring 73, and the fourth vertical wiring 74 becomes the second magnetic layer 55. Therefore, the second magnetic layer 55 is stacked on the upper surface of the first inductor wiring 20. The material of the second magnetic layer 55 is the same magnetic material as the first magnetic layer 54 described above.

[0077] In the inductor component 10, the magnetic layer 50 is composed of an inner magnetic circuit portion 51, an outer magnetic circuit portion 52, an insulating resin magnetic layer 53, a first magnetic layer 54, and a second magnetic layer 55. The inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are connected to surround the first inductor wiring 20 and the second inductor wiring 30. In this way, the magnetic layer 50 forms a closed magnetic circuit with respect to the first inductor wiring 20 and the second inductor wiring 30. Therefore, the first inductor wiring 20 and the second inductor wiring 30 extend inside the magnetic layer 50. In addition, the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are shown separately in the figure, but are integrated as the magnetic layer 50. In addition, the magnetic layer 50 integrated here includes the case where the interface is located inside the magnetic layer 50, and also includes the case where there is no interface inside the magnetic layer 50. For example, when manufacturing by the manufacturing method described later, there is no interface at the boundary between the insulating resin magnetic layer 53 and the first magnetic layer 54, and there is no interface at the boundary between the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, and the second magnetic layer 55. On the other hand, there is an interface at the boundary between the inner magnetic circuit portion 51 and the insulating resin magnetic layer 53. Even in such a case, the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53, the first magnetic layer 54, and the second magnetic layer 55 are integrated.

[0078] The fifth layer L5 having the same rectangular shape as the fourth layer L4 when viewed from the thickness direction Td is stacked on the upper side surface of the fourth layer L4 in the thickness direction Td. The fifth layer L5 is composed of the first external terminal 81, the second external terminal 82, the third external terminal 83, the fourth external terminal 84 and the insulating layer 90.

[0079] like Figure 3 As shown, the first external terminal 81 is directly connected to the upper surface of the first vertical wiring 71 without passing through other layers. Figure 2 As shown, the first external terminal 81 has a rectangular shape when viewed from the thickness direction Td. The long sides of the rectangle of the first external terminal 81 extend parallel to the long side direction Ld of the fifth layer L5, and the short sides extend parallel to the short side direction Wd of the fifth layer L5.

[0080] The second external terminal 82 is directly connected to the upper surface of the second vertical wiring 72 without passing through other layers. When viewed from the thickness direction Td, the second external terminal 82 is rectangular. The long side of the rectangle of the second external terminal 82 extends parallel to the long side direction Ld of the fifth layer L5, and the short side extends parallel to the short side direction Wd of the fifth layer L5.

[0081] like Figure 3 As shown, the third external terminal 83 is directly connected to the upper surface of the third vertical wiring 73 without passing through other layers. Figure 2 As shown, the third external terminal 83 has a rectangular shape when viewed from the thickness direction Td. The long sides of the rectangle of the third external terminal 83 extend parallel to the long side direction Ld of the fifth layer L5, and the short sides extend parallel to the short side direction Wd of the fifth layer L5.

[0082] The fourth external terminal 84 is directly connected to the upper surface of the fourth vertical wiring 74 without passing through other layers. When viewed from the thickness direction Td, the fourth external terminal 84 is rectangular. The long side of the rectangle of the fourth external terminal 84 extends parallel to the long side direction Ld of the fifth layer L5, and the short side extends parallel to the short side direction Wd of the fifth layer L5.

[0083] In the fifth layer L5, the portion other than the first external terminal 81, the second external terminal 82, the third external terminal 83 and the fourth external terminal 84 becomes the insulating layer 90. In other words, the range of the upper surface of the fourth layer L4 that is not covered by the first external terminal 81, the second external terminal 82, the third external terminal 83 and the fourth external terminal 84 is covered by the insulating layer 90 of the fifth layer L5. The insulating property of the insulating layer 90 is higher than that of the magnetic layer 50, and the material of the insulating layer 90 is an epoxy resin material. In the present embodiment, the insulating layer 90 is a solder resist. The dimension of the thickness direction Td of the insulating layer 90 is smaller than the dimension of the thickness direction Td of any one of the first external terminal 81, the second external terminal 82, the third external terminal 83 and the fourth external terminal 84.

[0084] In the present embodiment, the base body BD is composed of the magnetic layer 50, the first insulating resin 61, the second insulating resin 62, and the insulating layer 90. The surface of the base body BD that is on the upper side of the insulating layer 90 in the thickness direction Td is the main surface MF. Therefore, the portion of the upper surface of the first vertical wiring 71 that contacts the first external terminal 81 is exposed from the main surface MF to the upper side in the thickness direction Td. Similarly, the portion of the upper surface of the second vertical wiring 72 that contacts the second external terminal 82 is exposed from the main surface MF to the upper side in the thickness direction Td. The portion of the upper surface of the third vertical wiring 73 that contacts the third external terminal 83 is exposed from the main surface MF to the upper side in the thickness direction Td. The portion of the fourth vertical wiring 74 that contacts the fourth external terminal 84 is exposed from the main surface MF to the upper side in the thickness direction Td. Exposing from the main surface MF means that it does not need to protrude outward from the main surface MF, and it may be covered by other members, but is not covered by the main surface MF. In addition, the first layer L1 including the first inductor wiring 20 and the second inductor wiring 30 is parallel to the main surface MF.

[0085] Here, the first external terminal 81 is described in detail. Figure 3 As shown, the first external terminal 81 is composed of a metal layer 81A and a solder portion 81B.

[0086] The metal layer 81A covers the portion of the first vertical wiring 71 exposed from the main surface MF. The metal layer 81A is formed as a thin film with a small dimension in the thickness direction Td. The upper surface of the metal layer 81A is located above the upper surface of the insulating layer 90. The material of the metal layer 81A is a conductive material. In addition, although not shown in the figure, in the present embodiment, the metal layer 81A is a three-layer structure of copper, nickel, and gold.

[0087] like Figure 2As shown, when viewed from the thickness direction Td, the dimension DL1 of the long side of the metal layer 81A is larger than the dimension DV1 of one side of the square-shaped first vertical wiring 71 when viewed from the thickness direction Td. In the present embodiment, the dimension DL1 of the long side direction Ld of the metal layer 81A is approximately 1.5 times the dimension DV1 of the long side direction Ld of the first vertical wiring 71. Moreover, the end of the first end side of the long side direction Ld of the metal layer 81A is located closer to the first end side of the long side direction Ld than the end of the first end side of the long side direction Ld of the first vertical wiring 71. In addition, the end of the second end side of the long side direction Ld of the metal layer 81A is located closer to the second end side of the long side direction Ld than the end of the second end side of the long side direction Ld of the first vertical wiring 71. Therefore, the metal layer 81A covers the range from the upper surface of the first vertical wiring 71 to the portion of the upper surface of the second magnetic layer 55 that is not covered by the insulating layer 90. Furthermore, the center position of the metal layer 81A in the long-side direction Ld is located closer to the second end side in the long-side direction Ld than the center position in the long-side direction Ld of the first vertical wiring 71. Therefore, when viewed from the thickness direction Td, the geometric center CE1 of the metal layer 81A is offset from the geometric center CV1 of the first vertical wiring 71 toward the second end side in the long-side direction Ld. On the other hand, when viewed from the thickness direction Td, the geometric center CE1 of the metal layer 81A is included in the range occupied by the first vertical wiring 71.

[0088] In addition, the dimension DS1 of the short side of the rectangular metal layer 81A when viewed from the thickness direction Td is slightly smaller than the dimension DV1 of one side of the square first vertical wiring 71 when viewed from the thickness direction Td. The position of the center of the short side direction Wd of the metal layer 81A coincides with the position of the center of the short side direction Wd of the first vertical wiring 71. Moreover, when viewed from the thickness direction Td, the area of ​​the range occupied by the metal layer 81A is larger than the area of ​​the range of the first vertical wiring 71 exposed from the main surface MF.

[0089] like Figure 4 As shown, the entire upper surface of the metal layer 81A is covered by the solder portion 81B. Therefore, the portion of the first external terminal 81 including the end protruding from the main surface MF in the thickness direction Td, that is, the upper side of the protruding end P, becomes the solder portion 81B. The material of the solder portion 81B is composed of a material having a lower melting point than the first inductor wiring 20 and the first vertical wiring 71, and in this embodiment, it is an alloy mainly composed of lead and tin. Moreover, the dimension TS of the solder portion 81B in the thickness direction Td, that is, the distance from the upper surface of the metal layer 81A to the protruding end P of the solder portion 81B, is larger than the dimension TM of the metal layer 81A in the thickness direction Td, that is, the distance from the upper surface of the first vertical wiring 71 to the upper surface of the metal layer 81A.

[0090] In addition, although not shown in the figure, a plurality of voids are included inside the solder portion 81B. When viewed from the thickness direction Td, the voids in the portion of the solder portion 81B above the first vertical wiring 71 are smaller than the voids in the portion above the second magnetic layer 55. The amount of voids included in each portion of the solder portion 81B can be measured by calculating the total area of ​​the range occupied by the voids in each portion relative to the cross-sectional area of ​​each portion of the solder portion 81B when observing a cross section parallel to the long side direction Ld and including the protruding end P of the first external terminal 81 using an electron microscope at 1000 times.

[0091] like Figure 2 As shown in FIG. 1 , when viewed from the thickness direction Td, the solder portion 81B has the same rectangular shape as the metal layer 81A. Therefore, the shapes of the metal layer 81A and the solder portion 81B when viewed from the thickness direction Td are the same as the shape of the first external terminal 81. Moreover, the geometric center CE1 of the metal layer 81A becomes the geometric center of the first external terminal 81.

[0092] like Figure 3 As shown, when the solder portion 81B is viewed from the long side direction Ld, the closer to the center of the solder portion 81B in the short side direction Wd, the larger the size in the thickness direction Td. Moreover, when viewed from the long side direction Ld, the upper surface of the solder portion 81B in the thickness direction Td is in a curved shape with a smaller curvature as it approaches the upper side in the thickness direction Td. Moreover, the position of the protruding end P of the solder portion 81B coincides with the center of the first vertical wiring 71 in the short side direction Wd.

[0093] like Figure 4 As shown, when the solder portion 81B is viewed from the short side direction Wd, the closer it is to the center of the solder portion 81B in the long side direction Ld, the larger the size in the thickness direction Td. Moreover, when viewed from the short side direction Wd, the surface of the upper side of the solder portion 81B in the thickness direction Td is in a curved shape with a smaller curvature as it approaches the upper side in the thickness direction Td. Moreover, the position of the protruding end P of the solder portion 81B is located in the long side direction Ld, and is located closer to the center of the fifth layer L5 in the long side direction Ld than the center of the first vertical wiring 71.

[0094] The distance TP in the thickness direction Td from the main surface MF to the protruding end P of the first external terminal 81 is less than half the dimension TBD in the thickness direction Td of the substrate BD, and is 0.2 times in the present embodiment. In addition, the dimension TS in the thickness direction Td of the solder portion 81B, i.e., the distance from the upper surface of the metal layer 81A to the protruding end P of the solder portion 81B, is more than one tenth the dimension TBD in the thickness direction Td of the substrate BD, and is approximately 0.17 times in the present embodiment. In addition, the dimension TBD in the thickness direction Td of the substrate BD does not include the dimension TBD in the thickness direction of each external terminal including the solder portion. In addition, the dimension TBD in the thickness direction Td of the substrate BD is the average value of the dimension TBD in the thickness direction measured at five equally spaced locations in a cross section passing through the center of the substrate BD and parallel to the long side direction Ld when viewed from the thickness direction Td.

[0095] Here, if Figure 2 As shown, when viewed from the thickness direction Td, the geometric center of the solder portion 81B coincides with the geometric center CE1 of the first external terminal 81. Therefore, when viewed from the thickness direction Td, the geometric center CE1 of the first external terminal 81 is offset from the geometric center CV1 of the first vertical wiring 71 toward the center side of the fifth layer L5 in the long side direction Ld. On the other hand, when viewed from the thickness direction Td, the geometric center CE1 of the first external terminal 81 is located within the upper surface of the first vertical wiring 71, which is the range occupied by the first vertical wiring 71.

[0096] In addition, when viewed from the thickness direction Td, the shape of the solder portion 81B coincides with the first external terminal 81. Therefore, the dimension DL1 of the solder portion 81B in the long side direction Ld is larger than the dimension DS1 of the solder portion 81B in the short side direction Wd. In addition, the dimension DL1 of the solder portion 81B in the long side direction Ld is larger than the dimension DV1 of the first vertical wiring 71 in the long side direction Ld.

[0097] In addition, if Figure 4 As shown, in a cross section that is orthogonal to the short side direction Wd and includes the protruding end P of the first external terminal 81, a line segment connecting the protruding end P and the lower end of the first end of the long side direction Ld of the first external terminal 81 is set as a first line segment VL1. In addition, a line segment connecting the protruding end P and the lower end of the second end of the long side direction Ld of the first external terminal 81 is set as a second line segment VL2. In addition, a line segment connecting the lower end of the first end of the long side direction Ld of the first external terminal 81 and the lower end of the second end of the long side direction Ld of the first external terminal 81 is set as a third line segment VL3. Moreover, the acute angle formed by the first line segment VL1 and the third line segment VL3, that is, the angle of the first angle θ1, is about 14 degrees. The acute angle formed by the third line segment VL3 and the second line segment VL2, that is, the angle of the second angle θ2, is about 15 degrees. Therefore, the difference between the angle of the first angle θ1 and the angle of the second angle θ2 is about 1 degree.

[0098] Next, the dimensional relationship of the second external terminal 82 is described. Figure 2 As shown, the dimension DL2 of the long side of the rectangular second external terminal 82 when viewed from the thickness direction Td is larger than the dimension DV2 of one side of the square second vertical wiring 72 when viewed from the thickness direction Td. In the present embodiment, the dimension DL2 of the long side direction Ld of the second external terminal 82 is approximately 1.5 times the dimension DV2 of the long side direction Ld of the second vertical wiring 72. Moreover, the end of the first end side of the long side direction Ld of the second external terminal 82 is located closer to the first end side of the long side direction Ld than the end of the first end side of the long side direction Ld of the second vertical wiring 72. In addition, the end of the second end side of the long side direction Ld of the second external terminal 82 is located closer to the second end side of the long side direction Ld than the end of the second end side of the long side direction Ld of the second vertical wiring 72. Therefore, the second external terminal 82 covers the range from the upper surface of the second vertical wiring 72 to the upper surface of the second magnetic layer 55. Furthermore, the position of the center in the long-side direction Ld of the second external terminal 82 is located closer to the first end in the long-side direction Ld than the position of the center in the long-side direction Ld of the second vertical wiring 72. Therefore, when viewed from the thickness direction Td, the geometric center CE2 of the second external terminal 82 is offset from the geometric center CV2 of the second vertical wiring 72 toward the first end in the long-side direction Ld. On the other hand, when viewed from the thickness direction Td, the geometric center CE2 of the second external terminal 82 is included in the range occupied by the second vertical wiring 72.

[0099] In addition, the dimension DS2 of the short side of the rectangular second external terminal 82 when viewed from the thickness direction Td is slightly smaller than the dimension DV2 of one side of the square second vertical wiring 72 when viewed from the thickness direction Td. The position of the center of the short side direction Wd of the second external terminal 82 coincides with the position of the center of the short side direction Wd of the second vertical wiring 72. Moreover, when viewed from the thickness direction Td, the area of ​​the range occupied by the second external terminal 82 is larger than the area of ​​the range of the second vertical wiring 72 exposed from the main surface MF.

[0100] Next, the dimension relationship of the third external terminal 83 is described. The dimension DL3 of the long side of the rectangular third external terminal 83 when viewed from the thickness direction Td is larger than the dimension DV3 of one side of the square third vertical wiring 73 when viewed from the thickness direction Td. In the present embodiment, the dimension DL3 of the long side direction Ld of the third external terminal 83 is approximately 1.5 times the dimension DV3 of the long side direction Ld of the third vertical wiring 73. Moreover, the end of the first end side of the long side direction Ld of the third external terminal 83 is located closer to the first end side of the long side direction Ld than the end of the first end side of the long side direction Ld of the third vertical wiring 73. In addition, the end of the second end side of the long side direction Ld of the third external terminal 83 is located closer to the second end side of the long side direction Ld than the end of the second end side of the long side direction Ld of the third vertical wiring 73. Therefore, the third external terminal 83 covers the range from the upper surface of the third vertical wiring 73 to the upper surface of the second magnetic layer 55. Furthermore, the position of the center in the long-side direction Ld of the third external terminal 83 is located closer to the second end in the long-side direction Ld than the position of the center in the long-side direction Ld of the third vertical wiring 73. Therefore, when viewed from the thickness direction Td, the geometric center CE3 of the third external terminal 83 is offset from the geometric center CV3 of the third vertical wiring 73 toward the second end in the long-side direction Ld. On the other hand, when viewed from the thickness direction Td, the geometric center CE3 of the third external terminal 83 is included in the range occupied by the third vertical wiring 73.

[0101] In addition, the dimension DS3 of the short side of the rectangular third external terminal 83 when viewed from the thickness direction Td is slightly smaller than the dimension DV3 of one side of the square third vertical wiring 73 when viewed from the thickness direction Td. The position of the center of the short side direction Wd of the third external terminal 83 coincides with the position of the center of the short side direction Wd of the third vertical wiring 73. Moreover, when viewed from the thickness direction Td, the area of ​​the range occupied by the third external terminal 83 is larger than the area of ​​the range of the third vertical wiring 73 exposed from the main surface MF.

[0102] Next, the dimensional relationship of the fourth external terminal 84 is described. The dimension DL4 of the long side of the fourth external terminal 84 in a rectangular shape when viewed from the thickness direction Td is larger than the dimension DV4 of one side of the fourth vertical wiring 74 in a square shape when viewed from the thickness direction Td. In the present embodiment, the dimension DL4 of the long side direction Ld of the fourth external terminal 84 is approximately 1.5 times the dimension DV4 of the long side direction Ld of the fourth vertical wiring 74. Moreover, the end of the first end side of the long side direction Ld of the fourth external terminal 84 is located closer to the first end side of the long side direction Ld than the end of the first end side of the long side direction Ld of the fourth vertical wiring 74. In addition, the end of the second end side of the long side direction Ld of the fourth external terminal 84 is located closer to the second end side of the long side direction Ld than the end of the second end side of the long side direction Ld of the fourth vertical wiring 74. Therefore, the fourth external terminal 84 covers the range from the upper surface of the fourth vertical wiring 74 to the upper surface of the second magnetic layer 55. Furthermore, the position of the center in the long-side direction Ld of the fourth external terminal 84 is located closer to the first end in the long-side direction Ld than the position of the center in the long-side direction Ld of the fourth vertical wiring 74. Therefore, when viewed from the thickness direction Td, the geometric center CE4 of the fourth external terminal 84 is offset from the geometric center CV4 of the fourth vertical wiring 74 toward the first end in the long-side direction Ld. On the other hand, when viewed from the thickness direction Td, the geometric center CE4 of the fourth external terminal 84 is included in the range occupied by the fourth vertical wiring 74.

[0103] In addition, the dimension DS4 of the short side of the fourth external terminal 84 in the rectangular shape when viewed from the thickness direction Td is slightly smaller than the dimension DV4 of one side of the fourth vertical wiring 74 in the square shape when viewed from the thickness direction Td. The position of the center of the short side direction Wd of the fourth external terminal 84 coincides with the position of the center of the short side direction Wd of the fourth vertical wiring 74. Moreover, when viewed from the thickness direction Td, the area of ​​the range occupied by the fourth external terminal 84 is larger than the area of ​​the range of the fourth vertical wiring 74 exposed from the main surface MF.

[0104] In addition, the second external terminal 82, the third external terminal 83, and the fourth external terminal 84 have the same structure as the first external terminal 81 described above, so detailed description is omitted. In addition, in the drawings, the metal layer and the solder portion of the second external terminal 82 correspond to the metal layer 81A and the solder portion 81B of the first external terminal 81, and are represented as the metal layer 82A and the solder portion 82B of the second external terminal 82. Similarly, the metal layer and the solder portion of the third external terminal 83 are represented as the metal layer 83A and the solder portion 83B of the third external terminal 83, and the metal layer and the solder portion of the fourth external terminal 84 are represented as the metal layer 84A and the solder portion 84B of the fourth external terminal 84.

[0105] Next, an embodiment of a method for manufacturing the inductor component 10 will be described.

[0106] like Figure 5 As shown, first, a base member preparation step is performed. Specifically, a plate-shaped base member 101 is prepared. The base member 101 is made of ceramic. When viewed from the thickness direction Td, the base member 101 is in a quadrilateral shape. The size of each side is a size that can accommodate a plurality of inductor components 10. In the following description, the direction perpendicular to the surface direction of the base member 101 is described as the thickness direction Td.

[0107] Next, if Figure 6 As shown, the dummy insulating layer 102 is applied to the entire upper surface of the base member 101. Next, the first insulating resin 61 and the second insulating resin 62 are patterned by photolithography in a range slightly wider than the range where the first inductor wiring 20 and the second inductor wiring 30 are arranged when viewed in the thickness direction Td.

[0108] Next, a seed layer forming step is performed to form the seed layer 103. Specifically, the copper seed layer 103 is formed on the upper surfaces of the first insulating resin 61, the second insulating resin 62, and the dummy insulating layer 102 by sputtering from the upper surface side of the base member 101. In addition, in the drawings, the seed layer 103 is illustrated with a thick line.

[0109] Next, if Figure 7 As shown, a first coating process for forming a first coating portion 104 is performed, and the first coating portion 104 covers a portion of the upper surface of the seed layer 103 where the first inductor wiring 20, the second inductor wiring 30, the first dummy wiring 41, the second dummy wiring 42, the third dummy wiring 43, and the fourth dummy wiring 44 are not formed. Specifically, first, a photosensitive dry film resist is applied to the entire upper surface of the seed layer 103. Next, the entire upper surface of the dummy insulating layer 102 and the upper surface of the outer edge of the range covered by the first insulating resin 61 and the second insulating resin 62 are exposed to solidify. Then, the uncured portion of the applied dry film resist is removed by stripping with a liquid. Thus, the cured portion of the applied dry film resist is formed as the first coating portion 104. On the other hand, the seed layer 103 is exposed in the portion of the applied dry film resist that is removed by the chemical solution and not covered by the first covering portion 104. The dimension of the first covering portion 104 in the thickness direction Td, that is, the thickness ratio of the first covering portion 104 Figure 3 The first inductor wiring 20 and the second inductor wiring 30 of the inductor component 10 shown in the figure are slightly thick. In addition, the photolithography method in other steps described later is also the same step, and therefore the detailed description is omitted.

[0110] Next, if Figure 8 As shown, an inductor wiring processing step is performed, wherein the first inductor wiring 20, the second inductor wiring 30, the first dummy wiring 41, the second dummy wiring 42, the third dummy wiring 43, and the fourth dummy wiring 44 are formed by electroplating on the portion of the upper surface of the first insulating resin 61 and the second insulating resin 62 that is not covered by the first covering portion 104. Specifically, electrolytic copper plating is performed to grow copper on the upper surface of the first insulating resin 61 and the second insulating resin 62, starting from the portion where the seed layer 103 is exposed. Thus, the first inductor wiring 20, the second inductor wiring 30, the first dummy wiring 41, the second dummy wiring 42, the third dummy wiring 43, and the fourth dummy wiring 44 are formed. In addition, Figure 8 In FIG. 1 , the first inductor wiring 20 and the second inductor wiring 30 are shown, but dummy wirings are not shown.

[0111] Next, if Fig. 9 As shown in FIG. 1 , the second covering step of forming the second covering portion 105 is performed. The range of forming the second covering portion 105 is the entire upper surface of the first covering portion 104, the entire upper surface of each dummy wiring, the range of the upper surface of the first inductor wiring 20 where the first vertical wiring 71 and the second vertical wiring 72 are not formed, and the range of the upper surface of the second inductor wiring 30 where the third vertical wiring 73 and the fourth vertical wiring 74 are not formed. In this range, the second covering portion 105 is formed by the same photolithography method as the method of forming the first covering portion 104. In addition, the dimension of the second covering portion 105 in the thickness direction Td is the same as that of the first covering portion 104.

[0112] Next, a vertical wiring processing step of forming each vertical wiring is performed. Specifically, the first vertical wiring 71, the second vertical wiring 72, the third vertical wiring 73, and the fourth vertical wiring 74 are formed by electrolytic copper plating on the portion of the upper surface of the first inductor wiring 20 and the second inductor wiring 30 that is not covered by the second covering portion 105. In addition, in the vertical wiring processing step, the upper end of the grown copper is set to a position slightly lower than the upper surface of the second covering portion 105. Specifically, the dimension of the thickness direction Td of each vertical wiring before cutting described later is set to be the same as the dimension of the thickness direction Td of each inductor wiring.

[0113] Next, if Fig.10 As shown in FIG. 1 , a covering portion removal step of removing the first covering portion 104 and the second covering portion 105 is performed. Specifically, a portion of the first covering portion 104 and the second covering portion 105 is physically grasped, and the first covering portion 104 and the second covering portion 105 are peeled off from the base member 101 to separate them. Fig.10In FIG. 1 , the first vertical wiring 71 and the third vertical wiring 73 are shown, but the second vertical wiring 72 and the fourth vertical wiring 74 are not shown.

[0114] Next, a seed layer etching step is performed to etch the seed layer 103. The exposed seed layer 103 is removed by etching the seed layer 103. In this way, each inductor wiring and each dummy wiring are formed by SAP (Semi Additive Process).

[0115] Next, if Fig.11 As shown in the figure, the second magnetic layer processing step of laminating the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 is performed. Specifically, first, a resin containing magnetic powder as the material of the magnetic layer 50 is applied to the upper surface side of the base member 101. At this time, the resin containing magnetic powder is applied so as to also cover the upper surface of each vertical wiring. Next, the resin containing magnetic powder is pressed and fixed by a stamping process, thereby forming the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 on the upper surface side of the base member 101.

[0116] Next, if Fig.12 As shown in the figure, the upper part of the second magnetic layer 55 is cut until the upper surface of each vertical wiring is exposed. In addition, the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 are formed as a whole, but in the accompanying drawings, the inner magnetic circuit portion 51, the outer magnetic circuit portion 52, the insulating resin magnetic layer 53 and the second magnetic layer 55 are also shown separately.

[0117] Next, if Fig.13 As shown, an insulating layer processing step is performed. Specifically, on the upper surface of the second magnetic layer 55 and the upper surface of each vertical wiring where each external terminal is not formed, a solder resist that functions as an insulating layer 90 is patterned by photolithography. In addition, in this embodiment, the direction orthogonal to the upper surface of the insulating layer 90, that is, the main surface MF of the substrate BD becomes the thickness direction Td.

[0118] Next, if Fig.14 As shown in FIG. 1 , the base member cutting step is performed. Specifically, the base member 101 and the dummy insulating layer 102 are completely removed by cutting. In addition, as a result of completely cutting the dummy insulating layer 102, a part of the lower side portion of each insulating resin is also removed by cutting, but each inductor wiring is not removed.

[0119] Next, if Fig.15As shown, the first magnetic layer processing step of laminating the first magnetic layer 54 is performed. Specifically, first, a resin containing magnetic powder as a material of the first magnetic layer 54 is applied to the lower side of the base member 101. Next, the resin containing the magnetic powder is pressed and fixed by a press process, thereby forming the first magnetic layer 54 on the lower side of the base member 101.

[0120] Next, the lower end portion of the first magnetic layer 54 is cut. For example, the lower end portion of the first magnetic layer 54 is cut so that the dimension from the upper surface of each external terminal to the lower surface of the first magnetic layer 54 becomes a desired value.

[0121] Next, if Fig.16 As shown, the external terminal processing step is performed. Specifically, on the upper surface of the second magnetic layer 55 and the upper surface of each vertical wiring that is not covered by the insulating layer 90, a metal layer 81A of the first external terminal 81, a metal layer 82A of the second external terminal 82, a metal layer 83A of the third external terminal 83, and a metal layer 84A of the fourth external terminal 84 are formed. These metal layers are formed by electroless plating each of copper, nickel, and gold. Thus, a three-layer structure of metal layer 81A, metal layer 82A, metal layer 83A, and metal layer 84A is formed. In addition, Fig.16 , the first external terminal 81 and the third external terminal 83 are shown, but the second external terminal 82 and the fourth external terminal 84 are not shown.

[0122] Next, if Fig.17As shown, the solder portion 81B of the first external terminal 81, the solder portion 82B of the second external terminal 82, the solder portion 83B of the third external terminal 83, and the solder portion 84B of the fourth external terminal 84 are formed. Specifically, solder, which is the material of each solder portion, is printed on the portion of the upper surface of the metal layer 81A, the metal layer 82A, the metal layer 83A, and the metal layer 84A that touches the upper side of the second magnetic layer 55. Then, the solder is melted and flows into the portion of the upper surface of the metal layer 81A that touches the upper side of the first vertical wiring 71. Similarly, the solder flows into the portion of the upper surface of the metal layer 82A that touches the upper side of the second vertical wiring 72, the portion of the upper surface of the metal layer 83A that touches the upper side of the third vertical wiring 73, and the portion of the upper surface of the metal layer 84A that touches the upper side of the fourth vertical wiring 74. Then, by cooling the melted solder, solder portion 81B, solder portion 82B, solder portion 83B, and solder portion 84B are formed. In this way, the shape of each solder portion is formed by heating the solder after printing. Specifically, when viewed from the long side direction Ld, the closer each solder portion is to the center of the short side direction Wd, the larger the size in the thickness direction Td. In addition, when viewed from the long side direction Ld, the surface on the upper side of the thickness direction Td of each solder portion becomes a curved shape with a smaller curvature as it approaches the upper side of the thickness direction Td. In addition, in Fig.17 , the first external terminal 81 and the third external terminal 83 are shown, but the second external terminal 82 and the fourth external terminal 84 are not shown.

[0123] Next, if Fig.18 As shown, a slicing process is performed. Specifically, the slicing is performed by cutting along the break lines DL. Thus, the inductor component 10 can be obtained. In addition, at this time, each dummy wiring included in the break lines DL is also cut, and each dummy wiring is exposed on the side of the inductor component 10.

[0124] Next, the operation of the above-mentioned embodiment will be described.

[0125] Assume that the inductor component 910 of the comparative example in which the external terminal does not have a solder portion is mounted on the substrate 920. Fig.19 As shown, the inductor component 910 of the comparative example is different from the inductor component 10 of the above-mentioned embodiment only in that each external terminal does not have a solder portion. That is, the first external terminal is composed of only the metal layer 81A. In addition, the third external terminal is composed of only the metal layer 83A. The substrate 920 has a substrate-side terminal 921. The substrate-side terminal 921 is exposed on the surface of the substrate 920. Then, the solder 930 is uniformly applied to the substrate-side terminal 921.

[0126] Next, the inductor component 910 is placed on the upper side of the substrate 920 so that each external terminal of the inductor component 910 is located at the position of the substrate-side terminal 921. Then, the solder 930 is melted in the reflow furnace, thereby connecting the substrate-side terminal 921 of the substrate 920 and each external terminal of the inductor component 910. At this time, if the amount of solder 930 is excessive, Fig. 20 As shown, there is a concern that the solder 930 connected to the metal layer 81A as the first external terminal and the solder 930 connected to the metal layer 83A as the third external terminal may come into contact. On the other hand, if the amount of solder 930 is insufficient, when the inductor component 910 is connected to the substrate 920, the area in contact with each external terminal is small, which may result in insufficient fixing force or insufficient conductivity.

[0127] In particular, in the case of a component with a relatively small dimension in the thickness direction Td, the weight is correspondingly small, and the surface area is large relative to the dimension in the thickness direction Td. Therefore, if the amount of solder 930 of each terminal is slightly deviated, the tilt of the component is likely to become too large, or the orientation of the component is likely to change due to rotation. Therefore, in the case of such a component with a relatively small dimension in the thickness direction Td, it is particularly difficult to adjust the amount of solder 930.

[0128] When the inductor component 10 of this embodiment is mounted on the substrate 920, as shown in FIG. Fig.21 As shown in FIG. 1 , the portion including the protruding tip P of the first external terminal 81 of the inductor component 10 becomes the solder portion 81B. In addition, the portion including the protruding tip P of the third external terminal 83 becomes the solder portion 83B. Furthermore, the amounts of the solder portion 81B and the solder portion 83B are adjusted according to the inductor component 10. Therefore, it is not necessary to apply solder to the substrate-side terminal 921 of the substrate 920 as in the comparative example, or it is sufficient to adjust the amount of the solder 930 applied to the substrate 920 by a small amount.

[0129] Next, if Fig. 22 As shown in FIG. 1 , the inductor component 10 is placed on the upper side of the substrate 920 so that the first external terminal 81 and the third external terminal 83 of the inductor component 10 are located at the position of the substrate-side terminal 921. Then, the solder portion 81B and the solder portion 83B are melted in a reflow furnace, whereby the substrate-side terminal 921 of the substrate 920 and the inductor component 10 are connected.

[0130] Next, the effects of the inductor component 10 of the above embodiment will be described. In the following description, the first external terminal 81 is described, and the description of other external terminals is omitted, but the same effects are achieved.

[0131] (1) According to the first embodiment, the upper portion of the first external terminal 81 of the inductor component 10 including the protruding tip P is formed as a solder portion. Therefore, it is not necessary to apply solder to the substrate-side terminal 921 of the substrate 920. It is possible to suppress the excess or shortage of solder relative to the inductor component 10 caused by applying the solder 930 to the substrate 920.

[0132] Here, when the solder 930 is uniformly applied to the substrate-side terminal 921 of the substrate 920, it is difficult to adjust the amount of solder and apply it according to the type and size of the mounting component mounted on the substrate-side terminal 921. In this regard, in the present embodiment, since the upper portion including the protruding tip P of the first external terminal 81 of the inductor component 10 becomes the solder portion 81B, the amount of solder suitable for the inductor component 10 can be formed as the solder portion 81B.

[0133] (2) According to the first embodiment, the first vertical wiring 71 and the second vertical wiring 72 are directly connected to the first inductor wiring 20 and the second inductor wiring 30. Therefore, the first inductor wiring 20 and the second inductor wiring 30 are composed of only a single layer of the first layer L1. In addition, the first layer L1 is parallel to the main surface MF of the base body BD from which the first external terminal 81 protrudes. Therefore, it is possible to contribute to the reduction in size of the inductor component 10 in the thickness direction Td.

[0134] (3) According to the first embodiment, the material of the magnetic layer 50 is a resin composite material containing metal magnetic powder composed of an iron-silicon alloy or an amorphous alloy. Therefore, the efficiency of obtaining the inductance of the inductor component 10 can be improved. In addition, the DC superposition characteristics of the inductor component 10 can be improved. Therefore, it is not necessary to make the magnetic path excessively thick, so that the dimension of the thickness direction Td of the magnetic layer 50 can be reduced accordingly. As a result, the dimension of the thickness direction Td of the inductor component 10 can be reduced.

[0135] (4) According to the first embodiment, the distance TP in the thickness direction Td from the main surface MF, which is the upper surface of the insulating layer 90, to the protruding tip P of the first external terminal 81 is less than half the dimension TBD in the thickness direction Td of the base BD. Therefore, it is possible to suppress the dimension Td in the thickness direction Td of the entire inductor component 10 from being excessively enlarged. In addition, the dimension TS in the thickness direction Td of the solder portion 81B is at least one-tenth the dimension TBD in the thickness direction Td of the base BD. Therefore, it is possible to ensure an amount of solder sufficient to mount the inductor component 10 on the substrate 920.

[0136] (5) According to the first embodiment described above, when viewed from the thickness direction Td, the area of ​​the range occupied by the first external terminal 81 is larger than the area of ​​the range of the first vertical wiring 71 exposed from the main surface MF. Therefore, compared with the case where solder is provided only on the portion of the upper surface of the vertical wiring exposed from the main surface MF, when the solder portion 81B is melted and connected to the substrate 920, it is possible to securely connect. In addition, since the area over which the solder portion 81B extends can be increased, the amount of protrusion can be suppressed while ensuring the amount of solder.

[0137] (6) According to the first embodiment described above, when viewed from the thickness direction Td, the geometric center CE1 of the solder portion 81B is offset from the geometric center CV1 of the first vertical wiring 71 in contact. Therefore, even if the positional relationship of each vertical wiring is slightly different from the positional relationship of the substrate-side terminal 921 of the substrate 920, the solder portion 81B can be connected to the substrate 920 by adjusting the position. Therefore, the degree of freedom of pattern layout of the substrate-side terminal 921 of the substrate 920 is improved.

[0138] (7) According to the first embodiment described above, when viewed from the thickness direction Td, the geometric center CE1 of the solder portion 81B is offset from the geometric center CV1 of the first vertical wiring 71. On the other hand, the geometric center CE1 of the solder portion 81B is included in the range occupied by the first vertical wiring 71. Therefore, it is possible to suppress the solder portion 81B from being excessively offset from the first vertical wiring 71. Therefore, it is possible to suppress the amount of the first external terminal 81 between the first vertical wiring 71 and the substrate 920 from becoming excessive due to the position of the solder portion 81B being excessively offset from the first vertical wiring 71 when viewed from the thickness direction Td. As a result, it is possible to suppress the loss caused by the current flowing through the first external terminal 81.

[0139] (8) According to the first embodiment, the dimension DL1 of the solder portion 81B in the long side direction Ld is larger than the dimension DS1 of the solder portion 81B in the short side direction Wd. In addition, the dimension DL1 of the solder portion 81B in the long side direction Ld is larger than the dimension DV1 of the first vertical wiring 71 in the long side direction Ld. That is, the shape of the solder portion 81B has anisotropy, so that the dimension DS1 in the short side direction Wd is not too large, and the short circuit with the third external terminal 83 can be suppressed. On the other hand, by making the dimension DL1 in the long side direction Ld larger than the first vertical wiring 71, the surface area of ​​the solder portion 81B can be increased. Therefore, when the inductor component 10 is mounted on a substrate or the like, the solder portion 81B is reliably brought into contact with the substrate-side terminal 921 of the substrate 920.

[0140] (9) According to the first embodiment, the difference between the first angle θ1 and the second angle θ2 is about 1 degree. That is, since the second angle θ2 is larger than the first angle θ1, the protruding end P is close to the center of the inductor component 10 when viewed from the thickness direction Td. After the inductor component 10 is mounted, it is difficult to confirm whether the inductor component 10 is properly mounted near the center when viewed from the thickness direction Td, but according to the first embodiment, it is possible to ensure the fixing force and conductivity in the portion that is difficult to confirm after mounting. In addition, according to the first embodiment, the difference between the first angle θ1 and the second angle θ2 is small. Therefore, when viewed from the thickness direction Td, the position of the protruding end P of the first external terminal 81 does not move too far away from the geometric center CE1 of the first external terminal 81, and the solder portion 81B is located approximately in the center of the first external terminal 81. Therefore, when the inductor component 10 is mounted on the substrate 920, it is possible to suppress the molten solder portion 81B from flowing to one side in the long side direction Ld.

[0141] (10) According to the first embodiment, the first angle θ1 is 14 degrees, which is 10 degrees or more and less than 30 degrees. In addition, the second angle θ2 is 15 degrees, which is 10 degrees or more and less than 30 degrees. Therefore, the first angle θ1 and the second angle θ2 are not too large, so the dimension TS of the thickness direction Td of the solder portion 81B is also set to a corresponding size. Therefore, it is possible to prevent the solder portion 81B from becoming too large.

[0142] (11) According to the first embodiment, when viewed from the short side direction Wd, the closer the solder portion 81B is to the center of the long side direction Ld, the larger the dimension in the thickness direction Td. Moreover, when viewed from the short side direction Wd, the upper surface of the solder portion 81B in the thickness direction Td is curved with a curvature that decreases as it approaches the upper side in the thickness direction Td. By forming such a curved shape, the solder portion 81B can be made to protrude to some extent, and the dimension TS of the solder portion 81B in the thickness direction Td can be reduced. In addition, when the solder portion 81B is melted, it is possible to suppress the solder portion 81B from protruding excessively from the end of the metal layer.

[0143] (12) According to the first embodiment described above, when viewed from the thickness direction Td, the voids in the portion of the solder portion 81B included on the upper side of the first vertical wiring 71 are smaller than the voids in the portion included on the upper side of the second magnetic layer 55. The voids in the portion of the solder portion 81B included on the upper side of the second magnetic layer 55 can reduce the residual stress when the solder portion 81B is formed. In addition, the current mainly flows in the portion of the solder portion 81B on the upper side of the first vertical wiring 71, and the voids in this portion are small, so that the flow of current from the first vertical wiring 71 to the solder portion 81B is not easily hindered.

[0144] (13) According to the first embodiment, the first external terminal 81 includes the metal layer 81A and the solder portion 81B. Therefore, by providing the metal layer 81A, the position of the protruding tip P of the first external terminal 81 can be made to protrude from the main surface MF by a dimension in the thickness direction Td of the solder portion 81B or more.

[0145] (14) According to the first embodiment described above, the distance from the upper surface of the metal layer 81A to the protruding end P of the first external terminal 81 is greater than the distance from the upper surface of the first vertical wiring 71 to the upper surface of the metal layer 81A. In other words, the dimension TS of the solder portion 81B in the thickness direction Td is greater than the dimension TM of the metal layer 81A in the thickness direction Td. In this way, by increasing the dimension TS of the solder portion 81B in the thickness direction of the first external terminal 81, the overall size of the first external terminal 81 can be increased.

[0146] (15) According to the first embodiment, the first external terminal 81 protrudes from the main surface MF toward the upper side in the thickness direction Td. Therefore, when the inductor component 10 is mounted on the substrate 920, the first external terminal 81 protruding from the main surface MF contacts the substrate 920. Therefore, it is easy to mount the main surface MF on the substrate 920 without causing interference.

[0147] The above-mentioned embodiment can be implemented by being modified as follows. The above-mentioned embodiment and the following modified examples can be implemented in combination within the range that there is no technical contradiction.

[0148] In the above embodiment, the structure of the first external terminal 81 is not limited to the example of the above embodiment. For example, the first external terminal 81 may be composed of only the solder portion 81B. In addition, for example, the structure of the metal layer 81A of the first external terminal 81 may be a two-layer structure or a four-layer or more structure. At least a portion of the first external terminal 81 including the protruding end P may be the solder portion 81B. Fig.23 In the example shown, in the inductor component 110, the first external terminal 181 is composed of a nickel layer 181A, a copper layer 181B, and a solder portion 181C. The upper surface of the first vertical wiring 71 is covered with the nickel layer 181A. The nickel layer 181A is in a thin film shape. The copper layer 181B is connected to the upper surface of the nickel layer 181A. The copper layer 181B is in a quadrangular prism shape and extends in the thickness direction Td. The metal layer is composed of the nickel layer 181A and the copper layer 181B. The solder portion 181C is connected to the upper surface of the copper layer 181B. The dimension of the copper layer 181B in the thickness direction Td is larger than the dimension of the nickel layer 181A in the thickness direction Td and the dimension of the solder portion 181C in the thickness direction Td. In addition, in this modification example, the third external terminal 183 is also composed of a nickel layer 183A, a copper layer 183B, and a solder portion 183C, similarly to the first external terminal 181.

[0149] In this way, if the dimension Td of the copper layer 181B in the thickness direction is greater than the dimension Td of the solder portion 181C in the thickness direction, that is, the distance from the upper surface of the copper layer 181B to the protruding end P of the first external terminal 181, then by increasing the dimension Td of the copper layer 181B in the thickness direction, the dimension Td of the first external terminal 181 in the thickness direction can be increased.

[0150] In addition, Fig.23 In the example shown, the dimension TS of the solder portion 181C in the thickness direction Td, i.e., the distance from the upper surface of the copper layer 181B to the protruding tip P of the first external terminal 181, is smaller than the dimension TM of the nickel layer 181A and the copper layer 181B in the thickness direction Td, i.e., the distance from the upper surface of the first vertical wiring 71 to the upper surface of the copper layer 181B. Therefore, since the ratio of the dimension of the metal layer to the dimension of the first external terminal 181 in the thickness direction Td is more than half, it is possible to suppress the amount of the solder portion 181C from becoming excessive.

[0151] In addition, as a method for forming the copper layer 181B, the copper layer 181B can be formed by arranging a pre-prepared columnar member made of copper. In addition, SAP that can form a high aspect ratio wiring can be used to increase the cross-sectional area in the thickness direction Td. In addition, the copper layer 181B can be formed by stacking multiple layers by multiple SAPs.

[0152] exist Fig.24 In the example shown, in the inductor component 210, the first external terminal 281 has a first nickel layer 281A, a copper layer 281B, and a second nickel layer 281C as metal layers. In addition, the first external terminal 281 has a solder portion 281D. The upper surface of the first vertical wiring 71 is covered with the first nickel layer 281A. The first nickel layer 281A is in a thin film shape. The copper layer 281B is connected to the upper surface of the first nickel layer 281A. The copper layer 281B is in a quadrangular prism shape and extends in the thickness direction Td. The second nickel layer 281C is connected to the upper surface of the copper layer 281B. The metal layer is composed of the first nickel layer 281A, the copper layer 281B, and the second nickel layer 281C. The solder portion 281D is connected to the upper surface of the second nickel layer 281C. Since the first nickel layer 281A and the second nickel layer 281C are provided, electromigration can be suppressed. In this modification example, the third external terminal 283 is also composed of a first nickel layer 283A, a copper layer 283B, a second nickel layer 283C, and a solder portion 283D, similar to the first external terminal 281 .

[0153] In the above embodiment, the shape of the metal layer 81A is not limited to the example in the above embodiment. Fig.25In the example shown, in the inductor component 310, the first external terminal 381 is composed of a metal layer 381A and a solder portion 381B. The dimension of the metal layer 381A in the short side direction Wd is larger than the dimension of the first vertical wiring 71 in the short side direction Wd. In addition, the upper surface of the metal layer 381A includes a portion in a planar shape and a portion in a non-planar shape. Specifically, when viewed from the upper side in the thickness direction Td, the portion other than the center of the metal layer 381A is in a planar shape, and the central portion is recessed from the upper end surface to the lower side in the thickness direction Td. Moreover, the solder portion 381B is connected to the upper surface of the metal layer 381A. In addition, in this modification, the third external terminal 383 is also composed of a metal layer 383A and a solder portion 383B, similarly to the first external terminal 381. In this way, if the surface of the metal layer 381A includes a portion in a non-planar shape, the contact area between the metal layer 381A and the solder portion 381B becomes larger. Therefore, the metal layer 381A and the solder portion 381B are also more firmly connected when the inductor component 310 is connected to the substrate 920. In addition, when the solder portion 381B is formed, the solder portion 381B is self-aligned to the position of the depression of the metal layer 381A, so that the accuracy of the formation position of the solder portion 381B can be improved.

[0154] In addition, for example, Fig.26 In the illustrated example, in the inductor component 410 , the surface of the metal layer 481A of the first external terminal 481 has a convex shape that bulges upward when viewed in the longitudinal direction Ld.

[0155] In addition, in the above Fig.25 and Fig.26 In the modified example shown, the insulating layer 90 is omitted in the inductor component 410. In this case, the main surface MF2 of the base body BD becomes the upper surface of the second magnetic layer 55. Fig.26 In the example shown, when viewed from the long side direction Ld, the surface of the metal layer 481A is convexly convex to the upper side, so even if the amount of the solder portion 481B is relatively small, the portion of the first external terminal 481 protruding from the main surface MF2 can be ensured. Therefore, even if the insulating layer 90 is omitted, the leakage of current between the terminals can be suppressed. In addition, the third external terminal 483 is composed of a metal layer 483A and a solder portion 483B, similarly to the first external terminal 481.

[0156] In addition, Fig.26In the example shown, the dimension DS41 of the short side direction Wd of the first external terminal 481 is smaller than that of the example of the above-mentioned embodiment. Similarly, the dimension DS43 of the short side direction Wd of the third external terminal 483 is smaller than that of the example of the above-mentioned embodiment. Therefore, when viewed from the thickness direction Td, the dimension DG1 of the gap between the first external terminal 481 and the third external terminal 483 is larger than the dimension DG2 of the gap between the first vertical wiring 71 and the third vertical wiring 73. In addition, when viewed from the thickness direction Td, the dimension DG1 of the gap between the first external terminal 481 and the third external terminal 483 is smaller than the dimension DV1 of one side of the square shape, which is the smallest dimension passing through the geometric center CE1 of the first external terminal 481. Therefore, the first external terminal 81 and the third external terminal 83 are configured to be separated accordingly. Therefore, even if the solder portion 81B and the solder portion 83B are melted, the short circuit between the first external terminal 81 and the third external terminal 83 can be more effectively suppressed.

[0157] In the above embodiment, the shape of each external terminal is not limited to the example in the above embodiment. For example, the upper surface of the first external terminal 81 may be flat. In this case, more solder portions 81B can be provided at positions away from the main surface MF.

[0158] ·exist Fig. 27 In the example shown, the inductor component 510 includes two sets of the inductor components 10 of the above-described embodiment. Specifically, when viewed from the thickness direction Td, the first inductor wiring 20 and the second inductor wiring 30 of the first group are arranged on the first end side of the geometric center C of the inductor component 510 in the long-side direction Ld. Furthermore, the first inductor wiring 20 and the second inductor wiring 30 of the second group are arranged at a position where the first inductor wiring 20 and the second inductor wiring 30 of the first group are rotated 180 degrees around the geometric center C. Therefore, the second inductor wiring 30 of the second group is arranged on the second end side of the first inductor wiring 20 of the first group in the long-side direction Ld. In addition, the first inductor wiring 20 of the second group is arranged on the second end side of the second inductor wiring 30 of the first group in the long-side direction Ld. In addition, each dummy wiring is omitted. In the first inductor wiring 20 of the first group, when viewed in the thickness direction Td, a distance D51 between the geometric center C of the inductor component 510 and the geometric center CE1 of the first external terminal 581 is greater than a distance D52 between the geometric center C of the inductor component 510 and the geometric center CE2 of the second external terminal 582. Fig.28As shown, the protruding end P of the first external terminal 581 is located at a position higher than the protruding end P of the second external terminal 582 in the thickness direction Td. That is, the distance TP51 ​​from the main surface MF to the protruding end P of the first external terminal 581 in the thickness direction Td is greater than the distance TP52 from the main surface MF to the protruding end P of the second external terminal 582 in the thickness direction Td. In addition, although the illustration is omitted, similarly, the protruding end of the third external terminal 583 is located at a position higher than the protruding end of the fourth external terminal 584 in the thickness direction Td.

[0159] In the above example, when the inductor component 510 is mounted on the substrate 920, the inductor component 510 tends to warp in the thickness direction Td. When viewed from the thickness direction Td, the amount of warping may increase as it is farther from the geometric center C of the substrate BD of the inductor component 510. Even in such a case, when viewed from the thickness direction Td, the first external terminal 581 farther from the geometric center C of the substrate BD protrudes more from the main surface MF than the second external terminal 582 closer to the geometric center C of the substrate BD. Therefore, when the inductor component 510 warps in the thickness direction Td, the protruding tip P of each external terminal is likely to contact the substrate 920.

[0160] In addition, in the above example, Fig.28 As shown, the first external terminal 581 is composed of a layered metal layer 581A and a layered solder portion 581B. Moreover, the upper surface of the solder portion 581B becomes the protruding end P of the first external terminal 581, so the protruding end P of the first external terminal 581 becomes a plane. Similarly, the second external terminal 582 is composed of a layered metal layer 582A and a layered solder portion 582B. Moreover, the upper surface of the solder portion 582B becomes the protruding end P of the second external terminal 582, so the protruding end P of the second external terminal 582 becomes a plane. In the case where the distance from the main surface MF to the protruding end P of the external terminal in the thickness direction Td is different, if the protruding end P is made flat, it is easy to adjust by cutting the protruding side of the external terminal whose protrusion amount is set to be small.

[0161] In addition, Fig. 27In the example shown, on the main surface MF of the substrate BD, a conductive portion 591 different from each external terminal is provided between the first external terminal 581 and the second external terminal 582 in the long side direction Ld. By providing a plurality of such conductive portions 591, the number of portions having a higher thermal conductivity than the magnetic layer 50 increases, thereby facilitating heat dissipation. In addition, the surface area of ​​the inductor component 510 is enlarged, thereby facilitating heat dissipation. In this modification, three conductive portions 591 are arranged in the short side direction Wd, and a total of six conductive portions 591 are installed. The position of the conductive portion 591 located at the end of the three arranged conductive portions 591 in the short side direction Wd coincides with each external terminal. The conductive portion 591 is in the shape of a rectangular parallelepiped. As shown Fig.28 As shown, the dimension TC of the thickness direction Td of the conductive portion 591, i.e., the distance from the main surface MF to the upper surface of the conductive portion 591, is smaller than the distance TP51 ​​of the thickness direction Td from the main surface MF to the protruding end P of the first external terminal 581. Fig. 27 As shown, when viewed from the thickness direction Td, the minimum dimension DG55 of the gap between the first external terminal 581 and the conductive portion 591 is larger than the minimum dimension of the first external terminal 581 passing through the geometric center CE1 of the first external terminal 581, that is, the dimension DS1 of the short side direction Wd of the first external terminal 581. Therefore, each external terminal is separated from the conductive portion 591 accordingly. Therefore, even if each solder portion is melted, it is possible to prevent the external terminals from being short-circuited via the conductive portion.

[0162] In the above embodiment, the structure of the base body BD is not limited to the example in the above embodiment. Fig.25 and Fig.26 As in the example shown in the figure, the insulating layer 90 is omitted, and the first insulating resin 61 and the second insulating resin 62 can also be omitted. It is sufficient as long as the first inductor wiring 20 and the second inductor wiring 30 are arranged in the base BD. Therefore, the material of the base BD is not limited to the above-mentioned embodiment, and can be all resin, non-magnetic material, or a sintered body of ferrite, glass, aluminum oxide, etc. In addition, for example, the insulating resin magnetic layer 53 and the first magnetic layer 54 in the base BD can also be non-magnetic materials. In this case, it is easy to ensure the insulation of the lower side of each inductor wiring in the thickness direction Td. In addition, if the base BD includes a magnetic layer 50 made of a magnetic material, it is easy to ensure the corresponding inductance value. In particular, if the first magnetic layer 54 and the second magnetic layer 55 are stacked so as to clamp each inductor wiring from both sides in the thickness direction Td, it is easy to prevent magnetic flux leakage, so that the corresponding inductance value can be obtained.

[0163] In the above-described embodiment, the first inductor wiring 20 and the second inductor wiring 30 only need to generate magnetic flux in the magnetic layer when current flows therethrough, thereby providing inductance to the inductor component 10 .

[0164] In the above embodiment, the shape of each inductor wiring is not limited to the example of the above embodiment. For example, the first inductor wiring 20 may be a curved shape with more than 1.0 turns or a straight shape with 0 turns. In addition, the first inductor wiring 20 and the second inductor wiring 30 may have different shapes. In addition, each inductor wiring may have a meandering shape. In addition, for example, the first inductor wiring 20 and the second inductor wiring 30 may extend in multiple layers parallel to the main surface MF.

[0165] In the above-described embodiment, the first wiring body 21 of the first inductor wiring 20 , the pads, and the dummy wirings do not necessarily need to be integrated, and may be separate components.

[0166] In addition, each pad may be arranged so as to be offset from the geometric center of each vertical wiring when viewed from the thickness direction Td.

[0167] In the above embodiment, the number of inductor wirings is not limited to the example in the above embodiment. Fig. 27 As in the illustrated modification example, the total number of inductor wirings is four, but the number of inductor wirings may be only one.

[0168] In the above embodiment, the structure of each inductor wiring is not limited to the example in the above embodiment. For example, in the first inductor wiring 20, the first pad 22 and the second pad 23 may be omitted, and the shapes of the first pad 22 and the second pad 23 are not limited to the example in the above embodiment. For example, the shapes of the first pad 22 and the second pad 23 may be circular or polygonal when viewed from the thickness direction Td.

[0169] In the above embodiment, the composition of each inductor wiring is not limited to the example in the above embodiment. For example, silver or gold may be used.

[0170] In the above embodiment, the composition of the magnetic layer 50 is not limited to the example in the above embodiment. For example, the material of the magnetic layer 50 may be ferrite powder or a mixture of ferrite powder and metal magnetic powder.

[0171] In the above embodiment, the first vertical wiring 71 may not only extend in the direction perpendicular to the main surface MF. The first vertical wiring 71 only needs to extend in the direction perpendicular to the main surface MF, and for example, may be inclined with respect to the thickness direction Td, as long as it penetrates the second magnetic layer 55. The same applies to the second vertical wiring 72, the third vertical wiring 73, and the fourth vertical wiring 74.

[0172] In each of the above-described embodiments, the first vertical wiring 71 is connected to the first pad 22 via a through hole. This also applies to the second vertical wiring 72, the third vertical wiring 73, and the fourth vertical wiring 74.

[0173] In the above embodiment, the amount of the first external terminal 81 protruding from the main surface MF is not limited to the example of the above embodiment. The larger the distance TP in the thickness direction Td from the main surface MF to the protruding end P of the first external terminal 81 is, the larger the distance between the main surface MF and the substrate 920 can be ensured when the inductor component 10 is mounted on the substrate 920. On the other hand, the smaller the distance TP in the thickness direction Td from the main surface MF to the protruding end P of the first external terminal 81 is, the smaller the dimension of the thickness direction Td of the inductor component 10 can be suppressed from becoming too large. In terms of suppressing the dimension of the thickness direction Td of the inductor component 10 from becoming too large, it is preferable that the distance TP in the thickness direction Td from the main surface MF to the protruding end P of the first external terminal 81 is less than one-fifth of the dimension TBD in the thickness direction Td of the base BD.

[0174] In the above embodiment, when viewed from the thickness direction Td, the area of ​​the range occupied by the first external terminal 81 may be less than the area of ​​the range exposed from the main surface MF of the first vertical wiring 71. If the area of ​​the range occupied by the first external terminal 81 is appropriately small, contact with other external terminals and conductive portions provided around the first external terminal 81 can be avoided.

[0175] In the above embodiment, the first external terminal 81 may cover other than the main surface MF. For example, the first external terminal 81 may cover the side surface on the first end side in the short-side direction Wd of the base body BD.

[0176] In the above embodiment, the position of the solder portion 81B when viewed from the thickness direction Td is not limited to the example of the above embodiment. When viewed from the thickness direction Td, the geometric center of the solder portion 81B may coincide with the geometric center CV1 of the first vertical wiring 71. In addition, when viewed from the thickness direction Td, the geometric center of the solder portion 81B may be located outside the range occupied by the first vertical wiring 71.

[0177] In the above embodiment, the magnitude of the angle of the first angle θ1 and the angle of the second angle θ2 is not limited to the example of the above embodiment. For example, the difference between the angle of the first angle θ1 and the angle of the second angle θ2 may be greater than 15 degrees. In this regard, if the difference between the angle of the first angle θ1 and the angle of the second angle θ2 is less than 15 degrees, the first external terminal 81 is preferred in preventing the deviation in the long side direction Ld. In addition, the angle of the first angle θ1 and the angle of the second angle θ2 may be less than 10 degrees, or may be greater than 30 degrees.

[0178] In the above embodiment, the relationship between the void included in the solder portion 81B on the upper side of the first vertical wiring 71 and the void included in the portion on the upper side of the upper surface of the second magnetic layer 55 is not limited to the example of the above embodiment. The void included in the solder portion 81B may not exist, and the void included in the solder portion 81B on the upper side of the first vertical wiring 71 may be greater than the void included in the portion on the upper side of the upper surface of the second magnetic layer 55. In addition, there may be no void inside the solder portion 81B.

[0179] In the above-mentioned embodiment, the material of the solder portion 81B is not limited to an alloy containing tin and lead as main components. The material of the solder portion 81B can be any alloy containing tin, specifically, an alloy containing tin, silver and copper, an alloy containing tin and antimony, and an alloy containing tin and bismuth. In the case of containing silver, the melting point of the solder can be adjusted by increasing the amount of silver added, so it is preferred. If it is an alloy of tin and antimony, the melting point is higher than that of an alloy of tin, silver and copper, and it can also cope with the situation of installation at high temperature. If it is an alloy of tin and bismuth, the melting point can be lowered compared to the alloy of tin, silver and copper. The alloy of tin, silver and copper is particularly excellent in the balance between reliability and price, so it is preferred. In addition, the material of the solder portion 81B is an alloy containing tin, so it does not contain pure metal tin.

[0180] Regarding the layers L1 to L5 in the above-mentioned embodiments, the boundaries between the layers L1 to L5 are not necessarily clear, but may be unclear. In addition, the layers L1 to L5 may be warped or deformed.

[0181] The material of the insulating layer 90 does not need to be a solder resist, and may be a resin that is not photosensitive and thermosetting. The insulating layer 90 is preferably of the same system as the resin that is the base material of the magnetic layer 50, in order to improve adhesion. Specifically, if the base material of the magnetic layer 50 is an epoxy resin, the material of the insulating layer 90 is also an epoxy resin, and the adhesion between the insulating layer 90 and the magnetic layer 50 is improved.

[0182] However, if the inductor component and the substrate are warped when the inductor component is mounted on the substrate, the main surface of the inductor component may interfere with the substrate, and the external terminal of the inductor component may not contact the terminal of the substrate, or the distance between the two may increase. In this case, there is a possibility that poor conduction may occur between the external terminal of the inductor component and the terminal of the substrate.

[0183] exist Fig.31In the example shown, the first external terminal 681 is composed of a layer made of copper alone, and protrudes from the main surface MF2 of the base body BD. In addition, the third external terminal 683 is composed of a layer made of copper alone, similarly to the first external terminal 681. In the case where the inductor component 610 or the substrate is warped, the first external terminal 681 may not have a solder portion, and it is sufficient that the first external terminal 681 protrudes from the main surface MF2 of the base body BD, from the viewpoint of making the first external terminal 681 reliably contact the terminal of the substrate.

[0184] In the above embodiment, the manufacturing method of the inductor component 10 is not limited to the example of the above embodiment. For example, in order to form each vertical wiring, it is also possible to use a columnar metal columnar member instead of a plating method. Fig.23 As shown in the modification example, the copper layer included in the metal layer is formed by SAP. Specifically, Fig.15 As shown in FIG. 1 , after the first magnetic layer processing step of laminating the first magnetic layer 54 is performed, as shown in FIG. Fig.29 As shown, a third covering step is performed to form a third covering portion 106 on the upper surface of the insulating layer 90. The third covering portion 106 is formed on the upper surface of the insulating layer 90 by the same photolithography method as the method of forming the first covering portion 104.

[0185] Next, if Fig.30 As shown in FIG. 1 , each copper layer is formed by electrolytic copper plating in the portion not covered by the third covering portion 106. Then, the third covering portion 106 is removed, and solder portions are formed on the upper surfaces of each copper layer and separated into pieces, thereby obtaining the inductor component 110. In this way, the copper layer 181B can be formed by SAP, so that the dimension in the thickness direction Td can be relatively easily adjusted.

[0186] The following is a summary of technical ideas that can be grasped from the above-described embodiment and modified examples.

[0187] <Note>

[0188] Provided is an inductor component comprising:

[0189] a substrate having a major surface;

[0190] an inductor wiring extending in parallel with the main surface in the substrate;

[0191] a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; and

[0192] The external terminal is stacked on the vertical wiring exposed from the main surface, and at least a part thereof protrudes from the main surface.

[0193] A distance from the main surface to the distal end of the external terminal in the thickness direction is not less than one tenth and less than one half of a dimension of the base in the thickness direction.

Claims

1. An inductor component, characterized in that: have: a substrate having a major surface; an inductor wiring extending in parallel with the main surface in the base; a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; as well as an external terminal, arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring, When viewed from the thickness direction, the geometric center of the solder portion deviates from the geometric center of the vertical wiring, When viewed from the thickness direction, the geometric center of the solder portion is located within a range occupied by the vertical wiring.

2. An inductor component, characterized in that: have: a substrate having a major surface; an inductor wiring extending in parallel with the main surface in the base; a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; as well as an external terminal, arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring, When a direction parallel to the main surface is set as a first direction, and a direction parallel to the main surface and orthogonal to the first direction is set as a second direction, a dimension of the solder portion in the first direction is larger than a dimension of the solder portion in the second direction and a dimension of the vertical wiring in the first direction, In a cross section orthogonal to the second direction and including the end of the external terminal, The acute angle formed by a line segment connecting the end of the external terminal and the first end of the external terminal in the first direction and a line segment connecting the first end of the external terminal in the first direction and the second end of the external terminal in the first direction is set as a first angle, When the acute angle formed by a line segment connecting the end of the external terminal and the second end of the external terminal in the first direction and a line segment connecting the first end of the external terminal in the first direction and the second end of the external terminal in the first direction is set as the second angle, The first angle is greater than 10 degrees and less than 30 degrees, The second angle is greater than or equal to 10 degrees and less than 30 degrees.

3. The inductor component according to claim 2, characterized in that In a cross section orthogonal to the second direction and including the end of the external terminal, The acute angle formed by a line segment connecting the end of the external terminal and the first end of the external terminal in the first direction and a line segment connecting the first end of the external terminal in the first direction and the second end of the external terminal in the first direction is set as a first angle, When the acute angle formed by a line segment connecting the end of the external terminal and the second end of the external terminal in the first direction and a line segment connecting the first end of the external terminal in the first direction and the second end of the external terminal in the first direction is set as the second angle, The difference between the first angle and the second angle is less than 15 degrees.

4. An inductor component, characterized in that: have: a substrate having a major surface; an inductor wiring extending in parallel with the main surface in the base; a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; as well as an external terminal, arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring, When viewed from a direction parallel to the main surface, the surface of the solder portion has a curved shape whose curvature decreases as it approaches the distal end of the external terminal.

5. An inductor component, characterized in that: have: a substrate having a major surface; an inductor wiring extending in parallel with the main surface in the base; a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; as well as an external terminal, arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring, The solder portion covers a range from above the vertical wiring to above the base body and has a plurality of gaps therein. In the solder portion, the void in a portion above the vertical wiring is smaller than the void in a portion above the base.

6. An inductor component, characterized in that: have: a substrate having a major surface; an inductor wiring extending in parallel with the main surface in the base; a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; as well as an external terminal, arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring, A conductive portion different from the external terminal is exposed from the main surface, A distance from the main surface to an upper surface of the conductive portion in the thickness direction is smaller than a distance from the main surface to a distal end of the external terminal in the thickness direction.

7. An inductor component, characterized in that: have: a substrate having a major surface; an inductor wiring extending in parallel with the main surface in the base; a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; as well as an external terminal, arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring, When the vertical wiring is a first vertical wiring and the external terminal is a first external terminal, the inductor component further includes: a second vertical wiring connected to the inductor wiring and extending in the thickness direction to be exposed from the main surface; and a second external terminal disposed on the second vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the second vertical wiring, A distance from the main surface to the end of the first external terminal in the thickness direction is different from a distance from the main surface to the end of the second external terminal in the thickness direction, When viewed from the thickness direction, the distance between the geometric center of the first external terminal and the geometric center of the substrate is greater than the distance between the geometric center of the second external terminal and the geometric center of the substrate. A distance from the main surface to the distal end of the first external terminal in the thickness direction is greater than a distance from the main surface to the distal end of the second external terminal in the thickness direction.

8. An inductor component, characterized in that: have: a substrate having a major surface; an inductor wiring extending in parallel with the main surface in the base; a vertical wiring connected to the inductor wiring and extending in a thickness direction perpendicular to the main surface to be exposed from the main surface; as well as an external terminal, arranged on the vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion composed of a tin alloy having a lower melting point than the inductor wiring and the vertical wiring, When the inductor wiring is used as a first inductor wiring and the external terminal is used as a first external terminal, The inductor component further comprises: a second inductor wiring extending in parallel with the main surface in the base body, separate from the first inductor wiring; a third vertical wiring connected to the second inductor wiring and extending in the thickness direction to be exposed from the main surface; as well as a third external terminal disposed on the third vertical wiring exposed from the main surface, at least a portion of which protrudes from the main surface, and at least a portion including a terminal end of the protrusion is a solder portion made of a material having a lower melting point than the second inductor wiring and the third vertical wiring, When observed from the thickness direction, the minimum distance of the gap between the first external terminal and the third external terminal is smaller than the minimum dimension of the first external terminal passing through the geometric center of the first external terminal and the minimum dimension of the third external terminal passing through the geometric center of the third external terminal.

9. The inductor component according to any one of claims 1, 2, 4 to 8, characterized in that: When the vertical wiring is a first vertical wiring, the inductor component further includes a second vertical wiring extending in the thickness direction and exposed from the main surface. The inductor wiring includes: a wiring main body extending in a linear shape; a first pad provided at a first end of the wiring main body; and a second pad provided at a second end of the wiring main body. The first vertical wiring is connected to the first pad, The second vertical wiring is connected to the second pad, The base body has: a first magnetic layer arranged on the opposite side of the main surface with respect to the inductor wiring; and a second magnetic layer disposed on the main surface side with respect to the inductor wiring, The first vertical wiring and the second vertical wiring penetrate the second magnetic layer.

10. The inductor component according to any one of claims 1, 2, 4 to 8, characterized in that: The distance from the main surface to the end of the external terminal in the thickness direction is less than half of the dimension of the base in the thickness direction. A dimension of the solder portion in the thickness direction is one tenth or more of a dimension of the base in the thickness direction.

11. The inductor component according to any one of claims 1, 2, 4 to 8, characterized in that: The tip of the external terminal forms a plane parallel to the main surface.

12. The inductor component according to any one of claims 1, 2, 4 to 8, characterized in that: The external terminal further includes a metal layer covering the vertical wiring exposed from the main surface, The solder portion covers a surface of the metal layer.

13. The inductor component according to claim 12, characterized in that A dimension of the solder portion in the thickness direction is larger than a dimension of the metal layer in the thickness direction.

14. The inductor component according to claim 12, characterized in that A dimension of the solder portion in the thickness direction is smaller than a dimension of the metal layer in the thickness direction.

15. The inductor component according to claim 12, characterized in that A surface of the metal layer on the side where the external terminal protrudes has a convex shape that protrudes toward the side where the external terminal protrudes relative to the main surface.

16. The inductor component according to claim 12, characterized in that A surface of the metal layer on the side where the external terminal protrudes includes a portion having a planar shape and a portion having a non-planar shape.

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