Glue removal equipment and glue removal method

Abstract

The present invention relates to a degumming device and a degumming method. The degumming device comprises a feeding unit, a heating unit and a degumming unit. The feeding unit is used to transfer chips forward according to a preset orientation. The heating unit is arranged on a transfer path of the chips and is used to heat the chips. The degumming unit comprises a scraper, which can move relative to the chips to remove colloid on the surface of the heated chips. The chips are transferred forward according to the preset orientation by the feeding unit, so that the chips can be transferred forward in a regular manner according to the same orientation. When the chips are transferred through the heating unit, the chips can be heated, and the interface between the chip colloid and the PCB board will be softened to a certain extent. At this time, the scraper in the degumming unit removes the colloid. In this way, since the colloid is softened by heat, the scraper does not need to directly remove hard colloid, and the driving force of the scraper does not need to be very large. At the same time, damage to the PCB board caused by direct removal of the hard colloid is avoided.

Description

Technical Field

[0001] The invention relates to the processing of regenerated ink cartridge chips in the technical field of printer consumables, and in particular to a glue removal device for removing black glue on the surface of the regenerated chips. Background Art

[0002] Ink cartridges and toner cartridges are consumables used in printers. They are equipped with a chip that records information about the cartridge or toner cartridge, including but not limited to the manufacturer, toner / ink level, and production date. As the consumables are used, the chip continuously updates this information until the toner / ink is depleted. When the toner or ink is depleted, the printer typically needs to be replaced with new, genuine consumables. However, replacing genuine cartridges is expensive, and discarding consumables is environmentally unfriendly. Therefore, recycling printer consumables is gaining increasing attention.

[0003] In the aforementioned consumables, a bonding process is used to establish an electrical connection between the pins and traces of the original chip wafer and the PCB. After bonding, a black adhesive is applied to the bonded wafer and cured at high temperature to create a complete, original chip. To regenerate a chip, the cured adhesive must first be removed without damaging the PCB structure, exposing the wafer and removing it. This allows the regenerated wafer to be bonded to the PCB.

[0004] Technicians in this field often attempt to remove vinyl using chemical methods. These methods involve soaking the entire chip in vinyl-specific solvents or dissolving agents, or by dripping these chemicals onto the vinyl surface and waiting for it to dissolve. However, vinyl, used to protect wafers and wire bonds, is primarily composed of epoxy resin. To achieve optimal protection, it is often mixed with curing agents, additives, and fillers, resulting in a higher hardness after high-temperature curing. PCBs are also primarily made of epoxy resin. Therefore, when using these chemical methods to remove vinyl, the PCB often dissolves while the vinyl remains intact.

[0005] It can be seen that the sol used to dissolve black glue in the chemical methods currently tried is not only difficult to dissolve the black glue, but also very easy to damage the PCB board structure. Therefore, a new glue removal method needs to be proposed to meet the needs of recycled chips. Summary of the Invention

[0006] Based on this, it is necessary to provide a degumming device and a degumming method to address the above problems, wherein the degumming device can efficiently remove the colloid on the chip surface.

[0007] The present invention first provides a degumming device, which includes a feeding unit, a heating unit and a degumming unit, wherein:

[0008] The feeding unit is used to transfer the chips forward according to a preset orientation;

[0009] The heating unit is arranged on the transfer path of the chip and is used to heat the chip;

[0010] The adhesive removal unit includes a scraper, and the scraper can move relative to the chip to scrape off the adhesive on the surface of the heated chip.

[0011] In one embodiment, the feeding unit includes a conveying device, and the conveying device includes a conveying track and a pushing component for pushing the chips on the conveying track forward.

[0012] In one embodiment, the feeding unit further includes a vibration device, and one end of the conveying track is connected to the material outlet of the vibration device and is used to receive the chips output from the material outlet;

[0013] The conveying track can vibrate along with the vibration device and has at least one screening portion, and the screening portion only screens the chips placed in a preset direction on the conveying track and transfers them forward.

[0014] In one embodiment, the pushing assembly includes a driving source and a feeding brush capable of rotating at a constant speed along with the driving source;

[0015] The feeding brush is suspended above the conveying track and can contact the chips on the conveying track to push the chips forward.

[0016] In one embodiment, the heating unit includes a heat conduction platform and a heating component mounted on the heat conduction platform. The heat conduction platform is arranged on a path for the feeding unit to transfer the chip and can transfer the heat of the heating component to the PCB board of the chip.

[0017] In one embodiment, the feeding unit includes a conveying track for transferring the chips forward, the conveying track extends through the heat conducting platform, and the scraper is correspondingly provided on one side of the conveying track passing through the heat conducting platform and can move to the other side in a direction perpendicular to the direction in which the conveying track extends; or,

[0018] The feeding unit includes a conveying track for transferring the chip forward, and the conveying track extends to the heat conduction platform so that the chip is conveyed forward to the heat conduction platform. The heat conduction platform is provided with a conveying trough for allowing the chip to continue to be transferred forward. The scraper is correspondingly provided on one side of the extension direction of the conveying trough and can move to the other side of the conveying trough in a direction perpendicular to the extension direction of the conveying trough.

[0019] In one embodiment, the heat conduction platform is provided with limit baffles, and the limit baffles are located on both sides of the chip forward transfer direction; and

[0020] The adhesive removal unit includes a lifting device installed on the heat conduction platform, and the lifting device can push the chip in the conveying groove toward the lower surface of the limiting baffle so that the adhesive surface of the chip abuts against the lower surface of the limiting baffle;

[0021] The limit baffle is provided with a tool groove running through the limit baffle. When the scraper moves in the tool groove, the blade of the scraper is flush with the lower surface of the limit baffle to scrape off the colloid from the interface between the adhesive surface of the chip and the colloid.

[0022] In one embodiment, the glue removal unit also includes a tool holder assembly for mounting the scraper, and a support assembly installed in a fixed position, the support assembly includes a guide rail extending in the same direction as the tool groove, and the tool holder assembly is slidably connected to the guide rail.

[0023] In one embodiment, the glue removal equipment further includes a cleaning unit, which is correspondingly arranged at the end point of the moving stroke of the scraper and can take away the scraped colloid.

[0024] In one embodiment, the degumming device further includes a polishing unit, which is arranged behind the degumming unit along the direction in which the chip is transferred forward, and is used to polish the area of ​​the chip after degumming.

[0025] In one embodiment, the glue removal equipment also includes a base and a hood, and the feeding unit, the heating unit and the glue removal unit are all arranged on the base; the hood is installed on the base and covers the feeding unit, the heating unit and the glue removal unit; the glue removal equipment also includes a dust removal unit installed on the hood and used to remove impurities in the hood.

[0026] In addition, the present invention also provides a chip debonding method, which includes performing the following steps during the process of transferring the chip forward:

[0027] S1. Heating step: heating the non-glue surface of the chip to soften the colloid at the junction of the chip and the PCB board;

[0028] S2. Glue removal step: Move the scraper along the glued surface of the chip to remove the glue on the glued surface of the chip at the softened part of the glue.

[0029] In one embodiment, the following steps are further included before the adhesive removal step:

[0030] S3. A lifting step, wherein the chip is lifted upward by a lifting device so that the adhesive surface of the chip and the blade of the blade are in the same plane;

[0031] Add the following steps after the degumming step:

[0032] S4. Polishing step: polishing the adhesive surface of the chip by a rotating roller brush.

[0033] In the above-mentioned degumming equipment and degumming method, the chip is transferred forward in a preset orientation by the feeding unit, so that the chip can be transferred forward in an orderly manner in the same orientation. When the chip is transferred through the heating unit, the chip can be heated, and the interface between the chip's colloid and the PCB board will soften to a certain extent. At this time, the colloid is scraped off by the scraper in the degumming unit. In this way, since the colloid is softened by heat, the scraper does not need to directly scrape off the hard colloid, and the scraper driving force does not need to be very large. At the same time, it also avoids damage to the PCB board caused by direct scraping of the hard colloid. Compared with the existing chemical sol method, the method of scraping off the colloid after heating can better avoid damage to the PCB board; the chip is transferred forward by the feeding unit and is first heated and then degummed during the transfer process. The heating only needs to soften the colloid locally. Compared with the chemical sol method, the time is shortened, and the production efficiency of the regenerated chip is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of the three-dimensional structure of a typical chip;

[0035] Figure 2 A schematic diagram of the three-dimensional structure of a glue removal device according to an embodiment of the present invention;

[0036] Figure 3 for Figure 2 The internal structure diagram of the glue removal equipment is shown in the figure, in which components such as the machine cover and base are omitted;

[0037] Figure 4 for Figure 3 A schematic diagram of the three-dimensional structure of the structure shown in another perspective;

[0038] Figure 5 for Figure 2 The internal structure diagram of the glue removal equipment is shown in FIG. Figure 3 The cleaning unit is further omitted on the basis of

[0039] Figure 6 for Figure 3 A schematic diagram of the enlarged structure of part A of the structure shown in ;

[0040] Figure 7 for Figure 4 A schematic diagram of the enlarged structure of part B of the structure shown in FIG;

[0041] Figure 8 for Figure 5 Schematic diagram of the enlarged structure of part C of the structure shown in ;

[0042] Figure 9 This is a schematic diagram of the three-dimensional structure of a heating unit according to one embodiment;

[0043] Figure 10 for Figure 9 A top view of the heating unit shown in ;

[0044] Figure 11 This is a diagram of the working principle of the elastic lifting device.

[0045] 100, feeding unit; 11, transmission device; 111, transmission track; 112, pushing assembly; 1121, driving source; 1122, feeding brush; 12, vibration device;

[0046] 200, heating unit; 21, heat conduction platform; 211, conveying trough; 212, top outlet; 22, limit baffle; 221, tool groove; 222, grinding groove;

[0047] 300, glue removal unit; 31, scraper; 32, tool holder assembly; 33, support assembly; 331, guide rail; 34, impact unit;

[0048] 400, cleaning unit; 500, polishing unit; 51, roller brush; 600, base; 700, hood; 71, touch screen; 72, function button; 73, temperature control device; 74, indicator light; 800, dust removal unit;

[0049] 900, chip; 91, PCB board; 92, colloid; 93, component; 94, notch. DETAILED DESCRIPTION

[0050] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0051] It should be noted that when a component is referred to as being "mounted on" another component, it may be mounted directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component. When a component is considered to be "fixed to" another component, it may be directly fixed to the other component or there may be a central component.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0053] In the present invention, unless otherwise specified, directional words such as "front" and "rear" generally refer to the front and rear relative to the chip transfer direction, that is, along the transmission direction of the chip from the vibration device to the polishing unit, the direction close to the vibration device is "front" and the direction close to the polishing unit is "rear".

[0054] Hereinafter, the adhesive removal equipment will be further described through the following specific embodiments.

[0055] First reference Figure 1 As shown in the figure, the chip 900 currently used in the production of regenerative chips on the market generally includes: a roughly rectangular PCB board 91, with a colloid 92 disposed on one side of the PCB board 91. The side of the PCB board with the colloid 92 is defined as the adhesive side, and the other side opposite to it is defined as the adhesive-free side. Components 93 are also disposed on the adhesive side, which can be common electronic components on chips, such as resistors. In addition, the edge of the PCB board also has a notch 94. As can be understood, Figure 1 The above is only a schematic diagram of a chip structure. Existing chip structures vary. Some chips do not have components, and some chips do not have notches. However, these chips all have a colloid 92 for protecting the bonding structure between the wafer and the PCB board.

[0056] When using chip 900 to produce recycled chips, the adhesive 92 on PCB 91 must be removed. During the removal process, the PCB 91 must be kept intact to allow the circuitry within PCB 91 to re-bond with the new wafer. During automated recycled chip production, the chips 900 must be continuously fed into the relevant equipment according to a specific pattern. For example, the adhesive removal equipment provided by the present invention continuously feeds the chips 900 forward with the adhesive-coated surface facing upward.

[0057] refer to Figures 2 to 5 As shown in FIG, a degumming device according to an embodiment of the present invention includes a feeding unit 100, a heating unit 200 and a degumming unit 300, wherein:

[0058] The feeding unit 100 is used to transfer the chips forward according to a preset orientation. In one embodiment, the feeding unit 100 includes a transmission device 11 and a vibration device 12. The vibration device 12 can be a device similar to a vibrating plate that continuously outputs materials through vibration.

[0059] The transmission device 11 may include a transmission track 111 and a pushing assembly 112. The transmission track 111 is connected to the material output port of the vibration device 12, and the chip can be output from the vibration device 12 to the transmission track 111. The pushing assembly 112 includes a driving source 1121 and a feeding brush 1122 connected to the motion output end of the driving source 1121. The driving source 1121 can be configured as any device that can output uniform rotation, such as a motor. The feeding brush 1122 rotates at a uniform speed under the drive of the driving source 1121; the feeding brush 1122 is suspended above the transmission track 111, and the bristles on the feeding brush 1122 can contact the chip on the transmission track 111, and utilize the uniform rotation of the feeding brush 1122 itself to push the chip forward at a basically uniform speed. In other embodiments, the transmission device 11 may also adopt a structure similar to a conveyor belt, that is, the chip is directly transferred forward through the transmission track 111, and the feeding brush 1122 is eliminated, or other forms are adopted, as long as the chip output by the vibration device 12 can be pushed forward.

[0060] The conveying track 111 may also be provided with an empty position sensor for detecting whether there is an empty position on the conveying track 111. In this way, when there is no chip on the conveying track 111 or the chip transmission is interrupted, the empty position sensor can send an electrical signal to the central control unit of the degumming equipment. For example, when there are no chips in the vibration device 12, there are no chips on the conveying track 111. At this time, the empty position sensor can detect the lack of material in the vibration device 12 and send a signal to the central control system of the degumming equipment.

[0061] Return Reference Figure 1 As shown in , in order to cooperate with the subsequent heating and degumming process, the chips 900 need to be arranged according to a certain pattern, and the chips arranged according to the pattern are transferred to the transfer track 111. For example, the chips 900 need to be arranged in a direction with the adhesive surface facing upward, and it is also necessary to consider that the components 93 will not be damaged during the degumming process. Therefore, in some embodiments, the transfer track 111 can vibrate with the vibration device 12 and has at least one screening part, which is used to screen the chips placed in a preset direction and transfer them forward, and the remaining chips fall back into the material trough of the vibration device 12 as the transfer track 111 vibrates. In this way, the chips transferred forward by the transfer track 111 are all placed in the same direction, and they can all keep the adhesive surface facing upward and the components or gaps in the same direction.

[0062] The heating unit 200 is disposed on the path where the chip is transferred forward to heat the chip. Figure 9 and Figure 10 As shown in the figure, the heating unit 200 may include a heat-conducting platform 21 and a heating element (not shown) installed in the heat-conducting platform 21. The heating element generates heat and increases the temperature of the heat-conducting platform 21. The PCB board 91 of the chip receives the heat, and the temperature of the PCB board 91 gradually increases, so that the contact between the colloid 92 and the PCB board 91 first softens. It is understandable that since the regenerated chip needs to be re-bound to a new wafer using the PCB board 91 later, the heating temperature cannot affect the structure of the PCB board 91 itself. Generally speaking, the components of the sensor circuit or logic circuit on the chip are connected to the PCB board through high-temperature solder. The melting point of this type of high-temperature solder is generally above 150°. Therefore, as long as the temperature transferred to the PCB board 91 is lower than the melting point of the solder, the original structure of the PCB board 91 will not be damaged.

[0063] Furthermore, in order to prevent the temperature of the heating components or the heat conducting platform 21 from being too high, a temperature control device for controlling the temperature may be provided at the heating unit 200 or other locations of the degumming equipment.

[0064] In order to allow the chips on the conveying track 111 to receive the heat from the heat conducting platform 21, the conveying track 111 can be extended directly through the heat conducting platform 21, or the like can be used. Figure 6 、 Figure 9 and Figure 10 As shown in FIG, a transfer slot 211 for accommodating chips to be transferred forward is provided on the heat transfer platform 21 , so that the chips can transfer heat to the heat transfer platform 21 directly or indirectly through other devices without the need for heat conduction through the transfer track 111 .

[0065] refer to Figure 6 、 Figure 8 and Figure 10 As shown in FIG, the adhesive removal unit 300 includes a blade 31, a guide frame assembly 32 for mounting the blade 31, and a support assembly 33 mounted in a fixed position. The support assembly 33 is mounted in a fixed position on the adhesive removal equipment and is equipped with an impact unit 34 for driving the blade 31 to quickly extend and retract. In some embodiments, the impact unit 34 can be configured as a pneumatic cylinder, a hydraulic cylinder, etc. To achieve a faster movement speed for the blade 31, the pneumatic cylinder, hydraulic cylinder, etc. serving as the impact unit 34 can also be connected to a fast-action control circuit to enable it to drive the blade 31 to quickly extend and retract.

[0066] Furthermore, to more precisely control the trajectory of the blade 31, the support assembly 33 is provided with a guide rail 331, to which the tool holder assembly 32 is slidably connected. When the impact unit 34 is activated, it drives the tool holder assembly 32 along the guide rail 331, thereby ensuring a more precise movement path for the blade 31 mounted on the tool holder assembly 32.

[0067] If the chip structure size is not limited, multiple scrapers 31 can be used along the direction of chip forward transmission to simultaneously complete the glue removal operation. Chip structures not only vary in the presence or absence of components 93 and notches 94, but also in the thickness of PCB boards 91 of chips with roughly the same structure: some chips have thicker PCB boards 91, while others have thinner ones. However, the upper surface of the conveyor track 111 or the upper surface of the conveyor groove 211 on the heat transfer platform 21 is at the same height. In other words, different PCB board 91 thicknesses will result in different levels of the chip's glued surface. The scraper 31 may damage the PCB board 91 or fail to completely remove the glue 92 during the scraping process.

[0068] In order to solve this problem, combined with Figures 9 to 11 As shown in the figure, a limiting baffle 22 is provided on the heat conduction platform 21. In some embodiments, the limiting baffle 22 can be provided with two pieces and respectively arranged on both sides of the forward transmission direction of the chip. The side of a pair of limiting baffles 22 close to each other extends to the top of the conveying groove 211. In this way, the upward movement of the chip transferred to the conveying groove 211 is limited by the lower surface of the limiting baffle 22.

[0069] The adhesive removal unit 300 further includes a lifting device (not shown) mounted on the heat conducting platform 21. Figure 11 As shown in FIG, the lifting device can lift the chip upward in the direction of the hollow arrow shown in the figure. When the lifting device lifts the chip, the lower surface of the limit baffle 22 limits the chip from moving further upward. Therefore, the lifting device can make the chip's adhesive surface abut against the lower surface of the limit baffle 22 ( Figure 11 (The horizontal line shown in the figure represents the lower surface of the stopper 22). This allows the adhesive surfaces of the chips to be held in the same plane, and the force applied against the chips also keeps the chips relatively fixed in their lifted positions. Thus, the lifting device forces the adhesive surfaces of the chips against the lower surface of the stopper 22. This allows the scraper 31 to be mounted relative to the lower surface of the stopper 22, ensuring that the blade 31's edge is flush with the lower surface of the stopper 22. This ensures that the scraper 31's adhesive removal performance is not affected by varying thicknesses of the PCB 91.

[0070] See also Figure 10As shown in , the heat conducting platform 21 can also be provided with a top outlet 212, which can accommodate the upper end of the aforementioned lifting device to extend into and lift the chip in the conveying trough 211. The position of the lifting outlet 212 can be set based on the position of the scraper 31. In one embodiment, the lifting device is arranged in the heat conducting platform 21 and can receive the heat of the heat conducting platform 21. When it lifts the chip, the lifting device transfers the heat to the chip. After about 10 seconds, the colloid at the junction of the chip and the PCB board softens. At this time, the scraper 31 is controlled to move and remove the colloid. It can be understood that the purpose of the lifting device is to lift the chip upward at a preset position (for example, the place where the scraper 31 moves to remove the glue) so that the glued surface of the chip is against the lower surface of the limit baffle 22. Therefore, the lifting device can be implemented including but not limited to hydraulic or pneumatic lifting devices, or elastic lifting devices connected to elastic members (such as springs). In addition, the lifting device can also create a certain positive pressure between the adhesive surface of the chip and the lower surface of the limiting baffle 22. The friction between the adhesive surface and the lower surface of the limiting baffle 22 caused by this positive pressure can better prevent the chip from moving with the scraper 31 when the scraper 31 moves, affecting the glue removal effect.

[0071] refer to Figures 8 to 10 As shown in FIG, the limit baffle 22 is further provided with a knife groove 221 that passes through the limit baffle 22. The number of the knife grooves 221 corresponds to the number of the scraper blades 31. The scraper blade 31 can extend from the knife groove 221 until the blade position is flush with the lower surface of the limit baffle 22. In this way, when the scraper blade 31 is moved along the knife groove 221, the scraper blade 31 can move along the knife groove 221. Figure 8 and Figure 9 When moving in the direction of the solid arrow in the figure, the blade of the scraper 31 can be flush with the lower surface of the limiting baffle 22 to scrape off the colloid on the chip from the interface between the adhesive surface of the chip and the colloid.

[0072] refer to Figure 6 As shown in , the glue removal equipment also includes a cleaning unit 400, which is correspondingly arranged at the end point of the scraper 31's glue scraping movement and is capable of removing the scraped glue. In some embodiments, the cleaning unit 400 can be configured as a negative pressure suction device to use negative pressure to remove the scraped glue; or, in other embodiments, the cleaning unit 400 can also be a blowing device that can blow outward gas, so that the blown gas blows away the glue, preventing the scraped glue from affecting the next glue removal action of the scraper 31. In addition, other forms of cleaning unit structures can also be used, as long as they can remove the scraped glue in a timely manner.

[0073] In addition, reference Figure 7 、 Figure 9 and Figure 10As shown in , the degumming equipment also includes a polishing unit 500, which is arranged after the degumming unit 300 and is used to polish the area of ​​the chip after degumming. In one embodiment, the polishing unit 500 may include a rotating drive source and a roller brush 51 connected thereto, which can scrape the area of ​​the chip after degumming to remove a small amount of residual colloid without scratching the surface of the PCB board. Similar to the tool groove 221, a polishing groove 222 that penetrates the limit baffle 22 is also provided on the limit baffle 22 corresponding to the location of the roller brush 51, and the roller brush 51 can partially extend into the polishing groove 222 to better polish the surface of the chip. Since the polishing unit 500 is arranged adjacent to the degumming unit 300, the aforementioned cleaning unit 400 can also absorb some of the powder generated during the polishing process.

[0074] In some related prior arts, it is proposed to use laser to remove the colloid or to melt the colloid at high temperature using laser to complete the glue removal process. However, the temperature of the laser beam is high and difficult to control. When the colloid is melted at high temperature, it is very easy to melt the PCB board or melt the solder inside the PCB board. As mentioned above, the thickness of the PCB board of the chip is different, and the surface is not necessarily completely flat. Therefore, when using laser to remove the colloid, it is difficult to achieve efficient automatic removal due to the state difference of the PCB board, and the scraping rate is high. In contrast, in the present invention, the glue-bearing surface of the chip is fixed to a uniform plane by a lifting device. As long as the displacement of the scraper 31 is accurate, its glue scraping effect is controllable. Even if there is residual glue on the PCB board due to factors such as warping or unevenness of the PCB board, the polishing unit 500 can further remove the residual glue by scraping and polishing. The chip after treatment basically meets the needs of removing the original wafer in the next step of regenerating the chip.

[0075] Return Reference Figure 1 As shown in , the degumming equipment further includes a base 600 and a hood 700. The hood 700 is mounted on the upper surface of the base 600 and forms a certain space on the upper surface of the base 600. The aforementioned feeding unit 100, heating unit 200, degumming unit 300, cleaning unit 400, polishing unit 500, etc. can all be arranged in the housing space of the hood 700. In addition, the hood 700 is also provided with a dust removal unit 800, which is used to remove dust, impurities, etc. in the hood 700.

[0076] The cover 700 is also equipped with a touch screen 71, function buttons 72, a temperature control device 73 and an indicator light 74, etc. These devices are electrically connected to the corresponding units in the cover 700 to form a complete glue removal device.

[0077] In this way, when the glue removal equipment is powered on, the central control unit in the glue removal equipment can first issue a self-test instruction to execute the self-test program of each unit and feed back the self-test information to the central control unit.

[0078] The vibration device 12 in the feeding unit 100 starts working, and the empty position sensor can send an electrical signal to the central control unit to indicate that there is no chip in the vibration device 12;

[0079] The heating components in the heating unit receive the electrical signal from the central control unit and start heating the heat conducting platform 21 according to the temperature parameters set by the program. At this time, the temperature control device 73 in the device detects the temperature inside the device. When the temperature rises to the set temperature, the hollow unit sends a signal to stop heating. When the temperature is lower than the set temperature value, the heating components continue heating.

[0080] The touch screen 71 embedded on the outer surface of the cover 700 can simultaneously display the above status information, so that the user can understand the working conditions of each unit in the cover 700 through the status information displayed. When everything is normal in the device, the indicator light 74 lights up to prompt the user to add a chip to the vibration device 12 and start working.

[0081] In addition, the present invention also provides a chip debonding method, characterized in that the debonding method includes performing the following steps during the process of the chip being transferred forward:

[0082] S1. Heating step: heating the non-glue surface of the chip to soften the colloid at the junction of the chip and the PCB board;

[0083] S2. Glue removal step: Move the scraper along the glued surface of the chip to remove the glue on the glued surface of the chip at the softened part of the glue.

[0084] In the heating step, the heating temperature is controlled by a temperature control device so as not to exceed the melting point of the solder in the chip.

[0085] The following steps may also be included before the degumming step:

[0086] S3. A lifting step, wherein the chip is lifted upward by a lifting device so that the adhesive surface of the chip and the blade of the scraper are in the same plane.

[0087] Add the following steps after the degumming step:

[0088] S4. Polishing step: polishing the adhesive surface of the chip by a rotating roller brush.

[0089] The following steps may also be included before the degumming step:

[0090] In some embodiments, the heating step and the lifting step may also be performed simultaneously, that is, when the lifting device lifts the chip upward, the chip is heated synchronously by the temperature of the lifting device.

[0091] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A glue removal device, characterized in that: The degumming device comprises a feeding unit (100), a heating unit (200) and a degumming unit (300), wherein: The feeding unit (100) is used to transfer the chips forward according to a preset orientation; The heating unit (200) is arranged on the transfer path of the chip and is used to heat the chip; The glue removal unit (300) comprises a scraper (31), and the scraper (31) is movable relative to the chip to remove the glue on the surface of the heated chip; The heating unit (200) comprises a heat conduction platform (21); The feeding unit (100) includes a conveying track (111) for transferring the chip forward, the conveying track (111) extends through the heat conducting platform (21), and the scraper (31) is correspondingly arranged on one side of the conveying track (111) passing through the heat conducting platform (21) and can move to the other side in a direction perpendicular to the direction in which the conveying track (111) extends; or, The feeding unit (100) includes a conveying track (111) for conveying the chip forward, the conveying track (111) extends to the heat conduction platform (21) so that the chip is conveyed forward to the heat conduction platform (21), and the heat conduction platform (21) is provided with a conveying trough (211) for allowing the chip to continue to be conveyed forward, and the scraper (31) is correspondingly arranged on one side of the extension direction of the conveying trough (211) and can move to the other side of the conveying trough (211) along a direction perpendicular to the extension direction of the conveying trough (211).

2. The adhesive removal equipment according to claim 1, characterized in that: The feeding unit (100) comprises a transmission device (11), and the transmission device (11) comprises a transmission track (111) and a pushing component (112) for pushing the chip on the transmission track (111) forward.

3. The adhesive removal equipment according to claim 2, characterized in that: The feeding unit (100) further comprises a vibration device (12), one end of the conveying track (111) is connected to a material outlet of the vibration device (12) and is used to receive the chips output from the material outlet; The conveying track (111) is capable of vibrating along with the vibration device (12) and has at least one screening portion, wherein the screening portion only screens the chips placed in a preset position on the conveying track (111) and transfers them forward.

4. The adhesive removal equipment according to claim 2, characterized in that: The pushing component (112) comprises a driving source (1121) and a feeding brush (1122) capable of rotating at a uniform speed along with the driving source (1121); The feeding brush (1122) is suspended above the conveying track (111) and is capable of contacting the chip on the conveying track (111) to push the chip forward.

5. The adhesive removal equipment according to any one of claims 1 to 4, characterized in that: The heating unit (200) further comprises a heating component mounted on the heat conducting platform (21); the heat conducting platform (21) is arranged on a path for the feeding unit (100) to transfer the chip, and is capable of transferring heat from the heating component to the PCB board of the chip.

6. The adhesive removal equipment according to claim 5, characterized in that: A limit baffle (22) is provided on the heat conduction platform (21), and the limit baffle (22) is located on both sides of the chip forward transfer direction; and The adhesive removal unit (300) includes a lifting device installed at the heat conduction platform (21), and the lifting device is capable of pushing the chip in the conveying groove (211) toward the lower surface of the limiting baffle (22) so that the adhesive surface of the chip abuts against the lower surface of the limiting baffle (22); The limiting baffle (22) is provided with a tool groove (221) that passes through the limiting baffle (22). When the scraper (31) moves in the tool groove (221), the blade of the scraper (31) is flush with the lower surface of the limiting baffle (22) to scrape off the colloid from the interface between the adhesive surface of the chip and the colloid.

7. The adhesive removal equipment according to claim 6, characterized in that: The glue removal unit (300) further includes a tool holder assembly (32) for mounting the scraper (31), and a support assembly (33) mounted at a fixed position, wherein the support assembly (33) includes a guide rail (331) extending in the same direction as the tool path (221), and the tool holder assembly (32) is slidably connected to the guide rail (331).

8. The adhesive removal equipment according to claim 1, characterized in that: The glue removal device further comprises a cleaning unit (400), which is correspondingly arranged at the end point of the scraping movement stroke of the scraper (31) and is capable of taking away the scraped glue.

9. The adhesive removal equipment according to claim 1, characterized in that: The degumming device further comprises a polishing unit (500), which is arranged behind the degumming unit (300) along the direction in which the chip is transferred forward, and is used to polish the area of ​​the chip after degumming.

10. The adhesive removal equipment according to claim 1, characterized in that: The degumming device further comprises a base (600) and a hood (700), wherein the feeding unit (100), the heating unit (200) and the degumming unit (300) are all arranged on the base (600); the hood (700) is mounted on the base (600) and covers the feeding unit (100), the heating unit (200) and the degumming unit (300); the degumming device further comprises a dust removal unit (800) mounted on the hood (700) and used for removing impurities in the hood (700).

11. A chip debonding method, characterized in that: The chip is debonded using the debonding device according to any one of claims 1 to 10, wherein the debonding method comprises performing the following steps during the forward transfer of the chip: S1 heating step: heating the non-glue surface of the chip to soften the colloid at the junction of the chip and the PCB board; S2. Glue removal step: Move the scraper along the adhesive surface of the chip to remove the adhesive on the adhesive surface of the chip at the softened area.

12. The adhesive removal method according to claim 11, characterized in that: The following steps are also included before the degumming step: S3. A lifting step, wherein the chip is lifted upward by a lifting device so that the adhesive surface of the chip and the blade of the blade are in the same plane; Add the following steps after the degumming step: S4. Polishing step: Polishing the adhesive surface of the chip with a rotating roller brush.

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