Substrate support member, substrate processing apparatus and method having substrate support member

Abstract

A substrate support member capable of adjusting the flow of electric charges on a substrate and a substrate processing apparatus having the substrate support member are provided. The substrate support member includes a main body, a support pin provided on the main body and supporting a substrate, a guide pin provided on the main body and supporting the substrate, and a charge control device controlling the electrical connection between the support pin and a first resistor and the electrical connection between the guide pin and a second resistor to control the electric charges around the substrate.

Description

Technical Field

[0001] This invention relates to a substrate support member for supporting a substrate and a substrate processing apparatus and method having the substrate support member. More specifically, it relates to a substrate support member for supporting a substrate during substrate cleaning and a substrate processing apparatus and method having the substrate support member. Background Technology

[0002] Semiconductor devices can be manufactured by forming predetermined patterns on a substrate. When a predetermined pattern is formed on a substrate, multiple processes can be performed continuously in a semiconductor manufacturing equipment.

[0003] Typically, the space housing a semiconductor manufacturing equipment can be defined as a FAB. Within such a FAB, the following processes can be sequentially performed: a deposition process to form a film on a semiconductor substrate; a polishing process to planarize the film; a photolithography process to form a photoresist pattern on the film; an etching process to form an electrically patterned film using the photoresist pattern; an ion implantation process to implant specific ions into a predetermined area of ​​the semiconductor substrate; a cleaning process to remove contaminants from the semiconductor substrate; and an inspection process to inspect the surface of the patterned semiconductor substrate. Summary of the Invention

[0004] When using a chemical solution to clean a substrate, it is necessary to adjust the charge on the substrate. In the prior art, the charge on the substrate is adjusted by grounding the guide pin supporting the substrate and the motor shaft located inside the chuck.

[0005] However, when adjusting the charge in this way, an aluminum plate electrically connected to the guide pin needs to be separately installed inside the chuck.

[0006] Furthermore, the resistance may vary depending on the material of the guide pin, which may result in variations in etching rate (ER), thickness, and edge.

[0007] Furthermore, since there is no system inside the chuck to control the grounding resistance value, charge may flow out indiscriminately.

[0008] The technical problem to be solved by the present invention is to provide a substrate support member that uses a variable resistor to control the grounding resistance value of the guide pin and the support pin, thereby enabling the adjustment of the flow of charge on the substrate, and a substrate processing apparatus and method having the substrate support member.

[0009] The technical problems of this invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0010] One aspect of the substrate support component of the present invention for solving the above-mentioned technical problems includes: a body; a support pin disposed on the body and supporting the substrate; a guide pin disposed on the body and supporting the substrate; and a charge control device for controlling the electrical connection between the support pin and a first resistor and the electrical connection between the guide pin and a second resistor to control the charge around the substrate.

[0011] The charge control device may include: a first resistor disposed on a first line connecting the support pin and the grounding terminal; a first switch disposed on the first line and switching the electrical connection between the support pin and the first resistor; a second resistor disposed on a second line connecting the guide pin and the grounding terminal; a second switch disposed on the second line and switching the electrical connection between the guide pin and the second resistor; and a control unit for controlling the switching of the first switch and the second switch.

[0012] The first resistor may be disposed on a first line connecting the support pin and the grounding terminal, the second resistor may be disposed on a second line connecting the guide pin and the grounding terminal, and at least one of the first resistor and the second resistor may be disposed in the substrate support member.

[0013] When multiple first resistors are provided, the amount of charge can be controlled according to the number of first resistors electrically connected to the support pin among the multiple first resistors, and / or when multiple second resistors are provided, the amount of charge can be controlled according to the number of second resistors electrically connected to the guide pin among the multiple second resistors.

[0014] The first resistor may be disposed on a first line connecting the support pin and the grounding terminal, and multiple first resistors may be connected in parallel; and / or the second resistor may be disposed on a second line connecting the guide pin and the grounding terminal, and multiple second resistors may be connected in parallel.

[0015] When the plurality of first resistors are connected in parallel, the plurality of first resistors may have different resistance values ​​from each other, and / or when the plurality of second resistors are connected in parallel, the plurality of second resistors may have different resistance values ​​from each other.

[0016] The first resistor may be disposed on a first line connecting the support pin and the grounding terminal, and at least a portion of the multiple first resistors may be connected in series, and / or the second resistor may be disposed on a second line connecting the guide pin and the grounding terminal, and at least a portion of the multiple second resistors may be connected in series.

[0017] When multiple first resistors are provided, at least two of the multiple first resistors may have different resistance values ​​from each other, and the amount of charge of the charge can be precisely controlled by the at least two first resistors. And / or when multiple second resistors are provided, at least two of the multiple second resistors may have different resistance values ​​from each other, and the amount of charge of the charge can be precisely controlled by the at least two second resistors.

[0018] At least one of the support pins can be electrically connected to the first resistor, and / or at least one of the guide pins can be electrically connected to the second resistor.

[0019] At least one of the first resistor and the second resistor may be a variable resistor.

[0020] The first resistor and the second resistor may be disposed inside the body.

[0021] The charge that accumulates around the substrate can be used to process the substrate.

[0022] The charge control device can control the charge when cleaning the substrate with a chemical solution.

[0023] The charge control device can control the electrical connection between the guide pin and the second resistor when the liquid medicine is supplied to the upper part of the substrate.

[0024] The charge control device can control the electrical connection between the support pin and the first resistor when the liquid medicine is supplied to the upper and lower parts of the substrate.

[0025] The charge control device can also control the electrical connection between the guide pin and the second resistor.

[0026] There may be multiple first electrical connections between the support pin and the first resistor, and the charge control device may control at least one of the multiple first electrical connections; and / or there may be multiple second electrical connections between the guide pin and the second resistor, and the charge control device may control at least one of the multiple second electrical connections.

[0027] The charge control device can control the at least one first electrical connection and / or the at least one second electrical connection based on the etching rate of the substrate.

[0028] The charge control device can control the charge before the substrate is supplied with the liquid medicine.

[0029] The charge control device can repeatedly control the charge with time differences during the supply of the drug solution to the substrate.

[0030] Another aspect of the substrate support component of the present invention for solving the above-mentioned technical problems includes: a body; a support pin disposed on the body and supporting the substrate; a guide pin disposed on the body and supporting the substrate; and a charge control device that controls the electrical connection between the support pin and a first resistor and the electrical connection between the guide pin and a second resistor to control the charge around the substrate, wherein the charge control device controls the charge before the substrate is supplied with the liquid medicine and when the liquid medicine is supplied to the substrate, and repeatedly controls the charge with a time difference during the period when the liquid medicine is supplied to the substrate.

[0031] One aspect of the substrate processing apparatus of the present invention for solving the above-mentioned technical problems includes: a support member comprising a main body, a support pin disposed on the main body and supporting the substrate, and a guide pin disposed on the main body and supporting the substrate; a spraying member for supplying liquid medicine to an upper surface of the substrate; a rear nozzle for supplying liquid medicine to a bottom surface of the substrate; and a charge control device for controlling the electrical connection between the support pin and a first resistor and the electrical connection between the guide pin and a second resistor to control the charge around the substrate.

[0032] The substrate processing apparatus may be an apparatus that uses the chemical solution to clean the substrate.

[0033] One aspect of the substrate processing method of the present invention for solving the above-mentioned technical problems includes the following steps: a first step: controlling the charge amount of the charge around the substrate before processing the substrate; and a second step: controlling the charge amount of the charge around the substrate during the processing of the substrate.

[0034] The second step may include: treating the substrate with a chemical solution, and repeatedly controlling the amount of charge by time difference during the supply of the chemical solution to the substrate.

[0035] Specific details of other embodiments are included in the detailed description and accompanying drawings. Attached Figure Description

[0036] Figure 1This is a schematic plan view showing the internal structure of a substrate processing system for cleaning substrates.

[0037] Figure 2 It is a schematic illustration of the setting. Figure 1 A cross-sectional view of the internal structure of the substrate processing apparatus within the process chamber.

[0038] Figure 3 This is a schematic view illustrating a charge control device disposed on a support member according to a first embodiment of the present invention.

[0039] Figure 4 This is a schematic view illustrating a charge control device disposed on a support member according to a second embodiment of the present invention.

[0040] Figure 5 This is a schematic view illustrating a charge control device disposed on a support member according to a third embodiment of the present invention.

[0041] Figure 6 This is a schematic view illustrating a charge control device disposed on a support member according to a fourth embodiment of the present invention.

[0042] Figure 7 This is a schematic view illustrating a charge control device disposed on a support member according to a fifth embodiment of the present invention.

[0043] Figure 8 This is a schematic view illustrating a charge control device disposed on a support member according to a sixth embodiment of the present invention.

[0044] Figure 9 This is a schematic view illustrating a charge control device disposed on a support member according to a seventh embodiment of the present invention.

[0045] Figure 10 This is an example diagram illustrating the use of guide pins to control charge.

[0046] Figure 11 This is the first example diagram of using a support pin to control the charge.

[0047] Figure 12 This is a second example diagram illustrating the use of support pins to control the charge.

[0048] Figure 13 This is an example diagram illustrating the use of resistors connected to support pins and guide pins during substrate processing.

[0049] Explanation of reference numerals in the attached figures

[0050] 200: Substrate processing device; 210: Cup body

[0051] 220: Support component; 221: Main body

[0052] 222: Support pin; 223: Guide pin

[0053] 224: First support shaft; 230: Lifting unit

[0054] 240: Injection component 250: Controller

[0055] 300: Charge control device; 310: First switch

[0056] 320, 320a, 320b: First resistor; 330: Second switch

[0057] 340, 340a, 340b: Second resistors; 350: Control unit

[0058] 360: Ground terminal 410: Charge

[0059] W: substrate Detailed Implementation

[0060] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, as well as methods for achieving these advantages and features, will be explained below with reference to the accompanying drawings. Figure 1 The invention becomes clear from the detailed description of the embodiments. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. These embodiments are provided only to make the disclosure of the invention complete and to fully inform those skilled in the art of the scope of the invention, which is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0061] When an element or layer is referred to as being "on" or "above" another element or layer, it includes not only that it is directly above another element or layer, but also that other layers or other elements are in between. Conversely, when an element is referred to as being "directly" on or directly above another element, it indicates that there are no other elements or layers in between.

[0062] To readily describe the relationship between one element or component and another, as shown in the figure, spatial relative terms such as "below," "below," "lower," "above," and "upper" can be used. It should be understood that, in addition to the orientation shown in the figure, spatial relative terms also include terms indicating the different orientations of the elements during use or operation. For example, when the element shown in the figure is flipped, an element described as "below" or "below" of another element may be located "above" of another element. Therefore, the exemplary term "below" can include both "below" and "above" orientations. Element may also be oriented in another direction, so spatial relative terms can be interpreted according to orientation.

[0063] Although the terms "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are obviously not limited by these terms. These terms are only used to distinguish one element, constituent element, and / or part from another element, constituent element, and / or part. Therefore, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part within the technical concept of the present invention.

[0064] The terminology used in this specification is for illustrative purposes and is not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other constituent elements, steps, operations, and / or components in addition to those mentioned.

[0065] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in the sense that can be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be ideally or excessively interpreted unless explicitly defined otherwise.

[0066] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing the invention with reference to the drawings, the same or corresponding constituent elements are given the same reference numerals regardless of the reference numerals, and repeated descriptions thereof are omitted.

[0067] The present invention relates to a substrate support member and a substrate processing apparatus having a substrate support member, wherein a variable resistor is used to control the grounding resistance value of the guide pin and the support pin, thereby enabling adjustment of the flow of charge on the substrate.

[0068] The present invention will now be described in detail with reference to the accompanying drawings.

[0069] Figure 1 This is a schematic plan view showing the internal structure of a substrate processing system for cleaning substrates.

[0070] Reference Figure 1 The substrate processing system 100 may be configured to include an index module 110 and a process processing module 120.

[0071] The index module 110 and the process processing module 120 can be arranged sequentially in one direction. In this embodiment, the direction in which the index module 110 and the process processing module 120 are arranged is defined as the first direction 10. Furthermore, when viewed from above, the direction perpendicular to the first direction 10 is defined as the second direction 20, and the direction perpendicular to the plane including the first direction 10 and the second direction 20 is defined as the third direction 30.

[0072] The index module 110 is located in front of the process module 120. This index module 110 may be configured to include a loading port 111 and a transfer frame 112.

[0073] The loading port 111 holds the carrier 130 containing the substrate. Multiple loading ports 111 can be provided in front of the transfer frame 112, and multiple loading ports 111 can be arranged in a row along the second direction 20.

[0074] Figure 1 Four loading ports 111 are shown arranged in the index module 110. However, this embodiment is not limited to this. The number of loading ports 111 can be increased or decreased depending on factors such as the process efficiency and space requirements of the process module 120.

[0075] The carrier 130 accommodates multiple substrates (e.g., wafers). This carrier 130 may have grooves (not shown) disposed therein to support the edges of the substrates.

[0076] Multiple slots can be configured on the third direction 30. In this case, the substrates can be stacked along the third direction 30 in a spaced-apart state within the carrier 130. For example, the carrier 130 can be implemented as a front-opening unified pod (FOUP).

[0077] The transfer frame 112 transports substrates between the carrier 130, which is placed at the loading port 111, and the buffer unit 121. This transfer frame 112 may be configured to include an index track 113 and an index robot 114.

[0078] The index track 113 provides a path for the index robot 114 to move. This index track 113 can be arranged such that its length direction is parallel to the second direction 20.

[0079] The indexing robot 114 directly transports the substrate. This indexing robot 114 can be mounted on the indexing track 113 and can move linearly along the second direction 20 on the indexing track 113.

[0080] The indexing robot 114 can be configured to include a first base 114a, a first body 114b, and an indexing arm 114c. The first base 114a can be configured to move along the indexing track 113.

[0081] The first body 114b can be attached to the first base 114a. The first body 114b can be configured to move along a third direction 30 on the first base 114a. In addition, the first body 114b can also be configured to rotate on the first base 114a.

[0082] The index arm 114c can be attached to the first body 114b and can be configured to move forward and backward relative to the first body 114b. Multiple such index arms 114c can be configured on the first body 114b and can be individually driven.

[0083] Multiple index arms 114c can be stacked and arranged spaced apart from each other along a third direction 30. A portion of the index arms 114c can be used when transporting a substrate from the process module 120 to the carrier 130, and another portion can be used when transporting a substrate from the carrier 130 to the process module 120. If the multiple index arms 114c are configured in this way, it is possible to prevent particles generated from the substrate before process handling from adhering to the substrate after process handling during the loading and unloading of the substrate by the indexing robot 114.

[0084] The process module 120 can be configured to include a buffer unit 121, a transfer cavity 122, and a process cavity 125.

[0085] The buffer unit 121 provides space for the substrate to remain in place before it is transported between the transfer frame 112 and the transfer cavity 122. For this purpose, the buffer unit 121 can be arranged between the transfer frame 112 and the transfer cavity 122.

[0086] The buffer unit 121 may have a slot (not shown) for placing a substrate inside. Multiple slots may be provided in the buffer unit 121, and the multiple slots may be spaced apart from each other along a third direction 30. In addition, the surfaces of the buffer unit 121 facing the transfer frame 112 and the surfaces facing the transfer cavity 122 may each be open.

[0087] The transfer cavity 122 transports substrates between the buffer unit 121 and the process cavity 125. This transfer cavity 122 can be configured to include a guide rail 123 and a main robot 124. Furthermore, the transfer cavity 122 can also transport substrates between two different process cavities 125.

[0088] The guide rail 123 provides a path for the main robot 124 to move. This guide rail 123 can be arranged so that its length direction is parallel to the first direction 10.

[0089] The main robot 124 directly transports the substrate. This main robot 124 can be mounted on a guide rail 123 and can move linearly along the first direction 10 on the guide rail 123.

[0090] The main robot 124 can be configured to include a second base 124a, a second body 124b, and a main arm 124c. The second base 124a can be configured to move along the guide rail 123.

[0091] The second body 124b can be attached to the second base 124a. The second body 124b can be configured to move along a third direction 30 on the second base 124a. In addition, the second body 124b can also be configured to rotate on the second base 124a.

[0092] The main arm 124c can be attached to the second body 124b and can be configured to move forward and backward relative to the second body 124b. Multiple main arms 124c can be configured on the second body 124b and can be individually driven.

[0093] Multiple main arms 124c can be stacked and arranged in a spaced-apart manner along a third direction 30. Among the multiple main arms 124c, a portion can be used when transporting a substrate from the buffer unit 121 to the process chamber 125, and another portion can also be used when transporting a substrate from the process chamber 125 to the buffer unit 121.

[0094] The transfer cavity 122 can be arranged so that its length direction is parallel to the first direction 10. At this time, multiple process cavities 125 can be arranged on both sides of the transfer cavity 122 along the second direction 20, and multiple process cavities 125 can also be arranged on each side of the transfer cavity 122 along the first direction 10.

[0095] Multiple process cavities 125 can be stacked on top of each other. That is, multiple process cavities 125 can be arranged in an X*Y pattern on one side of the transfer cavity 122. Here, X is a natural number greater than or equal to 1, which means the number of process cavities 125 arranged in a row along the first direction 10, and Y is a natural number greater than or equal to 1, which means the number of process cavities 125 arranged in a row along the third direction 30.

[0096] For example, if four process cavities 125 are set on one side of the transfer cavity 122, the four process cavities 125 can be arranged in a 2*2 arrangement, and if six process cavities 125 are set on one side of the transfer cavity 122, the six process cavities 125 can be arranged in a 3*2 arrangement.

[0097] Furthermore, the number of process cavities 125 can be increased or decreased. Additionally, process cavities 125 can be provided only on one side of the transfer cavity 122, or they can be configured as a single layer on one or both sides of the transfer cavity 122.

[0098] The substrate processing apparatus uses a chemical solution to clean the substrate. This substrate processing apparatus can be installed inside the process chamber 125.

[0099] Figure 2 It is a schematic illustration of the setting. Figure 1 A cross-sectional view of the internal structure of the substrate processing apparatus within the process chamber. The following description refers to... Figure 1 and Figure 2 .

[0100] The substrate processing apparatus 200 may be configured to have the same structure in multiple process chambers 125. However, this embodiment is not limited to this. The substrate processing apparatus 200 may also be configured to have different structures in multiple process chambers 125 depending on the type of chemical solution, the type of process, etc.

[0101] Multiple process chambers 125 can be divided into multiple groups. In this case, the substrate processing apparatus in the process chambers belonging to the same group can have the same structure, and the substrate processing apparatus in the process chambers belonging to different groups can have different structures.

[0102] For example, when a first process cavity belonging to the first group is arranged on one side of the transfer cavity 122, and a second process cavity belonging to the second group is arranged on the other side of the transfer cavity 122, the substrate processing devices in the first process cavity may have the same structure, and the substrate processing devices in the second process cavity may have the same structure. Moreover, the substrate processing devices in the first process cavity may have a different structure from the substrate processing devices in the second process cavity.

[0103] Furthermore, for example, if the third process cavity belonging to the third group is arranged on the lower layer of one side and the other side of the transfer cavity 122, and the fourth process cavity belonging to the fourth group is arranged on the upper layer of one side and the other side of the transfer cavity 122, the substrate processing apparatuses in the third process cavity may have the same structure, and the substrate processing apparatuses in the fourth process cavity may have the same structure. Moreover, the substrate processing apparatuses in the third process cavity may have a different structure from the substrate processing apparatuses in the fourth process cavity.

[0104] For example, such as Figure 2 As shown, the substrate processing apparatus 200 may include a cup body 210, a support member 220, a lifting unit 230, a spraying member 240, and a controller 250.

[0105] The cup body 210 provides space for processing the substrate W. This cup body 210 can be formed with its upper part open.

[0106] The cup body 210 can be configured to include an inner recycling tank 211, an intermediate recycling tank 212, and an outer recycling tank 213. In this case, each of the recycling tanks 211, 212, and 213 can recycle different processing liquids from the processing liquids used in the process.

[0107] The internal recovery tank 211 can be configured to be in the shape of a ring surrounding the support member 220. In this case, the inner space 214 of the internal recovery tank 211 can function as an inlet for the treatment fluid to flow into the internal recovery tank 211.

[0108] The intermediate recovery tank 212 can be configured as a ring around the inner recovery tank 211. In this case, the space 215 between the inner recovery tank 211 and the intermediate recovery tank 212 can function as an inlet for the treatment fluid to flow into the intermediate recovery tank 212.

[0109] The outer recycling bin 213 can be configured as a ring around the intermediate recycling bin 212. In this case, the space 216 between the intermediate recycling bin 212 and the outer recycling bin 213 can function as an inlet for the treatment fluid to flow into the outer recycling bin 213.

[0110] Each of the recovery bins 211, 212, and 213 can be connected to a recovery line 217, 218, or 219 extending vertically downwards from its bottom surface. Each of the recovery lines 217, 218, and 219 can discharge the treated liquid flowing into each of the recovery bins 211, 212, and 213 to the outside. The discharged treated liquid can be treated for reuse by a treated liquid regeneration system (not shown).

[0111] The support member 220 supports and rotates the substrate W during the process. This support member 220 can be arranged inside the cup body 210.

[0112] The support component 220 may be configured to include a main body 221, a support pin 222, a guide pin 223, and a first support shaft 224.

[0113] When viewed from above, the main body 221 may have an upper surface that is generally circular. A first support shaft 224, which can be rotated by a motor 225, may be fixedly attached to the bottom surface of such a main body 221. In addition, a rear nozzle (not shown) may be provided on the upper surface of the main body 221.

[0114] Support pins 222 support the bottom surface of substrate W on the main body 221. Multiple such support pins 222 can be provided on the main body 221.

[0115] Multiple support pins 222 can be formed to protrude upward from the upper surface of the body 221. Furthermore, the multiple support pins 222 can be arranged at predetermined intervals along the edge of the upper surface of the body 221. For example, the multiple support pins 222 can be arranged to have a ring shape as a whole through their combination. This configuration allows the multiple support pins 222 to support the edge of the rear surface of the substrate W, thereby separating the substrate W from the upper surface of the body 221 by a certain distance.

[0116] The guide pin 223, also known as a chuck pin, supports the side of the base plate W so that the base plate W does not disengage from its upright position to the side when the support member 220 rotates. Multiple guide pins 223 can be provided on the body 221, just like the support pins 222, and can be formed to protrude upward from the upper surface of the body 221.

[0117] The guide pin 223 can be arranged further away from the center of the body 221 than the support pin 222. The guide pin 223 can be configured to move linearly between a waiting position and a supporting position along the radial direction of the body 221. Here, the waiting position means a position further away from the center of the body 221 than the supporting position.

[0118] The guide pin 223 can be in a waiting position when the substrate W is loaded onto the support member 220 or when the substrate W is unloaded from the support member 220, and in a supported position when the substrate W is being processed. The guide pin 223 can contact the side of the substrate W in the supported position.

[0119] The lifting unit 230 moves the cup body 210 linearly in the vertical direction. As the cup body 210 moves linearly in the vertical direction, the relative height of the cup body 210 with respect to the support member 220 can change.

[0120] The lifting unit 230 can be configured to include a bracket 231, a moving shaft 232, and a first driver 233.

[0121] The bracket 231 is fixedly mounted on the outer wall of the cup body 210. This bracket 231 can be combined with a moving shaft 232 that moves vertically via a first driver 233.

[0122] When the substrate W is placed on or lifted from the support member 220, the cup body 210 can be lowered, causing the support member 220 to protrude upwards from the cup body 210. Furthermore, during the process, the height of the cup body 210 can be adjusted according to the type of processing liquid supplied to the substrate W, allowing the processing liquid to flow into pre-set recovery tanks 211, 212, and 213.

[0123] For example, during the treatment of substrate W with the first processing liquid, substrate W can be positioned at a height corresponding to the inner space 214 of the inner recycling bin 211. Furthermore, during the treatment of substrate W with the second processing liquid, substrate W can be positioned at a height corresponding to the space 215 between the inner recycling bin 211 and the intermediate recycling bin 212. Furthermore, during the treatment of substrate W with the third processing liquid, substrate W can be positioned at a height corresponding to the space 216 between the intermediate recycling bin 212 and the outer recycling bin 213.

[0124] In addition, the lifting unit 230 can also move the support member 220 instead of the cup body 210 in the vertical direction.

[0125] The spraying component 240 supplies processing liquid to the substrate W during the substrate processing process. For this purpose, the spraying component 240 can be configured to include a nozzle support rod 241, a nozzle 242, a second support shaft 243, and a second driver 244.

[0126] The spraying component 240 can be configured as one or more. When multiple spraying components 240 are configured, the liquid medicine, cleaning fluid, organic solvent, etc., can be supplied through different spraying components 240. The cleaning fluid can be a first fluid, and the organic solvent can be a mixture of isopropanol vapor and inert gas or isopropanol liquid.

[0127] The nozzle support rod 241 can be positioned along the second direction 20. The nozzle support rod 241 can be connected to one end of the second support shaft 243 in a direction perpendicular to the length of the second support shaft 243. The second driver 244 can be connected to the other end of the second support shaft 243.

[0128] Nozzle 242 can be disposed on the bottom surface of the end of nozzle support rod 241. This nozzle 242 can be moved to a process position and a waiting position by a second actuator 244. The process position means the area vertically above the support member 220 where the nozzle 242 can spray the processing liquid onto the substrate W, and the waiting position means the area other than the area vertically above the support member 220, that is, the area detached from the area vertically above the support member 220.

[0129] The length direction of the second support shaft 243 can be set along a third direction 30. The lower end of this second support shaft 243 can be connected to the second driver 244.

[0130] The second drive 244 causes the second support shaft 243 to rotate and move up and down. This second drive 244 can be connected to and controlled by the controller 250.

[0131] In addition, Figure 2 The diagram shows controller 250 connected to second driver 244. However, this embodiment is not limited to this. Controller 250 can be connected not only to second driver 244, but also to first driver 233 to control first driver 233.

[0132] When using chemical solutions to clean substrates, the unstripping and etching rate (ER) depend on the flow rate, properties, conductivity, surface tension, etc. of the chemical solution, and can change every instantaneously due to various devices, substrate types, and recipes.

[0133] To prevent incomplete stripping and improve electrostatic discharge (ER), the charge on the substrate can be adjusted. However, when the substrate processing process is repeatedly performed within the limited space inside the substrate processing apparatus 200, excessive ±kV of charge continuously accumulates in the material inside due to various charging processes such as spraying, friction, and induction, which can trigger electrostatic discharge (ESD). Therefore, there is a need for technology that can prevent ESD during substrate processing.

[0134] Furthermore, due to various electrification and ionization effects, the interior of the drug solution can possess a charge. However, there is currently no technology capable of utilizing this charge to prevent unstripped tissue and control ER and ESD.

[0135] In addition, there is a problem that it is difficult to monitor the electrostatic forces caused by the surrounding materials and environmental factors of the support component 220.

[0136] In this embodiment, a variable resistor can be used to control the grounding resistance values ​​of the support pin 222 and the guide pin 223, thereby effectively regulating the flow of charge on the substrate W. This will be described in detail below.

[0137] Figure 3 This is a schematic view illustrating a charge control device disposed on a support member according to a first embodiment of the present invention.

[0138] Reference Figure 3 The charge control device 300 may be configured to include a first switch 310, a first resistor 320, a second switch 330, a second resistor 340, and a control unit 350.

[0139] The charge control device 300 controls the charge around the substrate by selectively switching multiple resistors connected to the support pin 222 and the guide pin 223, respectively. This charge control device 300 can be disposed inside and outside the support member 220.

[0140] The first switch 310 electrically connects the support pin 222 and the first resistor 320. The first switch 310 can be installed on the line connecting the support pin 222, the first resistor 320 and the ground terminal 360, and can be installed on this line between the support pin 222 and the first resistor 320.

[0141] The first switch 310 can be switched according to the control of the control unit 350 to electrically connect the support pin 222 and the first resistor 320. For example, if the first switch 310 is set to switch on by the control unit 350, the support pin 222 and the first resistor 320 are electrically connected. At this time, the charge around the substrate W moves sequentially to the ground terminal 360 through the support pin 222 and the first resistor 320, thereby reducing the amount of charge around the substrate W.

[0142] Conversely, if the first switch 310 is set to switch off by the control unit 350, the support pin 222 is not electrically connected to the first resistor 320. Therefore, the charge located around the substrate W cannot move to the ground terminal 360, and the amount of charge present around the substrate W can be maintained.

[0143] The first switch 310 can be located inside the main body 221 of the support member 220. However, this embodiment is not limited to this. As long as it can be electrically connected to the support pin 222, the first switch 310 can also be located outside the main body 221 of the support member 220.

[0144] The first resistor 320 controls the movement of charge on the line connecting the support pin 222 and the ground terminal 360. This first resistor 320 can be implemented as a variable resistor to control the speed of charge movement.

[0145] The first resistor 320 can be disposed between the first switch 310 and the ground terminal 360. The first resistor 320 can be disposed inside the main body 221 of the support member 220, just like the first switch 310, and can also be disposed outside the main body 221 of the support member 220, as long as it can be electrically connected to the first switch 310.

[0146] The second switch 330 electrically connects the guide pin 223 and the second resistor 340. The second switch 330 can be installed on the line connecting the guide pin 223, the second resistor 340 and the ground terminal 360, and can be installed on this line between the guide pin 223 and the second resistor 340.

[0147] The second switch 330 can be switched according to the control of the control unit 350 to electrically connect the guide pin 223 and the second resistor 340. For example, if the second switch 330 is set to be turned on by the control unit 350, the guide pin 223 and the second resistor 340 are electrically connected. At this time, the charge located around the substrate W moves sequentially to the ground terminal 360 through the guide pin 223 and the second resistor 340, thereby reducing the amount of charge present around the substrate W.

[0148] Conversely, if the second switch 330 is set to open by the control unit 350, the guide pin 223 is not electrically connected to the second resistor 340. Therefore, the charge around the substrate W cannot move to the ground terminal 360, and the amount of charge present around the substrate W can be maintained.

[0149] The second switch 330 can be disposed inside the main body 221 of the support member 220. However, this embodiment is not limited to this. As long as it can be electrically connected to the guide pin 223, the second switch 330 can also be disposed outside the main body 221 of the support member 220.

[0150] The second resistor 340 controls the movement of charge on the line connecting the guide pin 223 and the ground terminal 360. The second resistor 340 can be implemented as a variable resistor to control the speed of charge movement.

[0151] The second resistor 340 can be disposed between the second switch 330 and the ground terminal 360. The second resistor 340 can be disposed inside the main body 221 of the support member 220, just like the second switch 330, and can also be disposed outside the main body 221 of the support member 220, as long as it can be electrically connected to the second switch 330.

[0152] The control unit 350 controls the switching of the first switch 310 and the second switch 330. The first switch 310 and the second switch 330 can be set to be on or off according to the control of the control unit 350. The control unit 350 can also control the first resistor 320 and the second resistor 340.

[0153] The control unit 350 can be electrically connected to the first switch 310 and the second switch 330 to control the switching of the first switch 310 and the second switch 330. The control unit 350 can be implemented as a device with a processor having computing functions (e.g., a computer or server) and can be disposed outside the board processing device 200.

[0154] As mentioned above, in Figure 3 In the example shown, the amount of charge around the substrate W can be controlled using a single first resistor 320 electrically connected to the support pin 222 and a single second resistor 340 electrically connected to the guide pin 223.

[0155] However, this embodiment is not limited to this. The amount of charge around the substrate W can also be controlled using a plurality of first resistors 320 electrically connected to the support pin 222 and a plurality of second resistors 340 electrically connected to the guide pin 223. For example, as Figure 4 As shown, the amount of charge around the substrate W can be controlled by using two first resistors 320 electrically connected to the support pin 222 and two second resistors 340 electrically connected to the guide pin 223. Figure 4 This is a schematic view illustrating a charge control device disposed on a support member according to a second embodiment of the present invention.

[0156] exist Figure 4 The example illustrates the case where multiple first resistors 320 and second resistors 340 are configured. In this embodiment, multiple first switches 310 and second switches 330 can be configured, just like multiple first resistors 320 and second resistors 340. In this case, the first switches 310 and second switches 330 can be configured to have the same number as the first resistors 320 and second resistors 340, and can be connected one-to-one with each of the first resistors 320 and second resistors 340.

[0157] If multiple first switches 310 and multiple first resistors 320 are configured, the amount of charge or the speed of charge movement can be controlled according to the number of first switches 310 that are switched on among the multiple first switches 310. For example, Figure 4As shown in the example, when there are two first switches 310 and two first resistors 320 respectively, when there are two first switches 310 connected, compared with when there is one first switch 310 connected, the amount of charge or the speed of movement of the charge moving from the substrate W to the ground terminal 360 can be controlled because the grounding resistance value of the first resistor 320 can be increased.

[0158] Similarly, if multiple second switches 330 and second resistors 340 are configured, the amount of charge or the speed of charge movement can be controlled according to the number of second switches 330 that are switched on among the multiple second switches 330. For example, as Figure 4 As shown in the example, when there are two second switches 330 and two second resistors 340 respectively, when there are two second switches 330 connected, compared with when there is one second switch 330 connected, the amount of charge or the speed of movement of the charge moving from the substrate W to the ground terminal 360 can be controlled because the grounding resistance value of the second resistor 340 can be increased.

[0159] In the above scenario, the two first resistors 320 can have the same resistance value. However, this embodiment is not limited to this. The two first resistors 320 can also have different resistance values. In this case, such as Figure 5 As shown, the first switch 310 can be configured as a single unit, and when the first switch 310 is switched to the b-th resistor 320b with a relatively large resistance value, compared to when it is switched to the a-th resistor 320a with a relatively small resistance value, the amount of charge or the speed of movement of the charge moving from the substrate W toward the ground terminal 360 can be controlled because the ground resistance value of the first resistor 320 can be increased. Figure 5 This is a schematic view illustrating a charge control device disposed on a support member according to a third embodiment of the present invention.

[0160] Similarly, the two second resistors 340 can have different resistance values ​​than each other. In this case, such as Figure 5 As shown, the second switch 330 can be configured as a single unit, and when the second switch 330 is switched to the d-th resistor 340b with a relatively large resistance value, compared to switching to the c-th resistor 340a with a relatively small resistance value, the amount of charge or the speed of movement of the charge moving from the substrate W toward the ground terminal 360 can be controlled because the ground resistance value of the second resistor 340 can be increased.

[0161] exist Figure 5In the example, although the case is illustrated that the two first resistors 320 and the two second resistors 340 have different resistance values, it is also possible that either the two first resistors 320 or the two second resistors 340 have different resistance values.

[0162] Furthermore, as mentioned above, in Figure 4 In the example, the two first resistors 320 can have different resistance values. That is, either of the two first resistors 320 can have a relatively larger resistance value than the other. In this case, if both first resistors 320 are used, the amount of charge or the speed at which the charge moves can be precisely controlled. The same applies to the two second resistors 340.

[0163] Furthermore, in this embodiment, such as Figure 6 As shown, the first resistor 320 with the same resistance value can also be placed on either side to produce a resistance value deviation. Figure 6 This is an exemplary view showing a charge control device disposed on a support member according to a fourth embodiment of the present invention.

[0164] Similarly, as Figure 6 As shown, a second resistor 340 with the same resistance value can also be placed on either side to produce a resistance value deviation.

[0165] exist Figure 6 The example illustrates a case where both the first resistor 320 and the second resistor 340 are more predominantly located on either side. However, this embodiment is not limited to this. In this embodiment, either only the first resistor 320 or only the second resistor 340 may be predominantly located on either side.

[0166] Furthermore, in this embodiment, the amount of charge around the substrate W can also be controlled using a plurality of first resistors 320 electrically connected to the support pin 222 and a single second resistor 340 electrically connected to the guide pin 223. For example, as Figure 7 As shown, the amount of charge around the substrate W can be controlled by using two first resistors 320 electrically connected to the support pin 222 and a second resistor 340 electrically connected to the guide pin 223. Figure 7 This is an exemplary view showing a charge control device disposed on a support member according to a fifth embodiment of the present invention.

[0167] Furthermore, in this embodiment, the amount of charge around the substrate W can also be controlled using a single first resistor 320 electrically connected to the support pin 222 and a plurality of second resistors 340 electrically connected to the guide pin 223. For example, as Figure 8 As shown, the amount of charge around the substrate W can be controlled by using a first resistor 320 electrically connected to the support pin 222 and two second resistors 340 electrically connected to the guide pin 223. Figure 8 This is an exemplary view showing a charge control device disposed on a support member according to a sixth embodiment of the present invention.

[0168] like Figure 7 and Figure 8 As shown, when either the first resistor 320 or the second resistor 340 is configured as multiple, the above reference can obviously be applied. Figure 5 and Figure 6 The following sections provide explanations.

[0169] Based on the above references Figures 3 to 8 In the illustrated embodiment, each of the support pins 222 can be connected to the first switch 310 and the first resistor 320, and each of the guide pins 223 can be connected to the second switch 330 and the second resistor 340.

[0170] However, this embodiment is not limited thereto. For example... Figure 9 As shown, a support pin 222 and a guide pin 223 can also be connected to the first switch 310 and the first resistor 320 simultaneously. Figure 9 This is a schematic view illustrating a charge control device disposed on a support member according to a seventh embodiment of the present invention.

[0171] Furthermore, although not shown, in this embodiment, multiple support pins 222 may be connected to a first switch 310 and a first resistor 320 simultaneously, and multiple guide pins 223 may be connected to a second switch 330 and a second resistor 340 simultaneously.

[0172] Next, we will explain the cases where the charge is controlled by electrically connecting the support pin 222 to the ground terminal 360 and the cases where the charge is controlled by electrically connecting the guide pin 223 to the ground terminal 360.

[0173] Figure 10 This is an example diagram illustrating the use of guide pins to control charge. The following explanation refers to... Figure 10 .

[0174] When cleaning the substrate W with a chemical solution, the chemical solution can be supplied to the upper surface of the substrate W using the spraying member 240. In this case, the charge 410 can be located on the upper surface of the substrate W.

[0175] In this embodiment, when the charge 410 is located on the upper surface of the substrate W, the amount of charge or the speed of movement of the charge 410 can be controlled by the guide pin 223.

[0176] Figure 11 This is a first example diagram illustrating the use of support pins to control charge. The following explanation refers to... Figure 11 .

[0177] When cleaning substrate W with a chemical solution, the spraying member 240 can supply the chemical solution to the upper surface of substrate W, and simultaneously, the rear nozzle can supply the chemical solution to the bottom surface of substrate W. In this case, the charge 410 can be located on both the upper and lower surfaces of substrate W.

[0178] In this embodiment, when charge 410 is located on the upper and lower surfaces of substrate W, the amount of charge or the speed of movement of charge 410 can be controlled using support pin 222. However, this embodiment is not limited to this. Figure 12 As shown, the amount of charge or the speed of movement of charge 410 can also be controlled by using support pin 222 and guide pin 223. Figure 12 This is a second example diagram showing how to control charge using support pins.

[0179] Furthermore, multiple support pins 222 and guide pins 223 can be respectively provided on the main body 221 of the support member 220. In this case, a portion of the multiple support pins 222 can be used to control the charge. In this case, in this embodiment, the etch rate (ER) of the substrate W can be considered to control the charge using at least a portion of the multiple support pins 222.

[0180] Similarly, the etching rate of the substrate W can also be considered when at least a portion of the guide pins 223 are used to control the charge.

[0181] Next, a method for controlling charge during a substrate processing (e.g., a cleaning process) will be described.

[0182] Figure 13 This is an example diagram illustrating the use of resistors connected to support pins and guide pins during substrate processing. The following explanation refers to... Figure 13 .

[0183] If the substrate W is placed on the body 221 of the support member 220 and supported by the support pin 222 and guide pin 223 (Wafer In), the spraying member 240 can spray liquid onto the upper surface of the substrate W. At this time, the rear nozzle can spray liquid onto the bottom surface of the substrate W.

[0184] (1) Before spraying the medicine (510)

[0185] Before the spraying component 240, the rear nozzle, etc., spray the liquid medicine onto the substrate W, it is necessary to remove the charge around the substrate W by grounding in order to prevent ESD that may occur during liquid medicine spraying. In this case, the amount of charge around the substrate W can be controlled by at least one of the support pin 222 and the guide pin 223. When it is desired to remove the charge in a short time, both the support pin 222 and the guide pin 223 can be used.

[0186] Furthermore, when the charge around the substrate W is removed, the grounded state transitions to the ungrounded state.

[0187] (2) During the spraying of the medicine (520)

[0188] When a liquid is sprayed onto the upper surface, bottom surface, or other surfaces of a substrate W via a spraying component 240 or a rear nozzle, a substrate process (e.g., substrate cleaning process) is established that can control the unstripped and ER processes using the charge remaining around the substrate W and the charge in the liquid.

[0189] During substrate processing, if a certain amount of time has elapsed, or if it is determined that the charge around the substrate W has reached a predetermined value, the charge around the substrate W can be removed to prevent ESD by switching from a non-grounded state to a grounded state. At this time, at least one of the support pin 222 and guide pin 223 can be switched to a grounded state.

[0190] In this embodiment, during the substrate processing, the transition from grounded state to non-grounded state and the transition from non-grounded state to grounded state can be repeated N times (where N is a natural number greater than 1).

[0191] In this embodiment, the rate of charge outflow can be controlled by adjusting the variable resistors (i.e., the first resistor 320 and the second resistor 340) in the grounding path to ensure unstripped and ER-adjusted technology.

[0192] (3) After the medicine is sprayed (530)

[0193] When the substrate processing is finished, the amount of charge remaining on the substrate W can be adjusted by controlling the resistor, thus satisfying the conditions that are beneficial to subsequent processes.

[0194] In the prior art, since most of the charge is removed from the substrate for substrate processing, or the amount of charge remaining on the substrate is unknown, it is difficult to utilize the charge accumulated during the substrate processing process. In this embodiment, since the amount of charge remaining on the substrate can be adjusted using the charge control device 300, it is possible to utilize the accumulated charge to perform the substrate processing process (e.g., a cleaning process). Furthermore, in this embodiment, this process also allows for the control of electrostatic Added PC based on changes in the amount of charge on the surface of the substrate W.

[0195] Reference above Figures 3 to 13 A charge control device 300 and its operation method according to various embodiments are described. The charge control device 300 is used to prevent un-stripping and improve edge etch rate (ER) by controlling the grounding resistance. The charge control device 300 can prevent un-stripping and improve the edge etch rate by controlling the charge in the substrate (also called a wafer) and solution during the wafer process. The charge control device 300 can control the movement of charge and ESD by grounding pins and using variable resistors throughout the wafer process to prevent un-stripping and improve the etch rate.

[0196] Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without altering its technical concept or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A substrate support component, comprising: main body; A support pin is provided on the main body and supports the base plate; A guide pin is provided on the main body and supports the substrate; as well as A charge control device controls the electrical connection between the support pin and the first resistor, and the electrical connection between the guide pin and the second resistor, to control the charge around the substrate. The charge control device controls the amount of charge remaining on the substrate so that the charge accumulated around the substrate is used to process the substrate.

2. The substrate support member according to claim 1, wherein, The charge control device includes: The first resistor is disposed on the first line connecting the support pin and the grounding terminal; A first switch is provided on the first line and switches the electrical connection between the support pin and the first resistor; The second resistor is disposed on the second line connecting the guide pin and the grounding terminal; A second switch is provided on the second circuit and switches the electrical connection between the guide pin and the second resistor; and The control unit controls the switching between the first switch and the second switch.

3. The substrate support member according to claim 1, wherein, The first resistor is disposed on the first line connecting the support pin and the grounding terminal. The second resistor is disposed on the second line connecting the guide pin and the ground terminal, and At least one of the first resistor and the second resistor is disposed in the substrate support member.

4. The substrate support member according to claim 3, wherein, When multiple first resistors are configured, the charge control device controls the amount of charge based on the number of first resistors electrically connected to the support pin among the multiple first resistors, and / or When multiple second resistors are configured, the charge control device controls the amount of charge based on the number of second resistors electrically connected to the guide pin among the multiple second resistors.

5. The substrate support member according to claim 3, wherein, When multiple first resistors are used, at least two of the multiple first resistors have different resistance values, and the at least two first resistors are used to precisely control the amount of charge, and / or When multiple second resistors are provided, at least two of the multiple second resistors have different resistance values ​​from each other, and the amount of charge is precisely controlled by the at least two second resistors.

6. The substrate support member according to claim 1, wherein, At least one of the support pins is electrically connected to the first resistor, and / or At least one of the guide pins is electrically connected to the second resistor.

7. The substrate support member according to claim 1, wherein, At least one of the first resistor and the second resistor is a variable resistor.

8. The substrate support member according to claim 1, wherein, The first resistor and the second resistor are disposed inside the body.

9. The substrate support member according to claim 1, wherein, The charge control device controls the charge when the substrate is cleaned with a chemical solution.

10. The substrate support member according to claim 9, wherein, The charge control device controls the electrical connection between the guide pin and the second resistor when the liquid medicine is supplied to the upper part of the substrate.

11. The substrate support member according to claim 9, wherein, The charge control device controls the electrical connection between the support pin and the first resistor when the liquid medicine is supplied to the upper and lower parts of the substrate.

12. The substrate support member according to claim 11, wherein, The charge control device also controls the electrical connection between the guide pin and the second resistor.

13. The substrate support member according to claim 1, wherein, The first electrical connection between the support pin and the first resistor is multiple, and the charge control device controls at least one of the multiple first electrical connections, and / or There are multiple second electrical connections between the guide pin and the second resistor, and the charge control device controls at least one of the multiple second electrical connections.

14. The substrate support member according to claim 13, wherein, The charge control device controls the at least one first electrical connection and / or the at least one second electrical connection based on the etching rate of the substrate.

15. The substrate support member according to claim 9, wherein, The charge control device controls the charge before the substrate is supplied with the liquid medicine.

16. The substrate support member according to claim 9, wherein, The charge control device repeatedly controls the charge with a time difference during the supply of the drug solution to the substrate.

17. A substrate processing apparatus, comprising: A support component, the support component including a main body, a support pin disposed on the main body and supporting a substrate, and a guide pin disposed on the main body and supporting the substrate; The spraying component supplies liquid medicine to the upper surface of the substrate; The rear nozzle supplies the liquid medicine to the bottom surface of the substrate; as well as A charge control device controls the electrical connection between the support pin and the first resistor, and the electrical connection between the guide pin and the second resistor, to control the charge around the substrate. The charge control device controls the amount of charge remaining on the substrate so that the charge accumulated around the substrate is used to process the substrate.

18. A substrate processing method, comprising the following steps: First step: Control the amount of charge around the substrate before processing it; Second step: During the processing of the substrate, control the amount of charge around the substrate; as well as The third step: control the amount of charge remaining on the substrate so that the charge accumulated around the substrate is used to process the substrate.

19. The substrate processing method according to claim 18, wherein, The second step includes: treating the substrate with a chemical solution, and repeatedly controlling the amount of charge by a time difference during the supply of the chemical solution to the substrate.

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