Micro-component transfer device and micro-component transfer method

Abstract

The present invention discloses a micro-component, a micro-component transfer device and a micro-component transfer method, wherein the aforementioned micro-component transfer device has a magnetic suction plate with a plurality of magnetic suction heads or magnetic suction positioning holes on its surface, and utilizes the aforementioned plurality of magnetic suction heads or magnetic suction positioning holes to adsorb magnetic materials on the surfaces of a plurality of micro-components on a temporary carrier, so that the aforementioned plurality of micro-components on the aforementioned temporary carrier can be adsorbed by the aforementioned plurality of magnetic suction heads or the aforementioned plurality of magnetic suction positioning holes on the aforementioned magnetic suction plate, and then transferred to a plurality of micro-component fixing locations on a target carrier and fixed thereafter.

Description

Technical Field

[0001] The invention relates to a micro-component transfer device and a micro-component transfer method. Background Art

[0002] With the development of technology, micro components including semiconductor components, LED chips or micro LED chips have been widely used in various electronic devices. Among them, LEDs have the advantages of active light emission, high brightness, and energy saving. Therefore, they have been widely used in technical fields such as lighting, display, and projector, and micro LED display has gradually become a new generation of display technology. However, a high-density (FHD: Full High Density) display has 1920 rows x 1080 columns, about 2 million pixels, and each pixel is further divided into three sub-pixels (Sub pixel) of red, green, and blue. Therefore, a high-density LED display (FHD LED Display) has a total of about 6 million LED chips (Die). To cut 6 million chips smaller than the diameter of human hair and stick them on the substrate of the display panel, the key technology lies in how to accurately transfer a large number of micro LEDs to the substrate of the display panel.

[0003] In addition, in response to the current trend of miniaturization and integrating components with different characteristics into a single electronic device, the difficulty of manufacturing has been greatly increased. How to transfer a large number of miniaturized micro components to a target carrier to achieve rapid packaging, high integration, reduced packaging module size, and increased pad number is a major issue.

[0004] In view of this, a micro-component transfer device that can accurately transfer a large number of micro-components to a target carrier and a micro-component transfer method using the micro-component transfer device are eagerly awaited in the industry. Summary of the invention

[0005] The invention discloses a micro-component, comprising a bonding surface and a magnetic attraction surface opposite to each other, wherein the bonding surface comprises one or more bonding pads, and the magnetic attraction surface comprises one or more magnetic attraction layers.

[0006] The aforementioned micro-component is a semiconductor component, a light-emitting diode chip or a micro-light-emitting diode chip.

[0007] The aforementioned micro-component, the aforementioned magnetic absorption layer includes a magnetic material layer, and the material of the aforementioned magnetic material layer is selected from a metal material containing at least one of iron, cobalt, nickel or an alloy thereof.

[0008] The present invention also discloses a micro-component transfer device, comprising: a first magnet having a first end and a second end opposite to each other; a first magnetic attraction plate, arranged below the aforementioned first magnet, the aforementioned first magnetic attraction plate having first and second surfaces opposite to each other, wherein the aforementioned first surface of the aforementioned first magnetic attraction plate is connected to the first end of the aforementioned first magnet, and the aforementioned second surface of the aforementioned first magnetic attraction plate also has one or more micro-component alignment areas, and each of the aforementioned micro-component alignment areas includes one or more magnetic suction heads protruding from the aforementioned second surface; and an insulating layer, covering the aforementioned first magnetic attraction plate, and allowing the aforementioned magnetic suction head portion in each of the aforementioned micro-component alignment areas to be exposed from the aforementioned insulating layer surface.

[0009] The aforementioned micro-component transfer device, the aforementioned insulating layer also includes a magnetic barrier layer, which is formed at a distance d (d>0) adjacent to the aforementioned second surface of the aforementioned first magnetic attraction plate, and the aforementioned magnetic barrier layer surrounds the aforementioned magnetic attraction head in each aforementioned micro-component alignment area.

[0010] The aforementioned micro-component transfer device also includes a second magnet and a second magnetic attraction plate. The aforementioned second magnet has a third end and a fourth end opposite to each other. The aforementioned second magnetic attraction plate is connected to the aforementioned third end of the aforementioned second magnet, and the aforementioned second magnetic attraction plate is arranged below the aforementioned first magnetic attraction plate.

[0011] The present invention also discloses a micro-component transfer method, the steps of which include: providing a micro-component transfer device; providing a temporary carrier, the temporary carrier having a third and a fourth surface opposite to each other, the third surface being formed with one or more micro-components, and each micro-component is placed on the third surface of the temporary carrier by the bonding surface of each micro-component; providing a target carrier, the target carrier having a fifth and a sixth surface opposite to each other, the fifth surface including one or more micro-component fixing places, and each micro-component fixing place has a surface A conductive bonding layer is formed; the temporary carrier is moved into the micro-component transfer device, so that the temporary carrier is located below the first magnetic attraction plate and the third surface of the temporary carrier faces the second surface of the first magnetic attraction plate, and the magnetic attraction layer located on the magnetic attraction surface of each micro-component faces the micro-component alignment area; the magnetic strength of the first magnet of the micro-component transfer device is controlled so that each micro-component can be adsorbed by the magnetic attraction head in one of the micro-component alignment areas facing it through the magnetic attraction layer located on the magnetic attraction surface, thereby being detached from the previous micro-component. The temporary carrier is moved out of the micro-component transfer device, and the target carrier is moved into the micro-component transfer device, so that the target carrier is located below the first magnetic plate and the fifth surface of the target carrier faces the second surface of the first magnetic plate, and each of the micro-component fixing positions on the fifth surface of the target carrier is aligned with each of the micro-component alignment areas on the second surface of the first magnetic plate; the first magnetic plate is docked with the target carrier, and each of the micro-component alignment areas adsorbed Each of the aforementioned microcomponents is respectively in contact with the aforementioned conductive bonding layer on the surface of each aforementioned microcomponent fixing location on the aforementioned fifth surface of the aforementioned target carrier board through the aforementioned bonding pads on the aforementioned bonding surface; and a heat treatment is applied so that each of the aforementioned microcomponents is bonded to the aforementioned conductive bonding layer on the surface of each aforementioned microcomponent fixing location through the aforementioned bonding pads on the aforementioned bonding surface, and then detached from each of the aforementioned microcomponent alignment areas and respectively fixed to each of the aforementioned microcomponent fixing locations on the aforementioned fifth surface of the aforementioned target carrier board, thereby completing the process of transferring the aforementioned microcomponents from the aforementioned temporary carrier board to the aforementioned target carrier board.

[0012] The aforementioned micro-component transfer method further comprises a peeling step before the step of moving the aforementioned temporary carrier into the aforementioned micro-component transfer device, so that the aforementioned micro-component is peeled off the aforementioned third surface of the aforementioned temporary carrier.

[0013] In the aforementioned micro-component transfer method, the aforementioned peeling step is laser peeling or ultraviolet light peeling.

[0014] The aforementioned micro-component transfer method can also control the distance between the aforementioned temporary carrier and the aforementioned first magnetic attraction plate, and / or by coating the aforementioned second magnetic attraction plate with a magnetic-resistance material, so that the aforementioned micro-component on the aforementioned temporary carrier feels that the magnetic force from the aforementioned first magnetic attraction plate is greater than the magnetic force from the aforementioned second magnetic attraction plate.

[0015] The present invention also discloses another micro-component transfer device, comprising: a first magnet having a first end and a second end opposite to each other; a first magnetic attraction plate, arranged below the aforementioned first magnet, the aforementioned first magnetic attraction plate having first and second surfaces opposite to each other, wherein the aforementioned first surface of the aforementioned first magnetic attraction plate is connected to the first end of the aforementioned first magnet, and the aforementioned second surface of the aforementioned first magnetic attraction plate also has one or more micro-component alignment areas; and an insulating layer, covering the aforementioned first magnetic attraction plate, and the aforementioned insulating layer in each of the aforementioned micro-component alignment areas also includes one or more magnetic attraction positioning holes exposing the aforementioned second surface of the aforementioned first magnetic attraction plate adjacent to the aforementioned second surface of the aforementioned first magnetic attraction plate.

[0016] The aforementioned another micro-component transfer device also includes a magnetic barrier layer formed at a distance d (d>0) adjacent to the aforementioned second surface of the aforementioned first magnetic attraction plate, and the aforementioned magnetic barrier layer surrounds the aforementioned magnetic attraction positioning holes in each aforementioned micro-component alignment area.

[0017] The aforementioned another micro-component transfer device also includes a second magnet and a second magnetic attraction plate, the aforementioned second magnet has a third end and a fourth end opposite to each other, the aforementioned second magnetic attraction plate is connected to the aforementioned third end of the aforementioned second magnet, and the aforementioned second magnetic attraction plate is arranged below the aforementioned first magnetic attraction plate.

[0018] The present invention also discloses another micro-component transfer method, the steps of which include: providing the aforementioned another micro-component transfer device; providing a temporary carrier, the aforementioned temporary carrier having a third and a fourth surface opposite to each other, the aforementioned third surface being formed with one or more aforementioned micro-components, and each aforementioned micro-component is placed on the aforementioned third surface of the aforementioned temporary carrier by the aforementioned bonding surface of each aforementioned micro-component; providing a target carrier, the aforementioned target carrier having a fifth and a sixth surface opposite to each other, the aforementioned fifth surface including one or more micro-component fixing places, and each aforementioned micro-component fixing place The temporary carrier is placed below the first magnetic plate and the third surface of the temporary carrier faces the second surface of the first magnetic plate, and the magnetic layer on the magnetic surface of each micro-component faces the micro-component alignment area. The magnetic strength of the first magnet of the micro-component transfer device is controlled so that each micro-component can be adsorbed by the magnetic positioning hole in one of the micro-component alignment areas facing the magnetic layer on the magnetic surface, thereby The third surface of the temporary carrier is separated; the temporary carrier is moved out of the micro-component transfer device, and the target carrier is moved into the micro-component transfer device, so that the target carrier is located below the first magnetic attraction plate and the fifth surface of the target carrier faces the second surface of the first magnetic attraction plate, and each of the micro-component fixing positions on the fifth surface of the target carrier is aligned with each of the micro-component alignment areas on the second surface of the first magnetic attraction plate; the first magnetic attraction plate is docked with the target carrier, and each of the micro-components attracted by the alignment area is aligned with the micro-components attracted by the alignment area. Each of the aforementioned microcomponents attached is respectively contacted with the aforementioned conductive bonding layer on the surface of each aforementioned microcomponent fixing location located on the aforementioned fifth surface of the aforementioned target carrier board through the aforementioned bonding pads on the aforementioned bonding surface; and a heat treatment is applied so that each of the aforementioned microcomponents is bonded with the aforementioned conductive bonding layer on the surface of each aforementioned microcomponent fixing location through the aforementioned bonding pads on the aforementioned bonding surface, and then detached from each of the aforementioned microcomponent alignment areas and respectively fixed to each of the aforementioned microcomponent fixing locations on the aforementioned fifth surface of the aforementioned target carrier board, thereby completing the process of transferring the aforementioned microcomponents from the aforementioned temporary carrier board to the aforementioned target carrier board.

[0019] As mentioned above, the other micro-component transfer method further includes a peeling step before the step of moving the temporary carrier into the micro-component transfer device, so that the micro-component is peeled off the third surface of the temporary carrier.

[0020] As mentioned above in another micro-component transfer method, the aforementioned peeling step is laser peeling or ultraviolet peeling.

[0021] As described above, another micro-component transfer method can also control the distance between the temporary carrier and the first magnetic plate, and / or by coating the second magnetic plate with a magnetic-resistance material, so that the micro-component on the temporary carrier feels that the magnetic force from the first magnetic plate is greater than the magnetic force from the second magnetic plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figures 1A to 1C Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 100 applicable to a micromodule transfer method according to a first embodiment of the invention.

[0023] Figure 2A The drawings are top views of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface.

[0024] Figure 2B-2C For along Figure 2A The cross-sectional view of the temporary carrier 20 with a plurality of micro-components 30 to be transferred on the surface thereof is shown along the section line II-II'.

[0025] Figure 3A The illustrated diagram is a top view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing locations 70 .

[0026] Figure 3B For along Figure 3A A cross-sectional view of a target carrier 60 having a surface indicated by a section line III-III' having a plurality of micro-component fixing locations 70, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing locations 70.

[0027] Figures 4A to 4F The figure shows a cross-sectional process of a micro-component transfer method according to the first embodiment of the invention.

[0028] Figures 5A to 5C Illustrated are a cross-sectional view, a top view and a bottom view of a micro-module transfer device 200 applicable to a micro-module transfer method according to a second embodiment of the invention.

[0029] Figures 6A to 6F The figure shows a cross-sectional process of a micro-component transfer method according to the second embodiment of the invention.

[0030] Figures 7A to 7C Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 300 applicable to a micromodule transfer method according to a third embodiment of the invention.

[0031] Figures 8A to 8FThe figure shows a cross-sectional process of a micro-component transfer method according to the third embodiment of the invention.

[0032] Figures 9A to 9C Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 400 applicable to a micromodule transfer method according to a fourth embodiment of the invention.

[0033] Figures 10A to 10F Illustrated is a cross-sectional view of a micro-component transfer method according to a fourth embodiment of the invention.

[0034] Fig.11 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 500 applicable to a micromodule transfer method according to a fifth embodiment of the invention.

[0035] Figures 12A to 12F The figure shows a cross-sectional process of a micro-component transfer method according to a fifth embodiment of the invention.

[0036] Fig.13 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 600 applicable to a micromodule transfer method according to a sixth embodiment of the invention.

[0037] Figures 14A to 14F Illustrated is a cross-sectional view of a micro-component transfer method according to a sixth embodiment of the invention.

[0038] Fig.15 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 700 applicable to a micromodule transfer method according to a seventh embodiment of the invention.

[0039] Figures 16A to 16F Illustrated is a cross-sectional view of a micro-component transfer method according to a seventh embodiment of the invention.

[0040] Fig.17 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 800 suitable for use in a micromodule transfer method according to an eighth embodiment of the invention.

[0041] Figures 18A to 18F Illustrated is a cross-sectional view of a micro-component transfer method according to an eighth embodiment of the invention.

[0042] Figures 19A to 19C Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 900 applicable to the micromodule transfer method according to the ninth embodiment of the invention.

[0043] Fig. 20A The drawings are top views of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface.

[0044] Fig. 20B For along Fig. 20A The cross-sectional view of the temporary carrier 20 with a plurality of micro-components 35 to be transferred on the surface thereof is shown along the section line VV'.

[0045] Fig.21A The illustrated diagram is a top view of a target carrier 60 having a plurality of micro-component fixing locations 70 ′ on its surface, and a conductive bonding layer 80 ′ is formed on the surface of each of the plurality of micro-component fixing locations 70 ′.

[0046] Fig. 21B For along Fig.21A The cross-sectional view of the target carrier 60 is shown in FIG. 1 , wherein the surface indicated by the section line VI-VI' has a plurality of micro-component fixing locations 70', and a conductive bonding layer 80' is formed on the surface of each of the aforementioned plurality of micro-component fixing locations 70'.

[0047] Figures 22A to 22F Illustrated is a cross-sectional view of a micro-component transfer method according to a ninth embodiment of the invention.

[0048] Figures 23A to 23C Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 1000 applicable to the micromodule transfer method according to the tenth embodiment of the invention.

[0049] Figures 24A to 24F Illustrated is a cross-sectional view of the micro-component transfer method according to the tenth embodiment of the invention.

[0050] Figures 25A to 25C Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 1100 applicable to a micromodule transfer method according to the eleventh embodiment of the invention.

[0051] Figures 26A to 26F Illustrated is a cross-sectional view of a micro-component transfer method according to the eleventh embodiment of the invention.

[0052] Figures 27A to 27C Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 1200 applicable to a micromodule transfer method according to a twelfth embodiment of the invention.

[0053] Figures 28A to 28F The figure shows a cross-sectional process of a micro-component transfer method according to the twelfth embodiment of the invention.

[0054] Fig.29 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 1300 applicable to a micromodule transfer method according to a thirteenth embodiment of the invention.

[0055] Figures 30A to 30FIllustrated is a cross-sectional view of a micro-component transfer method according to a thirteenth embodiment of the invention.

[0056] Fig.31 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 1400 applicable to a micromodule transfer method according to a fourteenth embodiment of the invention.

[0057] Figures 32A to 32F Illustrated is a cross-sectional view of a micro-component transfer method according to a fourteenth embodiment of the invention.

[0058] Fig.33 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 1500 applicable to a micromodule transfer method according to a fifteenth embodiment of the invention.

[0059] Figures 34A to 34F Illustrated is a cross-sectional view of a micro-component transfer method according to a fifteenth embodiment of the invention.

[0060] Fig.35 Illustrated are a cross-sectional view, a top view and a bottom view of a micromodule transfer device 1600 applicable to a micromodule transfer method according to a sixteenth embodiment of the invention.

[0061] Figures 36A to 36F Illustrated is a cross-sectional view of a micro-component transfer method according to a sixteenth embodiment of the invention.

[0062] Among them, the simple description of the symbols in the accompanying drawings is as follows:

[0063] 20 Temporary carrier

[0064] 110 First Magnet

[0065] 20A Third surface

[0066] 110A First terminal

[0067] 20B Fourth surface

[0068] 110B Second end

[0069] 30, 35 micro modules

[0070] 115 Second Magnet

[0071] 30A, 35A joint surface

[0072] 115A Third terminal

[0073] 30B, 35B magnetic surface

[0074] 115B Fourth Terminal

[0075] 50 Magnetic layer

[0076] 120 First Magnetic Plate

[0077] 50A Lower metal layer

[0078] 20A First surface

[0079] 50B Magnetic material layer

[0080] 120A First surface

[0081] 120B Second surface

[0082] 50C Upper metal layer

[0083] 125, 125' micromodule alignment area

[0084] 60 Target carrier

[0085] 130 Insulation layer

[0086] 60A Fifth surface

[0087] 140 Magnetic Barrier

[0088] 60B Sixth surface

[0089] 150 Magnetic Head

[0090] 70, 70' micro module fixing place

[0091] 160 Second magnetic plate

[0092] 80, 80' conductive bonding layer

[0093] 250 Magnetic Positioning Hole

[0094] 100~1600 Micromodule transfer device

[0095] d is the distance between the second surface of the first magnetic attraction plate and the magnetic barrier layer DETAILED DESCRIPTION

[0096] In order to make the description of the disclosed content of the present invention more detailed and complete, the following is an illustrative description of the implementation and specific embodiments of the present invention; however, this is not the only form of implementing or using the specific embodiments of the present invention. The various embodiments disclosed below can be combined or replaced with each other under beneficial circumstances, and other embodiments can be added to one embodiment without further recording or explanation.

[0097] In the following description, many specific details will be described in detail to enable the reader to fully understand the following embodiments. However, embodiments of the present invention can be practiced without these specific details. In other cases, well-known structures and devices are only schematically depicted in the figures to simplify the drawings.

[0098] Example

[0099] Embodiment 1

[0100] See also Figures 1A to 1C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-component transfer device 100 suitable for a micro-component transfer method according to a first embodiment of the invention, wherein Figure 1A For along Figure 1B A cross-sectional view taken along section line II'; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 4A to 4F , which illustrates a cross-sectional process of a micro-component transfer method according to a first embodiment of the present invention.

[0101] First, provide a Figures 1A to 1C The micro-component transfer device 100 shown in the figure comprises: a first magnet 110 having a first end 110A and a second end 110B opposite to each other; a first magnetic attraction plate 120 disposed below the first magnet 110, the first magnetic attraction plate 120 having first and second surfaces 120A and 120B opposite to each other, wherein the first surface 120A of the first magnetic attraction plate 120 is connected to the first end 110A of the first magnet 110, and the second surface 120B of the first magnetic attraction plate 120 further has a plurality of micro-component alignment areas 125 spaced from each other, and each of the plurality of micro-component alignment areas 125 comprises a magnetic head 150 protruding from the second surface; and an insulating layer 130 covering the first magnetic attraction plate 120, and allowing the magnetic head 150 in each of the plurality of micro-component alignment areas 125 to partially expose the surface of the insulating layer 130. The first magnet can be a permanent magnet or an electromagnet.

[0102] Secondly, provide Figures 2A to 2CThe temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0103] Then, provide a Figure 3A-3B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0104] Then, if Figure 4A As shown, the temporary carrier 20 is moved into the micro-component transfer device 100, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 100, a step may also be included as shown in FIG. Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0105] Then, if Figure 4BAs shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 100 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic head 150 in one of the plurality of micro-component alignment regions 125 facing the magnetic layer 50 located on the magnetic surface 30B, thereby Figure 4C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0106] Then, if Figure 4D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 100, and the target carrier 60 is moved into the micro-component transfer device 100, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0107] Then, if Figure 4E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0108] Finally, if Figure 4F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0109] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to ensure that the bonding pad or pads (not shown) are firmly bonded to the conductive bonding layer 80.

[0110] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0111] Embodiment 2

[0112] See also Figures 5A to 5C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-module transfer device 200 suitable for a micro-module transfer method according to a second embodiment of the invention, wherein Figure 5A For along Figure 5B A cross-sectional view taken along section line II'; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 6A to 6F , which illustrates a cross-sectional process of a micro-component transfer method according to the second embodiment of the present invention.

[0113] First, provide a Figures 5A to 5C The micromodule transfer device 200 shown in FIG. 1 is generally similar to the micromodule transfer device 200 shown in FIG. Figures 1A to 1C The micromodule transfer device 100 is similar to the one shown in FIG. Figures 5A to 5C The insulating layer 130 of the micro-component transfer device 200 further includes a magnetic barrier layer 140 formed at a distance d (d>0) from the second surface 120B adjacent to the first magnetic attraction plate 120, and the magnetic barrier layer 140 surrounds the magnetic suction head 150 in each of the plurality of micro-component alignment regions 125.

[0114] Secondly, provide Figures 2A to 2CThe temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0115] Then, provide a Figure 3A-3B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0116] Then, if Fig. 6A As shown, the temporary carrier 20 is moved into the micro-component transfer device 200, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 200, a step may also be included as shown in FIG. Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0117] Then, if Figure 6BAs shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 200 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic head 150 in one of the plurality of micro-component alignment regions 125 facing the magnetic layer 50 located on the magnetic surface 30B, thereby Figure 6C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0118] Then, if Fig.6D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 200, and the target carrier 60 is moved into the micro-component transfer device 200, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0119] Then, if Fig. 6E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0120] Finally, if Fig. 6F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0121] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to ensure that the bonding pad or pads (not shown) are firmly bonded to the conductive bonding layer 80.

[0122] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0123] Embodiment 3

[0124] See also Figures 7A to 7C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-module transfer device 300 applicable to a micro-module transfer method according to a third embodiment of the invention, wherein Fig. 7A For along Figure 7B A cross-sectional view taken along section line II'; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 8A to 8F , which illustrates the cross-sectional process of the micro-component transfer method according to the third embodiment of the present invention.

[0125] First, provide a Figures 7A to 7CThe micro-component transfer device 300 shown in the figure comprises: a first magnet 110 having a first end 110A and a second end 110B opposite to each other; a first magnetic attraction plate 120 disposed below the first magnet 110, the first magnetic attraction plate 120 having first and second surfaces 120A and 120B opposite to each other, wherein the first surface 120A of the first magnetic attraction plate 120 is connected to the first end 110A of the first magnet 110, and the second surface 120B of the first magnetic attraction plate 120 further comprises a plurality of micro-component alignment areas 125 spaced apart from each other; and an insulating layer 130 covering the first magnetic attraction plate 120, and the insulating layer 130 in each of the plurality of micro-component alignment areas 125 comprises a magnetic attraction positioning hole 250 exposing the second surface 120B of the first magnetic attraction plate 120 adjacent to the second surface 120B of the first magnetic attraction plate 120. The first magnet 110 may be a permanent magnet or an electromagnet. In addition, in other embodiments according to the present invention, the insulating layer 130 in each of the plurality of micro-component alignment regions 125 may further include one or more magnetic attraction positioning holes 250 that expose the second surface 120B of the first magnetic attraction plate 120 as needed.

[0126] Secondly, provide Figures 2A to 2C The temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0127] Then, provide a Figure 3A-3BThe target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0128] Then, if Fig. 8A As shown, the temporary carrier 20 is moved into the micro-component transfer device 300, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 300, a step may also be included as shown in FIG. Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0129] Then, if Figure 8B As shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 300 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic attraction positioning hole 250 in one of the plurality of micro-component alignment regions 125 facing the magnetic attraction layer 50 located on the magnetic attraction surface 30B, thereby Figure 8C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0130] Then, if Fig.8D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 300, and the target carrier 60 is moved into the micro-component transfer device 300, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0131] Then, if Fig. 8EAs shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0132] Finally, if Figure 8F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0133] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to ensure that the bonding pad or pads (not shown) are firmly bonded to the conductive bonding layer 80.

[0134] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0135] Embodiment 4

[0136] See also Figures 9A to 9C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-module transfer device 400 suitable for a micro-module transfer method according to a fourth embodiment of the invention, wherein Fig.9A For along Fig. 9B A cross-sectional view taken along section line II'; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B, which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 10A to 10F , which illustrates a cross-sectional process of a micro-component transfer method according to a fourth embodiment of the present invention.

[0137] First, provide a Figures 9A to 9C The micromodule transfer device 400 shown in FIG. 1 is generally similar to the micromodule transfer device 400 shown in FIG. Figures 7A to 7C The micromodule transfer device 300 is similar to the one shown in FIG. Figures 9A to 9C The aforementioned insulating layer 130 of the micro-component transfer device 400 shown also includes a magnetic barrier layer 140, which is formed at a distance d (d>0) adjacent to the aforementioned second surface 120B of the aforementioned first magnetic attraction plate 120, and the aforementioned magnetic barrier layer 140 surrounds the magnetic attraction positioning holes 250 in each of the aforementioned multiple micro-component alignment areas 125.

[0138] Secondly, provide Figures 2A to 2C The temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0139] Then, provide a Figure 3A-3B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0140] Then, if Fig. 10A As shown, the temporary carrier 20 is moved into the micro-component transfer device 400, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 400, a step may also be included as shown in FIG. Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0141] Then, if Fig. 10B As shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 400 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic attraction positioning hole 250 in one of the plurality of micro-component alignment regions 125 facing the magnetic attraction layer 50 located on the magnetic attraction surface 30B, thereby Fig. 10C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0142] Then, if Fig. 10D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 400, and the target carrier 60 is moved into the micro-component transfer device 400, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0143] Then, if Fig.10E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0144] Finally, if Fig.10F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0145] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to ensure that the bonding pad or pads (not shown) are firmly bonded to the conductive bonding layer 80.

[0146] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0147] Embodiment 5

[0148] See also Fig.11 , which respectively illustrate cross-sectional views of a micro-module transfer device 500 applicable to a micro-module transfer method according to a fifth embodiment of the invention; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 12A to 12F , which illustrates a cross-sectional process of a micro-component transfer method according to a fifth embodiment of the present invention.

[0149] First, provide a Fig.11 The micromodule transfer device 500 shown in FIG. 1 is generally similar to the micromodule transfer device 500 shown in FIG. Figures 1A to 1C The micromodule transfer device 100 is similar to the one shown in FIG. Fig.11The illustrated micromodule transfer device 500 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115, like the first magnet 110A, can also be a permanent magnet or an electromagnet.

[0150] Secondly, provide Figures 2A to 2C The temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0151] Then, provide a Figure 3A-3B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0152] Then, if Fig. 12AAs shown, the temporary carrier 20 is moved into the micro-component transfer device 500, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 500, a step may also be included as follows: Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0153] Then, if Fig. 12B As shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 500 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic head 150 in one of the plurality of micro-component alignment regions 125 facing the magnetic layer 50 located on the magnetic surface 30B, thereby Fig. 12C In addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 30 or micro-components 30 on the temporary carrier can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 500 of the present embodiment is achieved by, for example but not limited to, controlling the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic attraction plate 120, and / or by coating the aforementioned second magnetic attraction plate 160 with a magnetic-resistive material (not shown), so that the aforementioned or aforementioned multiple micro-components 30 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic attraction plate 120 is greater than the magnetic force from the aforementioned second magnetic attraction plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic attraction plate 120 and the second magnetic plate 160, the aforementioned magnetic attraction layer 50 of the aforementioned magnetic attraction surface 30B of each of the aforementioned multiple micro-components 30 can be more accurately adsorbed by the aforementioned magnetic attraction head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0154] Then, if Fig.12DAs shown, the temporary carrier 20 is moved out of the micro-component transfer device 500, and the target carrier 60 is moved into the micro-component transfer device 500, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0155] Then, if Fig.12E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0156] Then, if Fig.12F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0157] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80 more firmly bonded.

[0158] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0159] Embodiment 6

[0160] See also Fig.13 , which respectively illustrate cross-sectional views of a micro-module transfer device 600 applicable to a micro-module transfer method according to a sixth embodiment of the invention; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 14A to 14F , which illustrates a cross-sectional process of a micro-component transfer method according to a sixth embodiment of the present invention.

[0161] First, provide a Fig.13 The micromodule transfer device 600 shown in FIG. 1 is generally similar to the micromodule transfer device 600 shown in FIG. Figures 5A to 5C The micromodule transfer device 200 is similar to the one shown in FIG. Fig.13 The illustrated micromodule transfer device 600 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115, like the first magnet 110A, can also be a permanent magnet or an electromagnet.

[0162] Secondly, provide Figures 2A to 2CThe temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0163] Then, provide a Figure 3A-3B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0164] Then, if Fig.14A As shown, the temporary carrier 20 is moved into the micro-component transfer device 600, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 600, a step may also be included as follows: Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0165] Then, if Fig. 14BAs shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 600 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic head 150 in one of the plurality of micro-component alignment regions 125 facing the magnetic layer 50 located on the magnetic surface 30B, thereby Fig. 14C In addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 30 or micro-components 30 on the temporary carrier can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 600 of the present embodiment controls the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic attraction plate 120, and / or by coating the aforementioned second magnetic attraction plate 160 with a magnetic-resistive material (not shown), so that the aforementioned or aforementioned multiple micro-components 30 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic attraction plate 120 is greater than the magnetic force from the aforementioned second magnetic attraction plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic attraction plate 120 and the second magnetic plate 160, the aforementioned magnetic attraction layer 50 of the aforementioned magnetic attraction surface 30B of each of the aforementioned multiple micro-components 30 can be more accurately adsorbed by the aforementioned magnetic attraction head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0166] Then, if Fig.14D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 600, and the target carrier 60 is moved into the micro-component transfer device 600, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0167] Then, if Fig.14E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0168] Then, if Fig.14F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0169] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80 more firmly bonded.

[0170] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0171] Embodiment 7

[0172] See also Fig.15 , which respectively illustrate cross-sectional views of a micro-module transfer device 700 applicable to a micro-module transfer method according to a seventh embodiment of the invention; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 16A to 16F , which illustrates a cross-sectional process of a micro-component transfer method according to Embodiment 7 of the present invention.

[0173] First, provide a Fig.15 The micromodule transfer device 700 shown in FIG. 1 is generally similar to the micromodule transfer device 700 shown in FIG. Figures 7A to 7C The micromodule transfer device 300 is similar to the one shown in FIG. Fig.15The illustrated micromodule transfer device 700 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115, like the first magnet 110A, can also be a permanent magnet or an electromagnet.

[0174] Secondly, provide Figures 2A to 2C The temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0175] Then, provide a Figure 3A-3B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0176] Then, if Fig.16AAs shown, the temporary carrier 20 is moved into the micro-component transfer device 700, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 700, a step may also be included as follows: Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0177] Then, if Fig. 16B As shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 700 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic attraction positioning hole 250 in one of the plurality of micro-component alignment areas 125 facing the magnetic attraction layer 50 located on the magnetic attraction surface 30B, thereby Fig. 16C In addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 30 or micro-components 30 on the temporary carrier can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 700 of the present embodiment controls the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic attraction plate 120, and / or by coating the aforementioned second magnetic attraction plate 160 with a magnetic-resistive material (not shown), so that the aforementioned or aforementioned multiple micro-components 30 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic attraction plate 120 is greater than the magnetic force from the aforementioned second magnetic attraction plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic attraction plate 120 and the second magnetic plate 160, the aforementioned magnetic attraction layer 50 of the aforementioned magnetic attraction surface 30B of each of the aforementioned multiple micro-components 30 can be more accurately adsorbed by the aforementioned magnetic attraction positioning hole 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0178] Then, if Fig.16DAs shown, the temporary carrier 20 is moved out of the micro-component transfer device 700, and the target carrier 60 is moved into the micro-component transfer device 700, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0179] Then, if Fig.16E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0180] Then, if Fig.16F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0181] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80 more firmly bonded.

[0182] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0183] Embodiment 8

[0184] See also Fig.17 , which respectively illustrate cross-sectional views of a micro-module transfer device 800 applicable to a micro-module transfer method according to an eighth embodiment of the invention; Figures 2A to 2C The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 30 to be transferred on its surface; Figure 3A-3B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70 on its surface, and a conductive bonding layer 80 formed on the surface of each of the plurality of micro-component fixing locations 70; and Figures 18A to 18F , which illustrates a cross-sectional process of a micro-component transfer method according to an eighth embodiment of the present invention.

[0185] First, provide a Fig.17 The micromodule transfer device 800 shown in FIG. 1 is generally similar to the micromodule transfer device 800 shown in FIG. Figures 9A to 9C The micromodule transfer device 400 is similar to the one shown in FIG. Fig.17 The illustrated micromodule transfer device 800 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115, like the first magnet 110A, can also be a permanent magnet or an electromagnet.

[0186] Secondly, provide Figures 2A to 2CThe temporary carrier 20 shown in the figure has a third and a fourth surface 20A and 20B opposite to each other, and the third surface 20A is formed with a plurality of micro-components 30 spaced from each other, and each of the plurality of micro-components 30 includes a bonding surface 30A and a magnetic surface 30B opposite to each other, wherein the bonding surface 30A includes one or more bonding pads (not shown), and the magnetic surface 30B includes a magnetic layer 50. The micro-component 30 may be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. The magnetic layer 50 includes a magnetic material layer 50B, and may also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A may be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0187] Then, provide a Figure 3A-3B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70 spaced apart from each other, and a conductive bonding layer 80 is formed on the surface of each of the plurality of micro-component fixing places 70. The material of the conductive bonding layer 80 can be selected from, for example, but not limited to, conductive adhesive, anisotropic conductive adhesive (ACF) or hot-melt metal layer.

[0188] Then, if Fig.18A As shown, the temporary carrier 20 is moved into the micro-component transfer device 800, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 30 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 800, a step may also be included as follows: Figure 2C In the peeling step shown, the plurality of micro-components 30 are peeled off from the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0189] Then, if Fig.18BAs shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 800 is controlled so that each of the plurality of micro-components 30 can be attracted by the magnetic attraction positioning hole 250 in one of the plurality of micro-component alignment regions 125 facing the magnetic attraction layer 50 located on the magnetic attraction surface 30B, thereby Fig.18C In addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 30 or micro-components 30 on the temporary carrier can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 800 of the present embodiment controls the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic attraction plate 120, and / or by coating the aforementioned second magnetic attraction plate 160 with a magnetic-resistive material (not shown), so that the aforementioned or aforementioned multiple micro-components 30 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic attraction plate 120 is greater than the magnetic force from the aforementioned second magnetic attraction plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic attraction plate 120 and the second magnetic plate 160, the aforementioned magnetic attraction layer 50 of the aforementioned magnetic attraction surface 30B of each of the aforementioned multiple micro-components 30 can be more accurately adsorbed by the aforementioned magnetic attraction positioning hole 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0190] Then, if Fig.18D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 800, and the target carrier 60 is moved into the micro-component transfer device 800, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70 located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0191] Then, if Fig.18E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 30 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80 located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70 of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0192] Then, if Fig.18F As shown, after heat treatment, each of the aforementioned multiple micro-components 30 is bonded to the aforementioned conductive bonding layer 80 on the surface of each of the aforementioned multiple micro-component fixing locations 70 through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 30 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70 on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 30 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0193] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80 more firmly bonded.

[0194] Since each of the aforementioned multiple micro-components 30 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 30B, and then transferred to the aforementioned multiple micro-component fixing locations 70 located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0195] Embodiment 9

[0196] See also Figures 19A to 19C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-module transfer device 900 suitable for the micro-module transfer method according to the ninth embodiment of the invention, wherein Fig.19A For along Fig.19B A cross-sectional view taken along section line IV-IV'; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 22A to 22F It illustrates the cross-sectional process of the micro-component transfer method according to the ninth embodiment of the present invention.

[0197] First, provide a Figures 19A to 19CThe micro-component transfer device 900 shown in the figure comprises: a first magnet 110 having a first end 110A and a second end 110B opposite to each other; a first magnetic attraction plate 120 disposed below the first magnet 110, the first magnetic attraction plate 120 having first and second surfaces 120A and 120B opposite to each other, wherein the first surface 120A of the first magnetic attraction plate 120 is connected to the first end 110A of the first magnet 110, and the second surface 120B of the first magnetic attraction plate 120 further has a plurality of micro-component alignment areas 125 spaced from each other, and each of the plurality of micro-component alignment areas 125 comprises two or more magnetic heads 150 protruding from the second surface; and an insulating layer 130 covering the first magnetic attraction plate 120, and allowing the plurality of magnetic heads 150 in each of the plurality of micro-component alignment areas 125 to partially expose the surface of the insulating layer 130. The first magnet may be a permanent magnet or an electromagnet.

[0198] Secondly, provide Figures 20A to 20B The temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0199] Then, provide a Figures 21A-21B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0200] Then, if Fig.22A As shown, the temporary carrier 20 is moved into the micro-component transfer device 900, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 35 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to an embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 900, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0201] Then, if Fig. 22B As shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 900 is controlled so that each of the plurality of micro-components 35 can be attracted by the plurality of magnetic heads 150 in one of the plurality of micro-component alignment regions 125 facing the plurality of magnetic layers 50 located on the magnetic attraction surface 35B, thereby Fig. 22C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0202] Then, if Fig.22D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 900, and the target carrier 60 is moved into the micro-component transfer device 900, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0203] Then, if Fig.22E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 adsorbed by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the aforementioned bonding surface 35A or the aforementioned plurality of bonding pads (not shown) on the bonding surface 35A.

[0204] Then, if Fig.22FAs shown, after the heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned one or multiple bonding pads (not shown) on the aforementioned bonding surface 35A, each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0205] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to make the bonding pad or pads (not shown) more firmly bonded to the conductive bonding layer 80'.

[0206] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0207] Embodiment 10

[0208] See also Figures 23A to 23C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-module transfer device 1000 suitable for the micro-module transfer method according to the tenth embodiment of the invention, wherein Fig.23A For along Fig. 23B A cross-sectional view taken along section line IV-IV'; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 24A to 24F , which illustrates a cross-sectional process of a micro-component transfer method according to the tenth embodiment of the present invention.

[0209] First, provide a Figures 23A to 23C The micromodule transfer device 1000 shown in FIG. 1 is generally similar to the micromodule transfer device 1000 shown in FIG. Figures 19A to 19CThe micromodule transfer device 900 is similar to the one shown in FIG. Figures 23A to 23C The aforementioned insulating layer 130 of the micro-component transfer device 1000 shown also includes a magnetic barrier layer 140, which is formed at the aforementioned second surface 120B adjacent to the aforementioned first magnetic attraction plate 120 and at a distance d (d>0), and the aforementioned magnetic barrier layer 140 surrounds each of the aforementioned multiple magnetic suction heads 150 in each of the aforementioned multiple micro-component alignment areas 125.

[0210] Secondly, provide Figures 20A to 20B The temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0211] Then, provide a Figures 21A-21B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0212] Then, if Fig.24AAs shown, the temporary carrier 20 is moved into the micro-component transfer device 1000, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 1000, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0213] Then, if Fig. 24B As shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 1000 is controlled so that each of the plurality of micro-components 35 can be attracted by the plurality of magnetic heads 150 in one of the plurality of micro-component alignment regions 125 facing the plurality of magnetic layers 50 located on the magnetic attraction surface 35B, thereby Fig. 22C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0214] Then, if Fig.24D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 1000, and the target carrier 60 is moved into the micro-component transfer device 1000, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0215] Then, if Fig.24E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0216] Then, if Fig.24FAs shown, after the heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned one or multiple bonding pads (not shown) on the aforementioned bonding surface 35A, each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0217] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to make the bonding pad or pads (not shown) more firmly bonded to the conductive bonding layer 80'.

[0218] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0219] Embodiment 11

[0220] See also Figures 25A to 25C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-module transfer device 1100 applicable to a micro-module transfer method according to an eleventh embodiment of the invention, wherein Fig.25A For along Fig.25B A cross-sectional view taken along section line IV-IV'; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 26A to 26F , which illustrates a cross-sectional process of a micro-component transfer method according to the eleventh embodiment of the present invention.

[0221] First, provide a Figures 25A to 25CThe micro-component transfer device 1100 shown in the figure comprises: a first magnet 110 having a first end 110A and a second end 110B opposite to each other; a first magnetic attraction plate 120 disposed below the first magnet 110, the first magnetic attraction plate 120 having first and second surfaces 120A and 120B opposite to each other, wherein the first surface 120A of the first magnetic attraction plate 120 is connected to the first end 110A of the first magnet 110, and the second surface 120B of the first magnetic attraction plate 120 further comprises a plurality of micro-component alignment areas 125 spaced apart from each other; and an insulating layer 130 covering the first magnetic attraction plate 120, and the insulating layer 130 in each of the plurality of micro-component alignment areas 125 comprises two or more magnetic attraction positioning holes 250 exposing the second surface 120B of the first magnetic attraction plate 120 adjacent to the second surface 120B of the first magnetic attraction plate 120. The first magnet 110 may be a permanent magnet or an electromagnet.

[0222] Secondly, provide Figures 20A to 20B The temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0223] Then, provide a Figures 21A-21B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0224] Then, if Fig.26A As shown, the temporary carrier 20 is moved into the micro-component transfer device 1100, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 1100, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0225] Then, if Fig.26B As shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 1100 is controlled so that each of the plurality of micro-components 35 can be attracted by the plurality of magnetic attraction holes 250 in one of the plurality of micro-component alignment regions 125 facing the plurality of magnetic attraction layers 50 located on the magnetic attraction surface 35B, thereby Fig.26C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0226] Then, if Fig.26D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 1100, and the target carrier 60 is moved into the micro-component transfer device 1100, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0227] Then, if Fig.26E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 adsorbed by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the aforementioned bonding surface 35A or the aforementioned plurality of bonding pads (not shown) on the bonding surface 35A.

[0228] Then, if Fig.26FAs shown, after the heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned one or multiple bonding pads (not shown) on the aforementioned bonding surface 35A, each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0229] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to make the bonding pad or pads (not shown) more firmly bonded to the conductive bonding layer 80'.

[0230] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0231] Embodiment 12

[0232] See also Figures 27A to 27C , which respectively illustrate a cross-sectional view, a top view and a bottom view of a micro-module transfer device 1200 applicable to a micro-module transfer method according to a twelfth embodiment of the invention, wherein Fig.27A For along Fig.27B A cross-sectional view taken along section line IV-IV'; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 28A to 28F , which illustrates a cross-sectional process of a micro-component transfer method according to a twelfth embodiment of the present invention.

[0233] First, provide a Figures 27A to 27C The micromodule transfer device 1200 shown in FIG. 1 is generally similar to the micromodule transfer device 1200 shown in FIG. Figures 25A to 25CThe micromodule transfer device 1100 is similar to the one shown in FIG. Figures 27A to 27C The aforementioned insulating layer 130 of the micro-component transfer device 1200 shown also includes a magnetic barrier layer 140, which is formed at a distance d (d>0) adjacent to the aforementioned second surface 120B of the aforementioned first magnetic attraction plate 120, and the aforementioned magnetic barrier layer 140 surrounds each of the aforementioned multiple magnetic attraction positioning holes 250 in each of the aforementioned multiple micro-component alignment areas 125.

[0234] Secondly, provide Figures 20A to 20B The temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0235] Then, provide a Figures 21A-21B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0236] Then, if Fig.28AAs shown, the temporary carrier 20 is moved into the micro-component transfer device 1200, so that the temporary carrier 20 is located below the first magnetic plate 120 and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 1100, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0237] Then, if Fig.28B As shown, the magnetic strength of the first magnet 110 of the micro-component transfer device 1200 is controlled so that each of the plurality of micro-components 35 can be attracted by the plurality of magnetic attraction holes 250 in one of the plurality of micro-component alignment regions 125 facing the plurality of magnetic attraction layers 50 located on the magnetic attraction surface 30B, thereby Fig.28C As shown, the third surface 20A of the temporary carrier 20 is separated from the third surface 20A.

[0238] Then, if Fig.28D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 1200, and the target carrier 60 is moved into the micro-component transfer device 1200, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0239] Then, if Fig.28E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 attracted by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the one or more bonding pads (not shown) on the bonding surface 30A.

[0240] Then, if Fig.28FAs shown, after heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned or aforementioned multiple bonding pads (not shown) on the aforementioned bonding surface 30A, and then each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0241] The heat treatment can be performed under the condition that the first magnet 110 continuously provides a magnetic field or interrupts the magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment can be performed after the heat treatment as needed to ensure that the bonding pad or pads (not shown) are firmly bonded to the conductive bonding layer 80'.

[0242] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0243] Embodiment 13

[0244] See also Fig.29 , which respectively illustrate cross-sectional views of a micro-module transfer device 1300 applicable to a micro-module transfer method according to a thirteenth embodiment of the invention; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 30A to 30F , which illustrates a cross-sectional process of a micro-component transfer method according to a thirteenth embodiment of the present invention.

[0245] First, provide a Fig.29 The micromodule transfer device 1300 shown in FIG. 1 is generally similar to the micromodule transfer device 1300 shown in FIG. Figures 19A to 19C The micromodule transfer device 900 is similar to the one shown in FIG. Fig.29The illustrated micromodule transfer device 1300 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115, like the first magnet 110A, can also be a permanent magnet or an electromagnet.

[0246] Secondly, provide Figures 20A to 20B The temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0247] Then, provide a Figures 21A-21B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0248] Then, if Fig. 30AAs shown, the temporary carrier 20 is moved into the micro-component transfer device 1300, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to an embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 1300, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or ultraviolet peeling.

[0249] Then, if Fig. 30B As shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 1300 is controlled so that each of the plurality of micro-components 35 can be attracted by the magnetic head 150 in one of the plurality of micro-component alignment regions 125 facing the magnetic layer 50 located on the magnetic surface 30B, thereby Fig. 30C In addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 35 on the temporary carrier 20 or the micro-components 35 can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 500 of the present embodiment controls the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic attraction plate 120, and / or by coating the aforementioned second magnetic attraction plate 160 with a magnetic-resistive material (not shown), so that the aforementioned or aforementioned multiple micro-components 35 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic attraction plate 120 is greater than the magnetic force from the aforementioned second magnetic attraction plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic attraction plate 120 and the second magnetic plate 160, the aforementioned multiple magnetic attraction layers 50 of the aforementioned magnetic attraction surface 35B of each of the aforementioned multiple micro-components 35 can be more accurately adsorbed by the aforementioned multiple magnetic attraction heads 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0250] Then, if Fig.30DAs shown, the temporary carrier 20 is moved out of the micro-component transfer device 1300, and the target carrier 60 is moved into the micro-component transfer device 1300, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0251] Then, if Fig.30E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 adsorbed by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the aforementioned bonding surface 35A or the aforementioned plurality of bonding pads (not shown) on the bonding surface 35A.

[0252] Then, if Fig.30F As shown, after the heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned one or multiple bonding pads (not shown) on the aforementioned bonding surface 35A, each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0253] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80' more firmly bonded.

[0254] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0255] Embodiment 14

[0256] See also Fig.31 , which respectively illustrate cross-sectional views of a micro-module transfer device 1400 applicable to a micro-module transfer method according to a fourteenth embodiment of the invention; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 32A to 32F , which illustrates a cross-sectional process of a micro-component transfer method according to a fourteenth embodiment of the present invention.

[0257] First, provide a Fig.31 The micromodule transfer device 1400 shown in FIG. 1 is generally similar to the micromodule transfer device 1400 shown in FIG. Figures 23A to 23C The micro-module transfer device 1000 shown in FIG. 32 is similar and will not be described in detail here. The only difference is that the micro-module transfer device 1400 shown in FIG. 32 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115 can also be a permanent magnet or an electromagnet like the first magnet 110A.

[0258] Secondly, provide Figures 20A to 20BThe temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0259] Then, provide a Figures 21A-21B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0260] Then, if Fig.32A As shown, the temporary carrier 20 is moved into the micro-component transfer device 1400, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to an embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 1400, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or ultraviolet peeling.

[0261] Then, if Fig.32BAs shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 1400 is controlled so that each of the plurality of micro-components 35 can be attracted by the magnetic head 150 in one of the plurality of micro-component alignment regions 125 facing the magnetic layer 50 located on the magnetic surface 35B, thereby Fig.32C In addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 35 on the temporary carrier 20 or the micro-components 35 can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 500 of the present embodiment controls the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic attraction plate 120, and / or by coating the aforementioned second magnetic attraction plate 160 with a magnetic-resistive material (not shown), so that the aforementioned or aforementioned multiple micro-components 35 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic attraction plate 120 is greater than the magnetic force from the aforementioned second magnetic attraction plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic attraction plate 120 and the second magnetic plate 160, the aforementioned multiple magnetic attraction layers 50 of the aforementioned magnetic attraction surface 35B of each of the aforementioned multiple micro-components 35 can be more accurately adsorbed by the aforementioned multiple magnetic attraction heads 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0262] Then, if Fig.32D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 1400, and the target carrier 60 is moved into the micro-component transfer device 1400, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0263] Then, if Fig.32EAs shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 adsorbed by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the aforementioned bonding surface 35A or the aforementioned plurality of bonding pads (not shown) on the bonding surface 35A.

[0264] Then, if Fig.32F As shown, after the heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned one or multiple bonding pads (not shown) on the aforementioned bonding surface 35A, each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0265] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80' more firmly bonded.

[0266] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic head 150 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0267] Embodiment 15

[0268] See also Fig.33 , which respectively illustrate cross-sectional views of a micro-module transfer device 1500 applicable to a micro-module transfer method according to a fifteenth embodiment of the invention; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B, which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 34A to 34F , which illustrates a cross-sectional process of a micro-component transfer method according to a fifteenth embodiment of the present invention.

[0269] First, provide a Fig.33 The micromodule transfer device 1500 shown in FIG. 1 is generally similar to the micromodule transfer device 1500 shown in FIG. Figures 25A to 25C The micromodule transfer device 1100 is similar to the one shown in FIG. Fig.33 The illustrated micromodule transfer device 1500 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115, like the first magnet 110A, can also be a permanent magnet or an electromagnet.

[0270] Secondly, provide Figures 20A to 20B The temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0271] Then, provide a Figures 21A-21BThe target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0272] Then, if Fig.34A As shown, the temporary carrier 20 is moved into the micro-component transfer device 1500, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 1500, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0273] Then, if Fig.34B As shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 1500 is controlled so that each of the plurality of micro-components 35 can be attracted by the magnetic attraction positioning hole 250 in one of the plurality of micro-component alignment areas 125 facing the magnetic attraction layer 50 located on the magnetic attraction surface 35B, thereby Fig.34CIn addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 35 on the temporary carrier 20 or the micro-components 35 can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 1500 of the present embodiment controls the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic plate 120, and / or covers the aforementioned second magnetic plate 160 with a magnetic-resistive material (not shown), so that the aforementioned or aforementioned multiple micro-components 35 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic plate 120 is greater than the magnetic force from the aforementioned second magnetic plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic plate 120 and the second magnetic plate 160, the aforementioned multiple magnetic layers 50 of the aforementioned magnetic surface 35B of each of the aforementioned multiple micro-components 35 can be more accurately adsorbed by the aforementioned multiple magnetic positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0274] Then, if Fig.34D As shown, the temporary carrier 20 is moved out of the micro-component transfer device 1500, and the target carrier 60 is moved into the micro-component transfer device 1500, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0275] Then, if Fig.34E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 adsorbed by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the aforementioned bonding surface 35A or the aforementioned plurality of bonding pads (not shown) on the bonding surface 35A.

[0276] Then, if Fig.34FAs shown, after the heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned one or multiple bonding pads (not shown) on the aforementioned bonding surface 35A, each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0277] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80' more firmly bonded.

[0278] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0279] Embodiment 16

[0280] See also Fig.35 , which respectively illustrate cross-sectional views of a micro-module transfer device 1600 applicable to a micro-module transfer method according to a sixteenth embodiment of the invention; Figures 20A to 20B The drawings are respectively a top view and a cross-sectional view of a temporary carrier 20 having a plurality of micro-components 35 to be transferred on its surface; Figures 21A-21B , which respectively show a top view and a cross-sectional view of a target carrier 60 having a plurality of micro-component fixing locations 70' on its surface, and a conductive bonding layer 80' formed on the surface of each of the plurality of micro-component fixing locations 70'; and Figures 36A to 36F , which illustrates a cross-sectional process of a micro-component transfer method according to a sixteenth embodiment of the present invention.

[0281] First, provide a Fig.35 The micromodule transfer device 1600 shown in FIG. 1 is generally similar to the micromodule transfer device 1600 shown in FIG. Figures 27A to 27C The micromodule transfer device 1200 is similar to the one shown in FIG. Fig.35The illustrated micro-module transfer device 1600 further includes a second magnet 115 and a second magnetic attraction plate 160. The second magnet 115 has a third end 115A and a fourth end 115B opposite to each other. The second magnetic attraction plate 160 is connected to the third end 115A of the second magnet 115, and the second magnetic attraction plate 160 is disposed below the first magnetic attraction plate 120. The second magnet 115, like the first magnet 110A, can also be a permanent magnet or an electromagnet.

[0282] Secondly, provide Figures 20A to 20B The temporary carrier 20 shown in the figure has a third and fourth surfaces 20A and 20B opposite to each other. The third surface 20A is formed with a plurality of micro-components 35 spaced from each other, and each of the plurality of micro-components 35 includes a bonding surface 35A and a magnetic surface 35B opposite to each other, wherein the bonding surface 35A includes one or more bonding pads (not shown), and the magnetic surface 35B includes two or more magnetic layers 50. The micro-component 35 can be, for example but not limited to, a semiconductor component, a light-emitting diode die, or a micro-light-emitting diode die. Each of the plurality of magnetic layers 50 includes a magnetic material layer 50B, and can also include an upper metal layer 50C and a lower metal layer 50A to sandwich the magnetic material layer 50B, and the magnetic material layer 50B, the upper metal layer 50C, and the lower metal layer 50A can be formed in sequence respectively by electroplating, physical deposition, or chemical vapor deposition. In one embodiment according to the present invention, the lower metal layer 50A and the upper metal layer 50C may be, for example but not limited to, metal copper layers, and the material of the magnetic material layer 50B may be selected from metal materials containing at least one of iron, cobalt, nickel or their alloys.

[0283] Then, provide a Figures 21A-21B The target carrier 60 shown in the figure has a fifth and sixth surfaces 60A and 60B facing each other, the fifth surface 60A includes a plurality of micro-component fixing places 70' spaced apart from each other, and a conductive bonding layer 80' is formed on the surface of each of the plurality of micro-component fixing places 70'. The material of the conductive bonding layer 80' can be selected from, for example, but not limited to, conductive glue or hot-melt metal layer.

[0284] Then, if Fig.36AAs shown, the temporary carrier 20 is moved into the micro-component transfer device 1600, so that the temporary carrier 20 is located between the first magnetic plate 120 and the second magnetic plate 160, and the third surface 20A of the temporary carrier 20 faces the second surface 120B of the first magnetic plate 120, and the magnetic layer 50 of each of the plurality of micro-components 35 located on the third surface 20A of the temporary carrier 20 faces the plurality of micro-component alignment areas 125. According to one embodiment of the present invention, before the step of moving the temporary carrier 20 into the micro-component transfer device 1500, a peeling step (not shown) may be further included, in which the plurality of micro-components 35 are peeled off the third surface 20A of the temporary carrier 20 by laser peeling or UV peeling.

[0285] Then, if Fig.36B As shown, the magnetic strength of the first magnet 110 and the second magnet 115 of the micro-component transfer device 1600 is controlled so that each of the plurality of micro-components 35 can be attracted by the magnetic attraction positioning hole 250 in one of the plurality of micro-component alignment regions 125 facing the magnetic attraction layer 50 located on the magnetic attraction surface 35B, thereby Fig.36C In addition, by controlling the distance between the temporary carrier 20 and the first magnetic plate 120 and / or by coating the second magnetic plate 160 with a magnetic-resistance material (not shown), the micro-components 35 on the temporary carrier 20 or the micro-components 35 can feel that the magnetic force from the first magnetic plate 120 is greater than the magnetic force from the second magnetic plate 160. Since the aforementioned micro-component transfer device 1600 of the present embodiment controls the distance between the aforementioned temporary carrier 20 and the aforementioned first magnetic plate 120, and / or coats a magnetic-resistant material (not shown) on the aforementioned second magnetic plate 160, so that the aforementioned or aforementioned multiple micro-components 35 on the aforementioned temporary carrier feel that the magnetic force from the aforementioned first magnetic plate 120 is greater than the magnetic force from the aforementioned second magnetic plate 160, and a uniform and stable magnetic field is created through the magnetic force between the aforementioned first magnetic plate 120 and the second magnetic plate 160, the aforementioned multiple magnetic layers 50 of the aforementioned magnetic surface 35B of each of the aforementioned multiple micro-components 35 can be more accurately adsorbed by the aforementioned multiple magnetic positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it.

[0286] Then, if Fig.36DAs shown, the temporary carrier 20 is moved out of the micro-component transfer device 1600, and the target carrier 60 is moved into the micro-component transfer device 1600, so that the target carrier 60 is located below the first magnetic plate 120 and the fifth surface 60A of the target carrier 60 faces the second surface 120B of the first magnetic plate 120, and each of the plurality of micro-component fixing locations 70' located on the fifth surface 60A of the target carrier 60 is aligned with each of the plurality of micro-component alignment areas 125 located on the second surface 120B of the first magnetic plate 120.

[0287] Then, if Fig.36E As shown, the first magnetic attraction plate 120 is docked with the target carrier 60, and each of the plurality of micro-components 35 adsorbed by each of the plurality of micro-component alignment regions 125 is contacted with the conductive bonding layer 80' located on the fifth surface 60A of the target carrier 60 and aligned with the surface of each of the plurality of micro-component fixing locations 70' of each of the plurality of micro-component alignment regions 125 through the aforementioned bonding surface 35A or the aforementioned plurality of bonding pads (not shown) on the bonding surface 35A.

[0288] Then, if Fig.36F As shown, after the heat treatment, each of the aforementioned multiple micro-components 35 is bonded to the aforementioned conductive bonding layer 80' on the surface of each of the aforementioned multiple micro-component fixing locations 70' through the aforementioned one or multiple bonding pads (not shown) on the aforementioned bonding surface 35A, each of the aforementioned multiple micro-components 35 is separated from each of the aforementioned multiple micro-component alignment areas 125, and then is respectively fixed to each of the aforementioned multiple micro-component fixing locations 70' on the aforementioned fifth surface 60A of the aforementioned target carrier 60, thereby completing the process of transferring the aforementioned multiple micro-components 35 from the aforementioned temporary carrier 20 to the aforementioned target carrier 60.

[0289] The aforementioned heat treatment may be performed under the condition that the aforementioned first magnet 110 and / or the aforementioned second magnet 115 continuously provide a magnetic field or interrupt the provision of a magnetic field. In addition, according to other embodiments of the present invention, a cooling treatment may be performed after the aforementioned heat treatment as needed to make the aforementioned or the aforementioned plurality of bonding pads (not shown) and the aforementioned conductive bonding layer 80' more firmly bonded.

[0290] Since each of the aforementioned multiple micro-components 35 located on the temporary carrier 20 can be adsorbed by the aforementioned magnetic attraction positioning holes 250 in one of the aforementioned multiple micro-component alignment areas 125 facing it through the aforementioned magnetic attraction layer 50 located on the aforementioned magnetic attraction surface 35B, and then transferred to the aforementioned multiple micro-component fixing locations 70' located on the target carrier 60 and aligned with the aforementioned multiple micro-component alignment areas 125, respectively, the purpose of automatic alignment and rapid mass transfer can be achieved.

[0291] Although the second surface 120B of the first magnetic plate 120 of the micro-component transfer device 100-800 disclosed in the aforementioned embodiments 1 to 8 is illustrated as having a plurality of micro-component alignment areas 125 spaced apart from each other, the micro-component alignment area 125 of the second surface 120B of the first magnetic plate 120 of the micro-component transfer device 100-800 disclosed in the aforementioned embodiments 1 to 8 may be adjusted to have only one micro-component alignment area 125 as needed, and the micro-component alignment area 125 includes one or more magnetic heads 150 protruding from the second surface 120B or includes one or more magnetic positioning holes 250 exposing the second surface 120B of the first magnetic plate 120 in the aforementioned insulating layer 130, so as to transfer a single micro-component 30 from the temporary carrier 20 to the target carrier 60. For example, when a NG micro-component 30 appears on the target carrier 60, the NG micro-component 30 can be firstly peeled off from the micro-component fixing portion 70 located on the fifth surface 60A of the target carrier 60 by means of laser or the like, so that the conductive bonding layer 80 of the micro-component fixing portion 70 where the NG micro-component 30 is located is exposed, and then the micro-component transfer device 100-800 having only one micro-component alignment area 125 on the second surface 120B of the first magnetic suction plate 120 is used to adsorb a normal micro-component 30 on the temporary carrier 20 by the same process disclosed in the first to eighth embodiments, and then the normal micro-component 30 is transferred to the micro-component fixing portion 70 where the NG micro-component 30 was originally located on the target carrier 60, and bonded to the conductive bonding layer 80 exposed at the aforementioned location, thereby completing the purpose of repair.

[0292] Although the second surface 120B of the first magnetic plate 120 of the micro-component transfer device 900-1600 disclosed in the aforementioned embodiments 9 to 16 is illustrated as having a plurality of mutually spaced micro-component alignment areas 125', the micro-component alignment area 125' of the second surface 120B of the first magnetic plate 120 of the micro-component transfer device 900-1600 disclosed in the aforementioned embodiments 9 to 16 can be adjusted to have only one micro-component alignment area 125' as needed, and the micro-component alignment area 125 includes one or more magnetic heads 150 protruding from the second surface 120B or includes one or more magnetic positioning holes 250 exposing the second surface 120B of the first magnetic plate 120 in the aforementioned insulating layer 130, so as to transfer a single micro-component 35 from the temporary carrier 20 to the target carrier 60. For example, when a NG micro-component 30 appears on the target carrier 60, the NG micro-component 35 can be firstly peeled off from the micro-component fixing portion 70' located on the fifth surface 60A of the target carrier 60 by means of laser or the like, so that the conductive bonding layer 80' at the micro-component fixing portion 70' where the NG micro-component 35 is located is exposed, and then the micro-component transfer device 100-400, 900-1200 having only one micro-component alignment area 125 on the second surface 120B of the first magnetic suction plate 120 is used to adsorb a normal micro-component 35 on the temporary carrier 20 by the same process disclosed in the ninth to sixteenth embodiments, and then the normal micro-component 35 is transferred to the micro-component fixing portion 70' where the NG micro-component 35 was originally located on the target carrier 60, and bonded to the conductive bonding layer 80' exposed at the aforementioned location, thereby completing the purpose of repair.

[0293] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the appended claims.

Claims

1. A micro-component transfer device, characterized in that: include: A first magnet having a first end and a second end opposite to each other; a first magnetic plate disposed below the first magnet, the first magnetic plate having a first surface and a second surface opposite to each other, wherein the first surface of the first magnetic plate is connected to the first end of the first magnet, and the second surface of the first magnetic plate further has one or more micro-component alignment areas, and each of the micro-component alignment areas includes one or more magnetic heads protruding from the second surface; and An insulating layer covers the first magnetic plate and allows the magnetic head portion in the alignment area of ​​each micro-component to be exposed from the surface of the insulating layer.

2. The micromodule transfer device according to claim 1, characterized in that: The insulating layer further includes a magnetic barrier layer formed at a distance d adjacent to the second surface of the first magnetic attraction plate, where d>0, and the magnetic barrier layer surrounds the magnetic attraction head in each of the micro-component alignment areas.

3. The micromodule transfer device according to claim 1, wherein: It also includes a second magnet and a second magnetic attraction plate, the second magnet has a third end and a fourth end opposite to each other, the second magnetic attraction plate is connected to the third end of the second magnet, and the second magnetic attraction plate is arranged below the first magnetic attraction plate.

4. The micromodule transfer device according to claim 2, characterized in that: It also includes a second magnet and a second magnetic attraction plate, the second magnet has a third end and a fourth end opposite to each other, the second magnetic attraction plate is connected to the third end of the second magnet, and the second magnetic attraction plate is arranged below the first magnetic attraction plate.

5. A micro-component transfer method, characterized in that: The steps include: Providing a micromodule transfer device as claimed in any one of claims 1 to 4; A temporary carrier is provided, wherein the temporary carrier has a third surface and a fourth surface opposite to each other, wherein the third surface is formed with one or more micro-components, wherein the micro-components include a bonding surface and a magnetic attraction surface opposite to each other, wherein the bonding surface includes one or more bonding pads, and the magnetic attraction surface includes one or more magnetic attraction layers, and each of the micro-components is placed on the third surface of the temporary carrier via the bonding surface of each of the micro-components; A target carrier is provided, wherein the target carrier has a fifth surface and a sixth surface opposite to each other, the fifth surface includes one or more micro-component fixing places, and a conductive bonding layer is formed on the surface of each micro-component fixing place; The temporary carrier is moved into the micro-component transfer device, so that the temporary carrier is located below the first magnetic plate, the third surface of the temporary carrier faces the second surface of the first magnetic plate, and the magnetic layer located on the magnetic surface of each micro-component faces the micro-component alignment area; Controlling the magnetic strength of the first magnet of the micro-component transfer device so that each of the micro-components can be attracted by the magnetic attraction head in one of the micro-component alignment regions facing the micro-component through the magnetic attraction layer located on the magnetic attraction surface, thereby being separated from the third surface of the temporary carrier; The temporary carrier is moved out of the micro-component transfer device, and the target carrier is moved into the micro-component transfer device, so that the target carrier is located below the first magnetic plate and the fifth surface of the target carrier faces the second surface of the first magnetic plate, and each of the micro-component fixing positions on the fifth surface of the target carrier is aligned with each of the micro-component alignment regions on the second surface of the first magnetic plate; docking the first magnetic attraction plate with the target carrier, and making each of the micro-components attracted by each of the micro-component alignment regions contact the conductive bonding layer on the surface of each of the micro-component fixing locations on the fifth surface of the target carrier through the bonding pads on the bonding surface; and A heat treatment is applied so that each of the aforementioned microcomponents is bonded to the aforementioned conductive bonding layer on the surface of each aforementioned microcomponent fixing location via the aforementioned bonding pad on the aforementioned bonding surface, and then detached from each aforementioned microcomponent alignment area and respectively fixed to each aforementioned microcomponent fixing location on the aforementioned fifth surface of the aforementioned target carrier, thereby completing the process of transferring the aforementioned microcomponent from the aforementioned temporary carrier to the aforementioned target carrier.

6. The micromodule transfer method according to claim 5, characterized in that: Before the step of moving the temporary carrier into the micro-component transfer device, a peeling step is further included to peel the micro-component off the third surface of the temporary carrier.

7. The micromodule transfer method according to claim 6, wherein: The aforementioned stripping step is laser stripping or ultraviolet light stripping.

8. The micromodule transfer method according to claim 5, characterized in that: When the micro-component transfer device as described in claim 3 or 4 is used to transfer the micro-component, by controlling the distance between the temporary carrier and the first magnetic attraction plate, and / or by coating the second magnetic attraction plate with a magnetic-resistance material, the micro-component on the temporary carrier feels that the magnetic force from the first magnetic attraction plate is greater than the magnetic force from the second magnetic attraction plate.

9. A micromodule transfer device, characterized in that: include: A first magnet having a first end and a second end opposite to each other; a first magnetic attraction plate disposed below the first magnet, the first magnetic attraction plate having a first surface and a second surface opposite to each other, wherein the first surface of the first magnetic attraction plate is connected to the first end of the first magnet, and the second surface of the first magnetic attraction plate further has one or more micro-component alignment areas; and An insulating layer covers the first magnetic plate, and the insulating layer in each of the micro-component alignment areas adjacent to the second surface of the first magnetic plate further includes one or more magnetic positioning holes exposing the second surface of the first magnetic plate.

10. The micromodule transfer device according to claim 9, wherein: It also includes a magnetic barrier layer formed on the second surface adjacent to the first magnetic plate and at a distance d, d>0, and the magnetic barrier layer surrounds the magnetic positioning holes in each of the micro-component alignment areas.

11. The micromodule transfer device according to claim 9, wherein: It also includes a second magnet and a second magnetic attraction plate. The second magnet has a third end and a fourth end opposite to each other. The second magnetic attraction plate is connected to the third end of the second magnet, and the second magnetic attraction plate is arranged below the first magnetic attraction plate.

12. The micromodule transfer device according to claim 10, wherein: It also includes a second magnet and a second magnetic attraction plate. The second magnet has a third end and a fourth end opposite to each other. The second magnetic attraction plate is connected to the third end of the second magnet, and the second magnetic attraction plate is arranged below the first magnetic attraction plate.

13. A micro-component transfer method, characterized in that: The steps include: Providing a micromodule transfer device as claimed in any one of claims 9 to 12; A temporary carrier is provided, wherein the temporary carrier has a third surface and a fourth surface opposite to each other, wherein the third surface is formed with one or more micro-components, wherein the micro-components include a bonding surface and a magnetic attraction surface opposite to each other, wherein the bonding surface includes one or more bonding pads, and the magnetic attraction surface includes one or more magnetic attraction layers, and each of the micro-components is placed on the third surface of the temporary carrier via the bonding surface of each of the micro-components; A target carrier is provided, wherein the target carrier has a fifth surface and a sixth surface opposite to each other, the fifth surface includes one or more micro-component fixing places, and a conductive bonding layer is formed on the surface of each micro-component fixing place; The temporary carrier is moved into the micro-component transfer device, so that the temporary carrier is located below the first magnetic plate, the third surface of the temporary carrier faces the second surface of the first magnetic plate, and the magnetic layer located on the magnetic surface of each micro-component faces the micro-component alignment area; Controlling the magnetic strength of the first magnet of the micro-component transfer device so that each of the micro-components can be attracted by the magnetic attraction positioning holes in one of the micro-component alignment regions facing the micro-components through the magnetic attraction layer located on the magnetic attraction surface, thereby being separated from the third surface of the temporary carrier; The temporary carrier is moved out of the micro-component transfer device, and the target carrier is moved into the micro-component transfer device, so that the target carrier is located below the first magnetic plate and the fifth surface of the target carrier faces the second surface of the first magnetic plate, and each of the micro-component fixing positions on the fifth surface of the target carrier is aligned with each of the micro-component alignment regions on the second surface of the first magnetic plate; docking the first magnetic attraction plate with the target carrier, and making each of the micro-components attracted by each of the micro-component alignment regions contact the conductive bonding layer on the surface of each of the micro-component fixing locations on the fifth surface of the target carrier through the bonding pads on the bonding surface; and A heat treatment is applied so that each of the aforementioned microcomponents is bonded to the aforementioned conductive bonding layer on the surface of each aforementioned microcomponent fixing location via the aforementioned bonding pad on the aforementioned bonding surface, and then detached from each aforementioned microcomponent alignment area and respectively fixed to each aforementioned microcomponent fixing location on the aforementioned fifth surface of the aforementioned target carrier, thereby completing the process of transferring the aforementioned microcomponent from the aforementioned temporary carrier to the aforementioned target carrier.

14. The micromodule transfer method according to claim 13, wherein: Before the step of moving the temporary carrier into the micro-component transfer device, a peeling step is also included to peel the micro-component off the third surface of the temporary carrier.

15. The micromodule transfer method according to claim 14, wherein: The aforementioned stripping step is laser stripping or ultraviolet light stripping.

16. The micromodule transfer method according to claim 14, wherein: When the micro-component transfer device as described in claim 11 or 12 is used to transfer the micro-component, by controlling the distance between the temporary carrier and the first magnetic attraction plate, and / or by coating the second magnetic attraction plate with a magnetic-resistance material, the micro-component on the temporary carrier feels that the magnetic force from the first magnetic attraction plate is greater than the magnetic force from the second magnetic attraction plate.

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