Dynamic correction method for chip appearance, electronic device and readable storage medium

Abstract

The present invention provides a method for dynamically correcting the appearance of a chip, an electronic device, and a readable storage medium. The method includes: for the same wafer, continuously capturing a plurality of grayscale images, with a plurality of die distributed on the wafer; obtaining at least one image from the continuously captured plurality of grayscale images and processing it to form a calibration image; starting from the center of the calibration image and uniformly expanding outward to obtain a calibration region; obtaining a calibration value corresponding to each calibration position according to the grayscale values of the pixel points in the calibration region; using the calibration value to inspect each die and / or a predetermined region of each die, and determining whether the currently detected die is a defective product according to the result. Corresponding to each detected die, the present invention needs to sequentially extract a calibration image, select a calibration region, and form an independent calibration value for each wafer case; and use the calibration value to control the quality of the die, improving the control accuracy of the die quality.

Description

Technical Field

[0001] The present invention relates to the field of medical device imaging, and particularly to a method for dynamically correcting the appearance of a chip, an electronic device, and a readable storage medium. Background Art

[0002] During the wafer packaging manufacturing process, due to scratches, manufacturing processes, etc., the thickness fluctuations of coatings such as PV or ITO will occur, resulting in some chips on the wafer being defective products.

[0003] In order to prevent defective products from entering the market, in the prior art, a gray-scale control method is adopted to detect the appearance of chips, and then to distinguish which part of the chips on the wafer are defective products for further rejection.

[0004] In the prior art, for the appearance inspection of chips, it is usually controlled by the boundary method. Specifically, the grains on all wafers are partitioned. The basis for partitioning is, for example, the categories of components on the grains, such as electrodes, light-emitting areas, and scribe lanes; a fixed gray-scale control value is set for each partition. When it is confirmed that the gray scale of any partition is lower than the corresponding gray-scale control value, the chip is determined to be a defective product; this appearance inspection method is simple, but the gray scales of each partition of the chips often cannot reach the same level due to manufacturing or process influences. In this way, the gray-scale differences between chips are too large. Using the same gray-scale value to control different grains on different wafers, when the parameters are too strict, the grains with low gray scales will be over-killed; when the parameters are too loose, the color difference cannot be effectively controlled. Summary of the Invention

[0005] In order to solve the above technical problems, the purpose of the present invention is to provide a method for dynamically correcting the appearance of a chip, an electronic device, and a readable storage medium.

[0006] In order to achieve one of the above invention purposes, an embodiment of the present invention provides a method for dynamically correcting the appearance of a chip, the method including: for the same wafer, continuously taking multiple gray-scale images, and a plurality of grains are distributed on the wafer;

[0007] Obtaining at least one image from the continuously taken multiple gray-scale images and processing it to form a calibration image;

[0008] Uniformly expanding outward from the center of the calibration image to obtain a calibration area, the calibration area being a partition equivalent to a preset area, and / or a partition equivalent to a preset number of grains, and / or a partition of a predetermined pattern with a predetermined size; the area of the calibration area is smaller than the area of the calibration image and / or the number of grains included in the calibration area is smaller than the number of grains included in the wafer;

[0009] Obtain a verification value corresponding to each verification position according to the gray values of the pixel points in the verification area; the verification position is any single grain and / or any part on any single grain; the verification value is the controlled gray value corresponding to the verification position.

[0010] Use the verification value to verify each grain and / or a predetermined area of each grain, and confirm whether the currently detected grain is a defective product according to the result.

[0011] As a further improvement of an embodiment of the present invention, the method includes: setting the number of continuously captured gray images according to the size of the wafer.

[0012] As a further improvement of an embodiment of the present invention, "obtain at least one image from a plurality of continuously captured gray images and process it to form a verification image" specifically includes:

[0013] Obtain at least one image from the image at the middle position of a plurality of continuously captured gray images and process it to form a verification image.

[0014] As a further improvement of an embodiment of the present invention, the method further includes: the number of continuously captured images is an odd number;

[0015] "Obtain at least one image from a plurality of continuously captured gray images and process it to form a verification image" specifically includes: obtain 1 image at the middle position of a plurality of continuously captured gray images and directly use it as the verification image.

[0016] As a further improvement of an embodiment of the present invention, before uniformly expanding outward from the center of the verification image to obtain the verification area, the method further includes:

[0017] If the number of images obtained from a plurality of continuously captured gray images is 2 or more, use the image formed by taking the average value of the obtained images as the verification image.

[0018] As a further improvement of an embodiment of the present invention, the method further includes: setting the verification area as a circular area with the center of the verification image as the center and a preset radius r.

[0019] As a further improvement of an embodiment of the present invention, "obtain a verification value corresponding to each verification position according to the gray values of the pixel points in the verification area, and the verification position is any single grain" includes:

[0020] Calculate at least one of the gray average value, median value, and weighted average value of all grains in the verification area as the verification value;

[0021] "Inspecting each grain with the verification value and confirming whether the currently detected grain is a defective product according to the result" includes:

[0022] Obtaining any grain to be inspected, and determining whether the actual gray value of the grain to be inspected is within the verification interval, where the actual gray value is at least one of the average value, median value, and weighted average value of the same category as the verification value; the verification interval is (X1 - Y1, X1 + Y1), X1 represents the verification value, and Y1 is a constant;

[0023] If so, confirm that the current grain is a good product;

[0024] If not, confirm that the current grain is a defective product.

[0025] As a further improvement of an embodiment of the present invention, "obtaining the verification value corresponding to each verification position according to the gray values of the pixel points in the verification area, where the verification position is any part on any single grain" includes:

[0026] Dividing each grain into multiple verification sub - areas according to the verification position;

[0027] Calculating at least one of the gray average value, median value, and weighted average value of all the grains in the verification area and all the verification sub - areas with the same part to be the verification value of the current part of any grain;

[0028] "Inspecting a predetermined area of each grain with the verification value and confirming whether the currently detected grain is a defective product according to the result" includes:

[0029] Obtaining the part to be inspected of any grain to be inspected, and determining whether the actual gray value of the part to be inspected of the grain to be inspected is within the corresponding verification interval, where the actual gray value is at least one of the average value, median value, and weighted average value of the same category as the verification value; the verification interval is (X2 - Y2, X2 + Y2), X2 represents the verification value corresponding to the part to be inspected, and Y2 is a constant;

[0030] If so, confirm that the part to be inspected of the current grain to be inspected is qualified;

[0031] If not, confirm that the part to be inspected of the current grain to be inspected is unqualified;

[0032] Confirm whether the grain to be inspected is a good product according to the part to be inspected of the grain to be inspected.

[0033] As a further improvement of an embodiment of the present invention, "confirming whether the grain to be inspected is a good product according to the part to be inspected of the grain to be inspected" includes:

[0034] If the proportion of all parts to be inspected of the currently inspected crystal grain that are qualified is greater than the preset proportion threshold, and / or a preset specific part to be inspected is qualified, then confirm that the current crystal grain is a good product;

[0035] If the proportion of all parts to be inspected of the currently inspected crystal grain that are qualified is not greater than the preset proportion threshold, and / or a preset specific part to be inspected is unqualified, then confirm that the current crystal grain is a defective product.

[0036] To achieve one of the above-mentioned invention purposes, an embodiment of the present invention provides an electronic device, including a memory and a processor. The memory stores a computer program that can run on the processor, and when the processor executes the program, it implements the steps in the dynamic correction method of the chip appearance as described above.

[0037] To achieve one of the above-mentioned invention purposes, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements the steps in the dynamic correction method of the chip appearance as described above.

[0038] Compared with the prior art, the beneficial effects of the present invention are as follows: For the dynamic correction method of the chip appearance, the electronic device, and the readable storage medium of the present invention, for each detected crystal grain, it is necessary to sequentially extract the calibration image. After the calibration area is selected, an independent calibration value is formed for each wafer case; and the goodness of the crystal grain is controlled by this calibration value, improving the control accuracy of the goodness of the crystal grain. Description of the Drawings

[0039] Figure 1 is a schematic flowchart of the dynamic correction method of the chip appearance provided by an embodiment of the present invention;

[0040] Figure 2 、 Figure 3 respectively are Figure 1 schematic flowcharts of the preferred embodiments of the dynamic correction method of the chip appearance. Detailed Embodiments

[0041] The present invention will be described in detail below in conjunction with the specific embodiments shown in the drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional transformation made by those of ordinary skill in the art based on these embodiments is included in the protection scope of the present invention.

[0042] As Figure 1 shown, in the first embodiment of the present invention, a dynamic correction method of the chip appearance is provided, and the method includes:

[0043] S1. For the same wafer, continuously capture multiple grayscale images, and several crystal grains are distributed on the wafer;

[0044] S2. Obtain at least one image from multiple consecutively captured grayscale images, and process it to form a verification image;

[0045] S3. Uniformly expand outward from the center of the verification image to obtain a verification area, where the verification area is a partition equal to a preset area, and / or a partition equal to a preset number of grains, and / or a partition of a predetermined pattern with a predetermined size. The area of the verification area is smaller than the area of the verification image and / or the number of grains included in the verification area is smaller than the number of grains included in the wafer;

[0046] S4. Obtain a verification value corresponding to each verification position according to the grayscale values of the pixel points in the verification area; the verification position is any single grain and / or any part on any single grain; the verification value is the controlled grayscale value corresponding to the verification position;

[0047] S5. Use the verification value to inspect each grain and / or a predetermined area of each grain, and confirm whether the currently detected grain is a defective product according to the result.

[0048] For step S1, for the same wafer, there is no specific limit on the number of consecutively captured grayscale images, and the number can be specifically specified according to requirements.

[0049] In a preferred embodiment of the present invention, the number of consecutively captured grayscale images is set according to the size of the wafer; for example: if the wafer is circular and its diameter size is 4 inches, the number of consecutively captured grayscale images can be set to 255. When the diameter size of the wafer is 2 inches, the number of consecutively captured grayscale images can be correspondingly reduced based on 255; in addition, the outer frame size of the wafer changes according to the selected substrate, and the substrate is usually rectangular, circular, etc., which will not be further elaborated here.

[0050] For step S2, in an implementable manner of the present invention, the number of images used to form the verification image can be custom-specified, and it can be one of the consecutively captured grayscale images or multiple images.

[0051] The position where the grayscale image is obtained can be any position in the consecutively captured images, such as: the grayscale image with a relatively early shooting sequence number, the shooting image near the middle, the grayscale image at the back; when the number of obtained grayscale images is two or more, the multiple grayscale images can be obtained sequentially, at intervals, or according to a certain rule.

[0052] In a preferred embodiment of the present invention, affected by the parameters of the device for capturing grayscale images, such as the image exposure time and the sensor gain, according to the shooting order, the image at the intermediate time position is more likely to reflect the true appearance of the wafer. Thus, for step S2, at least one image is obtained from the image at the intermediate position among multiple continuously captured grayscale images and processed to form a calibration image, thereby improving the calculation accuracy.

[0053] Preferably, for step S1, the number of continuously captured images is odd; for step S2, 1 image at the intermediate position among multiple continuously captured grayscale images is obtained and directly used as the calibration image.

[0054] Correspondingly, for step S2, if the number of images obtained from multiple continuously captured grayscale images is 2 or more, the image formed by taking the average of the obtained images is used as the calibration image.

[0055] It can be understood that taking the average of the obtained images means taking the average of the grayscale values of multiple images. When there are multiple images of the same size, taking the average of the grayscale values of these multiple images to form an image is a prior art, so the specific implementation process of this step will not be described in detail.

[0056] Preferably, in an embodiment of the present invention, for step S3, the calibration region is set as a circular region with the center of the calibration image as the center and a preset radius r.

[0057] In a specific example of the present invention, the wafer is circular, then the preset radius r is less than the radius of the wafer shown in the calibration image. Correspondingly, after the calibration image is determined, a circular region is demarcated with the center of the calibration image as the center and the preset radius r as the radius, and this circular region is the calibration region.

[0058] In the first preferred embodiment of the present invention, it is possible to indirectly determine whether any to-be-inspected grain is a good product through the grayscale value of each grain in the calibration region of the wafer.

[0059] Combined with Figure 2 As shown, specifically, in this specific embodiment, for step S4, the calibration position is any single grain. Correspondingly, at least one of the grayscale average value, median value, and weighted average value of all grains in the calibration region is calculated as the calibration value.

[0060] Further, for step S5, in this specific implementation, any grain to be inspected is obtained, and it is determined whether the actual gray value of the grain to be inspected is within the calibration interval. The actual gray value is at least one of the average value, median value, and weighted average value of the same category as the calibration value. The calibration interval is (X1 - Y1, X1 + Y1), where X1 represents the calibration value and Y1 is a constant. If so, the current grain is confirmed as a good product; if not, the current grain is confirmed as a defective product.

[0061] Preferably, the value of Y1 can be set according to the color tolerance between the middle part and the edge part of a single grain with excellent performance under normal circumstances.

[0062] In the first preferred embodiment of the present invention, it is possible to determine whether the corresponding part of any grain to be inspected is qualified by the gray value of the selected part of each grain in the calibration area of the wafer. Further, it is indirectly determined whether any grain to be inspected is a good product by whether the corresponding part of the grain to be inspected is qualified.

[0063] Combined Figure 3 As shown, in this specific implementation, for step S4, the calibration position is any part on any single grain. Correspondingly, each grain is divided into multiple calibration sub - areas according to the calibration position.

[0064] The gray average value, median value, and weighted average value of at least one of all the grains in the calibration area and all the calibration sub - areas with the same part are calculated as the calibration value of the current part of any grain.

[0065] Further, for step S5, in this specific implementation, the part to be inspected of any grain to be inspected is obtained, and it is determined whether the actual gray value of the part to be inspected of the grain to be inspected is within the corresponding calibration interval. The actual gray value is at least one of the average value, median value, and weighted average value of the same category as the calibration value. The calibration interval is (X2 - Y2, X2 + Y2), where X2 represents the calibration value corresponding to the part to be inspected and Y2 is a constant. If so, the part to be inspected of the current grain to be inspected is confirmed as qualified; if not, the part to be inspected of the current grain to be inspected is confirmed as unqualified.

[0066] Further, step S5 further includes: determining whether the grain to be inspected is a good product according to the part to be inspected of the grain to be inspected.

[0067] Preferably, in this second preferred embodiment, the value of Y2 can also be set according to the color tolerance between the middle part and the edge part of a single grain with excellent performance under normal circumstances.

[0068] Any part on any single grain forming the calibration position can usually be specifically delimited according to the category of the part. For example: electrodes, light-emitting regions, scribe lanes, etc.; in this specific example, each category on each grain forms a calibration sub-region, and the gray values of the calibration sub-regions of the same category on all grains within the calibration region of the wafer are used to calculate the calibration value corresponding to the category.

[0069] For example: There are 100 grains distributed in the calibration area of the wafer, and one of the calibration sub-regions on the grains is the scribe lane. Then, the number of calibration sub-regions is also 100. The dynamic calibration value corresponding to the scribe lane can be calculated through the gray values of these 100 calibration sub-regions of the category of scribe lanes; further, when the scribe lane of a certain grain on the entire wafer needs to be visually inspected, the dynamic calibration value can be used to accurately calibrate whether the scribe lane is qualified.

[0070] In the implementation manner of the present invention, "confirming whether the to-be-inspected particle is a good product according to the to-be-inspected part of the to-be-inspected grain" includes:

[0071] If the proportion of all to-be-inspected parts of the current to-be-inspected grain that are qualified is greater than the preset proportion threshold, and / or a preset specific to-be-inspected part is qualified, then confirm that the current grain is a good product;

[0072] If the proportion of all to-be-inspected parts of the current to-be-inspected grain that are qualified is not greater than the preset proportion threshold, and / or a preset specific to-be-inspected part is unqualified, then confirm that the current grain is a defective product.

[0073] The preset proportion threshold is a set percentage constant value, and its size can be specifically set according to needs.

[0074] In a specific example of the present invention, when using the qualified proportion to confirm whether a grain is a good product, for example: the number of to-be-inspected parts of a single grain is set to 4, and the preset proportion threshold is set to 50%; for the corresponding to-be-inspected grain, if 3 of the to-be-inspected parts are determined to be qualified, then its qualified proportion is 75%, which is greater than the preset proportion threshold of 50%. At this time, it can be determined that the current grain is a good product; if only 2 of the to-be-inspected parts are determined to be qualified, then its qualified proportion is 50%, which is equal to the preset proportion threshold of 50%. At this time, it can be determined that the current grain is a defective product.

[0075] In another specific example of the present invention, for example: setting that if one of the parts on the grain, such as the electrode, is unqualified, it is determined to be a defective product, or setting that if one of the parts on the grain, such as the electrode, is qualified, it is determined to be a good product, and no further elaboration is made here.

[0076] Further, after step S5, the method further includes: outputting parameters on the wafer, where the parameters include: the serial number and / or position of qualified grains, the serial number and / or position of unqualified grains, and whether a certain part on the grain is qualified and / or unqualified; the parameters can be stored and output in the form of a list for subsequent calls, and no further elaboration is provided here.

[0077] Further, an embodiment of the present invention provides an electronic device, including a memory and a processor, where the memory stores a computer program that can run on the processor, and when the processor executes the program, it implements the steps in the method for dynamic correction of the chip appearance as described above.

[0078] Further, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps in the method for dynamic correction of the chip appearance as described above.

[0079] In summary, when the grayscale difference between different wafers is large due to manufacturing processes and materials, for the method for dynamic correction of the chip appearance, the electronic device, and the readable storage medium of the present invention, for each detected grain, it is necessary to sequentially extract the calibration image, select the calibration area, and then form an independent calibration value for each wafer case; and use this calibration value to control the quality of the grains. In this way, the problem of over-killing of grains caused by using the same calibration parameter for different wafers can be solved, and further, the color difference of a single wafer can be effectively controlled, and the control accuracy of the grain quality can be improved.

[0080] It should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0081] The series of detailed descriptions listed above are only specific descriptions of the feasible embodiments of the present invention, and they are not used to limit the protection scope of the present invention. Any equivalent embodiments or changes made without departing from the technical spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A dynamic correction method for the appearance of a chip, characterized in that, The method includes: For the same wafer, continuously taking multiple grayscale images, with a number of grains distributed on the wafer; Obtaining at least one image from the multiple continuously taken grayscale images and processing it to form a verification image; Uniformly expanding outward from the center of the verification image to obtain a verification area, where the verification area is a partition equal to a preset area, and / or a partition equal to a preset number of grains, and / or a partition with a predetermined pattern of a predetermined size; the area of the verification area is smaller than the area of the verification image and / or the number of grains included in the verification area is smaller than the number of grains included in the wafer; Obtaining a verification value corresponding to each verification position according to the grayscale values of the pixel points in the verification area; the verification position is any single grain and / or any part on any single grain; the verification value is the controlled grayscale value corresponding to the verification position; Using the verification value to inspect each grain and / or a predetermined area of each grain, and confirming whether the currently detected grain is a defective product according to the result.

2. The dynamic correction method for the appearance of a chip according to claim 1, wherein The method includes: setting the number of continuously taken grayscale images according to the size of the wafer.

3. The dynamic correction method for the appearance of a chip according to claim 1, wherein "Obtaining at least one image from the multiple continuously taken grayscale images and processing it to form a verification image" specifically includes: Obtaining at least one image from the image at the middle position among the multiple continuously taken grayscale images and processing it to form a verification image.

4. The dynamic correction method for the appearance of the chip according to claim 3, characterized in that, The method further includes: the number of continuously taken images is odd; "Obtaining at least one image from the multiple continuously taken grayscale images and processing it to form a verification image" specifically includes: obtaining 1 image at the middle position among the multiple continuously taken grayscale images and directly using it as the verification image.

5. The dynamic correction method for the appearance of a chip according to claim 1, characterized in that, Before uniformly expanding outward from the center of the verification image to obtain the verification area, the method further includes: If the number of images obtained from the multiple continuously taken grayscale images is 2 or more, taking the average value of the obtained images to form an image as the verification image.

6. The dynamic correction method for the appearance of a chip according to claim 1, wherein The method further includes: setting the verification area as a circular area with the center of the verification image as the center and a preset radius r.

7. The dynamic correction method for the appearance of a chip according to claim 1, wherein "Obtaining a verification value corresponding to each verification position according to the grayscale values of the pixel points in the verification area, where the verification position is any single grain" includes: Calculating at least one of the grayscale average value, median value, and weighted average value of all grains in the verification area as the verification value; "Using the verification value to inspect each grain and confirming whether the currently detected grain is a defective product according to the result" includes: Obtaining any grain to be inspected, and judging whether the actual grayscale value of the grain to be inspected is within the verification interval, where the actual grayscale value is at least one of the average value, median value, and weighted average value of the same type as the verification value; the verification interval is (X1 - Y1, X1 + Y1), X1 represents the verification value, and Y1 is a constant; If so, confirming that the current grain is a good product; If not, confirming that the current grain is a defective product.

8. The dynamic correction method for the appearance of a chip according to claim 1, wherein "Obtaining a verification value corresponding to each verification position according to the grayscale values of the pixel points in the verification area, where the verification position is any part on any single grain" includes: Each grain is divided into a plurality of check sub - regions according to the check positions; Calculate at least one of the gray - scale average value, median value, and weighted average value of all grains in the check region and all check sub - regions with the same part as the check value of the current part of any grain; "Inspect a predetermined region of each grain with the check value and confirm whether the currently detected grain is a defective product according to the result" includes: Obtain the part to be inspected of any grain to be inspected, and determine whether the actual gray - scale value of the part to be inspected of the grain to be inspected is within the corresponding check interval. The actual gray - scale value is at least one of the average value, median value, and weighted average value of the same category as the check value; the check interval is (X2 - Y2, X2+Y2), where X2 represents the check value corresponding to the part to be inspected and Y2 is a constant; If so, confirm that the part to be inspected of the currently inspected grain is qualified; If not, confirm that the part to be inspected of the currently inspected grain is unqualified; Confirm whether the grain to be inspected is a good product according to the part to be inspected of the grain to be inspected.

9. The dynamic correction method for the appearance of the chip according to claim 8, wherein "Confirm whether the grain to be inspected is a good product according to the part to be inspected of the grain to be inspected" includes: If the proportion of all parts to be inspected of the currently inspected grain that are qualified is greater than a preset proportion threshold, and / or a preset specific part to be inspected is qualified, then confirm that the current grain is a good product; If the proportion of all parts to be inspected of the currently inspected grain that are qualified is not greater than a preset proportion threshold, and / or a preset specific part to be inspected is unqualified, then confirm that the current grain is a defective product.

10. An electronic device, comprising a memory and a processor, the memory storing a computer program that can run on the processor, characterized in that, When the processor executes the program, it implements the steps in the dynamic correction method for the appearance of the chip described in any one of claims 1 - 9.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps in the dynamic correction method for the appearance of the chip described in any one of claims 1 - 9.

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