Display panel, method for manufacturing display panel, and display device

Abstract

The application provides a display panel, a preparation method of the display panel and a display device. The display panel is used for binding connection with a driving chip. The display panel comprises a binding area. The display panel comprises a substrate, an organic layer and a plurality of conductive parts which are stacked on the substrate in the binding area. The plurality of conductive parts are arranged at a side of the organic layer away from the substrate. The organic layer has a avoiding opening. The orthographic projection of the conductive part on the organic layer coincides with at least part of the avoiding opening. The organic layer in the avoiding opening is removed, so that the organic layer under the conductive part is reduced, thereby reducing the deformation degree of the organic layer in the binding process. Therefore, the display panel, the preparation method of the display panel and the display device provided by the application can improve the binding effect of the display panel and the driving chip, thereby ensuring the display effect of the display panel and the display device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, in particular to a display panel, a preparation method of the display panel and a display device. BACKGROUND

[0002] Organic light-emitting diode (OLED) has the characteristics of active light-emitting, high contrast, ultra-thin, low temperature resistance, fast response speed, low power consumption, wide viewing angle, strong anti-shock ability and the like, and is thus applied more and more.

[0003] In the related art, a display panel includes a display area and a binding area, and the display panel located in the binding area is connected with a driving chip in a binding manner, so as to transmit electrical signals between the driving chip and the display panel.

[0004] However, the display panel described above is prone to poor binding between the driving chip and the display panel, which affects the display effect of the display panel and the display device. SUMMARY

[0005] In view of the above problems, the embodiments of the present application provide a display panel, a preparation method of the display panel and a display device, which can improve the binding effect of the display panel and the driving chip, thereby ensuring the display effect of the display panel and the display device.

[0006] In order to achieve the above-mentioned purpose, the embodiments of the present application provide the following technical solutions:

[0007] The first aspect of the embodiments of the present application provides a display panel for binding connection with a driving chip, the display panel including a binding area, the display panel including a substrate, an organic layer and a plurality of conductive parts being stacked on the substrate located in the binding area, the plurality of conductive parts being arranged at a side of the organic layer away from the substrate.

[0008] The organic layer has a avoiding opening, and a normal projection of the conductive part on the organic layer coincides with at least part of the avoiding opening.

[0009] The display panel provided by the embodiment of the present application can be used in binding connection with a driving chip to realize signal transmission between the display panel and the driving chip. The display panel can include a binding area, which is an area connected with the driving chip. The display panel includes a substrate, an organic layer and a plurality of conductive parts which are arranged in a stack on the substrate in the binding area, and a conductive structure on the driving chip, and the conductive parts are electrically connected with the conductive structure. The plurality of conductive parts are arranged at intervals on a side of the organic layer away from the substrate, and the organic layer has an avoiding opening therein, and the orthographic projection of the conductive part on the organic layer coincides with at least part of the avoiding opening. In this way, the organic layer under the conductive part is removed, so that the deformation of the organic layer is reduced, thereby avoiding the influence of the deformation of the organic layer on the binding effect between the driving chip and the display panel, and improving the binding stability of the two, and ensuring the display effect of the display panel and the display device.

[0010] In a possible implementation, the avoiding opening penetrates the organic layer along the thickness direction of the organic layer.

[0011] In this way, the removed organic layer is more, and the deformation of the organic layer is smaller, which can better ensure the display effect of the display panel and the display device.

[0012] In a possible implementation, the avoiding opening has one, and the orthographic projection of all the conductive parts on the organic layer is located in the avoiding opening.

[0013] In this way, the number of avoiding openings is smaller, and the preparation process is simple.

[0014] In a possible implementation, the avoiding opening has a plurality of, and the number of the plurality of avoiding openings is equal to the number of the plurality of conductive parts, and the orthographic projection of the plurality of conductive parts on the organic layer corresponds to the plurality of avoiding openings one by one.

[0015] The orthographic projection of each conductive part on the organic layer is located in each avoiding opening.

[0016] In this way, the organic layer is reserved between the adjacent two avoiding openings, and the reserved organic layer can protect the film layer thereunder.

[0017] In a possible implementation, the plurality of conductive parts are arranged at intervals along a first direction.

[0018] Along the first direction, the edge of the orthographic projection of the conductive part on the organic layer is located inside the corresponding avoiding opening, and has a spacing between the edge and the edge of the corresponding avoiding opening.

[0019] In this way, along the first direction, the removed organic layer is more, and the deformation of the organic layer is smaller, which can better ensure the display effect of the display panel and the display device.

[0020] In a possible implementation, the display panel includes a display area, and the display area is arranged adjacent to the binding area.

[0021] The first shielding portion is connected to one side of the display area close to the avoiding opening, and at least part of the projection of the conductive portion on the organic layer coincides with the first shielding portion.

[0022] Preferably, the second shielding portion is connected to one side of the display area away from the avoiding opening, and at least part of the projection of the conductive portion on the organic layer coincides with the second shielding portion.

[0023] In this way, the first shielding portion and the second shielding portion can protect the film layer thereunder.

[0024] In a possible implementation, the display panel further includes an array substrate, a first insulating layer, and a touch layer which are sequentially stacked on the substrate, and the touch layer includes a first metal layer, a second insulating layer, and a second metal layer which are sequentially stacked.

[0025] At least one of the first insulating layer and the second insulating layer forms the organic layer, and at least one of the first metal layer and the second metal layer is located in the binding area and forms the conductive portion.

[0026] In a possible implementation, a third metal layer and a third insulating layer are arranged between the array substrate and the first insulating layer, the third insulating layer is located on a side of the third metal layer away from the substrate, and the third insulating layer has a via hole.

[0027] The first metal layer is located in the binding area, the first metal layer is electrically connected to the third metal layer through the via hole, and the first metal layer forms the conductive portion.

[0028] Alternatively, the second metal layer is located in the binding area, the second metal layer is electrically connected to the third metal layer through the via hole, and the second metal layer forms the conductive portion.

[0029] Alternatively, the first metal layer and the second metal layer are both located in the binding area, the first metal layer is electrically connected to the third metal layer through the via hole, the first metal layer and the second metal layer are electrically connected, and the first metal layer and the second metal layer form the conductive portion.

[0030] In this way, the conductive portion and the organic layer can be prepared in various ways to meet different requirements of the binding area.

[0031] A second aspect of the embodiment of the application provides a display panel preparation method, including:

[0032] A substrate is provided, and the substrate includes a binding area.

[0033] An organic layer is formed on the substrate, and an avoiding opening is formed in the organic layer.

[0034] A plurality of conductive parts are formed on a side of the organic layer away from the substrate, the plurality of conductive parts are arranged at intervals on the organic layer, and a projection of the conductive part on the organic layer coincides with at least part of the avoiding opening.

[0035] The preparation method of the display panel provided in the embodiments of the present application can include a binding area, which is an area connected with a driving chip. The display panel includes a substrate, an organic layer and a plurality of conductive parts are arranged in layers on the substrate in the binding area, the driving chip has a conductive structure, and the conductive parts are electrically connected with the conductive structure. The plurality of conductive parts are arranged at intervals on a side of the organic layer away from the substrate, the organic layer has an avoiding opening, and a projection of the conductive part on the organic layer coincides with at least part of the avoiding opening. The organic layer in the avoiding opening is removed, so that the organic layer under the conductive part is reduced, thereby reducing the deformation degree of the organic layer in the binding process. The binding effect between the driving chip and the display panel is improved, thereby reducing the influence of the organic layer on the display effect of the display panel and the display device.

[0036] The third aspect of the embodiments of the present application provides a display device, which includes a driving chip and the display panel in the first aspect.

[0037] The display device provided in the embodiments of the present application includes a display panel, which can include a binding area, which is an area connected with a driving chip. The display panel includes a substrate, an organic layer and a plurality of conductive parts are arranged in layers on the substrate in the binding area, the driving chip has a conductive structure, and the conductive parts are electrically connected with the conductive structure. The plurality of conductive parts are arranged at intervals on a side of the organic layer away from the substrate, the organic layer has an avoiding opening, and a projection of the conductive part on the organic layer coincides with at least part of the avoiding opening. The organic layer in the avoiding opening is removed, so that the organic layer under the conductive part is reduced, thereby reducing the deformation degree of the organic layer in the binding process. The binding effect between the driving chip and the display panel is improved, thereby reducing the influence of the organic layer on the display effect of the display panel and the display device.

[0038] The structure of the present application and other inventive purposes and benefits will be more obvious and easy to understand through the description of the preferred embodiments in conjunction with the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0040] Figure 1A top view of a touch layer in a display panel according to an embodiment of the present application;

[0041] Figure 2 A partial sectional view of a display panel according to an embodiment of the present application;

[0042] Figure 3 A partial sectional view of a binding area without a relief opening;

[0043] Figure 4 A partial sectional view of a binding area with a relief opening according to an embodiment of the present application;

[0044] Figure 5 A top view of a relief opening and a conductive part according to an embodiment of the present application;

[0045] Figure 6 A top view of another relief opening and a conductive part according to an embodiment of the present application;

[0046] Figure 7 A top view of another relief opening and a conductive part according to an embodiment of the present application;

[0047] Figure 8 A structural schematic diagram of a first shielding part and a second shielding part according to an embodiment of the present application;

[0048] Figure 9 A top view of another relief opening and a conductive part according to an embodiment of the present application;

[0049] Figure 10 A top view of another relief opening and a conductive part according to an embodiment of the present application;

[0050] Figure 11 An enlarged structural schematic diagram of a relief opening according to an embodiment of the present application;

[0051] Figure 12 A partial sectional view of a binding area according to an embodiment of the present application;

[0052] Figure 13 A partial sectional view of another binding area according to an embodiment of the present application;

[0053] Figure 14 A partial sectional view of another binding area according to an embodiment of the present application;

[0054] Figure 15 A partial sectional view of another binding area according to an embodiment of the present application;

[0055] Figure 16 A partial sectional view of another binding area according to an embodiment of the present application;

[0056] Figure 17 A partial cross-sectional view of another binding area provided in an embodiment of this application;

[0057] Figure 18 A partial cross-sectional view of another binding area provided in an embodiment of this application;

[0058] Figure 19 for Figure 6 Sectional view along the middle AA direction;

[0059] Figure 20 for Figure 7 Sectional view along the BB direction;

[0060] Figure 21 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0061] Figure 22 This is a schematic diagram of the structure after step S10 is completed in the method for manufacturing the display panel provided in the embodiments of this application;

[0062] Figure 23 This is a schematic diagram of the structure after step S20 is completed in the method for preparing the display panel provided in the embodiments of this application.

[0063] Explanation of reference numerals in the attached figures:

[0064] 100a - Display area;

[0065] 100b - Bending area;

[0066] 100c - Binding Area;

[0067] 10-Substrate;

[0068] 20-Organic layer;

[0069] 21-Avoid openings;

[0070] 22-First shielding part;

[0071] 23-Second shielding part;

[0072] 30 - Conductive part;

[0073] 40-Array substrate;

[0074] 50 - First insulating layer;

[0075] 60-Touch layer;

[0076] 61 - First metal layer;

[0077] 62 - Second insulating layer;

[0078] 63 - Second metal layer;

[0079] 70 - third metal layer;

[0080] 80 - third insulating layer;

[0081] 91 - transmission line. DETAILED DESCRIPTION

[0082] In the related art, the display panel has an organic layer. When the display panel is subjected to external impact force or bending, the organic layer can relieve stress on the display panel and protect each functional film layer in the display panel.

[0083] The display panel can include a binding area, which can be used to bind an integrated circuit (IC) chip. During the binding process, the IC chip needs to be pressed onto the display panel in the binding area, so that the conductive structure on the IC chip is pressed and electrically connected between the conductive part in the binding area.

[0084] However, the IC chip is relatively hard. When the IC chip is pressed onto the display panel in the binding area, the organic layer under the conductive part is deformed under stress, and the organic layer is pressed between adjacent conductive parts, which can easily cause the display panel in the binding area to be warped, leading to poor binding between the IC chip and the display panel, and even causing the metal traces in the binding area to be broken, which affects the display effect of the display panel and the display device.

[0085] Based on the above problems, the embodiments of the present application provide a display panel, a preparation method of the display panel, and a display device. The display panel can be used to bind and connect with a driving chip to realize signal transmission between the display panel and the driving chip. The display panel can include a binding area, which is an area connected with the driving chip. The display panel includes a substrate, an organic layer and a plurality of conductive parts which are stacked on the substrate in the binding area. The driving chip has a conductive structure, and the conductive parts are electrically connected with the conductive structure. The plurality of conductive parts are spaced apart from each other on a side of the organic layer away from the substrate. The organic layer has an avoiding opening. The orthogonal projection of the conductive part on the organic layer coincides with at least part of the avoiding opening. The organic layer in the avoiding opening is removed, so that the amount of the organic layer under the conductive part is reduced, thereby reducing the deformation degree of the organic layer during the binding process. The binding effect between the driving chip and the display panel is improved, thereby reducing the influence of the organic layer on the display effect of the display panel and the display device.

[0086] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0087] The display device provided by the embodiments of the present application comprises a display panel. The display device can be an electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a super personal computer, a navigator or the like mobile or fixed terminal with a display panel.

[0088] The display panel provided by the embodiments of the present application will be described in detail below with reference to the drawings.

[0089] As shown in Figure 1 and Figure 2 , the display panel provided by the embodiments of the present application can be connected with a driving chip in a binding manner, so as to realize signal transmission between the driving chip and the display panel.

[0090] The display panel comprises a display area 100a and a binding area 100c, and the display area 100a is arranged adjacent to the binding area 100c. The display panel located in the binding area 100c can be used to bind the driving chip.

[0091] In addition, the display panel can further comprise a bending area 100b, the bending area 100b is located between the display area 100a and the binding area 100c, and the bending area 100b connects the display area 100a and the binding area 100c. By bending the bending area 100b, the binding area 100c can be bent to the backlight surface of the display panel, so that the frame width of the display device can be reduced.

[0092] It should be noted that the display panel in the embodiments of the present application is taken as an example, and the first direction in the embodiments of the present application, i.e. the X direction in Figure 1 , the second direction in the embodiments of the present application, i.e. the Y direction in Figure 1 . The first direction X can be the width direction of the display panel, and the second direction Y can be the length direction of the display panel. It should be understood that the length direction and the width direction in the embodiments of the present application are only for convenience of description, and do not mean any limitation on the size, for example, the length can also be shorter than the width.

[0093] As shown in Figure 3As shown, the display panel comprises a substrate 10, which can be made of hard transparent glass or transparent materials such as polyimide (PI) and polyethylene terephthalate (PET). The substrate 10 can provide support for the remaining structure layers arranged subsequently.

[0094] With reference to the drawings again, Figure 3 In the binding area 100c, the substrate 10 is arranged with the organic layer 20 and the plurality of conductive parts 30. The plurality of conductive parts 30 are arranged at intervals on the side of the organic layer 20 away from the substrate 10. The conductive structure is arranged on the driving chip, and the conductive parts 30 are used to press and electrically connect with the conductive structure, so that the driving chip is electrically connected with the display panel.

[0095] Among them, the plurality of conductive parts 30 are arranged at intervals along the first direction X, so that the binding area 100c occupies a smaller total area of the display panel, and the display area 100a can be arranged larger.

[0096] As shown, Figure 4 The organic layer 20 can have an avoidance opening 21, and the orthogonal projection of the conductive part 30 on the organic layer 20 coincides with at least part of the avoidance opening 21. Among them, the organic layer 20 in the avoidance opening 21 is removed to reduce the organic layer 20 below the conductive part 30. The deformation degree of the organic layer 20 below the conductive part 30 is reduced to improve the binding effect between the driving chip and the display panel, thereby reducing the influence of the organic layer 20 on the display effect of the display panel and the display device.

[0097] The avoidance opening 21 in the organic layer 20 will be described in detail below.

[0098] In some examples, the avoidance opening 21 does not completely penetrate the organic layer 20 along the thickness direction of the organic layer 20, that is, the avoidance opening 21 forms a non-penetrating groove on the organic layer 20, the groove opening is located on the side of the organic layer 20 away from the substrate 10, the groove depth is less than the thickness of the organic layer 20, and the groove bottom wall is located at the middle of the thickness direction of the organic layer 20. In this way, along the thickness direction of the organic layer 20, the thickness of the organic layer 20 is reduced, thereby reducing the deformation of the organic layer 20 during the binding process. In addition, the part of the organic layer 20 retained along the thickness direction can protect the film layers below it. It should be explained that "below it" here refers to all film layers arranged on the side of the part of the organic layer 20 close to the substrate 10. The "below it" of the part of the organic layer 20 in the following is the same meaning, which will not be described in detail hereinafter.

[0099] In other examples, as shown, Figure 4As shown, the avoidance opening 21 penetrates the organic layer 20 along the thickness direction of the organic layer 20, i.e. the avoidance opening 21 forms a through hole in the organic layer 20. In this way, more of the organic layer 20 is removed, and the binding effect between the driving chip and the display panel is better.

[0100] The present embodiment is described with the avoidance opening 21 penetrating the organic layer 20 along the thickness direction of the organic layer 20.

[0101] In some examples, as shown in FIG. 2, the conductive part 30 can be located in the display area 100a, and the avoidance opening 21 can be located in the non-display area 100b. Figures 5-7 As shown, the orthographic projection of the conductive part 30 on the organic layer 20 can coincide with part of the avoidance opening 21, i.e. part of the orthographic projection of the conductive part 30 on the organic layer 20 is located in the avoidance opening 21, and another part of the orthographic projection of the conductive part 30 on the organic layer 20 is located outside the avoidance opening 21. Part of the organic layer 20 in the region below the conductive part 30 is removed, and another part of the organic layer 20 in the region below the conductive part 30 is also retained. In this way, the removed part of the organic layer 20 can reduce the deformation of the organic layer 20, and the retained part of the organic layer 20 can protect the film layer below.

[0102] For example, as shown in FIG. 3, the avoidance opening 21 can be connected with a first shielding part 22, and the first shielding part 22 can be part of the organic layer 20 in the region below the conductive part 30. Part of the orthographic projection of the conductive part 30 on the organic layer 20 is located in the first shielding part 22, i.e. the conductive part 30 covers the edge of the avoidance opening 21 close to the display area 100a. In this way, the first shielding part 22 can protect the film layer below the first shielding part 22 close to the display area 100a. Figure 8 The side of the avoidance opening 21 away from the display area 100a can be connected with a second shielding part 23, and the second shielding part 23 can be part of the organic layer 20 in the region below the conductive part 30. Part of the orthographic projection of the conductive part 30 on the organic layer 20 is located in the second shielding part 23, i.e. the conductive part 30 covers the edge of the avoidance opening 21 away from the display area 100a. In this way, the second shielding part 23 can protect the film layer below the second shielding part 23 away from the display area 100a.

[0103] In other examples, as shown in FIG. 4, the avoidance opening 21 can be located in the display area 100a, and the conductive part 30 can be located in the non-display area 100b.

[0104] Figure 9 and Figure 10 ​As shown, the entire orthographic projection of the conductive part 30 on the organic layer 20 can be located in the avoidance opening 21. That is, the organic layer 20 in the area below the conductive part 30 is completely removed, and the organic layer 20 in the area below the conductive part 30 is not reserved. In this way, the area of the removed organic layer 20 is large, and the organic layer 20 is not completely extruded by the conductive part 30, and the binding effect between the driving chip and the display panel is good.

[0105] Embodiments of the present application are described with the entire orthographic projection of the conductive part 30 on the organic layer 20 located in the avoidance opening 21.

[0106] In some examples, as shown in Figure 9 As shown, the avoidance opening 21 has one, and the orthographic projection of the plurality of conductive parts 30 on the organic layer 20 is located in the same avoidance opening 21. In this way, the number of avoidance openings 21 is small, and the process is simple. The area of the removed organic layer 20 is large, which can better guarantee the binding effect between the driving chip and the display panel.

[0107] In other examples, as shown in Figure 10 As shown, the avoidance opening 21 can have multiple, the number of the plurality of avoidance openings 21 is equal to the number of the plurality of conductive parts 30, and the orthographic projection of the plurality of conductive parts 30 on the organic layer 20 corresponds to the plurality of avoidance openings 21 one by one. Among them, the orthographic projection of each conductive part 30 on the organic layer 20 is located in each avoidance opening 21. In this way, the organic layer 20 between the adjacent two avoidance openings 21 is reserved, which can protect the film layer below.

[0108] Embodiments of the present application are described with the avoidance opening 21 having multiple.

[0109] The plurality of avoidance openings 21 are arranged at intervals along the first direction X, as shown in Figure 11 As shown, for one of the avoidance openings 21, along the first direction X, the edge of the orthographic projection of the conductive part 30 on the organic layer 20 and the edge of the corresponding avoidance opening 21 have a spacing L. That is, along the first direction X, the avoidance opening 21 is larger than the conductive part 30, so as to remove more organic layer 20 and reduce the deformation of the organic layer 20.

[0110] In some embodiments, as shown in Figure 2 As shown, the display panel can further include an array substrate 40 arranged on the substrate 10. The array substrate 40 is provided with a plurality of driving units (not shown), and the side of the array substrate 40 away from the substrate 10 is provided with a light emitting layer (not shown). The plurality of driving units are arranged in an array, and the driving units are electrically connected with the light emitting layer, and the driving units are used to be electrically connected with the driving chip to provide driving signals for the light emitting unit.

[0111] The driving unit can include a transistor on the substrate 10, which includes an active layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a source-drain layer, and the like, which are sequentially disposed on the substrate 10.

[0112] The light-emitting layer includes, in sequence, an anode layer, a light-emitting material layer, and a cathode layer, and an electron blocking layer and a hole transport layer between the anode layer and the light-emitting material layer, a hole blocking layer and an electron transport layer between the cathode layer and the light-emitting material layer, and the like. The specific structure of the light-emitting layer is not limited in the embodiments of the present application.

[0113] The touch layer 60 is located on the side of the array substrate 40 away from the substrate 10, and the first insulating layer 50 is disposed between the touch layer 60 and the array substrate 40. The first insulating layer 50 can be formed of inorganic material, or can be formed of organic material. The display panel in the bending area 100b is subjected to a large bending stress when bending, and the first insulating layer 50 can be formed of soft organic material, so as to relieve the bending stress of the display panel in the bending area 100b when bending.

[0114] The touch layer 60 includes, in sequence, a first metal layer 61, a second insulating layer 62, and a second metal layer 63. The second insulating layer 62 is used to electrically isolate the first metal layer 61 and the second metal layer 63. The second insulating layer 62 can be formed of inorganic material, or can be formed of organic material. The display panel in the bending area 100b is subjected to a large bending stress when bending, and the second insulating layer 62 can be formed of soft organic material, so as to relieve the bending stress of the display panel in the bending area 100b when bending.

[0115] In some embodiments, as shown in FIG. 1A, the first insulating layer 50 can be the organic layer 20 in the above embodiments, the second insulating layer 62 can also be the organic layer 20 in the above embodiments, or the first insulating layer 50 and the second insulating layer 62 are both the organic layer 20 in the above embodiments. Figure 12 As shown in FIG. 1A, in the touch layer 60, one of the first metal layer 61 and the second metal layer 63 is a bridge layer, and the other of the first metal layer 61 and the second metal layer 63 can be a touch functional layer. The touch functional layer can include a plurality of first touch electrodes extending along the first direction X, and a plurality of second touch electrodes extending along the second direction Y. Each first touch electrode includes first sub-touch electrodes spaced from each other, and adjacent two first sub-touch electrodes in the same first touch electrode can be electrically connected through the bridge layer.

[0116] Figure 1 As shown in FIG. 1A, in the touch layer 60, one of the first metal layer 61 and the second metal layer 63 is a bridge layer, and the other of the first metal layer 61 and the second metal layer 63 can be a touch functional layer. The touch functional layer can include a plurality of first touch electrodes extending along the first direction X, and a plurality of second touch electrodes extending along the second direction Y. Each first touch electrode includes first sub-touch electrodes spaced from each other, and adjacent two first sub-touch electrodes in the same first touch electrode can be electrically connected through the bridge layer.

[0117] ​One of the first touch control electrode and the second touch control electrode is a touch control driving electrode, and the other is a touch control sensing electrode. It should be noted that although the touch control driving electrode and the touch control sensing electrode are both located in the second metal layer 63, that is, they are arranged in the same layer, but they are insulated from each other. One of the touch control driving electrode and the touch control sensing electrode is a continuous and uninterrupted structure, and the other includes a plurality of spaced sub-electrode structures and is connected together by a bridging manner.

[0118] The first metal layer 61 is used as a bridging layer, and the second metal layer 63 is used as a touch control functional layer in the present application.

[0119] In some embodiments, as shown in Figure 12 The first metal layer 61 can form the conductive part 30 in the above-mentioned embodiments, that is, the first metal layer 61 forms the bridging layer in the display area 100a, and also forms the conductive part 30 in the binding area 100c, and the bridging layer and the conductive part 30 are of the same layer and the same material, so that the manufacturing process of the conductive part 30 can be simplified. In other examples, the second metal layer 63 can also form the conductive part 30 in the above-mentioned embodiments, that is, the second metal layer 63 forms the touch control functional layer in the display area 100a, and also forms the conductive part 30 in the binding area 100c, and the touch control functional layer and the conductive part 30 are of the same layer and the same material, so that the manufacturing process of the conductive part 30 can be simplified. In other examples, the first metal layer 61 and the second metal layer 63 can both form the conductive part 30 in the above-mentioned embodiments, and the principle is similar to that of the first metal layer 61 forming the conductive part 30, which will not be repeated here.

[0120] The conductive part 30 formed by the first metal layer 61 is a first conductive part, and the conductive part 30 formed by the second metal layer 63 is a second conductive part.

[0121] In some embodiments, continuing to refer to Figure 12 A third metal layer 70 is arranged between the substrate 10 and the first insulating layer 50, and the third metal layer 70 can be arranged in the array substrate 40. The third metal layer 70 can transmit signals in the driving chip to the driving unit in the array substrate 40, and the driving unit transmits the signals to the light-emitting layer to control the light-emitting layer to emit light.

[0122] The third metal layer 70 can be arranged in the same layer and of the same material as the gate layer, the third metal layer 70 can also be arranged in the same layer and of the same material as the source-drain layer, of course, the third metal layer 70 can also be arranged in the same layer and of the same material as other metal layers, so that the manufacturing process of the third metal layer 70 can be simplified.

[0123] Continuing to refer to Figure 12The third insulating layer 80 is located on the side of the third metal layer 70 away from the substrate 10, and can be a planarization layer to planarize the structure layer below.

[0124] The third insulating layer 80 has a via hole, and the conductive part 30 is electrically connected to the third metal layer 70 through the via hole.

[0125] The following describes the connection between the conductive part 30 formed by the first metal layer 61 and / or the second metal layer 63 and the third metal layer 70 in detail.

[0126] It should be noted that the first insulating layer 50 can have a first via hole, the second insulating layer 62 can have a second via hole, and the third insulating layer 80 can have a third via hole. The first via hole and the third via hole are used to expose the third metal layer 70 to realize the connection between the first metal layer 61 or the second metal layer 63 and the third metal layer 70. The second via hole is used to expose the first metal layer 61 or the third metal layer 70 below. When the avoidance opening 21 is provided in the first insulating layer 50, the area of the avoidance opening 21 is larger than the first via hole, which is equivalent to that the first via hole is part of the avoidance opening 21. At this time, there is no need to separately provide the first via hole, and only the avoidance opening 21 needs to be provided. The same is true when the avoidance opening 21 is provided on the second insulating layer 62, and will not be described here.

[0127] In the embodiment in which the first metal layer 61 forms the conductive part 30, as shown in FIG. 6, Figure 13 The first insulating layer 50 can be an organic layer 20 in the binding area 100c. The avoidance opening 21 is provided in the first insulating layer 50, and the first insulating layer 50 below the first metal layer 61 is removed to reduce the deformation of the first insulating layer 50, which is conducive to improving the binding effect of the driving chip and the display panel. The conductive part 30 formed by the first metal layer 61 is directly located on the side of the third insulating layer 80 away from the substrate 10, and the first metal layer 61 is electrically connected to the third metal layer 70 through the third via hole. The second via hole is used to expose the first metal layer 61 to electrically connect the first metal layer 61 to the driving chip. In this embodiment, the second insulating layer 62 can be an organic layer 20 or an inorganic layer.

[0128] In the first embodiment in which the second metal layer 63 forms the conductive part 30, as shown in FIG. 7, Figure 14As shown in the binding area 100c, the second insulating layer 62 can be the organic layer 20. The second insulating layer 62 is provided with the avoiding opening 21, and the second insulating layer 62 under the second metal layer 63 is removed, which reduces the deformation of the second insulating layer 62 and is conducive to improving the binding effect of the driving chip and the display panel. The conductive part 30 formed by the second metal layer 63 is directly located on the side of the first insulating layer 50 away from the substrate 10, and the second metal layer 63 is electrically connected to the third metal layer 70 through the first via and the third via. The first insulating layer 50 has a good protective effect on the film layer thereunder. In this embodiment, the first insulating layer 50 can be the organic layer 20 or the inorganic layer.

[0129] In the second embodiment in which the second metal layer 63 forms the conductive part 30, as shown in Figure 15 As shown in the binding area 100c, the first insulating layer 50 can be the organic layer 20. The first insulating layer 50 is provided with the avoiding opening 21, and the first insulating layer 50 under the second metal layer 63 is removed, which reduces the deformation of the first insulating layer 50 and is conducive to improving the binding effect of the driving chip and the display panel. Part of the second insulating layer 62 sinks to the avoiding opening 21, and the conductive part 30 formed by the second metal layer 63 is located on the side of the second insulating layer 62 away from the substrate 10, and the second metal layer 63 is electrically connected to the third metal layer 70 through the second via and the third via. The second insulating layer 62 has a good protective effect on the film layer thereunder. In this embodiment, the second insulating layer 62 can be the organic layer 20 or the inorganic layer.

[0130] In the third embodiment in which the second metal layer 63 forms the conductive part 30, as shown in Figure 16 As shown in the binding area 100c, the first insulating layer 50 and the second insulating layer 62 can both be the organic layer 20, and the avoiding opening 21 is formed in the first insulating layer 50 and the second insulating layer 62. The first insulating layer 50 and the second insulating layer 62 under the second metal layer 63 are removed, which reduces the deformation of the first insulating layer 50 and the second insulating layer 62 and is conducive to improving the binding effect of the driving chip and the display panel. The conductive part 30 formed by the second metal layer 63 is directly located on the side of the third insulating layer 80 away from the substrate 10, and the second metal layer 63 is electrically connected to the third metal layer 70 through the third via. The avoiding opening 21 is formed in the first insulating layer 50 and the second insulating layer 62, and more organic layers 20 are removed, so that the deformation of the organic layer 20 is further reduced.

[0131] In the first embodiment in which the first metal layer 61 and the second metal layer 63 both form the conductive part 30, as shown in Figure 17As shown in the binding area 100c, the second insulating layer 62 can be the organic layer 20, and the avoiding opening 21 is arranged on the second insulating layer 62. The second insulating layer 62 under the second metal layer 63 is removed, the deformation of the second insulating layer 62 is reduced, and the binding effect of the driving chip and the display panel is improved. The first conductive part formed by the first metal layer 61 is located on the side of the first insulating layer 50 away from the substrate 10, and is electrically connected with the third metal layer 70 through the first via and the third via. The second conductive part formed by the second metal layer 63 directly covers the side of the first metal layer 61 away from the substrate 10. The first insulating layer 50 has a good protective effect on the film layer thereunder. In this embodiment, the first insulating layer 50 can be the organic layer 20 or the inorganic layer.

[0132] In the second embodiment in which the first metal layer 61 and the second metal layer 63 both form the conductive part 30, as shown in the binding area 100c, Figure 18 the first insulating layer 50 can be the organic layer 20, and the avoiding opening 21 is arranged in the first insulating layer 50. The first insulating layer 50 under the first metal layer 61 and the second metal layer 63 is removed, the deformation of the first insulating layer 50 is reduced, and the binding effect of the driving chip and the display panel is improved. The first conductive part formed by the first metal layer 61 is located on the side of the third insulating layer 80 away from the substrate 10, and the first metal layer 61 is electrically connected with the third metal layer 70 through the third via. The second conductive part formed by the second metal layer 63 is located on the side of the second insulating layer 62 away from the substrate 10, and the second metal layer 63 is electrically connected with the first metal layer 61 through the second via. The second insulating layer 62 has a good protective effect on the film layer thereunder. In this embodiment, the second insulating layer 62 can be the organic layer 20 or the inorganic layer.

[0133] In the third embodiment in which the first metal layer 61 and the second metal layer 63 both form the conductive part 30, as shown in the binding area 100c, Figure 19 the first insulating layer 50 and the second insulating layer 62 can both be the organic layer 20, and the avoiding opening 21 is arranged in the first insulating layer 50 and the second insulating layer 62. The first insulating layer 50 and the second insulating layer 62 under the second metal layer 63 are both removed, and the deformation of the first insulating layer 50 and the second insulating layer 62 is reduced, which is beneficial to improve the binding effect of the driving chip and the display panel. The first conductive part formed by the first metal layer 61 is directly located on the side of the third insulating layer 80 away from the substrate 10, and the first metal layer 61 is electrically connected with the third metal layer 70 through the third via. The second conductive part formed by the second metal layer 63 directly covers the side of the first metal layer 61 away from the substrate 10. The avoiding opening 21 is arranged in the first insulating layer 50 and the second insulating layer 62, and the removed organic layer 20 is more, and the deformation of the organic layer 20 is further reduced.

[0134] It can be understood that, as Figure 6 , Figure 7 , Figure 19 and Figure 20 indicated, in the above-mentioned multiple embodiments of forming the conductive part 30 by the first metal layer 61 and / or the second metal layer 63, the multiple avoidance openings 21 are mainly described. When the avoidance opening 21 is one, it is equivalent to connecting multiple avoidance openings 21 together to form one overall avoidance opening 21, and the area of the avoidance opening 21 is larger, and the deformation of the organic layer 20 is smaller. The principle of the avoidance opening 21 being one is similar to that of the avoidance opening 21 being multiple, and will not be described one by one.

[0135] In some embodiments, as Figure 1 indicated, the display panel further includes a transmission line 91, and the transmission line 91 is used to electrically connect the display area 100a and the binding area 100c. The transmission line 91 can include a touch transmission line and a light-emitting transmission line. The driving chip provides a touch signal for the touch layer 60 through the touch transmission line, and the driving chip provides a light-emitting signal for the driving unit in the array substrate 40 through the light-emitting transmission line.

[0136] The light-emitting transmission line can be formed by a metal layer in the array substrate 40, and the touch transmission line can be formed by the first metal layer 61 and / or the second metal layer 63. Since at least one of the first insulating layer 50 and the second insulating layer 62 is the organic layer 20, the bending stress of the touch transmission line in the bending area 100b when bending can be alleviated.

[0137] The touch transmission line includes a first touch transmission line, and the first touch transmission line can be formed by the first metal layer 61. That is, the first metal layer 61 can simultaneously form the bridge layer, the first touch transmission line 91, and the first conductive part. The first touch transmission line connects the first conductive part and the bridge layer. In this way, when transmitting signals between the touch layer 60 and the driving chip, there is no need to change the line, and the signal transmission is stable.

[0138] The touch transmission line can also include a second touch transmission line, and the second touch transmission line can be formed by the second metal layer 63. That is, the second metal layer 63 can simultaneously form the touch function layer, the second touch transmission line, and the second conductive part. The second touch transmission line connects the second conductive part and the touch function layer. In this way, when transmitting signals between the touch layer 60 and the driving chip, there is no need to change the line, and the signal transmission is stable.

[0139] The first touch transmission line and the second touch transmission line can be only one of them, or both can be set at the same time.

[0140] It should be noted that, as Figure 7 and Figure 8As shown, in an embodiment where a first touch transmission line is provided and an avoidance opening 21 is provided in the second insulating layer 62 (organic layer 20), a first shielding part 22 can be provided on the side of the avoidance opening 21 of the second insulating layer 62 near the display area 100a. In this way, the end of the first touch transmission line near the conductive part 30 can be protected, and corrosion of that end of the first touch transmission line during manufacturing can be avoided, which would cause the first touch transmission line to break.

[0141] This application also provides a method for manufacturing a display panel, which is used to manufacture the display panel described in the above embodiments. Figure 21 As shown, the preparation method may include:

[0142] S10: Provides a substrate, which includes a bonding region.

[0143] like Figure 22 As shown, a substrate 10 is provided first. The material of the substrate 10 is not limited; for example, the substrate 10 can be PI or PET. The substrate 10 can provide support for the remaining structural layers that are subsequently added.

[0144] The substrate 10 may include a bonding region 100c, a bending region 100b, and a display region 100a, wherein the bending region 100b connects the bonding region 100c and the display region 100a.

[0145] S20: An organic layer is formed on the substrate, and an avoidance opening is made in the organic layer.

[0146] like Figure 4 and Figure 23 As shown, an organic layer 20 is formed on the substrate 10. The organic layer 20 is used to relieve the stress on the display panel. An avoidance opening 21 is formed in the organic layer 20, that is, the organic layer 20 at the avoidance opening 21 is removed, so as to reduce the organic layer 20 located below the conductive part 30, thereby reducing the deformation of the organic layer 20.

[0147] S30: A plurality of conductive portions are formed on the side of the organic layer away from the substrate. The plurality of conductive portions are spaced apart on the organic layer. The orthogonal projection of the conductive portions on the organic layer coincides with at least a portion of the clearance opening.

[0148] like Figure 4 As shown, conductive portions 30 are formed on the substrate 10, and the conductive portions 30 are spaced apart on the side of the organic layer 20 facing away from the substrate 10. The conductive portions 30 are located in the bonding region 100c, and are used to electrically connect with the driving chip, so that the signals on the driving chip can be transmitted to the display area 100a of the display panel.

[0149] like Figure 2As shown, the display panel includes an array substrate 40, a first insulating layer 50 and a touch layer 60 disposed on the substrate 10, the touch layer 60 includes a first metal layer 61, a second insulating layer 62 and a second metal layer 63 which are sequentially stacked. The organic layer 20 can be formed by at least one of the first insulating layer 50 and the second insulating layer 62. The conductive part 30 can be formed by at least one of the first metal layer 61 and the second metal layer 63. In this way, the preparation process of the organic layer 20 and the conductive part 30 can be simplified.

[0150] The normal projection of the conductive part 30 on the organic layer 20 can be partially or entirely located in the avoidance opening 21, so that the avoidance opening 21 meets the different binding area 100c requirements.

[0151] In addition, the avoidance opening 21 can be located in the partial area of the organic layer 20 close to the conductive part 30, the avoidance opening 21 forms a groove on the organic layer 20, or the avoidance opening 21 penetrates the organic layer 20 to form a through hole on the organic layer 20.

[0152] As shown in Figure 12 Before the first insulating layer 50 is formed, a third metal layer 70 can be formed on the substrate 10, the third metal layer 70 is patterned, and the conductive part 30 can transmit the signal of the driving chip to the display area 100a through the third metal layer 70. The third insulating layer 80 is formed on the third metal layer 70, and the third insulating layer 80 can be a planarization layer. The third via hole is formed in the third insulating layer 80, and the conductive part 30 is electrically connected to the third metal layer 70 through the third via hole.

[0153] The preparation process of the first metal layer 61 and / or the second metal layer 63 forming the conductive part 30 and the conductive part 30 being connected to the third metal layer 70 is described in detail below.

[0154] In the embodiment in which the first metal layer 61 forms the conductive part 30, as shown in Figure 13 In the binding area 100c, the first insulating layer 50 is formed on the side of the third insulating layer 80 away from the substrate 10. The avoidance opening 21 is formed in the first insulating layer 50. The first metal layer 61 is formed on the side of the first insulating layer 50 away from the substrate 10, and the first metal layer 61 is patterned to form the first conductive part on the surface of the side of the third insulating layer 80 away from the substrate 10. Then the second insulating layer 62 is formed on the side of the first metal layer 61 and the first insulating layer 50 away from the substrate 10, and the second via hole is formed in the second insulating layer 62 to expose the first metal layer 61, so that the driving chip is electrically connected to the first metal layer 61 through the second via hole. The first metal layer 61 is electrically connected to the third metal layer 70 through the third via hole. The first insulating layer 50 is the organic layer 20, and the second insulating layer 62 can be the organic layer 20 or the inorganic layer.

[0155] In the first embodiment of forming the conductive part 30 by the second metal layer 63, as shown in FIG. 6, the first insulating layer 50 is formed on the side of the third insulating layer 80 facing away from the substrate 10 in the binding area 100c, and the first via hole is formed in the first insulating layer 50. The second insulating layer 62 is formed on the side of the first insulating layer 50 facing away from the substrate 10, and the avoiding opening 21 is formed in the second insulating layer 62. Then the second metal layer 63 is formed on the side of the second insulating layer 62 facing away from the substrate 10, and the second metal layer 63 is patterned to form the second conductive part. The second conductive part is located on the side of the second insulating layer 62 facing away from the substrate 10. The second metal layer 63 and the third metal layer 70 are electrically connected through the first via hole and the third via hole. The first insulating layer 50 can be the organic layer 20 or the inorganic layer, and the second insulating layer 62 is the organic layer 20. Figure 14 In the second embodiment of forming the conductive part 30 by the second metal layer 63, as shown in FIG. 7, the first insulating layer 50 is formed on the side of the third insulating layer 80 facing away from the substrate 10 in the binding area 100c, and the avoiding opening 21 is formed in the first insulating layer 50. The second insulating layer 62 is formed on the side of the first insulating layer 50 facing away from the substrate 10, and part of the second insulating layer 62 covers the side of the third insulating layer 80 facing away from the substrate 10 at the avoiding opening 21, and the second via hole is formed in the second insulating layer 62. Then the second metal layer 63 is formed on the side of the second insulating layer 62 facing away from the substrate 10, and the second metal layer 63 is patterned to form the second conductive part, which is located on the side of the second insulating layer 62 facing away from the substrate 10. The second metal layer 63 and the third metal layer 70 are electrically connected through the second via hole and the third via hole.

[0156] Figure 15 In the third embodiment of forming the conductive part 30 by the second metal layer 63, as shown in FIG. 8, the first insulating layer 50 is formed on the side of the third insulating layer 80 facing away from the substrate 10 in the binding area 100c, and the avoiding opening 21 is formed in the first insulating layer 50. The second insulating layer 62 is formed on the side of the first insulating layer 50 facing away from the substrate 10, and the avoiding opening 21 is formed in the second insulating layer 62. Then the second metal layer 63 is formed on the side of the second insulating layer 62 facing away from the substrate 10, and the second metal layer 63 is patterned to form the second conductive part, which is located on the side of the third insulating layer 80 facing away from the substrate 10. The second metal layer 63 and the third metal layer 70 are electrically connected through the third via hole.

[0157] In the fourth embodiment of forming the conductive part 30 by the second metal layer 63, as shown in FIG. 9, the first insulating layer 50 is formed on the side of the third insulating layer 80 facing away from the substrate 10 in the binding area 100c, and the avoiding opening 21 is formed in the first insulating layer 50. The second insulating layer 62 is formed on the side of the first insulating layer 50 facing away from the substrate 10, and the avoiding opening 21 is formed in the second insulating layer 62. Then the second metal layer 63 is formed on the side of the second insulating layer 62 facing away from the substrate 10, and the second metal layer 63 is patterned to form the second conductive part, which is located on the side of the third insulating layer 80 facing away from the substrate 10. The second metal layer 63 and the third metal layer 70 are electrically connected through the third via hole. Figure 16 In the first embodiment of forming the conductive part 30 by the first metal layer 61 and the second metal layer 63, as shown in FIG. 10, the first insulating layer 50 is formed on the side of the third insulating layer 80 facing away from the substrate 10 in the binding area 100c, and the avoiding opening 21 is formed in the first insulating layer 50. The second insulating layer 62 is formed on the side of the first insulating layer 50 facing away from the substrate 10, and the avoiding opening 21 is formed in the second insulating layer 62. Then the first metal layer 61 and the second metal layer 63 are formed on the side of the second insulating layer 62 facing away from the substrate 10, and the first metal layer 61 and the second metal layer 63 are patterned to form the first conductive part and the second conductive part. The first conductive part and the second conductive part are located on the side of the second insulating layer 62 facing away from the substrate 10. The first metal layer 61 and the second metal layer 63 are electrically connected through the third via hole.

[0158] Figure 17 ​​As shown, in the bonding region 100c, a first insulating layer 50 is formed on the side of the third insulating layer 80 facing away from the substrate 10, and a first via is formed in the first insulating layer 50. A first metal layer 61 is formed on the side of the first insulating layer 50 facing away from the substrate 10, and the first metal layer 61 is patterned to form a first conductive portion, which is located on the surface of the first insulating layer 50 facing away from the substrate 10. The first conductive portion is electrically connected to the third metal layer 70 through the first via and the third via. A second insulating layer 62 is formed on the side of the first metal layer 61 facing away from the substrate 10, and a clearance opening 21 is provided in the second insulating layer 62. A second metal layer 63 is formed on the side of the second insulating layer 62 facing away from the substrate 10, and the second metal layer 63 is patterned to form a second conductive portion, which is located on the surface of the first conductive portion facing away from the substrate 10.

[0159] In a second embodiment, where conductive portions 30 are formed in both the first metal layer 61 and the second metal layer 63, such as Figure 18 As shown, in the bonding area 100c, a first insulating layer 50 is formed on the side of the third insulating layer 80 facing away from the substrate 10, and a clearance opening 21 is formed in the first insulating layer 50. A first metal layer 61 is formed on the side of the first insulating layer 50 facing away from the substrate 10, and the first metal layer 61 is patterned to form a first conductive portion 30, which is located on the surface of the third insulating layer 80 facing away from the substrate 10. The first conductive portion and the third metal layer 70 are electrically connected through a third via. A second insulating layer 62 is formed on the side of the first metal layer 61 and the first insulating layer 50 facing away from the substrate 10, and a second via is provided in the second insulating layer 62. A second metal layer 63 is formed on the side of the second insulating layer 62 facing away from the substrate 10, and the second metal layer 63 is patterned to form a second conductive portion 30, which is located on the surface of the second insulating layer 62 facing away from the substrate 10. The second conductive portion is electrically connected to the first conductive portion through the second via.

[0160] In a third embodiment where conductive portions 30 are formed in both the first metal layer 61 and the second metal layer 63, such as Figure 19As shown, in the binding area 100c, the first insulating layer 50 is formed on the side of the third insulating layer 80 away from the substrate 10, and the avoiding opening 21 is formed in the first insulating layer 50. The first metal layer 61 is formed on the side of the first insulating layer 50 away from the substrate 10, and the first metal layer 61 is patterned to form the first conductive part on the surface of the side of the third insulating layer 80 away from the substrate 10. The first conductive part is electrically connected with the third metal layer 70 through the third via. The second insulating layer 62 is formed on the side of the first metal layer 61 and the first insulating layer 50 away from the substrate 10, and the avoiding opening 21 is formed in the second insulating layer 62. The second metal layer 63 is formed on the side of the second insulating layer 62 away from the substrate 10, and the second metal layer 63 is patterned to form the second conductive part on the surface of the side of the first metal layer 61 away from the substrate 10.

[0161] It should be noted that the numerical values and numerical ranges involved in the embodiments of the present application are approximate values, and there may be a certain range of errors due to the manufacturing process, which can be considered negligible by those skilled in the art.

[0162] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized by, The display panel comprises a binding area and a display area, the display area is arranged adjacent to the binding area, the display panel comprises a substrate, an organic layer and a plurality of conductive parts are sequentially arranged on the substrate in the binding area, and the plurality of conductive parts are arranged at intervals on the side of the organic layer away from the substrate. The organic layer has an avoiding opening, and the orthogonal projection of the conductive part on the organic layer coincides with at least part of the avoiding opening. Further comprising an array substrate, a first insulating layer and a touch layer which are sequentially arranged on the substrate, the touch layer comprises a first metal layer, a second insulating layer and a second metal layer which are sequentially arranged. At least one of the first insulating layer and the second insulating layer forms the organic layer, at least one of the first metal layer and the second metal layer is located in the binding area, and forms the conductive part. One of the first metal layer and the second metal layer is a bridging layer, and the other of the first metal layer and the second metal layer is a touch function layer. The first metal layer forms the bridging layer in the display area and forms the conductive part in the binding area. The second metal layer forms the touch function layer in the display area and forms the conductive part in the binding area.

2. The display panel of claim 1, wherein, The avoiding opening penetrates the organic layer along the thickness direction of the organic layer.

3. The display panel of claim 1, wherein, The avoiding opening has one, and the orthogonal projection of all the conductive parts on the organic layer is located in the avoiding opening.

4. The display panel of claim 1, wherein, The avoiding opening has a plurality of avoiding openings, the number of the plurality of avoiding openings is equal to the number of the plurality of conductive parts, and the orthogonal projection of the plurality of conductive parts on the organic layer corresponds to the plurality of avoiding openings one by one. The orthogonal projection of each conductive part on the organic layer is located in each avoiding opening.

5. The display panel of claim 4, wherein, The plurality of conductive parts are arranged at intervals along a first direction. Along the first direction, the edge of the orthogonal projection of the conductive part on the organic layer is located inside the corresponding avoiding opening, and has a spacing with the edge of the corresponding avoiding opening.

6. The display panel of any of claims 1-5, wherein, The avoiding opening is connected with a first shielding part on the side close to the display area; and at least part of the projection of the conductive part on the organic layer coincides with the first shielding part.

7. The display panel of claim 6, wherein, The avoiding opening is connected with a second shielding part on the side away from the display area; and at least part of the projection of the conductive part on the organic layer coincides with the second shielding part.

8. The display panel of claim 1, wherein, The third metal layer and the third insulating layer are arranged between the array substrate and the first insulating layer, the third insulating layer is located on the side of the third metal layer away from the substrate; and the third insulating layer has a via hole; The first metal layer is located in the binding area, the first metal layer is electrically connected with the third metal layer through the via hole, and the first metal layer forms the conductive part; Or, the second metal layer is located in the binding area, the second metal layer is electrically connected with the third metal layer through the via hole, and the second metal layer forms the conductive part. Or, the first metal layer and the second metal layer are both located in the binding area, the first metal layer is electrically connected with the third metal layer through the via hole, the first metal layer and the second metal layer are electrically connected, and the first metal layer and the second metal layer form the conductive part.

9. A method for manufacturing a display panel, characterized by, Comprise: A substrate is provided, the substrate comprises a binding area and a display area, the display area is arranged adjacent to the binding area; An organic layer is formed on the substrate, and a relief opening is formed in the organic layer; A plurality of conductive parts are formed on the side of the organic layer away from the substrate, the plurality of conductive parts are arranged at intervals on the organic layer, and the orthogonal projection of the conductive part on the organic layer coincides with at least part of the relief opening; An array substrate, a first insulating layer and a touch layer are sequentially stacked on the substrate, the touch layer comprises a first metal layer, a second insulating layer and a second metal layer which are sequentially stacked; At least one of the first insulating layer and the second insulating layer forms the organic layer, at least one of the first metal layer and the second metal layer is located in the binding area, and forms the conductive part; One of the first metal layer and the second metal layer is a bridging layer, and the other of the first metal layer and the second metal layer is a touch function layer; The first metal layer forms the bridging layer in the display area while forming the conductive part in the binding area; The second metal layer forms the touch function layer in the display area while forming the conductive part in the binding area.

10. A display device, characterized by comprising: The display panel comprises a driving chip and any one of the display panels in claims 1-8, and the driving chip is bound to the display panel.

Images