Heat dissipation module, display component and display device

Abstract

The present application relates to the field of display technology, and discloses a heat dissipation module, a display assembly, and a display device, the purpose of which is to improve the heat dissipation module structure and reduce the thickness of the whole device. The heat dissipation module includes: a heat dissipation substrate layer, provided with a first receiving groove for accommodating a fingerprint sensor and a second receiving groove for accommodating a flexible circuit board; the fingerprint sensor and the flexible circuit board are electrically connected; the first receiving groove is a groove that penetrates the heat dissipation substrate layer; a light shielding buffer layer, located on the side of the heat dissipation substrate layer away from the opening of the second receiving groove, provided with a hollow area, the orthographic projection of the hollow area on the heat dissipation substrate layer is located in the first receiving groove and is configured to expose the photosensitive area of ​​the fingerprint sensor; the impedance of the surface of the light shielding buffer layer on the side away from the heat dissipation substrate layer is 10 <supgt;6< / supgt;Ω‑10<supgt;10< / supgt;Ω。

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a heat dissipation module, a display component and a display device. Background Art

[0002] OLED display devices, as display components of electronic devices, have been widely used in various electronic products, and OLED display panels are an important component of display devices. At present, in order to realize the under-screen fingerprint function, a fingerprint module is set on the back of the heat dissipation module (SCF), and a fingerprint module hole is opened on the SCF, so that the fingerprint module can collect fingerprint information through the SCF fingerprint module hole. In this design, the sensor (Sensor) and flexible circuit board (FPC) of the fingerprint module will occupy the space of the whole machine, increase the thickness of the whole machine, and increase the difficulty of assembly. Summary of the invention

[0003] The present application discloses a heat dissipation module, a display assembly and a display device, the purpose of which is to improve the heat dissipation module structure and reduce the thickness of the entire device.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] A heat dissipation module, comprising:

[0006] The heat dissipation substrate layer is provided with a first accommodating groove for accommodating a fingerprint sensor and a second accommodating groove for accommodating a flexible circuit board; the fingerprint sensor and the flexible circuit board are electrically connected; the first accommodating groove is a groove penetrating the heat dissipation substrate layer;

[0007] The light-shielding buffer layer is located on a side of the heat dissipation substrate layer away from the opening of the second receiving groove, and is provided with a hollow area, the orthographic projection of the hollow area on the heat dissipation substrate layer is located in the first receiving groove and is configured to expose the photosensitive area of ​​the fingerprint sensor; the impedance of the surface of the light-shielding buffer layer on the side away from the heat dissipation substrate layer is 10 6 Ω-10 10 Ω.

[0008] Optionally, the flexible circuit board is configured to carry components for implementing a fingerprint recognition function.

[0009] Optionally, the second containing groove is a groove penetrating the heat dissipation substrate layer.

[0010] Optionally, the flexible circuit board has a component area; at least a portion of the flexible circuit board is located in the second accommodating groove, and the at least a portion includes the component area.

[0011] Optionally, the fingerprint sensor is square, the flexible circuit board is strip-shaped and one end of the flexible circuit board is connected to the fingerprint sensor;

[0012] The first accommodating groove is a square groove similar to the shape of the fingerprint sensor, and the second accommodating groove is a strip-shaped groove similar to the shape of the flexible circuit board and one end of which is communicated with the first accommodating groove.

[0013] Optionally, the distance between the edge of the fingerprint sensor and the edge of the first accommodating groove is 0.5 mm - 0.7 mm; the distance between the edge of the flexible circuit board and the edge of the second accommodating groove is 0.5 mm - 0.7 mm.

[0014] Optionally, the hollowed-out area is square, and there is an included angle between each side of the hollowed-out area and each side of the square groove.

[0015] Optionally, the included angle is greater than 0 degrees and less than 90 degrees.

[0016] Optionally, the light-shielding buffer layer includes a grid adhesive layer and a foam layer, and the grid adhesive layer is located on the side of the foam layer away from the heat dissipation base material layer.

[0017] Optionally, the heat dissipation base material layer includes an adhesive layer, a polyimide film layer and a metal film layer; the adhesive layer is located on the side of the polyimide film layer facing the light-shielding buffer layer; the metal film layer is located on the side of the polyimide film layer away from the light-shielding buffer layer.

[0018] Optionally, the material of the metal film layer is copper.

[0019] Optionally, the thickness of the grid adhesive layer is 0.035 mm - 0.045 mm, the thickness of the foam layer is 0.09 mm - 0.11 mm, the thickness of the polyimide film layer is 0.02 mm - 0.03 mm; the thickness of the metal film layer is 0.045 mm - 0.055 mm.

[0020] Optionally, the depth of the first accommodating groove and the second accommodating groove is greater than or equal to 0.1 mm.

[0021] A display component includes a display module and a heat dissipation module as described in any one of the above; wherein:

[0022] The display module has a display area, and the display area includes a fingerprint recognition area;

[0023] The heat dissipation module is located on the non-display side of the display module, and the orthographic projection of the hollowed-out area of the light-shielding buffer layer on the display module at least partially coincides with the fingerprint recognition area.

[0024] Optionally, the fingerprint recognition area is located within the orthographic projection of the hollowed-out area of the light-shielding buffer layer on the display module.

[0025] Optionally, the display component further includes:

[0026] A fingerprint sensor, located in the first accommodation groove of the heat dissipation base layer, covering the hollow area of the light-shielding buffer layer and having an edge adhered to the light-shielding buffer layer;

[0027] A flexible printed circuit board, electrically connected to the fingerprint sensor, located in the second accommodation groove of the heat dissipation base layer and adhered to the light-shielding buffer layer.

[0028] Optionally, there is a spacing between the fingerprint sensor and the edge of the first accommodation groove; there is a gap between the flexible printed circuit board and the edge of the second accommodation groove.

[0029] Optionally, the surface of the fingerprint sensor facing away from the light-shielding buffer layer is closer to the light-shielding buffer layer than the surface of the heat dissipation base layer facing away from the light-shielding buffer layer, or the surface of the fingerprint sensor facing away from the light-shielding buffer layer is substantially flush with the surface of the heat dissipation base layer facing away from the light-shielding buffer layer;

[0030] The surface of the flexible printed circuit board facing away from the light-shielding buffer layer is closer to the light-shielding buffer layer than the surface of the heat dissipation base layer facing away from the light-shielding buffer layer, or the surface of the flexible printed circuit board facing away from the light-shielding buffer layer is substantially flush with the surface of the heat dissipation base layer facing away from the light-shielding buffer layer.

[0031] Optionally, the fingerprint recognition area of the display module has an optical path allowing light to pass through.

[0032] A display device includes the display component according to any one of the above. Description of the Drawings

[0033] Figure 1 It is a schematic structural diagram of a heat dissipation module provided by an embodiment of the present application;

[0034] Figure 2 is Figure 1 The cross-sectional structural diagram of the heat dissipation module in along the A1-A2 direction;

[0035] Figure 3 It is a schematic structural diagram of a display component provided by an embodiment of the present application;

[0036] Figure 4 is Figure 3 The cross-sectional structural diagram of the display component in along the B1-B2 direction;

[0037] Figure 5 is Figure 3A schematic diagram of a cross-sectional structure of a display assembly along the C1-C2 direction;

[0038] Figure 6 A partial cross-sectional schematic diagram of an under-screen fingerprint recognition structure in a display component provided in one embodiment of the present application. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0040] like Figures 1 to 4 As shown, the embodiment of the present application provides a heat dissipation module 1, comprising:

[0041] The heat dissipation substrate layer 10 is provided with a first receiving groove 101 for receiving the fingerprint sensor 31 and a second receiving groove 102 for receiving the flexible circuit board 32; the fingerprint sensor (Sensor) 31 and the flexible circuit board (FPC) 32 are electrically connected; the first receiving groove 101 is a groove penetrating the heat dissipation substrate layer 10;

[0042] The light shielding buffer layer 20 is located on the side of the heat dissipation substrate layer 10 away from the opening of the second receiving groove 102, and is provided with a hollow area 200. The orthographic projection of the hollow area 200 on the heat dissipation substrate layer 10 is located in the first receiving groove 101 and is configured to expose the photosensitive area of ​​the fingerprint sensor 31; the impedance of the surface of the light shielding buffer layer 20 away from the heat dissipation substrate layer 10 is 10 6 Ω-10 10 Ω.

[0043] The heat dissipation module 1 provided in the embodiment of the present application includes two parts: a heat dissipation substrate layer 10 and a light shielding buffer layer 20. In a display device, for example Figure 3 and Figure 4 As shown, the light shielding buffer layer 20 is attached to the back side of the display module 4 (the side away from the display surface) to provide light shielding and buffering effects. The impedance of the surface close to the display module 4 is 10 6 Ω-10 10Ω, with good anti-static effect; the heat dissipation substrate layer 10 is located on the side of the light-shielding buffer layer 20 away from the display module 4, playing a heat dissipation effect. In the heat dissipation module 1 provided by the embodiment of the present application, a first accommodation groove 101 and a second accommodation groove 102 are provided in the heat dissipation substrate layer 10 to respectively accommodate the fingerprint sensor 31 and the flexible circuit board 32. Thus, the fingerprint module does not occupy the space of the entire display product or occupies very little space, which can effectively reduce the thickness of the entire machine and the difficulty of assembling the entire machine. Moreover, since the first accommodation groove 101 and the second accommodation groove 102 have positioning and limiting functions, the assembly of the fingerprint sensor 31 and the flexible circuit board 32 can be made simpler, reducing the assembly difficulty of the fingerprint module. In addition, the first accommodation groove 101 is a through groove penetrating the heat dissipation substrate layer 10, and a hollow area 200 is provided at the position of the light-shielding buffer layer 20 corresponding to the first accommodation groove 101. The light entering from one side of the OELD display module 4 can reach the photosensitive area of the fingerprint sensor 31 through the hollow area 200 of the light-shielding buffer layer 20, thereby realizing the identification of fingerprint information.

[0044] In summary, the heat dissipation module 1 provided by the embodiment of the present application can accommodate the fingerprint module, reduce the thickness of the entire machine, and simplify the difficulty of assembling the entire machine.

[0045] In some embodiments, the flexible circuit board 32 is configured to carry components for realizing the fingerprint recognition function, and the fingerprint recognition function can be realized. That is, the flexible circuit board 32 is provided with a fingerprint recognition circuit for fingerprint recognition. Of course, the flexible circuit board 32 can also be only used for circuit connection. For example, it is used for the circuit connection between the fingerprint sensor 31 and the main board of the entire machine.

[0046] Such as Figure 2 and Figure 4 As shown, in some embodiments, the second accommodation groove 102 is a through groove penetrating the heat dissipation substrate layer 10.

[0047] Specifically, the flexible printed circuit (FPC) 32 has a small thickness. The second accommodation groove 102 is set as a groove with a relatively large depth, which can make the flexible circuit board 32 completely accommodated in the second accommodation groove 102, avoiding the flexible circuit board 32 protruding relative to the second accommodation groove 102, thereby minimizing the thickness of the entire machine as much as possible and reducing the difficulty of assembling the entire machine. Specifically, the thickness of the flexible printed circuit (FPC) 32 is 0.09 mm - 1.11 mm, and the depth of the second accommodation groove 102 is greater than or equal to 0.1 mm. Optionally, the depth of the second accommodation groove 102 is greater than or equal to 0.15 mm.

[0048] Specifically, at least a part of the flexible circuit board 32 is located in the second receiving groove 102, that is, the flexible circuit board 32 can be entirely received in the second receiving groove 102 or partially received in the second receiving groove 102. Exemplarily, the flexible circuit board 32 has a component area (for example, an area where components such as resistors and capacitors are arranged), and the part of the flexible circuit board 32 located in the second receiving groove 102 includes the component area. For example, the component area of the flexible circuit board 32 is located in the second receiving groove 102, and the rest is outside the second receiving groove 102.

[0049] Exemplarily, the depth of the first receiving groove 101 is greater than or equal to 0.1 mm. Optionally, the depth of the first receiving groove 101 is greater than or equal to 0.15 mm.

[0050] As Figure 3 shown, in some embodiments, the fingerprint sensor 31 is square, and the flexible circuit board 32 is strip-shaped and connected to one end of the fingerprint sensor 31.

[0051] As Figure 3 shown, exemplarily, the first receiving groove 101 is a square groove similar to the shape of the fingerprint sensor 31, and the second receiving groove 102 is a strip-shaped groove similar to the shape of the flexible circuit board 32 and connected to one end of the first receiving groove 101.

[0052] Specifically, the size of the first receiving groove 101 can be slightly larger than that of the fingerprint sensor 31. When the fingerprint sensor 31 is received in the first receiving groove 101, there can be a gap between the fingerprint sensor 31 and the edge of the first receiving groove 101, which facilitates the assembly of the fingerprint sensor 31. Similarly, the size of the second receiving groove 102 is also slightly larger than that of the flexible circuit board 32, and the specific size and gap can be determined according to the size and tolerance requirements during actual design; specifically, the gap between the edge of the fingerprint sensor 31 and the edge of the first receiving groove 101 can be 0.5 mm - 0.7 mm. Similarly, the gap between the edge of the flexible circuit board 32 and the edge of the second receiving groove 102 is also 0.5 mm - 0.7 mm. In addition, since the first receiving groove 101 and the second receiving groove 102 are designed according to the shapes and sizes of the fingerprint sensor 31 and the flexible circuit board 32 respectively, and can accommodate the fingerprint sensor 31 and the flexible circuit board 32, the size is relatively small, so that it can ensure that the heat dissipation base layer 10 has sufficient heat dissipation area and avoid affecting the heat dissipation effect of the heat dissipation module 1.

[0053] Specifically, the setting position of the first receiving groove 101 can be determined according to the fingerprint recognition area set on the display module 4. For example, as Figure 4 shown, in the heat dissipation module 1, the positions of the first receiving groove 101 and the hollow area 200 need to overlap with the fingerprint recognition area 40 of the display module 4.

[0054] Specifically, the setting position and extending direction of the second receiving groove 102 are determined according to the setting requirements of the flexible circuit board 32. One end of the flexible circuit board 32 is connected to the fingerprint sensor 31, and the other end is used to be connected to the circuit board. For example, for display products such as smart phones, the other end of the flexible circuit board 32 can be connected to the main board of the whole machine.

[0055] Specifically, as Figure 3 shown, since the fingerprint recognition area of the display module 4 is generally close to the lower border of the whole machine module, the positions of the fingerprint sensor 31 and the flexible circuit board 32 are relatively close to the lower border. Generally, the lower binding part of the display module 4 will be bent to the back of the heat dissipation module 1 and bound and connected to the main flexible circuit board (FPC) 6. In this application, as Figure 3 shown, the flexible circuit board 32 is set to a strip-shaped profile and bent and extended towards the left border of the whole machine module, which can avoid the main flexible circuit board 6 and prevent overlapping with the main flexible circuit board 6.

[0056] Specifically, as Figure 3 and Figure 4 shown, after the heat dissipation module 1 and the display module 4 are assembled, a display assembly 5 is formed. The display assembly 5 is assembled with structures such as the middle frame, polarizer, touch control component, and protection cover plate to complete the assembly of the whole machine. Specifically, the side of the heat dissipation module 1 and the fingerprint module facing away from the display module 4 is the middle frame of the whole machine, and the main board is arranged on the side of the middle frame facing away from the heat dissipation module 1 and the fingerprint module. A connector (Connector) can be provided at the end of the flexible circuit board 32 far from the fingerprint sensor 31. The middle frame is provided with a hollow part at the position of the connector, and the main board is electrically connected to the connector of the flexible circuit board 32 through the hollow part of the middle frame, so as to realize the signal connection between the fingerprint module and the main board. Specifically, the flexible circuit board 32 has an arc-shaped corner and a right-angled corner, and the radial dimension at the right-angled corner is relatively large, which can be used to arrange components.

[0057] As Figure 1 and Figure 3 shown, in some embodiments, the hollow area 200 of the light-shielding buffer layer 20 is square, and there is an included angle between each side of the hollow area 200 and each side of the first receiving groove 101.

[0058] Exemplarily, the included angle between each side of the hollow area 200 and each side of the first receiving groove 101 is greater than 0 degrees and less than 90 degrees.

[0059] Specifically, both the hollow area 200 and the first accommodating groove 101 are square, and there is an angle greater than 0 degrees and less than 90 degrees between each side of the hollow area 200 and each side of the first accommodating groove 101, that is, any side of the hollow area 200 is not parallel to any side of the first accommodating groove 101, or in other words, the hollow area 200 is inclined relative to the first accommodating groove 101. Since the fingerprint sensor 31 is square and similar in shape to the first accommodating groove 101 and is accommodated in the first accommodating groove 101, furthermore, the hollow area 200 is also inclined relative to the square fingerprint sensor 31. Specifically, the photosensitive elements in the fingerprint sensor 31 are arranged in a dot matrix along two right-angle sides of the fingerprint sensor 31, that is, the photosensitive elements in the fingerprint sensor 31 are arranged horizontally and vertically respectively, and the horizontal arrangement direction and the vertical arrangement direction are respectively parallel to the two right-angle sides of the fingerprint sensor 31. Furthermore, the arrangement direction of the photosensitive elements in the fingerprint sensor 31 is inclined relative to the hollow area 200, that is, the arrangement direction of the photosensitive elements in the fingerprint sensor 31 is not parallel to the extension direction of each side of the hollow area 200; as the light-gathering entrance of the fingerprint sensor 31, the hollow area 200 is inclined relative to the fingerprint sensor 31, and the extension direction of each side of the hollow area 200 is inconsistent with the arrangement direction of the photosensitive elements in the fingerprint sensor 31, which can effectively avoid the moiré problem in fingerprint collection and improve the fingerprint recognition effect.

[0060] Of course, the hollow area 200 of the light-shielding buffer layer 20 may not be square, but other shapes, such as circular, oval or trapezoidal, which can be determined according to actual needs.

[0061] As Figure 2 and Figure 4 shown, in some embodiments, the light-shielding buffer layer 20 includes a mesh adhesive layer 21 and a foam layer 22, and the mesh adhesive layer 21 is located on the side of the foam layer 22 away from the heat dissipation base layer 10.

[0062] Specifically, the mesh adhesive layer 21 can play a role in light shielding to avoid light leakage from the back of the display module 4, and the mesh adhesive layer 21 can paste the heat dissipation module 1 and the display module 4 together. The foam layer 22 plays a buffering role.

[0063] As Figure 2 and Figure 4 shown, in some embodiments, the heat dissipation base layer 10 includes an adhesive layer (not shown in the figure), a polyimide film layer 11 and a metal film layer 12; the adhesive layer is located on the side of the polyimide film layer 11 facing the light-shielding buffer layer 20; the metal film layer 12 is located on the side of the polyimide film layer 11 away from the light-shielding buffer layer 20.

[0064] Specifically, the polyimide film layer 11 has a certain hardness and provides a supporting function. It can disperse external forces and ensure the flatness of the metal film layer 12. The metal film layer 12 mainly functions as heat dissipation and grounding. Exemplarily, the material of the metal film layer 12 can be copper, specifically copper foil. The adhesive layer is used to bond the polyimide film layer 11 and the metal film layer 12 to the light-shielding buffer layer 20.

[0065] Exemplarily, the composite adhesive tape of the embodiment of the present application includes a grid adhesive layer (EMBO) 21, a foam layer (FOAM) 22, a polyimide film layer (PI) 11, and a metal film layer 12 arranged in sequence; the thickness of the grid adhesive layer 21 is 0.035 mm - 0.045 mm, for example, 0.04 mm; the thickness of the foam layer 22 is 0.09 mm - 0.11 mm, for example, 0.1 mm; the thickness of the polyimide film layer 11 is 0.02 mm - 0.03 mm, for example, 0.025 mm; the thickness of the metal film layer 12 is 0.045 mm - 0.055 mm, for example, 0.05 mm. Additionally, an adhesive layer can be provided between each film layer to make the film layers adhere to each other.

[0066] As Figures 3 to 5 shown, the embodiment of the present application also provides a display component 5, which includes a display module 4 and the heat dissipation module 1 of any one of the above; wherein: the display module 4 has a display area, and the display area includes a fingerprint recognition area 40; the heat dissipation module 1 is located on the non-display side of the display module 4, and the orthographic projection of the hollow area 200 of the light-shielding buffer layer 20 on the display module 4 at least partially coincides with the fingerprint recognition area 40.

[0067] Exemplarily, the orthographic projection of the hollow area 200 of the light-shielding buffer layer 20 on the display module 4 substantially coincides with the fingerprint recognition area 40.

[0068] Exemplarily, the fingerprint recognition area 40 is located within the orthographic projection of the hollow area 200 of the light-shielding buffer layer 20 on the display module 4. That is, the area of the fingerprint recognition area 40 of the display module 4 is smaller than the area of the hollow area 200 of the light-shielding buffer layer 20, thereby ensuring fingerprint recognition within the fingerprint recognition area 40, that is, effectively triggering fingerprint sensing.

[0069] As Figure 1 and Figure 2 shown, in some embodiments, both the first accommodation groove 101 and the second accommodation groove 102 of the heat dissipation module 1 are through-grooves penetrating the heat dissipation base layer 10, and the first accommodation groove 101 and the second accommodation groove 102 are communicated with each other.

[0070] As Figure 3 and Figure 4As shown, in some embodiments, the display component provided in the present application further includes a fingerprint module. The fingerprint module includes a fingerprint sensor 31 and a flexible circuit board 32, where: the fingerprint sensor 31 is located in the first accommodation groove 101 of the heat dissipation base layer 10. The fingerprint sensor 31 covers the hollow area 200 of the light-shielding buffer layer 20 and its edge adheres to the light-shielding buffer layer 20; the flexible circuit board 32 is electrically connected to the fingerprint sensor 31. The flexible circuit board 32 is located in the second accommodation groove 102 of the heat dissipation base layer 10 and adheres to the light-shielding buffer layer 20.

[0071] As Figure 3 shown, in some embodiments, there is a spacing between the fingerprint sensor 31 and the edge of the first accommodation groove 101; there is a gap between the flexible circuit board 32 and the edge of the second accommodation groove 102. That is, the size of the first accommodation groove 101 is slightly larger than that of the fingerprint sensor 31; the size of the second accommodation groove 102 is slightly larger than that of the flexible circuit board 32, which can facilitate the assembly of the fingerprint sensor 31 and the flexible circuit board 32.

[0072] As Figure 4 shown, in some embodiments, the surface S1 of the fingerprint sensor 31 facing away from the light-shielding buffer layer 20 is closer to the light-shielding buffer layer 20 than the surface S2 of the heat dissipation base layer 10 facing away from the light-shielding buffer layer 20, or the surface S1 of the fingerprint sensor 31 facing away from the light-shielding buffer layer 20 is substantially flush with the surface S2 of the heat dissipation base layer 10 facing away from the light-shielding buffer layer 20. The surface S3 of the flexible circuit board 32 facing away from the light-shielding buffer layer 20 is closer to the light-shielding buffer layer 20 than the surface S2 of the heat dissipation base layer 10 facing away from the light-shielding buffer layer 20, or the surface S3 of the flexible circuit board 32 facing away from the light-shielding buffer layer 20 is substantially flush with the surface S2 of the heat dissipation base layer 10 facing away from the light-shielding buffer layer 20. In other words, the fingerprint sensor 31 and the flexible circuit board 32 are accommodated in the accommodation groove and do not protrude relative to the accommodation groove, and do not increase the thickness of the whole machine, which can greatly reduce the assembly difficulty of the whole machine and reduce the thickness of the whole machine.

[0073] For example, for display products such as smart phones, generally the display component is assembled with the middle frame. That is, the side of the heat dissipation module 1 and the fingerprint module facing away from the display module 4 is the middle frame of the whole machine. The fingerprint sensor 31 and the flexible circuit board 32 are completely accommodated in the accommodation groove of the heat dissipation module 1 or flush with the surface of the heat dissipation module 1, which can greatly reduce the assembly difficulty of the display component and the middle frame and reduce the thickness of the whole machine.

[0074] As Figure 3 and Figure 5As shown, in some embodiments, the display assembly provided by the present application further includes a main flexible circuit board (FPC) 6 located on the back of the heat dissipation module 1. Specifically, the binding portion of the display module 4 is bent to the back of the heat dissipation module 1 and is bound and connected to the main flexible circuit board (FPC) 6, and the position of the flexible circuit board 32 avoids the main flexible circuit board 6 and does not overlap with the main flexible circuit board 6.

[0075] like Figure 6 As shown, in some embodiments, the fingerprint recognition area of ​​the display module 4 has an optical path that allows light to pass through. Fingerprint information can reach the fingerprint sensor 31 through these optical paths.

[0076] Specifically, Figure 6 As shown, the fingerprint recognition area of ​​the display module 4 includes a light-emitting area D1 with pixels 40 and a non-luminous area D2 located between the pixels 40. The non-luminous area D2 has an optical path that allows light to pass through. The light emitted by the light-emitting layer 41 in the pixel 40 is reflected by the finger 7 and can reach the fingerprint sensor 31 on the back of the display module 4 through the optical path of the non-luminous area D2, thereby realizing fingerprint information recognition.

[0077] In addition, the present application also provides a display device, which includes any of the display components described above.

[0078] Specifically, the display device can be applied to display devices with fingerprint recognition function, such as tablet computers and mobile phones.

[0079] In the display device provided in the embodiment of the present application, the fingerprint recognition module is arranged in the accommodating groove of the heat dissipation module 1, which does not occupy the space of the entire display product or occupies very little space, and can effectively reduce the thickness of the entire device and reduce the difficulty of assembling the entire device.

[0080] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0081] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A heat dissipation module, wherein, include: The heat dissipation substrate layer is provided with a first accommodating groove for accommodating the fingerprint sensor and a second accommodating groove for accommodating the flexible circuit board; The fingerprint sensor is electrically connected to the flexible circuit board; the first accommodation groove is a groove penetrating the heat dissipation substrate layer; The light-shielding buffer layer is located on the side of the heat dissipation base material layer facing away from the opening of the second accommodation groove, and is provided with a hollow area. The orthographic projection of the hollow area on the heat dissipation base material layer is located within the first accommodation groove and is configured to expose the photosensitive area of the fingerprint sensor; the impedance of the surface of the light-shielding buffer layer away from the heat dissipation base material layer is 10 6 Ω - 10 10 Ω.

2. The heat dissipation module according to claim 1, wherein, The flexible circuit board is configured to carry components for realizing a fingerprint recognition function.

3. The heat dissipation module according to claim 1, wherein, The second containing groove is a groove penetrating through the heat dissipation substrate layer.

4. The heat dissipation module according to claim 1, wherein, The flexible circuit board has a component area; at least a portion of the flexible circuit board is located in the second accommodating groove, and the at least a portion includes the component area.

5. The heat dissipation module according to claim 1, wherein, The fingerprint sensor is square, the flexible circuit board is strip-shaped and one end is connected to the fingerprint sensor; The first accommodating groove is a square groove similar in shape to the fingerprint sensor, and the second accommodating groove is a strip groove similar in shape to the flexible circuit board and one end of the second accommodating groove is connected to the first accommodating groove.

6. The heat dissipation module according to claim 5, wherein, The distance between the edge of the fingerprint sensor and the edge of the first accommodating groove is 0.5mm-0.7mm; the distance between the edge of the flexible circuit board and the edge of the second accommodating groove is 0.5mm-0.7mm.

7. The heat dissipation module according to claim 5, wherein, The hollow area is square, and each side of the hollow area and each side of the square groove have an included angle.

8. The heat dissipation module according to claim 7, wherein, The angle is greater than 0 degree and less than 90 degrees.

9. The heat dissipation module according to any one of claims 1-8, wherein, The light-shielding buffer layer includes a grid adhesive layer and a foam layer, and the grid adhesive layer is located on a side of the foam layer away from the heat dissipation substrate layer.

10. The heat dissipation module according to claim 9, wherein, The heat dissipation substrate layer includes an adhesive layer, a polyimide film layer and a metal film layer; the adhesive layer is located on the side of the polyimide film layer facing the light-shielding buffer layer; the metal film layer is located on the side of the polyimide film layer away from the light-shielding buffer layer.

11. The heat dissipation module according to claim 10, wherein, The material of the metal film layer is copper.

12. The heat dissipation module according to claim 9, wherein, The thickness of the grid adhesive layer is 0.035mm-0.045mm, the thickness of the foam layer is 0.09mm-0.11mm, the thickness of the polyimide film layer is 0.02mm-0.03mm; and the thickness of the metal film layer is 0.045mm-0.055mm.

13. The heat dissipation module according to any one of claims 1-8, wherein, The depth of the first accommodating groove and the second accommodating groove is greater than or equal to 0.1 mm.

14. A display assembly, comprising a display module, and a heat dissipation module according to any one of claims 1 to 13; wherein: The display module has a display area, and the display area includes a fingerprint recognition area; The heat dissipation module is located on the non-display side of the display module, and the orthographic projection of the hollow area of ​​the light-shielding buffer layer on the display module at least partially overlaps with the fingerprint recognition area.

15. The display component according to claim 14, wherein, The fingerprint identification area is located within the orthographic projection of the hollow area of ​​the light-shielding buffer layer on the display module.

16. The display component according to claim 14, wherein, Also includes: A fingerprint sensor is located in the first containing groove of the heat dissipation substrate layer, the fingerprint sensor covers the hollow area of ​​the light-shielding buffer layer and the edge of the fingerprint sensor is adhered to the light-shielding buffer layer; A flexible circuit board is electrically connected to the fingerprint sensor. The flexible circuit board is located in the second containing groove of the heat dissipation substrate layer and adhered to the light shielding buffer layer.

17. The display component according to claim 16, wherein, There is a distance between the fingerprint sensor and the edge of the first accommodating groove; there is a gap between the flexible circuit board and the edge of the second accommodating groove.

18. The display assembly of claim 16, wherein: The surface of the fingerprint sensor facing away from the light-shielding buffer layer is closer to the light-shielding buffer layer than the surface of the heat dissipation substrate layer facing away from the light-shielding buffer layer, or the surface of the fingerprint sensor facing away from the light-shielding buffer layer is flush with the surface of the heat dissipation substrate layer facing away from the light-shielding buffer layer; The side surface of the flexible circuit board facing away from the light-shielding buffer layer is closer to the light-shielding buffer layer than the side surface of the heat dissipation substrate layer facing away from the light-shielding buffer layer, or the side surface of the flexible circuit board facing away from the light-shielding buffer layer is flush with the side surface of the heat dissipation substrate layer facing away from the light-shielding buffer layer.

19. The display component according to claim 14, wherein, The fingerprint recognition area of ​​the display module has an optical path allowing light to pass through.

20. A display device, wherein, Comprising a display assembly as described in any one of claims 14-19.

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