Surface Mount Magnetics Modules

Abstract

A magnetic component module includes: a substrate including a groove on a first surface of the substrate; a core in the groove; a spacer on the core; a winding including a wiring bond extending over the core and electrically connecting a first portion of the substrate to a second portion of the substrate; and a trace on and / or in the substrate; and an overmolding material encapsulating the core, the spacer, and the wiring bond.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Patent Application No. 62 / 871,847, filed on July 9, 2019. The entire contents of that application are hereby incorporated by reference herein. Technical Field

[0003] The present invention relates to magnetic assemblies and magnetic assembly modules, and more particularly, to transformers and surface mounted transformer modules. Background Art

[0004] Transformers are used in many applications, for example, to change the voltage of input electricity. A transformer has one or more primary windings and one or more secondary windings wound around a common core of magnetic material. The primary winding receives electrical energy, for example from a power source, and couples this energy to the secondary winding via a changing magnetic field. This electrical energy manifests as an electromagnetic force through the secondary winding. The voltage developed in the secondary winding is related to the voltage in the primary winding by the turns ratio between the primary and secondary windings. Conventional transformers are implemented using an arrangement of adjacent coils. In a toroidal transformer, the windings are wound around a toroidal core.

[0005] The demands of many fields, including telecommunications, implantable medical devices, and battery-powered wireless devices, for example, have driven design efforts to minimize the size of components with lower cost solutions that exhibit the same or better performance, but operate at reduced power consumption. Reduced power consumption is often caused by other requirements to reduce the supply voltage of various circuits. Therefore, there is a continuing need to provide more efficient, smaller, and lower cost magnetic components. Summary of the invention

[0006] In order to overcome the above problems and meet the above needs, the preferred embodiments of the present invention provide magnetic component modules, each of which includes a substrate having a groove, a core in the groove, a spacer arranged above the core, and a wiring joint extending above the spacer and the core.

[0007] According to a preferred embodiment of the present invention, a magnetic component module includes a substrate, which includes a groove on a first surface of the substrate; a core in the groove; a spacer on the core; a winding, including a wiring joint extending above the core and electrically connecting a first part of the substrate to a second part of the substrate, and traces on and / or in the substrate; and an overmolding material that encapsulates the core, the spacer and the wiring joint.

[0008] The electronic component can be attached to a second surface of the substrate opposite the first surface of the substrate. The spacer can be consistent with the top of the core. The edge of the spacer can overhang the core. The spacer can extend over the entire outer surface of the core or over substantially the entire outer surface of the core. The groove can be wider than the width of the core. Alternatively, the groove can be narrower than the width of the core, and the core can include a protrusion that protrudes into the groove.

[0009] The magnetic assembly module may also include a gap between the bottom surface of the core and the first surface of the substrate, wherein the overmold material fills the gap. An adhesive may be in the gap between the core and the substrate, and the overmold material may encapsulate the adhesive.

[0010] The magnetic assembly module may further include input / output pins on the surface of the substrate. The input / output pins may be exposed on the first surface of the substrate.

[0011] The magnetic assembly module may further include an adhesive to mount the core to the substrate. The spacer may include a polyethylene terephthalate (PET) resin. The groove may include an exposed trace.

[0012] According to a preferred embodiment of the present invention, a method of manufacturing a magnetic component module includes providing a substrate including a groove on a first surface of the substrate; depositing a first adhesive on a portion of the first surface of the substrate; positioning a core in the groove and adhering the core to the portion of the first surface of the substrate on which the first adhesive is deposited; providing a spacer on the core; connecting a first conductive portion of the substrate with a second conductive portion of the substrate with a wire bond; providing a trace on and / or in the substrate; and overmolding the core, the spacer, and the wire bond with an overmolding material. The wire bond and the trace define a winding.

[0013] The method may also include depositing a second adhesive on the core and adhering a spacer to the core using the second adhesive. The method may also include attaching the electronic component to a second surface of the substrate opposite to the first surface of the substrate. The method may also include overmolding the electronic component. The spacer may be consistent with the top of the core. The edge of the spacer may overhang the core. The spacer may extend over the entire outer surface of the core or over substantially the entire outer surface of the core. The groove may be wider than the width of the core. Alternatively, the groove may be narrower than the width of the core, and the core may include a protrusion protruding into the groove. The first adhesive may create a gap between the core and the substrate, and the overmolding material may encapsulate the first adhesive. The method may also include mounting input / output pins on the surface of the substrate. The input / output pins may be exposed on the first surface of the substrate. The spacer may include polyethylene terephthalate resin. The groove may include exposed traces.

[0014] According to a preferred embodiment of the present invention, a magnetic component module includes: a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including a wiring joint extending above the core and electrically connecting a first portion of the substrate with a second portion of the substrate, and traces on and / or in the substrate; and an overmolding material that encapsulates the core, the spacer, and the wiring joint.

[0015] The electronic component can be attached to a second surface of the substrate opposite the first surface of the substrate. The spacer can be consistent with the top of the core. The edge of the spacer can overhang the core. The spacer can extend over the entire outer surface of the core or over substantially the entire outer surface of the core.

[0016] The magnetic assembly module may also include a gap between the bottom surface of the core and the first surface of the substrate, wherein the overmold material may fill the gap. An adhesive may be in the gap between the core and the substrate, and the overmold material may encapsulate the adhesive.

[0017] The magnetic assembly module may further include input / output pins on the surface of the substrate. The input / output pins may be exposed on the first surface of the substrate.

[0018] The magnetic assembly module may further include an adhesive to mount the core to the substrate. The spacer may include polyethylene terephthalate (PET) resin.

[0019] According to a preferred embodiment of the present invention, a method for manufacturing a magnetic component module includes: providing a substrate; adhering a core to a portion of a first surface of the substrate on which a first adhesive is deposited; providing a spacer on the core; defining a winding, the winding including a wiring joint extending above the core and electrically connecting a first conductive portion of the substrate to a second conductive portion of the substrate, and providing a trace on and / or in the substrate; and overmolding the core, the spacer and the wiring joint with an overmolding material.

[0020] The method of manufacturing a magnetic assembly module may further include depositing a second adhesive on the core and adhering the spacer to the core using the second adhesive.

[0021] The method of manufacturing a magnetic component module may further include attaching an electronic component to a second surface of the substrate opposite to the first surface of the substrate. The method of manufacturing a magnetic component module may further include overmolding the electronic component.

[0022] The spacer may be in line with the top of the core. The edge of the spacer may overhang the core. The spacer may extend over the entire outer surface of the core or over substantially the entire outer surface of the core. The spacer may include polyethylene terephthalate resin.

[0023] The adhesive may create a gap between the core and the substrate, and the overmold material may encapsulate the first adhesive.

[0024] The method of manufacturing a magnetic assembly module may include mounting input / output pins on a surface of a substrate. The input / output pins may be exposed on a first surface of the substrate.

[0025] The above and other features, elements, characteristics, steps and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A magnetic assembly module is shown with spacers attached to the core.

[0027] Figure 2 yes Figure 1 Figure 2. Top perspective view of the magnetic assembly module.

[0028] Figure 3 yes Figure 1 Side view of the magnetic assembly module.

[0029] Figure 4 yes Figure 1 Top view of the magnetic assembly module.

[0030] Figure 5 A magnetic assembly module is shown having a core with alignment tabs that engage grooves in a substrate.

[0031] Figure 6 A magnetic assembly module is shown having a core in a cavity of a substrate.

[0032] Figures 7 to 16 Shows the manufacturing Figure 1 The steps of the method of the magnetic assembly module.

[0033] Fig.17 A magnetic assembly module is shown with a spacer surrounding a core.

[0034] Figures 18 to 25 Shows the manufacturing Fig.17 The steps of the method of the magnetic assembly module.

[0035] Fig.26 A magnetic assembly module is shown with a core and a standoff.

[0036] Figures 27 to 36 Shows the manufacturing Fig.26 The steps of the method of the magnetic assembly module.

[0037] Fig.37A magnetic assembly module with input / output pins is shown.

[0038] Figures 38 to 50 Shows the manufacturing Fig.37 The steps of the method of the magnetic assembly module.

[0039] Figures 51 to 60 Shows the manufacturing Figure 5 has Figure 1 The steps of the method of the spacer magnetic assembly module are shown.

[0040] Figures 61 to 70 Shows the manufacturing Figure 6 has Figure 1 The steps of the method of the spacer magnetic assembly module are shown.

[0041] Fig.71 is a block diagram of an example of an implementation of a magnetic assembly module.

[0042] Fig.72 Yes, it can include Fig.71 Block diagram of a gate drive circuit application of one or more magnetic component modules shown in FIG.

[0043] Fig.73 Yes, it can include Fig.72 Circuit diagram of the gate drive unit for motor control application. DETAILED DESCRIPTION

[0044] Figure 1 A magnetic assembly module 100 is shown having a core 110, windings defined by wiring bonds 120 and traces 145, spacers 130, and a substrate 140, such as a multilayer printed circuit board (PCB). Note that two examples of spacers are shown, including spacer 130 and spacer 135, wherein spacer 135 is consistent with the top of core 110 and partially covers the sidewalls of core 110, as will be discussed below. An overmold material 190 may cover or encapsulate core 110, wiring bonds 120, and spacer 130. Magnetic assembly module 100 may be a transformer having a primary winding and a secondary winding extending around core 110, such as Figure 1 Although Figure 1 A transformer with two windings is shown, but other magnetic components including, for example, an inductor with a single winding or a transformer with three or more windings may also be used. Circuit components and / or connectors may be located on the bottom surface of substrate 140. Figure 1As shown, the magnetic component module 100 may include surface mount (SM) or input / output (I / O) pins 160 located on the bottom surface of the substrate 140. The magnetic component module 100 may include an electronic component 150 mounted on the bottom surface of the substrate 140. The electronic component 150 may include passive components such as capacitors, resistors, etc., and may include active components such as transistors.

[0045] The core 110 may be an uninsulated core and may be fixed (ie, adhered) to the multilayer substrate 140 using an adhesive 170. Figure 2 As shown, the adhesive 170 may include portions spaced apart along the bottom of the core 110, or may extend along the entire bottom of the core 110. The spacer 130 may be an insulating spacer and may be fixed (i.e., adhered) to the top of the core 140. The spacer 130 may be made by an injection molding process. The spacer 130 may be made of any suitable material that can be injection molded, including polyethylene terephthalate (PET) resin. The spacer 130 may help ensure that the wiring joint 120 does not contact the core 110, which may cause the magnetic component module to short-circuit. Although the spacer is shown as a single integral body in the drawings, the spacer may include two or more bodies arranged around the core.

[0046] The winding is disposed around the core 110 and includes a wiring bond 120 extending above the core 110 and a trace 145 on or in the substrate 140 extending below the core 110. The wiring bond 120 includes two ends that engage different portions of the substrate 140. Figure 4 As shown, the wiring bond 120 can be attached to the substrate 140 in a single row outside the spacer 135 and in two rows inside the spacer 135. Other arrangements are also possible, including two or more rows outside the spacer 135 and one or more than two rows inside the spacer 135. The wiring bond 120 defines the upper half of the winding. The wiring bond 120 may include copper wire, gold wire, aluminum wire, or any other suitable conductive material. The wiring bond 120 may be attached to the substrate 140 by ball bonding, wedge bonding, flexible bonding, or any other suitable attachment method. The traces 145 may be located on an inner or outer layer of the substrate 140 and define the lower half of the winding. If the core 110 is uninsulated, the traces 145 may be located on an inner layer or bottom surface of the substrate 140. If the core 110 is insulated or if the spacer 130 is as Fig.17 Although shown completely surrounding the outer surface of core 110 , traces 145 may also be on the top surface of substrate 140 .

[0047] Figure 1The left side of FIG. 1 shows an example of a spacer 130 between the top of the core 110 and the wire bond 120, which prevents the wire from contacting the core 110 and preventing a short circuit. As shown, the spacer 130 is wider than the width of the core 110 to create an overhang that maintains a predetermined distance between the wire bond 120 and the core 110. Figure 1 The right side of FIG. 1 shows an alternative configuration of the spacer 135, where the spacer 135 is aligned with the top of the core 110 and partially covers the sidewalls of the core 110. It should be understood that, typically, the spacer will have a single cross-sectional shape throughout the spacer and Figure 1 The two different cross-sectional shapes shown in are examples of possible cross-sectional shapes. Figures 2 to 4 The magnetic assembly module 100 is shown using a spacer 135 that is aligned with the top of the core 110 and partially covers the sidewalls of the core 110, while Figures 11 to 16 The use of spacers 130 that are wider than the width of the core 110 to create a suspended magnetic assembly module is shown.

[0048] Figure 1 It is also shown that the core 110, spacers 130 and wire bonds 120 may be overmolded with an overmolding material 190 to stabilize and protect the components of the magnetic assembly module. In addition to overmolding, potting methods or encapsulation methods may also be used to stabilize and protect the components of the magnetic assembly module.

[0049] Figures 2 to 4 An example of a magnetic assembly module 100 having spacers 135 and no overmold material 190 is shown. Figure 2 This is a top perspective view. Figure 3 is a side view, and Figure 4 It is a top view. Figures 2 to 4 A view of a spacer 135 having a single cross-sectional shape and conforming to the top of the core 110 is shown. Figures 2 to 4 Core 110 , wire bonds 120 , substrate 140 , components 150 , I / O pins 150 , and adhesive 170 are shown.

[0050] Figure 5 A magnetic assembly module 100A having a modified core 110A and modified spacers 130A, 135A is shown. The top of the core 110A may be covered by the spacers 130A, 135A including a groove, and the wire bond 120 is located in the groove. Similar to Figure 1 , circuit components and / or connectors may be located on the bottom surface of substrate 140 . Figure 5 It is also shown that the core 110A, spacers 130A, spacers 135A, and wire bonds 120 may be covered or encapsulated by an overmold material 190. The core 110A need not be secured to the top surface of the substrate.

[0051] like Figure 5 As shown, a groove 141 is provided in the substrate 140, and the bottom surface of the core 110A includes a protrusion 111 that engages with the groove 141 to align the core 110A with the substrate 140. The groove 141 can limit the movement of the core 110A relative to the substrate 140. When viewed in a plan view, the shape of the groove 141 generally matches the shape of the core 110A and can be continuous or discontinuous. Similarly, when viewed in a plan view, the shape of the protrusion 111 generally matches the shape of the core 110A and can be continuous or discontinuous. For example, if the core 110A has a circular shape when viewed in a plan view, the groove 141 and the protrusion 111 have a circular shape when viewed in a plan view. Alternatively, the protrusion 111 may include a hemispherical protrusion arranged in a circle, and the groove 141 may include a corresponding discrete hole or groove arranged in a corresponding circle, wherein each hemispherical protrusion engages with a corresponding hole or groove.

[0052] Figure 6 Shows that there is Figure 1 The core 110 and Figure 5 The magnetic assembly module 100B of the modified spacer 130A and spacer 135A is shown. The top of the core 110 may be covered by the spacer 130A and spacer 135A including a groove, and the wiring bonding part 120 is located in the groove. Figure 1 , circuit components and / or connectors may be located on the bottom surface of substrate 140 . Figure 6 It is also shown that the core 110A, the spacer 130 and the wire bond 120 may be covered or encapsulated by the overmold material 190. The core 110 may not be fixed to the top surface of the substrate 140. The substrate 140 includes a groove 142 that can align the core 110 with the substrate 140. Figure 5 The groove 141 in the substrate 140 is shown to be narrower than the core 110A. Figure 6 The groove 142 in the substrate 140 is shown to be wider than the core 110 at the bottom surface of the core 110 .

[0053] like Figure 6 As shown, the groove 142 is slightly wider than the core 110, and the core 110 can be positioned in the groove 142 to align the core 110 with the substrate 140. If the core 110 is insulated or if the spacers 130A, 135A completely or substantially completely cover the core 110, the groove 140 can include exposed traces. If the core 140 is not insulated or if the spacers 130A, 135A only cover the top and / or sides of the core 140, the traces can be located on an inner layer of the substrate 140 below the groove 142.

[0054] Figures 7 to 16 Steps of a method of manufacturing a magnetic assembly module 100 having a spacer 130 are shown. Figure 7 A substrate 140 such as a PCB is shown which may be provided with traces 145 according to conventional techniques. Figure 8 It is shown that adhesive 170 may be deposited on a portion of the surface of substrate 140 on which core 110 is to be mounted. Fig. 9 It is shown that the core 110 may be adhered to a substrate 140 having an adhesive 170 deposited thereon. Fig.10 It is shown that adhesive 132 may be deposited on the top surface of core 110 . Fig.11 It is shown that the spacer 130 can be adhered to the top surface of the core 110 . Fig.12 It is shown that the wire bond 120 may be formed such that the wire bond 120 is attached to the substrate 140 , extends over the core 110 and the spacer 130 , and does not contact the core 110 . Fig.13 An overmold material 190 is shown that may be overmold to cover or encapsulate the core 110 , the wire bonds 120 , and the spacers 130 . Fig.14 It is shown that solder 180 may be deposited on a surface of substrate 140 opposite overmold material 190 . Fig.15 It is shown that the component 150 and the I / O pins 160 can be mounted on the substrate 140 using solder 180 . Fig.16 Shows Figure 1 The completed magnetic assembly module 100 is shown on the left side of FIG.

[0055] Fig.17 A magnetic assembly module 200 is shown having a core 210 fixed (i.e., adhered) to a substrate 240. The magnetic assembly module 200 includes the core 210, windings defined by wire bonds 220 and traces 245, spacers 230, and the substrate 240. All sides of the core 210 are covered by the spacers 230. Figure 1 As shown, the wiring joint 220 defines the upper half of the winding. The traces 245 on the top surface of the substrate 240 define the lower half of the winding. Because the spacer 230 covers the entire outer surface of the core 210, it is not necessary to use a more expensive multi-layer substrate, and a cheaper substrate 240 without an inner layer can be used. However, a multi-layer substrate in which the traces 245 defining the lower half of the winding are located on the top surface or inner layer of the multi-layer substrate can also be used. Circuit components and / or connectors can be located on the bottom surface of the substrate 240. Figure 2It is also shown that the core 210, the spacer 230, and the wiring bond 220 can be overmolded with an overmolding material 290. Instead of the spacer 230 extending over the entire outer surface of the core 210, the spacer 230 can also extend only over substantially the entire outer surface of the core 210. For example, the spacer 230 can extend substantially over the entire outer surface of the core 210 by having a C-shape, so that the top and bottom and the inside or outside of the core 210 are covered, while the outside or inside of the core 210 is exposed. Alternatively, the spacer 230 can extend over the entire outer surface of the core 210 by using two spacers, one of which extends over the top of the core 210 and one of which extends over the bottom of the core 210.

[0056] like Fig.17 As shown, the magnetic component module 200 may include surface mount (SM) or input / output (I / O) pins 260 located on the bottom surface of the substrate 240. The magnetic component module 200 may include an electronic component 250 mounted on the bottom surface of the substrate 240. The electronic component 250 may include passive components such as capacitors, resistors, etc., and may include active components such as transistors.

[0057] Figures 18 to 25 Shows the manufacturing Fig.17 The steps of the method of the magnetic assembly module 200 are shown. Fig.18 A substrate 240 such as a PCB is shown which may be provided with traces 245 on two opposing outer surfaces according to conventional techniques. Fig.19 It is shown that adhesive 270 may be deposited on a portion of the surface of substrate 240 on which core 210 is to be mounted. Fig. 20 It is shown that the core 210 covered on all sides by the spacers 230 can be adhered to the substrate 240 having the adhesive 270 deposited therein. Fig.21 It is shown that the wire bond 220 may be formed such that the wire bond 220 is attached to the substrate 240 , extends over the core 210 covered by the spacer 230 , and does not contact the core 210 . Fig. 22 An overmold material 290 is shown that may be overmold to cover or encapsulate the core 210 , the wire bonds 220 , and the spacers 230 . Fig.23 It is shown that solder 280 may be deposited on a surface of substrate 240 opposite overmold material 290 . Fig.24 It is shown that component 250 and I / O pins 260 may be mounted on substrate 240 using solder 280 . Fig.25 Shows Fig.17 The completed magnetic assembly module 200 is shown.

[0058] As mentioned above Figure 1 and Fig.17 As described, the core may be secured to the top surface of the substrate. Fig.26 An alternative arrangement of the magnetic assembly module 300 is shown in which the adhesive or glue layer 370 is thick enough to create a gap between the core 310 and the substrate 340 to allow the overmold material 390 to extend under the core 310 after bonding the wire bonds 320. The magnetic assembly module 300 includes the core 310, the windings defined by the wire bonds 320 and the traces 345, the spacers 330, and the substrate 340. Fig.26 A truncated cone-shaped bonding layer 370 is shown disposed below the core 310, which creates a gap between the core 310 and the substrate 340. An overmold material 390 may extend into the gap between the core 310 and the substrate 340, thereby providing an additional insulating layer to strengthen the isolation barrier between the core 310 and the traces 345 on the top surface of the substrate 340. Because the overmold material 390 fills the gap between the core 310 and the substrate 340, a more expensive multi-layer substrate does not have to be used, and a cheaper substrate 340 without an inner layer may be used. However, a multi-layer substrate may also be used in which the traces 345 defining the lower half of the winding are located on the top surface or inner layer of the multi-layer substrate.

[0059] Fig.26 The left side of FIG. 3 shows an example of a spacer 330 between the top of the core 310 and the wire bond 320, which prevents the wire from contacting the core 310 and preventing short circuits. As shown, the spacer 330 is wider than the width of the core 310 to create an overhang that maintains a predetermined distance between the wire bond 320 and the core 310. Fig.26 The right side of FIG. 3 shows an alternative configuration of the spacer 335, where the spacer 335 is aligned with the top of the core 310 and partially covers the sidewalls of the core 310. It should be understood that, typically, the spacer will have a single cross-sectional shape throughout the spacer and Fig.26 The two different cross-sectional shapes shown in are examples of possible cross-sectional shapes. Figure 31 to Figure 36 The use of spacers 130 that are wider than the width of the core 110 to create a suspended magnetic assembly module is shown.

[0060] like Fig.26 As shown, the magnetic assembly module 300 may include surface mount (SM) or input / output (I / O) pins 360 located on the bottom surface of the substrate 340. The magnetic assembly module 300 may include electronic components 350 mounted on the bottom surface of the substrate 340. The electronic components 350 may include passive components such as capacitors, resistors, etc., and may include active components such as transistors.

[0061] Figures 27 to 36 Shows the manufacturing Fig.26The steps of the method of the magnetic assembly module 300 are shown. Fig. 27 A substrate 340 such as a PCB is shown which may be provided with traces 345 on two opposing outer surfaces according to conventional techniques. Fig.28 It is shown that adhesive 370 may be deposited on the portion of the surface of substrate 340 on which core 310 is to be mounted. Fig.29 It is shown that the core 310 may be adhered to a substrate 340 having an adhesive 370 deposited thereon. Fig.30 It is shown that adhesive 332 may be deposited on the top surface of core 310 . Fig.31 It is shown that the spacer 330 can be adhered to the top surface of the core 310 . Fig.32 It is shown that the wire bond 320 may be formed such that the wire bond 220 is attached to the substrate 340 , extends over the core 310 and the spacer 330 , and does not contact the core 310 . Fig.33 An overmold material 390 is shown that may be overmold to cover or encapsulate the core 310 , wire bonds 320 , spacers 330 , and adhesive 370 . Fig.34 It is shown that solder 380 may be deposited on a surface of substrate 340 opposite overmold material 390 . Fig.35 It is shown that component 350 and I / O pins 360 may be mounted on substrate 340 using solder 380 . Fig.36 Shows Fig.17 The completed magnetic assembly module 300 is shown.

[0062] Fig.37 4 shows a similar structure to the magnetic assembly module 400 except that the input / output (I / O) pins 460 of the magnetic assembly module 400 may be located on the same side of the substrate 440 as the core 410, the wiring bond 420, and the spacer 430. Figure 1 The magnetic assembly module 400 is shown as a magnetic assembly module. The magnetic assembly module 400 includes a core 410, windings defined by wiring bonds 420 and traces 445, a spacer 430, and a substrate 440.

[0063] The I / O pins 460 may be made of metal posts or metal cylinders that are connected to lands on the substrate 440 via a surface mount process. After the magnetic assembly module 400 including the I / O pins 460 and the circuit assembly 450 is overmolded, the top surface of the magnetic assembly module 400 may be grinded to remove the overmolding material 490 and expose the I / O pins 460. Exposing the I / O pins 460 on the same side of the substrate 440 as the core 410 allows for a smaller and more integrated arrangement of the components because overmolding allows for smaller gaps between the primary and secondary circuit assemblies.

[0064] like Fig.37As shown, the magnetic assembly module 400 may include an electronic assembly 450 mounted on a bottom surface of a substrate 440. The electronic assembly 450 may include passive components such as capacitors, resistors, etc., and may include active components such as transistors.

[0065] Figures 38 to 50 Shows the manufacturing Fig.37 The steps of the method of the magnetic assembly module 400 are shown. Fig.38 A substrate 440 such as a PCB is shown which may be provided with traces 445 according to conventional techniques. Fig.39 It is shown that adhesive 470 may be deposited on the portion of the surface of substrate 440 on which core 410 is to be mounted. Fig.40 It is shown that the core 410 may be adhered to a substrate 440 having an adhesive 470 deposited thereon. Fig.41 It is shown that adhesive 432 may be deposited on the top surface of core 410 . Fig.42 It is shown that the spacer 430 can be adhered to the top surface of the core 410. Fig.43 It is shown that the wire bond 420 may be formed such that the wire bond is attached to the substrate 440 , extends over the core 410 and the spacer 430 , and does not contact the core 410 . Fig.44 It is shown that solder 485 may be deposited on the same surface of substrate 440 as core 410 . Fig.45 It is shown that I / O pins 460 may be mounted on a substrate 440 having solder 485 deposited therein. Fig.46 An overmold material 490 is shown that may be overmold to cover or encapsulate the core 410 , the wire bonds 420 , the spacers 430 , and the I / O pins 460 . Fig.47 It is shown that a portion of the overmold material 490 may be removed to expose the I / O pins 460 . Fig.48 It is shown that solder 480 may be deposited on a surface of substrate 440 opposite core 410 and overmold material 490 . Fig.49 It is shown that component 450 may be mounted on substrate 440 using solder 480 . Fig.50 The overmold material 495 may be overmold to cover or encapsulate the component 450 to complete the Fig.50 The magnetic assembly module 400 shown in FIG.

[0066] Alternatively, an overmold material may be overmold to cover or encapsulate the core 410 , the wire bonds 420 , the spacers 430 , the I / O pins 460 , and the electronic components 450 in the same step.

[0067] Figures 51 to 60 Shows the manufacturing Figure 5 The modified core 110A and Figure 1The spacer 130 is shown in the steps of the method of the magnetic assembly module 100A. Fig.51 A substrate 140 such as a PCB is shown which may be provided with traces 145 according to conventional techniques. Fig.52 It is shown that a groove is formed in the surface of the substrate 140 on which the core 110A is to be mounted. Fig.53 It is shown that the core 110A may be mounted on the substrate 140 with the protrusion 111 inserted into the groove 141 . Fig.54 It is shown that adhesive 132 may be deposited on the top surface of core 110A. Fig.55 It is shown that the spacer 130 can be adhered to the top surface of the core 110A. Fig.56 1. The wire bond 120 is shown to be formed such that: the wire bond 120 is attached to the substrate 140, extends over the core 110A and the spacer 130, and does not contact the core 110A. However, the wire bond 120 may also be located in a groove provided in the spacer 130, for example similar to Figure 5 Spacer 130A is shown. Fig.57 An overmold material 190 is shown that may be overmold to cover or encapsulate the core 110A, the wire bonds 120 , and the spacers 130 . Fig.58 It is shown that solder 180 may be deposited on a surface of substrate 140 opposite overmold material 190 . Fig.59 It is shown that the component 150 and the I / O pins 160 can be mounted on the substrate 140 using solder 180 . Fig.60 Shows Figure 5 As shown in Figure 1 The completed magnetic assembly module 100A with the spacer 130 shown in FIG.

[0068] Figures 61 to 70 Shows the manufacturing Figure 6 The shown Figure 1 The spacer 130 is shown in the steps of the method of the magnetic assembly module 100B. Fig.61 A substrate 140 such as a PCB is shown which may be provided with traces 145 according to conventional techniques. Fig.62 It is shown that a groove is formed in the surface of the substrate 140 on which the core 110 is to be mounted. Fig.63 It is shown that the core 110 may be mounted on a substrate 140 in a recess 142 . Fig.64 It is shown that adhesive 132 may be deposited on the top surface of core 110 . Fig.65 It is shown that the spacer 130 can be adhered to the top surface of the core 110 . Fig.661 shows that the wire bond 120 can be formed such that: the wire bond 120 is attached to the substrate 140, extends over the core 110 and the spacer 130, and does not contact the core 110. However, the wire bond 120 can also be located in a groove provided in the spacer 130, for example similar to Figure 6 Spacer 130A is shown. Fig.67 An overmold material 190 is shown that may be overmold to cover or encapsulate the core 110 , the wire bonds 120 , and the spacers 130 . Fig.68 It is shown that solder 180 may be deposited on a surface of substrate 140 opposite overmold material 190 . Fig.69 It is shown that the component 150 and the I / O pins 160 can be mounted on the substrate 140 using solder 180 . Fig.70 Shows Figure 6 As shown in Figure 1 The completed magnetic assembly module 100B with the spacer 130 shown in FIG.

[0069] Fig.71 is a block diagram of an example of an implementation of the magnetic component module TXM. Fig.71 In FIG. 1 , the magnetic component module TXM is implemented as an isolated converter, where the isolation boundary is shown by the dotted line through the transformer TX. Fig.71 The primary side connected to the primary winding PR is located on the left side of Fig.71 The secondary side connected to the secondary winding SEC is isolated on the right side. Fig.71 It is shown that the electronic module TXM may include a switch stage SS, a control stage CS, a transformer TX, a rectifier stage RS and an output filter LC. The transformer TX may include a core and windings defined by the aforementioned wiring joints and traces. Circuits and components other than the transformer TX may include other electronic components attached to a substrate or PCB on which the transformer TX is mounted, as previously described.

[0070] like Fig.71As shown, the switch stage SS receives an input voltage Vin and outputs a voltage SSout to at least one primary winding PRI of the transformer TX. The switch stage may include a switch or transistor that controls the power flow. The control stage CS includes an input control signal CSin. The control stage CS may control the switching of the switches in the switch stage SS and may monitor the transformer TX via the auxiliary winding AUX. The vertical dotted line through the transformer TX represents the current isolation between the primary winding PRI and the auxiliary winding AUX and the secondary winding SEC. The secondary winding of the transformer TX may be connected to a rectifier stage RS, which is in turn connected to an output filter LC that outputs a DC voltage between +Vout and -Vout. The rectifier stage may include a diode and / or a synchronous rectifier that rectifies the voltage at the secondary winding SEC. The output filter LC may include an arrangement of an inductor and a capacitor to filter unwanted frequencies.

[0071] Fig.72 Yes, it can include Fig.71 A block diagram of a gate drive circuit application of one or more magnetic component modules TXM shown in FIG. The vertical dashed lines and horizontal dashed lines represent galvanic isolation. Fig.72 It is shown that the magnetic component module TXM may include, for example, an input of +12Vdc and outputs of -5Vdc and +18Vdc, which may be used, for example, to drive a metal oxide semiconductor field effect transistor (MOSFET) or an insulated gate bipolar transistor (IGBT). The output of the magnetic component module TXM may be connected to the gate driver IXDD614YI. The controller CONT may send and receive control signals represented by those control signals shown in the dashed box, including, for example, power disable, pulse width modulation PWM enable, low-side and high-side PWM, over-current detection, etc. Control signals may be sent and received between the controller CONT and the isolation circuit ISO and between the controller CONT and the magnetic component module TXM. The isolation circuit ISO may receive and send a feedback signal V DS The isolation circuit may include a transformer, a capacitor, an optocoupler, a digital isolator, etc. The output of the gate drive circuit may be connected to the gate of a switch located in the inverter unit circuit as a Fig.73 Part of an inverter for a motor control application is shown.

[0072] Fig.73 A circuit for a motor control application is shown, which may include a power supply PS such as an inverter INV running at a fixed frequency of 50 Hz or 60 Hz, and a motor MTR running at its required frequency. As shown, the inverter INV may include a power converter PC, a smoothing circuit S, and an inverter unit circuit IU controlled by PWM control. Fig.73shows that a controller CONT may be included to control Fig.72 The gate drive unit GDU may control the gate of the switch within the inverter unit circuit IU. Feedback FB may be provided from the motor MTR to the controller CONT to stabilize the control of the gate drive unit GDU.

[0073] The package including the magnetic component module can be of any size. For example, the package can be about 12.7 mm × about 10.4 mm × about 4.36 mm. Packages with these dimensions can provide higher isolation. The magnetic component module can be used in many different applications, including, for example, industrial, medical, and automotive applications. For example, as described above, the magnetic component module can be included in a gate driver. For example, the magnetic component module can provide 1W to 2W of power, with an efficiency of more than 80%, and a 3kV or 5kV breakdown rated voltage can be provided depending on the occupied area of ​​the magnetic component module. For example, the magnetic component module can include enhanced isolation required by UL and can operate at a temperature between about -40°C and about 105°C or between about -40°C and about 125°C. For example, depending on the application, the magnetic component module can have a moisture sensitivity level (MSL) of 1 or 2. The magnetic component module can be used for battery management systems or programmable logic controllers and data acquisition and communication compliant with RS484 / 232.

[0074] If the magnetic component module includes a transformer, for example, the primary winding may include at least 20 turns and the secondary winding may include 12 turns. For example, the coupling coefficient of the transformer may be 0.99. For example, the primary winding may have a DC resistance (DCR) of about 17.8Ω / turn, and the secondary winding may have a DCR of about 16.9Ω / turn. The maximum current may be 600mA (overcurrent protection), and the typical current is 300mA, for example to ensure that the magnetic component module is not damaged in such an overcurrent situation. For example, the core may have an inner diameter of about 5.4mm, an outer diameter of about 8.8mm, and a height of about 1.97mm. For example, the spacer may have an inner diameter of about 5.1mm, an outer diameter of about 8.8mm, and a height of about 0.2mm. For example, the transformer may have a size of about 12.7mm×about 10.4mm×about 2.5mm. The core may be made of any suitable material, including, for example, Mn-Zn, Ni-Zn, FeNi, etc. The spacers may be made of any suitable material, including, for example, epoxy adhesive. The wiring joints may be made of any suitable material, including, for example, aluminum or copper. The pins may be made of any suitable material, including, for example, Cu with a Ni-Sn coating. The overmold material may be made of any suitable material, including, for example, epoxy.

[0075] It should be understood that the above description is only for illustrating the present invention. Without departing from the present invention, those skilled in the art can design various substitutions and modifications. Therefore, the present invention is intended to include all these substitutions, modifications and variations that fall within the scope of the appended claims.

Claims

1. A magnetic component module, comprising: an insulating substrate, comprising a groove on a first surface of the insulating substrate; a core in the groove such that a portion of the core extends above the first surface of the insulating substrate; an insulating spacer on the core; A winding comprising: a wiring junction extending over the core and electrically connecting a first portion of the insulating substrate with a second portion of the insulating substrate; and traces on and / or in the insulating substrate; and an overmold material encapsulating the core, the insulating spacers, and the wiring bonds.

2. The magnetic component module according to claim 1, wherein: An electronic component is attached to a second surface of the insulating substrate opposite to the first surface of the insulating substrate.

3. The magnetic component module according to claim 1, wherein: The insulating spacer is consistent with the top of the core.

4. The magnetic component module according to claim 1, wherein: Edges of the insulating spacer overhang the core. 5 . The magnetic assembly module of claim 1 , wherein the insulating spacer extends over the entire outer surface of the core or substantially over the entire outer surface of the core.

6. The magnetic component module according to any one of claims 1 to 5, wherein: The groove is wider than the width of the core.

7. The magnetic assembly module according to any one of claims 1 to 5, wherein The groove is narrower than the width of the core, and The core includes a protrusion that protrudes into the groove.

8. The magnetic component module according to any one of claims 1 to 5, further comprising a gap between the bottom surface of the core and the first surface of the insulating substrate, wherein The overmold material fills the gap.

9. The magnetic assembly module according to claim 8, wherein Adhesive is in the gap between the core and the insulating substrate, and The overmold material encapsulates the adhesive. 10 . The magnetic assembly module according to claim 1 , further comprising input / output pins on a surface of the insulating substrate. 11 . The magnetic component module according to claim 10 , wherein the input / output pins are exposed on the first surface of the insulating substrate. 12 . The magnetic assembly module according to claim 1 , further comprising an adhesive mounting the core to the insulating substrate.

13. The magnetic assembly module according to any one of claims 1 to 5, wherein: The insulating spacer includes polyethylene terephthalate resin.

14. The magnetic assembly module of any one of claims 1 to 5, wherein the recess comprises an exposed trace.

15. A method for manufacturing a magnetic assembly module, the method comprising: providing an insulating substrate, the insulating substrate comprising a groove on a first surface of the insulating substrate; depositing a first adhesive on a portion of the first surface of the insulating substrate; positioning a core in the recess and adhering the core to a portion of the first surface of the insulating substrate on which the first adhesive is deposited such that a portion of the core extends above the first surface of the insulating substrate; providing insulating spacers on said core; connecting the first conductive portion of the insulating substrate to the second conductive portion of the insulating substrate using a wiring bonding portion; providing traces on and / or in the insulating substrate; as well as overmolding the core, the insulating spacers and the wiring junction with an overmolding material; wherein The wiring bond and the trace define a winding.

16. The method according to claim 15, further comprising: depositing a second adhesive on the core; as well as The insulating spacer is adhered to the core using the second adhesive. 17 . The method of claim 15 , further comprising attaching an electronic component to a second surface of the insulating substrate opposite the first surface of the insulating substrate.

18. The method of any one of claims 15 to 17, wherein the insulating spacer is in line with the top of the core.

19. The method of any one of claims 15 to 17, wherein edges of the insulating spacer overhang the core.

20. A method according to any one of claims 15 to 17, wherein the insulating spacer extends over the entire outer surface of the core or substantially over the entire outer surface of the core.

21. A method according to any one of claims 15 to 17, wherein the groove is wider than the width of the core.

22. The method according to any one of claims 15 to 17, wherein The groove is narrower than the width of the core, and The core includes a protrusion that protrudes into the groove.

23. The method according to any one of claims 15 to 17, wherein The first adhesive defines a gap between the core and the insulating substrate, and The overmold material encapsulates the first adhesive.

24. The method of any one of claims 15 to 17, further comprising mounting input / output pins on a surface of the insulating substrate.

25. The method of claim 24, wherein the input / output pins are exposed on the first surface of the insulating substrate.

26. The method of any one of claims 15 to 17, wherein the insulating spacer comprises polyethylene terephthalate resin.

27. The method of claim 17, further comprising overmolding the electronic assembly.

28. The method of any one of claims 15 to 17, wherein the recess comprises an exposed trace.

Images