Silicon rod processing equipment and silicon rod processing method

Abstract

The present application discloses a silicon rod processing device and a silicon rod processing method. Among them, a first processing location and a second processing location are provided on the silicon rod processing device, so that silicon rod processing operations can be carried out simultaneously at the two processing locations, thereby improving the silicon rod processing efficiency. At the same time, the cutting device of the silicon rod processing device can be switched between different processing locations by means of a first conversion mechanism, and the grinding device can be switched between different processing locations by means of a second conversion mechanism. The silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, and squaring cutting and grinding operations can be realized at any processing location, simplifying the transfer path of the silicon rod between different processes. In this way, the silicon rod processing device of the present application improves the processing efficiency while simplifying the transfer path of the silicon rod during processing between different processes, reducing the manpower loss, time loss during the process flow, and the risk of damage to the silicon rod.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and in particular to a silicon rod processing device and a silicon rod processing method. Background Art

[0002] At present, with the increasing attention and development of the utilization of green renewable energy in society, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are made on high-quality silicon wafers, and such silicon wafers are formed by multi-wire saw cutting and subsequent processing after pulling or casting silicon ingots.

[0003] Taking monocrystalline silicon products as an example, the general production process of existing silicon wafers generally includes the following steps: first, use a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, use a silicon rod squaring machine to square the cut short silicon rods to form monocrystalline silicon rods; then perform processing operations such as surface grinding and chamfering on each monocrystalline silicon rod to make the surface shaping of the monocrystalline silicon rod meet the corresponding flatness and dimensional tolerance requirements; subsequently, use a slicing machine to slice the monocrystalline silicon rod to obtain monocrystalline silicon wafers.

[0004] However, in general, in the related art, the operations required for each process operation (such as cutting and squaring, surface grinding, chamfering, etc.) are independently arranged, and the corresponding processing devices are dispersed in different production units or different production areas of the production workshop. The transfer of workpieces performing different process operations requires handling and allocation, and pre-treatment work may be required before each process operation. In this way, the processes are complicated, the efficiency is low, and the quality of silicon rod processing operations is easily affected. More manpower or transfer equipment is required, and there are great safety hazards. In addition, there are many flow links between the operation devices of each process, which increases the risk of workpiece damage during the transfer of workpieces, easily generates unqualified products caused by non-production factors, reduces the product qualification rate and the unreasonable losses brought by the existing processing methods, which is a major improvement issue faced by each company. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the related art, the purpose of the present application is to provide a silicon rod processing device and a silicon rod processing method to solve the problems of complicated processes and low efficiency in silicon rod processing in the prior art.

[0006] To achieve the above and other related objectives, the present application discloses a silicon rod processing device in a first aspect, including: a machine base having a silicon rod processing platform, where the silicon rod processing platform is provided with a first processing location and a second processing location; at least one first silicon rod clamp disposed on the first processing platform for clamping a silicon rod and driving the clamped silicon rod to move in a first direction, where the first direction is parallel to the axis direction of the silicon rod; at least one second silicon rod clamp disposed on the second processing platform for clamping a silicon rod and driving the clamped silicon rod to move in the first direction; a cutting device disposed on a first conversion mechanism for cutting the silicon rod on the first processing location or the second processing location of the silicon rod processing platform to form a cut silicon rod, where the first conversion mechanism drives the cutting device to switch positions between the first processing location and the second processing location, and the first conversion mechanism is disposed at a first installation position on the silicon rod processing platform; a grinding device disposed on a second conversion mechanism for grinding the cut silicon rod on the first processing location or the second processing location of the silicon rod processing platform, where the second conversion mechanism drives the grinding device to switch positions between the first processing location and the second processing location, and the second conversion mechanism is disposed at a second installation position on the silicon rod processing platform.

[0007] The present application also discloses a silicon rod processing method in a second aspect, which is applied to a silicon rod processing device. The silicon rod processing device includes a machine base with a silicon rod processing platform, a cutting device, a grinding device, a first silicon rod clamp, and a second silicon rod clamp. Among them, the cutting device is arranged on a first conversion mechanism, the grinding device is arranged on a second conversion mechanism, and the first silicon rod clamp and the second silicon rod clamp are respectively arranged at a first processing location and a second processing location on the silicon rod processing platform. The method includes the following steps: positioning the cutting device at the first processing location and the grinding device at the second processing location; loading a first silicon rod to be cut on the first silicon rod clamp at the first processing location; clamping the first silicon rod to be cut by the first silicon rod clamp and moving it in a first direction to feed the cutting device relative to the first silicon rod to be cut for cutting, obtaining a first cut silicon rod with a quasi-rectangular cross-section; wherein the first direction is parallel to the axis direction of the silicon rod; driving the cutting device to be converted from the first processing location to the second processing location by the first conversion mechanism, and driving the grinding device to be converted from the second processing location to the first processing location by the second conversion mechanism; clamping the first cut silicon rod by the first silicon rod clamp and moving it in the first direction to cooperate with the grinding device to grind the first cut silicon rod, obtaining a first ground silicon rod; and loading a second silicon rod to be cut on the second silicon rod clamp and clamping the second silicon rod to be cut and moving it in the first direction to feed the cutting device relative to the second silicon rod to be cut for cutting, obtaining a second cut silicon rod with a quasi-rectangular cross-section; unloading the first ground silicon rod clamped by the first silicon rod clamp and loading a third silicon rod to be cut; driving the cutting device to be converted from the second processing location to the first processing location by the first conversion mechanism, and driving the grinding device to be converted from the first processing location to the second processing location by the second conversion mechanism; cutting the third silicon rod to be cut by the cutting device at the first processing location to obtain a third cut silicon rod, and grinding the second cut silicon rod by the grinding device at the second processing location to obtain a second ground silicon rod.

[0008] In summary, the silicon rod processing device and the silicon rod processing method of the present application have the following beneficial effects: The silicon rod processing device is provided with a first processing location and a second processing location, so that silicon rod processing operations can be carried out simultaneously at the two processing locations, thereby improving the silicon rod processing efficiency; at the same time, by driving the cutting device and the grinding device to convert their processing locations by the first conversion mechanism and the second conversion mechanism respectively, and making the silicon rod clamp drive the clamped silicon rod to move along the axis direction of the silicon rod, squaring cutting and grinding operations can be realized at any processing location, and the transfer path of the silicon rod between different processes is simplified; thus, the silicon rod processing device of the present application simplifies the transfer path of the silicon rod during processing between different processes while improving the processing efficiency, reducing the labor loss, time loss during the process flow, and the risk of silicon rod damage. Description of the Drawings

[0009] The specific features of the invention involved in this application are shown in the appended claims. The features and advantages of the invention involved in this application can be better understood by referring to the exemplary embodiments and the drawings described in detail below. A brief description of the drawings is as follows:

[0010] Figure 1 It shows a schematic structural diagram of the silicon rod processing equipment of this application in an embodiment.

[0011] Figure 2 It shows a schematic diagram of the first conversion mechanism of the silicon rod processing equipment of this application in an embodiment.

[0012] Figure 3 It shows a schematic diagram of the second conversion mechanism of the silicon rod processing equipment of this application in an embodiment.

[0013] Figure 4 It shows a schematic structural diagram of the cutting device of the silicon rod processing equipment of this application in an embodiment.

[0014] Figure 5 It shows a schematic structural diagram of the cutting device of the silicon rod processing equipment of this application in an embodiment.

[0015] Figure 6 It shows Figure 5 An enlarged schematic diagram of part A in

[0016] Figure 7 It shows a schematic diagram of a partial structure of the silicon rod processing equipment of this application in an embodiment.

[0017] Figure 8a 、 Figure 8b It shows schematic structural diagrams of the silicon rod clamp of the silicon rod processing equipment of this application in different view directions in an embodiment.

[0018] Figure 9 It shows Figure 8a A partial structural diagram of the silicon rod clamp in

[0019] Figure 10 It shows a schematic diagram of a partial structure of the silicon rod processing equipment of this application in an embodiment.

[0020] Figure 11 It shows a schematic structural diagram of the edge skin supporting mechanism of the silicon rod processing equipment of this application in an embodiment.

[0021] Figure 12 It shows a schematic structural diagram of a partial structure of the silicon rod processing equipment of this application in an embodiment.

[0022] Figure 13 It shows Figure 8b An enlarged schematic diagram of part B in

[0023] Figure 14 Shown is a schematic structural view of the silicon rod cutting device in the silicon rod processing equipment of the present application in an embodiment.

[0024] Figure 15a 、 Figure 15b Shown are schematic structural views of the feeding device of the silicon rod processing equipment of the present application in different view directions in an embodiment.

[0025] Figure 16 Shown is a partial schematic structural view of the feeding device of the silicon rod processing equipment of the present application in an embodiment. Detailed implementation manners

[0026] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0027] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical compositions, structures, electricals, and operations may be changed without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower part", "above", "upper part", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the drawings and another element or feature.

[0028] Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another. For example, the first silicon rod clamp can be referred to as the second silicon rod clamp, and similarly, the second silicon rod clamp can be referred to as the first silicon rod clamp without departing from the scope of the various described embodiments. The first silicon rod clamp and the second silicon rod clamp are both describing a silicon rod clamp, but unless the context clearly indicates otherwise in other ways, they are not the same silicon rod clamp. Similar situations also include the first processing location and the second processing location, or the first clamping block and the second clamping block, or the first conversion mechanism and the second conversion mechanism, the first installation position and the second installation position.

[0029] Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the stated features, steps, operations, elements, components, items, kinds, and / or groups, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" as used herein are to be construed as inclusive, meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition occurs only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some manner.

[0030] In the related processing technology of silicon rods, several processes are involved, such as squaring cutting, grinding the surface, chamfering, etc.

[0031] Generally, most of the existing silicon rods are cylindrical structures. The silicon rod is squared and cut by a silicon rod squaring device, so that the cross-section of the silicon rod is quasi-rectangular (including quasi-square) after squaring, and the processed silicon rod as a whole is quasi-cuboid (which may also include quasi-cubic).

[0032] Taking a single crystal silicon rod as an example, the forming process of the single crystal silicon rod may include: first using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods; after the cutting is completed, using a silicon rod squaring machine to perform a squaring operation on the cut short silicon rod to form a single crystal silicon rod with a quasi-rectangular cross-section. Among them, the specific implementation of using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods can refer to patent disclosure documents such as CN105856445A, CN105946127A, and CN105196433A, etc. The specific implementation of using a silicon rod squaring machine to perform a squaring operation on the cut short silicon rod to form a single crystal silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN105818285A, etc. However, the forming process of the single crystal silicon rod is not limited to the foregoing technologies. In alternative examples, the forming process of the single crystal silicon rod may further include: first using a full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single crystal silicon rod with a quasi-rectangular cross-section; after the squaring is completed, using a silicon rod cutting machine to perform a cutting operation on the squared long single crystal silicon rod to form short single crystal silicon rods. Among them, the specific implementation of using a full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single crystal silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN106003443A, etc.

[0033] After a cylindrical single-crystal silicon rod is cut into a quasi-rectangular silicon rod by a squaring device, a grinding device can be used to perform operations such as grinding the surface and chamfering the quasi-rectangular silicon rod.

[0034] The inventors of the present application found that in the related processing technologies for silicon rods, the processing devices involved in squaring, grinding (such as surface grinding, chamfering, etc.) are scattered and independently arranged. The conversion of silicon rods for different process operations requires handling and pre-treatment before processing, resulting in problems such as complicated processes and low efficiency.

[0035] In view of this, the present application proposes a silicon rod processing device and a silicon rod processing method. Through equipment transformation, multiple processing devices are integrated in one device, which can automatically realize the squaring cutting and grinding (such as surface grinding, chamfering, etc.) of silicon rods. The various processing operations are seamlessly connected, saving labor costs, improving production efficiency, and enhancing the quality of silicon rod processing operations.

[0036] Herein, the silicon rod processing device provided by the present application includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a first processing area and a second processing area; at least one first silicon rod clamp is provided on the first processing platform for clamping a silicon rod and driving the clamped silicon rod to move in a first direction, where the first direction is parallel to the axis direction of the silicon rod; at least one second silicon rod clamp is provided on the second processing platform for clamping a silicon rod and driving the clamped silicon rod to move in the first direction; a cutting device is provided on a first conversion mechanism for cutting the silicon rod on the first processing area or the second processing area of the silicon rod processing platform to form a cut silicon rod, where the first conversion mechanism is provided at a first installation position on the silicon rod processing platform and drives the cutting device to switch positions between the first processing area and the second processing area; a grinding device is provided on a second conversion mechanism for grinding the cut silicon rod on the first processing area or the second processing area of the silicon rod processing platform, where the second conversion mechanism is provided at a second installation position on the silicon rod processing platform and drives the grinding device to switch positions between the first processing area and the second processing area.

[0037] To facilitate the description of the structural layout and working mode of the silicon rod processing device of the present application, the present application defines a first direction and a second direction. Among them, the first direction is the axis direction of the horizontally placed silicon rod in the silicon rod processing device (also referred to as the silicon rod axis in the present application), and the first direction, the second direction, and the direction of the plumb line are perpendicular to each other in pairs.

[0038] In the silicon rod processing equipment provided by the present application, the cutting device can be switched between the first processing position and the second processing position by the first conversion mechanism, and the grinding device can be switched between the first processing position and the second processing position by the second conversion mechanism. By coordinating and cooperating with the cutting device, the grinding device, the first silicon rod clamp and the second silicon rod clamp, the silicon rod can complete the cutting and squaring operations in any processing position, which simplifies the flow procedures between different processes and simplifies the equipment, reducing the equipment space; at the same time, different processing positions on the silicon rod processing equipment can simultaneously perform processing operations of different processes, which is beneficial to improving processing efficiency.

[0039] See also Figure 1 , which is a schematic diagram of the structure of the silicon rod processing equipment in one embodiment of the present application.

[0040] As shown in the figure, the silicon rod processing equipment includes a machine base 10, a cutting device 20, a grinding device 30, a first silicon rod clamp 11, and a second silicon rod clamp 12. It should be noted that the silicon rod processing equipment may optionally include other components, such as Figure 1 The view shown is not intended to limit the silicon rod processing equipment of the present application.

[0041] The machine base 10 is the main component of the silicon rod processing equipment and is used to provide a working platform. In one example, the machine base 10 is large in size and weight to provide a larger installation surface and a more solid stability of the whole machine. It should be understood that the machine base 10 can be used as the base of different structures or components that perform processing operations in the silicon rod processing equipment, and the specific structure of the machine base 10 can be changed based on different functional requirements or structural requirements; in some examples, the machine base 10 includes a fixed structure or a limiting structure such as a base, a rod, a column, a frame, etc. for receiving different components in the silicon rod processing equipment, which are all the machine bases 10 described in this application.

[0042] Meanwhile, in some examples, the base 10 may be an integrated base, and in other examples, the base 10 may include a plurality of independent bases.

[0043] The machine base 10 has a silicon rod processing platform, on which a first processing area and a second processing area are arranged. The first processing area and the second processing area are areas for cutting, squaring and grinding the silicon rod.

[0044] Here, the first silicon rod clamp 11 and the second silicon rod clamp 12 are clamping devices corresponding to the first processing location and the second processing location respectively, used to achieve the movement control of the silicon rod. By clamping the silicon rod and driving it to move in the first direction, the silicon rod can be made to move relative to the cutting device 20 or the grinding device 30 in the first direction, so as to achieve the preset cutting operation and grinding operation. In an actual scenario, at least one silicon rod clamp can be arranged at the first processing location and the second processing location, so that silicon rod processing operations can be carried out at both the first processing location and the second processing location on the silicon rod processing platform, thereby improving production efficiency.

[0045] The cutting device 20 is used to cut the silicon rod on the first processing location or the second processing location of the silicon rod processing platform to form a cut silicon rod. Here, the cutting device 20 is arranged at the first installation position on the silicon rod processing platform by means of the first conversion mechanism 43. It should be noted that the area of the silicon rod processing platform is not limited to the physical area of the machine base 10. For example, when the machine base 10 is U-shaped or two parallel and opposite bases, the silicon rod processing platform can be, for example, the circumscribed rectangle of the machine base 10, or the silicon rod processing platform includes the accommodation space in the machine base 10. The first conversion mechanism 43 can be arranged on the machine base 10; or it can be arranged in the hollow area (or accommodation space) of the machine base 10. In this setting, the first conversion mechanism 43 and the cutting device 20 can also be independent of the machine base 10, for example, they can be used as independent sales units. The first conversion mechanism 43 drives the cutting device 20 to switch positions between the first processing location and the second processing location, that is, any processing location can perform a cutting operation.

[0046] The grinding device 30 is used to grind the cut silicon rod on the first processing location or the second processing location of the silicon rod processing platform. The grinding device 30 is arranged at the second installation position on the silicon rod processing platform by means of the second conversion mechanism 40. Similarly, the second conversion mechanism 40 can be arranged on the machine base 10, or arranged in the accommodation space of the machine base 10. In this setting, the second conversion mechanism 40 and the grinding device 30 can also be independent of the machine base 10, for example, they can be used as independent sales units. The second conversion mechanism 40 drives the grinding device 30 to switch positions between the first processing location and the second processing location, that is, any processing location can perform a grinding operation.

[0047] Here, the silicon rod processing equipment can control the processing locations where the cutting device 20 and the grinding device 30 are respectively located, so that the first processing location and the second processing location can perform cutting operations and grinding operations respectively at the same time, thereby improving processing efficiency.

[0048] It should be understood that the first installation position and the second installation position are not the same position. Correspondingly, the first conversion mechanism 43 and the second conversion mechanism 40 are arranged at different positions on the silicon rod processing platform. The first installation position and the second installation position should satisfy that the cutting device 20 and the grinding device 30 do not interfere with each other during the process of converting the processing location. In some embodiments, the first installation position and the second installation position can be arranged between the first processing location and the second processing location. In one implementation, the first installation position and the second installation position can also be arranged in the central area between the first processing location and the second processing location. For example, when the first processing location and the second processing location are arranged in parallel and symmetrically, the first installation position and the second installation position can be arranged on the symmetry line of the first processing location and the second processing location.

[0049] The cutting device and the grinding device are respectively driven by the first conversion mechanism and the second conversion mechanism, and can relatively independently switch positions between the first processing location and the second processing location.

[0050] In some embodiments, the first conversion mechanism includes a first rotating shaft, and the cutting device rotates a preset angle along the first rotating shaft to switch positions between the first processing location and the second processing location; the second conversion mechanism includes a second rotating shaft, and the grinding device rotates a preset angle along the second rotating shaft to switch positions between the first processing location and the second processing location.

[0051] In one implementation, the cutting device switches positions between the first processing location and the second processing location by rotating a preset angle along the first rotating shaft. Compared with the method of switching the processing location by a linear displacement mechanism, in the implementation provided in the present application, the structure of the first conversion mechanism and the equipment space occupied by it can be simplified; similarly, the grinding device switches between different processing locations by rotating a preset angle along the second rotating shaft, which can simplify the structure of the second conversion mechanism and reduce its equipment space.

[0052] Please refer to Figure 1 and Figure 2 , where Figure 2 shows a partial structural schematic diagram of the silicon rod processing equipment of the present application in an embodiment.

[0053] In one embodiment, the first conversion mechanism 43 includes: a bracket 430 for arranging the cutting device 20; a rotation driving source 432 for driving the cutting device 20 to rotate relative to the bracket 430 along the first rotating shaft 431 to switch positions between the first processing location and the second processing location.

[0054] The bracket 430 can serve as the base of the first conversion mechanism 43. The cutting device 20 can be movably arranged on the bracket 430 based on the first rotating shaft 431 and can rotate relative to the bracket 430 along the first rotating shaft 431 under the drive of the rotation drive source 432. The rotation drive source 432 is, for example, a motor with a power output shaft, and its power output shaft can be shaft-connected to the first rotating shaft 431.

[0055] In some examples, the bracket 430 can be arranged to include two relatively arranged frames. The two frames can be respectively connected to the first rotating shaft 431, and the gap between the two frames can be used as the moving space for the rotation of the cutting device 20, that is, the cutting device 20 will not collide or interfere with the frames during rotation.

[0056] In one embodiment, the second conversion mechanism further includes a rotation drive mechanism for driving the grinding device to rotate. The rotation drive mechanism includes: a driving gear, shaft-connected to a power drive source; a driven gear, engaged with the driving gear and connected to the second rotating shaft.

[0057] Please refer to Figure 3 , which shows a partial structural schematic diagram of the second conversion mechanism of the silicon rod processing equipment of the present application in one embodiment.

[0058] The driving gear rotates under the drive of the drive source 423, thereby driving the engaged driven gear 422 to rotate. The driven gear 422 can be used to carry or connect the grinding device and the cutting device, or the driven gear 422 can be arranged to be integrated with the housing or cylinder body for connecting the grinding device and the cutting device. For example, the teeth of the driven gear 422 are arranged on the housing of the second conversion mechanism; thus, the driven gear 422 can drive the grinding device and the cutting device to rotate. In this example, the second rotating shaft 41 can be the axle of the driven gear 422, or the second rotating shaft 41 is connected to the driven gear 422 along the axial direction of the axle of the driven gear 422.

[0059] In another example, the rotation drive mechanism is a drive motor (not shown) shaft-connected to the second rotating shaft, which is used to control the first rotating shaft to rotate a preset angle to switch the grinding device between the first processing position and the second processing position.

[0060] It should be noted that in each example provided in the present application, the specific structure of the second rotating shaft is not limited to a shaft body. For example, the second rotating shaft can also be a cylinder, a cylinder body or a housing for connecting the grinding device. For example, in Figure 1In the illustrated embodiment, the second rotating shaft is the housing for arranging the grinding device. It should be understood that the second rotating shaft only needs to be used to realize the rotation of the grinding device along the axis when the second rotating shaft rotates, so as to realize the switching between the first processing position and the second processing position.

[0061] The first conversion mechanism and the second conversion mechanism can drive their corresponding cutting devices and grinding devices relatively independently. Here, the directions of the first rotating shaft and the second rotating shaft can be set to the same direction or different directions.

[0062] In some embodiments, the first rotating shaft is arranged in the first direction, and the second rotating shaft is arranged in the direction of the plumb line; the first processing position and the second processing position are arranged on opposite sides in the second direction, wherein the first direction, the second direction, and the direction of the plumb line are perpendicular to each other in pairs.

[0063] Please refer to Figure 1 、 Figure 2 and Figure 3 , the first rotating shaft 431 is arranged in the first direction, and the second rotating shaft 41 is arranged in the direction of the plumb line. Under this setting, only by making the first installation position and the second installation position corresponding to the first conversion mechanism 43 and the second conversion mechanism 40 have a certain distance in the position of the first direction, the interference between the cutting device 20 and the grinding device 30 during the process of switching the processing position can be avoided.

[0064] When the first processing position and the second processing position are arranged in parallel and opposite to each other, in the actual processing scenario, the preset angle of the cutting device 20 rotating along the first rotating shaft 431 is, for example, 180°, and the switching between the two processing positions can be realized. The grinding device 30 rotates along the second rotating shaft 41 by a preset angle to switch between the two processing positions, and the preset angle is, for example, 180°. In one embodiment, to make the layout of the silicon rod processing equipment more compact, the direction of the grinding device 30 rotating along the second rotating shaft 41 when switching the processing position is the direction away from the cutting device 20, so as to reduce the distance between the cutting device 20 and the grinding device 30 in the first direction; taking Figure 1 the view state shown as an example, at this time the grinding device 30 is in the second processing position. When the grinding device 30 needs to switch the processing position, the rotation direction of the grinding device 30 along the second rotating shaft 41 is Figure 1 the clockwise direction in the corresponding top view.

[0065] It should be understood that the grinding device 30 of the silicon rod processing equipment needs to be configured with a grinding tool for grinding. Generally, the grinding device 30 is relatively heavy. If the second rotating shaft 41 is arranged in the direction of the plumb line, during the process of driving the grinding device 30 to rotate, the center of gravity height of the grinding device 30 remains unchanged. Thus, the stability of the conversion process can be improved, which is beneficial to reducing the work done by the second conversion mechanism to drive the grinding device 30 and maintaining the service life of the second rotating shaft 41.

[0066] Define the first direction as the length direction of the machine base and the silicon rod processing platform. Let the first rotating shaft 431 corresponding to the cutting device 20 be arranged in the first direction. During the process of the cutting device 20 converting the processing location, its position in the first direction remains unchanged. In this way, the length of the machine base or the silicon rod processing platform in the first direction can be reduced or a more reasonable layout can be achieved. For example, when the silicon rod processing platform is also provided with a feeding location or a waiting location for the silicon rod to be cut along the length direction, the feeding location or the waiting location can be arranged adjacent to the cutting device 20.

[0067] In the silicon rod processing equipment of the present application, the cutting device includes a plurality of cutting wheels and a cutting wire saw formed by winding around the plurality of cutting wheels. The silicon rod is driven to move along the first direction by the first silicon rod clamp or the second silicon rod clamp. Thus, when the cutting device performs the cutting operation, it can be set in a fixed state to achieve the relative feeding between the cutting wire saw and the silicon rod. In traditional silicon rod processing equipment, the cutting wire saw needs to be moved in space to cut the silicon rod to be cut. Therefore, a driving device and a guiding structure need to be configured for the cutting wheels and the cutting wire to achieve the relative feeding of the cutting wire saw with respect to the silicon rod. Here, the structure of the cutting device in the present application can be simplified. The cutting wheels can be fixed to the main body of the cutting device, such as a cutting frame, and the guiding structure and the driving device for moving the cutting wheels along the axis direction of the silicon rod can be omitted, thereby reducing the structure of the cutting device and the occupied equipment space.

[0068] In some embodiments, the cutting device includes: a cutting frame and at least one wire cutting unit; wherein, the at least one wire cutting unit is arranged on the cutting frame, and the wire cutting unit includes: a plurality of cutting wheels, a transition wheel, and a cutting wire, and the cutting wire winds around the plurality of cutting wheels and the transition wheel to form at least one cutting wire saw.

[0069] The cutting frame is connected to the first conversion mechanism, and the cutting frame is used to arrange the wire cutting unit. Here, the specific structure of the cutting frame can be set in different forms based on the layout requirements of the cutting wheels and the transition wheels, such as a column, a beam, or a plate frame.

[0070] In some embodiments, multiple cutting wheels and idler wheels in the wire cutting unit are connected to the cutting frame. Alternatively, the multiple cutting wheels and idler wheels are arranged on the cutting frame through a bracket, a connecting plate, or a mounting frame. Here, the carrier for arranging the multiple cutting wheels and idler wheels can be in different forms, which is not limited in this application.

[0071] Please refer to Figure 4 , which shows a schematic diagram of the cutting device of the silicon rod processing equipment of this application in an embodiment.

[0072] In one implementation, the wire cutting support 23 is arranged on the cutting frame 21 through a limiting structure such as a guide rail or a guide post. Among them, the guide rail or the guide post is arranged along the perpendicular direction of the wheel surface of the cutting wheel 221 in the wire cutting unit 22, so that the arranged wire cutting unit 22 has the freedom to move along the perpendicular direction of the wheel surface of the cutting wheel; under this setting, the wire cutting support 23 can move along the orthogonal direction of the wheel surface of the cutting wheel 221 under the action of a driving source.

[0073] When the wire cutting unit 22 moves along the perpendicular direction of the wheel surface of the cutting wheel 221, correspondingly, the wire saw in the wire cutting unit 22 moves along the perpendicular direction of the wheel surface of the cutting wheel, and the wire saw realizes moving away from or approaching the axis of the silicon rod, thereby adjusting the cutting amount or cutting position of the silicon rod.

[0074] At least one cutting wire groove for winding the cutting wire 223 is provided in the cutting wheel 221, and the cutting wire groove can limit the position of the cutting wire 223 to control the cutting accuracy. Any one of the wire saws is formed by winding the cutting wire 223 between two cutting wheels 221, and the positions of the two cutting wheels 221 and the positional relationship between the cutting wheels 221 can be used to determine the direction of the wire saw.

[0075] The idler wheel 222 is used for reversing or guiding the cutting wire 223, or the idler wheel 222 can be used to adjust the tension of the cutting wire 223.

[0076] In the silicon rod processing equipment of this application, during the cutting process, the cutting wire is driven to run along the winding direction, and the silicon rod is driven by the silicon rod fixture to move along the axis direction of the silicon rod, that is, the first direction, to realize the feeding relative to the wire saw, wherein the wire saw can be arranged in the second direction or the vertical direction.

[0077] It should be noted that the direction of the cutting wire saw can achieve cutting only when it is orthogonal to the axis direction of the silicon rod. Therefore, in a specific scenario, the direction of the cutting wire saw can be within the vertical plane of the first direction. For the convenience of controlling the cutting amount of the silicon rod, the arrangement of the cutting wheel and the transition wheel, and for the convenience of describing the structure of the cutting device and the arrangement of components in this application, the following embodiments will be described by taking the cutting wire saw being arranged in the second direction or the plumb line direction as an example.

[0078] In an embodiment, the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, arranged on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; wherein, the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; a first transition wheel, adjacent to the first cutting wheel, and in the state of pulling the cutting wire, making the cutting wire between the first cutting wheel and the first transition wheel located in the plane where the first cutting wire groove for winding the cutting wire in the first cutting wheel is located; a second transition wheel, adjacent to the second cutting wheel, and in the state of pulling the cutting wire, making the cutting wire between the second cutting wheel and the second transition wheel located in the plane where the second cutting wire groove for winding the cutting wire in the second cutting wheel is located; at least one third transition wheel, arranged between the first transition wheel and the second transition wheel, for pulling the cutting wire between the first transition wheel and the second transition wheel, so as to form a cutting accommodation space in the wire cutting unit, and the cutting accommodation space can accommodate the silicon rod to be cut and only the cutting wire saw in the cutting device intersects with the cutting accommodation space.

[0079] There is a corresponding relationship between the direction of the wheel surface of the cutting wheel and the direction of the cutting wire saw. It should be understood that the wheel surface of the cutting wheel is parallel to the plane where any cutting wire groove in the cutting wheel is located. To control the cutting accuracy and the stability of the cutting process, the cutting wire saw should be located in the plane where the cutting wire groove for winding the cutting wire is located; at the same time, during the cutting process, it is necessary to make the force application direction of the silicon rod on the cutting wire parallel to the cutting wire groove, that is, the wheel surface of the cutting wheel is parallel to the cutting direction, and the cutting direction is the axis direction of the silicon rod during the opening operation.

[0080] In the cutting device of this application, the cutting wire saw is located in the second direction or the plumb line direction. Correspondingly, the wheel surface of the cutting wheel is parallel to the second direction and the axis direction of the silicon rod, that is, the wheel surface of the cutting wheel is in the horizontal plane direction, or the wheel surface of the cutting wheel is parallel to the plumb line direction and the axis direction of the silicon rod.

[0081] Please refer to Figure 5 and Figure 6 , Figure 5 , which shows the structural schematic diagram of the wire cutting unit of the cutting device of this application in an embodiment, Figure 6 shown as Figure 5 the enlarged schematic diagram at A in

[0082] In Figure 5 the illustrated example, the cutting device includes two wire cutting units 22 arranged oppositely, forming two parallel cutting wire saws. Referring to Figure 6 also, in any one of the wire cutting units 22, there are a first cutting wheel 221a and a second cutting wheel 221b, and a cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b to form a cutting wire saw.

[0083] The first cutting wheel 221a includes at least one first cutting wire groove, and the plane where any one of the first cutting wire grooves is located is parallel to the wheel surface of the first cutting wheel; the second cutting wheel 221b includes at least one second cutting wire groove, and the plane where any one of the second cutting wire grooves is located is parallel to the wheel surface of the second cutting wheel.

[0084] The wheel surface of the first cutting wheel 221a and the wheel surface of the second cutting wheel 221b are parallel or coplanar, so that when the cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b, the first cutting wire groove and the second cutting wire groove respectively corresponding to winding the cutting wire 223 are located in the same plane. In this way, the direction of the cutting wire saw can be located in the plane where the first cutting wire groove and the second cutting wire groove for winding the cutting wire 223 are located. It should be understood that the cutting wire 223 is in an operating state during the cutting action, so the cutting wire saw is defined by its spatial position. In the embodiments of the present application, the cutting wire 223 wound between the first cutting wheel 221a and the second cutting wheel 221b is the cutting wire saw.

[0085] It should be understood that when the cutting wire 223 is wound around any cutting wheel, the cutting wire 223 on both sides of the cutting wheel should be located in the plane where the cutting wire groove for winding the cutting wire 223 in the cutting wheel is located.

[0086] When the cutting wire 223 is wound around the first cutting wheel 221a, the cutting wire 223 at one end of the first cutting wire groove is wound to the second cutting wheel 221b to form a cutting wire saw, and the cutting wire 223 at the other end of the first cutting wire groove is wound to the first transition wheel 222a. The first transition wheel 222a is adjacent to the first cutting wheel 221a, and in the state of pulling the cutting wire 223 wound around the first cutting wheel 221a, the cutting wire 223 wound around the first cutting wheel 221a is located in the plane where the first cutting wire groove for winding the cutting wire 223 in the first cutting wheel 221a is located.

[0087] When the cutting wire 223 winds around the second cutting wheel 221b, the cutting wire 223 at one end of the second cutting wire groove winds from being wound around to the first cutting wheel 221a to form a cutting wire saw, and the cutting wire 223 at the other end of the second cutting wire groove winds around the second transition wheel 222b. The second transition wheel 222b is adjacent to the second cutting wheel 221b, and in a state of pulling the cutting wire 223 wound around the second cutting wheel 221b, the cutting wire 223 wound around the second cutting wheel 221b is located in the plane of the second cutting wire groove for winding the cutting wire 223 in the second cutting wheel 221b.

[0088] The first transition wheel 222a and the second transition wheel 222b each have at least one wire guiding groove for pulling the cutting wire 223. The first transition wheel 222a and the second transition wheel 222b are respectively adjacent to the first cutting wheel 221a and the second cutting wheel 221b. Here, the adjacent setting can be on the left side, right side, upper side, lower side, etc., and the present application does not make any restrictions.

[0089] It should be understood that when the cutting wire 223 winds around any cutting wheel or transition wheel, the direction of the cutting wire 223 wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire groove or wire guiding groove.

[0090] The at least one third transition wheel 222c is arranged between the first transition wheel 222a and the second transition wheel 222b for pulling the cutting wire 223 between the first transition wheel 222a and the second transition wheel 222b, so as to form a cutting accommodation space in the wire cutting unit to be processed. The cutting accommodation space can accommodate the silicon rod to be cut and only the cutting wire saw intersects with the cutting accommodation space in the cutting device.

[0091] During the cutting operation, the silicon rod clamp drives the clamped silicon rod to feed relative to the cutting wire saw along the axis direction of the silicon rod. The cutting accommodation space is the movement range of the silicon rod to be cut from the beginning of contacting the cutting wire 223 to the process of the cutting wire 223 penetrating the silicon rod to form the edge skin.

[0092] The cutting accommodation space can accommodate the silicon rod to be cut and only the cutting wire saw intersects with the cutting accommodation space in the cutting device. It should be understood that during the cutting process, it is a problem that needs to be avoided that the silicon rod clamp and the silicon rod to be clamped collide with other components in the silicon rod processing equipment during movement, including the cutting wire 223 (the cutting wire 223 here excludes the cutting wire saw); at the same time, in order to realize cutting, the cutting wire saw and the silicon rod feed relative to each other during the movement of the silicon rod clamp clamping the silicon rod. Therefore, it should be ensured that the cutting accommodation space includes and only includes the silicon rod and the cutting wire saw.

[0093] The first idler wheel 222a, the second idler wheel 222b, and at least one third idler wheel 222c can all be used to achieve the traction of the cutting wire 223 direction. The cutting wire 223 between the first idler wheel 222a and the second idler wheel 222b is tractioned by the third idler wheel 222c to form the cutting accommodation space.

[0094] In some embodiments, the first idler wheel 222a, the second idler wheel 222b, and at least one third idler wheel 222c are used to traction the cutting wire 223 in a direction away from the silicon rod to be cut. It should be understood that the cutting wire 223 between the first cutting wheel 221a and the first idler wheel 222a, and the cutting wire 223 between the second cutting wheel 221b and the second idler wheel 222b are both located in the plane of the first cutting wire groove (or the second cutting wire groove) for winding the cutting wire 223. In one implementation manner, in order to form the cutting accommodation space, the length of the cutting wire 223 between the first cutting wheel 221a and the first idler wheel 222a, and between the second cutting wheel 221b and the second idler wheel 222b can be made long enough, for example, longer than the length of the silicon rod to be cut. However, in this setting, the equipment space occupied by the cutting frame is too large and the layout is unreasonable.

[0095] In some embodiments, the first idler wheel 222a, the second idler wheel 222b, and at least one third idler wheel 222c are used to traction the cutting wire 223 away from the cutting accommodation space.

[0096] Embodiments are provided in the present application to form the cutting accommodation space through the first idler wheel 222a, the second idler wheel 222b, and the third idler wheel 222c. In one implementation manner, an included angle is formed between the wheel surface of at least one of the first idler wheel 222a, the second idler wheel 222b, and the third idler wheel 222c and the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, so that the cutting wire 223 deviates from the plane of the first cutting wire groove (or the second cutting wire groove) for winding the cutting wire 223. To optimize the overall structural layout of the cutting device and the silicon rod processing equipment, the deviation direction can be selected to be away from the cutting accommodation space.

[0097] Taking the example of the cutting device including two wire cutting units arranged oppositely, as shown in Figure 5 the illustrated embodiment, by setting the first idler wheel 222a, the second idler wheel 222b, and the third idler wheel 222c to be inclined in a direction away from the cutting accommodation space, or by arranging the idler wheel on the side of the cutting frame away from the cutting accommodation space, the cutting wire 223 can be made to be away from the cutting accommodation space. In this layout, the equipment space required for the wire cutting unit can be effectively reduced, and it is beneficial to the overall equipment layout of the silicon rod processing equipment.

[0098] Here, for any one of the wire cutting units, the direction away from the cutting accommodation space is the vector of the perpendicular direction of the wheel surface of the cutting wheel. Taking Figure 6 the illustrated embodiment as an example, the directions away from the cutting accommodation space corresponding to two opposite wire cutting units point in opposite directions, which are the directions indicated by the arrows in the figure.

[0099] In some embodiments, the wheel surface of the first idler wheel 222a and the wheel surface of the first cutting wheel 221a may form a certain angle, and the wheel surface of the second idler wheel 222b and the wheel surface of the second cutting wheel 221b may form a certain angle. The direction of the first idler wheel 222a is set only when the cutting wire 223 at the other end of the first cutting wheel 221a is located within the intersection line of the plane of the first cutting wire groove for winding the cutting wire 223 and the plane of the wire guiding groove for winding the cutting wire 223 in the first idler wheel 222a; and the direction of the second idler wheel 222b is set only when the cutting wire 223 at the other end of the second cutting wheel 221b is located within the intersection line of the plane of the second cutting wire groove for winding the cutting wire 223 and the plane of the wire guiding groove for winding the cutting wire 223 in the second idler wheel 222b.

[0100] By setting the first idler wheel 222a and the second idler wheel 222b to form a certain angle with the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, and the angle direction is such that the first idler wheel 222a or the second idler wheel 222b is inclined towards the direction away from the cutting accommodation space, it is beneficial to reduce the number of the required third idler wheels 222c and beneficial to reduce the length of the wire cutting support in the first direction.

[0101] In some embodiments, the cutting wire 223 is wound between the first cutting wheel 221a, the second cutting wheel 221b, the first idler wheel 222a, the second idler wheel 222b and the third idler wheel 222c in a head-to-tail connection manner to form a closed-loop cutting wire 223.

[0102] The cutting wheel and the idler wheels in the wire cutting unit are wound by an annular cutting wire. In this example, the cutting device can omit the wire storage cylinder, and the annular cutting wire can be driven by a driving device to achieve cutting.

[0103] In the existing cutting device, the cutting wire is wound from the wire-unwinding drum to the cutting wheel and transition wheel in the wire-cutting unit, and then wound from the wire-cutting unit to the wire-rewinding drum. During the cutting operation, the cutting wire is driven to run, and the running process of the cutting wire is an alternating acceleration and deceleration process. In the cutting device of the present application, the annular cutting wire in the wire-cutting unit can maintain high-speed operation, and at the same time, the annular cutting wire can run in the same direction during the cutting operation. In this way, the wire-cutting unit of the present application can achieve high-precision cutting operations, avoiding problems such as ripples on the cutting surface caused by the reversal of the cutting wire or the running speed in the existing cutting method; at the same time, the annular cutting wire can effectively reduce the total length of the cutting wire required by the wire-cutting unit, thereby reducing production costs.

[0104] In some embodiments, the wire cutting unit includes two third transition wheels, wherein the cutting wire is sequentially wound around the first cutting wheel, the second cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form a circular cutting wire connected end to end.

[0105] Please refer to Figure 6 Taking the first cutting wheel 221a as the starting point of the winding of the circular cutting wire 223 as an example, the cutting wire 223 is wound from the first cutting wheel 221a to the second cutting wheel 221b, forming a cutting wire saw between the two cutting wheels; the cutting wire 223 is sequentially wound from the second cutting wheel 221b to the second transition wheel 222b, a third transition wheel 222c, another third transition wheel 222c, the first transition wheel 222a, and the first cutting wheel 221a, thereby forming a circular winding connected end to end. At the same time, the cutting wire 223 is pulled and guided by multiple transition wheels, and the cutting accommodating space is formed in the wire cutting unit.

[0106] Of course, it should be understood that the positions of the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c relative to the cutting wheel and the inclination direction of the wheel surface are not limited to the illustrated embodiment, and the cutting accommodation space is formed only when the cutting wire 223 is wound between the multiple cutting wheels and transition wheels of the wire cutting unit. At the same time, the third transition wheel 222c of the wire cutting unit can also be set to three, four, etc., which is not limited in this application.

[0107] In certain embodiments, the cutting device further comprises a cutting wire driving device for driving the cutting wire to operate so as to cut the silicon rod.

[0108] The principle of wire cutting is that a high-speed steel wire drives a cutting blade attached to the steel wire or directly uses a diamond wire to rub the workpiece to be processed, thereby achieving the purpose of wire cutting. Here, the cutting wire driving device is used to realize the operation of the cutting wire.

[0109] In some embodiments, for example Figure 4 in the illustrated embodiment, the cutting wire driving device 224 is a motor having a power output shaft, and the power output shaft is shaft-connected to the first cutting wheel or the second cutting wheel. Thus, the cutting wire can be driven by the wound cutting wheel to run in the winding direction. Of course, in a specific implementation, the cutting wire driving device can also be other driving sources such as a hydraulic motor, as long as it can drive the cutting wire to run, and the present application does not make any restrictions.

[0110] In some embodiments, the cutting device further includes a tension detection mechanism. In wire cutting processing, the magnitude of the cutting wire tension affects the yield and processing accuracy during cutting. The tension detection mechanism performs tension detection and adjustment to make the tension of the cutting wire reach a set threshold value and remain constant during cutting or within a certain range allowed with the constant value as the numerical center.

[0111] In one implementation, when the idler wheel in the wire cutting unit realizes the guiding and traction of the cutting wire, it simultaneously serves as a tensioning wheel for adjusting the cutting wire tension.

[0112] The tensioning wheel is used to adjust the tension of the cutting wire, which can reduce the probability of the cutting wire breaking and thus reduce the consumption of consumables. In cutting operations, the cutting wire plays a crucial role. However, even the best cutting wire has limited elongation and wear resistance, that is, the cutting wire will gradually become thinner during continuous operation until it is finally broken. Therefore, current wire cutting equipment generally designs a cutting wire tension compensation mechanism to compensate for the elongation of the cutting wire during its round-trip movement. Using a tensioning wheel is one implementation means.

[0113] In some embodiments of the application, the tension detection mechanism at least includes: a tension sensor, a servo motor, and a lead screw; the tension sensor is disposed on the idler wheel, continuously senses the tension value of the cutting wire on the idler wheel, and sends a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and starts to work after receiving the driving signal sent by the tension sensor; one end of the lead screw is connected to the tensioning wheel, and the other end is connected to the servo motor, and the idler wheel is pulled to perform a one-way displacement when the servo motor works to adjust the tension of the cutting wire.

[0114] In some embodiments, the cutting device further includes: at least one distance adjustment mechanism disposed in the at least one wire cutting unit for driving the plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame in a direction perpendicular to the wheel surface of the cutting wheel. The cutting device can switch the cutting wire between different cutting grooves of the cutting wheel based on the distance adjustment mechanism, or adjust the position of the wire cutting saw to change the cutting position (or processing specification) relative to the silicon rod.

[0115] In some implementations, please combine Figure 4 , Figure 5 , and Figure 6 . Taking a wire cutting unit 22 in a cutting device as an example for illustration, the wire cutting unit 22 includes a plurality of cutting wheels 221 and idler wheels 222. A carrier for carrying the plurality of cutting wheels 221 and idler wheels 222 is, for example, Figure 5 the wire cutting support 23 shown. The distance adjusting mechanism (not shown) can be used to drive the wire cutting support 23 to move integrally along the perpendicular direction of the wheel surface of the cutting wheel 221. The idler wheel 222 and the cutting wheel 221 jointly move along the perpendicular direction of the wheel surface of the cutting wheel 221 following the wire cutting support 23. In this state, the plurality of cutting wheels 221 and the idler wheels 222 are relatively stationary, that is, the positional relationship between the idler wheel 222 and the cutting wheel 221 remains unchanged. At this time, the distance adjusting mechanism is used to adjust the cutting position of at least one wire saw in at least one wire cutting unit 22 relative to the silicon rod.

[0116] In some embodiments, each cutting wheel has at least two cutting grooves. The different cutting grooves are parallel to each other and have a cutting offset in the perpendicular direction of the wheel surface of the cutting wheel between the different cutting grooves. When the distance adjusting mechanism is used to drive the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the groove position of the cutting wire wound around the cutting wheel can be changed. In one implementation, the plurality of cutting wheels in the wire cutting unit can be connected to a bracket, where the bracket is movably arranged on the wire cutting support and is driven by the distance adjusting mechanism to move along the perpendicular direction of the wheel surface of the cutting wheel.

[0117] When the at least one distance adjusting mechanism is used to realize changing the cutting groove of the cutting wire wound around the plurality of cutting wheels in the at least one wire cutting unit, in an actual scenario, the cutting grooves respectively corresponding to the cutting wire before and after changing the groove can be determined in advance. For example, the position where the cutting wire is located before changing the groove is cutting groove a1, and after changing the groove, the cutting wire is wound around cutting groove a2. Based on the cutting offset between cutting groove a1 and cutting groove a2, the displacement of the at least one distance adjusting mechanism driving the plurality of cutting wheels in the wire cutting unit to move is determined, that is, the displacement is set as the cutting offset between cutting groove a1 and cutting groove a2, which can be used to realize the replacement of the cutting wire from cutting groove a1 to cutting groove a2; it should be noted that the direction in which the at least one distance adjusting mechanism drives the plurality of cutting wheels in the wire cutting unit to move along the perpendicular direction of the wheel surface of the cutting wheel is the direction from cutting groove a2 to cutting groove a1. After changing the groove, the cutting position of the wire saw in space remains unchanged, so the step of further calibrating the position of the cutting wheel or other components is omitted, and the silicon rod can be cut according to the preset cutting amount, simplifying the groove changing process.

[0118] To further illustrate the implementation manner in which the at least one distance adjustment mechanism realizes the movement of multiple cutting wheels in the wire cutting unit relative to the cutting frame in a direction perpendicular to the wheel surface of the cutting wheel, the present application provides the following embodiments. When the number of wire cutting units in the cutting device is different, the specific form of the at least one distance adjustment mechanism can be correspondingly changed.

[0119] In one embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a lead screw, arranged in a direction orthogonal to the wheel surface of the cutting wheel and threadedly connected to the single-wire cutting unit; and a driving source for driving the lead screw to rotate.

[0120] Herein, the single-wire cutting unit is a single wire cutting unit, and the single-wire cutting unit in the wire cutting device includes multiple cutting wheels, and the cutting wire is wound around the multiple cutting wheels to form at least one cutting wire saw. The lead screw of the distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the lead screw can be connected to the driving source and rotated under the drive of the driving source, and the distal end of the lead screw is threadedly connected to the single-wire cutting unit. By means of the connection methods at both ends of the lead screw, the lead screw can rotate based on the transmission of the driving source and convert the rotation of the lead screw into an axial displacement through the threaded connection. The axial displacement direction is the setting direction of the lead screw, that is, the direction orthogonal to the wheel surface of the cutting wheel; by driving the lead screw to rotate through the driving source in the distance adjustment mechanism, the displacement of the single-wire cutting unit in the direction orthogonal to the wheel surface of the cutting wheel can be realized. When the lead screw is driven to rotate in different rotation directions, the cutting wheels of the single-wire cutting unit can move forward or backward in the direction orthogonal to the wheel surface of the cutting wheel.

[0121] In another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a telescopic member, arranged in a direction orthogonal to the wheel surface of the cutting wheel and associated with the single-wire cutting unit; and a driving source for driving the telescopic member to perform a telescopic movement in the direction orthogonal to the wheel surface of the cutting wheel. Herein, the telescopic member can be set as a rod structure, and the extending direction of the rod is the direction orthogonal to the wheel surface of the cutting wheel. The telescopic member can perform a telescopic movement along its extending direction under the drive of the driving source. One end of the telescopic member can be connected to the driving source, and the telescopic free end is associated with the single-wire cutting unit, so that the cutting wheels of the single-wire cutting unit can be driven to move in the direction orthogonal to the wheel surface of the cutting wheel under the action of the driving source. The telescopic member is, for example, an electric telescopic rod, or a connecting rod connected to the conical rod of a cylinder, and the cylinder can be used as the driving source, which is not limited in the present application. The manner in which the telescopic rod is associated with the single-wire cutting unit can be a direct connection or an indirect connection. For example, it can be directly connected to the wire cutting support or the cutting wheel support of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or a bearing. It should be understood that when the telescopic member extends or contracts, it corresponds to the forward or backward movement of the single-wire cutting unit in the direction orthogonal to the wheel surface of the cutting wheel.

[0122] Here, in the embodiments provided in the present application, the association can be achieved, for example, by one or more of snap-fitting, screw-locking, bonding, and welding. For example, in the above embodiments, the telescopic rod can be associated with the wire cutting unit by one or more of snap-fitting, screw-locking, bonding, and welding. Of course, the implementation manner of the association is not limited thereto, and the purpose is to achieve transmission in the second direction.

[0123] In another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a rack disposed along the orthogonal direction of the cutting wheel surface on the single-wire cutting unit; a transmission gear meshing with the rack; and a driving source for driving the transmission gear to rotate. The transmission gear rotates under the drive of the driving source, and the rack meshing with the transmission gear moves correspondingly along the rack step direction. In this example, by the cooperation of the rack and the transmission gear, the rotational motion driven by the driving source can be converted into a linear transportation along the rack direction. The rack is disposed along the orthogonal direction of the cutting wheel surface on the single-wire cutting unit, and can drive the cutting wheel of the single-wire cutting unit to move along the orthogonal direction of the cutting wheel surface. At the same time, by controlling the driving source to switch the rotation direction of the transmission gear, the multiple cutting wheels of the single-wire cutting unit can move forward or backward along the orthogonal direction of the cutting wheel surface.

[0124] In one embodiment, the cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other. At least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjustment mechanism to move along the orthogonal direction of the cutting wheel surface, for adjusting the wire cutting saw distance between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit, or changing the cutting wire wound around the cutting wire grooves of multiple cutting wheels in the first wire cutting unit and / or the cutting wire grooves of multiple cutting wheels in the second wire cutting unit.

[0125] The at least one distance adjustment mechanism can be set to be connected to the first wire cutting unit or the second wire cutting unit, or simultaneously associated with the first wire cutting unit and the second wire cutting unit, so as to drive multiple cutting wheels in the connected or associated first wire cutting unit or / and the second wire cutting unit to move along the orthogonal direction of the cutting wheel surface.

[0126] In one embodiment, the distance adjustment mechanism includes: a lead screw disposed in the orthogonal direction of the cutting wheel surface and threadedly connected to the first wire cutting unit or the second wire cutting unit; and a driving source for driving the lead screw to rotate. The manner in which the lead screw and the driving source drive a plurality of cutting wheels of the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the cutting wheel surface is similar to that of the foregoing embodiment. The first cutting unit or the second wire cutting unit driven by the distance adjustment mechanism can be regarded as a single-wire cutting unit, which will not be elaborated here. It should be understood that by providing the distance adjustment mechanism on any wire cutting unit, the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit can be increased or decreased, and the wire cutting device can cut the silicon rod into different specifications.

[0127] In another embodiment, the distance adjustment mechanism includes: a telescopic member disposed in the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit; and a driving source for driving the telescopic member to perform a telescopic movement in the orthogonal direction of the cutting wheel surface. Here, the first cutting unit or the second wire cutting unit provided with the distance adjustment mechanism can be regarded as a single-wire cutting unit. The specific implementation manner can refer to the foregoing embodiment and will not be elaborated here.

[0128] In yet another embodiment, the distance adjustment mechanism includes: a rack disposed in the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear meshing with the rack; and a driving source for driving the transmission gear to rotate. Through the meshing transmission gear and rack, the driving source can control the rack to move along the rack direction line, and the first wire cutting unit or the second wire cutting unit associated with the rack can drive a plurality of cutting wheels to move in the orthogonal direction of the cutting wheel surface by means of the rack.

[0129] In one embodiment, the distance adjustment mechanism includes: a bidirectional lead screw disposed in the orthogonal direction of the cutting wheel surface and threadedly connected to the first wire cutting unit and the second wire cutting unit; and a driving source for driving the lead screw to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other in the orthogonal direction of the cutting wheel surface. In one implementation manner, the bidirectional lead screw is a double-threaded lead screw, and both ends of the bidirectional lead screw are provided with threads and the thread directions are opposite. The driving source can be disposed at any one end of the bidirectional lead screw to drive the bidirectional lead screw to rotate along the screw axis. By means of the threads with opposite directions at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates driven by the driving source, the movements of both ends of the bidirectional lead screw are converted into axial linear movements in opposite directions, and the axial direction is the orthogonal direction of the cutting wheel surface where the bidirectional lead screw is disposed. Driven by the driving source, the plurality of cutting wheels respectively corresponding to the first wire cutting unit and the second wire cutting unit can move towards each other or away from each other.

[0130] In some embodiments, the distance adjusting mechanism is a servo motor provided on at least one wire cutting unit. In an actual scenario, a servo motor is provided on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the corresponding wire cutting unit is controlled by the servo motor to displace in the orthogonal direction of the cutting wheel surface. The wire cutting unit can be adjusted by a pre-determined cutting offset amount for changing slots or an adjustment amount for changing the cutting position of the cutting wire. With the precise positioning function of the servo motor, a plurality of cutting wheels in the wire cutting unit are driven to move along the orthogonal direction of the cutting wheel surface by a preset displacement amount. For example, in the wire cutting device, there is a single wire cutting unit, and a servo motor is provided on the single wire cutting unit to drive the single wire cutting unit to move along the orthogonal direction of the cutting wheel surface; or, in the wire cutting device, there is a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or / and the second wire cutting unit move relatively independently along the orthogonal direction of the cutting wheel surface driven by their corresponding servo motors. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw. It should be understood that the distance adjusting mechanism is a driving device for driving a plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame, and the specific form thereof is not limited in this application.

[0131] In some embodiments, the first silicon rod clamp is provided in the first processing area through a first guiding structure, wherein the first guiding structure is a transfer rail or a guide post arranged along a first direction; the second silicon rod clamp is provided in the second processing area through a second guiding structure, wherein the second guiding structure is a transfer rail or a guide post arranged along the first direction.

[0132] Please refer to Figure 7 , which shows a partial structural schematic diagram of the silicon rod processing equipment in an embodiment. As shown, it is either the first silicon rod clamp or the second silicon rod clamp and its corresponding guiding structure.

[0133] For the convenience of explaining the silicon rod processing equipment of this application, in the following embodiments provided by this application, the term "guiding structure" can represent any one of the first guiding structure or the second guiding structure; the term "silicon rod clamp" can represent any one of the first silicon rod clamp or the second silicon rod clamp; that is, the first guiding structure and the second guiding structure, as well as the first silicon rod clamp and the second silicon rod clamp, can be distinguished according to their positions in the processing area, and they are similar in specific structure. Of course, the first silicon rod clamp corresponds to the first guiding structure, and the second silicon rod clamp corresponds to the second guiding structure; similarly, the "processing area" can represent any one of the first processing area or the second processing area.

[0134] The following takes the first guiding structure and the corresponding first silicon rod clamp as an example for explanation. As Figure 7In the illustrated embodiment, the guiding structure 131 includes a transfer guide rail disposed along a first direction, i.e., the axis direction of the silicon rod, and the transfer guide rail is used to set a corresponding silicon rod clamp 11 so that the silicon rod clamp 11 can move along the first transfer guide rail.

[0135] It should be understood that the specific form of the guiding structure 131 is not limited to Figure 7 the illustrated embodiment. The guiding structure 131 only needs to be able to set a corresponding silicon rod clamp 11 and form a degree of freedom of movement along the axis direction of the silicon rod. In a specific implementation manner, the guiding structure 131 includes, but is not limited to, guiding columns, cross beams, guide rails, guide grooves, etc.

[0136] The length of the guiding structure 131 can determine the displacement range of the corresponding silicon rod clamp 11 along the axis direction of the silicon rod, and the displacement range can be at least used to achieve square cutting and grinding. Here, in the silicon rod processing equipment, the cutting device and the grinding device do not move along the axis direction of the silicon rod in the cutting state or the grinding state. The silicon rod clamped by the silicon rod clamp 11 drives the silicon rod to move along the axis direction of the silicon rod to achieve the feeding of the cutting wire or the grinding tool relative to the silicon rod. Correspondingly, the length of the guiding structure 131 can at least ensure that the displacement range of the corresponding silicon rod clamp 11 can achieve square cutting and grinding.

[0137] In some examples, the guiding structure 131 is set to have the same length as the machine base 10. In this way, when different positions are respectively set in the machine base 10 along the axis direction of the silicon rod, such as a loading position, an unloading position, a processing position, etc., the silicon rod clamp 11 can drive the clamped silicon rod to move to respectively dock with the loading position, the unloading position, and the processing position.

[0138] It should be understood that in the silicon rod processing equipment of the present application, the silicon rod clamped by the silicon rod clamp drives the silicon rod to move to achieve cutting. During the cutting process, it should be ensured that there is no collision between the silicon rod clamp and the components (including the cutting wire) in the cutting device. Therefore, the specific structure of the silicon rod clamp is related to the cutting device.

[0139] In some embodiments, at least one cutting wire saw is disposed along a second direction. Any one of the first silicon rod clamp or the second silicon rod clamp includes: a clamp arm mounting seat disposed on the corresponding transfer guide rail or guide column; a power source for driving the clamp arm mounting seat to move along the corresponding transfer guide rail or guide column; a pair of clamping parts relatively disposed along the first direction for clamping two end faces of the silicon rod; a pair of clamp arms disposed in the horizontal plane direction, each of which has a proximal end connected to the clamp arm mounting seat and a distal end connected to the clamping part; and a clamp arm driving mechanism for driving at least one of the pair of clamp arms to move along the first direction to adjust the distance between the pair of clamp arms along the first direction.

[0140] Please refer toFigure 1 , Figure 8a 、 Figure 8b , wherein, Figure 8a 、 Figure 8b respectively show a top view and a three-dimensional schematic view of any one of the silicon rod clamps and the corresponding guiding structure.

[0141] For ease of understanding, the silicon rod clamp 11 and the guiding structure 121 located in the first processing position are described below.

[0142] The cutting device 20 includes two wire cutting units arranged oppositely. The cutting device 20 includes two cutting wire saws parallel to each other along the second direction. During the process of feeding the silicon rod to be cut relative to the cutting wire saws, two opposite horizontal cut surfaces are formed on the surface of the silicon rod.

[0143] The silicon rod clamp 11 includes a pair of clamping arms 113 for clamping at two end faces of the silicon rod. Among them, a clamping portion 114 for contacting the end face of the silicon rod is connected to the distal end of the clamping arm 113. The proximal end of the clamping arm 113 is connected to a clamping arm mounting seat 111. The clamping arm mounting seat 111 is movably arranged on the guiding structure and moves along the guiding structure under the drive of a power source 112, thereby driving the clamping arm 113 and the clamping portion 114 at the distal end of the clamping arm 113 to move along the guiding structure. The power source 112 is, for example, a servo motor, and the present application does not make any limitation. The silicon rod clamp 11 further includes a clamping arm driving mechanism 115 for driving at least one of the pair of clamping arms 113 to move along the first direction to adjust the distance between the pair of clamping arms 113 along the first direction. In this way, the clamping portions 114 respectively connected to the distal ends of the pair of clamping arms 113 can approach or move away from each other under the action of the clamping arm driving mechanism 115 to perform the clamping or releasing action on the silicon rod. It should be understood that the axis of the silicon rod is along the first direction. To clamp the silicon rod at two end faces of the silicon rod, the clamping portions 114 respectively corresponding to the distal ends of the pair of clamping arms 113 are arranged oppositely along the first direction. The pair of clamping arms 113 are arranged horizontally. When the power source 112 drives the clamping arm mounting seat 111 to drive the clamping arm 113 and the silicon rod held by it to move along the guiding structure, the moving clamping arm 113 can avoid the cutting wire saw. In some other feasible implementation manners, the pair of clamping arms 113 can also be arranged at a certain angle with the horizontal plane, as long as it is ensured that the moving range of the clamping arm 113 is separated from the cutting wire saw during the process of moving the silicon rod clamp 11 to achieve cutting.

[0144] In some embodiments, the clamping arm driving mechanism 115 includes a lead screw arranged along the first direction and associated with any one of the pair of clamping arms 113; a driving source for driving the associated clamping arm 113 to move along the first direction.

[0145] The lead screw of the clamping arm driving mechanism has a distal end and a proximal end. In a specific implementation, for example, the proximal end of the lead screw can be connected to a driving source and rotated under the drive of the driving source. The distal end of the lead screw is threadedly connected to any one of the pair of clamping arms. By means of the connection modes at both ends of the lead screw, the lead screw can rotate based on the transmission of the driving source and convert the rotation of the lead screw into an axial displacement through the threaded connection. The axial displacement direction is the setting direction of the lead screw, i.e., the first direction. By driving the lead screw to rotate by the driving source, the clamping arm connected to the distal end of the lead screw can be moved in the first direction. When the rotation direction of the lead screw driven by the driving source is changed, the associated clamping arm can move forward or backward in the first direction.

[0146] In some embodiments, the clamping arm driving mechanism includes: a bidirectional lead screw disposed along the first direction and threadedly connected to the pair of clamping arms at both ends; a driving source for driving the lead screw to rotate so that the pair of clamping arms move towards each other or away from each other in the first direction.

[0147] Please refer to Figure 8a 、 Figure 8b In an implementation, the bidirectional lead screw of the clamping arm driving mechanism 115 is threadedly connected to the pair of clamping arms 113 at both ends, and the bidirectional lead screw is a double-threaded lead screw with opposite thread directions at both ends. The driving source can be disposed at any end of the bidirectional lead screw or connected to the bidirectional lead screw (such as Figure 8b shown state) to drive the bidirectional lead screw to rotate along the lead screw axis. By means of the opposite-threaded threads at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates under the drive of the driving source, the movements at both ends of the bidirectional lead screw are converted into linear movements in opposite directions along the lead screw axis and the first direction. Under the drive of the driving source, the pair of clamping arms 113 can move towards each other or away from each other in the first direction.

[0148] In an embodiment, the clamping arm mounting seat 111 can be multiple mounting seats connected by the clamping arm driving mechanism 115. As shown in the embodiments of Figure 8a 、 Figure 8b , any one of the pair of clamping arms 113 corresponds to a clamping arm mounting seat 111, and the driving source is disposed on the clamping arm mounting seat 111 between the pair of clamping arms 113. Here, any clamping arm 113 can move along the guiding structure 131. When the silicon rod clamp needs to move integrally along the guiding structure 131, for example, the driving source of the clamping arm driving mechanism 115 can be controlled to make the pair of clamping arms 131 relatively stationary. At this time, the different clamping arm mounting seats 111 can be made relatively stationary through the connection function of the clamping arm driving mechanism 115, and the power source of the silicon rod clamp can drive any clamping arm mounting seat 111 to move along the guiding structure 131 to achieve the overall movement of the silicon rod clamp.

[0149] In yet another implementation, the jaw driving mechanism includes a first rack, a second rack, and a driving gear; the first rack and the second rack are respectively linked to a jaw, the driving gear is connected to the power output shaft of a driving motor (not shown) and meshes with the first rack and the second rack, and the driving gear is configured to drive the pair of jaws to move towards each other to perform a clamping action when rotating forward, and drive the pair of jaws to move away from each other to perform a releasing action when rotating reversely.

[0150] In some embodiments, either the first silicon rod clamp or the second silicon rod clamp further includes a clamping part rotating mechanism for driving the clamping part to rotate.

[0151] In one implementation of this embodiment, the clamping parts 114 corresponding to the pair of jaws 113 are provided with rotatable structures such as rotatable bases, and the clamping part rotating mechanism 116 can be configured to drive the clamping parts 114 corresponding to at least one jaw 113 to rotate. The clamping part rotating mechanism 116 drives the clamping part 114 to rotate about the first direction as the axis, thereby causing the clamped silicon rod to rotate along the axis of the silicon rod. During cutting and grinding operations, by driving the silicon rod to rotate along its axis through the clamping part rotating mechanism 116, the positional relationship between the clamped silicon rod and the cutting wire saw can be adjusted, thereby determining the cutting surface of the silicon rod by the cutting device, and the positional relationship between the clamped silicon rod and the grinding device can be adjusted to determine the grinding surface relative to the silicon rod, that is, the silicon rod clamp can cooperate with the cutting device and the grinding device to realize the selection and control of different cutting surfaces and grinding surfaces of the silicon rod.

[0152] In some embodiments, the clamping part has a multi-point contact clamping head. It should be understood that the contact mode between the multi-point contact clamping head and the end face of the silicon rod is not limited to point contact. For example, the clamping part has a plurality of protruding parts to contact the end face of the silicon rod, and each protruding part and the end face of the silicon rod can be surface contact. In one implementation, the protruding parts of the clamping part can also be connected to the clamping part base through a spring along the first direction, thereby forming a multi-point floating contact, so that the silicon rod clamp can adapt to the flatness of the end face of the silicon rod to clamp the silicon rod when clamping the end face of the silicon rod. In some examples, the clamping end of the clamping part for contacting the end face of the silicon rod can also be connected to the clamping part base through a universal mechanism such as a universal ball, and the clamping part can thus adapt to clamp the end faces of silicon rods with different inclinations.

[0153] In some embodiments, the pair of clamping parts of the silicon rod clamp for contacting the silicon rod are set as rigid structures to prevent the clamped silicon rod from being disturbed during cutting and grinding operations and affecting the processing accuracy.

[0154] Please refer to Figure 9 which is shown as Figure 8aSchematic enlarged structure diagram of the clamping part of the silicon rod clamp. As Figure 9 shown, the clamping part 114 includes a rotatable base and a series of protruding contacts 1141 arranged on the base, and each contact 1141 has a contact plane. The frustum rotates driven by the clamping part rotating mechanism 116. In an implementation manner of this embodiment, the protruding length of the contact 1141, that is, the position in the first direction, is adjustable, so that during the process of clamping the silicon rod, for a silicon rod with a lower end face flatness, the protruding length of the contact 1141 can be adjusted according to the end face of the silicon rod, so that each contact surface is in a tight state with the end face of the silicon rod.

[0155] In an embodiment of the present application, a pressure sensor may also be provided in one of the clamping parts corresponding to a pair of clamping arms, so as to adjust the protruding length of the contact based on the detected pressure state, or alternatively, the clamping arm driving mechanism may be controlled based on the detection data of the pressure sensor to determine the distance between the pair of clamping arms in the first direction. Generally, during the process of clamping the silicon rod, a pair of clamping arms of the silicon rod clamp move closer to each other in the first direction driven by the clamping arm driving mechanism until the clamping part contacts the end face of the silicon rod to be clamped. When the clamping end is provided with a plurality of contacts and it is detected that the pressure value of some contacts contacting the end face of the silicon rod in contact is less than a set value or a set area, the protruding length of the contact can be adjusted (generally in the direction close to the end face of the silicon rod) to change the clamping degree; alternatively, during the process of clamping the silicon rod, a pair of clamping arms are driven by the clamping arm driving mechanism to move closer to the end faces at both ends of the silicon rod to achieve clamping. After the clamping end contacts the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor. When the set pressure range is reached, the clamping arm driving mechanism controls the pair of clamping arms to stop moving towards each other, and the clamping state of the silicon rod can be maintained.

[0156] In some embodiments, at least one of the cutting wire saws is arranged along the vertical line direction. In some embodiments where the cutting wire saw is arranged along the vertical line direction, any one of the first silicon rod clamp or the second silicon rod clamp includes: a clamping arm mounting seat arranged on the corresponding transfer guide rail or guide post; a power source for driving the clamping arm mounting seat to move along the corresponding transfer guide rail or guide post; a pair of clamping parts arranged opposite to each other in the first direction for clamping the two end faces of the silicon rod; a pair of clamping arms arranged in a plane perpendicular to the second direction, and each clamping arm has a proximal end connected to the clamping arm mounting seat and a distal end connected to the clamping part; a clamping arm driving mechanism for driving at least one of the pair of clamping arms to move in the first direction to adjust the distance between the pair of clamping arms in the first direction.

[0157] Herein, the clamping arm mounting seat of the silicon rod clamp, the pair of clamping portions, and the clamping arm driving mechanism may refer to the foregoing embodiments, and will not be elaborated herein. It should be noted that the pair of clamping arms in the silicon rod clamp are arranged in a plane perpendicular to the second direction, so that during the movement of the pair of clamping arms and the silicon rod being clamped along the guiding structure, the silicon rod being clamped contacts the cutting wire saw, and at the same time the pair of clamping arms are separated from the cutting wire saw. In some other feasible implementation manners, the pair of clamping arms may also be arranged in other directions, as long as it is ensured that the moving range of the clamping arms is separated from the cutting wire saw during the movement of the silicon rod clamp to achieve cutting.

[0158] In some embodiments where the cutting wire saw is arranged along the plumb line direction, any one of the first silicon rod clamp and the second silicon rod clamp further includes a clamping portion rotating mechanism for driving the clamping portion to rotate; the specific implementation manner may refer to the foregoing embodiments, and will not be elaborated herein.

[0159] In some embodiments where the cutting wire saw is arranged along the plumb line direction, the clamping arm driving mechanism includes: a lead screw arranged along the first direction and associated with any one of the pair of clamping arms; a driving source for driving the associated clamping arm to move along the first direction; the specific implementation manner may refer to the foregoing embodiments, and will not be elaborated herein.

[0160] In some embodiments where the cutting wire saw is arranged along the plumb line direction, the clamping arm driving mechanism includes: a bidirectional lead screw arranged along the first direction and threadedly connected to the pair of clamping arms at both ends; a driving source for driving the lead screw to rotate so that the pair of clamping arms move towards each other or away from each other along the first direction; the specific implementation manner may refer to the foregoing embodiments, and will not be elaborated herein.

[0161] At the first processing location and the second processing location, cutting is achieved by coordinating the relative movement between the cutting device and the corresponding silicon rod clamp. In some examples, a loading location and an unloading location are also provided in the silicon rod processing equipment, for example Figure 1 As shown, when the loading location and the processing location are adjacent to each other along the first direction, the silicon rod clamp always clamps the silicon rod to be cut from the loading location and transports the silicon rod to be cut to the processing location along the direction of the arrow shown in the figure.

[0162] It should be understood that during the cutting process, the feeding direction of the silicon rod relative to the cutting wire saw is towards the side of the cutting wheel axis to prevent the cutting wire from being deflected out of the cutting wire groove during cutting, as shown in Figure 1 the embodiment shown, the silicon rod clamp should drive the silicon rod to be cut to feed relative to the cutting wire saw in the direction of the arrow shown in the figure to achieve cutting.

[0163] In some implementation scenarios, the distance adjustment mechanism can also be used to move the wire saw for cutting to avoid the silicon rod to be cut. For example, when the cutting device includes two wire cutting units arranged oppositely, two side surfaces can be formed on the surface of the silicon rod during one cutting. In this case, it is necessary to drive the silicon rod fixture to rotate the silicon rod by a certain angle along its axis, and then the wire saw for cutting performs a second cut on the silicon rod to obtain a cut silicon rod with a rectangular or quasi-rectangular cross-section. After the first cut is performed, the silicon rod fixture drives the clamped silicon rod to shift in the first direction to return to the side near the loading position area. The distance adjustment mechanism can drive the wire saw for cutting to move away from the silicon rod to avoid interference with the silicon rod. When the position of the silicon rod returns to the side near the loading position area, the feeding direction of the silicon rod relative to the wire saw for cutting is toward the side of the cutting wheel axis. Based on the preset cutting amount of the silicon rod, the position of the wire saw for cutting can be readjusted to perform the second side cut, thereby obtaining the cut silicon rod.

[0164] In some implementation manners, the silicon rod processing equipment further includes a side skin discharging position area, and the side skin discharging position area can be arranged adjacent to the processing position area along the first direction. Please refer to Figure 10 , which shows a partial structural schematic diagram of the silicon rod processing equipment of the present application in an embodiment. In this example, for the convenience of realizing the transfer of the side skin, the feeding direction of the silicon rod fixture relative to the wire saw for cutting can be set to be the direction toward the side skin discharging position area (i.e., Figure 10 the arrow direction shown), so that the discharging process of the side skin can be simplified or the structure for discharging the side skin can be simplified.

[0165] In some implementation manners, the silicon rod processing equipment further includes a side skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the cut side skin.

[0166] In actual production, removing the cut side skin can prevent the cut silicon rod from colliding with the side skin during transportation. At the same time, removing the side skin can realize its reuse. In the silicon rod processing equipment of the present application, the silicon rod to be cut clamped by the silicon rod fixture is in a horizontal state, and thus the cut side skin is also in a horizontal state. In this example, it is necessary to support the side skin during cutting to assist in removing the side skin; at the same time, the side skin formed on the horizontal silicon rod during cutting is no longer subjected to the clamping force of the silicon rod fixture. Before the wire saw for cutting completely penetrates the silicon rod, the connecting part between the side skin and the silicon rod may break due to the moment formed by the gravity of the side skin (also known as edge chipping). Thus, the side skin supporting mechanism of the present application can also prevent edge chipping by supporting the side skin.

[0167] In some embodiments, the edge skin supporting mechanism includes: a supporting assembly, including: a supporting portion that is abutted against and supports the edge skin; a cylinder or a hydraulic pump, including a telescopic portion, and the telescopic portion is connected to the supporting portion to control the supporting portion to move away from or abut against the edge skin; and a mounting portion for connecting the supporting assembly to the cutting frame.

[0168] The supporting assembly can be connected to the cutting frame through the mounting portion. In some examples, the mounting portion is detachably connected to the cutting frame. Based on the need for the supporting position of the silicon rod, the mounting portion can be arranged at different positions on the cutting frame.

[0169] The supporting assembly includes a supporting portion, and the supporting portion is used to contact and abut against the silicon rod to achieve the supporting effect on the edge skin. It should be noted that in the embodiments of the present application, the supporting effect is to apply a force to the edge skin to keep the edge skin in a stable state. Taking the cutting wire saw in the second direction as an example, the edge skin formed by cutting is located on the upper side or the lower side of the silicon rod. At this time, the supporting portion can provide a supporting force to the edge skin on the lower side of the silicon rod to prevent the edge skin from breaking, thereby keeping the edge skin in a stable state; or when the cutting wire saw is arranged in the direction of the plumb line and the edge skin formed by cutting is located beside the silicon rod (left side or / and right side), the supporting portion can be set to a structure adapted to the outer arc surface of the silicon rod to provide a supporting force to the edge skin, or to abut against the edge skin to make the edge skin receive an upward frictional force and maintain a stable state. The cylinder or the hydraulic pump of the supporting assembly is a driving source for driving the supporting portion to move away from or abut against the edge skin. In one implementation, the telescopic portion of the cylinder or the hydraulic pump is connected to the supporting portion, and the telescopic direction of the telescopic portion is, for example, a direction away from or close to the axis of the silicon rod, thereby driving the connected supporting portion to move away from or abut against the edge skin.

[0170] The supporting portion can be set to different structures to achieve the supporting effect. For example, the supporting portion can be a supporting plate and has an arc surface for contacting the edge skin, or the supporting portion is a supporting plate with a folded edge to prevent the edge skin from rolling. For example, the cross-section of the supporting plate is an open inverted trapezoid; it should be understood that there are various implementation ways for the supporting portion that can be used to achieve the supporting of the edge skin, and the present application does not make any restrictions.

[0171] To achieve the stable support of the edge skin formed by cutting to prevent the edge skin from breaking, or to simplify the discharging and transferring of the edge skin, the present application also provides the following implementation ways:

[0172] In one example, the supporting portion includes at least two supporting blocks, which are arranged at intervals along the first direction and have a bearing surface for contacting and bearing the edge skin. The bearing surface of the supporting block can be set to have an arc surface to adapt to the edge skin to be supported, or can be set to be composed of contact planes with different levels to prevent the edge skin from rolling.

[0173] It should be understood that in some processing scenarios, the support for the edge skin can be achieved by a single support block; here, the present application also provides an embodiment in which at least two support blocks arranged at intervals in the first direction are used to support the edge skin. By setting the interval or span in the first direction between the at least two support blocks, the support for the edge skin formed by cutting silicon rods of different length specifications can be achieved. At the same time, the edge skin is supported by the support blocks arranged at intervals, so that the edge skin can be subjected to the acting force of the supporting part in different length directions (i.e., the first direction), which is beneficial to preventing the edge skin in front of the silicon rod from breaking before the cutting wire saw penetrates through the silicon rod. After the cutting wire saw penetrates through the silicon rod to form an edge skin independent of the silicon rod, the at least two support blocks arranged at intervals can be used to support the edge skin to prevent the edge skin from tilting and falling.

[0174] In another example, the supporting part includes: at least two supporting rods arranged in the first direction for contacting and supporting the edge skin; a connecting part arranged on opposite sides of the cutting frame in the first direction corresponding to opposite ends of the supporting rods for connecting the at least two supporting rods and the telescopic part.

[0175] Please refer to Figure 11 , which shows a partial structural schematic diagram of the silicon rod processing equipment of the present application in an embodiment. As shown in the figure, the supporting part includes two supporting rods 5111 arranged at intervals in the second direction, and the rod bodies of the supporting rods 5111 are in the first direction.

[0176] Here, the supporting effect on the edge skin can be achieved through the at least two supporting rods 5111. It should be understood that the center of gravity of the edge skin formed by cutting is located between the at least two supporting rods 5111 to achieve the support for the edge skin; at the same time, any one of the supporting rods 5111 is in line contact with the supported edge skin. Under this setting, the friction between the supporting part and the edge skin can be reduced.

[0177] The connecting part 5112 is arranged on both sides of the supporting rod 5111, so that the supporting rod 5111 is symmetrically stressed when the supporting part is stressed away from or close to the silicon rod, which is beneficial to improving the structural stability of the supporting part. As Figure 11 shown in the embodiment, the connecting part 5112 is respectively connected to the supporting rod 5111 and the telescopic part 512. Among them, one end of the telescopic part 512 is connected to the cutting frame through the installation part, and the free end that can be telescopically moved is connected to the connecting part 5112 to drive the whole supporting part to move along the telescopic direction of the telescopic part 512.

[0178] In Figure 11In the example shown, the supporting portion is controlled to move along the direction of the vertical line to move away from or closer to the edge skin; it should be understood that when the direction of the cutting wire saw in the cutting device is different, or when the structure of the supporting portion is different, the corresponding telescopic portion 512 in the edge skin supporting mechanism can be set in different directions to adapt to the need to support the edge skin. For example, when the cutting wire saw in the cutting device is along the direction of the vertical line, the telescopic portion 512 can be set to telescope along the second direction, so that the supporting portion moves along the second direction to move closer to or away from the edge skin. This application does not limit the direction of the controlled movement of the supporting portion, as long as the supporting portion can achieve the supporting effect on the edge skin.

[0179] The number of the edge skin supporting mechanisms can be set according to the need to support the edge skin. For example, when the cutting device includes a cutting wire saw, a side skin is correspondingly formed in one cutting operation, and a side skin supporting mechanism can be set on the cutting frame to support the edge skin; for another example, when the cutting device includes two parallel cutting wire saws, two side skins are correspondingly formed in one cutting operation, and two side skin supporting mechanisms can be set on the cutting frame to support the side skins on both sides of the silicon rod respectively.

[0180] In some embodiments, the silicon rod processing equipment further includes a side skin dislocation mechanism, which is disposed in the first processing position and the second processing position, and is used to push the side skin along the first direction to make the side skin detach from the side skin supporting mechanism. The cutting device can be switched between the first processing position and the second processing position by the first conversion mechanism. In one example, the side skin dislocation mechanism can be respectively disposed in the first processing position and the second processing position. After the cutting device is transferred to any processing position, the side skin formed after cutting can be pushed by the side skin dislocation mechanism in the processing position to help realize the side skin unloading.

[0181] In other embodiments, the edge skin dislocation mechanism may be provided on the cutting frame, and the edge skin dislocation mechanism may rotate with the cutting frame under the drive of the first conversion mechanism, so as to push the edge skin formed after cutting in any processing position. In some embodiments, when the cutting wire saw in the cutting device is arranged along the second direction, the edge skin supporting mechanism may be respectively provided on the upper side and the lower side of the cutting frame, so that the cutting device has a corresponding edge skin dislocation mechanism for pushing the lower edge skin formed by cutting the silicon rod in the process of converting the processing position.

[0182] It should be understood that the axial direction of the silicon rod to be cut is along the first direction, and the edge skin formed during cutting is also along the first direction when supported. The edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin move relative to the edge skin supporting mechanism, so that the edge skin can be separated from the edge skin supporting mechanism and the subsequent transportation process of the edge skin can be carried out.

[0183] In one implementation, the edge skin dislocation mechanism includes a cylinder or a hydraulic pump, wherein the telescopic rod of the cylinder or the hydraulic pump is arranged along a first direction.

[0184] Please refer to Figure 10 , Figure 11 , as shown in the figure, the edge skin dislocation mechanism 54 is arranged on the silicon rod processing platform. The edge skin dislocation mechanism 54 is a cylinder 541 with a telescopic rod. The telescopic rod is arranged along the first direction and aligned with the edge skin end face. After the wire saw penetrates the silicon rod to form an independent edge skin, the edge skin dislocation mechanism 54 moves along the first direction to abut against the edge skin end face and push the edge skin to move, so that the edge skin can be separated from the edge skin supporting mechanism or the cut silicon rod. Here, the telescopic range of the telescopic rod of the edge skin dislocation mechanism 54 can be determined based on the length specification of the silicon rod or based on the span of the supporting part in the edge skin supporting mechanism in the first direction to ensure that the edge skin can be separated.

[0185] In some embodiments, the silicon rod processing equipment further includes an edge skin conveying structure for receiving the cut edge skin and transporting the edge skin to the unloading area. Here, the unloading area is the edge skin unloading area.

[0186] In one embodiment, the edge skin conveying structures are respectively arranged at the first processing position and the second processing position, so that the edge skin formed by cutting the silicon rod when the cutting device is switched to any processing position can be conveyed by the edge skin conveying structure corresponding to the processing position, thereby reducing the transportation of the edge skin.

[0187] Please continue to refer to Figure 10 , the arrangement direction and position of the edge skin conveying mechanism 52 can be determined by the positional relationship between the cutting area and the edge skin unloading area. In the silicon rod processing equipment of the present application, the cutting area is the first processing position and the second processing position. In one implementation, the edge skin unloading area and the cutting area are arranged adjacent to each other along the first direction. Here, the edge skin conveying structure can be arranged along the first direction and respectively docked with the silicon rod clamps corresponding to the first processing position and the second processing position, so that after the silicon rod clamped by the silicon rod clamp is cut to form an edge skin, the edge skin is pushed along the first direction to be separated from the cut silicon rod or the edge skin supporting mechanism and then transferred to the edge skin conveying structure corresponding to the processing position where it is located, thereby simplifying the transportation path of the edge skin.

[0188] In some embodiments, the edge skin conveying mechanism is a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

[0189] In one implementation, the edge skin conveying mechanism includes: a conveying part for carrying the edge skin; a conveying driving source for driving the conveying part to move to convey the edge skin.

[0190] In one embodiment, the edge skin conveying mechanism 52 includes: a conveying part 521 for carrying the edge skin; and a conveying driving source 522 for driving the conveying part 521 to move so as to convey the edge skin.

[0191] In some examples, in order to prevent the edge skin from being worn due to collision during conveying, in some embodiments, the conveying part 521 is provided with a buffer pad for contacting the edge skin, or alternatively, the conveying part 521 is made of a buffer material. The buffer pad or the buffer material is, for example, elastic rubber, silica gel, or other materials having elastic deformation, damping characteristics, or buffer characteristics.

[0192] As Figure 10 shown in the embodiment, herein, the conveying part 521 can be arranged along the first direction and, under the drive of the conveying driving source 522, convey the carried edge skin along the first direction. The conveying driving source 522 is, for example, a motor for driving the conveying part 521 to move and controlling the conveying speed of the conveying part 521.

[0193] In the silicon rod processing equipment of the present application, after the silicon rod clamp drives the clamped silicon rod to move along the first direction to cut and form a cut silicon rod, the grinding device is driven by the second changing mechanism to be converted to the processing position where the cut silicon rod is located, and the grinding device can perform a grinding operation on the cut silicon rod.

[0194] In certain embodiments, the grinding device includes at least a pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are located in opposite horizontal planes; and a grinding tool advancing and retracting mechanism for driving at least one of the pair of grinding tools to move along the vertical direction.

[0195] Please refer to Figure 12 , which shows a schematic structural diagram of a part of the silicon rod processing equipment of the present application in one embodiment. The pair of grinding tools 301 are arranged oppositely in the vertical direction to form two opposite grinding surfaces in the horizontal plane direction. In certain implementation manners, the grinding tool 301 includes a grinding wheel and a rotating shaft. In certain embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is connected to the rotating shaft to be controlled to rotate along the rotating shaft, and thus can contact the side surface of the silicon rod to be cut in a rotating state to achieve grinding. It should be understood that in a feasible embodiment, the grinding device 30 may also include one grinding tool 301, but in this setting, the grinding time increases.

[0196] The grinding wheel has a certain particle size and roughness, and is, for example, consolidated by abrasive grains and a binder to form a surface with abrasive grains to contact and grind the side surface of the cut silicon rod. The grinding wheel has a certain abrasive grain size and abrasive grain density, and its abrasive can be set to abrasive grains such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc. whose hardness is greater than the hardness of the silicon material according to the need for grinding the silicon rod.

[0197] In an embodiment of the present application, the grinding device 30 further includes a cooling device (not shown) to cool the grinding tool 301, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and service life of the grinding wheel. In an implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole. In some embodiments, a protective cover for preventing cooling water from entering the rotary drive motor is provided on the outer circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The diversion groove is provided on the protective cover as the contact point between the protective cover and the cooling water pipe, and the diversion hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source, and the cooling water sucked through the cooling water pipe reaches the diversion groove and diversion hole on the surface of the grinding wheel, and is guided to directly reach the contact surface between the grinding wheel and the silicon rod to be ground for cooling. During the grinding of the grinding wheel, the cooling water in the diversion hole enters the interior of the grinding wheel by centrifugal action for sufficient cooling.

[0198] The grinding tool advancing and retracting mechanism 302 is used to drive at least one grinding tool 301 in the at least one pair of grinding tools 301 to move along the vertical line direction to adjust the grinding amount of the silicon rod after cutting. In some embodiments, the grinding tool advancing and retracting mechanism 302 includes: an advancing and retracting guide rail, which is arranged along the vertical line direction on the second conversion mechanism and is used to arrange the grinding tool 301; a driving source, which is used to drive at least one of the grinding tools 301 to move along the advancing and retracting guide rail.

[0199] In an implementation manner, the grinding tool advancing and retracting mechanism 302 includes a sliding guide rail, a driving motor, and a ball screw (not shown in the figure). The sliding guide rail is arranged along the vertical line direction on the second conversion mechanism. The grinding tool 301 is provided with a guide groove along the vertical line direction that cooperates with the sliding guide rail. The ball screw is arranged along the sliding guide rail and is axially connected to the driving motor. In other feasible implementation manners, the driving source can also be set as a cylinder, a hydraulic pump, etc., and its telescopic direction is set as the vertical line direction; alternatively, the driving source can be set as a screw rod assembly, and the screw rod assembly includes a screw rod and a rotational driving source, wherein the screw rod is connected to the grinding tool 301 to drive the grinding tool 301 to move along the sliding guide rail under the drive of the rotational driving source.

[0200] In some embodiments, the grinding tool advancing and retracting mechanism includes a bidirectional screw rod and a driving source. The two sides of the bidirectional screw rod are provided with threads with opposite helix directions. The bidirectional screw rod is arranged along the vertical line direction and is respectively connected to a grinding tool on both sides. In this setting, the driving source drives the bidirectional screw rod to rotate, and the grinding tools at both ends of the bidirectional screw rod approach or move away from each other along the vertical line direction. Thus, the grinding position and grinding amount of the grinding tool relative to the silicon rod can be adjusted.

[0201] Generally, the grinding tool is in a fatigue state during use. Uneven wear of different regions on the surface of the grinding tool causes the surface of the grinding tool to be uneven or the flatness to decrease. The surface of the grinding tool may be contaminated with silicon rod debris or grinding tool debris. Therefore, performing grinding operations for a long time will inevitably change the surface state of the grinding tool, resulting in a decrease in grinding performance. To improve the service life of the grinding tool, tools such as grindstones can be used to correct the surface of the grinding tool, or the grinding tool can be replaced after it reaches its fatigue life.

[0202] Herein, the silicon rod processing equipment of the present application further provides a grinding repair device, which can be used to grind and repair the grinding tool to ensure that the grinding tool can reach the required accuracy after being used for silicon rod grinding. Among them, the grinding repair device includes a mounting body and at least one grinding and repairing part; wherein, the at least one grinding and repairing part is arranged on the mounting body and is used for grinding and repairing the corresponding at least one grinding tool.

[0203] In some embodiments, either the first silicon rod clamp or the second silicon rod clamp further includes a grinding repair device for grinding and repairing the grinding tool in the corresponding grinding device.

[0204] Please refer to Figure 13 , shown as Figure 8b the enlarged schematic view at B in. As shown in the figure, the grinding repair device is configured on the silicon rod clamp, that is, the mounting body 321 in the grinding repair device is arranged on one of the clamping arms of the silicon rod clamp, and the grinding and repairing part 322 in the grinding repair device is arranged on the side of the mounting body 321 facing the grinding tool. For example, in Figure 13 the illustrated embodiment, the grinding and repairing parts 322 are respectively located on the upper side and the lower side of the clamping arm and respectively face the grinding tools on the upper side and the lower side. The mounting body 321 and the grinding and repairing part 322 thereon make a reciprocating motion along the first direction under the drive of the corresponding silicon rod clamp (the first silicon rod clamp or the second silicon rod clamp).

[0205] In other embodiments, the mounting body in the grinding repair device can be arranged on the machine base of the silicon rod processing equipment, the grinding and repairing part in the grinding repair device is arranged on the mounting body, and the grinding repair device can further include a driving unit for driving the mounting body and the grinding and repairing part thereon to make a reciprocating motion along a predetermined direction.

[0206] Please refer to in combination Figure 12 , Figure 13 , herein, the grinding and repairing part 322 of the grinding repair device has a surface for contacting the grinding tool. In some embodiments, the grinding and repairing part 322 as a whole has properties such as high adhesion, wear resistance, and hardness for grinding the grinding tool.

[0207] In some embodiments, the grinding part 322 is an oil stone. Here, the oil stone is, for example, diamond oil stone, boron carbide oil stone, fine grinding oil stone, ordinary oil stone, etc. The oil stone can trim the surface of the contacted abrasive tool by means of the particle size of the oil stone surface. During the grinding process, the surface of the oil stone contacts the abrasive tool, trims the surface of the abrasive tool to a uniform particle size, and improves the flatness and verticality of the abrasive tool surface.

[0208] In some embodiments, when the at least one grinding portion is grinding the corresponding at least one grinding tool, the at least one grinding tool is driven by a driving motor to rotate.

[0209] Compared with the traditional grinding method, the grinding tool is usually in a rotating state when it contacts a grinding device such as an oilstone to achieve grinding. Therefore, there may be high and low points on the surface of the oilstone, resulting in poor flatness of the surface of the grinding tool after grinding. In the embodiment provided in the present application, the grinding part such as the oilstone in the grinding and repairing device of the present application grinds in a reciprocating motion. The plane formed by the oilstone itself under the reciprocating motion is different from the plane of the oilstone in the static state. Under the reciprocating motion, the surface of the oilstone (i.e., the plane used for grinding) has no high and low points, so the surface of the grinding tool can be smoothed and the grinding quality can be improved. Furthermore, the grinding efficiency is related to the rotation speed between the workpieces during grinding. The reciprocating motion state of the grinding part corresponds to the rotating state of the grinding tool. Therefore, relative motion will occur between the grinding tool and the grinding part, which is beneficial to the easy implementation of the grinding process and the improvement of grinding efficiency.

[0210] In some embodiments, the grinding surface of the grinding portion is rectangular, circular, elliptical, annular, regular polygonal or other custom shapes, etc. It should be understood that grinding and repair can be achieved only when the grinding portion is made of a preset material that meets the grinding requirements and can achieve surface contact with the grinding tool. The above-mentioned shapes are only optional embodiments and are not limited in this application.

[0211] In certain embodiments, the grinding and repairing device further includes a sensor device, which is disposed on the base and is used to detect the grinding tool of the silicon rod processing equipment.

[0212] The grinding and repairing device is designed to repair the grinding surface of the grinding tool. After being ground and repaired by the grinding and repairing part, the surface layer of the grinding tool is ground and removed. For example, when the grinding tool is a grinding wheel, the particles on the surface of the grinding wheel are gradually removed after grinding and repairing. Usually, a certain thickness of the grinding wheel is removed after the grinding and repairing is completed, so as to form a new grinding surface that meets the grinding surface requirements for silicon rod processing. In the subsequent grinding surface processing of the silicon rod, the side surface of the silicon rod is ground with the new grinding surface. Here, it should be noted that the grinding amount of the silicon rod needs to be controlled during the grinding surface operation of the silicon rod. The grinding amount can be determined in advance based on the specifications of the silicon rod processing equipment and the specifications of the silicon rod. For example, in the silicon rod processing equipment, the grinding tool can usually move relative to the silicon rod in a feeding motion. In the control system of the silicon rod processing equipment, the initial position of the grinding surface of the grinding tool can be used as a known input value (or obtained by calculating multiple input values). Thus, the feeding of the grinding tool relative to the silicon rod can be controlled based on the preset grinding amount. However, after the grinding tool is ground and repaired by the grinding and repairing device, the initial position of the grinding surface has changed. Therefore, the silicon rod processing equipment needs to know the specifications of the grinding tool during grinding and repairing, so as to correct the actual position of the grinding surface and control the grinding amount of the silicon rod according to the preset value during subsequent processing.

[0213] Here, in the example of the present application, the sensor component in the grinding and repairing device can be used to determine the dimensional specifications (mainly the thickness) of the grinding tool after the grinding and repairing is completed. Here, the sensor component can confirm the size of the grinding tool after grinding by determining the distance from the sensor to the grinding surface or the distance between the two grinding surfaces of a pair of relatively arranged grinding tools.

[0214] In one implementation, the sensor component is a contact sensor, and the contact sensor has a detection head for contacting the grinding surface. In an actual scenario, the grinding tool of the silicon rod processing equipment can move relative to the grinding and repairing part. The feeding motion can be driven by a servo motor, for example. Here, the servo motor can control the feeding amount of the grinding tool. However, during the grinding and repairing process, the feeding amount determined by the servo motor control is not equal to the layer thickness of the grinding tool ground during the grinding and repairing process. Or it can be understood that the accurate grinding amount during the grinding and repairing process cannot be obtained through the feeding control device of the grinding tool, that is, the actual dimensional specifications of the grinding tool need to be obtained through measurement.

[0215] Taking the example of a grinding repair device having two opposite grinding parts, here, the contact sensor can be set to have detection heads at both ends for contacting two opposite grinding surfaces of a pair of grinding tools. The contact sensor can be arranged on the mounting body, and the connection line of the detection heads at both ends of the contact sensor is parallel to the direction of the plumb line. During the measurement process, the grinding tool can be driven by a servo motor to approach the detection head. The contact sensor can obtain and record the distance between the detection heads at both ends. When the grinding tool contacts the detection head, it stops moving and records the position data of the servo motor. Based on the position data of the servo motor and the detection head data of the contact sensor, the size of the grinding tool after grinding repair can be re-determined, and the silicon rod processing equipment can use the measured size of the grinding tool as the input data in the control system.

[0216] In some examples, a telescopic spring is further arranged on the detection head of the contact sensor. When the detection head contacts an object, it can retreat under the drive of the telescopic spring, which can be used to protect the detection head and prevent the detection head from being damaged by being touched.

[0217] In some examples, the sensor component can be set as a probe type displacement sensor.

[0218] In some embodiments, the sensor component can also be a distance measuring sensor. Here, the distance detection direction of the distance measuring sensor can be set perpendicular to the grinding surface of the grinding tool, so as to obtain the specification of the grinding tool after grinding repair. Examples of the distance measuring sensor can include an infrared distance measuring sensor, a laser distance sensor, an ultrasonic sensor, a radar sensor, etc.

[0219] Generally, for the production process of silicon wafers, taking single-crystalline silicon products as an example, the general operation procedures can include: first, using a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, performing squaring cutting on the cut short silicon rods to form cut silicon rods; then performing processing operations such as rounding and grinding on each cut silicon rod to make the surface shaping of the silicon rod meet the corresponding flatness and dimensional tolerance requirements; subsequently, using a slicing machine to slice the single-crystalline silicon rod to obtain single-crystalline silicon wafers. Taking polycrystalline silicon products as an example, generally, the general operation procedures can include: first, using a silicon ingot squaring machine to perform squaring processing on the primary silicon ingot (large-size silicon ingot) to form a secondary silicon ingot (small-size silicon ingot); after squaring, using a silicon ingot cutting machine to perform cutting processing on the secondary silicon ingot to form polycrystalline silicon rods; then performing processing operations such as chamfering and rolling grinding on each polycrystalline silicon rod to make the surface shaping of the polycrystalline silicon rod meet the corresponding flatness and dimensional tolerance requirements; subsequently, using a slicing machine to slice the polycrystalline silicon rod to obtain polycrystalline silicon wafers.

[0220] After slicing and squaring, grinding is carried out to obtain a silicon rod with a rectangular or quasi-rectangular cross-section and better surface flatness. At the same time, chamfering of the silicon rod is also required to make the transition between different sides of the silicon rod cross-section smooth, thereby preventing edge cracking and lattice defects, relieving the internal stress of the ingot, and facilitating the formation of complete silicon wafers in subsequent slicing.

[0221] In some embodiments, when the silicon rod processing equipment grinds different sides of the cut silicon rod or chamfers the edge, it is achieved by driving the clamped silicon rod to rotate through the clamping part rotation mechanism of the silicon rod fixture. Usually, the cross-section of the cut silicon rod is rectangular or quasi-rectangular. When grinding different sides, the clamping part rotation mechanism controls the silicon rod to rotate a certain angle, such as 90°, to achieve the switching of the grinding surface of the grinding tool relative to the silicon rod. When chamfering different edges, it can be achieved by controlling the clamping part to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a plane, when chamfering the silicon rod, the clamping part rotation mechanism can control the clamped silicon rod to rotate different angles for multiple chamfers. For example, after grinding one side of the silicon rod, for an edge adjacent to this side and the edge opposite to this edge, multiple chamfers can be performed by rotating a certain angle, such as 40°, 45°, 50°, etc., to obtain a silicon rod with a more rounded transition at the junction of different sides. The method of realizing chamfering can refer to patent disclosure documents such as CN108942570A. By driving the silicon rod to rotate a certain angle and the grinding tool to cooperate with the relative feed of the silicon rod, the edge grinding of the cut silicon rod can be achieved. In this example, by controlling the relative movement between the silicon rod fixture and the grinding device, the grinding device can achieve the grinding and chamfering of the cut silicon rod.

[0222] In some embodiments, to reduce the wear of the grinding tool, the silicon rod processing equipment of the present application further includes a chamfering device for grinding the edges of the cut silicon rod. Generally, chamfering the silicon rod is likely to cause relatively large wear to the grinding tool. Here, by using the grinding tool and the chamfering tool of the chamfering device to grind the surface and chamfer the silicon rod respectively, the service life of the grinding tool can be improved.

[0223] In some embodiments, the chamfering device is connected to the second conversion mechanism and is used to switch between the first processing position and the second processing position under the drive of the second conversion mechanism to chamfer the cut silicon rod clamped by the first silicon rod fixture or the second silicon rod fixture.

[0224] In some embodiments, the chamfering device is disposed beside the grinding device so that the chamfering device and the grinding device are located at the same processing position at the same time. For example, when the grinding device and the chamfering device correspond to the first processing position, the cutting device corresponds to the second processing position, or when the grinding device and the chamfering device correspond to the second processing position, the cutting device corresponds to the first processing position.

[0225] In this example, in an actual processing scenario, after the silicon rod fixture drives the clamped silicon rod to move to complete the cutting operation, the second conversion mechanism can be used to drive the grinding device and the chamfering device to switch the processing positions they are in, so as to chamfer and grind the cut silicon rod.

[0226] Here, there is no restriction on the order of the chamfering process and the grinding process. For example, the cut silicon rod can be ground first and then chamfered, or chamfered first and then ground. In the implementation scenario, the grinding operation and the chamfering operation can be respectively performed by controlling the positional relationship between the chamfering device and the grinding device relative to the silicon rod fixture. For example, when the grinding device grinds the cut silicon rod, the chamfering device is retracted to avoid collision with the cut silicon rod. The chamfering device can be disposed on the second conversion mechanism through a displacement mechanism in the second direction, so as to move in the second direction to avoid the silicon rod during the grinding operation; or, the chamfering tool of the chamfering device can be controlled to move along the plumb line to avoid the silicon rod, and the present application does not make any restrictions.

[0227] In some embodiments, the chamfering device includes: at least a pair of chamfering tools, having chamfering surfaces located in a horizontal plane; a chamfering tool advancing and retracting mechanism for driving at least one of the pair of chamfering tools to move in the direction of the plumb line.

[0228] The chamfering tool advancing and retracting mechanism is used to drive at least one of the chamfering tools to move up and down in the direction of the plumb line, and the direction of the plumb line is perpendicular to the horizontal plane. In this way, the relative distance between the two chamfering tools in the at least a pair of chamfering tools in the direction of the plumb line can be adjusted, and further the feed amount of the chamfering tools for grinding the edges of the silicon rod is controlled, that is, the grinding amount of the edges of the silicon rod is determined.

[0229] In some implementation manners, the chamfering tool advancing and retracting mechanism includes: an advancing and retracting guide rail, disposed on the second conversion mechanism along the direction of the plumb line, for setting the at least a pair of chamfering tools; an advancing and retracting driving unit for driving at least one of the at least a pair of chamfering tools to move along the advancing and retracting guide rail.

[0230] In one implementation, the advancing and retracting guide rail of the chamfering tool is arranged in the direction of the plumb line on the second conversion mechanism of the chamfering tool. A guide groove structure or a guide block structure in the direction of the plumb line that cooperates with the advancing and retracting guide rail is provided at the bottom of the chamfering tool. The advancing and retracting drive unit includes, for example, a ball screw and a drive motor. The ball screw is arranged along the advancing and retracting guide rail. The ball screw is associated with the corresponding chamfering tool and is axially connected to the drive motor.

[0231] With the chamfering tool advancing and retracting mechanism, the position of the chamfering tool in the direction of the plumb line can be adjusted. In some processing scenarios, when the chamfering device and the grinding device are adjacent to each other, for example, in an embodiment where the chamfering device and the grinding device correspond to the same processing area, by adjusting the position of the chamfering tool with the chamfering tool advancing and retracting mechanism, the chamfering operation and the grinding operation can be prevented from interfering with each other. For example, when the grinding device grinds the side surface of the silicon rod, a pair of chamfering tools move away from each other to avoid the silicon rod.

[0232] Please continue to refer to Figure 12 , here, the chamfering tool 311 can be set as a chamfering grinding wheel, for example, and the chamfering grinding wheel can be set as an R-angle grinding wheel; the chamfering tool 311 can also be a grinding wheel formed by different manufacturing methods, such as a grinding wheel by electroplating method, a grinding wheel by sintering method.

[0233] The grinding wheel of the chamfering tool 311 is formed by consolidating abrasive grains and a binder, for example, to form a surface with abrasive grains to contact and grind the edge of the silicon rod after cutting; the grinding wheel has a certain abrasive grain size and abrasive grain density, and its abrasive can be set as abrasive grains such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc. whose hardness is greater than the hardness of the silicon material according to the need of grinding the silicon rod.

[0234] Generally, the chamfering tool 311 is a grinding wheel with an annular grinding surface. The chamfering tool 311 can grind the edge of the silicon rod with different chord sides. It should be understood that the silicon rod fixture and the clamped silicon rod can move in the first direction, and by controlling the position of the chamfering tool 311 in the second direction, the edge of the silicon rod can correspond to different chord sides of the chamfering tool 311. In some embodiments, the chord side of the grinding wheel of the chamfering tool 311 for chamfering can be preset, and thus the relative position of the chamfering device and the silicon rod fixture in the second direction can be determined when the chamfering device is installed on the second conversion mechanism, so that the contact length between the edge of the silicon rod and the grinding wheel in the chamfering operation can be pre-controlled.

[0235] In one implementation, the chamfering tool 311 includes a grinding wheel and a rotating shaft. The rotating shaft is connected to the grinding wheel and is linked to the drive source to drive the grinding wheel to rotate along the rotating shaft under the drive of the drive source, so that the grinding surface of the rotating grinding wheel contacts the edge of the silicon rod after cutting, and chamfering of the silicon rod after cutting can be achieved.

[0236] The advancing and retreating mechanism is used to drive the chamfering tool 311 to move along the vertical line direction, thereby adjusting the positional relationship between the chamfering tool 311 and the sawn silicon rod, so as to determine the grinding amount and grinding position for chamfering the sawn silicon rod. At the same time, by adjusting the position of the chamfering tool 311 in the vertical line direction through the advancing and retreating mechanism, it is possible to avoid interference between the silicon rod fixture and the clamped silicon rod and the chamfering tool 311 during the grinding process of the grinding device.

[0237] It should be understood that generally, after a single-crystal silicon rod with a circular cross-section is square-cut to form a silicon rod with a rectangular or quasi-rectangular cross-section, it is necessary to grind the side surface and chamfer the edge of the silicon rod, or grind the side surface and round the edge. The inventor of the present application found that for a sawn silicon rod with a common side length specification of about 210 mm, the subsequent process usually required is grinding and chamfering, and for a sawn silicon rod with a common side length specification of about 158 mm, the subsequent process usually required is grinding and rounding. In this regard, the chamfering device provided in the present application is adapted to different process requirements and can be used for chamfering or rounding.

[0238] In one working mode, when the chamfering device is used to chamfer the sawn silicon rod, taking the initial position where two opposite side surfaces of the sawn silicon rod are in the horizontal plane as an example, the clamping part rotating mechanism of the silicon rod fixture is made to drive the clamping part and the clamped silicon rod to rotate by a certain angle, for example, rotate 40° clockwise, thereby making the advancing and retreating mechanism drive the chamfering tool 311 to feed relative to the silicon rod along the vertical line direction to achieve contact and grinding of the silicon rod, and making the silicon rod fixture drive the silicon rod to move in the first direction to achieve edge grinding; then, for example, the silicon rod can be rotated 5° clockwise each time for multiple edge grindings, so as to obtain a silicon rod with a smoother edge transition. When a pair of chamfering tools 311 are arranged oppositely in the chamfering device, the pair of chamfering tools 311 can chamfer a pair of opposite edges of the sawn silicon rod; after chamfering a pair of opposite edges of the sawn silicon rod is completed, for example, the clamping part rotating mechanism can be made to drive the silicon rod to rotate 45° to chamfer the other pair of opposite edges of the silicon rod.

[0239] In another working mode, when the chamfering device is used to round the sawn silicon rod, the silicon rod fixture can drive the clamped silicon rod to rotate along the axis of the silicon rod, and by making the edge of the rotating silicon rod contact the chamfering tool 311, rounding of each edge of the sawn silicon rod is achieved.

[0240] Herein, after the silicon rod fixture in the silicon rod processing equipment of the present application clamps the silicon rod, it can move along the guiding structure at the processing position to achieve cutting and grinding. Among them, the cutting position and the grinding position can be respectively switched to the processing positions corresponding to the silicon rod to be cut and the silicon rod after cutting by the first switching mechanism and the second switching mechanism. After cutting and grinding are completed, the ground silicon rod is unloaded. In this way, the silicon rod fixture can load the silicon rod to be cut to continue the processing operation. In each example provided by the present application, the cutting position is the position where the cutting device is located, and the grinding position is the position where the grinding device is located.

[0241] In some embodiments, the silicon rod processing equipment of the present application further includes a silicon rod unloading device for unloading the ground silicon rod. This is beneficial to the connection of the process flow, reduces the waiting time of the silicon rod processing equipment after cutting and grinding the silicon rod, and this automatic unloading method can also be used to reduce or avoid the collision and damage of the ground silicon rod during transportation.

[0242] Please continue to refer to Figure 1 , in some embodiments, the silicon rod unloading device 80 includes: a conveyor belt 811 for carrying the ground silicon rod; an unloading drive source (not shown in the figure) for driving the conveyor belt 811 to move so as to drive the ground silicon rod carried thereon to move in a first direction.

[0243] The conveyor belt 811 can be set to have a carrying plane to adapt to the ground silicon rod with a flat side. In some embodiments, to avoid the impact between the conveyor belt 811 and the surface of the silicon rod, the conveyor belt 811 can also be made of a flexible material or an elastic material, or a buffer layer can be added to the surface of the conveyor belt 811; the buffer layer or the flexible material is, for example, elastic rubber, silica gel or other materials with elastic deformation, damping characteristics or buffer characteristics.

[0244] The drive source drives the conveyor belt 811 to move so as to drive the carried ground silicon rod to move in a first direction to transfer the ground silicon rod out of the processing position. Herein, the unloading area of the ground silicon rod is, for example, adjacent to the processing position along the first direction. By driving the silicon rod to move in the first direction through the conveyor belt 811, the silicon rod can be transferred out of the silicon rod processing platform.

[0245] In some examples, when the silicon rod processing equipment is provided with both a silicon rod unloading device 80 and a side skin conveying mechanism 52, the silicon rod unloading device 80 and the side skin conveying mechanism 52 can be arranged, for example, at both ends of the first direction of the silicon rod processing equipment, thereby preventing interference between the side skin and the ground silicon rod during the conveying process. At the same time, after the side skin is removed, it usually needs to be loaded into a side skin cylinder for reuse, and after the ground silicon rod is removed, it needs to be transferred to other processing equipment for subsequent processing such as slicing. By distinguishing the unloading areas corresponding to the side skin and the ground silicon rod respectively, the subsequent processes corresponding to the side skin and the ground silicon rod can be carried out respectively after unloading.

[0246] In certain embodiments, the silicon rod unloading device 80 is arranged on the silicon rod processing platform through a displacement mechanism 82 and is used to move between a first processing position and a second processing position under the drive of the displacement mechanism 82.

[0247] The silicon rod unloading device 80 is used to receive the ground silicon rod clamped by the first silicon rod clamp and the second silicon rod clamp. It should be understood that when the first silicon rod clamp clamps the ground silicon rod, the silicon rod clamped by the first silicon rod clamp is the cut silicon rod, that is, at the same moment, the processing states of the silicon rods at the first processing position and the second processing position are different. Therefore, the silicon rod unloading device 80 receives the ground silicon rod at one processing position during one unloading.

[0248] As described above, the silicon rod unloading device 80 unloads the ground silicon rod at one processing position during one unloading. In some embodiments, by making the silicon rod unloading device 80 correspond to the first processing position and the second processing position respectively under the drive of the displacement mechanism 82, the ground silicon rods at two processing positions can be unloaded by one silicon rod unloading device 80.

[0249] Here, the displacement mechanism 82 can be arranged on the silicon rod processing platform through a guide post or a guide rail along the second direction. The displacement mechanism 82 is used to carry the silicon rod unloading device 80 and move along the second direction under the drive of a driving source, thereby enabling it to be movably docked to different processing positions.

[0250] The positions of the silicon rod clamp and the clamped ground silicon rod in the second direction are fixed. Here, the silicon rod unloading device 80 is moved to a position in the second direction that is aligned with the silicon rod clamp, and the silicon rod clamp clamps the ground silicon rod and moves along the first direction to correspond to the silicon rod unloading device 80 in the first direction. For example, the projection of the ground silicon rod on the horizontal plane falls on the conveyor belt 811, and when the silicon rod clamp releases the ground silicon rod, the conveyor belt 811 of the silicon rod unloading device 80 can receive the ground silicon rod.

[0251] In some embodiments, the silicon rod unloading device 80 is provided on the shifting mechanism 82 through a lifting mechanism 83. Among them, the lifting mechanism 83 includes: a lifting guiding structure provided on the shifting mechanism 82 and connected to the silicon rod unloading device 80; a lifting driving source for driving the silicon rod unloading device 80 to move up and down along the lifting guiding structure.

[0252] In an actual processing scenario, when the silicon rod processing equipment is used to process silicon rods of different specifications, such as different diameters, the side lengths of the polished silicon rods obtained correspondingly may be different. During the process of the conveyor belt 811 receiving the polished silicon rod, the conveyor belt 811 should be located below the polished silicon rod and the height difference between the two should be minimized as much as possible. The lifting mechanism 83 can be used to adapt to unloading polished silicon rods of different specifications.

[0253] The lifting guiding structure is, for example, a guide rail or a guide post arranged along the direction of the plumb line. The silicon rod loading and unloading device is provided on the shifting mechanism 82 through the lifting guiding structure and moves along the lifting guiding structure under the drive of the lifting driving source. In one implementation, the silicon rod loading and unloading device is provided at the free end of the lifting guiding structure. The lifting guiding structure expands and contracts along the direction of the plumb line under the drive of the lifting driving source to drive the silicon rod loading and unloading device at the free end to move up and down. In another implementation, the lifting driving source is used to drive the movement along the lifting guiding structure. In this example, the lifting driving source is, for example, a cylinder or a hydraulic pump. The telescopic end of the cylinder or the hydraulic pump is connected to the silicon rod loading and unloading device; alternatively, the lifting driving source is, for example, a motor provided on the silicon rod loading and unloading device to drive the silicon rod loading and unloading device to move along the lifting guiding structure.

[0254] Generally, the silicon rod to be cut clamped by the silicon rod clamp is a silicon rod of a certain length specification obtained by truncating a silicon rod. In actual production, it is necessary to first perform a truncation operation on the original long silicon rod to obtain a silicon rod to be cut that can be used for squaring. The original long silicon rod is, for example, a rod-shaped single crystal silicon grown from a melt by the Czochralski method or the floating zone melting method. In silicon rod processing, a single crystal silicon rod with a length of about 5000 mm (such as a specification of 5360 mm, etc.) is common. After truncating the original single crystal silicon rod, the silicon rod clamp can clamp the cut silicon rod, and subsequent cutting and grinding operations can be carried out therefrom.

[0255] In some embodiments, the silicon rod processing equipment of the present application further includes a silicon rod truncating device. Among them, the silicon rod truncating device includes a silicon rod carrying device for carrying a single crystal silicon rod; a truncating cutting frame including a wire saw that can be lifted relative to the silicon rod carrying device for truncating the single crystal silicon rod to form the silicon rod to be cut.

[0256] In some embodiments, the silicon rod carrying device is a chain conveyor mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

[0257] Please refer to Figure 14 , which shows a partial structural schematic diagram of the silicon rod processing equipment of the present application.

[0258] In one example, the silicon rod carrying device 61 is a chain conveyor mechanism driven by a motor. The chain conveyor mechanism includes: two annular chains arranged oppositely and sprockets for driving the two annular chains. The two annular chains are arranged parallel and opposite to each other in the first direction. Wherein, both ends of each annular chain are respectively provided with sprockets, and the teeth of the sprockets mesh with the chain and drive the chain to run when rotating. The sprocket is driven to rotate, for example, by the power output shaft of the motor.

[0259] In one implementation, the sprockets are arranged at both ends of each annular chain. The two relatively arranged annular chains are parallel to each other, and the sprockets at the same end are used as the driving sprockets. The axes of the driving sprockets of the two annular chains are on the same horizontal axis. The driving sprocket can be power-connected to the motor shaft, that is, the power output shaft. The driving sprocket meshes with the sprockets of the two annular chains. Furthermore, the conveying speed of the chain can be controlled by the driving motor, so as to control the axial conveying speed of the single crystal silicon rod on the silicon rod carrying device.

[0260] In one implementation, a plurality of carrying blocks can also be arranged on each annular chain. In some embodiments of the present application, the carrying blocks on the two annular chains are a row of wedge-shaped blocks fixed on the chain at intervals to directly support the silicon rod to be cut or the cut silicon rod segment, and limit the degree of freedom of movement of the carried single crystal silicon rod to only the movement direction of the conveying mechanism of the carrying device, that is, to ensure that the silicon rod is relatively stationary with respect to the chain conveyor mechanism and the silicon rod does not move relatively during cutting. The surface of the wedge-shaped block for contacting the silicon rod to be cut or the cut silicon rod segment can be set to be arc-shaped to conform to the arc-shaped surface of the silicon rod; in some embodiments of the present application, the wedge-shaped block is made of an elastic rubber material, or silica gel or other materials with elastic deformation or buffering characteristics to protect the surface of the silicon rod in contact with it from being scratched or knocked.

[0261] In some other feasible examples, the silicon rod carrying device can also be set as a double-speed chain mechanism, a conveyor belt mechanism, etc.; the double-speed chain mechanism or the conveyor belt mechanism can be arranged along the first direction and has a limiting device for the silicon rod with a circular cross-section, such as a wedge-shaped block, to prevent the carried silicon rod from rolling.

[0262] It should be understood that the silicon rod carrying device can be used to carry the silicon rod and limit its movement direction to control the relative position between the silicon rod and the truncation cutting frame.

[0263] As shown Figure 14 As shown, the silicon rod carrier 61 conveys the silicon rod along the axis direction of the silicon rod. The truncating and cutting frame 62 includes a liftable wire saw. By controlling the silicon rod carrier 61 to convey the silicon rod below the wire saw, the long silicon rod can be truncated into silicon rods to be cut with a preset length specification. Among them, the length specification is determined by the conveying distance of the silicon rod carrier 61.

[0264] The truncating and cutting frame 62 is arranged on the machine base and includes a lifting support and a plurality of cutting wheels 621 and idler wheels arranged on the lifting support. The cutting wire is wound around the plurality of cutting wheels 621 and idler wheels to form a wire saw along the second direction. The lifting support 623 is arranged on the guide posts in the lifting direction and is driven by a lifting drive source to move so that the wire saw makes a lifting motion. At the same time, the wire saw is aligned with the silicon rod carrier in the first direction. Thus, the wire saw can truncate the silicon rod placed on the silicon rod bearing structure.

[0265] In one implementation, for example, two cutting wheels 621 are included on the lifting support 623 for forming a wire saw along the second direction; there is a hollow area in the lifting support 623, for example, in an inverted U shape. The hollow area can accommodate the cross-section of the silicon rod to ensure that there is no collision between the lifting support 623 and the silicon rod when the lifting support 623 descends to truncate the silicon rod with the wire saw.

[0266] In one example, the lifting drive source is set as a lead screw assembly. The lead screw assembly includes a lead screw and a motor. One end of the lead screw is connected to the lifting support 623, and the other end is connected to the motor and is driven by the motor to drive the lifting support 623 to move along the guide post. The specific form of the lifting drive source is not limited to this. In another example, the lifting drive source is, for example, a cylinder assembly.

[0267] After the truncating and cutting frame 62 truncates the long silicon rod into silicon rods to be cut with a preset length specification, the silicon rod clamp can load the silicon rods to be cut; of course, the silicon rods to be cut can also be obtained by cutting with a separate silicon rod truncating device.

[0268] The displacement range of the silicon rod clamp is limited by its corresponding guiding structure, so any one of the silicon rod clamps needs to load the silicon rods to be cut at its corresponding processing location. In view of this, it is necessary to transport the silicon rods to be cut to the position where the silicon rod clamp can achieve clamping in advance.

[0269] In some embodiments, the silicon rod processing equipment further includes a loading device for conveying the silicon rods to be cut to the first processing location or the second processing location so that the first silicon rod clamp or the second silicon rod clamp loads the silicon rods to be cut. The loading device can be set to have a degree of freedom of movement along the second direction to move corresponding to the silicon rod clamp at any processing location.

[0270] In some embodiments, the loading device includes at least one clamping assembly, wherein the clamping assembly includes: a material taking arm, a top frame suspended above the silicon rod processing platform through a mounting portion, wherein the top frame includes a guiding structure arranged along a second direction to enable the mounting portion to have a degree of freedom of moving along the second direction; a clamping member arranged at the bottom end of the material taking arm for clamping the silicon rod to be cut.

[0271] Please refer to Figure 1 , Figure 15a , Figure 15b , wherein, Figure 15a , Figure 15b respectively show schematic structural diagrams of the loading device of the present application in different view directions in an embodiment.

[0272] The top frame 13 can be arranged on the machine base, for example, on the column between the first processing position and the second processing position. In some examples, the column can also be regarded as a part of the machine base.

[0273] The top frame 13 includes a guiding structure 131 arranged in the second direction. The guiding structure 131 is used to arrange the mounting portion 72 and enable the mounting portion 72 to move along the second direction under the limiting action of the guiding structure 131. The material taking arm 711 connected to the mounting portion 72 can then move along the second direction.

[0274] The clamping member 712 is arranged at the bottom end of the material taking arm 711 for clamping the silicon rod to be cut. Here, the number of the clamping members 712 corresponds to that of the material taking arms 711. The loading device includes at least one clamping assembly. In one example, when the loading device includes a single clamping assembly, the clamping member 712 can be arranged to have a preset length in a first direction to achieve stable clamping of the silicon rod to be cut. In another example, the loading device includes a plurality of clamping assemblies, and the clamping members 712 corresponding to the plurality of clamping assemblies have a spacing in the first direction, whereby the center of gravity of the silicon rod to be cut can fall between the plurality of clamping members 712 to achieve stable clamping of the silicon rod to be cut.

[0275] In some embodiments, the mounting portion 72 includes a translation mechanism 721 arranged in a first direction for arranging the material taking arm 711 to enable the material taking arm 711 to have a degree of freedom of moving along the first direction.

[0276] The translation mechanism 721 arranged in the first direction is, for example, a translation guide rail. The material taking arm 711 moves along the translation guide rail to drive the clamping member 712 at the lower end of the material taking arm 711 to move in the first direction. In this way, the clamping position of the clamping member 712 relative to the silicon rod to be cut can be adjusted. In an example where the feeding device has multiple clamping components, the translation structure in the first direction can adjust the spacing of the multiple clamping members 712 in the first direction, and the feeding device can be applicable to clamp silicon rods to be cut with different length specifications.

[0277] In some embodiments, the clamping member 712 includes: a first clamping block 7121 and a second clamping block 7122 arranged oppositely, wherein the first clamping block 7121 and the second clamping block 7122 have clamping arc surfaces; a clamping block driving mechanism (not shown in the figure), which is used to drive the first clamping block 7121 and the second clamping block 7122 to perform opening and closing movements.

[0278] The clamping arc surfaces of the first clamping block and the second clamping block can be adapted to the silicon rod to be cut with a circular cross-section. In one implementation, the clamping arc surface is set as an arc surface in the part of the clamping block facing the clamping space; in another implementation, the clamping arc surface is the contact plane of the clamping block arranged in different directions along the surface curvature of the silicon rod. In this way, the silicon rod with an arc surface can be clamped.

[0279] In some examples, the clamping arm driving mechanism includes: an opening and closing gear, a rack, and a driving source (not shown); wherein, opening and closing gears are respectively arranged on the first clamping arm and the second clamping arm, tooth patterns corresponding to the opening and closing gears on the first clamping arm and the second clamping arm are respectively arranged on the opposite sides of the rack, and the driving source is connected to the gear driving member and is used to drive the gear driving member to move.

[0280] The clamping block drives the first clamping block and the second clamping block to perform opening and closing movements, so as to realize the clamping and release of the silicon rod to be cut.

[0281] In one implementation, the clamping block driving mechanism includes: a first rack, which is linked to the first clamping block; a second rack, which is linked to the second clamping block; a clamping cylinder, which is arranged on the first rack or the second rack and is used to push the first rack or the second rack to move in the extending direction of the rack; a transmission gear, which meshes with the first rack and the second rack and is used to drive the first clamping block and the second clamping block to move towards each other to perform a closing operation when rotating forward, and drive the first clamping block and the second clamping block to move away from each other to perform an opening action when rotating reversely.

[0282] The first rack and the second rack are arranged on both sides of the transmission gear. Based on the basic law of meshing between gears or between a gear and a rack, when the transmission gear rotates, the linear velocities of the tooth parts on both sides of the gear move in opposite directions. Thus, the first rack and the second rack can move in opposite directions. Correspondingly, the first clamping part and the second clamping part linked to the first rack and the second rack respectively will move towards or away from each other. For example, when the clamping cylinder pushes the first rack or the second rack to move and drive the transmission gear to rotate, when the transmission gear is in the forward rotation state, the first rack and the second rack move towards each other to drive the first clamping block and the second clamping block to move towards each other to perform the closing action; when the transmission gear is in the reverse rotation state, the first rack and the second rack move away from each other to drive the first clamping part and the second clamping part to move away from each other to perform the releasing action.

[0283] In another implementation, the clamping block driving mechanism includes: a first rack linked to the first clamping block; a second rack linked to the second clamping block; a driving gear connected to the power output shaft of the driving motor and meshing with the first rack and the second rack, for driving the first clamping block and the second clamping block to move towards each other to perform the closing action when rotating forward, and driving the first clamping block and the second clamping block to move away from each other to perform the opening action when rotating reversely.

[0284] The first rack and the second rack can be meshed on both sides of the driving gear, such that when the driving gear rotates, the directions of the linear velocities at the first rack and the second rack are opposite. The driving motor drives the driving gear to rotate. When the driving gear rotates forward, the first rack and the second rack move towards each other, which drives the first clamping block and the second clamping block to move towards each other to perform the closing action. When the driving gear is driven to rotate reversely, the first rack and the second rack move away from each other to drive the first clamping block and the second clamping block to move away from each other to perform the opening action.

[0285] In yet another implementation, the clamping block driving mechanism includes: an opening and closing gear provided on the first clamping block and the second clamping block; a rack, with tooth patterns corresponding to the meshing of the opening and closing gears on the first clamping block and the second clamping block respectively provided at both opposite ends of the rack; a driving source connected to the rack for driving the rack to move forward and backward along the rack direction.

[0286] Here, the rack is located between the first clamping block and the second clamping block. Tooth patterns corresponding to the opening and closing gears on the first clamping block and the second clamping block are respectively provided on two outer side surfaces of the rack facing the clamping blocks on both sides. The driving source can be, for example, a driving motor or a cylinder. Thus, according to the above implementation method, in practical applications, when it is necessary to realize the clamping of the clamping blocks, the driving motor or the cylinder serving as the driving source drives the rack serving as the gear driving member to move upward, and the rack drives the opening and closing gears engaged on both sides to perform an outward rotation action. During the outward rotation of the opening and closing gears, the clamping blocks (the opening and closing gears and the clamping blocks can be connected through a rotating shaft) are driven to perform a lowering action to change from the loosening state to the clamping state; conversely, when it is necessary to realize the loosening of the clamping blocks, the driving motor (or the cylinder) serving as the driving source drives the rack serving as the gear driving member to move downward, and the rack drives the opening and closing gears engaged on both sides to perform an inward rotation action. During the inward rotation of the opening and closing gears, the clamping blocks (the opening and closing gears and the clamping blocks can be connected through a rotating shaft) are driven to perform a lifting action to change from the clamping state to the loosening state. Of course, the above is only an embodiment and is not used to limit the working state of the silicon rod clamping member. In fact, the state changes of "upward", "outward rotation", "lowering", "downward", "inward rotation", "lifting", as well as "loosening" and "clamping" can have other changes according to the structure and operation mode of the clamping blocks and the structure of the clamping block driving mechanism.

[0287] In another implementation method, the clamping block driving mechanism includes: a bidirectional lead screw, the two ends of which are threadedly connected to the first clamping block and the second clamping block; a driving source for driving the lead screw to rotate so that the first clamping block and the second clamping block move towards each other or away from each other.

[0288] Here, the bidirectional lead screw is arranged along the second direction and is threadedly connected to the first clamping block and the second clamping block; the driving source drives the lead screw to rotate so that the first clamping block and the second clamping block move towards each other or away from each other along the second direction. In one implementation method, the bidirectional lead screw is a double-threaded lead screw. Threads with opposite directions are respectively provided at both ends of the bidirectional lead screw. The driving source can be arranged at any one end of the bidirectional lead screw to drive the bidirectional lead screw to rotate along the axis of the lead screw. By means of the threads with opposite directions at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates driven by the driving source, the movements at both ends of the bidirectional lead screw are converted into axial linear movements in opposite directions, and the axis is the second direction in which the bidirectional lead screw is arranged. Driven by the driving source, the first clamping block and the second clamping block can move towards each other or away from each other to realize the clamping or release of the silicon rod to be cut.

[0289] In some embodiments, the pick-up arm 711 is vertically movable and disposed on the mounting portion 72. When the clamping assembly clamps an object, the first clamping block 7121 and the second clamping block 7122 are respectively located on opposite sides of the silicon rod, so that the silicon rod is in the clamping space between the first clamping block 7121 and the second clamping block 7122. In the process of moving the clamping assembly to place the silicon rod in the clamping space, it is necessary to avoid collision between the clamping block and the silicon rod. In one implementation, the pick-up arm 711 is vertically movably disposed on the mounting portion 72. Before the clamping member corresponding to the pick-up arm 711 approaches the silicon rod to be cut in the second direction, the lifting height of the pick-up arm 711 is controlled so that the clamping member is located above the silicon rod to be cut. After the first clamping block 7121 and the second clamping block 7122 are located on both sides of the silicon rod to be cut, the pick-up arm 711 can be driven to drive the clamping member to descend so that the silicon rod to be cut is located in the clamping space. In this state, driving the first clamping block 7121 and the second clamping block 7122 to approach each other can clamp the silicon rod to be cut.

[0290] In some scenarios, the diameters of the silicon rods to be cut are different, so the axis heights of the silicon rods are different when they are in the pre-loading position. By driving the clamping member to move in the vertical direction by the pick-up arm, the axis height of the silicon rod can be correspondingly aligned with the preset clamping position.

[0291] In some embodiments of the present application, by suspending the loading device above the machine base, in this setting, a position for placing the silicon rod to be cut can be provided on the silicon rod processing platform of the corresponding machine base, thereby reducing the area occupied by the machine base in space.

[0292] In some embodiments, the silicon rod processing equipment further includes a predetermined loading mechanism disposed along the first direction for carrying the silicon rod to be cut so that the loading device conveys the silicon rod to be cut from the predetermined loading mechanism to the first processing location or the second processing location. Please continue to refer to Figure 14 , in one example, when the silicon rod processing equipment includes a truncation cutting frame 62, the predetermined loading mechanism 74 can be aligned with the silicon rod carrying device in the first direction, so that the silicon rod carrying device conveys the silicon rod along the axis direction onto the predetermined loading mechanism 74. The silicon rod to be cut that can be used for squaring obtained after the truncation cutting frame 62 truncates the silicon rod is located on the predetermined loading mechanism 74; in other examples, the predetermined loading mechanism 74 can also be used to carry the silicon rod to be cut obtained by truncating the silicon rod truncation equipment.

[0293] The predetermined loading mechanism 74 has a bearing part to define that the silicon rod to be cut is stably placed. In one implementation, the bearing part includes two rows of parallel and opposite rollers arranged in the first direction, so that the silicon rod to be cut is not likely to roll on the bearing part. At the same time, when the predetermined loading mechanism 74 corresponds to the silicon rod bearing device of the silicon rod cutting device, when the silicon rod to be cut moves relative to the predetermined loading mechanism 74 in the first direction, the friction between it and the bearing part is rolling friction, so as to facilitate the transportation of the silicon rod.

[0294] In one implementation, the predetermined loading mechanism 74 can be arranged between the first processing location and the second processing location. The control system of the silicon rod processing equipment can read the position of the predetermined loading mechanism 74, so as to control the displacement distance required for the feeding device to clamp the silicon rod from the predetermined loading mechanism 74 and then transport the silicon rod to the corresponding first silicon rod clamp or second silicon rod clamp. For example, when the first processing location and the second processing location are arranged on the opposite sides in the second direction, in this example, the movement distance of the feeding device from the predetermined loading mechanism 74 to the corresponding silicon rod clamp in the second direction can be controlled.

[0295] In the silicon rod processing equipment of the present application, the silicon rod is clamped by the silicon rod clamp and moves along the axis direction of the silicon rod. To ensure that the silicon rod clamp remains stable during the process of clamping the silicon rod and driving it to move, it is necessary to make the silicon rod clamp clamp at a position aligned with the axis of the silicon rod. At the same time, during the cutting or grinding operation, the cutting amount or grinding amount of the silicon rod is determined by the relative position of the wire saw or grinding tool and the silicon rod. By making the silicon rod clamp clamp at a position aligned with the axis of the silicon rod, the silicon rod processing equipment can know the position of the axis of the silicon rod, that is, the silicon rod can be processed with a preset cutting amount or grinding amount, and at the same time, the change in the center of gravity height during the process of the silicon rod clamp driving the silicon rod to rotate along the axis can be avoided or reduced.

[0296] The feeding device is used to transport the silicon rod to be cut to the corresponding first silicon rod clamp or second silicon rod clamp. In actual operation, the clamping position corresponding to the silicon rod clamp only has the freedom of adjustment in the first direction. To ensure that the silicon rod clamp clamps at a position where its clamping part is aligned with the axis of the silicon rod, the spatial position of the silicon rod clamped by the feeding device can be adjusted to enable the silicon rod clamp to clamp the silicon rod at the predetermined loading position.

[0297] In the embodiment of the present application, the predetermined loading position is the position where the axis position of the silicon rod clamped by the feeding device is aligned with the center of the clamping part of the silicon rod clamp.

[0298] In an implementation scenario, the position of the midline between the first clamping block and the second clamping block in the feeding device in the second direction can be obtained by the control system. In this state, when the silicon rod to be cut is in the state of being clamped by the feeding device, the position of the axis of the silicon rod in the second direction can be known. By controlling the moving distance of the feeding device in the second direction, it can be ensured that the axis of the silicon rod is aligned with the clamping part of the silicon rod fixture in the second direction; to make the silicon rod fixture clamp at the position where the clamping part is aligned with the axis of the silicon rod, it is necessary to control the position of the axis of the silicon rod in the direction of the plumb line to be aligned with the clamping part. For this reason, in some embodiments of the present application, the feeding device further includes a sensor for detecting the silicon rod clamped by the clamping member or the first silicon rod fixture or the second silicon rod fixture to determine that the first silicon rod fixture or the second silicon rod fixture clamps the silicon rod at a predetermined loading position.

[0299] The sensor can be used, for example, to detect the height of the silicon rod clamped by the clamping member, thereby determining the position of the axis of the silicon rod in the direction of the plumb line. It should be understood that the silicon rod fixture only has the degree of freedom of moving along its guiding structure and the degree of freedom of rotating the clamping part along the central axis. Then, the position of the center of the clamping part of the silicon rod fixture in the direction of the plumb line is a definite value. Based on the height of the axis of the silicon rod measured by the sensor, the lifting movement of the material taking arm in the direction of the plumb line can be controlled to raise or lower the position of the axis of the silicon rod to be aligned with the clamping part of the silicon rod fixture in the direction of the plumb line.

[0300] Please refer to Figure 13 , which shows a partial structural schematic diagram of the silicon rod processing equipment of the present application in an embodiment.

[0301] In one implementation, the sensor is set to detect the height of the highest point in the state where the silicon rod is clamped. It should be understood that the first clamping block and the second clamping block in the clamping member are symmetrical. When the silicon rod is in the clamped state, the position of the axis of the silicon rod in the second direction is the same as the midline (or symmetry plane) of the two clamping blocks. In this state, the position of the highest point on the surface of the silicon rod in the second direction is also the same as that of the axis of the silicon rod. In an actual scenario, the sensor can be set at the midline position between the first clamping block and the second clamping block.

[0302] In some embodiments, the sensor is a contact sensor or a ranging sensor.

[0303] The telescopic direction corresponding to the contact sensor or the ranging direction corresponding to the ranging sensor can be set along the direction of the plumb line, thereby determining the height of the highest point on the surface of the silicon rod clamped by the clamping member.

[0304] Please refer to Figure 16 , which shows a partial structural schematic diagram of the feeding device of the silicon rod processing equipment of the present application in an embodiment.

[0305] Here, the contact sensor 73 can be arranged such that one end is provided at the bottom end of the pick-up arm 711 or the clamping member, and the other end is a free end that moves up and down towards the silicon rod. The free end is provided with a detection head to contact the silicon rod. During the measurement process, the movement of the detection head towards the silicon rod can be controlled. When the detection head contacts the surface of the silicon rod, the movement stops and the corresponding position data is recorded. The contact sensor 73 can obtain and record the height when the detection head contacts the silicon rod. Based on the detection head data of the contact sensor 73, the height of the highest point on the surface of the silicon rod can be determined. By comparing the highest point height with the reference height, the adjustment height of the silicon rod can be determined.

[0306] The reference height can be, for example, the highest point height of a reference silicon rod pre-stored in the control system of the silicon rod processing equipment. The reference silicon rod is a silicon rod with a known diameter value. By adjusting the highest point height of the reference silicon rod in the state where the clamping member clamps the reference silicon rod, the axis height of the corresponding reference silicon rod can be determined. Aligning the axis position of the reference silicon rod with the center of the clamping portion of the silicon rod fixture in the height direction, at this time, the highest point height of the reference silicon rod can be used as a reference height. By comparing the detection data with the reference height, the displacement adjustment amount required for the silicon rod in the lifting direction can be determined from the difference between the highest point height of the silicon rod clamped by the current state clamping member and the reference height.

[0307] Alternatively, the reference height can be determined by the predetermined loading mechanism. When the feeding device clamps the silicon rod to be cut from the predetermined loading mechanism, the position of the lowest point of the silicon rod is a determined value, that is, the height determined by the bearing surface of the predetermined loading mechanism. In this example, based on the detection data of the contact sensor 73, the diameter data of the silicon rod clamped by the corresponding clamping member can be obtained, and thus the displacement amount of the silicon rod in the lifting direction can be determined to make the silicon rod fixture clamp the silicon rod at the predetermined loading position.

[0308] In some examples, a telescopic spring is further provided on the detection head of the contact sensor 73. When the detection head contacts an object, it can retreat under the drive of the telescopic spring, which can be used to protect the detection head and prevent the detection head from being damaged by being touched.

[0309] In some examples, the sensor device can be arranged as a probe type displacement sensor.

[0310] In some embodiments, the sensor device can also be a distance measuring sensor. Here, the distance detection direction of the distance measuring sensor can be set as the plumb line direction. The distance measuring sensor can be, for example, an infrared distance measuring sensor, a laser distance sensor, an ultrasonic sensor, a radar sensor, etc.

[0311] The sensor device can be used for measurement in the state where the silicon rod to be cut is clamped by the clamping member, or in the state where the silicon rod to be cut is clamped by the silicon rod fixture.

[0312] For example, with the reference silicon rod held by the silicon rod clamp at a predetermined loading position, the height of the highest point of the reference silicon rod is taken as the reference height. In an actual scenario, by measuring the height of the highest point of the silicon rod held by the silicon rod clamp and comparing it with the reference height, the displacement adjustment amount of the silicon rod is determined.

[0313] Please refer to Figure 15a 、 Figure 15b 、and Figure 16 , for example, when the feeding device moves the held silicon rod to align with the silicon rod clamp in the second direction, the pair of clamping arms of the silicon rod clamp move towards each other to clamp the silicon rod at both end faces of the silicon rod; the first clamping block 7121 and the second clamping block 7122 of the clamping member of the feeding device move away from each other to release the silicon rod. At the same time, the sensor 73 member moves telescopically to detect the height of the silicon rod to be cut held by the silicon rod clamp. By measuring the height of the highest point of the silicon rod held by the silicon rod clamp and comparing it with the reference height, the displacement adjustment amount of the silicon rod is determined; when the height of the highest point of the silicon rod is already the reference height, it is determined that the silicon rod clamp has held the silicon rod at the predetermined loading position. Thus, the picking arm 711 and the clamping member can be lifted to a specified position, and the silicon rod clamp can drive the silicon rod to move along the guiding structure to perform subsequent cutting operations; when there is a height difference between the height detected by the sensor 73 member and the reference height, the first clamping block 7121 and the second clamping block 7122 of the clamping member of the feeding device move towards each other to clamp the silicon rod, and then the pair of clamping arms of the silicon rod clamp move away from each other to release the silicon rod. The feeding device drives the silicon rod to move up and down by the displacement amount determined by the height difference; after the lifting adjustment, the pair of clamping arms of the silicon rod clamp move towards each other to approach both end faces of the silicon rod and achieve clamping. The clamping member releases the silicon rod, and the picking arm 711 and the clamping member are lifted to the specified position. The silicon rod clamp can drive the silicon rod to move along the guiding structure to perform subsequent cutting operations.

[0314] To facilitate understanding of the processing flow of the silicon rod processing equipment of the present application in an actual scenario, the present application also provides the following examples:

[0315] At the initial moment, when the cutting device is located at the first processing position and the grinding device is located at the second processing position, a silicon rod to be cut is conveyed to the silicon rod processing platform for the first silicon rod clamp at the first processing position to clamp the silicon rod to be cut; in some implementation manners, the silicon rod to be cut can be obtained by truncating a long silicon rod by the truncating cutting frame in the silicon rod processing equipment. In other implementation manners, the silicon rod to be cut can also be processed by a silicon rod truncating device;

[0316] To achieve the clamping of the silicon rod to be cut by the silicon rod clamp, in some implementation manners, a feeding device is used to convey the silicon rod to the clamping position corresponding to the silicon rod clamp at the processing location. In some feasible embodiments, the feeding device can clamp the silicon rod to be cut from a predetermined loading mechanism and then convey the silicon rod to the predetermined loading position corresponding to the silicon rod clamp;

[0317] After the first silicon rod clamp clamps the silicon rod to be cut at the predetermined loading position, it moves in the axial direction of the silicon rod at the first processing location, so that the wire saw in the cutting device feeds relative to the silicon rod to be cut to achieve squaring cutting; here, a guiding structure in the axial direction of the silicon rod can be arranged at the processing location to enable the silicon rod clamp to move along the guiding structure under the drive of a power source; the cutting device can cooperate with the movement of the silicon rod clamp and the silicon rod clamped by it. For example, the position of the wire saw is adjusted to avoid the silicon rod clamp clamping the silicon rod that has been cut once and returning to the initial position. The silicon rod clamp drives the clamped silicon rod to rotate a certain angle, and then feeds relative to the wire saw from the initial position to perform the second cutting until a cut silicon rod with a rectangular or quasi-rectangular cross-section is formed; among them, the initial position is, for example, the predetermined loading position of the silicon rod clamp. Here, the initial position should be a position where the silicon rod can be moved towards the wire saw to achieve cutting; in some embodiments, a side skin conveying mechanism can also be configured in the silicon rod processing equipment to transfer the side skin formed by cutting out of the working area;

[0318] After obtaining the cut silicon rod, the first conversion mechanism drives the cutting device to be converted from the first processing location to the second processing location, and the second conversion mechanism drives the grinding device to be converted to the first processing location. In this state, the first silicon rod clamp can drive the cut silicon rod clamped by it to move along the guiding structure, and the grinding device drives the grinding tool to move along the plumb line direction to achieve grinding of the side surface of the cut silicon rod. By driving the silicon rod to rotate along the axis of the silicon rod by the first silicon rod clamp, the grinding surface of the silicon rod can be switched by the grinding device, and thus the ground silicon rod can be obtained;

[0319] During the grinding operation at the first processing location, the second silicon rod clamp can load another silicon rod to be cut. Here, the implementation manner of the second silicon rod clamp loading the silicon rod to be cut can refer to the manner of the first silicon rod clamp loading the silicon rod to be cut. The cutting device converted to the second processing location can also cut the silicon rod clamped by the second silicon rod clamp;

[0320] Unload the ground silicon rod at the first processing location. The first silicon rod clamp can then load another silicon rod to be cut. The cutting device is driven by the first conversion mechanism to switch from the second processing location to the first processing location, and the cutting device can then cut the silicon rod to be cut clamped by the first silicon rod clamp. At the same time, the second conversion mechanism is used to switch the grinding device to the second processing location, and the ground silicon rod clamped by the second silicon rod clamp can be ground. In some embodiments, unloading of the ground silicon rod can also be achieved by configuring a silicon rod unloading device in the silicon rod processing equipment. The silicon rod unloading device can also be arranged to move between the first processing location and the second processing location to respectively dock with the first processing location and the second processing location according to the unloading requirements at different times.

[0321] Repeat the above process, and the silicon rod processing equipment can simultaneously perform silicon rod processing operations at the two processing locations, improving the silicon rod processing efficiency. At the same time, by switching the processing location held by the cutting device through the first conversion mechanism and switching the processing location where the grinding device is located through the second conversion mechanism, the silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, and squaring cutting and grinding operations can be achieved at any processing location, simplifying the transfer path of the silicon rod between different processes. At the same time, at the same moment, the cutting device and the grinding device can be located at different processing locations, and different processing operations can be simultaneously performed on the silicon rod processing platform. Thus, the silicon rod processing equipment of the present application improves the processing efficiency while simplifying the transfer path of the silicon rod during processing between different processes, reducing the labor loss, time loss during process flow, and the risk of silicon rod damage.

[0322] In a second aspect, the present application also provides a silicon rod processing method, which is applied to a silicon rod processing equipment. The silicon rod processing equipment includes a machine base with a silicon rod processing platform, a cutting device, a grinding device, a first silicon rod clamp, and a second silicon rod clamp. Among them, the cutting device is arranged on the first conversion mechanism, the first conversion mechanism is arranged at the first installation position of the silicon rod processing platform, the grinding device is arranged on the second conversion mechanism, the second conversion mechanism is arranged at the second installation position of the silicon rod processing platform, and the first silicon rod clamp and the second silicon rod clamp are respectively arranged at the first processing location and the second processing location of the silicon rod processing platform, including the following steps:

[0323] In step S10, the cutting device is located at the first processing location and the grinding device is located at the second processing location.

[0324] At the initial moment, when the cutting device is located at the first processing position and the grinding device is located at the second processing position, the first silicon rod to be cut is conveyed to the silicon rod processing platform for the first silicon rod clamp at the first processing position to clamp the silicon rod to be cut; in some implementation manners, the silicon rod to be cut can be obtained by truncating a long silicon rod by a truncating cutting frame in the silicon rod processing equipment, and in some other implementation manners, the silicon rod to be cut can also be processed by a silicon rod truncating device;

[0325] In step S11, the first silicon rod clamp at the first processing position is made to load the first silicon rod to be cut;

[0326] To realize the clamping of the silicon rod to be cut by the silicon rod clamp, in some implementation manners, a feeding device is used to convey the silicon rod to the clamping position corresponding to the silicon rod clamp at the processing position. In some feasible embodiments, the feeding device can clamp the silicon rod to be cut from a predetermined loading mechanism and then convey the silicon rod to be cut to the predetermined loading position of the corresponding silicon rod clamp.

[0327] In step S12, the first silicon rod clamp is made to clamp the first silicon rod to be cut and move along the first direction to make the cutting device feed and cut relative to the first silicon rod to be cut, obtaining a first cut silicon rod with a quasi-rectangular cross section; wherein, the first direction is parallel to the axis direction of the silicon rod;

[0328] After the first silicon rod clamp clamps the silicon rod to be cut at the predetermined loading position, it moves along the axis direction of the silicon rod at the first processing position, so that the cutting wire saw in the cutting device feeds relative to the silicon rod to be cut to realize square cutting; here, a guiding structure in the axis direction of the silicon rod can be arranged at the processing position to make the silicon rod clamp move along the guiding structure under the drive of a power source. The guiding structure is, for example, a guide post or a guide rail; the cutting device can cooperate with the movement of the silicon rod clamp and the silicon rod clamped by it. For example, the position of the cutting wire saw is adjusted to avoid the silicon rod clamped by the silicon rod clamp after one cut and return to the initial position. The silicon rod clamp drives the clamped silicon rod to rotate by a certain angle, and then feeds relative to the cutting wire saw from the initial position to perform the second cut until a cut silicon rod with a rectangular or quasi-rectangular cross section is formed; wherein, the initial position is, for example, the predetermined loading position of the silicon rod clamp. Here, the initial position should be a position where the silicon rod can be moved towards the cutting wire saw to realize cutting; in some embodiments, a side skin conveying mechanism can also be configured in the silicon rod processing equipment to transfer the side skin formed by cutting out of the working area.

[0329] In step S13, the first conversion mechanism is made to drive the cutting device to be converted from the first processing position to the second processing position, and the second conversion mechanism is made to drive the grinding device to be converted from the second processing position to the first processing position;

[0330] In some embodiments, the first conversion mechanism includes a first rotating shaft. By driving the cutting device to rotate a preset angle along the first rotating shaft, the switching of the processing location where the cutting device is located can be achieved; the second conversion mechanism includes a second rotating shaft. By driving the grinding device to rotate a preset angle along the second rotating shaft, the switching of the processing location where the grinding device is located can be achieved.

[0331] In a scenario, when the first processing location and the second processing location are located on opposite sides in the second direction, the first rotating shaft can be arranged in the first direction, and the second rotating shaft is arranged in the direction of the plumb line; wherein, the first direction, the second direction, and the direction of the plumb line are perpendicular to each other in pairs.

[0332] In step S14, the first silicon rod clamp is made to hold the first cut silicon rod and move along the first direction to cooperate with the grinding device to grind the first cut silicon rod, obtaining a first ground silicon rod; and the second silicon rod clamp is made to load the second silicon rod to be cut and hold the second silicon rod to be cut and move along the first direction to make the cutting device feed and cut relative to the second silicon rod to be cut, obtaining a second cut silicon rod with a quasi-rectangular cross-section.

[0333] After the first cut silicon rod is processed, the second conversion mechanism drives the grinding device to be converted from the first processing location to the second processing location. In this state, the first silicon rod clamp can drive the held first cut silicon rod to move along the guiding structure. The grinding device drives the grinding tool to move along the direction of the plumb line and cooperate with the movement of the first silicon rod clamp in the first direction, thereby realizing the grinding of the side surface of the first cut silicon rod. By driving the silicon rod to rotate along the axis of the silicon rod by the first silicon rod clamp, the grinding surface of the silicon rod by the grinding device can be switched, and thus a first ground silicon rod can be obtained.

[0334] During the process of grinding operation in the first processing location, the second silicon rod clamp can load the second silicon rod to be cut. Here, the implementation method of the second silicon rod clamp loading the second silicon rod to be cut can refer to the method of the first silicon rod clamp loading the first silicon rod to be cut described above. The cutting device switched to the second processing location can also cut the second silicon rod to be cut held by the second silicon rod clamp to obtain a second cut silicon rod.

[0335] In step S15, the first ground silicon rod held by the first silicon rod clamp is unloaded and the third silicon rod to be cut is loaded; the first conversion mechanism is made to drive the cutting device to be converted from the second processing location to the first processing location, and the second conversion mechanism is made to drive the grinding device to be converted from the first processing location to the second processing location.

[0336] Unload the first ground silicon rod at the first processing location. The first silicon rod fixture can then load the third silicon rod to be cut. The cutting device is driven by the first conversion mechanism to switch from the second processing location to the first processing location, and the cutting device can cut the third silicon rod to be cut clamped by the first silicon rod fixture. At the same time, the second conversion mechanism drives the grinding device to switch from the first processing location to the second processing location, and the grinding device can grind the second cut silicon rod clamped by the second silicon rod fixture; in some embodiments, the unloading of the first ground silicon rod can also be achieved by configuring a silicon rod unloading device in the silicon rod processing equipment, and the silicon rod unloading device can also be set to move between the first processing location and the second processing location to adapt to the unloading needs and dock with the first processing location and the second processing location at different times.

[0337] In step S16, the cutting device at the first processing location cuts the third silicon rod to be cut to obtain the third cut silicon rod, and the grinding device at the second processing location grinds the second cut silicon rod to obtain the second ground silicon rod.

[0338] Here, the implementation method of the cutting device at the first processing location cutting the third silicon rod to be cut can refer to the implementation method of the cutting device cutting the first silicon rod to be cut or the second silicon rod to be cut in the foregoing steps; similarly, the implementation method of the grinding device grinding the second cut silicon rod can refer to the implementation method of grinding the first cut silicon rod.

[0339] Repeat the foregoing process, and the silicon rod processing equipment can simultaneously perform silicon rod processing operations at the two processing locations, improving the silicon rod processing efficiency; at the same time, by switching the processing location where the cutting device is located through the first conversion mechanism and switching the processing location where the grinding device is located through the second conversion mechanism, the silicon rod fixture drives the clamped silicon rod to move along the axis direction of the silicon rod, and squaring cutting and grinding operations can be achieved at any processing location, simplifying the transfer path of the silicon rod between different processes; at the same time, at the same moment, the cutting device and the grinding device can be located at different processing locations, and different processing operations can be respectively performed on the silicon rod processing platform; thus, the silicon rod processing equipment of the present application improves the processing efficiency while simplifying the transfer path of the silicon rod during processing between different processes, reducing the labor loss, time loss during process flow, and the risk of silicon rod damage.

[0340] The above embodiments are only illustrative of the principles and effects of the present application and are not used to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present application should still be covered by the claims of the present application.

Claims

1. A silicon rod processing device, characterized in that, Comprising: A machine base having a silicon rod processing platform provided with a first processing area and a second processing area; At least one first silicon rod clamp disposed in the first processing area for clamping a silicon rod and driving the clamped silicon rod to move in a first direction; wherein, the first direction is parallel to the axis direction of the silicon rod; At least one second silicon rod clamp disposed in the second processing area for clamping a silicon rod and driving the clamped silicon rod to move in the first direction; A cutting device disposed on a first conversion mechanism for cutting the silicon rod on the first processing area or the second processing area of the silicon rod processing platform to form a cut silicon rod; wherein, the cutting device includes a cutting frame and at least one wire cutting unit disposed on the cutting frame; the first conversion mechanism is disposed at a first installation position on the silicon rod processing platform, and the first conversion mechanism includes a first rotating shaft, and the cutting device rotates by a preset angle along the first rotating shaft to switch positions between the first processing area and the second processing area; A grinding device disposed on a second conversion mechanism for grinding the cut silicon rod on the first processing area or the second processing area of the silicon rod processing platform; wherein, the second conversion mechanism is disposed at a second installation position on the silicon rod processing platform, and the second conversion mechanism includes a second rotating shaft, and the grinding device rotates by a preset angle along the second rotating shaft to switch positions between the first processing area and the second processing area; Wherein, the first rotating shaft is disposed in the first direction, and the second rotating shaft is disposed in the direction of the plumb line; the first processing area and the second processing area are disposed on opposite sides in the second direction, wherein, the first direction, the second direction, and the direction of the plumb line are perpendicular to each other in pairs.

2. The silicon rod processing equipment according to claim 1, characterized in that The second conversion mechanism further includes a rotation driving mechanism for driving the grinding device to rotate, and the rotation driving mechanism includes: A driving gear axially connected to a power driving source; A driven gear meshing with the driving gear and connected to the second rotating shaft.

3. The silicon rod processing equipment according to claim 1, characterized in that, The first conversion mechanism includes: A bracket for setting the cutting device; A rotation driving source for driving the cutting device to rotate relative to the bracket along the first rotating shaft to switch positions between the first processing area and the second processing area.

4. The silicon rod processing equipment according to claim 1, characterized in that, The wire cutting unit includes: a plurality of cutting wheels, a transition wheel, and a cutting wire, and the cutting wire is wound around the plurality of cutting wheels and the transition wheel to form at least one cutting wire saw.

5. The silicon rod processing equipment according to claim 4, characterized in that, The wire cutting unit includes: A cutting wire; A first cutting wheel and a second cutting wheel disposed on the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; wherein, the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar; A first transition wheel adjacent to the first cutting wheel, and in the state of pulling the cutting wire, the cutting wire of the first cutting wheel and the first transition wheel is located in the plane of the first cutting wire groove for winding the cutting wire in the first cutting wheel; A second transition wheel adjacent to the second cutting wheel, and in the state of pulling the cutting wire, the cutting wire of the second cutting wheel and the second transition wheel is located in the plane of the second cutting wire groove for winding the cutting wire in the second cutting wheel; At least one third idler wheel, disposed between the first idler wheel and the second idler wheel, is used to traction a cutting wire between the first idler wheel and the second idler wheel, so as to form a cutting accommodation space in the wire cutting unit. The cutting accommodation space can accommodate a silicon rod to be cut, and only the wire saw in the cutting device intersects with the cutting accommodation space.

6. The silicon rod processing equipment according to claim 5, characterized in that, The first idler wheel, the second idler wheel, and at least one third idler wheel are used to traction the cutting wire away from the cutting accommodation space.

7. The silicon rod processing equipment according to claim 5, characterized in that The cutting wire winds between the first cutting wheel, the second cutting wheel, the first idler wheel, the second idler wheel, and the third idler wheel to form a closed-loop cutting wire with the head and tail connected.

8. The silicon rod processing equipment according to claim 5, characterized in that, Two third idler wheels are included in the wire cutting unit. Among them, the cutting wire sequentially winds around the first cutting wheel, the second cutting wheel, the second idler wheel, one third idler wheel, the other third idler wheel, the first idler wheel, and the first cutting wheel to form a closed-loop cutting wire with the head and tail connected.

9. The silicon rod processing equipment according to claim 5, wherein The cutting device further includes a cutting wire driving device, which is used to drive the cutting wire to run to cut the silicon rod.

10. The silicon rod processing equipment according to claim 9, characterized in that, The cutting wire driving device is a motor, which has a power output shaft, and the power output shaft is shaft-connected to the first cutting wheel or the second cutting wheel.

11. The silicon rod processing equipment according to claim 4, characterized in that, The cutting device further includes: At least one distance adjusting mechanism, disposed in the at least one wire cutting unit, is used to drive a plurality of cutting wheels in the wire cutting unit to move in a direction perpendicular to the wheel surface of the cutting wheel, wherein the wheel surface of the cutting wheel is disposed in the horizontal plane direction or the vertical plane direction parallel to the first direction.

12. The silicon rod processing equipment according to claim 11, characterized in that, The cutting device includes a single-wire cutting unit, and the distance adjusting mechanism includes: A lead screw, disposed in the orthogonal direction of the wheel surface of the cutting wheel and thread-connected to the single-wire cutting unit; A driving source, which is used to drive the lead screw to rotate.

13. The silicon rod processing equipment according to claim 11, characterized in that, The cutting device includes a single-wire cutting unit, and the distance adjusting mechanism includes: A telescopic member, disposed in the orthogonal direction of the wheel surface of the cutting wheel and associated with the single-wire cutting unit; A driving source, which is used to drive the telescopic member to perform a telescopic movement in the orthogonal direction of the wheel surface of the cutting wheel.

14. The silicon rod processing equipment according to claim 11, wherein, The cutting device includes a first wire cutting unit and a second wire cutting unit that are parallel and oppositely disposed. At least one of the first wire cutting unit and the second wire cutting unit is driven to move in the orthogonal direction of the wheel surface of the cutting wheel through the distance adjusting mechanism.

15. The silicon rod processing equipment according to claim 14, characterized in that, The distance adjusting mechanism includes: A lead screw, disposed in the orthogonal direction of the wheel surface of the cutting wheel and thread-connected to the first wire cutting unit or the second wire cutting unit; A driving source, which is used to drive the lead screw to rotate.

16. The silicon rod processing equipment according to claim 14, wherein, The distance adjusting mechanism includes: A telescopic member, disposed in the orthogonal direction of the wheel surface of the cutting wheel and associated with the first wire cutting unit or the second wire cutting unit; A driving source, which is used to drive the telescopic member to perform a telescopic movement in the orthogonal direction of the wheel surface of the cutting wheel.

17. The silicon rod processing equipment according to claim 14, characterized in that, The distance adjusting mechanism includes: A bidirectional lead screw, disposed in the orthogonal direction of the wheel surface of the cutting wheel and thread-connected to the first wire cutting unit and the second wire cutting unit; A driving source, which is used to drive the bidirectional lead screw to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other in the orthogonal direction of the wheel surface of the cutting wheel.

18. The silicon rod processing equipment according to claim 4, characterized in that, The first silicon rod clamp is arranged at the first processing position through a first guiding structure, wherein the first guiding structure is a transfer guide rail or a guide post arranged along a first direction; the second silicon rod clamp is arranged at the second processing position through a second guiding structure, wherein the second guiding structure is a transfer guide rail or a guide post arranged along the first direction.

19. The silicon rod processing equipment according to claim 18, characterized in that, The wire saw is along a second direction, and any one of the first silicon rod clamp and the second silicon rod clamp includes: A clamp arm mounting seat arranged on the corresponding transfer guide rail; A power source for driving the clamp arm mounting seat to move along the corresponding transfer guide rail or guide post; A pair of clamping parts arranged opposite to each other along the first direction for clamping two end faces of the silicon rod; A pair of clamp arms arranged in a horizontal plane, having a proximal end connected to the clamp arm mounting seat and a distal end connected to the clamping part; A clamp arm driving mechanism for driving at least one of the pair of clamp arms to move along the first direction to adjust the distance between the pair of clamp arms in the first direction.

20. The silicon rod processing equipment according to claim 19, characterized in that, Any one of the first silicon rod clamp and the second silicon rod clamp further includes a clamping part rotating mechanism for driving the clamping part to rotate.

21. The silicon rod processing equipment according to claim 19, characterized in that, The clamp arm driving mechanism includes: A lead screw arranged along the first direction and associated with any one of the pair of clamp arms; A driving source for driving the associated clamp arm to move along the first direction.

22. The silicon rod processing equipment according to claim 19, characterized in that, The clamp arm driving mechanism includes: A double lead screw arranged along the first direction and threadedly connected to the pair of clamp arms at both ends; A driving source for driving the double lead screw to rotate so that the pair of clamp arms move towards each other or away from each other along the first direction.

23. The silicon rod processing equipment according to claim 18, wherein, At least one wire saw is arranged along the plumb line direction, and any one of the first silicon rod clamp and the second silicon rod clamp includes: A clamp arm mounting seat arranged on the corresponding transfer guide rail or guide post; A power source for driving the clamp arm mounting seat to move along the corresponding transfer guide rail or guide post; A pair of clamping parts arranged opposite to each other along the first direction for clamping two end faces of the silicon rod; A pair of clamp arms arranged in a plane perpendicular to the second direction, having a proximal end connected to the clamp arm mounting seat and a distal end connected to the clamping part; A clamp arm driving mechanism for driving at least one of the pair of clamp arms to move along the first direction to adjust the distance between the pair of clamp arms in the first direction.

24. The silicon rod processing equipment according to claim 23, characterized in that, Any one of the first silicon rod clamp and the second silicon rod clamp further includes a clamping part rotating mechanism for driving the clamping part to rotate.

25. The silicon rod processing equipment according to claim 23, characterized in that, The clamp arm driving mechanism includes: A lead screw arranged along the first direction and associated with any one of the pair of clamp arms; A driving source for driving the associated clamp arm to move along the first direction.

26. The silicon rod processing equipment according to claim 23, characterized in that, The clamp arm driving mechanism includes: A double lead screw arranged along the first direction and threadedly connected to the pair of clamp arms at both ends; A driving source for driving the double lead screw to rotate so that the pair of clamp arms move towards each other or away from each other along the first direction.

27. The silicon rod processing equipment according to claim 1, characterized in that The silicon rod processing equipment further includes a side skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the cut side skin.

28. The silicon rod processing equipment according to claim 27, wherein The side skin supporting mechanism includes: A supporting assembly including: a supporting part, controllably abutting against and supporting the side skin; a cylinder or a hydraulic pump including a telescopic part, and the telescopic part is connected to the supporting part to control the supporting part to move away from or abut against the side skin; The mounting portion is used to connect the supporting assembly to the cutting device.

29. The silicon rod processing equipment according to claim 28, characterized in that, The supporting part comprises: At least two supporting blocks are spaced apart along the first direction and have a bearing surface for contacting and bearing the edge skin.

30. The silicon rod processing equipment according to claim 28, characterized in that, The supporting part comprises: At least two supporting rods are arranged along a first direction and are used to contact and support the edge skin; The connecting parts are arranged at two opposite sides of the cutting frame in a first direction to correspond to the opposite ends of the supporting rod, and are used to connect the at least two supporting rods and the telescopic part.

31. The silicon rod processing equipment according to claim 27, wherein It also includes a side skin dislocation mechanism, which is arranged at the first processing position and the second processing position and is used to push the side skin along a first direction to make the side skin separate from the side skin supporting mechanism.

32. The silicon rod processing equipment according to claim 31, characterized in that, The edge skin misalignment mechanism comprises a cylinder or a hydraulic pump, wherein a telescopic rod of the cylinder or the hydraulic pump is arranged along a first direction.

33. The silicon rod processing equipment according to claim 1 or 27, characterized in that, It also includes a side skin conveying mechanism, which is used to receive the side skins formed by cutting and transport the side skins to a unloading area.

34. The silicon rod processing equipment according to claim 33, characterized in that, The edge skin conveying mechanism comprises: A conveying part, used for carrying the edge skin; A conveying driving source is used to drive the conveying part to move along a first direction to convey the edge skin.

35. The silicon rod processing equipment according to claim 1, characterized in that, The grinding device comprises: At least one pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are parallel and arranged opposite to each other; The grinding tool advancing and retreating mechanism is used to drive at least one of the pair of grinding tools to move along the vertical line direction.

36. The silicon rod processing equipment according to claim 35, characterized in that, The grinding tool advance and retreat mechanism comprises: An advance and retreat guide rail is arranged on the second conversion mechanism along the direction of the vertical line, and is used to set the grinding tool; A driving source is used to drive at least one of the grinding tools to move along the advance and retreat guide rail.

37. The silicon rod processing equipment according to claim 35, characterized in that, Either the first silicon rod fixture or the second silicon rod fixture further comprises a grinding and repairing device for repairing the grinding tool in the corresponding grinding device.

38. The silicon rod processing equipment according to claim 37, characterized in that, The grinding and repairing device comprises: A mounting body, arranged on the silicon rod clamp, and configured to reciprocate along a first direction under the drive of the silicon rod clamp; At least one grinding part is arranged on the mounting body and is used for detecting or grinding the grinding tool of the grinding device.

39. The silicon rod processing equipment according to claim 38, characterized in that, It comprises two grinding parts which are respectively arranged on two opposite sides of the installation body.

40. The silicon rod processing equipment according to claim 1, characterized in that, It also includes a chamfering device for grinding the edges of the cut silicon rods.

41. The silicon rod processing equipment according to claim 40, wherein, The chamfering device comprises: At least one pair of chamfering grinding tools, wherein the chamfering grinding surfaces of the pair of chamfering grinding tools are parallel and arranged opposite to each other; The chamfering tool advance and retreat mechanism is used to drive at least one of the pair of chamfering tools to move along the direction of the vertical line.

42. The silicon rod processing equipment according to claim 41, wherein, The chamfering device is connected to the second conversion mechanism, and is used to switch between the first processing position and the second processing position under the drive of the second conversion mechanism to chamfer the cut silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp.

43. The silicon rod processing equipment according to claim 42, characterized in that, The chamfering tool advance and retreat mechanism comprises: An advance and retreat guide rail is arranged on the second conversion mechanism along the direction of the vertical line, and is used to set the at least one pair of chamfering grinding tools; The advance and retreat driving unit is used to drive at least one chamfering grinding tool of the at least one pair of chamfering grinding tools to move along the advance and retreat guide rail.

44. The silicon rod processing equipment according to claim 1, characterized in that, It also includes a silicon rod unloading device for receiving the ground silicon rods clamped by the first silicon rod clamp and the second silicon rod clamp.

45. The silicon rod processing equipment according to claim 44, characterized in that, The silicon rod unloading device comprises: A conveyor belt, used for carrying the ground silicon rods; A discharging driving source for driving the conveyor belt to move so as to drive the ground silicon rod carried thereon to move in a first direction.

46. The silicon rod processing equipment according to claim 44, characterized in that, The silicon rod discharging device is arranged on the silicon rod processing platform through a shifting mechanism and is used to move between a first processing position and a second processing position under the drive of the shifting mechanism.

47. The silicon rod processing equipment according to claim 46, characterized in that, The silicon rod discharging device is arranged on the shifting mechanism through a lifting mechanism, wherein the lifting mechanism includes: A lifting guiding structure arranged on the shifting mechanism and connected to the silicon rod discharging device; A lifting driving source for driving the silicon rod discharging device to move up and down along the direction of the plumb line.

48. The silicon rod processing equipment according to claim 1, characterized in that, It further includes a silicon rod cutting-off device, and the silicon rod cutting-off device includes: A silicon rod carrying device for carrying a single crystal silicon rod; A cutting-off cutting frame including a cutting wire saw that can be lifted relative to the silicon rod carrying device and used for cutting off the single crystal silicon rod to form a silicon rod to be cut.

49. The silicon rod processing equipment according to claim 48, wherein, The silicon rod carrying device is a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

50. The silicon rod processing equipment according to claim 48, characterized in that, The silicon rod cutting-off device and the grinding device are respectively located at opposite ends of the cutting device along the first direction.

51. The silicon rod processing equipment according to claim 1 or 48, characterized in that, It further includes a feeding device for conveying the silicon rod to be cut to the first processing position or the second processing position so that the first silicon rod clamp or the second silicon rod clamp loads the silicon rod to be cut.

52. The silicon rod processing equipment according to claim 51, characterized in that, It further includes a predetermined loading mechanism arranged along the first direction and used for carrying the silicon rod to be cut so that the feeding device conveys the silicon rod to be cut from the predetermined loading mechanism to the first processing position or the second processing position.

53. The silicon rod processing equipment according to claim 51, characterized in that, The feeding device includes at least one clamping assembly, and the clamping assembly includes: A material taking arm suspended above the silicon rod processing platform through a mounting part on a top frame, wherein the top frame includes a guiding structure arranged along a second direction to enable the mounting part to have a degree of freedom of moving along the second direction; A clamping member arranged at the bottom end of the material taking arm and used for clamping the silicon rod to be cut.

54. The silicon rod processing equipment according to claim 53, wherein, The mounting part includes a translation mechanism arranged along the first direction and used for arranging the material taking arm so that the material taking arm has a degree of freedom of moving along the first direction.

55. The silicon rod processing equipment according to claim 53, characterized in that, The clamping member includes: A first clamping block and a second clamping block arranged oppositely, wherein the first clamping block and the second clamping block have clamping arc surfaces; A clamping block driving mechanism for driving the first clamping block and the second clamping block to perform opening and closing movements.

56. The silicon rod processing equipment according to claim 55, characterized in that, The clamping block driving mechanism includes: A first rack linked to the first clamping block; A second rack linked to the second clamping block; A clamping cylinder arranged on the first rack or the second rack and used for pushing the first rack or the second rack to move in the extending direction of the rack; A transmission gear meshing with the first rack and the second rack and used for driving the first clamping block and the second clamping block to move towards each other to perform a closing action when rotating forward and driving the first clamping block and the second clamping block to move away from each other to perform an opening action when rotating reversely.

57. The silicon rod processing equipment according to claim 55, characterized in that, The clamping block driving mechanism includes: A first rack linked to the first clamping block; A second rack linked to the second clamping block; The driving gear is connected to the power output shaft of the driving motor and meshes with the first rack and the second rack, and is used to drive the first clamping block and the second clamping block to move towards each other to perform a closing action when rotating forward, and drive the first clamping block and the second clamping block to move away from each other to perform an opening action when rotating reversely.

58. The silicon rod processing equipment according to claim 55, characterized in that, The clamping block driving mechanism includes: An opening and closing gear, which is arranged on the first clamping block and the second clamping block; A rack, and tooth patterns corresponding to the meshing of the opening and closing gears on the first clamping block and the second clamping block are respectively arranged at opposite ends of the rack; A driving source, which is used to drive the rack to move forward and backward along the rack direction.

59. The silicon rod processing equipment according to claim 55, characterized in that, The clamping block driving mechanism includes: A bidirectional lead screw, the two ends of which are threadedly connected to the first clamping block and the second clamping block; A driving source, which is used to drive the bidirectional lead screw to rotate so that the first clamping block and the second clamping block move towards each other or away from each other.

60. The silicon rod processing equipment according to claim 53, characterized in that, The material taking arm is arranged on the mounting part in a liftable manner.

61. The silicon rod processing equipment according to claim 51, characterized in that, The feeding device further includes a sensor element, which is used to detect the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp to determine that the first silicon rod clamp or the second silicon rod clamp clamps the silicon rod at a predetermined loading position.

62. The silicon rod processing equipment according to claim 61, characterized in that, The sensor element is a contact sensor or a ranging sensor.

63. A method for processing a silicon rod, which is applied to a silicon rod processing device. The silicon rod processing device includes a machine base with a silicon rod processing platform, a cutting device, a grinding device, a first silicon rod clamp, and a second silicon rod clamp, wherein, The cutting device is arranged on the first conversion mechanism, the grinding device is arranged on the second conversion mechanism, the first silicon rod clamp and the second silicon rod clamp are respectively arranged corresponding to the first processing area and the second processing area of the silicon rod processing platform, the first conversion mechanism includes a first rotating shaft, the second conversion mechanism includes a second rotating shaft, the first rotating shaft is arranged in the first direction, the second rotating shaft is arranged in the direction of the plumb line, the first processing area and the second processing area are arranged on opposite sides in the second direction, and the first direction, the second direction, and the direction of the plumb line are perpendicular to each other pairwise; it is characterized by including the following steps: Position the cutting device at the first processing area and the grinding device at the second processing area; Load the first silicon rod to be cut on the first silicon rod clamp at the first processing area; Clamp the first silicon rod to be cut by the first silicon rod clamp and move it along the first direction to make the cutting device feed and cut relative to the first silicon rod to be cut, and obtain a first cut silicon rod with a quasi-rectangular cross section; wherein, the first direction is parallel to the axis direction of the silicon rod; Drive the cutting device to rotate a preset angle along the first rotating shaft by the first conversion mechanism to switch from the first processing area to the second processing area, and drive the grinding device to rotate a preset angle along the second rotating shaft by the second conversion mechanism to switch from the second processing area to the first processing area; Clamp the first cut silicon rod by the first silicon rod clamp and move it along the first direction to cooperate with the grinding device to grind the first cut silicon rod to obtain a first ground silicon rod; and load the second silicon rod to be cut on the second silicon rod clamp and clamp the second silicon rod to be cut and move it along the first direction to make the cutting device feed and cut relative to the second silicon rod to be cut, and obtain a second cut silicon rod with a quasi-rectangular cross section; Unload the first ground silicon rod clamped by the first silicon rod clamp and load the third silicon rod to be cut; Let the first conversion mechanism drive the cutting device to rotate a preset angle along the first rotating shaft to switch from the second processing position to the first processing position, and let the second conversion mechanism drive the grinding device to rotate a preset angle along the second rotating shaft to switch from the first processing position to the second processing position; Let the cutting device at the first processing position cut the third silicon rod to be cut to obtain the third cut silicon rod, and let the grinding device at the second processing position grind the second cut silicon rod to obtain the second ground silicon rod.

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